Metal insert heat dissipation structure and heater

Abstract

The invention relates to the technical field of heat management, in particular to a metal insert heat dissipation structure and a heater. The metal insert heat dissipation structure comprises a shell, an IGBT module and a metal insert, the shell comprises a cylinder and a partition plate, and the partition plate is arranged in the cylinder in a sealed mode so as to divide the cylinder into an upper containing space and a lower containing space which are sealed mutually. A through hole is formed in the partition plate; one end of the metal insert is arranged in the lower accommodating space, and the other end of the metal insert penetrates through the through hole and extends to the upper accommodating space; one end of the metal insert is attached to the runner plate assembly of the heating core body, and the IGBT module is arranged on the metal insert so that heat generated by the IGBT module can be dissipated through the metal insert and the runner plate assembly in sequence. In this way, the IGBT module can be rapidly cooled, the structure is simple, and arrangement is convenient.

Description

Technical Field

[0001] The present invention relates to the field of thermal management technology, and in particular to a metal insert heat dissipation structure and a heater. Background Art

[0002] Ceramic heaters are heating devices used in automotive thermal management systems. The working principle is that the ceramic heater generates heat under a set voltage, and then transfers the heat to the vehicle system coolant. After the coolant is heated, it passes through a traditional air-conditioning box so that the air conditioning blows out the coolant heat to heat the passenger compartment or other locations. The ceramic heater includes an IGBT module (Insulated Gate Bipolar Transistor). The IGBT module is a switching electrical component that can control the power on and off of the heater.

[0003] The existing IGBT module adopts natural heat dissipation, but the IGBT module may overheat during operation, thus affecting its working condition and further affecting the operation stability of the ceramic heater. Summary of the invention

[0004] The objects of the present invention include, for example, providing a metal insert heat dissipation structure and a heater, which can achieve rapid heat dissipation of an IGBT module and have a simple structure and convenient arrangement.

[0005] The embodiments of the present invention can be implemented as follows:

[0006] In a first aspect, the present invention provides a metal insert heat dissipation structure, comprising:

[0007] Housing, IGBT module and metal inserts;

[0008] The shell includes a cylinder and a partition, wherein the partition is hermetically arranged in the cylinder to separate the cylinder into an upper accommodating space and a lower accommodating space which are closed to each other; the upper accommodating space can be used to accommodate a heating core, and the lower accommodating space can be used to accommodate an IGBT module;

[0009] The partition is provided with a through hole; one end of the metal insert is arranged in the lower accommodation space, and the other end of the metal insert passes through the through hole and extends to the upper accommodation space;

[0010] One end of the metal insert is attached to the flow channel plate assembly of the heating core, and the IGBT module is arranged on the metal insert, so that the heat generated by the IGBT module is dissipated through the metal insert and the flow channel plate assembly in sequence.

[0011] In an optional embodiment, the metal insert includes a first plate body, which can be embedded in the through hole; the top surface of the first plate body is attached to the bottom surface of the flow channel plate assembly, and the IGBT module is arranged on the bottom surface of the first plate body.

[0012] In an optional embodiment, the metal insert further includes a connecting plate and a second plate body; two ends of the connecting plate are respectively connected to the first plate body and the second plate body; the side wall of the shell has a slot, and the second plate body is snapped into the slot.

[0013] In an optional embodiment, a thermally conductive insulating pad is further included; the top of the thermally conductive insulating pad is attached to the bottom surface of the first plate body, and the bottom surface of the thermally conductive insulating pad is attached to the top surface of the IGBT module.

[0014] In an optional implementation, the top of the IGBT module is bonded to the bottom surface of the first plate of the metal insert.

[0015] In an optional embodiment, a heat-curing adhesive film is further included; the heat-curing adhesive film is arranged between the top surface of the IGBT module and the bottom surface of the first plate body.

[0016] In an optional embodiment, it further includes a pressing plate and at least two supporting columns;

[0017] The support column is arranged at the bottom of the partition, and the support column extends in a direction away from the upper accommodation space; the support column has a first end close to the partition, and a second end away from the partition; the support column is respectively located on both sides of the IGBT module;

[0018] The top surface of the pressing plate is pressed against the bottom of the IGBT module, and the second ends of the support columns are detachably connected to the pressing plate, so that the support columns and the pressing plate are maintained to form a holding space for holding the IGBT module.

