Casing of portable electronic device and manufacturing method thereof

Abstract

The invention relates to a casing of a portable electronic device and a manufacturing method thereof, and the manufacturing method comprises the following steps: providing a shell which comprises a joint surface; forming a bonding layer on the bonding surface of the shell, wherein the bonding layer contains a silicon material; providing a functional part, wherein the functional part is made of silica gel; and bonding the functional member to the housing via the bonding layer. Therefore, the machine shell is high in manufacturing speed and can be produced and manufactured in a large scale, and the functional part can be stably fixed on the joint surface of the shell part through the bonding layer.

Description

Technical Field

[0001] The invention relates to a casing of a portable electronic device and a manufacturing method thereof, and in particular to a casing of a portable electronic device in which a functional part is combined with a casing part through a combining layer and a manufacturing method thereof. Background Art

[0002] Conventional portable electronic devices achieve waterproof or dustproof effects by sandwiching a sealing gasket between a housing and a panel, so that the sealing gasket is pressed against the housing and the panel in a contact manner. Since the sealing gasket is not fixed to the housing or the panel, it is easy for the sealing gasket to fall off during the assembly or disassembly of the housing and the panel. In addition, the sealing gasket is also easily affected by incorrect assembly by humans and cannot be in close contact with the housing or the panel, resulting in poor waterproof or dustproof effects.

[0003] In order to achieve the effect of collision prevention, the existing portable electronic devices will put a cushion on an outer peripheral surface of the casing. However, the above-mentioned method of setting is easily affected by the inaccurate assembly of the human body, which may cause the cushion to fall off the casing when the portable electronic device falls, thereby causing damage to the casing. Another method is to cover the casing and four cushions with an outer shell, and then fix the cushions at the four corners of the casing respectively to prevent the cushions from falling off. However, the above-mentioned method increases the cost of using the outer shell and will cause the thickness of the portable electronic device to become thicker. Summary of the invention

[0004] An object of the present invention is to provide a method for manufacturing a casing of a portable electronic device that can overcome at least one disadvantage of the prior art.

[0005] The purpose of the present invention and the problem to be solved by the background technology are achieved by adopting the following technical solutions. According to the manufacturing method of the casing of the portable electronic device proposed by the present invention, the following steps are included:

[0006] Providing a shell member, the shell member comprising at least one engagement surface;

[0007] forming at least one bonding layer on the joint surface of the shell, wherein the bonding layer contains silicon material;

[0008] Providing at least one functional part, wherein the functional part is made of silicone; and

[0009] The functional component is bonded to the shell component via the bonding layer.

[0010] In the manufacturing method of the casing of the portable electronic device of the present invention, the bonding layer comprises silicon or silicon dioxide.

[0011] In the manufacturing method of the casing of the portable electronic device of the present invention, the bonding layer is plated on the bonding surface by physical vapor deposition, chemical vapor deposition or coating.

[0012] The manufacturing method of the casing of the portable electronic device of the present invention further comprises a step after forming the bonding layer, of modifying the surface of the bonding layer so that the surface of the bonding layer is transformed into a modified surface for bonding the functional parts.

[0013] In the manufacturing method of the casing of the portable electronic device of the present invention, in the step of providing the functional component, the functional component is formed on the bonding layer so that the functional component is directly and fixedly bonded to the bonding layer.

[0014] In the manufacturing method of the casing of the portable electronic device of the present invention, the functional part is combined with the combination layer by hot pressing, injection molding or coating.

[0015] In the manufacturing method of the casing of the portable electronic device of the present invention, the joint surface is a bearing surface in a surrounding and closed shape, the bonding layer is in a surrounding and closed shape, and the functional part is a sealing gasket in a surrounding and closed shape.

[0016] In the manufacturing method of the casing of the portable electronic device of the present invention, the joint surface is a peripheral surface in a surrounding and closed shape, the bonding layer is in a surrounding and closed shape, and the functional part is a buffer pad in a surrounding and closed shape.

[0017] The manufacturing method of the casing of a portable electronic device of the present invention comprises four mutually spaced joint surfaces, each of which is an angle surface, and four bonding layers are formed on the joint surfaces respectively. Four functional parts are provided and are respectively bonded to the bonding layers, and each of the functional parts is a buffer pad.

[0018] In the manufacturing method of the casing of the portable electronic device of the present invention, the joint surface is located on the outer peripheral surface of the casing, and the functional part is a buffer pad.

[0019] In the manufacturing method of the casing of the portable electronic device of the present invention, the joint surface is located on the inner peripheral surface of the casing, and the functional part is a sealing gasket.

