Power supply detection assembly, monitoring circuit, method, electronic equipment, product and medium

Abstract

The invention discloses a power supply detection assembly, a monitoring circuit, a monitoring method, electronic equipment, a product and a medium, relates to the technical field of electronics, directly uses a conductor section of a board card as a current sampling carrier, solves the problems of power supply loop impedance increase and board card layout difficulty caused by introduction of a precision resistor, and achieves the purposes of reducing the power supply loop impedance and improving the product quality. The invention has the advantages of saving space, improving the utilization rate of the board card, relieving the wiring pressure of the high-density PCB, facilitating the device layout and jointed board design of the high-density board card, improving the power supply integrity of the board card, reducing parasitic parameters and power supply path loss, and improving the stability of the conductor section, thereby improving the detection precision.

Description

Technical Field

[0001] The present invention relates to the field of electronic technology, and in particular to a power supply detection component, a monitoring circuit, a method, an electronic device, a product and a medium. Background Art

[0002] With the rapid growth of the electronics industry, the power density of core components such as processors inside the equipment continues to rise, and the board layout faces multiple technical challenges: on the one hand, in high-current power supply scenarios, traditional current detection solutions usually require precision sampling resistors to be connected in series in the power path. This additional component not only significantly increases the impedance of the power loop, causing additional power loss in the system and reducing overall energy efficiency; on the other hand, the introduction of precision resistors and their supporting protection devices makes the layout of high-density boards more difficult, and will cause routing congestion problems in multi-layer PCB (Printed Circuit Board) design.

[0003] Therefore, how to provide a solution to the above technical problems is a problem that those skilled in the art need to solve at present. Summary of the invention

[0004] The present invention provides a power supply detection component, a monitoring circuit, a method, an electronic device, a product and a medium, so as to at least solve the problem that the introduction of precision resistors causes an increase in power supply loop impedance and a difficulty in board layout.

[0005] The present invention provides a power supply detection component, comprising a conductor segment connected to a power input terminal and a power output terminal on a board, and measuring points arranged at both ends of the conductor segment, wherein the power input terminal is connected to a power output end of a power supply, and the power output terminal is connected to a corresponding load on the board, and the measuring point is configured to output power supply parameters of the power supply, wherein the power supply parameters include a voltage detection value of the conductor segment.

[0006] The present invention also provides a power supply monitoring circuit, comprising:

[0007] A switch component connected to the power supply, the switch component being configured to disconnect the power supply output of the power supply in response to a control signal;

[0008] The power supply detection component as described above is connected to the power supply output end of the power supply, and the power supply detection component is configured to detect the power supply parameters of the power supply output end of the power supply, and the power supply parameters include the voltage detection value of the conductor segment in the power supply detection component;

[0009] A control component is connected to the control end of the switch component and the measuring point of the power supply detection component, and is configured to generate the control signal when the voltage detection value meets the abnormal protection condition.

[0010] The present invention also provides an electronic device, comprising a power supply, a load, and the power supply monitoring circuit as described above.

[0011] The present invention further provides a power supply monitoring method, which is applied to the power supply monitoring circuit as described in any one of the above, and the power supply monitoring method comprises:

[0012] Acquire power supply parameters of the power supply detected by the power supply detection component in the power supply monitoring circuit; the power supply parameters include voltage detection values ​​of the conductor segments in the power supply detection component;

[0013] In response to the power supply parameter satisfying the abnormal protection condition, the switch component in the power supply monitoring circuit is controlled to disconnect the power supply output of the power supply connected thereto.

[0014] The present invention also provides a computer program product, comprising a computer program / instruction, which implements the steps of the power supply monitoring method described above when executed by a processor.

[0015] The present invention further provides a computer-readable storage medium, on which a computer program is stored, and when the computer program is executed by a processor, the steps of any of the power supply monitoring methods described above are performed.

[0016] Through the present invention, the conductor segment of the board is directly used as the current sampling carrier, and there is no need to connect an external precision resistor in series. The impedance of the power supply loop is reduced, space is saved, the utilization rate of the board is improved, the pressure of high-density PCB routing is relieved, it is beneficial to the device layout and panel design of high-density boards, the power integrity of the board is improved, the parasitic parameters and power supply path loss are reduced, the stability of the conductor segment is better, and the detection accuracy is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0018] Figure 1 A schematic diagram of the structure of a power supply detection component provided by an embodiment of the present invention;

[0019] Figure 2 A schematic diagram of the structure of a power supply monitoring circuit provided by an embodiment of the present invention;

[0020] Figure 3 A flowchart of the steps of a first power supply protection method provided by an embodiment of the present invention;

[0021] Figure 4A schematic diagram of the structure of a second power supply monitoring method provided by an embodiment of the present invention;

[0022] Figure 5 A schematic diagram of the structure of a third power supply monitoring method provided by an embodiment of the present invention;

[0023] Figure 6 A schematic diagram of the structure of a fourth power supply monitoring method provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0025] It should be noted that, in the description of the present invention, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. The terms "first", "second", etc. in the present invention are used to distinguish similar objects, and are not used to describe a specific order or sequence.

[0026] In order to enable those skilled in the art to better understand the scheme of the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0027] The embodiment of the present invention provides a power supply detection component. The power supply detection component is described in detail in combination with the structure of the power supply detection component. Please refer to Figure 1 The power supply detection component includes a conductor segment 11 connected to a power input terminal and a power output terminal on a board, and a measuring point 12 arranged at both ends of the conductor segment 11, the power input terminal is connected to a power output end of a power supply, and the power output terminal is connected to a corresponding load on the board. The measuring point 12 is configured to output power supply parameters of the power supply, and the power supply parameters include a voltage detection value of the conductor segment 11.

[0028] In this embodiment, non-invasive current detection is used to achieve high-precision detection while eliminating traditional sampling resistors, effectively solving the two core problems of power loss and layout density mentioned in related technologies.

