Electronic device including reinforcement

Abstract

An electronic device according to one embodiment includes: a first housing; the second shell is capable of rotating relative to the first shell; a hinge structure; a display; a heat sink; a stiffener disposed between the hinge structure and a portion of the display and providing rigidity to the display; and the fixing structure is pressurized by the hinge structure in the folded state. The reinforcement is flat in an unfolded state in which the first direction and the second direction are the same, and at least a portion of the reinforcement is bent by means of a force applied from the hinge structure to the fixed structure in a folded state. Other various embodiments are possible.

Description

Technical Field

[0001] Various embodiments of the present disclosure are directed to an electronic device including a reinforcement member. Background Art

[0002] An electronic device including a large screen display can improve user utilization. As the demand for electronic devices with high portability increases, the electronic device may include a deformable display. The deformable display may be deformable by sliding, by folding, or by rolling.

[0003] For the purpose of helping to understand the present disclosure, the above information may be provided as related art. No claim or determination is made as to whether any of the above content can be applied as prior art related to the present disclosure. Summary of the invention

[0004] Technical Solution The electronic device according to the embodiment may include a first housing, a second housing, a hinge structure, a display, a heat sink, a reinforcement, and a fixed structure. The first housing may include a first surface. The second housing may include a second surface. The second housing may be rotatable relative to the first housing. The hinge structure may include a first hinge plate and a second hinge plate. The second hinge plate may be rotatable relative to the first hinge plate. The display may include a first display area, a second display area, and a third display area. The first display area may be arranged on the first housing. The second display area may be arranged on the second housing. The third display area may be arranged on the hinge structure. The heat sink may include a first section, a second section, and a third section. The first section may be arranged between the first display area and the first surface. The second section may be arranged between the second display area and the second surface. The third section may be arranged between the third display area and the hinge structure. The reinforcement may be arranged between the third display area and the hinge structure. The reinforcement may provide rigidity to the third display area. The fixed structure may be connected to the reinforcement. In a folded state in which a first direction facing the first surface and a second direction facing the second surface are opposite, the fixed structure may be squeezed by the first hinge plate and the second hinge plate. In an unfolded state in which the first direction and the second direction are the same, the reinforcement may be flat. In the folded state, at least a portion of the reinforcement member may be bent by a force applied from the first hinge plate and the second hinge plate to the fixing structure.

[0005] The electronic device according to the embodiment may include a first housing, a second housing, a hinge structure, a display, a flexible printed circuit board, a reinforcement member, and a fixing structure. The first housing may include a first surface. The second housing may include a second surface. The second housing may be rotatable relative to the first housing. The hinge structure may include a hinge bracket, a first hinge plate, and a second hinge plate. The hinge bracket may include a first guide groove and a second guide groove. The first hinge plate may be slidably connected to the first guide groove. The second hinge plate may be slidably connected to the second guide groove. The display may include a first display area, a second display area, and a third display area. The first display area may be provided on the first housing. The second display area may be provided on the second housing. The third display area may be provided on the hinge structure. The flexible printed circuit board may include a first section, a second section, and a third section. The first section may extend from the first printed circuit board in the first housing to between the first display area and the first surface. The second section may extend from the second printed circuit board in the second housing to between the second display area and the second surface. The third section may be provided between the first section and the second section. The third section may be provided between the third display area and the hinge structure. The reinforcement member may be provided between the third display area and the hinge structure. The reinforcement member may provide rigidity to the third display area. The fixing structure may be connected to the reinforcement member. In a folded state in which a first direction facing the first surface and a second direction facing the second surface are opposite, the fixing structure may be squeezed by the first hinge plate and the second hinge plate. In an unfolded state in which the first direction and the second direction are the same, the reinforcement member may be flat. In the folded state, at least a portion of the reinforcement member may be bent by a force applied from the first hinge plate and the second hinge plate to the fixing structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] Figure 1 is a block diagram of an electronic device in a network environment according to an embodiment.

[0007] Figure 2a An exemplary electronic device is shown in an unfolded state.

[0008] Figure 2b A folded state of an exemplary electronic device is shown.

[0009] Figure 2c is an exploded view of an exemplary electronic device.

[0010] Figure 3 An exemplary electronic device is schematically illustrated in an unfolded state.

[0011] Figure 4 An exemplary electronic device is schematically shown in a folded state.

[0012] Figure 5a An exemplary electronic device is schematically illustrated.

[0013] Figure 5b is a plan view of an exemplary heat sink.

[0014] Figure 6 An exemplary electronic device is schematically illustrated in an unfolded state.

[0015] Figure 7 An exemplary electronic device is schematically illustrated in a folded state. DETAILED DESCRIPTION

[0016] Figure 1 is a block diagram illustrating an electronic device 101 in a network environment 100 according to various embodiments.

[0017] Reference Figure 1 , the electronic device 101 in the network environment 100 may communicate with the electronic device 102 via the first network 198 (e.g., a short-range wireless communication network), or communicate with at least one of the electronic device 104 or the server 108 via the second network 199 (e.g., a long-range wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 via the server 108. According to an embodiment, the electronic device 101 may include a processor 120, a memory 130, an input module 150, a sound output module 155, a display module 160, an audio module 170, a sensor module 176, an interface 177, a connection terminal 178, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a user identification module (SIM) 196, or an antenna module 197. In some embodiments, at least one of the above components (e.g., the connection terminal 178) may be omitted from the electronic device 101, or one or more other components may be added to the electronic device 101. In some embodiments, some of the above-described components (eg, sensor module 176 , camera module 180 , or antenna module 197 ) may be implemented as a single component (eg, display module 160 ).

[0018] The processor 120 may run, for example, software (e.g., program 140) to control at least one other component (e.g., hardware component or software component) of the electronic device 101 coupled to the processor 120, and may perform various data processing or calculations. According to one embodiment, as at least part of the data processing or calculation, the processor 120 may store a command or data received from another component (e.g., sensor module 176 or communication module 190) in the volatile memory 132, process the command or data stored in the volatile memory 132, and store the resultant data in the non-volatile memory 134. According to an embodiment, the processor 120 may include a main processor 121 (e.g., a central processing unit (CPU) or an application processor (AP)) or an auxiliary processor 123 (e.g., a graphics processing unit (GPU), a neural processing unit (NPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is independent of or combined with the main processor 121 in operation. For example, when the electronic device 101 includes a main processor 121 and an auxiliary processor 123, the auxiliary processor 123 may be adapted to consume less power than the main processor 121, or adapted to be dedicated to a specific function. The auxiliary processor 123 may be implemented separately from the main processor 121, or as part of the main processor 121.

[0019] When the main processor 121 is in an inactive (e.g., sleep) state, the auxiliary processor 123 (rather than the main processor 121) may control at least some of the functions or states related to at least one component among the components of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190), or when the main processor 121 is in an active state (e.g., running an application), the auxiliary processor 123 may control at least some of the functions or states related to at least one component among the components of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190) together with the main processor 121. According to an embodiment, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., camera module 180 or communication module 190) that is functionally related to the auxiliary processor 123. According to an embodiment, the auxiliary processor 123 (e.g., a neural processing unit) may include a hardware structure dedicated to artificial intelligence model processing. The artificial intelligence model may be generated through machine learning. For example, such learning can be performed by the electronic device 101 where the artificial intelligence model is executed or via a separate server (e.g., server 108). The learning algorithm may include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, for example. The artificial intelligence model may include multiple artificial neural network layers. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), or a deep Q network or a combination of two or more thereof, but is not limited thereto. Additionally or optionally, the artificial intelligence model may include a software structure in addition to a hardware structure.

[0020] The memory 130 may store various data used by at least one component of the electronic device 101 (e.g., the processor 120 or the sensor module 176). The various data may include, for example, software (e.g., the program 140) and input data or output data for commands related thereto. The memory 130 may include a volatile memory 132 or a nonvolatile memory 134.

[0021] The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system (OS) 142 , middleware 144 , or applications 146 .

[0022] The input module 150 may receive a command or data to be used by another component (e.g., the processor 120) of the electronic device 101 from outside (e.g., a user) of the electronic device 101. The input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus).

[0023] The sound output module 155 can output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. The speaker may be used for general purposes such as playing multimedia or playing records. The receiver may be used to receive incoming calls. Depending on the embodiment, the receiver may be implemented as a separate part from the speaker, or as part of the speaker.

[0024] The display module 160 may visually provide information to the outside of the electronic device 101 (e.g., a user). The display module 160 may include, for example, a display, a holographic device, or a projector, and a control circuit for controlling a corresponding one of the display, the holographic device, and the projector. According to an embodiment, the display module 160 may include a touch sensor adapted to detect a touch or a pressure sensor adapted to measure the strength of a force caused by a touch.

[0025] The audio module 170 may convert sound into an electrical signal, or vice versa. According to an embodiment, the audio module 170 may obtain sound via the input module 150, or output sound via the sound output module 155 or an earphone of an external electronic device (e.g., electronic device 102) directly (e.g., wired) coupled to the electronic device 101 or wirelessly coupled.

[0026] The sensor module 176 may detect an operating state (e.g., power or temperature) of the electronic device 101 or an environmental state (e.g., a user's state) outside the electronic device 101, and then generate an electrical signal or data value corresponding to the detected state. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor.

[0027] The interface 177 may support one or more specific protocols to be used to couple the electronic device 101 with an external electronic device (e.g., electronic device 102) (e.g., wired) or wirelessly. According to an embodiment, the interface 177 may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.

[0028] The connection end 178 may include a connector, wherein the electronic device 101 may be physically connected to an external electronic device (e.g., the electronic device 102) via the connector. According to an embodiment, the connection end 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0029] The haptic module 179 may convert the electric signal into mechanical stimulation (eg, vibration or movement) or electric stimulation that can be recognized by the user via his sense of touch or kinesthetic sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electric stimulator.

[0030] The camera module 180 may capture still images or moving images. According to an embodiment, the camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0031] The power management module 188 may manage power supply to the electronic device 101. According to one embodiment, the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0032] The battery 189 may power at least one component of the electronic device 101. According to an embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0033] The communication module 190 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. The communication module 190 may include one or more communication processors capable of operating independently from the processor 120 (e.g., an application processor (AP)), and support direct (e.g., wired) communication or wireless communication. According to an embodiment, the communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules may communicate via a first network 198 (e.g., a short-range communication network such as Bluetooth TM , Wireless Fidelity (Wi-Fi) Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-distance communication network such as a traditional cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN)))) to communicate with an external electronic device. These various types of communication modules may be implemented as a single component (e.g., a single chip), or may be implemented as multiple components (e.g., multiple chips) separated from each other. The wireless communication module 192 may identify and authenticate the electronic device 101 in a communication network (such as the first network 198 or the second network 199) using user information (e.g., an International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196.