[0020] Another object of the present invention is to provide a casing for a portable electronic device that can overcome at least one disadvantage of the background art.

[0021] The purpose of the present invention and the background technical problem to be solved are achieved by adopting the following technical scheme. The casing of the portable electronic device proposed in the present invention includes a shell, at least one bonding layer, and at least one functional part. The shell includes at least one bonding surface. The bonding layer is formed on the bonding surface. The bonding layer contains silicon material. The functional part is bonded to the shell via the bonding layer. The functional part is made of silicone.

[0022] In the casing of the portable electronic device of the present invention, the bonding layer comprises silicon or silicon dioxide and is plated on the bonding surface.

[0023] In the housing of the portable electronic device of the present invention, the bonding layer has a modified surface bonded to the functional component.

[0024] In the housing of the portable electronic device of the present invention, the joint surface is a bearing surface in a surrounding and closed shape, the bonding layer is in a surrounding and closed shape, and the functional part is a sealing gasket in a surrounding and closed shape.

[0025] In the housing of the portable electronic device of the present invention, the joint surface is a peripheral surface in a surrounding and closed shape, the bonding layer is in a surrounding and closed shape, and the functional part is a buffer pad in a surrounding and closed shape.

[0026] The casing of the portable electronic device of the present invention comprises four joint surfaces spaced apart from each other, each of which is an angle surface, and the casing comprises four bonding layers respectively formed on the bonding surfaces and four functional parts respectively bonded to the bonding layers, each of which is a buffer pad.

[0027] In the housing of the portable electronic device of the present invention, the joint surface is located on the outer peripheral surface of the housing, and the functional part is a buffer pad.

[0028] In the housing of the portable electronic device of the present invention, the joint surface is located on the inner peripheral surface of the housing component, and the functional component is a sealing gasket.

[0029] The beneficial effects of the present invention are: the manufacturing speed is fast and can be mass-produced. In addition, the functional part can be firmly fixed on the joint surface of the shell part through the bonding layer, so that the functional part will not fall off the shell part. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 is a flow chart of steps of a first embodiment of a method for manufacturing a casing of a portable electronic device of the present invention;

[0031] Figure 2 is a three-dimensional view of a shell member of the first embodiment;

[0032] Figure 3 is a front view of the housing of the first embodiment;

[0033] Figure 4 is along Figure 3 A cross-sectional view taken along the IV-IV line in FIG.

[0034] Figure 5 is a front view of the shell and a bonding layer of the first embodiment, illustrating that the bonding layer is formed on a bearing surface of the shell;

[0035] Figure 6 is along Figure 5 A cross-sectional view taken along the VI-VI line in FIG.

[0036] Figure 7 is similar to Figure 6 A cross-sectional view of the bonding layer, illustrating that one surface of the bonding layer is transformed into a modified surface through surface modification;

[0037] Figure 8 is a front view of the shell and a functional part of the first embodiment, illustrating that the functional part is formed on the modified surface of the bonding layer;

[0038] Fig. 9 is along Figure 8 A cross-sectional view taken along the line IX-IX in FIG.

[0039] Fig.10 is similar to Fig. 9 A cross-sectional view of the embodiment of the present invention illustrates a panel pressing against a functional component;

[0040] Fig.11 is a fragmentary front view of a second embodiment of a method for manufacturing a casing of a portable electronic device of the present invention, illustrating that a bonding layer is formed on an outer peripheral surface of the casing; and

[0041] Fig.12 It is an incomplete front view of a third embodiment of the manufacturing method of the casing of a portable electronic device of the present invention, illustrating that four bonding layers are respectively formed on four corner portions of the casing, and four functional components are respectively bonded to the bonding layers. DETAILED DESCRIPTION

[0042] The present invention is described in detail below with reference to the accompanying drawings and embodiments.

[0043] Before the present invention is described in detail, it should be noted that similar elements are denoted by the same reference numerals in the following description.

[0044] See also Figure 1A first embodiment of a method for manufacturing a casing of a portable electronic device of the present invention comprises the following steps: step S1: providing a casing, step S2: forming a bonding layer on a bonding surface of the casing, step S3: performing surface modification on the bonding layer, and step S4: providing a functional component so that it is bonded to the casing via the bonding layer.

