Composite heat dissipation assembly

Abstract

A composite heat dissipation assembly is suitable for being thermally coupled to a heat source and comprises a three-dimensional heat transfer device and a liquid cooling pipe. The three-dimensional heat transfer device comprises a heat conduction shell and a plurality of heat pipes. The heat conduction shell is provided with a first surface and a second surface which are opposite. The heat pipes are inserted into the heat conduction shell and protrude out of the second face. The first surface is thermally coupled to a heat source. The liquid cooling pipe is thermally coupled to the heat conduction shell.

Description

Technical Field

[0001] The invention relates to a composite heat dissipation component, in particular to a composite heat dissipation component of a composite three-dimensional heat transfer device and a liquid cooling pipe. Background Art

[0002] The technical principle of the heat spreader is similar to that of the heat pipe, but there is a difference in the conduction method. The heat pipe is a one-dimensional linear heat conduction, while the heat in the vacuum chamber heat spreader is conducted on a two-dimensional surface, so it is more efficient. Specifically, the heat spreader mainly includes a cavity and a capillary structure. There is a hollow chamber inside the cavity, and the hollow chamber is used to fill a working fluid. The capillary structure is arranged in the hollow chamber. The heated part of the cavity is called the evaporation zone. The part of the cavity that dissipates heat is called the condensation zone. The working fluid absorbs heat in the evaporation zone and vaporizes and rapidly expands to the entire cavity. Heat is released in the condensation zone and condenses into liquid. Then, the liquid working fluid returns to the evaporation zone through the capillary structure to form a cooling cycle.

[0003] Generally speaking, most of the temperature spreaders and heat pipes operate independently, resulting in only planar or linear heat transfer for each temperature spreader or heat pipe, rather than integrated three-dimensional heat transfer, so that the heat dissipation effect has not been fully exerted. At present, some manufacturers have integrated temperature spreaders and heat pipes to produce heat dissipation components that can transfer heat in three dimensions. However, the heat transfer efficiency of the current three-dimensional heat transfer heat dissipation components is still insufficient, so that the heat dissipation efficiency does not meet the needs of users. Therefore, how to further improve the heat dissipation efficiency of the three-dimensional heat transfer heat dissipation components is one of the problems that R&D personnel should solve. Summary of the invention

[0004] The present invention provides a composite heat dissipation component to further improve the heat dissipation efficiency of the heat dissipation component with three-dimensional heat transfer.

[0005] The composite heat dissipation assembly disclosed in one embodiment of the present invention is suitable for thermal coupling to a heat source, and includes a three-dimensional heat transfer device and a liquid cooling pipe. The three-dimensional heat transfer device includes a heat-conducting shell and a plurality of heat pipes. The heat-conducting shell has a first surface and a second surface opposite to each other. The heat pipes are inserted into the heat-conducting shell and protrude from the second surface. The first surface is used for thermal coupling to the heat source. The liquid cooling pipe is thermally coupled to the heat-conducting shell.

[0006] In one embodiment of the present invention, the first surface has a thermal contact surface and a heat dissipation surface, the thermal contact surface and the heat dissipation surface have a step difference, and the thermal contact surface is used to thermally couple to the heat source, and the liquid cooling tube is in thermal contact with the heat dissipation surface.

[0007] In one embodiment of the present invention, the liquid cooling tube is a flat tube.

[0008] In one embodiment of the present invention, the liquid cooling tube includes a flat tube wall and an arc tube wall, the flat tube wall is connected to the arc tube wall and together surrounds a fluid channel, and the flat tube wall of the liquid cooling tube is in thermal contact with the heat dissipation surface.

[0009] In one embodiment of the present invention, the first surface has a thermal contact surface and a heat dissipation surface, the thermal contact surface is used to thermally couple to the heat source, and the thermal contact surface and the heat dissipation surface maintain a step difference, the heat conductive shell has an embedding groove, the embedding groove is located on the heat dissipation surface, and the liquid cooling pipe is embedded in the embedding groove.

[0010] In one embodiment of the present invention, the liquid cooling tube includes a flat tube wall and an arc-shaped tube wall. The flat tube wall is connected to the arc-shaped tube wall and together surrounds a fluid channel. The arc-shaped tube wall of the liquid cooling tube is located in the embedding groove.

[0011] In one embodiment of the present invention, the flat tube wall is flush with the heat dissipation surface.

