Passive component packaging method, packaging structure and chip packaging method

Abstract

The embodiment of the invention provides a passive component packaging method, a packaging structure and a chip packaging method.The passive component packaging method comprises the steps that a second connecting piece is formed in the central area of the bottom of a passive component, and a second solder layer containing an isolation material body is formed at the position, corresponding to a non-bonding-pad position of the second connecting piece, of a substrate; in this way, in the reflow soldering process, the solder in the second solder layer enables the second connecting piece to be welded to the non-bonding-pad position of the substrate, and the two sides of the welded second connecting piece are extruded and filled with the isolation material bodies in the second solder layer under the action of tension at the high temperature, so that electrical connection between the first connecting pieces located on the two sides of the second connecting piece is isolated. According to the method, the problem that in the prior art, due to the fact that bottom sealing glue between the passive component and the substrate is not completely filled, tin on an electrode is fused and then is in bridge connection along a cavity at high temperature, and electrical property abnormity is caused can be completely solved, and the packaging reliability of the passive component is improved. And there is no need to fill underfill between the passive component and the substrate, so that the cost is reduced.

Description

Technical Field

[0001] The embodiments of the present disclosure belong to the field of semiconductor packaging technology, and specifically relate to a passive component packaging method and packaging structure, and a chip packaging method. Background Art

[0002] In order to increase the heat dissipation efficiency, FCBGA and FCLGA products usually use indium sheets or other metals to weld the metal on the chip and the metal on the heat dissipation cover together through flux to achieve the heat dissipation function. However, the flux will carry the molten liquid metal to volatilize and splash during high-temperature reflow. When the splashed metal falls on the passive components, it will cause the product to short-circuit. In order to protect passive components, the traditional method uses a protective cover to cover the capacitor to prevent the splashed metal from falling on the capacitor during high-temperature reflow and causing short-circuit abnormalities. However, with the market requirements, there are more and more passive components, the arrangement is becoming more and more irregular, the KOZ is getting smaller and smaller, and the package size is getting larger and larger. The morphology, KOZ and warping of the protective cover cannot meet the market demand. Therefore, the protection method of applying protective glue is derived. The problem with the method of applying protective glue is that the distance from the electrode on the capacitor to the substrate is too small (only 1um~10um), which makes it difficult to fill the bottom fill glue and thus produce voids. At high temperatures, the tin on the electrode melts and bridges along the void, causing electrical abnormalities.

[0003] In view of the above problems, it is necessary to propose a passive component packaging method and packaging structure, and a chip packaging method that are reasonably designed and effectively solve the above problems. Summary of the invention

[0004] The embodiments of the present disclosure aim to solve at least one of the technical problems existing in the prior art and provide a passive component packaging method and packaging structure, and a chip packaging method.

[0005] An aspect of an embodiment of the present disclosure provides a passive component packaging method.

[0006] Methods include:

[0007] Providing a substrate and a passive component, wherein a first connecting member is disposed at an edge area of ​​a bottom of the passive component;

[0008] forming a second connecting member in a central area of ​​the bottom of the passive component;

[0009] Forming a first solder layer at the pad of the substrate corresponding to the first connector, and forming a second solder layer at the non-pad of the substrate corresponding to the second connector, wherein the second solder layer contains an isolation material body;

[0010] Mounting the passive component on the substrate so that the first connector is connected to the first solder layer and the second connector is connected to the second solder layer;

[0011] The passive component is subjected to reflow soldering to fix the passive component to the substrate through the first connector and the second connector; wherein,

[0012] During the reflow process, the isolation material body in the second solder layer is squeezed and filled on both sides of the second connector after soldering under the action of tension at high temperature, so as to isolate the electrical connection between the first connectors located on both sides of the second connector;

[0013] A protective adhesive layer is formed on the surface of the passive component to wrap the passive component.

[0014] Optionally, there is a gap between the passive component and the substrate; wherein,

[0015] During the reflow process, the isolation material in the second solder layer is squeezed under tension at high temperature to fill the gaps on both sides of the second connector after soldering, so as to achieve underfill between the passive component and the substrate.

