Compatible open front wafer cassette loading device

Abstract

The application relates to the technical field of semiconductor equipment, and discloses a compatible open wafer box loading device which comprises a supporting bottom plate, a wafer box positioning assembly, a wafer box in-position detection assembly and a wafer protrusion detection assembly. The compatible open wafer box loading device can be compatible with wafer boxes of different specifications. When the wafer box is replaced, the wafer box positioning assembly does not need to be replaced or adjusted in position, the position of the wafer box in-position detection assembly does not need to be adjusted, the position of the wafer protrusion detection assembly does not need to be adjusted, and the wafer protrusion detection assembly is not affected whether the wafer is a notched wafer or a flat-edge wafer. The wafer box is only needed to be placed on the corresponding position of the supporting bottom plate, the specification of the wafer box can be automatically identified, the whole process basically does not need manual participation and confirmation, the operation difficulty and error probability are reduced, and the wafer is more convenient for the subsequent mechanical hand to take and place.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor equipment, and in particular to a compatible open wafer cassette loading device. BACKGROUND

[0002] In the field of semiconductor manufacturing, especially in the field of silicon carbide third-generation emerging semiconductor manufacturing, a new development trend is that the customer's production line gradually upgrades from six-inch wafer manufacturing to eight-inch wafer manufacturing, while still retaining six-inch wafer manufacturing, that is, to realize the co-line of six-inch and eight-inch wafer manufacturing.

[0003] However, the open cassette (cst) loading device currently widely used in semiconductor manufacturing is often designed for six-inch csts and cannot be compatible with eight-inch csts. Even if it can be compatible with csts of two sizes, the following problems still exist:

[0004] 1) When replacing csts of different specifications, the corresponding stop blocks need to be manually replaced or their positions need to be adjusted;

[0005] 2) When replacing csts of different specifications, the positions of the corresponding in-position detection sensors need to be manually adjusted;

[0006] 3) When replacing csts of different specifications, the positions of the wafer protrusion detection sensors need to be manually adjusted;

[0007] 4) When replacing csts of different specifications, the system cannot automatically identify the specification of the current cst and needs to be manually confirmed to inform the system of the specification of the current cst;

[0008] 5) The accuracy of the wafer protrusion detection sensor is affected by the wafer style, which has two types, notch (usually for eight-inch wafers) and flat (usually for six-inch wafers). In the prior art, the edge of the notch wafer is usually detected to determine whether the wafer is protruding, but when the flat wafer is replaced, if the sensor is directly on the flat side of the flat wafer, when the wafer protrudes part of the cst and the flat side of the wafer does not reach the sensor position, the sensor cannot detect the wafer, which will misjudge that the wafer is not protruding, resulting in inaccurate wafer protrusion detection.

[0009] The above problems result in the need for a large amount of manual adjustment and manual confirmation of the cst loading device when switching between six-inch and eight-inch csts, and there is a false detection of wafer protrusion, which increases the difficulty of operation and the probability of error, and technical improvement is needed. SUMMARY

[0010] In view of the above problems, the present application aims to provide a compatible open wafer box loading device, so that the replacement process of wafer boxes of different specifications basically does not require manual adjustment and confirmation, thereby reducing the operation difficulty and error probability.

[0011] To achieve the above object, the present application adopts the following technical solutions:

[0012] A compatible open wafer box loading device comprises a support bottom plate, a wafer box positioning assembly mounted on the support bottom plate, a wafer box in-position detection assembly, and a wafer protrusion detection assembly, wherein:

[0013] The wafer box positioning assembly comprises a first positioning block, a second positioning block, and a third positioning block, the first positioning block and the second positioning block cooperate to position a wafer box of a first specification, and the second positioning block and the third positioning block cooperate to position a wafer box of a second specification;

[0014] The wafer box in-position detection assembly comprises a plurality of in-position sensors for judging whether the wafer box is placed in position;

[0015] The wafer protrusion detection assembly comprises at least two protrusion detection sensors, the light spots of the two protrusion detection sensors are tangent to the outer contour of the wafer in the wafer box of different specifications at the same time, and the center distance of the light spots of the two protrusion detection sensors is not less than the positioning edge length of the wafer.

