Chip assembly

Abstract

The invention discloses a chip assembly. The chip assembly comprises a substrate; the heat dissipation cover is installed on one side of the substrate, a containing cavity is defined by the heat dissipation cover and the substrate, and the heat dissipation cover is provided with a first heat conduction part; the chip is installed in the containing cavity, the chip is provided with a first heat dissipation socket, and at least part of the first heat conduction part is inserted into the first heat dissipation socket. According to the chip assembly, installation and protection of the chip can be achieved by arranging the heat dissipation cover and the substrate, damage and failure caused by collision or extrusion between the chip and external parts or surface oxidation or pollution caused by erosion of moisture and dust in air are avoided, the service life of the chip can be prolonged, and the service life of the chip is prolonged. The heat dissipation cover and the chip can be connected by inserting at least part of the first heat conduction part into the first heat dissipation socket, the reliability of transferring heat of the chip to the heat dissipation cover can be improved, and then the reliability of cooling the chip can be improved.

Description

Technical Field

[0001] The present invention relates to the field of chip technology, and in particular to a chip component. Background Art

[0002] Nowadays, due to the slow advancement of wafer process nodes and the low process yield, advanced integrated packaging has become the industry's preferred solution, such as fan-out packaging (FOP), 2.5D (Chip On Wafer On Substrate, COWOS) packaging, etc. This type of packaging often integrates multiple chips on a polyimide (PI) or silicon (Si licon, Si) adapter board, which is then soldered to the packaging substrate and finally protected with a heat sink.

[0003] Among them, the more integrated chips are, the higher the heat generated by the chip when working. In the heat dissipation path of the entire chip, upward heat dissipation is the main path. In this path, the thermal conductivity of the heat dissipation cover is usually 387W / (m*K), the thermal conductivity of the thermal interface material (TIM) is 4.5W / (m*K), and the thermal conductivity of Si is 180W / (m*K). It can be seen that the weakest heat dissipation link is TIM. For this reason, the industry has introduced more types of TIM, but the thermal conductivity of most TIMs is still around 3-5W / (m*K). Among them, the thermal conductivity of indium sheets can reach about 80W / (m*K), but it is still the component with the lowest thermal conductivity in the entire main heat dissipation path. The reliability of transferring heat to the chip is low, and there is room for improvement. Summary of the invention

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention provides a chip assembly, which can realize the installation and protection of the chip, and can transfer the heat generated by the chip during operation along the first heat conduction part to the heat dissipation cover for release, thereby improving the reliability of the heat transfer of the chip to the heat dissipation cover, and further improving the reliability of cooling the chip.

[0005] According to an embodiment of the present invention, the chip assembly includes: a substrate; a heat dissipation cover, which is installed on one side of the substrate and defines a receiving cavity with the substrate, and the heat dissipation cover is provided with a first heat conduction portion; a chip, which is installed in the receiving cavity, and the chip is provided with a first heat dissipation socket, and at least a part of the first heat conduction portion is plugged into the first heat dissipation socket.

[0006] According to the chip assembly of the embodiment of the present invention, by connecting the heat dissipation cover with the substrate, the heat dissipation cover and the substrate can jointly define a receiving cavity to provide an installation position for the chip, and the heat dissipation cover and the substrate can jointly protect the chip to avoid damage and failure caused by collision or extrusion between the chip and external components, or oxidation or contamination of the surface caused by corrosion by moisture and dust in the air, thereby extending the service life of the chip, and the connection between the heat dissipation cover and the chip can be achieved by plugging at least a part of the first heat conduction part into the first heat dissipation socket, so that the heat generated by the chip during operation can be transferred along the first heat conduction part to the heat dissipation cover for release, which can improve the reliability of heat transfer from the chip to the heat dissipation cover, and further improve the reliability of cooling the chip.

[0007] According to the chip assembly of some embodiments of the present invention, there are a plurality of the first heat conducting parts and a plurality of the first heat dissipation sockets, and the plurality of the first heat conducting parts are plugged and matched with the plurality of the first heat dissipation sockets in a one-to-one correspondence.

[0008] In the chip assembly according to some embodiments of the present invention, a plurality of the first heat conducting parts are distributed in an array at intervals.

[0009] In the chip assembly according to some embodiments of the present invention, there is one chip, and one chip is provided with a plurality of the first heat dissipation sockets.

[0010] According to the chip assembly of some embodiments of the present invention, there are multiple chips, and there are multiple groups of the first heat conducting parts, and the multiple groups of the first heat conducting parts are plugged and matched with the first heat dissipation sockets of the multiple chips in a one-to-one correspondence.

[0011] According to the chip assembly of some embodiments of the present invention, a plurality of groups of the first heat conducting parts are distributed at intervals along the length direction of the heat dissipation cover.

[0012] According to some embodiments of the chip assembly of the present invention, the distribution density of the first heat conducting parts in any two groups is the same; or, the distribution density of the first heat conducting parts in at least two groups is different.