[0029] The current detection in the related art relies on an external sampling resistor, which not only increases power loss, but also occupies precious board space and affects layout density. However, this embodiment uses the inherent parasitic resistance of the conductor segment 11 in the board power path (such as PCB (Printed Circuit Board) copper foil resistor) as a detection element, without the need for an additional series precision resistor. It can be understood that the first end of the conductor segment 11 is connected to the power input terminal on the board, and the second end of the conductor segment 11 is connected to the power output terminal on the board. The power input terminal is used to connect to the power output terminal of the power supply, and the power output terminal is used to connect to the corresponding load on the board. Based on this, the conductor segment 11 of this embodiment can not only realize the function of efficiently transmitting current, but also realize the function of a sampling resistor to detect the power supply parameters of the power output terminal of the power supply.

[0030] This embodiment adopts an integrated measuring point design, and measuring points 12 are respectively provided at both ends of the conductor segment 11, which can be defined as a bridge head measuring point and a bridge tail measuring point. The measuring point 12 refers to a point on the copper foil, which is generally changed through a via. The two measuring points 12 can detect the voltage drop (ΔV) at both ends of the conductor segment 11. Based on the preset impedance (R) of the conductor segment 11, the current (I=ΔV / R) flowing through the conductor segment 11 can be determined, thereby detecting whether there is a large current in the power supply circuit of the power supply. Among them, the impedance of the conductor segment 11 depends on the thickness H, length L, width W and resistivity K of the conductor segment 11, and the power bridge impedance R=K×L / (W×H). The size of the conductor segment 11 is designed according to the actual engineering needs to meet the power path loss requirements and power path detection accuracy requirements of the target electronic device. This embodiment is not specifically limited here. Among them, the target electronic device can be an electronic device with a power supply, such as a server.

[0031] Since the present embodiment directly utilizes the conductor segment 11 of the board as the current sampling carrier, the conductor segment 11 is integrally formed with the board, thereby avoiding the problem of desoldering or poor contact of discrete resistors due to vibration and temperature change, and the parasitic parameters (inductance, capacitance) are controllable, which is beneficial to the signal integrity in high-frequency scenarios. No external precision resistor is required, so that the impedance of the power supply loop is greatly reduced, which not only saves space but also improves the utilization rate of the board. On the other hand, in the design of high-density PCB routing, the present embodiment can effectively alleviate the layout pressure, facilitate the device layout and panel design of high-density boards, further improve the power integrity of the board, and reduce parasitic parameters and power path losses. In addition, the stability of the conductor segment 11 is better, thereby significantly improving the accuracy of current detection, providing a strong guarantee for the stable operation and precise control of related equipment.

[0032] In an exemplary embodiment, the conductor segment 11 is formed by at least one conductive layer on a board.

[0033] In this embodiment, the conductor segment 11 can be composed of a conductive layer on the board or a plurality of conductive layers. The conductive layer can be a copper layer or other conductive material layer on the board. Copper and other conductive materials have excellent electrical conductivity, which can ensure that the current is efficiently transmitted in the conductor segment 11 and reduce energy loss. The conductor segment 11 can also be regarded as a current transmission channel, and the spacing between the two sides of the channel is a width W, and the channel can preferably be a parallel channel. Specifically, a rectangular conductor segment 11 can be selected, and the width of the rectangular conductor segment 11 is consistent on the path to ensure that the impedance parameters of the conductor segment 11 are standardized, thereby improving the accuracy and reliability of current detection. Taking copper foil as an example, the power path on the board is a large area of ​​copper foil, but the specific size of the large area of ​​copper foil is not clearly defined. The conductor segment 11 in this embodiment is a copper foil with detailed dimensions designed according to the requirements. Accordingly, when the conductor segment 11 is composed of multiple layers of copper foil, the shapes of the multiple layers of copper foil are the same.

[0034] In an exemplary embodiment, the conductive layer constituting the conductor segment 11 and the power input terminal and the power output terminal are arranged on different layers of the board, and the conductive layer constituting the conductor segment 11 is connected to the power input terminal and the power output terminal through a via;

[0035] Alternatively, the conductive layer constituting the conductor segment 11 is arranged on the same layer of the board as the power input terminal and the power output terminal.

[0036] In this embodiment, the power input terminal and the power output terminal can be specifically a power input copper foil and a power output copper foil on the board. In this embodiment, the layout design of the conductor segment 11 and the power input terminal and the power output terminal has a certain flexibility, and there are mainly the following two situations:

[0037] The conductor segment 11 and the power terminal are arranged in layers, that is, the conductive layer constituting the conductor segment 11 and the power input terminal and the power output terminal are arranged on different layers of the board. In this case, the conductive layer constituting the conductor segment 11 is connected to the power input terminal and the power output terminal through vias. Vias, as a common connection method in PCB board design, can achieve electrical connection between different layers, ensuring that current can be smoothly transmitted from the power input terminal to the conductor segment 11, and then from the conductor segment 11 to the power output terminal, and then connected to the corresponding load. This layered layout method is conducive to optimizing the space utilization of the board, especially in the design of high-density boards, which can effectively alleviate the wiring pressure on the same layer and provide more space for the layout of other components and lines.

[0038] The conductor segment 11 is arranged on the same layer as the power terminal, and the conductive layer constituting the conductor segment 11 is arranged on the same layer as the power input terminal and the power output terminal. At this time, the power input terminal and the power output terminal can specifically be the power input copper foil and the power output copper foil on the board. The copper foil of the conductor segment 11 and the power input / output copper foil can be arranged on the same layer or on different layers. When the copper foil of the conductor segment 11 is multi-layered, one layer can be arranged on the same layer as the power input / output copper foil. This same-layer layout method can simplify the manufacturing process of the board in some cases, reduce the number of vias used, and reduce potential reliability problems and manufacturing costs caused by vias. At the same time, the same-layer layout is also convenient for wiring optimization and debugging in the design stage, and can more intuitively observe and adjust the connection relationship between the conductor segment 11 and the power terminal, ensuring the efficiency and stability of the current transmission path.

[0039] In an exemplary embodiment, the conductor segment 11 is a multi-layer structure composed of a plurality of interconnected conductive layers, and a plurality of interconnected vias are provided on both the power input terminal and the power output terminal.