[0016] As an optional solution, the first positioning block, the second positioning block, and the third positioning block are arranged in sequence along the center line of the support bottom plate, and the two protrusion detection sensors are symmetrically distributed on both sides of the center line of the support bottom plate.

[0017] As an optional solution, the wafer box positioning assembly further comprises at least one fourth positioning block, and the fourth positioning block is used for positioning the side edge of the wafer box of the first specification.

[0018] As an optional solution, two fourth positioning blocks are provided, and the two fourth positioning blocks are symmetrically distributed on both sides of the center line of the support bottom plate, and are used for positioning the two side edges of the wafer box of the first specification.

[0019] As an optional solution, the wafer box positioning assembly further comprises at least one fifth positioning block, and the fifth positioning block is used for positioning the side edge of the wafer box of the second specification.

[0020] As an optional solution, two fifth positioning blocks are provided, and the two fifth positioning blocks are symmetrically distributed on both sides of the center line of the support bottom plate, and are used for positioning the two side edges of the wafer box of the second specification.

[0021] As an alternative, the fourth positioning block and / or the fifth positioning block is an L-shaped clamping block, the side surface of the side edge of the wafer box abuts against a straight angle side of the L-shaped clamping block, and the end surface of the side edge of the wafer box abuts against another straight angle side of the L-shaped clamping block.

[0022] As an alternative, the wafer box in-position detection assembly comprises a first in-position sensor and a second in-position sensor, wherein:

[0023] At least one first in-position sensor is arranged in the gap between the first positioning block and the second positioning block, for detecting whether the middle edge at the bottom of the wafer box of the first specification is in position;

[0024] At least one second in-position sensor is arranged in the gap between the second positioning block and the third positioning block, for detecting whether the middle edge at the bottom of the wafer box of the second specification is in position.

[0025] As an alternative, the wafer box in-position detection assembly further comprises a third in-position sensor, which is arranged at a position where the side edges of the wafer box of the first specification and the wafer box of the second specification overlap when placed in position, for detecting whether the side edge of the wafer box of the first specification or the side edge of the wafer box of the second specification is in position.

[0026] As an alternative, the in-position sensor comprises a mounting bracket, a sensing pressure block and a proximity switch, wherein:

[0027] The mounting bracket is arranged on the lower surface of the support bottom plate;

[0028] The first end of the sensing pressure block penetrates the support bottom plate, the second end of the sensing pressure block penetrates the mounting bracket, the middle part of the sensing pressure block is provided with a protrusion, and a compression spring is arranged between the protrusion and the mounting bracket;

[0029] The proximity switch is arranged below the mounting bracket, and when the first end of the sensing pressure block is pressed into the support bottom plate and the second end of the sensing pressure block is close to the proximity switch, the proximity switch sends an in-position signal.

[0030] The beneficial effects of the present application are:

[0031] The compatible open wafer box loading device can be compatible with wafer boxes of different specifications. Taking six-inch wafer boxes and eight-inch wafer boxes as examples, when the wafer box is replaced, the first positioning block, the second positioning block and the third positioning block are adapted to at least two specifications of wafer boxes, without the need to replace the wafer box positioning assembly or adjust the position thereof, without the need to adjust the position of the wafer box in-place detection assembly, without the need to adjust the position of the wafer protrusion detection assembly, and regardless of whether the wafer is a notch wafer or a flat edge wafer, the light spot of at least one protrusion detection sensor can be tangent to the outer contour of the wafer, so that the wafer protrusion detection assembly is not affected, and the wafer box is only needed to be placed on the corresponding position of the support bottom plate, so that the specification of the wafer box can be automatically identified, the entire process basically does not need manual participation and confirmation, thereby reducing the difficulty of operation and the probability of error, and being more beneficial to subsequent mechanical hand wafer taking and placing. BRIEF DESCRIPTION OF DRAWINGS

