Inductor element structure and manufacturing method thereof

Abstract

The invention belongs to the technical field of electromagnetism, and provides an inductance element structure and a manufacturing method thereof.The inductance element structure comprises a magnetic core and a winding arranged in the magnetic core and penetrating out of the magnetic core, and the winding is provided with a terminal at an opening of the magnetic core; meanwhile, a conductor sheet is additionally arranged on the magnetic core of the inductance element structure, and the conductor sheet and the terminal are simultaneously used for forming external electric connection; when the inductance element structure is connected with a PCB (Printed Circuit Board), a novel multilayer circuit board structure can be formed, the space is saved, the packaging volume of a PCB multilayer product can be further reduced, and the energy storage filtering inductance function of the inductance element structure can be exerted while the through-flow is realized; meanwhile, due to the fact that the conductor piece is attached to the magnetic core, heat dissipation of the magnetic core can be accelerated, working loss of the inductance element structure is reduced, and overall power consumption of the multi-layer circuit board structure is reduced.

Description

Technical Field

[0001] The invention belongs to the field of circuit manufacturing and electromagnetic technology, and relates to an inductor element structure and a manufacturing method thereof and a multi-layer circuit board structure. Background Art

[0002] In recent years, with the rapid popularization of portable electronic products such as smartphones, tablets, and wearable devices, users have put forward higher requirements for the miniaturization, lightweight, and high performance of devices. Electronic equipment manufacturers continue to pursue more compact designs to achieve thinner and lighter product forms. This miniaturization trend is not only reflected in the external structure, but also in the internal circuit design. Traditional single-layer circuit boards can no longer meet the requirements of complex functions, and the demand for miniaturized and miniaturized multi-layer board structures is increasing.

[0003] In the existing multi-layer board connection technology, the most commonly used method is to connect different layers of circuit boards through wiring or flat cables. For example, CN215187923U discloses a multi-layer PCB board installation structure, including more than two layers of PCB boards, each layer of PCB boards is provided with installation holes, and all PCB boards are stacked and installed through stacked positioning components. CN103517578B discloses a multi-layer PCB board manufacturing method and a multi-layer PCB board, which realizes the connection between the circuit layer of the first back-drilled layer and the metal layer of the second back-drilled layer, and the connection between the circuit layers of the inner layer boards by making conductive through holes in the inner conductive holes, thereby reducing the area of ​​the PCB board occupied by the inner conductive holes and the conductive through holes, which is conducive to the production of high-density PCB boards.

[0004] It can be seen that the existing technology currently only solves the connection problem between multi-layer boards in a targeted manner, and the method adopted is to stack the multi-layer boards and connect the layers with metal cables. Although this method is simple and easy, it has obvious disadvantages in practical applications: first, this connection method will greatly increase the connection resistance between two or more boards, resulting in an increase in the overall circuit impedance, heat generation and energy consumption; and the complex wiring arrangement will not only make the assembly and manufacturing process complicated, but also affect the internal aesthetics of the product, affecting maintenance and replacement.

[0005] Moreover, the current application market and research and development efforts in the field are still mainly focused on reducing the volume of electronic components in the circuit and the loss of the single unit, while reducing the connection circuit loss between boards and the heat dissipation of components is rarely involved. Therefore, in order to achieve a miniaturized multi-layer circuit board structure that can both reduce the package size and improve the heat dissipation capacity of the components, a new solution needs to be found. Summary of the invention

[0006] In view of the problems existing in the prior art, the purpose of the present invention is to provide an inductor element structure and a manufacturing method thereof, wherein the inductor element structure comprises a magnetic core and a winding arranged inside the magnetic core and passing through the magnetic core, wherein the winding has a terminal at the opening of the magnetic core; at the same time, a conductor sheet is additionally arranged on the magnetic core of the inductor element structure, and the conductor sheet and the terminal are simultaneously used to form an external electrical connection; using the inductor element structure to connect a PCB board can form a new multi-layer circuit board structure, which saves space and is conducive to further reducing the packaging volume of the PCB multi-layer product, and can realize the current flow while also exerting the energy storage filtering inductance of the inductor element structure itself; at the same time, since the conductor sheet is in close contact with the magnetic core, the heat dissipation of the magnetic core can also be accelerated, reducing the working loss of the inductor element structure and the overall power consumption of the multi-layer circuit board structure.