[0034] The wireless communication module 192 can support 5G networks after 4G networks and next-generation communication technologies (e.g., new radio (NR) access technologies). NR access technologies can support enhanced mobile broadband (eMBB), massive machine type communications (mMTC), or ultra-reliable low-latency communications (URLLC). The wireless communication module 192 can support high-frequency bands (e.g., millimeter wave bands) to achieve, for example, high data transmission rates. The wireless communication module 192 can support various technologies for ensuring performance on high-frequency bands, such as, for example, beamforming, massive multiple-input multiple-output (massive MIMO), full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. The wireless communication module 192 can support various requirements specified in the electronic device 101, an external electronic device (e.g., electronic device 104), or a network system (e.g., a second network 199). According to an embodiment, the wireless communication module 192 may support a peak data rate for implementing eMBB (e.g., 20 Gbps or greater), loss coverage for implementing mMTC (e.g., 164 dB or less), or U-plane latency for implementing URLLC (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less for a round trip).

[0035] The antenna module 197 may transmit or receive a signal or power to or from the outside of the electronic device 101 (e.g., an external electronic device). According to an embodiment, the antenna module 197 may include an antenna including a radiation element formed of a conductive material or a conductive pattern formed in or on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, the antenna module 197 may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication scheme used in a communication network (such as the first network 198 or the second network 199) may be selected from the plurality of antennas by, for example, the communication module 190 (e.g., the wireless communication module 192). A signal or power may then be transmitted or received between the communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, another component (e.g., a radio frequency integrated circuit (RFIC)) other than the radiation element may be additionally formed as a part of the antenna module 197.

[0036] According to various embodiments, the antenna module 197 may form a millimeter wave antenna module. According to an embodiment, the millimeter wave antenna module may include a printed circuit board, an RFIC, and a plurality of antennas (e.g., array antennas), wherein the RFIC is disposed on a first surface (e.g., bottom surface) of the printed circuit board, or is adjacent to the first surface and is capable of supporting a specified high frequency band (e.g., millimeter wave band), and the plurality of antennas are disposed on a second surface (e.g., top surface or side surface) of the printed circuit board, or is adjacent to the second surface and is capable of transmitting or receiving signals of the specified high frequency band.

[0037] At least some of the above components may be coupled to each other via an inter-peripheral communication scheme (e.g., a bus, a general purpose input output (GPIO), a serial peripheral interface (SPI), or a mobile industry processor interface (MIPI)) and communicatively transmit signals (e.g., commands or data) therebetween.

[0038] According to an embodiment, a command or data may be sent or received between the electronic device 101 and the external electronic device 104 via the server 108 coupled to the second network 199. Each of the electronic device 102 or the electronic device 104 may be a device of the same type as the electronic device 101, or a device of a different type from the electronic device 101. According to an embodiment, all or some operations to be executed in the electronic device 101 may be executed in one or more of the external electronic device 102, the external electronic device 104, or the server 108. For example, if the electronic device 101 should automatically execute a function or service or should execute a function or service in response to a request from a user or another device, the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service instead of executing the function or service, or the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service in addition to executing the function or service. The one or more external electronic devices receiving the request may execute at least part of the requested function or service, or execute another function or another service related to the request, and transmit the result of the execution to the electronic device 101. The electronic device 101 may provide the result as at least a partial reply to the request in the case of further processing the result or in the case of not further processing the result. To this end, for example, cloud computing technology, distributed computing technology, mobile edge computing (MEC) technology or client-server computing technology may be used. The electronic device 101 may use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In another embodiment, the external electronic device 104 may include an Internet of Things (IoT) device. The server 108 may be an intelligent server using machine learning and / or neural networks. According to an embodiment, the external electronic device 104 or the server 108 may be included in the second network 199. The electronic device 101 may be applied to intelligent services (e.g., smart homes, smart cities, smart cars, or health care) based on 5G communication technology or IoT-related technologies.

[0039] Figure 2a An exemplary electronic device is shown in an unfolded state. Figure 2b A folded state of an exemplary electronic device is shown. Figure 2c is an exploded view of an exemplary electronic device.

[0040] Reference Figure 2a , Figure 2b and Figure 2c , electronic devices (e.g. Figure 1 The electronic device 101 may include a first housing 210, a second housing 220, and a display 230 (eg, Figure 1display module 160), at least one camera 240 (eg, Figure 1 camera module 180), a hinge structure 250 and / or at least one electronic component 260.

[0041] The first housing 210 and the second housing 220 may form at least a portion of the outer surface of the electronic device 101 that may be held by a user. When the electronic device 101 is used by the user, at least a portion of the outer surface of the electronic device 101 defined by the first housing 210 and the second housing 220 may contact a portion of the user's body. According to an embodiment, the first housing 210 may include a first surface 211, a second surface 212 facing the first surface 211 and spaced apart from the first surface 211, and a first side surface 213 surrounding at least a portion of the first surface 211 and at least a portion of the second surface 212. The first side surface 213 may connect the periphery of the first surface 211 and the periphery of the second surface 212. The first surface 211, the second surface 212, and the first side surface 213 may define an internal space of the first housing 210. According to an embodiment, the first housing 210 may provide a space formed by the first surface 211, the second surface 212, and the first side surface 213 as a space for arranging at least one component 260 of the electronic device 101.

[0042] According to an embodiment, the second housing 220 may include a third surface 221, a fourth surface 222 facing the third surface 221 and spaced apart from the third surface 221, and a second side surface 223 surrounding at least a portion of the third surface 221 and at least a portion of the fourth surface 222. The second side surface 223 may connect the periphery of the third surface 221 and the periphery of the fourth surface 222. The third surface 221, the fourth surface 222, and the second side surface 223 may define an internal space of the second housing 220. According to an embodiment, the second housing 220 may provide a space formed by the third surface 221, the fourth surface 222, and the second side surface 223 surrounding at least a portion of the third surface 221 and at least a portion of the fourth surface 222 as a space for installing at least one component 260 of the electronic device 101. According to an embodiment, the second housing 220 may be coupled to the first housing 210 so that the second housing 220 is rotatable relative to the first housing 210.

[0043] According to an embodiment, each of the first housing 210 and the second housing 220 may include a first protective member 214 and a second protective member 224, respectively. The first protective member 214 and the second protective member 224 may be provided on the first surface 211 and the third surface 221 along the periphery of the display 230. According to an embodiment, the first protective member 214 and the second protective member 224 may prevent foreign matter (e.g., dust or moisture) from flowing in through the gap between the display 230 and the first housing 210 and the second housing 220. For example, the first protective member 214 may surround the periphery of the first display area 231 of the display 230, and the second protective member 224 may surround the periphery of the second display area 232 of the display 230. The first protective member 214 may be formed by being attached to the first side surface 213 of the first housing 210 or may be formed integrally with the first side surface 213. The second protective member 224 may be formed by being attached to the second side surface 223 of the second housing 220 or may be formed integrally with the second side surface 223.

[0044] According to an embodiment, the first side surface 213 and the second side surface 223 may include a conductive material, a non-conductive material, or a combination thereof. For example, the second side surface 223 may include at least one conductive member 225 and at least one non-conductive member 226. At least one conductive member 225 may include a plurality of conductive members spaced apart from each other. At least one non-conductive member 226 may be disposed between the plurality of conductive members. The plurality of conductive members may be disconnected from each other by at least one non-conductive member 226 disposed between the plurality of conductive members. According to an embodiment, the plurality of conductive members and the plurality of non-conductive members may form an antenna radiator together. The electronic device 101 may be able to communicate with an external electronic device through an antenna radiator formed by a plurality of conductive members and a plurality of non-conductive members.

[0045] The display 230 may be configured to display visual information. According to an embodiment, the display 230 may be arranged on the first surface 211 of the first housing 210 and the third surface 221 of the second housing 220 across the hinge structure 250. For example, the display 230 may include a first display area 231 arranged on the first surface 211 of the first housing, a second display area 232 arranged on the third surface 221 of the second housing, and a third display area 233 arranged between the first display area 231 and the second display area 232. The first display area 231, the second display area 232, and the third display area 233 may form the front surface of the display 230. According to an embodiment, the display 230 may also include a sub-display panel 235 arranged on the fourth surface 222 of the second housing 220. For example, the display 230 may be referred to as a flexible display. According to an embodiment, the display 230 may include a window exposed toward the outside of the electronic device 101. The window may protect the surface of the display 230 and include a substantially transparent material, thereby transmitting the visual information provided by the display 230 to the outside of the electronic device 101. For example, the window may include glass (eg, UTG, ultra-thin glass) and / or polymer (eg, PI, polyimide), but is not limited thereto.

[0046] At least one camera 240 may be configured to obtain an image based on receiving light from a subject outside the electronic device 101. According to an embodiment, the at least one camera 240 may include a first camera 241, a second camera 242, and a third camera 243. The first camera 241 may be disposed in the first housing 210. For example, the first camera 241 may be disposed inside the first housing 210 and at least a portion of them may be visible through the second surface 212 of the first housing 210. The first camera 241 may be supported by a bracket (not shown) in the first housing 210. The first housing 210 may include at least one opening 241a overlapping the first camera 241 when the electronic device 101 is viewed from above. The first camera 241 may obtain an image based on receiving light from outside the electronic device 101 through the at least one opening 241a.

[0047] According to an embodiment, the second camera 242 may be provided in the second housing 220. For example, the second camera 242 may be provided inside the second housing 220 and may be visible through the sub-display panel 235. The second housing 220 may include at least one opening 242a overlapping the second camera 242 when the electronic device 101 is viewed from above. The second camera 242 may obtain an image based on receiving light from the outside of the electronic device 101 through the at least one opening 242a.

[0048] According to an embodiment, the third camera 243 may be provided in the first housing 210. For example, the third camera 243 may be provided inside the first housing 210, and at least a portion thereof may be visible through the first surface 211 of the first housing 210. For another example, the third camera 243 may be provided inside the first housing 210, and at least a portion thereof may be visible through the first display area 231 of the display 230. The first display area 231 of the display 230 may include at least one opening overlapping with the third camera 243 when the display 230 is viewed from above. The third camera 243 may obtain an image based on receiving light from the outside of the display 230 through the at least one opening.

