Display panel and electronic equipment

Abstract

The invention provides a display panel and electronic equipment, and relates to the technical field of display. The display panel comprises a driving substrate, the driving substrate comprises a first surface, and a plurality of connecting electrodes are exposed on the first surface; the light-emitting elements are located on one side of the first surface, each light-emitting element comprises a chip electrode, and the chip electrodes are welded and fixed to the connecting electrodes; and the energy reflecting layer covers at least partial area of the first surface. According to the technical scheme provided by the invention, the energy reflecting layer can reflect energy generated when the chip electrode of the light-emitting element and the connecting electrode of the driving substrate are welded, and the energy reflecting layer also has a certain heat insulation effect, so that the energy reflecting layer is arranged to cover at least partial area of the first surface of the driving substrate; therefore, the problems of plate cracking and the like caused by overheating after the internal circuit of the driving substrate absorbs energy are solved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and more specifically, to a display panel and an electronic device. Background Art

[0002] With the development of science and technology, more and more electronic devices with display functions are widely used in people's daily life and work, which has brought great convenience to people's daily life and work, and has become an indispensable tool for people today; among them, the main component of electronic devices to realize the display function is the display panel. Micro-light emitting diode display panel is one of the hot spots in the current display technology field. Micro-light emitting diode display panel has the advantages of high display quality, long life, high contrast, high resolution, high stability, etc., and can support high brightness, high dynamic range and wide color gamut. However, the existing micro-light emitting diode display panels often have the problem of board cracking during preparation, which affects the preparation yield and quality of the panel. Summary of the invention

[0003] In view of this, the present application provides a display panel and an electronic device, which effectively solve the technical problems existing in the prior art. The energy reflecting layer can reflect the energy when the chip electrode of the light-emitting element and the connecting electrode of the driving substrate are welded, and the energy reflecting layer also has a certain heat insulation effect, thereby improving the problem of cracking of the board caused by overheating after the circuit of the driving substrate absorbs energy.

[0004] To achieve the above objectives, the technical solutions provided by this application are as follows:

[0005] A display panel, comprising:

[0006] A driving substrate, the driving substrate comprising a first surface, wherein a plurality of connecting electrodes are exposed on the first surface;

[0007] A plurality of light-emitting elements, wherein the light-emitting elements are located on one side of the first surface, the light-emitting elements include chip electrodes, and the chip electrodes are fixed to the connecting electrodes by welding;

[0008] An energy reflecting layer covers at least a portion of the first surface.

[0009] Optionally, the display panel includes a display area and a non-display area outside the display area, and the drive substrate is provided with a scan drive circuit at a location corresponding to the non-display area;

[0010] The energy reflective layer includes a first reflective layer portion, and the first reflective layer portion covers at least a portion of the non-display area corresponding to the scan driving circuit.

[0011] Optionally, the non-display area includes a first area in a first direction and located at at least one side of the display area, and the non-display area includes a second area in a second direction and located at at least one side of the display area, and the first direction and the second direction intersect;

[0012] The first area and the second area are connected at corner areas opposite to each other at the ends;

[0013] The scan driving circuit is located in the first area, and the scan driving circuit also includes a portion located in the corner area;

[0014] The first reflective layer partially covers at least a portion of the corner area corresponding to the scan driving circuit.

[0015] Optionally, the first reflective layer portion also extends to cover at least a portion of the first region corresponding to the scan driving circuit.

[0016] Optionally, a portion of the first reflective layer portion corresponding to the corner region is a first sub-portion, and a portion of the first reflective layer portion corresponding to the first region is a second sub-portion;

[0017] The reflection intensity of the first sub-portion is greater than the reflection intensity of the second sub-portion.

[0018] Optionally, the energy reflective layer further includes a second reflective layer portion, and the second reflective layer portion covers at least a portion of the display area.

[0019] Optionally, the reflection intensity of the first reflection layer portion is greater than the reflection intensity of the second reflection layer portion.

[0020] Optionally, the display area includes a plurality of sub-pixels, and the sub-pixels include a transparent area and a non-transparent area;

[0021] The connecting electrode and the light emitting element are located in the non-transparent area;

[0022] The second reflective layer partially covers at least a portion of the non-transparent area, and the second reflective layer partially exposes the connecting electrode.

[0023] Optionally, the second reflective layer also partially covers at least a portion of the transparent area.

[0024] Optionally, a portion of the second reflective layer portion corresponding to the non-transparent area is a third sub-portion, and a portion of the second reflective layer portion corresponding to the transparent area is a fourth sub-portion;

[0025] The reflection intensity of the third sub-portion is greater than the reflection intensity of the fourth sub-portion.

[0026] Optionally, the chip electrode is fixed to the connecting electrode by laser welding, wherein the energy reflection layer is a phase change material reflection layer.

[0027] Optionally, the phase change material reflective layer includes vanadium dioxide.

[0028] Based on the same inventive concept, the present application also provides an electronic device, which includes the above-mentioned display panel.

[0029] Compared with the prior art, the technical solution provided by this application has at least the following advantages:

[0030] The present application provides a display panel and an electronic device, wherein the display panel comprises: a driving substrate, wherein the driving substrate comprises a first surface, wherein the first surface exposes a plurality of connecting electrodes; a plurality of light-emitting elements, wherein the light-emitting elements are located on one side of the first surface, wherein the light-emitting elements comprise chip electrodes, and wherein the chip electrodes are welded and fixed to the connecting electrodes; and an energy reflecting layer, wherein the energy reflecting layer covers at least a portion of the first surface.

