Imaging drive device, camera module and camera module assembly method

Abstract

The present invention discloses an imaging drive device, a camera module, and an assembly method for the camera module. The imaging drive device includes a module circuit board, which includes an imaging circuit board and a driving circuit board. The imaging circuit board is used to be electrically connected to a photosensitive chip. The driving circuit board can flexibly extend from the outside of the imaging circuit board so that the driving circuit board can be bendably electrically connected to the imaging circuit board. A base is formed on the imaging circuit board and extends from the imaging circuit board toward the light incident side along a first direction. The driving circuit board is suitable for bending from the outside of the imaging circuit board toward the base so that the driving circuit board and the side wall of the base are arranged relative to each other along a second direction and / or relative to each other along a third direction and are located on the periphery of the base. The driving circuit board can be flexibly bendably electrically connected to the outside of the imaging circuit board, making the arrangement of the driving circuit board and the imaging circuit board more compact, which is conducive to miniaturization and thinness of the imaging drive device.

Description

Technical Field

[0001] The present invention relates to the technical field of camera modules, and in particular to an imaging drive device, a camera module, and an assembling method of the camera module. Background Art

[0002] In the consumer electronics sector, especially in smart devices, miniaturized and lightweight camera modules are essential components. Currently, portable devices are equipped with at least one camera module. The driver is an essential component of high-pixel camera modules. During operation, the driver enables multi-directional movement of the optical lens to achieve AF (auto focus) and OIS (optical image stabilization) during shooting.

[0003] In order to meet market demand, the requirements for the imaging quality and imaging functions of camera modules are becoming increasingly higher, and the number of lenses in the optical lens is gradually increasing, resulting in the optical lens becoming larger and heavier. Accordingly, the driving device needs to have greater driving force to ensure that the optical lens moves quickly and smoothly.

[0004] In related technologies, the structures of the driving device and the camera module are usually designed independently and installed separately. For example, the base of the driving device and the base of the camera module are two different components. The base of the driving device is mainly used to carry a number of functional components such as the driving circuit board and movable components; while the base of the camera module is mainly used to carry components such as the driving device and the optical lens. The base of the camera module can also be used to attach filters. When installing the driving device on the base of the camera module, it is also necessary to consider avoiding resistors and capacitors. In other words, the base of the driving device and the base of the camera module need to consider factors such as their structural strength, the minimum wall thickness that can be injection molded, and the flatness of the finished product. Ultimately, the total height of the camera module is raised by the base of the driving device and the base of the camera module.

[0005] However, as electronic devices continue to become thinner and lighter, the demand for miniaturization of camera modules has become increasingly stringent, especially the requirements for the shoulder height of camera modules. The shoulder height of a camera module refers to the vertical height from the mounting substrate of the camera module (such as an imaging circuit board, the bottom surface of the camera module) to the highest point (such as the top surface of the camera module housing, the top surface of the optical lens). The shoulder height of the camera module will directly affect the thickness of the electronic device and the appearance design of the entire machine. The shoulder height of the camera module needs to be strictly limited to meet the requirements of the overall design of the electronic device.

[0006] Therefore, for the sub-components with execution functions of the driving device and optical lens, such as driving coils, driving magnets, guides, reeds, etc., it is necessary to reduce the size as much as possible, compress the occupied space, or move closer to the mounting substrate (such as an imaging circuit board) to reduce the shoulder height of the camera module. Summary of the Invention

[0007] One object of the present invention is to provide an imaging drive device, which integrates the functional components with electrical performance of the camera module into the module circuit board of the imaging drive device, so as to achieve the sinking or downward movement of the functional components, thereby reducing the shoulder height of the camera module.

[0008] Another object of the present invention is to provide an imaging drive device, which directly connects the driving circuit board and the imaging circuit board of the camera module to form a module circuit board of the imaging drive device, thereby reducing welding operations, simplifying the conduction steps, and improving the electrical connection reliability.

[0009] Another object of the present invention is to provide a camera module, wherein the base of the camera module is formed on the module circuit board of the imaging drive device, so that the base of the camera module can be lowered; the movable component is directly supported by the base, so that the movable component can sink or move downward, thereby reducing the shoulder height of the camera module.

[0010] Another object of the present invention is to provide a camera module that can reduce the number of components supported by the base, thereby alleviating the burden on the supporting area of the base.

[0011] Another object of the present invention is to provide a camera module that integrates devices used for imaging and driving through an imaging driving device, thereby making the structure of the camera module more compact and reducing the size of the camera module.

[0012] Another object of the present invention is to provide an assembly method for assembling the above-mentioned camera module.

[0013] In order to achieve at least one of the above purposes, the technical solution adopted by the present invention is: an imaging drive device, comprising: a module circuit board, the module circuit board comprising an imaging circuit board and a driving circuit board, the imaging circuit board being used to be electrically connected to a photosensitive chip, the driving circuit board flexibly extending from the outside of the imaging circuit board so that the driving circuit board can be bendably electrically connected to the imaging circuit board; a base, the base being formed on the imaging circuit board, the base extending from the imaging circuit board toward the light incident side along a first direction; wherein, the driving circuit board is suitable for bending from the outside of the imaging circuit board toward the base, so that the driving circuit board and the side wall of the base are arranged relative to each other along a second direction and / or relative to each other along a third direction, and are located on the outer periphery of the base; wherein, the first direction is parallel to the height direction of the imaging drive device, the second direction is parallel to the length direction of the imaging drive device, and the third direction is parallel to the width direction of the imaging drive device, and the first direction, the second direction and the third direction are orthogonal to each other.

[0014] Preferably, the imaging drive device further includes a drive coil, which is electrically connected to the drive circuit board. When the drive circuit board is bent to be arranged on a different plane from the imaging circuit board, the drive coil is located on the surface of the drive circuit board facing the base.

[0015] Preferably, the driving circuit board includes a mounting portion and a bending portion, wherein the bending portion flexibly and conductively connects the mounting portion and the imaging circuit board, and the bending portion is suitable for bending from the outside of the imaging circuit board toward the base so that the mounting portion and the side wall of the base are arranged relative to each other along the second direction and / or relative to each other along the third direction.

[0016] As a preference, the width of the bent portion is smaller than the length of the edge of the mounting portion to which it is connected, the width of the bent portion is smaller than the length of the edge of the imaging circuit board to which it is connected, the bent portion is connected to the middle section of the edge of the mounting portion, and is connected to the middle section of the edge of the imaging circuit board.

[0017] Preferably, a groove is provided on the edge of the imaging circuit board, the opening of the groove faces the outside of the imaging circuit board, and the bent portion is connected to the bottom of the groove. When the driving circuit board and the imaging circuit board are placed on the same plane, at least part of the bent portion is accommodated in the groove. When the driving circuit board and the imaging circuit board are arranged on different planes, the projection of the bent portion along the first direction falls into the projection of the groove along the first direction.

[0018] Preferably, the mounting portion includes a first plate, a second plate and a third plate. When the driving circuit board is bent to be arranged on a different plane from the imaging circuit board, the surfaces of the first plate, the second plate and the third plate are all parallel to the first direction, wherein the first plate and the third plate are arranged relative to each other along the third direction, and the second plate is located between the first plate and the third plate, so that the first plate, the second plate and the third plate surround the outer periphery of the base.

[0019] As a preference, the imaging circuit board includes a first side, a second side, a third side and a fourth side arranged in sequence in a counterclockwise direction, and the bending portion includes a first soft board, a second soft board and a third soft board, wherein the first soft board can be flexibly bent to connect and conduct the first side and the first board body, the second soft board can be flexibly bent to connect and conduct the second side and the second board body, and the third soft board can be flexibly bent to connect and conduct the third side and the third board body, so that the first board body, the second board body and the third board body are suitable for bending from the outside of the imaging circuit board toward the base.

[0020] As a preference, the mounting portion is provided with a limited area, the base has a boss, and the boss extends from the side wall of the base toward the mounting portion. When the mounting portion and the side wall of the base are arranged relative to each other along the second direction and / or relative to each other along the third direction, the boss extends into the limited area, so that the mounting portion is fixed to the base.

[0021] Preferably, a through slot is provided on the base in an area corresponding to the drive coil, so that when the drive circuit board is bent to be arranged on a different plane from the imaging circuit board, the drive coil can be accommodated in the through slot.

[0022] Preferably, the imaging drive device further comprises a reinforcing plate, and the reinforcing plate is provided on a surface of the mounting portion that is away from the driving coil, so as to support the mounting portion.

[0023] Preferably, the driving coil includes a focusing coil, a first anti-shake coil and a second anti-shake coil, wherein the focusing coil is arranged on the first plate, the first anti-shake coil is arranged on the second plate, and the second anti-shake coil is arranged on the third plate.

[0024] Preferably, the imaging driving device further includes a connecting component, which extends from the outside of the imaging circuit board so that the connecting component is electrically connected to the imaging circuit board, and the connecting component and the driving circuit board are located on opposite sides of the imaging circuit board.

[0025] Preferably, the imaging drive device further includes a sensing device for sensing the position of the optical lens. The sensing device is electrically connected to the driving circuit board. When the driving circuit board is bent to be arranged on a different plane from the imaging circuit board, the sensing device is located on the surface of the driving circuit board facing the base.