[0049] According to an embodiment, the second camera 242 and the third camera 243 may be disposed below the display 230 (e.g., in a direction toward the interior of the first housing 210 or the interior of the second housing 220). For example, the second camera 242 and the third camera 243 may be under-screen cameras (UDC). In the case where the second camera 242 and the third camera 243 are under-screen cameras, one area of ​​the display 230 corresponding to each position of the second camera 242 and the third camera 243 may be an inactive area. The inactive area of ​​the display 230 may mean an area of ​​the display 230 that does not include pixels or does not emit light to the outside of the electronic device 101. For another example, the second camera 242 and the third camera 243 may be punch hole cameras. In the case where the second camera 242 and the third camera 243 are punch hole cameras, one area of ​​the display 230 corresponding to each position of the second camera 242 and the third camera 243 may be an inactive area.

[0050] According to an embodiment, the hinge structure 250 may rotatably connect the first shell 210 and the second shell 220. The hinge structure 250 may be disposed between the first shell 210 and the second shell 220 of the electronic device 101, so that the electronic device 101 may be curved, curved or folded. For example, the hinge structure 250 may be disposed between a portion of the first side surface 213 and a portion of the second side surface 223, the two portions facing each other. The hinge structure 250 may change the electronic device 101 to an unfolded state in which the first surface 211 of the first shell 210 and the third surface 221 of the second shell 220 face the same direction or a folded state in which the first surface 211 and the third surface 221 face each other. When the electronic device 101 is in a folded state, the first shell 210 and the second shell 220 may be stacked or overlapped by facing each other.

[0051] According to an embodiment, when the electronic device 101 is in a folded state, the direction in which the first surface 211 faces and the direction in which the third surface 221 faces may be different from each other. For example, when the electronic device 101 is in a folded state, the direction in which the first surface 211 faces and the direction in which the third surface 221 faces may be opposite to each other. For another example, when the electronic device 101 is in a folded state, the direction in which the first surface 211 faces and the direction in which the third surface 221 faces may be tilted relative to each other. In the case where the direction in which the first surface 211 faces is tilted relative to the direction in which the third surface 221 faces, the first housing 210 may be tilted relative to the second housing 220.

[0052] According to an embodiment, the electronic device 101 may be foldable based on a folding axis f. The folding axis f may mean a direction parallel to the longitudinal direction of the electronic device 101 (eg, Figure 2a and Figure 2b The folding axis f may be a virtual line extending through the hinge cover 251 on the folding axis d1, but is not limited thereto. For example, the folding axis f may be a virtual line extending through the hinge cover 251 on the folding axis d2 (eg, Figure 2a and Figure 2b In the case where the folding axis f extends in a direction perpendicular to the longitudinal direction of the electronic device 101, the hinge structure 250 may extend in a direction parallel to the folding axis f to connect the first housing 210 and the second housing 220. The first housing 210 and the second housing 220 may be rotatable by the hinge structure 250 extending in a direction perpendicular to the longitudinal direction of the electronic device 101.

[0053] According to an embodiment, the hinge structure 250 may include a hinge cover 251, a first hinge plate 252, a second hinge plate 253, and a hinge module 254. The hinge cover 251 may surround the inner components of the hinge structure 250 and may form the outer surface of the hinge structure 250. According to an embodiment, when the electronic device 101 is in a folded state, at least a portion of the hinge cover 251 surrounding the hinge structure 250 may be exposed to the outside of the electronic device 101 by passing between the first housing 210 and the second housing 220. According to an embodiment, when the electronic device 101 is in an unfolded state, the hinge cover 251 may not be exposed to the outside of the electronic device 101 by being covered by the first housing 210 and the second housing 220.

[0054] According to an embodiment, the first hinge plate 252 and the second hinge plate 253 may be coupled to the first housing 210 and the second housing 220, respectively, thereby rotatably connecting the first housing 210 and the second housing 220. For example, the first hinge plate 252 may be coupled to the first front bracket 215 of the first housing 210, and the second hinge plate 253 may be coupled to the second front bracket 227 of the second housing 220. Since the first hinge plate 252 and the second hinge plate 253 are coupled to the first front bracket 215 and the second front bracket 227, respectively, the first housing 210 and the second housing 220 may be rotatable according to the rotation of the first hinge plate 252 and the rotation of the second hinge plate 253.

[0055] The hinge module 254 can rotate the first hinge plate 252 and the second hinge plate 253. For example, the hinge module 254 can rotate the first hinge plate 252 and the second hinge plate 253 based on the folding axis f by including rotatable gears that mesh with each other. According to an embodiment, the hinge module 254 can be multiple. For example, each of the multiple hinge modules 254 can be spaced apart from each other and disposed at both ends of the first hinge plate 252 and the second hinge plate 253.

[0056] According to an embodiment, the first housing 210 may include a first front bracket 215 and a rear bracket 216, and the second housing 220 may include a second front bracket 227. The first front bracket 215 and the rear bracket 216 may be disposed inside the first housing 210 and may support at least one component 260 of the electronic device 101. The second front bracket 227 may be disposed inside the second housing 220 and may support at least one component 260 of the electronic device 101. For example, the display 230 may be disposed on one surface of the first front bracket 215 and one surface of the second front bracket 227. The rear bracket 216 may be disposed on the other surface of the first front bracket 215 facing one surface of the first front bracket 215.

[0057] According to an embodiment, a portion of the first front bracket 215 may be surrounded by the first side surface 213, and a portion of the second front bracket 227 may be surrounded by the second side surface 223. For example, the first front bracket 215 may be formed integrally with the first side surface 213, and the second front bracket 227 may be formed integrally with the second side surface 223. For another example, the first front bracket 215 may be formed separately from the first side surface 213, and the second front bracket 227 may be formed separately from the second side surface 223.

[0058] At least one electronic component 260 may implement various functions provided to the user. According to an embodiment, at least one electronic component 260 may include a first printed circuit board 261, a second printed circuit board 262, a flexible printed circuit board 263, a battery 264 (eg, Figure 1battery 189) and / or antenna 265 (e.g., Figure 1 The first printed circuit board 261 and the second printed circuit board 262 may respectively form electrical connections for components in the electronic device 101. For example, components for implementing the overall functions of the electronic device 101 (e.g., Figure 1 The processor 120 of the fourth surface 222 may be disposed on the first printed circuit board 261, and the electronic components for implementing some functions of the first printed circuit board 261 may be disposed on the second printed circuit board 262. For another example, the components for operating the sub-display panel 235 disposed on the fourth surface 222 may be disposed on the second printed circuit board 262.

[0059] According to an embodiment, the first printed circuit board 261 may be disposed in the first housing 210. For example, the first printed circuit board 261 may be disposed on one surface of the first front bracket 215. According to an embodiment, the second printed circuit board 262 may be disposed in the second housing 220. For example, the second printed circuit board 262 may be spaced apart from the first printed circuit board 261 and disposed on one surface of the second front bracket 227. The flexible printed circuit board 263 may connect the first printed circuit board 261 and the second printed circuit board 262. For example, the flexible printed circuit board 263 may extend from the first printed circuit board 261 to the second printed circuit board 262.

[0060] The battery 264 is a device for supplying power to at least one component 260 of the electronic device 101, and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery 264 may be substantially disposed on the same plane as the first printed circuit board 261 or the second printed circuit board 262.

[0061] The antenna 265 may be configured to receive power or signals from outside the electronic device 101. According to an embodiment, the antenna 265 may be provided between the rear bracket 216 and the battery 264. The antenna 265 may include, for example, a near field communication (NFC) antenna, an antenna module, and / or a magnetic secure transmission (MST) antenna. The antenna 265 may, for example, perform short-range communication with an external device or wirelessly transmit / receive power required for charging.

[0062] Figure 3 is an exemplary electronic device in an unfolded state along Figure 2a A-A' cut cross-sectional view. Figure 4 is an exemplary electronic device in a folded state along Figure 2b Cross-sectional view of the B-B' cut.

[0063] Reference Figure 3 , Figure 45 , the electronic device 101 according to the embodiment may include a first housing 210 , a second housing 220 , a hinge structure 250 , a display 230 , a heat sink 320 , a reinforcement member 310 and / or a fixing structure 330 .

[0064] The electronic device 101 according to the embodiment may include a first housing 210 and a second housing 220 that can be folded or unfolded with each other. The electronic device 101 according to the embodiment may be referred to as a foldable electronic device 101. The hinge structure 250 may enable the electronic device 101 to switch to a folded state or an unfolded state by rotatably connecting the first housing 210 and the second housing 220 based on a folding axis f. For example, when the first surface 211 (e.g., Figure 2a The first direction D1 of the first surface 211 of the second housing 220 corresponds to the second surface 221 of the second housing 220 (for example, Figure 2a When the first direction D1 (the third surface 221 of the electronic device 101) is facing the second direction D2, the electronic device 101 can be referred to as the unfolded state. For example, when the first direction D1 is opposite to the second direction D2, the electronic device 101 can be referred to as the folded state. For example, when the electronic device 101 is in a state between the folded state and the unfolded state, the electronic device 101 can be referred to as the intermediate state. The hinge structure 250 can maintain the position of the first shell 210 and the position of the second shell 220, so that the angle between the first shell 210 and the second shell 220 has a predetermined angle (for example, 90 degrees) in the intermediate state. The predetermined angle can be greater than the angle between the first shell 210 and the second shell 220 in the folded state, and can be less than the angle between the first shell 210 and the second shell 220 in the unfolded state.

[0065] Reference Figure 3 When the electronic device 101 is in the unfolded state, the first housing 210 and the second housing 220 may be disposed on substantially the same plane. For example, in the unfolded state, the first direction D1 and the second direction D2 may be the same. Figure 4 , when the electronic device 101 is in the folded state, the first housing 210 and the second housing 220 may face each other. For example, in the folded state, the first direction D1 and the second direction D2 may be opposite to each other. According to an embodiment, when the electronic device 101 is in the intermediate state, the first housing 210 and the second housing 220 may form a predetermined angle. For example, in the intermediate state, the first direction D1 and the second direction D2 may form a predetermined angle.

[0066] According to an embodiment, the display 230 may be referred to as a flexible display in which at least a portion of the display 230 (e.g., the third display area 233) may be folded or unfolded. According to an embodiment, the display 230 may have flexibility. For example, the display 230 may include a folding area that may be folded by movement of the first housing 210 or movement of the second housing 220.

