Semiconductor module

Abstract

The semiconductor module includes: a substrate; at least one semiconductor element disposed on the first surface of the substrate; a heat dissipation member disposed above the semiconductor element; and an optical fiber cable connected to the semiconductor element. A first direction in which the heat dissipation member extends with respect to the semiconductor element intersects a second direction in which the optical fiber cable extends with respect to the semiconductor element.

Description

Technical Field

[0001] Embodiments of the present invention relate to a semiconductor module. Background Art

[0002] Conventionally, there is a known semiconductor module in which a semiconductor element (hereinafter also referred to as an optical element) that converts an electrical signal into an optical signal is mounted on a substrate. In this semiconductor module, an optical fiber cable that transmits the converted optical signal from the optical element to the outside is sometimes connected (see Patent Document 1).

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent document 1: Japanese Patent Application Publication No. 2020-9824. Summary of the invention

[0006] Problems to be solved by the invention

[0007] The semiconductor module of the present invention comprises: a substrate; at least one semiconductor element arranged on a first surface of the substrate; a heat dissipation component arranged above the semiconductor element; and an optical fiber cable connected to the semiconductor element. In addition, a first direction in which the heat dissipation component extends relative to the semiconductor element and a second direction in which the optical fiber cable extends relative to the semiconductor element intersect. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 This is a perspective view of the semiconductor module according to the embodiment as viewed obliquely from above.

[0009] Figure 2 This is a perspective view of the semiconductor module according to the embodiment as viewed diagonally from below.

[0010] Figure 3 It is a top view of the semiconductor module according to the embodiment.

[0011] Figure 4 It is a side view of the semiconductor module according to the embodiment.

[0012] Figure 5 This is a plan view of a semiconductor module according to another first embodiment.

[0013] Figure 6 This is a plan view of a semiconductor module according to another second embodiment.

[0014] Figure 7 This is a top view of a semiconductor module according to another third embodiment.

[0015] Figure 8 This is a side view of a semiconductor module according to another third embodiment.

[0016] Fig. 9 is along Figure 7 A cross-sectional view along line AA is shown.

[0017] Fig.10 This is a perspective view of a semiconductor module according to another fourth embodiment as viewed obliquely from above.

[0018] Fig.11 is along Fig.10 A cross-sectional view taken along line BB is shown. DETAILED DESCRIPTION

[0019] Hereinafter, the embodiments of the semiconductor module disclosed in the present application will be described with reference to the accompanying drawings. It should be noted that the present invention is not limited to the embodiments shown below. In addition, the various embodiments can be appropriately combined within the scope that does not cause inconsistency in the processing content. In addition, in the following embodiments, the same symbols are marked for the same parts, and repeated descriptions are omitted.

[0020] In the embodiments described below, expressions such as "fixed", "orthogonal", "perpendicular" or "parallel" are sometimes used, but these expressions do not need to be precise "fixed", "orthogonal", "perpendicular" or "parallel". That is, the above expressions allow for deviations such as manufacturing accuracy and setting accuracy.

[0021] In order to facilitate understanding of the description, in the drawings referred to below, an orthogonal coordinate system is sometimes shown which defines mutually orthogonal X-axis, Y-axis, and Z-axis directions and sets the positive Z-axis direction as the vertically upward direction.

[0022] Conventionally, there is known a semiconductor module in which a semiconductor element (hereinafter also referred to as an optical element) that converts an electrical signal into an optical signal is mounted on a substrate. The semiconductor module is sometimes connected to an optical fiber cable that transmits the converted optical signal from the optical element to the outside.

[0023] However, in the above-mentioned prior art, heat generated in various elements such as optical elements mounted on semiconductor modules may cause uneven heat distribution in the extending direction of the optical fiber cable, which may reduce the signal quality of the optical signal transmitted in the optical fiber cable.

[0024] Therefore, it is desired to realize a technology that can overcome the above-mentioned problems and improve the signal quality of optical signals.

[0025] (Implementation Method)

[0026] First, refer to Figure 1 and Figure 2 The overall structure of the semiconductor module 1 according to the embodiment will be described. Figure 1This is a perspective view of the semiconductor module 1 according to the embodiment as viewed from obliquely above. Figure 2 This is a perspective view of the semiconductor module 1 according to the embodiment as viewed diagonally from below.

[0027] It should be noted that, in each of the following embodiments, the semiconductor module 1 is described as an optical module in which the optical element 3 is mounted on a substrate, but the semiconductor module of the present invention is not necessarily an optical module.