[0040] In this embodiment, when the conductor segment 11 is composed of multiple interconnected conductive layers, multiple interconnected vias are provided on the power input terminal and the power output terminal. The interconnected vias are vertical channels connecting different conductive layers, allowing current to flow between different layers. By reasonably designing the number and distribution of vias, it is possible to ensure that the current is evenly distributed between the layers, and to avoid overheating or damage caused by excessive current in a certain layer. It can be understood that the multi-layer structure can arrange more circuits in a limited space, improve the integration and density of the circuit, help reduce interference and crosstalk in signal transmission, and improve signal integrity.

[0041] The number of interconnect vias is usually determined by the current requirements of the circuit. For example, if the circuit needs to pass a current of 30A, the number of vias is usually designed to be 30 or more to ensure that the current can be evenly distributed. The number of interconnect vias can also be reduced appropriately, but it is necessary to ensure that it will not affect the balanced distribution of current and the performance of the circuit. The arrangement of vias can be dense or scattered, depending on the design requirements of the circuit and the process capabilities of the PCB board factory.

[0042] For example, taking a power branch requiring a current of 50A as an example, the thickness of the copper foil H can be selected as 2OZ (0.06096mm thick), the width of the copper foil W is 3mm, the length L is 6mm, and the resistivity K=0.018ohm.mm2 / m;

[0043] The impedance of the conductor segment 11 is: R=K×L / (H×W)=6mm×(10^-3)×0.018 / (0.06096mm×3mm)=0.59mohm;

[0044] The detection voltage of the conductor segment 11 is: V=50A×0.59mohm=29.5mV.

[0045] In an exemplary embodiment, the conductor segment 11 includes a first side and a second side of equal length, the measuring point 12 includes a first measuring point arranged on the first side and a second measuring point arranged on the second side, the first measuring point is connected to a first detection line, and the second measuring point is connected to a second detection line, and the first detection line and the second detection line are arranged on different layers on the board with the conductor segment 11.

[0046] In this embodiment, the conductor segment 11 includes a first side and a second side of equal length. The measuring point 12 includes a first measuring point arranged on the first side and a second measuring point arranged on the second side. As an optional embodiment, the first measuring point and the second measuring point are selected on the center line on both sides of the conductor segment 11. This symmetrical layout of the measuring points 12 helps to accurately obtain the voltage drop across the conductor segment 11 and provide a reliable data basis for current calculation. The first measuring point is connected to the first detection line, and the second measuring point is connected to the second detection line. The first detection line and the second detection line are connected to the control component in the form of a differential pair. The differential pair connection method has good anti-interference performance and can effectively improve the accuracy and stability of the detection signal. In high-speed signal transmission and precision measurement, the differential signal can offset the influence of external electromagnetic interference, while reducing crosstalk between signals, ensuring that the detected voltage drop signal truly reflects the current change in the conductor segment 11.

[0047] The first detection line, the second detection line and the conductor segment 11 are arranged on different layers on the board, which can effectively utilize the vertical space of the board and avoid wiring conflicts between the conductor segment 11 and the detection line on the same layer. Especially in high-density board design, this layered layout provides more flexibility for the arrangement of other components and lines, which helps to achieve complex circuit design and compact device layout. It can be understood that a large working current flows through the conductor segment 11, and the detection line transmits a weak signal for detection. The layered arrangement of the two can significantly reduce the mutual inductance effect of the current change in the conductor segment 11 on the detection line signal, reduce noise interference, and thus improve the accuracy of current detection. In addition, the layered layout also helps to reduce mutual interference between the detection lines and ensure the transmission quality of the differential signal. In addition, during the manufacturing process, the layered layout is conducive to optimizing the manufacturing process of the PCB. The functional divisions of different layers are clear, which can improve production efficiency and yield. At the same time, reducing the direct contact between the detection line and the high-current conductor segment 11 reduces the risk of electrical failures due to manufacturing defects or during use, and improves the overall reliability of the board.

[0048] In an exemplary embodiment, the size of the conductor segment 11 is determined based on the power path loss requirement and the power path detection accuracy of the target electronic device.

[0049] In this embodiment, in order to meet the power path loss requirements, it is necessary to ensure that the resistance of the conductor segment 11 is small enough to reduce the energy loss during the current transmission process. This can be achieved by increasing the cross-sectional area of ​​the conductor segment 11 or reducing the length. For example, when designing a server board, for a large current path, a wider copper foil trace is usually selected to reduce resistance and reduce loss. The power path detection accuracy is related to the impedance of the conductor segment 11. In non-invasive current detection technology, the inherent parasitic resistance of the conductor segment 11 is used as a detection element, and the voltage drop across the conductor segment 11 needs to be accurately measured to calculate the current. In order to improve the detection accuracy, the impedance of the conductor segment 11 should be kept stable and within the allowable range. The size of the conductor segment 11 will affect its impedance. Generally speaking, the longer the length of the conductor segment 11 and the smaller the cross-sectional area, the greater the impedance. Therefore, when designing the conductor segment 11, it is necessary to determine the appropriate size according to the detection requirements to ensure that the impedance meets the detection accuracy requirements. For example, in high-precision current detection applications, the size of the conductor segment 11 should be designed to be more precise to ensure the stability and consistency of its impedance.

[0050] In order to ensure the normal operation of the power supply circuit in the related technology, it is necessary to add current monitoring devices to the power supply circuit. Current monitoring devices generally use precision resistors to sample voltage to collect current information. When there are multiple power supply branches, it will take up a considerable amount of board area, and after the device is added, the gap with other electronic components will be increased, which is not very friendly to the PCB layout of high-density boards. In addition, the increase in abnormal protection devices also brings about an increase in cost. In order to realize the mounting of precision resistors, the copper foil of the PCB board needs to increase the layer change of different levels through VIA (Vertical Interconnect Access) vias, which increases the copper foil path from the inner layer to the outer layer and then from the outer layer to the inner layer, which brings parasitic impedance and inductive parameters, and also reduces the integrity of the power supply.