[0007] To achieve this object, the present invention adopts the following technical solutions:

[0008] In a first aspect, the present invention provides an inductor element structure, the inductor element structure comprising:

[0009] A magnetic core, wherein at least one accommodating space is provided inside the magnetic core, and two ends of the accommodating space form openings on the top surface and the bottom surface of the magnetic core respectively;

[0010] A winding, comprising a coil; the winding is arranged in the accommodation space, and the winding has a terminal electrically connected to the coil at the opening; the terminal is used to form an external electrical connection;

[0011] A conductor sheet is arranged on the side surface of the magnetic core, and the two ends of the conductor sheet extend toward the top surface and the bottom surface of the magnetic core respectively until the end surface is in the same plane as the terminal; the conductor sheet is used to form an external electrical connection.

[0012] The present invention provides a novel integrated inductor element structure, the winding of the inductor element structure is arranged inside the magnetic core and passes through the winding of the magnetic core to form a terminal for external electrical connection; at the same time, a conductor sheet is additionally arranged on the magnetic core of the inductor element structure, and the conductor sheet and the terminal are used to form an external electrical connection at the same time; therefore, the inductor element structure can be used to form an electrical connection between two circuit boards to form a novel multi-layer circuit board structure, which is not only conducive to saving space, but also conducive to further reducing the packaging volume of PCB multi-layer products, and can play the role of energy storage filter inductance of the inductor element structure itself while achieving current flow; at the same time, because the conductor sheet fits with the magnetic core in the inductor element structure, it can also speed up the heat dissipation of the magnetic core, reduce the working loss of the inductor element structure, and the overall power consumption of the multi-layer circuit board structure. Specifically, the winding placed inside the magnetic core is combined with the magnetic core to play the role of inductor filtering noise reduction and voltage step-up and step-down, and the conductor sheet placed outside the magnetic core plays the role of connecting the upper and lower layers of PCB boards, powering on and passing electrical signals. By connecting the conductor sheet on the side of the magnetic core, the length of the power line in the circuit can be reduced, and the upper and lower PCBs that originally needed to be connected by external wiring can be connected by the conductor sheet on the periphery of the magnetic core by sandwiching the inductor component structure in the middle of the PCB board. This reduces circuit losses. The terminal sheet placed on the periphery of the magnetic core is close to the magnetic core and can quickly dissipate the heat on the magnetic core, playing a role in cooling the magnetic core, avoiding the problem of increased DC impedance of the internal winding and increased power loss due to higher temperature after the inductor component structure heats up.

[0013] The following are preferred technical solutions of the present invention, but are not intended to be limitations of the technical solutions provided by the present invention. Through the following technical solutions, the technical objectives and beneficial effects of the present invention can be better achieved and realized.

[0014] As a preferred technical solution of the present invention, the conductor sheet includes a metal copper sheet, or other materials with excellent thermal and electrical conductivity.

[0015] As a preferred technical solution of the present invention, the shape of the winding includes any one of a straight line, a curve, a U shape or a Z shape; and the accommodating space is arranged in accordance with the shape of the winding.

[0016] As a preferred technical solution of the present invention, the number of the conductor sheets should be designed and selected according to the specific needs of the upper and lower PCB boards.

[0017] As a preferred technical solution of the present invention, two ends of the conductor sheet extend to the top surface and the bottom surface of the magnetic core respectively.

[0018] As a preferred technical solution of the present invention, a coating is provided in the outer surface of the magnetic core in the area other than the position of the terminal and the position where the conductor piece is provided, so as to protect the magnetic core (ie, as a protective layer).

[0019] As a preferred technical solution of the present invention, the coating includes a paint layer and / or a resin layer, and the thickness of the coating is 0.02 to 0.2 mm.