[0016] Optionally, forming a first solder layer at a pad of the substrate corresponding to the first connector, and forming a second solder layer at a non-pad of the substrate corresponding to the second connector, comprises:

[0017] A first opening is formed at a pad of the substrate corresponding to the first connector, and a second opening is formed at a non-pad of the substrate corresponding to the second connector;

[0018] The first solder layer is printed in the first opening window, and the second solder layer is printed in the second opening window.

[0019] Optionally, the first solder layer is solder paste, and the second solder layer is epoxy resin solder paste, wherein the isolation material body in the second solder layer is epoxy resin.

[0020] Optionally, the first connecting member is an external electrode of the passive component.

[0021] Optionally, forming a second connecting member in a central area at the bottom of the passive component includes:

[0022] When the external electrode is formed on the passive component, the second connecting member is simultaneously formed around the central area of ​​the passive component, wherein the material of the second connecting member is the same as that of the external electrode, and the second connecting member is electrically insulated from the internal electrode of the passive component.

[0023] Optionally, forming a protective adhesive layer wrapping the passive component on the surface of the passive component includes:

[0024] A high temperature resistant glue is coated on the surface of the passive component to form the protective glue layer wrapping the passive component.

[0025] Another aspect of the disclosed embodiment provides a passive component packaging structure, including a substrate, a passive component, a first connector, a second connector, an isolation layer, and a protective adhesive layer;

[0026] The first connecting member is arranged at an edge area of ​​the bottom of the passive component;

[0027] The second connecting member is arranged in the central area of ​​the bottom of the passive component;

[0028] The passive component is fixed to the substrate through the first connector and the second connector, wherein the passive component is electrically connected to the pad of the substrate through the first connector, and there is a gap between the passive component and the substrate;

[0029] The isolation layer fills at least a portion of the gap on both sides of the second connecting member;

[0030] The protective adhesive layer is wrapped around the surface of the passive component.

[0031] Optionally, the isolation layer fills the gap on both sides of the second connecting member.

[0032] Another aspect of the present disclosure provides a chip packaging method, the method comprising:

[0033] Provide substrates, chips and passive components;

[0034] Flip-chip the chip onto the substrate;

[0035] The passive components are fixed to the substrate; wherein the passive components are fixed to the substrate using the passive component packaging method described above;

[0036] A heat dissipation cover is provided on a side of the chip facing away from the substrate;

[0037] A plurality of solder balls are formed on a side of the substrate facing away from the chip.

[0038] The passive component packaging method and packaging structure, and chip packaging method of the disclosed embodiments, in the passive component packaging method, a second connector is formed in the central area at the bottom of the passive component, and a second solder layer containing an isolation material body is formed at the non-pad corresponding to the second connector on the substrate, so that during the reflow process, the solder in the second solder layer solders the second connector to the non-pad of the substrate, and the isolation material body in the second solder layer is squeezed and filled on both sides of the second connector after soldering under the action of tension at high temperature to isolate the electrical connection between the first connectors on both sides of the second connector. The problem of incomplete filling of the bottom sealant between the passive component and the substrate in the prior art, which causes the tin on the electrode to melt and bridge along the void at high temperature to cause electrical abnormality, can be completely improved, and the reliability of the passive component packaging can be improved. In addition, there is no need to fill the bottom sealant between the passive component and the substrate, which reduces the cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Figure 1 A schematic diagram of a process of a passive component packaging method according to an embodiment of the present disclosure;

[0040] Figures 2 to 6 A process schematic diagram of a passive component packaging method according to another embodiment of the present disclosure;

[0041] Figure 7 This is a structural schematic diagram of a passive component packaging structure of another embodiment of the present disclosure. DETAILED DESCRIPTION

[0042] In order to enable those skilled in the art to better understand the technical solutions of the embodiments of the present disclosure, the embodiments of the present disclosure are further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0043] like Figure 1 As shown, the present disclosure discloses a passive component packaging method S100, the method S100 comprising:

[0044] S110, providing a substrate and a passive component, wherein a first connecting member is disposed at an edge area of ​​a bottom of the passive component.

[0045] like Figure 2 and Figure 3 As shown, a substrate 110 and a passive component 120 are provided. A first connector 121 is disposed at an edge area at the bottom of the passive component 120 . The first connector 121 is used to fix the passive component 120 to the substrate 110 and to achieve electrical connection with the substrate 110 .