[0012] In one embodiment of the present invention, the heat-conducting shell includes a first shell portion and a second shell portion, the first shell portion is connected to the second shell portion and together surrounds a chamber, the first surface and the second surface are respectively located at the first shell portion and the second shell portion, the multiple heat pipes are inserted in the second shell portion and communicated with the chamber, and the liquid cooling pipe is thermally coupled to the first shell portion.

[0013] In one embodiment of the present invention, the three-dimensional heat transfer device further includes a plurality of support columns and a capillary structure. The plurality of support columns connect the first shell portion and the second shell portion. The capillary structure is distributed in the chamber.

[0014] In one embodiment of the present invention, the heat-conducting shell includes a first shell portion, a second shell portion and a partition shell portion, the first shell portion and the second shell portion are respectively connected to opposite sides of the partition shell portion, so that the first shell portion and the partition shell portion form a first chamber, and the second shell portion and the partition shell portion form a second chamber, the second chamber is not connected to the first chamber, the first surface and the second surface are respectively located at the first shell portion and the second shell portion, the multiple heat pipes are inserted in the second shell portion and are connected to the second chamber, and the liquid cooling pipe is thermally coupled to the partition shell portion.

[0015] In one embodiment of the present invention, the three-dimensional heat transfer device further includes a plurality of first support columns, a plurality of second support columns, a first capillary structure and a second capillary structure, wherein the plurality of first support columns connect the first shell portion and the partition shell portion, the plurality of second support columns connect the second shell portion and the partition shell portion, the first capillary structure is distributed in the first chamber, and the second capillary structure is distributed in the second chamber.

[0016] In one embodiment of the present invention, the three-dimensional heat transfer device further includes a plurality of heat dissipation fins, and the plurality of heat dissipation fins are thermally coupled to the plurality of heat pipes.

[0017] In one embodiment of the present invention, the liquid cooling tube has a fluid inlet and a fluid outlet, and the fluid inlet and the fluid outlet are respectively used to connect to a water-cooled heat dissipation component to form a cooling cycle.

[0018] According to the composite heat dissipation assembly of the above-mentioned embodiment, since the liquid cooling pipe is thermally coupled to the heat conductive shell of the three-dimensional heat transfer device, the three-dimensional heat transfer device is provided with not only the heat conductive shell and a plurality of heat pipes to dissipate heat from the heat source, but also the liquid cooling pipe can be thermally coupled to the heat conductive shell to further dissipate heat from the heat source, thereby further improving the heat dissipation efficiency.

[0019] The above description of the content of the present invention and the following description of the embodiments are used to demonstrate and explain the principles of the present invention, and to provide a further explanation of the scope of the patent application of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 is a three-dimensional schematic diagram of a composite heat dissipation assembly according to a first embodiment of the present invention;

[0021] Figure 2 for Figure 1 An exploded schematic diagram of a composite heat dissipation component;

[0022] Figure 3 for Figure 1 A cross-sectional schematic diagram of a composite heat dissipation component;

[0023] Figure 4 is an exploded schematic diagram of a composite heat dissipation assembly according to a second embodiment of the present invention;

[0024] Figure 5 for Figure 4 A cross-sectional schematic diagram of a composite heat dissipation component;

[0025] Figure 6 is an exploded schematic diagram of a composite heat dissipation assembly according to a third embodiment of the present invention;

[0026] Figure 7 for Figure 6 A cross-sectional schematic diagram of a composite heat dissipation component;

[0027] Figure 8 is a three-dimensional schematic diagram of a composite heat dissipation assembly according to a fourth embodiment of the present invention;

[0028] Fig. 9 for Figure 8 A cross-sectional schematic diagram of a composite heat dissipation component.

[0029]

Explanation of symbols

[0030] 10,10A,10B: Composite heat dissipation components

[0031] 11,11B: Three-dimensional heat transfer device

[0032] 111,111B: Thermally conductive shell

[0033] 1111: first shell

[0034] 1112: Second shell

[0035] 1113: First side

[0036] 11131: Thermal contact surface

[0037] 11132: Heat dissipation surface

[0038] 1114: Side 2

[0039] 1115: Embedded groove

[0040] 1116:Separation shell

[0041] 112: Heat pipe

[0042] 113: Cooling fins

[0043] 114: Support column

[0044] 115: Capillary structure

[0045] 116: First support

[0046] 117: Second support column

[0047] 118: first capillary structure

[0048] 119: Second capillary structure

[0049] 12,12A,12B: Liquid cooling tube

[0050] 121: Flat tube wall

[0051] 122: Arc tube wall

[0052] 123: Fluid inlet

[0053] 124: Fluid outlet

[0054] C: Fluid channel

[0055] S: Chamber

[0056] S1: First chamber

[0057] S2: Second chamber DETAILED DESCRIPTION

[0058] See also Figures 1 to 3 . Figure 1 FIG. 4 is a three-dimensional schematic diagram of a composite heat dissipation assembly according to a first embodiment of the present invention. Figure 2 for Figure 1 Schematic diagram of the exploded view of the composite heat dissipation component. Figure 3 for Figure 1 A cross-sectional schematic diagram of a composite heat dissipation component.