[0026] In order to achieve at least one of the above purposes, the technical solution adopted by the present invention is: a camera module, comprising: an imaging drive device as described above; a photosensitive component, the photosensitive component includes a photosensitive chip, and the photosensitive chip is electrically connected to the imaging circuit board of the imaging drive device for imaging; a movable component, the movable component is movably arranged on the base of the imaging drive device; and an optical lens, the optical lens is carried by the movable component and can be movably maintained on the light-sensitive path of the photosensitive component.

[0027] Preferably, the camera module further comprises a shell, which is suitable for covering the outer side of the base so that the driving circuit board of the imaging driving device is maintained between the shell and the base; an avoidance area is provided on the lower edge of the shell, and the opening of the avoidance area faces the imaging circuit board of the imaging driving device to avoid the driving circuit board.

[0028] Preferably, the camera module further includes a driving magnet, which is arranged on the movable component. The driving magnet and the driving coil of the imaging driving device are arranged relative to each other along the second direction and / or along the third direction, so as to drive the movable component to move relative to the base.

[0029] As a preference, the driving magnet includes a focusing magnet, a first anti-shake magnet and a second anti-shake magnet, wherein the focusing magnet and the focusing coil of the imaging drive device are arranged relative to each other along a third direction, so as to drive the movable component to move relative to the base along the first direction, the first anti-shake magnet and the first anti-shake coil of the imaging drive device are arranged relative to each other along the second direction, so as to drive the movable component to move relative to the base along the second direction, and the second anti-shake magnet and the second anti-shake coil of the imaging drive device are arranged relative to each other along the third direction, so as to drive the movable component to move relative to the base along the third direction.

[0030] To achieve at least one of the above purposes, the present invention adopts a technical solution: an assembly method for assembling any of the above-mentioned camera modules, comprising the steps of:

[0031] S1. Provide an imaging drive device, a photosensitive component, and a movable component, install the photosensitive component on an imaging circuit board of the imaging drive device, and install the movable component on a base of the imaging drive device;

[0032] S2. Providing an optical lens, and installing the optical lens on the movable component, wherein power is supplied through an external coil semi-finished fixture and the photosensitive component to assist in calibrating and installing the optical lens;

[0033] S3. Provide a driving coil and a sensing device, and fix the driving coil and the sensing device to a driving circuit board of the imaging driving device respectively and conduct them;

[0034] S4. Bend the driving circuit board so that the driving circuit board and the side wall of the base are arranged relative to each other along the second direction and / or relative to each other along the third direction, and are located at the periphery of the base; provide a shell, and cover the periphery of the driving circuit board with the shell.

[0035] Compared with the prior art, the present invention has the following beneficial effects:

[0036] (1) The functional components with electrical performance of the camera module are integrated into the module circuit board of the imaging drive device, and the base of the camera module is imaged on the module circuit board of the imaging drive device, so that the arrangement of the functional components is more centralized and the structure of the camera module is more compact, thereby reducing the shoulder height of the camera module and facilitating the thinning of the camera module.

[0037] (2) The driving circuit board of the camera module and the imaging circuit board of the camera module are directly connected to form a module circuit board of the imaging driving device, so that the driving circuit board and the imaging circuit board are directly electrically connected, reducing the welding operation, simplifying the conduction steps, and improving the reliability of the electrical connection. It also makes the arrangement of the driving circuit board and the imaging circuit board more compact, which is conducive to the miniaturization of the camera module.

[0038] (3) The base of the camera module is formed on the module circuit board of the imaging drive device, and the drive circuit board is suitable for bending from the imaging circuit board toward the base, so that the drive circuit board and the side wall of the base are arranged relative to each other along the second direction and / or relative to each other along the third direction, which is conducive to further reducing the shoulder height of the camera module and facilitating the assembly of the camera module. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Figure 1 3D is a perspective structural diagram of an imaging drive device and a movable component according to some embodiments of the present application.

[0040] Figure 2 is an exploded view of an imaging drive device and a movable component according to some embodiments of the present application.

[0041] Figure 3 This is a three-dimensional structural diagram of a module circuit board according to some embodiments of the present application.

[0042] Figure 4 This is a schematic diagram of a driving coil and a sensing device arranged on a driving circuit board according to some embodiments of the present application.

[0043] Figure 5 This is an exploded view of the drive coil and photosensitive component arranged on the module circuit board according to some embodiments of the present application.

[0044] Figure 6 It is a three-dimensional structural diagram of a base according to some embodiments of the present application.

[0045] Figure 7 It is a three-dimensional structural diagram of a focusing carrier according to some embodiments of the present application.

[0046] Figure 8 This is a three-dimensional structural diagram of an anti-shake carrier according to some embodiments of the present application.

[0047] Figure 9 It is a three-dimensional structural diagram of a stop assembly according to some embodiments of the present application.

[0048] Figure 10 This is a three-dimensional structural diagram of a camera module according to some embodiments of the present application.

[0049] Figure 11 is a cross-sectional view of a camera module according to some embodiments of the present application.

[0050] Figure 12 yes Figure 11 Enlarged view of part A.

[0051] In the figure: 1. Imaging drive device; 10. Base; 11. First side wall; 12. Second side wall; 13. Third side wall; 14. Fourth side wall; 15. Accommodation space; 16. Boss; 17. Through slot; 18. Base guide slot; 20. Module circuit board; 21. Imaging circuit board; 211. First side edge; 212. Second side edge; 213. Third side edge; 214. Fourth side edge; 215. Groove; 216. Through hole; 22. Driver circuit board; 221 , mounting portion; 2211, first plate; 2212, second plate; 2213, third plate; 2214, limiting area; 222, bending portion; 2221, first soft board; 2222, second soft board; 2223, third soft board; 30, connecting assembly; 31, connecting belt; 32, connector; 40, reinforcement plate; 41, first reinforcement plate; 42, second reinforcement plate; 43, third reinforcement plate; 50, driving coil; 51, focusing coil; 52, first Anti-shake coil; 53, second anti-shake coil; 60, sensing device; 2, camera module; 70, driving magnet; 71, focus magnet; 72, first anti-shake magnet; 73, second anti-shake magnet; 80, movable component; 81, focus carrier; 811, focus receiving slot; 812, open area; 813, focus guide; 82, anti-shake carrier; 821, first anti-shake receiving slot; 822, second anti-shake receiving slot; 823, anti-shake guide; 83, focus guide ;84. Anti-shake guide;85. Focus magnetic member;86. Anti-shake magnetic member;90. Housing;91. Avoidance area;92. Recess;93. Gap;101. Stop assembly;1011. Bracket;1012. Buffer;102. Photosensitive assembly;1021. Photosensitive chip;1022. Electronic component;1023. Filter;1024. Adhesive layer;1025. Support plate;103. Optical lens;1031. Lens barrel;1032. Lens. DETAILED DESCRIPTION

[0052] The present invention will be further described below in conjunction with specific implementation methods. It should be noted that, under the premise of no conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments.

[0053] In the description of the present invention, it should be noted that, for directional words, such as the terms "center", "horizontal", "longitudinal", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like, indicating directions and positional relationships, are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and cannot be understood as limiting the specific scope of protection of the present invention.

[0054] It should be noted that the terms "first", "second", etc. in the description and claims of this application are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence.

[0055] The terms "comprises" and "having" and any variations thereof in the specification and claims of this application are intended to cover non-exclusive inclusions. For example, a process, method, system, product or apparatus that includes a series of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, product or apparatus.

[0056] In the description of the present invention, it should also be noted that, unless otherwise expressly specified or limited, the terms "disposed," "installed," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed, detachable, or integral connections; mechanical or electrical connections; direct, contact, or indirect connections through an intermediate medium; and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0057] This application provides a camera module, such as Figures 1-12 As shown, the camera module 2 includes an imaging drive device 1, a photosensitive component 102, a movable component 80 and an optical lens 103. The imaging drive device 1 is suitable for driving the movable component 80 to carry the optical lens 103 and move relative to the photosensitive component 102 to achieve adjustment of the optical performance. The camera module 2 includes functional components and structural components with electrical performance. The functional components with electrical performance are integrated into the imaging drive device 1 to achieve the sinking or downward movement of the functional components, thereby reducing the shoulder height of the camera module 2. Furthermore, the base 10 is formed on the module circuit board 20 of the imaging drive device 1, so as to integrate the functions of the base of the camera module and the base of the drive device in the related art, thereby achieving the lowering of the base 10 of the camera module 2; the movable component 80 is directly supported on the base 10 of the imaging drive device 1, so as to achieve the sinking or downward movement of the movable component 80, thereby further reducing the shoulder height of the camera module 2. In addition, the imaging drive device 1 can integrate the components used for imaging and driving, making the structure of the camera module 2 more compact and reducing the components supported by the base 10, thereby reducing the burden on the supporting area of the base 10.

[0058] Specifically, the present application provides an imaging drive device 1 of a camera module 2, wherein the imaging drive device 1 is capable of integrating functional components with electrical performance of the camera module 2 and a photosensitive component 102 of the camera module 2. Figures 1-12As shown, the imaging drive device 1 includes a module circuit board 20 and a base 10. The module circuit board 20 includes an imaging circuit board 21 and a driver circuit board 22. The imaging circuit board 21 is electrically connected to the photosensitive chip 1021 to convert the optical signals captured by the photosensitive chip 1021 into electrical signals for processing. The driver circuit board 22 flexibly extends from the outer side of the imaging circuit board 21, allowing the driver circuit board 22 to be bendably electrically connected to the imaging circuit board 21.

