Chip anti-explosion packaging structure

Abstract

The invention provides a chip anti-explosion packaging structure. The chip anti-explosion packaging structure comprises a precise breakdown thyristor chip; the first surface of the precise breakdown thyristor chip is provided with a cathode assembly, the second surface of the precise breakdown thyristor chip is provided with an anode assembly, an anti-explosion ring is installed between the cathode assembly and the anode assembly, and the anode assembly, the cathode assembly and the anti-explosion ring form a first cavity space; a ceramic umbrella skirt is arranged between the cathode assembly and the anode assembly, a first anode welding ring and a first cathode connecting ring are welded outside the anode assembly, and a first cathode welding ring is welded outside the cathode assembly. The anode assembly, the first anode welding ring, the ceramic umbrella skirt, the first cathode connecting ring, the first cathode welding ring and the cathode assembly form a second cavity space, the chip anti-explosion packaging structure provides enough cavity space in the packaging while ensuring the through-current capability, the anti-explosion ring is arranged in the packaging structure, and the anti-explosion performance of the chip is improved. And the anti-explosion capability of the precise breakdown thyristor is improved.

Description

Technical Field

[0001] The invention belongs to the technical field of power semiconductor devices, and in particular relates to an explosion-proof chip packaging structure. Background Art

[0003] With the development of industrial technology, for some special application scenarios, a device that can accurately break down at a specific higher voltage and pass a large current is needed, so the precise breakdown thyristor device came into being. This device may be obtained by improving the materials, structure, etc. of traditional thyristors. For example, in a high-energy pulse system, it may be necessary to use the breakdown characteristics of this device to achieve rapid energy release or signal conversion.

[0004] However, due to its special working conditions (breaking down at a specified higher voltage value and passing a current of hundreds of kiloamperes), this poses a huge challenge to traditional thyristor packaging technology. The traditional packaging structure was not designed to take into account the instantaneous release of such high energy. When this device works under such conditions, the huge energy generated will cause the temperature inside the package to rise sharply, and the thermal stress generated may cause the ceramic package to crack or disconnect the connection between the metal pins and the chip. At the same time, the electromagnetic force generated by the large current may also have a destructive effect on the mechanical stability of the packaging structure. Summary of the invention

[0005] To achieve the above-mentioned purpose, the technical solution adopted by the present invention is: a chip explosion-proof packaging structure, comprising: a precision breakdown thyristor chip; a cathode assembly is provided on the first surface of the precision breakdown thyristor chip, an anode assembly is provided on the second surface of the precision breakdown thyristor chip, the precision breakdown thyristor chip is located between the anode assembly and the cathode assembly and is tightly connected to the two, an explosion-proof ring is installed between the cathode assembly and the anode assembly, and a first cavity space is formed between the anode assembly, the cathode assembly and the explosion-proof ring;

[0006] A ceramic shed is arranged between the cathode assembly and the anode assembly, the ceramic shed is located on the outside of the explosion-proof ring, a first anode welding ring is welded to the outside of the anode assembly, a first cathode welding ring is welded to the outside of the cathode assembly, a first cathode connecting ring is welded to the outside of the first cathode welding ring, and the anode assembly, the first anode welding ring, the ceramic shed, the first cathode connecting ring, the first cathode welding ring, and the cathode assembly constitute a second cavity space.

[0007] Furthermore, the anode assembly includes an anode molybdenum sheet and an anode copper block, the anode copper block is located below the anode molybdenum sheet, one surface of the anode molybdenum sheet is bonded to the second surface of the precision breakdown thyristor chip, and the other surface of the anode molybdenum sheet is bonded to an end face of the anode copper block, and the cathode assembly includes a cathode molybdenum sheet and a cathode copper block, the cathode copper block is located above the cathode molybdenum sheet, one surface of the cathode molybdenum sheet is bonded to the first surface of the precision breakdown thyristor chip, and the other surface of the cathode molybdenum sheet is bonded to an end face of the cathode copper block.

