Heat dissipation device and electronic equipment
By using substrates, structural reinforcements and cover plate buckles to form a sealing chamber in the liquid-cooled heat dissipation device, and sealing them in combination with the first packaging structure and the second packaging structure, the problem of poor sealing performance is solved, and more efficient heat dissipation and longer service life are achieved.
Patent Information
- Application Number
- CN202311391155.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-10-24
- Publication Date
- 2025-04-25
AI Technical Summary
In the existing liquid-cooled heat dissipation devices, the sealing performance of the sealing chamber is poor, resulting in leakage of cooling medium and reduced heat dissipation efficiency.
The sealing chamber is formed by using a substrate, structural reinforcement and cover plate buckle in the heat dissipation device, and sealing is combined with the first packaging structure and the second packaging structure. The first packaging structure has a certain elasticity to absorb thermal deformation of the substrate, while the second packaging structure prevents the first packaging structure from contacting the cooling medium and improves sealing performance.
It effectively improves the sealing performance of the heat dissipation device, prevents cooling medium from leaking, enhances heat dissipation efficiency, and extends the service life of the device.
Smart Images
Figure CN119890149A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of heat dissipation technology, and in particular to a heat dissipation device and an electronic device. Background Art
[0002] As the power of semiconductor devices gradually increases, how to dissipate heat from the devices is the focus of current research. Traditional heat dissipation methods include natural heat dissipation, air cooling and liquid cooling. Since liquid cooling has a relatively high heat dissipation efficiency, liquid cooling is currently used for chip cooling in communication equipment and large servers.
[0003] One way to achieve liquid cooling is to combine the substrate carrying the chip with other components to form a sealed chamber, and input liquid cooling medium into the sealed chamber. The cooling medium can directly contact the chip and take away the heat emitted by the chip through the flow. However, since the sealed chamber is formed by the combination of the substrate and other components, there is often a problem of poor sealing of the liquid cooling medium. There is currently no better solution to this problem. Summary of the invention
[0004] The present application provides a heat dissipation device and an electronic device to improve the sealing performance of a sealed chamber formed by a combination of a substrate and other components.
[0005] In a first aspect, the present application provides a heat dissipation device. The heat dissipation device includes a substrate, a structural reinforcement, a cover plate, a first packaging structure and a second packaging structure. The cover plate is buckled with the substrate through the structural reinforcement to form a sealed chamber, and the surface of the substrate facing the sealed chamber is used to set the chip. A medium inlet and a medium outlet are provided on the cover plate, the medium inlet is used to input a cooling medium into the sealed chamber, and the medium outlet is used to output the cooling medium in the sealed chamber. The substrate and the structural reinforcement are connected through the first packaging structure. The second packaging structure is located on the surface of the first packaging structure facing the sealed chamber, and is used to prevent the first packaging structure from contacting the cooling medium in the sealed chamber.
[0006] In the present application, the substrate, structural reinforcement, and cover plate of the heat dissipation device are buckled together to form a sealed chamber, and the sealed chamber is sealed by the first packaging structure and the second packaging structure. Among them, the first packaging structure is used to realize the structural connection between the substrate and the structural reinforcement, and the first packaging structure has a certain elasticity, which can absorb part of the deformation when the substrate is thermally deformed, thereby ensuring a stable connection between the substrate and the structural reinforcement. However, since the first packaging structure used for structural connection has a weak ability to resist liquid erosion, direct contact with the cooling medium will cause the first packaging structure to be easily damaged by aging. The second packaging structure is arranged on the surface of the first packaging structure facing the sealed chamber, which can prevent the first packaging structure from contacting the cooling medium and improve the sealing performance of the heat dissipation device. Therefore, the heat dissipation device of the present application can improve the sealing performance of the heat dissipation device by using the first packaging structure and the second packaging structure in combination.
[0007] In one possible implementation, a blocking portion is provided on the substrate, and the second packaging structure is located between the surface of the first packaging structure facing the sealed chamber and the blocking portion. In this way, the flow of the second packaging structure is restricted by the blocking portion before it is manufactured and formed, so that the second packaging structure can be well formed. Moreover, the height of the second packaging structure can be adjusted by the blocking portion, the material consumption of the second packaging structure can be increased, and better sealing performance can be provided. Exemplarily, the blocking portion can be made of frame-sealing glue, and the frame-sealing glue is evenly applied around the substrate during manufacturing, and the second packaging structure is manufactured between the blocking portion and the first packaging structure after molding.