[0032] Figure 1 FIG. 1 is a structural schematic diagram of a compatible open wafer box loading device provided by an embodiment of the present application;

[0033] Figure 2 FIG. 2 is a protrusion detection schematic diagram of a wafer protrusion detection assembly related to an embodiment of the present application on six-inch wafers and eight-inch wafers;

[0034] Figure 3 FIG. 3 is a schematic diagram of a support bottom plate on which a six-inch wafer box is placed;

[0035] Figure 4 FIG. 4 is a schematic diagram of a support bottom plate on which an eight-inch wafer box is placed;

[0036] Figure 5 FIG. 5 is a structural schematic diagram of an in-place sensor related to an embodiment of the present application.

[0037] In the drawings:

[0038] 1, support bottom plate;

[0039] 2, wafer box positioning assembly; 21, first positioning block; 22, second positioning block; 23, third positioning block; 24, fourth positioning block; 25, fifth positioning block;

[0040] 3, wafer box in-place detection assembly; 31, first in-place sensor; 311, mounting bracket; 312, induction pressing block; 313, proximity switch; 314, compression spring; 32, second in-place sensor; 33, third in-place sensor;

[0041] 4, wafer protrusion detection assembly; 41, protrusion detection sensor;

[0042] 5, six-inch wafer box;

[0043] 6. an eight-inch wafer cassette;

[0044] 7. a side edge;

[0045] 8. a middle edge. DETAILED DESCRIPTION

[0046] The application will be further described below in conjunction with the drawings and embodiments. It is to be understood that the specific embodiments described herein are merely illustrative of the application and are not intended to limit the application in any way. In addition, it is to be understood that the drawings are not necessarily to scale and that, unless otherwise indicated, the drawings are merely intended to schematically represent the general structure of the application.

[0047] In the description of the application, unless otherwise clearly specified and limited, the terms "connected", "connected", "fixed" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the application can be understood according to the specific circumstances.

[0048] In the present application, unless otherwise clearly specified and limited, "on" or "under" the first feature of the second feature can include that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, "on", "above" and "above" of the first feature of the second feature includes that the first feature is directly above and obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The "below", "below" and "below" of the first feature of the second feature includes that the first feature is directly below and obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.

[0049] In the description of the present embodiment, the terms "up", "down", "left", "right" and other orientation or position relationships are based on the orientation or position relationship shown in the drawings, and are only for the convenience of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the application.

[0050] In addition, the terms "first", "second" and the like are only used to distinguish in description and have no special meaning.

[0051] Example 1:

[0052] Please refer to Figure 1 and Figure 2As shown, the embodiment provides a compatible open wafer box loading device, which comprises a support bottom plate 1, a wafer box positioning assembly 2 mounted on the support bottom plate 1, a wafer box in-place detection assembly 3 and a wafer protrusion detection assembly 4. The wafer box positioning assembly 2 is used to position the wafer box placed on the support bottom plate 1, and the wafer box can stack several wafers, and the wafers have positioning notches or positioning edges. The wafer box positioning assembly 2 comprises a first positioning block 21, a second positioning block 22 and a third positioning block 23. The first positioning block 21 cooperates with the second positioning block 22 to position the wafer box of the first specification, and the second positioning block 22 cooperates with the third positioning block 23 to position the wafer box of the second specification. The wafer box in-place detection assembly 3 comprises several in-place sensors, which are used to judge whether the wafer box is placed in place. The wafer protrusion detection assembly 4 comprises at least two protrusion detection sensors 41. The light spots of the two protrusion detection sensors 41 are tangent to the outer contour of the wafers in the wafer box of different specifications at the same time, and the center distance of the light spots of the two protrusion detection sensors 41 is not less than the length of the positioning edge of the wafer.

