Membrane module and method of making

Abstract

The invention provides a membrane assembly and a preparation method, the membrane assembly comprises a first base material layer, a second base material layer, a first adhesion layer and a second adhesion layer, the first adhesion layer and the second adhesion layer are clamped between the first base material layer and the second base material layer, the first adhesion layer and the second adhesion layer are arranged side by side in the direction parallel to the first base material layer, the membrane assembly further comprises a first isolation layer, and the first isolation layer is arranged between the second adhesion layer and the second base material layer. The second adhesion layer and the first adhesion layer are both arranged on the base material layer, the distance between the second adhesion layer and the first adhesion layer can be controlled in the forming process of the film assembly, positioning and attaching between the second adhesion layer and the display substrate and positioning and attaching between the first adhesion layer and the display substrate can be synchronous, the second adhesion layer can be attached without adding extra procedures, and therefore the film assembly is convenient to use. And the space additionally reserved for the second adhesion layer in the display substrate due to the laminating precision error factor can be further reduced.

Description

Technical Field

[0001] The present application belongs to the field of membrane material technology, and more specifically, relates to a membrane component and a preparation method. Background Art

[0002] With the continuous updating and iteration of technology, display devices are gradually developing towards the direction of ultra-narrow bezel design. At present, the bending design of the binding part of flexible organic light-emitting diode display devices has become the first choice for ultra-narrow bezels. However, due to the dense wiring and large bending stress in the bending area of ​​the binding part, cracks are prevalent in the bending area, which seriously restricts product application.

[0003] In the related art, some products spray a layer of adhesive on the surface of the bending area to increase the strength of the bending area, thereby reducing the occurrence of cracks in this area. However, this method requires a large space to be reserved between the bending area of ​​the display substrate and the display area and chip binding area to accommodate the protective adhesive layer, making it difficult to reduce the border of the display device. Summary of the invention

[0004] The purpose of the embodiments of the present application is to provide a film assembly and a preparation method to solve the technical problem in the prior art that a large space needs to be reserved between the bending area of ​​the display substrate and the display area and the chip binding area to accommodate a protective adhesive layer.

[0005] To achieve the above purpose, the technical solution adopted in this application is:

[0006] In a first aspect, a membrane assembly is provided, comprising a first adhesive layer, a second adhesive layer, a first substrate layer and a second substrate layer, wherein the first adhesive layer and the second adhesive layer are disposed between the first substrate layer and the second substrate layer, and the first adhesive layer and the second adhesive layer are arranged side by side in a direction parallel to the first substrate layer;

[0007] The membrane assembly further includes a first insulating layer, and the first insulating layer is disposed between the second adhesive layer and the second substrate layer.

[0008] In some embodiments, the thickness of the first insulating layer is d1, the thickness of the second adhesion layer is d2, and d1≤0.2*d2.

[0009] In some embodiments, an orthographic projection of the first insulating layer in the thickness direction at least partially overlaps an orthographic projection of the second adhesive layer in the thickness direction.

[0010] In some embodiments, an orthographic projection of the first insulating layer in the thickness direction overlaps with an orthographic projection of the second adhesive layer in the thickness direction.

[0011] In some embodiments, the film assembly further includes a polarizer, and the polarizer is disposed between the first adhesion layer and the second substrate layer.

[0012] In some embodiments, the orthographic projection of the first adhesive layer in the thickness direction is located within the orthographic projection of the second substrate layer in the thickness direction, and the edge of the second substrate layer protrudes from the edge of the first adhesive layer; and / or,

[0013] The orthographic projection of the second adhesive layer in the thickness direction is located within the orthographic projection of the second substrate layer in the thickness direction, and an edge of the second substrate layer protrudes from an edge of the second adhesive layer.

[0014] In some embodiments, the minimum distance that the edge of the second substrate layer protrudes from the edge of the first adhesive layer is less than or equal to 0.2 mm; and / or,

[0015] The minimum distance that the edge of the second substrate layer protrudes from the edge of the second adhesive layer is less than or equal to 0.2 mm.

[0016] In some embodiments, along a direction parallel to the substrate layer, the first adhesive layer and the second adhesive layer are spaced apart from each other.

[0017] In some embodiments, the spacing distance between the first adhesion layer and the second adhesion layer is d3, 0.08 mm≤d3≤0.17 mm.

[0018] In some embodiments, along a direction parallel to the substrate layer, an edge of the first adhesive layer is connected to an edge of the second adhesive layer.

[0019] In a second aspect, a method for preparing a membrane assembly is provided, comprising the following steps:

[0020] providing a first substrate layer;

[0021] sequentially forming a first adhesive material layer and a process protection layer on the first substrate layer;

[0022] A first through hole is formed on the first adhesive material layer to form a first adhesive layer, and a second through hole is formed on the process protection layer, wherein the first through hole is connected to the second through hole;

[0023] A second adhesive material layer is disposed in the first through hole, and the first insulating material layer is disposed on a side of the second adhesive material layer away from the first substrate layer, wherein the second adhesive material layer is used to form a second adhesive layer; and the first insulating material layer is used to form a first insulating layer;

[0024] removing the process protection layer;

[0025] A second substrate layer is covered on the first adhesive layer and the second adhesive layer to form the membrane assembly.

[0026] In some embodiments, the second adhesive material layer is used to form a second adhesive layer; and the first insulating material layer is used to form a first insulating layer, comprising:

[0027] removing at least a portion of the second adhesive material layer and the first insulating material layer facing the first adhesive material layer to form the second adhesive layer and the first insulating layer spaced apart from the first adhesive material layer;

[0028] In some embodiments, the method further includes: removing a portion of the first adhesive material layer facing the second adhesive layer and the first insulating layer to form the first adhesive layer spaced apart from the second adhesive layer and the first insulating layer.

[0029] In some embodiments, the step of sequentially forming a first adhesive material layer and a process protection layer on the first substrate layer includes:

[0030] forming the first adhesive material layer on the first substrate layer, forming a polarizing material layer on a side of the first adhesive material layer away from the first substrate layer, and forming the process protection layer on a side of the polarizing material layer away from the first substrate layer;

[0031] It also includes: a third through hole is opened on the polarizing material layer to form a polarizer, and the third through hole is connected to the first through hole and the second through hole.

[0032] In some embodiments, the second adhesive material layer is used to form a second adhesive layer; and the first insulating material layer is used to form a first insulating layer, comprising:

[0033] At least the second adhesive material layer and the first insulating material layer are removed from the side facing the first adhesive material layer to form the second adhesive layer and the first insulating layer spaced apart from the first adhesive material layer and the polarizing material layer;

[0034] In some embodiments, it also includes: removing a portion of the first adhesive material layer facing the second adhesive layer and the first insulating layer, and removing a portion of the polarizing material layer facing the second adhesive layer and the first insulating layer to form the first adhesive layer and the polarizer that are spaced apart from the second adhesive layer and the first insulating layer.

[0035] The beneficial effects of the membrane assembly provided by the present application are: the second adhesive layer is arranged on the substrate layer, that is, the second adhesive layer can be formed outside the bending zone, so that the bending zone will not be damaged during the processing of the second adhesive layer, and the processing difficulty of the second adhesive layer can be reduced, which helps to improve the uniformity of the thickness of the second adhesive layer, and makes the size of the second adhesive layer close to the size of the bending zone, which is beneficial to reduce the additional space reserved for the second adhesive layer on the display substrate due to the size factor of the second adhesive layer, that is, the distance between the bending zone of the display substrate and the display area and the chip binding area can be reduced; the second adhesive layer and the first adhesive layer are both arranged on the substrate layer, and the distance between the second adhesive layer and the first adhesive layer can be controlled during the molding process of the membrane assembly, and in the process of positioning and bonding the first adhesive layer to the display area of ​​the display substrate, The second adhesive layer and the bending area can be positioned and bonded, that is, the positioning and bonding between the second adhesive layer and the first adhesive layer and the display substrate can be synchronized. In this way, there is no need to add additional steps to bond the second adhesive layer. In addition, it helps to reduce the assembly steps and difficulty of the display device, and can further reduce the space reserved for the second adhesive layer in the display substrate due to the bonding accuracy error factor, that is, reduce the distance between the bending area and the display area of ​​the display substrate, which helps to achieve a narrow frame design of the display device; in addition, substrate layers are arranged on both sides of the second adhesive layer and the first adhesive layer, and the two substrate layers can respectively shield and protect both sides of the second adhesive layer and the first adhesive layer, reduce the damage of the membrane assembly by collision during transportation, and reduce the possibility of the second adhesive layer and the first adhesive layer accidentally bonding to other components. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0037] Figure 1 It is a schematic diagram showing a substrate, a first adhesive layer and a second adhesive layer in the related art;

[0038] Figure 2 A schematic diagram of the first adhesive layer and the second adhesive layer of the film assembly provided in an embodiment of the present application being adhered to a display substrate;