[0008] In one possible implementation, the heat dissipation device also includes a first molding structure, which seals the second packaging structure through the first molding structure, so that the second packaging structure can be well formed, and further prevent the first packaging structure and the second packaging structure from being corroded by the cooling medium, thereby improving the sealing of the heat dissipation device.
[0009] In another optional embodiment of the present application, the substrate of the heat sink and the structural reinforcement are connected by the first packaging structure and the second packaging structure at the same time. That is, by connecting the substrate and the structural reinforcement by the first packaging structure and the second packaging structure, the manufacturing process of the heat sink can be simplified while ensuring the sealing performance of the heat sink.
[0010] Furthermore, if the first packaging structure and the second packaging structure are manufactured in different orders, the structure of the heat dissipation device may be different. In the first case, the first packaging structure and the second packaging structure have the same height in the first direction, and the first direction is the direction in which the substrate faces the cover plate. That is to say, when the structural reinforcement is buckled with the substrate, the first packaging structure and the second packaging structure are manufactured together, and then the structural reinforcement is buckled with the substrate, so that the first packaging structure and the second packaging structure have the same height in the first direction, which can simplify the manufacturing process of the heat dissipation device. Or in the second case, when the structural reinforcement is buckled with the substrate, the second packaging structure is first manufactured, and then the structural reinforcement is buckled with the substrate, and after the second packaging structure is solidified and formed, the first packaging structure is manufactured. Considering that the spacing between the structural reinforcement and the substrate is already small at this time, in order to facilitate the manufacture of the first packaging structure, a groove can be made at the position where the first packaging structure is set on the structural reinforcement to increase the spacing. Finally, the height of the first packaging structure in the first direction is greater than the height of the second packaging structure in the first direction, which can improve the sealing performance of the heat dissipation device. Or in the third case, similarly, when the structural reinforcement is buckled with the substrate, the second packaging structure is made first, and then the first packaging structure is made. The height of the first packaging structure finally made in the first direction is smaller than the height of the second packaging structure in the first direction, and the sealing performance of the heat dissipation device can be improved.
[0011] In a possible implementation, the heat sink further includes a second molding structure, which is disposed on the substrate and between the second packaging structure and the chip. The second molding structure is used to seal the second packaging structure, so that the second packaging structure can be well formed, and the first packaging structure and the second packaging structure can be further prevented from being corroded by the cooling medium, thereby improving the sealing performance of the heat sink.
[0012] In a possible implementation manner, the height of the first packaging structure in the first direction may be 50-500 um, and the first direction is a direction where the substrate faces the cover plate.
[0013] In a possible implementation, the first packaging structure may be made of silicone glue, and / or the second packaging structure may be made of epoxy resin glue.
[0014] In a second aspect, the present application further provides an electronic device, the electronic device comprising at least one chip and the heat dissipation device of the first aspect, the electronic device can dissipate heat from the at least one chip through the heat dissipation device. Since the heat dissipation device in the first aspect has the advantage of good cooling medium sealing performance, the electronic device here also has the advantage of good cooling medium sealing performance. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1It is a structural schematic diagram of an existing cold plate heat dissipation device;
[0016] Figure 2 It is a schematic diagram of the structure of an existing liquid-cooled direct heat dissipation heat dissipation device;
[0017] Figure 3 A schematic diagram of the structure of a heat dissipation device provided in an embodiment of the present application;
[0018] Figure 4 is a schematic structural diagram of the blocking portion;
[0019] Figure 5 for Figure 3 Another structural schematic diagram of the heat dissipation device shown;
[0020] Figure 6 Another schematic diagram of the structure of the heat dissipation device provided in the embodiment of the present application;
[0021] Figure 7a to Figure 7c for Figure 6 A schematic diagram of the local positional relationship between the first packaging structure and the second packaging structure at A shown.