[0053] In the embodiment, the wafer box of the first specification takes a six-inch wafer box 5 as an example, and the wafer box of the second specification takes an eight-inch wafer box 6 as an example. The six-inch wafer in the six-inch wafer box 5 is provided with a positioning edge, and the eight-inch wafer in the eight-inch wafer box 6 is provided with a positioning notch.

[0054] The center distance A of the light spots of the two protrusion detection sensors 41 is greater than the length B of the positioning edge of the six-inch wafer, so that no matter at what angle the wafers in the wafer box are placed, the light spot of at least one of the two protrusion detection sensors 41 can be tangent to the outer contour of the wafer, as shown in the figure. Figure 2 Thus, it is ensured that the protrusion detection will not cause false detection, and the detection of flat and notch wafers is compatible.

[0055] In addition, the wafer box is not limited to the two specifications, but can also be a wafer box of other specifications. According to the specific size and characteristics of the wafer box, the position and quantity of the wafer box positioning assembly 2 and the wafer box in-place detection assembly 3 on the support bottom plate 1 are adjusted, so that the compatible loading of wafer boxes of different specifications can be realized.

[0056] Therefore, this compatible open wafer cassette loading device can be compatible with wafer cassettes of different specifications. When changing wafer cassettes, the first positioning block 21, the second positioning block 22, and the third positioning block 23 can adapt to at least two specifications of wafer cassettes without replacing the wafer cassette positioning component 2 or adjusting its position, without adjusting the position of the wafer cassette in-situ detection component 3, and without adjusting the position of the wafer protrusion detection component 4. Moreover, regardless of whether it is a notched wafer or a flat-edge wafer, it can ensure that the light spot of at least one protrusion detection sensor 41 is tangent to the outer contour of the wafer, so that the wafer protrusion detection component 4 is not affected. Simply place the wafer cassette on the corresponding position on the support base plate 1, and the specifications of the wafer cassette can be automatically identified. The whole process basically does not require manual intervention and confirmation, thereby reducing the difficulty of operation and the probability of error, and making it easier for the robot arm to pick up and place wafers.

[0057] Example 2:

[0058] Please see Figure 1 and Figure 2 As shown, this embodiment provides a compatible open wafer cassette loading device. Based on embodiment 1, the first positioning block 21, the second positioning block 22 and the third positioning block 23 are arranged sequentially along the center line of the support base plate 1, and two protruding detection sensors 41 are symmetrically distributed on both sides of the center line of the support base plate 1.

[0059] Specifically, both the six-inch wafer cassette 5 and the eight-inch wafer cassette 6 include two side edges 7 and a middle edge 8 connecting the two side edges 7. The middle edge 8 of the six-inch wafer cassette 5 is positioned between the first positioning block 21 and the second positioning block 22, and the middle edge 8 of the eight-inch wafer cassette 6 is positioned between the second positioning block 22 and the third positioning block 23.

[0060] Therefore, by combining different positioning blocks, wafer cassettes of different specifications can be precisely adapted, limiting the position of the wafer cassettes on the support base plate 1. In particular, the design of sharing the second positioning block 22 simplifies the structure of the wafer cassette positioning assembly 2, and when switching between different specifications of wafer cassettes, there is no need to disassemble idle positioning blocks, making it flexible and convenient to use. In addition, placing the wafer cassettes and wafers symmetrically on the support base plate 1 ensures the balance and accuracy of the inspection, reduces errors caused by asymmetry, and further improves the stability and reliability of wafer cassette loading and inspection.

[0061] Example 3:

[0062] Please see Figures 1 to 3 As shown, this embodiment provides a compatible open wafer cassette loading device. Based on embodiment 2, the wafer cassette positioning component 2 further includes at least one fourth positioning block 24, which is used to position the side edge 7 of the six-inch wafer cassette 5.