[0059] It should be understood that the driving circuit board 22 is used to set the driving coil 50, sensing device 60 and other functional devices with electrical properties of the camera module 2, so that the module circuit board 20 can integrate the driving coil 50, sensing device 60 and other functional devices with electrical properties and the photosensitive component 102, that is, the imaging drive device 1 can integrate the photosensitive component 102 for imaging and the functional devices for driving, so as to realize the sinking or downward movement of the functional devices, thereby reducing the shoulder height of the camera module 2.

[0060] Furthermore, the driving circuit board 22 can be bendably connected to the imaging circuit board 21, and can be bent relative to the imaging circuit board 21, so that the driving circuit board 22 is suitable for being arranged along the height direction of the camera module 2 and is located on the outside of the imaging circuit board 21, so that the arrangement of the driving circuit board 22 and the imaging circuit board 21 can be made more compact, which is conducive to avoiding the functional components with electrical performance of the camera module 2 occupying the space in the height direction of the camera module 2.

[0061] Furthermore, the direct conductive connection between the driver circuit board 22 and the imaging circuit board 21 avoids the need for an additional flexible printed circuit board for connecting the driver circuit board 22 and the imaging circuit board 21. This reduces the space required for the additional flexible printed circuit board and facilitates the miniaturization of the camera module 2. Furthermore, during the design of the camera module 2, there is no need to consider the installation location and method of the flexible printed circuit board, which helps reduce the difficulty and complexity of the design of the camera module 2.

[0062] It is worth mentioning that the driving circuit board 22 is electrically connected to the imaging circuit board 21 as an integral part, that is, there is no need to solder between the imaging circuit board 21 and the driving circuit board 22 of the module circuit board 20, thereby improving the electrical connection reliability of the driving circuit board 22 and the imaging circuit board 21, and reducing the difficulty of conduction between the driving circuit board 22 and the imaging circuit board 21, thereby improving the production efficiency of the imaging driving device 1 and the camera module 2.

[0063] like Figure 1 and Figure 2As shown, the base 10 is formed on the imaging circuit board 21, and the base 10 extends from the imaging circuit board 21 toward the light incident side along the first direction. Furthermore, the driving circuit board 22 is suitable for bending from the outside of the imaging circuit board 21 toward the base 10, so that the driving circuit board 22 and the side wall of the base 10 are arranged relative to each other along the second direction and / or relative to each other along the third direction, and are located on the periphery of the base 10, which is conducive to further reducing the size of the camera module 2 along the first direction, that is, reducing the shoulder height of the camera module 2. It is worth noting that the driving circuit board 22 is suitable for bending from the outside of the imaging circuit board 21 toward the base 10, which is conducive to reducing the difficulty of assembling the driving circuit board 22, thereby improving production efficiency.

[0064] It should be understood that the base 10 is molded on the imaging circuit board 21, which can improve the connection strength and connection reliability between the base 10 and the imaging circuit board 21, and is conducive to reducing the risk of loose connection due to vibration or external force impact; it can also reduce the gap or support structure required for the additional installation of the base 10, so that the structure of the camera module 2 is more compact, which is conducive to reducing the size of the camera module 2.

[0065] It is worth mentioning that in the related art, the movable component is supported by the base of the driving device. Furthermore, the driving device is supported by the base of the camera module. The base of the camera module not only needs to support the movable component, but also needs to support the base of the driving device. In the present application, the base 10 is formed on the imaging circuit board 21 of the module circuit board 20 through the imaging driving device 1, and the movable component 80 is directly supported by the base 10, which can reduce the components supported by the base 10, thereby reducing the burden on the supporting area of the base 10. In addition, the movable component 80 is directly supported by the base 10 of the imaging driving device 1, and the movable component 80 can also be sunk or moved downward, making the structure of the camera module 2 more compact and further reducing the shoulder height of the camera module 2.

[0066] Among them, the first direction is parallel to the height direction of the imaging drive device 1, that is, the optical axis direction of the camera module 2, the second direction is parallel to the length direction of the imaging drive device 1, and the third direction is parallel to the width direction of the imaging drive device 1. The first direction, the second direction and the third direction are orthogonal to each other.

[0067] In some embodiments, as Figure 1 and Figure 2As shown, the imaging drive device 1 further includes a drive coil 50, which is electrically connected to the drive circuit board 22. The drive coil 50 is used to drive the optical lens 103 to move relative to the base 10. It should be understood that when the drive circuit board 22 is bent to be arranged on a different plane from the imaging circuit board 21, the drive coil 50 is located on the surface of the drive circuit board 22 facing the base 10. In at least one embodiment, the drive coil 50 is disposed on the surface of the drive circuit board 22 facing the movable component 80, which helps to reduce the distance between the drive coil 50 and the drive magnet 70 of the camera module 2.

[0068] That is, when the drive coil 50 is mounted on the drive circuit board 22, and when the base 10 is molded, the drive circuit board 22 is adapted to be arranged coplanar with the imaging circuit board 21, that is, the drive circuit board 22 is also able to extend in a plane perpendicular to the first direction, thereby facilitating the installation and conduction operation of the drive coil 50, and helping to reduce the interference of the drive circuit board 22 on the injection-molded base 10. Furthermore, after the drive coil 50 is mounted on the drive circuit board 22 and the base 10 is molded, the drive circuit board 22 is adapted to bend from the imaging circuit board 21 toward the base 10, so that the drive circuit board 22 and the side wall of the base 10 are arranged relative to each other along the second direction and / or relative to each other along the third direction, that is, the drive circuit board 22 and the imaging circuit board 21 are arranged on different planes, and the drive coil 50 is able to be located on the side of the drive circuit board 22 facing the side wall of the base 10.

[0069] In some embodiments, as Figure 2-Figure 5 As shown, the driver circuit board 22 includes a mounting portion 221 and a bent portion 222. The bent portion 222 flexibly and conductively connects the mounting portion 221 and the imaging circuit board 21. The bent portion 222 is adapted to bend from the outside of the imaging circuit board 21 toward the base 10, so that the mounting portion 221 and the sidewall of the base 10 are disposed opposite each other along the second direction and / or along the third direction. Furthermore, the drive coil 50 is disposed on the surface of the mounting portion 221 facing the base 10. In other words, the bent portion 222 functions as a connecting strip, mechanically and electrically connecting the mounting portion 221 to the imaging circuit board 21, i.e., the driver circuit board 22 is integrally electrically connected to the imaging circuit board 21.

[0070] It should be understood that the bent portion 222 is flexible and can be bent, thereby allowing the mounting portion 221 to be positioned on different planes from the imaging circuit board 21. Specifically, when the drive coil 50 is mounted on the drive circuit board 22, the mounting portion 221 is adapted to be positioned coplanar with the imaging circuit board 21, thereby facilitating the installation and conduction of the drive coil 50 and improving the assembly accuracy of the drive coil 50. When molding the base 10, the mounting portion 221 and the imaging circuit board 21 are positioned coplanar; alternatively, by bending the bent portion 222, the mounting portion 221 and the injection mold are positioned on different planes from the imaging circuit board 21, thereby minimizing interference between the mounting portion 221 and the bent portion 222 and the injection molded base 10. Furthermore, after the drive coil 50 is installed on the drive circuit board 22 and the base 10 is formed, by bending the bending portion 222, the mounting portion 221 and the side wall of the base 10 are arranged relative to each other along the second direction and / or along the third direction, and the drive coil 50 is located on the side of the mounting portion 221 facing the side wall of the base 10.

[0071] It is worth mentioning that the bending portion 222 facilitates maintaining integrity when repeatedly bent in different directions. Therefore, during the assembly and production of the camera module 2, the bending portion 222 can reliably maintain the integral connection and mutual conduction between the mounting portion 221 and the imaging circuit board 21, and also facilitates repeated disassembly and maintenance of the camera module 2. For example, when the drive coil 50 needs to be repaired, the bending portion 222 can be used to make the mounting portion 221 coplanar with the imaging circuit board 21, that is, the mounting portion 221 extends in a plane perpendicular to the first direction, so that engineers can easily repair the drive coil 50. After the repair is completed, the driving coil 50 can be re-positioned relative to the driving magnet 70 of the movable component 80 by bending the bending portion 222.

[0072] In some embodiments, as Figure 2-Figure 5 As shown, the width of the bent portion 222 is smaller than the length of the edge of the mounting portion 221 to which it is connected, and the width of the bent portion 222 is smaller than the length of the edge of the imaging circuit board 21 to which it is connected. This allows the bent portion 222 to have a smaller width while reliably mechanically and electrically connecting the mounting portion 221 and the imaging circuit board 21, thereby making the structure between the driving circuit board 22 and the imaging circuit board 21 more compact. It is worth mentioning that by making the bent portion 222 have a smaller width, it is also beneficial to reduce the reaction force of the bent portion 222, that is, the bent portion 222 is easier to deform, thereby reducing the difficulty of bending the bent portion 222 when assembling the camera module 2, and it is beneficial to keep the mounting portion 221 relative to the side wall of the base 10.

