Air-cooled radiator

Abstract

The invention provides an air-cooled radiator. The air-cooled radiator comprises a radiating substrate; the shell assembly and the heat dissipation substrate are integrally machined and formed, and a sealed air cavity is formed between the shell assembly and the heat dissipation substrate; and the heat dissipation assembly, the heat dissipation substrate and / or the shell assembly are integrally machined and formed, and the heat dissipation assembly is arranged in the sealed air cavity. Under the conditions of not increasing the equipment weight, not increasing the equipment volume, not changing the raw materials of the radiator and not replacing a fan with a higher performance index, the performance of the radiator can be improved, the radiating efficiency is enhanced, and the temperature rise of the equipment is further reduced.

Description

Technical Field

[0001] The invention relates to the technical field of electronic products, and in particular to an air-cooled radiator. Background Art

[0002] With the development of integration and lightweight of electronic equipment, heat dissipation design has become a key factor affecting product reliability. Quickly taking away the heat dissipation generated by the equipment and completing heat exchange with the surrounding environment to reduce the temperature rise of the product has become a key problem to be solved by current electronic equipment. One of the solutions is to add a radiator to the electronic equipment to help quickly complete the heat exchange. The current radiators are mainly divided into two categories: radiators for natural heat dissipation and air-cooled radiators. Among them, radiators used for natural heat dissipation mainly use heat dissipation fins to enhance heat exchange with the air. To increase the heat dissipation, it is necessary to continuously increase the height of the fins and increase the number of fins, which will lead to a sharp increase in weight and volume, which does not meet the needs of product miniaturization and integration.

[0003] The current air-cooled radiator is usually composed of several parts such as heat dissipation substrate, fins, sealing cover, guide plate, sealing strip, mounting screws, etc., and is usually composed of multiple parts spliced ​​and assembled. The fins are all plate structures with a thickness of 0.8mm to 2mm, and the height is determined by the size of the fan. In order to reduce air flow short circuit, the air duct needs to be sealed, so a sealing cover is set and sealed with a sealing strip. According to the principle of keeping the inlet and outlet as far away as possible and the actual installation position, determine whether a guide plate is needed. The guide plate is used at the air inlet, and its main function is to evenly disperse the air flow in the air cavity; the guide plate is used at the air outlet, and its main function is to change the wind direction, so as to flexibly set the outlet position. In order to further improve the heat dissipation capacity, the current main measures are: replace the fan in order to obtain a larger air volume and higher wind pressure; replace the material with a higher thermal conductivity to process the heat sink parts; increase the height of the fins or increase the number to obtain a larger heat exchange area. Replacing the fan will increase the size and power consumption; the current mainstream material is aluminum alloy, and the material with higher thermal conductivity is copper, and the weight increases sharply after replacement; changes in the fins will increase the weight and size. Summary of the invention

[0004] In view of this, the present invention provides an air-cooled radiator to achieve the purpose of reducing temperature rise to the maximum extent.

[0005] The present invention provides the following technical solution: an air-cooled radiator, comprising: a heat dissipation substrate; a shell assembly, which is integrally processed and formed with the heat dissipation substrate, and a sealed air cavity is formed between the shell assembly and the heat dissipation substrate; a heat dissipation component, which is integrally processed and formed with the heat dissipation substrate and / or the shell assembly, and the heat dissipation component is arranged in the sealed air cavity.

[0006] Furthermore, the shell assembly includes: a first side wall and a second side wall, which are symmetrically spaced and perpendicular to the heat dissipation substrate; a top cover plate, which is arranged at the top of the first side wall and the second side wall, and the top cover plate is parallel to the heat dissipation substrate.

[0007] Furthermore, a plurality of air outlets are provided on one side of the top cover plate, and the air outlets are respectively connected to the sealed air cavity and the external space.

[0008] Furthermore, the heat dissipation assembly includes a plurality of fins, which are spaced apart along the extension direction of the sealed air cavity, and a heat dissipation channel is formed between two adjacent fins, and both ends of each heat dissipation channel are respectively connected to the inlet and the outlet of the sealed air cavity.

[0009] Furthermore, the upper side of each fin is integrally formed with the top cover plate, and the lower side of each fin is integrally formed with the heat dissipation substrate.

[0010] Furthermore, both the longitudinal section and the transverse section of the fin are S-shaped.

[0011] Furthermore, the air-cooled radiator also includes a columnar lattice unit, and a plurality of columnar lattice units are arranged in each heat dissipation channel.

