Printed circuit board chemical nickel-metal processing equipment

Abstract

The invention discloses a printed circuit board chemical nickel-metal processing device, and relates to the technical field of integrated circuit manufacturing, the printed circuit board chemical nickel-metal processing device comprises a base station, a gold plating cabinet assembly and a grasping assembly, the outer side of the top of the base station is provided with the gold plating cabinet assembly, and the two sides of the outer part of the gold plating cabinet assembly are provided with displacement assemblies. The cover plate can extrude a pressing head in the process of being attached to the cabinet body, after the pressing head is extruded, a second reset spring can be compressed for displacement, and in the downward displacement process of the pressing head, a first bevel gear can be driven to rotate through a connecting rod, the first bevel gear is meshed with a second bevel gear, and the pressing head is driven to rotate. The second bevel gear can drive the rotating shaft and the flow mixing plate to rotate in the cabinet body, the flow mixing plate can effectively mix the gold leaching solution in the cabinet body in the rotating process, the situation that the densities of the upper layer and the lower layer of the gold leaching solution are different can be reduced, the pressing head is extruded synchronously along with lifting of the cover plate, and therefore the pressing head can be conveniently pressed. Therefore, the equipment can realize the up-down positioning of the printed circuit board and the mixing of the gold leaching solution at the same time.

Description

Technical Field

[0001] The invention relates to the technical field of integrated circuit manufacturing, in particular to chemical nickel-gold processing equipment for printed circuit boards. Background Art

[0002] Chemical nickel gold is a process widely used in the surface treatment of printed circuit boards. Chemical nickel gold is a double-layer metal surface treatment process. First, a layer of chemical nickel is deposited on the copper surface, and then a thin immersion gold layer is deposited on the nickel layer. The printed circuit board after chemical nickel gold has excellent flatness and uniformity, good weldability and conductivity, high oxidation resistance and corrosion resistance, suitable for fine pitch and high-density printed circuit boards, and can be reflowed multiple times. This makes the chemical nickel gold process occupy an important position in the manufacture of high-end printed circuit boards due to its excellent performance and reliability.

[0003] It is usually difficult to accurately control the thickness of the gold-plated layer during the gold-plating process of the printed circuit board in the nickel-gold treatment, because the immersion gold solution used for gold plating is usually reused, and the gold content inside the reused immersion gold solution will change, which leads to a low accuracy of using time to control the thickness of the gold-plated layer. In addition, the immersion gold solution is prone to different densities in the upper and lower layers during use, which will cause uneven gold plating thickness of the printed circuit board.

[0004] Therefore, in view of this, the existing structure and defects are studied and improved, and a printed circuit board chemical nickel gold processing equipment is proposed. Summary of the invention

[0005] The object of the present invention is to provide a printed circuit board chemical nickel-gold processing equipment to solve the problems raised in the above background technology.

[0006] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a printed circuit board chemical nickel-gold processing equipment, comprising a base, a gold-plating cabinet assembly and a gripping assembly, wherein a gold-plating cabinet assembly is arranged on the outer side of the top of the base, and displacement assemblies are arranged on both sides of the outside of the gold-plating cabinet assembly, and the displacement assembly comprises a servo motor, a screw rod, a screw rod slider, a lifting platform, a top seat, an electromagnet, a connecting seat, a stretching seat, a first tension spring, a cover plate and an armature plate, the output end of the servo motor is connected to a screw rod, and a screw rod slider is arranged on the outer end of the screw rod, a lifting platform is arranged on the outer end of the screw rod slider, and a top seat is arranged on the top of the lifting platform, an electromagnet is arranged on the bottom end of the top seat, and connecting seats are arranged at both ends of the bottom of the top seat, a stretching seat is arranged on the inner side of the bottom of the connecting seat, a first tension spring is arranged between the connecting seat and the stretching seat, and the stretching seat A cover plate is arranged at the bottom end, and an armature plate is arranged on the outer side of the top of the cover plate, the electromagnet is electromagnetically attracted to the armature plate, and the armature plate is fixed to the cover plate, a gripping assembly is arranged at the bottom end of the displacement assembly, the gripping assembly includes a fixed base, an extension seat, a second tension spring, a second tension sensor, an electric control panel, a clamping anode and cathode plate, and a power line, an extension seat is sleeved on the inner side of the fixed base, and a second tension spring is arranged between the fixed base and the extension seat, a second tension sensor is arranged between the fixed base and the extension seat, an electric control panel is arranged at the bottom end of the extension seat, and clamping anode and cathode plates are arranged on both sides of the bottom of the electric control panel, a power line is arranged between the clamping anode and cathode plates and the electric control panel, a printed circuit board is clamped on the inner side of the clamping anode and cathode plates, a reflux assembly is arranged at the outer end of the gold-plated cabinet assembly, and a mixed flow assembly is arranged inside the gold-plated cabinet assembly.

