Quantum cascade laser packaging heat dissipation device
The heat dissipation device is packaged through the quantum cascade laser, and heat is transmitted to the semiconductor thermoelectric refrigeration component and further heat dissipation through the heat dissipation fins, solving the problem that the heat cannot be dissipated by itself during operation of the quantum cascade laser, achieving efficient heat dissipation and extending service life.
Patent Information
- Application Number
- CN202510166127.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-14
- Publication Date
- 2025-04-25
AI Technical Summary
Quantum cascade lasers generate a large amount of heat during operation and cannot dissipate themselves, resulting in a decrease in the laser gain and shortening of the life of the laser.
A quantum cascade laser package heat dissipation device is designed, including a casing, a quantum cascade laser, a heat sink, a semiconductor thermoelectric refrigeration assembly and multiple heat dissipation fins. Heat is transmitted through the heat sink to the semiconductor thermoelectric refrigeration assembly for refrigeration and further dissipates heat through the heat dissipation fins.
It realizes efficient and rapid heat dissipation of quantum cascade lasers, extends the service life of the laser and ensures its normal operation.
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Figure CN119890880A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of semiconductor lasers, and in particular to a quantum cascade laser packaging and heat dissipation device. Background Art
[0002] Quantum Cascade Lasers (QCL) are a new type of unipolar semiconductor device designed based on the principle of electron inter-subband transition and phonon-assisted resonant tunneling in the conduction band of semiconductor quantum wells. Quantum cascade lasers have a multi-layer quantum well structure. When electrons transition from a high energy state to a low energy state, photons are emitted, accompanied by the release of light energy and heat energy.
[0003] When the quantum cascade laser is working, its active area generates heat, and the active area is in the central area, so the heat cannot dissipate by itself. At this time, the temperature of the laser increases due to heat accumulation, and the carriers in the active area have the opportunity to be thermally excited to a higher energy continuous state, resulting in electron leakage; at the same time, the electrons in the next-level injection area may also be backfilled to the lower lasing energy level in the previous-level active area. Both of these situations will reduce the number of carrier inversions between lasing energy levels, resulting in a decrease in laser gain and affecting the normal operation of the device. In addition, due to the increase in temperature, the difference in thermal expansion coefficients between the layers of material in the quantum cascade laser will cause local stress between the layers of material, and intensify the atomic diffusion between the layers of material, ultimately leading to device degradation and shortening the service life of the quantum cascade laser. Summary of the invention
[0004] The embodiment of the present application provides a quantum cascade laser package heat dissipation device, which aims to solve the problem in the prior art that the quantum cascade laser generates huge heat during operation and cannot dissipate itself, thereby inducing a decrease in laser gain and a shortened lifespan.
[0005] The embodiment of the present application provides a quantum cascade laser package heat dissipation device, comprising a housing, a quantum cascade laser, a heat sink, a semiconductor thermoelectric refrigeration component and a plurality of heat dissipation fins; each of the heat dissipation fins is vertically arranged on the inner bottom surface of the housing; the heat sink is arranged inside the housing, and the bottom end surface of the heat sink is abutted to one end of several heat dissipation fins of the plurality of heat dissipation fins away from the inner bottom surface of the housing; the quantum cascade laser is arranged on the top surface of the heat sink and connected to the top of the semiconductor thermoelectric refrigeration component; the top of the semiconductor thermoelectric refrigeration component is attached to the top surface of the heat sink; the heat sink is used to control the working temperature of the quantum cascade laser; the semiconductor thermoelectric cooler in the semiconductor thermoelectric refrigeration component is connected to the heat sink for adjusting the temperature of the heat sink; each of the heat dissipation fins is used to absorb the heat of the semiconductor thermoelectric refrigeration component.
[0006] In some embodiments, the water cooling channel is opened inside the heat sink in a manner of multiple bends.
[0007] In some embodiments, the semiconductor thermoelectric cooling component includes the semiconductor thermoelectric cooler and a temperature measuring component; the semiconductor thermoelectric cooler is connected to the heat sink; the temperature measuring component is arranged on the top surface of the semiconductor thermoelectric cooler to fit to the top surface of the heat sink and abut against the quantum cascade laser.