[0063] Further, the fourth positioning block 24 is provided with two, and the two fourth positioning blocks 24 are symmetrically distributed on both sides of the center line of the support bottom plate 1, and are used for positioning the two side edges 7 of the six-inch wafer box 5.

[0064] In addition, the fourth positioning block 24 is preferably an L-shaped clamping block, the side surface of the side edge 7 of the six-inch wafer box 5 abuts against one straight angle side of the L-shaped clamping block, and the end surface of the side edge 7 of the six-inch wafer box 5 abuts against the other straight angle side of the L-shaped clamping block.

[0065] Therefore, by using the fourth positioning block 24 in cooperation with the first positioning block 21 and the second positioning block 22, the six-inch wafer box 5 is accurately positioned in all directions, and the stability and detection accuracy of the six-inch wafer box 5 during loading are ensured.

[0066] Embodiment 4:

[0067] Please refer to Figure 1 、 Figure 2 and Figure 4 , the present embodiment provides a compatible open wafer box loading device, on the basis of embodiment 2, the wafer box positioning assembly 2 further comprises at least one fifth positioning block 25, and the fifth positioning block 25 is used for positioning the side edge 7 of the eight-inch wafer box 6.

[0068] Further, the fifth positioning block 25 is provided with two, and the two fifth positioning blocks 25 are symmetrically distributed on both sides of the center line of the support bottom plate 1, and are used for positioning the two side edges 7 of the eight-inch wafer box 6.

[0069] In addition, the fifth positioning block 25 is preferably an L-shaped clamping block, the side surface of the side edge 7 of the eight-inch wafer box 6 abuts against one straight angle side of the L-shaped clamping block, and the end surface of the side edge 7 of the eight-inch wafer box 6 abuts against the other straight angle side of the L-shaped clamping block.

[0070] Therefore, by using the fifth positioning block 25 in cooperation with the second positioning block 22 and the third positioning block 23, the eight-inch wafer box 6 is accurately positioned in all directions, and the stability and detection accuracy of the eight-inch wafer box 6 during loading are ensured.

[0071] It should be noted that in other embodiments, embodiments 3 and 4 can be combined to realize accurate positioning of six-inch wafer boxes and eight-inch wafer boxes at the same time.

[0072] Embodiment 5:

[0073] Please refer to Figures 1 to 4As shown, the embodiment provides a compatible open wafer box loading device, and the wafer box in-place detection assembly 3 includes a first in-place sensor 31 and a second in-place sensor 32. At least one first in-place sensor 31 is arranged in the gap between the first positioning block 21 and the second positioning block 22, and the first in-place sensor 31 is used to detect whether the middle edge 8 of the six-inch wafer box 5 is in place. At least one second in-place sensor 32 is arranged in the gap between the second positioning block 22 and the third positioning block 23, and the second in-place sensor 32 is used to detect whether the middle edge 8 of the eight-inch wafer box 6 is in place.

[0074] Further, the embodiment takes two first in-place sensors 31 and two second in-place sensors 32 as an example. The two first in-place sensors 31 are located at both ends of the gap between the first positioning block 21 and the second positioning block 22, and the two second in-place sensors 32 are located at both ends of the gap between the second positioning block 22 and the third positioning block 23, which fully guarantees the accuracy of the detection result.

[0075] Therefore, the middle edge 8 of the wafer box is accurately detected by multiple in-place sensors to monitor the in-place state of the wafer box in real time. At the same time, according to the triggering condition of the in-place sensor at different positions, the current loaded wafer box specification can be automatically identified, which ensures the intelligence and efficiency of the detection system and further improves the automation level of the production line.

[0076] Embodiment 6:

[0077] Please refer to Figures 1 to 4 As shown, the embodiment provides a compatible open wafer box loading device, and on the basis of embodiment 5, the wafer box in-place detection assembly 3 further includes a third in-place sensor 33. The third in-place sensor 33 is located at the position where the side edge 7 of the six-inch wafer box 5 and the side edge 7 of the eight-inch wafer box 6 overlap when placed in place, and the third in-place sensor 33 is used to detect whether the side edge 7 of the six-inch wafer box 5 or the side edge 7 of the eight-inch wafer box 6 is in place.

