Manipulator control system and method based on wafer calibrator

Abstract

The invention discloses a mechanical arm control system and method based on a wafer calibrator, and belongs to the technical field of mechanical arm control, the mechanical arm control system specifically comprises a mechanical arm device, the wafer calibrator and a control unit, and the mechanical arm device is used for carrying and operating materials in the wafer manufacturing process; the wafer calibrator comprises a plurality of laser sensors, and the laser sensors detect the plane position and the rotation angle of the wafer based on visual detection; the control unit comprises a central processing unit, a memory and an input / output interface, the central processing unit operates a preset control algorithm, calculates motion parameters of each joint of the manipulator device according to detection data transmitted by the wafer calibrator, generates corresponding control signals, transmits the control signals to a driver of the manipulator device through the input / output interface, and controls the manipulator device to move. And the driver drives a motor of the manipulator device according to the control signal so as to control the manipulator device.

Description

Technical Field

[0001] The present invention relates to the technical field of robot control, and in particular to a robot control system and method based on a wafer aligner. Background Art

[0002] In the semiconductor manufacturing process, wafer handling and operation are crucial links. Traditional manual operation is not only inefficient, but also prone to human errors, affecting the quality and production efficiency of wafers. With the continuous development of automation technology, robot control systems are widely used in wafer manufacturing to achieve efficient and precise material handling and operation. However, existing robot control systems still have some problems in practical applications.

[0003] First, due to the small size and light weight of the wafer, the control accuracy of the robot is very high. The wafer may shift or rotate during the manufacturing process, which requires the robot to detect and adjust its motion trajectory and operation accuracy in real time. For example, wafer handling robots usually use high-precision optical sensors and laser positioning systems to monitor the position of the wafer, and make real-time adjustments through advanced control algorithms. Secondly, the existing robot control system often lacks an effective feedback mechanism and cannot adjust the control strategy in time according to the actual working status. For example, the traditional robot control system may not be able to perceive the slight changes of the wafer during the handling process in real time, resulting in operational errors. In order to solve this problem, some advanced robot systems have begun to introduce sensor feedback and intelligent algorithms to optimize the control strategy through real-time monitoring and data analysis. Summary of the invention

[0004] The purpose of the present invention is to provide a robot control system and method based on a wafer aligner to solve the following technical problems:

[0005] Problems include inaccurate positioning, inability to accurately judge the wafer status, and complex control methods.

[0006] The purpose of the present invention can be achieved through the following technical solutions:

[0007] Wafer aligner based robot control system, including:

[0008] Robotic devices for material handling and manipulation during wafer fabrication;

[0009] Wafer aligner, used to detect the position and posture of the wafer;

[0010] A control unit is used to connect with the robot device and the wafer aligner, and is used to control the motion trajectory and operation accuracy of the robot device according to the detection result of the wafer aligner.

[0011] As a further solution of the present invention: the wafer aligner includes a plurality of laser sensors, and the laser sensors detect the planar position and rotation angle of the wafer based on visual detection.

[0012] As a further solution of the present invention: the control unit includes a central processing unit, a memory and multiple input and output interfaces. The central processing unit runs a preset control algorithm, calculates the motion parameters of each joint of the manipulator device according to the detection data transmitted by the wafer calibrator, generates corresponding control signals, and transmits them to the driver of the manipulator device through the input and output interface. The driver drives the motor of the manipulator device according to the control signal to achieve control of the manipulator device.

[0013] As a further solution of the present invention: the control unit monitors the operating status of the system in real time, and when an abnormal situation is detected, an alarm signal is promptly issued and corresponding safety operations are taken.

[0014] As a further solution of the present invention: the robot device has a joint structure with at least three degrees of freedom, including a base, a large arm, a small arm and an end effector, the end effector is used to grasp and place the wafer, and the joint structure can achieve precise positioning and posture adjustment of the wafer in three-dimensional space.

[0015] As a further solution of the present invention: it also includes a user interface for displaying the detection results of the wafer aligner and the movement status of the robot device, and allowing the user to perform manual intervention and parameter setting.

[0016] The present invention also includes a wafer aligner-based robot control method for implementing the above-mentioned wafer aligner-based robot control system, comprising the following steps:

[0017] The robot device and the wafer aligner move to the zero position;

[0018] Use a wafer aligner to detect the position and posture of the wafer;

[0019] transmitting the detection results to the control unit;

[0020] The control unit generates a motion instruction for the manipulator device according to the detection result;

[0021] The manipulator device performs corresponding handling and operation tasks according to the motion instructions.

[0022] As a further solution of the present invention: it also includes a feedback step for receiving the detection data of the wafer calibrator in real time during the execution of the task by the robot device, and adjusting the movement trajectory and operation accuracy of the robot device according to the data.

[0023] As a further solution of the present invention: in the step of detecting the position and posture of the wafer, multiple laser sensors are used to visually detect the plane position and rotation angle of the wafer at the same time to determine whether the position and angle of the wafer meet the preset standards.