[0031] From the above content, it can be seen that in the technical solution provided by the present application, the energy reflecting layer can reflect the energy when the chip electrode of the light-emitting element and the connecting electrode of the driving substrate are welded, and the energy reflecting layer also has a certain heat insulation effect. Therefore, an energy reflecting layer is set to cover at least part of the first surface of the driving substrate, so as to improve the problem of cracking of the plate caused by overheating after the internal circuit of the driving substrate absorbs energy. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying any creative work.

[0033] Figure 1 A schematic diagram of the structure of a display panel provided in an embodiment of the present application;

[0034] Figure 2 for Figure 1 A cross-sectional view along the BB' direction;

[0035] Figure 3 for Figure 1 Another cross-sectional view along the BB' direction;

[0036] Figure 4 A schematic diagram of the structure of another display panel provided in an embodiment of the present application;

[0037] Figure 5 A schematic diagram of the structure of another display panel provided in an embodiment of the present application;

[0038] Figure 6 A schematic diagram of the structure of another display panel provided in an embodiment of the present application;

[0039] Figure 7 A schematic diagram of the structure of another display panel provided in an embodiment of the present application;

[0040] Figure 8 A schematic diagram of the structure of another display panel provided in an embodiment of the present application;

[0041] Fig. 9 A schematic diagram of the structure of another display panel provided in an embodiment of the present application;

[0042] Fig.10 A schematic diagram of the structure of another display panel provided in an embodiment of the present application;

[0043] Fig.11 A schematic diagram of the structure of another display panel provided in an embodiment of the present application;

[0044] Fig.12 A schematic diagram of the structure of another display panel provided in an embodiment of the present application;

[0045] Fig.13 A schematic diagram of the structure of another display panel provided in an embodiment of the present application;

[0046] Fig.14 for Fig.13 Section along CC' direction;

[0047] Fig.15 A schematic diagram of the structure of another display panel provided in an embodiment of the present application;

[0048] Fig.16 A schematic diagram of the structure of another display panel provided in an embodiment of the present application;

[0049] Fig.17 for Fig.16 Section along DD' direction;

[0050] Fig.18 A schematic diagram of the structure of another display panel provided in an embodiment of the present application;

[0051] Fig.19 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0052] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0053] As described in the background technology, with the development of science and technology, more and more electronic devices with display functions are widely used in people's daily life and work, which has brought great convenience to people's daily life and work, and has become an indispensable and important tool for people today; among them, the main component of electronic devices to realize the display function is the display panel. Micro-light emitting diode display panel is one of the hot spots in the current display technology field. Micro-light emitting diode display panel has the advantages of high display quality, long life, high contrast, high resolution, high stability, etc., and can support high brightness, high dynamic range and wide color gamut. However, the existing micro-light emitting diode display panels often have the problem of plate cracking during preparation, which affects the preparation yield and quality of the panel.

[0054] Specifically, the micro-LED display panel includes a driving substrate and a plurality of micro-LEDs electrically connected to the driving substrate. In the preparation process of the micro-LED display panel, the micro-LEDs need to be welded and fixed on the driving substrate. During the welding and fixing, the corresponding welding energy will be absorbed by the circuits in the driving substrate. After the circuits absorb the energy, the temperature will rise and overheat, thereby causing the risk of cracking of the board. In particular, in the area with dense circuits in the driving substrate, the risk of cracking of the board due to overheating caused by the circuits absorbing energy is more likely to occur.

[0055] Based on this, the embodiments of the present application provide a display panel and an electronic device, which effectively solve the technical problems existing in the prior art. The energy reflecting layer can reflect the energy when the chip electrode of the light-emitting element and the connecting electrode of the driving substrate are welded, and the energy reflecting layer also has a certain heat insulation effect, thereby improving the problem of cracking of the board caused by overheating after the circuit of the driving substrate absorbs energy.

[0056] To achieve the above purpose, the technical solution provided in the embodiment of the present application is as follows, specifically combined with Figures 1 to 19 The technical solution provided in the embodiments of the present application is described in detail.

[0057] Combination Figure 1 and Figure 2 As shown, Figure 1 A schematic diagram of the structure of a display panel provided in an embodiment of the present application is shown in FIG. Figure 2 for Figure 1A cross-sectional view along the BB' direction. The display panel provided in the embodiment of the present application includes: a driving substrate 10, the driving substrate 10 includes a first surface, and the first surface exposes a plurality of connecting electrodes 11. A plurality of light-emitting elements 20, the light-emitting elements 20 are located on one side of the first surface, the light-emitting elements 20 include chip electrodes 21, and the chip electrodes 21 are welded and fixed to the connecting electrodes 21. An energy reflecting layer 30, the energy reflecting layer 30 covers at least a portion of the first surface of the driving substrate 10. It can be understood that the energy reflecting layer 30 can reflect the energy when the chip electrodes 21 of the light-emitting elements 20 and the connecting electrodes 11 of the driving substrate 10 are welded, and the energy reflecting layer 30 also has a certain heat insulation effect. Therefore, an energy reflecting layer 30 is provided to cover at least a portion of the first surface of the driving substrate 10, so that the energy during welding can be blocked by the energy reflecting layer 30 from being transmitted to the circuit inside the driving substrate 10, thereby improving the problem of cracking of the plate caused by overheating of the internal circuit of the driving substrate 10 after absorbing energy.