[0022] Reference numerals:
[0023] 100-cold plate heat sink; 101-bare chip; 102-substrate; 103-cold plate; 104-thermal interface material layer; 105-medium inlet; 106-medium outlet; 200-heat sink; 203-cover plate; 300-heat sink; 303-cover plate; 304-structural reinforcement; 305-first packaging structure; 306-second packaging structure; 307-blocking part; 308-first molded structure; 309-sealing ring; 600-heat sink; 605-first packaging structure; 606-second packaging structure; 608-second molded structure. DETAILED DESCRIPTION
[0024] In order to make the purpose, technical scheme and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings. The terms used in the following embodiments of the present application are only for the purpose of describing specific embodiments, and are not intended to be used as limitations to the present application. As used in the specification and appended claims of the present application, the singular expressions "one", "a kind of", "described", "above", "the" and "this" are intended to also include, for example, "one or more" such expressions, unless there is clearly an opposite indication in the context.
[0025] References to "one embodiment" or "some embodiments" etc. described in this specification mean that a particular feature, structure or characteristic described in conjunction with the embodiment is included in one or more embodiments of the present application. Thus, the phrases "in one embodiment", "in some embodiments", "in some other embodiments", "in some other embodiments", etc. that appear at different places in this specification do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in other ways. The terms "including", "comprising", "having" and their variations all mean "including but not limited to", unless otherwise specifically emphasized in other ways.
[0026] This application mainly relates to liquid cooling. In order to facilitate understanding of the heat dissipation device provided in the embodiment of this application, the following briefly introduces the existing liquid cooling technology. Figure 1 , shows an existing cold plate heat dissipation device. The cold plate heat dissipation device 100 includes a substrate 102 and a cold plate 103. The cold plate 103 includes a sealed chamber, a medium inlet 105 and a medium outlet 106. The sealed chamber can accommodate a cooling medium, and the cooling medium can be input into the sealed chamber through the medium inlet 105, and the cooling medium in the sealed chamber can be output from the medium outlet 106. A bare chip 101 is mounted on the substrate 102, and a thermal interface material (TIM) 104 is filled between the cold plate 103 and the bare chip 101. The heat generated by the bare chip 101 is transferred to the cold plate 103 through the TIM material 104. The flow of the cooling medium in the sealed chamber of the cold plate 103 takes away the heat generated by the bare chip 101, thereby achieving heat dissipation of the bare chip 101. In the heat dissipation device, the cold plate 103 does not directly contact the bare chip 101, but conducts heat through the TIM material 104. The heat conduction efficiency of the TIM material 104 directly determines the heat dissipation efficiency of the bare chip 101. Typically, TIM material 104 includes silicone grease, liquid metal, PCM film, carbon fiber thermal conductive film and other materials. Although these materials have high thermal conductivity, their heat dissipation efficiency is still insufficient when facing high-power chips.
[0027] See also Figure 2 Another existing heat dissipation device 200 can solve Figure 1 The problem of insufficient heat dissipation efficiency of the cold plate heat dissipation device in the Figure 2The heat dissipation device 200 includes a substrate 102 and a cover plate 203, and the substrate 102 and the cover plate 203 form a sealed chamber, and the sealed chamber is provided with a medium inlet 105 and a medium outlet 106. The bare chip 101 carried on the substrate 102 is directly placed in the sealed chamber, and the cooling medium is input through the medium inlet 105, directly contacts the bare chip 101 in the sealed chamber, and is output through the medium outlet 106 to take away the heat generated by the bare chip 101. In the heat dissipation device 200, the cooling medium directly contacts the bare chip 101, which can improve the heat dissipation efficiency. However, the substrate 102 is usually a printed circuit board (PCB), so that the temperature of the substrate 102 will change frequently during the heat dissipation of the bare chip 101, which may cause thermal deformation of the substrate 102 and affect the sealing performance of the heat dissipation device 200. Therefore, how to ensure the sealing performance of the heat dissipation device when the substrate 102 is thermally deformed is a key issue.
[0028] The heat dissipation device provided in the present application is intended to solve the above-mentioned problem. A sealed chamber is formed by snapping together a substrate, a structural reinforcement, and a cover plate. The first packaging structure and the second packaging structure are used together to seal the sealed chamber, thereby ensuring the sealing of the heat dissipation device. The specific structure will be described in detail below in conjunction with multiple drawings.
