Near field communication antenna and electronic equipment

Abstract

The invention discloses a near field communication antenna and electronic equipment. The near field communication antenna comprises a coil module, a first magnetic isolation piece and a second magnetic isolation piece. Wherein the coil module comprises a carrier and a coil, the carrier is provided with a first surface and a second surface which are arranged back to back, and the coil is arranged on the first surface and is wound to be configured into a plane ring shape; the first magnetism isolating piece is arranged on the first surface and is positioned on the inner side of the innermost coil; the second magnetism isolating piece is arranged on the second surface and at least partially corresponds to the coil. According to the technical scheme, the communication distance of the near field communication antenna can be improved, so that the communication capability of the electronic equipment is improved.

Description

Technical Field

[0001] The present application relates to the field of antenna technology, and in particular to a near field communication antenna and an electronic device using the near field communication antenna. Background Art

[0002] Near Field Communication (NFC) is a short-range high-frequency wireless communication technology that allows two devices to exchange data within a few centimeters. In addition, due to its advantages such as ease of use, fast transmission and high security, NFC has gradually been used in various electronic devices.

[0003] However, in wearable devices such as smart watches and smart bracelets, due to the small size of the device and the large number of metal and other conductive devices contained, the near-field communication antenna and metal and other conductive devices in the device are relatively close, and are easily surrounded by metal and other conductive devices. In short, the use environment of the near-field communication antenna in such electronic devices is relatively complex. At this time, when the near-field communication antenna is working, the electromagnetic field radiated by the near-field communication antenna is likely to induce eddy currents on metal and other conductive devices close to it in multiple directions, and the magnetic field formed by the eddy current is opposite to the electromagnetic field formed by the near-field communication antenna, and has a counteracting and weakening effect on the electromagnetic field formed by the near-field communication antenna, thereby shortening the communication distance of the near-field communication antenna, resulting in the communication capability of such electronic devices being affected. Summary of the invention

[0004] The main purpose of the present application is to provide a near field communication antenna, aiming to improve the communication distance of the near field communication antenna so as to enhance the communication capability of the electronic device.

[0005] To achieve the above objectives, the near field communication antenna proposed in this application includes:

[0006] A coil module, the coil module comprising a carrier and a coil, the carrier having a first surface and a second surface disposed opposite to each other, the coil being disposed on the first surface and being wound and configured in a planar ring shape;

[0007] a first magnetic shielding member, which is disposed on the first surface and located inside the innermost coil; and

[0008] A second magnetic isolation member is stacked on the second surface and at least partially corresponds to the coil.

[0009] Optionally, the first magnetic isolation member and the innermost coil are spaced apart from each other.

[0010] Optionally, the distance between the first magnetic shielding member and the innermost coil at the smallest distance is defined as L1, satisfying the relationship: 0.3 mm ≤ L1 ≤ 0.7 mm.

[0011] Optionally, the distance between the first magnetic shielding member and the innermost coil at the smallest distance is defined as L1, and the width of the coil is defined as L2, satisfying the relationship: 0.5≤L1 / L2≤5.

[0012] Optionally, the area of ​​the first magnetic shielding member is defined as S1, and the area enclosed by the innermost coil is defined as S2, satisfying the relationship: 0.7≤S1 / S2≤0.9.

[0013] Optionally, the shape of the first magnetic isolation member is the same as the inner contour shape of the coil.

[0014] Optionally, the first magnetic shielding member and the innermost coil are spaced apart, and the first magnetic shielding member and the innermost coil are spaced equally apart at all locations in the circumferential direction of the first magnetic shielding member;

[0015] And / or, the shape of the first magnetic shielding member and the inner contour of the coil are both square, circular or elliptical.