[0058] In some embodiments, the chip electrode 21 of the light emitting element 20 provided in the embodiment of the present application includes two electrodes, one input and one output. Therefore, the connecting electrode 11 corresponds to two electrodes. Figure 3 As shown, Figure 1 Another cross-sectional view along the BB' direction, wherein the chip electrode 21 provided in the embodiment of the present application includes an anode 211 and a cathode 212, and the anode 211 and the cathode 212 are both located on the side of the light-emitting element 20 facing the driving substrate 10; similarly, the connecting electrode 11 includes a first electrode 111 corresponding to the anode 211 and a first electrode 112 corresponding to the cathode 212, the first electrode 111 is bonded and electrically connected to the anode 211, and the second electrode 112 is bonded and electrically connected to the cathode 212. In some embodiments, the light-emitting element 20 provided in the embodiment of the present application can be a light-emitting diode, specifically a micro light-emitting diode, such as micro-LED, mini-LED, etc.

[0059] The driving substrate 10 provided in the embodiment of the present application is composed of a plurality of metal layers and other structural layers, and these metal layers and other structures will be prepared into circuits such as pixel circuits and scanning driving circuits in the driving substrate 10. Therefore, when the connecting electrode 11 and the chip electrode 21 are welded, the circuit formed by the metal layer will absorb energy and heat up, thereby posing a risk of cracking of the plate. Among them, the scanning driving circuit is electrically connected to the pixel circuit, and the scanning driving circuit is used to provide a corresponding scanning control signal to the pixel circuit. The pixel circuit is electrically connected to the light-emitting element 20, and the pixel circuit is used to provide a corresponding driving signal to the light-emitting element 20, wherein the scanning driving circuit and the pixel circuit are both composed of components such as transistors and capacitors connected together, which is the same as the prior art, so no unnecessary details are given. For specific reference Figure 4As shown, it is a schematic diagram of the structure of another display panel provided by an embodiment of the present application, wherein the driving substrate 10 includes a substrate 101; a semiconductor layer 102 located on the substrate 101, the semiconductor layer 102 including an active region forming a transistor TFT; a gate insulating layer 103 located on the side of the semiconductor layer 102 away from the substrate 101; a gate metal layer 104 located on the side of the gate insulating layer 103 away from the substrate 101, the gate metal layer 104 including a gate electrode forming the transistor TFT; a capacitor insulating layer 105 located on the side of the gate metal layer 104 away from the substrate 101; a capacitor metal layer 106 located on the side of the capacitor insulating layer 105 away from the substrate 101, the capacitor metal layer 106 including a plate forming a capacitor in the circuit, the other plate forming the capacitor can be located on the gate metal layer 104, or the other plate forming the capacitor can be located on the source-drain metal layer 108; an interlayer located on the side of the capacitor metal layer 106 away from the substrate 101 An insulating layer 107; a source-drain metal layer 108 located on a side of the interlayer insulating layer 107 away from the substrate 101, the source-drain metal layer 108 including a source and a drain forming a transistor TFT, and the source and the drain are in contact with the active area through respective vias; a passivation layer 109 located on a side of the source-drain metal layer 108 away from the substrate 101; a circuit metal layer 1010 located on a side of the passivation layer 109 away from the substrate 101; a planarization layer 1011 located on a side of the circuit metal layer 1010 away from the substrate 101; an electrode layer 1012 located on a side of the planarization layer 1011 away from the substrate 101, the electrode layer 1012 including a first electrode 111 and a second electrode 112; and a surface passivation layer 1013 located on a side of the electrode layer 1012 away from the substrate 101, the surface passivation layer 1013 exposing the first electrode 111 and the second electrode 112, and the surface of the driving panel 10 having the surface passivation layer 1013 side is the first surface. Among them, the first electrode 111 is electrically connected to the transfer electrode 13 in the circuit metal layer 1010 through a via, and the transfer electrode 13 is electrically connected to the electrode of the transistor TFT in the source-drain metal layer 108 (which can be a source electrode or a drain electrode, which needs to be specifically selected according to the actual application) through a via, and the second electrode 112 is electrically connected to the power supply electrode 14 in the circuit metal layer 1010 through a via, thereby forming a circuit for providing a driving signal to the light-emitting element 20.