[0029] Reference Figure 3 , Figure 3 A schematic diagram of the structure of a heat dissipation device 300 provided in an embodiment of the present application. The heat dissipation device 300 includes a substrate 102, a cover plate 303, a structural reinforcement 304, a first packaging structure 305 and a second packaging structure 306. Among them, the substrate 102 can be an ordinary PCB board, and the cover plate 303 is buckled with the substrate 102 through the structural reinforcement 304 to form a sealed chamber, and a bare chip 101 can be set on the side surface of the substrate 102 facing the sealed chamber. The bare chip 101 can be some common chips, for example, a central processing unit (CPU) chip, a graphic processing unit (GPU) chip, etc. A medium inlet 105 and a medium outlet 106 are provided on the cover plate 303, and a cooling medium is input into the sealed chamber through the medium inlet 105, and the cooling medium in the sealed chamber is output through the medium outlet 106.
[0030] After the cooling medium is input from the medium inlet 105, it directly contacts the bare chip 101, and then outputs through the medium outlet 106. The flow of the cooling medium can take away the heat emitted by the bare chip 101, so as to achieve heat dissipation of the bare chip 101 by the sealed chamber. Generally, the cooling medium can be a liquid cooling medium. The liquid cooling medium can also be further divided into conductive and non-conductive (dielectric) liquid cooling media. Among them, the conductive liquid cooling medium may include water, salt water, etc., and the non-conductive liquid cooling medium may include fluorinated liquid, etc. The cooling medium in the present application may adopt a non-conductive cooling medium, such as fluorinated liquid. In this way, the chip can be a chip bare chip (Die), and the chip bare chip is carried on the substrate 102, and the fluorinated liquid will not cause corrosion to the circuit of the chip bare chip. The advantage of this method is that since the cooling medium is not conductive, it can directly contact the bare chip, and the heat dissipation efficiency is high. Alternatively, if a conductive cooling medium is used, the chip can also be a packaged chip (Lid) or a chip with an isolation ring (sealring) structure, and the chip package or isolation ring can protect the chip to prevent the chip from being corroded.
[0031] The structural reinforcement 304 is a structural component with a certain rigidity. After the cover plate 303 is buckled with the substrate 102 through the structural reinforcement 304 to form a sealed chamber, when the heat of the die 101 is transferred to the substrate 102, the substrate 102 is deformed by the heat at the position of the die 101 and has a tendency to bend downward. By arranging the structural reinforcement 304 between the substrate 102 and the cover plate 303, a downward force can be applied to the connection between the structural reinforcement 304 and the substrate 102 to offset the thermal deformation of the substrate 102.
[0032] The structural reinforcement 304 is connected to the substrate 102 through the first packaging structure 305. The first packaging structure 305 realizes the structural connection between the substrate 102 and the structural reinforcement 304, and the first packaging structure 305 has a certain elasticity, which can make elastic deformation occur when the substrate 102 is thermally deformed, thereby absorbing part of the thermal deformation of the substrate 102 and releasing the stress at the connection portion between the structural reinforcement 304 and the substrate 102. The first packaging structure 305 can prevent the relative displacement between the substrate 102 and the structural reinforcement 304 from being too large, ensuring that the substrate 102 and the structural reinforcement 304 are firmly connected. As an example, the first packaging structure 305 can use silicone glue. Silicone glue is soft in nature and can provide better bonding performance for the structural reinforcement 304 and the substrate 102.
