Electronic device

Abstract

The embodiment of the invention discloses electronic equipment. The electronic equipment comprises a heat conduction assembly; the first heating part is arranged on the first surface side of the heat conduction assembly, and a distance is formed between the first heating part and the heat conduction assembly; the functional part is at least partially arranged on the first surface side of the heat conduction assembly; the functional part is located at the position where the heat conduction assembly is limited to move towards the side of the first heating part; at least part of the first target component is arranged between the heat conduction assembly and the first heating component, and the first target component is used for dissipating heat of the first heating component; the first target component is provided with a first group of heat exchange channels; the first group of heat exchange channels are used for accommodating a first heat exchange medium; and the driving part is used for driving the first heat exchange medium to flow in the first group of heat exchange channels.

Description

Technical Field

[0001] The present application relates to the field of electronic technology, and in particular to an electronic device. Background Art

[0002] Electronic devices are devices that people use frequently. In related technologies, the heat-conducting structure and the heat-generating components of the electronic device are heat-conductingly connected through heat-conducting parts. The heat dissipation capacity of the electronic device is limited by the heat dissipation capacity of the heat-conducting structure, resulting in limited heat dissipation capacity of the electronic device. Summary of the invention

[0003] In view of this, an embodiment of the present application hopes to provide an electronic device.

[0004] To achieve the above purpose, the technical solution of this application is implemented as follows:

[0005] An embodiment of the present application provides an electronic device, including:

[0006] Thermally conductive components;

[0007] A first heat-generating component is disposed on the first surface side of the heat-conducting component and is spaced apart from the heat-conducting component;

[0008] A functional component is at least partially disposed on the first surface side of the heat-conducting component; the functional component is located at a position that limits the movement of the heat-conducting component toward the first heat-generating component side;

[0009] A first target component is at least partially disposed between the heat-conducting component and the first heat-generating component, and the first target component is used to dissipate heat from the first heat-generating component; the first target component has a first group of heat exchange channels; the first group of heat exchange channels is used to accommodate a first heat exchange medium;

[0010] A driving member is used to drive the first heat exchange medium to flow in the first group of heat exchange channels.

[0011] Heat dissipation can include "conducting to the thermally conductive component", emphasizing that heat dissipation can also be conducted, and an instruction manual is provided.

[0012] In some optional implementations, the first heat-generating component contacts a first side of the first target component, a second side of the first target component contacts a first surface side of the heat-conducting component, and the second side of the first target component is opposite to the first side of the first target component.

[0013] The functional component is in contact with the first surface side of the thermally conductive component.

[0014] In some optional implementations, the heat-conducting component includes a first area and a second area, the orthographic projection area of ​​the first heat-generating component toward the heat-conducting component is the first area, and the orthographic projection area of ​​the functional component toward the heat-conducting component is the second area.

[0015] The projection direction of the first heat-generating component toward the orthographic projection area of ​​the heat-conducting component is a first direction, the projection direction of the functional component toward the orthographic projection area of ​​the heat-conducting component is a second direction, and the first direction is the same as the second direction.

[0016] The first region of the heat conducting component and the second region of the heat conducting component meet a coplanar condition in the first direction.

[0017] In some optional implementations, the first portion of the first target component is located between the first heat-generating component and the first surface of the thermally conductive component; the second portion of the first target component contacts at least one side surface of the thermally conductive component; and the side surface of the thermally conductive component is disposed adjacent to the first surface of the thermally conductive component.

[0018] In some optional implementations, the first portion of the first target component and the second portion of the first target component form a receiving groove, and at least a portion of the heat conductive component is located in the receiving groove.

[0019] In some optional implementations, the first target component is used to conduct the first portion of heat absorbed by the first heat-generating component to the heat-conducting component, and the first target component is also used to transfer the first heat exchange medium that absorbs the second portion of heat of the first heat-generating component away through the driving member.

[0020] In some optional implementations, the first group of heat exchange channels includes at least two first heat exchange channels;

[0021] The electronic device further comprises:

[0022] an outlet channel connected to the outlet of the driving member; the cross-sectional area of ​​the outlet channel is larger than the cross-sectional area of ​​the first heat exchange channel;

[0023] an inlet channel connected to the inlet of the driving member; the cross-sectional area of ​​the inlet channel is larger than the cross-sectional area of ​​the first heat exchange channel;

[0024] The first group of heat exchange channels are respectively connected to the outlet channel and the inlet channel, the driving member is spaced apart from the first target component, and the driving member is used to drive the first heat exchange medium to circulate in the outlet channel, the first group of heat exchange channels and the inlet channel.

[0025] In some optional implementations, the method further includes:

[0026] a second heat generating component;

[0027] a second target component, at least partially disposed between the heat-conducting component and the second heat-generating component, the second target component being used to conduct heat from the second heat-generating component to the heat-conducting component; the second target component having a second group of heat exchange channels; the second group of heat exchange channels being in communication with the introduction channel;

[0028] a first sub-channel, connected to the outlet channel and the first group of heat exchange channels respectively;

[0029] The second sub-channel is communicated with the outlet channel and the second group of heat exchange channels respectively.

[0030] In some optional implementations, the first heat-generating component includes at least two first heat-generating areas disposed at intervals;

[0031] The first group of heat exchange channels includes at least two first heat exchange channels disposed at intervals, and the at least two first heat exchange channels disposed at intervals are correspondingly located between at least two first heating areas and the heat conduction component.

[0032] In some optional implementations, the method further includes:

[0033] The first set of heat sinks;

[0034] A connecting pipe is at least partially disposed on the first group of heat sinks and is respectively connected to the first group of heat exchange channels and the inlet of the driving member; the driving member is used to drive the first heat exchange medium to circulate in the first group of heat exchange channels and the connecting pipe.

[0035] In some optional implementations, the method further includes:

[0036] The first body has a receiving space;

[0037] The first heat-generating component, the first target component and the heat-conducting component are stacked in the accommodating space in the thickness direction of the first body;

[0038] The first heat generating component and the functional component are arranged in the accommodation space at intervals along a third direction, wherein the third direction is different from a thickness direction of the first body;

[0039] The driving member and the first target member are disposed in the accommodation space along a fourth direction with an interval therebetween, wherein the fourth direction is different from a thickness direction of the first body.

[0040] In some optional implementations, the first group of heat exchange channels includes at least two first heat exchange channels;

[0041] The dimension of the first heat exchange channel in the fifth direction is greater than the dimension of the first heat exchange channel in the thickness direction of the first body; wherein the fifth direction is different from the thickness direction of the first body; and / or,

[0042] A dimension of the heat-conducting component in a sixth direction is greater than a dimension of the heat-conducting component in a thickness direction of the first body, wherein the sixth direction is different from a thickness direction of the first body.

[0043] In some optional implementations, the method further includes:

[0044] A second body, rotatably connected to the first body;

[0045] An input component or a first display component is disposed outside the first body;

[0046] a second display assembly, disposed on the outer side of the second body; and / or,

[0047] The electronic device further comprises:

[0048] The bearing member is in the form of a plate;

[0049] The first heat-generating component and the functional component are arranged on the carrier at intervals, and the driving component is arranged on a side of the carrier close to the first group of heat exchange channels in a seventh direction; the seventh direction is perpendicular to the thickness direction of the carrier. BRIEF DESCRIPTION OF THE DRAWINGS

[0050] Figure 1 This is an optional structural diagram of an electronic device in an embodiment of the present application, wherein direction A is the stacking direction of the heat-conducting component, the first target component, and the first heat-generating component;

[0051] Figure 2 is another optional structural schematic diagram of the electronic device in the embodiment of the present application, wherein direction A is the stacking direction of the heat conducting component, the first target component and the first heat generating component;

[0052] Figure 3 This is another optional structural diagram of the electronic device in the embodiment of the present application, wherein direction A is the stacking direction of the heat-conducting component, the first target component and the first heat-generating component;

[0053] Figure 4 This is a first optional structural diagram of a first target component of an electronic device in an embodiment of the present application;

[0054] Figure 5 A second optional structural diagram of the first target component of the electronic device in the embodiment of the present application;

[0055] Figure 6 A third optional structural diagram of the first target component of the electronic device in the embodiment of the present application;

[0056] Figure 7 This is a fourth optional structural schematic diagram of the first target component of the electronic device in the embodiment of the present application, wherein the arrow indicates the flow direction of the first heat exchange medium;

[0057] Figure 8 This is a fifth optional structural schematic diagram of the first target component of the electronic device in the embodiment of the present application, wherein the arrow indicates the flow direction of the first heat exchange medium;

[0058] Fig. 9 This is another optional structural diagram of the electronic device in the embodiment of the present application, wherein direction A is the stacking direction of the heat-conducting component, the first target component and the first heat-generating component;

[0059] Fig.10 This is a schematic diagram of the working principle of an optional local structure of an electronic device in an embodiment of the present application, wherein the arrow indicates the flow direction of the first heat exchange medium;

[0060] Fig.11a It is another optional partial structural schematic diagram of the electronic device in the embodiment of the present application, wherein direction A is the stacking direction of the heat-conducting component, the first target component and the first heat-generating component;

[0061] Fig.11b It is another optional partial structural schematic diagram of the electronic device in the embodiment of the present application, wherein direction A is the stacking direction of the heat-conducting component, the first target component and the first heat-generating component;

[0062] Fig.12 Schematic diagram of another optional partial structure of the electronic device in the embodiment of the present application, wherein direction A is the stacking direction of the heat-conducting component, the first target component and the first heat-generating component;

[0063] Fig.13 This is another optional partial structural diagram of the electronic device in the embodiment of the present application;

[0064] Fig.14 This is an optional structural diagram of an electronic device in an embodiment of the present application, wherein direction A is the stacking direction of the heat-conducting component, the first target component, and the first heat-generating component;

[0065] Fig.15 This is another optional structural diagram of the electronic device in the embodiment of the present application, wherein direction A is the stacking direction of the heat-conducting component, the first target component and the first heat-generating component.