[0008] Furthermore, the cathode copper block has the same structure as the anode copper block, and a groove is provided on its edge, and a plurality of blind holes are provided on the inside, the depth of the blind holes is smaller than the width of the groove, and a fixing ring is provided in the groove, and the height of the fixing ring is lower than the height of the blind hole.

[0009] Furthermore, an anode spring pad is provided in the groove of the cathode copper block, and the anode spring pad is fixed in the groove by a fixing ring. The anode spring pad is lower than the fixing ring, and the other end of the anode spring pad is in contact with the end face of the anode copper block and is placed in the groove of the anode copper block and fixed in the groove by the fixing ring.

[0010] Furthermore, it is characterized in that the cathode copper block, the first cathode welding ring, the ceramic umbrella skirt, the first cathode connecting ring, the first anode welding ring, and the anode copper block are connected in an airtight manner, and the airtight connection is welding.

[0011] Furthermore, it is characterized in that the cathode molybdenum sheet, cathode copper block, anode molybdenum sheet and anode copper block are connected by pressure.

[0012] Furthermore, the cathode copper block, the anode copper block, the explosion-proof ring and the anode spring pad are connected under pressure by deformation of the spring pad.

[0013] Furthermore, the anode spring pad is made of metal spring steel, and the explosion-proof ring is made of high-strength insulating material.

[0014] Compared with the prior art, the beneficial effects of the present invention are as follows: the present invention sets a cathode molybdenum sheet on the first surface of the precise breakdown thyristor chip, sets a cathode copper block on the cathode molybdenum sheet, sets a groove on the outer ring of the cathode copper block, sets an anti-explosion ring on the anode spring pad, and forms a first cavity space through the anode copper block, the anode spring pad, the anti-explosion ring, and the cathode copper block. And sets an anode molybdenum sheet on the second surface of the precise breakdown thyristor chip, sets an anode copper block on the anode molybdenum sheet, sets a ceramic shed between the anode copper block and the cathode copper block, welds a first anode welding ring outside the anode copper block, welds a first cathode welding ring outside the cathode copper block, welds a first cathode connecting ring outside the first cathode welding ring, forms a second cavity space through the anode copper block, the first anode welding ring, the ceramic shed, the first cathode connecting ring, the first cathode welding ring, and the cathode copper block, forms a double-layer protection through the first cavity space and the second cavity space, so that the structure has stronger anti-explosion characteristics.

[0015] The chip explosion-proof packaging structure of the present invention provides sufficient space inside the cavity in the precise breakdown thyristor packaging structure, and ensures the current flow capacity of the chip. At the same time, through the internally placed explosion-proof ring, the chip's explosion-proof ability to withstand extremely high-intensity current impact during high-voltage breakdown is achieved. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative work.

[0017] Figure 1 It is a schematic diagram of the front view of the chip explosion-proof packaging structure of the present invention;

[0018] Figure 2 It is a schematic cross-sectional view of the chip explosion-proof packaging structure of the present invention;

[0019] Figure 3 It is a schematic diagram of the structure of the chip explosion-proof packaging structure disassembled in the present invention;

[0020] Figure 4 It is a schematic diagram of the chip explosion-proof packaging structure of the present invention;

[0021] Among them, 1-precision breakdown thyristor chip, 2-anode molybdenum sheet, 3-cathode molybdenum sheet, 4-anode copper block, 5-cathode copper block, 6-anode spring pad, 7-anti-explosion ring, 8-first anode welding ring, 9-first cathode welding ring, 10-first cathode connecting ring, 11-ceramic umbrella skirt. DETAILED DESCRIPTION

[0022] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. It should be understood that the preferred embodiments described herein are only used to illustrate and explain the present invention, and are not used to limit the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. The components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various configurations. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making creative work belong to the scope of protection of the present invention. In the embodiments, the components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various configurations. Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the application claimed for protection, but merely represents the selected embodiments of the present application.