[0028] like Figure 1 and Figure 2 As shown, the semiconductor module 1 of the embodiment includes a substrate 2, a plurality of optical elements 3 (optical elements 3a to 3d), and a heat dissipation member 4. The optical element 3 is an example of a semiconductor element.

[0029] The substrate 2 has a rectangular plate shape when viewed from above. In addition to the plurality of optical elements 3a to 3d and the heat sink 4, a power IC 5, a control IC 6, and a chip resistor 7 (see FIG. 1 ) are disposed on the first surface 21 (the upper surface) of the substrate 2. Figure 3 ) etc. In addition, capacitors and coils, etc., which are not shown in the figure, may be arranged on the first surface 21 of the substrate 2.

[0030] A connector 25 is disposed on the second surface 22 (here, the lower surface) of the substrate 2. The substrate 2 is electrically connected to the main board via the connector 25.

[0031] The optical element 3 is a semiconductor element that converts an electrical signal into an optical signal. In addition, the optical element 3 can also convert an optical signal into an electrical signal. An interface 31 is arranged on the upper surface of each optical element 3. The interface 31 is connected to a cable group 32A (see Figure 3 ) is connected to the optical connector 33. Hereinafter, when the optical fiber cable 32 is described, it may also be referred to as the cable group 32A based on the corresponding drawings.

[0032] The heat dissipation component 4 is a so-called heat sink, and is disposed above the plurality of optical elements 3. In addition, the heat dissipation component 4 may not cover the entire top of the plurality of optical elements 3. Figure 1 As shown, the upper surfaces of the plurality of optical elements 3 may be partially exposed from the heat dissipation member 4 .

[0033] The heat dissipation component 4 is close to the plurality of optical elements 3, and discharges the heat generated from the optical elements 3 to the outside of the semiconductor module 1. In addition, the heat dissipation component 4 may be in direct contact with the optical elements 3. Alternatively, the heat dissipation component 4 may be in contact with the optical elements 3 via a thermal interface material (TIM). That is, the heat dissipation component 4 may be thermally connected to the plurality of optical elements 3.

[0034] The heat dissipating member 4 may be formed of a metal having a high thermal conductivity, such as aluminum, copper, or iron. TIM is a composite material containing a thermally conductive filler in a resin.

[0035] The heat dissipation member 4 includes a first portion 41, a plurality of third portions 42, and a plurality of second portions 45. The first portion 41 is spaced apart from the first surface 21 of the substrate 2 by a first gap G1 (see Fig.11 ) are plate-like parts arranged relatively to each other.

[0036] The plurality of third portions 42 are leg-shaped portions provided on the first portion 41. Specifically, the third portion 42 extends from the first portion 41 toward the substrate 2 and is in contact with the substrate 2 (provided on the substrate 2). Fig.11 ) are separated from each other by a third interval G3 (refer to Fig.11 ).

[0037] The third portions 42 are formed in a shape in which the thickness is partially thickened from the first portion 41. The third portion 42 may be integrated with the first portion 41. The plurality of third portions 42 may be connected to the first portion 41 and the substrate 2. The plurality of third portions 42 extend in a fixed direction (here, the X-axis direction).

[0038] The second portion 45 is disposed on the surface of the first portion 41 opposite to the surface facing the substrate 2 and is a portion extending from the first portion 41 along the first direction D1. Figure 1 and Figure 2 , an example is shown in which the second portion 45 has a pin shape (ie, a heat sink pin), but the second portion 45 may also be, for example, a plate shape (ie, a heat sink).

[0039] Then, refer to Figure 3 and Figure 4 The detailed structure of the semiconductor module 1 according to the embodiment will be described. Figure 3 is a top view of a semiconductor module 1 according to an embodiment. Figure 4 is a side view of the semiconductor module 1 according to the embodiment. Figure 3 and Figure 4 In the figure, for ease of understanding, the heat dissipation component 4 is shown with a dotted line.

[0040] like Figure 4 As shown in FIG. 1 , the first direction D1 in which the heat dissipation component 4 extends relative to the optical element 3 is the positive direction of the Z axis. That is, the first direction D1 in which the heat dissipation component 4 dissipates heat is the positive direction of the Z axis. On the other hand, the second direction D2 in which the optical fiber cable 32 extends from the optical element 3 is the positive direction of the X axis.

