Electronic pouring sealant with high thermal conductivity and preparation method thereof

Abstract

The invention relates to a high-thermal-conductivity electronic pouring sealant, polypropylene glycol diglycidyl ether has good dilution performance, can dilute the high-thermal-conductivity electronic pouring sealant, and can improve the impact resistance and cold and hot impact resistance of the high-thermal-conductivity electronic pouring sealant. The liquid nitrile rubber buna can enhance the flexibility and structural strength of the electronic pouring sealant with high thermal conductivity. The methyl silicone oil and the castor oil can further improve the electrical insulation property and the chemical stability of the high-thermal-conductivity electronic pouring sealant. The nano calcium carbonate can enhance the structural strength and structural stability of the high-thermal-conductivity electronic pouring sealant. The phosphotriester can improve the flame retardant property and plasticity of the electronic pouring sealant with high thermal conductivity. The heat conduction agent can increase the heat conduction performance of the high-heat-conduction electronic pouring sealant. The electronic pouring sealant with high thermal conductivity is good in thermal conductivity, and meets the heat conduction and heat dissipation requirements of the pouring sealant.

Description

Technical Field

[0001] The invention relates to the field of electronic potting glue, and in particular to an electronic potting glue with high thermal conductivity and a preparation method thereof. Background Art

[0002] Electronic potting glue is in liquid form before solidification and has fluidity. The viscosity of the glue varies according to the material, performance, and production process of the product. The potting glue can only realize its use value after it is completely solidified. After solidification, it can play the role of waterproof, moisture-proof, dust-proof, insulating, thermally conductive, confidential, anti-corrosion, temperature-resistant, and shock-proof. There are many types of electronic potting glue, mainly thermal conductive potting glue, epoxy resin potting glue, silicone potting glue, polyurethane potting glue, and LED potting glue.

[0003] However, conventional thermally conductive potting glue, such as the technical solution to be protected by the patent with application number CN01107555.4 and invention name Thermally Conductive Potting Glue, has poor thermal conductivity and cannot meet the thermal conductivity and heat dissipation requirements of the potting glue. Summary of the invention

[0004] Based on this, it is necessary to provide a high thermal conductivity electronic potting glue to address the technical problem that the traditional thermal conductive potting glue has poor thermal conductivity and cannot meet the thermal conductivity and heat dissipation requirements of the potting glue.

[0005] A high thermal conductivity electronic potting glue, the high thermal conductivity electronic potting glue comprises the following components in parts by weight: 20 to 50 parts of polyamide resin, 10 to 30 parts of turpentine epoxy resin, 10 to 20 parts of terminal hydroxyl polybutadiene, 8 to 16 parts of polypropylene glycol diglycidyl ether, 4 to 8 parts of propylene oxide butyl ether, 2 to 4 parts of benzyl alcohol, 3 to 6 parts of liquid nitrile rubber, and 6 to 10 parts of methyl silicone oil , 1 to 2 parts of castor oil, 4 to 8 parts of nano calcium carbonate, 1 to 4 parts of thermal conductor, 1 to 2 parts of triester phosphate, 0.2 to 1 part of diisocyanate, 3 to 7 parts of pigment, 1 to 2 parts of dispersant, 0.3 to 0.7 parts of plasticizer, 2 to 4 parts of coupling agent, 0.5 to 1 part of curing agent, 1 to 2 parts of lubricant, 0.5 to 1.5 parts of anti-settling agent and 1.5 to 2.5 parts of flame retardant.

[0006] In one embodiment, the thermal conductor includes the following components in parts by weight: 10 to 20 parts of aluminum oxide powder, 20 to 30 parts of aluminum nitride, 15 to 25 parts of boron nitride, 25 to 35 parts of aluminum hydroxide powder, and 10 to 20 parts of hollow glass powder.

[0007] In one embodiment, the pigment is phthalocyanine blue.

[0008] In one embodiment, the dispersant is an organosilicon dispersant.

[0009] In one embodiment, the plasticizer is a mixture of dioctyl phthalate and dibutyl phthalate.

[0010] In one embodiment, the coupling agent is an organic silicon coupling agent.

[0011] In one embodiment, the curing agent is a mixture of aliphatic amine and aromatic amine.

[0012] In one embodiment, the lubricant is liquefied paraffin.

[0013] In one embodiment, the flame retardant is mica powder.

[0014] In one embodiment, the anti-settling agent is fumed silica.