[0012] Furthermore, the columnar lattice unit is integrally arranged on the top cover plate and / or the heat dissipation substrate.

[0013] Furthermore, a mounting structure for mounting electronic components is provided on a side of the heat dissipation substrate away from the housing assembly.

[0014] Compared with the prior art, the beneficial effects that can be achieved by at least one of the above-mentioned technical solutions adopted by the present invention include at least the following: the present invention can improve the performance of the radiator, enhance the heat dissipation efficiency, and further reduce the temperature rise of the equipment without increasing the weight of the equipment, increasing the volume of the equipment, changing the raw materials of the radiator, or replacing a fan with higher performance indicators. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0016] Figure 1 is a schematic diagram of a three-dimensional structure of an embodiment of the present invention;

[0017] Figure 2 yes Figure 1 A cross-sectional view of

[0018] Figure 3is a schematic diagram of a top view of the structure of an embodiment of the present invention;

[0019] Figure 4 is a schematic side view of the structure of an embodiment of the present invention;

[0020] Figure 5 is a schematic diagram of the main structure of an embodiment of the present invention;

[0021] Figure 6 yes Figure 4 Middle AA section view;

[0022] Figure 7 yes Figure 3 Middle CC section view;

[0023] Figure 8 It is a schematic diagram of the structure of an embodiment of the present invention when viewed from above.

[0024] The reference numerals in the figure are: 1. first side wall; 2. top cover plate; 3. fin; 4. columnar lattice unit; 5. second side wall; 6. flow guide structure; 7. mounting structure; 8. heat dissipation substrate. DETAILED DESCRIPTION

[0025] The embodiments of the present application are described in detail below with reference to the accompanying drawings.

[0026] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0027] like Figures 1 to 8 As shown, an embodiment of the present invention provides an air-cooled heat sink, comprising a heat dissipation substrate 8, a shell component and a heat dissipation component. The shell component and the heat dissipation substrate 8 are integrally processed and formed, and a sealed air cavity is formed between the shell component and the heat dissipation substrate 8; the heat dissipation component is integrally processed and formed with the heat dissipation substrate 8 and / or the shell component, and the heat dissipation component is arranged in the sealed air cavity.

[0028] The embodiments of the present invention can improve the performance of the radiator, enhance the heat dissipation efficiency, and further reduce the temperature rise of the equipment without increasing the weight of the equipment, increasing the volume of the equipment, changing the raw materials of the radiator, or replacing a fan with a higher performance index.

[0029] The housing assembly includes:

[0030] The first side wall 1 and the second side wall 5 are symmetrically spaced and arranged, and the first side wall 1 and the second side wall 5 are both perpendicular to the heat dissipation substrate 8;

[0031] The top cover plate 2 is disposed at the top ends of the first side wall 1 and the second side wall 5 , and the top cover plate 2 is parallel to the heat dissipation substrate 8 .

[0032] All components of the radiator are processed into an integral part, and there is no splicing structure. Therefore, the sealed air cavity does not have a sealing problem caused by splicing, and there is no airflow short-circuit problem. At the same time, the heat dissipation component is in direct contact with the top cover plate 2, and the heat on the heat dissipation component can also be transferred to the top cover plate 2 through heat conduction, making full use of the outer surface of the top cover plate 2 for heat dissipation. Compared with the conventional radiator in which the top cover plate can only play a sealing role and is not very helpful for heat dissipation, the top cover plate 2 involved in the present invention has a greater role.

[0033] Preferably, a plurality of air outlets are provided on one side of the top cover plate 2, and the air outlets are connected to the sealed air cavity and the external space respectively. The air outlets in the embodiment of the present invention are a certain number of through holes, which are small rectangular holes with rounded corners, or other shapes, serving as the air outlet of the sealed air cavity, and the other end of the sealed air cavity serves as the air inlet.

[0034] The heat dissipation assembly includes a plurality of fins 3, which are arranged at intervals along the extension direction of the sealed air cavity, and a heat dissipation channel is formed between two adjacent fins 3, and the two ends of each heat dissipation channel are respectively connected to the inlet and the outlet of the sealed air cavity. The upper side of each fin 3 is integrally formed with the top cover plate 2, and the lower side of each fin 3 is integrally formed with the heat dissipation substrate 8.