[0046] It should be noted that the passive component 120 may be a capacitor, an inductor, or a resistor, etc., and this embodiment does not specifically limit the type of the passive component 120. In this embodiment, the passive component 120 is described as a capacitor.

[0047] S120: forming a second connecting member in a central area at the bottom of the passive component.

[0048] like Figure 3 As shown, a second connection member 122 is formed in the central area of ​​the bottom of the passive component 120. The second connection member 122 is located between the first connection members 121.

[0049] Specifically, taking the passive component 120 as a capacitor as an example, the first connector 121 is an external electrode of the capacitor, and the external electrode has a plating layer. The second connector is formed in the central area of ​​the bottom of the passive component, and specifically includes:

[0050] When the passive component 120 forms the external electrode, the second connector 122 is formed around the central area of ​​the passive component 120 at the same time, wherein the material of the second connector 122 is the same as that of the external electrode, and the second connector 122 is electrically insulated from the internal electrode of the passive component 120. As long as the second connector 122 is formed at the bottom of the passive component 120, the second connector 122 can also be arranged around the central area of ​​the passive component 120.

[0051] That is to say, in this embodiment, the second connecting member 122 is a dummy electrode. The dummy electrode has the same material and operation process as the external electrode, but the dummy electrode is not connected to the internal electrode and is electrically insulated.

[0052] S130, forming a first solder layer at the pad of the substrate corresponding to the first connector, and forming a second solder layer at the non-pad of the substrate corresponding to the second connector, wherein the second solder layer contains an isolation material body.

[0053] like Figure 4 As shown, a first solder layer 130 is formed at the pad of the substrate 110 corresponding to the first connector 121 , and a second solder layer 140 is formed at the non-pad of the substrate 110 corresponding to the second connector 122 , wherein the second solder layer 140 contains an isolation material body.

[0054] Specifically, Figure 2 As shown, a first window 111 is formed at the pad of the substrate 110 corresponding to the first connector 121 , and a second window 112 is formed at the non-pad of the substrate 110 corresponding to the second connector 122 .

[0055] like Figure 4As shown, a first solder layer 130 is printed in the first opening window 111 , and a second solder layer 140 is printed in the second opening window 112 .

[0056] Preferably, in this embodiment, the first solder layer 130 is solder paste, and the second solder layer 140 is epoxy resin solder paste, wherein the isolation material body in the second solder layer 140 is epoxy resin.

[0057] It should be noted that there is no specific limitation on the types of the first solder layer 130 and the second solder layer 140 as long as they can achieve corresponding functions.

[0058] S140, mounting the passive component on the substrate so that the first connector is connected to the first solder layer and the second connector is connected to the second solder layer.

[0059] like Figure 5 As shown, the passive component 120 is mounted on the substrate 110 so that the first connection member 121 is connected to the first solder layer 130 and the second connection member 122 is connected to the second solder layer 140 .

[0060] Specifically, in this embodiment, the external electrodes of the capacitor are connected to solder paste, and the dummy electrodes of the capacitor are connected to epoxy solder paste, so that the capacitor is mounted on the substrate 110 .

[0061] S150, reflow soldering the passive component to fix the passive component to the substrate through the first connector and the second connector; wherein,

[0062] During the reflow process, the isolation material in the second solder layer is squeezed under tension at high temperature and filled on both sides of the second connector after soldering to isolate the electrical connection between the first connectors on both sides of the second connector.

[0063] like Figure 5 As shown, the mounted passive component 120 is reflowed to fix the passive component 120 to the substrate through the first connector 121 and the second connector 122. The first connector 122 realizes electrical connection between the passive component 120 and the substrate 110.

[0064] During the welding process, the isolation material in the second solder layer 140 is squeezed under high temperature and tension to fill both sides of the welded second connector 122 to form an isolation layer 150 to isolate the electrical connection between the first connectors 121 on both sides of the second connector 122.

[0065] Specifically, in this embodiment, during the welding process, the epoxy resin in the epoxy resin solder paste is squeezed under the action of tension at high temperature and filled on both sides of the dummy electrode after welding to isolate the electrical connection between the external electrodes located on both sides of the dummy electrode to prevent bridging.

[0066] It should be noted that during the welding process, the epoxy resin in the epoxy resin solder paste may partially fill the gaps on both sides of the dummy electrodes, or the epoxy resin in the epoxy resin solder paste may completely fill the gaps on both sides of the dummy electrodes.

