Splicing pad and sub-pad address generation method

Abstract

The invention discloses a splicing pad and a sub-pad address generation method, and relates to the technical field of control signal devices, the splicing pad comprises a main control unit and one or more sub-pads; the main control unit is spliced with any one sub-pad through the connecting interface; each sub-cushion is spliced with one or more other sub-cushions through the connecting interfaces; and the main control unit and each sub-pad perform message interaction based on the sub-pad address. The splicing pad can be detachably connected according to the use environment / area or the use function, the requirements of different users are met, meanwhile, the sub-pads can automatically recognize the coordinate positions (the row number and the column number) of the sub-pads in the splicing pad, the corresponding sub-pad addresses are generated, and the user experience is improved. Therefore, when the main control unit issues the message including the specified address according to the coordinate position, the message can be identified and responded by the corresponding sub-pad.

Description

Technical Field

[0001] The invention relates to the technical field of control signal devices, in particular to a method for generating addresses of a splicing pad and a sub-pad. Background Art

[0002] Traditional smart mats, such as massage mats, cannot change their functions and sizes, so they cannot adapt to different environments. For example, when using them on a bed, sofa, or chair, you must purchase a massage mat that is compatible with the corresponding carrier size. This makes the massage mat non-reusable, which leads to a waste of resources on the one hand, and inconvenient storage of the mat on the other hand, resulting in reduced user enthusiasm and satisfaction. If the mat can be spliced ​​arbitrarily, it can increase the user's DIY fun on the one hand, and improve user satisfaction on the other hand. In addition, existing spliced ​​mats are often non-smart mats that only perform pure physical splicing, and there is no communication or status monitoring between the spliced ​​mats. Summary of the invention

[0003] The main purpose of the present invention is to propose a splicing mat and a sub-mat address generation method, which overcomes the shortcomings of the prior art. The splicing mat can be detachably connected according to the use environment / area or use function to meet the needs of different users. At the same time, the sub-mats can automatically identify their respective coordinate positions (row level and column level) in the splicing mat and generate corresponding sub-mat addresses. Therefore, when the main control unit sends a message including a specified address according to the coordinate position, it can be recognized and responded by the corresponding sub-mat to meet the use requirements.

[0004] The present invention adopts the following technical solution:

[0005] A splicing pad comprises: a main control unit, one or more sub-pads and one or more execution components; the main control unit is spliced ​​with any sub-pad via a connection interface; each sub-pad is spliced ​​with one or more other sub-pads via a connection interface; each sub-pad comprises a sub-processor MCU, two horizontal bus terminal electrical interfaces, two vertical bus terminal electrical interfaces, a horizontal address sampling circuit and a vertical address sampling circuit; the sub-processor MCU is respectively connected to the two horizontal bus terminal electrical interfaces and the two vertical bus terminal electrical interfaces via a serial port for communication, and the sub-processor MCU is respectively connected to the horizontal address sampling circuit and the vertical address sampling circuit for voltage sampling; the main control unit obtains the operating status of each sub-pad, and controls the execution component to perform corresponding operations based on the sub-pad operating status and / or user instructions.

[0006] Preferably, the horizontal address sampling circuit and the vertical address sampling circuit have the same structure, both comprising a first resistor and a second resistor; the first resistor is connected to the horizontal bus terminal electrical interface, and the horizontal bus terminal electrical interface is also connected to a power supply; the second resistor is connected to the vertical bus terminal electrical interface; the connection point between the first resistor and the second resistor is connected to the sub-processor MCU.

[0007] Preferably, if the horizontal address sampling circuit or the vertical address sampling circuit is a circuit at the head end of the splicing pad, the corresponding horizontal bus terminal electrical interface is short-circuited; if the horizontal address sampling circuit or the vertical address sampling circuit is a circuit at the tail end of the splicing pad, the corresponding vertical bus terminal electrical interface is short-circuited.

[0008] Preferably, the horizontal bus terminal electrical interface is a male connector; and the vertical bus terminal electrical interface is a female connector.

[0009] Preferably, the actuator includes one or more of an air pump, a temperature control module and a vibration motor; the main control unit is connected to the air pump to control the inflation of the airbag in the sub-cushion, the main control unit is connected to the temperature control module to control the heating / cooling of the sub-cushion, and the main control unit is connected to the vibration motor to control the vibration of the sub-cushion.

[0010] Preferably, the main control unit and each sub-pad perform message exchange based on the sub-pad address to obtain the sub-pad operation status.

[0011] Preferably, the method for generating the sub-pad address comprises:

[0012] The main control unit broadcasts the total number of rows and columns of the splicing mat obtained to each sub-mat;

[0013] Each sub-pad calculates the number of rows in the splicing pad according to the total number of rows received and the sampled transverse voltage value, and calculates the number of columns in the splicing pad according to the total number of columns received and the sampled longitudinal voltage value;

[0014] Each sub-pad combines the row level number and the column level number to generate a corresponding sub-pad address.