[0007] Furthermore, the gold-plated cabinet assembly includes a cabinet body, a gravity block, a first return spring and a first tension sensor. The gravity block is arranged at the inner bottom end of the cabinet body, and the first return spring is arranged between the gravity block and the cabinet body. The first tension sensor is arranged between the gravity block and the cabinet body.

[0008] Furthermore, the gravity block is elastically connected to the first return spring through the cabinet, and the first tension sensor is located at the vertical center line of the gravity block.

[0009] Furthermore, the reflux assembly includes a first reflux box, a first electrically controlled one-way inlet pipe, a second electrically controlled one-way inlet pipe, a second reflux box and an electrically controlled one-way outlet pipe, the outer end of the first reflux box is connected to the first electrically controlled one-way inlet pipe, and the bottom end of the first reflux box is provided with the second electrically controlled one-way inlet pipe, and the end of the second electrically controlled one-way inlet pipe is connected to the second reflux box, and the outer end of the second reflux box is connected to the electrically controlled one-way outlet pipe.

[0010] Furthermore, the first reflux box is connected to the cabinet through a first electrically controlled one-way inlet pipe, and the cabinet is connected to the second reflux box through an electrically controlled one-way outlet pipe.

[0011] Furthermore, the mixing flow assembly includes a pressing head, a second return spring, a connecting rod, a first bevel gear, a second bevel gear, a rotating shaft and a mixing flow plate, the second return springs are arranged on both sides of the bottom of the pressing head, and the pressing head is connected to the first bevel gear through the connecting rod, and the second bevel gear is arranged at the outer end of the first bevel gear, and the bottom end of the second bevel gear is connected to the rotating shaft, and the outer end of the rotating shaft is provided with a mixing flow plate

[0012] Furthermore, the pressing head is elastically connected to the second return spring, and the pressing head is fitted to the cover plate, the first bevel gear is meshed with the second bevel gear, and the second bevel gear drives the mixing plate to rotate through the rotating shaft.

[0013] The present invention provides a printed circuit board chemical nickel-gold processing device, which has the following beneficial effects:

[0014] 1. After the printed circuit board of the present invention is electroplated, the gold plating layer will adhere to the surface of the printed circuit board, which increases the overall weight of the printed circuit board. After the weight of the printed circuit board increases, gravity will be transmitted to the extension seat through the electric control console, which increases the gravity on the extension seat. After the gravity on the extension seat increases, gravity will pull the second tension spring to extend, which enables the extension seat to move downward inside the fixed base. After the extension seat moves inside the fixed base, the sensing value of the second tension sensor can change. Through this design, the staff only needs to observe the sensing value of the second tension sensor to accurately control the weight (thickness) of the gold plating layer on the surface of the printed circuit board, which can avoid the tediousness of frequently checking the thickness of the gold plating layer on the surface of the printed circuit board and the disadvantage that the gold amount decreases after long-term use of the gold immersion solution, resulting in different gold plating times, and it is difficult to use the length of time to judge the gold plating thickness. This can effectively improve the convenience of nickel-gold processing of equipment.

[0015] 2. During the gold plating process of the printed circuit board of the present invention, the electromagnet is energized, so that the electromagnet can adsorb the armature plate at the top of the cover plate. During the adsorption of the electromagnet and the armature plate, the stretching seat will squeeze the first tension spring to move upward inside the connecting seat. At this time, the printed circuit board will move upward synchronously inside the cabinet. After the electromagnet loses power, the cover plate will move downward due to the elastic reset of the first tension spring, and the printed circuit board will move downward synchronously inside the cabinet. Through this design, the printed circuit board can be conveniently displaced up and down at high frequency inside the cabinet. Because the gold immersion solution is very likely to have different densities in the upper and lower layers during use, through this design, the uneven electroplating thickness of the printed circuit board caused by the different densities of the upper and lower layers of the gold immersion solution can be effectively reduced.