[0067] According to an embodiment, the display 230 may include a display panel 230a and a conductive plate 234. The display panel 230a may display visual information (e.g., multimedia data or text data) to a user. For example, the display panel 230a may include a display area for displaying visual information. For example, the display panel 230a may include a first display area 231, a second display area 232, and a third display area 233. The first display area 231 may be disposed on the first surface 211 of the first housing 210. The second display area 232 may be disposed on the second surface 221 of the second housing 220. The third display area 233 may be disposed on the hinge structure 250. When the electronic device 101 is in a folded state, the third display area 233 may be referred to as a foldable area.

[0068] According to an embodiment, the shape of the third display area 233 may be different depending on the state of the electronic device 101. Figure 3 , in the unfolded state, the third display area 233 may be substantially flat. Figure 4 In the folded state, the third display area 233 may be curved. Although not shown, the display 230 may include a window (eg, polyimide (PI) film, ultra-thin glass (UTG)) provided on the display panel 230a.

[0069] According to an embodiment, the conductive plate 234 may be disposed on a surface (e.g., a rear surface) opposite to the surface directed to the outside of the display 230. For example, the conductive plate 234 may be disposed on the rear surface of the display panel 230a. The conductive plate 234 may provide rigidity to the display 230 by supporting the display panel 230a. The conductive plate 234 may shield noise. For example, the conductive plate 234 may be a sheet including a conductive material (e.g., a metal). The conductive plate 234 may include a first portion 234a corresponding to the first display area 231, a second portion 234b corresponding to the second display area 232, and a third portion 234c corresponding to the third display area 233. The first portion 234a may be disposed below the first display area 231, the second portion 234b may be disposed below the second display area 232, and the third portion 234c may be disposed below the third display area 233. At least a portion of the third portion 234c may be bent in a folded state. The third portion 234c may include a pattern 234d. For example, the pattern 234d may be a grid structure including a plurality of openings and / or a plurality of recesses. When the electronic device 101 is in the folded state, the third portion 234c may be bent by the pattern 234d.

[0070] The electronic device 101 according to the embodiment may include a first support plate 351 and a second support plate 352 for supporting a portion of the display 230. The first support plate 351 may be disposed between the first display area 231 and the first surface 211. The second support plate 352 may be disposed between the second display area 232 and the second surface 221. For example, the first support plate 351 may be adhered to the first portion 234a by an adhesive member 353. For example, the second support plate 352 may be adhered to the second portion 234b by an adhesive member 353. For example, the adhesive member 353 may include at least one of an optically clear adhesive (OCA), a pressure sensitive adhesive (PSA), a thermally reactive adhesive, a general adhesive, or an adhesive tape, but is not limited thereto. The first support plate 351 may support the first display area 231, and the second support plate 352 may support the second display area 232. The first support plate 351 and the second support plate 352 may be spaced apart from each other. The first support plate 351 and the second support plate 352 may support the first display area 231 and the second display area 232 in a planar shape to strengthen the rigidity of the display 230.

[0071] According to an embodiment, the first support plate 351 and the second support plate 352 may be rigid so as to support the first display area 231 and the second display area 232, respectively. Because the third display area 233 is curved in the folded state, the support plate may be omitted in the area corresponding to the third display area 233. Because the support plate is omitted in the area corresponding to the third display area 233, a step may be formed between the first support plate 351 and the second support plate 352. The electronic device 101 according to the embodiment may include a leveler 340 to compensate for the step. For example, the leveler 340 may include a film having a certain thickness to compensate for the step, but is not limited thereto. The leveler 340 may be disposed between the first support plate 351 and the second support plate 352. The leveler 340 may reduce the occurrence of wrinkles in the third display area 233 when the electronic device 101 is repeatedly folded and unfolded. For example, the leveler 340 may be flexible. Reducing the occurrence of wrinkles in the third display area may help reduce the stress of the deformed portion of the display. In this way, the durability of the display can be improved.

[0072] According to an embodiment, the hinge structure 250 may include a hinge cover 251, a hinge bracket 255, a first hinge plate 252, and a second hinge plate 253. The hinge cover 251 may define an outer surface of the hinge structure 250. For example, the hinge cover 251 may surround the hinge bracket 255, the first hinge plate 252, and the second hinge plate 253. When the electronic device 101 is in an unfolded state, the hinge cover 251 may be covered by the first housing 210 and the second housing 220. When the electronic device 101 is in a folded state, the hinge cover 251 may be exposed between the first housing 210 and the second housing 220.

[0073] For example, the hinge bracket 255 may support the first hinge plate 252 and the second hinge plate 253. The hinge bracket 255 may be coupled to the first hinge plate 252 and the second hinge plate 253. For example, the first hinge plate 252 may be coupled to the first guide groove 255a of the hinge bracket 255 and may be rotatable along the first guide groove 255a. The second hinge plate 253 may be coupled to the second guide groove 255b different from the first guide groove 255a and may be rotatable along the second guide groove 255b.

[0074] According to an embodiment, the reinforcing member 310 may provide rigidity to the third display area 233. Since the conductive plate 234 includes a pattern in the third portion corresponding to the third display area 233, it may not be sufficient to provide rigidity against an external force applied to the third display area 233. Since the third display area 233 overlaps between the first support plate 351 and the second support plate 352, the first support plate 351 and the second support plate 352 may only support the first display area 231 and the second display area 232. Figure 3 , the reinforcement 310 may be disposed between the third display area 233 and the hinge structure 250. In order to provide rigidity to the third display area 233, the reinforcement 310 may be positioned to overlap with the third display area 233. For example, when the electronic device 101 is viewed from the display 230 toward the hinge cover 251, the third display area 233 and the reinforcement 310 may at least partially overlap. For example, the reinforcement 310 may be a stainless steel (SUS) plate having a thin thickness, but is not limited thereto.

[0075] According to an embodiment, the fixing structure 330 may be configured to press the reinforcement member 310 when the electronic device 101 is in the folded state. Figure 3 , the fixing structure 330 may be connected to the reinforcement member 310. For example, the fixing structure 330 may be attached to the reinforcement member 310 by an adhesive between the fixing structure 330 and the reinforcement member 310, but is not limited thereto. For example, the fixing structure 330 and the reinforcement member 310 may be physically fastened. In the unfolded state, the fixing structure 330 may be spaced apart from the first hinge plate 252 and the second hinge plate 253. In the folded state, the fixing structure 330 may be squeezed by the first hinge plate 252 and the second hinge plate 253 by contacting the first hinge plate 252 and the second hinge plate 253.

[0076] According to an embodiment, the reinforcement 310 may provide rigidity to the third display area 233 by having a shape corresponding to the third display area 233. For example, the fixing structure 330 may include a first fixing structure 331 and a second fixing structure 332 coupled to the reinforcement 310. The first fixing structure 331 may be disposed between the first housing 210 and the first hinge plate 252. The second fixing structure 332 may be disposed between the second housing 220 and the second hinge plate 253. The first fixing structure 331 may be coupled to the first portion 311 of the reinforcement 310. The second fixing structure 332 may be coupled to the second portion 312 spaced apart from the first portion 311 of the reinforcement 310. Figure 3 , in the unfolded state, the first fixing structure 331 may be spaced apart from the first hinge plate 252, and the second fixing structure 332 may be spaced apart from the second hinge plate 253. For example, in the unfolded state, the first fixing structure 331 may be spaced apart from the side surface 252a of the first hinge plate 252 facing the first fixing structure 331. For example, the second fixing structure 332 may be spaced apart from the side surface 253a of the second hinge plate 253 facing the second fixing structure 332. In the unfolded state, the reinforcement 310 may be flat.

[0077] Reference Figure 4, when the electronic device 101 changes from the unfolded state to the folded state, the first hinge plate 252 and the second hinge plate 253 may rotate. For example, as the electronic device 101 changes from the unfolded state to the folded state, the first hinge plate 252 may move along the first guide groove 255a, and the second hinge plate 253 may move along the second guide groove 255b. In the folded state, the first hinge plate 252 and the second hinge plate 253 may contact the fixed structure 330. For example, in the folded state, the side surface 252a of the first hinge plate 252 facing the first fixed structure 331 may contact the first fixed structure 331. For example, the side surface 253a of the second hinge plate 253 facing the second fixed structure 332 may contact the second fixed structure 332. In the folded state, the first fixed structure 331 may be pressed by the first hinge plate 252 in contact with the first fixed structure 331, and the second fixed structure 332 may be pressed by the second hinge plate 253 in contact with the second fixed structure 332. In the folded state, the force provided from the first hinge plate 252 to the first fixing structure 331 and the force provided from the second hinge plate 253 to the second fixing structure 332 may be transmitted to the reinforcement member 310. For example, when the first hinge plate 252 presses the first fixing structure 331, the first fixing structure 331 may press the first portion 311. When the second hinge plate 253 presses the second fixing structure 332, the second fixing structure 332 may press the second portion 312. The reinforcement member 310 may bend without being substantially elongated by the force of pressing the first portion 311 and the force of pressing the second portion 312. The reinforcement member 310 may provide rigidity below the third display area 233 of the display 230.

[0078] According to an embodiment, the reinforcement 310 can reduce damage to the third display area 233 by providing rigidity to the third display area 233. For example, when an external force is applied to the third display area 233, the reinforcement 310 can reduce damage to the third display area 233 by providing rigidity to resist the external force under the third display area 233. When the shape of the third display area 233 changes according to the state of the electronic device 101, the reinforcement 310 can effectively provide rigidity to the third display area 233 by having a shape corresponding to the shape of the third display area 233. The shape of the reinforcement 310 can be deformed independently of the display 230 through the first hinge plate 252, the second hinge plate 253, and the fixing structure 330. Because the shape of the reinforcement 310 can be deformed independently of the display 230, it can be deformed regardless of the shape of the display 230. For example, when the electronic device 101 changes from the unfolded state to the folded state, the reinforcement 310 can be bent by being squeezed by the fixing structure 330. When the electronic device 101 changes from the folded state to the unfolded state, the reinforcement 310 may be flattened again due to the restoring force. According to an embodiment, the reinforcement 310 may provide rigidity to the third display area 233 by deforming to correspond to the shape of the display 230. The shape of the reinforcement 310 may be deformed independently of the display 230.

[0079] According to an embodiment, the heat sink 320 may be configured to dissipate heat generated from the display 230. For example, the heat sink 320 may be configured to dissipate heat generated from the display 230 to the outside. The heat sink 320 may diffuse heat concentrated in a specific area of ​​the display 230 to the entire area of ​​the display 230. For example, the heat sink 320 may be configured to diffuse heat generated from some areas of the display 230 (e.g., the first display area 231) to other areas of the display 230 (e.g., the second display area 232). The heat sink 320 may include a material with high thermal conductivity in order to diffuse heat. For example, the heat sink 320 may include graphite and / or copper, but is not limited thereto.