[0051] To solve the above problems, please refer to Figure 2 , an embodiment of the present invention further provides a power supply monitoring circuit, comprising:

[0052] A switch component 21 connected to the power supply, the switch component 21 is configured to disconnect the power supply output of the power supply in response to a control signal;

[0053] The power supply detection component 22 as described in any of the above embodiments is connected to the power supply output end of the power supply source, and the power supply detection component 22 is configured to detect the power supply parameters of the power supply output end of the power supply source, and the power supply parameters include the voltage detection value of the conductor segment in the power supply detection component 22;

[0054] The control component 23 is connected to the control end of the switch component 21 and the measuring point of the power supply detection component 22, and is configured to generate a control signal when the voltage detection value meets the abnormal protection condition.

[0055] In this embodiment, the first end of the switch component 21 is connected to the power supply, and the control end of the switch component 21 is connected to the control component 23. The control signal sent by the control component 23 is responded to to disconnect the power output of the power supply. Its function is to quickly cut off the power supply when an abnormality is detected to protect the circuit. The power supply detection component 22 is connected to the power supply output end of the power supply, and is responsible for detecting the power supply parameters of the power supply output end, including the voltage detection value of the conductor segment. This component uses the inherent parasitic resistance of the conductor segment as a detection element, and does not require an external precision resistor, which reduces the board area occupied. The control component 23 connects the control end of the switch component 21 and the measuring point of the power supply detection component 22. When the voltage detection value meets the abnormal protection condition, the control component 23 generates a control signal to trigger the switch component 21 to disconnect the power supply.

[0056] The control component 23 can be implemented in the form of a chip, circuit, element or a combination thereof having the above functions.

[0057] Since the power supply detection component 22 does not require additional precision resistors, the board area is saved, and the PCB layout of high-density boards is more friendly. It will not take up too much space due to the increase of current monitoring devices, nor will it affect the layout of other electronic components. The use of devices such as precision resistors is reduced, and the cost is reduced. At the same time, the increase in the copper foil vias and layer changes of the PCB board for the precision resistor mounting is avoided, the manufacturing process is simplified, and the manufacturing cost is further reduced. The parasitic impedance and inductive parameters caused by the increase of precision resistors and via layer changes are avoided, the integrity of the power supply is improved, the power supply path loss is reduced, and the stability and reliability of current transmission are ensured.

[0058] In an exemplary embodiment, the power supply includes a transformer, and at least one end of the primary winding and the secondary winding of the transformer is connected in series with a switch component 21.

[0059] In this embodiment, the power supply includes a transformer, and the switch component 21 is connected in series to one end of the primary winding or the secondary winding of the transformer. By controlling the conduction or disconnection of the switch component 21, the power output of the power supply can be turned on and off.

[0060] The switch component 21 is connected in series to one end of the primary winding. When the switch component 21 is turned on, the primary winding and the power supply form a closed loop, and current begins to flow in the primary winding. According to the principle of electromagnetic induction, the alternating current in the primary winding will induce a voltage in the secondary winding, so that the power supply has a power output. When the switch component 21 is disconnected, the circuit between the primary winding and the power supply is cut off, and no current flows in the primary winding. Therefore, no voltage is induced in the secondary winding, and the power supply stops outputting power.

[0061] The switch component 21 is connected in series to one end of the secondary winding. When the switch component 21 is turned on, the secondary winding and the load form a closed loop. The voltage induced in the secondary winding drives the current to flow through the load, thereby realizing the power output of the power supply. When the switch component 21 is disconnected, the circuit between the secondary winding and the load is cut off, and the current in the secondary winding cannot flow through the load, so the power supply stops outputting power.

[0062] The switch component 21 can be a switch tube, such as a MOS (Metal-Oxide-Semiconductor Field-Effect Transistor) tube, a triode, an IGBT (Insulated Gate Bipolar Transistor) tube, etc.

[0063] It can be understood that the power supply is an external component of the board, the control component 23, the MOS tube, and the load are devices and components on the board, and the conductor segment can be etched out of the PCB board of the board during production, and is not a device outside the board; the power supply is connected to the board through a connector, and the connector realizes the connection between the power supply and the signal. The load can be divided into a fixed load and a plug-in load. The fixed load is a load welded or fixed on the board, and the plug-in load is connected to the board through a connector. In the related art, the power supply circuit is designed separately using the power supply and the board circuit, and the current monitoring + switching device is added to the board power path. The power supply and the board power abnormality design have poor interconnectivity and cannot achieve coordinated consistency control of the system. In the circuit abnormality design of the board end, when the current is large, the E-Fuse circuit requires multiple precision resistors and MOS in parallel, and the number of devices will increase significantly. Since the surface mounting of the device requires repeated layer replacement of the copper foil of the board, the impedance and parasitic parameters of the power path are increased, which destroys the power integrity of the device and causes the cost of the device and the board to rise. The solution of this embodiment can save the cost of E-Fuse devices in conventional power supply protection design and reduce the area occupied by the board, which is beneficial to the device layout and panel design of high-density boards, improves the power integrity of the board, reduces parasitic parameters and power path losses, and integrates the power supply and board load from independent subsystems into system-level logic control, thereby realizing refined power supply management of the system and protection against circuit abnormalities.

[0064] In an exemplary embodiment, the power supply includes a main power supply and a backup power supply, and the switch component 21 includes a first switch tube and a second switch tube, the first switch tube connects the main power supply and the control component 23, and the second switch tube connects the backup power supply and the control component 23.

[0065] In this embodiment, the power supply is of redundant design, including a main power supply and a backup power supply. The main power supply is the main power supply source when the system is working normally, and the backup power supply is put into use when the main power supply fails or is abnormal, to ensure the continuous and stable operation of the system. Assuming that the power supply is of N+1 redundant design, it includes N main power supplies and 1 backup power supply. Assuming that the power supply is of N+N redundant design, it includes the same number of main power supplies and backup power supplies.