[0013] According to the chip assembly of some embodiments of the present invention, the depth of the first heat dissipation socket along the insertion direction of the first heat conducting portion is greater than or equal to half the thickness of the chip.

[0014] According to some embodiments of the present invention, the chip assembly further includes a heat-conducting layer, which is disposed in the accommodating cavity and between the heat dissipation cover and the chip, and the first heat-conducting portion penetrates the heat-conducting layer.

[0015] According to the chip assembly of some embodiments of the present invention, the heat dissipation cover includes a top plate and a side panel, wherein the side panel is connected to a side of the top plate facing the substrate, and the side panel is connected to the substrate and separates the top plate from the substrate to jointly define the accommodating cavity.

[0016] In the chip assembly according to some embodiments of the present invention, the first heat conducting portion is disposed on the top plate and is configured to protrude toward the substrate.

[0017] According to the chip assembly of some embodiments of the present invention, the top plate is further provided with a second heat conducting portion, the second heat conducting portion is spaced apart from the side surrounding plate, and the second heat conducting portion is used for thermally cooperating with the substrate.

[0018] According to the chip assembly of some embodiments of the present invention, the substrate is provided with a second heat dissipation socket, and at least a portion of the second heat conducting portion is plugged into the second heat dissipation socket.

[0019] According to some embodiments of the present invention, the chip assembly further includes an adapter plate, wherein the chip is located above the substrate, and the adapter plate is supported between the chip and the substrate; wherein the first heat conducting portion is disposed on the top wall of the accommodating cavity, and the first heat dissipation socket is opened on the upper surface of the chip.

[0020] According to the chip assembly of some embodiments of the present invention, a first protrusion is connected between the chip and the adapter board, and the chip and the adapter board are separated; and / or a second protrusion is connected between the adapter board and the substrate, and the adapter board is separated from the substrate.

[0021] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0023] Figure 1 Schematic diagram of the structure of a chip assembly according to an embodiment of the present invention Figure 1 ;

[0024] Figure 2 Schematic diagram of the structure of a chip assembly according to an embodiment of the present invention Figure 2 ;

[0025] Figure 3 is a cross-sectional schematic diagram of a heat dissipation cover according to an embodiment of the present invention;

[0026] Figure 4 FIG. 1 is a bottom view of a heat dissipation cover according to an embodiment of the present invention. Figure 1 ;

[0027] Figure 5 FIG. 1 is a bottom view of a heat dissipation cover according to an embodiment of the present invention. Figure 2 ;

[0028] Figure 6 Schematic diagram of the structure of a chip assembly according to an embodiment of the present invention Figure 3 ;

[0029] Figure 7 Schematic diagram of the structure of a chip assembly according to an embodiment of the present invention Figure 4 .

[0030] Reference numerals:

[0031] Chip assembly 100,

[0032] Substrate 1, accommodating cavity 11, solder ball 12, epoxy resin 13, second heat dissipation socket 14, heat dissipation cover 2, first heat conduction part 21, top plate 22, side panel 23, second heat conduction part 24, chip 3, first heat dissipation socket 31, first protrusion 32, sealant 33, heat conduction layer 4, adapter plate 5, second protrusion 51. DETAILED DESCRIPTION

[0033] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0034] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0035] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0036] Reference below Figure 1-Figure 7 A chip assembly 100 according to an embodiment of the present invention is described. By connecting the heat dissipation cover 2 to the substrate 1, the heat dissipation cover 2 and the substrate 1 can jointly define a receiving cavity 11 to provide an installation position for the chip 3, and the heat dissipation cover 2 and the substrate 1 can jointly protect the chip 3 to prevent the chip 3 from colliding or being squeezed with external components and causing damage and failure, or from being oxidized or contaminated on the surface due to corrosion by moisture and dust in the air, thereby extending the service life of the chip 3, and the connection between the heat dissipation cover 2 and the chip 3 can be achieved by plugging at least a portion of the first heat conducting portion 21 into the first heat dissipation socket 31, so that the heat generated by the chip 3 during operation can be transferred along the first heat conducting portion 21 to the heat dissipation cover 2 for release, which can improve the reliability of the heat transfer of the chip 3 to the heat dissipation cover 2, and further improve the reliability of cooling the chip 3.

[0037] like Figure 1-Figure 2 As shown, a chip assembly 100 according to an embodiment of the present invention includes: a substrate 1, a heat dissipation cover 2 and a chip 3.

[0038] The heat dissipation cover 2 is installed on one side of the substrate 1 and defines a receiving cavity 11 with the substrate 1. The heat dissipation cover 2 is provided with a first heat dissipation portion 21. The chip 3 is installed in the receiving cavity 11. The chip 3 is provided with a first heat dissipation socket 31. At least a portion of the first heat dissipation portion 21 is plugged into the first heat dissipation socket 31.