[0008] In some embodiments, the heat dissipation fins include a plurality of first heat dissipation fins and a plurality of second heat dissipation fins; the top ends of the plurality of first heat dissipation fins abut against the semiconductor thermoelectric cooler in the semiconductor thermoelectric refrigeration component, and the bottom ends of the plurality of first heat dissipation fins abut against the inner bottom surface of the outer shell; the top ends of the plurality of second heat dissipation fins abut against the bottom end of the heat sink, and the bottom ends of the plurality of second heat dissipation fins abut against the inner bottom surface of the outer shell.
[0009] In some embodiments, the first cooling fan and the second cooling fan are respectively disposed opposite the two opposite side walls of the housing; each of the cooling fins is disposed between the first cooling fan and the second cooling fan; and an extension axis of each of the cooling fins is parallel to a line connecting the first cooling fan and the second cooling fan.
[0010] In some embodiments, the housing includes a base and a protective shell; the protective shell is connected to the base from above the base; each of the heat dissipation fins is vertically arranged on the inner bottom surface of the base; a laser window is opened on the protective shell; the laser window is directly opposite to the quantum cascade laser, and is used for allowing the laser generated by the quantum cascade laser to pass through.
[0011] In some embodiments, the base includes a supporting base plate and an enclosing wall; the enclosing wall is connected to the top of the supporting base plate; each of the heat dissipation fins is vertically arranged on the top surface of the supporting base plate; the quantum cascade laser, the heat sink, the semiconductor thermoelectric cooling component and each of the heat dissipation fins are all enclosed by the enclosing wall; a lens window is opened on the enclosing wall and is opposite to and connected to the laser window.
[0012] In some embodiments, the laser windows are symmetrically opened on two opposite side walls of the protective shell; the lens windows are symmetrically opened on two opposite side walls of the enclosure wall; each of the laser windows is provided with a lens mount; and the lens mount is connected to a lens facing the quantum cascade laser.
[0013] In some embodiments, a limiting latch tooth is protrudingly provided on the enclosing wall; and an edge of the heat sink is fixedly engaged with the limiting latch tooth.
[0014] In some embodiments, a ventilation hole is provided on the shell; the ventilation hole connects the inside of the shell with the outside of the shell to provide flowing air for heat dissipation.
[0015] The quantum cascade laser package heat dissipation device provided in the embodiment of the present application includes a housing, a quantum cascade laser, a heat sink, a semiconductor thermoelectric refrigeration component and a plurality of heat dissipation fins; each of the heat dissipation fins is vertically arranged on the inner bottom surface of the housing; the heat sink is arranged inside the housing, and the bottom end surface of the heat sink abuts against one end of several heat dissipation fins of the plurality of heat dissipation fins away from the inner bottom surface of the housing; the quantum cascade laser is arranged on the top surface of the heat sink and connected to the top of the semiconductor thermoelectric refrigeration component; the top of the semiconductor thermoelectric refrigeration component is attached to the top surface of the heat sink; the heat sink is used to control the working temperature of the quantum cascade laser; the semiconductor thermoelectric cooler in the semiconductor thermoelectric refrigeration component is connected to the heat sink to adjust the temperature of the heat sink; each of the heat dissipation fins is used to absorb the heat of the semiconductor thermoelectric refrigeration component. The embodiment of the present application can realize the conduction of the heat generated by the quantum cascade laser when working to the heat sink, and at the same time, the semiconductor thermoelectric refrigeration component is cooled according to the temperature of the heat sink to reduce the temperature of the heat sink and realize heat dissipation. In addition, the heat sink fins can absorb and further dissipate the heat transferred from the semiconductor thermoelectric refrigeration component, which can achieve efficient and rapid heat dissipation of the quantum cascade laser, while ensuring the normal operation of the quantum cascade laser and extending the service life of the quantum cascade laser. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.