[0066] In this embodiment, the switch assembly 21 includes a first switch tube and a second switch tube. The first switch tube is connected to the main power supply and the control assembly 23, and the second switch tube is connected to the backup power supply and the control assembly 23. The switch tube can be a semiconductor device such as a transistor, a MOSFET, etc., which is used to control the on and off of the power supply. The control ends of the first switch tube and the second switch tube are both connected to the control assembly 23, and the control assembly 23 is responsible for monitoring the state of the power supply system and generating a control signal according to the monitoring result to control the on or off of the first switch tube and the second switch tube.

[0067] In a specific embodiment, when the system is operating normally, the main power supply is the main power supply, and the first switch tube is turned on, allowing the main power supply to supply power to the load. The control component 23 monitors the power supply parameters of the main power supply in real time, such as voltage, current, etc. When an abnormality occurs in the main power supply, such as low voltage, overload, etc., the control component 23 immediately generates a control signal after detecting the abnormality, disconnects the first switch tube, and stops the power supply of the main power supply. At the same time, the control component 23 triggers the second switch tube to turn on, so that the backup power supply starts to supply power to the load, ensuring the uninterrupted operation of the system. After the main power supply fault is eliminated, the control component 23 can automatically or manually switch back to the main power supply mode, disconnect the second switch tube, and restore the normal working state of the main power supply.

[0068] Of course, in addition to the above redundancy modes, other redundancy modes are also possible, which are not specifically limited in this embodiment.

[0069] This embodiment uses redundant design to automatically switch to the backup power supply when the main power supply fails, greatly improving the reliability and stability of the power supply and reducing the system downtime caused by power failure. N+1 or N+N redundant design can be selected according to actual needs, and the number of main power supplies and backup power supplies can be flexibly configured to meet the requirements of power supply reliability and cost in different application scenarios. The control component 23 can monitor the power supply status in real time, detect abnormalities in time and take measures to protect the system from power failures and extend the service life of the equipment.

[0070] In an exemplary embodiment, the power supply monitoring circuit further includes:

[0071] A temperature acquisition component, wherein at least one conductor segment is provided within the temperature acquisition range of the temperature acquisition component, a sampling output end of the temperature acquisition component is connected to the control component 23, and the temperature acquisition component is configured to output a temperature sampling value;

[0072] The control component 23 is further configured to correct the impedance of the corresponding conductor segment according to the temperature sampling value.

[0073] In this embodiment, after the conductor segment theoretical impedance data is designed, after the PCB is processed and before the device is soldered to the PCB, an impedance test is performed on each conductor segment, such as a flying probe test or an ICT (In-Circuit Test) test; the theoretical data and the actual data are compared to confirm the correction coefficient K1, and the power bridge impedance is corrected in the subsequent logic control: R_real=R×K1. As a preferred embodiment, the PCB process is strengthened, and the same coefficient is used for the power bridge impedance correction of the same batch of PCBs.

[0074] Taking into account that the resistance of the conductor segment changes with temperature, the present embodiment also arranges a temperature acquisition component, such as a temperature sensor, around the conductor segment to monitor the temperature of the conductor segment. The sampling output end of the temperature sensor is connected to the second detection end of the control component 23 for transmitting the temperature signal. The control component 23 is responsible for receiving the output signal of the temperature sensor and correcting the impedance value of the conductor segment in real time according to these signals, thereby reducing the current detection error and improving the detection accuracy.

[0075] The temperature collection components and the conductor segments can be one-to-one, or multiple adjacent conductor segments can share a temperature detection circuit.

[0076] In summary, the present invention saves the cost of E-Fuse devices in conventional power supply protection design and reduces the board area, which is beneficial to the device layout and panel design of high-density boards; improves the board power integrity, reduces parasitic parameters and power path loss; the power supply and board load are integrated into system-level logic control by independent subsystems to achieve a refined power supply design of the system. It can effectively solve the problems of difficult PCB layout, increased board area and cost, increased power transmission loss and poor power integrity in the power supply design of high-density boards for servers and computers.

[0077] The embodiment of the present invention further provides a power supply monitoring method, which is applied to the power supply monitoring circuit of any of the above embodiments, referring to Figure 3 , the power supply monitoring method includes:

[0078] S101: Acquire power supply parameters of a power supply detected by a power supply detection component in a power supply monitoring circuit; the power supply parameters include a voltage detection value of a conductor segment in the power supply detection component;

[0079] S102: In response to the power supply parameter satisfying the abnormal protection condition, controlling the switch component in the power supply monitoring circuit to disconnect the power supply output of the power supply to which it is connected.

[0080] In this embodiment, after the design of each conductor segment is completed, at least two voltage thresholds are designed for the impedance of each conductor segment to set the abnormal protection conditions. In this embodiment, multiple voltage thresholds are designed, namely, a first preset value V1, a second preset value V2, a third preset value V3 and a fourth preset value V4, wherein V2 and V4 may be equal. In this embodiment, the abnormal protection conditions satisfied by the power supply parameters can be determined based on the magnitude relationship between the voltage detection value and the above voltage thresholds. When it is determined that the power supply parameters satisfy a certain abnormal protection condition, the system immediately controls the switch component in the power supply monitoring circuit to disconnect the power supply output of the power supply connected thereto. This response mechanism ensures that the power supply can be quickly cut off in the event of an abnormal situation to avoid potential damage or danger.

[0081] As an optional embodiment, V1=R_real×I, I is the estimated maximum load current on each power sub-circuit, and R_real is the actual impedance of the conductor segment; V3=R_real×I×K3, V3 is the alarm threshold, K3 is the alarm threshold coefficient, the coefficient can be adjusted, generally between 1.2-1.5 times; or the threshold V2 can also be set, V2=R_real×I×K4, V2 is the fault abnormality threshold, the coefficient K4 can be adjusted, generally between 1.5-2 times.

[0082] In an exemplary embodiment, there are multiple power supplies, and in response to a power supply parameter satisfying an abnormal protection condition, a process of controlling a switch component in a power supply monitoring circuit to disconnect a power supply output of the power supply connected thereto includes:

[0083] Determine the target power source according to the abnormal protection condition satisfied by the voltage detection value;

[0084] The switch component connected to the target power supply in the control power supply monitoring circuit is disconnected.