[0045] See also Figure 1 , Figure 2 , Figure 3 and Figure 4 In step S1, a shell 1 is provided. The shell 1 includes a base wall 11, a surrounding wall 12, and a bearing wall 13. The base wall 11 is, for example, in the shape of a long wall. The surrounding wall 12 is formed on the outer periphery of the base wall 11 and has an inner peripheral surface 121, and an outer peripheral surface 122 opposite to the inner peripheral surface 121. The outer peripheral surface 122 is in a surrounding and closed shape and has four angle surface portions 123 spaced apart from each other. In the first embodiment, each angle surface portion 123 is an arc-shaped curved surface as an example, but is not limited to this. Each angle surface portion 123 can also be an L-shaped right-angled surface. The bearing wall 13 extends inwardly from the inner peripheral surface 121 of the surrounding wall 12 and is spaced apart from the base wall 11. The bearing wall 13 is in a surrounding and closed shape and has a bearing surface 131 opposite to the base wall 11. The bearing surface 131 is in a surrounding and closed shape and is connected to the inner peripheral surface 121. In the first embodiment, the bearing surface 131 of the bearing wall 13 is a joint surface, and the joint surface is located on the inner circumferential surface 121 of the shell 1 .

[0046] See also Figure 1 , Figure 5 and Figure 6 In step S2, a bonding layer 2 is formed on the bearing surface 131 of the shell 1. The bonding layer 2 contains a material of a chemical element. The bonding layer 2 has a surface 21 opposite to the bearing surface 131. Since the bearing surface 131 is in a surrounding and closed shape, the bonding layer 2 formed on the bearing surface 131 is also in a surrounding and closed shape. In this first embodiment, the chemical element is silicon (Si) as an example but not limited to this. The bonding layer 2 contains silicon or silicon dioxide (SiO2) and is plated on the bearing surface 131 of the shell 1 by methods such as physical vapor deposition (PVD), chemical vapor deposition (CVD) or coating. The shell 1 is made of a material that can be plated with the chemical element, for example, it can be made of a metal material but not limited to this.

[0047] See also Figure 1 , Figure 6 and Figure 7 In step S3, the surface 21 of the bonding layer 2 is modified to transform the surface 21 into a modified surface 22. The surface 21 of the bonding layer 2 can be modified to transform into the modified surface 22 by, for example, oxygen ion treatment, ultraviolet light or plasma.

[0048] See also Figure 1 , Figure 8 and Fig. 9 In step S4, a functional component 3 is provided, and the functional component 3 is made of a material containing the chemical element. That is, the functional component 3 and the bonding layer 2 are both made of a material containing silicon. The functional component 3 is bonded to the modified surface 22 of the bonding layer 2, so that the functional component 3 is bonded to the shell 1 via the bonding layer 2.

[0049] In the first embodiment, the functional part 3 is made of silicone, for example, but not limited thereto. Specifically, the functional part 3 is made of liquid silicone rubber (LSR). In addition, in the first embodiment, the functional part 3 is formed on the modified surface 22 of the bonding layer 2 so that the functional part 3 is directly and fixedly bonded to the modified surface 22 of the bonding layer 2. The functional part 3 can be formed on the modified surface 22 of the bonding layer 2 by, for example, hot pressing, injection molding or coating and directly bonded to the modified surface 2. When the functional part 3 is bonded to the modified surface 22 of the bonding layer 2, the manufacture of a housing 100 of a portable electronic device is completed. Since the bonding layer 2 is in a surrounding and closed shape, the functional part 3 formed on the bonding layer 2 is also in a surrounding and closed shape. Thereby, the functional part 3 can function as a sealing gasket.

[0050] The bonding layer 2 is formed into a thin film by being plated on the bearing surface 131 of the shell 1 by, for example, physical vapor deposition (PVD), chemical vapor deposition (CVD) or coating, so that the bonding layer 2 can be directly fixedly bonded to the bearing surface 131 to enhance the bonding strength. Since the physical vapor deposition method can plate the bonding layer 2 on each of hundreds of shells 1 at one time, the manufacturing speed is fast, mass production can be achieved and the manufacturing cost can be reduced. In addition, since the bonding layer 2 and the functional part 3 are both made of the material containing the chemical element, the functional part 3 is easily bonded to the bonding layer 2 and can be firmly fixed on the bonding layer 2, so that the functional part 3 can be firmly bonded and fixed to the bearing surface 131 of the shell 1 through the bonding layer 2. Thereby, the shell 1 does not need to be designed with a gripping structure such as a barb or a groove to provide the functional part 3 with a coating, which can reduce the design complexity of the shell 1 structure and the manufacturing cost of the shell 1. Furthermore, by modifying the surface of the bonding layer 2 so that the layer 21 (such as Figure 6 The method of transforming the functional part 3 into a modified surface 22 can further enhance the stability of the functional part 3 combined with the bonding layer 2.