[0019] In an optional embodiment, a fastener is further included, the pressure plate is provided with a first matching hole, and the support column is provided with a second matching hole; the fastener passes through the first matching hole and the second matching hole in sequence to fasten the pressure plate and the support column.

[0020] In an optional embodiment, a flexible member is further included; a receiving groove is provided on the end surface of the pressure plate close to the support column, the flexible member is arranged in the receiving groove, and one end of the flexible member away from the pressure plate is abutted against the bottom of the IGBT module.

[0021] In a second aspect, the present invention provides a heater, comprising any one of the aforementioned embodiments.

[0022] The beneficial effects of the embodiments of the present invention include, for example:

[0023] The metal insert heat dissipation structure of the present scheme includes a shell, an IGBT module and a metal insert. The partition divides the shell into an upper accommodation space that can accommodate the heating core and a lower accommodation space that accommodates the IGBT module. The metal insert can penetrate into the upper accommodation space through the through hole and connect with the flow channel plate assembly, so as to transfer the heat of the IGBT module set on the metal insert to the flow channel plate assembly, so as to use the fluid in the flow channel to take away the heat and improve the heat dissipation efficiency of the IGBT. The other end of the metal insert is penetrated by a through hole extending to the upper accommodation space, so that the IGBT modules and the flow channel plate assembly on both sides of the partition can achieve contact heat dissipation. Without changing the original heater structure, the heat dissipation efficiency of the IGBT module can be improved through simple improvements. In this way, the metal insert heat dissipation structure is convenient to set up, simple in structure, and low in modification cost. It can significantly improve the heat dissipation effect of the IGBT module, thereby ensuring the stability and reliability of the heater operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0025] Figure 1 A schematic cross-sectional view of a metal insert heat dissipation structure according to an embodiment of the present invention;

[0026] Figure 2 It is a structural schematic diagram of a metal insert heat dissipation structure according to an embodiment of the present invention;

[0027] Figure 3 A schematic cross-sectional view of the metal insert heat dissipation structure of an embodiment of the present invention from another perspective;

[0028] Figure 4 It is a structural schematic diagram from another perspective of the metal insert heat dissipation structure of an embodiment of the present invention.

[0029] Icons: 10-metal insert heat dissipation structure; 100-shell; 101-upper accommodating space; 102-lower accommodating space; 110-cylinder; 111-slot; 112-first through hole; 120-partition; 121-through hole; 200-IGBT module; 300-metal insert; 310-first plate body; 320-second plate body; 322-second through hole; 330-connecting plate; 400-thermal insulating pad; 510-pressing plate; 511-first matching hole; 512-accommodating groove; 520-support column; 530-flexible part; 20-heating core; 21-flow channel plate assembly; 31-bolt. DETAILED DESCRIPTION

[0030] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.

[0031] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention claimed for protection, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0032] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0033] In the description of the present invention, it should be noted that if the terms "upper", "lower", "inside", "outside", etc. appear to indicate an orientation or position relationship, they are based on the orientation or position relationship shown in the accompanying drawings, or are the orientation or position relationship in which the product of the invention is usually placed when used. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0034] In addition, the terms “first”, “second”, etc., if used, are merely used to distinguish between the descriptions and should not be understood as indicating or implying relative importance.

[0035] It should be noted that, in the absence of conflict, the features in the embodiments of the present invention may be combined with each other.

[0036] Please refer to Figure 1This embodiment provides a metal insert heat dissipation structure 10, including:

[0037] Housing 100, IGBT module 200 and metal insert 300;

[0038] The housing 100 includes a cylinder 110 and a partition 120, wherein the partition 120 is hermetically disposed in the cylinder 110 to separate the cylinder 110 into an upper accommodation space 101 and a lower accommodation space 102 which are closed to each other; the upper accommodation space 101 can be used to accommodate the heating core 20, and the lower accommodation space 102 can be used to accommodate the IGBT module 200;

[0039] The partition plate 120 is provided with a through hole 121; one end of the metal insert 300 is disposed in the lower accommodation space 102, and the other end of the metal insert 300 penetrates the through hole 121 and extends to the upper accommodation space 101;

[0040] One end of the metal insert 300 is attached to the flow channel plate assembly 21 of the heating core 20 , and the IGBT module 200 is disposed on the metal insert 300 , so that the heat generated by the IGBT module 200 is dissipated through the metal insert 300 and the flow channel plate assembly 21 in sequence.