[0017] Figure 1 A schematic diagram of the disassembled structure of the quantum cascade laser packaging heat dissipation device provided in an embodiment of the present application;
[0018] Figure 2 A schematic diagram of a disassembled heat dissipation device for a quantum cascade laser package provided in an embodiment of the present application from another angle;
[0019] Figure 3 A cross-sectional view of a heat sink in a quantum cascade laser package heat dissipation device provided in an embodiment of the present application;
[0020] Figure 4A schematic diagram of the connection between the top of the heat sink, the quantum cascade laser, and the temperature measurement component in the quantum cascade laser package heat dissipation device provided in an embodiment of the present application;
[0021] Figure 5 A schematic diagram of the connection between the bottom end of the heat sink and the semiconductor thermoelectric cooler in the quantum cascade laser packaging heat dissipation device provided in an embodiment of the present application;
[0022] Figure 6 A cross-sectional view of a quantum cascade laser packaging heat dissipation device provided in an embodiment of the present application.
[0023] Among them, the specific reference numerals are:
[0024] 10. Quantum cascade laser package heat dissipation device; 100. housing; 110. first heat dissipation fan; 120. second heat dissipation fan; 130. protective shell; 131. laser window; 140. base; 141. support base plate; 142. enclosure wall; 143. lens window; 144. limit latch; 150. ventilation hole; 200. quantum cascade laser; 210. metal electrode layer; 220. active area; 300. heat sink; 310. water cooling channel; 400. semiconductor thermoelectric cooling component; 410. semiconductor thermoelectric cooler; 420. temperature measuring component; 421. thermistor; 422. resistor mounting seat; 500. heat dissipation fin; 510. first heat dissipation fin; 520. second heat dissipation fin; 600. lens mount; 610. lens. DETAILED DESCRIPTION
[0025] The technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0026] It should be understood that when used in this specification and the appended claims, the terms "include" and "comprises" indicate the presence of described features, integers, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or combinations thereof.
[0027] It should also be understood that the terms used in the present specification are only for the purpose of describing specific embodiments and are not intended to limit the present invention. As used in the present specification and the appended claims, unless the context clearly indicates otherwise, the singular forms "a", "an" and "the" are intended to include plural forms.
[0028] It should be further understood that the term "and / or" used in the present description and the appended claims refers to and includes any and all possible combinations of one or more of the associated listed items.
[0029] See also Figure 1-Figure 6 ,like Figure 1 and Figure 2 As shown, the embodiment of the present application provides a quantum cascade laser packaging heat dissipation device 10, including a housing 100, a quantum cascade laser 200, a heat sink 300, a semiconductor thermoelectric cooling component 400 and a plurality of heat dissipation fins 500; each heat dissipation fin 500 is vertically arranged on the inner bottom surface of the housing 100; the heat sink 300 is arranged inside the housing 100, and the bottom end surface of the heat sink 300 abuts against one end of a plurality of heat dissipation fins of the plurality of heat dissipation fins away from the inner bottom surface of the housing 100 ; The quantum cascade laser 200 is arranged on the top surface of the heat sink 300 and is connected to the top of the semiconductor thermoelectric refrigeration component 400; the top of the semiconductor thermoelectric refrigeration component 400 is attached to the top surface of the heat sink 300; the heat sink 300 is used to control the working temperature of the quantum cascade laser 200; the semiconductor thermoelectric refrigeration component 400 is connected to the heat sink 300 to adjust the temperature of the heat sink 300; each heat sink fin 500 is used to absorb the heat of the semiconductor thermoelectric refrigeration component 400.
