Manufacturing method of protection structure

Abstract

The manufacturing method of the protection structure comprises the following steps: providing a polymer matrix material and a reinforcing material; mixing the polymer matrix material with the reinforcing material, and adding a plasticizer to form a mixture; impregnating the mixture with a resin solution in a predetermined mold to obtain a mixture; and curing the mixture to form the protection structure. According to the invention, the protection structure with anti-collision performance can be obtained to effectively absorb and reduce collision force when the semiconductor product is protected, so that the performance of the semiconductor product is protected.

Description

Technical Field

[0001] The invention relates to the field of manufacturing resin composite materials, and in particular to a manufacturing method of a protective structure. Background Art

[0002] In the processing and manufacturing of semiconductors, such as during transfer and transportation, semiconductor products need to be protected. For example, the components in a computer hard disk are cantilever parts assembled by riveting, which have very low anti-collision ability. Sudden collisions often cause deformation of internal parts or even component shedding, thus shortening the life of the hard disk.

[0003] Therefore, it is necessary to provide a simple and effective method for manufacturing a protective structure to obtain an anti-collision protective structure to solve the above problems. Summary of the invention

[0004] The object of the present invention is to provide a method for manufacturing a protective structure to obtain a protective structure with anti-collision performance, so as to effectively absorb and reduce the collision force when protecting semiconductor products, thereby protecting the performance of semiconductor products.

[0005] To achieve the above object, the manufacturing method of the protective structure of the present invention comprises the following steps:

[0006] Providing polymer matrix materials and reinforcement materials;

[0007] Mixing the polymer matrix material and the reinforcing material, and adding a plasticizer to form a mixture;

[0008] impregnating the mixture with a resin solution in a predetermined mold to obtain a mixed material; and

[0009] The mixture is cured to form a protective structure.

[0010] Compared with the prior art, in the manufacturing method of the present invention, a protective structure is prepared by simple operation using a polymer matrix material, a reinforcing material and a plasticizer. The composite material of the protective structure has good impact resistance and high strength, and can effectively absorb collision force, thereby protecting the performance of the semiconductor element. Moreover, the method can be achieved through operations such as mixing, impregnation, and curing, and has the advantages of low manufacturing cost and high production efficiency, and is suitable for large-scale industrial production.

[0011] Preferably, the polymer matrix material is polypropylene or polycarbonate.

[0012] Preferably, the reinforcing material is a carbon fiber material.

[0013] Preferably, the carbon fiber material is cut into pieces and mixed with the polymer matrix material.

[0014] Preferably, the mass ratio of the polymer matrix material, the reinforcing material and the plasticizer is 6:3:1 to 6.5:3:0.5.

[0015] As an embodiment, the curing includes heating the mixed material.

[0016] Preferably, the curing temperature is 160-180°C.

[0017] As another embodiment, the curing includes adding a curing agent to the mixed material. DETAILED DESCRIPTION

[0018] Many specific details are described in the following description to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0019] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like to indicate orientations or positional relationships are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0020] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0021] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0022] In the present application, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being “above”, “above”, and “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being “below”, “below”, and “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0023] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation method.

[0024] The manufacturing method of the protective structure of the present invention is further described below in conjunction with the embodiments, but the present invention is not limited thereby. The method of the present invention is intended to provide an improved manufacturing method of the protective structure to obtain a protective structure with anti-collision performance, so as to effectively absorb and reduce the collision force when protecting the semiconductor product, thereby protecting the performance of the semiconductor product.

[0025] In one embodiment of the method for manufacturing the protective structure of the present invention, the following steps are included:

[0026] Providing polymer matrix materials and reinforcement materials;

[0027] Mixing the polymer matrix material and the reinforcing material, and adding a plasticizer to form a mixture;

[0028] impregnating the mixture with a resin solution in a predetermined mold to obtain a mixed material; and

[0029] The mixture is cured to form a protective structure.