[0059] The composite heat dissipation component 10 of this embodiment is suitable for thermal coupling to a heat source (not shown). The heat source is, for example, a chip. The so-called thermal coupling refers to thermal contact or connection through other heat-conducting media. The composite heat dissipation component 10 includes a three-dimensional heat transfer device 11 and a liquid cooling pipe 12.

[0060] The three-dimensional heat transfer device 11 includes a heat-conducting shell 111, a plurality of heat pipes 112 and a plurality of heat dissipation fins 113. The heat-conducting shell 111 is made of a heat-conducting metal such as aluminum or copper. The heat-conducting shell 111 includes a first shell portion 1111 and a second shell portion 1112. The first shell portion 1111 is connected to the second shell portion 1112 and together surrounds a chamber S. The chamber S is used to accommodate a cooling fluid (not shown). The heat-conducting shell 111 has a first surface 1113 and a second surface 1114 opposite to each other. The first surface 1113 and the second surface 1114 are respectively located in the first shell portion 1111 and the second shell portion 1112. The first surface 1113 has a thermal contact surface 11131 and a heat dissipation surface 11132. The thermal contact surface 11131 and the heat dissipation surface 11132 maintain a step difference, and the thermal contact surface 11131 is used to be thermally coupled to a heat source.

[0061] The liquid cooling tube 12 includes a flat tube wall 121 and an arc-shaped tube wall 122. In other words, the liquid cooling tube 12 is a semi-flat tube. The flat tube wall 121 of the liquid cooling tube 12 is, for example, in thermal contact with the heat dissipation surface 11132 located on the first shell 1111, and the flat tube wall 121 is connected to the arc-shaped tube wall 122 and together surrounds a fluid channel C. The liquid cooling tube 12 has a fluid inlet 123 and a fluid outlet 124. The fluid inlet 123 and the fluid outlet 124 are connected to the fluid channel C. The fluid inlet 123 and the fluid outlet 124 are respectively used to connect a water-cooled heat dissipation component (not shown) to form a cooling cycle to further dissipate the heat of the cooling fluid that absorbs the heat from the heat source. Among them, the water-cooled heat dissipation component, for example, only includes a water-cooling row or includes a water-cooling row and a pump connected in series.

[0062] The heat pipes 112 are, for example, flat tubes and are inserted into the second shell 1112. The heat pipes 112 protrude from the second surface 1114 and are in communication with the chamber S. The cooling fluid absorbs heat from the heat source through the thermal contact surface 11131 and evaporates, and flows to the heat pipes 112. The heat dissipation fins 113 are thermally coupled to the heat pipes 112 to dissipate heat from the cooling fluid flowing to the heat pipes 112.

[0063] Compared to a common three-dimensional heat transfer device or a single heat dissipation device of a common water cooling radiator, the composite heat dissipation assembly 10 of the present embodiment is thermally coupled to the heat-conducting shell 111 of the three-dimensional heat transfer device 11 through the liquid cooling pipe 12, so that the three-dimensional heat transfer device 11 is provided with not only the heat-conducting shell 111 and a plurality of heat pipes 112 to dissipate heat from the heat source, but also the liquid cooling pipe 12 of the external water-cooled heat dissipation assembly is thermally coupled to the heat-conducting shell 111 to further dissipate heat from the heat source. In other words, the composite heat dissipation assembly 10 of the present embodiment dissipates heat from the heat source through the composite three-dimensional heat transfer device 11 and the liquid cooling pipe 12 of the external water-cooled heat dissipation assembly, so that the heat dissipation efficiency can be further improved.

[0064] In this embodiment, the three-dimensional heat transfer device 11 may further include a plurality of support columns 114 and a capillary structure 115. The support columns 114 connect the first shell 1111 and the second shell 1112. In this way, the support columns 114 can support the first shell 1111 and the second shell 1112 to prevent the three-dimensional heat transfer device 11 from expanding or deforming after being heated. The capillary structure 115 is, for example, a powder sintered body and is distributed in the chamber S so that the cooling fluid can absorb the heat of the heat source and evaporate and then flow back through the capillary structure 115.