[0030] In this embodiment, the housing 100 is a containing structure with a cavity, and the cavity inside it is used to contain the quantum cascade laser 200, the heat sink 300, the semiconductor thermoelectric refrigeration component 400 and each heat dissipation fin 500. Inside the housing 100, each plate-shaped heat dissipation fin 500 is fixedly connected to the inner bottom surface of the housing 100, and each heat dissipation fin 500 is perpendicular to the inner bottom surface of the housing 100, forming an upright plate-shaped heat dissipation structure. Since each heat dissipation fin 500 is perpendicular to the inner bottom surface of the housing 100, and the top of each heat dissipation fin 500 is flush with each other, the tops of all heat dissipation fins 500 are located in a supporting plane, and the heat sink 300 is placed on the semiconductor thermoelectric refrigeration component 400. The heat sink 300 is a metal plate structure with a certain thickness, which can be made of a high thermal conductivity material, such as pure copper or aluminum. The number of quantum cascade lasers 200 may be one or more, and each quantum cascade laser 200 is provided with a metal electrode layer 210 at the bottom, and each quantum cascade laser 200 is connected to the top of the heat sink 300 through the metal electrode layer 210 at the bottom, and heat conduction is achieved through the metal electrode layer 210 and the heat sink 300. Above the metal electrode layer 210 is the active region 220 of the quantum cascade laser 200, and the heat generated by the active region 220 is transferred to the heat sink 300 through the metal electrode layer 210. Furthermore, the heat generated by the quantum cascade laser 200 during operation can be transferred to the heat sink 300, and further transferred from the heat sink 300 to the semiconductor thermoelectric cooling component 400, and then to the heat sink 500.
[0031] The semiconductor thermoelectric cooler 410 in the semiconductor thermoelectric cooler assembly 400 is connected to the heat sink 300, the top of the semiconductor thermoelectric cooler assembly 400 (specifically, the temperature measuring assembly 420 at the top of the semiconductor thermoelectric cooler assembly 400) is attached to the top surface of the heat sink 300 to connect with the quantum cascade laser 200, and the bottom surface of the semiconductor thermoelectric cooler assembly 400 (specifically, the semiconductor thermoelectric cooler 410) is in contact with the top surface of the heat sink 500, and there is a cooling circuit inside it, which can cool down to reduce the temperature of the heat sink 300. Furthermore, when the heat generated by the quantum cascade laser 200 is absorbed by the heat sink 300, the semiconductor thermoelectric cooler assembly 400 can timely reduce the temperature of the heat sink 300 to dissipate the heat generated by the quantum cascade laser 200, thereby reducing the temperature of the quantum cascade laser 200 itself and ensuring the normal operation of the quantum cascade laser 200. At the same time, another part of the heat transferred to the heat sink 500 is dissipated through the large area of contact between the heat sink 500 and the air. Furthermore, the semiconductor thermoelectric cooling component 400 can effectively dissipate the heat absorbed by the heat sink 300, and the heat sink 500 can further dissipate the remaining heat. Among them, each heat sink fin 500 can be arranged in parallel to achieve uniform heat absorption and heat dissipation, and the heat sink fin 500 can also be made of pure copper or aluminum to ensure the efficiency of heat absorption and heat dissipation.
[0032] In one embodiment, if Figure 1 As shown, a water cooling channel 310 is provided inside the heat sink 300 ; the water cooling channel 310 runs through both ends of the heat sink 300 and is used to pass cooling water to reduce the temperature of the heat sink 300 .
[0033] In this embodiment, since the heat sink 300 has a certain thickness, a water cooling channel 310 can be opened therein and passes through the side walls at both ends of the heat sink 300. Specifically, the openings at both ends of the water cooling channel 310 are located on the side walls of the heat sink 300, and the plane through which the water cooling channel 310 passes can be parallel to the top and bottom surfaces of the heat sink 300 to ensure the efficiency of heat dissipation. In the specific design and production, a through hole can be opened on the outer shell 100 for the cooling water pipe to be connected to the water cooling channel 310, so as to pass flowing cooling water into the water cooling channel 310 to accelerate the dissipation of heat by the cooling water. The cooling effect generated by the semiconductor thermoelectric refrigeration component 400 also acts on the cooling water in the water cooling channel 310 at the same time, and the cooled cooling water takes away more heat. Among them, such as Figure 6 As shown, a plurality of water cooling channels 310 may be provided, and each water cooling channel 310 may be arranged in parallel and equidistantly inside the heat sink 300 to achieve uniform heat dissipation at different positions of the heat sink 300 .
[0034] In one embodiment, if Figure 3As shown, the water cooling channel 310 is opened inside the heat sink 300 in a manner of multiple bends.
[0035] In this embodiment, only one water-cooling channel 310 may be provided, and the water-cooling channel 310 is bent multiple times inside the heat sink 300 to present multiple continuous S-shaped structures, and the multiple S-shaped structures in the water-cooling channel 310 are evenly distributed inside the heat sink 300, thereby achieving uniform heat dissipation at various positions of the heat sink 300.