[0041] The metal insert heat dissipation structure 10 of the present solution has a partition 120 that divides the housing 100 into an upper accommodation space 101 that can accommodate the heating core 20 and a lower accommodation space 102 that accommodates the IGBT module 200. The metal insert 300 can penetrate into the upper accommodation space 101 through the through hole 121 and connect with the flow channel plate assembly 21, so as to transfer the heat of the IGBT module 200 set on the metal insert 300 to the flow channel plate assembly 21, so as to use the fluid in the flow channel to take away the heat and improve the heat dissipation efficiency of the IGBT. The other end of the metal insert 300 is penetrated by the through hole 121 and extends to the upper accommodation space 101, so that the IGBT module 200 and the flow channel plate assembly 21 on both sides of the partition 120 can achieve contact heat dissipation. Without changing the original heater structure, the heat dissipation efficiency of the IGBT module 200 can be improved through simple improvements. Such a heat dissipation structure is convenient to set up, simple in structure, and low in modification cost. It can significantly improve the heat dissipation effect of the IGBT module 200, thereby ensuring the stability and reliability of the heater operation.

[0042] Please continue reading Figure 1 , Figure 2 , Figure 3 and Figure 4 , to understand more structural details of the metal insert heat dissipation structure 10.

[0043] It should be noted that in order to maintain the stability and reliability of the IGBT module 200 and avoid electromagnetic interference, during installation, the IGBT module 200 will not directly contact the first plate 310. Optionally, a thermally conductive insulating material is provided between the top surface of the IGBT module 200 and the bottom surface of the first plate 310.

[0044] It can also be seen from the figure that in an optional embodiment, the metal insert 300 includes a first plate body 310, and the first plate body 310 can be embedded in the through hole 121; the top surface of the first plate body 310 is in contact with the bottom surface of the flow channel plate assembly 21, and the IGBT module 200 is arranged on the bottom surface of the first plate body 310. In this way, the airtightness between the upper accommodating space 101 and the lower accommodating space 102 can be ensured.

[0045] from Figure 2 It can be seen that in an optional embodiment, the metal insert 300 further includes a connecting plate 330 and a second plate body 320; the two ends of the connecting plate 330 are respectively connected to the first plate body 310 and the second plate body 320; the side wall of the housing 100 has a card slot 111, and the second plate body 320 is carded in the card slot 111. In this way, the second plate body 320 can be stably arranged on the housing 100. Optionally, the inner wall of the card slot 111 can also be provided with a first through hole 112, and the second plate body 320 can be provided with a second through hole 322. The bolt 31 passes through the first through hole 112 and the second through hole 322 in sequence, so that the second plate body 320 is fastened to the card slot 111, thereby further ensuring the stable connection between the metal insert 300 and the housing 100.

[0046] Optionally, the connecting plate 330 and the first plate body 310 and the second plate body 320 have an angle, so that the connecting plate 330, the first plate body 310, and the second plate body 320 are staggered, thereby avoiding interference of the metal insert 300 with other parts. It is not difficult to understand that in other embodiments of the present invention, the connecting plate 330 and the first plate body 310 and the second plate body 320 can also be parallel, coplanar, partially maintain an angle, partially maintain parallelism, or all maintain a staggered arrangement, etc. Those skilled in the art should be able to make reasonable selections and designs according to actual needs, and no specific restrictions are made here.

[0047] Optionally, the connecting plate 330 is perpendicular to the first plate 310 and the second plate 320 respectively, and the first plate 310 and the second plate 320 remain parallel, so that the metal insert 300 can extend in the horizontal direction, thereby reducing the height of the metal insert 300 and avoiding interference with other components.

[0048] from Figure 3 and Figure 4It can be seen that in an optional embodiment, the metal insert heat dissipation structure 10 further includes a thermally conductive insulating pad 400; the top of the thermally conductive insulating pad 400 is attached to the bottom surface of the first plate body 310, and the bottom surface of the thermally conductive insulating pad 400 is attached to the top surface of the IGBT module 200. On the one hand, the thermally conductive insulating pad 400 enables the IGBT module 200 to be transferred to the first plate body 310, and then heat is dissipated through the flow channel assembly; on the other hand, it can prevent electromagnetic interference of other components to the IGBT module 200 through insulation.