[0015] Preferably, the method for generating the sub-pad address is applied to the sub-pad and includes:

[0016] Obtain the sampled transverse voltage value and longitudinal voltage value;

[0017] Initialize the total number of rows and row levels;

[0018] The total number of rows and the number of row levels are incremented in sequence, and a horizontal calculated voltage value is obtained based on the incremented current total number of rows and the number of row levels; whether the horizontal calculated voltage value is equal to the sampled horizontal voltage value is determined, and if they are equal, the current number of row levels is used as the actual number of row levels of the sub-pad;

[0019] Initialize the total number of columns and column levels;

[0020] The total number of columns and the number of column levels are incremented in sequence, and a longitudinal calculated voltage value is obtained based on the incremented current total number of columns and the number of column levels; whether the longitudinal calculated voltage value is equal to the sampled longitudinal voltage value is determined, and if they are equal, the current number of column levels is used as the actual number of column levels of the sub-pad;

[0021] The row level number and the column level number are combined to generate the corresponding sub-pad address.

[0022] In another aspect, a subpad address generation method includes:

[0023] The main control unit broadcasts the total number of rows and columns of the splicing mat obtained to each sub-mat;

[0024] Each sub-pad calculates the number of rows in the splicing pad according to the total number of rows received and the sampled transverse voltage value, and calculates the number of columns in the splicing pad according to the total number of columns received and the sampled longitudinal voltage value;

[0025] Each sub-pad combines the row level number and the column level number to generate a corresponding sub-pad address.

[0026] Preferably, the sub-pad calculates the number of rows in the splicing pad according to the total number of rows received and the sampled lateral voltage value, which is expressed as follows:

[0027] i = M – M * [V i - VDD / M / (1+k1)] / VDD;

[0028] Where i represents the row number of the sub-mat; M represents the total number of rows of the spliced ​​mat; V i represents the lateral voltage value sampled by the sub-pad; k1 represents the ratio of two voltage-dividing resistors in the lateral address sampling circuit; VDD represents the power supply voltage;

[0029] The sub-pad calculates the number of column levels in the splicing pad based on the total number of rows received and the sampled vertical voltage value, which is expressed as follows:

[0030] j = N – N * [V j - VDD / N / (1+k2)] / VDD;

[0031] Wherein, j represents the number of columns of the sub-mat; N represents the total number of columns of the spliced ​​mat; V j represents the vertical voltage value sampled by the sub-pad; k2 represents the ratio of the two voltage-dividing resistors in the vertical address sampling circuit; VDD represents the power supply voltage.

[0032] Preferably, the horizontal address sampling circuit and the vertical address sampling circuit have the same structure, both comprising a first resistor and a second resistor; the first resistor is connected to the horizontal bus terminal electrical interface, and the horizontal bus terminal electrical interface is also connected to a power supply; the second resistor is connected to the vertical bus terminal electrical interface; the connection point between the first resistor and the second resistor is connected to the sub-processor MCU.

[0033] Preferably, if the horizontal address sampling circuit or the vertical address sampling circuit is a circuit at the head end of the splicing pad, the corresponding horizontal bus terminal electrical interface is short-circuited; if the horizontal address sampling circuit or the vertical address sampling circuit is a circuit at the tail end of the splicing pad, the corresponding vertical bus terminal electrical interface is short-circuited.

[0034] Preferably, the method for the main control unit to obtain the total number of rows and columns of the splicing pads includes: the main control unit receives the total number of rows and columns of the splicing pads set by the external terminal.

[0035] Preferably, the method for the main control unit to obtain the total number of rows and columns of the splicing mat includes:

[0036] S11, the main control unit initializes the total number of rows / columns;

[0037] S12, the main control unit sends the corresponding minimum sampling voltage value to the sub-pad in a broadcasting manner;

[0038] S13, if the sampling voltage value of a sub-pad is equal to the minimum sampling voltage value, the corresponding sub-pad sends a reply message to the main control unit, and the process goes to S14; otherwise, the process goes to S15;

[0039] S14, the main control unit obtains the total number of rows and the total number of columns according to the received reply message;

[0040] S15, the main control unit increments the total number of rows / columns, and then goes to S12.

[0041] In another aspect, a sub-pad address generation method is applied to a sub-pad, comprising:

[0042] Obtain the sampled transverse voltage value and longitudinal voltage value;

[0043] Initialize the total number of rows and row levels;

[0044] The total number of rows and the number of row levels are incremented in sequence, and a horizontal calculated voltage value is obtained based on the incremented current total number of rows and the number of row levels; whether the horizontal calculated voltage value is equal to the sampled horizontal voltage value is determined, and if they are equal, the current number of row levels is used as the actual number of row levels of the sub-pad;

[0045] Initialize the total number of columns and column levels;

[0046] The total number of columns and the number of column levels are incremented in sequence, and a longitudinal calculated voltage value is obtained based on the incremented current total number of columns and the number of column levels; whether the longitudinal calculated voltage value is equal to the sampled longitudinal voltage value is determined, and if they are equal, the current number of column levels is used as the actual number of column levels of the sub-pad;

[0047] The row level number and the column level number are combined to generate the corresponding sub-pad address.

