Chip bonding device and chip bonding system

Abstract

The invention belongs to the technical field of semiconductor processing and manufacturing, and discloses a chip bonding device and a chip bonding system. The chip bonding device comprises a shell, a driving assembly, a sensor assembly and an adsorption assembly, the driving assembly comprises a first driving piece fixedly installed on the shell and a rotating shaft arranged at the output end of the first driving piece, the rotating shaft rotatably penetrates through the shell, and the shell is connected with the rotating shaft through a first thrust piece; the sensor assembly is fixedly installed on the shell, the sensor assembly is connected with the rotating shaft through the second thrust piece, and the sensor assembly can detect the force in the first range and the force in the second range; the adsorption assembly is arranged at the end, away from the first driving piece, of the rotating shaft and used for adsorbing chips. According to the chip bonding device, the problem of poor signal stability and reliability caused by rotation of the sensor assembly is avoided; due to the arrangement of the first thrust piece and the second thrust piece, the axial stress is effectively eliminated, and the accuracy of pressure measurement and feedback is ensured.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor processing and manufacturing, and in particular to a chip bonding device and a chip bonding system. Background Art

[0002] Wafer bonding is a key process in semiconductor processing. In the chip manufacturing process, a large number of tiny devices and structures are first formed on a substrate, and then they are packaged and bonded to another substrate. The more commonly used bonding method is thermal compression bonding; thermal compression bonding requires a certain amount of pressure and temperature to be applied to the pre-bonded chip, and the accuracy and uniformity of the pressure and temperature must be guaranteed. The uniformity of the pressure is affected by many factors, such as the roughness of the chip and substrate, the horizontality of the upper and lower workbenches, and the verticality of the mechanical transmission. In particular, during thermal compression bonding, there will be a time for boosting and holding pressure, as well as linearity requirements for force control.

[0003] At present, most chip bonding machines on the market are composed of a force sensor and a rigid structure. This structure can control the output of pressure through the force sensor. During bonding, the vertical motor first drives the combined mechanism to move downward quickly. When the chip is about to touch the substrate (the distance is set by the thickness tolerance of the substrate and the chip), the motor will slow down, and then the combined mechanism will move downward at a very low speed until the chip touches the substrate. When the pressure reaches the required value, the motor immediately controls the combined mechanism to stop descending. The reason for slow and constant descent is that the thickness of the substrate and the chip has errors. The specific height needs to be fed back by the force sensor. Rapid descent may damage the chip. The problem with this combined mechanism is that the force sensor will shake as the motor shaft rotates, resulting in unstable signal of the force sensor and poor reliability. In addition, a force sensor cannot take into account both large and small forces. Under the same external dimensions, the force can only reach 5kg. When a large force output is required, the size of the bonding head will increase a lot, resulting in the loss of the overall stroke of the machine patch area.

[0004] Therefore, there is an urgent need for a chip bonding device and a chip bonding system to solve the above technical problems. Summary of the invention

[0005] The purpose of the present invention is to provide a chip bonding device and a chip bonding system, aiming to solve the problems of low testing accuracy and poor reliability of force sensors when bonding chips and substrates using existing bonding devices. The chip bonding device and the chip bonding system can effectively improve the accuracy of pressure measurement and feedback.

[0006] To achieve this object, the present invention adopts the following technical solutions:

[0007] A chip bonding device, comprising:

[0008] case;

[0009] A driving assembly, comprising a first driving member fixedly mounted on the housing and a rotating shaft arranged at an output end of the first driving member, the rotating shaft rotatably passing through the housing, and the housing and the rotating shaft are connected via a first thrust member;

[0010] A sensor assembly is fixedly mounted on the housing, the sensor assembly is connected to the rotating shaft via a second thrust member, and the sensor assembly is capable of detecting a force within a first range and a force within a second range;

[0011] The adsorption component is arranged at one end of the rotating shaft away from the first driving member and is used for adsorbing the chip.

[0012] Preferably, a receiving groove for accommodating the sensor assembly is provided on the housing, and the sensor assembly is pressed into the receiving groove by a pressing block.

[0013] Preferably, the receiving groove extends along the axial direction of the rotating shaft, and a notch of the receiving groove is away from the first driving member.

[0014] Preferably, the sensor assembly includes a first sensor and a second sensor connected in series, the first sensor is used to detect forces within the first range, and the second sensor is used to detect forces within the second range.

[0015] Preferably, the first sensor and the second sensor are spaced apart, and two pressing blocks are provided, namely a first pressing block and a second pressing block, and the first sensor is pressed onto the shell through the first pressing block, and the second sensor is pressed onto the first sensor through the second pressing block.