[0024] Beneficial effects of the present invention:

[0025] By integrating a wafer calibrator and a manipulator device, the present invention can detect the position and posture of the wafer in real time, and accurately control the motion trajectory and operation accuracy of the manipulator based on the detection results. This significantly improves the accuracy of material handling and operation, and reduces the impact of human errors. The use of multiple laser sensors improves the accuracy and reliability of visual detection, ensuring high-precision judgment of the position and angle of the wafer. This enables the system to operate stably in a complex manufacturing environment and improves the reliability of the overall system. The present invention introduces a real-time feedback mechanism, which continuously receives the detection data of the wafer calibrator during the execution of the task by the manipulator, and adjusts the motion trajectory and operation accuracy accordingly. This dynamic adjustment capability enables the system to cope with emergencies such as wafer position offset or rotation, ensuring the continuity and accuracy of operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The present invention will be further described below in conjunction with the accompanying drawings.

[0027] Figure 1 It is a flow chart of the robot control method based on the wafer aligner of the present invention. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0029] Embodiment 1:

[0030] Wafer aligner based robot control system, including:

[0031] Robotic device:

[0032] The manipulator is the core execution unit of the entire system and is responsible for the actual physical operation. It consists of multiple joints that give the manipulator at least three degrees of freedom of movement. Specifically, the manipulator includes a base, a large arm, a small arm, and an end effector. The end effector is the part that directly contacts the wafer and is used to grab and place the wafer. This multi-degree-of-freedom joint structure enables the manipulator to accurately position and adjust the wafer in three-dimensional space, thereby meeting high-precision production requirements.

[0033] Wafer Aligner:

[0034] The wafer aligner is a key inspection component in the system. It uses multiple laser sensors for visual inspection to determine the plane position and rotation angle of the wafer. This data is critical to ensure the correct position and posture of the wafer during the manufacturing process. Through high-precision calibration, production defects caused by position deviation or rotation error can be significantly reduced.

[0035] Control unit:

[0036] The control unit is the brain of the system, responsible for processing data from the wafer aligner and directing the actions of the robot. The control unit contains a central processing unit (CPU), memory, and multiple input and output interfaces. The CPU runs the preset control algorithm and calculates the motion parameters required for each joint of the robot based on the detection data transmitted by the wafer aligner. Then, the control unit generates the corresponding control signal and sends it to the driver of the robot through the input and output interface. The driver then drives the motor according to these signals to achieve precise control of the robot.

[0037] In addition, the control unit is also capable of real-time monitoring of the system's operating status. If any abnormal situation is detected, such as the robot deviating from the predetermined trajectory or a potential fault is detected, the control unit will immediately issue an alarm signal and take necessary safety measures to ensure the safety and stability of the production process.

[0038] user interface:

[0039] The user interface provides an intuitive platform that allows operators to easily view the inspection results of the wafer aligner and the motion status of the robot device. Through the user interface, operators can not only monitor the operation of the entire system, but also perform manual intervention and parameter settings to meet specific production needs. This interactive design improves the flexibility and operability of the system.

[0040] In summary, the wafer aligner-based robot control system provides an efficient, accurate and reliable automation solution for the wafer manufacturing process through its advanced robot device, precise aligner, intelligent control unit and friendly user interface.

[0041] Embodiment 2:

[0042] The wafer aligner's robotic control system, including POWERON, returns all axes to their origins, selects the size, and moves to the wafer position at the designed angle.

[0043] By setting the WOP angle and executing the WA calibration command, multiple angle positioning can be achieved. For example, first position the angle to 90° to read the WaferID, and then rotate to 180° to the material removal angle. The command sequence is as follows: #1WOP9000, #1WA, #1WOP18000, #1WA. If only one calibration is required, send #1G14 to remove the wafer after the first calibration.

[0044] Compared with standard mode 0, fast mode 1 sets the position of the receiving wafer at the calibration position of the corresponding size, reducing the round-trip movement from the G12 receiving wafer position to the G13 wafer calibration position, effectively improving the calibration rate.

[0045] Embodiment three:

[0046] Please see attached Figure 1 The present invention also includes a wafer aligner-based robot control method for implementing the above-mentioned wafer aligner-based robot control system, comprising the following steps:

[0047] 1. The gripper assembly and laser sensor move to the zero position; the gripper moves above the preset gripping point, calibration begins, and the wafer position is in the middle through TCP communication values;

[0048] 2. The laser sensor moves to the specified target position;

[0049] 3. Detect the wafer position and record the first data acquired by the laser sensor, where the first data includes Boolean, byte, int, and word;

[0050] 4. Use a laser sensor to visually detect the rotation angle of the semiconductor wafer silicon chip gap to determine whether the rotation angle reaches the preset angle;

[0051] 5. The gripper moves forward at a preset speed and a preset distance, and records the second data visually acquired by the laser sensor, where the second data includes Boolean, byte, int, and word;

[0052] 6. The clamp moves to the gripping point, opens the vacuum to absorb the wafer, transports it to the designated location, and moves upward to above the discharge point to separate the clamp from the wafer;

[0053] 7. The jaw assembly and the vision move to the zero position.

[0054] Furthermore, the robot control method based on the wafer aligner includes the following working states:

[0055] Initialize the search for the zero position state, and after completion, feed back the synthesized data to the robot control system.

