Circuit board assembly, middle frame assembly and electronic equipment

Abstract

The invention relates to a circuit board assembly, a middle frame assembly and electronic equipment. The circuit board assembly comprises a dielectric plate; the functional layer is arranged on the dielectric plate; the floor is arranged on the dielectric plate; and at least one supporting layer, the supporting layer comprises a plurality of supporting members, the supporting members are used for supporting a dielectric plate, and the supporting members are insulated from the floor of the circuit board assembly or the functional layer of the circuit board assembly. According to the invention, one side of the floor in the dielectric plate is provided with the supporting layer comprising the plurality of supporting members, and the supporting members can be suspended in the dielectric plate, so that the structural stability of the circuit board is improved, the assembly distribution of the circuit board is balanced, and the risk in the production process of the circuit board is reduced.

Description

Technical Field

[0001] The present disclosure relates to the technical field of circuit board structure design, and in particular to a circuit board assembly, a middle frame assembly and an electronic device. Background Art

[0002] With the rapid development of mobile communication technology, electronic devices such as mobile phones and tablet computers have become indispensable in people's daily lives. And with the gradual popularization of 5G signals, many electronic devices are designed with 5G antennas, among which, the antenna signal quality is improved by setting an antenna board on the middle frame of the electronic device.

[0003] In order to prevent the antenna board from being too close to the middle frame and generating coupling current to interfere with the antenna, the number of layers of the antenna board can be reduced. However, reducing the number of layers of the antenna board will reduce the yield rate of the antenna board. Summary of the invention

[0004] In order to overcome the problems existing in the related art, the present disclosure provides a circuit board assembly, a middle frame assembly and an electronic device.

[0005] According to a first aspect of an embodiment of the present disclosure, a circuit board assembly is provided, comprising: a dielectric board; at least one functional layer, the functional layer being arranged on the dielectric board; at least one floor layer, the floor layer being arranged on the dielectric board; and at least one supporting layer, the supporting layer comprising a plurality of supporting members, the supporting members being used to support the dielectric board, the supporting members being insulated from the floor layer of the circuit board assembly or the functional layer of the circuit board assembly.

[0006] In some embodiments, the plurality of support members are evenly distributed on the dielectric plate in a length direction of the support layer, and / or the plurality of support members are evenly distributed on the dielectric plate in a width direction of the support layer.

[0007] In some embodiments, the circuit board assembly includes at least two supporting layers; the supporting members in each supporting layer are aligned in a thickness direction of the supporting layer.

[0008] In some embodiments, the support members in two adjacent support layers are insulated.

[0009] In some embodiments, in the same supporting layer, the multiple supporting members are insulated from each other.

[0010] In some embodiments, the functional layer is disposed on a side of the floor panel away from the supporting layer.

[0011] In some embodiments, the floor panel includes a first floor panel, a second floor panel, and a third floor panel; the first floor panel, the second floor panel, and the third floor panel are stacked along a thickness direction of the circuit board assembly.

[0012] In some embodiments, the circuit board component is an antenna board.

[0013] In some embodiments, the antenna plate is used to configure an antenna; the antenna plate is arranged in parallel with the antenna radiator of the antenna, and the support layer is arranged on a side away from the antenna radiator.

[0014] In some embodiments, the functional layer and the floor include one or more of a copper layer, a silver layer, an aluminum layer, a tungsten layer, and a cobalt layer, and / or the support member includes one or more of a copper member, a silver member, an aluminum member, a tungsten member, and a cobalt member.

[0015] In some embodiments, the shape of the support member can be one or more of circular, elliptical, rectangular, and triangular.

[0016] In some embodiments, the diameter of the support member is 0.5 mm to 2 mm.

[0017] In some embodiments, the plurality of support members are spaced apart by a distance of 0.5 mm to 1 mm.

[0018] In some embodiments, the ratio of the sum of the areas of the plurality of support members in the same support layer to the area of ​​the support layer is 0.2-0.4.

[0019] In some embodiments, the functional layer and the floor panel include a conductive layer, and the support member has the same thermal expansion rate as the conductive layer.

[0020] According to a second aspect of an embodiment of the present disclosure, a middle frame assembly is provided, comprising: a middle frame body, wherein the middle frame body is provided with a mounting groove; and a circuit board assembly according to any one of the first aspects, wherein the circuit board assembly is mounted in the mounting groove.

[0021] In some embodiments, the middle frame assembly includes an antenna radiator and a battery compartment, the battery compartment includes a side wall, and a portion of the middle frame body is the antenna radiator; the mounting groove is arranged between the side wall of the battery compartment and the antenna radiator; the functional layer faces the antenna radiator, and the support layer faces the side wall of the battery compartment.

[0022] According to a third aspect of an embodiment of the present disclosure, an electronic device is provided, comprising: the middle frame assembly described in any one of the second aspects.

[0023] In some embodiments, the electronic device includes a main board, which includes a multi-layer main board circuit board; wherein the number of layers of the multi-layer main board circuit board is the same as the sum of the number of layers of the floor, the number of layers of the support layer, and the number of layers of the functional layer.