[0041] That is, in the embodiment, the first direction D1 in which the heat dissipation component 4 extends relative to the optical element 3 may intersect with the second direction D2 in which the optical fiber cable 32 extends relative to the optical element 3. Thus, since the heat generated in the optical element 3 can be dissipated in a direction away from the optical fiber cable 32, the temperature distribution in the extension direction of the optical fiber cable 32 can be uniformed.

[0042] Therefore, according to the embodiment, since it is possible to prevent degradation of signal quality due to non-uniform temperature distribution in the optical fiber cable 32 , it is possible to improve the signal quality of the optical signal.

[0043] In addition, in the embodiment, if Figure 4 As shown, the cable group 32A is preferably arranged to have a portion parallel to the first surface 21 above the substrate 2. The portion of the cable group 32A parallel to the substrate 2 is preferably arranged on the optical element 3 side to which the cable group 32A is connected.

[0044] The cable group 32A may be gradually bent in a direction from the optical element 3 side to which the cable group 32A is connected to the end side of the substrate 2, the end side of the substrate 2 being the direction in which the cable group 32A extends. For example, a portion of the cable group 32A may be bent so that the cable group 32A approaches the first surface 21 of the substrate 2 near the end of the substrate 2 or is in contact with the first surface 21 of the substrate 2.

[0045] The cable group 32A may be arranged in a direction away from the first surface 21 of the substrate 2 near the end of the substrate 2. This is because the direction changes depending on the arrangement or height of the external circuit device connected to the cable group 32A.

[0046] The optical fiber cable 32 (or the cable group 32A) may be parallel to the first surface 21 at least above the substrate 2. Thus, the temperature distribution in the extending direction of the optical fiber cable 32 (or the cable group 32A) can be further uniformed.

[0047] In this case, the optical fiber cable 32 (or the cable group 32A) is preferably formed to extend parallel to the first surface 21 of the substrate 2 over the entire range from the portion connected to the optical element 3 above the substrate 2 to the end of the substrate 2 .

[0048] This is because if a portion of the optical fiber cable 32 (or the cable group 32A) is bent above the substrate 2, the airflow (heat) that hits the bent portion is likely to become turbulent, which is likely to hinder heat dissipation.

[0049] Therefore, according to the embodiment, the signal quality of the optical signal can be further improved.

[0050] like Figure 3As shown, when viewed along the extension direction (X-axis direction) of the optical fiber cable 32, the plurality of optical elements 3a to 3d are arranged in a direction (Y-axis direction) orthogonal to the extension direction. Specifically, the plurality of optical elements 3a to 3d are arranged in the order of optical element 3d, optical element 3c, optical element 3b, and optical element 3a in the positive direction of the Y-axis.

[0051] In addition, the plurality of optical elements 3a to 3d are arranged to be separated from each other. By adopting this structure, when the plurality of optical elements 3a to 3d are arranged on the substrate 2, thermal interference between the optical elements 3a to 3d can be reduced.

[0052] When multiple devices such as optical elements 3a~3d serving as heat sources are arranged on the same substrate, if the distance between the optical elements 3a~3d becomes closer, the heat generated by each optical element 3a~3d is superimposed, and the temperature of the optical elements 3a~3d is sometimes higher than when used individually.

[0053] Through Figure 3 By arranging the plurality of optical elements 3a to 3d separately as shown, it is possible to suppress the accumulation of heat generated by the individual optical elements 3a to 3d. By arranging the power IC 5 and the chip resistor 7 between the optical fiber cables 32, the intervals between the optical elements 3a to 3d can also be widened.

[0054] Specifically, if Figure 3 As shown, among the plurality of optical elements 3a to 3d, the positions of the optical element 3a and the optical element 3b located closest to the optical element 3a are offset in the extending direction (X-axis direction) and the direction orthogonal to the extending direction (Y-axis direction) of the optical fiber cable 32. Similarly, among the plurality of optical elements 3a to 3d, the positions of the optical element 3d and the optical element 3c located closest to the optical element 3d are offset in the X-axis direction and the Y-axis direction.

[0055] Thus, the plurality of optical elements 3 are arranged to be staggered. Thus, in the embodiment, the distance between adjacent optical elements 3 can be ensured, in other words, thermal interference between adjacent optical elements 3 can be suppressed, and the size of the substrate 2 can be reduced.

[0056] Here, an example is described in which two adjacent optical elements (for example, optical element 3a and optical element 3b) among the plurality of optical elements 3a to 3d are separated in the X-axis direction and the Y-axis direction. However, the present invention is not limited to this, and the positions of two adjacent semiconductor elements among all the plurality of optical elements 3a to 3d may be staggered in the extension direction (X-axis direction) of the optical fiber cable 32 and in the direction orthogonal to the extension direction (Y-axis direction).