[0056] In the vacuum adsorption state, after the silicon wafer is placed on the calibration table, the robot sends the completion data, and the calibrator starts adsorption to prevent it from falling during calibration.

[0057] Loading status position, the position where the robot places the silicon wafer.

[0058] Unloading status position, the position where the robot unloads the wafer.

[0059] The above embodiments can be implemented in whole or in part by software, hardware, firmware or any other combination. When implemented using software, the above embodiments can be implemented in whole or in part in the form of a computer program product. The computer program product includes one or more computer instructions or computer programs. When the computer instructions or computer programs are loaded or executed on a computer, the process or function described in the embodiment of the present application is generated in whole or in part. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable devices. The computer instructions can be stored in a computer-readable storage medium, or transmitted from one computer-readable storage medium to another computer-readable storage medium. For example, the computer instructions can be transmitted from one website site, computer, server or data center to another website site, computer, server or data center by wired (e.g., infrared, wireless, microwave, etc.). The computer-readable storage medium can be any available medium that a computer can access or a data storage device such as a server or data center that contains one or more available media sets. The available medium can be a magnetic medium (e.g., a floppy disk, a hard disk, a tape), an optical medium (e.g., a DVD), or a semiconductor medium. The semiconductor medium can be a solid-state hard disk.

[0060] Those of ordinary skill in the art will appreciate that the modules and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of this application.

[0061] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working processes of the systems, devices and modules described above can refer to the corresponding processes in the aforementioned method embodiments and will not be repeated here.

[0062] In the several embodiments provided in the present application, it should be understood that the disclosed systems, devices and methods can be implemented in other ways. For example, the device embodiments described above are only schematic. For example, the division of the modules is only a logical function division. There may be other division methods in actual implementation, such as multiple modules or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or modules, which can be electrical, mechanical or other forms.

[0063] The modules described as separate components may or may not be physically separated, and the components shown as modules may or may not be physical modules, and may be located in one place or distributed on multiple network modules. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0064] In addition, each functional module in each embodiment of the present application may be integrated into one processing module, or each module may exist physically separately, or two or more modules may be integrated into one module.

[0065] If the functions are implemented in the form of software function modules and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application can be essentially or partly embodied in the form of a software product that contributes to the prior art. The computer software product is stored in a storage medium and includes several instructions for a computer device (which can be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the methods described in each embodiment of the present application. The aforementioned storage medium includes: various media that can store program codes, such as a USB flash drive, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk.

[0066] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

[0067] Finally: The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A robot control system based on a wafer aligner, characterized in that: include: Robotic devices for material handling and manipulation during wafer fabrication; Wafer aligner, used to detect the position and posture of the wafer; A control unit is used to connect with the robot device and the wafer aligner, and is used to control the motion trajectory and operation accuracy of the robot device according to the detection result of the wafer aligner.

2. The wafer aligner-based robot control system according to claim 1, characterized in that: The wafer aligner includes a plurality of laser sensors that detect a planar position and a rotation angle of a wafer based on visual inspection.

3. The wafer aligner-based robot control system according to claim 1, characterized in that: The control unit includes a central processing unit, a memory and multiple input and output interfaces. The central processing unit runs a preset control algorithm, calculates the motion parameters of each joint of the robot device based on the detection data transmitted by the wafer calibrator, generates corresponding control signals, and transmits them to the driver of the robot device through the input and output interface. The driver drives the motor of the robot device according to the control signal to achieve control of the robot device.

4. The wafer aligner-based robot control system according to claim 3, characterized in that: The control unit monitors the operating status of the system in real time, and when an abnormal situation is detected, it promptly issues an alarm signal and takes corresponding safety actions.

5. The wafer aligner-based robot control system according to claim 1, characterized in that: The manipulator device has a joint structure with at least three degrees of freedom, including a base, a large arm, a small arm and an end effector. The end effector is used to grasp and place the wafer. The joint structure can achieve precise positioning and posture adjustment of the wafer in three-dimensional space.

6. The wafer aligner-based robot control system according to claim 1, characterized in that: A user interface is also included for displaying the inspection results of the wafer aligner and the motion status of the robot device, and allowing the user to perform manual intervention and parameter settings.

7. A wafer aligner-based robot control method, used to implement the wafer aligner-based robot control system according to any one of claims 1 to 6, characterized in that: The following steps are involved: The robot device and the wafer aligner move to the zero position; Use a wafer aligner to detect the position and posture of the wafer; transmitting the detection results to the control unit; The control unit generates a motion instruction for the manipulator device according to the detection result; The manipulator device performs corresponding handling and operation tasks according to the motion instructions.

8. The wafer aligner-based robot control method according to claim 7, characterized in that: The method also includes a feedback step for receiving detection data of the wafer calibrator in real time during the execution of the task by the robot device, and adjusting the motion trajectory and operation accuracy of the robot device according to the data.

9. The wafer aligner-based robot control method according to claim 7, characterized in that: In the step of detecting the position and posture of the wafer, multiple laser sensors are used to visually detect the plane position and rotation angle of the wafer at the same time to determine whether the position and angle of the wafer meet the preset standards.

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