[0016] Preferably, the first sensor and the second sensor each include a sensor body and a connecting wire, one end of the connecting wire is connected to the sensor body, and the other end of the connecting wire passes through the shell and is connected to an external component.

[0017] Preferably, the force in the first range is 0N-5N; the force in the second range is 5N-500N.

[0018] Preferably, the adsorption assembly comprises an air-floating shaft and a suction nozzle, wherein the air-floating shaft is connected to the rotating shaft, and the suction nozzle is arranged at one end of the air-floating shaft away from the rotating shaft, and the suction nozzle is used to adsorb the chip.

[0019] Preferably, a pre-tightening nut is threaded onto the rotating shaft, and the pre-tightening nut is arranged on a side of the first thrust member away from the housing.

[0020] The present invention also provides a chip bonding system, comprising a substrate workbench and the chip bonding device described in any of the above schemes, wherein the substrate workbench is used to support a substrate.

[0021] Beneficial effects of the present invention:

[0022] In the chip bonding device provided by the present invention, the sensor assembly is fixedly mounted on the shell, the shell is connected to the rotating shaft through the first thrust piece, and the sensor assembly is connected to the rotating shaft through the second thrust piece. During the rotation of the rotating shaft, the shell and the sensor assembly remain fixed, thereby avoiding the problem of poor signal stability and reliability due to the rotation of the sensor assembly compared with the prior art; the provision of the first thrust piece and the second thrust piece effectively eliminates axial stress, and the welding pressure received by the rotating shaft can be directly transmitted to the sensor assembly, thereby ensuring the accuracy of pressure measurement and feedback; the sensor assembly can detect forces in the first range and forces in the second range, thereby achieving accurate measurement and feedback of forces in both ranges.

[0023] The present invention also provides a chip bonding system, comprising a substrate workbench and the above chip bonding device, and the chip bonding system has high pressure measurement and feedback accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 is a schematic structural diagram of a chip bonding device provided by an embodiment of the present invention;

[0025] Figure 2 is a cross-sectional view of a chip bonding device provided by an embodiment of the present invention;

[0026] Figure 3 is a schematic structural diagram of a chip and a substrate provided by an embodiment of the present invention when they are bonded or not;

[0027] Figure 4 It is a schematic diagram of the structure after the chip and substrate provided by an embodiment of the present invention are bonded.

[0028] In the figure:

[0029] 100, housing; 200, drive assembly; 210, first drive member; 220, rotating shaft; 300, first thrust member; 400, sensor assembly; 410, first sensor; 420, second sensor; 430, connecting line; 500, second thrust member; 600, adsorption assembly; 610, air floating shaft; 620, suction nozzle; 700, clamping block; 710, first clamping block; 720, second clamping block; 800, pre-tightening nut; 900, coupling; 1000, third thrust member; 1100, vacuum channel; 1200, chip; 1300, substrate. DETAILED DESCRIPTION

[0030] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only parts related to the present invention, rather than all structures, are shown in the accompanying drawings.

[0031] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0032] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0033] In the description of this embodiment, the terms "upper", "lower", "right", etc., directions or positional relationships are based on the directions or positional relationships shown in the drawings, and are only for the convenience of description and simplification of operation, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.

[0034] The present invention provides a chip bonding device, which aims to solve the problems of low test accuracy and poor use reliability of force sensors when bonding chips and substrates using existing bonding devices. The chip bonding device can effectively improve the accuracy of pressure measurement and feedback.

[0035] See also Figures 1 to 4The chip bonding device includes a shell 100, a driving component 200, a sensor component 400 and an adsorption component 600. The driving component 200 includes a first driving member 210 fixedly mounted on the shell 100 and a rotating shaft 220 arranged at the output end of the first driving member 210. The rotating shaft 220 can be rotatably penetrated in the shell 100, and the shell 100 and the rotating shaft 220 are connected by a first thrust member 300; the sensor component 400 is fixedly mounted on the shell 100, and the sensor component 400 is connected to the rotating shaft 220 by a second thrust member 500. The sensor component 400 can detect forces of a first range and forces of a second range; the adsorption component 600 is arranged at one end of the rotating shaft 220 away from the first driving member 210, and is used to adsorb the chip 1200. Exemplarily, the first thrust member 300 and the second thrust member 500 are both thrust bearings, which include two thrust washers and rolling bodies arranged between the two thrust washers. The two thrust washers are a shaft ring and a seat ring, respectively. The shaft ring is matched and connected to the rotating shaft 220, and the seat ring is matched and connected to the housing 100 or the sensor assembly 400.