[0015] In the above-mentioned electronic potting glue with high thermal conductivity, polyamide resin, turpentine epoxy resin and diisocyanate are used as the main components of the electronic potting glue with high thermal conductivity to increase the viscosity and bonding performance of the electronic potting glue with high thermal conductivity. The terminal hydroxyl polybutadiene has good chemical resistance and excellent electrical insulation performance, which can increase the chemical resistance and excellent electrical insulation performance of the electronic potting glue with high thermal conductivity. Polypropylene glycol diglycidyl ether and benzyl alcohol have good dilution performance, which can dilute the electronic potting glue with high thermal conductivity, and can increase the impact resistance and cold and hot shock resistance of the electronic potting glue with high thermal conductivity. Liquid nitrile rubber can increase the flexibility and structural strength of the electronic potting glue with high thermal conductivity. Methyl silicone oil and castor oil can further increase the electrical insulation performance and chemical stability of the electronic potting glue with high thermal conductivity. Nano calcium carbonate can increase the structural strength and structural stability of the electronic potting glue with high thermal conductivity. Trisphosphate can increase the flame retardant performance and plasticity of the electronic potting glue with high thermal conductivity. The thermal conductive agent can increase the thermal conductivity of the electronic potting glue with high thermal conductivity. The electronic potting glue with high thermal conductivity has good thermal conductivity and meets the thermal conductivity and heat dissipation requirements of the potting glue. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 A diagram showing the components of a highly thermally conductive electronic potting adhesive in one embodiment. DETAILED DESCRIPTION

[0017] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below.

[0018] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0019] See also Figure 1 The present application provides a high thermal conductivity electronic potting glue, comprising the following components in parts by weight: 20 to 50 parts of polyamide resin, 10 to 30 parts of turpentine epoxy resin, 10 to 20 parts of terminal hydroxyl polybutadiene, 8 to 16 parts of polypropylene glycol diglycidyl ether, 4 to 8 parts of propylene oxide butyl ether, 2 to 4 parts of benzyl alcohol, 3 to 6 parts of liquid nitrile rubber, 6 to 10 parts of methyl silicone oil, castor oil, 10 to 20 parts of hydroxyl-terminated ...8 to 16 parts of polypropylene glycol diglycidyl ether, 4 to 8 parts of propylene oxide butyl ether, 1 to 2 parts of sesame oil, 4 to 8 parts of nano calcium carbonate, 1 to 4 parts of thermal conductor, 1 to 2 parts of triester phosphate, 0.2 to 1 part of diisocyanate, 3 to 7 parts of pigment, 1 to 2 parts of dispersant, 0.3 to 0.7 parts of plasticizer, 2 to 4 parts of coupling agent, 0.5 to 1 part of curing agent, 1 to 2 parts of lubricant, 0.5 to 1.5 parts of anti-settling agent and 1.5 to 2.5 parts of flame retardant. Furthermore, the high thermal conductivity electronic potting glue comprises the following components in parts by weight: 25 to 45 parts of polyamide resin, 10 to 25 parts of turpentine epoxy resin, 10 to 15 parts of terminal hydroxyl polybutadiene, 10 to 14 parts of polypropylene glycol diglycidyl ether, 5 to 7 parts of propylene oxide butyl ether, 1 to 3 parts of benzyl alcohol, 4 to 5 parts of liquid nitrile rubber, 7 to 9 parts of methyl silicone oil, 1.2 to 1.8 parts of castor oil, and nano 5 to 7 parts of calcium carbonate, 2 to 3 parts of thermal conductive agent, 1.2 to 1.8 parts of phosphate triester, 0.4 to 0.8 parts of diisocyanate, 4 to 6 parts of pigment, 1.2 to 1.8 parts of dispersant, 0.4 to 0.6 parts of plasticizer, 2.5 to 3.5 parts of coupling agent, 0.6 to 0.9 parts of curing agent, 1.4 to 1.6 parts of lubricant, 0.8 to 1.2 parts of anti-settling agent and 1.8 to 2.2 parts of flame retardant. In this embodiment, the pigment is phthalocyanine blue.

[0020] In order to improve the thermal conductivity of electronic potting glue with high thermal conductivity, in one embodiment, the thermal conductive agent includes the following components by weight: 10 to 20 parts of aluminum oxide powder, 20 to 30 parts of aluminum nitride, 15 to 25 parts of boron nitride, 25 to 35 parts of aluminum hydroxide powder, and 10 to 20 parts of hollow glass powder. The thermal conductive agent composed of the above components has high chemical stability, strong corrosion resistance, and excellent thermal conductivity, which can greatly improve the thermal conductivity of electronic potting glue.

[0021] In order to increase the stability of the electronic potting glue with high thermal conductivity, in one of the embodiments, the dispersant is an organosilicon dispersant, which can increase the mixing uniformity of the components in the electronic potting glue with high thermal conductivity. In one of the embodiments, the plasticizer is a mixture of dioctyl phthalate and dibutyl phthalate, thereby increasing the plasticity of the electronic potting glue with high thermal conductivity. In one of the embodiments, the coupling agent is an organosilicon coupling agent to increase the bonding stability of the components in the electronic potting glue with high thermal conductivity. In one of the embodiments, the curing agent is a mixture of aliphatic amines and aromatic amines to increase the curing performance of the electronic potting glue with high thermal conductivity. In one of the embodiments, the lubricant is liquefied paraffin, which is convenient for reducing the viscosity of the electronic potting glue with high thermal conductivity, facilitating the stirring of the electronic potting glue with high thermal conductivity, thereby increasing the mixing uniformity of the components in the electronic potting glue with high thermal conductivity. In one embodiment, the anti-settling agent is fumed silica, which can prevent the high-density components of the high thermal conductivity electronic potting glue from settling and ensure the mixing uniformity of the components of the high thermal conductivity electronic potting glue. In this embodiment, the flame retardant is mica powder, which has excellent fireproof and high temperature resistance to increase the high temperature and fire resistance of the high thermal conductivity electronic potting glue. In this way, the stability of the high thermal conductivity electronic potting glue is increased.