[0016] Optionally, a distance between a side of the first magnetic shielding member facing away from the first surface and the first surface is greater than a distance between a side of the coil facing away from the first surface and the first surface;

[0017] and / or, on a projection plane perpendicular to the arrangement direction of the first surface and the second surface, a projection of the coil module is located on the inner side of the second magnetic shielding member;

[0018] And / or, the first magnetic shielding member is bonded to the carrier;

[0019] And / or, the second magnetic isolation member is bonded to the carrier;

[0020] and / or, the coil is bonded to the carrier;

[0021] And / or, the material of the first magnetic isolation member is ferrite;

[0022] And / or, the material of the second magnetic isolation member is ferrite;

[0023] And / or, the first magnetic shielding member is a plate structure and is stacked on the first surface;

[0024] And / or, the second magnetic shielding member is a plate structure and is stacked on the second surface;

[0025] And / or, the carrier is a plate structure.

[0026] The present application also proposes an electronic device, comprising:

[0027] Motherboard;

[0028] The near field communication antenna as described above, wherein the near field communication antenna and the main board are arranged opposite to each other, and the second magnetic shielding member in the near field communication antenna is arranged toward the main board; and

[0029] The screen is arranged on a side of the near field communication antenna facing away from the mainboard, and the first magnetic shielding member in the near field communication antenna is arranged toward the screen.

[0030] Optionally, the coil and the screen are spaced apart, and the first magnetic isolation member and the screen are in contact.

[0031] The near field communication antenna of the technical solution of the present application is provided with a first magnetic shielding member on the first surface of the coil provided on the carrier of the coil module, and the first magnetic shielding member is located on the inner side of the coil, so that the first magnetic shielding member will not affect the external radiation of the electromagnetic field generated by the coil. At the same time, because the first magnetic shielding member has high magnetic permeability and low hysteresis loss, it can effectively absorb and block the inward radiation propagation of the electromagnetic field generated by the coil, so as to block the electromagnetic field generated by the coil from being transmitted to the metal or other conductor components opposite to the first surface as much as possible, thereby reducing the eddy current generated in the metal or other conductor components opposite to the first surface as much as possible.

[0032] Moreover, the near-field communication antenna in the present embodiment is also provided with a second magnetic shielding member on the second surface of the carrier facing away from the coil. The second magnetic shielding member also has high magnetic permeability and low hysteresis loss, so that it can effectively absorb and block the propagation of the electromagnetic field generated by the coil toward the side facing the second surface, so as to isolate the electromagnetic field generated by the coil from being transmitted to the metal or other conductive devices opposite to the second surface as much as possible, thereby reducing the eddy current generated in the metal or other conductive devices opposite to the second surface as much as possible.

[0033] Therefore, the structural setting of the near-field communication antenna in this solution achieves the effect of reducing the generation of eddy currents for the metal or other conductor components located on the side facing the first surface of the coil module and the metal or other conductor components located on the side facing the second surface of the coil module. Furthermore, when the near-field communication antenna is applied to electronic devices with a relatively complex use environment, the eddy current effect of the metal or other conductor components on the two sides of the near-field communication antenna can be reduced as much as possible, so as to effectively improve the communication distance of the near-field communication antenna and improve the communication capability of the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0035] Figure 1 This is a schematic diagram of the structure of an embodiment of an electronic device of the present application;

[0036] Figure 2 for Figure 1 A partial enlarged view of the middle A;

[0037] Figure 3 This is a schematic structural diagram of an embodiment of a near field communication antenna of the present application;

[0038] Figure 4 for Figure 3 Another perspective diagram of the near-field communication antenna;

[0039] Figure 5 for Figure 3 Another perspective diagram of the near-field communication antenna;

[0040] Figure 6 for Figure 3 A cross-sectional schematic diagram of a medium and near field communication antenna;

[0041] Figure 7 for Figure 6 Schematic diagram of the mid- and near-field communication antenna from another perspective.

[0042] Description of Figure Numbers:

[0043] Label name Label name 100 Electronic devices 113 Coil 10 Near Field Communication Antenna 13 The first magnetic isolation member 11 Coil module 15 The second magnetic isolation member 111 Carrier 30 Motherboard 111a First surface 50 Screen 111b Second surface

[0044] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0045] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0046] It should be noted that all directional indications in the embodiments of the present application (such as up, down, left, right, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0047] In this application, unless otherwise clearly specified and limited, the terms "connection", "fixation", etc. should be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0048] In addition, the descriptions of "first", "second", etc. in this application are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the meaning of "and / or" appearing in the full text is to include three parallel solutions. Taking "A and / or B as an example", it includes solution A, or solution B, or a solution that satisfies both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by this application.