[0073] Further, such as Figure 2-Figure 5As shown, the bent portion 222 connects to the middle section of the edge of the mounting portion 221 and to the middle section of the edge of the imaging circuit board 21. This helps prevent the bent portion 222 from interfering with the ends of the mounting portion 221 and the corners of the imaging circuit board 21, thereby making the structure of the mounting portion 221 and the imaging circuit board 21 more compact. Furthermore, the bent portion 222 is connected to the middle section of the edge of the mounting portion 221. When the mounting portion 221 is positioned opposite the sidewall of the base 10, the bent portion 222 more stably supports the mounting portion 221, thereby ensuring more balanced force on the mounting portion 221. Furthermore, the bent portion 222 is connected to the middle section of the edge of the mounting portion 221, allowing the wiring on the mounting portion 221 to extend from the center to the ends, which helps prevent excessive wiring lengths and, in turn, helps mitigate signal delays, signal reflections, and crosstalk.

[0074] It is worth mentioning that, compared with the bending portion 222 connecting the entire edge of the mounting portion 221 and the entire edge of the imaging circuit board 21, in this embodiment, the bending portion 222 connects the middle section of the mounting portion 221 and the middle section of the imaging circuit board 21, which is beneficial to reducing the risk of twisting of the bending portion 222 due to improper bending angle or bending position, and reducing the risk of pulling or damage of the bending portion 222 due to twisting, which is beneficial to further improve the reliability and stability of the mechanical connection and electrical connection of the bending portion 222 to the mounting portion 221 and the imaging circuit board 21.

[0075] In some embodiments, as Figure 3 As shown, a groove 215 is defined along the edge of the imaging circuit board 21. The opening of the groove 215 faces the outside of the imaging circuit board 21, and the bent portion 222 is connected to the bottom of the groove 215. It should be understood that when the driver circuit board 22 and the imaging circuit board 21 are placed coplanar, at least a portion of the bent portion 222 is accommodated in the groove 215. While ensuring that the bent portion 222 has sufficient length, this allows for a more compact structure among the imaging circuit board 21, the bent portion 222, and the mounting portion 221, thereby reducing the overall size of the imaging circuit board 21 and the driver circuit board 22, facilitating storage and improving transportation efficiency.

[0076] Furthermore, when the driver circuit board 22 and the imaging circuit board 21 are arranged on different planes, the projection of the bent portion 222 along the first direction falls within the projection of the groove 215 along the first direction. In other words, when the mounting portion 221 of the imaging circuit board 21 is positioned opposite the sidewall of the base 10, the projection of the bent portion 222 along the first direction falls within the projection of the groove 215 along the first direction. It is worth noting that in this case, the projection of the mounting portion 221 along the first direction falls within the projection of the imaging circuit board 21 along the first direction, thereby facilitating the reduction of the dimensions of the imaging driver device 1 and the camera module 2 along the second and third directions.

[0077] In some embodiments, as Figure 6As shown, the base 10 includes a first side wall 11, a second side wall 12, a third side wall 13 and a fourth side wall 14 arranged in sequence in a counterclockwise direction, defining a receiving space 15 between the first side wall 11, the second side wall 12, the third side wall 13 and the fourth side wall 14, and the receiving space 15 is used to accommodate the movable component 80 of the camera module 2.

[0078] Further, such as Figure 3 and Figure 5 As shown, the mounting portion 221 includes a first plate 2211, a second plate 2212, and a third plate 2213. When the driving circuit board 22 is bent to be disposed on a different plane from the imaging circuit board 21, the surfaces of the first plate 2211, the second plate 2212, and the third plate 2213 are all parallel to the first direction. The first plate 2211 and the third plate 2213 are disposed opposite each other along a third direction, and the second plate 2212 is located between the first plate 2211 and the third plate 2213, so that the first plate 2211, the second plate 2212, and the third plate 2213 surround the outer periphery of the base 10. Specifically, the first plate 2211 is disposed opposite the first side wall 11 of the base 10 along the third direction, the second plate 2212 is disposed opposite the second side wall 12 of the base 10 along the second direction, and the third plate 2213 is disposed opposite the third side wall 13 of the base 10 along the third direction.

[0079] In some embodiments, as Figure 4 As shown, the driving coil 50 includes a focus coil 51, a first anti-shake coil 52, and a second anti-shake coil 53. The focus coil 51 is disposed on the first plate 2211, the first anti-shake coil 52 is disposed on the second plate 2212, and the second anti-shake coil 53 is disposed on the third plate 2213.

[0080] Specifically, the focus coil 51 is disposed on the surface of the first plate 2211 facing the movable component 80 and is accommodated in the through-slot 17 on the first side wall 11 of the base 10. The focus coil 51 is used to drive the movable component 80 of the camera module 2 to move in a first direction relative to the base 10. The first anti-shake coil 52 is disposed on the surface of the second plate 2212 facing the movable component 80 and is accommodated in the through-slot 17 on the second side wall 12 of the base 10. The first anti-shake coil 52 is used to drive the movable component 80 of the camera module 2 to move in a second direction relative to the base 10. The second anti-shake coil 53 is disposed on the surface of the third plate 2213 facing the movable component 80 and is accommodated in the through-slot 17 on the third side wall 13 of the base 10. The second anti-shake coil 53 is used to drive the movable component 80 of the camera module 2 to move in a third direction relative to the base 10.

[0081] In some embodiments, as Figure 3As shown, the imaging circuit board 21 includes a first side 211, a second side 212, a third side 213 and a fourth side 214 arranged in sequence in a counterclockwise direction, and the bending portion 222 includes a first soft board 2221, a second soft board 2222 and a third soft board 2223, wherein the first soft board 2221 can be flexibly bent to connect the first side 211 and the first plate body 2211, the second soft board 2222 can be flexibly bent to connect the second side 212 and the second plate body 2212, and the third soft board 2223 can be flexibly bent to connect the third side 213 and the third plate body 2213, so that the first plate body 2211, the second plate body 2212 and the third plate body 2213 are suitable for bending from the outside of the imaging circuit board 21 toward the base 10.

[0082] It should be understood that the first plate 2211 is electrically connected to the first side 211 of the imaging circuit board 21 through the first soft plate 2221, which can be bent into one piece, the second plate 2212 is electrically connected to the second side 212 of the imaging circuit board 21 through the second soft plate 2222, and the third plate 2213 is electrically connected to the third side 213 of the imaging circuit board 21 through the third soft plate 2223, which can make the focusing coil 51 on the first plate 2211, the first anti-shake coil 52 on the second plate 2212 and the second anti-shake coil 53 on the third plate 2213 respectively conductive to the imaging circuit board 21, so as to realize the integration of the driving coil 50 and the photosensitive component 102.

[0083] It is worth mentioning that during the assembly of the camera module 2, the bending directions of the first soft board 2221, the second soft board 2222 and the third soft board 2223 are consistent, that is, each soft board is bent from the imaging circuit board 21 toward the light incident side of the camera module 2. The operation is simple, which is conducive to improving the efficiency of assembly.

[0084] Furthermore, when the drive coil 50 needs to be repaired, the independent plate can be separated from the base 10, and the corresponding flexible plate can be bent so that the plate is in a plane perpendicular to the first direction, which helps improve the convenience of maintenance. For example, if the AF function of the camera module 2 has a problem, the first plate 2211 can be separated from the base 10, and the first flexible plate 2221 can be bent so that the first plate 2211 is in a horizontal plane, so that the focus coil 51 can be repaired. At the same time, it helps to avoid affecting the first anti-shake coil 52 on the second plate 2212 and the second anti-shake coil 53 on the third plate 2213.

[0085] It is worth mentioning that, according to the actual structure of the camera module 2, the first plate 2211 and the second plate 2212 can be connected by a soft board, and the second plate 2212 and the third plate 2213 can be connected by a soft board, so that the first plate 2211, the second plate 2212 and the third plate 2213 can be bent and electrically connected as a whole. Furthermore, one of the first plate 2211, the second plate 2212 and the third plate 2213 is connected and conducted to the imaging circuit board 21 through a soft board, so that the driving circuit board 22 is electrically connected to the imaging circuit board 21 as a whole. This application does not impose any specific restrictions on this.

[0086] In some embodiments, as Figure 1 and Figure 3 As shown, the mounting portion 221 defines a limited area 2214, and the base 10 has a boss 16, which extends from the side wall of the base 10 toward the mounting portion 221. When the mounting portion 221 and the side wall of the base 10 are arranged relative to each other along the second direction and / or along the third direction, the boss 16 is able to extend into the limited area 2214, thereby fixing the mounting portion 221 to the base 10. In other words, through the cooperation between the limited area 2214 and the boss 16, the mounting portion 221 is easily fixed to the side wall of the base 10 according to the preset position, thereby improving the ease of assembly and improving production efficiency.

[0087] In at least one embodiment, Figure 3 As shown, the limiting area 2214 is implemented as a through hole extending along the thickness direction of the mounting portion 221. The through hole cooperates with the boss 16 to enable the mounting portion 221 to be supported by the base 10, which is beneficial to prevent the mounting portion 221 from being separated from the base 10 under vibration or external force impact. The cross-section of the through hole includes but is not limited to a circle or a rectangle, and this application does not impose specific restrictions on this. In at least one other embodiment, as Figure 4 As shown, the limiting area 2214 is implemented as a gap opened on the edge of the mounting portion 221, which is beneficial to reducing the space occupied by the limiting area 2214 on the mounting portion 221, and reducing the impact of the opening of the limiting area 2214 on the wiring of the mounting portion 221 and the structural strength of the mounting portion 221.