[0065] In this embodiment, the liquid cooling tube 12 is in thermal contact with the heat dissipation surface 11132, but the present invention is not limited thereto. In other embodiments, the liquid cooling tube may also be in thermal contact with other planes of the three-dimensional heat transfer device.

[0066] In this embodiment, the heat pipe 112 of the three-dimensional heat transfer device 11 is a flat pipe, but the present invention is not limited thereto. In other embodiments, the heat pipe of the three-dimensional heat transfer device may also be a semi-flat pipe or a round pipe.

[0067] In this embodiment, the number of heat pipes 112 of the three-dimensional heat transfer device 11 is multiple, but the present invention is not limited thereto. In other embodiments, the number of heat pipes of the three-dimensional heat transfer device may be only one.

[0068] In this embodiment, the liquid cooling tube 12 includes a flat tube wall 121 and an arc-shaped tube wall 122 to form a semi-flat tube, but the present invention is not limited thereto. Figure 4 and Figure 5 . Figure 4 FIG. 4 is a schematic cross-sectional view of a composite heat dissipation assembly according to a second embodiment of the present invention. Figure 5 for Figure 4 A cross-sectional schematic diagram of a composite heat dissipation component.

[0069] The composite heat dissipation assembly 10A of the present embodiment is similar to the composite heat dissipation assembly 10 of the first embodiment, so the differences between the present embodiment and the first embodiment will be described below, and the similarities will not be repeated. The composite heat dissipation assembly 10A of the present embodiment includes a three-dimensional heat transfer device 11 and a liquid cooling pipe 12A. The three-dimensional heat transfer device 11 includes a heat-conducting shell 111, a plurality of heat pipes 112, and a plurality of heat dissipation fins 113. The heat-conducting shell 111 includes a first shell portion 1111 and a second shell portion 1112, and the heat-conducting shell 111 has a first surface 1113 and a second surface 1114 opposite to each other. The first shell portion 1111 is connected to the second shell portion 1112 and together surrounds a chamber S. The chamber S is used to accommodate a cooling fluid.

[0070] The first surface 1113 and the second surface 1114 are respectively located at the first shell 1111 and the second shell 1112. The first surface 1113 has a thermal contact surface 11131 and a heat dissipation surface 11132. The liquid cooling tube 12A is a flat tube, and is, for example, in thermal contact with the heat dissipation surface 11132 located at the first shell 1111. The heat pipes 112 are inserted into the second shell 1112 and protrude from the second surface 1114, and the heat pipes 112 are connected to the chamber S. The cooling fluid absorbs the heat from the heat source through the thermal contact surface 11131 and evaporates, and flows to the heat pipes 112. The heat dissipation fins 113 are thermally coupled to the heat pipes 112 to dissipate the heat of the cooling fluid flowing to the heat pipes 112.

[0071] See also Figure 6 and Figure 7 . Figure 6 Schematic diagram of an exploded view of a composite heat dissipation assembly according to a third embodiment of the present invention. Figure 7 for Figure 6 A cross-sectional schematic diagram of a composite heat dissipation component.

[0072] The composite heat dissipation assembly 10B of this embodiment is similar to the composite heat dissipation assembly 10 of the first embodiment, so the differences between this embodiment and the first embodiment will be described below, and the similarities will not be repeated. The composite heat dissipation assembly 10B of this embodiment includes a three-dimensional heat transfer device 11B and a liquid cooling pipe 12B.

[0073] The three-dimensional heat transfer device 11B includes a heat-conducting shell 111B, a plurality of heat pipes 112, and a plurality of heat dissipation fins 113. The heat-conducting shell 111B includes a first shell portion 1111, a second shell portion 1112, and a partition shell portion 1116. The first shell portion 1111 and the second shell portion 1112 are respectively connected to opposite sides of the partition shell portion 1116, so that the first shell portion 1111 and the partition shell portion 1116 form a first chamber S1, and the second shell portion 1112 and the partition shell portion 1116 form a second chamber S2, and the second chamber S2 is not connected to the first chamber S1. The first chamber S1 and the second chamber S2 are used to contain cooling fluid.

