RFID tag and heat transfer method thereof

By designing an RFID tag including a heat transfer adhesive layer, a chip layer, a waterproof layer, a printing layer and a release layer, and using heat transfer and hot pressing and pasting technology, the existing RFID tags are solved in the field of clothing and luggage, and high waterproofness and stable pasting effects are achieved.

CN119903867APending Publication Date: 2025-04-29SHENZHEN JIANHE SMART CARD TECH CO LTD
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Patent Information

Application Number
CN202411880907.1
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-12-19
Publication Date
2025-04-29

AI Technical Summary

Technical Problem

The existing RFID tags in the field of clothing and bags are subject to insufficient waterproofness and adhesion, which cannot meet the needs of this field.

Method used

An RFID tag including a heat transfer adhesive layer, a chip layer, a waterproof layer, a printing layer and a release layer was designed. The waterproofness and adhesion of the RFID tag were improved by combining the design of the waterproof layer and the printing layer.

Benefits of technology

It realizes the stable pasting and high waterproofness of RFID tags on clothing materials, meets the application needs in the field of clothing and luggage, and improves the rubbing resistance and stability of RFID tags.

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Abstract

The invention relates to the technical field of RFID tags, and discloses an RFID tag which comprises a heat transfer adhesive layer, a chip layer, a waterproof layer, a printing layer and a release layer which are sequentially arranged, the heat transfer adhesive layer is used for being pasted with an external garment material, the chip layer is used for storing information, the waterproof layer is used for protecting the chip layer, the printing layer is used for printing patterns, and the release layer is used for releasing the patterns. The release layer is used for outer layer protection; the invention further discloses a method for thermally transferring the RFID tag. The method comprises the following steps: S1, tightly attaching the thermal transfer adhesive layer to materials such as clothing, leather, woven labels, shoes, insoles, clothing hangtags, clothing ribbons and the like which are to be externally adhered; s2, the garment material is subjected to hot pressing so that the heat transfer adhesive layer can be melted and pasted to the garment material; therefore, the waterproof performance of the RFID tag is improved, and the waterproof requirement of the RFID tag on the clothes is met.
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Description

Technical Field

[0001] The present invention relates to the technical field of RFID tags, and in particular to an RFID tag and a heat transfer method thereof. Background Art

[0002] RFID tag is an electronic tag that uses radio frequency identification technology. It is also a contactless automatic identification technology that automatically identifies the target object and obtains relevant data through radio frequency signals. The identification work does not require human intervention and can work in various harsh environments. In addition, RFID technology can identify high-speed moving objects and can identify multiple tags at the same time, making the operation quick and convenient.

[0003] The RFID tag is matched with a corresponding reader / writer. When the RFID tag enters the magnetic field, it receives the radio frequency signal sent by the reader / writer, and uses the energy obtained from the induced current to send out the product information stored in the chip (PassiveTag, passive tag or passive tag), or actively sends a signal of a certain frequency (ActiveTag, active tag or active tag); after the reader / writer reads and decodes the information, it sends it to the central information system for relevant data processing to realize the data interpretation of the RFID tag.

[0004] Most of the existing RFID tags are used in the warehousing field, such as book management and logistics management. In these fields, the requirements for the fit and waterproofness of RFID tags are relatively low. The main reason is that in the warehousing field, RFID tags have a certain strength stability after being glued to materials such as books or logistics boxes through the adhesive surface. At the same time, RFID tags can also avoid water sources to the maximum extent in the warehousing field. Therefore, the existing RFID tags cannot be directly used in the field of clothing and luggage, so they need to be improved. Summary of the invention

[0005] The main purpose of the present invention is to propose an RFID tag and a heat transfer method thereof, aiming to provide an RFID tag with good waterproofness and strong adhesion and a method for heat transferring the RFID tag to clothing and bags.