[0024] The technical solution provided by the embodiments of the present disclosure may include the following beneficial effects: the present disclosure provides a support layer including a plurality of support members on one side of the floor in the dielectric board, and enables the support members to be suspended in the dielectric board, thereby increasing the structural stability of the circuit board, balancing the component distribution of the circuit board, and reducing the risks in the circuit board production process.

[0025] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and, together with the description, serve to explain the principles of the present disclosure.

[0027] Figure 1 The figure is a schematic structural diagram of a middle frame assembly according to an exemplary embodiment.

[0028] Figure 2 FIG. 4 is a side view of a support layer and a dielectric layer of a circuit board assembly according to an exemplary embodiment.

[0029] Figure 3 is a top view of a circuit board assembly according to an exemplary embodiment.

[0030] Figure 4 is a diagram of antenna radiation efficiency according to an exemplary embodiment. DETAILED DESCRIPTION

[0031] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present disclosure. Instead, they are merely examples of devices and methods consistent with some aspects of the present disclosure as detailed in the appended claims.

[0032] In the related technology, in order to save production costs, the antenna board can be produced using the same circuit board template as the main board. However, since the main board has more layers and is thicker, the thickness of the antenna board also increases accordingly. This causes the antenna board to couple with the middle frame when it is set in the middle frame to generate an induced current, thereby affecting the radiation efficiency of the antenna.

[0033] The influence of induced current generated by coupling with the middle frame can be weakened by reducing the number of layers of the antenna board. However, the residual copper rate of the circuit board after reducing the number of layers is asymmetric, resulting in warping when the single board is pressed together. At the same time, after reducing the number of layers, the copper-free area of ​​the circuit board is relatively large, which makes it easy for bubbles to be generated during the colloid pressing of the circuit board.

[0034] In order to solve the above technical problems, according to an embodiment of the present disclosure, a circuit board assembly is provided, which includes: a dielectric board; at least one functional layer, which is arranged on the dielectric board; at least one floor layer, which is arranged on the dielectric board; and at least one supporting layer, wherein the supporting layer includes a plurality of supporting members, which are used to support the dielectric board, and the supporting members are insulated from the floor layer of the circuit board assembly or the functional layer of the circuit board assembly.

[0035] The present invention increases the structural stability of the circuit board assembly, balances the component distribution of the circuit board assembly, and reduces the risk in the production process of the circuit board assembly by disposing a support layer including multiple support members on one side of the floor of the dielectric board, and allowing the support members to be suspended in the dielectric board.

[0036] It can be understood that the circuit board assembly involved in the present disclosure can be applicable to any electronic device listed below.

[0037] It is understandable that the electronic device involved in the present disclosure may also be referred to as a terminal device, user equipment (UE), mobile station (MS), mobile terminal (MT), etc., which is a device that provides voice and / or data connectivity to users. For example, the electronic device may be a handheld device with a wireless connection function, a vehicle-mounted device, etc. At present, some examples of electronic devices are: a smart phone (Mobile Phone), a pocket computer (PPC), a PDA, a personal digital assistant (PDA), a laptop computer, a tablet computer, a wearable device, or a vehicle-mounted device, etc. In addition, when it is a vehicle-to-everything (V2X) communication system, the electronic device may also be a vehicle-mounted device. It should be understood that the embodiments of the present disclosure do not limit the specific technology and specific device form adopted by the electronic device.

[0038] Figure 1 The figure is a schematic structural diagram of a middle frame assembly according to an exemplary embodiment. Figure 2 FIG. 4 is a side view of a support layer and a dielectric layer of a circuit board assembly according to an exemplary embodiment. Figure 3is a top view of a circuit board assembly according to an exemplary embodiment.

[0039] In some embodiments, Figure 1 , Figure 2 and Figure 3 As shown, the circuit board assembly may include: a dielectric board 21 , at least one functional layer 11 , at least one floor layer 12 and at least one supporting layer 23 .

[0040] The dielectric plate 21 can provide wrapping and support for the functional layer 11, the floor 12 and the support layer 23. The dielectric plate 21 can be composed of a circuit board substrate, and illustratively, the dielectric plate 21 can be a substrate formed by a composite of epoxy resin and glass fiber cloth.

[0041] The circuit board assembly may include a ground plane 12, which may provide a good ground reference for the circuit board assembly. The ground plane 12 is mainly used to form a large-area ground plane to provide low noise, low impedance and electromagnetic shielding effects.

[0042] The floor 12 may provide a reference ground for the entire circuit board assembly, and the floor 12 may be located on one side of the functional layer 11 .

[0043] The support layer 23 may include support members 22. A plurality of support members 22 may be disposed on the dielectric plate 21 in an insulated manner, and the dielectric plate 21 may wrap the support members 22, thereby providing installation locations for the support members 22 and fixing the spatial locations of the support members 22.