[0049] Near Field Communication (NFC) is a short-range high-frequency wireless communication technology that allows two devices to exchange data within a few centimeters. In addition, due to its advantages such as ease of use, fast transmission and high security, NFC has gradually been used in various electronic devices.

[0050] However, in wearable devices such as smart watches and smart bracelets, due to the small size of the devices and the large number of metal and other conductive devices contained, the near-field communication antenna in the device is relatively close to the metal and other conductive devices, and is easily surrounded by metal and other conductive devices. In short, the use environment of the near-field communication antenna in such electronic devices is relatively complex. For example: in smart watches and smart bracelets, the near-field communication antenna is usually installed between the mainboard and the screen of the device, and there are metal and other conductive devices on the mainboard and the screen.

[0051] Among them, the electromagnetic field radiated by the near-field communication antenna when working is easy to induce eddy currents on nearby metal and other conductor devices. The magnetic field formed by the eddy current is opposite to the electromagnetic field formed by the near-field communication antenna, and has a counteracting and weakening effect on the electromagnetic field formed by the near-field communication antenna, thereby shortening the communication distance of the near-field communication antenna. At the same time, the near-field communication antenna in the related art is usually set as a double-layer structure, that is, it includes a coil module and a magnetic isolation layer arranged on the side of the coil module facing the mainboard. At this time, the magnetic isolation layer can only absorb and block the electromagnetic field generated by the coil module from being transmitted to the side where the mainboard is located, so as to reduce the eddy currents generated by the metal and other conductor devices on the mainboard, but it cannot reduce the eddy currents generated by the metal and other conductor devices on the screen, resulting in the communication distance of such electronic equipment being affected and reducing the communication capability of the electronic equipment.

[0052] Therefore, based on the above considerations, in order to solve the technical problem that the communication distance of the near-field communication antenna is affected in a relatively complex use environment where there are metal or other conductive devices on both sides of the near-field communication antenna, the present application proposes a new type of near-field communication antenna. The near-field communication antenna is innovatively provided with a first magnetic shielding member and a second magnetic shielding member on the back-to-back sides, respectively, to effectively reduce the eddy current effect generated by the metal or other conductive devices on the motherboard and the screen on the back-to-back sides of the near-field communication antenna, thereby improving the communication distance of the near-field communication antenna.

[0053] In addition, it should be noted that the near-field communication antenna proposed in this application can be used in application scenarios where it needs to be installed between the mainboard and the screen, and of course it can also be used in application scenarios where it needs to be installed between the mainboard and the metal block. That is, this application does not limit the application scenario of the near-field communication antenna, as long as it is used in application scenarios where it needs to be installed between two relatively spaced metal or other conductive devices.

[0054] Next, the structure of the near field communication antenna proposed in this application is explained:

[0055] Please refer to Figures 1 to 7 In one embodiment of the present application, the near field communication antenna 10 proposed in the present application includes a coil module 11, a first magnetic shielding member 13 and a second magnetic shielding member 15. The coil module 11 includes a carrier 111 and a coil 113. The carrier 111 has a first surface 111a and a second surface 111b disposed back to back. The coil 113 is disposed on the first surface 111a and is wound to be configured in a planar ring shape; the first magnetic shielding member 13 is disposed on the first surface 111a and is located on the inner side of the innermost coil 113; the second magnetic shielding member 15 is stacked on the second surface 111b and at least partially corresponds to the coil 113.