[0006] To achieve the above-mentioned purpose, the present invention proposes an RFID tag, comprising a heat transfer adhesive layer, a chip layer, a waterproof layer, a printing layer and a release layer arranged in sequence, the heat transfer adhesive layer is used to adhere to the external clothing material, the chip layer is used to store information, the waterproof layer is used to protect the chip layer, the printing layer is used to print patterns, and the release layer is used to protect the outer layer.

[0007] Specifically, the heat transfer adhesive layer is made by mixing water-based plastic acrylic resin and water-based epoxy resin, the mixing ratio of the water-based plastic acrylic resin is 62% to 66%, and the mixing ratio of the water-based epoxy resin is 34% to 38%.

[0008] Specifically, the chip layer includes a chip body and an antenna connected to the chip, and the antenna is printed by silver paste.

[0009] Specifically, the waterproof layer is made of a mixture of phenyl silicone heat-resistant resin and acrylic resin, the mixing ratio of the phenyl silicone heat-resistant resin is 68% to 72%, and the mixing ratio of the acrylic resin is 28% to 32%.

[0010] Specifically, the printing layer is drawn by oil film, and the printing layer is formed on a side of the waterproof layer close to the release layer.

[0011] Specifically, the release layer is made of PET or PE material.

[0012] Specifically, a packaging inner layer is arranged on the side of the heat transfer adhesive layer facing the chip layer, and the chip layer is packaged in the packaging inner layer. The waterproof layer is coated on the side of the heat transfer adhesive layer provided with the packaging inner layer.

[0013] Specifically, the thickness of the heat transfer adhesive layer is 10 μm to 15 μm, the thickness of the chip layer is 4 μm to 5 μm, the thickness of the waterproof layer is 5 μm to 6 μm; the thickness of the printing layer is 2 μm to 3 μm, and the thickness of the release layer is 0.2 mm to 0.4 mm.

[0014] To achieve the above-mentioned purpose, the present invention also proposes a method for heat-transferring RFID tags, comprising: S1, closely attaching a heat-transfer adhesive layer to clothing, leather, woven labels, footwear, insoles, clothing tags, clothing ribbons and other materials to be attached to the outside; S2, heat-pressing the clothing material to melt the heat-transfer adhesive layer and adhere it to the clothing material.

[0015] Specifically, the hot pressing temperature described in S2 is 130°C to 150°C.

[0016] The technical solution of the present invention forms an RFID tag by combining a heat transfer adhesive layer, a chip layer, a waterproof layer, a printing layer and a release layer, so that it can be stably adhered to the clothing material through the heat transfer adhesive layer. At the same time, the waterproof layer, the printing layer and the release layer are arranged to provide waterproof protection for the chip layer, so as to improve the waterproofness of the RFID tag, thereby meeting the waterproof requirements of the RFID tag located on the clothing. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a cross-sectional view of the present invention.

[0018] The reference numerals include: 10, heat transfer adhesive layer; 20, chip layer; 30, waterproof layer; 40, printing layer; 50, release layer. DETAILED DESCRIPTION