[0057] For example, the plurality of optical elements 3a to 3d may be arranged in a staggered manner. In this way, thermal interference between the optical elements 3 can be suppressed, and the size of the substrate 2 can be reduced.

[0058] A blower (not shown) such as a cooling fan for blowing air toward the semiconductor module 1 may be disposed on the negative side of the semiconductor module 1 in the X-axis direction. The blower generates air W in the positive direction of the X-axis.

[0059] The wind W blown from the blower contacts the plurality of second portions 45 (see Figure 1 ), and flows along the first surface 21 of the substrate 2 by passing through the ventilation path 100 formed between the substrate 2 and the first portion 41 of the heat dissipation component 4.

[0060] Then, in the embodiment, the wind W contacts the plurality of optical elements 3 disposed on the outlet side of the ventilation passage 100 , so that the heat dissipation efficiency of the plurality of optical elements 3 can be further improved.

[0061] Furthermore, in the embodiment, since the plurality of optical elements 3 are arranged in a direction intersecting the flow direction of the wind W (here, the Y-axis direction), the wind W contacts all the optical elements 3 approximately uniformly. Therefore, according to the embodiment, the heat dissipation efficiency of the plurality of optical elements 3 can be further improved.

[0062] like Figure 3 As shown, the control IC 6 may be disposed below the heat sink 4. Then, the control IC 6 may be thermally connected to the heat sink 4. Thus, the heat generated by the control IC 6 can be efficiently dissipated by the heat sink 4.

[0063] For example, a plurality of power ICs 5 may be arranged on the substrate 2 ( Figure 3 Thus, it is possible to provide the optical element 3 with a plurality of types ( Figure 3 There are four types of reference voltages in the figure to provide power.

[0064] In addition, when looking down at the first surface 21, the power IC 5 may be arranged on the opposite side of the control IC 6 with respect to the optical element 3. For example, the control IC 6 may be arranged on the negative side of the optical element 3 in the X-axis direction, and the power IC 5 may be arranged on the positive side of the optical element 3 in the X-axis direction.

[0065] This can reduce the mutual interference between various wirings (not shown) disposed between the control IC 6 and the optical element 3 and the power IC 5 on the first surface 21 of the substrate 2. Therefore, according to the embodiment, the degree of freedom in wiring design can be ensured.

[0066] The plurality of chip resistors 7 may be arranged close to the corresponding power supply IC 5. That is, when the first surface 21 is viewed in plan, the plurality of chip resistors 7 may be arranged on the opposite side of the control IC 6 with respect to the optical element 3.

[0067] In addition, in the embodiment, if Figure 3 As shown, when looking down at the first surface 21 , at least one of the power IC 5 and the chip resistor 7 may be adjacent to the optical fiber cable 32 and arranged at a position not overlapping with the optical fiber cable 32 .

[0068] Furthermore, when the first surface 21 is viewed in plan, at least one of the power IC 5 and the chip resistor 7 is preferably arranged at a position that does not overlap with the optical element 3 in the X-axis direction.

[0069] Furthermore, when the first surface 21 is viewed in plan, both the power IC 5 and the chip resistor 7 are preferably arranged at a location that does not overlap with the optical element 3 when viewed from the X-axis direction.

[0070] For example, when the first surface 21 is viewed in plan, at least one of the power supply IC 5 and the chip resistor 7 may be arranged between the cable groups 32A adjacent to each other.

[0071] This can reduce a local increase in the temperature of the optical fiber cable 32 caused by heat generated by at least one of the power IC 5 and the chip resistor 7. That is, in the embodiment, the temperature distribution in the extending direction of the optical fiber cable 32 can be made uniform.

[0072] Therefore, according to the embodiment, the signal quality of the optical signal can be improved.

[0073] In the embodiment, either the power IC 5 or the chip resistor 7 may be arranged at a position not overlapping the optical fiber cable 32 , or both the power IC 5 and the chip resistor 7 may be arranged at positions not overlapping the optical fiber cable 32 .

[0074] By arranging both the power IC 5 and the chip resistor 7 at positions not overlapping the optical fiber cable 32, it is possible to further reduce a local temperature increase of the optical fiber cable 32. Therefore, according to the embodiment, the signal quality of the optical signal can be further improved.