[0060] Figure 4 In the display panel shown, the transistor TFT in the driving substrate 10 is a top-gate transistor, that is, the gate of the transistor TFT is located above the active layer. In some other embodiments of the present application, the transistor TFT in the driving substrate 10 provided in the embodiment of the present application can also be a bottom-gate transistor, that is, the gate of the transistor TFT is located below the active layer. Figure 51 is a schematic diagram of the structure of another display panel provided by an embodiment of the present application, wherein a driving substrate 10 includes a substrate 101; a gate metal layer 104 located on the substrate 101, the gate metal layer 104 includes a gate electrode for forming a transistor TFT; a gate insulating layer 103 located on a side of the gate metal layer 104 away from the substrate 101; a semiconductor layer 102 located on a side of the gate insulating layer 103 away from the substrate 101, the semiconductor layer 102 includes an active region for forming a transistor TFT; a capacitor insulating layer 105 located on a side of the semiconductor layer 102 away from the substrate 101; a capacitor metal layer 106 located on a side of the capacitor insulating layer 105 away from the substrate 101, the capacitor metal layer 106 includes a plate for forming a capacitor in a circuit, and another plate for forming a capacitor may be located on the gate metal layer 104, or another plate for forming a capacitor may be located on the source-drain metal layer 108; a capacitor metal layer 106 located on a side of the capacitor metal layer 106 away from the substrate 101 An interlayer insulating layer 107; a source-drain metal layer 108 located on a side of the interlayer insulating layer 107 away from the substrate 101, the source-drain metal layer 108 including a source and a drain forming a transistor TFT, and the source and the drain are in contact with the active area through respective vias; a passivation layer 109 located on a side of the source-drain metal layer 108 away from the substrate 101; a circuit metal layer 1010 located on a side of the passivation layer 109 away from the substrate 101; a planarization layer 1011 located on a side of the circuit metal layer 1010 away from the substrate 101; an electrode layer 1012 located on a side of the planarization layer 1011 away from the substrate 101, the electrode layer 1012 including a first electrode 111 and a second electrode 112; and a surface passivation layer 1013 located on a side of the electrode layer 1012 away from the substrate 101, the surface passivation layer 1013 exposing the first electrode 111 and the second electrode 112, and the surface of the driving panel 10 having the surface passivation layer 1013 side is the first surface. Among them, the first electrode 111 is electrically connected to the transfer electrode 13 in the circuit metal layer 1010 through a via, and the transfer electrode 13 is electrically connected to the electrode of the transistor TFT in the source-drain metal layer 108 (which can be a source electrode or a drain electrode, which needs to be specifically selected according to the actual application) through a via, and the second electrode 112 is electrically connected to the power supply electrode 14 in the circuit metal layer 1010 through a via, thereby forming a circuit for providing a driving signal to the light-emitting element 20.

[0061] It should be noted that the energy reflection layer 30 provided in the embodiment of the present application may be an insulating energy reflection layer or a conductive energy reflection layer. When the energy reflection layer 30 is a conductive energy reflection layer, the energy reflection layer 30 is insulated from the connection electrode 11 and the chip electrode 21, so as to prevent the energy reflection layer 30 from short-circuiting between different connection electrodes 11, between different chip electrodes 21, between the first electrode 111 and the second electrode 112 of the same connection electrode 11, and between the anode 211 and the cathode 212 of the same chip electrode 21.

[0062] In some embodiments, the display panel provided in the embodiments of the present application can be a full-screen display and only includes the display area AA (that is, the first surface only includes the display area AA), wherein the energy reflection layer 30 is disposed in the display area AA. Figure 1 As shown, the display panel provided in the embodiment of the present application only includes the display area AA. When the energy reflective layer 30 is located on the first surface of the driving substrate 10, the energy reflective layer 30 can cover part of the display area AA according to design requirements, and the energy reflective layer 30 exposes the connecting electrode 11 so that the connecting electrode 11 and the chip electrode 21 can be welded and fixed. Or refer to Figure 6 , which is a schematic diagram of the structure of another display panel provided by an embodiment of the present application, wherein the display panel provided by the embodiment of the present application only includes the display area AA, and when the energy reflection layer 30 is located on the first surface of the driving substrate 10, the energy reflection layer 30 can cover the entire area in the display area AA according to design requirements, and the energy reflection layer 30 exposes the connection electrode 11 so as to be able to weld and fix the connection electrode 11 and the chip electrode 21. The laser can pass through the light-emitting element 20 to act between the connection electrode 11 and the chip electrode 21 to achieve a welding effect, and the blocking of the energy reflection layer 30 can prevent the laser energy from affecting the electrical properties of the driving substrate 10.

[0063] In addition, the display panel provided in the embodiment of the present application may also be a display panel with a frame, that is, the display panel includes a display area AA and a non-display area SA (that is, the first surface includes the display area AA and the non-display area SA), and the non-display area SA may be located only on one side of the display area AA; or the non-display area SA is located on at least two sides of the display area AA; or the non-display area SA is arranged around the display area AA, and the present application does not make any specific restrictions on this. Figure 7 , which is a schematic diagram of the structure of another display panel provided in an embodiment of the present application, wherein the display panel provided in the embodiment of the present application includes a display area AA and a non-display area SA located outside the display area AA, and the non-display area S1 is optionally arranged around the display area AA, wherein the energy reflective layer 30 can only cover at least a portion of the non-display area SA according to design requirements (that is, the energy reflective layer 30 covers a portion of the non-display area SA, or the energy reflective layer 30 covers the entire non-display area SA). Or refer to Figure 8As shown, it is a structural schematic diagram of another display panel provided by an embodiment of the present application, wherein the display panel provided by the embodiment of the present application includes a display area AA and a non-display area SA located outside the display area AA, and the non-display area S1 is optionally arranged around the display area AA, wherein the energy reflection layer 30 can only cover at least a part of the display area AA according to design requirements (that is, the energy reflection layer 30 covers a part of the display area AA, or the energy reflection layer 30 covers the entire display area AA), and the energy reflection layer 30 exposes the connection electrode 11 so that the connection electrode 11 and the chip electrode 21 can be welded and fixed. Or refer to Fig. 9 As shown, it is a structural schematic diagram of another display panel provided by an embodiment of the present application, wherein the display panel provided by the embodiment of the present application includes a display area AA and a non-display area SA located outside the display area AA, and the non-display area S1 is optionally arranged around the display area AA, wherein the energy reflecting layer 30 can only cover at least a portion of the display area AA according to design requirements, and also cover at least a portion of the non-display area SA (that is, the energy reflecting layer 30 covers a portion of the non-display area SA, and the energy reflecting layer 30 covers a portion of the display area AA; or, the energy reflecting layer 30 covers a portion of the non-display area SA, and the energy reflecting layer 30 covers the entire display area AA; or, the energy reflecting layer 30 covers the entire non-display area SA, and the energy reflecting layer 30 covers a portion of the display area AA; or, the energy reflecting layer 30 covers the entire non-display area SA, and the energy reflecting layer 30 covers the entire display area AA), and the energy reflecting layer 30 exposes the connecting electrode 11 so as to be able to weld and fix the connecting electrode 11 and the chip electrode 21.