[0039] Specifically, the chip 3 is a core component in the chip assembly 100, and is used to realize data processing functions or control functions, etc. The heat dissipation cover 2 is installed on one side of the substrate 1, and the heat dissipation cover 2 and the substrate 1 are directly connected, so that the heat dissipation cover 2 and the substrate 1 can jointly define a accommodating cavity 11, and then the chip 3 can be installed in the accommodating cavity 11, so that the heat dissipation cover 2 and the substrate 1 can jointly protect the chip 3 to avoid damage or failure caused by collision or extrusion between the chip 3 and external components, and can prevent the chip 3 from being eroded by moisture and dust in the air, and avoid oxidation or contamination of the surface of the chip 3, thereby extending the service life of the chip 3.

[0040] In such Figure 1-Figure 2In the illustrated embodiment, the heat dissipation cover 2 and the substrate 1 are arranged along the up-down direction, and the heat dissipation cover 2 is connected to the top of the substrate 1, so that the heat dissipation cover 2 and the substrate 1 can jointly define a housing cavity 11 to provide an installation position for the chip 3, and the chip 3 is installed in the housing cavity 11, and the heat dissipation cover 2, the chip 3 and the substrate 1 can be arranged in sequence, so that the substrate 1 can be located below the chip 3 to provide stable physical support for the chip 3 to prevent damage to the chip 3 by external force, and the heat dissipation cover 2 can be located above the chip 3 to conduct away the heat generated during the operation of the chip 3, thereby reducing the temperature of the chip 3 and preventing the chip 3 from being damaged due to overheating, wherein the heat dissipation cover 2 can be made of a high thermal conductivity material, such as copper or stainless steel.

[0041] Furthermore, the heat dissipation cover 2 is provided with a first heat conducting part 21, and the chip 3 is provided with a first heat dissipation socket 31. At least a portion of the first heat conducting part 21 can be plugged into the first heat dissipation socket 31, that is, part or all of the first heat conducting part 21 can be plugged into the first heat dissipation socket 31, so that the connection between the heat dissipation cover 2 and the chip 3 is realized through the cooperation between the first heat conducting part 21 and the first heat dissipation socket 31, so that the heat generated by the chip 3 during operation can be transferred to the heat dissipation cover 2 along the first heat conducting part 21, and then can be released through the heat dissipation cover 2, wherein, by connecting the heat dissipation cover 2 with the chip 3, the reliability of the heat transfer of the chip 3 to the heat dissipation cover 2 can be improved, and then the reliability of cooling the chip 3 can be improved, and the first heat conducting part 21 can be formed by forging or casting.

[0042] According to the chip assembly 100 of the embodiment of the present invention, by connecting the heat dissipation cover 2 with the substrate 1, the heat dissipation cover 2 and the substrate 1 can jointly define a accommodating cavity 11 to provide an installation position for the chip 3, and the heat dissipation cover 2 and the substrate 1 can jointly protect the chip 3 to avoid the chip 3 from colliding or squeezing with external components and causing damage and failure, or erosion by moisture and dust in the air and causing surface oxidation or contamination, thereby extending the service life of the chip 3, and the connection between the heat dissipation cover 2 and the chip 3 can be achieved by plugging at least a portion of the first heat conducting portion 21 into the first heat dissipation socket 31, so that the heat generated by the chip 3 during operation can be transferred along the first heat conducting portion 21 to the heat dissipation cover 2 for release, which can improve the reliability of the heat transfer of the chip 3 to the heat dissipation cover 2, and further improve the reliability of cooling the chip 3.

[0043] In some embodiments, there are multiple first heat conducting parts 21 and multiple first heat dissipation sockets 31 , and the multiple first heat conducting parts 21 are plugged and matched with the multiple first heat dissipation sockets 31 in a one-to-one correspondence.

[0044] Specifically, the first heat conducting part 21 is arranged on the heat dissipation cover 2, the first heat dissipation socket 31 is formed on the chip 3, and the first heat conducting part 21 and the first heat dissipation socket 31 are used to realize the connection between the heat dissipation cover 2 and the chip 3, so as to transfer the heat generated by the chip 3 during the operation process to the heat dissipation cover 2 along the first heat conducting part 21. The first heat conducting part 21 and the first heat dissipation socket 31 can be set to multiple, that is, the number of the first heat conducting part 21 and the first heat dissipation socket 31 can be two, three or more, so that the connection between the heat dissipation cover 2 and the chip 3 can be realized through multiple first heat conducting parts 21 and multiple first heat dissipation sockets 31, thereby improving the reliability of the connection between the heat dissipation cover 2 and the chip 3, that is, improving the reliability and efficiency of the heat transfer of the chip 3 to the heat dissipation cover 2.

[0045] Furthermore, the plurality of first heat-conducting parts 21 are plugged and matched with the plurality of first heat-dissipating sockets 31 in a one-to-one correspondence, that is, for each first heat-conducting part 21, a first heat-dissipating socket 31 is provided for accommodating the first heat-conducting part 21, which can effectively improve the connection reliability between the heat-dissipating cover 2 and the chip 3, and further effectively improve the reliability and efficiency of the heat transfer from the chip 3 to the heat-dissipating cover 2, so as to quickly cool down the chip 3 and prevent the chip 3 from being damaged due to overheating.