[0039] Figure 3 A schematic diagram of a membrane assembly provided in one embodiment of the present application;

[0040] Figure 4 A schematic diagram of a membrane module provided in yet another embodiment of the present application;

[0041] Figure 5 A schematic diagram of a second adhesion layer and a first insulating layer provided in an embodiment of the present application;

[0042] Figure 6 A schematic diagram of a membrane assembly provided in yet another embodiment of the present application;

[0043] Figure 7 A schematic diagram of a membrane assembly provided in yet another embodiment of the present application;

[0044] Figure 8 A schematic diagram of a membrane assembly provided in yet another embodiment of the present application;

[0045] Fig. 9 A schematic diagram of a membrane assembly provided in yet another embodiment of the present application;

[0046] Fig.10 A schematic diagram of a membrane assembly provided in yet another embodiment of the present application;

[0047] Fig.11 A schematic diagram of a membrane assembly provided in yet another embodiment of the present application;

[0048] Fig.12 A schematic diagram of the steps of a method for preparing a membrane assembly provided in one embodiment of the present application;

[0049] Fig.13 A schematic diagram of the steps of a method for preparing a membrane module provided in another embodiment of the present application;

[0050] Fig.14 A schematic diagram of the steps of a method for preparing a membrane assembly provided in yet another embodiment of the present application;

[0051] Fig.15 A schematic diagram of the steps of a method for preparing a membrane assembly provided in yet another embodiment of the present application;

[0052] Fig.16 A schematic diagram of the steps of a method for preparing a membrane assembly provided in yet another embodiment of the present application;

[0053] Fig.17 A schematic diagram of the steps of a method for preparing a membrane assembly provided in yet another embodiment of the present application;

[0054] Fig.18 A schematic diagram of the steps of a method for preparing a membrane assembly provided in yet another embodiment of the present application;

[0055] Fig.19 A schematic diagram of the steps of a method for preparing a membrane assembly provided in yet another embodiment of the present application;

[0056] Fig. 20 A schematic diagram of the steps of a method for preparing a membrane assembly provided in yet another embodiment of the present application;

[0057] Fig.21 A schematic diagram of the steps of a method for preparing a membrane assembly provided in yet another embodiment of the present application;

[0058] Fig. 22 A schematic diagram of the steps of a method for preparing a membrane assembly provided in yet another embodiment of the present application.

[0059] in, Figure 1 Reference numerals:

[0060] 100', display substrate; 200', display area; 300', bending area; 400', chip bonding area;

[0061] 1', functional layer;

[0062] 2', protective rubber layer;

[0063] Figures 2 to 22 Reference numerals:

[0064] 100, display substrate; 200, display area; 300, bending area; 400, chip bonding area;

[0065] 1. first adhesive layer; 10. first adhesive material layer; 11. first through hole; 12. first groove; 13. adhesive layer; 14. polarizing layer;

[0066] 2. second adhesive layer; 20. second adhesive material layer;

[0067] 31. a first substrate layer; 32. a second substrate layer;

[0068] 4. a first insulating layer; 41. a first insulating material layer;

[0069] 5. Polarizer;

[0070] 6. Process protection layer; 61. Second through hole. DETAILED DESCRIPTION

[0071] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0072] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0073] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0074] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0075] With the continuous updating and iteration of technology, display devices are gradually developing towards ultra-narrow bezel design. At present, the flex OLED pad bending design has become the first choice for ultra-narrow bezels. Figure 1 This design includes a display substrate 100', which is provided with a display area 200', a bending area 300' and a chip binding area 400'. The surface of the display area 200' can be provided with functional layers 1' such as a polarizing layer and a connecting layer. The bending area 300' can be used for bending so that the chip binding area 400' after assembly can be located on the back side of the display area 200'. However, due to the dense wiring and large back bending stress in the binding bending area 300' (pad bending), cracks (cracks) are common in the bending area 300', which seriously restricts product application.

[0076] In the related art, during the assembly process of the display device, a protective adhesive layer 2' is applied to the surface of the bending area 300' to increase the strength of the bending area 300', thereby reducing the occurrence of cracks in this area. However, the attachment operation of the protective adhesive layer 2' increases the difficulty of assembly, which is not conducive to improving the assembly speed of the display device. Therefore, some display device products directly spray glue on the surface of the bending area 300' to form a protective adhesive layer 2'. However, it is difficult to ensure the uniformity of the overall thickness of the spray-formed protective adhesive layer 2', resulting in the thickness of the edge area of ​​the protective adhesive layer 2 being less than the thickness of the middle area. As a result, it is difficult for the edge area of ​​the protective adhesive layer 2' to play a substantial protective role. Therefore, the spraying range is usually set to be larger than the range of the bending area 300', so that the entire bending area 300' can be covered by the effective protection area (middle area) of the protective adhesive layer 2'; although this method can effectively protect the bending area 300' of the binding portion, However, the width L1 of the edge area of ​​the protective adhesive layer 2' is usually not less than 0.35 mm, resulting in the effective protection area of ​​the protective adhesive layer 2' accounting for about 85% of the actual size of the protective adhesive layer 2', making the size of the protective adhesive layer 2' far exceed the size of the bending area 300', resulting in the protective adhesive layer 2' occupying too much space. A large space needs to be reserved between the bending area 300' and the display area 200' and the chip binding area 400' to accommodate the edge of the protective adhesive layer 2', resulting in it being difficult to reduce the border of the display device.

[0077] Based on this, an embodiment of the present application provides a membrane assembly and a preparation method, wherein the membrane assembly includes a first substrate layer, a second substrate layer, a first adhesion layer and a second adhesion layer, wherein the first adhesion layer and the second adhesion layer are sandwiched between the first substrate layer and the second substrate layer, and the first adhesion layer and the second adhesion layer are arranged side by side in a direction parallel to the first substrate layer, and the membrane assembly also includes a first insulating layer, and the first insulating layer is arranged between the second adhesion layer and the second substrate layer.

[0078] The second adhesive layer is arranged between the first substrate layer and the second substrate layer, that is, the second adhesive layer can be formed outside the bending area. In this way, the bending area will not be damaged during the processing of the second adhesive layer, and the processing difficulty of the second adhesive layer can be reduced, which is helpful to improve the uniformity of the thickness of the second adhesive layer, and the size of the second adhesive layer can be close to the size of the bending area, which is beneficial to reduce the space reserved for the second adhesive layer due to the size factor of the second adhesive layer of the display substrate, that is, the distance between the bending area of ​​the display substrate and the display area and the chip binding area can be reduced; the second adhesive layer and the first adhesive layer are both arranged between the first substrate layer and the second substrate layer, and the distance between the second adhesive layer and the first adhesive layer can be controlled during the molding process of the membrane assembly, and the first adhesive layer can be completed in the process of positioning and bonding the first adhesive layer to the display area of ​​the display substrate. The positioning and bonding of the second adhesive layer and the bending area, that is, the positioning and bonding between the second adhesive layer and the first adhesive layer and the display substrate can be synchronized. In this way, there is no need to add an additional process to bond the second adhesive layer. In addition, it helps to reduce the assembly process and difficulty of the display device, and can further reduce the space reserved for the second adhesive layer in the display substrate due to the bonding accuracy error factor, that is, reduce the distance between the bending area and the display area of ​​the display substrate, which helps to achieve a narrow frame design of the display device; in addition, the first substrate layer and the second substrate layer are arranged on both sides of the second adhesive layer and the first adhesive layer, and the first substrate layer and the second substrate layer can respectively shield and protect the second adhesive layer and the first adhesive layer on both sides, reduce the damage of the membrane assembly by collision during transportation, and reduce the possibility of the second adhesive layer and the first adhesive layer accidentally bonding to other components.

[0079] The second adhesive layer and the second substrate layer of the membrane assembly can have a certain adhesion so that the second substrate layer can support the second adhesive layer, and the adhesion between the second adhesive layer and the second substrate layer will increase the difficulty of peeling the two. In this way, a first insulating layer is arranged between the second adhesive layer and the second substrate layer, and the first insulating layer and the second substrate layer are attached but not sticky. The edge of the second adhesive layer will not be directly adhered to the second substrate layer. The area where the second substrate layer and the first insulating layer are attached can be used as the starting point for peeling the second substrate layer, thereby reducing the difficulty of peeling, and the second substrate layer can be easily peeled off from the second adhesive layer, thereby reducing the deformation of the second adhesive layer caused by being pulled during the process of peeling the second substrate layer; in addition, there is less adhesion between the first insulating layer and the second adhesive layer, and the difficulty of peeling the two is low, so the first insulating layer can be easily peeled off from the second adhesive layer.