[0051] See also Fig.10When a panel 4 is assembled and fixed to the shell 1 of the housing 100 of the portable electronic device, for example, by engaging a hook and a slot, the panel 4 will be tightly pressed against the functional component 3, so that the functional component 3 plays a sealing role to prevent water or dust from penetrating from the external environment into an internal space defined by the shell 1 and the panel 4. Since the functional component 3 is fixed to the bearing surface 131 by the bonding layer 2 rather than pressed against the bearing surface 131 by contact, the waterproof and dustproof effect of the functional component 3 between the shell 1 and the panel 4 can be effectively improved, and the functional component 3 can be prevented from falling off from the shell 1 during the assembly or disassembly process of the panel 4 and the shell 1.

[0052] It should be noted that the material used to manufacture the bonding layer 2 in the first embodiment is selected based on the material of the functional component 3. In other words, the chemical elements contained in the material of the bonding layer 2 must be the same as the chemical elements contained in the material of the functional component 3, so that the functional component 3 can be smoothly bonded to the bonding layer 2. It can be understood that in other implementations of the first embodiment, the chemical elements contained in the materials of the functional component 3 and the bonding layer 2 can also be chemical elements other than silicon, and are not limited to silicon.

[0053] See also Fig.11 A second embodiment of the method for manufacturing a casing of a portable electronic device of the present invention has the same overall steps as the first embodiment, except for the joint surface of the casing 1 and the function and role of the functional component 3.

[0054] In the second embodiment, the outer peripheral surface 122 of the surrounding wall 12 of the shell 1 is a joint surface, that is, the joint surface is located on the outer peripheral surface 122 of the shell 1. The bonding layer 2 is formed on the outer peripheral surface 122 of the shell 1. Since the outer peripheral surface 122 is in a surrounding and closed shape, the bonding layer 2 formed on the outer peripheral surface 122 and the functional part 3 formed on the bonding layer 2 are also in a surrounding and closed shape. Thereby, the functional part 3 can function as a buffer pad, so that the housing 100 of the portable electronic device can achieve an anti-collision effect. Since the functional part 3 is fixed to the outer peripheral surface 122 of the shell 1 through the bonding layer 2, when the portable electronic device falls, the functional part 3 can be firmly fixed to the shell 1 and will not fall off the shell 1, thereby firmly playing the role of buffer protection to prevent the shell 1 from being damaged.

[0055] See also Fig.12 A third embodiment of the method for manufacturing the casing of a portable electronic device of the present invention has the same overall steps as the second embodiment, except for the joint surface of the casing 1 and the number of the joint surface of the casing 1, the bonding layer 2 and the functional parts 3.

[0056] In the third embodiment, each corner surface 123 of the outer peripheral surface 122 of the shell 1 is a joint surface. Figure 1 In step S4 (as shown), four bonding layers 2 are formed on the corner surface 123 of the outer peripheral surface 122 of the shell 1. Figure 1 As shown in the figure, four functional parts 3 are provided and are respectively combined with the combining layer 2. Since each corner surface part 123 is arc-shaped, the corresponding combining layer 2 formed on each corner surface part 123 and the corresponding functional parts 3 formed on each combining layer 2 are also arc-shaped. Thereby, the functional parts 3 can function as a buffer pad, so that the casing 100 of the portable electronic device can achieve an anti-collision effect. Since each functional part 3 is fixed to the corresponding corner surface part 123 of the shell part 1 through the corresponding combining layer 2, there is no need to additionally cover the shell part 1 and the functional parts 3 through a shell to fix the functional parts 3 on the shell part 1. Thereby, the use cost of the shell can be omitted, and the portable electronic device can be made thinner.

[0057] In the third embodiment, the bonding layer 2 is formed on the corner surface portion 123 and the functional component 3 is bonded to the bonding layer 2 respectively. Compared with the second embodiment, the third embodiment can save the usage of the bonding layer 2 and the functional component 3, thereby reducing the manufacturing cost of the housing 100 of the portable electronic device.

[0058] In summary, the manufacturing method of the housing 100 of the portable electronic device of each embodiment has a high manufacturing speed and can be mass-produced. In addition, the functional component 3 can be firmly fixed on the joint surface of the housing 1 through the bonding layer 2, so that the functional component 3 will not fall off the housing 1, and the purpose of the present invention can be achieved.