[0016] 3. The cover plate of the present invention will squeeze the pressing head during the process of fitting with the cabinet. After the pressing head is squeezed, the second return spring will be compressed to move. During the downward displacement of the pressing head, the first bevel gear can be driven to rotate through the connecting rod. The first bevel gear is meshed with the second bevel gear, which enables the second bevel gear to drive the rotating shaft and the mixing plate to rotate inside the cabinet. During the rotation of the mixing plate, the gold immersion solution in the cabinet can be effectively mixed, which can reduce the situation where the density of the upper and lower layers of the gold immersion solution is different. In addition, the pressing head is squeezed synchronously with the lifting and lowering of the cover plate, which enables the equipment to simultaneously realize the up and down adjustment of the printed circuit board and the mixing of the gold immersion solution, which further improves the uniformity of gold plating of the printed circuit board. During the rotation of the mixing plate, the first electrically controlled one-way inlet pipe, the second electrically controlled one-way inlet pipe and the electrically controlled one-way outlet pipe will be opened. Because the mixing plate will drive the gold immersion solution to flow inside the cabinet, the gold immersion solution can pass through the electrically controlled one-way outlet pipe After the immersion gold solution flows into the second reflux box, the first reflux box and the second reflux box are both filled with gold leaching solution. After the immersion gold solution flows into the second reflux box, the second reflux box will inject the gold leaching solution inside the first reflux box through the second electrically-controlled one-way inlet pipe. After the immersion gold solution inside the cabinet is reduced, the first reflux box will inject the gold leaching solution inside the cabinet through the first electrically-controlled one-way inlet pipe. The above design allows the immersion gold solution to circulate, so that the gold content of the immersion gold solution inside the cabinet can always be maintained at a high value, which can effectively improve the gold plating time of the equipment. The gravity block can sense the weight of the immersion gold solution in the cabinet. After the gold content of the immersion gold solution decreases and the weight decreases, the first reset spring will push the gravity block to move upward, which enables the first tension sensor to sense the gold content of the immersion gold solution. Through this design, the staff can replace the first reflux box, the second reflux box and the immersion gold solution in the cabinet in a timely manner to ensure the electroplating rate of the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic diagram of the overall three-dimensional structure of a printed circuit board chemical nickel-gold processing equipment of the present invention;

[0018] Figure 2 It is a schematic diagram of the overall structure of a side view of a chemical nickel-gold processing device for printed circuit boards of the present invention;

[0019] Figure 3 This is a schematic diagram of the structure of a gripping component of a printed circuit board chemical nickel-gold processing device of the present invention;

[0020] Figure 4 This is a schematic diagram of the overall cross-sectional structure of a printed circuit board chemical nickel-gold processing equipment of the present invention;

[0021] Figure 5 A printed circuit board chemical nickel-gold processing equipment of the present invention Figure 4 The enlarged structural diagram at A in the middle;

[0022] Figure 6 This is a schematic diagram of the structure of a reflow component of a printed circuit board chemical nickel-gold processing equipment of the present invention;

[0023] Figure 7 This is a schematic diagram of the structure of a mixed flow component of a printed circuit board chemical nickel-gold processing equipment of the present invention;

[0024] Figure 8 This is a schematic diagram of the structure of the first bevel gear and the second bevel gear of a printed circuit board chemical nickel-gold processing equipment of the present invention;

[0025] Fig. 9 The present invention is a schematic diagram of a cabinet structure of a printed circuit board chemical nickel-gold processing equipment viewed from above.

[0026] In the figure: 1, base; 2, gold-plated cabinet assembly; 201, cabinet; 202, gravity block; 203, first return spring; 204, first tension sensor; 3, displacement assembly; 301, servo motor; 302, screw rod; 303, screw rod slider; 304, lifting platform; 305, top seat; 306, electromagnet; 307, connecting seat; 308, stretching seat; 309, first tension spring; 310, cover plate; 311, armature plate; 4, gripping assembly; 401, fixed base; 402, extension seat; 403, second tension sensor Force spring; 404, second tension sensor; 405, electric control console; 406, clamping anode and cathode plates; 407, power wire; 5, printed circuit board; 6, reflux assembly; 601, first reflux box; 602, first electrically controlled one-way inlet pipe; 603, second electrically controlled one-way inlet pipe; 604, second reflux box; 605, electrically controlled one-way outlet pipe; 7, mixed flow assembly; 701, pressing head; 702, second return spring; 703, connecting rod; 704, first bevel gear; 705, second bevel gear; 706, rotating shaft; 707, mixed flow plate. DETAILED DESCRIPTION

