Suction cup cloth pasting structure for increasing humid environment and control method of suction cup cloth pasting structure

Abstract

The invention relates to a wet environment increasing sucker cloth pasting structure and a control method thereof, and belongs to the technical field of silicon wafer processing equipment.The wet environment increasing sucker cloth pasting structure comprises a sucker, a rotating shaft is arranged at the lower end of the sucker, a center hole is formed in the sucker, and a plurality of adsorption grooves which are annularly distributed and communicate with the center hole are formed in the upper end of the sucker; a vacuum pump communicating hole communicated with the center hole is formed in the rotating shaft, a silicon wafer is arranged at the upper end of the suction cup, and suction cup cloth is arranged between the silicon wafer and the suction cup. A supporting ring assembling step is arranged on the outer circle of the upper end of the suction cup, a supporting ring nested with the suction cup is arranged on the supporting ring assembling step, an edge cavity is formed among the suction cup cloth, the supporting ring and the suction cup, and a plurality of vacuum branch channels communicated with the edge cavity are arranged in the suction cup. The device has the advantages of simple structure, good structural stability and convenience in operation. The edge of the sucker cloth is fixed through the additionally-arranged vacuum cavity on the edge, so that the number of damaged silicon wafers is effectively controlled, and the loss and the utilization rate of the sucker cloth and the polishing cloth are reduced.

Description

Technical Field

[0001] The invention relates to the technical field of silicon wafer processing equipment, and in particular to a structure for applying a suction cup cloth to increase a humid environment and a control method thereof. Background Art

[0002] In the semiconductor wafer edge polishing process, when polishing the edge, it is important to be able to stably adsorb the silicon wafer on the rotating table without warping, which is an important condition to ensure the polishing effect and fragmentation rate. The current process is to stick a suction cup cloth on the suction cup by gluing, and then adsorb the silicon wafer through the suction cup cloth.

[0003] Due to the humidity of the environment and the lack of sufficient fixation of the suction cup cloth, the suction cup cloth will debond after a period of use, resulting in poor adsorption of the silicon wafer. The biggest loss is the damage of the silicon wafer, the failure of the suction cup cloth and polishing cloth, and the reduction of utilization rate. Summary of the invention

[0004] The present invention mainly solves the shortcomings of the prior art and provides a structure for applying a suction cup cloth in a humid environment and a control method thereof, which has the advantages of simple structure, good structural stability and convenient operation. The vacuum cavity newly added at the edge fixes the edge of the suction cup cloth, effectively controlling the number of silicon wafer breakages, the loss of the suction cup cloth and the polishing cloth, and the reduction of the utilization rate.

[0005] The above technical problems of the present invention are mainly solved by the following technical solutions: A suction cup cloth application structure for increasing the humidity environment includes a suction cup, a rotating shaft is provided at the lower end of the suction cup, a center hole is provided on the suction cup, a plurality of adsorption grooves distributed in an annular shape and connected to the center hole are provided at the upper end of the suction cup, a vacuum pump connecting hole connected to the center hole is provided in the rotating shaft, a silicon wafer is provided at the upper end of the suction cup, and a suction cup cloth is provided between the silicon wafer and the suction cup.

[0006] Preferably, the outer circle of the upper end of the suction cup is provided with a support ring assembly step, the support ring assembly step is provided with a support ring nested with the suction cup, an edge cavity is formed between the suction cup cloth, the support ring and the suction cup, and the suction cup is provided with a plurality of vacuum branch channels connected with the edge cavity.

[0007] During the vacuum suction, check the application effect and build up the initial vacuum in the edge cavity. The edge cavity ensures sufficient suction force to prevent relative movement from debonding from the edge to the center. The support ring serves as a support for the edge of the suction cup cloth and at the same time realizes the formation of the edge cavity.

[0008] Preferably, an auxiliary adsorption gas path is provided between the vacuum branch channel and the vacuum pump communication hole, and a one-way valve is provided between the vacuum branch channel and the auxiliary adsorption gas path. The vacuum branch channel builds the gas path interconnection between the one-way valves in the edge cavity.