[0088] It should be understood that, on the basis of fixing the mounting portion 221 to the base 10 through the cooperation of the limiting area 2214 and the boss 16, the mounting portion 221 can be further bonded to the base 10 to improve the connection strength and connection reliability between the mounting portion 221 and the base 10; or the mounting portion 221 can be further detachably connected to the base 10 through fasteners to improve the connection strength between the mounting portion 221 and the base 10, and facilitate later disassembly and maintenance.

[0089] In some embodiments, as Figure 1 and Figure 6As shown, a through slot 17 is defined in the area of the base 10 corresponding to the drive coil 50. When the drive circuit board 22 is bent to be positioned on a different plane from the imaging circuit board 21, the drive coil 50 is accommodated within the through slot 17. In other words, the through slot 17 is defined in the sidewall of the base 10 and extends along the thickness direction of the sidewall of the base 10, penetrating the sidewall of the base 10. Furthermore, when the driving circuit board 22 is bent from the imaging circuit board 21 toward the base 10 so that the mounting portion 221 of the driving circuit board 22 is arranged opposite to the side wall of the base 10, the mounting portion 221 is able to fit into the side wall of the base 10, and the driving coil 50 on the mounting portion 221 is able to be accommodated in the through groove 17, so that the driving coil 50 is closer to the driving magnet 70 of the camera module 2, which is beneficial to enhance the driving force of the imaging driving device 1 and the camera module 2, and improve the driving stability; in addition, it is also beneficial to reduce the size of the camera module 2 along the second direction and along the third direction, which is beneficial to achieve the miniaturization of the camera module 2.

[0090] In at least one embodiment, Figure 6 As shown, the cross section of the through slot 17 is implemented as a rectangle, and the side wall of the base 10 is used to assist in limiting the driving coil 50, which is beneficial to improving the structural reliability of the camera module 2. In at least one embodiment, as Figure 6 As shown, the cross-section of the through groove 17 is implemented as a "U" shape, that is, the opening of the through groove 17 faces the upper edge of the side wall of the base 10, thereby reducing the difficulty of placing the driving coil 50 into the through groove 17 when the driving circuit board 22 is bent, which is beneficial to reducing the assembly difficulty of the camera module 2 and improving the production efficiency of the camera module 2.

[0091] In some embodiments, as Figure 4 and Figure 5 As shown, the imaging drive device 1 further includes a reinforcing plate 40, which is disposed on the surface of the mounting portion 221 on the side away from the drive coil 50, so as to support the mounting portion 221, thereby improving the structural strength of the mounting portion 221 and improving the flatness of the mounting portion 221. It should be understood that the reinforcing plate 40 is located on the side of the mounting portion 221 away from the drive coil 50, which is also beneficial for resisting external impacts and protecting the mounting portion 221, the drive coil 50, and even the side walls of the base 10 and the movable component 80. It is worth mentioning that the reinforcing plate 40 includes but is not limited to metal plates such as steel plates and copper plates, as well as plastic plates, and this application does not impose specific restrictions on this.

[0092] In at least one embodiment, the reinforcing plate 40 is implemented as a metal plate, and the reinforcing plate 40 also functions as a magnetic yoke. Specifically, the reinforcing plate 40 is located on the side of the drive coil 50 that faces away from the drive magnet 70 of the camera module 2. The reinforcing plate 40 can constrain the magnetic field of the drive magnet 70, thereby reducing the spread of the magnetic field of the drive magnet 70 outside the camera module 2. This helps improve the utilization efficiency of the magnetic field, thereby enhancing the driving force of the imaging drive device 1 and improving the driving stability.

[0093] It is worth mentioning that Figure 4 As shown, a through hole or notch can also be provided in the area on the reinforcing plate 40 corresponding to the limiting area 2214, so that the boss 16 of the base 10 can pass through the mounting portion 221 and the reinforcing plate 40 in sequence to improve the connection strength and connection reliability between the mounting portion 221, the reinforcing plate 40 and the base 10.

[0094] In some embodiments, as Figure 5 As shown, the reinforcing plate 40 includes a first reinforcing plate 41, a second reinforcing plate 42, and a third reinforcing plate 43. The first reinforcing plate 41 is mounted on the surface of the first plate 2211 facing away from the focus coil 51, thereby supporting the first plate 2211. The second reinforcing plate 42 is mounted on the surface of the second plate 2212 facing away from the first image stabilization coil 52, thereby supporting the second plate 2212. The third reinforcing plate 43 is mounted on the surface of the third plate 2213 facing away from the second image stabilization coil 53, thereby supporting the third plate 2213.

[0095] In some embodiments, as Figure 10 As shown, the imaging drive device 1 also includes a connecting component 30, which is used to be conductive with the mainboard of the smart device. The connecting component 30 is electrically connected to the outside of the imaging circuit board 21 as a whole. The connecting component 30 and the driving circuit board 22 are located on opposite sides of the imaging circuit board 21, which is beneficial to avoid interference between the connecting component 30 and the driving circuit board 22, and also simplifies the wiring of the imaging drive device 1, thereby improving the electrical connection reliability and stability of the imaging drive device 1.

[0096] In at least one embodiment, Figure 3 and Figure 10As shown, the connection assembly 30 includes a connection belt 31 and a connector 32. The connection belt 31 is mechanically and electrically connected to the fourth side 214 of the imaging circuit board 21 and the connector 32, so that the connector 32 and the driving circuit board 22 are located on opposite sides of the imaging circuit board 21. The connector 32 is used to conduct with the mainboard of the smart device, so that the driving coil 50 and the sensing device 60 on the driving circuit board 22, and the photosensitive chip 1021 and the electronic components 1022 on the imaging circuit board 21 can be conducted with the mainboard. It should be understood that the connection belt 31 is flexible so as to be suitable for bending and deformation, thereby reducing the difficulty of installing the camera module 2 on the smart device, which is conducive to improving the production efficiency of the smart device.

[0097] It is worth mentioning that the first board 2211, the second board 2212, the third board 2213 and the connector 32 are respectively connected to the first side 211, the second side 212, the third side 213 and the fourth side 214 of the imaging circuit board 21 through the first soft board 2221, the second soft board 2222, the third soft board 2223 and the connecting belt 31, which is conducive to making the wiring on the imaging circuit board 21 more uniform, thereby reducing the risk of defects such as short circuit and open circuit in the manufacturing process of the imaging circuit board 21; it is also conducive to reducing stress concentration points on the imaging circuit board 21, reducing the risk of wiring breakage or even solder joint cracking due to temperature changes, mechanical vibrations, external impacts, etc., thereby improving the reliability of the imaging circuit board 21.

[0098] In some embodiments, as Figure 5 As shown, the imaging drive device 1 further includes a sensing device 60 for sensing the position of the optical lens 103, thereby facilitating closed-loop control of the movable assembly 80. The sensing device 60 is electrically connected to the driver circuit board 22. When the driver circuit board 22 is bent to be disposed on a different plane from the imaging circuit board 21, the sensing device 60 is located on the surface of the driver circuit board 22 facing the base 10.

[0099] In at least one embodiment, the sensing device 60 is located inside the drive coil 50, making the arrangement of the drive coil 50 and the sensing device 60 on the drive circuit board 22 more compact, which helps further reduce the size of the camera module 2. In at least one other embodiment, the sensing device 60 is located outside the drive coil 50, which helps reduce the magnetic interference of the drive coil 50 on the sensing device 60, making the detection results of the sensing device 60 more accurate, and helping to improve the accuracy of the camera module 2 in controlling the position of the optical lens 103.

[0100] A camera module 2, such as Figure 10-12As shown, it includes: the above-mentioned imaging drive device 1, a photosensitive component 102, a movable component 80, and an optical lens 103. The photosensitive component 102 includes a photosensitive chip 1021, and the photosensitive chip 1021 is electrically connected to the imaging circuit board 21 of the imaging drive device 1 for imaging. The movable component 80 is movably arranged on the base 10 of the imaging drive device 1. The optical lens 103 is carried by the movable component 80 and can be movably maintained on the photosensitive path of the photosensitive component 102 to collect external imaging light. The optical lens 103 defines an optical axis O. Specifically, the movable component 80 is suitable for carrying the optical lens 103, and driving the optical lens 103 to move along the first direction to realize the AF function, and move along the second direction and / or along the third direction to realize the OIS function.

[0101] In some embodiments, the optical lens 103 includes a lens barrel 1031 and at least one lens 1032 mounted within the lens barrel 1031. In at least one embodiment, the lens barrel 1031 is integrally formed with the anti-shake carrier 82 of the imaging drive device 1, thereby improving the structural strength of the lens barrel 1031 and the connection strength and reliability between the lens barrel 1031 and the anti-shake carrier 82.

[0102] In some embodiments, as Figure 1 and Figure 2 As shown, the motor of the camera module 2 also includes a driving magnet 70, which is arranged on the movable component 80, so that it can be arranged relative to the driving coil 50 on the imaging drive device 1 along the second direction and / or along the third direction, and then through the Lorentz force between the driving coil 50 and the driving magnet 70, the movable component 80 can be driven to move relative to the base 10.