[0022] In the above-mentioned electronic potting glue with high thermal conductivity, polyamide resin, turpentine epoxy resin and diisocyanate are used as the main components of the electronic potting glue with high thermal conductivity to increase the viscosity and bonding performance of the electronic potting glue with high thermal conductivity. The terminal hydroxyl polybutadiene has good chemical resistance and excellent electrical insulation performance, which can increase the chemical resistance and excellent electrical insulation performance of the electronic potting glue with high thermal conductivity. Polypropylene glycol diglycidyl ether and benzyl alcohol have good dilution performance, which can dilute the electronic potting glue with high thermal conductivity, and can increase the impact resistance and cold and hot shock resistance of the electronic potting glue with high thermal conductivity. Liquid nitrile rubber can increase the flexibility and structural strength of the electronic potting glue with high thermal conductivity. Methyl silicone oil and castor oil can further increase the electrical insulation performance and chemical stability of the electronic potting glue with high thermal conductivity. Nano calcium carbonate can increase the structural strength and structural stability of the electronic potting glue with high thermal conductivity. Trisphosphate can increase the flame retardant performance and plasticity of the electronic potting glue with high thermal conductivity. The thermal conductive agent can increase the thermal conductivity of the electronic potting glue with high thermal conductivity. The electronic potting glue with high thermal conductivity has good thermal conductivity and meets the thermal conductivity and heat dissipation requirements of the potting glue.

[0023] 1000 copies of the above-mentioned high thermal conductivity electronic potting glue were used, and the thickness after curing was 2 mm, 5 cm, and 1 cm. Performance tests were carried out, and the average test results are shown in the following table:

[0024] The above test results show that the electronic potting glue with high thermal conductivity has high viscosity, high structural strength, good flexibility, excellent impact and tensile resistance, and excellent thermal conductivity and heat dissipation performance.

[0025] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0026] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A highly thermally conductive electronic potting adhesive, characterized in that: The invention comprises the following components in parts by mass: 20 to 50 parts of polyamide resin, 10 to 30 parts of turpentine epoxy resin, 10 to 20 parts of hydroxy-terminated polybutadiene, 8 to 16 parts of polypropylene glycol diglycidyl ether, 4 to 8 parts of propylene oxide butyl ether, 2 to 4 parts of benzyl alcohol, 3 to 6 parts of liquid nitrile rubber, 6 to 10 parts of methyl silicone oil, 1 to 2 parts of castor oil, 4 to 8 parts of nano calcium carbonate, 1 to 4 parts of thermal conductor, 1 to 2 parts of triester phosphate, 0.2 to 1 parts of diisocyanate, 3 to 7 parts of pigment, 1 to 2 parts of dispersant, 0.3 to 0.7 parts of plasticizer, 2 to 4 parts of coupling agent, 0.5 to 1 parts of curing agent, 1 to 2 parts of lubricant, 0.5 to 1.5 parts of anti-settling agent and 1.5 to 2.5 parts of flame retardant.

2. The high thermal conductivity electronic potting glue according to claim 1, characterized in that: The thermal conductor includes the following components in parts by mass: 10 to 20 parts of aluminum oxide powder, 20 to 30 parts of aluminum nitride, 15 to 25 parts of boron nitride, 25 to 35 parts of aluminum hydroxide powder, and 10 to 20 parts of hollow glass powder.

3. The high thermal conductivity electronic potting glue according to claim 1, characterized in that: The pigment is phthalocyanine blue.

4. The high thermal conductivity electronic potting glue according to claim 1, characterized in that: The dispersant is an organic silicon dispersant.

5. The high thermal conductivity electronic potting glue according to claim 1, characterized in that: The plasticizer is a mixture of dioctyl phthalate and dibutyl phthalate.

6. The high thermal conductivity electronic potting glue according to claim 1, characterized in that: The coupling agent is an organic silicon coupling agent.

7. The high thermal conductivity electronic potting adhesive according to claim 1, characterized in that: The curing agent is a mixture of aliphatic amine and aromatic amine.

8. The high thermal conductivity electronic potting glue according to claim 1, characterized in that: The lubricant is liquefied paraffin.

9. The high thermal conductivity electronic potting adhesive according to claim 1, characterized in that: The flame retardant is mica powder.

10. The high thermal conductivity electronic potting adhesive according to claim 1, characterized in that: The anti-settling agent is fumed silica.

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