[0035] The calculation formula for convection heat transfer is: Q = hcA△t, where Q is the heat transfer between the radiator and the external environment, hc is the convection heat transfer coefficient, A is the heat dissipation surface area, and △t is the temperature difference between the surface temperature of the electronic component and the air. Therefore, when hc and △t remain unchanged, increasing the heat dissipation surface area A helps to increase the heat transfer, and the increase in heat transfer can directly reduce the temperature rise of the equipment.

[0036] In the embodiment of the present invention, the electronic components that need heat dissipation treatment are further conducted to the fins 3 through the lateral and longitudinal heat conduction of the heat dissipation substrate 8. The fan brings the cold air in the external environment into the sealed air cavity through the air inlet. The cold air flows along the air duct formed by the fins 3 and completes the heat exchange, taking the heat away from the fins 3 and out of the sealed air cavity through the air outlet, thereby achieving the purpose of lowering the temperature of the radiator and lowering the temperature of the components on the electronic equipment.

[0037] Preferably, the longitudinal and transverse cross-sections of the fin 3 are both S-shaped. The "S"-shaped structure in the longitudinal direction can obtain a larger surface area than the plate-type fin at the same height; the "S"-shaped structure in the transverse direction can also make the air duct have a larger equivalent length under the same total length, thereby obtaining a larger fin surface area.

[0038] The heat dissipation component also includes a columnar lattice unit 4, and each heat dissipation channel is provided with a plurality of columnar lattice units 4. The columnar lattice unit structure is filled between the fins 3. Under the premise of not affecting the gas flow characteristics in the air cavity, by providing the columnar lattice unit 4, the space size in the air cavity is more fully utilized to increase the heat exchange surface area, so that the cold air takes away more heat when passing through the air cavity.

[0039] In the embodiment of the present invention, the columnar lattice unit 4 is integrally arranged on the top cover plate 2 and / or the heat dissipation substrate 8. The columnar lattice unit 4 is connected to the adjacent fins 3 to increase the heat conduction performance.

[0040] Furthermore, a guide structure 6 is provided on the side of the sealed air cavity opposite to the air outlet. The guide structure 6 is located at the lower end of the air outlet and has an arc-shaped structure, which can ensure that the airflow will not be subject to excessive wind resistance when flowing through. The guide structure 6 is used to change the direction of the airflow so that the air outlet position can be set as needed.

[0041] Preferably, a mounting structure 7 for mounting electronic components is provided on one side of the heat dissipation substrate 8 away from the housing assembly. The mounting structure 7 may be a protrusion or a groove, and is provided according to the position, size and height of the electronic components that actually require heat dissipation.

[0042] It should be noted that the embodiment of the present invention also performs copper plating on the surface of the air-cooled radiator, using the higher thermal conductivity of copper than aluminum to improve the average thermal conductivity of the radiator, so that heat can be conducted more quickly and efficiently, especially the heat is conducted from the bosses and grooves of the heat dissipation substrate 8 to the rest of the substrate, ensuring that the heat is quickly uniformized. The uniformized heat is conducted to the fins at the corresponding positions through the heat dissipation substrate 8, and then completes heat exchange with the airflow and diffuses out, which can further improve the efficiency of heat conduction.

[0043] The present invention also provides a method for preparing a radiator:

[0044] (1) The radiator is made of aluminum alloy material with high thermal conductivity but low density. The whole radiator is made of 3D printing technology. The fins and top cover plate have a wall thickness of 0.5 mm, the base plate is 1 mm to 1.2 mm, the columnar lattice unit uses a 0.5 mm diameter cylinder, the radius of the arc guide structure is 8 mm to 10 mm, the fin height is 13 mm, the fin spacing is 6 mm to 8 mm, the number of fins is 20, the length is 82 mm, and the lattice unit size is 10 mm.

[0045] (2) After 3D printing is completed, the radiator is cleaned, desanded, burred, and polished according to conventional process requirements. After processing is completed, the surface of the radiator is copper-plated. Pre-treatment and post-treatment are carried out according to conventional process requirements. The thickness of the copper plating is 8μm to 12μm.

[0046] (3) Since the copper plating layer is easily oxidized in the environment, the surface is further subjected to corrosion-resistant nickel plating, and the thickness of the nickel plating layer is 3 μm to 5 μm.

[0047] (4) Complete nickel plating post-processing according to conventional process requirements.

[0048] The size parameters mentioned are the sizes of the heat sink in the example. For technicians in the relevant field, it is completely possible to design heat sinks of different specifications and sizes according to specific methods. At the same time, the heat sink can also be made of different raw materials, especially directly choosing copper for processing, which can achieve better heat dissipation effect.