[0056] The carrier 111 may be used only to provide a mounting position to install the limit coil 113. Of course, a circuit may be further provided based on the mounting position so that the coil 113 and the external circuit are electrically connected. Therefore, the carrier 111 may be a common plate or block having only a supporting function, or may be a hard circuit board or a flexible circuit board. The present application does not limit the structural type of the carrier 111. In addition, the first surface 111a and the second surface 111b may be two back-to-back surfaces of the carrier 111, such as the left surface and the right surface, or the upper surface and the lower surface, etc. The present application does not limit the arrangement direction of the first surface 111a and the second surface 111b. In addition, in the arrangement direction of the first surface 111a and the second surface 111b, it can also be said that in the direction from the first surface 111a to the second surface 111b, or from the second surface 111b to the first surface 111a, the projection of the carrier 111 may be square, circular or elliptical, etc., and the present application does not limit the shape of the carrier 111. It should be noted that the square described in this application includes the shapes of a rectangle and a square.

[0057] The coil 113 can be used to receive an external magnetic field signal and generate a corresponding voltage difference, and then transmit the voltage signal to the receiving end of the near-field communication driver chip electrically connected to the coil 113 in the electronic device 100. After receiving the voltage signal of the coil 113, the receiving end of the near-field communication driver chip can send a drive signal to the coil 113 through the transmitting end to drive the coil 113 to conduct, thereby realizing the near-field communication function. Among them, each area of ​​the coil 113 can be attached to the first surface 111a and wound to form a planar ring shape, and the planar ring shape can be specifically a square spiral, a circular spiral or an elliptical spiral, etc., and the specific shape formed by the winding of the coil 113 is not limited in this application. In addition, the installation of the coil 113 on the carrier 111 can be connected by bonding, and of course, it can also be installed by clamping the coil 113 with the carrier 111 by a clamping member connected to the carrier 111, and the installation method of the coil 113 on the carrier 111 is not limited in this application.

[0058] The first magnetic shielding member 13 may be made of ferrite, amorphous / nanocrystalline material or Permalloy, etc., and of course, may also be other materials with high magnetic permeability and low hysteresis loss characteristics. The present application does not limit the material of the first magnetic shielding member 13. Based on the high magnetic permeability and low hysteresis loss characteristics, the first magnetic shielding member 13 can be used to absorb and block the inward radiation propagation of the electromagnetic field generated by the coil 113, so as to block the electromagnetic field generated by the coil 113 from being transmitted to the metal or other conductor components opposite to the first surface 111a as much as possible. Among them, the metal or other conductor components arranged relative to the first surface 111a in the electronic product may be some of the components in the screen 50 introduced above. Of course, the metal or other conductor components arranged relative to the first surface 111a in the electronic product may also be directly one or at least two metal blocks, and the present application does not limit this. In addition, the first magnetic shielding member 13 is located on the inner side of the innermost coil 113, that is, the first magnetic shielding member 13 is located on the inner side of the entire coil 113, so as to reduce the restriction on the external radiation of the electromagnetic field generated by the coil 113. In addition, the first magnetic shielding member 13 can be a plate, a block or a cylinder, etc., and the present application does not limit the structural type of the first magnetic shielding member 13. The shape of the first magnetic shielding member 13 can be adapted to the contour shape of the innermost coil 113, and of course it can also be set to be different from the contour shape of the innermost coil 113, and the present application does not limit the shape of the first magnetic shielding member 13. In addition, the first magnetic shielding member 13 and the innermost coil 113 can be set at a distance, and of course it can also be set in contact with the innermost coil 113. In addition, the first magnetic isolation component 13 can be installed on the carrier 111 by bonding, or by clamping the first magnetic isolation component 13 with the carrier 111 through a clamping component connected to the carrier 111. The present application does not limit the installation method of the first magnetic isolation component 13 on the carrier 111.