[0048] Preferably, the calculation method of the lateral calculated voltage value is as follows:

[0049] V' i = VDD / M' / (1+ k1) + (M' – i') * VDD / M';

[0050] Among them, V' i represents the horizontal calculation voltage value; VDD represents the power supply voltage; M' represents the current total number of rows; i' represents the current row level; k1 represents the ratio of the two voltage-dividing resistors in the horizontal address sampling circuit;

[0051] The calculation method of the longitudinal calculated voltage value is as follows:

[0052] V' j = VDD / N' / (1+ k2) + (N' – j') * VDD / N';

[0053] Among them, V' j represents the vertical calculated voltage value; VDD represents the power supply voltage; N' represents the current total number of columns; j' represents the current column level number; k2 represents the ratio of the two voltage-dividing resistors in the vertical address sampling circuit.

[0054] Preferably, after taking the current row level as the actual row level of the sub-pad, the method further includes:

[0055] Calculate the minimum transverse voltage based on the current total number of rows, determine whether the minimum transverse voltage is equal to the sampled transverse voltage value, and if they are equal, take the current total number of rows as the actual total number of rows and send it to the main control unit;

[0056] The minimum longitudinal voltage is calculated based on the current total number of columns, and it is determined whether the minimum longitudinal voltage is equal to the sampled longitudinal voltage value. If they are equal, the current total number of columns is used as the actual total number of columns and sent to the main control unit.

[0057] Preferably, the minimum horizontal voltage is a calculated horizontal voltage value when the current row number is equal to the current total row number; the minimum vertical voltage is a calculated vertical voltage value when the current column number is equal to the current total column number.

[0058] Compared with the prior art, the present invention has the following beneficial effects:

[0059] (1) The splicing pad of the present invention comprises a main control unit and one or more sub-pads; the main control unit is spliced ​​with any sub-pad through a connection interface; each sub-pad is spliced ​​with one or more other sub-pads through a connection interface; each sub-pad comprises a sub-processor MCU, two horizontal bus terminal electrical interfaces, two vertical bus terminal electrical interfaces, a horizontal address sampling circuit and a vertical address sampling circuit; the splicing pad of the present invention can be detachably connected according to the use environment / area or use function to meet the needs of different users, and the sub-pads can automatically identify their respective coordinate positions (row levels and column levels) in the splicing pad and generate corresponding sub-pad addresses, so that when the main control unit sends a message including a specified address according to the coordinate position, the corresponding sub-pad can recognize and respond;

[0060] (2) The main control unit and each sub-pad of the present invention exchange messages based on the sub-pad address; thus, when it is necessary to obtain the status / information of the sub-pad at the specified coordinate position, the main control unit sends a message to the specified address to obtain it, or, when the sub-pad actively reports a message, the main control unit can identify the coordinate position of the sub-pad that reports the message, and then perform further control to meet the splicing and use requirements of the smart pad;

[0061] (3) The method for generating the sub-pad address of the present invention may be that after the main control unit obtains the total number of rows and the total number of columns, it broadcasts them to each sub-pad, and each sub-pad calculates according to the sampling circuit to obtain the corresponding row level and column level and then combines them to obtain them. In this method, the sub-pad only needs to calculate according to the sampled voltage value to obtain the corresponding row level and column level, which is suitable for the scene where the total number of rows and the total number of columns are obtained by setting or the main control unit has a strong processing capability;

[0062] (4) The method for generating the sub-pad address of the present invention can be implemented independently according to the sampled voltage value after each sub-pad is powered on, without the need for message interaction with the main control unit. In addition, after the sub-pad address is generated, the total number of rows and columns can be identified and reported to the main control unit. In this method, the main control unit does not need to perform any calculations, and is suitable for scenarios where the total number of rows and columns is unknown or the sub-pad has a strong processing capability.

[0063] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention so that it can be implemented in accordance with the contents of the specification, and in order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are listed below.

[0064] Based on the following detailed description of specific embodiments of the present invention in conjunction with the accompanying drawings, those skilled in the art will become more aware of the above and other objects, advantages and features of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0065] Figure 1This is a connection diagram of a splicing pad according to the first embodiment of the present invention;

[0066] Figure 2 This is a schematic diagram of the connection interface of the splicing pad according to the first embodiment of the present invention;

[0067] Figure 3 This is a schematic diagram of the internal structure of a sub-pad according to the first embodiment of the present invention;

[0068] Figure 4 This is a schematic diagram of an interface of a main control unit according to a first embodiment of the present invention;

[0069] Figure 5 This is a schematic diagram of the interface of the sub-pad according to the first embodiment of the present invention;

[0070] Figure 6 This is a schematic diagram of the inflation structure of a single cushion according to the first embodiment of the present invention;

[0071] Figure 7 It is a schematic diagram of the inflation structure of the splicing cushion according to the first embodiment of the present invention;

[0072] Figure 8 Schematic diagram of a horizontal address sampling circuit / vertical address sampling circuit according to Embodiment 1 of the present invention;

[0073] Fig. 9 It is a schematic diagram of the splicing of the horizontal address sampling circuit / vertical address sampling circuit of the first embodiment of the present invention;

[0074] Fig.10 is a flow chart of a sub-pad address generating method according to a second embodiment of the present invention;

[0075] Fig.11 A flowchart of the main control unit obtaining the total number of rows in the second embodiment of the present invention;

[0076] Fig.12 is a flow chart of a sub-pad address generating method according to a third embodiment of the present invention;

[0077] Fig.13 Schematic diagram of the process of obtaining the number of sub-pad row levels and the total number of rows in the third embodiment of the present invention. DETAILED DESCRIPTION

[0078] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention; it is obvious that the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments, and all other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making creative work are within the scope of protection of the present invention.