[0080] Through the above arrangement, the second adhesive layer is arranged between the first substrate layer and the second substrate layer, which can further reduce the space additionally reserved for the second adhesive layer in the display substrate due to the error factor of the bonding accuracy, that is, reduce the distance between the bending area and the display area of ​​the display substrate, which helps to realize the narrow frame design of the display device; the first insulating layer is arranged between the second adhesive layer and the second substrate layer, which can facilitate the second substrate layer to be peeled off from the second adhesive layer, thereby reducing the deformation of the second adhesive layer caused by being pulled during the process of peeling off the second substrate layer, and can facilitate the first insulating layer to be peeled off from the second adhesive layer.

[0081] Reference Figures 2 to 4 The present application embodiment first provides a membrane assembly, which includes a first substrate layer 31, a second substrate layer 32, a first adhesive layer 1 and a second adhesive layer 2, wherein the first adhesive layer 1 and the second adhesive layer 2 are sandwiched between the first substrate layer 31 and the second substrate layer 32, and the first adhesive layer 1 and the second adhesive layer 2 are arranged side by side in a direction parallel to the first substrate layer 31, referring to Figure 3 and Figure 4 The membrane assembly further includes a first insulating layer 4 , and the first insulating layer 4 is disposed between the second adhesive layer 2 and the second substrate layer 32 .

[0082] It should be noted that the first adhesive layer 1 can be used to be adhered to the display area 200 of the display substrate 100 after being separated from the first base layer 31 , and the second adhesive layer 2 can be used to be adhered to the bending area 300 of the display substrate 100 after being separated from the first base layer 31 .

[0083] It should be noted that when the film assembly exists independently, the first substrate layer 31 and the second substrate layer 32 can serve as supporting structures for the first adhesive layer 1 and the second adhesive layer 2. When the film assembly is applied to a display device, the first substrate layer 31 can be peeled off from the first adhesive layer 1 and the second adhesive layer 2 first, so that the first adhesive layer 1 and the second adhesive layer 2 can be bonded to the display substrate 100 facing the same side, and after the first adhesive layer 1 is bonded to the display area 200 of the display substrate 100 and the second adhesive layer 2 is bonded to the bending area 300 of the display substrate 100, the second substrate layer 32 of the film assembly can be peeled off from the first adhesive layer 1 and the second adhesive layer 2, so that the second substrate layer 32 will not interfere with other structures in the display device.

[0084] It should be noted that, in some embodiments, the first adhesive layer 1 can be a functional layer that has a specific processing effect on light. For example, the first adhesive layer 1 can include a polarizer (POL). The polarizer layer can contain a tiny grating structure. When natural light passes through the polarizer layer, the light perpendicular to the transmission axis of the polarizer layer will be absorbed and cannot pass through, thereby leaving only the light parallel to the transmission axis of the polarizer layer, forming a light and dark contrast, thereby achieving the function of picture display; in other embodiments, the first adhesive layer 1 can also be a film layer that plays a connecting role. For example, the first adhesive layer 1 can be an adhesive layer. When the film assembly is applied to a display device, the two sides of the first adhesive layer 1 can be respectively bonded to the display substrate 100 and the cover plate. At this time, the first adhesive layer 1 can serve as a connecting structure between the display substrate 100 and the cover plate; the second adhesive layer 2 can be a protective adhesive layer that protects the bending area 300 of the display substrate 100.

[0085] It should be noted that when the film assembly is applied to a display device, in addition to the first substrate layer 31 and the second substrate layer 32 being able to be peeled off from the second adhesive layer 2, the first insulating layer 4 can also be peeled off from the second adhesive layer 2. The first insulating layer 4 can be peeled off from the second adhesive layer 2 before the bending area 300 of the display substrate 100 is bent, or can be peeled off from the second adhesive layer 2 after the bending area 300 is bent, or can be peeled off from the second adhesive layer 2 before the second adhesive layer 2 is cured, or can be peeled off from the second adhesive layer 2 after the second adhesive layer 2 is cured.

[0086] The membrane assembly provided in the embodiment of the present application arranges the second adhesive layer 2 between the first substrate layer 31 and the second substrate layer 32, that is, the second adhesive layer 2 can be formed outside the bending area 300. In this way, the bending area 300 will not be damaged during the processing of the second adhesive layer 2, and the processing difficulty of the second adhesive layer 2 can be reduced, which helps to improve the uniformity of the thickness of the second adhesive layer 2, and makes the size of the second adhesive layer 2 close to the size of the bending area 300, which is beneficial to reduce the space reserved for the second adhesive layer 2 due to the size factor of the second adhesive layer 2 on the display substrate 100, that is, the distance between the bending area 300 of the display substrate 100 and the display area 200 and the chip binding area 400 can be reduced; the second adhesive layer 2 and the first adhesive layer 1 are both arranged between the first substrate layer 31 and the second substrate layer 32. During the molding process of the membrane assembly, the distance between the second adhesive layer 2 and the first adhesive layer 1 can be controlled, and when the first adhesive layer 1 is bonded to the display area 200 of the display substrate 100 During the positioning and bonding process, the positioning and bonding of the second adhesive layer 2 and the bending area 300 can be completed, that is, the positioning and bonding between the second adhesive layer 2 and the first adhesive layer 1 and the display substrate 100 can be synchronized. In this way, there is no need to add additional steps to bond the second adhesive layer 2. In addition, it helps to reduce the assembly steps and assembly difficulty of the display device, and can further reduce the space reserved for the second adhesive layer 2 in the display substrate 100 due to the bonding accuracy error factor, that is, reduce the distance between the bending area 300 of the display substrate 100 and the display area 200, which helps to achieve a narrow frame design of the display device; in addition, a first substrate layer 31 and a second substrate layer 32 are arranged on both sides of the second adhesive layer 2 and the first adhesive layer 1, and the first substrate layer 31 and the second substrate layer 32 can respectively shield and protect the two sides of the second adhesive layer 2 and the first adhesive layer 1, reduce the damage of the membrane assembly by collision during transportation, and reduce the possibility of the second adhesive layer 2 and the first adhesive layer 1 accidentally bonding to other components.

[0087] It can be understood that there can be a certain adhesion between the second adhesive layer 2 and the second substrate layer 32 of the membrane assembly, so that the second substrate layer 32 can support the second adhesive layer 2, and the adhesion between the second adhesive layer 2 and the second substrate layer 32 will increase the difficulty of peeling the two. In this way, a first insulating layer 4 is arranged between the second adhesive layer 2 and the second substrate layer 32, and the first insulating layer 4 and the second substrate layer 32 are in contact but not sticky. The edge of the second adhesive layer 2 will not be directly adhered to the second substrate layer 32. The area where the second substrate layer 32 and the first insulating layer 4 are in contact can be used as the starting point for peeling the second substrate layer 32, thereby reducing the difficulty of peeling, and the second substrate layer 32 can be easily peeled off from the second adhesive layer 2, thereby reducing the deformation of the second adhesive layer 2 caused by being pulled during the process of peeling the second substrate layer 32; in addition, there is less adhesion between the first insulating layer 4 and the second adhesive layer 2, and the difficulty of peeling the two is low, so the first insulating layer 4 can be easily peeled off from the second adhesive layer 2.

[0088] Through the above arrangement, the second adhesive layer 2 is arranged between the first substrate layer 31 and the second substrate layer 32, which can further reduce the space additionally reserved for the second adhesive layer 2 in the display substrate 100 due to the error factor of the fitting accuracy, that is, reduce the distance between the bending area 300 and the display area 200 of the display substrate 100, which helps to realize the narrow frame design of the display device; the first insulating layer 4 is arranged between the second adhesive layer 2 and the second substrate layer 32, which can facilitate the second substrate layer 32 to be peeled off from the second adhesive layer 2, thereby reducing the deformation of the second adhesive layer 2 caused by being pulled during the process of peeling off the second substrate layer 32, and can facilitate the first insulating layer 4 to be peeled off from the second adhesive layer 2.

[0089] In some embodiments, the second adhesive layer 2 can be pre-cured by heat-curing glue, light-curing glue or moisture-curing glue. Pre-curing refers to lowering the environmental conditions for curing or shortening the curing time so that the formed second adhesive layer 2 has a certain shape and is flexible and sticky, so that the second adhesive layer 2 can be adhered to the bending area 300 of the display substrate 100, and when the bending area 300 is bent, the second adhesive layer 2 can produce corresponding bending deformation to adapt to the change in the shape of the bending area 300; in some embodiments, the glue can be one of heat-curing glue, light-curing glue and moisture-curing glue. For example, when heat-curing glue is used to form the second adhesive layer 2, the curing temperature of the heat-curing glue can be reduced or the curing time can be shortened so that the obtained second adhesive layer 2 has a certain flexibility and stickiness. When light-curing glue is used, the curing light intensity can be reduced or the curing time can be shortened. When moisture-curing glue is used, the moisture concentration can be reduced or the curing time can be shortened. Exemplarily, the heat-curing glue can be epoxy resin, polyester resin, vinyl ester, bismaleimide, thermosetting polyimide, cyanate ester, etc.; the light-curing glue can be acrylate glue, ultraviolet light-curing (ultraviolet, UV) glue, etc.; the moisture-curing glue can be cyanoacrylate glue, moisture-curing reactive polyurethane hot melt adhesive (polyurethane reactive, PUR), etc.