[0044] The support member 22 can be formed during the production process of the circuit board assembly, and by forming the support member 22 during the production process, the structural stability of the circuit board assembly is increased, the component distribution of the circuit board assembly is balanced, and the risk during the production process of the circuit board assembly is reduced.

[0045] The circuit board assembly may include a first insulating layer 24, which may be disposed between the support member 22 and the floor 12. The first insulating layer 24 may form an insulating relationship between the support member 22 and the floor 12, thereby preventing an electrical connection between the two, so that the current in the circuit board assembly can flow normally between the components, thereby ensuring the normal operation of the circuit board assembly. In addition, the portion of the dielectric board 12 located on the floor 12 away from the functional layer 11 may be used as part of the clearance area of ​​the circuit board assembly, thereby ensuring the normal operation of the circuit board assembly.

[0046] When the circuit board assembly is produced together with other multi-layer circuit boards using the same circuit board template, the support member 22 can be provided to change the component distribution of the circuit board assembly, thereby improving the warping phenomenon caused when the single board is pressed together. At the same time, after adding the support layer 23, the component distribution of the circuit board assembly is changed, thereby improving the phenomenon of bubbles generated when the circuit board colloid is pressed together.

[0047] In some embodiments, multiple support members 22 can be evenly distributed on the dielectric plate 21 in the length direction of the floor 12. By evenly distributing multiple support members 22 on the dielectric plate 21 in the length direction of the floor 12, the supporting effect of the support members 22 can be evenly distributed in the length direction of the floor 12, thereby increasing the structural stability of the circuit board assembly and making the component distribution of the circuit board assembly more uniform.

[0048] Multiple support members 22 can also be evenly distributed on the dielectric plate 21 in the width direction of the floor 12. By evenly distributing multiple support members 22 on the dielectric plate 21 in the length direction of the floor 12, the supporting effect of the support members 22 can be made uniform in the width direction of the floor 12, thereby increasing the structural stability of the circuit board assembly and making the component distribution of the circuit board assembly more uniform.

[0049] In other embodiments, a plurality of support members 22 may be arranged in an array on a plane parallel to the floor 12, thereby increasing the structural stability of the circuit board assembly and making the components of the circuit board assembly more evenly distributed.

[0050] In some embodiments, the circuit board assembly may include at least two supporting layers 23, and the support members 22 in each supporting layer 23 may be aligned in the thickness direction of the supporting layer 23, so that the support members 22 of different supporting layers 23 are arranged in an array, thereby increasing the structural stability of the circuit board assembly and making the component distribution of the circuit board assembly more uniform.

[0051] In some embodiments, the dielectric plate 21 may be an insulating member, which may form an insulating relationship between the support member 22 and the floor 12, preventing an electrical connection between the two, so that the current in the circuit board assembly can flow normally between the components, ensuring the normal operation of the circuit board assembly. This may also prevent the support member 22 from forming an electrical connection with other conductive objects in the outside world, reducing the coupling current in the support member 22. This may also allow the portion of the dielectric plate 12 located on the floor 12 away from the functional layer 11 to be used as part of the clearance area of ​​the circuit board assembly, ensuring the normal operation of the circuit board assembly.

[0052] In some embodiments, Figure 1 and Figure 2 As shown, the dielectric plate 21 may include a plurality of dielectric layers 25. The dielectric plate 21 may be a substrate of a circuit board. Therefore, during the production process of the circuit board, the dielectric plate 21 may form a dielectric layer 25 of a layered structure between other layers of the circuit board. The circuit board assembly may include one or more supporting layers 23 between the plurality of dielectric layers 25. For example, Figure 2As shown, the support layer 23 may be 5 layers, the dielectric layer 25 sandwiched between the support layer 23 may be 4 layers, and the dielectric layer 25 disposed outside the support member 22 may be 2 layers, wherein the dielectric layer 25 disposed outside the support member 22 may be a first insulating layer 24 and a second insulating layer 26. Multiple support members 22 may be distributed in each support layer 23.

[0053] The support members 22 in two adjacent support layers 23 may be insulated from each other. For example, the support members 22 in two adjacent support layers 23 may be provided with an insulating dielectric layer 25 therebetween.

[0054] During the production process of the circuit board, the support layer 23 may be a copper layer disposed in the dielectric board 21 , and the entire copper layer is etched into a plurality of independent copper sheets, so that the copper sheets constitute the support member 22 .

[0055] And by designing the total number of the support layer 23, the functional layer 11 and the floor 12, the risk of the circuit board assembly being produced on the same board as other circuit boards can be reduced. For example, in the production process of the main board, the main board can be 9 layers, the support layer 23 of the circuit board assembly can be 5 layers, and the other layers of the circuit board assembly can be 4 layers, for a total of 9 layers. By providing the support layer 23, the component distribution of the circuit board assembly is changed, so that the warping phenomenon generated when the single board is pressed can be improved. At the same time, the component distribution of the circuit board assembly can also be changed by the support layer 23, so that the phenomenon of bubbles generated when the circuit board colloid is pressed can be improved. The circuit board assembly can be produced on the same board as the main board, reducing the production cost of the circuit board assembly.