[0079] In the description of the present invention, it should be noted that the terms "comprises", "includes" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the existence of other identical elements in the process, method, article or device including the element.

[0080] In the description of the present invention, it should be noted that, unless otherwise clearly stipulated and limited, the terms "installed", "provided with", "mounted / connected", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection. It can be a mechanical connection or an electrical connection. It can be a direct connection or an indirect connection through an intermediate medium. It can be the internal connection of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0081] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, step identifiers S101, S102, S103, etc. are only used for convenient expression and do not represent the execution order, and the corresponding execution order can be adjusted.

[0082] Embodiment 1

[0083] See also Figure 1 and Figure 2 As shown, the present embodiment provides a splicing pad, comprising: a main control unit, one or more sub-pads and one or more execution components (not shown in the figure); the main control unit is spliced ​​with any sub-pad through a connection interface; each sub-pad is spliced ​​with one or more other sub-pads through a connection interface; each sub-pad comprises a sub-processor MCU, two horizontal bus terminal electrical interfaces, two vertical bus terminal electrical interfaces, a horizontal address sampling circuit and a vertical address sampling circuit; the sub-processor MCU is respectively connected to the two horizontal bus terminal electrical interfaces and the two vertical bus terminal electrical interfaces through a serial port for communication, and the sub-processor MCU is respectively connected to the horizontal address sampling circuit and the vertical address sampling circuit for voltage sampling; the main control unit obtains the operating status of each sub-pad, and controls the execution component to perform corresponding operations based on the sub-pad operating status and / or user instructions.

[0084] In this embodiment, the main control unit can periodically send status query messages (messages with specified addresses), and the corresponding sub-pad will judge the address after receiving the message, and reply if it is its own address, and the reply content may include the current working status of the air valve, the status of the airbag (air pressure), the heating temperature, the current voltage, etc. If the coordinate position to be controlled by the main control unit is the sub-pad in row 1 and column 1, the main control unit sends the address 0x0101 for broadcasting, and the sub-pad in row 1 and column 1 replies after receiving the message.

[0085] It should be noted that the main control unit can also send a message to the sub-pad based on the broadcast address, and each sub-pad that receives the broadcast message performs corresponding processing according to the message content. In addition, the sub-pad can also actively report a status message or a request message to the main control unit based on the sub-pad address. The specific settings are made according to needs, and this embodiment does not limit it.

[0086] To ensure normal communication, the main control unit and the sub-pad use a response method to convey messages and collect status. The main control unit can send status query messages to the sub-pad in turn at fixed time intervals. After receiving its own message, the sub-pad uploads its own status as a response.

[0087] It should be noted that the main control unit described in this embodiment can be a separate control unit or a control unit embedded in a physical mat. It can be configured according to specific needs and this embodiment does not impose any limitation.

[0088] Specifically, the main control unit and the sub-pad or the sub-pad and the sub-pad are spliced ​​by connecting the horizontal bus terminal electrical interface (such as a male connector) and the vertical bus terminal electrical interface. Figure 3 As shown, the connection interface includes a power interface and a communication interface, and the main control unit and each sub-pad exchange messages through the communication interface based on the sub-pad address. For massage pad products, the connection interface may also include an air circuit interface. The communication interface is connected via a wired serial bus, and the serial bus includes RS485, CAN, etc., which is not limited in this embodiment.

[0089] Furthermore, the actuator includes one or more of an air pump, a temperature control module and a vibration motor; the main control unit is connected to the air pump to control the inflation of the airbag in the sub-cushion, the main control unit is connected to the temperature control module to control the heating / cooling of the sub-cushion, and the main control unit is connected to the vibration motor to control the vibration of the sub-cushion (for vibration, the main control unit may control the vibration after receiving the user's instruction). It should be noted that the temperature control module may be a device with integrated heating and cooling functions, or it may include independent heating plates and cooling plates. The main control unit may be indirectly connected to the temperature control unit, the vibration motor and the air valve. The main control unit sends instructions to the sub-control unit of the sub-cushion, and the sub-control unit drives the corresponding actuator.

[0090] See also Figure 4 and Figure 5 As shown, in this embodiment, the sub-cushion includes a sub-control unit, which includes a sub-controller MCU and an independent driving circuit for driving individual functions such as heating / cooling, vibration, and an air valve (when the air valve is open, the air pump is allowed to inflate the airbag in the sub-cushion), etc., and has a sensor interface for collecting temperature or air pressure and other piezoelectric signals. The main control unit includes a main controller MCU and an independent driving circuit for driving, for example, an air pump, etc. The specific settings are based on the application and are not limited in this embodiment.