[0066] Figure numerals: 100, first target component; 110, first group of heat exchange channels; 111, first heat exchange channel; 120, first part; 130, second part; 140, accommodating groove; 200, second target component; 210, second group of heat exchange channels; 211, second heat exchange channel; 400, heat conduction component; 410, first surface; 510, first heat generating component; 520, functional component; 530, second heat generating component; 600, driving member; 710, outlet channel; 720, inlet channel; 730, connecting pipe; 740, filter; 750, first sub-channel; 760, second sub-channel; 810, first group of heat sinks; 820, first fan; 910, first body; 911, accommodating space; 920, bearing member. DETAILED DESCRIPTION

[0067] The technical solution of the present application is further elaborated in detail below in conjunction with the accompanying drawings and specific embodiments of the specification.

[0068] In the embodiments of the present application, it should be noted that, unless otherwise specified and limited, the term "connection" should be understood in a broad sense. For example, it can be an electrical connection or a connection between two components. It can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to the specific circumstances.

[0069] It should be noted that the terms "first\second\third" involved in the embodiments of the present application are only used to distinguish similar objects, and do not represent a specific order for the objects. It is understandable that the specific order or sequence of "first\second\third" can be interchanged where permitted. It should be understood that the objects distinguished by "first\second\third" can be interchanged where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein.

[0070] In the related art, the heat-conducting structure and the heat-generating components of the electronic device are heat-conductingly connected via a heat-conducting member, and the heat dissipation capacity of the electronic device is limited by the heat dissipation capacity of the heat-conducting structure, resulting in the limitation of the heat dissipation capacity of the electronic device.

[0071] The following combination Figures 1 to 15 The electronic device described in the embodiments of the present application is described in detail.

[0072] The electronic device comprises: a heat-conducting component 400, a first heat-generating component 510, a functional component 520, a first target component 100 and a driving member 600. The first heat-generating component 510 is arranged on the first surface 410 side of the heat-conducting component 400, and there is a distance between the first heat-generating component 510 and the heat-conducting component 400; at least part of the functional component 520 is arranged on the first surface 410 side of the heat-conducting component 400; the functional component 520 is located at a position that limits the heat-conducting component 400 to move toward the first heat-generating component 510 side; at least part of the first target component 100 is arranged between the heat-conducting component 400 and the first heat-generating component 510, and the first target component 100 is used to dissipate the heat of the first heat-generating component 510; the first target component 100 has a first group of heat exchange channels 110; the first group of heat exchange channels 110 is used to accommodate a first heat exchange medium; the driving member 600 is used to drive the first heat exchange medium to flow in the first group of heat exchange channels 110.

[0073] In the electronic device of the embodiment of the present application, since the first target component 100 also has the first group of heat exchange channels 110, the heat of the first heat-generating component 510 can be conducted to the heat-conducting component 400 through the first target component 100, so that the heat of the first heat-generating component 510 can be quickly dissipated through the heat-conducting component 400, and the heat of the first heat-generating component 510 can also be taken away by the first heat exchange medium in the first group of heat exchange channels 110, so that the heat dissipation capacity of the electronic device can be greatly improved. At the same time, since the functional component 520 is located at a position that limits the movement of the heat-conducting component 400 toward the first heat-generating component 510, there is a distance between the first heat-generating component 510 and the heat-conducting component 400; the height of the first heat-generating component 510 can also be compensated by the first target component 100, solving the problem that the first heat-generating component 510 cannot directly contact the heat-conducting component 400; in other words, the heat-conducting structure of the first target component 100 that compensates for the height can greatly improve the ability of the electronic device to dissipate heat for the first heat-generating component 510.

[0074] In the embodiments of the present application, the structure of the electronic device is not limited. For example, the electronic device may be a tablet computer, a mobile phone, a laptop computer, a game console, etc. However, the present application is not limited thereto, and those skilled in the art may adjust or set the structure according to specific needs.

[0075] In the embodiment of the present application, the structure of the heat-conducting component 400 is not limited, as long as the heat-conducting component 400 can take away the heat generated by the first heat-generating component 510 .

[0076] For example, the heat conductive component 400 may have a closed cavity, and the closed cavity may have a second heat exchange medium; here, the second heat exchange medium can flow in the closed cavity to take away the heat generated by the first heat-generating component 510, so that the heat conductive component 400 can continuously take away the heat generated by the first heat-generating component 510.

[0077] Here, the second heat exchange medium may have two states in the closed cavity, and the second heat exchange medium can transfer the heat absorbed by the heat conducting component 400 by switching between the two states.

[0078] As an example, the second heat exchange medium can have a liquid state and a gas state; the heat conduction component 400 can have a hot end and a cold end, and a capillary structure can also be provided in the closed cavity. The first target component 100 is used to transfer the heat of the first heat-generating component 510 to the hot end of the heat conduction component 400. After the hot end absorbs heat, the liquid second heat exchange medium absorbs heat and evaporates to form a gaseous second heat exchange medium. The gaseous second heat exchange medium flows to the cold end under the action of the pressure difference, releases heat at the cold end and condenses into a liquid second heat exchange medium, and then returns to the hot end by the capillary action of the capillary structure, forming a closed heat conduction cycle.

[0079] The cold end of the heat-conducting component 400 may be a position that can volatilize heat, and the hot end of the heat-conducting component 400 may be a position that can absorb heat.

[0080] The form of the second heat exchange medium is not limited. For example, the second heat exchange medium can be liquid ammonia, freon, liquid nitrogen, water, methanol, acetone, liquid metal, etc. However, the present application is not limited thereto, that is, those skilled in the art can adjust or set it according to specific needs.

[0081] Here, the electronic device may further include: a second group of heat sinks, the heat absorbed by the heat conductive component 400 may be taken away by the second group of heat sinks, and the second group of heat sinks may take away the heat by exchanging heat with the air. The cold end of the heat conductive component 400 may be connected to the second group of heat sinks by means of clamping, bonding, welding, etc., so that the heat of the cold end of the heat conductive component 400 is transferred to the second group of heat sinks.

[0082] Here, the electronic device may further include: a second fan, and the second group of heat sinks may be located on the wind path of the second fan, so that the heat dissipation effect of the second group of heat sinks is improved by the second fan.

[0083] Of course, the electronic device may also include only one of the second group of heat sinks and the second fan. In the case where the electronic device only includes the second fan, the cold end of the heat conductive component 400 may be located in the wind path of the second fan, so as to improve the heat dissipation effect of the cold end of the heat conductive component 400 through the second fan. Alternatively, the electronic device may not include the second group of heat sinks and the second fan, and the cold end of the heat conductive component 400 may directly exchange heat with the air. Here, the cold end of the heat conductive component 400 may be located at a relatively cold position of the electronic device, or the cold end of the heat conductive component may be located at a position where the electronic device can contact with the outside air.

[0084] Here, the structure of the heat conducting component 400 is not limited. For example, the heat conducting component 400 may include a heat pipe component. For another example, the heat conducting component 400 may also include a temperature averaging component, etc. For another example, the heat conducting component 400 may also include a heat pipe component and a temperature averaging component.

[0085] For another example, the heat-conducting component 400 may not have a closed cavity. As an example, the heat-conducting component 400 may be a copper bar, a copper plate, etc. The heat-conducting component 400 can be used to transfer the heat absorbed by the first heat-generating component 510 to other areas. The heat transferred to other areas by the heat-conducting component 400 can be dissipated by the above-mentioned cold end heat dissipation method, which will not be repeated here. However, the present application is not limited to this, that is, those skilled in the art can adjust or set according to specific needs.

[0086] In the embodiment of the present application, the structure of the first heating component 510 is not limited. For example, the first heating component 510 may include electronic components of an electronic device. As an example, the first heating component 510 may be a resistor, a capacitor, an inductor, a diode, a triode, a field effect transistor, a transformer, an integrated circuit, etc. As another example, the first heating component 510 may be a central processing unit (CPU), a graphics processing unit (GPU), a solid state disk (SSD), etc.

[0087] The first surface 410 of the heat-conducting component 400 may be a surface of the heat-conducting component 400 facing the first heat-generating component 510. The shape of the first surface 410 of the heat-conducting component 400 is not limited. For example, the first surface 410 of the heat-conducting component 400 may be a plane. For another example, the first surface 410 of the heat-conducting component 400 may be a curved surface. However, the present application is not limited thereto, that is, those skilled in the art may adjust or set the shape according to specific needs.