[0036] In one embodiment, if Figure 4 and Figure 5 As shown, the semiconductor thermoelectric cooling component 400 includes a semiconductor thermoelectric cooler 410 and the temperature measuring component 420; the semiconductor thermoelectric cooler 410 is connected to the heat sink 300; the temperature measuring component 420 is arranged on the top surface of the semiconductor thermoelectric cooler 410 to fit to the top surface of the heat sink 300, and abuts against the quantum cascade laser 200.
[0037] In this embodiment, the semiconductor thermoelectric cooler 410 is the main cooling device, which can reduce its internal energy through the Peltier effect (Peltier effect, also known as the thermo-electric effect), thereby achieving cooling. The semiconductor thermoelectric cooler 410 is connected to the surface of the heat sink 300, and is fully in contact with the heat sink 300, thereby being able to fully reduce the surface temperature of the heat sink 300. At the same time, the single temperature measuring component 420 includes a thermistor 421 and a resistor mounting seat 422, the resistor mounting seat 422 can be fixedly connected to the heat sink 300, and the thermistor 421 is fixedly connected to the heat sink 300 through the resistor mounting seat 422. The single temperature measuring component 420 corresponds to a single quantum cascade laser 200, and the thermistor 421 in the temperature measuring component 420 is in contact with the quantum cascade laser 200, which can sensitively sense the temperature change of the quantum cascade laser 200, and adjust the working state and cooling rate of the semiconductor thermoelectric cooler by connecting with the semiconductor thermoelectric cooler 410. Specifically, the current direction of the semiconductor inside the semiconductor thermoelectric cooler 410 can be changed according to the temperature feedback of the thermistor 421 , thereby adjusting the cooling rate of the semiconductor thermoelectric cooler 410 .
[0038] In one embodiment, if Figure 1-Figure 6As shown, the heat dissipation fins 500 include a plurality of first heat dissipation fins 510 and a plurality of second heat dissipation fins 520; the top ends of the plurality of first heat dissipation fins 510 abut against the semiconductor thermoelectric cooler 410 in the semiconductor thermoelectric cooling component 400, and the bottom ends of the plurality of first heat dissipation fins 510 abut against the inner bottom surface of the outer shell 100; the top ends of the plurality of second heat dissipation fins 520 abut against the bottom end of the heat sink 300, and the bottom ends of the plurality of second heat dissipation fins 520 abut against the inner bottom surface of the outer shell 100.
[0039] In this embodiment, the semiconductor thermoelectric cooling component 400 is arranged at the bottom of the heat sink 300 and above the heat dissipation fins to cool down the heat sink 300 and the heat dissipation fins 500 at the same time, further improving the heat dissipation efficiency. The number and arrangement of the heat dissipation fins are set as needed according to the size of the bottom area of the heat sink 300 and the size of the semiconductor thermoelectric cooling component 400. More specifically, after the heat dissipation fins 500 are divided into two categories, the first heat dissipation fins 510 and the second heat dissipation fins 520, the first heat dissipation fins 510 are in contact with the semiconductor thermoelectric cooler 410 in the semiconductor thermoelectric cooling component 400 because their top ends are in contact with the semiconductor thermoelectric cooler 410 in the semiconductor thermoelectric cooling component 400, and the bottom ends of the first heat dissipation fins 510 are in contact with the inner bottom surface of the housing 100, so the semiconductor thermoelectric cooler 410 can be used to cool down the heat sink 300 and the heat dissipation fins 500 at the same time. Since the top of the first heat sink 510 abuts against the bottom of the heat sink 300 and the bottom of the second heat sink 520 abuts against the inner bottom surface of the housing 100 , the heat in the heat sink 300 can also be transferred to the second heat sink 520 for heat dissipation.
[0040] In one embodiment, if Figure 1 and Figure 2 As shown, the first cooling fan 110 and the second cooling fan 120 are respectively disposed opposite to the two opposite side walls of the housing 100; each cooling fin 500 is disposed between the first cooling fan 110 and the second cooling fan 120; and the extension axis of each cooling fin 500 is parallel to the connecting line between the first cooling fan 110 and the second cooling fan 120.