[0027] See also Figures 1 to 9The present invention provides a technical solution: a printed circuit board chemical nickel-gold processing equipment, comprising a base 1, a gold-plating cabinet component 2 and a gripping component 4, the top outer side of the base 1 is provided with the gold-plating cabinet component 2, and the outer sides of the gold-plating cabinet component 2 are provided with displacement components 3, the bottom end of the displacement component 3 is provided with the gripping component 4, the gripping component 4 comprises a fixed base 401, an extension seat 402, a second tension spring 403, a second tension sensor 404, an electric control console 405, a clamping anode and cathode plates 406, and a power line 407, the inner side of the fixed base 401 is sleeved with the extension seat 402, A second tension spring 403 is provided between the fixed base 401 and the extension base 402, a second tension sensor 404 is arranged between the fixed base 401 and the extension base 402, an electric control panel 405 is arranged at the bottom end of the extension base 402, and clamping anode and cathode plates 406 are arranged on both sides of the bottom of the electric control panel 405, and a power supply line 407 is arranged between the clamping anode and cathode plates 406 and the electric control panel 405, a printed circuit board 5 is clamped inside the clamping anode and cathode plates 406, a reflux component 6 is arranged at the outer end of the gold-plated cabinet assembly 2, and a mixed flow component 7 is arranged inside the gold-plated cabinet assembly 2.

[0028] See also Figures 1 to 9The gold-plated cabinet component 2 includes a cabinet body 201, a gravity block 202, a first reset spring 203 and a first tension sensor 204. The gravity block 202 is arranged at the inner bottom end of the cabinet body 201, and the first reset spring 203 is arranged between the gravity block 202 and the cabinet body 201. The first tension sensor 204 is arranged between the gravity block 202 and the cabinet body 201. The gravity block 202 is elastically connected to the first reset spring 203 through the cabinet body 201, and the first tension sensor 204 is located at the vertical center line of the gravity block 202. The displacement component 3 includes a servo motor 301, a screw rod 302, a screw rod slider 303, a lifting platform 304, a top seat 305, an electromagnet 306, a connecting seat 307, a stretching seat 308, a first tension spring 309, a cover plate 310 and an armature plate 311, the output end of the servo motor 301 is connected to a screw rod 302, and a screw rod slider 303 is arranged at the outer end of the screw rod 302, a lifting platform 304 is arranged at the outer end of the screw rod slider 303, and a top seat 305 is arranged at the top of the lifting platform 304, an electromagnet 306 is arranged at the bottom end of the top seat 305, and a connecting seat 307 is arranged at both ends of the bottom of the top seat 305, a stretching seat 308 is arranged on the inner side of the bottom of the connecting seat 307, a first tension spring 309 is arranged between the connecting seat 307 and the stretching seat 308, a cover plate 310 is arranged at the bottom end of the stretching seat 308, and an armature plate 311 is arranged on the outer side of the top of the cover plate 310, the electromagnet 306 and the armature plate 311 are electromagnetically adsorbed, and the armature plate 311 is fixed to the cover plate 310, the return assembly 6 includes a first return box 601, a first electrically controlled one-way inlet pipe 602, a second electrically controlled one-way inlet pipe 603, a second return box 604 and an electrically controlled one-way outlet pipe 605, the outer end of the first return box 601 is connected to the first electrically controlled one-way inlet pipe 602, and the bottom end of the first return box 601 is provided with a second electrically controlled one-way inlet pipe 603, and the end of the second electrically controlled one-way inlet pipe 603 is connected to the second return box 604, the outer end of the second return box 604 is connected to the electrically controlled one-way outlet pipe 605, the first return box 601 is connected to the cabinet 201 through the first electrically controlled one-way inlet pipe 602, and the cabinet 201 is connected to the second return box 604 through the electrically controlled one-way outlet pipe 605, the mixed flow assembly 7 includes a press The pressing head 701, the second return spring 702, the connecting rod 703, the first bevel gear 704, the second bevel gear 705, the rotating shaft 706 and the mixing plate 707, the second return spring 702 is arranged on both sides of the bottom of the pressing head 701, and the pressing head 701 is connected with the first bevel gear 704 through the connecting rod 703, and the outer end of the first bevel gear 704 is provided with the second bevel gear 705, and the bottom end of the second bevel gear 705 is connected with the rotating shaft 706, and the outer end of the rotating shaft 706 is provided with the mixing plate 707, the pressing head 701 is elastically connected with the second return spring 702, and the pressing head 701 is fitted with the cover plate 310, the first bevel gear 704 is meshed with the second bevel gear 705, and the second bevel gear 705 drives the mixing plate 707 to rotate through the rotating shaft 706;