[0090] In some embodiments, the second adhesive layer 2 can be cured after the bending area 300 of the display substrate 100 is bent. This curing operation can completely cure the second adhesive layer 2. When the second adhesive layer 2 is completely cured, the flexibility and viscosity of the second adhesive layer 2 will be reduced. In this way, the probability of the second adhesive layer 2 adhering to other components can be reduced.

[0091] In this embodiment, the second adhesive layer 2 is formed by pre-curing UV glue, and the UV glue may be acrylic single polymer glue. The selection of the UV glue may refer to Table 1:

[0092] Table 1: Parameters for UV adhesive selection

[0093] project unit Specification Curing conditions <![CDATA[mj / cm 2 ]]> <![CDATA[>1000mj / cm 2 (High-pressure mercury lamp)]]> Viscosity Cps ≥950Cps(25℃) Peel strength N / cm ≥4 Young's modulus <![CDATA[N / mm 2 ]]> ≤230 Elongation ％ ≥240

[0094] In some embodiments, the second adhesive layer 2 is completely cured after being bent in the bending zone 300, and the first insulating layer 4 can be peeled off from the second adhesive layer 2 after being bent in the bending zone 300 and before the second adhesive layer 2 is completely cured; it can be understood that after the bending zone 300 is bent, the second adhesive layer 2 will deform following the bending of the bending zone 300, and the edge of the second adhesive layer 2 may be separated from the edge of the first insulating layer 4 due to its change in shape. At this time, peeling the first insulating layer 4 off the second adhesive layer 2 can reduce the difficulty of peeling, which is beneficial to reduce damage to the second adhesive layer 2 during the peeling process.

[0095] Reference Figures 5 to 7 In some embodiments, the orthographic projection of the first insulating layer 4 in the thickness direction at least partially overlaps with the orthographic projection of the second adhesive layer 2 in the thickness direction. When the orthographic projection of the first insulating layer 4 in the thickness direction partially overlaps with the orthographic projection of the second adhesive layer 2 in the thickness direction, the size of the first insulating layer 4 can be smaller than the size of the second adhesive layer 2. When the orthographic projection of the first insulating layer 4 in the thickness direction completely overlaps with the orthographic projection of the second adhesive layer 2 in the thickness direction, the size of the first insulating layer 4 can be the same as that of the second adhesive layer 2, or can be slightly larger than the size of the second adhesive layer 2.

[0096] The orthographic projection of the first insulating layer 4 in the thickness direction is at least partially overlapped with the orthographic projection of the second adhesive layer 2 in the thickness direction. At least part of the second adhesive layer 2 can be separated by the first insulating layer 4 so that this part of the second adhesive layer 2 may not contact the second substrate layer 32. This can reduce the difficulty of peeling the second substrate layer 32 and the second adhesive layer 2.

[0097] In some embodiments, the orthographic projection of the first insulating layer 4 in the thickness direction overlaps with the orthographic projection of the second adhesive layer 2 in the thickness direction, that is, the first insulating layer 4 can be the same size as the second adhesive layer 2, or slightly larger than the size of the second adhesive layer 2, so that the second adhesive layer 2 can be completely non-adherent to the second substrate layer 32.

[0098] When the first insulating layer 4 can be the same size as the second adhesive layer 2, or slightly larger than the size of the second adhesive layer 2, the second substrate layer 32 of the film assembly can be peeled off from the second adhesive layer 2 and the first adhesive layer 1 before the bending area 300 is bent, and can also be peeled off from the second adhesive layer 2 and the first adhesive layer 1 after the bending area 300 is bent; in some embodiments, the second substrate layer 32 is peeled off from the second adhesive layer 2 and the first adhesive layer 1 before the bending area 300 is bent. It can be understood that since the second adhesive layer 2 and the second substrate layer 32 of the film assembly are blocked by the first insulating layer 4, the second adhesive layer 2 will not directly adhere to the second substrate layer 32. When the bending area 300 of the display substrate 100 is 0 is bent, the second adhesive layer 2 is deformed. At this time, the first insulating layer 4 can be separated from the second substrate layer 32 so that the second adhesive layer 2 will not be pulled and deformed by the second substrate layer 32. That is, when the second adhesive layer 2 is deformed, the relative position between the second adhesive layer 2 and the second substrate layer 32 can change accordingly to reduce the pulling of the second substrate layer 32 on the second adhesive layer 2. When the bending area 300 is bent, a part of the first insulating layer 4 can be separated from the second substrate layer 32 without being attached. At this time, peeling off the second substrate layer 32 can reduce the difficulty of peeling off and reduce the damage to the second adhesive layer 2 and the first adhesive layer 1 during the peeling process of the second substrate layer 32.

[0099] In some embodiments, the first insulating layer 4 may be a polyimide (PI) layer, a polyethylene glycol terephthalate (PET) layer, or the like.

[0100] In some embodiments, the membrane assembly may be provided with only one first insulating layer 4, that is, the first insulating layer 4 may be provided only on one side of the second adhesive layer 2, referring to Figure 2 During the assembly process of the display device, the first substrate layer 31 can be peeled off first, and after the second adhesive layer 2 and the first adhesive layer 1 are glued to the display substrate 100, the area between the second substrate layer 32 and the first insulating layer 4 can be used as the peeling starting point of the second substrate layer 32 to peel off the second substrate layer 32.

[0101] In some embodiments, at least one of the first substrate layer 31 and the second substrate layer 32 may also be a release layer, that is, the first substrate layer 31 and the second substrate layer 32 may both be release layers, or one of them may be a release layer and the other may be a protective layer. For example, during the assembly process of the display device, the first substrate layer 31 that is first peeled off from the second adhesive layer 2 and the first adhesive layer 1 may be a release layer, and the second substrate layer 32 that is later peeled off from the second adhesive layer 2 and the first adhesive layer 1 may be made of a material with greater hardness, thereby improving the protection strength of the second substrate layer 32 to the second adhesive layer 2 and the first adhesive layer 1; in some embodiments, the first substrate layer 31 as a release layer may be a polyimide (PI) layer, a polyethylene glycol terephthalate (PET) layer, etc.

[0102] In some other embodiments, the first substrate layer 31 and the second substrate layer 32 may also be made of a material with relatively high hardness, so that the first substrate layer 31 and the second substrate layer 32 may both serve as protective structures for the second adhesive layer 2 and the first adhesive layer 1 .

[0103] Reference Figure 5 In some embodiments, the thickness of the first insulating layer 4 is d1, the thickness of the second adhesive layer 2 is d2, and d1≤0.2*d2. It can be understood that, for objects of the same material, the smaller the thickness, the more difficult it is to bend. Setting the thickness of the first insulating layer 4 to be no greater than one fifth of the thickness of the second adhesive layer 2 can allow the first insulating layer 4 to have a certain bending ability, so that during the process of peeling the first insulating layer 4 from the second adhesive layer 2, the first insulating layer 4 can be bent to a certain extent, thereby facilitating the peeling operation.

[0104] In some embodiments, the thickness d2 of the second adhesive layer 2 is ≥50 μm. When the thickness d2 of the second adhesive layer 2 is 50 μm, the thickness d1 of the first insulating layer 4 may be no greater than 10 μm. For example, the thickness d1 of the first insulating layer 4 may be 8 μm, 8.2 μm, 8.4 μm, 8.6 μm, 8.8 μm, 9 μm, 9.2 μm, 9.4 μm, 9.6 μm, 9.8 μm, 10 μm. In some embodiments, when the thickness d2 of the second adhesion layer 2 is 60 μm, the thickness of the first insulating layer 4 can be 10 μm to 12 μm. Exemplarily, the thickness d1 of the first insulating layer 4 can be 10 μm, 10.2 μm, 10.4 μm, 10.6 μm, 10.8 μm, 11 μm, 11.2 μm, 11.4 μm, 11.6 μm, 11.8 μm, or 12 μm.

[0105] In some embodiments, when the orthographic projection of the first insulating layer 4 in the thickness direction partially overlaps with the orthographic projection of the second adhesive layer 2 in the thickness direction, that is, the size of the first insulating layer 4 is smaller than the size of the second adhesive layer 2, a depression can be set on the side of the second adhesive layer 2 facing the second substrate layer 32, and the first insulating layer 4 is set in the depression. In some embodiments, the thickness of the first insulating layer 4 can be equal to the depth of the depression, so that the surface of the first insulating layer 4 can be offset against the second substrate layer 32. In other embodiments, the thickness of the first insulating layer 4 can be less than the depth of the depression, so that the surface of the first insulating layer 4 can be spaced from the second substrate layer 32, which is convenient for peeling off the second substrate layer 32. In some further embodiments, the thickness of the first insulating layer 4 can be greater than the depth of the depression, so that the first insulating layer 4 can be offset against the second substrate layer 32, and the second adhesive layer 2 can be spaced from the second substrate layer 32, which can also facilitate peeling off the second substrate layer 32.