Claims

1. A method for manufacturing a housing (100) of a portable electronic device; characterized in that: The manufacturing method comprises the following steps: A shell (1) is provided, wherein the shell (1) comprises at least one joint surface; forming at least one bonding layer (2) on the bonding surface of the shell (1), wherein the bonding layer (2) contains a silicon material; Providing at least one functional part (3), wherein the functional part (3) is made of silicone; and The functional component (3) is bonded to the shell component (1) via the bonding layer (2).

2. The method for manufacturing a casing of a portable electronic device according to claim 1, wherein: The bonding layer includes silicon or silicon dioxide.

3. The method for manufacturing a casing of a portable electronic device according to claim 1, wherein: The bonding layer is deposited on the bonding surface by physical vapor deposition, chemical vapor deposition or coating.

4. The method for manufacturing a casing of a portable electronic device according to claim 1, wherein: The method further comprises a step after forming the bonding layer, of modifying the surface of the bonding layer so that the surface of the bonding layer is transformed into a modified surface for bonding the functional component.

5. The method for manufacturing a casing of a portable electronic device according to claim 1, wherein: In the step of providing the functional component, the functional component is formed on the bonding layer so that the functional component is directly and fixedly bonded to the bonding layer.

6. The method for manufacturing a casing of a portable electronic device according to claim 5, wherein: The functional part is bonded to the bonding layer by hot pressing, injection molding or coating.

7. The method for manufacturing a casing of a portable electronic device according to any one of claims 1 to 6, characterized in that: The joint surface is a bearing surface in a surrounding and closed shape, the bonding layer is in a surrounding and closed shape, and the functional part is a sealing gasket in a surrounding and closed shape.

8. The method for manufacturing a casing of a portable electronic device according to any one of claims 1 to 6, characterized in that: The joint surface is an outer peripheral surface in a surrounding and closed shape, the bonding layer is in a surrounding and closed shape, and the functional part is a buffer pad in a surrounding and closed shape.

9. The method for manufacturing a casing of a portable electronic device according to any one of claims 1 to 6, characterized in that: The shell comprises four joint surfaces spaced apart from each other, each of the joint surfaces is an angle surface, four bonding layers are formed on the joint surfaces respectively, four functional parts are provided and are bonded to the bonding layers respectively, and each of the functional parts is a buffer pad.

10. The method for manufacturing a casing of a portable electronic device according to any one of claims 1 to 6, characterized in that: The joint surface is located on the outer peripheral surface of the shell, and the functional part is a buffer pad.

11. The method for manufacturing a casing of a portable electronic device according to any one of claims 1 to 6, characterized in that: The joint surface is located on the inner circumference of the shell, and the functional part is a sealing gasket.

12. A housing (100) of a portable electronic device, characterized in that: The casing (100) of the portable electronic device comprises a casing (1), at least one bonding layer (2), and at least one functional component (3); the casing (1) comprises at least one bonding surface; the bonding layer (2) is formed on the bonding surface; the bonding layer (2) contains a silicon material; the functional component (3) is bonded to the casing (1) via the bonding layer (2); and the functional component (3) is made of silicone.

13. The housing of the portable electronic device according to claim 12, wherein: The bonding layer comprises silicon or silicon dioxide and is plated on the bonding surface.

14. The housing of the portable electronic device according to claim 12, wherein: The bonding layer has a modified surface bonded to the functional component.

15. The housing of a portable electronic device according to any one of claims 12 to 14, wherein: The joint surface is a bearing surface in a surrounding and closed shape, the bonding layer is in a surrounding and closed shape, and the functional part is a sealing gasket in a surrounding and closed shape.

16. The housing of a portable electronic device according to any one of claims 12 to 14, wherein: The joint surface is an outer peripheral surface in a surrounding and closed shape, the bonding layer is in a surrounding and closed shape, and the functional part is a buffer pad in a surrounding and closed shape.

17. The housing of a portable electronic device according to any one of claims 12 to 14, characterized in that: The shell comprises four joint surfaces spaced apart from each other, each of which is an angled surface, and the housing comprises four bonding layers respectively formed on the joint surfaces and four functional parts respectively bonded to the bonding layers, each of which is a buffer pad.

18. The housing of a portable electronic device according to any one of claims 12 to 14, wherein: The joint surface is located on the outer peripheral surface of the shell, and the functional part is a buffer pad.

19. The housing of a portable electronic device according to any one of claims 12 to 14, wherein: The joint surface is located on the inner circumference of the shell, and the functional part is a sealing gasket.

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