[0064] In some embodiments, the chip electrode 21 of the light-emitting element 20 provided in the embodiment of the present application and the connecting electrode 11 of the driving substrate 10 can be welded by laser welding, and the energy reflection layer 30 is a laser energy reflection layer. Specifically, the energy reflection layer 30 is a phase change material reflection layer. It can be understood that the phase change material reflection layer has high transmittance to infrared radiation in the low-temperature semiconductor state, and has high reflectivity to infrared radiation in the high-temperature metal state. Based on this characteristic, when the chip electrode 21 and the connecting electrode 11 are laser welded, the phase change material reflection layer is changed from the semiconductor state to the metal state, so that the effect of reflecting the laser can be achieved, so that the laser transmittance is greatly reduced, so as to improve the problem of the circuit in the driving substrate 10 absorbing the laser energy and overheating during laser welding, resulting in the cracking of the substrate. Optionally, the phase change material reflection layer provided in the embodiment of the present application includes vanadium dioxide, that is, the energy reflection layer 30 is formed by a mixed material of coated vanadium dioxide and PVP (polyvinyl pyrrolidone) and other substances, wherein the concentration of vanadium dioxide determines the reflection intensity of the energy reflection layer.

[0065] The following is a more detailed description of the display panel provided by the embodiment of the present application, especially the energy reflection layer 30 included in the display panel, in conjunction with the accompanying drawings. Fig.10 As shown, it is a structural schematic diagram of another display panel provided by an embodiment of the present application, wherein the display panel provided by the embodiment of the present application includes a display area AA, and a non-display area SA located outside the display area AA, and the drive substrate 10 is provided with a scanning drive circuit VSR corresponding to the non-display area SA; the energy reflection layer 30 includes a first reflection layer portion 31, and the first reflection layer portion 31 covers at least a part of the area of ​​the non-display area SA corresponding to the scanning drive circuit VSR. It can be understood that the scanning drive circuit VSR is a circuit for providing a scanning control signal to the pixel circuit, and the scanning drive circuit VSR is electrically connected to the pixel circuit at the display area AA through the scanning control signal line. Due to the narrow frame design trend of the display panel, the wiring area at the non-display area SA is limited, and the effective wiring area of ​​the non-display area SA is very small. Therefore, arranging the scanning drive circuit VSR at the limited non-display area SA will make the circuit of the non-display area SA at the scanning drive circuit VSR more compact and dense. Dense circuits are more likely to absorb welding energy, such as dense circuits are more likely to absorb laser energy. Therefore, in the display panel provided in the embodiment of the present application, an energy reflection layer 30 is set in at least a part of the area of ​​the non-display area SA corresponding to the scanning drive circuit VSR. This can improve the problem of plate cracking caused by overheating due to the dense circuit absorbing laser energy; at the same time, it can also balance the temperature distribution of the entire non-display area SA, further improving problems such as plate cracking.

[0066] Optionally, the scan driving circuit VSR provided in the embodiment of the present application may be arranged at one side of the display area AA, such as Fig.10 As shown. Or refer to Fig.11 As shown, it is a structural schematic diagram of another display panel provided in an embodiment of the present application, wherein, in the display panel provided in the embodiment of the present application, a scanning drive circuit VSR can be respectively provided at two opposite sides of the display area AA; at this time, a first reflective layer portion 31 is respectively provided at two opposite sides of the display area AA, and the first reflective layer portion 31 covers at least a partial area of ​​the non-display area SA corresponding to the scanning drive circuit VSR.