[0106] Reference Figure 7 In some embodiments, the film assembly further includes a polarizer 5 , and the polarizer 5 is disposed between the first adhesive layer 1 and the second substrate layer 32 .

[0107] Polarizer 5 is an optical element that can convert natural light into polarized light. The working principle of polarizer 5 is based on the selection and control of the polarization characteristics of light. It has a special molecular structure or optical properties inside, which only allows light vibrating in a specific direction to pass through, while absorbing or blocking light vibrating in other directions, so that the transmitted light becomes polarized light. Polarizer 5 includes a linear polarizer and a circular polarizer. The linear polarizer allows linear polarized light vibrating in a specific direction to pass through, while absorbing or greatly attenuating light vibrating perpendicular to the direction. The circular polarizer is composed of a linear polarizer plus a 1 / 4 wave plate. The circular polarizer can convert linear polarized light into circular polarized light, or vice versa.

[0108] A polarizer 5 is disposed between the first adhesive layer 1 and the second substrate layer 32. The polarizer 5 can filter and regulate the light of the backlight source so that it propagates in a specific direction, illuminates the liquid crystal molecules, and forms a clear image. In addition, the polarizer 5 can also improve the contrast and color reproduction of the liquid crystal display, making the display effect more realistic and natural.

[0109] In some embodiments, the first adhesive layer 1 may be a single-layer structure, and the first adhesive layer 1 may be an adhesive layer 13 . In this case, the material of the first adhesive layer 1 may be an optically clear adhesive (OCA), an optically clear resin (OCR), or the like.

[0110] Reference Figure 8In some embodiments, the film assembly may not be provided with a separate polarizer 5. In this case, the first adhesive layer 1 may be a multi-layer structure, and the first adhesive layer 1 includes a polarizing layer 14 and an adhesive layer 13 that are stacked. The adhesive layer 13 may be provided with only one layer and located on one side of the polarizing layer 14, or the adhesive layer 13 may be provided with two layers and located on both sides of the polarizing layer 14, respectively. In this way, the polarizing layer 14 may be directly adhered to the display area 200 of the display substrate 100 through the adhesive layer 13. When the first adhesive layer 1 is a multi-layer structure, the thickness of the adhesive layer 13 included in the first adhesive layer 1 may be 0.1 mm.

[0111] In some embodiments, when the first adhesive layer 1 is a single-layer structure and the first adhesive layer 1 is a polarizing layer 14 , the polarizing layer 14 itself may be adhesive so that the polarizing layer 14 can be adhered to the display area 200 of the display substrate 100 .

[0112] Reference Fig. 9 In some embodiments, the edge of the first adhesive layer 1 can be spaced apart from the edges of the first substrate layer 31 and the second substrate layer 32, and the edges of the first substrate layer 31 and the second substrate layer 32 protrude from the first adhesive layer 1. In this way, the edge of the second substrate layer 32 can protrude relative to the first adhesive layer 1. Then, when peeling off the first substrate layer 31 and the second substrate layer 32, the portion of the first substrate layer 31 and the second substrate layer 32 protruding from the first adhesive layer 1 can be used as the starting point for peeling, thereby reducing the difficulty of peeling the first substrate layer 31 and the second substrate layer 32 from the first adhesive layer 1 and the second adhesive layer 2.

[0113] In some embodiments, the edge of the second adhesive layer 2 can be spaced apart from the edge of the first substrate layer 31 and the second substrate layer 32, and the edges of the first substrate layer 31 and the second substrate layer 32 protrude from the second adhesive layer 2. In this way, the edges of the first substrate layer 31 and the second substrate layer 32 can protrude relative to the second adhesive layer 2. Then, when peeling off the first substrate layer 31 and the second substrate layer 32, the portion of the first substrate layer 31 and the second substrate layer 32 protruding from the second adhesive layer 2 can be used as the starting point of peeling, thereby reducing the difficulty of peeling the first substrate layer 31 and the second substrate layer 32 from the first adhesive layer 1 and the second adhesive layer 2.

[0114] In some embodiments, the minimum distance that the edge of the second substrate layer 32 protrudes from the edge of the first adhesive layer is less than or equal to 0.2 mm.

[0115] It should be noted that, refer to Fig.10One side of the first adhesive layer is close to the second adhesive layer, and the other three sides of the first adhesive layer 1 are close to the edge of the second substrate layer 32. The distances between the three sides of the first adhesive layer and the edge of the second substrate layer 32 are W1, W2, and W3, respectively. The values ​​of W1, W2, and W3 may be equal or different. When the values ​​of W1, W2, and W3 are different, the minimum value of W1, W2, and W3 may be less than or equal to 0.2 mm.

[0116] Exemplarily, the minimum value among W1, W2, and W3 may be 0.05 mm, 0.08 mm, 0.09 mm, 0.11 mm, 0.13 mm, 0.15 mm, 0.17 mm, 0.19 mm, or 0.2 mm.

[0117] The minimum distance that the edge of the second substrate layer 32 protrudes from the edge of the first adhesive layer 1 is set to be less than or equal to 0.2 mm, which can limit the size of the edge of the second substrate layer 32 protruding from the edge of the first adhesive layer 1, thereby reducing the space occupied by the second substrate layer 32 and facilitating the transportation of the membrane assembly.

[0118] In some embodiments, the minimum distance that the edge of the second substrate layer 32 protrudes from the edge of the second adhesive layer 2 is less than or equal to 0.2 mm.

[0119] It should be noted that, refer to Fig.10 One side of the second adhesive layer 2 is close to the first adhesive layer, and the other three sides of the second adhesive layer 2 are close to the edge of the second substrate layer 32. The distances between the three sides of the second adhesive layer 2 and the edge of the second substrate layer 32 are W4, W5, and W6, respectively. The values ​​of W4, W5, and W6 may be equal or different. When the values ​​of W4, W5, and W6 are different, the minimum value of W4, W5, and W6 may be less than or equal to 0.2 mm.

[0120] Exemplarily, the minimum value among W4, W5, and W6 may be 0.05 mm, 0.08 mm, 0.09 mm, 0.11 mm, 0.13 mm, 0.15 mm, 0.17 mm, 0.19 mm, or 0.2 mm.

[0121] The minimum distance that the edge of the second substrate layer 32 protrudes from the edge of the second adhesive layer 2 is set to be less than or equal to 0.2 mm, which can limit the size of the edge of the second substrate layer 32 protruding from the edge of the second adhesive layer 2, thereby reducing the space occupied by the second substrate layer 32 and facilitating the transportation of the membrane assembly.

[0122] Reference Figures 7 to 9In some embodiments, the edge of the first adhesive layer 1 and the edge of the second adhesive layer 2 are arranged at intervals along the direction parallel to the first substrate layer 31. It can be understood that after the bending area 300 of the display substrate 100 is bent, the bending radius of the outer side of the bending area 300 will be greater than the bending radius of the inner side of the bending area 300. In this way, the distances between the display area 200 and each location in the thickness direction of the bending area 300 after bending may be different. The edges of the first adhesive layer 1 and the second adhesive layer 2 are arranged at intervals. After the first adhesive layer 1 and the second adhesive layer 2 are attached to the display substrate 100, the first adhesive layer 1 and the second adhesive layer 2 may not form contact. In this way, after the bending area 300 is bent, even if the distances between the display area 200 and each location in the thickness direction of the bending area 300 after bending may be different, the first adhesive layer 1 and the second adhesive layer 2 may not be pulled, thereby reducing the deformation caused by pulling between the first adhesive layer 1 and the second adhesive layer 2, which helps to enhance the protective effect of the second adhesive layer 2 on the bending area 300 of the display substrate 100.

[0123] Reference Fig.11 In some other embodiments, the edge of the first adhesive layer 1 can be connected to the edge of the second adhesive layer 2 along the direction parallel to the first substrate layer 31. By setting the edges of the first adhesive layer 1 and the second adhesive layer 2 to be connected, the difficulty of positioning the first adhesive layer 1 and the second adhesive layer 2 can be reduced, thereby reducing the difficulty of manufacturing the film assembly; in this case, the film assembly can be applied to a display device with a small bending range of the bending area 300.