[0041] In this embodiment, the first cooling fan 110 and the second cooling fan 120 are arranged on the two side walls facing each other in the housing 100, and the first cooling fan 110 and the second cooling fan 120 are both connected to the inside and the outside of the housing 100. Furthermore, when the first cooling fan 110 and the second cooling fan 120 work at the same time, a strong air flow can be formed inside the housing 100. Each heat dissipation fin 500 is a plate-like structure with a certain length, and the direction in which the axis is set is parallel to the connection line between the first cooling fan 110 and the second cooling fan 120. Furthermore, the air driven by the first cooling fan 110 and the second cooling fan 120 can evenly flow through the two side walls with a larger area in each heat dissipation fin 500, further accelerating the dissipation of the heat absorbed by the heat dissipation fin 500.
[0042] In one embodiment, if Figure 1 As shown, the housing 100 includes a base 140 and a protective shell 130; the protective shell 130 is connected to the base 140 from the top of the base 140; each heat dissipation fin 500 is vertically arranged on the inner bottom surface of the base 140; a laser window 131 is opened on the protective shell 130; the laser window 131 is opposite to the quantum cascade laser 200, and is used for allowing the laser generated by the quantum cascade laser 200 to pass through.
[0043] In this embodiment, the housing 100 includes a base 140 at the bottom and a protective shell 130 sleeved on the base 140. The protective shell 130 is made of metal material to achieve stable protection of the quantum cascade laser 200 inside the housing 100. The protective shell 130 and the base 140 are detachably connected. When the protective shell 130 is removed from the base 140, the overall structure composed of the quantum cascade laser 200, the heat sink 300 and the semiconductor thermoelectric refrigeration component 400 inside the housing 100 can also be removed for maintenance. The base 140 and the heat sink 500 are set as an integrated structure to ensure the stability of support and heat dissipation. At the same time, the side wall of the protective shell 130 is also provided with a laser window 131 to export the laser generated by the quantum cascade laser 200 when it is working to the outside of the housing 100.
[0044] The laser window 131 may be opened according to the specific location of the quantum cascade laser 200 , for example, it may be opened on two opposite side walls of the protective shell 130 at the same time.
[0045] In one embodiment, if Figure 2 and Figure 6As shown, the base 140 includes a supporting base plate 141 and an enclosure wall 142; the enclosure wall 142 is connected to the top of the supporting base plate 141; each heat sink 500 is vertically arranged on the top surface of the supporting base plate 141; the quantum cascade laser 200, the heat sink 300, the semiconductor thermoelectric cooling component 400 and each heat sink 500 are all enclosed by the enclosure wall 142; a lens window 143 is opened on the enclosure wall 142 and is opposite to and connected to the laser window 131.
[0046] In the present embodiment, the support base plate 141 is a flat plate structure, which can be made of metal material to further dissipate the heat absorbed by the heat sink 500. The enclosure wall 142 is protrudingly arranged at the top of the support base plate 141, and it has four side walls connected end to end to form a four-sided enclosure structure. An enclosure cavity is formed in the center of the enclosure wall 142, and the quantum cascade laser 200, the heat sink 300, the semiconductor thermoelectric refrigeration component 400 and each heat sink 500 are all located in the enclosure cavity to achieve the fixation and protection of each device. Specifically, each edge of the heat sink 300 can be arranged to fit on the inner side wall of the enclosure wall 142 to achieve stable fixation of the heat sink 300. At the same time, a lens window 143 that is opposite to and connected to the laser window 131 is also provided on one of the side walls of the enclosure wall 142 to smoothly guide the laser out of the housing 100. When the protective shell 130 is sleeved on the base 140 , the inner side wall of the protective shell 130 is in contact with the outer side wall of the enclosing wall 142 .
[0047] In one embodiment, the laser windows 131 are symmetrically opened on two opposite side walls of the protective shell 130; the lens windows 143 are symmetrically opened on two opposite side walls of the enclosure wall 142; each of the laser windows 131 is provided with a lens mount 600; and the lens mount 600 is connected to a lens 610 facing the quantum cascade laser 200.