[0009] Preferably, the suction cup cloth comprises an outer ring and an inner ring, the outer ring is connected to the center hole, the inner ring is fitted with the edge cavity, a plurality of radial strips are provided between the outer ring and the inner ring, and a plurality of annular strips integrated with the radial strips are provided between two adjacent radial strips.

[0010] A control method for increasing the humid environment suction cup cloth application structure includes the following steps: Step 1: Remove the release paper from the adhesive backing of the suction cup cloth.

[0011] Step 2: Align the center of the suction cup and the suction cup cloth and complete the application near the center hole.

[0012] Step 3: Press from the middle to the sides, and the suction groove on the suction cup cannot be completely covered by the suction cup cloth.

[0013] Step 4: After installing the suction cup, place a standard silicon wafer fixture with a good and clean surface on the suction cup cloth, and then connect it to the vacuum pump through the vacuum pump connecting hole in the rotating shaft to absorb the vacuum.

[0014] Step 5: Break the vacuum and remove the standard silicon wafer fixture, and the suction cup cloth application process is completed.

[0015] Preferably, when silicon wafers are processed, the auxiliary adsorption air path is connected to the connecting hole of the vacuum pump, and a horizontally placed one-way valve structure without a reset spring is adopted. By utilizing the centrifugal force during the rotation of the suction cup, when the suction cup rotates, the sealing beads in the one-way valve block the vacuum branch channel, thereby ensuring that the pressure of the edge cavity is stable during silicon wafer processing. The presence of the one-way valve ensures that only the vacuum can establish a connection with the edge cavity, and water and air cannot enter the edge cavity.

[0016] Preferably, when the machine is on standby, water is sprayed upward from the vacuum pump connecting hole and the center hole to keep the suction cup cloth moist.

[0017] Preferably, when processing silicon wafers, vacuum is collected from the adsorption groove to the central hole and the connecting hole of the vacuum pump and then extracted by the vacuum pump, and the silicon wafer is adsorbed on the suction cup and driven to rotate via the rotating shaft.

[0018] Preferably, when the silicon wafer is being transported, the gas diffuses from the connecting hole of the vacuum pump and the central hole to the adsorption groove to prevent adhesion between the suction cup cloth and the silicon wafer.

[0019] The present invention can achieve the following effects: The present invention provides a structure for applying a suction cup cloth in a humid environment and a control method thereof, which has the advantages of simple structure, good structural stability and convenient operation compared with the prior art. The vacuum cavity newly added at the edge fixes the edge of the suction cup cloth, effectively controlling the number of silicon wafer breakages, the loss of the suction cup cloth and the polishing cloth, and the reduction of the utilization rate. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a structural cross-sectional view of the present invention.

[0021] Figure 2 It is a schematic diagram of the top structure of the suction cup of the present invention.

[0022] Figure 3 It is a schematic diagram of the top structure of the suction cup cloth of the present invention.

[0023] In the figure: silicon wafer 1, suction cup cloth 2, vacuum pump connecting hole 3, adsorption groove 4, vacuum branch channel 5, support ring 6, suction cup 7, one-way valve 8, rotating shaft 9, auxiliary adsorption gas path 10, support ring assembly step 11, center hole 12, outer ring 13, annular strip 14, radial strip 15, inner ring 16. DETAILED DESCRIPTION

[0024] The technical solution of the invention is further specifically described below through embodiments and in conjunction with the accompanying drawings.