[0046] In some embodiments, the plurality of first heat conducting portions 21 are distributed in an array at intervals.

[0047] Specifically, the first heat conducting parts 21 and the first heat dissipation sockets 31 are both provided in plurality, and the plurality of first heat conducting parts 21 are plugged in and matched with the plurality of first heat dissipation sockets 31 in a one-to-one correspondence, which can effectively improve the reliability and efficiency of the heat transfer from the chip 3 to the heat dissipation cover 2. The plurality of first heat conducting parts 21 are distributed in an array-like manner, so that the plurality of first heat conducting parts 21 are spaced apart and neatly arranged, which can avoid interference between the plurality of first heat conducting parts 21, resulting in reduced reliability and efficiency of heat transfer to the chip 3. Moreover, by neatly arranging the plurality of first heat conducting parts 21, the number of the first heat conducting parts 21 can be increased without increasing the setting area of ​​the heat dissipation cover 2, thereby further improving the reliability and efficiency of the heat transfer from the chip 3 to the heat dissipation cover 2.

[0048] It should be noted that the number of the first heat conducting parts 21 can be provided in a corresponding array form by balancing thermal simulation and process capability.

[0049] In some embodiments, there is one chip 3 , and one chip 3 is provided with a plurality of first heat dissipation sockets 31 .

[0050] Specifically, Figure 2As shown, the number of chips 3 can be one, that is, one chip 3 can be arranged in the accommodating cavity 11, so that the heat dissipation cover 2 and the substrate 1 can jointly install and protect the chip 3, and a plurality of first heat dissipation sockets 31 are provided on the chip 3, so that the plurality of first heat conducting parts 21 on the heat dissipation cover 2 can be plugged and matched with the plurality of first heat dissipation sockets 31 on the chip 3 in a one-to-one correspondence, so that the heat of the chip 3 can be transferred to the heat dissipation cover 2 through the cooperation of the plurality of first heat conducting parts 21 and the plurality of first heat dissipation sockets 31 at the same time, thereby improving the reliability and efficiency of transferring the heat of the chip 3 to the heat dissipation cover 2, and quickly cooling the chip 3 to avoid overheating and damage.

[0051] In some embodiments, there are multiple chips 3 and multiple groups of first heat conducting parts 21 , and the multiple groups of first heat conducting parts 21 are plugged and matched with the first heat dissipation sockets 31 of the multiple chips 3 in a one-to-one correspondence.

[0052] Specifically, Figure 1 As shown, the number of chips 3 can be multiple, that is, multiple chips 3 can be arranged in the accommodating cavity 11 at the same time, so that the heat dissipation cover 2 and the substrate 1 can jointly install and protect the multiple chips 3, and the first heat-conducting parts 21 are multiple groups, and the multiple groups of first heat-conducting parts 21 are plugged and matched with the first heat dissipation sockets 31 of the multiple chips 3 one by one, that is, for each first heat dissipation socket 31 on the chip 3, a group of first heat-conducting parts 21 is provided to be plugged and matched therewith, so as to transfer the heat on each chip 3 to the heat dissipation cover 2 respectively, and then the multiple chips 3 can be cooled at the same time, and the working efficiency of the heat dissipation cover 2 can be improved.

[0053] It should be noted that each group of first heat-conducting parts 21 includes multiple first heat-conducting parts 21, and each chip 3 is also provided with multiple first heat-dissipating sockets 31, that is, each chip 3 can be connected to the heat dissipation cover 2 through the cooperation between multiple first heat-dissipating sockets 31 and multiple first heat-conducting parts 21, so as to quickly transfer the heat on multiple chips 3 to the heat dissipation cover 2 at the same time, thereby improving the reliability of cooling down multiple chips 3 at the same time.

[0054] In some embodiments, a plurality of groups of first heat conducting portions 21 are spaced apart and distributed along the length direction of the heat dissipation cover 2 .

[0055] Specifically, multiple groups of first heat-conducting parts 21 are plugged into and matched with the first heat dissipation sockets 31 of multiple chips 3 in a one-to-one correspondence. The multiple groups of first heat-conducting parts 21 are spaced apart and distributed, so that there is a certain distance between the multiple groups of first heat-conducting parts 21, thereby avoiding interference between the multiple groups of first heat-conducting parts 21, which leads to reduced reliability and efficiency of heat transfer to the chip 3. The multiple groups of first heat-conducting parts 21 are distributed along the length direction of the heat dissipation cover 2, so that the number of first heat-conducting parts 21 can be increased, and correspondingly, the number of chips 3 can also be increased, thereby improving the integration and performance of the chip assembly 100, and enabling the heat dissipation cover 2 to cool down multiple chips 3 at the same time, so as to improve the working efficiency of the heat dissipation cover 2.