[0091] See also Figure 6 and Figure 7 As shown, the following is an example of the main control unit controlling the air pump to inflate the airbag of the sub-cushion. Figure 7 In the example, the sub-control unit is a control unit embedded in a physical pad, that is, the pad connected to the air pump is the pad where the main control unit is located (hereinafter referred to as the main pad). It can be seen that each sub-pad and main pad is provided with a connection to other pads (via Figure 6 The cushion is provided with an external air pipe connected to the cushion by a butt joint as shown in the figure, and an internal air pipe connected by an air valve. Each cushion is provided with one or more air bags, one of which controls whether air enters a cushion, and another air valve controls whether air enters a single air bag. Through the above structure, it is possible to inflate a specified air bag in a specified cushion by an air pump. Correspondingly, each cushion is provided with an exhaust port, and when exhaust is required, the air valve is controlled to open for exhaust. It should be noted that, see Figure 7 As shown, butt joints that are not connected to other mats need to be closed (i.e. Figure 7 plug shown).

[0092] See also Figure 8 and Fig. 9 As shown, the structures of the horizontal address sampling circuit and the vertical address sampling circuit are the same, both including a first resistor and a second resistor; the first resistor is connected to the male connector, and the male connector is also connected to the power supply; the second resistor is connected to the female connector; the connection point between the first resistor and the second resistor is connected to the ADC acquisition point of the sub-processor MCU.

[0093] Specifically, if the horizontal address sampling circuit or the vertical address sampling circuit is a circuit at the head end of the splicing pad, the corresponding male connector is short-circuited; if the horizontal address sampling circuit or the vertical address sampling circuit is a circuit at the tail end of the splicing pad, the corresponding female connector is short-circuited.

[0094] from Figure 8 and Fig. 9It can be seen that in each sub-pad, R1 / R2 = k1 (or k2). It can be seen that due to the connection relationship, the voltage sampled on the resistor gradually decreases from left to right, and the corresponding voltage sampling values ​​will be different for different numbers of connections. The horizontal voltage value sampled at each row level is expressed as follows:

[0095] V i = VDD / M / (1+ k1) + (M – i) * VDD / M;

[0096] Among them, V i represents the horizontal voltage value; VDD represents the power supply voltage; M represents the total number of rows; i represents the number of row levels; k1 represents the ratio of the two voltage-dividing resistors in the horizontal address sampling circuit;

[0097] The longitudinal voltage value sampled at each column level is expressed as follows:

[0098] V j = VDD / N / (1+ k2) + (N – j) * VDD / N;

[0099] Among them, V j represents the vertical voltage value; VDD represents the power supply voltage; N represents the total number of columns; j represents the number of column levels; k2 represents the ratio of the two voltage-dividing resistors in the vertical address sampling circuit.

[0100] The row number of the sub-pad in the splicing pad can be calculated from the sampled lateral voltage value, which is expressed as follows:

[0101] i = M – M * [V i - VDD / M / (1+k1)] / VDD;

[0102] The number of column levels in the splicing pad is calculated from the sampled longitudinal voltage value, as shown below:

[0103] j = N – N * [V j - VDD / N / (1+k2)] / VDD.

[0104] Embodiment 2

[0105] This embodiment is based on the above-mentioned embodiment 1. The main control unit of the splicing pad and each sub-pad of the embodiment 1 perform message exchange based on the sub-pad address.

[0106] In this embodiment, the main control unit and each sub-pad perform message interaction based on the sub-pad address, specifically including:

[0107] The main control unit sends a message including a designated sub-pad address to each sub-pad;

[0108] Each sub-pad determines whether the designated sub-pad address is its own sub-pad address, and if so, responds to the message.

[0109] In this embodiment, the main control unit can periodically send status query messages (messages with specified addresses). After receiving the message, the sub-pad determines the address and replies if it is its own address. The reply content may include the current working status of the air valve, the status of the airbag (air pressure), the heating temperature, the current voltage, etc. If the coordinate position to be controlled by the main control unit is the sub-pad in row 1 and column 1, the main control unit sends the address 0x0101 for broadcasting, and the sub-pad in row 1 and column 1 replies after receiving the message.

[0110] It should be noted that the main control unit can also send a message to the sub-pad based on the broadcast address, and each sub-pad that receives the broadcast message performs corresponding processing according to the message content. In addition, the sub-pad can also actively report a status message or a request message to the main control unit based on the sub-pad address. The specific settings are made according to needs, and this embodiment does not limit it.

[0111] See also Fig.10 As shown, this embodiment provides a sub-pad address generation method, including:

[0112] S1001, the main control unit broadcasts the acquired total number of rows and columns of the splicing mat to each sub-mat.

[0113] In this embodiment, there are two ways for the main control unit to obtain the total number of rows and columns of the splicing mat.

[0114] For a splicing mat equipped with a remote controller, the main control unit is connected to the remote controller via a wired or wireless method, and then the total number of rows and columns is sent to the main control unit via the remote controller.