[0088] The first heat-generating component 510 may include at least two first heat-generating regions arranged at intervals; the first group of heat exchange channels 110 may include at least two first heat exchange channels 111 arranged at intervals, and the at least two first heat exchange channels 111 arranged at intervals may be correspondingly located between at least two first heat-generating regions and the heat-conducting component 400. By arranging the first heat exchange channel 111 between the first heat-generating region and the heat-conducting component 400, the heat of the first heat-generating region can be quickly taken away by the first heat exchange medium in the first heat exchange channel 111; at the same time, arranging the first heat exchange channel 111 in the first heat-generating region with a higher temperature can also improve the heat dissipation efficiency of the first heat exchange channel 111; in addition, the heat of the first heat-generating component 510 can also be quickly transferred from the region of the first target component 100 located between two adjacent first heat exchange channels 111 to the heat-conducting component 400, so that the heat-conducting component 400 and the first heat exchange medium can simultaneously and quickly dissipate the heat for the first heat-generating component 510, thereby improving the heat transfer efficiency of the first heat-generating component 510 to the heat-conducting component 400.

[0089] The temperature of the first heating area is relatively high, and the manner in which the first heating component 510 has at least two first heating areas arranged at intervals is not limited. For example, the first heating component 510 may include 2 first processing cores arranged at intervals, 4 first processing cores arranged at intervals, 6 first processing cores arranged at intervals, 8 first processing cores arranged at intervals, 10 first processing cores arranged at intervals, 12 first processing cores arranged at intervals, 16 first processing cores arranged at intervals, etc. The temperature of the first heating component 510 corresponding to the first processing core is relatively high, forming a first heating area.

[0090] The number of first heating regions and the number of first heat exchange channels 111 may be the same or different. As an example, the first heating component 510 may include 16 first heating regions arranged at intervals, and the 16 first heating regions arranged at intervals may be arranged in 4 rows and 4 columns; the first group of heat exchange channels 110 may include 4 first heat exchange channels 111 arranged at intervals, and each first heat exchange channel 111 is located on 1 row or 1 column of first heating regions, so that heat is dissipated for 4 first heating regions through one first heat exchange channel 111. However, the present application is not limited to this, that is, those skilled in the art may adjust or set according to specific needs.

[0091] In the embodiment of the present application, at least a portion of the first target component 100 is disposed between the thermally conductive component 400 and the first heat-generating component 510, which may include that the entire first target component 100 is disposed between the thermally conductive component 400 and the first heat-generating component 510, or may include that a portion of the first target component 100 is disposed between the thermally conductive component 400 and the first heat-generating component 510, and a portion of the first target component 100 is not disposed between the thermally conductive component 400 and the first heat-generating component 510.

[0092] As an example, Figures 1 to 3 As shown, the first heat generating component 510 contacts the first side of the first target component 100, the second side of the first target component 100 contacts the first surface side of the heat conducting component 400, and the second side of the first target component 100 is opposite to the first side of the first target component 100. Here, the heat conducting component 400, the first target component 100 and the first heat generating component 510 are stacked together in sequence, which can reduce the occupied space.

[0093] The first target component 100 can be used to dissipate the heat of the first heat-generating component 510 to achieve heat dissipation for the first heat-generating component 510. The first target component 100 can be used to conduct the first part of the heat absorbed by the first heat-generating component 510 to the heat-conducting component 400 to conduct the first part of the heat of the first heat-generating component 510 through the heat-conducting component 400; here, the first target component 100 can achieve heat dissipation based on the thermal conductivity of the material. The first target component 100 can also be used to transfer the first heat exchange medium of the second part of the heat absorbed by the first heat-generating component 510 through the driving member 600 to transfer the second part of the heat of the first heat-generating component 510 through the flowing first heat exchange medium; here, the first target component 100 can achieve heat dissipation based on the first heat exchange medium flowing inside. Here, the heat dissipation performance of the first target component 100 based on the thermal conductivity of the material and the heat dissipation performance based on the flowing first heat exchange medium are not limited. As an example, the heat dissipation performance of the first target component 100 based on the thermal conductivity of the material can be greater than or equal to the heat dissipation performance based on the flowing first heat exchange medium. As yet another example, the heat dissipation performance of the first target component 100 based on the thermal conductivity of the material may be smaller than the heat dissipation performance based on the flowing first heat exchange medium.

[0094] The material of the first target component 100 may have good thermal conductivity. The material of the first target component 100 is not limited. For example, the material of the first target component 100 may be copper, aluminum, etc. However, the present application is not limited thereto, that is, those skilled in the art may adjust or set the material according to specific needs.

[0095] The shape of the first target component 100 is not limited. For example, in some embodiments, the first target component 100 can be a plate-like structure, a block-like structure, etc. The thickness of the first target component 100 is not limited. For example, the thickness of the first target component 100 between the first surface 410 and the first heat-generating component 510 can be less than or equal to 2 mm. The thickness of the first target component 100 can be less than the thickness of the heat-conducting component 400 so that the heat of the first heat-generating component 510 can be quickly transferred to the heat-conducting component 400. For example, in some embodiments, the thickness of the first target component 100 between the first surface 410 and the first heat-generating component 510 can be 1 / 2 of the thickness of the heat-conducting component 400 in the stacking direction of the heat-conducting component 400, the first target component 100, and the first heat-generating component 510. to

[0096] The form of the first heat exchange medium is not limited. For example, the first heat exchange medium can be water, oil, ethylene glycol aqueous solution, liquid metal, etc. However, the present application is not limited thereto, that is, those skilled in the art can adjust or set it according to specific needs.

[0097] During the operation, the first heat exchange medium may remain in a state that remains unchanged; in other words, the first heat exchange medium may not undergo a phase change during the operation. As an example, the first heat exchange medium may remain in a liquid state, a gaseous state, etc. during the operation.

[0098] The number of the first heat exchange channels 111 in the first group of heat exchange channels 110 is not limited. For example, the first group of heat exchange channels 110 may include at least two first heat exchange channels 111, and the at least two first heat exchange channels 111 may be arranged at intervals. The at least two first heat exchange channels 111 arranged at intervals can increase the amount of the first heat exchange medium flowing in the first target component 100, thereby increasing the amount of heat carried away by the first heat exchange medium. At the same time, the heat of the first heat-generating component 510 can also be quickly transferred from the area of ​​the first target component 100 between two adjacent first heat exchange channels 111 to the heat-conducting component 400. As an example, Figures 1 to 3 As shown, the first group of heat exchange channels 110 may include 6 first heat exchange channels 111 arranged at intervals. As another example, the first group of heat exchange channels 110 may include 2 first heat exchange channels 111 arranged at intervals, 3 first heat exchange channels 111 arranged at intervals, 4 first heat exchange channels 111 arranged at intervals, 5 first heat exchange channels 111 arranged at intervals, 8 first heat exchange channels 111 arranged at intervals, 10 first heat exchange channels 111 arranged at intervals, etc. However, the present application is not limited thereto, that is, those skilled in the art may adjust or set the first heat exchange channels 111 according to specific needs.

[0099] The cross-sectional shape of the first heat exchange channel 111 is not limited. Figure 4As shown, the cross section of the first heat exchange channel 111 may be rectangular. Figure 5 As shown, the cross section of the first heat exchange channel 111 may be trapezoidal. Figure 6 As shown, the cross section of the first heat exchange channel 111 may be semicircular, etc. However, the present application is not limited thereto, that is, those skilled in the art may adjust or configure the cross section according to specific requirements.

[0100] The number of layers of the first heat exchange channel 111 in the first target component 100 is not limited. Figures 4 to 7 As shown, the first heat exchange channel 111 in the first target component 100 can be arranged in a single layer. For another example, the first heat exchange channel 111 in the first target component 100 can be arranged in at least two layers. Figure 8 As shown, the first heat exchange channel 111 in the first target component 100 can be arranged in double layers. However, the present application is not limited thereto, that is, those skilled in the art can adjust or set it according to specific needs.

[0101] The cross-sectional dimensions of the first heat exchange channel 111 are not limited. For example, the maximum cross-sectional width of the first heat exchange channel 111 may be less than or equal to 1 mm and greater than or equal to 0.3 mm. As an example, the maximum cross-sectional width of the first heat exchange channel 111 may be equal to 1 mm, 0.9 mm, 0.8 mm, 0.7 mm, 0.6 mm, 0.5 mm, 0.4 mm, 0.3 mm, etc. However, the present application is not limited thereto, that is, those skilled in the art may adjust or set the same according to specific needs.

[0102] The cross-sectional arrangement direction of the first heat exchange channel 111 is not limited. For example, the cross-sectional minimum width direction of the first heat exchange channel 111 can be the same as the direction in which the heat conduction component 400, the first target component 100 and the first heat generating component 510 are stacked, so that the first heat exchange channel 111 can be conveniently arranged in the first target component 100 with a relatively thin thickness. As an example, Figures 1 to 3 As shown, the cross section of the first heat exchange channel 111 may be rectangular, and the short side of the cross section of the first heat exchange channel 111 may be in the same direction as the stacking direction of the heat conduction component 400 , the first target component 100 and the first heat generating component 510 .

[0103] In the embodiment of the present application, the structure of the functional component 520 is not limited. The structure of the functional component 520 may be the same as or different from the structure of the first heating component 510. For example, the functional component 520 may include electronic components of an electronic device. As an example, the functional component 520 may be a resistor, a capacitor, an inductor, a diode, a triode, a field effect transistor, a transformer, an integrated circuit, etc. As another example, the functional component 520 may be a CPU, a GPU, an SSD, etc. For another example, the functional component 520 may be a frame structure, a bracket structure, a connection structure, etc. of an electronic device. As an example, the functional component 520 may be a middle frame structure of an electronic device.