[0049] The beneficial effects of the present invention include:

[0050] (1) The radiator involved is an integral component without any splicing structure, so the wall thickness at each location can be set smaller, thereby enabling lightweight design to be carried out to the greatest extent possible. The weight of the corresponding radiator in the example is reduced by 40%;

[0051] (2) It can reduce the types and quantity of parts from 4 parts to 1 part, without any assembly relationship, simplifying the structure;

[0052] (3) The integrated structure has no overlap, so there is no contact gap, which can effectively prevent airflow from overflowing from the gap and avoid airflow short circuit, making the utilization efficiency of cold air higher;

[0053] (4) The fins have a spatial streamlined structure, and the effective heat dissipation area is increased by 30% to 40% compared with plate fins, which can greatly increase the heat exchange capacity;

[0054] (5) The columnar lattice units added inside make full use of the space between the fins to increase the heat dissipation surface area;

[0055] (6) The fins and columnar lattice units are integrated with the top cover plate, so that heat can be directly transferred to the top cover plate, making full use of the direct contact between the top cover plate surface and the external ambient air for heat dissipation;

[0056] (7) Set up an arc-shaped guide structure to smoothly change the air outlet position;

[0057] (8) The surface of the radiator is copper-plated. The thermal conductivity of the copper plating is twice that of aluminum alloy. Therefore, the overall average thermal conductivity of the radiator is improved, and the heat conduction efficiency is higher.

[0058] (9) Due to the use of copper plating, the heat at the bosses and grooves on the heat dissipation substrate can be quickly conducted in a plane, so that the heat is evenly distributed from point to surface, thereby reducing the temperature at the bosses and grooves.

[0059] The above is only a specific embodiment of the present invention, and cannot be used to limit the scope of the invention. Therefore, the replacement of equivalent components, or equivalent changes and modifications made according to the scope of protection of the patent of the present invention, should still fall within the scope of this patent. In addition, the technical features of the present invention can be freely combined with each other, with each other, and with each other.

Claims

1. An air-cooled radiator, characterized in that: include: Heat dissipation substrate (8); A shell component is integrally formed with a heat dissipation substrate (8), and a sealed air cavity is formed between the shell component and the heat dissipation substrate (8); A heat dissipation component is integrally formed with the heat dissipation substrate (8) and / or the shell component, and the heat dissipation component is arranged in the sealed air cavity.

2. The air-cooled radiator according to claim 1, characterized in that: The housing assembly comprises: The first side wall (1) and the second side wall (5) are symmetrically spaced and arranged, and both the first side wall (1) and the second side wall (5) are perpendicular to the heat dissipation substrate (8); A top cover plate (2) is arranged at the top ends of the first side wall (1) and the second side wall (5), and the top cover plate (2) is parallel to the heat dissipation substrate (8).

3. The air-cooled radiator according to claim 2, characterized in that: A plurality of air outlets are arranged on one side of the top cover plate (2), and the air outlets are respectively connected to the sealed air cavity and the external space.

4. The air-cooled heat sink according to claim 3, characterized in that: The heat dissipation component comprises a plurality of fins (3), the plurality of fins (3) being arranged at intervals along the extension direction of the sealed air cavity, and a heat dissipation channel being formed between two adjacent fins (3), and the two ends of each heat dissipation channel being respectively connected to the inlet of the sealed air cavity and the air outlet.

5. The air-cooled radiator according to claim 4, characterized in that: The upper side of each fin (3) is integrally formed with the top cover plate (2), and the lower side of each fin (3) is integrally formed with the heat dissipation substrate (8).

6. The air-cooled heat sink according to claim 4, characterized in that: The longitudinal section and the transverse section of the fin (3) are both S-shaped.

7. The air-cooled heat sink according to claim 4, characterized in that: The air-cooled heat sink also includes a columnar lattice unit (4), and a plurality of columnar lattice units (4) are arranged in each of the heat dissipation channels.

8. The air-cooled heat sink according to claim 7, characterized in that: The columnar dot matrix unit (4) is integrally arranged on the top cover plate (2) and / or the heat dissipation substrate (8).

9. The air-cooled heat sink according to claim 1, characterized in that: A mounting structure (7) for mounting electronic components is provided on a side of the heat dissipation substrate (8) away from the housing assembly.

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