[0029] The specific operation is as follows: the staff will place the printed circuit board 5 that has been nickel-plated and cleaned and dried at the bottom of the electric control table 405. The electric control table 405 can enable the clamping anode and cathode plates 406 to clamp and fix the printed circuit board 5. After the printed circuit board 5 is clamped and fixed, the servo motor 301 drives the screw rod 302 to rotate, which can enable the screw rod slider 303 to drive the lifting platform 304 to move downward. The lifting platform 304 is fixed to the top seat 305, and is fixed to the cover plate 310 through the connecting seat 307 and the stretching seat 308. The cover plate 310 is connected to the fixed base 401, which enables the equipment to drive the printed circuit board 5 to move down to the inside of the cabinet 201. The cabinet 201 is filled with a gold immersion solution. After the lifting platform 304 is lowered to the limit position, the cover plate 310 can be moved downward. The plate 310 is fitted with the top of the cabinet 201, and the printed circuit board 5 can be completely immersed in the gold immersion solution. At this time, the electric control console 405 can energize the clamping anode and cathode plates 406 through the power line 407, and the clamping anode and cathode plates 406 are clamped with the printed circuit board 5, so that the printed circuit board 5 can be energized for electroplating. After the printed circuit board 5 is electroplated, the gold plating layer will adhere to the surface of the printed circuit board 5, which will increase the overall weight of the printed circuit board 5. After the weight of the printed circuit board 5 increases, the gravity will be transmitted to the extension seat 402 through the electric control console 405, which will increase the gravity on the extension seat 402. After the gravity on the extension seat 402 is increased, the gravity will pull the second tension spring 403 to extend, which will make the extension seat 40 2 can move downward inside the fixed base 401. After the extension base 402 moves inside the fixed base 401, the sensing value of the second tension sensor 404 can change. Through this design, the staff only needs to observe the sensing value of the second tension sensor 404 to accurately control the weight (thickness) of the gold plating layer on the surface of the printed circuit board 5. This can avoid the tediousness of frequently checking the thickness of the gold plating layer on the surface of the printed circuit board 5 and the disadvantages of different gold plating times due to the decrease of gold content after long-term use of the gold immersion solution, which makes it difficult to judge the gold plating thickness by the length of time. This can effectively improve the convenience of nickel-gold processing of the equipment. During the gold plating process, the printed circuit board 5 is energized by the electromagnet 306, which can make the electromagnet 306 press the top of the cover plate 310. The armature plate 311 is adsorbed, and during the adsorption of the electromagnet 306 and the armature plate 311, the stretching seat 308 squeezes the first tension spring 309 to move upward inside the connecting seat 307. At this time, the printed circuit board 5 will move upward synchronously inside the cabinet 201. After the electromagnet 306 loses power, the cover plate 310 will move downward due to the elastic reset of the first tension spring 309, and the printed circuit board 5 will move downward synchronously inside the cabinet 201. Through this design, the printed circuit board 5 can be conveniently displaced up and down at high frequency inside the cabinet 201. Because the gold immersion solution is very likely to have different densities in the upper and lower layers during use, through this design, the uneven electroplating thickness of the printed circuit board 5 caused by the different densities of the upper and lower layers of the gold immersion solution can be effectively reduced.The cover plate 310 will squeeze the pressing head 701 during the process of fitting with the cabinet 201. After the pressing head 701 is squeezed, the second return spring 702 will be compressed to move. During the downward displacement of the pressing head 701, the first bevel gear 704 can be driven to rotate through the connecting rod 703. The first bevel gear 704 is meshed with the second bevel gear 705, so that the second bevel gear 705 can drive the rotating shaft 706 and the mixing plate 707 to rotate inside the cabinet 201. During the rotation of the mixing plate 707, the gold immersion solution in the cabinet 201 can be effectively mixed, which can reduce the In the case where the density of the upper and lower layers of the low immersion gold solution is different, in addition, the pressing head 701 is squeezed synchronously with the lifting and lowering of the cover plate 310, which enables the device to simultaneously realize the up and down adjustment of the printed circuit board 5 and the mixing of the immersion gold solution, which further improves the uniformity of the gold plating of the printed circuit board 5. During the rotation of the mixing plate 707, the first electrically controlled one-way inlet pipe 602, the second electrically controlled one-way inlet pipe 603 and the electrically controlled one-way outlet pipe 605 will be opened, because the mixing plate 707 will drive the immersion gold solution to flow inside the cabinet 201, which allows the immersion gold solution to pass through the electrically controlled one-way The gold leaching solution flows out through the outlet pipe 605 and enters the second reflux box 604. The first reflux box 601 and the second reflux box 604 are both filled with the gold leaching solution. After the gold leaching solution flows into the second reflux box 604, the second reflux box 604 will inject the gold leaching solution inside into the first reflux box 601 through the second electrically controlled one-way inlet pipe 603. After the gold leaching solution inside the cabinet 201 is reduced, the first reflux box 601 will inject the gold leaching solution inside into the cabinet 201 through the first electrically controlled one-way inlet pipe 602. The above design allows the gold leaching solution to circulate. The gold content of the immersion solution in the cabinet 201 can be kept at a high value at all times, which can effectively increase the gold plating time of the equipment. The gravity block 202 can sense the weight of the immersion solution in the cabinet 201. When the gold content of the immersion solution decreases and the weight decreases, the first reset spring 203 will push the gravity block 202 to move upward, which enables the first tension sensor 204 to sense the gold content of the immersion solution. Through this design, the staff can replace the first reflux box 601, the second reflux box 604 and the immersion solution in the cabinet 201 in a timely manner to ensure the electroplating rate of the equipment.