[0067] Exemplarily, there is a gap between the passive component 120 and the substrate 110; wherein, during the reflow process, the isolation material body in the second solder layer 140 is squeezed under tension at high temperature to fill the gap on both sides of the second connector after soldering, so as to achieve the bottom filling between the passive component 120 and the substrate 110, so as to further fix the passive component 120 to the substrate 110. In other words, the isolation material body can play the role of bottom filling glue, and further fix the passive component 120 to the substrate 110.

[0068] S160: forming a protective adhesive layer wrapping the passive component on the surface of the passive component.

[0069] like Figure 6 As shown, high temperature resistant glue is coated on the surface of the passive component 120 to form a protective glue layer 160 that wraps the passive component 120 to prevent heat dissipation metal splashing and causing bridging.

[0070] Specifically, in this embodiment, high temperature resistant glue is coated on the surface of the capacitor to protect the outer electrodes of the capacitor.

[0071] The passive component packaging method of the disclosed embodiment forms a second connector in the central area at the bottom of the passive component and forms a second solder layer containing an isolation material body at the non-pad corresponding to the second connector on the substrate, so that during the reflow process, the solder in the second solder layer solders the second connector to the non-pad of the substrate, and the isolation material body in the second solder layer is squeezed and filled on both sides of the second connector after soldering under the action of tension at high temperature to isolate the electrical connection between the first connectors on both sides of the second connector. The problem of incomplete filling of the bottom sealant between the passive component and the substrate in the prior art, which causes the tin on the electrode to melt and bridge along the void at high temperature to cause electrical abnormality, can be completely improved, and the reliability of passive component packaging can be improved. In addition, there is no need to fill the bottom sealant between the passive component and the substrate, which reduces the cost.

[0072] like Figure 7As shown, another aspect of the embodiment of the present disclosure provides a passive component packaging structure 100 , including a substrate 110 , a passive component 120 , a first connector 121 , a second connector 122 , an isolation layer 150 and a protective adhesive layer 160 .

[0073] The first connecting member 121 is disposed at an edge region of the bottom of the passive component 120 .

[0074] The second connecting member 122 is disposed at the central area of ​​the bottom of the passive component 120 .

[0075] The passive component 120 is fixed to the substrate 110 through the first connector 121 and the second connector 122 , wherein the passive component 120 is electrically connected to the pad of the substrate 110 through the first connector 121 , and there is a gap between the passive component 120 and the substrate 110 .

[0076] The isolation layer 150 fills at least a portion of the gap on both sides of the second connector 122 , and electrically isolates the first connector 121 on both sides of the second connector 122 to prevent a bridging effect.

[0077] The protective adhesive layer 160 is wrapped around the surface of the passive component 120 to protect the entire passive component 120 .

[0078] Exemplarily, the isolation layer 150 may fill the gaps on both sides of the second connector 122 , play the role of an underfill layer, and further fix the passive component 120 to the substrate 110 .

[0079] The passive component packaging structure of the disclosed embodiment fixes the passive component to the substrate through the first connector and the second connector, wherein the isolation layer fills at least part of the gap between the passive component and the substrate on both sides of the second connector, plays the role of electrical isolation for the first connector on both sides of the second connector, prevents bridging, and improves the reliability of the passive component packaging. In addition, the isolation layer plays the role of bottom filling, and there is no need to fill bottom filling between the passive component and the substrate, which reduces the cost.

[0080] Another aspect of the present disclosure provides a chip packaging method, the chip packaging method comprising:

[0081] S210 , providing a substrate 110 , a chip and passive components 120 .

[0082] S220 , flip-chip and place the chip on the substrate 110 .

[0083] S230, fixing the passive component 120 on the substrate 110. The passive component 120 is fixed on the substrate 110 by using the passive component packaging method S100 described above.

[0084] It should be noted that the passive component packaging method S100 has been described in detail above and will not be repeated here.

[0085] S240 , disposing a heat dissipation cover on a side of the chip facing away from the substrate 110 .

[0086] S250 , forming a plurality of solder balls on a side of the substrate 110 facing away from the chip.