[0056] In some embodiments, Figure 3 As shown, in the same support layer 23, multiple support members 22 are insulated from each other. By insulating the multiple support members 22 from each other, the support members 22 can be dispersed in the same support layer 23, so that the support members 22 in the same support layer 23 are distributed more evenly, thereby improving the component distribution of the circuit board assembly.

[0057] In some embodiments, Figure 2 As shown, a portion of the support members 22 between the plurality of support layers 23 may be arranged at intervals in the thickness direction of the floor panel 12 .

[0058] The present disclosure is not limited to this, and the specific distribution requirements of the support members 22 can be changed according to the requirements for the distribution of circuit board components in the production process. For example, one or more support members 22 can be arranged above a support member 22, or no other support members 22 can be arranged, and one or more support members 22 can be arranged below a support member 22, or no other support members 22 can be arranged.

[0059] In some embodiments, Figure 2 As shown, the dielectric plate 21 may include a second insulating layer 26, and the second insulating layer 26 may be disposed on the side of the support member 22 away from the circuit board. The second insulating layer 26 may form an insulating relationship between the support member 22 and other external components, prevent the two from being electrically connected, and prevent other external components from being electrically connected to the support member 22 and generating coupling current, thereby ensuring the normal operation of the circuit board assembly. In addition, this may also allow the support layer 23 and a portion of the dielectric plate 21 to be used as a portion of the clearance area of ​​the circuit board assembly, thereby ensuring the normal operation of the circuit board assembly.

[0060] In some embodiments, Figure 1 As shown, the circuit board may include a functional layer 11, and the functional layer 11 may be used to place electronic components of the circuit board assembly, and the functional layer 11 may be used to implement the component functions of the circuit board assembly. Exemplarily, the circuit board assembly may be an antenna board, and the functional layer 11 may be a circuit board used to improve the signal strength, signal quality and coverage of the antenna, and improve the signal receiving capability of the antenna.

[0061] The functional layer 11 can be disposed on the other side of the floor 12 away from the support 22, so that the functional layer 11 can be electrically connected to other external electronic components. For example, when the circuit board is an antenna board, the functional circuit board can be electrically connected to the antenna.

[0062] In some embodiments, Figure 1 and Figure 2 As shown, the floor 12 may include a first floor 121, a second floor 122 and a third floor 123, which are stacked along the thickness direction of the circuit board. By using three consecutive layers of circuit boards as the floor 12, the first floor 121, the second floor 122 and the third floor 123 can form a large-area ground plane, providing a good ground reference for the circuit board assembly, thereby providing low noise, low impedance and electromagnetic shielding effects.

[0063] Furthermore, the multi-layer floor panel 12 can also increase the number of layers of the circuit board assembly, thereby reducing the risk in the production process of the circuit board assembly and other circuit boards with multiple layers.

[0064] The present disclosure is not limited thereto, and the number of floors 12 may be changed according to design requirements. For example, the floor 12 may be one layer.

[0065] In some embodiments, the circuit board assembly can be an antenna boardlet, the circuit board assembly can be arranged in parallel with the antenna radiator, and the support layer 23 can be arranged on a side away from the antenna radiator. The antenna boardlet can improve the signal strength, signal quality and coverage of the antenna signal, effectively improve the signal receiving ability of the antenna, make the call quality of the antenna better, and thus improve the quality and experience of communication. It can improve the quality of signal reception, provide a higher data transmission rate, reduce signal attenuation, improve signal connection stability, improve communication quality, improve signal quality and coverage, reduce signal fluctuations, and improve signal communication effects.

[0066] When the circuit board assembly is subjected to coupling current generated by other external components, it will interfere with the performance of the circuit board assembly, thereby causing the radiation performance of the antenna connected to the circuit board assembly to decrease. For example, when the circuit board produced with the circuit board assembly has 8 layers, the number of circuit board layers of the circuit board assembly is 8, which increases the volume of the circuit board assembly and compresses the available clearance under a specific size of space, thereby causing the interference of the coupling current on the circuit board assembly to increase, thereby causing the radiation efficiency of the external antenna connected to the circuit board assembly to decrease.

[0067] Therefore, by providing the support layer 23, the support layer 23 can replace part of the layers of the circuit board assembly. Since the dielectric plate 21 and the support member 22 are insulated from the functional layer 11 and the floor 12 and the outside world, the support layer 23 and a part of the dielectric plate 21 can be used as a part of the clearance area of ​​the circuit board assembly, thereby equivalently expanding the clearance size of the circuit board assembly in a space of a specific size, thereby ensuring the normal operation of the circuit board assembly.

[0068] In some embodiments, the supported frequency band of the antenna board may be 1.71 GHz to 2.7 GHz. Exemplarily, the supported frequency band of the antenna board may include B1, B3, B40 and B41 frequency bands.