[0048] In this embodiment, the laser window 131 is simultaneously provided on the two opposite side walls of the protective shell 130, and correspondingly, the lens window 143 is also symmetrically provided on the two opposite side walls of the enclosure wall 142. In addition, a lens 610 for adjusting the laser can be installed in the laser window 131. Specifically, a lens mount 600 can be fitted on the laser window 131, and the lens 610 can be installed on the lens mount 600. The outer contour of the lens 610 is adapted to the laser window 131 to collimate the laser generated by the quantum cascade laser 200 when it is working. The lens mount 600 can also be provided with a movable adjustment component to adjust the focal length of the lens 610.
[0049] In one embodiment, if Figure 6 As shown, a limiting latch 144 is protrudingly provided on the enclosing wall 142 ; the edge of the heat sink 300 is fixedly engaged with the limiting latch 144 .
[0050] In this embodiment, the limiting latch 144 is protrudingly arranged on the inner side wall of the enclosure wall 142. When the heat sink 300 is installed into the base 140 from above, it can be clamped on the base 140 by the limiting latch 144 to prevent loosening, thereby ensuring the stability of the quantum cascade laser packaging heat dissipation device 10 during operation.
[0051] In one embodiment, if Figure 2 and Figure 6 As shown, a ventilation hole 150 is opened on the housing 100; the ventilation hole 150 connects the inside of the housing 100 with the outside of the housing 100, and is used to provide flowing air for heat dissipation.
[0052] In this embodiment, ventilation holes 150 are provided on the side walls of the housing 100, and the ventilation holes 150 need to be provided on two opposite side walls of the housing 100 at the same time to ensure air circulation inside the housing 100 and further ensure the heat dissipation effect. Two ventilation holes 150 located on the two side walls and facing each other are a group of ventilation holes 150, and multiple groups of ventilation holes 150 can be provided on the side walls of the housing 100 to increase the heat dissipation efficiency.
[0053] In summary, the quantum cascade laser package heat dissipation device provided in the embodiment of the present application includes a housing, a quantum cascade laser, a heat sink, a semiconductor thermoelectric refrigeration component and a plurality of heat dissipation fins; each of the heat dissipation fins is vertically arranged on the inner bottom surface of the housing; the heat sink is arranged inside the housing, and the bottom end surface of the heat sink is abutted to one end of several heat dissipation fins of the plurality of heat dissipation fins away from the inner bottom surface of the housing; the quantum cascade laser is arranged on the top surface of the heat sink and connected to the top of the semiconductor thermoelectric refrigeration component; the top of the semiconductor thermoelectric refrigeration component is attached to the top surface of the heat sink; the heat sink is used to control the working temperature of the quantum cascade laser; the semiconductor thermoelectric cooler in the semiconductor thermoelectric refrigeration component is connected to the heat sink to adjust the temperature of the heat sink; each of the heat dissipation fins is used to absorb the heat of the semiconductor thermoelectric refrigeration component. The embodiment of the present application can realize the conduction of the heat generated by the quantum cascade laser when working to the heat sink, and at the same time, the semiconductor thermoelectric refrigeration component is cooled according to the temperature of the heat sink to reduce the temperature of the heat sink and realize heat dissipation. In addition, the heat sink fins can absorb and further dissipate the heat transferred from the semiconductor thermoelectric refrigeration component, which can achieve efficient and rapid heat dissipation of the quantum cascade laser, while ensuring the normal operation of the quantum cascade laser and extending the service life of the quantum cascade laser.
[0054] The above are only specific implementations of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed in the present application, and these modifications or replacements should be included in the protection scope of the present application. Therefore, the protection scope of the present application shall be based on the protection scope of the claims.