[0056] For example, Figure 1 As shown, three groups of first heat-conducting parts 21 are arranged along the length direction of the heat dissipation cover 2, that is, three chips 3 are also arranged in the accommodating cavity 11 at the same time, which can improve the integration and performance of the chip assembly 100, and the three groups of first heat-conducting parts 21 can be used to cool down the three chips 3 at the same time to improve the working efficiency of the heat dissipation cover 2.

[0057] It should be noted that the number of chips 3 and first heat conducting parts 21 is not limited to that described in this embodiment, and can be flexibly arranged according to specific needs and space size.

[0058] In some embodiments, the distribution density of the first heat conducting parts 21 in any two groups is the same; or, the distribution density of the first heat conducting parts 21 in at least two groups is different.

[0059] Specifically, each group of first heat conducting parts 21 corresponds to a chip 3. Figure 5 As shown, by constructing the distribution density of any two groups of first heat-conducting parts 21 to be different, the distribution density of each group of first heat-conducting parts 21 can be adapted to different chips 3, that is, to the heat dissipation conditions of different chips 3, and then the number of first heat-conducting parts 21 can be increased at chips 3 with larger heat dissipation to enhance the cooling effect on the chip 3, and the number of first heat-conducting parts 21 can be reduced at chips 3 with smaller heat dissipation to reduce the setting cost while ensuring the cooling effect on the chip 3.

[0060] Alternatively, the distribution density of at least two groups of the first heat conducting parts 21 may be constructed to be different, that is, the distribution density of two groups of the first heat conducting parts 21 may be constructed to be different, or the distribution numbers of the three groups of the first heat conducting parts 21 may be constructed to be different, so that the distribution density of each group of the first heat conducting parts 21 can be adapted to different chips 3 respectively, that is, can be adapted to the heat dissipation conditions of different chips 3, thereby improving the cooling effect on the chip 3 or reducing the setting cost while ensuring the cooling effect on the chip 3, which is conducive to improving user satisfaction.

[0061] In some embodiments, the depth of the first heat dissipation socket 31 along the insertion direction of the first heat conducting portion 21 is greater than or equal to half the thickness of the chip 3 .

[0062] Specifically, the first heat-conducting portion 21 is arranged on the heat dissipation cover 2, the first heat dissipation socket 31 is formed on the chip 3, and the first heat-conducting portion 21 can be plugged into the first heat dissipation socket 31, and the depth of the first heat dissipation socket 31 along the insertion direction of the first heat-conducting portion 21 is constructed to be greater than or equal to half of the thickness of the chip 3, that is, the length of the first heat-conducting portion 21 that can extend into the inside of the chip 3 is greater than or equal to half of the thickness of the chip 3, which can ensure that the matching length between the first heat-conducting portion 21 and the first heat dissipation socket 31 is not too short, thereby ensuring the connection reliability between the heat dissipation cover 2 and the chip 3, and further ensuring the reliability of transferring the heat of the chip 3 to the heat dissipation cover 2.

[0063] Furthermore, it should be noted that the depth of the first heat dissipation socket 31 along the insertion direction of the first heat conducting portion 21 should not be too long, so as to avoid affecting the chip 3 and causing damage and failure of the chip 3 .

[0064] In some embodiments, the chip assembly 100 further includes a heat-conducting layer 4 , which is disposed in the accommodating cavity 11 and between the heat dissipation cover 2 and the chip 3 , and the first heat-conducting portion 21 penetrates the heat-conducting layer 4 .

[0065] Specifically, the thermal conductive layer 4 can be used to reduce thermal resistance and improve heat conduction efficiency. The thermal conductive layer 4 is arranged in the accommodating cavity 11, so that the thermal conductive layer 4 can be conveniently arranged between the heat dissipation cover 2 and the chip 3, so that the thermal conductive layer 4 can be used to fill the gap between the heat dissipation cover 2 and the chip 3 to exclude air and reduce the contact thermal resistance between the heat dissipation cover 2 and the chip 3. By arranging the thermal conductive layer 4, an effective heat conduction channel can be established between the heat dissipation cover 2 and the chip 3, so that the heat of the chip 3 can be transferred from the chip 3 to the heat dissipation cover 2 more quickly, so as to improve the efficiency of cooling the chip 3. Among them, the thermal conductive layer 4 can be a thermal interface material, that is, a material that improves the heat conduction efficiency.

[0066] Furthermore, the heat of the chip 3 can be directly transferred to the heat dissipation cover 2 through the thermal conductive layer 4, or can be transferred to the heat dissipation cover 2 through the first thermal conductive part 21, which can improve the reliability and efficiency of the heat transfer of the chip 3 to the heat dissipation cover 2, so as to achieve rapid cooling of the chip 3 and effectively avoid overheating and damage of the chip 3.

[0067] Furthermore, the heat conducting layer 4 is disposed between the heat dissipation cover 2 and the chip 3, and the heat dissipation cover 2, the heat conducting layer 4 and the chip 3 can be disposed in sequence, and the first heat conducting portion 21 can penetrate the heat conducting layer 4, which can facilitate the first heat conducting portion 21 to extend from the side of the heat conducting layer 4 toward the heat dissipation cover 2 to the side toward the chip 3, and then extend to the first heat dissipation socket 31 to transfer the heat of the chip 3, thereby improving the reliability of cooling the chip 3.