[0085] In this embodiment, when the voltage detection value meets different abnormal protection conditions, the protection strategy executed is different, that is, the target power supply of the disconnected power output is different. By way of example, when the voltage detection value meets the first abnormal protection condition, the power output of the main power supply is disconnected; when the voltage detection value meets the second abnormal protection condition, the power output of the backup power supply is disconnected; when the voltage detection value meets the third abnormal protection condition, it is necessary to disconnect the power outputs of the main power supply and the backup power supply. It can be understood that when the power output of the main power supply is disconnected, the control component sends a control signal to the first switch tube; when the power output of the backup power supply is disconnected, the control component sends a control signal to the second switch tube.

[0086] In an exemplary embodiment, the plurality of power supplies include a main power supply and a backup power supply, and according to an abnormal protection condition satisfied by a voltage detection value, a process of determining a target power supply includes:

[0087] When the voltage detection value is greater than or equal to the first preset value, it is determined that the voltage detection value meets the first alarm condition in the abnormal protection condition, and the target power supply is determined to be a backup power supply.

[0088] In this embodiment, the voltage detection value of the conductor segment in the power supply detection component is obtained in real time, and this detection value reflects the output voltage of the current power supply. The obtained voltage detection value is compared with the preset voltage threshold to determine whether the abnormal protection condition is met. In this embodiment, multiple voltage thresholds are designed, such as V1, V2, V3 and V4, where V2 and V4 can be equal. When the voltage detection value of a certain conductor segment is greater than or equal to the first preset value V1, it is determined that the first alarm condition in the abnormal protection condition is met. At this time, the target power supply is determined to be a backup power supply, and a control signal is sent to the second switch tube to disconnect the power supply output of the backup power supply. The purpose is to reduce the energy reserve of the front end when the back end of the board card is abnormal. When the board card circuit is abnormal, the expansion of the fault impact caused by the huge energy of the redundant power supply can be avoided. This method can quickly respond to abnormal situations, ensure that protection measures are taken in the shortest time, and avoid equipment damage or system shutdown caused by slow protection action. Through a reasonable target power supply determination and control mechanism, the system can seamlessly switch to the backup power supply when the main power supply is abnormal, ensuring the continuity of power supply.

[0089] In an exemplary embodiment, referring to Figure 4 , the power supply monitoring method further includes:

[0090] When the voltage detection value is greater than or equal to the first preset value, start timing;

[0091] When the current timing time does not reach the first preset time, if the switch component connected to the backup power supply is disconnected, and the obtained voltage detection value of the conductor segment is less than the first preset value, the switch component connected to the backup power supply is controlled to be turned on.

[0092] In this embodiment, after determining that the first alarm condition is met, the timing starts. This timing mechanism is used to monitor the duration of the abnormal state. The first preset time t1 is the duration of the load on the board under the maximum current condition. This setting ensures that the system can still safely complete the protection action under the maximum current that may occur in the load, and avoids the expansion of the fault due to long-term energy supply. During the timing period, the voltage detection value at both ends of each conductor segment is still continuously monitored after the power supply output of the backup power supply is disconnected to determine whether it is lower than the first preset value V1. If the voltage detection value obtained is less than the first preset value V1 when the current timing time does not reach the first preset time t1, the system determines that the abnormal situation has been resolved. At this time, the system controls the second switch tube connected to the backup power supply to conduct and restore the power supply output of the backup power supply.

[0093] By cutting off the backup power supply in time, the front-end energy reserve can be effectively reduced, and the expansion of the fault impact caused by the continuous energy supply of the redundant power supply can be avoided when the board circuit is abnormal. Not only can it respond quickly to abnormal situations, but it can also dynamically adjust the control strategy according to the duration of the abnormality and voltage changes to ensure that the power supply is restored in time after the abnormality is resolved, avoiding unnecessary system downtime. Through a reasonable dynamic control mechanism, the system can maintain stable operation under various working conditions and improve the overall power supply reliability.

[0094] In an exemplary embodiment, according to the abnormal protection condition satisfied by the voltage detection value, the process of determining the target power supply further includes:

[0095] When the current timing time has not reached the first preset time, if the switch component connected to the backup power supply is disconnected, the voltage detection value of the conductor segment obtained is greater than or equal to the second preset value, and it is determined that the voltage detection value meets the first fault protection condition in the abnormal protection condition, and it is determined that the target power supply also includes the main power supply; the second preset value is greater than the first preset value.

[0096] In this embodiment, during the timing period, the system continuously monitors the voltage detection value of the conductor segment to determine whether it is lower than the first preset value V1, but if the detected voltage detection value is greater than or equal to the second preset value V2, the system determines that the first fault protection condition in the abnormal protection condition is met. At this time, it is determined that the target power supply includes not only the backup power supply but also the main power supply, that is, under the current working condition, both the main power supply and the backup power supply need to be controlled accordingly to deal with more serious abnormal situations.

[0097] In an exemplary embodiment, referring to Figure 5 , the power supply monitoring method further includes:

[0098] When the current timing time reaches the first preset time, if the switch component connected to the backup power supply is disconnected, the voltage detection value of the conductor segment obtained is greater than or equal to the third preset value, and the target load is controlled to reduce the frequency; the target load is the load connected to the rear end of the conductor segment whose voltage detection value is greater than or equal to the third preset value, and the third preset value is greater than the first preset value.

[0099] In this embodiment, if the current timing time reaches the first preset time t1, if the voltage detection value of the conductor segment does not drop below the first preset value V1, but reaches the third preset value V2, it is determined that the abnormal situation persists and may worsen. At this time, a frequency reduction operation is performed on the load connected to the rear end of the conductor segment. The purpose of this operation is to reduce the power consumption of the load, thereby reducing its demand for power supply and alleviating power supply abnormalities. At the same time, it can also effectively protect critical loads from damage in power supply abnormalities and extend the service life of the equipment. The load can be a key component such as a processor.