[0069] In some embodiments, the circuit board may include one or more layers of a copper layer, a silver layer, an aluminum layer, a tungsten layer, and a cobalt layer. The copper layer, the silver layer, the aluminum layer, the tungsten layer, and the cobalt layer have good electrical conductivity and can be used as a conductive circuit layer of the circuit board to enable electrical connection of different components disposed on the circuit board.

[0070] Exemplarily, the circuit board may include a copper layer, which has good conductivity and can be used as a conductive circuit layer of the circuit board to electrically connect different components arranged on the circuit board.

[0071] The support member 22 may include one or more of copper, silver, aluminum, tungsten, and cobalt, wherein the copper, silver, aluminum, tungsten, and cobalt members may be arranged corresponding to the copper layer, silver layer, aluminum layer, tungsten layer, and cobalt layer of the circuit board.

[0072] When a circuit board assembly is produced together with other multi-layer circuit boards using the same circuit board template, the distribution of the above-mentioned metal parts will affect the force on the circuit board during the production process. When the distribution of the above-mentioned metal parts causes uneven force on the circuit board, the circuit board will warp, resulting in the circuit board being unable to be used normally.

[0073] By providing the support member 22, the distribution position of one or more of the copper, silver, aluminum, tungsten, and cobalt parts in the circuit board assembly can be changed, thereby changing the corresponding relationship with the copper layer, silver layer, aluminum layer, tungsten layer, and cobalt layer of the circuit board. By adjusting the distribution of the support member 22, the force of the circuit board during the production process can be changed, thereby improving the warping phenomenon generated when the single board is pressed. In addition, by changing the distribution of the copper, silver, aluminum, tungsten, and cobalt parts, a large area of ​​metal-free area in the circuit board assembly can be avoided, thereby improving the phenomenon of bubbles generated when the circuit board colloid is pressed.

[0074] In some embodiments, the shape of the support member 22 can be one or more of a circle, an ellipse, a rectangle, and a triangle. Figure 3 As shown, the support member 22 may be circular, and the circular support member 22 may make the support effect of the support member 22 more uniform in all directions.

[0075] In some embodiments, the diameter of the support member 22 is 0.5 mm to 2 mm. For example, the diameter of the support member 22 may be 1 mm, which allows the support member 22 to be better evenly distributed in the support layer 23 and avoids the occurrence of large gaps.

[0076] In some embodiments, the spacing distance of the plurality of support members 22 is 0.5 mm to 1 mm. Exemplarily, the spacing distance of the plurality of support members 22 may be 0.7 mm, which can make the support members 22 more evenly distributed in the support layer 23, avoid large gaps, and increase the structural stability of the circuit board assembly.

[0077] In some embodiments, the ratio of the sum of the areas of the plurality of support members 22 in the same support layer 23 to the area of ​​the support layer 23 may be 0.2 to 0.4. Exemplarily, the ratio of the sum of the areas of the plurality of support members 22 in the same support layer 23 to the area of ​​the support layer 23 may be 0.3. This enables the support members 22 to cover a sufficient area of ​​the support layer 23, so that the support layer 23 produces a sufficient support effect, thereby increasing the structural stability of the circuit board assembly.

[0078] In some embodiments, the functional layer 11 and the floor 12 may include a conductive layer, and the support member 22 has the same thermal expansion coefficient as the conductive layer. The conductive layer and the support member 22 may both be metal. For example, the conductive layer may be a copper layer, and the support member 22 may be a copper member.

[0079] During the production process of circuit board assemblies, the circuit board assemblies will undergo multiple heat treatments. During the heat treatment process, the thermal expansion coefficients of the substrate part of the circuit board assembly and the metal part of the circuit board assembly are different, which causes the metal part to exert pressure on the substrate part. When the forces generated by the expansion of the metal part cannot offset each other, the substrate part of the circuit board assembly will be subjected to greater pressure and warp, resulting in the circuit board being unable to be used normally.

[0080] By setting the thermal expansion coefficients of the conductive layer and the support member 22 to be the same, the design difficulty of the distribution position of the support member 22 can be reduced. For example, the materials of the conductive layer and the support member 22 are set to be the same material. For example, the conductive layer can be a copper layer and the support member 22 can be a copper member.

[0081] The distribution position design of the support member 22 can make the support member 22 correspond to the conductive layer of the circuit board. Therefore, during the production process of the circuit board assembly, the forces generated by the expansion of the support member 22 and the circuit board assembly offset each other, thereby preventing the base material part of the circuit board assembly from being subjected to greater pressure and warping, reducing the risk of the circuit board assembly in the production process and improving the yield rate of the circuit board assembly production.

[0082] Based on the same concept, an embodiment of the present disclosure also provides a middle frame assembly.

[0083] It can be understood that the middle frame assembly involved in the present disclosure can be applicable to any electronic device listed below.