[0104] The functional component 520 may or may not generate heat. When the functional component 520 generates heat, the heat generated by the functional component 520 may be removed by the heat conducting component 400. Of course, the heat generated by the functional component 520 may also be removed by air; or, the heat generated by the functional component 520 may also be removed by other heat exchange structures.

[0105] The functional component 520 may be entirely disposed on the first surface side of the heat conducting component 400 , or may be partially disposed on the first surface side of the heat conducting component 400 .

[0106] The functional component 520 is located at a position that limits the movement of the heat-conducting component 400 toward the first heat-generating component 510; in other words, based on the limiting effect of the functional component 520 on the heat-conducting component 400, the heat-conducting component 400 cannot move toward the first heat-generating component 510 to contact the first heat-generating component 510, so that the heat of the first heat-generating component 510 needs to pass through the first target component 100 to be conducted.

[0107] The functional component 520 does not limit the way in which the heat conducting component 400 is limited. Figure 1 , Figure 2 and Figure 3 As shown, the functional component 520 may be entirely disposed on the first surface side of the heat conductive component 400, and the functional component 520 contacts the heat conductive component 400. For another example, a portion of the functional component 520 may be disposed on the first surface side of the heat conductive component 400, and the functional component 520 contacts a portion of the heat conductive component 400. As an example, the functional component 520 contacts the first surface side of the heat conductive component 400.

[0108] In some embodiments, the heat conductive component 400 may include a first area and a second area, the area of ​​the first heat-generating component 510 projected toward the heat conductive component 400 is the first area, the area of ​​the functional component 520 projected toward the heat conductive component 400 is the second area, the projection direction of the first heat-generating component 510 toward the heat conductive component 400 is the first direction, the projection direction of the functional component 520 toward the heat conductive component 400 is the second direction, the first direction and the second direction may be the same, and the first area of ​​the heat conductive component 400 and the second area of ​​the heat conductive component 400 may satisfy a coplanar condition in the first direction.

[0109] Of course, in other embodiments, the first direction and the second direction may also be different, and the first region of the heat conducting component 400 and the second region of the heat conducting component 400 may not satisfy the coplanar condition in the first direction.

[0110] Here, the first region and the second region may be different regions of the first surface, the first region and the second region may both be planar structures, or the first region and the second region may both be curved structures.

[0111] Here, the coplanar condition can be coplanar or substantially coplanar, based on the first area of ​​the thermal conductive component 400 and the second area of ​​the thermal conductive component 400 being coplanar or substantially coplanar in the first direction, the functional component 520 and the first heat-generating component 510 are substantially in contact with the thermal conductive component 400 at the same level; in other words, the thermal conductive component 400 may not be bent toward the first heat-generating component 510 side or the functional component 520 side in the corresponding area from the first area to the second area, and the thermal conductive component 400 may be substantially located at the same level in the corresponding area from the first area to the second area.

[0112] In the embodiment of the present application, the structure of the driving member 600 is not limited, as long as the driving member 600 can drive the first heat exchange medium to flow in the first group of heat exchange channels 110 to increase the speed at which the first heat exchange medium takes away heat. For example, the driving member 600 can be a pump, and correspondingly, the first heat exchange medium can be water, oil, ethylene glycol aqueous solution, etc. Here, the driving member 600 can be connected to the first group of heat exchange channels 110 through a pipeline to drive the first heat exchange medium to circulate in the first group of heat exchange channels 110 and the driving member 600. For another example, the driving member 600 can be an electromagnetic pump, and correspondingly, the first heat exchange medium can be liquid metal; the electromagnetic pump can drive the liquid metal to flow. However, the present application is not limited to this, that is, those skilled in the art can adjust or set it according to specific needs.

[0113] In some optional implementations of the embodiments of the present application, the electronic device may further include: an outlet channel 710 and an inlet channel 720. The outlet channel 710 is connected to the outlet of the driver 600; the inlet channel 720 is connected to the inlet of the driver 600; the first group of heat exchange channels 110 are respectively connected to the outlet channel 710 and the inlet channel 720, and the driver 600 is used to drive the first heat exchange medium to circulate in the outlet channel 710, the first group of heat exchange channels 110 and the inlet channel 720; so that the first heat exchange medium can quickly take away the heat conducted from the first heat-generating component 510 to the first target component 100.

[0114] In this implementation, the cross-sectional area of ​​the outlet channel 710 is not limited. As an example, the first group of heat exchange channels 110 may include at least two first heat exchange channels 111; the cross-sectional area of ​​the outlet channel 710 is greater than the cross-sectional area of ​​the first heat exchange channel 111; here, at least two first heat exchange channels 111 may be connected to the outlet channel 710, so that the cross-sectional area of ​​a single first heat exchange channel 111 can be reduced, which can facilitate the arrangement of the first heat exchange channel 111 in the first target component 100, and can increase the total cross-sectional area of ​​the first heat exchange channel 111 in the first target component 100 through at least two first heat exchange channels 111.

[0115] In this implementation, the cross-sectional area of ​​the inlet channel 720 is not limited. As an example, the first group of heat exchange channels 110 may include at least two first heat exchange channels 111; the cross-sectional area of ​​the inlet channel 720 is greater than the cross-sectional area of ​​the first heat exchange channel 111; here, at least two first heat exchange channels 111 may be connected to the inlet channel 720, so that the cross-sectional area of ​​a single first heat exchange channel 111 can be reduced, which can facilitate the arrangement of the first heat exchange channel 111 in the first target component 100, and can increase the total cross-sectional area of ​​the first heat exchange channel 111 in the first target component 100 through at least two first heat exchange channels 111.

[0116] In this implementation, if Figure 3 As shown, the driving member 600 and the first target component 100 may be spaced apart. Here, the driving member 600 may not be in the stacking direction of the first heat-generating component 510, the first target component 100 and the heat-conducting component 400. In other words, the driving member 600 may not occupy the space in the stacking direction of the first heat-generating component 510, the first target component 100 and the heat-conducting component 400. By spacing the driving member 600 and the first target component 100 apart, the space occupied by the driving member 600 in the stacking direction of the first heat-generating component 510, the first target component 100 and the heat-conducting component 400 can be reduced, thereby reducing the thickness of the electronic device in the stacking direction of the first heat-generating component 510, the first target component 100 and the heat-conducting component 400.

[0117] The stacking direction of the first heat generating component 510, the first target component 100 and the heat conducting component 400 may be as follows: Figures 1 to 3 A direction as shown. The stacking direction of the first heat-generating component 510, the first target component 100 and the heat-conducting component 400 may be the thickness direction of the first heat-generating component 510. The stacking direction of the first heat-generating component 510, the first target component 100 and the heat-conducting component 400 may also be the thickness direction of the first target component 100. The stacking direction of the first heat-generating component 510, the first target component 100 and the heat-conducting component 400 may also be the thickness direction of the heat-conducting component 400. By stacking the first heat-generating component 510, the first target component 100 and the heat-conducting component 400 together in the thickness direction, the setting size of the electronic device in the stacking direction of the first heat-generating component 510, the first target component 100 and the heat-conducting component 400 can be greatly reduced. For example, the size of the electronic device in the stacking direction of the first heat generating component 510, the first target component 100 and the heat conducting component 400 can be relatively fixed or as small as possible. By stacking the first heat generating component 510, the first target component 100 and the heat conducting component 400 together in the thickness direction, the size requirement of the sub-device in the stacking direction of the first heat generating component 510, the first target component 100 and the heat conducting component 400 can be achieved. Of course, in other examples, the driving member 600 can also be located in the stacking direction of the first heat generating component 510, the first target component 100 and the heat conducting component 400.

[0118] In this implementation, if Fig.11bAs shown, the electronic device may further include a second heat generating component 530 , a second target component 200 , a first sub-channel 750 , and a second sub-channel 760 . At least a portion of the second target component 200 can be arranged between the heat-conducting component 400 and the second heat-generating component 530, and the second target component 200 can be used to transfer the heat of the second heat-generating component 530 to the heat-conducting component 400; the second target component 200 can have a second group of heat exchange channels 210; the second group of heat exchange channels 210 can be connected to the inlet channel 720; the first sub-channel 750 can be connected to the outlet channel 710 and the first group of heat exchange channels 110 respectively; the second sub-channel 760 can be connected to the outlet channel 710 and the second group of heat exchange channels 210 respectively; thereby, the driving member 600 drives the first heat exchange medium of the first group of heat exchange channels 110 to flow, so as to quickly dissipate heat for the first heat-generating component 510 through the first target component 100, and drives the first heat exchange medium of the second group of heat exchange channels 210 to flow, so as to quickly dissipate heat for the second heat-generating component 530 through the second target component 200. At the same time, the first heat exchange medium flowing out of the outlet channel 710 flows to the first group of heat exchange channels 110 and the second group of heat exchange channels 210 in parallel to take away the heat of the first heating component 510 and the second heating component 530, so that the heat of the first heating component 510 and the second heating component 530 does not affect each other.