[0100] In an exemplary embodiment, according to the abnormal protection condition satisfied by the voltage detection value, the process of determining the target power supply further includes:

[0101] If the duration that the acquired voltage detection value of the conductor segment is greater than or equal to the third preset value is greater than the second preset time, it is determined that the voltage detection value of the conductor segment meets the second alarm condition, and it is determined that the target power source also includes the main power source.

[0102] In this embodiment, if the voltage detection value of the conductor segment is greater than or equal to the third preset value and the duration is greater than the second preset time t2, then it is determined that the conductor segment meets the second alarm condition. At this time, the power supply output that needs to be shut down includes not only the backup power supply but also the main power supply, and t2 is greater than or equal to the time when the main processor changes from peak power consumption to rated power consumption.

[0103] Of course, after the voltage detection value of the conductor segment reaches the third preset value V3, if the current timing time is less than the second preset time t2, it is detected that the voltage detection value falls back, and the logic operation of detecting whether the voltage detection value is greater than or equal to the first preset value is returned. This embodiment can effectively protect key loads (such as processors) from damage in the case of power supply abnormality and extend the service life of the equipment by reducing the frequency operation and expanding the target power supply range.

[0104] In an exemplary embodiment, the power supply monitoring method further includes:

[0105] When the voltage detection value of the conductor segment obtained is greater than or equal to a third preset value, timing starts;

[0106] According to the abnormal protection condition satisfied by the voltage detection value, the process of determining the target power supply also includes:

[0107] When the current timing time has not reached the second preset time, if the voltage detection value of the conductor segment obtained after the target load is controlled to reduce the frequency is greater than or equal to the fourth preset value, it is determined that the voltage detection value meets the second fault protection condition in the abnormal protection condition, and it is determined that the target power supply also includes the main power supply; the fourth preset value is greater than the third preset value.

[0108] In this embodiment, if the target load is controlled to reduce frequency and the current timing time has not reached t2, if the voltage detection value of the conductor segment rises to the fourth preset value, it is determined that the voltage detection value meets the second fault protection condition in the abnormal protection condition, and it is determined that the target power supply also includes the main power supply, and the first switch tube and the second switch tube are controlled to be disconnected.

[0109] In an exemplary embodiment, according to the abnormal protection condition satisfied by the voltage detection value, the process of determining the target power supply further includes:

[0110] When the current timing time reaches the second preset time, if the switch component connected to the backup power supply is disconnected, the voltage detection value of the conductor segment obtained is greater than or equal to the third preset value, and the voltage detection value of the conductor segment is determined to meet the second alarm condition, and it is determined that the target power supply also includes the main power supply; the third preset value is greater than the first preset value.

[0111] In this embodiment, if the voltage detection value is still higher than the third preset value V3 after time t2, a shutdown signal is sent to the first switch tube of the main power supply, and the system is powered off.

[0112] As another optional embodiment, please refer to Figure 6 If the voltage detection value of the conductor segment reaches the second preset value V2 or the fourth preset value V4, the first switch tube of the main power supply and the second switch tube of the backup power supply are both disconnected.

[0113] An embodiment of the present invention further provides an electronic device, including a power supply, a load, and a power supply monitoring circuit as described in any one of the above embodiments.

[0114] An embodiment of the present invention further provides a computer-readable storage medium, on which a computer program is stored. When the computer program is executed by a processor, the steps of the power supply monitoring method described in any of the above embodiments are performed.

[0115] In an exemplary embodiment, the computer-readable storage medium may include, but is not limited to, various media that can store computer programs, such as a USB flash drive, a read-only memory (ROM), a random access memory (RAM), a mobile hard disk, a magnetic disk or an optical disk.

[0116] An embodiment of the present invention further provides a computer program product, which includes a computer program. When the computer program is executed by a processor, the steps of the power supply monitoring method described in any of the above embodiments are implemented.

[0117] An embodiment of the present invention further provides another computer program product, including a non-volatile computer-readable storage medium, wherein the non-volatile computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps of the power supply monitoring method described in any of the above embodiments are implemented.

[0118] Professionals may further appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of the two. In order to clearly illustrate the interchangeability of hardware and software, the composition and steps of each example have been generally described in the above description according to function. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professionals and technicians may use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of the present invention.

[0119] The above is a detailed introduction to a power supply detection component, monitoring circuit, method, electronic device, product and medium provided by the present invention. Specific examples are used herein to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of the present invention, several improvements and modifications can be made to the present invention, and these improvements and modifications also fall within the scope of protection of the claims of the present invention.

Claims

1. A power supply detection component, characterized in that: It includes a conductor segment connected to a power input terminal and a power output terminal on a board, and measuring points arranged at both ends of the conductor segment, the power input terminal is connected to a power output end of a power supply, the power output terminal is connected to a corresponding load on the board, and the measuring point is configured to output a power supply parameter of the power supply, and the power supply parameter includes a voltage detection value of the conductor segment.

2. The power supply detection component according to claim 1, characterized in that: The conductor segment is formed by at least one conductive layer on the board.

3. The power supply detection component according to claim 2, characterized in that: The conductive layer constituting the conductor segment and the power input terminal and the power output terminal are arranged on different layers of the board, and the conductive layer constituting the conductor segment is connected to the power input terminal and the power output terminal through a via hole; or, The conductive layer constituting the conductor segment is arranged on the same layer as the power input terminal and the power output terminal of the board.

4. The power supply detection component according to claim 3, characterized in that: The conductor segment is a multi-layer structure composed of a plurality of interconnected conductive layers, and a plurality of interconnected vias are provided on the power input terminal and the power output terminal.

5. The power supply detection component according to claim 1, characterized in that: The conductor segment includes a first side and a second side of equal length, the measuring point includes a first measuring point arranged on the first side and a second measuring point arranged on the second side, the first measuring point is connected to a first detection line, the second measuring point is connected to a second detection line, and the first detection line and the second detection line are arranged on different layers of the board with the conductor segment.

6. The power supply detection component according to any one of claims 1 to 5, characterized in that: The size of the conductor segment is determined based on the power path loss requirement and the power path detection accuracy of the target electronic device.