[0124] Reference Fig. 9In this embodiment, the interval between the first adhesive layer 1 and the second adhesive layer 2 is set, and the interval distance between the first adhesive layer 1 and the second adhesive layer 2 is d3, 0.08mm≤d3≤0.17mm. By setting the interval distance between the first adhesive layer 1 and the second adhesive layer 2 to be not less than 0.08mm, the probability of accidental adhesion between the first adhesive layer 1 and the second adhesive layer 2 during the transfer of the film assembly can be reduced, and the difficulty of adhering the first adhesive layer 1 and the second adhesive layer 2 to the display substrate can be reduced, and the probability of adhesion between the first adhesive layer 1 and the second adhesive layer 2 during the bonding process can be reduced, so that after the first adhesive layer 1 and the second adhesive layer 2 are adhered to the display substrate 100, the first adhesive layer 1 and the second adhesive layer 2 can form no contact, so that after the bending area 300 is bent, even if the bending area 30 0 and the edge of the display area 200 changes, and no pulling may occur between the first adhesive layer 1 and the second adhesive layer 2, thereby reducing the deformation caused by pulling between the first adhesive layer 1 and the second adhesive layer 2. In addition, the difficulty of positioning the first adhesive layer 1 and the second adhesive layer 2 when attached to the display substrate 100 can be reduced, which helps to improve the assembly efficiency; setting the spacing distance between the first adhesive layer 1 and the second adhesive layer 2 to a value not greater than 0.17 mm can help the display substrate 100 to correspondingly reduce the distance between the display area 200 and the bending area 300, thereby facilitating the narrow frame design of the display device.

[0125] In some embodiments, the spacing distance d3 between the first adhesion layer 1 and the second adhesion layer 2 may be 0.08 mm, 0.09 mm, 0.10 mm, 0.11 mm, 0.12 mm, 0.13 mm, 0.14 mm, 0.15 mm, 0.16 mm, or 0.17 mm.

[0126] In some embodiments, the size of the second adhesive layer 2 may be slightly larger than the size of the bending area 300, referring to Figure 2 The size of the bending area 300 may be H1, and the size of the second adhesive layer 2 may be H2, where H2>H1. Thus, the control accuracy of the film assembly during the bonding process with the display substrate 100 may be reduced.

[0127] In some embodiments, H2-H1=ΔH, ΔH≥0.15 mm. For example, the value of ΔH may be 0.15 mm, 0.151 mm, 0.152 mm, 0.153 mm, etc.

[0128] In some embodiments, the material of the first adhesive layer 1 may be optically clear adhesive (OCA), optically clear resin (OCR), etc. The second adhesive layer 2 may be formed by glue curing or pre-curing, and the glue may be heat-curing glue, light-curing glue or moisture-curing glue. When heat-curing glue is used, the curing temperature may be lowered or the curing time may be shortened to pre-cure it. When light-curing glue is used, the curing light intensity may be lowered or the curing time may be shortened. When moisture-curing glue is used, the moisture concentration may be lowered or the curing time may be shortened. In some embodiments, the glue may be heat-curing glue, light-curing glue or moisture-curing glue. When heat-curing glue is used, the curing temperature may be lowered or the curing time may be shortened to pre-cure it. When light-curing glue is used, the curing light intensity may be lowered or the curing time may be shortened. When moisture-curing glue is used, the moisture concentration may be lowered or the curing time may be shortened. Exemplarily, the heat-curing glue can be epoxy resin, polyester resin, vinyl ester, bismaleimide, thermosetting polyimide, cyanate ester, etc.; the light-curing glue can be acrylate glue, ultraviolet light-curing (ultraviolet, UV) glue, etc.; the moisture-curing glue can be cyanoacrylate glue, moisture-curing reactive polyurethane hot melt adhesive (polyurethane reactive, PUR), etc.

[0129] Reference Figures 12 to 15 The present invention also provides a method for preparing a membrane assembly, comprising the following steps:

[0130] S100, providing a first substrate layer 31;

[0131] S200, forming a first adhesive material layer 10 and a process protection layer 6 on the first substrate layer 31 in sequence;

[0132] S300, a first through hole 11 is formed on the first adhesive material layer 10 to form the first adhesive layer 1, and a second through hole 61 is formed on the process protection layer 6, the first through hole 11 is connected to the second through hole 61;

[0133] S400, disposing a second adhesive material layer 20 in the first through hole 11, disposing a first insulating material layer 41 on a side of the second adhesive material layer 20 away from the first substrate layer 31, the second adhesive material layer 20 is used to form a second adhesive layer 2; the first insulating material layer 41 is used to form a first insulating layer 4;

[0134] S500, removing the process protection layer 6;

[0135] S600 , covering the first adhesive layer 1 and the second adhesive layer 2 with the second substrate layer 32 to form a film assembly.

[0136] It should be noted that, in some embodiments, glue can be directly applied on the first substrate layer 31 to form the second adhesive material layer 20. For example, after the glue is applied to the first substrate layer 31, it can be pre-cured. Pre-curing refers to lowering the environmental conditions for curing or shortening the curing time so that the formed second adhesive material layer 20 has a certain shape and is flexible and sticky. In some embodiments, the glue can be a heat-curing glue, a light-curing glue, or a moisture-curing glue. When a heat-curing glue is used, the curing temperature can be lowered or the curing time can be shortened to pre-cure it. When a light-curing glue is used, the curing light intensity can be lowered or the curing time can be shortened. When a moisture-curing glue is used, the moisture concentration can be lowered or the curing time can be shortened. In some embodiments, the glue can be a heat-curing glue, a light-curing glue, or a moisture-curing glue. When a heat-curing glue is used, the curing temperature can be lowered or the curing time can be shortened to pre-cure it. When a light-curing glue is used, the curing light intensity can be lowered or the curing time can be shortened. When a moisture-curing glue is used, the moisture concentration can be lowered or the curing time can be shortened. Exemplarily, the heat-curing glue can be epoxy resin, polyester resin, vinyl ester, bismaleimide, thermosetting polyimide, cyanate ester, etc.; the light-curing glue can be acrylate glue, ultraviolet curing (ultraviolet, UV) glue, etc.; the moisture-curing glue can be cyanoacrylate glue, moisture-curing reactive polyurethane hot melt adhesive (polyurethane reactive, PUR), etc.; in other embodiments, the glue can be pre-cured in other places to initially form the second adhesive material layer 20, and then the initially formed second adhesive material layer 20 is transferred to the first substrate layer 31, so as to form the second adhesive material layer 20 on the first substrate layer 31.

[0137] It should be noted that the first adhesive material layer 10 may include a portion forming the first adhesive layer 1 and a portion other than the first adhesive layer 1 , wherein the portion other than the first adhesive layer 1 may be cut and removed during the preparation process.

[0138] It should be noted that the second adhesive material layer 20 may include a portion forming the second adhesive layer 2 and a portion other than the second adhesive layer 2, wherein the portion other than the second adhesive layer 2 may be cut and removed during the preparation process. In some embodiments, the second adhesive material layer 20 may be cut so that the formed second adhesive layer 2 can be separated from the first adhesive layer 1, and in other embodiments, the formed second adhesive layer 2 may be connected to the first adhesive layer 1.

[0139] It should be noted that the first insulating material layer 41 may include a portion forming the first insulating layer 4 and a portion other than the first insulating layer 4, wherein the portion other than the first insulating layer 4 may be cut and removed during the preparation process.

[0140] It should be noted that a cutting tool can be used to cut the process protection layer 6 and the first adhesive material layer 10 to open the second through hole 61 and the first through hole 11. The cutting tool can cut from the side of the process protection layer 6 away from the first adhesive material layer 10, and pass through the process protection layer 6 and the first adhesive material layer 10 in turn. After removing the excess material, the second through hole 61 and the first through hole 11 can be opened. In this way, the hole walls of the second through hole 61 and the first through hole 11 can be flush.

[0141] It should be noted that when the first through hole 11 is opened in the first adhesive material layer 10, the cutting depth of the cutting tool can be controlled to reduce damage to the first substrate layer 31 by the cutting tool, thereby reducing the probability of the first substrate layer 31 being cut by the cutting tool, thereby reducing the risk of the substrate layer being cut.

[0142] It should be noted that, in some embodiments, the thickness of the second adhesive material layer 20 may not be greater than the thickness of the first adhesive material layer 10. In this way, the second adhesive material layer 20 may not enter the second through hole 61 of the process protection layer 6, and the second adhesive material layer 20 will not form adhesion with the process protection layer 6. This can reduce the difficulty of peeling off the process protection layer 6.