[0023] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection", and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection; it can be an electrical connection; it can be a hydraulic oil circuit connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0024] See also Figure 1-4 As shown, Figure 3 and Figure 2 The cross-sectional schematic diagram and exploded schematic diagram of the packaging structure of a novel precision breakdown thyristor device with stronger anti-explosion characteristics according to an embodiment of the present invention are shown. Figure 2 Among them, 1 is the precision breakdown thyristor chip, 2 is the anode molybdenum sheet, 3 is the cathode molybdenum sheet, 4 is the anode copper block, 5 is the cathode copper block, 6 is the anode spring pad, 7 is the anti-explosion ring, 8 is the first anode welding ring, 9 is the first cathode welding ring, 10 is the first cathode connecting ring, and 11 is the ceramic umbrella skirt.

[0025] The present invention provides a chip explosion-proof packaging structure with high strength and anti-explosion, including a stacked structure, comprising a stacked structure, the stacked structure including an anode copper block 4, an anode molybdenum sheet 2, a precision breakdown thyristor chip 1, a cathode molybdenum sheet 3, and a cathode copper block 5 stacked in sequence, and the stacked structure is a tight pressure connection.

[0026] The above-mentioned precision breakdown thyristor chip has a circular structure as a whole, and a first electrode is provided on the first surface of the precision breakdown thyristor chip 1, and a cathode molybdenum sheet 3 is provided on the first electrode, and a second electrode is provided on the second surface of the precision breakdown thyristor chip 1, and an anode molybdenum sheet 2 is provided on the second electrode. The cathode molybdenum sheet 3 has the same structure as the anode molybdenum sheet 2 and both are circular structures, and a cathode copper block 5 is provided on the cathode molybdenum sheet 3, and the two surfaces of the cathode molybdenum sheet 3 are flat, one surface of the cathode molybdenum sheet 3 is in contact with the first electrode on the first surface of the precision breakdown thyristor chip 1, and the other surface of the cathode molybdenum sheet 3 is in contact with an end face of the cathode copper block 5, and an anode copper block 4 is provided on the anode molybdenum sheet 2, and the two surfaces of the anode molybdenum sheet 2 are flat, one surface of the anode molybdenum sheet 2 is in contact with the second electrode on the second surface of the precision breakdown thyristor chip 1, and the other surface of the anode molybdenum sheet 2 is in contact with an end face of the anode copper block 4.

[0027] The outer ring of the anode copper block 4 is provided with a groove, and a fixing ring is provided in the groove. A circular anode spring pad 6 is installed in the groove of the outer ring of the anode copper block 4, and the anode spring pad 6 is made of metal spring steel. The anode spring pad 6 is fixed in the groove by the fixing ring, and the height of the anode spring pad 6 is lower than the fixing ring. The outer ring of the cathode copper block 5 is provided with a groove, and an explosion-proof ring 7 is placed on the anode spring pad 6. The explosion-proof ring 7 is selected to be an overall ring structure and is made of high-strength insulating material. The explosion-proof ring 7 is placed between the groove of the anode copper block 4 and the groove of the cathode copper block 5 to form a first cavity space. The pressure connection between the anode copper block 4, the anode spring pad 6, the cathode copper block 5, and the explosion-proof ring 7 is ensured by the deformation of the anode spring pad 6.

[0028] A ceramic shed 11 is arranged between the anode copper block 4 and the cathode copper block 5. A first anode welding ring 8 is fixed to the outside of the anode copper block 4. The other end of the first anode welding ring 8 is welded and fixed to one end of the ceramic shed 11. A first cathode welding ring 9 is fixed to the outside of the cathode copper block 5. A first cathode connecting ring 10 is welded to the outside of the first cathode welding ring 9. The first cathode connecting ring 10 is fixed to the edge of one end of the ceramic shed 11. The anode copper block 4, the first anode welding ring 8, the ceramic shed 11, the first cathode welding ring 9, the first cathode connecting ring 10, and the cathode copper block 5 constitute a second cavity space.