[0080] According to an embodiment, the shape of the heat sink 320 may correspond to the shape of the display 230. The heat sink 320 may be adhered to the reinforcement 310. For example, the heat sink 320 may include a first section 321, a second section 322, and a third section 323. The second section 322 may be spaced apart from the first section 321. For example, the first section 321 may be disposed between the first surface 211 and the first support plate 351. The second section 322 may be disposed between the second surface 221 and the second support plate 352. The third section 323 may be disposed between the first section 321 and the second section 322.

[0081] According to an embodiment, the first segment 321 may correspond to the first display area 231, and the second segment 322 may correspond to the second display area 232. For example, the first segment 321 may be disposed between the first surface 211 and the display 230. For example, the second segment 322 may be disposed between the second surface 221 and the display 230. The third segment 323 may extend from the first segment 321 to the second segment 322 across the hinge structure 250. According to an embodiment, the third segment 323 may overlap with the hinge structure 250. "Overlapping with the hinge structure 250" may mean that the third segment 323 and the hinge structure 250 are disposed in the same area when the heat sink 320 is viewed from above. The third segment 323 may thermally connect the first segment 321 and the second segment 322. For example, heat generated in the first display area 231 may be transferred to the first segment 321 corresponding to the first display area 231, and may be transferred to the second segment 322 through the third segment 323.

[0082] Reference Figure 3 In the unfolded state, the first section 321, the second section 322 and the third section 323 may be disposed on substantially the same plane. Since the first section 321 and the second section 322 form substantially the same plane in the unfolded state, the first section 321, the second section 322 and the third section 323 may be flat.

[0083] Reference Figure 4 , when changing from the unfolded state to the folded state, the heat sink 320 may be folded based on the folding axis f. When the electronic device 101 changes from the unfolded state to the folded state, at least a portion of the third segment 323 overlapping the hinge structure 250 may be bent. According to an embodiment, in the folded state, the third segment 323 may receive tensile stress from the first segment 321 and the second segment 322. Because the third segment 323 is bent in the folded state, a first force in a direction toward the first segment 321 may be applied to a portion of the third segment 323 connected to the first segment 321, and a second force in a direction toward the second segment 322 may be applied to a portion of the third segment 323 connected to the second segment 322.

[0084] According to an embodiment, the heat sink 320 may include folded portions 320a-1 and 320a-2 to compensate for the first force and the second force. For example, when the electronic device 101 is in the unfolded state, the folded portions 320a-1 and 320a-2 may maintain the folded state. Figure 3 In the unfolded state, the folded portions 320a-1 and 320a-2 may be disposed in the first segment 321 and the second segment 322. For example, the folded portions 320a-1 and 320a-2 may include a first folded portion 320a-1 in the first segment 321 and a second folded portion 320a-2 in the second segment 322. However, it is not limited thereto. For example, in the unfolded state, in addition to Figure 3 In addition to the folded portions 320a-1 and 320a-2 shown, the heat sink 320 may further include additional folded portions.

[0085] Reference Figure 4 When the electronic device 101 changes from the unfolded state to the folded state, both ends of the third segment 323 may be subjected to tensile stress. When the first force and the second force are applied to the third segment 323, the folded portion (e.g., Figure 3 The folded portions 320a-1 and 320a-2) of the heat sink 320 can be unfolded. For example, in the folded state, the first folded portion 320a-1 in the first segment 321 can be unfolded due to a first force applied in a direction from the third segment 323 toward the first segment 321. For example, in the folded state, the second folded portion 320a-2 in the second segment 322 can be unfolded due to a second force applied in a direction from the third segment 323 toward the second segment 322. The unfolding length of the first folded portion 320a-1 can be determined based on the first force. The unfolding length of the second folded portion 320a-2 can be determined based on the second force. When the folded portions 320a-1 and 320a-2 are unfolded, the heat sink 320 can compensate without resisting the first force and the second force. The heat sink 320 may include a material having high thermal conductivity (e.g., graphite), and the elongation of the material having high thermal conductivity may be low. In the case where the heat sink 320 does not include the folded portion 320a, the heat sink 320 may be damaged due to being elongated by the tensile stress in the folded state. According to an embodiment, the folded portion 320a may reduce damage to the heat sink 320 by compensating for the tensile stress.

[0086] According to an embodiment, the length of the folded portions 320a-1 and 320a-2 may be determined based on the difference between the length of the heat sink 320 in the folded state and the length of the heat sink 320 in the unfolded state. The heat sink 320 may effectively dissipate heat from the entire area of ​​the display 230.

[0087] According to an embodiment, the hinge bracket 255 may provide a rotation axis of the first hinge plate 252 and a rotation axis of the second hinge plate 253. For example, the hinge bracket 255 may include a first guide groove 255a accommodating at least a portion of the first hinge plate 252 and a second guide groove 255b accommodating at least a portion of the second hinge plate 253. The first hinge plate 252 may be rotatable along the first guide groove 255a, and the second hinge plate 253 may be rotatable along the second guide groove 255b. The hinge bracket 255 may be disposed in the hinge cover 251. For example, the hinge cover 251 may surround the hinge bracket 255.

[0088] According to an embodiment, the second hinge plate 253 may be rotatable relative to the first hinge plate 252. Figure 3, in the unfolded state of the electronic device 101, the first hinge plate 252 and the second hinge plate 253 may form substantially the same plane. In the folded state of the electronic device 101, the second hinge plate 253 may be spaced apart from the first hinge plate 252. The first hinge plate 252 may be coupled to the first housing 210, and the second hinge plate 253 may be coupled to the second housing 220. Although not shown, a link structure may be provided between the first housing 210 and the first hinge plate 252, and between the second housing 220 and the second hinge plate 253. The first housing 210 and the second housing 220 may be rotatable toward each other through the first hinge plate 252 and the second hinge plate 253.

[0089] According to an embodiment, the rotation angle range of the second housing 220 rotatable relative to the first housing 210 may be different from the rotation angle range of the second hinge plate 253 rotatable relative to the first hinge plate 252. For example, the rotation angle range of the second housing 220 relative to the first housing 210 may be greater than the rotation angle range of the second hinge plate 253 relative to the first hinge plate 252.

[0090] Reference Figure 3 In the unfolded state, the angle between the first shell 210 and the second shell 220 may be about 180 degrees. For example, in the unfolded state, the first shell 210 and the second shell 220 may form substantially the same plane. Figure 4 In the folded state, the first housing 210 and the second housing 220 may be arranged to face each other. For example, when the electronic device 101 changes from the unfolded state to the folded state, each of the first housing 210 and the second housing 220 may be rotated by about 90 degrees.

[0091] Reference Figure 3 In the unfolded state, the angle between the first hinge plate 252 and the second hinge plate 253 may be about 180 degrees. For example, in the unfolded state, the first hinge plate 252 may be parallel to the first display area 231. For example, in the unfolded state, the second hinge plate 253 may be parallel to the second display area 232. Figure 4, in the folded state, the first hinge plate 252 and the second hinge plate 253 may have an inclination relative to the display 230. For example, the first hinge plate 252 may have an inclination relative to the first display area 231. For example, the second hinge plate 253 may have an inclination relative to the second display area 232. For example, the first hinge plate 252 may have an inclination of less than about 90 degrees relative to the first display area 231. For example, the second hinge plate 253 may have an inclination of less than about 90 degrees relative to the second display area 232. For example, when the electronic device 101 changes from the unfolded state to the folded state, each of the first hinge plate 252 and the second hinge plate 253 may rotate at an angle less than about 90 degrees.

[0092] According to an embodiment, in the folded state, the first direction D1 may be inclined relative to the third direction D3 to which the surface of the first hinge plate 252 facing the display 230 is directed. The fourth direction D4 may be referred to as the direction to which the surface of the second hinge plate 253 pointing to the display 230 is directed. According to an embodiment, the second housing 220 may be rotatable within a first angle range of about 0 degrees to about 90 degrees relative to the first housing 210. The second hinge plate 253 may be rotatable within a second angle range of less than about 0 degrees to about 90 degrees relative to the first hinge plate 252. However, the above-mentioned angle ranges are merely exemplary and are not limited thereto.

[0093] According to an embodiment, the state of the electronic device 101 can be changed from the unfolded state to the folded state by the movement of the first hinge plate 252 and / or the movement of the second hinge plate 253. Because the rotation angle ranges of the first hinge plate 252 and the second hinge plate 253 and the rotation angle ranges of the first housing 210 and the second housing 220 are different, the electronic device 101 according to the embodiment can provide a structure in which the curvature of the display 230 changes smoothly in the folded state. For example, in the case where the first hinge plate 252 and the second hinge plate 253 face each other, the curvature of the display 230 supported by the first hinge plate 252 and the second hinge plate 253 can be quickly changed between the first hinge plate 252 and the second hinge plate 253. According to an embodiment, because the first hinge plate 252 and the second hinge plate 253 are inclined relative to each other in the folded state, the curvature change of the display 230 can become gentle. Because the curvature of the display 230 changes smoothly, damage to the display 230 can be reduced. For example, in the folded state, the formation of wrinkles can be reduced in the area where the display 230 is folded (e.g., the third display area 233). Reducing the occurrence of wrinkles in the third display area can help reduce the stress in the area where the display is deformed (e.g., the third display area). In this way, the durability of the display can be improved.

[0094] Figure 5aAn exemplary electronic device is schematically illustrated. Figure 5b is a plan view of an exemplary heat sink.

[0095] According to one embodiment, the relative arrangement structure of the heat sink 320 and the reinforcement member 310 can be various. Figure 4 As shown, the reinforcement member 310 may be disposed on the hinge structure 250 and the heat sink 320 may be disposed on the reinforcement member 310. However, it is not limited thereto. Figure 5a , the heat sink 320 may be disposed on the hinge structure 250 and the reinforcement 310 may be disposed on the heat sink 320. For example, the heat sink 320 may be disposed between the hinge structure 250 and the reinforcement 310.

[0096] According to an embodiment, in the case where the reinforcement 310 is disposed on the heat sink 320, the fixing structure 330 may be disposed to pass through the heat sink 320 so as to be connected to the reinforcement 310. For example, the fixing structure 330 may pass through the heat sink 320 and be connected to the reinforcement 310 disposed on the heat sink 320.