[0033] like Figure 3, the second packaging structure 306 is located on the surface of the first packaging structure 305 facing the sealed chamber. That is to say, the second packaging structure 306 can be arranged along the connection portion between the substrate 102 and the structural reinforcement 304 located on the inner side of the sealed chamber, so that the second packaging structure 306 isolates the first packaging structure 305 from direct contact with the cooling medium. Since the first packaging structure 305 is located between the substrate 102 and the structural reinforcement 304, and the first packaging structure 305 is generally weak in resistance to liquid erosion, if it is directly in contact with the cooling medium in the sealed chamber, it is prone to aging damage, affecting the sealing performance of the sealed chamber. Therefore, in the present application, a second packaging structure 306 is further arranged on the surface of the first packaging structure 305 facing the sealed chamber, which can prevent the first packaging structure 305 from being corroded by the cooling medium. Exemplarily, the second packaging structure 306 can be made of a material with strong resistance to liquid erosion. For example, it can be made of corrosion-resistant epoxy resin glue or rubber material. In this way, by using the first packaging structure 305 and the second packaging structure 306 in combination to seal the heat dissipation device, the sealing performance of the sealed chamber formed by the combination of the substrate and other components can be improved.
[0034] Continue to see Figure 3 , the heat dissipation device 300 also includes a blocking portion 307. The blocking portion 307 is disposed on the substrate 102, and the second packaging structure 306 is located between the surface of the first packaging structure 305 facing the sealed chamber and the blocking portion 307. That is to say, a filling space can be formed between the blocking portion 307 and the first packaging structure 305 inside the sealed chamber, and the second packaging structure 306 can be filled in the space. Since the second packaging structure 306 has a certain fluidity before being manufactured and formed, the blocking portion 307 can limit the flow of the second packaging structure 306, so that the second packaging structure 306 is well formed. In some examples, the blocking portion 307 can be made of sealing glue and has a certain height, so that the height of the blocking portion 307 can be adjusted to control the height of the second packaging structure 306, and the material usage of the second packaging structure 306 can be increased to provide better sealing performance.
[0035] In some examples, the blocking portion 307 may have a square cross section or a trapezoidal cross section. It should be understood that the present application does not specifically limit the cross-sectional shape of the blocking portion 307, and it only needs to be able to fix the blocking portion 307 on the substrate 102. Figure 4 As shown, in order to ensure the uniformity of the second packaging structure 306 in the heat dissipation device 300, the blocking portion 307 can extend along the inner wall of the structural reinforcement member 304 of the sealed chamber to form a closed structure on the substrate 102, so that the second packaging structure 306 between the blocking portion 307 and the first packaging structure 305 is formed uniformly. Figure 3As shown, in the present application, when the cover plate 303 and the structural reinforcement 304 are buckled together to form a sealed chamber, a sealing ring 309 is provided between the cover plate 303 and the structural reinforcement 304. The sealing ring 309 is tightly fitted with the cover plate 303 and the structural reinforcement 304 by the buckling pressure, so that the connection part between the cover plate 303 and the structural reinforcement 304 can be sealed. When the blocking portion 307 is provided, the height of the blocking portion 307 can also exceed the height of the structural reinforcement 304 on the substrate 102, so that the second packaging structure 306 can not only seal the first packaging structure 305, but also seal the sealing ring 309, thereby improving the sealing performance of the heat dissipation device 300.
[0036] Please refer to Figure 5 In the embodiment of the present application, the heat dissipation device 300 can also cover the second packaging structure 306 on the substrate 102 with a layer of molding material to form a first molding structure 308. The molding material is a packaging material, which can be made of epoxy resin materials and is commonly used in packaging processes. The second packaging structure 306 can be further packaged by the first molding structure 308, so that the second packaging structure 306 can be well formed. The molding structure 308 can seal the second packaging structure 306 to prevent it from being corroded by the cooling medium, thereby improving the sealing of the heat dissipation device 300.
[0037] Reference Figure 6 As another embodiment of the present application, the substrate 102 and the structural reinforcement 304 of the heat dissipation device 600 can be connected through the first packaging structure 605 and the second packaging structure 606. In this way, the second packaging structure 606 can be limited and formed without using a blocking portion, which can reduce the manufacturing process of the heat dissipation device. In the finally manufactured heat dissipation device 600, the first packaging structure 605 is arranged along the side away from the sealed chamber, and the second packaging structure 606 is arranged facing the side of the sealed chamber. The first packaging structure 605 realizes the structural connection between the structural reinforcement 304 and the substrate 102, and the second packaging structure 606 prevents the first packaging structure 605 from contacting the cooling medium in the sealed chamber. Similarly, the first packaging structure 605 and the second packaging structure 606 can be used in combination to improve the sealing of the heat dissipation device 600.