[0084] It is understandable that the electronic device involved in the present disclosure may also be referred to as a terminal device, user equipment (UE), mobile station (MS), mobile terminal (MT), etc., which is a device that provides voice and / or data connectivity to users. For example, the electronic device may be a handheld device with a wireless connection function, a vehicle-mounted device, etc. At present, some examples of electronic devices are: a smart phone (Mobile Phone), a pocket computer (PPC), a PDA, a personal digital assistant (PDA), a laptop computer, a tablet computer, a wearable device, or a vehicle-mounted device, etc. In addition, when it is a vehicle-to-everything (V2X) communication system, the electronic device may also be a vehicle-mounted device. It should be understood that the embodiments of the present disclosure do not limit the specific technology and specific device form adopted by the electronic device.

[0085] In some embodiments, Figure 1 As shown, the middle frame assembly may include: a middle frame body 3 and a circuit board assembly.

[0086] The middle frame body 3 may be provided with a mounting groove 31 for mounting the circuit board assembly, wherein the side surface of the circuit board assembly faces the mounting groove 31 .

[0087] The thickness of the circuit board assembly can be smaller than the length and width of the circuit board assembly, so the area of ​​the side surface of the circuit board assembly is smaller than the upper surface and the lower surface of the circuit board assembly, thereby reducing the opening area of ​​the mounting groove 31 provided in the middle frame body 3, thereby reducing the impact on the structural width of the middle frame body 3. While the circuit board assembly is provided in the frame, the impact on the structural strength of the frame is reduced, so that the middle frame body 3 can maintain strong torsional stiffness and torsional strength, can effectively resist the action of external forces, and improve the reliability of the electronic device.

[0088] In some embodiments, Figure 1 As shown, the mounting groove 31 may include a first inner wall 32 and a second inner wall 33 opposite to each other; the middle frame assembly includes an antenna radiator 41 and a battery compartment 42, the battery compartment 42 includes a side wall 43, and a portion of the middle frame body may be the antenna radiator 41;

[0089] The functional layer 11 may face the antenna radiator 41 , and the support layer 23 may face the side wall of the battery compartment 42 . For example, the functional layer 11 may abut against the first inner wall 32 , and the side of the dielectric plate 21 away from the functional layer 11 may abut against the second inner wall 33 .

[0090] By abutting the functional layer 11 against the first inner wall 32, the functional layer 11 can be electrically connected to other components through the first inner wall 32. For example, the first inner wall 32 can be provided with an antenna shrapnel, and the functional layer 11 can be electrically connected to the antenna shrapnel, thereby realizing the electrical connection relationship between the functional layer 11 and the antenna.

[0091] Furthermore, since the functional layer 11 abuts against the first inner wall 32 , the floor panel 12 can face the second inner wall 33 and keep a distance from the second inner wall 33 .

[0092] In the related art, a large number of layers of the circuit board assembly causes the floor 12 and the second inner wall 33 to be close to each other, thereby generating coupling current between the floor 12 and the second inner wall 33, thereby interfering with the normal operation of the circuit board assembly.

[0093] The present disclosure reduces the number of floor panels 12 and adds a support layer 23 so that the floor panels 12 are farther away from the second inner wall 33 , thereby reducing the coupling current generated between the floor panels 12 and the second inner wall 33 , thereby reducing the interference of the coupling current on the circuit board assembly.

[0094] Since the dielectric plate 21 is an insulating member, and the support member 22 can be arranged inside the dielectric plate 21 without forming an electrical connection with the second inner wall 33, the support layer 23 and a portion of the dielectric plate 21 can serve as a portion of the clearance between the floor 12 and the second interior, thereby ensuring the size of the clearance area of ​​the floor 12 and ensuring the normal operation of the circuit board assembly.

[0095] Furthermore, the support member 22 independently arranged on the dielectric plate 21 can produce a shielding and protective effect on the circuit board assembly, thereby further reducing the interference to the circuit board assembly and ensuring the normal operation of the circuit board assembly.

[0096] In some embodiments, Figure 1 and Figure 2 As shown, the second insulating layer 26 can be arranged on the side of the support member 22 away from the circuit board, and the second insulating layer can be arranged between the support member 22 and the second inner wall 33. The second insulating layer 26 can form an insulating relationship between the support member 22 and the second inner wall 33, prevent the support member 22 from forming an electrical connection with the second inner wall 33, avoid the second inner wall 33 from forming an electrical connection with the support member 22, avoid equivalently shortening the distance between the circuit board and the support member 22, and ensure the normal operation of the circuit board assembly. In addition, this can also make the support layer 23 and a part of the dielectric plate 21 be used as part of the clearance area of ​​the circuit board assembly, ensuring the normal operation of the circuit board assembly.

[0097] Figure 4 is a diagram of antenna radiation efficiency according to an exemplary embodiment.

[0098] Curve A is the antenna radiation efficiency of the antenna connected to the circuit board assembly in a related technical embodiment when no support member 22 is provided in the dielectric plate 21, and curve B is the antenna radiation efficiency of the antenna connected to the circuit board assembly in an exemplary embodiment when a support member 22 is provided in the dielectric plate 21.