[0115] In addition, the main control unit can also obtain the total number of rows and columns of the splicing pad through the automatic addressing method. Taking a row as an example, the sampled voltage value of the sub-pad is expressed as V i = VDD / M / (1+ k1) + (M – i) * VDD / M. From this, we can know that the voltage value of the last-level sub-pad (same as the column) is always (M – i) * VDD / M, and the expansion level of the splicing pad has a definite upper limit (Max), so the main control unit can determine the current horizontal / vertical level by sending the minimum sampling voltage value to the sub-pad.

[0116] See also Fig.11 As shown, the method for the main control unit to obtain the total number of rows and columns of the splicing mat can also be implemented by the following steps:

[0117] S1101, the main control unit initializes the total number of rows / columns;

[0118] S1102, the main control unit sends the corresponding minimum sampling voltage value to the sub-pad in a broadcasting manner;

[0119] S1103, if the sampling voltage value of a sub-pad is equal to the minimum sampling voltage value, the corresponding sub-pad sends a reply message to the main control unit, and the process goes to S1104; otherwise, the process goes to S1105;

[0120] S1104, the main control unit obtains the total number of rows and the total number of columns according to the received reply message;

[0121] S1105, after the main control unit increments the total number of rows / columns, the process goes to S1102.

[0122] After obtaining the total number of rows and columns of the splicing pad, the main control unit sends a row / column broadcast address to the sub-pad, and the content includes the total number of rows / columns.

[0123] S1002, each sub-pad calculates the number of rows in the splicing pad according to the received total number of rows and the sampled transverse voltage value, and calculates the number of columns in the splicing pad according to the received total number of columns and the sampled longitudinal voltage value.

[0124] The calculation method of the row level and column level of the sub-mat in the spliced ​​mat is the same as the calculation of i and j above.

[0125] S1003, each sub-pad combines the row level number and the column level number to generate a corresponding sub-pad address.

[0126] Specifically, the subpad forms its own address 0xRRLL through the row and column levels, where RR is the row level address and LL is the column level address. If the row is 1 and the column is 1, the subpad address is 0x0101. If the row is 10 and the column is 9, the subpad address is 0x1009.

[0127] Furthermore, after obtaining the sub-pad address, the main control unit converts the sub-pad to be driven into an address through an algorithm to perform drive control.

[0128] To ensure normal communication, the main control unit and the sub-pad use a response method to convey messages and collect status. The main control unit sends control messages to the sub-pad in turn at fixed time intervals. After receiving its own message, the sub-pad uploads its own status as a response.

[0129] Embodiment 3

[0130] The difference between this embodiment and the second embodiment is that the method for generating the sub-pad address and the method for obtaining the total number of rows and the total number of columns are processed by each sub-pad respectively according to the sampled voltage value.

[0131] See also Fig.12 and Fig.13As shown, this embodiment provides a sub-pad address generation method, including:

[0132] S1201, obtaining sampled transverse voltage values ​​and longitudinal voltage values;

[0133] S1202, initializing the total number of rows and the number of row levels;

[0134] S1203, sequentially incrementing the total number of rows and the number of row levels, and obtaining a horizontal calculated voltage value based on the incremented current total number of rows and the number of row levels; determining whether the horizontal calculated voltage value is equal to the sampled horizontal voltage value, and if they are equal, taking the current number of row levels as the actual number of row levels of the sub-pad;

[0135] S1204, initializing the total number of columns and the number of column levels;

[0136] S1205, sequentially incrementing the total number of columns and the number of column levels, and obtaining a longitudinal calculated voltage value based on the incremented current total number of columns and the number of column levels; determining whether the longitudinal calculated voltage value is equal to the sampled longitudinal voltage value, and if they are equal, taking the current number of column levels as the actual number of column levels of the sub-pad;

[0137] S1206, combining the row level number and the column level number to generate a corresponding sub-pad address.

[0138] Specifically, the calculation method of the horizontal calculated voltage value is as follows:

[0139] V' i = VDD / M' / (1+ k1) + (M' – i') * VDD / M';

[0140] Among them, V' i represents the horizontal calculation voltage value; VDD represents the power supply voltage; M' represents the current total number of rows; i' represents the current row level; k1 represents the ratio of the two voltage-dividing resistors in the horizontal address sampling circuit;

[0141] The calculation method of the longitudinal calculated voltage value is as follows:

[0142] V' j = VDD / N' / (1+ k2) + (N' – j') * VDD / N';

[0143] Among them, V' j represents the vertical calculated voltage value; VDD represents the power supply voltage; N' represents the current total number of columns; j' represents the current column level number; k2 represents the ratio of the two voltage-dividing resistors in the vertical address sampling circuit.

[0144] After taking the current row level as the actual row level of the subpad, the method further includes:

[0145] Calculate the minimum transverse voltage based on the current total number of rows, determine whether the minimum transverse voltage is equal to the sampled transverse voltage value, and if they are equal, take the current total number of rows as the actual total number of rows and send it to the main control unit;

[0146] The minimum longitudinal voltage is calculated based on the current total number of columns, and it is determined whether the minimum longitudinal voltage is equal to the sampled longitudinal voltage value. If they are equal, the current total number of columns is used as the actual total number of columns and sent to the main control unit.