[0019] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0020] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, top, bottom, inside, outside, vertical, horizontal, longitudinal, counterclockwise, clockwise, circumferential, radial, axial...), then the directional indication is only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0021] In addition, if there are descriptions involving "first" or "second" etc. in the embodiments of the present invention, the descriptions of "first" or "second" etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" or "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in the field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0022] like Figure 1As shown, an RFID tag includes a heat transfer adhesive layer 10, a chip layer 20, a waterproof layer 30, a printing layer 40 and a release layer 50 which are arranged in sequence. The heat transfer adhesive layer 10 is used to be attached to the external clothing material, the chip layer 20 is used to store information, the waterproof layer 30 is used to protect the chip layer 20, the printing layer 40 is used to print patterns, and the release layer 50 is used for outer layer protection; the heat transfer adhesive layer 10 is made of a mixture of water-based plastic acrylic resin and water-based epoxy resin, the mixing ratio of the water-based plastic acrylic resin is 62% to 66%, and the mixing ratio of the water-based epoxy resin is 34% to 66%. 38%; the chip layer 20 includes a chip body and an antenna connected to the chip, and the antenna is printed with silver paste; the waterproof layer 30 is made of a mixture of phenyl silicone heat-resistant resin and acrylic resin, and the mixing ratio of phenyl silicone heat-resistant resin is 68% to 72%, and the mixing ratio of acrylic resin is 28% to 32%; the printing layer 40 is drawn with an oil film, and the printing layer 40 is formed on the side of the waterproof layer 30 close to the release layer 50; the release layer 50 is made of PET or PE material; a packaging inner layer is provided on the side of the heat transfer adhesive layer 10 facing the chip layer 20, and the chip layer 20 is encapsulated in the packaging inner layer. The waterproof layer 30 is coated on the side of the heat transfer adhesive layer 10 with the encapsulation inner layer; the thickness of the heat transfer adhesive layer 10 is 10μm to 15μm, the thickness of the chip layer 20 is 4μm to 5μm, and the thickness of the waterproof layer 30 is 5μm to 6μm; the thickness of the printing layer 40 is 2μm to 3μm, and the thickness of the release layer 50 is 0.2㎜ to 0.4㎜. The heat transfer adhesive layer 10 is provided to facilitate the temperature pasting of the RFID tag on the clothing material, such clothing material includes but is not limited to knitted fabric, non-woven fabric, spray melt fabric, nylon fabric, chemical fiber fabric, etc., and the RFID tag can withstand repeated friction after pasting. At the same time, the heat transfer adhesive layer 10, the waterproof layer 30, the printing layer 40 and the release layer 50 also provide protection for the chip layer 20, so as to prevent the RFID tag from breaking during the cleaning process, causing the chip layer 20 to contact with external chemical materials, or causing the chip layer 20 to be damaged due to repeated friction during the cleaning process, thereby improving the stability of the RFID chip on the clothing.

[0023] In this embodiment, the heat transfer adhesive layer 10 is formed by mixing 64% of water-based plastic acrylic resin and 36% of water-based epoxy resin to improve the adhesion stability of the heat transfer adhesive. At the same time, the thickness of the heat transfer adhesive layer 10 is set to 13 μm, and a packaging inner layer for accommodating the chip layer 20 is provided on one side of the heat transfer adhesive layer 10. The chip layer 20 is wrapped and sealed for the first time by the packaging inner layer, thereby achieving sealing protection for the chip layer 20 to prevent the chip layer 20 from being deformed and damaged due to external forces. The chip layer 20 is waterproofed; after the inner layer of the package is solidified, a waterproof coating prepared by mixing 70% phenyl silicone heat-resistant resin and 30% acrylic resin is coated on the outer side of the inner layer of the package, so that a waterproof layer 30 is formed on the outer side of the chip layer 20, and then the chip layer 20 is conveniently sealed for secondary packaging through the waterproof layer 30 to improve the waterproofness of the RFID tag. At the same time, the thickness of the waterproof layer 30 is 5μm, so as to maximize the waterproofness of the RFID tag while ensuring the thickness of the RFID tag.

[0024] On the chip layer 20, 99.9% pure silver sheets and spherical silver powder particles are used to make silver paste. The diameter of the silver powder particles in the silver paste is 3μm. The silver paste is printed on the chip layer 20 to make the chip layer 20 have better conductivity and improve the communication effect of the RFID chip. After the chip layer 20 is covered with the heat transfer adhesive layer 10 and the waterproof layer 30, the stability of the silver paste printed antenna on the chip layer 20 is improved, so that the printed antenna has the properties of being immovable, unchangeable, non-stratified, and non-peelable under stress, so that the antenna is not easily damaged, and at the same time has the functions of elasticity and stretchability, thereby improving the rubbing resistance of the chip layer 20.

[0025] The printing layer 40 is formed on the waterproof layer 30 by oil film printing, thereby facilitating the description of the RFID tag.