[0103] It should be understood that, compared to the drive magnet 70 and the drive coil 50 being arranged relative to each other along the first direction, in this embodiment, the drive magnet 70 and the drive coil 50 are arranged relative to each other along the second direction and / or along the third direction, which is conducive to avoiding the stacking of the drive magnet 70 and the drive coil 50 in the first direction, thereby reducing the shoulder height of the camera module 2, and catering to the trend of lightweight development of electronic equipment. In addition, compared to the drive coil 50 being arranged in the movable component 80 and the drive magnet 70 being arranged in the base 10, in this embodiment, the drive magnet 70 is arranged in the movable component 80 and the drive coil 50 is arranged in the base 10, which simplifies the routing of the drive coil 50, that is, the drive coil 50 is directly connected to the drive circuit board 22 and is fixed to the base 10 through the drive circuit board 22; and simplifies the structure of the camera module 2, that is, it is conducive to avoiding the setting of other structures to fix the drive circuit board 22 and the drive coil 50 separately, thereby making the structure of the camera module 2 more compact and reducing the size of the camera module 2.

[0104] In some embodiments, as Figure 2 As shown, the movable assembly 80 includes an anti-shake carrier 82 and a focus carrier 81. The anti-shake carrier 82 is used to support the optical lens 103, and the focus carrier 81 is stacked along a first direction between the anti-shake carrier 82 and the base 10. Specifically, the anti-shake carrier 82 can move along the second direction and / or along the third direction relative to the focus carrier 81 together with the optical lens 103 to implement the OIS function; the focus carrier 81 can move along the first direction relative to the base 10 together with the anti-shake carrier 82 and the optical lens 103 to implement the AF function.

[0105] It is worth mentioning that the focusing carrier 81 is stacked between the anti-shake carrier 82 and the base 10 along the first direction, which is beneficial to keep the size of the camera module 2 along the first direction small, so that the focusing carrier 81 has a relatively long focusing stroke, thereby making the camera module 2 have both a lower shoulder height and better focusing performance.

[0106] In some embodiments, as Figure 2 As shown, the movable assembly 80 further includes a plurality of anti-shake guides 84. These guides 84 are pressed along a first direction between the anti-shake carrier 82 and the focus carrier 81, supporting the anti-shake carrier 82 in movement relative to the focus carrier 81 in a second direction and / or a third direction to implement the OIS function. It will be appreciated that the anti-shake guides 84 reduce friction during relative movement between the anti-shake carrier 82 and the focus carrier 81, thereby reducing the driving force required to move the anti-shake carrier 82, thereby improving the flexibility and stability of the movement of the anti-shake carrier 82.

[0107] Further, such as Figure 12 As shown, the bottom surface of the anti-shake carrier 82 is provided with an anti-shake guide groove 823. The anti-shake guide groove 823 accommodates an anti-shake guide 84, thereby limiting the anti-shake guide 84 and preventing the anti-shake guide 84 from separating from the anti-shake carrier 82. Furthermore, the provision of the anti-shake guide groove 823 facilitates a more compact structure among the anti-shake carrier 82, the anti-shake guide 84, and the focus carrier 81, thereby reducing the shoulder height of the camera module 2. It should be understood that the anti-shake guide 84 includes, but is not limited to, balls, rollers, etc., and this application does not impose specific limitations on this.

[0108] In some embodiments, as Figure 11 As shown, the movable assembly 80 further includes a focus guide 83, which is press-fitted along the third direction between the focus carrier 81 and the first sidewall 11 of the base 10. This guide supports the focus carrier 81 in the first direction relative to the base 10 to achieve the AF function. It will be appreciated that the focus guide 83 reduces friction during relative movement between the focus carrier 81 and the base 10, thereby reducing the driving force required to move the focus carrier 81, thereby improving the flexibility and stability of the focus carrier 81's movement.

[0109] Further, such as Figure 6 and Figure 7 As shown, a focus guide groove 813 is defined on the side of the focus carrier 81 facing the first sidewall 11, and a base guide groove 18 is defined on the side of the first sidewall 11 facing the focus carrier 81. Both the focus guide groove 813 and the base guide groove 18 extend along the first direction, and the opening of the focus guide groove 813 and the opening of the base guide groove 18 are arranged relative to each other along the third direction. This allows the focus guide 83 to be accommodated between the focus guide groove 813 and the base guide groove 18, thereby limiting the focus guide 83 and preventing the focus guide 83 from separating from the focus carrier 81. In addition, the provision of the focus guide groove 813 also facilitates a more compact structure between the base 10, the focus guide 83, and the focus carrier 81, thereby reducing the size of the camera module 2 along the third direction. It should be understood that the focus guide 83 includes, but is not limited to, balls, rollers, guide rods, etc., and this application does not impose specific limitations on this.

[0110] In at least one embodiment, Figure 6 、 Figure 7 and Figure 11 As shown, two pairs of base guide grooves 18 and focus guide grooves 813 are defined between the first sidewall 11 of the base 10 and the focus carrier 81. These pairs are spaced apart along the second direction, with a ball being held between each pair of base guide grooves 18 and focus guide grooves 813, thereby reliably supporting the focus carrier 81 in its movement relative to the base 10 in the first direction. Furthermore, a recess 92 is provided on the housing 90, protruding toward the ball in the first direction. This constrains the ball between the recess 92 and the imaging circuit board 21 in the first direction, effectively preventing the ball from dislodging from the focus guide groove 813 and the base guide groove 18.

[0111] In some embodiments, as Figure 2 and Figure 8As shown, the driving magnet 70 includes a first anti-shake magnet 72 and a second anti-shake magnet 73. Specifically, a first anti-shake receiving groove 821 is defined on the side of the anti-shake carrier 82 facing the second side wall 12 of the base 10. The first anti-shake receiving groove 821 is adapted to accommodate the first anti-shake magnet 72, so that the first anti-shake magnet 72 and the through-slot 17 on the second side wall 12 are arranged relative to each other in the second direction. Furthermore, the first anti-shake magnet 72 and the first anti-shake coil 52 on the imaging drive device 1 are arranged relative to each other in the second direction, thereby driving the anti-shake carrier 82 to move in the second direction relative to the focus carrier 81 and the base 10. A second anti-shake accommodating groove 822 is provided on the anti-shake carrier 82 on one side of the third side wall 13 facing the base 10. The second anti-shake accommodating groove 822 is suitable for accommodating the second anti-shake magnet 73, so that the second anti-shake magnet 73 and the through groove 17 on the third side wall 13 are arranged relative to each other along the third direction, and then the second anti-shake magnet 73 and the second anti-shake coil 53 on the imaging drive device 1 are arranged relative to each other along the third direction, so as to drive the anti-shake carrier 82 to move relative to the focusing carrier 81 and the base 10 along the third direction.

[0112] Further, such as Figure 2 and Figure 7 As shown, the driving magnet 70 also includes a focusing magnet 71. A focusing accommodating groove 811 is provided on the side of the first side wall 11 of the focusing carrier 81 facing the base 10. The focusing accommodating groove 811 is suitable for accommodating the focusing magnet 71, so that the focusing magnet 71 and the through groove 17 on the first side wall 11 are arranged relative to each other along the third direction, and then the focusing magnet 71 and the focusing coil 51 on the imaging driving device 1 are arranged relative to each other along the third direction, so as to drive the movable component 80 to move relative to the base 10 along the first direction.

[0113] In some embodiments, as Figure 7 As shown, an open area 812 is respectively provided on the focusing carrier 81 on the side of the second side wall 12 facing the base 10 and on the side of the third side wall 13 facing the base 10. The open area 812 allows the first anti-shake magnet 72 and the second anti-shake magnet 73 on the anti-shake carrier 82 to be exposed to the focusing carrier 81, which is beneficial to avoid the focusing carrier 81 being blocked between the first anti-shake coil 52 and the first anti-shake magnet 72, and is beneficial to avoid the focusing carrier 81 being blocked between the second anti-shake coil 53 and the second anti-shake magnet 73, and is beneficial to enhance the Lorentz force between the first anti-shake coil 52 and the first anti-shake magnet 72, and between the second anti-shake coil 53 and the second anti-shake magnet 73, thereby improving the driving force and stability of the anti-shake drive of the camera module 2.

[0114] In some embodiments, as Figure 8As shown, the camera module 2 also includes an anti-shake magnetic conductive element 86. The anti-shake magnetic conductive element 86 is disposed on the walls of the first anti-shake accommodating slot 821 and the second anti-shake accommodating slot 822, positioned on the side of the first anti-shake magnet 72 facing away from the first anti-shake coil 52, and on the side of the second anti-shake magnet 73 facing away from the second anti-shake coil 53. It should be understood that the anti-shake magnetic conductive element 86 can constrain the magnetic field of the first and second anti-shake magnets 72 and 73, thereby reducing the spread of the magnetic field toward the optical lens 103. This in turn helps improve the utilization efficiency of the magnetic field and further enhances the driving force and stability of the anti-shake drive of the camera module 2. In at least one embodiment, the anti-shake magnetic conductive element 86 is embedded in the anti-shake carrier 82, which helps improve the connection strength and reliability between the anti-shake magnetic conductive element 86 and the anti-shake carrier 82.