[0020] As a preferred technical solution of the present invention, a soldering layer is provided between the conductor sheet and the surface of the magnetic core, and the soldering layer comprises a copper-nickel-tin layer or a nickel-silver layer, which is used to fix the conductor sheet.

[0021] In a second aspect, the present invention provides a method for manufacturing the inductor element structure according to the first aspect, the manufacturing method comprising:

[0022] (1) prefabricating a winding; dividing a magnetic core into a first part and a second part, prefabricating the first part, wherein the first part has an internal structure of the magnetic core in the accommodation space, and the internal structure is used to receive the winding;

[0023] (2) assembling the winding and the first part to obtain a semi-assembled body;

[0024] (3) prefabricating the second part, assembling the second part on the semi-assembly to form the magnetic core; or preparing the second part on the semi-assembly to form the magnetic core to obtain a semi-finished product;

[0025] (4) The semi-finished product is sequentially heated and cured, the surface is coated to form a coating, the coating at the position of the terminal and the position where the conductor sheet is set is removed, and then the conductor sheet is assembled to obtain an inductor element structure.

[0026] As a preferred technical solution of the present invention, the internal structure includes a receiving boss.

[0027] As a preferred technical solution of the present invention, in step (3), the method for preparing the second part on the semi-assembly includes placing the semi-assembly in a mold cavity, filling the mold cavity with magnetic material, and pressing to form the second part, forming a complete magnetic core, and obtaining the semi-finished product.

[0028] Preferably, in step (3), after assembling the second part on the semi-assembly, pressing is performed to form the magnetic core.

[0029] As a preferred technical solution of the present invention, in step (4), after the heating and curing, a shaping process is first performed, in which the edges of the magnetic core are chamfered to remove the right angles and edges around the magnetic core.

[0030] Preferably, in step (4), the surface coating method includes spraying, the coating includes paint and / or resin, and the thickness of the coating is 0.02 to 0.2 mm.

[0031] Preferably, in step (4), the method of removing the coating at the position of the terminal and the position where the conductor sheet is set includes laser stripping and / or grinding until a fresh conductor cross section is exposed.

[0032] As a preferred technical solution of the present invention, in step (4), the method for assembling the conductor sheet includes providing a solder layer on the surface of the magnetic core, fixing the conductor sheet on the solder layer to complete the assembly.

[0033] Preferably, the method for providing the solder layer includes preparing a copper-nickel-tin layer by electroplating or preparing a nickel-silver layer by tinning.

[0034] Compared with the prior art solutions, the present invention has at least the following beneficial effects:

[0035] The present invention provides a novel integrated inductor, wherein the winding of the inductor element structure is arranged inside a magnetic core and passes through the winding of the magnetic core to form a terminal for external electrical connection; at the same time, a conductor sheet is additionally arranged on the magnetic core of the inductor element structure, and the conductor sheet and the terminal are used to form an external electrical connection at the same time; therefore, the inductor element structure can be used to form an electrical connection between two circuit boards to form a novel multi-layer circuit board structure, which is beneficial for saving space and further reducing the packaging volume of PCB multi-layer products, and can realize the flow while also exerting the energy storage filtering inductance of the inductor element structure itself; at the same time, since the conductor sheet and the magnetic core are in contact in the inductor element structure, the heat dissipation of the magnetic core can be accelerated, and the working loss of the inductor element structure and the overall power consumption of the multi-layer circuit board structure can be reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 It is a schematic diagram of the inductor element structure of Example 1.

[0037] Figure 2 Schematic diagram of a multilayer circuit board structure of Application Example 1.

[0038] Figure 3 Schematic diagram of the windings in the inductor element structure of Example 1.

[0039] Figure 4 Schematic diagram of the first part of the magnetic core in the inductor element structure of Example 1.

[0040] Figure 5 It is a schematic diagram of assembling the first part of the magnetic core of Example 1 with the winding.

[0041] Figure 6 Schematic diagram of the second part of the magnetic core in the inductor element structure of Example 1.

[0042] Figure 7It is a schematic diagram of the assembly of the second part of the magnetic core of Example 1 and the semi-assembly.