[0087] The chip packaging method of the disclosed embodiment adopts the passive component packaging method described above, which can completely improve the electrical abnormality problem caused by incomplete filling of the bottom sealing glue between the passive components and the substrate in the prior art, resulting in the tin on the electrode melting and bridging along the void at high temperature, thereby improving the reliability of the chip packaging structure.

[0088] It is to be understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of the embodiments of the present disclosure, but the embodiments of the present disclosure are not limited thereto. For those of ordinary skill in the art, various modifications and improvements can be made without departing from the spirit and essence of the embodiments of the present disclosure, and these modifications and improvements are also considered to be within the protection scope of the embodiments of the present disclosure.

Claims

1. A passive component packaging method, characterized in that: The method comprises: Providing a substrate and a passive component, wherein a first connecting member is disposed at an edge area of ​​a bottom of the passive component; forming a second connecting member in a central area of ​​the bottom of the passive component; Forming a first solder layer at the pad of the substrate corresponding to the first connector, and forming a second solder layer at the non-pad of the substrate corresponding to the second connector, wherein the second solder layer contains an isolation material body; Mounting the passive component on the substrate so that the first connector is connected to the first solder layer and the second connector is connected to the second solder layer; The passive component is subjected to reflow soldering to fix the passive component to the substrate through the first connector and the second connector; wherein, During the reflow process, the isolation material body in the second solder layer is squeezed and filled on both sides of the second connector after soldering under the action of tension at high temperature, so as to isolate the electrical connection between the first connectors located on both sides of the second connector; A protective adhesive layer is formed on the surface of the passive component to wrap the passive component.

2. The method according to claim 1, characterized in that There is a gap between the passive component and the substrate; wherein, During the reflow process, the isolation material in the second solder layer is squeezed under tension at high temperature to fill the gaps on both sides of the second connector after soldering, so as to achieve underfill between the passive component and the substrate.

3. The method according to claim 1, characterized in that Forming a first solder layer at a pad of the substrate corresponding to the first connector, and forming a second solder layer at a non-pad of the substrate corresponding to the second connector, comprising: A first opening is formed at a pad of the substrate corresponding to the first connector, and a second opening is formed at a non-pad of the substrate corresponding to the second connector; The first solder layer is printed in the first opening window, and the second solder layer is printed in the second opening window.

4. The method according to any one of claims 1 to 3, characterized in that: The first solder layer is solder paste, and the second solder layer is epoxy resin solder paste, wherein the isolation material body in the second solder layer is epoxy resin.

5. The method according to any one of claims 1 to 3, characterized in that: The first connecting member is an external electrode of the passive component.

6. The method according to claim 5, characterized in that The second connecting member is formed in the central area of ​​the bottom of the passive component, comprising: When the external electrode is formed on the passive component, the second connecting member is simultaneously formed around the central area of ​​the passive component, wherein the material of the second connecting member is the same as that of the external electrode, and the second connecting member is electrically insulated from the internal electrode of the passive component.

7. The method according to any one of claims 1 to 3, characterized in that: The step of forming a protective adhesive layer wrapping the passive component on the surface of the passive component comprises: A high temperature resistant glue is coated on the surface of the passive component to form the protective glue layer wrapping the passive component.

8. A passive component packaging structure, characterized in that: It includes a substrate, passive components, a first connector, a second connector, an isolation layer and a protective adhesive layer; The first connecting member is arranged at an edge area of ​​the bottom of the passive component; The second connecting member is arranged in the central area of ​​the bottom of the passive component; The passive component is fixed to the substrate through the first connector and the second connector, wherein the passive component is electrically connected to the pad of the substrate through the first connector, and there is a gap between the passive component and the substrate; The isolation layer fills at least a portion of the gap on both sides of the second connecting member; The protective adhesive layer is wrapped around the surface of the passive component.

9. The passive component packaging structure according to claim 8, characterized in that: The isolation layer fills the gaps on both sides of the second connecting member.

10. A chip packaging method, characterized in that: The method comprises: Provide substrates, chips and passive components; Flip-chip the chip onto the substrate; The passive component is fixed to the substrate; wherein the passive component is fixed to the substrate by adopting the passive component packaging method according to any one of claims 1 to 7; A heat dissipation cover is provided on a side of the chip facing away from the substrate; A plurality of solder balls are formed on a side of the substrate facing away from the chip.

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