[0067] In some embodiments, the driving substrate 10 provided in the embodiment of the present application may be in the shape of a rectangular substrate, a circular substrate, etc. In addition, the driving substrate 10 may also include some irregularly shaped areas. When the circuits corresponding to the irregularly shaped areas are densely packed, the energy reflection layer 30 may also be provided to cover the areas to improve the problems such as cracking caused by overheating due to the circuits in the irregularly shaped areas absorbing laser energy. Fig.12As shown, it is a structural schematic diagram of another display panel provided by an embodiment of the present application, wherein the non-display area SA provided by the embodiment of the present application includes a first area SA1 in a first direction X and located at least on one side of the display area AA, and the non-display area SA includes a second area SA2 in a second direction Y and located at least on one side of the display area AA, and the first direction X and the second direction Y intersect (specifically, the first direction X and the second direction Y may be perpendicular to each other). The first area SA1 and the second area SA2 are connected at the corner area SA3 opposite to each other at the end; the scanning drive circuit VSR is located in the first area SA1, and the scanning drive circuit VSR also includes a portion located in the corner area SA3. The first reflective layer portion 31 covers at least a portion of the corner area SA3 corresponding to the scanning drive circuit VSR. It can be understood that the corner area SA3 provided by the embodiment of the present application is a special-shaped area on the drive substrate 10, and the corner area SA3 can be any shape such as an R angle and a broken line angle. When the first area SA1 and the second area SA2 are connected through the corner area SA3, it is equivalent to reducing the overall wiring area of ​​the non-display area SA, that is, the wiring area of ​​the corner area SA3, which is a special-shaped area, is more limited. Therefore, when the scan drive circuit VSR is extended and arranged in the corner area SA3, the line density in the corner area SA3 is higher than the line density in the first area SA1. Therefore, the first reflective layer part 31 is designed to cover at least part of the corner area 31, so as to improve the problem of cracking caused by overheating of the line in the special-shaped area due to absorption of laser energy; at the same time, the temperature distribution of the corner area SA3 and the rest of the driving substrate 10 is balanced, and the cracking problem of the driving substrate 10 is further improved.

[0068] In some embodiments, the first reflective layer portion 31 provided in the embodiment of the present application may also extend to cover at least a portion of the first area SA1 corresponding to the scan drive circuit VSR, thereby improving the problem of the line in the first area SA1 absorbing laser energy. Fig.13 , which is a schematic diagram of the structure of another display panel provided in an embodiment of the present application, wherein the first reflective layer portion 31 provided in the embodiment of the present application also extends to cover at least a portion of the first area SA1 corresponding to the scanning drive circuit VSR. It can be understood that the first reflective layer portion 31 provided in the embodiment of the present application not only covers at least a portion of the corner area SA3, but also extends to cover at least a portion of the first area SA1, thereby improving the problem of cracking of the plate caused by overheating due to absorption of laser energy by the scanning drive circuit VSR.

[0069] Furthermore, in the embodiment of the present application, the reflection intensity of different regions of the first reflection layer portion 31 can be optimized to balance the temperature distribution. Fig.13 and Fig.14 As shown, Fig.14 for Fig.13 The cross-sectional view along the CC' direction in FIG. 1 is a cross-sectional view of the embodiment of the present application, wherein the portion of the first reflective layer portion 31 corresponding to the corner area SA3 is the first sub-portion 311, and the portion of the first reflective layer portion 31 corresponding to the first area SA1 is the second sub-portion 312; the reflection intensity of the first sub-portion 311 is greater than the reflection intensity of the second sub-portion 312. It can be understood that the line density at the corner area SA3 provided in the embodiment of the present application is higher than the line density of the first area SA1, so the reflection intensity of the first sub-portion 311 is optimized to be greater than the reflection intensity of the second sub-portion 312, so as to balance the temperature of the line at the corner area SA3 and the line in the first area SA1 that absorbs the laser energy, and avoid the problem of easy cracking of the plate due to temperature difference. When the energy reflection layer 30 provided in the embodiment of the present application includes vanadium dioxide, the concentration of vanadium dioxide included in the first sub-portion 311 provided in the embodiment of the present application is greater than the concentration of vanadium dioxide included in the second sub-portion 312, thereby achieving the purpose of adjusting the reflection intensity of the first sub-portion 311 to be greater than the reflection intensity of the second sub-portion 312.

[0070] It should be noted that the first reflective portion 31 provided in the embodiment of the present application can also cover at least part of the second area SA2, thereby improving the problem of plate cracking caused by overheating of the line in the second area SA2 due to absorption of laser energy. Further, the reflection intensity of the part of the first reflective portion 31 covering the second area SA2 can be set to be less than the reflection intensity of the first sub-portion 311, thereby balancing the line temperature distribution of the second area SA2 and the corner area SA3, and improving the problem of plate cracking caused by excessive temperature difference between different areas. In addition, the reflection intensity of the part of the first reflective portion 31 covering the second area SA2 provided in the embodiment of the present application can be set to be the same as the reflection intensity of the second sub-portion 312, or set to be less than the reflection intensity of the second sub-portion 312, thereby balancing the line temperature distribution of the first area SA1, the second area SA2 and the corner area SA3, and improving the problem of plate cracking caused by excessive temperature difference between different areas.

[0071] Although the wiring area of ​​the display area AA provided in the embodiment of the present application is relatively large, the display area AA includes circuits such as pixel circuits that can also absorb laser energy, so that the display area AA also has the risk of cracking of the corresponding plate. Based on this, the energy reflection layer 30 provided in the embodiment of the present application can also include a portion located in the display area AA; for details, refer to Fig.15As shown, it is a schematic diagram of the structure of another display panel provided in an embodiment of the present application, wherein the energy reflection layer 30 provided in the embodiment of the present application further includes a second reflection layer portion 32, the second reflection layer portion 32 covers at least a part of the display area AA, and the second reflection layer portion 32 exposes the connection electrode 11. Generally, the line density of the display area AA is less than the line density of the non-display area SA, especially less than the line density of the first area SA1 and the corner area SA3, therefore, the reflection intensity of the first reflection layer portion 31 provided in the embodiment of the present application is greater than the reflection intensity of the second reflection layer portion 32. That is, when the energy reflection layer 30 provided in the embodiment of the present application includes vanadium dioxide, the vanadium dioxide concentration of the first reflection layer portion 31 is greater than the vanadium dioxide concentration of the second reflection layer portion 32, thereby increasing the reflection intensity of the first reflection portion 31, thereby balancing the temperature distribution of the non-display area SA and the display area AA, and improving the problem of plate cracking caused by excessive temperature difference between different areas. Furthermore, the first reflective layer portion 31 and the second reflective layer portion 32 provided in the embodiment of the present application also extend toward the boundary between the display area AA and the non-display area SA to form a whole, wherein the energy reflective layer 30 exposes the connecting electrode 11 in the display area AA, and the present application does not make any specific limitation on the coverage range of the energy reflective layer 30.