[0119] Of course, in other implementations, the first heat exchange medium flowing out of the outlet channel 710 may also flow through the first group of heat exchange channels 110 and the second group of heat exchange channels 210 in sequence. Fig.11a Alternatively, the first heat exchange medium flowing out of the outlet channel 710 may also flow through the second group of heat exchange channels 210 and the first group of heat exchange channels 110 in sequence. However, the present application is not limited thereto, that is, those skilled in the art may adjust or set the same according to specific needs.

[0120] The structure of the second heat generating component 530 is not limited. For example, the second heat generating component 530 may include electronic components of an electronic device. As an example, the second heat generating component 530 may be a resistor, a capacitor, an inductor, a diode, a triode, a field effect transistor, a transformer, an integrated circuit, etc. As another example, the second heat generating component 530 may be a CPU, a GPU, an SSD, etc.

[0121] The second heat generating component 530 may be disposed on the first surface 410 side of the heat conducting component 400, or may not be disposed on the first surface 410 side of the heat conducting component 400. Fig. 9As shown, the second heat generating component 530 may be disposed on the first surface 410 side of the heat conducting component 400, where the stacking direction of the heat conducting component 400, the second target component 200 and the second heat generating component 530 may be the same as the stacking direction of the heat conducting component 400, the first target component 100 and the first heat generating component 510, so as to reduce the setting size of the electronic device in the stacking direction of the heat conducting component 400, the first target component 100 and the first heat generating component 510. However, the present application is not limited thereto, that is, those skilled in the art may adjust or set the same according to specific needs.

[0122] like Fig. 9 As shown, there may be a first distance H1 between the first heat generating component 510 and the heat conducting component 400, and there may be a second distance H2 between the second heat generating component 530 and the heat conducting component 400; the first distance H1 and the second distance H2 may be the same or different. As an example, the first distance H1 may be greater than the second distance H2 or less than the second distance H2.

[0123] In the embodiment of the present application, at least a portion of the second target component 200 is disposed between the thermally conductive component 400 and the second heat-generating component 530, which may include that the entire second target component 200 is disposed between the thermally conductive component 400 and the second heat-generating component 530, or may include that a portion of the second target component 200 is disposed between the thermally conductive component 400 and the second heat-generating component 530, and a portion of the second target component 200 is not disposed between the thermally conductive component 400 and the second heat-generating component 530.

[0124] The second target component 200 can be used to conduct heat. The material of the second target component 200 has good thermal conductivity. The material of the second target component 200 is not limited. For example, the material of the second target component 200 can be copper, aluminum, etc. However, the present application is not limited thereto, that is, those skilled in the art can adjust or set according to specific needs.

[0125] The number of the second heat exchange channels 211 in the second group of heat exchange channels 210 is not limited. For example, the second group of heat exchange channels 210 may include at least two second heat exchange channels 211, and at least two second heat exchange channels 211 may be arranged at intervals. The amount of the first heat exchange medium flowing in the second target component 200 can be increased by at least two second heat exchange channels 211 arranged at intervals, thereby increasing the heat taken away by the first heat exchange medium. As an example, the second group of heat exchange channels 210 may include 6 second heat exchange channels 211 arranged at intervals. As another example, the second group of heat exchange channels 210 may include 2 second heat exchange channels 211 arranged at intervals, 3 second heat exchange channels 211 arranged at intervals, 4 second heat exchange channels 211 arranged at intervals, 5 second heat exchange channels 211 arranged at intervals, 8 second heat exchange channels 211 arranged at intervals, 10 second heat exchange channels 211 arranged at intervals, etc. However, the present application is not limited thereto, that is, those skilled in the art can adjust or set according to specific needs.

[0126] The cross-sectional shape of the second heat exchange channel 211 is not limited. For example, the cross-sectional shape of the second heat exchange channel 211 may be rectangular. For another example, the cross-sectional shape of the second heat exchange channel 211 may be trapezoidal. For another example, the cross-sectional shape of the second heat exchange channel 211 may be semicircular, etc. However, the present application is not limited thereto, that is, those skilled in the art may adjust or set the shape according to specific needs.

[0127] The number of layers of the second heat exchange channel 211 in the second target component 200 is not limited. For example, the second heat exchange channel 211 in the second target component 200 can be arranged in a single layer. For another example, the second heat exchange channel 211 in the second target component 200 can be arranged in at least two layers. As an example, the second heat exchange channel 211 in the second target component 200 can be arranged in a double layer. However, the present application is not limited thereto, that is, those skilled in the art can adjust or set according to specific needs.

[0128] The cross-sectional dimensions of the second heat exchange channel 211 are not limited. For example, the maximum cross-sectional width of the second heat exchange channel 211 may be less than or equal to 1 mm and greater than or equal to 0.3 mm. As an example, the maximum cross-sectional width of the second heat exchange channel 211 may be equal to 1 mm, 0.9 mm, 0.8 mm, 0.7 mm, 0.6 mm, 0.5 mm, 0.4 mm, 0.4 mm, etc. However, the present application is not limited thereto, that is, those skilled in the art may adjust or set the same according to specific needs.

[0129] The direction in which the cross section of the second heat exchange channel 211 is set is not limited. For example, the direction of the minimum width of the cross section of the second heat exchange channel 211 can be the same as the direction in which the heat conduction component 400, the second target component 200, and the second heat generating component 530 are stacked, so as to facilitate the second heat exchange channel 211 to be set in the second target component 200. As an example, the cross section of the second heat exchange channel 211 is rectangular, and the short side of the cross section of the second heat exchange channel 211 is the same as the direction in which the heat conduction component 400, the second target component 200, and the second heat generating component 530 are stacked.

[0130] The cross-sectional areas of the first sub-channel 750 and the second sub-channel 760 are different. For example, the cross-sectional area of ​​the first sub-channel 750 may be greater than or equal to the cross-sectional area of ​​the second sub-channel 760. For another example, the cross-sectional area of ​​the first sub-channel 750 may also be smaller than the cross-sectional area of ​​the second sub-channel 760.

[0131] The first sub-channel 750 may be a single channel or a plurality of channels. As an example, the first sub-channel 750 may include at least two first channels, and the number of the at least two first channels may be the same as the number of the first heat exchange channels 111 in the first group of heat exchange channels 110, so that each first channel is connected to a corresponding first heat exchange channel 111.

[0132] The second sub-channel 760 may be a single channel or a plurality of channels. As an example, the second sub-channel 760 may include at least two second channels, and the number of the at least two second channels may be the same as the number of the second heat exchange channels 211 in the second group of heat exchange channels 210, so that each second channel is connected to a corresponding second heat exchange channel 211.

[0133] The first group of heat exchange channels 110 may also be connected to the introduction channel 720 through at least two third channels, and the number of the third channels may be the same as the number of the first heat exchange channels 111 in the first group of heat exchange channels 110 .

[0134] The second group of heat exchange channels 210 may also be connected to the introduction channel 720 through at least two fourth channels, and the number of the fourth channels may be the same as the number of the second heat exchange channels 211 in the second group of heat exchange channels 210 .

[0135] In this implementation, the electronic device may further include: a first valve body, a second valve body, and a controller. The first valve body may be disposed in the first sub-channel 750; the second valve body may be disposed in the second sub-channel 760; the controller may be electrically connected to the first valve body and the second valve body, respectively; and the controller may be used to control the working states of the first valve body and the second valve body based on the temperatures of the second heating component 530 and the first heating component 510.

[0136] The first valve body may have a working state of connecting or disconnecting the first sub-channel 750, and may also have a function of controlling the flow rate of the first heat exchange medium in the first sub-channel 750. The structure of the first valve body is not limited. For example, the first valve body may be a gate valve, a stop valve, a ball valve, a butterfly valve, a regulating valve, a solenoid valve, a hydraulic valve, etc.

[0137] The second valve body may have a working state of connecting or disconnecting the second sub-channel 760, and may also have a function of controlling the flow rate of the first heat exchange medium in the second sub-channel 760. The structure of the second valve body is not limited. For example, the second valve body may be a gate valve, a stop valve, a ball valve, a butterfly valve, a regulating valve, a solenoid valve, a hydraulic valve, etc.

[0138] Of course, in some other examples, the electronic device may include only one of the first valve body and the second valve body; or, the electronic device may not include the first valve body and the second valve body.

[0139] The manner in which the controller is used to control the working state of the first valve body and the second valve body based on the temperature of the second heat-generating component 530 and the first heat-generating component 510 is not limited. For example, when the temperature of the first heat-generating component 510 is greater than the first set value, the controller can be used to control the second valve body to be in a working state of disconnecting the second sub-channel 760, or to control the second valve body to reduce the flow of the first heat exchange medium in the second sub-channel 760, or to control the first valve body to increase the flow of the first heat exchange medium in the first sub-channel 750, so that more of the first heat exchange medium flows to the first group of heat exchange channels 110, so as to quickly cool down the first heat-generating component 510. The first set value is not limited. For example, the first set value can be 50 degrees, 55 degrees, 60 degrees, 70 degrees, etc. For another example, when the temperature of the second heating component 530 is greater than the second set value, the controller can be used to control the first valve body to be in a working state of disconnecting the first sub-channel 750, or to control the first valve body to reduce the flow of the first heat exchange medium of the first sub-channel 750, or to control the second valve body to increase the flow of the first heat exchange medium of the second sub-channel 760, so that more first heat exchange medium flows to the second group of heat exchange channels 210, so as to quickly cool down the second heating component 530. The second set value is not limited. For example, the second set value can be 50 degrees, 55 degrees, 60 degrees, 70 degrees, etc.