[0099] from Figure 4 It can be seen that the provision of the support member 22 does not have a negative impact on the antenna radiation efficiency of the antenna connected to the circuit board assembly. The provision of the support member 22 can change the component distribution of the circuit board assembly when the circuit board assembly and other multi-layer circuit boards are produced using the same circuit board template, thereby improving the warping phenomenon caused by pressing the single board. At the same time, after adding the support layer 23, the component distribution of the circuit board assembly is changed, thereby improving the phenomenon of bubbles generated during the pressing of the circuit board colloid, reducing the production risk of the circuit board assembly, and improving the yield rate of the produced circuit board assembly.

[0100] Based on the same concept, an embodiment of the present disclosure also provides an electronic device.

[0101] The electronic device may be a laptop computer, a desktop computer, a mobile phone, a digital broadcast terminal, a message transceiver, a game console, a tablet device, a medical device, a fitness device, a personal digital assistant, a translator, and a wearable device such as a watch or a bracelet, and may be any electronic device with a speaker. In the following description, a mobile phone is used as an example, but the present disclosure is not limited thereto.

[0102] In some embodiments, an electronic device may include a midframe assembly.

[0103] The middle frame assembly can be a frame structure assembly. The middle frame assembly can be used to fix other components, such as screens, batteries, circuit boards, etc. At the same time, the middle frame assembly also has the function of protecting internal components.

[0104] The electronic device may further include an antenna. The antenna may be connected to the circuit board assembly of the middle frame assembly, wherein the circuit board assembly may be an antenna board.

[0105] The circuit board assembly can enhance the radiation performance of the antenna, thereby improving the communication quality of the electronic device. The circuit board assembly can improve the signal strength, signal quality and coverage of the electronic device signal, improve the signal reception capability of the electronic device, and thus improve the communication quality and experience. In addition, the circuit board assembly can also improve the signal reception quality of the antenna, provide a higher data transmission rate, improve the communication quality of the electronic device, reduce signal attenuation, improve the connection stability of the network, improve the communication quality, improve the signal quality and coverage, reduce signal fluctuations, and make the signal transmission and reception experience of the electronic device more stable.

[0106] In some embodiments, the electronic device may include a mainboard, which may include a multi-layer mainboard circuit board.

[0107] The number of layers of the multi-layer main board circuit board is the same as the sum of the number of layers of the floor 12 , the number of layers of the support layer 23 and the number of layers of the functional layer 11 .

[0108] In the production process of the PCB assembly, the PCB assembly can be produced using the same PCB template as the mainboard, thereby reducing the production cost of the PCB assembly. However, since the mainboard has more layers and a larger thickness, the number of layers and thickness of the PCB assembly also increase accordingly.

[0109] In order to avoid the excessively thick circuit board assembly and the small distance between the second inner wall 33, which would cause coupling current to be generated between the circuit board assembly and the second inner wall 33 and interfere with the normal operation of the circuit board assembly, it is necessary to reduce the thickness of the circuit board assembly by reducing the number of layers of the circuit board.

[0110] However, when the number of circuit board layers of the circuit board assembly is too small, the residual copper rate of the circuit board assembly will be asymmetric, which will cause warping when the single board is pressed together, thereby reducing the yield rate of the circuit board assembly.

[0111] Furthermore, when the number of circuit board layers of the circuit board assembly is too small, the copper-free area of ​​the circuit board assembly will be relatively large, which in turn will easily cause bubbles to be generated during the colloid pressing of the circuit board, thereby reducing the yield rate of the circuit board assembly.

[0112] Therefore, by setting a supporting layer 23 in the insulating dielectric board 21, and configuring the sum of the number of layers of the functional layer 11, the number of layers of the floor 12 and the number of layers of the supporting layer 23 to be the same as the number of layers of the main board circuit board, the residual copper rate and the copper-free area of ​​the circuit board assembly can be improved while reducing the number of circuit board layers, thereby reducing the risk of co-production of the circuit board assembly and the main board and improving the yield rate of the circuit board assembly. For example, in the production process of the main board, the main board can be 9 layers, the supporting layer 23 of the circuit board assembly can be 5 layers, and the circuit board of the circuit board assembly can be 4 layers, totaling 9 layers.

[0113] The embodiment of the present disclosure is provided with a support layer 23, thereby avoiding the warping of the circuit board assembly and the generation of bubbles caused by too few layers of the circuit board assembly, improving the yield rate of the circuit board assembly, allowing the circuit board assembly to be produced on the same board as the main board, and reducing the production cost of the circuit board assembly.

[0114] It is to be understood that in the present disclosure, "plurality" refers to two or more than two, and other quantifiers are similar. "And / or" describes the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. The character " / " generally indicates that the associated objects before and after are in an "or" relationship. The singular forms "a", "the" and "the" are also intended to include plural forms, unless the context clearly indicates other meanings.

[0115] It is further understood that the terms "second", "secondary", etc. are used to describe various information, but such information should not be limited to these terms. These terms are only used to distinguish information of the same type from each other and do not indicate a specific order or degree of importance. In fact, the expressions "secondary", "secondary", etc. can be used interchangeably. For example, without departing from the scope of the present disclosure, the second information may also be referred to as the second information, and similarly, the second information may also be referred to as the second information.