[0147] The minimum horizontal voltage is a calculated horizontal voltage value when the current row number is equal to the current total row number; the minimum vertical voltage is a calculated vertical voltage value when the current column number is equal to the current total column number.

[0148] The implementation of other parts of the splicing pad of this embodiment is the same as that of the first embodiment, and will not be repeated in this embodiment.

[0149] The above is only a preferred specific implementation of the present invention; however, the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical solution and its improved conception within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A splicing mat, characterized in that: include: A main control unit, one or more sub-pads and one or more execution components; the main control unit is spliced ​​with any sub-pad through a connection interface; each sub-pad is spliced ​​with one or more other sub-pads through a connection interface; each sub-pad includes a sub-processor MCU, two horizontal bus terminal electrical interfaces, two vertical bus terminal electrical interfaces, a horizontal address sampling circuit and a vertical address sampling circuit; the sub-processor MCU is connected to the two horizontal bus terminal electrical interfaces and the two vertical bus terminal electrical interfaces through a serial port for communication, and the sub-processor MCU is connected to the horizontal address sampling circuit and the vertical address sampling circuit for voltage sampling; the main control unit obtains the voltage of each sub-pad The operating status of the sub-pad is determined, and the execution component is controlled to perform corresponding operations based on the sub-pad operating status and / or user instructions.

2. The splicing mat according to claim 1, characterized in that: The structures of the horizontal address sampling circuit and the vertical address sampling circuit are the same, and both include a first resistor and a second resistor; the first resistor is connected to the horizontal bus terminal electrical interface, and the horizontal bus terminal electrical interface is also connected to a power supply; the second resistor is connected to the vertical bus terminal electrical interface; the connection point between the first resistor and the second resistor is connected to the sub-processor MCU.

3. The splicing mat according to claim 2, characterized in that: If the horizontal address sampling circuit or the vertical address sampling circuit is a circuit at the head end of the splicing pad, the corresponding horizontal bus terminal electrical interface is short-circuited; if the horizontal address sampling circuit or the vertical address sampling circuit is a circuit at the tail end of the splicing pad, the corresponding vertical bus terminal electrical interface is short-circuited.

4. The splicing mat according to claim 1, characterized in that: The horizontal bus terminal electrical interface is a male connector; the vertical bus terminal electrical interface is a female connector.

5. The splicing mat according to claim 1, characterized in that: The actuator includes one or more of an air pump, a temperature control module and a vibration motor; the main control unit is connected to the air pump to control the inflation of the airbag in the sub-cushion, the main control unit is connected to the temperature control module to control the heating / cooling of the sub-cushion, and the main control unit is connected to the vibration motor to control the vibration of the sub-cushion.

6. The splicing mat according to claim 1, characterized in that: The main control unit and each sub-pad perform message exchange based on the sub-pad address to obtain the sub-pad operation status.

7. The splicing mat according to claim 6, characterized in that: The method for generating the sub-pad address comprises: The main control unit broadcasts the total number of rows and columns of the splicing mat obtained to each sub-mat; Each sub-pad calculates the number of rows in the splicing pad according to the total number of rows received and the sampled transverse voltage value, and calculates the number of columns in the splicing pad according to the total number of columns received and the sampled longitudinal voltage value; Each sub-pad combines the row level number and the column level number to generate a corresponding sub-pad address.

8. The splicing mat according to claim 6, characterized in that: The method for generating a sub-pad address is applied to a sub-pad and includes: Obtain the sampled transverse voltage value and longitudinal voltage value; Initialize the total number of rows and row levels; The total number of rows and the number of row levels are incremented in sequence, and a horizontal calculated voltage value is obtained based on the incremented current total number of rows and the number of row levels; whether the horizontal calculated voltage value is equal to the sampled horizontal voltage value is determined, and if they are equal, the current number of row levels is used as the actual number of row levels of the sub-pad; Initialize the total number of columns and column levels; The total number of columns and the number of column levels are incremented in sequence, and a longitudinal calculated voltage value is obtained based on the incremented current total number of columns and the number of column levels; whether the longitudinal calculated voltage value is equal to the sampled longitudinal voltage value is determined, and if they are equal, the current number of column levels is used as the actual number of column levels of the sub-pad; The row level number and the column level number are combined to generate the corresponding sub-pad address.

9. A sub-pad address generation method, characterized in that: The splicing mat according to claim 1 comprises: The main control unit broadcasts the total number of rows and columns of the splicing mat obtained to each sub-mat; Each sub-pad calculates the number of rows in the splicing pad according to the total number of rows received and the sampled transverse voltage value, and calculates the number of columns in the splicing pad according to the total number of columns received and the sampled longitudinal voltage value; Each sub-pad combines the row level number and the column level number to generate a corresponding sub-pad address.