[0049] Optionally, the area of ​​the thermally conductive insulating pad 400 is larger than the aperture of the through hole 121, so that the thermally conductive insulating pad 400 covers the entire through hole 121. The area of ​​the thermally conductive insulating pad 400 is also larger than the area of ​​the first plate body 310, so that the thermally conductive insulating pad 400 covers the bottom surface of the first plate body 310, thereby ensuring the thermal insulation effect on the IGBT module 200.

[0050] In an optional embodiment, the top of the IGBT module 200 is bonded to the bottom of the first plate 310 of the metal insert 300. Such a setting can ensure the stable connection between the IGBT module 200 and the first plate 310, and the bonding method is conducive to improving the convenience of assembly; on the other hand, the bonding method can make the IGBT module 200 fit more closely to the surface of the first plate 310, so as to facilitate the efficient diffusion of the heat of the IGBT module 200 to the first plate 310, and then transfer to the flow channel plate assembly 21 to achieve efficient heat dissipation.

[0051] In an optional embodiment, the metal insert heat dissipation structure 10 further includes a thermosetting adhesive film; the thermosetting adhesive film is disposed between the top surface of the IGBT module 200 and the bottom surface of the first plate body 310 .

[0052] It can also be seen from the figure that in an optional embodiment, the metal insert heat dissipation structure 10 further includes a pressing plate 510 and at least two support columns 520; the support column 520 is arranged at the bottom of the partition 120, and the support column 520 extends in a direction away from the upper accommodation space 101; the support column 520 has a first end close to the partition 120, and a second end away from the partition 120; the support columns 520 are respectively located on both sides of the IGBT module 200; the top surface of the pressing plate 510 is against the bottom of the IGBT module 200, and the second ends of the support columns 520 are detachably connected to the pressing plate 510, so that the support columns 520 and the pressing plate 510 are maintained to form a holding space for holding the IGBT module 200. The pressing plate 510 can ensure that the IGBT module 200 is stably arranged in the housing 100.

[0053] In an optional embodiment, the metal insert heat dissipation structure 10 further includes a fastener, the pressing plate 510 is provided with a first matching hole 511, and the support column 520 is provided with a second matching hole; the fastener is sequentially provided with the first matching hole 511 and the second matching hole to fasten the pressing plate 510 and the support column 520. Optionally, the fastener is threadedly engaged with the second matching hole. In this way, the detachable engagement of the pressing plate 510 and the support column 520 can be simplified, and loading and unloading and maintenance are facilitated.

[0054] In an optional embodiment, the metal insert heat dissipation structure 10 further includes a flexible member 530; a receiving groove 512 is provided on the end surface of the pressing plate 510 close to the support column 520, and the flexible member 530 is disposed in the receiving groove 512, and one end of the flexible member 530 away from the pressing plate 510 abuts against the bottom of the IGBT module 200. The flexible member 530 can prevent the pressing plate 510 from being installed to cause extrusion damage to the IGBT module 200, thereby ensuring the safety and reliability of the IGBT module 200.

[0055] It should be noted that, in another embodiment of the present invention, the pressure plate 510 includes a plate body and a plurality of spring sheets, and the spring sheets are arranged on the top surface of the plate body. The plate body and the spring sheets are both made of metal. A first matching hole 511 is arranged on the plate body. The fasteners are sequentially penetrated through the first matching hole 511 and the second matching hole to fasten the plate body to the support column 520. The spring sheets are used to be able to abut against the bottom of the IGBT module 200 to provide an elastic force to keep the IGBT module 200 away from the plate body, so that the IGBT module 200 can be pressed against the thermally conductive insulating pad 400, thereby ensuring that the IGBT module 200 can be firmly arranged on the pressure plate. Optionally, the plate body and the spring sheets are integrally formed.

[0056] Furthermore, the plate body is provided with a plurality of through holes, the number of which is the same as the number of the springs, and the through holes are arranged one by one with the springs, and the through holes are located below the corresponding springs. On the one hand, the through holes can provide a space for the springs to move, and on the other hand, the plate body is formed into springs by stamping the plate of the through holes.