[0030] In summary, when the printed circuit board chemical nickel-gold processing equipment is used, the staff first places the printed circuit board 5 that has been nickel-plated and cleaned and dried on the bottom of the electric control table 405. The electric control table 405 can clamp the positive and negative plates 406 to clamp and fix the printed circuit board 5. After the printed circuit board 5 is clamped and fixed, the servo motor 301 drives the screw rod 302 to rotate, which can drive the screw rod slider 303 to drive the lifting platform 304 to move downward, and the lifting platform 304 is fixed to the top seat 305, and is connected to the cover through the connecting seat 307 and the stretching seat 308. The plate 310 is fixed, and the cover plate 310 is connected with the fixed base 401, so that the equipment can drive the printed circuit board 5 to move down to the inside of the cabinet 201, and the cabinet 201 is filled with a gold immersion solution. After the lifting platform 304 is lowered to the limit position, the cover plate 310 can be fitted with the top of the cabinet 201, and the printed circuit board 5 can be completely immersed in the gold immersion solution. At this time, the electric control console 405 can energize the clamping anode and cathode plates 406 through the power line 407, and the clamping anode and cathode plates 406 are clamped with the printed circuit board 5, so that the printed circuit board 5 can be energized for electroplating;

[0031] Then, after the printed circuit board 5 is electroplated, the gold plating layer will adhere to the surface of the printed circuit board 5, which increases the overall weight of the printed circuit board 5. After the weight of the printed circuit board 5 increases, the gravity will be transmitted to the extension seat 402 through the electric control console 405, which increases the gravity on the extension seat 402. After the gravity on the extension seat 402 increases, the gravity will pull the second tension spring 403 to extend, which enables the extension seat 402 to move downward inside the fixed base 401. After the extension seat 402 moves inside the fixed base 401, the sensing value of the second tension sensor 404 can change. Through this design, the staff only needs to observe the sensing value of the second tension sensor 404 to accurately control the weight (thickness) of the gold plating layer on the surface of the printed circuit board 5. This can avoid the tediousness of frequently checking the thickness of the gold plating layer on the surface of the printed circuit board 5 and the disadvantage that the gold amount decreases after the long-term use of the gold immersion solution, resulting in different gold plating times, and it is difficult to use the length of time to judge the thickness of the gold plating. This can effectively improve the convenience of nickel-gold processing of the equipment;

[0032] Then, during the gold plating process of the printed circuit board 5, the electromagnet 306 is energized, so that the electromagnet 306 can adsorb the armature plate 311 at the top of the cover plate 310. During the adsorption process of the electromagnet 306 and the armature plate 311, the stretching seat 308 squeezes the first tension spring 309 to move upward inside the connecting seat 307. At this time, the printed circuit board 5 will move upward synchronously inside the cabinet 201. After the electromagnet 306 loses power, the cover plate 310 will move downward due to the elastic reset of the first tension spring 309, and the printed circuit board 5 will move downward synchronously inside the cabinet 201. Through this design, the printed circuit board 5 can be conveniently displaced up and down at high frequency inside the cabinet 201. Because the gold immersion solution is very likely to have different densities in the upper and lower layers during use, through this design, the uneven plating thickness of the printed circuit board 5 caused by the different densities of the upper and lower layers of the gold immersion solution can be effectively reduced.