[0140] The second heat-generating component 530 may include at least two second heat-generating regions arranged at intervals; the second group of heat exchange channels 210 may include at least two second heat exchange channels 211 arranged at intervals, and the at least two second heat exchange channels 211 arranged at intervals may be correspondingly located between at least two second heat-generating regions and the heat-conducting component 400. By arranging the second heat exchange channels 211 between the second heat-generating regions and the heat-conducting component 400, the heat of the second heat-generating regions can be quickly taken away by the first heat exchange medium in the second heat exchange channels 211; at the same time, arranging the second heat exchange channels 211 in the second heat-generating region with a higher temperature can also improve the heat dissipation efficiency of the second heat exchange channels 211; in addition, the heat of the second heat-generating component 530 can also be quickly transferred from the region of the second target component 200 located between two adjacent second heat exchange channels 211 to the heat-conducting component 400, so that the heat-conducting component 400 and the first heat exchange medium can simultaneously and quickly dissipate the heat of the second heat-generating component 530, thereby improving the heat transfer efficiency of the second heat-generating component 530 to the heat-conducting component 400 and the first heat exchange medium.

[0141] The second heating area is an area where the temperature of the second heating component 530 is relatively high. The manner in which the second heating component 530 has at least two second heating areas arranged at intervals is not limited. For example, the second heating component 530 may include 2 second processing cores arranged at intervals, 4 second processing cores arranged at intervals, 6 second processing cores arranged at intervals, 8 second processing cores arranged at intervals, 10 second processing cores arranged at intervals, 12 second processing cores arranged at intervals, 16 second processing cores arranged at intervals, etc. The temperature of the area corresponding to the second heating component 530 and the second processing core is higher, forming a second heating area.

[0142] The number of the second heating regions and the number of the second heat exchange channels 211 may be the same or different. As an example, the second heating component 530 may include 16 second heating regions arranged at intervals, and the 16 second heating regions arranged at intervals may be arranged in 4 rows and 4 columns; the second group of heat exchange channels 210 may include 4 second heat exchange channels 211 arranged at intervals, and each second heat exchange channel 211 is located on 1 row or 1 column of second heating regions, so that heat is dissipated for 4 second heating regions through one second heat exchange channel 211. However, the present application is not limited thereto, that is, those skilled in the art may adjust or set according to specific needs.

[0143] In some optional implementations of the embodiments of the present application, the electronic device may further include a first group of heat sinks 810 and a connecting pipe 730. At least a portion of the connecting pipe 730 may be disposed on the first group of heat sinks 810, and the connecting pipe 730 may be connected to the first group of heat exchange channels 110 and the inlet of the driving member 600, respectively; the driving member 600 may be used to drive the first heat exchange medium to circulate in the first group of heat exchange channels 110 and the connecting pipe 730; thus, the heat of the first heat-generating component 510 absorbed by the first heat exchange medium may be quickly taken away through the first group of heat sinks 810, thereby improving the efficiency of the first heat exchange medium in dissipating heat for the first heat-generating component 510.

[0144] In this implementation, the first heat exchange medium with a relatively high temperature is introduced to the first group of heat sinks 810 through the connecting pipe 730. Since the first group of heat sinks 810 has a strong heat dissipation capacity, the heat of the first heat exchange medium with a relatively high temperature can be quickly dissipated to form a first heat exchange medium with a relatively low temperature. The first heat exchange medium with a relatively low temperature is then driven to the first group of heat exchange channels 110 through the driving member 600 to absorb the heat of the first heat-generating component 510 again. Such a cycle can enable the first heat exchange medium to continuously take away the heat of the first heat-generating component 510.

[0145] In this implementation, the structure of the first group of heat sinks 810 is not limited. For example, the first group of heat sinks 810 may include at least two first heat sinks, and a portion of the connecting tube 730 may be disposed on the at least two first heat sinks to increase the contact area between the connecting tube 730 and the at least two first heat sinks. As an example, the first group of heat sinks 810 may include a water cooling row, heat sink fins, etc.

[0146] In this implementation, the second electronic device may further include: a first fan 820 , and the first group of heat sinks 810 may be located on the wind path of the first fan 820 , so that the heat dissipation effect of the first group of heat sinks 810 is improved by the first fan 820 .

[0147] Of course, the electronic device may also include only one of the first group of heat sinks 810 and the first fan 820. In the case where the electronic device only includes the first fan 820, the connecting pipe 730 may be located on the wind path of the first fan 820, so as to improve the heat dissipation effect of the first heat exchange medium through the first fan 820. Alternatively, the electronic device may not include the first group of heat sinks 810 and the first fan 820, and the connecting pipe 730 may directly exchange heat with the air. Here, the connecting pipe 730 may be located at a relatively cool position of the electronic device, or the connecting pipe 730 may be located at a position where the electronic device can contact with the outside air.

[0148] When the electronic device includes a first group of heat sinks 810 and a second group of heat sinks, the first group of heat sinks 810 and the second group of heat sinks can be the same structural component or different structural components; when the electronic device includes a first fan 820 and a second fan, the first fan 820 and the second fan can be the same structural component or different structural components.

[0149] In this implementation, the electronic device may further include a filter 740, and the filter 740 is used to filter impurities in the first heat exchange medium; the location of the filter 740 is not limited. The number of filters 740 is not limited. As an example, Fig.10 As shown, the electronic device may further include an outlet channel 710 and an inlet channel 720; the outlet channel 710 may be connected to the first group of heat exchange channels 110, the first group of heat exchange channels 110 may be connected to the connecting pipe 730, the connecting pipe 730 may lead the first heat exchange medium to the first group of heat sinks 810, thereby taking away the heat of the first heat exchange medium through the first group of heat sinks 810, and the connecting pipe 730 may be connected to the inlet channel 720; here, two filters 740 may be respectively arranged on the outlet channel 710 and the inlet channel 720, of course, one of the two filters 740 may also be arranged on the connecting pipe 730; or, the electronic device may also be provided with a filter 740. However, the present application is not limited thereto, that is, those skilled in the art may adjust or set according to specific needs.

[0150] In this implementation, when the electronic device includes a second heat generating component 530 , the first group of heat sinks 810 can also quickly remove the heat of the second heat generating component 530 absorbed by the first heat exchange medium, thereby improving the efficiency of the first heat exchange medium in dissipating heat for the second heat generating component 530 .

[0151] As an example, Fig.11a As shown, the outlet channel 710 is in communication with the first group of heat exchange channels 110, the first group of heat exchange channels 110 is in communication with the second group of heat exchange channels 210, the connecting pipe 730 is in communication with the second group of heat exchange channels 210 and the inlet channel 720 respectively, and the connecting pipe 730 leads the first heat exchange medium to the two first groups of heat sinks 810 so as to dissipate heat for the first heat exchange medium through the two first groups of heat sinks 810. The two first groups of heat sinks 810 can dissipate heat through two first fans 820 respectively.

[0152] Of course, in other implementations, the electronic device may not include the first group of heat sinks 810. As an example, the first heat exchange medium can be used to bring the heat of the first heating component 510 to the area of ​​the electronic device with lower temperature, so as to reduce the local high temperature of the electronic device in the area of ​​the first heating component 510, so that the first heating component 510 can work better. As another example, the electronic device may also include a heat conductor, and the heat conductor may have a heat conduction channel, and the heat conduction channel may be connected to the first group of heat exchange channels 110 through a connecting pipe 730, so as to dissipate heat for the first heat exchange medium through the heat conductor. Here, the heat conductor may contact the heat conduction component 400, and the heat conductor and the first target component 100 may contact different areas of the heat conduction component 400. Of course, the heat conductor may also be in the wind path of the electronic device. Alternatively, part of the surface of the heat conductor may also be in an exposed state, so that part of the surface of the heat conductor can directly exchange heat with the outside air. However, the present application is not limited to this, that is, those skilled in the art can adjust or set according to specific needs.

[0153] In some optional implementations of the embodiments of the present application, the first portion 120 of the first target component 100 may be located between the first heat-generating component 510 and the first surface 410 of the heat-conducting component 400; the second portion 130 of the first target component 100 may be in contact with at least one side of the heat-conducting component 400; the side of the heat-conducting component 400 may be arranged adjacent to the first surface 410 of the heat-conducting component 400; the contact between the second portion 130 of the first target component 100 and at least one side of the heat-conducting component 400 can increase the contact area between the first target component 100 and the heat-conducting component 400, thereby enabling more heat from the first heat-generating component 510 to be transferred to the heat-conducting component 400, thereby improving the ability of the heat-conducting component 400 to dissipate heat for the first heat-generating component 510.

[0154] Of course, in other implementations, such as Fig.13 As shown, the first target component 100 may also not include the second portion 130. Here, the electronic device may be provided with at least two heat conducting components 400 to improve the heat dissipation capability of the heat conducting components 400 by increasing the contact area between the heat conducting components 400 and the first target component 100.

[0155] In this implementation, the second portion 130 of the first target component 100 may contact one side surface of the heat conductive component 400, or may contact two side surfaces of the heat conductive component 400. As an example, Fig.12 As shown, the second portion 130 of the first target component 100 contacts the two side surfaces of the heat-conducting component 400; here, the two side surfaces of the heat-conducting component 400 may be located in the width direction of the heat-conducting component 400, and the first heat-generating component 510 and the functional component 520 may be spaced or adjacently arranged in the length direction of the heat-conducting component 400. Here, Fig.12 The portion in the dotted line frame may be the first portion 120 of the first target component 100 .