[0074] The heat-conducting shell 111B has a first surface 1113, a second surface 1114 and an embedding groove 1115. The first surface 1113 and the second surface 1114 are opposite to each other and are respectively located in the first shell portion 1111 and the second shell portion 1112. The first surface 1113 has a thermal contact surface 11131 and a heat dissipation surface 11132. The embedding groove 1115 is located in the partition shell portion 1116. The liquid cooling tube 12B includes a flat tube wall 121 and an arc-shaped tube wall 122. In detail, the liquid cooling tube 12B is formed into a semi-flat tube by stamping, for example. The arc-shaped tube wall 122 of the liquid cooling tube 12B is, for example, thermally coupled with the embedding groove 1115 located in the partition shell portion 1116, and the flat tube wall 121 of the liquid cooling tube 12B is flush with the heat dissipation surface 11132.

[0075] The heat pipes 112 are inserted into the second shell 1112 and communicate with the second chamber S2. The cooling fluid absorbs the heat from the heat source through the thermal contact surface 11131 and evaporates, and flows to the heat pipes 112. The heat dissipation fins 113 are thermally coupled to the heat pipes 112 to dissipate the heat of the cooling fluid flowing to the heat pipes 112.

[0076] In this embodiment, the three-dimensional heat transfer device 11B may further include a plurality of first support columns 116, a plurality of second support columns 117, a first capillary structure 118, and a second capillary structure 119. The first support columns 116 connect the first shell 1111 and the partition shell 1116, and the second support columns 117 connect the second shell 1112 and the partition shell 1116. In this way, the first support columns 116 and the second support columns 117 can support the first shell 1111, the second shell 1112, and the partition shell 1116 to prevent the three-dimensional heat transfer device 11B from expanding or deforming after being heated.

[0077] The first capillary structure 118 and the second capillary structure 119 are, for example, powder sintered bodies and are respectively distributed in the first chamber S1 and the second chamber S2 , so that the cooling fluid can absorb the heat of the heat source and evaporate and then flow back through the first capillary structure 118 and the second capillary structure 119 .

[0078] In the first embodiment, the liquid cooling tube 12 is in thermal contact with the heat dissipation surface 11132 located on the first shell 1111, but the present invention is not limited thereto. Figure 8 and Fig. 9 . Figure 8 FIG. 4 is a perspective schematic diagram of a composite heat dissipation assembly according to a fourth embodiment of the present invention. Fig. 9 for Figure 8 A cross-sectional schematic diagram of a composite heat dissipation component.

[0079] The composite heat dissipation assembly 10C of this embodiment is similar to the composite heat dissipation assembly 10 of the first embodiment, so the differences between this embodiment and the first embodiment will be described below, and the similarities will not be repeated. The composite heat dissipation assembly 10C of this embodiment includes a three-dimensional heat transfer device 11 and a liquid cooling pipe 12C. The three-dimensional heat transfer device 11 includes a heat-conducting shell 111, a plurality of heat pipes 112, and a plurality of heat dissipation fins 113. The heat-conducting shell 111 includes a first shell portion 1111 and a second shell portion 1112. The first shell portion 1111 is connected to the second shell portion 1112 and together surrounds a chamber S. The chamber S is used to accommodate a cooling fluid.

[0080] The heat-conducting shell 111 has a first surface 1113 and a second surface 1114 opposite to each other. The first surface 1113 and the second surface 1114 are respectively located at the first shell portion 1111 and the second shell portion 1112. The first surface 1113 has a thermal contact surface 11131 and a heat dissipation surface 11132. The thermal contact surface 11131 and the heat dissipation surface 11132 maintain a step difference, and the thermal contact surface 11131 is used for thermal coupling to a heat source.

[0081] The heat pipes 112 are inserted into the second shell 1112 and protrude from the second surface 1114, and the heat pipes 112 are connected to the chamber S. The cooling fluid absorbs the heat from the heat source through the thermal contact surface 11131 and evaporates, and flows to the heat pipes 112. The heat dissipation fins 113 are thermally coupled to the heat pipes 112 to dissipate the heat of the cooling fluid flowing to the heat pipes 112. The liquid cooling pipe 12C is a flat pipe, and is, for example, in thermal contact with the second surface 1114 of the second shell 1112. That is, the liquid cooling pipe 12C is located between the second surface 1114 of the second shell 1112 and the heat dissipation fins 113.

[0082] According to the composite heat dissipation assembly of the above-mentioned embodiment, since the liquid cooling pipe is thermally coupled to the heat conductive shell of the three-dimensional heat transfer device, the three-dimensional heat transfer device is provided with not only the heat conductive shell and a plurality of heat pipes to dissipate heat from the heat source, but also the liquid cooling pipe can be thermally coupled to the heat conductive shell to further dissipate heat from the heat source, thereby further improving the heat dissipation efficiency.