[0068] In some embodiments, the heat dissipation cover 2 includes a top plate 22 and a side panel 23 , wherein the side panel 23 is connected to the side of the top plate 22 facing the base plate 1 , and the side panel 23 is connected to the base plate 1 and separates the top plate 22 from the base plate 1 to jointly define the accommodating cavity 11 .

[0069] Specifically, the heat dissipation cover 2 is connected to the substrate 1 to jointly define the accommodating cavity 11, and the substrate 1 is constructed in a flat plate shape. The heat dissipation cover 2 includes a top plate 22 and a side panel 23. The side panel 23 is connected to the top plate 22 so that the heat dissipation cover 2 is a whole, which can improve the overall structural strength of the heat dissipation cover 2 and the reliability of protecting the chip 3. The side panel 23 is arranged on the side of the top plate 22 facing the substrate 1 to facilitate connecting the side panel 23 to the substrate 1 to achieve the connection between the heat dissipation cover 2 and the substrate 1, so that the heat dissipation cover 2 and the substrate 1 can jointly define the accommodating cavity 11, that is, the two ends of the side panel 23 are respectively connected to the top plate 22 and the substrate 1, and the side panel 23 has a certain height, so that the side panel 23 can separate the top plate 22 from the substrate 1, so that the accommodating cavity 11 can have a certain height, which is convenient for installing the chip 3.

[0070] It should be noted that the side panel 23 can be constructed to extend along the circumference of the top plate 22, so that when the top plate 22 is connected to the substrate 1 through the side panel 23, the accommodating cavity 11 can be sealed to protect the chip 3 from the influence of the external environment, such as humidity, dust, etc., thereby improving the reliability and performance of the chip 3.

[0071] In some embodiments, the first heat conducting portion 21 is disposed on the top plate 22 and is configured to protrude toward the substrate 1 .

[0072] Specifically, the first heat-conducting portion 21 is arranged on the heat dissipation cover 2. The first heat-conducting portion 21 is arranged on the top plate 22, so that the first heat-conducting portion 21 can be arranged on the heat dissipation cover 2, so that the first heat-conducting portion 21 can transfer the heat of the chip 3 to the heat dissipation cover 2 for release, and the heat dissipation cover 2, the chip 3 and the substrate 1 are arranged in sequence, and the first heat-conducting portion 21 is constructed to protrude toward the substrate 1, that is, the first heat-conducting portion 21 can protrude toward the chip 3, so that the first heat-conducting portion 21 can have a certain length, so that the first heat-conducting portion 21 can extend from the heat dissipation cover 2 to the chip 3 to extend into the first heat dissipation socket 31 of the chip 3, and transfer the heat of the chip 3 to the heat dissipation cover 2.

[0073] In some embodiments, the top plate 22 is further provided with a second heat conducting portion 24 , the second heat conducting portion 24 is spaced apart from the side surrounding plate 23 , and the second heat conducting portion 24 is used for heat conducting cooperation with the base plate 1 .

[0074] Specifically, Figure 6As shown, the top plate 22 is provided with a second heat-conducting portion 24, and the second heat-conducting portion 24 is used to cooperate with the substrate 1 for heat conduction, that is, the second heat-conducting portion 24 can be extended in the up and down direction, so that the second heat-conducting portion 24 can extend from the top plate 22 to the substrate 1 and approach it, so as to be connected with the substrate 1, so that the heat on the substrate 1 can be transferred to the top plate 22 along the second heat-conducting portion 24, that is, transferred to the heat dissipation cover 2, so as to be released through the heat dissipation cover 2. At the same time, the top plate 22 can also be supported by the second heat-conducting portion 24 to ensure that the accommodating cavity 11 has a certain height, which can be used to accommodate the chip 3, and the second heat-conducting portion 24 is separated from the side panel 23, so as to avoid interference between the second heat-conducting portion 24 and the side panel 23, resulting in the inability to set the second heat-conducting portion 24, thereby reducing the reliability of heat transfer on the substrate 1.

[0075] It should be noted that the substrate 1 is arranged below the chip 3, and part of the heat generated by the chip 3 will be transferred to the substrate 1. The heat on the substrate 1 can be released through the second heat conducting part 24, and the chip 3 can be cooled to a certain extent, which can further ensure the reliability of the chip 3.

[0076] In some embodiments, the substrate 1 is provided with a second heat dissipation socket 14 , and at least a portion of the second heat conducting portion 24 is plugged into the second heat dissipation socket 14 .