[0043] Figure 8 Schematic diagram of the semi-finished product obtained in Example 1.

[0044] Fig. 9 Schematic diagram of the conductor sheet of Example 1.

[0045] Figures 1 to 9 In the figure: 1-magnetic core, 11-first part, 12-second part, 2-winding, 3-conductor sheet, 4-PCB board.

[0046] Fig.10 It is a comparison diagram of the surface temperature of the inductor element structure obtained in Example 1 and Comparative Example 1 when the same current passes through it.

[0047] Fig.11 This is a comparison chart of the efficiency differences of the multilayer circuit boards obtained in Application Example 1 and Comparative Example 1 under different currents. DETAILED DESCRIPTION

[0048] The technical solution of the present invention is further illustrated below through specific implementation methods.

[0049] It should be clear to those skilled in the art that the embodiments are only intended to help understand the present invention and should not be considered as specific limitations of the present invention.

[0050] In some specific embodiments, the present invention provides an inductor element structure, such as Figure 1 as well as Figures 3 to 9 As shown, the inductor element structure includes:

[0051] A magnetic core 1, wherein at least one accommodating space is provided inside the magnetic core 1, and two ends of the accommodating space form openings on the top surface and the bottom surface of the magnetic core 1 respectively;

[0052] The winding 2 comprises a coil; the winding 2 is arranged in the accommodation space, and the winding 2 has a terminal electrically connected to the coil at the opening; the terminal is used to form an external electrical connection;

[0053] The conductor sheet 3 is arranged on the side surface of the magnetic core 1, and the two ends of the conductor sheet 3 extend toward the top surface and the bottom surface of the magnetic core 1 respectively until the end surface is in the same plane as the terminal; the conductor sheet 3 is used to form an external electrical connection.

[0054] In one embodiment, the conductor sheet 3 includes a metal copper sheet.

[0055] In one embodiment, the winding 2 has a metal conduction function, and the number of the winding 2 can be one or more.

[0056] In one embodiment, the shapes of different windings 2 may be the same or different.

[0057] In one embodiment, the shape of the winding 2 includes any one of a straight line, a curve, a U shape or a Z shape; and the accommodating space is arranged in accordance with the shape of the winding 2 .

[0058] In one embodiment, the two ends of the accommodating space form openings on different magnetic surfaces (i.e., the top surface and the bottom surface), which means that the two ends of the winding 2 can pass through different magnetic surfaces, and the parts that pass through and are exposed to the outside form the terminals, which enable the winding 2 to form an electrical connection with the outside.

[0059] In one embodiment, the number of the conductor sheets 3 may be one or more, and they may be arranged around the magnetic core 1 in a symmetrical manner or an asymmetrical manner.

[0060] Furthermore, the number of the conductor sheets 3 is an even number, and they are symmetrically arranged on two opposite sides of the magnetic core 1 .

[0061] In one embodiment, two ends of the conductor sheet extend to the top surface and the bottom surface of the magnetic core respectively.

[0062] It should be noted that in order to achieve external electrical connection, the shape of the winding 2, the position of the terminal (position of the opening), the size of the winding 2, the number of windings 2, the position of the terminal (opening), the size of the terminal (opening), the shape of the conductor sheet 3, the size of the conductor sheet 3, the setting position of the conductor sheet 3, etc. should be reasonably adjusted as needed to adapt to the position and size of the current.

[0063] In one embodiment, a covering is provided in the outer surface of the magnetic core except for the position of the terminal and the position where the conductor piece is provided, for protection.

[0064] In one embodiment, the coating includes a paint layer and / or a resin layer, and the thickness of the coating is 0.02 to 0.2 mm, for example, it can be 0.02 mm, 0.04 mm, 0.06 mm, 0.08 mm, 0.10 mm, 0.12 mm, 0.14 mm, 0.16 mm or 0.2 mm, etc., but is not limited to the listed values, and values ​​not listed in the above numerical range are also applicable.

[0065] In one embodiment, a solder layer is provided between the conductor sheet and the surface of the magnetic core, and the solder layer includes a copper-nickel-tin layer or a nickel-silver layer, which is used to fix the conductor sheet; further, the solder layer can also be used for welding and fixing the conductor sheet to the PCB board.