[0116] It will be further understood that the terms “center”, “longitudinal”, “lateral”, “front”, “back”, “up”, “down”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inside”, “outside”, etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing the present embodiment and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation.

[0117] It can be further understood that, unless otherwise specified, “connection” includes a direct connection without other components between the two, and also includes an indirect connection with other components between the two.

[0118] It is further understood that, although the operations are described in a specific order in the drawings in the embodiments of the present disclosure, it should not be understood as requiring the operations to be performed in the specific order shown or in a serial order, or requiring the execution of all the operations shown to obtain the desired results. In certain environments, multitasking and parallel processing may be advantageous.

[0119] Those skilled in the art will readily appreciate other embodiments of the present disclosure after considering the specification and practicing the invention disclosed herein. This application is intended to cover any modification, use or adaptation of the present disclosure, which follows the general principles of the present disclosure and includes common knowledge or customary techniques in the art that are not disclosed in the present disclosure. The specification and examples are intended to be exemplary only, and the true scope and spirit of the present disclosure are indicated by the following scope of rights.

[0120] It should be understood that the present disclosure is not limited to the precise structures that have been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the scope of the appended claims.

Claims

1. A circuit board assembly, characterized in that: The circuit board assembly comprises: Dielectric plate; At least one functional layer, wherein the functional layer is disposed on the dielectric plate; at least one floor, the floor being disposed on the medium board; and At least one supporting layer, wherein the supporting layer comprises a plurality of supporting members, wherein the supporting members are used to support the dielectric board, and the supporting members are insulated from the floor of the circuit board assembly or the functional layer of the circuit board assembly.

2. The circuit board assembly according to claim 1, characterized in that: The plurality of support members are evenly distributed on the dielectric plate in the length direction of the support layer, and / or The plurality of support members are evenly distributed on the dielectric plate in a width direction of the support layer.

3. The circuit board assembly according to claim 1, characterized in that: The circuit board assembly comprises at least two layers of the support layer; The support members in each of the support layers are aligned in the thickness direction of the support layer.

4. The circuit board assembly according to claim 3, characterized in that: The support members in two adjacent support layers are insulated.

5. The circuit board assembly according to claim 3, characterized in that: In the same supporting layer, the multiple supporting members are insulated from each other.

6. The circuit board assembly according to claim 1, characterized in that: The functional layer is arranged on a side of the floor away from the supporting layer.

7. The circuit board assembly according to claim 1, characterized in that: The floor comprises a first floor, a second floor and a third floor; The first floor panel, the second floor panel, and the third floor panel are stacked in a thickness direction of the circuit board assembly.

8. The circuit board assembly according to claim 1, wherein: The circuit board component is an antenna board.

9. The circuit board assembly according to claim 8, characterized in that: The antenna board is used to configure the antenna; The antenna plate is arranged in parallel with the antenna radiator of the antenna, and the support layer is arranged on a side away from the antenna radiator.

10. The circuit board assembly according to claim 1, characterized in that: The functional layer and the floor include one or more layers of a copper layer, a silver layer, an aluminum layer, a tungsten layer, a cobalt layer, and / or The support member includes one or more of a copper member, a silver member, an aluminum member, a tungsten member, and a cobalt member.

11. The circuit board assembly according to claim 1, wherein: The shape of the support member is one or more of circular, elliptical, rectangular and triangular.

12. The circuit board assembly according to claim 1, wherein: The diameter of the support member is 0.5 mm to 2 mm.

13. The circuit board assembly according to claim 1, wherein: The spacing distance between the plurality of support members is 0.5 mm to 1 mm.

14. The circuit board assembly according to claim 1, wherein: The ratio of the sum of the areas of the plurality of support members in the same support layer to the area of ​​the support layer is 0.2 to 0.

4.

15. The circuit board assembly according to claim 1, wherein: The functional layer and the floor panel include a conductive layer, and the support member has the same thermal expansion rate as the conductive layer.

16. A middle frame assembly, characterized in that: include: A middle frame body, wherein the middle frame body is provided with a mounting groove; The circuit board assembly according to any one of claims 1 to 12, wherein the circuit board assembly is installed in the installation groove.

17. The middle frame assembly according to claim 16, characterized in that: The middle frame assembly includes an antenna radiator and a battery compartment, the battery compartment includes a side wall, and a portion of the middle frame body is the antenna radiator; The mounting groove is arranged between the side wall of the battery compartment and the antenna radiator; The functional layer faces the antenna radiator, and the supporting layer faces the side wall of the battery compartment.

18. An electronic device, characterized in that: include: A middle frame assembly as claimed in any one of claims 16 to 17.

19. The electronic device according to claim 18, characterized in that: The electronic device comprises a mainboard, and the mainboard comprises a multi-layer mainboard circuit board; The number of layers of the multi-layer main board circuit board is the same as the sum of the number of layers of the floor, the number of layers of the support layer and the number of layers of the functional layer.

Images