[0033] Then, the cover plate 310 will squeeze the pressing head 701 during the process of fitting with the cabinet 201. After the pressing head 701 is squeezed, the second return spring 702 will be compressed to move. During the downward displacement of the pressing head 701, the first bevel gear 704 can be driven to rotate through the connecting rod 703. The first bevel gear 704 is meshed with the second bevel gear 705, so that the second bevel gear 705 can drive the rotating shaft 706 and the mixing plate 707 to rotate inside the cabinet 201. During the rotation of the mixing plate 707, the gold immersion solution in the cabinet 201 can be effectively mixed, which can reduce the situation where the density of the upper and lower layers of the gold immersion solution is different. In addition, the pressing head 701 is squeezed synchronously with the lifting and lowering of the cover plate 310, which enables the device to simultaneously realize the up and down adjustment of the printed circuit board 5 and the mixing of the gold immersion solution, which further improves the uniformity of gold plating of the printed circuit board 5.

[0034] Finally, during the rotation of the mixing plate 707, the first electrically controlled one-way inlet pipe 602, the second electrically controlled one-way inlet pipe 603 and the electrically controlled one-way outlet pipe 605 will be opened, because the mixing plate 707 will drive the gold immersion solution to flow inside the cabinet 201, which allows the gold immersion solution to flow out through the electrically controlled one-way outlet pipe 605 and enter the second reflux box 604. The first reflux box 601 and the second reflux box 604 are both filled with gold immersion solution. After the gold immersion solution flows into the second reflux box 604, the second reflux box 604 will inject the gold immersion solution inside it into the first reflux box 601 through the second electrically controlled one-way inlet pipe 603. After the gold immersion solution inside the cabinet 201 is reduced, the first reflux box 601 will The gold immersion solution is injected into the cabinet 201 through the first electrically controlled one-way inlet pipe 602. The above design allows the gold immersion solution to circulate, so that the gold content of the gold immersion solution in the cabinet 201 can always be maintained at a high value, which can effectively improve the gold plating time of the equipment. The gravity block 202 can sense the weight of the gold immersion solution in the cabinet 201. After the gold content of the gold immersion solution decreases and the weight decreases, the first reset spring 203 will push the gravity block 202 to move upward, which enables the first tension sensor 204 to sense the gold content of the gold immersion solution. Through this design, the staff can replace the first reflux box 601, the second reflux box 604 and the gold immersion solution in the cabinet 201 in time to ensure the electroplating rate of the equipment.

[0035] The embodiments of the present invention are given for the purpose of illustration and description, and are not intended to be exhaustive or to limit the invention to the disclosed forms. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiments are selected and described in order to better illustrate the principles and practical applications of the present invention and to enable those of ordinary skill in the art to understand the present invention and thereby design various embodiments with various modifications suitable for specific uses.

Claims

1. A printed circuit board chemical nickel gold processing equipment, characterized in that: The invention comprises a base (1), a gold-plated cabinet component (2) and a gripping component (4); the gold-plated cabinet component (2) is arranged on the outer side of the top of the base (1), and displacement components (3) are arranged on both sides of the outside of the gold-plated cabinet component (2); the displacement component (3) comprises a servo motor (301), a screw rod (302), a screw rod slider (303), a lifting platform (304), a top seat (305), an electromagnet (306), a connecting seat (307), a stretching seat (308), a first tension spring (309), a cover plate (310) and an armature plate (311); the output end of the servo motor (301) is connected to the screw rod (302), and the outer end of the screw rod (302) is arranged with a screw rod slider (303); the outer end of the screw rod slider (303) is arranged with a lifting platform (304), and the top end of the lifting platform (304) is arranged with a top seat ( 305), an electromagnet (306) is arranged at the bottom end of the top seat (305), and connecting seats (307) are arranged at both ends of the bottom of the top seat (305), a stretching seat (308) is arranged on the inner side of the bottom of the connecting seat (307), a first tension spring (309) is arranged between the connecting seat (307) and the stretching seat (308), a cover plate (310) is arranged at the bottom end of the stretching seat (308), and an armature plate (311) is arranged on the outer side of the top of the cover plate (310), the electromagnet (306) and the armature plate (311) are electromagnetically attracted, and the armature plate (311) and the cover plate (310) are fixed, the bottom end of the displacement component (3) is arranged with a gripping component (4), the outer end of the gold-plated cabinet component (2) is arranged with a reflux component (6), and the interior of the gold-plated cabinet component (2) is arranged with a mixed flow component (7).