[0115] Further, such as Figure 7 As shown, the camera module 2 also includes a focus magnetic conductive member 85, which is arranged on the groove wall of the focus receiving groove 811 and is located on the side of the focus magnet 71 away from the focus coil 51. It should be understood that the focus magnetic conductive member 85 can restrain the magnetic field of the focus magnet 71, which is beneficial to reduce the diffusion of the magnetic field of the focus magnet 71 toward the direction of the optical lens 103, thereby improving the utilization efficiency of the magnetic field and further improving the driving force and stability of the focus drive of the camera module 2. In at least one embodiment, the focus magnetic conductive member 85 is embedded in the focus carrier 81, which is beneficial to improve the connection strength and connection reliability between the focus magnetic conductive member 85 and the focus carrier 81.

[0116] In some embodiments, as Figure 3 and Figure 4 As shown, the imaging circuit board 21 defines a through hole 216 for accommodating the photosensitive chip 1021. In at least one embodiment, the through hole 216 is similar in shape to the photosensitive chip 1021 and is slightly larger than the photosensitive chip 1021, thereby accommodating the photosensitive chip 1021 and further reducing the shoulder height of the camera module 2. It is worth noting that the photosensitive chip 1021 and the imaging circuit board 21 can be connected to each other through wire bonding, gold wire bonding, or other methods.

[0117] In some embodiments, as Figure 5 As shown, the photosensitive assembly 102 further includes a support plate 1025, which is fixed to a side of the imaging circuit board 21 facing away from the base 10, thereby supporting the imaging circuit board 21, thereby facilitating improvement of the structural strength of the bottom of the imaging drive device 1. It is worth mentioning that the support plate 1025 includes, but is not limited to, metal plates such as steel plates and copper plates, as well as plastic plates, and this application does not impose any specific restrictions on this.

[0118] In at least one embodiment, Figure 5 As shown, an adhesive layer 1024 is provided between the imaging circuit board 21 and the support plate 1025, thereby bonding the imaging circuit board 21 to the support plate 1025. Furthermore, the photosensitive chip 1021 is received in the through hole 216 of the imaging circuit board 21 and bonded to the support plate 1025 via the adhesive layer 1024. It should be understood that the support plate 1025 provides a smoother surface for the photosensitive chip 1021 to secure, thereby improving the flatness of the photosensitive chip 1021.

[0119] In some embodiments, as Figure 12 As shown, the photosensitive assembly 102 further includes a filter 1023. The filter 1023 is retained in the light sensing path of the photosensitive chip 1021 and is disposed between the optical lens 103 and the photosensitive chip 1021. The filter 1023 is used to filter the incident light entering the photosensitive chip 1021 to remove stray light, such as infrared light, that is not necessary for imaging. It should be understood that the filter 1023 can be directly fixed to the base 10 or fixed to the base 10 via a support frame, and this application does not impose specific limitations on this.

[0120] In some embodiments, as Figure 11 As shown, the photosensitive assembly 102 further includes a plurality of electronic components 1022 electrically connected to the imaging circuit board 21. It should be understood that the plurality of electronic components 1022 include but are not limited to passive electronic devices such as resistors and capacitors and / or driver chips, memory chips, etc., and this application does not impose specific limitations on this.

[0121] In some embodiments, as Figure 10-12 As shown, the camera module 2 also includes a shell 90, which is suitable for covering the outside of the base 10 so that the driving circuit board 22 can be maintained between the shell 90 and the base 10; an avoidance area 91 is opened on the lower edge of the shell 90, and the opening of the avoidance area 91 faces the imaging circuit board 21, so that the avoidance area 91 can avoid the driving circuit board 22.

[0122] It should be understood that when the driving circuit board 22 bends from the imaging circuit board 21 toward the base 10 so that the mounting portion 221 of the driving circuit board 22 is arranged opposite to the side wall of the base 10, the bent portion 222 may be bent and protrude toward the housing 90. In this embodiment, by providing an avoidance area 91 at the lower edge of the housing 90, it is helpful to avoid the bent portion 222 from abutting against the housing 90, to avoid the bent portion 222 lifting the housing 90, and to reduce the pulling force of the bent portion 222 on the mounting portion 221.

[0123] It is worth mentioning that Figure 12As shown, a gap 93 is provided between the housing 90 and the base 10. The gap 93 is capable of accommodating the mounting portion 221 and the reinforcing plate 40, so that the mounting portion 221 and the reinforcing plate 40 are clamped between the housing 90 and the base 10. In other words, the retaining area 2214 on the mounting portion 221 cooperates with the boss 16 on the base 10, so that the mounting portion 221 is fixed to the side wall of the base 10. After the housing 90 is assembled, the mounting portion 221 and the reinforcing plate 40 are clamped between the housing 90 and the base 10, further securing the mounting portion 221 and the reinforcing plate 40 and preventing the mounting portion 221 from moving relative to the side wall of the base 10. In addition, clamping the mounting portion 221 and the reinforcing plate 40 by the housing 90 and the base 10 helps reduce additional operations such as bonding and fastening, thereby simplifying the installation steps of the camera module 2 and improving the production efficiency of the camera module 2.

[0124] In some embodiments, as Figure 9 As shown, the camera module 2 also includes a stop assembly 101, which is arranged on the focusing carrier 81. At least a part of the stop assembly 101 is arranged relative to the anti-shake carrier 82 along the first direction, so that the anti-shake carrier 82 is maintained between the stop assembly 101 and the focusing member along the first direction, which is beneficial to avoid the anti-shake carrier 82 from being separated from the focusing carrier 81 due to mechanical vibration, external force impact or inertia of moving along the first direction, and to improve the reliability of the anti-shake guide 84 being pressed between the anti-shake carrier 82 and the focusing carrier 81.

[0125] In some embodiments, as Figure 9 As shown, the stopper assembly 101 includes a bracket 1011 and a plurality of buffer members 1012. The bracket 1011 is mounted on the focus carrier 81. At least a portion of the bracket 1011 is located on the top surface of the focus carrier 81 and bends and extends in a plane perpendicular to a first direction to retain the anti-shake carrier 82 between the bracket 1011 and the focus carrier 81. The plurality of buffer members 1012 are arranged at intervals on the bracket 1011. At least a portion of the buffer members 1012 protrudes from the bracket 1011 toward the anti-shake carrier 82 along the first direction to be located between the bracket 1011 and the anti-shake carrier 82. This helps to prevent hard collisions between the anti-shake carrier 82 and the bracket 1011, thereby protecting the anti-shake carrier 82, reducing the risk of damage to the anti-shake carrier 82, and reducing noise generated by collisions. At least another portion of the buffer member 1012 protrudes from the bracket 1011 toward the housing 90 along the first direction so as to be located between the bracket 1011 and the housing 90, which helps to avoid a hard collision between the focusing carrier 81 and the housing 90, thereby protecting the focusing carrier 81 and the housing 90, reducing the risk of damage to the focusing carrier 81, and reducing the noise generated by the collision, which helps to extend the service life of the camera module 2.

[0126] An assembly method for assembling any of the above camera modules 2 comprises the following steps:

[0127] S1. Provide an imaging drive device 1, a photosensitive component 102, and a movable component 80, install the photosensitive component 102 on the imaging circuit board 21 of the imaging drive device 1, and install the movable component 80 on the base 10 of the imaging drive device 1;

[0128] S2. Provide an optical lens 103 and install the optical lens 103 on the movable assembly 80 , wherein the external coil semi-finished fixture and the photosensitive assembly 102 are energized to assist in calibrating and installing the optical lens 103 ;

[0129] S3, providing a driving coil 50 and a sensing device 60, fixing the driving coil 50 and the sensing device 60 to the driving circuit board 22 of the imaging driving device 1 and conducting the driving coil 50 and the sensing device 60;

[0130] S4. Bend the driving circuit board 22 so that the driving circuit board 22 and the side wall of the base 10 are arranged relative to each other along the second direction and / or relative to each other along the third direction, and are located on the periphery of the base 10; provide a shell 90, and cover the shell 90 on the periphery of the driving circuit board 22.

[0131] It should be understood that in step S1, the photosensitive component 102 includes at least one of the photosensitive chip 1021, the electronic component 1022, and the filter 1023. That is, the photosensitive component 102 and other components located below the movable component 80 in the camera module are first installed on the imaging circuit board 21 or the base 10, and then the movable component 80 is installed. It should be understood that completing the installation of the photosensitive component 102 in step S1 is conducive to the installation of the optical lens 103 through imaging-assisted calibration of the photosensitive chip 1021 in step S2, thereby improving the assembly efficiency of the camera module 2 and improving the yield rate of the camera module 2.

[0132] Furthermore, in step S2, the semi-finished coil jig is energized so that the coil on the semi-finished coil jig and the driving magnet 70 on the movable component 80 interact with each other to drive the movable component 80 to move relative to the base 10; and the photosensitive component 102 is energized so that the imaging quality of the photosensitive chip 1021 can be intuitively reflected to assist in calibrating the installation position of the optical lens 103, thereby helping to improve the yield of the camera module 2. After completing the optical lens 103 in step S2, step S3 is performed, i.e., installing the driving coil 50 and the sensing device 60, which helps to avoid damage to the functional components with electrical properties of the camera module 2, such as the driving coil 50 and the sensing device 60, during the assembly process, so as to reduce losses and reduce the cost of producing the camera module 2.