[0036] In the above-mentioned chip bonding device, the sensor assembly 400 is fixedly mounted on the shell 100, the shell 100 is connected to the rotating shaft 220 through the first thrust member 300, and the sensor assembly 400 is connected to the rotating shaft 220 through the second thrust member 500. During the rotation of the rotating shaft 220, the shell 100 and the sensor assembly 400 remain fixed. Compared with the prior art, the problem of poor signal stability and reliability caused by the rotation of the sensor assembly 400 is avoided; the provision of the first thrust member 300 and the second thrust member 500 effectively eliminates axial stress, and the welding pressure received by the rotating shaft 220 can be directly transmitted to the sensor assembly 400, thereby ensuring the accuracy of pressure measurement and feedback; the sensor assembly 400 can detect forces in the first range and forces in the second range, thereby achieving accurate measurement and feedback of forces in both ranges.

[0037] Optionally, a receiving groove for accommodating the sensor assembly 400 is provided on the housing 100, and the sensor assembly 400 is pressed in the receiving groove by the pressing block 700. The receiving groove can effectively prevent the shaking of the sensor assembly 400, and at the same time, the sensor assembly 400 is fixed by the pressing block 700, which is convenient for disassembly and assembly.

[0038] Furthermore, in this embodiment, the receiving groove extends along the axial direction of the rotating shaft 220, and the notch of the receiving groove is away from the first driving member 210. During installation, the sensor assembly 400 enters the receiving groove along the notch, and the rotating shaft 220 passes through the sensor assembly 400, effectively saving the space occupied by the sensor assembly 400.

[0039] Preferably, the sensor assembly 400 includes a first sensor 410 and a second sensor 420 connected in series, wherein the first sensor 410 is used to detect a force within a first range, and the second sensor 420 is used to detect a force within a second range. This arrangement allows the sensor assembly 400 to simultaneously take into account accurate measurement and feedback of forces within two ranges, and the accurate characteristics of the sensor assembly 400 (±1% of the range) can be reused.

[0040] Optionally, the force in the first range is 0N-5N; the force in the second range is 5N-500N. That is, the first sensor 410 is responsible for the welding force measurement in the small force interval, and the second sensor 420 is responsible for the welding force measurement in the large force interval. The precision characteristics of the force sensor (±1% of the range) can be reused, so that the precision in the entire force interval, especially the small force interval, is more accurate. In specific implementation, when the force in the first range is 0N-5N, the force control accuracy is ±0.05N. The smaller the force, the higher the force control accuracy. When the process input bonding force is ≤5N, the external component automatically reads the data of the first sensor 410 as the patch pressure; the force in the second range is set to 5N-500N, because when the patch is hot-pressed with great force, the force value can reach 50kg, and the maximum force required for the patch process needs to be covered. When the process input bonding force is greater than 5N, the external component automatically reads the value of the second sensor 420.

[0041] When the first sensor 410 and the second sensor 420 are installed and fixed, the first sensor 410 and the second sensor 420 are arranged at intervals, and two pressing blocks 700 are provided, namely the first pressing block 710 and the second pressing block 720. The first sensor 410 is pressed onto the housing 100 by the first pressing block 710, and the second sensor 420 is pressed onto the first sensor 410 by the second pressing block 720. The structure is simple, and the first sensor 410 and the second sensor 420 can be easily and quickly installed or removed.

[0042] In this embodiment, the first sensor 410 and the second sensor 420 each include a sensor body and a connecting wire 430, one end of the connecting wire 430 is connected to the sensor body, and the other end of the connecting wire 430 passes through the housing 100 and is connected to an external component. In the prior art, the connecting wire 430 of the sensor will rotate with the rotation of the rotating shaft 220, and it is very easy to be pulled, resulting in the rotating shaft 220 not being able to rotate 360 ​​degrees infinitely. At the same time, the movement of the cable will also bring about signal stability and reliability problems. The other end of the connecting wire 430 of this embodiment passes through the housing 100 and is connected to the external component to avoid the problem of pulling the connecting wire 430 when the rotating shaft 220 rotates, ensuring the stability and reliability of the output signals of the first sensor 410 and the second sensor 420, and at the same time will not limit the rotation angle of the first sensor 410 and the second sensor 420. At the same time, the space occupied by the wiring of the connecting wire 430 is reduced, thereby facilitating the reduction of the overall size of the chip bonding device.