[0077] Specifically, the second heat conducting portion 24 is used to cooperate with the substrate 1 for heat conduction. Figure 7 As shown, the substrate 1 is provided with a second heat dissipation socket 14, and at least a portion of the second heat conducting part 24 is plugged into the second heat dissipation socket 14, that is, part or all of the second heat conducting part 24 can be plugged into the second heat dissipation socket 14, so that the connection between the heat dissipation cover 2 and the substrate 1 is realized through the cooperation between the second heat conducting part 24 and the second heat dissipation socket 14, so that the heat on the substrate 1 can be transferred to the heat dissipation cover 2 along the second heat conducting part 24, and then can be released through the heat dissipation cover 2, thereby further ensuring the reliability of the chip 3.

[0078] It should be noted that the second heat conducting part 24 and the second heat dissipation socket 14 are both multiple and arranged in one-to-one correspondence, that is, for each second heat conducting part 24, there is a second heat dissipation socket 14 that can be used to cooperate with the second heat conducting part 24, which can improve the reliability of heat transfer on the substrate 1.

[0079] In some embodiments, the chip assembly 100 also includes an adapter board 5, the chip 3 is located above the substrate 1, and the adapter board 5 is supported between the chip 3 and the substrate 1; wherein the first heat conducting portion 21 is arranged on the top wall of the accommodating cavity 11, and the first heat dissipation socket 31 is opened on the upper surface of the chip 3.

[0080] Specifically, the adapter board 5 is used to realize the connection between the chip 3 and other electronic components. By supporting the adapter board 5 between the chip 3 and the substrate 1, the chip 3 can be conveniently connected to other external electronic components through the adapter board 5. The adapter board 5 can also act as an intermediate layer between the chip 3 and the substrate 1, so as to connect the chip 3 to the substrate 1 and fix the chip 3. In addition, the adapter board 5 can also play a certain supporting role to provide stable physical support for the chip 3.

[0081] It should be noted that the adapter plate 5 is disposed below the chip 3, and the adapter plate 5 can be disposed below multiple chips 3 at the same time to integrate the multiple chips 3 together and realize the connection between the chips 3 and the chips 3. Figure 2 As shown, in the structure of the flip-chip ball grid array of the chip 3, the adapter plate 5 may not be provided, and the chip 3 may be directly placed above the substrate 1 and the two may be connected, so that the chip 3 may be connected to other external electronic components through the substrate 1.

[0082] Furthermore, the first heat-conducting portion 21 is disposed on the top wall of the accommodating cavity 11, and the first heat dissipation socket 31 is opened on the upper surface of the chip 3. The first heat-conducting portion 21 and the first heat-dissipating socket 31 can be disposed opposite to each other, so that the first heat-conducting portion 21 can extend toward the first heat-dissipating socket 31 to extend to the inside of the first heat-dissipating socket 31, thereby realizing the connection between the heat dissipation cover 2 and the chip 3, and then the heat of the chip 3 can be transferred to the heat dissipation cover 2 through the first heat-conducting portion 21 for release, thereby realizing cooling of the chip 3.

[0083] In some embodiments, a first protrusion 32 is connected between the chip 3 and the adapter board 5 to separate the chip 3 and the adapter board 5; and / or a second protrusion 51 is connected between the adapter board 5 and the substrate 1 to separate the adapter board 5 and the substrate 1.

[0084] Specifically, the first protrusion 32 is arranged between the chip 3 and the adapter board 5, so that the first protrusion 32 can realize the connection between the chip 3 and the adapter board 5, and then the connection between the chip 3 and other electronic components can be realized through the adapter board 5, and the first protrusion 32 can also provide certain physical support for the chip 3. At the same time, the first protrusion 32 can separate the chip 3 from the adapter board 5 to avoid interference between the two, that is, the reliability of the chip 3 and the adapter board 5 can be improved by setting the first protrusion 32, and there are multiple first protrusions 32, and the multiple first protrusions 32 are spaced apart and distributed, so that the chip 3 and the adapter board 5 can be connected at multiple positions at the same time through the multiple first protrusions 32, which can improve the connection reliability and stability between the two, wherein the first protrusion 32 can be constructed as a bump arranged under the chip 3.

[0085] At the same time, the second protrusion 51 is arranged between the adapter board 5 and the substrate 1, so that the second protrusion 51 can realize the connection between the adapter board 5 and the substrate 1, and then the connection between the chip 3 and the substrate 1 can be realized through the adapter board 5, so as to connect the chip 3 with other external electronic components through the substrate 1, and the second protrusion 51 can also provide a certain physical support for the adapter board 5. At the same time, the second protrusion 51 can separate the adapter board 5 from the substrate 1 to avoid interference between the two, that is, the reliability of the operation of the adapter board 5 and the substrate 1 can be improved by setting the second protrusion 51, and there are multiple second protrusions 51, and the multiple second protrusions 51 are spaced apart and distributed, so as to connect the adapter board 5 to the substrate 1 at multiple positions at the same time through the multiple second protrusions 51, which can improve the connection reliability and stability between the two, wherein the second protrusion 51 can be constructed as a micro-bump arranged under the adapter board 5.