[0030] In the manufacturing method of the present invention, a protective structure is prepared by simple operations using a polymer matrix material, a reinforcing material and a plasticizer. The composite material of the protective structure has good impact resistance and high strength, and can effectively absorb collision force, thereby protecting the performance of the semiconductor element. Moreover, the method can be achieved through operations such as mixing, impregnation, and curing, and has the advantages of low manufacturing cost and high production efficiency, and is suitable for large-scale industrial production.

[0031] In particular, the invention relates to a method for producing a composite material for absorbing impact forces, particularly suitable for use in impact protection structures in the semiconductor field.

[0032] Specifically, first, a polymer matrix material with good impact resistance and strength is selected, such as polypropylene or polycarbonate. Among them, polycarbonate has higher strength and rigidity and is suitable for requiring higher anti-collision protection.

[0033] Secondly, carbon fiber is selected as the reinforcing material, which has excellent strength and rigidity and can effectively absorb collision force. Specifically, the carbon fiber material can be cut into pieces of suitable length and mixed with the polymer matrix material.

[0034] Next, the polymer matrix material, the reinforcing material and the plasticizer are configured and mixed. Preferably, the mass ratio of the polymer matrix material, the reinforcing material and the plasticizer is 6:3:1 to 6.5:3:0.5. This optimized ratio can achieve an optimized balance between the flexibility and strength of the composite material and obtain the best performance.

[0035] Next, the mixture is placed in a predetermined mold, and then a resin solution is added, so that the resin solution completely covers the polymer matrix material and the reinforcing material, i.e., the plasticizer, through impregnation. After a period of time, the resin solution penetrates into the mixture, so that it is fully impregnated and obtains the desired shape. Subsequently, the mixture in the mold is taken out and solidified, thereby obtaining a protective structure with a predetermined shape.

[0036] Specifically, the mixture can be cured by heating or adding a curing agent to trigger a curing reaction. For example, the mixture is placed in a curing oven with a curing temperature range of 160-180° C. For another example, a curing agent is added to the mixture and cured at room temperature or in a curing oven.

[0037] Finally, the cured composite is removed from the mold and post-processed such as trimming, sanding and surface coating to achieve the desired final appearance.

[0038] In summary, in the manufacturing method of the present invention, a protective structure is prepared by simple operations using a polymer matrix material, a reinforcing material and a plasticizer. The composite material of the protective structure has good impact resistance and high strength, and can effectively absorb collision force, thereby protecting the performance of the semiconductor element. Moreover, the method can be achieved through operations such as mixing, impregnation, and curing, and has the advantages of low manufacturing cost and high production efficiency, and is suitable for large-scale industrial production.

[0039] The above disclosure is only a preferred embodiment of the present invention, which certainly cannot be used to limit the scope of rights of the present invention. Therefore, equivalent changes made according to the scope of the patent application of the present invention are still within the scope covered by the present invention.

Claims

1. A method for manufacturing a protective structure, characterized in that: The following steps are involved: Providing polymer matrix materials and reinforcement materials; Mixing the polymer matrix material and the reinforcing material, and adding a plasticizer to form a mixture; impregnating the mixture with a resin solution in a predetermined mold to obtain a mixed material; as well as The mixture is cured to form a protective structure.

2. The method for manufacturing a protective structure according to claim 1, characterized in that: The polymer matrix material is polypropylene or polycarbonate.

3. The method for manufacturing a protective structure according to claim 1, wherein: The reinforcing material is a carbon fiber material.

4. The method for manufacturing a protective structure according to claim 3, wherein: The carbon fiber material is cut into pieces and mixed with the polymer matrix material.

5. The method for manufacturing a protective structure according to claim 1, wherein: The mass ratio of the polymer matrix material, the reinforcing material and the plasticizer is 6:3:1 to 6.5:3:0.

5.

6. The method for manufacturing a protective structure according to claim 1, wherein: The curing includes heating the mixture.

7. The method for manufacturing a protective structure according to claim 6, characterized in that: The curing temperature is 160-180°C.

8. The method for manufacturing a protective structure according to claim 1, wherein: The curing includes adding a curing agent to the mixed material.