[0143] By forming the first adhesive material layer 10 and the second adhesive material layer 20 on the first substrate layer 31, the first adhesive material layer 10 is used to form the first adhesive layer, and the second adhesive material layer 20 is used to form the second adhesive layer, so that the distance design between the second adhesive layer 2 and the first adhesive layer 1 can be completed during the processing of the film assembly, so that the distance between the first adhesive layer 1 and the second adhesive layer 2 of the formed film assembly can be suitable for the corresponding display substrate 100; in the process of preparing the film assembly, the process protection layer 6 is covered on the first adhesive material layer 10, and the process protection layer 6 can protect the first adhesive material layer 10 from the first adhesive layer 10. The material layer 10 is protected, thereby reducing the damage of the cutting tool to the first adhesive material layer 10 during the cutting process; a second through hole 61 is opened in the process protection layer 6, and the second through hole 61 is connected to the first through hole 11, so that the second adhesive material layer 20 can be conveniently arranged in the first through hole 11; after removing the process protection layer 6, the second substrate layer 32 is covered on the first adhesive layer 1 and the second adhesive layer 2, and the first substrate layer 31 and the second substrate layer 32 can protect the first adhesive layer 1 and the second adhesive layer 2 from both sides respectively, thereby reducing the damage to the first adhesive layer 1 and the second adhesive layer 2 during the transportation of the membrane assembly.

[0144] In some embodiments, the preparation method of the membrane component provided in the embodiment of the present application can be used to process the membrane component in any of the above-mentioned embodiments. Thus, the first adhesion layer 1 of the membrane component manufactured by the preparation method of the membrane component provided in the embodiment of the present application is the first adhesion layer 1 in any of the above-mentioned embodiments, the second adhesion layer 2 of the membrane component manufactured by the preparation method of the membrane component provided in the embodiment of the present application is the second adhesion layer 2 in any of the above-mentioned embodiments, and the first substrate layer 31 and the second substrate layer 32 of the membrane component manufactured by the preparation method of the membrane component provided in the embodiment of the present application can be the first substrate layer 31 and the second substrate layer 32 of the membrane component in any of the above-mentioned embodiments.

[0145] In some embodiments, glue may be directly applied on the first substrate layer 31 to form the second adhesive material layer 20, as shown in FIG. Fig.16 The first through hole 11 and the substrate layer are combined to form a first groove 12. During the process of applying glue in the first groove 12, the hole wall of the first through hole 11 is equivalent to a dam. The first through hole 11 can limit the flow range of the glue, so that the glue will not flow out of the first groove 12 during the application process, thereby helping to form a second adhesive material layer 20 with uniform thickness, and then a second adhesive layer 2 with uniform thickness can be obtained. In addition, the overall thickness of the second adhesive material layer 20 is uniform, which can reduce the proportion of the cut-off portion of the second adhesive material layer 20, thereby reducing the amount of glue used in the molding process of the second adhesive layer 2, which helps to reduce the cost of the second adhesive layer 2; by cutting the first adhesive material layer 10, the excess portion of the first adhesive material layer 10 can be removed, so that after the second adhesive layer 2 and the first adhesive layer 1 of the film assembly are bonded to the display substrate 100, the second adhesive layer 2 and the first adhesive layer 1 can be correspondingly adhered to the display area 200 and the bending area 300.

[0146] The second adhesive material layer 20 is formed by applying glue on the first substrate layer 31, and the second adhesive material layer 20 is cut and shaped to obtain the second adhesive layer 2. In this way, the second adhesive material layer 20 includes the second adhesive layer 2 and the portion located at the periphery of the second adhesive layer 2, that is, the second adhesive layer 2 is a part of the second adhesive material layer 20 before cutting, and the portion located at the periphery of the second adhesive layer 2 is the portion of the second adhesive material layer 20 that needs to be cut and removed. By cutting the second adhesive material layer 20, the contour of the layer can be shaped, so that the redundant portion of the layer can be removed, thereby obtaining a second adhesive layer 2 with uniform thickness and consistent performance in each area; glue is directly applied on the first substrate layer 31, that is, the second adhesive layer 2 can be directly formed on the first substrate layer 31, so that the transfer of the second adhesive layer 2 during the processing of the membrane assembly can be reduced, which helps to improve the production efficiency of the membrane assembly.

[0147] In some embodiments, the thickness of the second adhesive material layer 20 can be less than the thickness of the first adhesive material layer 10, so that the first insulating layer 4 can be arranged in the first groove 12, that is, when the first insulating layer 4 covers the second adhesive material layer 20, the first insulating layer 4 will not extend into the second through hole 61. In this way, the risk of accidentally peeling off the first insulating layer 4 during the peeling process of the protective layer 6 can be reduced.

[0148] Reference Fig.17 In some embodiments, the step of the second adhesive material layer 20 in S400 being used to form the second adhesive layer 2 and the first insulating material layer 41 being used to form the first insulating layer 4 includes:

[0149] At least the second adhesive material layer 20 and the first insulating material layer 41 facing the first adhesive material layer 10 are removed to form the second adhesive layer 2 and the first insulating layer 4 spaced apart from the first adhesive material layer 10 .

[0150] By removing the second adhesive material layer 20 and the first insulating material layer 41 on the side facing the first adhesive material layer 10, the formed second adhesive layer and the first insulating layer 4 can be spaced apart from the first adhesive layer 1. After the first adhesive layer 1 and the second adhesive layer 2 are adhered to the display substrate 100, there may be no contact between the first adhesive layer 1 and the second adhesive layer 2. In this way, after the bending area 300 is bent, even if the distances between the bending area 300 and the display area 200 at different points in the thickness direction after bending may be different, there may be no pulling between the first adhesive layer 1 and the second adhesive layer 2, thereby reducing the deformation caused by pulling between the first adhesive layer 1 and the second adhesive layer 2, which helps to enhance the protective effect of the second adhesive layer 2 on the bending area 300 of the display substrate 100.

[0151] Reference Fig.18 In some embodiments, the step of the second adhesive material layer 20 being used to form the second adhesive layer 2 and the first insulating material layer 41 being used to form the first insulating layer 4 in S400 further includes:

[0152] The portion of the first adhesive material layer 10 facing the second adhesive layer 2 and the first insulating layer 4 is removed to form the first adhesive layer 1 spaced apart from the second adhesive layer 2 and the first insulating layer 4 .

[0153] By removing the portion of the first adhesive material layer 10 facing the second adhesive layer 2 and the first insulating layer 4, the edge of the first adhesive layer 1 can be shaped, and the distance between the first adhesive layer 1 and the second adhesive layer 2 after molding can be controlled so that after the first adhesive layer 1 and the second adhesive layer 2 are adhered to the display substrate 100, there is no contact between the first adhesive layer 1 and the second adhesive layer 2. In this way, after the bending area 300 is bent, even if the distances between the bending area 300 and the display area 200 at different points in the thickness direction after bending may be different, there is no pulling between the first adhesive layer 1 and the second adhesive layer 2, thereby reducing the deformation caused by pulling between the first adhesive layer 1 and the second adhesive layer 2, which helps to enhance the protective effect of the second adhesive layer 2 on the bending area 300 of the display substrate 100.

[0154] Reference Fig.19 In some embodiments, when cutting the second adhesive material layer 20 and the first adhesive material layer 10, the cutting tool can be set at the position of line a in the figure, so that the cutting operation can remove the excess parts of the edges of the second adhesive material layer 20 and the first adhesive material layer 10, and the first adhesive layer 1 and the second adhesive layer 2 of the membrane assembly obtained by cutting are connected; in other embodiments, the cutting tool can be set at the positions of line a, line b and line c in the figure, so that the cutting operation can not only remove the excess parts of the edges of the second adhesive material layer 20 and the first adhesive material layer 10, The portion where the second adhesive material layer 20 and the first adhesive material layer 10 are adhered can also be removed, so that the first adhesive layer 1 and the second adhesive layer 2 are spaced apart; in some further embodiments, the cutting tool can also be set on the a line, b line, c line and d line in the figure, so that the cutting operation can not only remove the excess portion of the edge of the second adhesive material layer 20 and the first adhesive material layer 10, remove the portion where the second adhesive material layer 20 and the first adhesive material layer 10 are adhered, but also remove the excess portion of the first adhesive material layer 10 on the side away from the second adhesive material layer 20.

[0155] In some embodiments, the cutting accuracy can be controlled within ±0.05 mm, and the process capability index (CPK) can be 1.33.

[0156] Reference Fig. 20 In some embodiments, S200 includes:

[0157] forming a first adhesive material layer 10 on the first substrate layer 31, forming a polarizing material layer on a side of the first adhesive material layer 10 away from the first substrate layer 31, and forming a process protection layer on a side of the polarizing material layer away from the first substrate layer 31;

[0158] A third through hole is provided on the polarizing material layer to form a polarizer 5, and the third through hole is connected to the first through hole and the second through hole.

[0159] A polarizing material layer is disposed on the first adhesive material layer 10, and the polarizing material layer can form a polarizer 5. The polarizer 5 can filter and regulate the light of the backlight source so that it propagates in a specific direction, illuminates the liquid crystal molecules, and forms a clear image. In addition, the polarizer 5 can also improve the contrast and color reproduction of the liquid crystal display, making the display effect more realistic and natural.