[0078] Therefore, by sharing the third in-place sensor 33, double verification of the side edge 7 of the six-inch wafer box 5 and the side edge 7 of the eight-inch wafer box 6 is realized, the number of in-place sensors is reduced, the detection layout is optimized, and the cost is reduced.

[0079] When detecting the six-inch wafer box 5, the two first in-place sensors 31 and the third in-place sensor 33 are triggered, and the two first in-place sensors 31 and the third in-place sensor 33 are triggered when the six-inch wafer box 5 is completely placed in place. For details, please refer to Figure 3 .

[0080] When detecting the 8-inch wafer cassette 6, two second in-situ sensors 32 are triggered by the middle edge 8 of the 8-inch wafer cassette 6, and a third in-situ sensor 33 is triggered by one side edge 7 of the 8-inch wafer cassette 6. When both second in-situ sensors 32 and the third in-situ sensor 33 are triggered simultaneously, the system determines that the 8-inch wafer cassette 6 is fully positioned. See details. Figure 4 .

[0081] Example 7:

[0082] Please see Figure 5 As shown, this embodiment provides a compatible open wafer cassette loading device. Based on embodiment 1, the structures of each in-situ sensor can be the same or different. Taking the first in-situ sensor 31 as an example, it includes a mounting bracket 311, a sensing block 312, and a proximity switch 313. The mounting bracket 311 is disposed on the lower surface of the support base plate 1. The first end of the sensing block 312 protrudes from the support base plate 1, and the second end of the sensing block 312 passes through the mounting bracket 311. A protrusion is provided in the middle of the sensing block 312, and a compression spring 314 is provided between the protrusion and the mounting bracket 311. The proximity switch 313 is located below the mounting bracket 311. When the first end of the sensing block 312 is pressed into the support base plate 1, and the second end of the sensing block 312 approaches the proximity switch 313, the proximity switch 313 sends an in-situ signal.

[0083] Therefore, the contact-based detection method ensures the high sensitivity and stability of the sensor. When the sensing block 312 is pressed by the wafer cassette, it retracts downward into the support base plate 1 against the elastic force of the compression spring 314, thereby triggering the proximity switch 313 and sending an in-position signal. When the wafer cassette is removed, the sensing block 312 resets under the action of the compression spring 314, and the second end of the sensing block 312 moves away from the proximity switch 313, sending an out-of-position signal.

[0084] In summary, this compatible open wafer cassette loading device, through the interdependence, correlation, and cooperation of the wafer cassette positioning component 2, the wafer cassette in-situ detection component 3, and the wafer protrusion detection component 4, can simultaneously accommodate six-inch wafer cassettes 5, eight-inch wafer cassettes 6, and even other wafer cassette specifications. When replacing wafer cassettes, there is no need to adjust the device structure; simply place the wafer cassette in the corresponding position. Furthermore, the device can automatically identify the specifications of the currently placed wafer cassette. Compared with existing technologies that require extensive manual adjustments and confirmation of the wafer cassette stage and suffer from false detections of wafer protrusion, this compatible open wafer cassette loading device achieves rapid positioning, automatic judgment, and accurate identification for wafer cassette replacement, resulting in higher efficiency, higher accuracy, and higher safety.

[0085] Obviously, the above embodiments of the present application are merely exemplary but not intended to limit the embodiments of the present application. Various obvious changes, re-adjustments and substitutions can be made by those skilled in the art without departing from the scope of the present application. It is not necessary or possible to enumerate all the embodiments. Any modification, equivalent replacement and improvement made within the spirit and principle of the present application shall be included in the protection scope of the claims of the present application.