[0075] (Another embodiment 1)

[0076] Below, refer to Figure 5 to Figure 11 , other various embodiments of the semiconductor module 1 will be described. Figure 5 This is a plan view of the semiconductor module 1 according to another first embodiment.

[0077] like Figure 5As shown, in another embodiment 1, the configuration of the power IC5 and the chip resistor 7 is different from that in the above embodiment. Specifically, in another embodiment 1, with respect to the wind W blowing from the outside along the first surface 21 of the substrate 2, all the optical elements 3 and all the power IC5 can be arranged at positions that do not interfere with each other.

[0078] Thus, all the optical elements 3 and all the power ICs 5 can be efficiently cooled by the wind W.

[0079] In another first embodiment, the chip resistor 7 may be arranged at a position on the upwind side of the corresponding power supply IC 5 with respect to the wind W blowing from the outside along the first surface 21 of the substrate 2 .

[0080] Thus, the wind W can be blown to both the chip resistor 7 and the power IC 5 located higher than the back of the chip resistor 7. Therefore, according to another first embodiment, the wind W can be used to efficiently cool all the power ICs 5 and all the chip resistors 7.

[0081] In another first embodiment, all the power ICs 5 and all the chip resistors 7 are efficiently cooled by the wind W, so that a local increase in the temperature of the optical fiber cable 32 caused by the heat generated from the power ICs 5 and the chip resistors 7 can be reduced.

[0082] That is, in another embodiment 1, it is possible to make uniform the temperature distribution in the extending direction of the optical fiber cable 32. Therefore, according to another embodiment 1, it is possible to improve the signal quality of the optical signal.

[0083] In addition, it is preferable that the width of the power IC 5 is greater than the width of the chip resistor 7. Here, the width refers to the length in the direction parallel to the first surface 21 of the substrate 2. Figure 5 , is the length in the Y-axis direction.

[0084] Between the power supply IC5 and the chip resistor 7, when the width of the power supply IC5 is greater than (wider than) the width of the chip resistor 7, on the substrate 2, when the power supply IC5 and the chip resistor 7 are arranged in the flow direction of the wind W (in this case, the X-axis direction), the power supply IC5 with a larger width can also be arranged behind the chip resistor 7.

[0085] This is because the wide power IC5 has a portion protruding further than the width of the chip resistor 7, so even if the power IC5 is arranged on the downstream side of the flow direction of the wind W behind the chip resistor 7, the wind W is likely to partially contact the power IC5.

[0086] The power IC 5 may have one of the height (thickness) and the width larger than the chip resistor 7 , or may have both the height (thickness) and the width larger than the chip resistor 7 .

[0087] (Another embodiment 2)

[0088] Figure 6 FIG. 2 is a top view of a semiconductor module 1 according to another embodiment 2. Figure 6 As shown, in another embodiment 2, the structure of the heat sink 4 is different from that of the above embodiment. Specifically, in another embodiment 2, the heat sink 4 may be arranged on the power IC 5 and the chip resistor 7 in addition to the optical element 3 and the control IC 6.

[0089] In another embodiment 2, at least one of the power IC 5 and the chip resistor 7 may be thermally connected to the heat sink 4. Thus, the heat generated in at least one of the power IC 5 and the chip resistor 7 can be efficiently dissipated by the heat sink 4.

[0090] In another second embodiment, by thermally connecting at least one of the power IC 5 and the chip resistor 7 to the heat dissipation component 4, it is possible to reduce a local temperature increase of the optical fiber cable 32 caused by heat generated from at least one of the power IC 5 and the chip resistor 7.

[0091] That is, in another embodiment 2, it is possible to make uniform the temperature distribution in the extending direction of the optical fiber cable 32. Therefore, according to another embodiment 2, it is possible to improve the signal quality of the optical signal.

[0092] In another second embodiment, either the power IC 5 or the chip resistor 7 may be thermally connected to the heat sink 4 , or both the power IC 5 and the chip resistor 7 may be thermally connected to the heat sink 4 .

[0093] By thermally connecting both the power IC 5 and the chip resistor 7 to the heat dissipation member 4 , the heat generated from both the power IC 5 and the chip resistor 7 can be efficiently dissipated by the heat dissipation member 4 .

[0094] (Another embodiment 3)

[0095] Figure 7 is a top view of a semiconductor module 1 according to another third embodiment. Figure 8 1 is a side view of a semiconductor module 1 according to another embodiment 3. Fig. 9 is along Figure 7 A cross-sectional view along line AA is shown.