[0066] In some specific embodiments, the present invention provides a method for manufacturing the inductor element structure described in the above embodiment, the manufacturing method comprising:

[0067] (1) prefabricating the winding 2; dividing the magnetic core 1 into a first part 11 and a second part 12, prefabricating the first part 11, wherein the first part 11 has the internal structure of the magnetic core 1 in the accommodation space, and the internal structure is used to receive the winding 2;

[0068] (2) Assembling the winding 2 and the first part 11 to obtain a semi-assembled body;

[0069] (3) prefabricating the second part 12, assembling the second part 12 on the semi-assembled body to form the magnetic core 1; or preparing the second part 12 on the semi-assembled body to form the magnetic core 1 to obtain a semi-finished product;

[0070] (4) The semi-finished product is sequentially heated and cured, the surface is coated to form a coating, the coating at the position of the terminal and the position where the conductor sheet 3 is set is removed, and then the conductor sheet 3 is assembled to obtain an inductor element structure.

[0071] It should be noted that, considering the structure that the winding 2 is arranged inside the magnetic core 1 and passes through it, in order to facilitate manufacturing, the manufacturing method first manufactures half of the magnetic core 1, so that the winding 2 can be pre-placed at the position where it should be set (the internal structure) to obtain a semi-assembly, and then the other half of the magnetic core 1 is assembled to the plate assembly or the second part 12 is directly prepared on the plate assembly to form a complete magnetic core 1.

[0072] In one embodiment, in step (1), the internal structure includes a receiving boss.

[0073] In one embodiment, in step (3), the method for preparing the second part 12 on the semi-assembly includes placing the semi-assembly in a mold cavity, filling the mold cavity with magnetic material, and pressing to form the second part 12 to constitute a complete magnetic core 1 to obtain the semi-finished product.

[0074] In one embodiment, in step (3), after assembling the second part 12 on the semi-assembled body, pressing is performed to form the magnetic core 1 .

[0075] In one embodiment, in step (4), the heating and curing is carried out under a protective atmosphere.

[0076] In one embodiment, in step (4), after the heating and curing, a shaping process is first performed, in which the edges of the magnetic core 1 are chamfered to remove the right angles and edges around the magnetic core.

[0077] In one embodiment, in step (4), the surface coating method includes spraying, the coating includes paint and / or resin, and the thickness of the coating is controlled to be 0.02 to 0.2 mm.

[0078] In one embodiment, in step (4), the method of removing the coating at the location of the terminal and the location where the conductor sheet 3 is set includes laser stripping and / or grinding until a fresh conductor cross section is exposed.

[0079] In one embodiment, in step (4), the method for assembling the conductor sheet 3 includes providing a solder layer on the surface of the magnetic core 1, fixing the conductor sheet 3 on the solder layer to complete the assembly.

[0080] In one embodiment, the method of providing the solder layer includes electroplating to prepare a copper-nickel-tin layer or dipping tin to prepare a nickel-silver layer.

[0081] Example 1

[0082] This embodiment provides an inductor element structure, such as Figure 1 as well as Figures 3 to 9 As shown, the inductor element structure includes:

[0083] A magnetic core 1, wherein two Z-shaped accommodation spaces are arranged inside the magnetic core 1, and two ends of each accommodation space form openings on the top surface and the bottom surface opposite to each other of the magnetic core 1;

[0084] Two windings 2, including coils, the coils are Z-shaped; the two windings 2 are respectively arranged in the two accommodating spaces, and the two ends of the windings 2 are respectively provided with terminals electrically connected to the coils at the openings; the terminals are used to form external electrical connections;

[0085] There are four conductor sheets 3, all of which are metal copper sheets, and two of them form a group. The two groups are symmetrically arranged on two opposite side surfaces of the magnetic core 1, and the two conductor sheets 3 on the same surface are spaced apart; the conductor sheet 3 is C-shaped, having a main portion and bending portions respectively arranged at both ends of the main portion; the main portions of all conductor sheets 3 are fitted on the side surfaces, and the two ends are respectively extended toward the top surface of the magnetic core 1 and the bottom surface of the magnetic core 1, until the end surfaces are in the same plane with the terminals, and bending portions parallel to the top surface and the bottom surface of the magnetic core 1 are formed, so that the conductor sheet 3 is clamped on the top surface and the bottom surface of the magnetic core 1 through the bending portions, and the bending portions are away from the outer surface of the magnetic core 1 for forming external electrical connections.