Claims
1. A quantum cascade laser packaging heat dissipation device, characterized in that: The invention comprises a shell, a quantum cascade laser, a heat sink, a semiconductor thermoelectric refrigeration component and a plurality of heat dissipation fins; each of the heat dissipation fins is vertically arranged on the inner bottom surface of the shell; the heat sink is arranged inside the shell, and the bottom end surface of the heat sink abuts against one end of several heat dissipation fins of the plurality of heat dissipation fins away from the inner bottom surface of the shell; the quantum cascade laser is arranged on the top end surface of the heat sink and connected to the top end of the semiconductor thermoelectric refrigeration component; the top end of the semiconductor thermoelectric refrigeration component is attached to the top end surface of the heat sink; the heat sink is used to control the working temperature of the quantum cascade laser; the semiconductor thermoelectric cooler in the semiconductor thermoelectric refrigeration component is connected to the heat sink for adjusting the temperature of the heat sink; each of the heat dissipation fins is used to absorb the heat of the heat sink and the semiconductor thermoelectric refrigeration component; a water cooling channel is opened inside the heat sink; the water cooling channel runs through both ends of the heat sink and is used to pass cooling water to reduce the temperature of the heat sink.
2. The quantum cascade laser packaging heat dissipation device according to claim 1, characterized in that: The water cooling channel is opened inside the heat sink in a manner of multiple bends.
3. The quantum cascade laser packaging heat dissipation device according to claim 1, characterized in that: The semiconductor thermoelectric cooling component includes the semiconductor thermoelectric cooler and a temperature measuring component; the semiconductor thermoelectric cooler is connected to the heat sink; the temperature measuring component is arranged on the top surface of the semiconductor thermoelectric cooler to fit to the top surface of the heat sink and abut against the quantum cascade laser.
4. The quantum cascade laser packaging heat dissipation device according to claim 3, characterized in that: The heat dissipation fins include a plurality of first heat dissipation fins and a plurality of second heat dissipation fins; the top ends of the plurality of first heat dissipation fins abut against the semiconductor thermoelectric cooler in the semiconductor thermoelectric refrigeration component, and the bottom ends of the plurality of first heat dissipation fins abut against the inner bottom surface of the shell; the top ends of the plurality of second heat dissipation fins abut against the bottom end of the heat sink, and the bottom ends of the plurality of second heat dissipation fins abut against the inner bottom surface of the shell.
5. The quantum cascade laser packaging heat dissipation device according to claim 1, characterized in that: The first cooling fan and the second cooling fan are respectively disposed opposite to the two opposite side walls of the shell; each cooling fin is disposed between the first cooling fan and the second cooling fan; and an extension axis of each cooling fin is parallel to a line connecting the first cooling fan and the second cooling fan.
6. The quantum cascade laser packaging heat dissipation device according to claim 1, characterized in that: The housing comprises a base and a protective shell; the protective shell is sleeved and connected to the base from above the base; each of the heat dissipation fins is vertically arranged on the inner bottom surface of the base; a laser window is opened on the protective shell; the laser window is directly opposite to the quantum cascade laser and is used for allowing the laser generated by the quantum cascade laser to pass through.
7. The quantum cascade laser packaging heat dissipation device according to claim 6, characterized in that: The base comprises a supporting bottom plate and an enclosing wall; the enclosing wall is connected to the top of the supporting bottom plate; each of the heat dissipation fins is vertically arranged on the top surface of the supporting bottom plate; The quantum cascade laser, the heat sink, the semiconductor thermoelectric refrigeration component and the heat dissipation fins are all enclosed by the enclosing wall; a lens window facing and communicating with the laser window is provided on the enclosing wall.
8. The quantum cascade laser packaging heat dissipation device according to claim 7, characterized in that: The laser windows are symmetrically arranged on two opposite side walls of the protective shell; the lens windows are symmetrically arranged on two opposite side walls of the enclosure wall; each of the laser windows is provided with a lens mount; and the lens mount is connected to a lens facing the quantum cascade laser.
9. The quantum cascade laser packaging heat dissipation device according to claim 7, characterized in that: The enclosing wall is provided with a limit locking tooth protruding therefrom; and the edge of the heat sink is fixedly connected to the limit locking tooth.
10. The quantum cascade laser package heat dissipation device according to claim 1, characterized in that: The shell is provided with ventilation holes, which communicate the inside of the shell with the outside of the shell and are used to provide flowing air for heat dissipation.