[0097] Reference Figure 5b, the heat sink 320 may include an opening 324. The fixing structure 330 may pass through the opening 324. The opening 324 may be provided at a position corresponding to the fixing structure 330. For example, the fixing structure 330 may include a first fixing structure 331, a second fixing structure 332, a third fixing structure 333, and / or a fourth fixing structure 334. The first fixing structure 331 and the third fixing structure 333 may be provided closer to the first housing 210 among the first housing 210 and the second housing 220. The second fixing structure 332 and the fourth fixing structure 334 may be provided closer to the second housing 220 among the first housing 210 and the second housing 220. The opening 324 may include a first opening 324a, a second opening 324b, a third opening 324c, and / or a fourth opening 324d. When the heat sink 320 is viewed in a direction from the heat sink 320 toward the reinforcement 310, the first opening 324a may overlap with the first fixing structure 331. The second opening 324b may overlap with the second fixing structure 332. The third opening 324c may overlap with the third fixing structure 333. The fourth opening 324d may overlap with the fourth fixing structure 334. When the electronic device 101 is changed from the unfolded state to the folded state, the first fixing structure 331 and the third fixing structure 333 may be squeezed by the first hinge plate 252, and the second fixing structure 332 and the fourth fixing structure 334 may be squeezed by the second hinge plate 253. The first fixing structure 331, the second fixing structure 332, the third fixing structure 333 and / or the fourth fixing structure 334 may change the shape of the reinforcement 310 by passing through the heat sink 320 and connecting to the reinforcement 310 when being squeezed by the first hinge plate 252 and the second hinge plate 253. In the folded state, the reinforcement 310 may be bent by the first fixing structure 331, the second fixing structure 332, the third fixing structure 333 and / or the fourth fixing structure 334. According to the embodiment, the arrangement structure of the reinforcement 310 and the heat sink 320 may be various.

[0098] Figure 6 An exemplary electronic device is schematically illustrated in an unfolded state. Figure 7 An exemplary electronic device is schematically illustrated in a folded state.

[0099] Reference Figure 6 and Figure 7, the electronic device 101 according to the embodiment may include a flexible printed circuit board 263. The flexible printed circuit board 263 may include a plurality of conductive layers and a plurality of non-conductive layers alternately laminated with the plurality of conductive layers. The flexible printed circuit board 263 may provide electrical connections between the printed circuit board and / or various electronic components disposed outside the printed circuit board by using wiring and conductive paths formed in the conductive layers. The flexible printed circuit board 263 may electrically connect the first printed circuit board 261 in the first housing 210 and the second printed circuit board 262 in the second housing 220. For example, the flexible printed circuit board 263 may be configured to transmit electrical signals from the printed circuit board in the first housing 210 to the second printed circuit board 262. For example, the flexible printed circuit board 263 may electrically connect various electronic components disposed on the first printed circuit board 261 and various electronic components disposed on the second printed circuit board 262.

[0100] Reference Figure 6 , the flexible printed circuit board 263 may be arranged across the first printed circuit board 261 and the second printed circuit board 262 to electrically connect the first printed circuit board 261 and the second printed circuit board 262. For example, the flexible printed circuit board 263 may extend from the first printed circuit board 261 in the first housing 210 to the first surface 211 of the first housing 210, across the hinge structure 250, and to the second printed circuit board 262 in the second housing 220.

[0101] According to an embodiment, the flexible printed circuit board 263 may include a first section 263a, a second section 263b, and a third section 263c. The first section 263a may be connected to the first printed circuit board 261. For example, a portion of the first section 263a may be inserted into the first housing 210 and connected to the first printed circuit board 261, and the rest of the first section 263a may be disposed between the first display area 231 and the first surface 211. A portion of the second section 263b may be inserted into the second housing 220 and connected to the second printed circuit board 262, and the rest of the second section 263b may be disposed between the second display area 232 and the second surface 221. The third section 263c may be disposed between the first section 263a and the second section 263b. The third section 263c may be disposed between the third display area 233 and the hinge structure 250.

[0102] According to an embodiment, the flexible printed circuit board 263 may be disposed between the reinforcement 310 and the third display area 233, but is not limited thereto. For example, the flexible printed circuit board 263 may be disposed between the reinforcement 310 and the hinge structure 250 (e.g., the first hinge plate 252 and the second hinge plate 253). The shape of the flexible printed circuit board 263 may be deformed according to the state of the electronic device 101. The shape of the flexible printed circuit board 263 may be deformed independently of the display 230 through the first hinge plate 252, the second hinge plate 253, the fixing structure 330, and the reinforcement 310.

[0103] According to an embodiment, the third segment 263c may overlap with the hinge structure 250. For example, the third segment 263c may be connected from the first segment 263a across the hinge structure 250 to the second segment 263b. Because the third segment 263c overlaps with the hinge structure 250, the shape of the third segment 263c in the unfolded state and the shape of the third segment 263c in the folded state may be different. For example, in the unfolded state, the third segment 263c may be arranged on substantially the same plane as the first segment 263a and the second segment 263b. In the unfolded state, because the first segment 263a and the second segment 263b form substantially the same plane, the first segment 263a, the second segment 263b and the third segment 263c may be flat.

[0104] Reference Figure 6 , when the electronic device 101 is in the unfolded state, the flexible printed circuit board 263 may be flat. Figure 7 , when the electronic device 101 changes from the unfolded state to the folded state, the flexible printed circuit board 263 may be bent by being pressed by the fixed structure 330. For example, in the folded state, the first hinge plate 252 and the second hinge plate 253 may press the fixed structure 330. The fixed structure 330 may press the reinforcement 310 by being pressed from the first hinge plate 252 and the second hinge plate 253. The reinforcement 310 may be bent due to the force, and the third section 263c of the flexible printed circuit board 263 in contact with the reinforcement 310 may also be bent. When the electronic device 101 changes from the folded state to the unfolded state, the reinforcement 310 may become flat again due to the restoring force. As the reinforcement 310 becomes flat, the third section 263c may also become flat.

[0105] According to an embodiment, in the unfolded state, the flexible printed circuit board 263 may be subjected to tensile stress. Since the third segment 263c is bent in the folded state, a first force in a direction toward the first segment 263a may be applied to a portion of the third segment 263c connected to the first segment 263a, and a second force in a direction toward the second segment 263b may be applied to a portion of the third segment 263c connected to the second segment 263b.

[0106] According to an embodiment, the flexible printed circuit board 263 may include folded portions 263d-1 and 263d-2 to compensate for the first force and the second force. For example, when the electronic device 101 is in the unfolded state, the folded portions 263d-1 and 263d-2 may maintain the folded state. Figure 6 In the unfolded state, the folded portions 263d-1 and 263d-2 may be provided in the first segment 263a and the second segment 263b. For example, the folded portions 263d-1 and 263d-2 may include the first folded portion 263d-1 in the first segment 263a and the second folded portion 263d-2 in the second segment 263b. However, it is not limited thereto. For example, in the unfolded state, in addition to Figure 6 In addition to the folded portions 263d-1 and 263d-2 shown, the flexible printed circuit board 263 may further include additional folded portions.

[0107] Reference Figure 7 , when the electronic device 101 changes from the unfolded state to the folded state, both ends of the third segment 263c are subjected to tensile stress. When the first force and the second force are applied to the third segment 263c, the folded portions 263d-1 and 263d-2 can be unfolded. For example, in the folded state, the first folded portion 263d-1 in the first segment 263a can be unfolded due to the first force applied in the direction from the third segment 263c toward the first segment 263a. For example, in the folded state, the second folded portion 263d-2 in the second segment 263b can be unfolded due to the second force applied in the direction from the third segment 263c toward the second segment 263b. The unfolded length of the first folded portion 263d-1 can be determined based on the first force. The unfolded length of the second folded portion 263d-2 can be determined based on the second force. When the folded portions 263d-1 and 263d-2 are unfolded, the flexible printed circuit board 263 can be compensated without resisting the first force and the second force. In the case where the flexible printed circuit board 263 does not include the folded portions 263d-1 and 263d-2, the flexible printed circuit board 263 may be damaged because it is stretched due to tensile stress in the folded state. The folded portions 263d-1 and 263d-2 can reduce damage to the flexible printed circuit board 263 by compensating for the tensile stress. According to an embodiment, the folded portions 263d-1 and 263d-2 can reduce damage to the printed circuit board 263 by compensating for the tensile stress. In this way, the stress on the component (e.g., the printed circuit board 263) will be reduced and the durability of the component can be improved. According to an embodiment, the flexible printed circuit board 263 can stably connect the first printed circuit board 261 and the second printed circuit board 262.

[0108] Figure 3 and Figure 4The electronic device 101 shown includes a heat sink 320, and FIG. 5 and FIG. Figure 6 The illustrated electronic device 101 is shown to include the flexible printed circuit board 263 , but is not limited thereto. For example, the electronic device 101 according to the embodiment may include both the heat sink 320 and the flexible printed circuit board 263 .

[0109] According to an electronic device (eg, Figure 3 The electronic device 101 may include a first housing (eg, Figure 3 The first shell 210), the second shell (for example, Figure 3 The second housing 320), the hinge structure (for example, Figure 3 hinge structure 250), a display (eg, Figure 3 display 230), a heat sink (e.g., Figure 3 heat sink 320), reinforcement (e.g., Figure 3 reinforcement member 310) and a fixing structure (e.g., Figure 3 The first housing may include a first surface (eg, Figure 3 The second housing may include a second surface (eg, Figure 3 The second housing may be rotatable relative to the first housing. The hinge structure may include a first hinge plate (eg, Figure 3 The first hinge plate 252 and the second hinge plate (eg, Figure 3 The second hinge plate 253 may be rotatable relative to the first hinge plate. The display may include a first display area (eg, Figure 3 The first display area 231), the second display area (for example, Figure 3 The second display area 232) and the third display area (eg, Figure 3 The first display area may be disposed on the first housing. The second display area may be disposed on the second housing. The third display area may be disposed on the hinge structure. The heat sink may include a first section (e.g., Figure 3 321), the second paragraph (for example, Figure 3 322) and the third paragraph (e.g. Figure 3 The first segment may be disposed between the first display area and the first surface. The second segment may be disposed between the second display area and the second surface. The third segment may be disposed between the third display area and the hinge structure. The reinforcement may be disposed between the third display area and the hinge structure. The reinforcement may provide rigidity to the third display area. The fixing structure may be connected to the reinforcement. In a first direction (e.g., Figure 4and the second direction D1 of the second surface 221 (eg, Figure 4 In a folded state in which the first hinge plate and the second hinge plate are opposite to each other in a second direction D2), the fixed structure may be squeezed by the first hinge plate and the second hinge plate. In an unfolded state in which the first direction and the second direction are the same, the reinforcement may be flat. In the folded state, at least a portion of the reinforcement may be bent by a force applied from the first hinge plate and the second hinge plate to the fixed structure. According to an embodiment of the present disclosure, the reinforcement may provide rigidity to the third display area. When the first hinge plate and the second hinge plate are squeezed by the fixed structure, the shape of the reinforcement may be deformed to correspond to the shape of the third display area. The reinforcement may provide rigidity to the third display area by deforming independently of the display. According to an embodiment, the heat sink may effectively dissipate heat from the display by corresponding to the entire area of ​​the display.