[0059] The material of the second magnetic shielding member 15 can also be ferrite, amorphous / nanocrystalline material or Permalloy, etc., and of course, it can also be other materials with high magnetic permeability and low hysteresis loss characteristics. The present application does not limit the material of the second magnetic shielding member 15. Based on the high magnetic permeability and low hysteresis loss characteristics, the second magnetic shielding member 15 can be used to absorb and block the propagation of the electromagnetic field generated by the coil 113 along the side toward which the second surface 111b is directed, so as to block the electromagnetic field generated by the coil 113 from being transmitted to the metal or other conductive components opposite to the first surface as much as possible. Among them, the metal or other conductive components arranged relative to the second surface 111b in the electronic product can be some of the components on the main board 30 introduced above. Of course, the metal or other conductive components arranged relative to the second surface 111b in the electronic product can also be directly one or at least two metal blocks, and the present application does not limit this. In addition, in the arrangement direction of the first surface 111a and the second surface 111b, the projection of the second magnetic shielding member 15 can be a projection that completely covers the coil 113, and the projection of the carrier 111 can even be further set to coincide with the projection of the second magnetic shielding member 15, or the projection of the carrier 111 can be set to be located on the inner side of the projection of the second magnetic shielding member 15. In addition, the second magnetic shielding member 15 can be a plate, a block or a cylinder, etc., and the present application does not limit the structural type of the second magnetic shielding member 15. The shape of the second magnetic shielding member 15 can be square, circular or elliptical, etc., and the present application does not limit the shape of the second magnetic shielding member 15. Moreover, the shape of the second magnetic shielding member 15 can be the same as the shape of the carrier 111, or of course, it can be different. In addition, the second magnetic isolation member 15 can be installed on the carrier 111 by bonding, or by clamping the second magnetic isolation member 15 between a clamping member connected to the carrier 111 and the carrier 111. The present application does not limit the installation method of the second magnetic isolation member 15 on the carrier 111.

[0060] The near field communication antenna 10 of the technical solution of the present application is provided with a first magnetic shielding member 13 on the first surface 111a of the carrier 111 of the coil module 11 on which the coil 113 is provided, and the first magnetic shielding member 13 is located on the inner side of the coil 113, so that the first magnetic shielding member 13 will not affect the external radiation of the electromagnetic field generated by the coil 113. At the same time, because the first magnetic shielding member 13 has high magnetic permeability and low hysteresis loss, it can effectively absorb and block the inward radiation propagation of the electromagnetic field generated by the coil 113, so as to block the electromagnetic field generated by the coil 113 from being transmitted to the metal or other conductive devices opposite to the first surface 111a as much as possible, thereby reducing the eddy current generated in the metal or other conductive devices opposite to the first surface 111a as much as possible.

[0061] Moreover, the near-field communication antenna 10 in the present embodiment is also provided with a second magnetic shielding member 15 on the second surface 111b of the carrier 111 which is away from the coil 113. The second magnetic shielding member 15 also has high magnetic permeability and low hysteresis loss, so that it can effectively absorb and block the propagation of the electromagnetic field generated by the coil 113 toward the side toward which the second surface 111b is facing, so as to prevent the electromagnetic field generated by the coil 113 from being transmitted to the metal or other conductive devices opposite to the second surface 111b as much as possible, thereby reducing the eddy current generated in the metal or other conductive devices opposite to the second surface 111b as much as possible.

[0062] Therefore, the structural setting of the near field communication antenna 10 in this solution realizes the effect of reducing the generation of eddy currents for the metal and other conductor components located on the side facing the first surface 111a of the coil module 11, and the metal and other conductor components located on the side facing the second surface 111b of the coil module 11. Furthermore, when the near field communication antenna 10 is applied to an electronic device 100 with a relatively complex use environment, the eddy current effect of the metal and other conductor components on the back sides of the near field communication antenna 10 can be reduced as much as possible, so as to effectively improve the communication distance of the near field communication antenna 10 and improve the communication capability of the electronic device 100.

[0063] Please refer to Figures 3 to 6 In one embodiment of the present application, the carrier 111 may be a plate structure.

[0064] In this embodiment, the carrier 111 is set as a plate structure, so that its thickness can be relatively small. After the coil 113, the first magnetic isolation component 13 and the second magnetic isolation component 15 are arranged on its surface, the overall thickness of the near-field communication antenna 10 will not be too small, so that it can be smoothly installed and arranged in the limited space of the currently popular lightweight electronic products.