Claims

1. A compatible open front wafer cassette loading device characterized by, The application relates to a wafer box positioning device, which comprises a supporting bottom plate (1), a wafer box positioning assembly (2) mounted on the supporting bottom plate (1), a wafer box in-position detection assembly (3) and a wafer protrusion detection assembly (4). The wafer box positioning assembly (2) comprises a first positioning block (21), a second positioning block (22) and a third positioning block (23), the first positioning block (21) and the second positioning block (22) are matched to position a wafer box of a first specification, and the second positioning block (22) and the third positioning block (23) are matched to position a wafer box of a second specification. The wafer box in-position detection assembly (3) comprises a plurality of in-position sensors, which are used for judging whether a wafer box is placed in position; the wafer box in-position detection assembly (3) comprises a first in-position sensor (31) and a second in-position sensor (32), at least one first in-position sensor (31) is arranged in a gap between the first positioning block (21) and the second positioning block (22) and is used for detecting whether the middle edge of the bottom of the wafer box of the first specification is in position, and at least one second in-position sensor (32) is arranged in a gap between the second positioning block (22) and the third positioning block (23) and is used for detecting whether the middle edge of the bottom of the wafer box of the second specification is in position. The wafer protrusion detection assembly (4) comprises at least two protrusion detection sensors (41), the light spots of the two protrusion detection sensors (41) are tangent to the outer contour of the wafer in the wafer box of different specifications at the same time, and the center distance of the light spots of the two protrusion detection sensors (41) is not less than the positioning edge length of the wafer.

2. The compatible open front wafer cassette loading device of claim 1, wherein, The first positioning block (21), the second positioning block (22) and the third positioning block (23) are arranged in sequence along the center line of the supporting bottom plate (1), and the two protrusion detection sensors (41) are symmetrically distributed on the two sides of the center line of the supporting bottom plate (1).

3. The compatible open front wafer cassette loading device of claim 2, wherein, The wafer box positioning assembly (2) further comprises at least one fourth positioning block (24), which is used for positioning the side edges of the wafer box of the first specification.

4. The compatible open front wafer cassette loading device of claim 3, wherein, The fourth positioning block (24) is provided with two fourth positioning blocks (24), which are symmetrically distributed on the two sides of the center line of the supporting bottom plate (1) and are used for positioning the two side edges of the wafer box of the first specification.

5. The compatible open front wafer cassette loading device of claim 2, wherein, The wafer box positioning assembly (2) further comprises at least one fifth positioning block (25), which is used for positioning the side edges of the wafer box of the second specification.

6. The compatible open front wafer cassette loading device of claim 5, wherein, The fifth positioning block (25) is provided with two fifth positioning blocks (25), which are symmetrically distributed on the two sides of the center line of the supporting bottom plate (1) and are used for positioning the two side edges of the wafer box of the second specification.

7. The compatible open front wafer cassette loading device of claim 1, wherein, The wafer box in position detection assembly (3) further comprises a third in position sensor (33) located at a position where the side edges of the wafer box of the first specification and the wafer box of the second specification overlap when placed in position, for detecting whether the side edge of the wafer box of the first specification or the side edge of the wafer box of the second specification is in position.

8. The compatible open front wafer cassette loading device of claim 1, wherein, The in position sensor comprises a mounting bracket (311), a sensing block (312) and a proximity switch (313), wherein: The mounting bracket (311) is arranged on the lower surface of the support bottom plate (1); The first end of the sensing block (312) penetrates the support bottom plate (1), the second end of the sensing block (312) penetrates the mounting bracket (311), the middle part of the sensing block (312) is provided with a protrusion, and a compression spring (314) is arranged between the protrusion and the mounting bracket (311); The proximity switch (313) is located below the mounting bracket (311), when the first end of the sensing block (312) is pressed into the support bottom plate (1) and the second end of the sensing block (312) is close to the proximity switch (313), the proximity switch (313) sends an in position signal.

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