[0029] It should be noted that in the packaging structure of the present invention, the anode copper block 4, the first anode welding ring 8, the ceramic umbrella skirt 11, and the first cathode connecting ring 10 are welded to achieve an airtight connection, and the cathode copper block 5 is welded to the cathode second welding ring to achieve an airtight connection. During packaging, the anode molybdenum sheet 2, the precision breakdown thyristor chip 1, the cathode molybdenum sheet 3, the anode spring pad 6, and the anti-explosion ring 7 are placed in sequence, and then the first cathode welding ring 9 and the first cathode connecting ring 10 are fixedly welded to ensure the airtightness inside the cavity. In addition, 16 blind holes are opened around the sides of the anode copper block 4 and the cathode copper block 5. The height of the anti-explosion ring 7 is lower than the height of the blind hole, and the height of the fixing ring is lower than the height of the blind hole. The blind hole provides sufficient cavity space and ensures the flow capacity of the chip at the same time.

[0030] The present invention provides a cathode molybdenum sheet 3 on the first surface of the precise breakdown thyristor chip, a cathode copper block 5 is provided on the cathode molybdenum sheet 3, a groove is provided on the outer ring of the cathode copper block 5, an explosion-proof ring 7 is provided on the anode spring pad 6, and a first cavity space is formed by the anode copper block 4, the anode spring pad 6, the explosion-proof ring 7, and the cathode copper block 5. The anode molybdenum sheet 2 is provided on the second surface of the precise breakdown thyristor chip 1, an anode copper block 4 is provided on the anode molybdenum sheet 2, a ceramic shed is provided between the anode copper block 4 and the cathode copper block 5, a first anode welding ring 8 is welded outside the anode copper block 4, a first cathode welding ring 9 is welded outside the cathode copper block 5, and a first cathode connecting ring 10 is welded outside the first cathode welding ring 9, and a second cavity space is formed by the anode copper block 4, the first anode welding ring 8, the ceramic shed 11, the first cathode connecting ring 10, the first cathode welding ring 9, and the cathode copper block 5, and a double-layer protection is formed by the first cavity space and the second cavity space, so that the structure has stronger explosion-proof characteristics.

[0031] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed by the present invention, which should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims

1. A chip explosion-proof packaging structure, characterized in that: include: Precision breakdown thyristor chip; a cathode assembly is provided on the first surface of the precision breakdown thyristor chip, an anode assembly is provided on the second surface of the precision breakdown thyristor chip, the precision breakdown thyristor chip is located between the anode assembly and the cathode assembly and is tightly connected to the two, an anti-explosion ring and a ceramic shed are installed between the cathode assembly and the anode assembly, and the anti-explosion ring and the ceramic shed separate the space between the anode assembly and the cathode assembly into a first cavity space and a second cavity space.

2. The chip explosion-proof packaging structure according to claim 1, characterized in that: The cathode assembly is connected with a first cathode connecting ring, and the first cathode connecting ring cooperates with the anode assembly to clamp and position the ceramic shed.

3. The chip explosion-proof packaging structure according to claim 2, characterized in that: The anode assembly and the cathode assembly both include a molybdenum sheet, a copper block and a welding ring. The molybdenum sheet is located between the copper block and the precision breakdown thyristor chip, and the welding ring is butted at the edge of the copper block.

4. The chip explosion-proof packaging structure according to claim 3, characterized in that: The edges of the copper blocks are all provided with grooves, the inner sides of the grooves are provided with a plurality of blind holes, and the depth of the blind holes is smaller than the width of the grooves.

5. The chip explosion-proof packaging structure according to claim 4, characterized in that: A fixing ring is arranged in the groove, and the height of the fixing ring is lower than the height of the blind hole.

6. A chip explosion-proof packaging structure according to claim 3 or 4, characterized in that: An elastic washer is arranged in the groove, and the end of the anti-explosion ring is located in the groove and in close contact with the elastic washer.

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