[0096] like Figure 7 As shown, in another embodiment 3, in addition to the heat dissipating member 4, another heat dissipating member 4A may be provided in the semiconductor module 1. The other heat dissipating member 4A may be formed of a metal having a high thermal conductivity, such as aluminum, copper, or iron.

[0097] like Figure 7As shown, another heat dissipation component 4A can be arranged on the power IC 5 and the chip resistor 7. Fig. 9 As shown, another heat dissipation member 4A may be arranged to surround the peripheral portion of the second surface 22 from above the first surface 21 of the substrate 2 via the side surface 23 of the substrate 2 .

[0098] In another embodiment 3, at least one of the power IC 5 and the chip resistor 7 may be thermally connected to another heat sink 4A. Thus, the heat generated from at least one of the power IC 5 and the chip resistor 7 can be efficiently dissipated by the other heat sink 4A.

[0099] Furthermore, by thermally connecting at least one of the power IC 5 and the chip resistor 7 to another heat sink 4A, a local increase in the temperature of the optical fiber cable 32 due to heat generated from at least one of the power IC 5 and the chip resistor 7 can be reduced.

[0100] That is, in another embodiment 3, it is possible to make uniform the temperature distribution in the extending direction of the optical fiber cable 32. Therefore, according to another embodiment 3, it is possible to improve the signal quality of the optical signal.

[0101] In addition, in another embodiment 3, Figure 8 As shown, the third direction D3 of heat dissipation of another heat dissipation component 4A may also be different from the first direction D1 of heat dissipation of heat dissipation component 4. For example, the first direction D1 of heat dissipation of heat dissipation component 4 is the positive direction of Z axis, and the third direction D3 of heat dissipation of another heat dissipation component 4A may also be the negative direction of Z axis.

[0102] Thus, the optical element 3 , the power IC 5 , the control IC 6 , and the chip resistor 7 arranged on the first surface 21 of the substrate 2 can be cooled more efficiently.

[0103] In another third embodiment, by directing the third direction D3 of heat dissipation of the other heat dissipating component 4A toward the second surface 22 of the substrate 2, it is possible to reduce a local temperature rise of the optical fiber cable 32 caused by heat generated from at least one of the power IC 5 and the chip resistor 7.

[0104] That is, in another embodiment 3, it is possible to make uniform the temperature distribution in the extending direction of the optical fiber cable 32. Therefore, according to another embodiment 3, it is possible to improve the signal quality of the optical signal.

[0105] In addition, in another embodiment 3, Fig. 9 As shown, the other heat sink 4A and the optical fiber cable 32 may be separated from each other. Thus, since the heat transfer from the other heat sink 4A to the optical fiber cable 32 can be reduced, the temperature distribution in the extending direction of the optical fiber cable 32 can be made uniform.

[0106] Therefore, according to another embodiment 3, the signal quality of the optical signal can be improved.

[0107] In another embodiment 3, a heat insulating member may be disposed between the other heat dissipating member 4A and the optical fiber cable 32. This can also reduce the heat transfer from the other heat dissipating member 4A to the optical fiber cable 32.

[0108] In addition, in another embodiment 3, Fig. 9 As shown, the other heat sink member 4A may have a substantially C-shape in cross-section. Thus, the other heat sink member 4A can be fixed to the substrate 2 by being fitted into the other heat sink member 4A from above the substrate 2 .

[0109] Therefore, according to another third embodiment, another heat dissipating member 4A can be easily mounted on the substrate 2 .

[0110] (Another Implementation 4)

[0111] Fig.10 FIG. 1 is a perspective view of a semiconductor module 1 according to another fourth embodiment as viewed from obliquely above. Fig.11 For along Fig.10 A cross-sectional view along line BB is shown.

[0112] like Fig.10 and Fig.11 As shown, in another embodiment 4, the structure of the second portion 45 in the heat dissipation component 4 is similar to that of the above embodiment (refer to Figure 1 Specifically, in another embodiment 4, the second portion 45 may be a plate-shaped heat sink extending from the first portion 41 along the first direction D1.

[0113] In another embodiment 4, for example, Fig.11 As shown, the plurality of second portions 45 are arranged along the first direction D2 (refer to Fig.10 ) are separated from each other by a second interval G2 in a fourth direction D4 (for example, the Y-axis direction) intersecting with each other.

[0114] Thus, compared with a case where the second portion 45 is a heat dissipation pin, the dimension S1 of the second portion 45 in the fourth direction D4 can be reduced, and thus the heat dissipation member 4 can be reduced in weight.