[0110] According to an embodiment, in the unfolded state in which the first direction and the second direction are the same, the fixing structure may be aligned with a side surface of the first hinge plate facing the fixing structure (eg, Figure 3 and a side surface 252a of the second hinge plate facing the fixed structure (eg, Figure 3 In the folded state, the fixing structure may be spaced apart from the side surface 253a of the first hinge plate and the second hinge plate. In the folded state, the fixing structure may be in contact with the side surface of the first hinge plate and the side surface of the second hinge plate. According to an embodiment of the present disclosure, in the unfolded state, the fixing structure is spaced apart from the first hinge plate and the second hinge plate, and therefore may not be squeezed. In the unfolded state, the reinforcement may be flat. In the folded state, the fixing structure may be squeezed from the first hinge plate and the second hinge plate. Because the fixing structure is coupled to the reinforcement, the reinforcement may be bent by the force transmitted from the first hinge plate and the second hinge plate. When the electronic device is in the unfolded state or the folded state, the reinforcement may provide rigidity to the third display area by corresponding to the third display area.

[0111] The electronic device according to the embodiment may further include a first fixing structure (eg, Figure 3 The first fixing structure 331 and the second fixing structure (eg, Figure 3The second fixing structure 332). The first fixing structure may be connected to the reinforcement. The first fixing structure may be disposed between the first housing and the first hinge plate. The second fixing structure may be connected to the reinforcement. The second fixing structure may be disposed between the second housing and the second hinge plate. The first fixing structure may be spaced apart from the first hinge plate in the unfolded state. The first fixing structure may be squeezed by the first hinge plate in the folded state. The second fixing structure may be spaced apart from the second hinge plate in the unfolded state. The second fixing structure may be squeezed by the second hinge plate in the folded state. According to an embodiment of the present disclosure, the first fixing structure may be squeezed by the first hinge plate, and the second fixing structure may be squeezed by the second hinge plate. In the folded state, the first fixing structure and the second fixing structure may bend the reinforcement by squeezing the reinforcement in different directions. The shape of the reinforcement in the folded state may be a water drop shape, but is not limited thereto.

[0112] According to an embodiment, the heat sink may include a folded portion (eg, Figure 3 Folding parts 320a-1 and 320a-2). The folding part can be arranged in the first section and the second section. The folding part can be folded in the unfolded state. When the electronic device changes from the unfolded state to the folded state, the folding part can be unfolded. According to an embodiment of the present disclosure, in the folded state, the heat sink can be subjected to tensile stress. When the length of the heat sink is fixed, when tensile stress is applied, the heat sink can be stretched while resisting the tensile stress. The heat sink may be damaged by being stretched. According to an embodiment, the folding part can compensate for the tensile stress in the folded state. The folding part can maintain the folded state in the unfolded state, and the folding part can compensate for the tensile stress by unfolding in the folded state. According to an embodiment, since damage to the heat sink can be reduced, the heat sink can effectively dissipate heat for the display.

[0113] According to an embodiment, the shape of the heat sink corresponds to the shape of the display. According to an embodiment of the present disclosure, the heat sink may include a first section corresponding to the first display area, a second section corresponding to the second display area, and a third section corresponding to the hinge structure. The third section may thermally connect the first section and the second section. According to an embodiment, the heat sink may effectively dissipate heat for the entire display area.

[0114] According to an embodiment, the hinge structure may include a hinge bracket (e.g., Figure 3 The hinge bracket 255 may include a first guide groove (eg, Figure 3 The first guide groove 255a and the second guide groove (eg, Figure 3 The first guide groove may be slidably connected to the first hinge plate. The second guide groove may be slidably connected to the second hinge plate.

[0115] According to an embodiment, the second housing can rotate relative to the first housing within a first angle range. The second hinge plate can rotate relative to the first hinge plate within a second angle range smaller than the first angle range.

[0116] According to an embodiment, the first direction may be inclined relative to a third direction to which the surface of the first hinge plate pointing to the display is oriented in the folded state. According to an embodiment of the present disclosure, since the first hinge plate and the second hinge plate are inclined relative to each other in the folded state, the curvature change of the display may become gentle. Since the curvature of the display changes smoothly, damage to the display may be reduced. For example, in the folded state, the formation of wrinkles may be reduced in an area where the display is folded (e.g., the third display area). Reducing damage to an area of ​​the display may help reduce stress in an area where the display is deformed. In this way, the durability of the display may be improved.

[0117] The electronic device according to the embodiment may further include a first support plate (eg, Figure 3 The first support plate 351 and the second support plate (eg, Figure 3 The first support plate may be disposed between the first display area and the first surface. The first support plate may support the first display area. The second support plate may be disposed between the second display area and the second surface. The second support plate may support the second display area. The first segment may be disposed between the first surface and the first support plate. The second segment may be disposed between the second surface and the second support plate.

[0118] The electronic device according to the embodiment may further include a leveler (eg, Figure 3 The leveler 340 may be provided between the first support plate and the second support plate. According to an embodiment of the present disclosure, the first display area and the second display area may be supported by the first support plate and the second support plate, respectively. The first display area may correspond to the first shell, and the second display area may correspond to the second shell. The first support plate may support the first display area between the first shell and the first display area. The second support plate may support the second display area between the second shell and the second display area. The leveler may compensate for the step between the first support plate and the second support plate.

[0119] According to an embodiment, the reinforcement member may be disposed on the hinge structure. The heat sink may be disposed on the reinforcement member.

[0120] According to an embodiment, the reinforcement member may be disposed on the hinge structure. The reinforcement member may be disposed on the heat sink.

[0121] According to an embodiment, the heat sink may include an opening (e.g., Figure 3The fixing structure may be coupled to the reinforcement member by passing through the opening. According to an embodiment of the present disclosure, the relative arrangement structure of the heat sink and the reinforcement member may be various. In the case where the heat sink may be arranged on the hinge structure and the reinforcement member is arranged on the heat sink, the fixing structure may be coupled to the reinforcement member through the opening of the heat sink. According to an embodiment, various types of designs of the electronic device may be possible.

[0122] According to an embodiment, when the electronic device changes from a folded state to an unfolded state, the reinforcement may be flattened by a restoring force of the reinforcement. According to an embodiment of the present disclosure, when the electronic device changes from a folded state to an unfolded state, the reinforcement may be flattened by a restoring force independently of the display.

[0123] According to an embodiment, a reinforcement member may be attached to the heat sink. According to an embodiment of the present invention, a reinforcement member may be attached to the heat sink, and thus when the shape of the reinforcement member is deformed, the shape of the heat sink is also deformed.

[0124] According to an electronic device (eg, Figure 3 The electronic device 101 may include a first housing (eg, Figure 3 The first shell 210), the second shell (for example, Figure 3 The second housing 320), the hinge structure (for example, Figure 3 hinge structure 250), a display (eg, Figure 3 display 230), a flexible printed circuit board (e.g., Figure 6 Flexible printed circuit board 263), reinforcement (e.g., Figure 3 reinforcement member 310) and a fixing structure (e.g., Figure 3 The first housing may include a first surface (eg, Figure 3 The second housing may include a second surface (eg, Figure 3 The second housing may be rotatable relative to the first housing. The hinge structure may include a hinge bracket (eg, Figure 3 The hinge bracket 255), the first hinge plate (eg, Figure 3 The first hinge plate 252 and the second hinge plate (eg, Figure 3 The hinge bracket may include a first guide groove (eg, Figure 3 The first guide groove 255a and the second guide groove (eg, Figure 3 The first hinge plate may be slidably connected to the first guide groove. The second hinge plate may be slidably connected to a second guide groove different from the first guide groove. The display may include a first display area (eg, Figure 3The first display area 231), the second display area (for example, Figure 3 The second display area 232) and the third display area (eg, Figure 3 The first display area may be disposed on the first housing. The second display area may be disposed on the second housing. The third display area may be disposed on the hinge structure. The flexible printed circuit board may include a first section (e.g., Figure 6 263a), the second paragraph (e.g. Figure 6 263b) and the third paragraph (e.g. Figure 6 The first section may be formed from a first printed circuit board (eg, Figure 6 The second section may be formed from a first printed circuit board 261 in the second housing (eg, Figure 6 The first section may be disposed between the first section and the second section. The third section may be disposed between the third display area and the hinge structure. The reinforcement member may be disposed between the third display area and the hinge structure. The reinforcement member may provide rigidity to the third display area. The fixing structure may be connected to the reinforcement member. In a first direction (e.g., Figure 4 The first direction D1 of the second surface and the second direction D2 of the second surface (for example, Figure 4 In a folded state in which the first hinge plate and the second hinge plate are opposite to each other in a second direction D2), the fixed structure may be squeezed by the first hinge plate and the second hinge plate. In an unfolded state in which the first direction and the second direction are the same, the reinforcement may be flat. In the folded state, at least a portion of the reinforcement may be bent by a force applied from the first hinge plate and the second hinge plate to the fixed structure. According to an embodiment of the present disclosure, the reinforcement may provide rigidity to the third display area. When the first hinge plate and the second hinge plate are squeezed by the fixed structure, the shape of the reinforcement may be deformed to correspond to the shape of the third display area. The reinforcement may provide rigidity to the third display area by deforming independently of the display.