[0072] In some embodiments, the second reflective layer portion 32 improved in the embodiment of the present application may cover the non-transparent area at the display area AA, while exposing the transparent area at the display area AA, so as to improve the light transmittance of the display panel. Fig.16 and Fig.17 As shown, Fig.16 A schematic diagram of the structure of another display panel provided in an embodiment of the present application is shown in FIG. Fig.17 for Fig.16 The cross-sectional view along the DD' direction in the embodiment of the present application includes a plurality of sub-pixels Pi, wherein the sub-pixel Pi includes a transparent area Pi1 and a non-transparent area Pi2; the connecting electrode 11 and the light-emitting element 20 are located in the non-transparent area Pi2; and in the transparent area Pi1, all structural layers on the substrate 101 of the driving substrate 10 are hollowed out, such as Fig.17The surface of the driving substrate 10 is exposed at the transparent area Pi 1 shown; wherein the second reflective layer portion 32 covers at least a portion of the non-transparent area Pi2, and the second reflective layer portion 32 exposes the connecting electrode 11, thereby improving the problem of plate cracking caused by overheating due to absorption of laser energy by the circuit in the non-transparent area Pi2 through the second reflective layer portion 32. The energy reflecting layer 30 provided in the embodiment of the present application may be an insulating reflecting layer. In this case, the energy reflecting layer 30 may be prepared on the surface passivation layer 1013, and there is no need to consider the problem of the energy reflecting layer 30 short-circuiting other circuits. Alternatively, the energy reflecting layer 30 provided in the embodiment of the present application may also be a conductive reflecting layer. For example, when the energy reflecting layer 30 is a phase change material reflecting layer including vanadium dioxide, the energy reflecting layer 30 is conductive, and in this case, the energy reflecting layer 30 is insulated and isolated from the connecting electrode 11 and the chip electrode 21; continue to refer to Fig.17 As shown, the display panel provided in the embodiment of the present application may further include a protective insulating layer 1014 ( Fig.16 The protective insulating layer 1014 (not shown) covers the energy reflecting layer 30, and the stack of the protective insulating layer 1014 and the energy reflecting layer 30 exposes the connecting electrode 11, and the protective insulating layer 1014 can insulate and isolate the energy reflecting layer 30 from the connecting electrode 11 and the chip electrode 21, so as to prevent the energy reflecting layer 30 from short-circuiting different connecting electrodes 11, different chip electrodes 21, the first electrode 111 and the second electrode 112 of the same connecting electrode 11, and the anode 211 and the cathode 212 of the same chip electrode 21.

[0073] refer to Fig.18 , which is a schematic diagram of the structure of another display panel provided in an embodiment of the present application, wherein the second reflective layer portion 32 provided in an embodiment of the present application also covers the transparent area Pi1, thereby preventing the laser from directly irradiating the substrate 101 and causing the substrate 101 to be overheated and cracked. Furthermore, the portion of the second reflective layer portion 32 provided in an embodiment of the present application corresponding to the non-transparent area Pi2 is the third sub-portion 321, and the portion of the second reflective layer portion 32 corresponding to the transparent area Pi1 is the fourth sub-portion 322; the reflection intensity of the third sub-portion 321 is greater than the reflection intensity of the fourth sub-portion 322. It can be understood that since the driving substrate 10 has at least integrated circuits such as pixel circuits in the non-transparent area Pi2, and the transparent area Pi1 directly exposes the surface of the substrate 101, the ability of the non-transparent area Pi2 to absorb laser energy is higher than that of the transparent area Pi1. Therefore, the reflection intensity of the third sub-part 321 is set to be greater than the reflection intensity of the fourth sub-part 322, so as to balance the temperature difference between the non-transparent area Pi2 and the transparent area Pi 1, and avoid the problem of board cracking caused by excessive temperature difference between different areas.

[0074] In some embodiments, when the energy reflection layer 30 provided by the embodiment of the present application simultaneously includes a first sub-portion 311 covering at least a portion of the corner area SA3, a second sub-portion 312 covering at least a portion of the first area SA2, a third sub-portion 321 covering at least a portion of the non-transparent area Pi2, and a fourth sub-portion 322 covering at least a portion of the transparent area Pi1, the reflection intensity of the first sub-portion 311 provided by the embodiment of the present application is greater than the reflection intensity of the second sub-portion 312, the reflection intensity of the second sub-portion 312 is greater than or equal to the reflection intensity of the third sub-portion 321, and the reflection intensity of the third sub-portion 321 is greater than the reflection intensity of the fourth sub-portion 322, thereby balancing the temperature distribution between the non-display area SA and the display area AA, and improving the problem of board cracking caused by excessive temperature difference between different areas. That is, when the energy reflection layer 30 includes vanadium dioxide, the vanadium dioxide concentration of the first sub-portion 311 provided in the embodiment of the present application is greater than the vanadium dioxide concentration of the second sub-portion 312, the vanadium dioxide concentration of the second sub-portion 312 is greater than or equal to the vanadium dioxide concentration of the third sub-portion 321, and the vanadium dioxide concentration of the third sub-portion 321 is greater than the vanadium dioxide concentration of the fourth sub-portion 322. The present application does not make any specific restrictions on this.