[0115] In addition, in another embodiment 4, Fig.10 As shown, the second interval G2 (refer to Fig.11 ) can also extend along the second direction D2. Thus, due to the wind W (refer to Figure 3 ) flows smoothly along the second gap G2, so the wind W contacts the entire second portion 45 approximately evenly.

[0116] Therefore, according to another fourth embodiment, the heat dissipation efficiency of the heat dissipation member 4 can be further improved.

[0117] In addition, in another embodiment 4, Fig.11 As shown, the dimension S1 of the second portion 45 in the fourth direction D4 may be smaller than the dimension S2 of the third portion 42 in the fourth direction D4. In this way, by reducing the dimension S1 of the second portion 45 (i.e., thinning the second portion 45), the desired heat dissipation efficiency can be achieved even if the heat dissipation component 4 is miniaturized and low-profile.

[0118] That is, in another embodiment 4, by making the dimension S1 of the second portion 45 smaller than the dimension S2 of the third portion 42, the thickness of the third portion 42 can be ensured to stably fix the heat dissipation component 4 to the substrate 2, and the second portion 45 can be made thinner to achieve a small size and low height of the heat dissipation component 4. In addition, in the present invention, the dimension S1 of the second portion 45 in the fourth direction D4 can be, for example, 0.5 mm to 1.0 mm, more specifically, about 0.6 mm. The dimension S2 of the third portion 42 can also be, for example, 1 mm or more.

[0119] In another fourth embodiment, when the dimension of the second gap G2 in the fourth direction D4 is set to S3, the dimension S4 of the interface portion 31 in the fourth direction D4 may satisfy the following formula (1).

[0120] S4 ≥ 2 × S1 + 2 × S3……(1)

[0121] In other words, the size of the heat dissipation component 4 can be determined based on the dimension S4 in the fourth direction D4 of the interface portion 31, which not only reduces the thickness of the second portion 45 (ie, dimension S1), but also reduces the spacing between multiple second portions 45 (ie, dimension S3).

[0122] Thus, since the number of second portions 45 that can be arranged on the upper surface of the first portion 41 can be increased, the heat dissipation efficiency of the heat dissipation component 4 can be further improved. In addition, since the desired heat dissipation efficiency can be achieved even if the heat dissipation component 4 is miniaturized and low-profiled, the heat dissipation component 4 can be miniaturized and low-profiled.

[0123] As mentioned above, although embodiment of this invention was described, this invention is not limited to the said embodiment, Various changes are possible without departing from the summary of this invention.

[0124] Those skilled in the art can easily derive further effects, other modes. Therefore, the broader aspects of the present invention are not limited to the specific details and representative embodiments shown and described above. Therefore, various changes can be made without departing from the spirit or scope of the concept of the overall invention defined by the appended claims and their equivalents.

[0125] It should be noted that the present technology can also adopt the following structure.

[0126] (1) A semiconductor module comprising:

[0127] substrate;

[0128] at least one semiconductor element disposed on the first surface of the substrate;

[0129] A heat dissipation component is disposed above the semiconductor element; and

[0130] A fiber optic cable connected to the semiconductor element,

[0131] A first direction in which the heat dissipation member extends relative to the semiconductor element intersects with a second direction in which the optical fiber cable extends relative to the semiconductor element.

[0132] (2) The semiconductor module according to (1), wherein

[0133] The optical fiber cable has a portion at least above the substrate that is parallel to the first surface.

[0134] (3) The semiconductor module according to (1) or (2), further comprising:

[0135] at least one power IC, disposed on the first surface and supplying power to the semiconductor element; and

[0136] at least one chip resistor, disposed on the first surface and electrically connected to the power IC,

[0137] When the first surface is viewed in plan, at least one of the power IC and the chip resistor is adjacent to the optical fiber cable and is arranged at a location that does not overlap with the optical fiber cable.

[0138] (4) The semiconductor module according to (3), wherein:

[0139] The semiconductor element and the power IC are arranged at locations where they do not interfere with each other with respect to wind blowing from the outside along the first surface of the substrate.

[0140] (5) The semiconductor module according to (3) or (4), wherein:

[0141] The chip resistor is located on the upwind side of the power IC with respect to wind blowing from the outside along the first surface of the substrate.

[0142] (6) The semiconductor module according to any one of (3) to (5), wherein:

[0143] At least one of the power IC and the chip resistor is thermally connected to the heat dissipation member.

[0144] (7) The semiconductor module according to any one of (3) to (5), wherein:

[0145] At least one of the power IC and the chip resistor is thermally connected to another heat dissipation member.