[0057] In a second aspect, the present invention provides a heater, the heater comprising any one of the aforementioned embodiments.

[0058] In summary, the embodiment of the present invention provides a metal insert heat dissipation structure 10 and a heater, which have at least the following advantages:

[0059] The metal insert 300 extends into the core side and contacts and connects with the flow channel surface, so as to use the water in the flow channel to take away the heat, thereby improving the heat dissipation efficiency of the IGBT module 200.

[0060] The above are only specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed by the present invention should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims

1. A metal insert heat dissipation structure, characterized in that: include: A housing (100), an IGBT module (200) and a metal insert (300); The housing (100) comprises a cylinder (110) and a partition (120), wherein the partition (120) is hermetically disposed in the cylinder (110) to separate the cylinder (110) into an upper accommodating space (101) and a lower accommodating space (102) that are mutually closed; the upper accommodating space (101) can be used to accommodate a heating core (20), and the lower accommodating space (102) can be used to accommodate an IGBT module (200); The partition (120) is provided with a through hole (121); one end of the metal insert (300) is arranged in the lower accommodating space (102), and the other end of the metal insert (300) passes through the through hole (121) and extends to the upper accommodating space (101); One end of the metal insert (300) is attached to the flow channel plate assembly (21) of the heating core (20), and the IGBT module (200) is arranged on the metal insert (300) so as to dissipate heat generated by the IGBT module (200) through the metal insert (300) and the flow channel plate assembly (21) in sequence.

2. The metal insert heat dissipation structure according to claim 1, characterized in that: The metal insert (300) comprises a first plate body (310), and the first plate body (310) can be embedded in the through hole (121); the top surface of the first plate body (310) is in contact with the bottom surface of the flow channel plate assembly (21), and the IGBT module (200) is arranged on the bottom surface of the first plate body (310).

3. The metal insert heat dissipation structure according to claim 2, characterized in that: The metal insert (300) further comprises a connecting plate (330) and a second plate body (320); two ends of the connecting plate (330) are respectively connected to the first plate body (310) and the second plate body (320); the side wall of the housing (100) has a slot (111), and the second plate body (320) is snap-fitted into the slot (111).

4. The metal insert heat dissipation structure according to claim 2, characterized in that: It also comprises a thermally conductive insulating pad (400); the top of the thermally conductive insulating pad (400) is attached to the bottom surface of the first plate body (310), and the bottom surface of the thermally conductive insulating pad (400) is attached to the top surface of the IGBT module (200).

5. The metal insert heat dissipation structure according to claim 2, characterized in that: The top of the IGBT module (200) is bonded to the bottom surface of the first plate body (310) of the metal insert (300).

6. The metal insert heat dissipation structure according to claim 5, characterized in that: It also includes a heat-curing adhesive film; the heat-curing adhesive film is arranged between the top surface of the IGBT module (200) and the bottom surface of the first plate body (310).

7. The metal insert heat dissipation structure according to claim 1, characterized in that: Also includes a pressing plate (510) and at least two supporting columns (520); The support column (520) is arranged at the bottom of the partition (120), and the support column (520) extends in a direction away from the upper accommodating space (101); the support column (520) has a first end close to the partition (120), and a second end away from the partition (120); the support column (520) is respectively located on both sides of the IGBT module (200); The top surface of the pressing plate (510) is pressed against the bottom of the IGBT module (200), and the second ends of the support columns (520) are detachably connected to the pressing plate (510), so that the support columns (520) and the pressing plate (510) are maintained to form a clamping space for clamping the IGBT module (200).

8. The metal insert heat dissipation structure according to claim 7, characterized in that: It also includes a fastener, the pressing plate (510) is provided with a first matching hole (511), and the supporting column (520) is provided with a second matching hole; the fastener is sequentially penetrated through the first matching hole (511) and the second matching hole to fasten the pressing plate (510) and the supporting column (520).

9. The metal insert heat dissipation structure according to claim 7, characterized in that: It also includes a flexible member (530); a receiving groove (512) is provided on the end surface of the pressure plate (510) close to the support column (520), the flexible member (530) is arranged in the receiving groove (512), and one end of the flexible member (530) away from the pressure plate (510) is abutted against the bottom of the IGBT module (200).

10. A heater, characterized in that: The heater comprises the metal insert heat dissipation structure according to any one of claims 1-9.

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