[0086] The inductor element structure of this embodiment is obtained by a manufacturing method as required, and the manufacturing method includes:

[0087] (1) prefabricating the winding 2; dividing the magnetic core 1 into a first part 11 and a second part 12, prefabricating the first part 11, wherein the first part 11 has the internal structure of the magnetic core 1 in the accommodation space, and the internal structure is a receiving boss, and the internal structure is used to receive the winding 2;

[0088] (2) Assembling the winding 2 and the first part 11 to obtain a semi-assembled body;

[0089] (3) placing the semi-assembled body in a mold cavity, filling the mold cavity with magnetic material raw materials, and pressing to form the second part 12, forming a complete magnetic core 1, and obtaining the semi-finished product;

[0090] (4) The semi-finished product is heated and cured, and then subjected to shaping processing, wherein the edges of the magnetic core 1 are chamfered, and the chamfer R is 0.18 mm;

[0091] Then, the surface is coated and a resin is sprayed to form a protective layer; then, the protective layer at the position of the terminal and the position where the conductor piece 3 is set is removed by laser stripping until a fresh conductor cross section is exposed;

[0092] A copper-nickel-tin layer is prepared by electroplating on the fresh conductor cross sections exposed on the four conductor sheets 3, and then the conductor sheets 3 are placed on the copper-nickel-tin layer for assembly and fixation to obtain an inductor element structure.

[0093] Comparative Example 1

[0094] This comparative example provides an inductor element structure, which does not contain a conductor sheet 3. Except for the above, other conditions are exactly the same as those of Example 1.

[0095] When the same current flows through the inductor component structure described in Example 1 and Comparative Example 1, the temperature of the surface of the inductor product is compared as follows: Fig.10 As shown in Table 1:

[0096] Table 1

[0097]

[0098] Combined with the data, it can be seen that in the inductor element structure with an external copper sheet, due to the rapid heat dissipation of the copper sheet, when the inductor passes the same current, its surface temperature is significantly lower than that of the inductor element structure in the embodiment. And as the current increases, the temperature rise of the product surface is less than that of the comparative example.

[0099] Application Example 1

[0100] This application example provides a multi-layer circuit board structure, such as Figure 2As shown, the multi-layer circuit board structure includes at least two PCB boards 4, and the inductor element structure provided in Example 1 is arranged between two adjacent PCB boards 4, and is electrically connected to the conductor sheet 3 and the terminal of the inductor element structure respectively, so as to obtain the multi-layer circuit board structure.

[0101] Application Comparative Example 1

[0102] The present application example provides a multi-layer circuit board structure, which includes at least two PCB boards 4. The inductor element structure provided in Example 1 is arranged between two adjacent PCB boards 4, and is electrically connected to the conductor sheet 3 and the terminal of the inductor element structure respectively, so as to obtain the multi-layer circuit board structure.

[0103] The multilayer circuit board structure obtained by the corresponding application example 1 and the application comparative example 1 was tested. The efficiency difference between the application example 1 and the application comparative example 1 under different currents is as follows: Fig.11 As shown in Table 2:

[0104] Table 2

[0105]

[0106] Combined with the data, it can be seen that the onboard efficiency in Application Example 1 is significantly higher than that in Application Comparison Example 1, indicating that the overall loss of the product can be significantly improved through such a setting in the application example.

[0107] The preferred embodiments of the present invention are described in detail above. However, the present invention is not limited to the specific details in the above embodiments. Within the technical concept of the present invention, a variety of simple modifications can be made to the technical solution of the present invention, and these simple modifications all belong to the protection scope of the present invention.