[0025] Example: Figure 1 , Figure 2 and Figure 3 As shown, a suction cup cloth application structure for increasing the humidity environment includes a suction cup 7, a rotating shaft 9 is provided at the lower end of the suction cup 7, a center hole 12 is provided on the suction cup 7, 6 adsorption grooves 4 distributed in an annular shape and connected to the center hole 12 are provided at the upper end of the suction cup 7, a vacuum pump communication hole 3 connected to the center hole 12 is provided in the rotating shaft 9, a silicon wafer 1 is provided at the upper end of the suction cup 7, and a suction cup cloth 2 is provided between the silicon wafer 1 and the suction cup 7. The suction cup cloth 2 includes an outer ring 13 and an inner ring 16, the outer ring 13 is connected to the center hole 12, the inner ring (16) is fitted with an edge cavity, 6 radial strips 15 are provided between the outer ring 13 and the inner ring 16, and 8 annular strips 14 integrated with the radial strips 15 are provided between two adjacent radial strips 15. The outer circle of the upper end of the suction cup 7 is provided with a support ring assembly step 11, and the support ring assembly step 11 is provided with a support ring 6 nested with the suction cup 7. An edge cavity is formed between the suction cup cloth 2, the support ring 6, and the suction cup 7. Three vacuum branch channels 5 connected to the edge cavity are arranged at intervals of 120 degrees in the suction cup 7. When adsorbing the vacuum, check the application effect and build an initial vacuum in the edge cavity. Auxiliary adsorption gas paths 10 are provided between the vacuum branch channel 5 and the vacuum pump connecting holes 3, and a one-way valve 8 is provided between the vacuum branch channel 5 and the auxiliary adsorption gas path 10.

[0026] A control method for increasing the humid environment suction cup cloth application structure includes the following steps: Step 1: Remove the release paper from the adhesive backing of the suction cup cloth 2.

[0027] Step 2: Align the centers of the suction cup 7 and the suction cup cloth 2 and complete the application near the center hole 12.

[0028] Step 3: Press and apply from the middle to the surrounding areas, and at the same time, the adsorption groove 4 on the suction cup 7 cannot be completely covered by the suction cup cloth 2.

[0029] Step 4: After installing the suction cup 7, place a standard silicon wafer fixture with a good and clean surface on the suction cup cloth 2, and then connect it to the vacuum pump through the vacuum pump connecting hole 3 in the rotating shaft 9 to perform vacuum adsorption.

[0030] Step 5: Break the vacuum and remove the standard silicon wafer fixture, and the process of applying the suction cup cloth 2 is completed.

[0031] When the silicon wafer 1 is processed, it is connected to the vacuum pump communication hole 3 through the auxiliary adsorption gas path 10. By adopting a horizontal one-way valve 8 structure without a return spring, the centrifugal force when the suction cup 7 rotates is used, so that when the suction cup rotates, the sealing bead in the one-way valve 8 blocks the vacuum branch channel 5, ensuring that the pressure of the edge cavity is stable when the silicon wafer 1 is processed; the existence of the one-way valve 8 ensures that only vacuum can establish a connection with the edge cavity, and water and air cannot enter the edge cavity. The vacuum is collected from the adsorption groove 4 to the central hole 12 and the vacuum pump communication hole 3, and then extracted by the vacuum pump. The silicon wafer 1 is adsorbed on the suction cup 7 and driven to rotate via the rotating shaft 9.

[0032] When the silicon wafer is transported, the gas diffuses from the vacuum pump connecting hole 3 and the central hole 12 to the adsorption groove 4 to prevent the suction cup cloth 2 and the silicon wafer 1 from sticking together.

[0033] When the machine is on standby, water is sprayed upward from the vacuum pump connecting hole 3 and the center hole 12 to keep the suction cup cloth moist.

[0034] In summary, the control method for adding a suction cup cloth application structure in a humid environment has the advantages of simple structure, good structural stability and convenient operation. The vacuum cavity newly added at the edge fixes the edge of the suction cup cloth, effectively controlling the number of silicon wafer breakages, the loss of suction cup cloth and polishing cloth, and the reduction of utilization rate.

[0035] The above description is only a specific embodiment of the present invention, but the structural features of the present invention are not limited thereto. Any changes or modifications made by any technician in the field of the present invention are included in the patent scope of the present invention.

Claims

1. A structure for applying a suction cup cloth in a humid environment, characterized in that: The invention comprises a suction cup (7), wherein a rotating shaft (9) is provided at the lower end of the suction cup (7), a center hole (12) is provided on the suction cup (7), a plurality of adsorption grooves (4) distributed in an annular shape and connected to the center hole (12) are provided at the upper end of the suction cup (7), a vacuum pump connecting hole (3) connected to the center hole (12) is provided in the rotating shaft (9), a silicon wafer (1) is provided at the upper end of the suction cup (7), and a suction cup cloth (2) is provided between the silicon wafer (1) and the suction cup (7).