[0038] Furthermore, when the substrate 102 is connected to the structural reinforcement 304 through the first packaging structure 605 and the second packaging structure 606, if the first packaging structure 605 and the second packaging structure 606 are made in different orders, the structure of the heat dissipation device 600 may be different. In the first case, in the first direction where the substrate faces the cover plate, the heights of the first packaging structure 605 and the second packaging structure 606 can be the same. Specifically, as shown in FIG. 7(a), it is a partial enlarged schematic diagram of the connection part between the substrate 102 and the structural reinforcement 304. Before the structural reinforcement 304 is buckled with the substrate 102, the material for making the first packaging structure 605 and the second packaging structure 606 is first set on the surface of the structural reinforcement 304, and then the structural reinforcement 304 is buckled with the substrate 102. In this way, the first packaging structure 605 and the second packaging structure 606 are cured and formed together, and the height in the first direction is the same, for example, it can be in the range of 50 to 500um. By manufacturing the first packaging structure 605 and the second packaging structure 606 together, the manufacturing process of the heat dissipation device can be simplified.
[0039] In the second case, the height of the first encapsulation structure 605 in the first direction is greater than the height of the second encapsulation structure 606 in the first direction. Specifically, as shown in FIG. 7( b), it is a partially enlarged schematic diagram of the connection portion between the substrate 102 and the structural reinforcement 304. Before the structural reinforcement 304 is buckled with the substrate 102, the material of the second encapsulation structure 606 is first set on the surface of the structural reinforcement 304, and then the structural reinforcement 304 is buckled with the substrate 102. After the second encapsulation structure 606 is cured and formed, the structural reinforcement 304 is connected to the substrate 102 so that the height of the second encapsulation structure 606 in the first direction is in the range of 50 to 500um. Then, the first encapsulation structure 605 is set between the structural reinforcement 304 and the substrate 102. Considering that the spacing between the structural reinforcement 304 and the substrate 102 is already small at this time, in order to facilitate the production of the first encapsulation structure 605, a groove can be set at the position of the structural reinforcement 304 facing the substrate 102 to increase the spacing. The height of the first packaging structure 605 finally manufactured in the first direction is greater than the height of the second packaging structure 606 in the first direction. Since the material usage of the first packaging structure 605 is increased, the sealing performance of the heat dissipation device 600 can be improved.
[0040] In the third case, the height of the first packaging structure 605 in the first direction is less than the height of the second packaging structure 606 in the first direction. As shown in FIG7(c), before the structural reinforcement 304 is buckled with the substrate 102, the material of the first packaging structure 605 is first set on the surface of the structural reinforcement 304, and then the structural reinforcement 304 is buckled with the substrate 102. The first packaging structure 605 is solidified and formed, and the structural reinforcement 304 and the substrate 102 are connected, so that the height of the first packaging structure 605 in the first direction is in the range of 50 to 500um. Then, the second packaging structure 606 is set between the structural reinforcement 304 and the substrate 102. A groove can be set at the position of the structural reinforcement 304 facing the substrate 102 to increase the spacing, and the height of the first packaging structure 605 in the first direction is finally made less than the height of the second packaging structure 606 in the first direction, and the sealing performance of the heat dissipation device 600 can be improved.
[0041] You can continue to refer to Figure 6 The heat dissipation device 600 further includes a second molded structure 608. The second molded structure 608 is disposed on a side surface of the substrate 102 facing the sealed chamber and is located between the second packaging structure 606 and the die 101. Similar to the above, the second molded structure 608 can be made of epoxy resin materials. By arranging the second molded structure 608 between the second packaging structure 606 and the die 101, the second packaging structure 606 can be prevented from contacting with the cooling medium in the sealed chamber, and the second packaging structure 606 can be prevented from being corroded by the cooling medium, thereby further improving the sealing performance of the heat dissipation device 600.