[0086] It should be noted that sealant 33 is filled between the adapter board 5 and the chip 3 and the substrate 1. The sealant 33 can be used to fill the gap between the adapter board 5 and the chip 3 and the substrate 1 to form a continuous bonding layer, thereby enhancing the connection strength between the adapter board 5 and the chip 3 and the substrate 1, and preventing the chip 3 or the adapter board 5 from falling off when subjected to mechanical stress such as vibration or impact. The sealant 33 can also be used to absorb the stress generated by the mismatch of the expansion coefficient, thereby avoiding stress concentration that causes solder joint breakage or chip 3 damage.

[0087] And, if Figure 1-Figure 2 As shown, a solder ball 12 is provided below the substrate 1. The solder ball 12 is used to realize the transmission of electrical signals between the chip 3 and the external circuit. There are multiple solder balls 12, and the multiple solder balls 12 are spaced apart and distributed. By providing multiple solder balls 12, the electrical connection points are increased, thereby improving the reliability of the connection. Even if some of the solder balls 12 have problems, such as breakage or poor contact, the other solder balls 12 can still maintain the connectivity of the circuit, thereby reducing the possibility of failure of the chip assembly 100. Moreover, an epoxy resin 13 is also provided between the heat dissipation cover 2 and the adapter plate 5. The epoxy resin 13 has excellent electrical insulation properties, and can effectively isolate the circuit between the heat dissipation cover 2 and the adapter plate 5, prevent current leakage and short circuit, and ensure the safe operation of the chip assembly 100. After curing, the epoxy resin 13 has good mechanical strength and toughness, and can provide a stable support for the heat dissipation cover 2 and the adapter plate 5 to prevent structural deformation or damage caused by mechanical vibration or impact.

[0088] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0089] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A chip assembly, characterized in that: include: substrate; A heat dissipation cover, which is installed on one side of the substrate and defines a receiving cavity with the substrate, and the heat dissipation cover is provided with a first heat conducting portion; A chip is installed in the accommodating cavity, the chip is provided with a first heat dissipation socket, and at least a part of the first heat conducting part is plugged into the first heat dissipation socket.

2. The chip assembly according to claim 1, characterized in that: There are multiple first heat-conducting parts and multiple first heat-dissipating sockets, and the multiple first heat-conducting parts are plugged and matched with the multiple first heat-dissipating sockets in a one-to-one correspondence.

3. The chip assembly according to claim 2, characterized in that: The plurality of first heat conducting parts are distributed at intervals in an array.

4. The chip assembly according to claim 2, characterized in that: There is one chip, and one chip is provided with a plurality of the first heat dissipation sockets.

5. The chip assembly according to claim 2, characterized in that: There are multiple chips, and there are multiple groups of the first heat-conducting parts, and the multiple groups of the first heat-conducting parts are plugged and matched with the first heat-dissipating sockets of the multiple chips in a one-to-one correspondence.

6. The chip assembly according to claim 5, characterized in that: A plurality of groups of the first heat conducting parts are distributed at intervals along the length direction of the heat dissipation cover.

7. The chip assembly according to claim 5, characterized in that: The distribution density of the first heat conducting parts in any two groups is the same; Alternatively, the distribution densities of the first heat conducting parts in at least two groups are different.

8. The chip assembly according to claim 1, characterized in that: A depth of the first heat dissipation socket along an insertion direction of the first heat conducting portion is greater than or equal to half a thickness of the chip.

9. The chip assembly according to claim 1, characterized in that: It also includes a heat-conducting layer, which is arranged in the accommodating cavity and between the heat dissipation cover and the chip, and the first heat-conducting part passes through the heat-conducting layer.

10. The chip assembly according to any one of claims 1 to 9, characterized in that: The heat dissipation cover comprises a top plate and a side panel, wherein the side panel is connected to a side of the top plate facing the base plate, and the side panel is connected to the base plate and separates the top plate from the base plate to jointly define the accommodating cavity.

11. The chip assembly according to claim 10, characterized in that: The first heat conducting portion is disposed on the top plate and is configured to protrude toward the base plate.

12. The chip assembly according to claim 10, characterized in that: The top plate is further provided with a second heat-conducting portion, the second heat-conducting portion is spaced apart from the side panels, and the second heat-conducting portion is used for heat-conducting cooperation with the base plate.

13. The chip assembly according to claim 12, characterized in that: The substrate is provided with a second heat dissipation socket, and at least a portion of the second heat conducting portion is plugged into the second heat dissipation socket.

14. The chip assembly according to any one of claims 1 to 9, characterized in that: Also comprising an adapter plate, the chip is located above the substrate, and the adapter plate is supported between the chip and the substrate; Wherein, the first heat conducting portion is arranged on the top wall of the accommodating cavity, and the first heat dissipation socket is opened on the upper surface of the chip.

15. The chip assembly according to claim 14, characterized in that: A first protrusion is connected between the chip and the adapter board, and separates the chip from the adapter board; And / or, a second protrusion is connected between the adapter plate and the base plate, and the adapter plate is spaced apart from the base plate.

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