[0065] In order to further reduce the overall thickness of the near field communication antenna 10, in one embodiment of the present application, the first magnetic shielding member 13 can also be set as a plate structure and stacked on the first surface 111a. Similarly, the second magnetic shielding member 15 can also be set as a plate structure and stacked on the second surface 111b. It should be noted that the stacking described in the present application means stacking.

[0066] In an embodiment of the present application, the coil 113 may be bonded to the carrier 111 .

[0067] In this embodiment, the coil 113 and the carrier 111 are bonded and fixed by glue, which can increase the connection area between the coil 113 and the carrier 111 on one hand, so as to improve the stability of the installation of the coil 113 on the carrier 111. On the other hand, it is also possible to eliminate the need to provide a connection structure between the coil 113 and the carrier 111, thereby helping to protect the structures of the coil 113 and the carrier 111 from being easily damaged.

[0068] Similarly, in order to improve the stability of the first magnetic shielding member 13 and the second magnetic shielding member 15 when installed on the carrier 111, and to protect the structures of the first magnetic shielding member 13 and the second magnetic shielding member 15 from being easily damaged, in one embodiment of the present application, the first magnetic shielding member 13 can be bonded to the carrier 111, and the second magnetic shielding member 15 can also be bonded to the carrier 111.

[0069] Furthermore, in order to improve the magnetic isolation effect of the first magnetic isolation member 13 and the second magnetic isolation member 15 and reduce the cost, the material of the first magnetic isolation member 13 can be ferrite, and the material of the second magnetic isolation member 15 can also be ferrite.

[0070] Please refer to Figure 3 and Figure 4 In one embodiment of the present application, the first magnetic isolation member 13 and the innermost coil 113 are spaced apart from each other.

[0071] In this embodiment, a gap is set between the first magnetic isolation member 13 and the innermost coil 113, which can further reduce the impact on the radiated electromagnetic field of the coil 113 itself and maximize the magnetic isolation effect on the screen 50 side, thereby reducing the generation of eddy currents on the screen 50 side of the electronic device 100 that is arranged opposite to the first surface 111a.

[0072] Furthermore, in order to better balance the avoidance effect of the first magnetic shielding member 13 on the coil 113 and the magnetic shielding effect on the screen 50 side, some relevant parameters of the first magnetic shielding member 13 can be optimized, for example:

[0073] Please refer to Figure 4 In one embodiment of the present application, the distance between the first magnetic shielding member 13 and the innermost coil 113 at the minimum interval is defined as L1, satisfying the relationship: 0.3㎜≤L1≤0.7㎜. At this time, the value of L1 can be 0.3㎜, 0.35㎜, 0.4㎜, 0.45㎜, 0.5㎜, 0.55㎜, 0.6㎜, 0.65㎜ or 0.7㎜, and of course, it can also be any value in the above intervals. In addition, it should be noted that when the distance between the first magnetic shielding member 13 and the innermost coil 113 is set equally at various locations on the circumference of the first magnetic shielding member 13 as described below, the distance between the first magnetic shielding member 13 and the innermost coil 113 at various locations on the circumference can be formed as the distance L1 at the minimum interval.

[0074] Alternatively, in one embodiment of the present application, the distance between the first magnetic shielding member 13 and the innermost coil 113 at the smallest distance is defined as L1, and the width of the coil 113 is L2, satisfying the relationship: 0.5≤L1 / L2≤5. At this time, the ratio of L1 to L2 can be 0.5, 1, 1.5, 2, 2.5, 3, 3.5, 4, 4.5 or 5, and of course it can be any value in the above range. In addition, it should be noted that the width of the coil 113 can be the distance between the two sides of a single coil 113 in the direction from the inside to the outside of the coil 113.

[0075] Alternatively, in one embodiment of the present application, the area of ​​the first magnetic shielding member 13 is defined as S1, and the area enclosed by the innermost coil 113 is defined as S2, satisfying the relationship: 0.7≤S1 / S2≤0.9. At this time, the ratio of S1 to S2 can be 0.7, 0.75, 0.8, 0.85 or 0.9, and of course can be any value in the above range.