[0108] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, the present invention will not further describe various possible combinations.

[0109] In addition, various embodiments of the present invention may be arbitrarily combined, and as long as they do not violate the concept of the present invention, they should also be regarded as the contents disclosed by the present invention.

Claims

1. An inductor element structure, characterized in that: include: A magnetic core, wherein at least one accommodating space is provided inside the magnetic core, and two ends of the accommodating space form openings on the top surface and the bottom surface of the magnetic core respectively; A winding, comprising a coil; the winding is arranged in the accommodation space, and the winding has a terminal electrically connected to the coil at the opening; the terminal is used to form an external electrical connection; A conductor sheet is arranged on the side surface of the magnetic core, and two ends of the conductor sheet extend toward the top surface and the bottom surface of the magnetic core respectively until the end surface and the terminal are in the same plane; the conductor sheet is used to form an external electrical connection.

2. The inductor element structure according to claim 1, characterized in that: The conductor sheet includes a metal copper sheet.

3. The inductor element structure according to claim 1 or 2, characterized in that: The shape of the winding includes any one of a straight line, a curve, a U shape or a Z shape; the accommodating space is arranged in accordance with the shape of the winding.

4. The inductor element structure according to any one of claims 1 to 3, characterized in that: Two ends of the conductor sheet extend to the top surface and the bottom surface of the magnetic core respectively.

5. The inductor element structure according to any one of claims 1 to 4, characterized in that: The outer surface of the magnetic core is provided with a coating to protect the magnetic core; Preferably, the coating comprises a paint layer and / or a resin layer, and the thickness of the coating is 0.02-0.2 mm.

6. The inductor element structure according to any one of claims 1 to 5, characterized in that: A soldering layer is provided between the conductor sheet and the magnetic core to fix the conductor sheet; Preferably, the solder layer comprises a copper-nickel-tin layer or a nickel-silver layer.

7. A method for manufacturing an inductor element structure according to any one of claims 1 to 6, characterized in that: The manufacturing method comprises: (1) prefabricating a winding; dividing a magnetic core into a first part and a second part, prefabricating the first part, wherein the first part has an internal structure of the magnetic core in the accommodation space, and the internal structure is used to receive the winding; (2) assembling the winding and the first part to obtain a semi-assembled body; (3) prefabricating the second part, assembling the second part on the semi-assembly to form the magnetic core; or preparing the second part on the semi-assembly to form the magnetic core to obtain a semi-finished product; (4) The semi-finished product is sequentially heated and cured, the surface is coated to form a coating, the coating at the position of the terminal and the position where the conductor sheet is set is removed, and then the conductor sheet is assembled to obtain an inductor element structure.

8. The method for manufacturing an inductor element structure according to claim 7, characterized in that: In step (1), the internal structure includes a receiving boss; Preferably, in step (3), the method for preparing the second part on the semi-assembly comprises placing the semi-assembly in a mold cavity, filling the mold cavity with magnetic material, and pressing to form the second part, forming a complete magnetic core, and obtaining the semi-finished product; Preferably, in step (3), after assembling the second part on the semi-assembly, pressing is performed to form the magnetic core.

9. The method for manufacturing an inductor element structure according to claim 7 or 8, characterized in that: In step (4), after the heating and curing, a shaping process is first performed, wherein the edges of the magnetic core are chamfered to remove the right angles and edges around the magnetic core; Preferably, in step (4), the surface coating method includes spraying, the coating includes paint and / or resin, and the thickness of the coating is controlled to be 0.02 to 0.2 mm; Preferably, in step (4), the method of removing the coating at the position of the terminal and the position where the conductor sheet is set includes laser stripping and / or grinding until a fresh conductor cross section is exposed.

10. The method for manufacturing an inductor element structure according to any one of claims 7 to 9, characterized in that: In step (4), the method for assembling the conductor sheet includes providing a solder layer on the surface of the magnetic core, fixing the conductor sheet on the solder layer to complete the assembly; Preferably, the method for providing the solder layer includes preparing a copper-nickel-tin layer by electroplating or preparing a tin-silver layer by dipping.

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