[0083] Although the present invention is disclosed as above with the aforementioned embodiments, they are not used to limit the present invention. Anyone familiar with similar skills can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of patent protection of the present invention shall be based on the scope defined by the claims attached to this specification.

Claims

1. A composite heat dissipation component, characterized in that: Suitable for thermal coupling to a heat source, the composite heat dissipation component comprises: A three-dimensional heat transfer device comprises a heat-conducting shell and a plurality of heat pipes, wherein the heat-conducting shell has a first surface and a second surface opposite to each other, the plurality of heat pipes are inserted into the heat-conducting shell and protrude from the second surface, and the first surface is used for thermal coupling to the heat source; as well as A liquid cooling tube is thermally coupled to the heat conductive shell.

2. The composite heat dissipation assembly according to claim 1, characterized in that: The first surface has a thermal contact surface and a heat dissipation surface. The thermal contact surface and the heat dissipation surface have a step difference. The thermal contact surface is used for thermal coupling to the heat source, and the liquid cooling tube is in thermal contact with the heat dissipation surface.

3. The composite heat dissipation assembly according to claim 2, characterized in that: The liquid cooling tube is a flat tube.

4. The composite heat dissipation assembly according to claim 2, characterized in that: The liquid cooling tube comprises a flat tube wall and an arc tube wall. The flat tube wall is connected with the arc tube wall and surrounds a fluid channel together. The flat tube wall of the liquid cooling tube is in thermal contact with the heat dissipation surface.

5. The composite heat dissipation assembly according to claim 1, characterized in that: The first surface has a thermal contact surface and a heat dissipation surface. The thermal contact surface is used for thermal coupling to the heat source, and a step is maintained between the thermal contact surface and the heat dissipation surface. The heat-conducting shell has an embedding groove, which is located on the heat dissipation surface, and the liquid cooling pipe is embedded in the embedding groove.

6. The composite heat dissipation assembly according to claim 5, characterized in that: The liquid cooling tube comprises a flat tube wall and an arc tube wall. The flat tube wall is connected with the arc tube wall and together surrounds a fluid channel. The arc tube wall of the liquid cooling tube is located in the embedding groove.

7. The composite heat dissipation assembly according to claim 6, characterized in that: The flat tube wall is flush with the heat dissipation surface.

8. The composite heat dissipation assembly according to claim 1, characterized in that: The heat-conducting shell includes a first shell portion and a second shell portion, the first shell portion is connected to the second shell portion and together surrounds a chamber, the first surface and the second surface are respectively located on the first shell portion and the second shell portion, the multiple heat pipes are inserted in the second shell portion and communicated with the chamber, and the liquid cooling pipe is thermally coupled to the first shell portion.

9. The composite heat dissipation assembly according to claim 8, characterized in that: The three-dimensional heat transfer device further comprises a plurality of support columns and a capillary structure. The plurality of support columns connect the first shell portion and the second shell portion, and the capillary structure is distributed in the chamber.

10. The composite heat dissipation assembly according to claim 1, characterized in that: The heat-conducting shell includes a first shell portion, a second shell portion and a partition shell portion. The first shell portion and the second shell portion are respectively connected to opposite sides of the partition shell portion so that the first shell portion and the partition shell portion form a first chamber, and the second shell portion and the partition shell portion form a second chamber. The second chamber is not connected to the first chamber. The first surface and the second surface are respectively located at the first shell portion and the second shell portion. The multiple heat pipes are inserted in the second shell portion and are connected to the second chamber. The liquid cooling pipe is thermally coupled to the partition shell portion.

11. The composite heat dissipation assembly according to claim 10, characterized in that: The three-dimensional heat transfer device also includes a plurality of first support columns, a plurality of second support columns, a first capillary structure and a second capillary structure. The plurality of first support columns connect the first shell portion and the partition shell portion, the plurality of second support columns connect the second shell portion and the partition shell portion, the first capillary structure is distributed in the first chamber, and the second capillary structure is distributed in the second chamber.

12. The composite heat dissipation assembly according to claim 1, characterized in that: The three-dimensional heat transfer device also includes a plurality of heat dissipation fins, and the plurality of heat dissipation fins are thermally coupled to the plurality of heat pipes.

13. The composite heat dissipation assembly according to claim 1, characterized in that: The liquid cooling pipe has a fluid inlet and a fluid outlet, and the fluid inlet and the fluid outlet are respectively used to connect a water-cooled heat dissipation component to form a cooling cycle.

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