[0076] In one embodiment of the present application, the shape of the first magnetic shielding member 13 is the same as the inner contour shape of the coil 113 .

[0077] In this embodiment, the shape of the first magnetic shielding member 13 and the inner contour shape of the coil 113 are set to be the same, so that the first magnetic shielding member 13 and the coil 113 can be distributed more compactly, so that the first magnetic shielding member 13 can be fully arranged in the limited space on the inner side of the coil 113 and the magnetic shielding effect on the screen 50 side is improved, and the effect of reducing the generation of eddy current on the screen 50 side set opposite to the first surface 111a in the electronic device 100 is further improved.

[0078] Furthermore, the shape of the first magnetic shielding member 13 and the inner contour of the coil 113 can be square, circular or elliptical, so that the shape is more regular, which is beneficial to improve the convenience of winding the coil 113 and the convenience of manufacturing the first magnetic shielding member 13.

[0079] Moreover, when the first magnetic shielding member 13 and the innermost coil 113 are arranged at intervals as described above, the first magnetic shielding member 13 and the innermost coil 113 are spaced equally at all locations in the circumferential direction of the first magnetic shielding member 13 to further improve the compactness of the distribution between the first magnetic shielding member 13 and the coil 113.

[0080] Please refer to Figures 1 to 3 ,as well as Figure 5 In one embodiment of the present application, the distance between the first surface 111a and the side of the first magnetic shielding member 13 facing away from the first surface 111a is greater than the distance between the first surface 111a and the side of the coil 113 facing away from the first surface 111a.

[0081] In this embodiment, it can also be said that the thickness of the first magnetic shielding member 13 is greater than the thickness of the planar ring formed by the winding of the coil 113. At this time, when the near field communication antenna 10 is installed in the electronic device 100, the protrusion of the first magnetic shielding member 13 can isolate the coil 113 from the screen 50, and the first magnetic shielding member 13 is close to or directly in contact with the screen 50, which is conducive to improving the magnetic shielding effect on the screen 50 side, and further improving the first magnetic shielding member 13 on the electronic device 100 and the screen 50 side arranged opposite to the first surface 111a The effect of reducing the generation of eddy currents on the screen 50 side of the electronic device 100.

[0082] Please refer to Figure 3 and Figure 4 In one embodiment of the present application, on a projection plane perpendicular to the arrangement direction of the first surface 111 a and the second surface 111 b , the projection of the coil module 11 is located on the inner side of the second magnetic isolation member 15 .

[0083] In this embodiment, the projection of the coil module 11 is set to be located on the inner side of the second magnetic shielding member 15, so that the area of ​​the second magnetic shielding member 15 is relatively large and can fully cover the coil module 11. At the same time, since there are many metal and other conductive components of the mainboard 30 where the electronic product and the second surface 111b are relatively arranged, the eddy current effect of the metal and other conductive components mainly comes from the mainboard 30 side. Therefore, setting the area of ​​the second magnetic shielding member 15 to be larger than the area of ​​the coil module 11 can greatly improve the magnetic shielding effect on the mainboard 30 side, reduce the influence of the eddy current generated by the mainboard 30 side on the near-field communication antenna 10, and increase the communication distance of the near-field communication antenna 10.

[0084] Please refer to Figure 1 and Figure 2, the present application also proposes an electronic device 100, which includes a near field communication antenna 10. The specific structure of the near field communication antenna 10 refers to the above embodiment. Since the electronic device 100 adopts all the technical solutions of all the above embodiments, it at least has all the beneficial effects brought by the technical solutions of the above embodiments, which will not be repeated here. Among them, the electronic device 100 may also include a main board 30 and a screen 50 arranged at a relative interval. At this time, the near field communication antenna 10 can be arranged between the main board 30 and the screen 50, and the first magnetic shielding member 13 in the near field communication antenna 10 can face the screen 50, and the second magnetic shielding member 15 in the near field communication antenna 10 can face the main board 30. Furthermore, the distance between the side of the first magnetic shielding member 13 facing away from the first surface 111a and the first surface 111a can be greater than the distance between the side of the coil 113 facing away from the first surface 111a and the first surface 111a, so that the coil 113 can be spaced apart from the screen 50, and the first magnetic shielding member 13 can be arranged in contact with the screen 50, thereby further improving the magnetic shielding effect of the first magnetic shielding member 13 on the screen 50 and reducing the generation of eddy currents on the side of the screen 50.