[0160] Reference Fig.21 In this embodiment, the second adhesive material layer 20 in S400 is used to form a second adhesive layer; the first insulating material layer 41 is used to form a first insulating layer, and the steps include:

[0161] At least the second adhesive material layer 20 and the first insulating material layer 41 facing the first adhesive material layer 10 are removed to form a second adhesive layer and a first insulating layer spaced apart from the first adhesive material layer 10 and the polarizing material layer.

[0162] By removing the second adhesive material layer 20 and the first insulating material layer 41 on the side facing the first adhesive material layer 10, the formed second adhesive layer and the first insulating layer can be spaced apart from the first adhesive layer 1 and the polarizer 5. After the first adhesive layer 1 and the second adhesive layer 2 are adhered to the display substrate 100, there may be no contact between the first adhesive layer 1 and the polarizer 5 and the second adhesive layer 2. In this way, after the bending area 300 is bent, even if the distances between the bending area 300 and the display area 200 at different points in the thickness direction after bending may be different, there may be no pulling between the first adhesive layer 1 and the polarizer 5 and the second adhesive layer 2, thereby reducing the deformation caused by pulling between the first adhesive layer 1 and the polarizer 5 and the second adhesive layer 2, which helps to enhance the protective effect of the second adhesive layer 2 on the bending area 300 of the display substrate 100.

[0163] Reference Fig. 22 In this embodiment, the step of the second adhesive material layer 20 in S400 being used to form the second adhesive layer 2 and the first insulating material layer 41 being used to form the first insulating layer 4 may also include:

[0164] The portion of the first adhesive material layer 10 facing the second adhesive layer 2 and the first insulating layer 4 is removed, and the portion of the polarizing material layer facing the second adhesive layer 2 and the first insulating layer 4 is removed to form a first adhesive layer 1 and a polarizer 5 spaced apart from the second adhesive layer 2 and the first insulating layer 4.

[0165] By removing the portion of the first adhesive material layer 10 facing the second adhesive layer 2 and the first insulating layer 4, and removing the portion of the polarizing material layer facing the second adhesive layer 2 and the first insulating layer 4, the edges of the first adhesive layer 2 and the polarizer 5 can be shaped, and the distance between the first adhesive layer 1 and the polarizer 5 and the second adhesive layer 2 after molding can be controlled, so that after the first adhesive layer 1 and the second adhesive layer 2 are adhered to the display substrate 100, there is no contact between the first adhesive layer 1 and the polarizer 5 and the second adhesive layer 2. In this way, after the bending area 300 is bent, even if the distances between the bending area 300 and the display area 200 at different locations in the thickness direction after bending may be different, there is no pulling between the first adhesive layer 1 and the polarizer 5 and the second adhesive layer 2, thereby reducing the deformation caused by pulling between the first adhesive layer 1 and the polarizer 5 and the second adhesive layer 2, which helps to enhance the protective effect of the second adhesive layer 2 on the bending area 300 of the display substrate 100.

[0166] In some embodiments, the membrane assembly can be processed according to the following steps:

[0167] S10, providing a first substrate layer 31;

[0168] S20, forming a first adhesive material layer 10 on the first substrate layer 31;

[0169] S30, covering the first adhesive material layer 10 with a process protection layer 6;

[0170] S40, opening a second through hole 61 in the process protection layer 6, and opening a first through hole 11 in the first adhesive material layer 10, so that a first groove 12 is formed between the first through hole 11 and the substrate layer, and the second through hole 61 is connected to the first groove 12;

[0171] S50, applying glue in the first groove 12 to form a second adhesive material layer 20;

[0172] S60, disposing a first insulating layer 4 on the second adhesive material layer 20;

[0173] S70, cutting the first insulating layer 4, the process protection layer 6, the second adhesive material layer 20 and the first adhesive material layer 10, wherein the second adhesive material layer 20 is cut to form the second adhesive layer 2, and the first adhesive material layer 10 is cut to form the first adhesive layer 1;

[0174] S80, peeling process protection layer 6;

[0175] S90 , covering the second substrate layer 32 on the second adhesive layer 2 and the first adhesive layer 1 to form a film assembly.

[0176] In some embodiments, after S80, the following steps may also be included:

[0177] Cut the edges of the membrane assembly.

[0178] The film assembly can be shaped by cutting the edge of the film assembly, so that the size of the film assembly can be suitable for the display device.

[0179] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A membrane module, characterized in that: The invention comprises a first adhesive layer, a second adhesive layer, a first substrate layer and a second substrate layer, wherein the first adhesive layer and the second adhesive layer are arranged between the first substrate layer and the second substrate layer, and the first adhesive layer and the second adhesive layer are arranged side by side in a direction parallel to the first substrate layer; The membrane assembly further includes a first insulating layer, and the first insulating layer is disposed between the second adhesive layer and the second substrate layer.

2. The membrane module according to claim 1, characterized in that The thickness of the first insulating layer is d1, the thickness of the second adhesive layer is d2, and d1≤0.2*d2; Preferably, the orthographic projection of the first insulating layer in the thickness direction at least partially overlaps with the orthographic projection of the second adhesive layer in the thickness direction; Preferably, an orthographic projection of the first insulating layer in the thickness direction overlaps with an orthographic projection of the second adhesive layer in the thickness direction.

3. The membrane module according to any one of claims 1 to 2, characterized in that: The film assembly further includes a polarizer, and the polarizer is disposed between the first adhesive layer and the second substrate layer.

4. The membrane module according to any one of claims 1 to 2, characterized in that: The orthographic projection of the first adhesive layer in the thickness direction is located within the orthographic projection of the second substrate layer in the thickness direction, and the edge of the second substrate layer protrudes from the edge of the first adhesive layer; and / or, The orthographic projection of the second adhesive layer in the thickness direction is located within the orthographic projection of the second substrate layer in the thickness direction and the edge of the second substrate layer protrudes from the edge of the second adhesive layer; Preferably, the minimum distance that the edge of the second substrate layer protrudes from the edge of the first adhesive layer is less than or equal to 0.2 mm; and / or, The minimum distance that the edge of the second substrate layer protrudes from the edge of the second adhesive layer is less than or equal to 0.2 mm.

5. The membrane module according to any one of claims 1 to 2, characterized in that: The first adhesive layer and the second adhesive layer are arranged at intervals in a direction parallel to the first substrate layer; Preferably, the spacing distance between the first adhesive layer and the second adhesive layer is d3, and 0.08 mm≤d3≤0.17 mm.

6. The membrane module according to any one of claims 1 to 2, characterized in that: The first adhesive layer and the second adhesive layer are connected along a direction parallel to the first substrate layer.

7. A method for preparing a membrane module, characterized in that: The following steps are involved: providing a first substrate layer; sequentially forming a first adhesive material layer and a process protection layer on the first substrate layer; A first through hole is formed on the first adhesive material layer to form a first adhesive layer, and a second through hole is formed on the process protection layer, wherein the first through hole is connected to the second through hole; A second adhesive material layer is disposed in the first through hole, and a first insulating material layer is disposed on a side of the second adhesive material layer away from the first substrate layer, wherein the second adhesive material layer is used to form a second adhesive layer; and the first insulating material layer is used to form a first insulating layer; removing the process protection layer; A second substrate layer is covered on the first adhesive layer and the second adhesive layer to form the membrane assembly.

8. The preparation method according to claim 7, characterized in that: The second adhesive material layer is used to form a second adhesive layer; The step of using the first insulating material layer to form a first insulating layer comprises: removing at least a portion of the second adhesive material layer and the first insulating material layer facing the first adhesive material layer to form the second adhesive layer and the first insulating layer spaced apart from the first adhesive material layer; Preferably, the method further comprises: removing a portion of the first adhesive material layer facing the second adhesive layer and the first insulating layer to form the first adhesive layer spaced apart from the second adhesive layer and the first insulating layer.

9. The preparation method according to claim 7, characterized in that: The step of sequentially forming a first adhesive material layer and a process protection layer on the first substrate layer comprises: forming the first adhesive material layer on the first substrate layer, forming a polarizing material layer on a side of the first adhesive material layer away from the first substrate layer, and forming the process protection layer on a side of the polarizing material layer away from the first substrate layer; It also includes: a third through hole is opened on the polarizing material layer to form a polarizer, and the third through hole is connected to the first through hole and the second through hole.

10. The preparation method according to claim 9, characterized in that: The second adhesive material layer is used to form a second adhesive layer; The step of using the first insulating material layer to form a first insulating layer comprises: At least the second adhesive material layer and the first insulating material layer are removed from the side facing the first adhesive material layer to form the second adhesive layer and the first insulating layer spaced apart from the first adhesive material layer and the polarizing material layer; Preferably, it also includes: removing a portion of the first adhesive material layer on a side facing the second adhesive layer and the first insulating layer, and removing a portion of the polarizing material layer on a side facing the second adhesive layer and the first insulating layer, so as to form the first adhesive layer and the polarizer spaced apart from the second adhesive layer and the first insulating layer.

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