[0156] In the present implementation, the location of the first group of heat exchange channels 110 is not limited. For example, the first group of heat exchange channels 110 may be only provided in the second portion 130 of the first target component 100. Here, the first portion 120 of the first target component 100 may not be provided with the first group of heat exchange channels 110, so that the first portion 120 of the first target component 100 may be provided thinner. For another example, the first group of heat exchange channels 110 may also be provided in both the first portion 120 of the first target component 100 and the second portion 130 of the first target component 100; thereby, the setting volume of the first group of heat exchange channels 110 can be greatly increased, so that the ability of the first heat exchange medium to dissipate heat for the first heat-generating component 510 can be greatly improved. As an example, if Fig.12 As shown, the first part 120 of the first target component 100 and the second part 130 of the first target component 100 may have at least two first heat exchange channels 111 arranged in multiple layers; here, the shape of the at least two first heat exchange channels 111 arranged in multiple layers is not limited. For example, at least two first heat exchange channels 111 may be arranged in a U-shape and surrounded by the outer peripheral side of the part of the heat conduction component 400, so that the heat dissipation capacity of the first heat exchange medium can be improved by increasing the area of ​​the first heat exchange channel 111, and the heat dissipation capacity of the heat conduction component 400 can be improved by increasing the area of ​​the first target component 100 located in the adjacent first heat exchange channel 111. Of course, in other examples, the first group of heat exchange channels 110 may also be only provided in the first part 120 of the first target component 100.

[0157] As an example, Fig.12 As shown, the first portion 120 of the first target component 100 and the second portion 130 of the first target component 100 form a receiving groove 140, and at least a portion of the thermal conductive component 400 is located in the receiving groove 140, so that the second portion 130 of the first target component 100 contacts two side surfaces of the thermal conductive component 400, so as to increase the contact area between the first target component 100 and the thermal conductive component 400.

[0158] In this implementation, the height of the second portion 130 of the first target component 100 protruding from the first surface 410 of the heat-conducting component 400 is not limited. For example, the height of the second portion 130 of the first target component 100 protruding from the first surface 410 of the heat-conducting component 400 can be less than or equal to the thickness of the heat-conducting component 400, so that the second portion 130 of the first target component 100 does not increase the size of the electronic device in the stacking direction of the heat-conducting component 400, the first target component 100 and the first heat-generating component 510, thereby achieving the thinning and lightening of the electronic device in the stacking direction of the heat-conducting component 400, the first target component 100 and the first heat-generating component 510. As an example, Fig.12 As shown, the height of the second portion 130 of the first target component 100 protruding from the first surface 410 of the thermally conductive component 400 can be equal to the thickness of the thermally conductive component 400, so that the second portion 130 of the first target component 100 does not increase the size of the electronic device in the stacking direction of the thermally conductive component 400, the first target component 100 and the first heat-generating component 510, and the contact area between the second portion 130 of the first target component 100 and the thermally conductive component 400 is maximized.

[0159] In some optional implementations of the embodiments of the present application, the electronic device may include: a first body 910, which may have a accommodating space 911; a first heat-generating component 510, a first target component 100, a heat-conducting component 400, a functional component 520 and a driving member 600 may be arranged in the accommodating space 911; so that the first body 910 can make the electronic device as a whole more tidy, and at the same time, the first body 910 can also protect the first heat-generating component 510, the first target component 100, the heat-conducting component 400, the functional component 520 and the driving member 600.

[0160] In this implementation, the structure of the first body 910 is not limited. Fig.14 As shown, the first body 910 may be a plate-like structure. For another example, the first body 910 may be a block-like structure, a spherical structure, etc. As an example, the first body 910 may be a housing of a mobile phone, a housing of a tablet computer, or a body where a keyboard of a notebook computer is located.

[0161] In this implementation, if Fig.14As shown, the first heat generating component 510, the first target component 100 and the heat conducting component 400 can be stacked in the receiving space 911 in the thickness direction of the first body 910, so as to reduce the size of the first body 910 in the thickness direction. Here, the thickness direction of the first body 910 and the stacking direction of the first heat generating component 510, the first target component 100 and the heat conducting component 400 can be the same, and the thickness direction of the first body 910 can be the A direction. Of course, the first heat generating component 510, the first target component 100 and the heat conducting component 400 can also be stacked in the receiving space 911 in other directions of the first body 910.

[0162] In this implementation, if Fig.14 As shown, the first heat generating component 510 and the functional component 520 can be arranged in the accommodation space 911 along the third direction, wherein the third direction may be different from the thickness direction of the first body 910. Here, by arranging the functional component 520 in the thickness direction of the non-first body 910, the space occupied by the functional component 520 in the thickness direction of the first body 910 can be reduced, thereby achieving the lightness and thinness of the first body 910. As an example, the third direction may be perpendicular to the thickness direction of the first body 910. Here, the functional component 520 does not occupy the space of the first body 910 in the thickness direction of the first body 910, thereby achieving the lightness and thinness of the first body 910. Of course, the third direction may not be perpendicular to the thickness direction of the first body 910; or, the third direction may be the same as the thickness direction of the first body 910.

[0163] In this implementation, the driver 600 and the first target component 100 may be arranged in the accommodation space 911 along the fourth direction, wherein the fourth direction may be different from the thickness direction of the first body 910. Here, by arranging the driver 600 in the thickness direction of the non-first body 910, the space occupied by the driver 600 in the thickness direction of the first body 910 can be reduced, thereby achieving the lightness and thinness of the first body 910. As an example, the fourth direction may be perpendicular to the thickness direction of the first body 910. Here, the driver 600 does not occupy the space of the first body 910 in the thickness direction of the first body 910, thereby achieving the lightness and thinness of the first body 910. Of course, the fourth direction may not be perpendicular to the thickness direction of the first body 910; or, the fourth direction may be the same as the thickness direction of the first body 910.

[0164] In the present implementation, the first group of heat exchange channels 110 may include at least two first heat exchange channels 111; the size of the first heat exchange channel 111 in the fifth direction may be greater than the size of the first heat exchange channel 111 in the thickness direction of the first body 910; wherein the fifth direction may be different from the thickness direction of the first body 910. Here, the fifth direction may be a thickness direction other than the first body 910. By setting the minimum size of the first heat exchange channel 111 in the thickness direction of the first body 910, the space occupied by the first heat exchange channel 111 in the thickness direction of the first body 910 can be reduced, thereby facilitating the formation of the first heat exchange channel 111 on the first target component 100. Here, the fifth direction may be perpendicular to the thickness direction of the first body 910. Of course, in other examples, the size of the first heat exchange channel 111 in the fifth direction may also be less than or equal to the size of the first heat exchange channel 111 in the thickness direction of the first body 910. As an example, Fig.14 As shown, the cross section of the first heat exchange channel 111 is rectangular, and the direction of the short side of the rectangular cross section may be the same as the thickness direction of the first body 910 .

[0165] In this implementation, the size of the heat-conducting component 400 in the sixth direction may be greater than the size of the heat-conducting component 400 in the thickness direction of the first body 910, wherein the sixth direction may be different from the thickness direction of the first body 910, and here, the sixth direction may be a thickness direction other than the first body 910, and the space occupied by the heat-conducting component 400 in the thickness direction of the first body 910 may be reduced by setting the minimum size of the heat-conducting component 400 in the thickness direction of the first body 910. Here, the sixth direction may be perpendicular to the thickness direction of the first body 910. Of course, in other examples, the size of the heat-conducting component 400 in the sixth direction may also be less than or equal to the size of the heat-conducting component 400 in the thickness direction of the first body 910. As an example, the thickness direction of the heat-conducting component 400 and the thickness direction of the first body 910 may be the same.

[0166] The minimum dimensions of the heat conducting component 400 and the first group of heat exchange channels 110 may both be set in the thickness direction of the first body 910. Of course, the minimum dimensions of only one of the heat conducting component 400 and the first group of heat exchange channels 110 may also be set in the thickness direction of the first body 910.

[0167] In this implementation, the electronic device may further include: an input component, which may be disposed on the outside of the first body 910 ; so as to input information through the input component.

[0168] The structure of the input component is not limited. For example, the input component can be an input screen, a handwriting screen, a physical keyboard, etc., so that the user can input information outside the first body 910.

[0169] In this implementation, the electronic device may further include: a first display component, which may be disposed on the outside of the first body so that information of the electronic device may be displayed through the first display component.

[0170] The structure of the first display component is not limited. For example, the first display component can be a display, an organic light emitting diode, etc.

[0171] In this implementation, the first body may include both the first display component and the input component, or may include only one of the first display component and the input component.

[0172] In this implementation, the electronic device may further include: a second body. The second body may be rotatably connected to the first body 910, so that the electronic device may be an openable and closable device.

[0173] The structure of the second body is not limited. For example, the second body can be a plate-like structure. For another example, the second body can be a block-like structure, a spherical structure, etc. As an example, the second body can be a housing of a mobile phone or a body where a display of a laptop computer is located.

[0174] In this implementation, the electronic device may further include: a second display component, and the second display component may be disposed outside the second body so that information of the electronic device may be displayed through the second display component.