10. The sub-pad address generation method according to claim 9, characterized in that: The sub-pad calculates the number of row levels in the splicing pad based on the total number of rows received and the sampled lateral voltage value, which is expressed as follows: i = M – M * [V i - VDD / M / (1+k1)] / VDD; Where i represents the row level of the sub-mat; M represents the total number of rows of the spliced ​​mat; V i represents the lateral voltage value sampled by the sub-pad; k1 represents the ratio of two voltage-dividing resistors in the lateral address sampling circuit; VDD represents the power supply voltage; The sub-pad calculates the number of column levels in the splicing pad based on the total number of rows received and the sampled vertical voltage value, which is expressed as follows: j = N – N * [V j - VDD / N / (1+k2)] / VDD; Wherein, j represents the number of columns of the sub-mat; N represents the total number of columns of the spliced ​​mat; V j It represents the vertical voltage value sampled by the sub-pad; k2 represents the ratio of the two voltage-dividing resistors in the vertical address sampling circuit; VDD represents the power supply voltage.

11. The sub-pad address generation method according to claim 10, characterized in that: The structures of the horizontal address sampling circuit and the vertical address sampling circuit are the same, and both include a first resistor and a second resistor; the first resistor is connected to the horizontal bus terminal electrical interface, and the horizontal bus terminal electrical interface is also connected to a power supply; the second resistor is connected to the vertical bus terminal electrical interface; the connection point between the first resistor and the second resistor is connected to the sub-processor MCU.

12. The sub-pad address generation method according to claim 11, characterized in that: If the horizontal address sampling circuit or the vertical address sampling circuit is a circuit at the head end of the splicing pad, the corresponding horizontal bus terminal electrical interface is short-circuited; if the horizontal address sampling circuit or the vertical address sampling circuit is a circuit at the tail end of the splicing pad, the corresponding vertical bus terminal electrical interface is short-circuited.

13. The sub-pad address generation method according to claim 9, characterized in that: The method for a main control unit to obtain the total number of rows and columns of a splicing pad comprises: the main control unit receives the total number of rows and columns of the splicing pad set by an external terminal.

14. The sub-pad address generation method according to claim 9, characterized in that: The method for the main control unit to obtain the total number of rows and columns of the splicing mat includes: S11, the main control unit initializes the total number of rows / columns; S12, the main control unit sends the corresponding minimum sampling voltage value to the sub-pad in a broadcasting manner; S13, if the sampling voltage value of a sub-pad is equal to the minimum sampling voltage value, the corresponding sub-pad sends a reply message to the main control unit, and the process goes to S14; otherwise, the process goes to S15; S14, the main control unit obtains the total number of rows and the total number of columns according to the received reply message; S15, the main control unit increments the total number of rows / columns, and then goes to S12.

15. A sub-pad address generation method, characterized in that: The sub-mat used in the splicing mat according to claim 1 comprises: Obtain the sampled transverse voltage value and longitudinal voltage value; Initialize the total number of rows and row levels; The total number of rows and the number of row levels are incremented in sequence, and a horizontal calculated voltage value is obtained based on the incremented current total number of rows and the number of row levels; whether the horizontal calculated voltage value is equal to the sampled horizontal voltage value is determined, and if they are equal, the current number of row levels is used as the actual number of row levels of the sub-pad; Initialize the total number of columns and column levels; The total number of columns and the number of column levels are incremented in sequence, and a longitudinal calculated voltage value is obtained based on the incremented current total number of columns and the number of column levels; whether the longitudinal calculated voltage value is equal to the sampled longitudinal voltage value is determined, and if they are equal, the current number of column levels is used as the actual number of column levels of the sub-pad; The row level number and the column level number are combined to generate the corresponding sub-pad address.

16. The sub-pad address generation method according to claim 15, characterized in that: The calculation method of the lateral calculated voltage value is as follows: V’ i = VDD / M’ / (1+ k1) + (M’ – i’) * VDD / M’; Among them, V' i represents the horizontal calculation voltage value; VDD represents the power supply voltage; M' represents the current total number of rows; i' represents the current row level; k1 represents the ratio of the two voltage-dividing resistors in the horizontal address sampling circuit; The calculation method of the longitudinal calculated voltage value is as follows: V' j = VDD / N' / (1+ k2) + (N' – j') * VDD / N'; Among them, V' j represents the vertical calculated voltage value; VDD represents the power supply voltage; N' represents the current total number of columns; j' represents the current column level number; k2 represents the ratio of the two voltage-dividing resistors in the vertical address sampling circuit.

17. The sub-pad address generation method according to claim 16, characterized in that: After taking the current row level as the actual row level of the subpad, the method further includes: Calculate the minimum transverse voltage based on the current total number of rows, determine whether the minimum transverse voltage is equal to the sampled transverse voltage value, and if they are equal, take the current total number of rows as the actual total number of rows and send it to the main control unit; The minimum longitudinal voltage is calculated based on the current total number of columns, and it is determined whether the minimum longitudinal voltage is equal to the sampled longitudinal voltage value. If they are equal, the current total number of columns is used as the actual total number of columns and sent to the main control unit.

18. The sub-pad address generation method according to claim 17, characterized in that: The minimum horizontal voltage is a calculated horizontal voltage value when the current row number is equal to the current total row number; the minimum vertical voltage is a calculated vertical voltage value when the current column number is equal to the current total column number.

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