[0133] Furthermore, in step S3, when the driving coil 50 and the sensing device 60 are installed on the driving circuit board 22, the driving circuit board 22 is suitable for being arranged coplanar with the imaging circuit board 21, thereby facilitating the installation and conduction operation of the driving coil 50 and helping to improve the assembly accuracy of the driving coil 50.

[0134] In some embodiments, step S1 includes step S11, providing a module circuit board 20, a photosensitive chip 1021, and an electronic component 1022, and fixing and electrically connecting the photosensitive chip 1021 and the electronic component 1022 to the imaging circuit board 21 of the module circuit board 20. Step S12, injection molding the module circuit board 20 to form the base 10. Step S13, providing a movable component 80, and mounting the movable component 80 on the base 10.

[0135] It should be understood that when molding the base 10, the driving circuit board 22 is suitable for being arranged on the same plane as the imaging circuit board 21; or the driving circuit board 22 is suitable for being located on different surfaces of the imaging circuit board 21 as the injection mold, thereby helping to reduce the interference of the driving circuit board 22 on the injection molding.

[0136] It is worth mentioning that, depending on the specific production conditions of the camera module 2, the execution order of step S2 and step S3 can also be interchanged, and this application does not impose any specific restrictions on this.

[0137] The above describes the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the foregoing embodiments. The foregoing embodiments and description merely illustrate the principles of the present invention. Various changes and modifications may be made to the present invention without departing from the spirit and scope of the present invention. Such changes and modifications are intended to fall within the scope of the present invention. The scope of protection claimed by the present invention is defined by the appended claims and their equivalents.

Claims

1. An imaging driving device, characterized in that: include: A module circuit board, comprising an imaging circuit board and a driving circuit board, wherein the imaging circuit board is electrically connected to the photosensitive chip, and the driving circuit board flexibly extends from the outside of the imaging circuit board so that the driving circuit board can be bent and electrically connected to the imaging circuit board; a base, the base being formed on the imaging circuit board and extending from the imaging circuit board toward the light incident side along a first direction; A movable component, the movable component being movably disposed on a base of the imaging drive device, and the movable component being used to carry an optical lens; a driving coil, the driving coil being electrically connected to the driving circuit board and configured to drive the optical lens to move relative to the base; The driving circuit board is adapted to bend from the outside of the imaging circuit board toward the base, such that the driving circuit board and the side wall of the base are arranged opposite to each other in the second direction and / or opposite to each other in the third direction, and are located on the outer periphery of the base; when the driving circuit board is bent to be arranged on a different plane from the imaging circuit board, the driving coil is located on the surface of the driving circuit board facing the base; The driving coil includes a focus coil, a first anti-shake coil, and a second anti-shake coil, wherein the focus coil is used to drive the movable component to move in a first direction relative to the base, the first anti-shake coil is used to drive the movable component to move in a second direction relative to the base, and the second anti-shake coil is used to drive the movable component to move in a third direction relative to the base; The first direction is parallel to the height direction of the imaging drive device, the second direction is parallel to the length direction of the imaging drive device, and the third direction is parallel to the width direction of the imaging drive device. The first direction, the second direction and the third direction are orthogonal to each other.

2. The imaging driving device according to claim 1, wherein: The driving circuit board includes a mounting portion and a bending portion, wherein the bending portion flexibly and conductively connects the mounting portion and the imaging circuit board, and the bending portion is suitable for bending from the outside of the imaging circuit board toward the base so that the mounting portion and the side wall of the base are arranged relative to each other along the second direction and / or relative to each other along the third direction.

3. The imaging driving device according to claim 2, wherein: The width of the bent portion is smaller than the length of the edge of the mounting portion to which it is connected, the width of the bent portion is smaller than the length of the edge of the imaging circuit board to which it is connected, the bent portion is connected to the middle section of the edge of the mounting portion, and is connected to the middle section of the edge of the imaging circuit board.

4. The imaging driving device according to claim 3, wherein: A groove is provided on the edge of the imaging circuit board, with the opening of the groove facing the outside of the imaging circuit board. The bent portion is connected to the bottom of the groove. When the driving circuit board and the imaging circuit board are placed on the same plane, at least a portion of the bent portion is accommodated in the groove. When the driving circuit board and the imaging circuit board are arranged on different planes, the projection of the bent portion along the first direction falls into the projection of the groove along the first direction.

5. The imaging driving device according to claim 2, wherein: The mounting portion includes a first plate, a second plate, and a third plate. When the driving circuit board is bent to be arranged in an eccentric manner with the imaging circuit board, the surfaces of the first plate, the second plate, and the third plate are all parallel to the first direction, wherein the first plate and the third plate are arranged opposite to each other along the third direction, and the second plate is located between the first plate and the third plate, so that the first plate, the second plate, and the third plate surround the outer periphery of the base.

6. The imaging driving device according to claim 5, wherein: The imaging circuit board includes a first side, a second side, a third side and a fourth side arranged in sequence in a counterclockwise direction, and the bending portion includes a first soft board, a second soft board and a third soft board, wherein the first soft board can be flexibly bent to connect and conduct the first side and the first board body, the second soft board can be flexibly bent to connect and conduct the second side and the second board body, and the third soft board can be flexibly bent to connect and conduct the third side and the third board body, so that the first board body, the second board body and the third board body are suitable for bending from the outside of the imaging circuit board toward the base.

7. The imaging driving device according to any one of claims 2 to 6, characterized in that: The mounting portion defines a limited area, and the base has a boss extending from the side wall of the base toward the mounting portion. When the mounting portion and the side wall of the base are arranged relative to each other along the second direction and / or relative to each other along the third direction, the boss extends into the limited area, so that the mounting portion is fixed to the base.

8. The imaging driving device according to any one of claims 1 to 6, characterized in that: A through slot is formed on the base in an area corresponding to the driving coil. When the driving circuit board is bent to be arranged at an eccentric surface with the imaging circuit board, the driving coil can be accommodated in the through slot.

9. The imaging driving device according to any one of claims 2 to 6, characterized in that: The imaging driving device further includes a reinforcing plate, which is provided on a surface of the mounting portion facing away from the driving coil to support the mounting portion.

10. The imaging driving device according to claim 5, wherein: The focusing coil is disposed on the first plate, the first anti-shake coil is disposed on the second plate, and the second anti-shake coil is disposed on the third plate.

11. The imaging driving device according to any one of claims 1 to 6, characterized in that: The imaging drive device further includes a connecting component extending from the outside of the imaging circuit board so as to be electrically connected to the imaging circuit board. The connecting component and the driving circuit board are located on opposite sides of the imaging circuit board.

12. The imaging driving device according to any one of claims 1 to 6, characterized in that: The imaging drive device also includes a sensing device, which is used to sense the position of the optical lens. The sensing device is electrically connected to the driving circuit board. When the driving circuit board is bent to be arranged on a different plane from the imaging circuit board, the sensing device is located on the surface of the driving circuit board facing the base.

13. A camera module, characterized in that: include: The imaging driving device according to any one of claims 1 to 12; A photosensitive component, the photosensitive component including a photosensitive chip, the photosensitive chip being electrically connected to an imaging circuit board of the imaging drive device for imaging; A movable component, wherein the movable component is movably disposed on a base of the imaging drive device; The optical lens is carried by the movable component and can be movably maintained on the light-sensitive path of the photosensitive component.

14. The camera module according to claim 13, wherein: The camera module also includes a shell, which is suitable for covering the outside of the base so that the driving circuit board of the imaging driving device can be maintained between the shell and the base; an avoidance area is provided on the lower edge of the shell, and the opening of the avoidance area faces the imaging circuit board of the imaging driving device to avoid the driving circuit board.

15. The camera module according to claim 13, wherein: The camera module also includes a driving magnet, which is arranged on the movable component. The driving magnet and the driving coil of the imaging driving device are arranged relative to each other along the second direction and / or along the third direction, so as to drive the movable component to move relative to the base.

16. The camera module according to claim 15, wherein: The driving magnet includes a focusing magnet, a first anti-shake magnet and a second anti-shake magnet, wherein the focusing magnet and the focusing coil of the imaging driving device are arranged relative to each other along a third direction, so as to drive the movable component to move relative to the base along the first direction, the first anti-shake magnet and the first anti-shake coil of the imaging driving device are arranged relative to each other along the second direction, so as to drive the movable component to move relative to the base along the second direction, and the second anti-shake magnet and the second anti-shake coil of the imaging driving device are arranged relative to each other along the third direction, so as to drive the movable component to move relative to the base along the third direction.

17. An assembly method for assembling the camera module according to any one of claims 13 to 16, characterized in that: Including steps: S1. Provide an imaging drive device, a photosensitive component, and a movable component, install the photosensitive component on an imaging circuit board of the imaging drive device, and install the movable component on a base of the imaging drive device; S2. Providing an optical lens, and installing the optical lens on the movable component, wherein power is supplied through an external coil semi-finished fixture and the photosensitive component to assist in calibrating and installing the optical lens; S3. Provide a driving coil and a sensing device, and fix the driving coil and the sensing device to a driving circuit board of the imaging driving device respectively and conduct them; S4. Bend the driving circuit board so that the driving circuit board and the side wall of the base are arranged relative to each other along the second direction and / or relative to each other along the third direction, and are located at the periphery of the base; provide a shell, and cover the periphery of the driving circuit board with the shell.

Images