[0175] The structure of the second display component is not limited. For example, the second display component can be a display, an organic light emitting diode, etc.

[0176] As an example, the electronic device may include a first body 910, a second body, an input component, and a second display component, and the electronic device is similar to a foldable mobile phone, a laptop computer, and the like.

[0177] In this implementation, if Fig.15As shown, the electronic device may further include a second heat generating component 530, and the second heat generating component 530 and the first heat generating component 510 may be arranged in the accommodation space 911 at intervals along the eighth direction, wherein the eighth direction may be different from the thickness direction of the first body 910. Here, by arranging the second heat generating component 530 in the thickness direction of the non-first body 910, the space occupied by the second heat generating component 530 in the thickness direction of the first body 910 can be reduced, thereby achieving the lightness and thinness of the first body 910. As an example, the eighth direction may be perpendicular to the thickness direction of the first body 910, and here, the second heat generating component 530 does not occupy the space of the first body 910 in the thickness direction of the first body 910, thereby achieving the lightness and thinness of the first body 910. Of course, the eighth direction may also be non-perpendicular to the thickness direction of the first body 910; or, the eighth direction may also be the same as the thickness direction of the first body 910.

[0178] In the embodiment of the present application, the first heat generating component 510, the functional component 520 and the second heat generating component 530 can be directly disposed on the wall of the first body 910. Fig.15 As shown, the first heating component 510, the functional component 520 and the second heating component 530 can also be arranged on the carrier 920. The structure of the carrier 920 is not limited. For example, the carrier 920 can be a printed circuit board (PCB), where the carrier 920 and the bottom wall of the first body 910 can be spaced apart, and no other structural parts are provided; here, the top wall of the first body 910 is adjacent to the heat-conducting component 400, and the bracket of the input component can be arranged on the top wall of the first body 910, and the heat-conducting component 400 can be arranged adjacent to the bracket. As an example, the input component, the bracket, the heat-conducting component 400, the first target component 100, the first heating component 510, the carrier 920 and the bottom wall of the first body 910 can be arranged in sequence in the thickness direction of the first body 910.

[0179] As another example, the first heat generating component 510 may be a CPU, the functional component 520 may be an SSD, the second heat generating component 530 may be a GPU, the heat conducting assembly 400 may dissipate heat for the first heat generating component 510, the second heat generating component 530 and the functional component 520, and the first heat exchange medium may dissipate heat for the first heat generating component 510 and the second heat generating component 530. Of course, the first heat generating component 510, the functional component 520 and the second heat generating component 530 may also be other heat generating components. The present application is not limited thereto, that is, those skilled in the art may adjust or set the same according to specific needs.

[0180] In some optional implementations of the embodiments of the present application, the electronic device may further include a carrier 920 ; the first heat generating component 510 may be disposed on the carrier 920 , so as to be supported by the carrier 920 .

[0181] In this implementation, the shape of the carrier 920 is not limited. For example, the carrier 920 can be plate-shaped, block-shaped, frame-shaped, etc. The structure of the carrier 920 is not limited. For example, the carrier 920 can be a printed circuit board, etc.

[0182] In this implementation, if Figure 3 As shown, in the case where the electronic device includes a functional component 520 and a driver 600, the first heat-generating component 510 and the functional component 520 can be arranged at intervals on the carrier 920, and the driver 600 can be arranged on the side of the carrier close to the first group of heat exchange channels 110 in the seventh direction; the seventh direction can be perpendicular to the thickness direction of the carrier 920; so that the driver 600 does not occupy the space of the carrier 920 in the thickness direction, and reduces the distance between the driver 600 and the first group of heat exchange channels 110 by being close to the first group of heat exchange channels 110, thereby reducing the power consumption of the driver 600.

[0183] Of course, in other examples, the functional component 520 may not be disposed on the carrier 920, such as Figure 2 In other examples, the seventh direction may not be perpendicular to the thickness direction of the carrier 920 .

[0184] Here, the thickness direction of the carrier 920 may be a stacking direction A of the heat conducting assembly 400 , the first target component 100 , and the first heat generating component 510 .

[0185] It should be noted that, when the electronic device includes the first target component 100 and the second target component 200 , at least the two target components may be different structural components or different parts of the same structural component.

[0186] It should be noted that in other embodiments of the application, the electronic device may also include at least one of the heat-conducting component 400, the first heat-generating component 510, the functional component 520, the first target component 100 and the driver 600; or, the electronic device may also include at least two of the heat-conducting component 400, the first heat-generating component 510, the functional component 520, the first target component 100 and the driver 600; or, the electronic device may also include only at least three of the heat-conducting component 400, the first heat-generating component 510, the functional component 520, the first target component 100 and the driver 600. The present application is not limited thereto, that is, those skilled in the art may adjust or set the same according to specific needs.

[0187] The various specific technical features described in the specific embodiments can be combined in any suitable manner without contradiction, for example, different embodiments and technical solutions can be formed by combining different specific technical features. In order to avoid unnecessary repetition, various possible combinations of the specific technical features in the present invention will not be described separately.

[0188] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. An electronic device, comprising: Thermally conductive components; A first heat-generating component is disposed on the first surface side of the heat-conducting component and is spaced apart from the heat-conducting component; a functional component, at least partially disposed on the first surface side of the thermally conductive component; The functional component is located at a position that limits the movement of the heat-conducting component toward the first heat-generating component; A first target component is at least partially disposed between the heat-conducting component and the first heat-generating component, and the first target component is used to dissipate heat from the first heat-generating component; the first target component has a first group of heat exchange channels; the first group of heat exchange channels is used to accommodate a first heat exchange medium; A driving member is used to drive the first heat exchange medium to flow in the first group of heat exchange channels.

2. The electronic device according to claim 1, The first heat generating component is in contact with a first side of the first target component, a second side of the first target component is in contact with a first surface side of the heat conducting component, and the second side of the first target component is opposite to the first side of the first target component. The functional component is in contact with the first surface side of the thermally conductive component.

3. The electronic device according to claim 1 or 2, The heat-conducting component includes a first area and a second area, the orthographic projection area of ​​the first heat-generating component toward the heat-conducting component is the first area, and the orthographic projection area of ​​the functional component toward the heat-conducting component is the second area. The projection direction of the first heat-generating component toward the orthographic projection area of ​​the heat-conducting component is a first direction, the projection direction of the functional component toward the orthographic projection area of ​​the heat-conducting component is a second direction, and the first direction is the same as the second direction. The first region of the heat conducting component and the second region of the heat conducting component meet a coplanar condition in the first direction.

4. The electronic device according to claim 1, wherein the first portion of the first target component is located between the first heat-generating component and the first surface of the thermally conductive component; the second portion of the first target component is in contact with at least one side surface of the thermally conductive component; and the side surface of the thermally conductive component is disposed adjacent to the first surface of the thermally conductive component. 5 . The electronic device according to claim 4 , wherein the first portion of the first target component and the second portion of the first target component form a receiving groove, and at least a portion of the heat conduction component is located in the receiving groove.

6. The electronic device according to claim 1, wherein the first target component is used to conduct a first portion of the heat absorbed by the first heat-generating component to the heat-conducting component, and the first target component is also used to transfer the first heat exchange medium that absorbs a second portion of the heat of the first heat-generating component away through the driving component.

7. The electronic device according to claim 1, wherein the first group of heat exchange channels comprises at least two first heat exchange channels; The electronic device further comprises: an outlet channel connected to the outlet of the driving member; the cross-sectional area of ​​the outlet channel is larger than the cross-sectional area of ​​the first heat exchange channel; an inlet channel connected to the inlet of the driving member; the cross-sectional area of ​​the inlet channel is larger than the cross-sectional area of ​​the first heat exchange channel; The first group of heat exchange channels are respectively connected to the outlet channel and the inlet channel, the driving member is spaced apart from the first target component, and the driving member is used to drive the first heat exchange medium to circulate in the outlet channel, the first group of heat exchange channels and the inlet channel.

8. The electronic device according to claim 1, further comprising: The first body has a receiving space; The first heat-generating component, the first target component and the heat-conducting component are stacked in the accommodating space in the thickness direction of the first body; The first heat generating component and the functional component are arranged in the accommodation space at intervals along a third direction, wherein the third direction is different from a thickness direction of the first body; The driving member and the first target member are disposed in the accommodation space along a fourth direction with an interval therebetween, wherein the fourth direction is different from a thickness direction of the first body.

9. The electronic device according to claim 8, wherein the first group of heat exchange channels comprises at least two first heat exchange channels; The dimension of the first heat exchange channel in the fifth direction is greater than the dimension of the first heat exchange channel in the thickness direction of the first body; wherein, The fifth direction is different from the thickness direction of the first body; and / or, A dimension of the heat-conducting component in a sixth direction is greater than a dimension of the heat-conducting component in a thickness direction of the first body, wherein the sixth direction is different from a thickness direction of the first body.

10. The electronic device according to claim 8, further comprising: A second body, rotatably connected to the first body; An input component or a first display component is disposed outside the first body; a second display assembly, disposed on the outer side of the second body; and / or, The electronic device further comprises: The bearing member is in the form of a plate; The first heat-generating component and the functional component are arranged on the carrier at intervals, and the driving component is arranged on a side of the carrier close to the first group of heat exchange channels in a seventh direction; the seventh direction is perpendicular to the thickness direction of the carrier.

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