[0026] The release layer 50 is made of a substrate such as PET or PE, so that the RFID tag has the characteristics of being resistant to high temperatures and not easy to deform. At the same time, it can ensure that the pattern of the printed layer 40 will not be scratched or damaged during the production of the RFID tag. At the same time, during heat transfer, it can be effectively separated from the waterproof layer 30 and the printed layer 40 without sticking.

[0027] The present invention also proposes a method for heat-transferring RFID tags, comprising: S1, attaching a heat-transfer adhesive layer 10 to external materials such as clothing, leather, woven labels, footwear, insoles, clothing tags, clothing ribbons, etc. to be attached; S2, hot-pressing the clothing material to melt the heat-transfer adhesive layer 10 and attach it to the clothing material; the hot-pressing temperature in S2 is 130° C. to 150° C. When attaching the RFID tag to the clothing material, first attach the heat-transfer adhesive layer 10 of the RFID tag to the clothing material, and then heat-press the RFID tag and the clothing material at a high temperature of 80° C. by a hot-pressing device, so that the heat-transfer adhesive layer 10 on the RFID tag melts and fuses and solidifies with the clothing material, thereby realizing the heat transfer of the RFID tag, thereby improving the connection stability between the RFID tag and the clothing material, and after completing the heat transfer of the RFID tag, the release layer 50 is peeled off to achieve complete transfer of the RFID tag.

[0028] The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the inventive concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. An RFID tag, characterized in that: It includes a heat transfer adhesive layer, a chip layer, a waterproof layer, a printing layer and a release layer which are arranged in sequence. The heat transfer adhesive layer is used for sticking to the external clothing material, the chip layer is used for storing information, the waterproof layer is used for protecting the chip layer, the printing layer is used for printing patterns, and the release layer is used for outer layer protection.

2. The RFID tag according to claim 1, characterized in that: The heat transfer adhesive layer is made by mixing water-based plastic acrylic resin and water-based epoxy resin, the mixing ratio of the water-based plastic acrylic resin is 62% to 66%, and the mixing ratio of the water-based epoxy resin is 34% to 38%.

3. The RFID tag according to claim 1, characterized in that: The chip layer includes a chip body and an antenna connected to the chip, and the antenna is printed by silver paste.

4. The RFID tag according to claim 1, characterized in that: The waterproof layer is made of a mixture of phenyl silicon heat-resistant resin and acrylic resin, wherein the mixing ratio of the phenyl silicon heat-resistant resin is 68% to 72% and the mixing ratio of the acrylic resin is 28% to 32%.

5. The RFID tag according to claim 1, characterized in that: The printing layer is drawn with an oil film and is formed on a side of the waterproof layer close to the release layer.

6. The RFID tag according to claim 1, characterized in that: The release layer is made of PET or PE material.

7. The RFID tag according to claim 1, characterized in that: The side of the heat transfer adhesive layer facing the chip layer is provided with a packaging inner layer, and the chip layer is packaged in the packaging inner layer. The waterproof layer is coated on the side of the heat transfer adhesive layer provided with the packaging inner layer.

8. The RFID tag according to claim 1, characterized in that: The thickness of the heat transfer adhesive layer is 10 μm to 15 μm, the thickness of the chip layer is 4 μm to 5 μm, the thickness of the waterproof layer is 5 μm to 6 μm; the thickness of the printing layer is 2 μm to 3 μm, and the thickness of the release layer is 0.2 mm to 0.4 mm.

9. A method for thermally transferring the RFID tag according to any one of claims 1 to 8, characterized in that: include: S1. Attach the heat transfer adhesive layer to the clothing, leather, woven label, footwear, insole, clothing tag, clothing ribbon and other materials to be attached; S2. Hot pressing the clothing material to melt the heat transfer adhesive layer and adhere it to the clothing material.

10. The method for thermally transferring an RFID tag according to claim 9, characterized in that: The hot pressing temperature described in S2 is 130°C to 150°C.