[0146] (8) The semiconductor module according to (7), wherein:

[0147] The third direction in which the other heat dissipation component dissipates heat is different from the first direction.

[0148] (9) The semiconductor module according to any one of (1) to (8), wherein:

[0149] The heat dissipation component at least comprises: a plate-shaped first portion which is spaced apart from the substrate by a first interval and arranged to face the substrate; and a plurality of second portions which extend from the first portion along the first direction.

[0150] The second portion is a plate-shaped heat sink extending along the first direction.

[0151] (10) The semiconductor module according to (9), wherein:

[0152] The plurality of second portions are arranged to be spaced apart from each other by a second interval along a fourth direction intersecting the second direction,

[0153] The second interval extends along the second direction.

[0154] (11) The semiconductor module according to (10), wherein

[0155] The heat dissipation component further includes a plurality of third portions, the plurality of third portions are configured to extend from the first portion toward the substrate to be in contact with the substrate, and are spaced apart from each other by a third interval along the fourth direction.

[0156] A dimension of the second portion in the fourth direction is smaller than a dimension of the third portion in the fourth direction.

[0157] Description of Reference Numerals

[0158] 1: Semiconductor module

[0159] 2: Substrate

[0160] 21: Side 1

[0161] 3. 3a to 3d: Optical element (an example of a semiconductor element)

[0162] 32: Fiber Optic Cable

[0163] 4: Heat dissipation components

[0164] 41: Part 1

[0165] 42: Part 3

[0166] 45: Part 2

[0167] 4A: Another heat sink

[0168] 5: Power IC

[0169] 6: Control IC

[0170] 7: Chip resistor

[0171] D1: First direction

[0172] D2: Second direction

[0173] D3: Third direction

[0174] D4: The fourth direction

[0175] G1: First interval

[0176] G2: Second interval

[0177] G3: Third interval

[0178] S1~S4:Size

[0179] W: Wind

Claims

1. A semiconductor module, wherein: have: substrate; at least one semiconductor element disposed on the first surface of the substrate; A heat dissipation component is arranged above the semiconductor element; as well as A fiber optic cable connected to the semiconductor element, A first direction in which the heat dissipation member extends relative to the semiconductor element intersects with a second direction in which the optical fiber cable extends relative to the semiconductor element.

2. The semiconductor module according to claim 1, wherein: The optical fiber cable has a portion at least above the substrate that is parallel to the first surface.

3. The semiconductor module according to claim 1 or 2, wherein: Also features: at least one power IC, disposed on the first surface and supplying power to the semiconductor element; as well as at least one chip resistor, disposed on the first surface and electrically connected to the power IC, When the first surface is viewed in plan, at least one of the power IC and the chip resistor is adjacent to the optical fiber cable and is arranged at a location that does not overlap with the optical fiber cable.

4. The semiconductor module according to claim 3, wherein: The semiconductor element and the power IC are arranged at locations where they do not interfere with each other with respect to wind blowing from the outside along the first surface of the substrate.

5. The semiconductor module according to claim 3 or 4, wherein: The chip resistor is located on the upwind side of the power IC with respect to wind blowing from the outside along the first surface of the substrate.

6. The semiconductor module according to any one of claims 3 to 5, wherein: At least one of the power IC and the chip resistor is thermally connected to the heat dissipation member.

7. The semiconductor module according to any one of claims 3 to 5, wherein: At least one of the power IC and the chip resistor is thermally connected to another heat dissipation member.

8. The semiconductor module according to claim 7, wherein: The third direction in which the other heat dissipation component dissipates heat is different from the first direction.

9. The semiconductor module according to any one of claims 1 to 8, wherein: The heat dissipation component has at least: a plate-shaped first portion, which is separated from the substrate by a first interval and is arranged to face the substrate; and a plurality of second portions extending from the first portion along the first direction, The second portion is a plate-shaped heat sink extending along the first direction.

10. The semiconductor module according to claim 9, wherein: The plurality of second portions are arranged to be spaced apart from each other by a second interval along a fourth direction intersecting the second direction, The second interval extends along the second direction.

11. The semiconductor module according to claim 10, wherein: The heat dissipation component further includes a plurality of third portions, the plurality of third portions are configured to extend from the first portion toward the substrate to be in contact with the substrate, and are spaced apart from each other by a third interval along the fourth direction. A dimension of the second portion in the fourth direction is smaller than a dimension of the third portion in the fourth direction.

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