[0043] Optionally, the adsorption assembly 600 includes an air-floating shaft 610 and a suction nozzle 620, the air-floating shaft 610 is connected to the rotating shaft 220, and the suction nozzle 620 is arranged at one end of the air-floating shaft 610 away from the rotating shaft 220, and the suction nozzle 620 is used to adsorb the chip 1200. The air-floating shaft 610 has the advantages of high precision, low friction, low energy consumption, environmental protection, long life, low noise and high stability, and can effectively improve the adsorption stability. Optionally, the air-floating shaft 610 is connected to the housing 100 through a third thrust member 1000, so that the axial force is better transmitted. The chip bonding device also includes a coupling 900, and the connecting shaft of the output end of the rotating shaft 220 and the first driving member 210 is connected through the coupling 900. A connected vacuum channel 1100 is arranged in the connecting shaft, the rotating shaft 220 and the air-floating shaft 610, and the vacuum channel 1100 constitutes a negative pressure channel so that the suction nozzle 620 adsorbs the chip 1200. Exemplarily, the third thrust member 1000 is configured as a thrust bearing, the shaft ring of the thrust bearing is matched and connected with the air bearing 610 , and the seat ring is matched and connected with the housing 100 .

[0044] Preferably, a pre-tightening nut 800 is threaded onto the rotating shaft 220 , and the pre-tightening nut 800 is disposed on a side of the first thrust member 300 away from the housing 100 , which can effectively improve the tightness and reliability of the connection between the first thrust member 300 and the housing 100 .

[0045] This embodiment also provides a chip bonding system, including a substrate workbench and the above-mentioned chip bonding device, wherein the substrate workbench is used to support the substrate 1300 , and the chip bonding system has high pressure measurement and feedback accuracy.

[0046] See also Figure 3 and Figure 4When the chip bonding system is in operation, the driving component 200 drives the adsorption component 600 to rotate to adjust the contact angle between the chip 1200 and the substrate 1300, and the external additional Z-direction driving device drives the adsorption component 600 to move downward to make the chip 1200 and the substrate 1300 contact.

[0047] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. For those skilled in the art, various obvious changes, readjustments and substitutions can be made without departing from the protection scope of the present invention. It is not necessary and impossible to list all the embodiments here. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the claims of the present invention.

Claims

1. A chip bonding device, characterized in that: include: Housing (100); A driving assembly (200) comprises a first driving member (210) fixedly mounted on the housing (100) and a rotating shaft (220) arranged at an output end of the first driving member (210); the rotating shaft (220) is rotatably arranged in the housing (100); and the housing (100) and the rotating shaft (220) are connected via a first thrust member (300); A sensor assembly (400) is fixedly mounted on the housing (100), the sensor assembly (400) is connected to the rotating shaft (220) via a second thrust member (500), and the sensor assembly (400) is capable of detecting a force within a first range and a force within a second range; The adsorption assembly (600) is arranged at one end of the rotating shaft (220) away from the first driving member (210) and is used for adsorbing the chip (1200).

2. The chip bonding device according to claim 1, characterized in that: The housing (100) is provided with a receiving groove for accommodating the sensor assembly (400), and the sensor assembly (400) is pressed into the receiving groove by a pressing block (700).

3. The chip bonding device according to claim 2, characterized in that: The receiving groove extends along the axial direction of the rotating shaft (220), and the notch of the receiving groove is away from the first driving member (210).

4. The chip bonding device according to claim 2, characterized in that: The sensor assembly (400) comprises a first sensor (410) and a second sensor (420) which are connected in series with each other, wherein the first sensor (410) is used to detect a force within the first range, and the second sensor (420) is used to detect a force within the second range.

5. The chip bonding device according to claim 4, characterized in that: The first sensor (410) and the second sensor (420) are arranged at intervals, and two pressing blocks (700) are provided, namely a first pressing block (710) and a second pressing block (720). The first sensor (410) is pressed onto the shell (100) through the first pressing block (710), and the second sensor (420) is pressed onto the first sensor (410) through the second pressing block (720).

6. The chip bonding device according to claim 4, characterized in that: The first sensor (410) and the second sensor (420) each include a sensor body and a connecting wire (430), one end of the connecting wire (430) is connected to the sensor body, and the other end of the connecting wire (430) passes through the housing (100) to be connected to an external component.

7. The chip bonding device according to claim 4, characterized in that: The force in the first range is 0N-5N; the force in the second range is 5N-500N.

8. The chip bonding device according to claim 1, characterized in that: The adsorption assembly (600) comprises an air-floating shaft (610) and a suction nozzle (620), wherein the air-floating shaft (610) is connected to the rotating shaft (220), and the suction nozzle (620) is arranged at one end of the air-floating shaft (610) away from the rotating shaft (220), and the suction nozzle (620) is used to adsorb the chip (1200).

9. The chip bonding device according to claim 1, characterized in that: A pre-tightening nut (800) is threadedly connected to the rotating shaft (220), and the pre-tightening nut (800) is arranged on a side of the first thrust member (300) away from the housing (100).

10. A chip bonding system, characterized in that: It comprises a substrate workbench and a chip bonding device as described in any one of claims 1 to 9, wherein the substrate workbench is used to support a substrate (1300).

Images