2. A printed circuit board chemical nickel-gold processing equipment according to claim 1, characterized in that: The gold-plated cabinet assembly (2) comprises a cabinet body (201), a gravity block (202), a first return spring (203) and a first tension sensor (204); the gravity block (202) is arranged at the inner bottom end of the cabinet body (201), the first return spring (203) is arranged between the gravity block (202) and the cabinet body (201), and the first tension sensor (204) is arranged between the gravity block (202) and the cabinet body (201).

3. A printed circuit board chemical nickel gold processing equipment according to claim 2, characterized in that: The gravity block (202) is elastically connected to the first return spring (203) through the cabinet (201), and the first tension sensor (204) is located at the vertical center line of the gravity block (202).

4. A printed circuit board chemical nickel gold processing equipment according to claim 2, characterized in that: The reflux assembly (6) comprises a first reflux box (601), a first electrically controlled one-way inlet pipe (602), a second electrically controlled one-way inlet pipe (603), a second reflux box (604) and an electrically controlled one-way outlet pipe (605), wherein the outer end of the first reflux box (601) is connected to the first electrically controlled one-way inlet pipe (602), and the bottom end of the first reflux box (601) is provided with the second electrically controlled one-way inlet pipe (603), and the end of the second electrically controlled one-way inlet pipe (603) is connected to the second reflux box (604), and the outer end of the second reflux box (604) is connected to the electrically controlled one-way outlet pipe (605).

5. A printed circuit board chemical nickel-gold processing equipment according to claim 4, characterized in that: The first reflux box (601) is connected to the cabinet (201) via a first electrically controlled one-way inlet pipe (602), and the cabinet (201) is connected to the second reflux box (604) via an electrically controlled one-way outlet pipe (605).

6. The chemical nickel-gold processing equipment for printed circuit boards according to claim 1, characterized in that: The mixing flow component (7) comprises a pressing head (701), a second return spring (702), a connecting rod (703), a first bevel tooth (704), a second bevel tooth (705), a rotating shaft (706) and a mixing flow plate (707). The second return springs (702) are arranged on both sides of the bottom of the pressing head (701), and the pressing head (701) is connected to the first bevel tooth (704) through the connecting rod (703). The outer end of the first bevel tooth (704) is provided with a second bevel tooth (705), and the bottom end of the second bevel tooth (705) is connected to the rotating shaft (706), and the outer end of the rotating shaft (706) is provided with a mixing flow plate (707).

7. A printed circuit board chemical nickel-gold processing equipment according to claim 6, characterized in that: The pressing head (701) is elastically connected to the second return spring (702), and the pressing head (701) is in contact with the cover plate (310), the first bevel gear (704) is meshed with the second bevel gear (705), and the second bevel gear (705) drives the mixing plate (707) to rotate via the rotating shaft (706).

8. The chemical nickel-gold processing equipment for printed circuit boards according to claim 7, characterized in that: The gripping assembly (4) comprises a fixed base (401), an extension base (402), a second tension spring (403), a second tension sensor (404), an electric control console (405), a clamping anode and cathode plates (406), and a power line (407). The inner side of the fixed base (401) is sleeved with the extension base (402), and a second tension spring (403) is arranged between the fixed base (401) and the extension base (402). A second tension sensor (404) is arranged between the base (401) and the extension base (402), an electric control panel (405) is arranged at the bottom end of the extension base (402), and clamping anode and cathode plates (406) are arranged on both sides of the bottom of the electric control panel (405), and a power supply line (407) is arranged between the clamping anode and cathode plates (406) and the electric control panel (405), and a printed circuit board (5) is clamped inside the clamping anode and cathode plates (406).

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