[0085] The above are only preferred embodiments of the present application, and are not intended to limit the patent scope of the present application. All equivalent structural changes made using the contents of the present application specification and drawings under the inventive concept of the present application, or direct / indirect applications in other related technical fields are included in the patent protection scope of the present application.

Claims

1. A near field communication antenna, characterized in that: include: A coil module, the coil module comprising a carrier and a coil, the carrier having a first surface and a second surface disposed opposite to each other, the coil being disposed on the first surface and being wound and configured in a planar ring shape; A first magnetic shielding member, which is disposed on the first surface and located inside the innermost coil; as well as A second magnetic isolation member is disposed on the second surface and at least partially corresponds to the coil.

2. The near field communication antenna according to claim 1, characterized in that: The first magnetic isolation member is spaced apart from the innermost coil.

3. The near field communication antenna according to claim 2, characterized in that: The distance between the first magnetic shielding member and the innermost coil at the smallest distance is defined as L1, satisfying the relationship: 0.3 mm ≤ L1 ≤ 0.7 mm.

4. The near field communication antenna according to claim 2, characterized in that: The distance between the first magnetic shielding member and the innermost coil at the smallest distance is defined as L1, and the width of the coil is defined as L2, satisfying the relationship: 0.5≤L1 / L2≤5.

5. The near field communication antenna according to claim 2, characterized in that: The area of ​​the first magnetic shielding member is defined as S1, and the area enclosed by the innermost coil is defined as S2, satisfying the relationship: 0.7≤S1 / S2≤0.

9.

6. The near field communication antenna according to any one of claims 1 to 5, characterized in that: The shape of the first magnetic shielding member is the same as the inner contour shape of the coil.

7. The near field communication antenna according to claim 6, characterized in that: The first magnetic shielding member is spaced apart from the innermost coil, and the first magnetic shielding member and the innermost coil are spaced apart from each other at the same distance in the circumferential direction of the first magnetic shielding member; And / or, the shape of the first magnetic shielding member and the inner contour of the coil are both square, circular or elliptical.

8. The near field communication antenna according to any one of claims 1 to 5, characterized in that: The distance between the first surface and the side of the first magnetic shielding member facing away from the first surface is greater than the distance between the first surface and the side of the coil facing away from the first surface; and / or, on a projection plane perpendicular to the arrangement direction of the first surface and the second surface, a projection of the coil module is located on the inner side of the second magnetic shielding member; And / or, the first magnetic shielding member is bonded to the carrier; And / or, the second magnetic isolation member is bonded to the carrier; and / or, the coil is bonded to the carrier; And / or, the material of the first magnetic isolation member is ferrite; And / or, the material of the second magnetic isolation member is ferrite; And / or, the first magnetic shielding member is a plate structure and is stacked on the first surface; And / or, the second magnetic isolation member is a plate structure and is stacked on the second surface; And / or, the carrier is a plate structure.

9. An electronic device, characterized in that: include: Motherboard; The near field communication antenna according to any one of claims 1 to 8, wherein the near field communication antenna and the main board are arranged opposite to each other, and the second magnetic shielding member in the near field communication antenna is arranged toward the main board; as well as The screen is arranged on a side of the near field communication antenna facing away from the mainboard, and the first magnetic shielding member in the near field communication antenna is arranged toward the screen.

10. The electronic device according to claim 9, characterized in that: The coil and the screen are spaced apart from each other, and the first magnetic isolation member and the screen are in contact with each other.

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