[0042] As an example, the first packaging structure 605 can be made of silicone glue, and / or the second packaging structure 606 can be made of epoxy resin glue. Both glues can be cured by common high-temperature heating curing or ultraviolet irradiation curing, but the process parameters required for curing of silicone glue and epoxy resin glue may be different. When using silicone glue to make the first packaging structure 605, the silicone glue can be placed in a heating environment for preheating for about 5 minutes, so that the silicone glue is gradually heated from the initial ambient temperature (30°C) to 125°C. Then, the heating temperature is fixed at 125°C and heated for 90 minutes, so that the silicone glue can be cured to form the first packaging structure 605. When using epoxy resin glue to make the second packaging structure 606, the epoxy resin glue is placed in a heating environment for preheating for about 5 minutes, so that the epoxy resin glue is gradually heated from the initial ambient temperature (30°C) to 160°C. Then, the heating temperature is fixed at 160°C and heated for 30 minutes, so that the epoxy resin glue can be cured to form the second packaging structure 606.
[0043] The heat dissipation device provided in the present application can be applied to various electronic devices. The electronic device can be a server, a personal computer, etc. The electronic device includes at least one chip and a heat dissipation device, and at least one chip is placed in a sealed chamber of the heat dissipation device. The heat dissipation device also includes a liquid pipeline connected to the medium inlet 105 and the medium outlet 106, and a driving device, a condenser, etc. connected to the liquid pipeline. The cooling medium is driven by the driving device to flow in the liquid pipeline and the sealed chamber. The cooling medium is input from the medium inlet 105 and output from the medium outlet 106, and then heated up, and then transported to the condenser via the liquid pipeline. The condenser cools the heated cooling medium and then inputs it into the sealed chamber again through the liquid pipeline to form a circulating cooling loop, which can continuously dissipate heat for at least one chip. It should be understood that the electronic device may include one or more of the above-mentioned heat dissipation devices, each heat dissipation device may include one or more chips, and the number of chips included in each heat dissipation device can be specifically determined according to the internal space of the electronic device and the arrangement of at least one chip, and this application does not make specific restrictions.
[0044] Obviously, those skilled in the art can make various changes and modifications to the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is also intended to include these modifications and variations.
Claims
1. A heat dissipation device, characterized in that: It includes a substrate, a structural reinforcement, a cover plate, a first packaging structure and a second packaging structure; The cover plate is buckled with the substrate through the structural reinforcement to form a sealed chamber, and the surface of the substrate facing the sealed chamber is used to set the chip; the cover plate is provided with a medium inlet and a medium outlet, the medium inlet is used to input the cooling medium into the sealed chamber, and the medium outlet is used to output the cooling medium in the sealed chamber; The substrate and the structural reinforcement are connected via the first packaging structure; The second packaging structure is located on a surface of the first packaging structure facing the sealed chamber, and is used to prevent the first packaging structure from contacting the cooling medium in the sealed chamber.
2. The device according to claim 1, characterized in that A blocking portion is provided on the substrate, and the second packaging structure is located between the blocking portion and a surface of the first packaging structure facing the sealed chamber.
3. The device according to claim 1 or 2, characterized in that Also includes: The first molding structure is used to seal the second packaging structure.
4. The device according to any one of claims 2, characterized in that The blocking part is made of frame sealing glue.
5. The device according to claim 1, characterized in that The substrate and the structural reinforcement are connected through the first packaging structure and the second packaging structure.
6. The device according to claim 5, characterized in that The first packaging structure and the second packaging structure have the same height in a first direction, where the first direction is a direction in which the substrate faces the cover plate; or, The height of the first encapsulation structure in the first direction is greater than the height of the second encapsulation structure in the first direction; or, A height of the first encapsulation structure in the first direction is smaller than a height of the second encapsulation structure in the first direction.
7. The device according to claim 5 or 6, characterized in that Also includes: A second molding structure is disposed on the substrate and located between the second packaging structure and the chip.
8. The device according to any one of claims 1 to 7, characterized in that: The height of the first packaging structure in the first direction is 50-500 um, and the first direction is the direction in which the substrate faces the cover.
9. The device according to any one of claims 1 to 8, characterized in that: The first packaging structure is made of silicone glue, and / or the second packaging structure is made of epoxy resin glue.
10. An electronic device, characterized in that: include: At least one chip and the heat dissipation device according to any one of claims 1 to 9, wherein the heat dissipation device is used to dissipate heat for the at least one chip.