7. A power supply monitoring circuit, characterized in that: include: A switch component connected to the power supply, the switch component being configured to disconnect the power supply output of the power supply in response to a control signal; The power supply detection component according to any one of claims 1 to 6, connected to the power supply output terminal of the power supply, the power supply detection component is configured to detect the power supply parameters of the power supply output terminal of the power supply, the power supply parameters including the voltage detection value of the conductor segment in the power supply detection component; A control component is connected to the control end of the switch component and the measuring point of the power supply detection component, and is configured to generate the control signal when the voltage detection value meets the abnormal protection condition.

8. The power supply monitoring circuit according to claim 7, characterized in that: The power supply comprises a transformer, and at least one end of the primary winding and the secondary winding of the transformer is connected in series with the switch component.

9. The power supply monitoring circuit according to claim 8, characterized in that: The power supply includes a main power supply and a backup power supply, and the switch component includes a first switch tube and a second switch tube, the first switch tube connects the main power supply and the control component, and the second switch tube connects the backup power supply and the control component.

10. The power supply monitoring circuit according to claim 7, characterized in that: The power supply monitoring circuit also includes: A temperature acquisition component, wherein at least one conductor segment is provided within the temperature acquisition range of the temperature acquisition component, a sampling output end of the temperature acquisition component is connected to the control component, and the temperature acquisition component is configured to output a temperature sampling value; The control component is further configured to correct the impedance of the corresponding conductor segment according to the temperature sampling value.

11. An electronic device, characterized in that: It comprises a power supply, a load and a power supply monitoring circuit as described in any one of claims 7 to 10.

12. A power supply monitoring method, characterized in that: Applied to the power supply monitoring circuit according to any one of claims 7 to 10, the power supply monitoring method comprises: Acquire power supply parameters of the power supply detected by the power supply detection component in the power supply monitoring circuit; the power supply parameters include voltage detection values ​​of the conductor segments in the power supply detection component; In response to the power supply parameter satisfying the abnormal protection condition, the switch component in the power supply monitoring circuit is controlled to disconnect the power supply output of the power supply connected thereto.

13. The power supply monitoring method according to claim 12, characterized in that: The number of the power supplies is multiple, and in response to the power supply parameter satisfying the abnormal protection condition, the process of controlling the switch component in the power supply monitoring circuit to disconnect the power supply output of the power supply connected thereto includes: Determining a target power source according to an abnormal protection condition satisfied by the voltage detection value; The switch component connected to the target power supply in the power supply monitoring circuit is controlled to be disconnected.

14. The power supply monitoring method according to claim 13, characterized in that: The multiple power supplies include a main power supply and a backup power supply. According to the abnormal protection condition satisfied by the voltage detection value, the process of determining the target power supply includes: When the voltage detection value is greater than or equal to a first preset value, it is determined that the voltage detection value meets a first alarm condition in the abnormal protection condition, and the target power supply is determined to be the backup power supply.

15. The power supply monitoring method according to claim 14, characterized in that: The power supply monitoring method further includes: When the voltage detection value is greater than or equal to a first preset value, start timing; When the current timing time does not reach the first preset time, if the switch component connected to the backup power supply is controlled to be disconnected, and the obtained voltage detection value of the conductor segment is less than the first preset value, the switch component connected to the backup power supply is controlled to be turned on.

16. The power supply monitoring method according to claim 15, characterized in that: According to the abnormal protection condition satisfied by the voltage detection value, the process of determining the target power supply further includes: When the current timing time has not reached the first preset time, if the switch component connected to the backup power supply is controlled to be disconnected, the voltage detection value of the conductor segment obtained is greater than or equal to the second preset value, and it is determined that the voltage detection value meets the first fault protection condition in the abnormal protection condition, and it is determined that the target power supply also includes the main power supply; the second preset value is greater than the first preset value.

17. The power supply monitoring method according to claim 15, characterized in that: The power supply monitoring method further includes: When the current timing time reaches the first preset time, if the voltage detection value of the conductor segment obtained after the switch component connected to the backup power supply is disconnected is greater than or equal to a third preset value, the target load is controlled to reduce the frequency; the target load is the load connected to the rear end of the conductor segment whose voltage detection value is greater than or equal to the third preset value, and the third preset value is greater than the first preset value.

18. The power supply monitoring method according to claim 17, characterized in that: According to the abnormal protection condition satisfied by the voltage detection value, the process of determining the target power supply further includes: If the duration that the acquired voltage detection value of the conductor segment is greater than or equal to the third preset value is greater than the second preset time, it is determined that the voltage detection value of the conductor segment meets the second alarm condition, and it is determined that the target power supply also includes the main power supply.

19. The power supply monitoring method according to claim 18, characterized in that: The power supply monitoring method further includes: When the voltage detection value of the conductor segment obtained is greater than or equal to a third preset value, timing starts; According to the abnormal protection condition satisfied by the voltage detection value, the process of determining the target power supply further includes: When the current timing time has not reached the second preset time, if after controlling the target load to reduce the frequency, the voltage detection value of the conductor segment obtained is greater than or equal to the fourth preset value, it is determined that the voltage detection value meets the second fault protection condition in the abnormal protection condition, and it is determined that the target power supply also includes the main power supply; the fourth preset value is greater than the third preset value.

20. The power supply monitoring method according to claim 15, characterized in that: According to the abnormal protection condition satisfied by the voltage detection value, the process of determining the target power supply further includes: When the current timing time reaches the first preset time, if the switch component connected to the backup power supply is controlled to be disconnected, the voltage detection value of the conductor segment obtained is greater than or equal to the third preset value, it is determined that the voltage detection value of the conductor segment meets the second alarm condition, and it is determined that the target power supply also includes the main power supply; the third preset value is greater than the first preset value.

21. A computer program product, characterized in that The invention comprises a computer program / instruction, which, when executed by a processor, implements the steps of the power supply monitoring method according to any one of claims 12 to 20.

22. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps of the power supply monitoring method according to any one of claims 12 to 20 are performed.

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