[0125] According to an embodiment, in the unfolded state in which the first direction and the second direction are the same, the fixing structure may be aligned with a side surface of the first hinge plate facing the fixing structure (eg, Figure 3 and a side surface 252a of the second hinge plate facing the fixed structure (eg, Figure 3In the folded state, the fixing structure may be spaced apart from the side surface 252b of the first hinge plate and the side surface of the second hinge plate. According to an embodiment of the present disclosure, the fixing structure is spaced apart from the first hinge plate and the second hinge plate in the unfolded state, and therefore may not be squeezed. In the unfolded state, the reinforcement may be flat. In the folded state, the fixing structure may be squeezed from the first hinge plate and the second hinge plate. Because the fixing structure is coupled to the reinforcement, the reinforcement may be bent by the force transmitted from the first hinge plate and the second hinge plate. When the electronic device is in the unfolded state or the folded state, the reinforcement may provide rigidity to the third display area by corresponding to the third display area.

[0126] The electronic device according to the embodiment may further include a first fixing structure (eg, Figure 6 The first fixing structure 331 and the second fixing structure (eg, Figure 6 The second fixing structure 332). The first fixing structure may be connected to the reinforcement. The first fixing structure may be disposed between the first housing and the first hinge plate. The second fixing structure may be connected to the reinforcement. The second fixing structure may be disposed between the second housing and the second hinge plate. The first fixing structure may be spaced apart from the first hinge plate in the unfolded state. The first fixing structure may be squeezed by the first hinge plate in the folded state. The second fixing structure may be spaced apart from the second hinge plate in the unfolded state. The second fixing structure may be squeezed by the second hinge plate in the folded state. According to an embodiment of the present disclosure, the first fixing structure may be squeezed by the first hinge plate, and the second fixing structure may be squeezed by the second hinge plate. In the folded state, the first fixing structure and the second fixing structure may bend the reinforcement by squeezing the reinforcement in different directions. The shape of the reinforcement in the folded state may be a water drop shape, but is not limited thereto.

[0127] According to an embodiment, the flexible printed circuit board may include a folded portion (eg, Figure 6 Folding portions 263d-1 and 263d-2). The folding portion may be provided in the first section and the second section. The folding portion may be folded in the unfolded state. When the electronic device is changed from the unfolded state to the folded state, the folding portion may be unfolded. According to an embodiment of the present disclosure, in the folded state, the flexible printed circuit board may be subjected to tensile stress. In the case where the flexible printed circuit board does not include the folding portion, when tensile stress is applied, the flexible printed circuit board may be stretched while resisting the tensile stress. The flexible printed circuit board may be damaged by being stretched. According to an embodiment, the folding portion may compensate for the tensile stress in the folded state. The folding portion may maintain the folded state in the unfolded state, and the folding portion may compensate for the tensile stress by unfolding in the folded state. According to an embodiment, damage to the flexible printed circuit board may be reduced.

[0128] According to an embodiment, in the folded state, the first direction may be inclined relative to the third direction to which the surface of the first hinge plate pointing to the display is directed. According to an embodiment of the present disclosure, since the first hinge plate and the second hinge plate are inclined relative to each other in the folded state, the curvature change of the display may become gentle. Since the curvature of the display changes gently, damage to the display may be reduced. For example, in the folded state, the formation of wrinkles may be reduced in the area where the display is folded (e.g., the third display area).

[0129] The electronic device according to various embodiments disclosed in this document may be various types of devices. The electronic device may include, for example, a portable communication device (e.g., a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. The electronic device according to the embodiments of this document is not limited to the above devices.

[0130] The various embodiments and terms used herein are not intended to limit the technical features described herein to specific embodiments, but should be understood to include various modifications, equivalents or substitutes of the embodiment. With regard to the description of the accompanying drawings, similar reference numerals may be used for similar or related parts. Unless clearly indicated differently in the relevant context, the singular form of the noun corresponding to the project may include one or more projects. In this document, each phrase such as "A or B", "at least one of A and B", "at least one of A, B and C", "at least one of A, B or C" and "at least one of A, B or C" may include any one of the phrases or all possible combinations thereof. Terms such as "1st", "2nd" or "first" or "second" may be simply used to distinguish a corresponding component from another corresponding component, without being limited to other aspects (e.g., importance or order). When a certain (e.g., first) component is referred to as being “coupled” or “connected” to another (e.g., second) component, with or without the term “functional” or “communicative”, it means that some components can be connected directly (e.g., wired), wirelessly, or through a third component.

[0131] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware and may be used interchangeably with terms such as logic, logic block, component, or circuit system. A module may be a minimum unit or a portion of a component configured integrally or performing one or more functions. For example, according to an embodiment, a module may be implemented in the form of an application specific integrated circuit (ASIC).

[0132] Various embodiments of this document may be implemented as software (e.g., a program) that includes one or more instructions stored in a storage medium (or external memory) readable by a device (e.g., electronic device 100). For example, a processor of a device (e.g., electronic device 100) may call and execute at least one of the one or more instructions stored from a storage medium. This makes it possible for the device to work to perform at least one function according to at least one command called. The one or more instructions may include code generated by a compiler or code that can be run by an interpreter. The device-readable storage medium may be provided in the form of a non-transitory storage medium. Here, the term "non-transitory" only means that the storage medium is a tangible device, and does not include signals (e.g., electromagnetic waves), and the term does not distinguish between a case where data is stored semi-permanently and a case where data is stored temporarily.

[0133] According to an embodiment, the methods according to various embodiments disclosed in this document may be provided by being included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a device-readable storage medium (e.g., a compact disk read-only memory (CD-ROM)), or distributed directly (e.g., downloaded or uploaded) or distributed online through an application store (e.g., Play Store™) or distributed between two user devices (e.g., smart phones). In the case of online distribution, at least some of the computer program products may be temporarily stored or temporarily created on a device-readable storage medium such as a memory in a manufacturer's server, a server in an application store, or a relay server.

[0134] According to various embodiments, each of the above-mentioned components (e.g., modules or programs) may include a single object or multiple objects, and some of the multiple objects may be separated and arranged in other components. According to various embodiments, one or more components or operations in the above-mentioned corresponding components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, multiple components (e.g., modules or programs) may be integrated into one component. In this case, the integrated component may perform one or more functions of each component in a manner identical or similar to those functions performed by the corresponding components among the multiple components before integration. According to various embodiments, the operations performed by modules, programs or other components may be run sequentially, in parallel, repeatedly or heuristically, performed in different orders, omitted, or one or more other operations may be added.

Claims

1. An electronic device, comprising: a first housing, the first housing comprising a first surface; a second housing including a second surface and rotatable relative to the first housing; A hinge structure, the hinge structure comprising a first hinge plate and a second hinge plate rotatable relative to the first hinge plate; a display, the display comprising a first display area disposed on the first housing, a second display area disposed on the second housing, and a third display area disposed on the hinge structure; a heat sink, the heat sink comprising a first section disposed between the first display area and the first surface, a second section disposed between the second display area and the second surface, and a third section disposed between the third display area and the hinge structure; a reinforcement member disposed between the third display area and the hinge structure and providing rigidity to the third display area; as well as a fixing structure connected to the reinforcement, wherein in a folded state in which the first surface faces a first direction opposite to the second surface faces a second direction, the fixing structure is squeezed by the first hinge plate and the second hinge plate, wherein, in the unfolded state in which the first direction and the second direction are the same, the reinforcement is flat, and Wherein, in the folded state, at least a portion of the reinforcement is bent due to a force applied from the first hinge plate and the second hinge plate to the fixing structure.

2. The electronic device according to claim 1, in, In the unfolded state, the fixing structure is spaced apart from a side surface of the first hinge plate facing the fixing structure and a side surface of the second hinge plate facing the fixing structure, and Wherein, in the folded state, the fixing structure contacts the side surface of the first hinge plate and the side surface of the second hinge plate.

3. The electronic device according to claim 2, in, The fixed structure comprises: a first fixing structure connected to the reinforcement and disposed between the first housing and the first hinge plate, and a second fixing structure connected to the reinforcement and disposed between the second housing and the second hinge plate, wherein, in the unfolded state, the first fixing structure is spaced apart from the first hinge plate, and in the folded state, the first fixing structure is squeezed by the first hinge plate, and Wherein, in the unfolded state, the second fixing structure is spaced apart from the second hinge plate, and in the folded state, the second fixing structure is pressed by the second hinge plate.

4. The electronic device according to any one of claims 1 to 3, in, The heat sink includes a folded portion folded in the unfolded state, wherein the folded portion is provided in the first section and the second section, and Wherein, when the electronic device changes from the unfolded state to the folded state, the folded portion unfolds.

5. The electronic device according to any one of claims 1 to 4, in, The shape of the heat sink corresponds to the shape of the display.

6. The electronic device according to any one of claims 1 to 5, in, The hinge structure includes a hinge bracket, and The hinge bracket includes a first guide groove and a second guide groove, the first hinge plate is slidably connected to the first guide groove, and the second hinge plate is slidably connected to the second guide groove.

7. The electronic device according to any one of claims 1 to 6, in, The second housing is rotatable relative to the first housing within a first angular range, and The second hinge plate is capable of rotating relative to the first hinge plate within a second angle range that is smaller than the first angle range.

8. The electronic device according to any one of claims 1 to 7, in, In the folded state, the first direction is inclined relative to a third direction toward which the surface of the first hinge plate facing the display is directed.

9. The electronic device according to any one of claims 1 to 8, further comprising: a first supporting plate, the first supporting plate being disposed between the first display area and the first surface and supporting the first display area; as well as a second supporting plate, the second supporting plate being disposed between the second display area and the second surface and supporting the second display area, wherein the first section is disposed between the first surface and the first support plate, and Wherein, the second section is arranged between the second surface and the second supporting plate. 10 . The electronic device of claim 9 , further comprising a leveler disposed between the first support plate and the second support plate.

11. The electronic device according to any one of claims 1 to 10, in, The reinforcement member is disposed on the hinge structure, and Wherein, the heat sink is arranged on the reinforcement.

12. The electronic device according to any one of claims 1 to 11, in, The heat sink is disposed on the hinge structure, and wherein the reinforcement is disposed on the heat sink.

13. The electronic device according to claim 12, in, The heat sink includes an opening, and Wherein, the fixing structure is coupled to the reinforcement member by passing through the opening.

14. The electronic device according to any one of claims 1 to 13, in, When the electronic device changes from the folded state to the unfolded state, the reinforcement member is flattened by a restoring force of the reinforcement member.

15. The electronic device according to any one of claims 1 to 14, further comprising: A flexible printed circuit board, the flexible printed circuit board comprising: a first section, the first section extending from a first printed circuit board in the first housing between the first display area and the first surface, a second section extending from a second printed circuit board in the second housing between the second display area and the second surface, and The third segment is arranged between the first segment and the second segment, and between the third display area and the hinge structure.

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