[0075] Based on the same inventive concept, the embodiment of the present application also provides an electronic device. Fig.19 , which is a schematic diagram of the structure of an electronic device provided in an embodiment of the present application, wherein the electronic device 1000 provided in an embodiment of the present application includes a display panel provided in any one of the above embodiments.

[0076] In some embodiments, the electronic device 1000 provided in the embodiments of the present application may be a mobile terminal, a notebook, a tablet computer, a computer, a wearable device, a vehicle-mounted display device, or the like, and the present application does not impose any specific restrictions on this.

[0077] In summary, the embodiments of the present application provide a display panel and an electronic device, wherein the display panel includes: a driving substrate, the driving substrate includes a first surface, the first surface exposes a plurality of connecting electrodes; a plurality of light-emitting elements, the light-emitting elements are located on one side of the first surface, the light-emitting elements include chip electrodes, and the chip electrodes are welded and fixed to the connecting electrodes; an energy reflecting layer, the energy reflecting layer covers at least a portion of the first surface.

[0078] From the above content, it can be seen that in the technical solution provided in the embodiment of the present application, the energy reflecting layer can reflect the energy when the chip electrode of the light-emitting element and the connecting electrode of the driving substrate are welded, and the energy reflecting layer also has a certain heat insulation effect. Therefore, an energy reflecting layer is set to cover at least a part of the first surface of the driving substrate, so as to improve the problem of cracking of the plate caused by overheating after the internal circuit of the driving substrate absorbs energy.

[0079] In the description of the embodiments of the present application, it needs to be understood that the orientation or position relationship indicated by terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0080] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the embodiments of the present application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0081] In the embodiments of the present application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection, an electrical connection, or communication with each other; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0082] In the embodiments of the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0083] In the embodiments of the present application, if the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" appear, it means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradicting each other.

[0084] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present application.

Claims

1. A display panel, characterized in that: include: A driving substrate, the driving substrate comprising a first surface, wherein a plurality of connecting electrodes are exposed on the first surface; A plurality of light-emitting elements, wherein the light-emitting elements are located on one side of the first surface, the light-emitting elements include chip electrodes, and the chip electrodes are fixed to the connecting electrodes by welding; An energy reflecting layer covers at least a portion of the first surface.

2. The display panel according to claim 1, characterized in that: The display panel includes a display area and a non-display area outside the display area, and the drive substrate is provided with a scan drive circuit corresponding to the non-display area; The energy reflective layer includes a first reflective layer portion, and the first reflective layer portion covers at least a portion of the non-display area corresponding to the scan driving circuit.

3. The display panel according to claim 2, characterized in that: The non-display area includes a first area in a first direction and located at at least one side of the display area, and the non-display area includes a second area in a second direction and located at at least one side of the display area, and the first direction and the second direction intersect; The first area and the second area are connected at corner areas opposite to each other at the ends; The scan driving circuit is located in the first area, and the scan driving circuit also includes a portion located in the corner area; The first reflective layer partially covers at least a portion of the corner area corresponding to the scan driving circuit.

4. The display panel according to claim 3, characterized in that: The first reflective layer portion also extends to cover at least a portion of the first region corresponding to the scan driving circuit.

5. The display panel according to claim 4, characterized in that: The portion of the first reflective layer portion corresponding to the corner region is a first sub-portion, and the portion of the first reflective layer portion corresponding to the first region is a second sub-portion; The reflection intensity of the first sub-portion is greater than the reflection intensity of the second sub-portion.

6. The display panel according to claim 2, characterized in that: The energy reflective layer further includes a second reflective layer portion, and the second reflective layer portion covers at least a portion of the display area.

7. The display panel according to claim 6, characterized in that: The reflection intensity of the first reflection layer portion is greater than the reflection intensity of the second reflection layer portion.

8. The display panel according to claim 6, characterized in that: The display area includes a plurality of sub-pixels, and the sub-pixels include a transparent area and a non-transparent area; The connecting electrode and the light emitting element are located in the non-transparent area; The second reflective layer partially covers at least a portion of the non-transparent area, and the second reflective layer partially exposes the connecting electrode.

9. The display panel according to claim 8, characterized in that: The second reflective layer portion also covers at least a portion of the transparent area.

10. The display panel according to claim 9, characterized in that: The portion of the second reflective layer portion corresponding to the non-transparent area is a third sub-portion, and the portion of the second reflective layer portion corresponding to the transparent area is a fourth sub-portion; The reflection intensity of the third sub-portion is greater than the reflection intensity of the fourth sub-portion.

11. The display panel according to claim 1, characterized in that: The chip electrode is fixed to the connection electrode by laser welding, wherein the energy reflection layer is a phase change material reflection layer.

12. The display panel according to claim 11, characterized in that: The phase change material reflective layer includes vanadium dioxide.

13. An electronic device, characterized in that: The electronic device comprises the display panel according to any one of claims 1 to 12.

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