2. The structure for applying a suction cup cloth to a humid environment according to claim 1, characterized in that: The outer circle of the upper end of the suction cup (7) is provided with a support ring assembly step (11), and the support ring (6) nested with the suction cup (7) is provided on the support ring assembly step (11). An edge cavity is formed between the suction cup cloth (2), the support ring (6) and the suction cup (7), and a plurality of vacuum branch channels (5) connected to the edge cavity are provided in the suction cup (7); when vacuum is adsorbed, the application effect is checked and an initial vacuum is established in the edge cavity.

3. The control method for increasing the humid environment suction cup cloth application structure according to claim 2, characterized in that: An auxiliary adsorption gas path (10) is provided between the vacuum branch channel (5) and the vacuum pump communication hole (3), and a one-way valve (8) is provided between the vacuum branch channel (5) and the auxiliary adsorption gas path (10).

4. The control method for increasing the humid environment suction cup cloth application structure according to claim 2, characterized in that: The suction cup cloth (2) comprises an outer ring (13) and an inner ring (16), wherein the outer ring (13) is connected to the central hole (12), and the inner ring (16) is fitted with the edge cavity. A plurality of radial strips (15) are provided between the outer ring (13) and the inner ring (16), and a plurality of annular strips (14) which are integrated with the radial strips (15) are provided between two adjacent radial strips (15).

5. A control method for increasing the humid environment suction cup cloth application structure according to claim 3 comprises the following steps: Step 1: Remove the release paper from the adhesive backing of the suction cup cloth (2); Step 2: Align the centers of the suction cup (7) and the suction cup cloth (2) and complete the application near the center hole (12); Step 3: Press and stick from the middle to the surrounding areas, while the suction groove (4) on the suction cup (7) cannot be completely covered by the suction cup cloth (2); Step 4: After installing the suction cup (7), place a standard silicon wafer fixture with a good and clean surface on the suction cup cloth (2), and then connect it to the vacuum pump through the vacuum pump connecting hole (3) in the rotating shaft (9) to perform vacuum adsorption; Step 5: Break the vacuum and remove the standard silicon wafer fixture, and the suction cup cloth (2) application process is completed.

6. The control method for increasing the humid environment suction cup cloth application structure according to claim 5, characterized in that: When the silicon wafer (1) is processed, the auxiliary adsorption gas path (10) is connected to the vacuum pump communication hole (3), and a horizontally placed one-way valve (8) without a return spring is adopted. The centrifugal force when the suction cup (7) rotates is utilized so that when the suction cup rotates, the sealing bead in the one-way valve (8) blocks the vacuum branch channel (5), thereby ensuring that the pressure of the edge cavity is stable when the silicon wafer (1) is processed. The presence of the one-way valve (8) ensures that only vacuum can establish a connection with the edge cavity, and water and air cannot enter the edge cavity.

7. The control method for increasing the humid environment suction cup cloth application structure according to claim 5, characterized in that: When the machine is in standby mode, water is sprayed upward from the vacuum pump connecting hole (3) and the center hole (12) to keep the suction cup cloth moist.

8. The control method for increasing the humid environment suction cup cloth application structure according to claim 5, characterized in that: When the silicon wafer (1) is processed, vacuum is collected from the adsorption groove (4) to the central hole (12) and the vacuum pump connecting hole (3) and then extracted by the vacuum pump. The silicon wafer (1) is adsorbed on the suction cup (7) and driven to rotate via the rotating shaft (9).

9. The control method for increasing the humid environment suction cup cloth application structure according to claim 5, characterized in that: When the silicon wafer is being transported, the gas diffuses from the vacuum pump connecting hole (3) and the center hole (12) to the adsorption groove (4), thereby preventing the suction cup cloth (2) and the silicon wafer (1) from adhering to each other.

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