Display panel and display device

Abstract

The embodiment of the invention discloses a display panel and a display device. The display panel comprises a display area; the display panel further comprises a substrate, a conductive structure and a first packaging area. The conductive structure and the first packaging area are arranged on the same side of the substrate and surround the display area. The orthographic projection of the conductive structure on the substrate and the orthographic projection of the first packaging area on the substrate are at least partially overlapped to form an overlapping part, and the overlapping part surrounds the display area. According to the technical scheme of the invention, the side etching of the conductive structure does not form a continuous gap extending from the outside of the first packaging area to the inside of the first packaging area, and does not form a water and oxygen invasion path extending from the outside of the first packaging area to the inside of the first packaging area, so that water and oxygen are difficult to enter the display area through the conductive structure, the service life of the display panel is prolonged, and the display efficiency is improved. And the reliability of the display panel is ensured.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a display panel and a display device. Background Art

[0002] With the development of display technology, higher requirements are placed on the service life of display panels.

[0003] The display panel in the prior art has the problem of short service life. Summary of the invention

[0004] The present invention provides a display panel and a display device to extend the service life of the display panel.

[0005] According to one aspect of the present invention, a display panel is provided, comprising: a display area; the display panel also comprises a substrate, a conductive structure and a first packaging area, the conductive structure and the first packaging area are arranged on the same side of the substrate and surround the display area; the orthographic projection of the conductive structure on the substrate and the orthographic projection of the first packaging area on the substrate at least partially overlap to form an overlapping portion, and the overlapping portion surrounds the display area.

[0006] Optionally, the first encapsulation area includes a dam and a groove, the dam is arranged on one side of the substrate and surrounds the display area, and the groove is located on a side of the dam close to the display area and / or away from the display area;

[0007] The orthographic projection of the conductive structure on the substrate at least partially covers the orthographic projection of the bank and the groove on the substrate;

[0008] Optionally, the orthographic projection of the conductive structure on the substrate completely covers the orthographic projection of the dam and the groove on the substrate;

[0009] Optionally, in the first packaging region, the conductive structure is located on a side of the dam away from the substrate and in the groove.

[0010] Optionally, the display panel further includes a pixel circuit and a power line, and the power line is electrically connected to the pixel circuit;

[0011] Optionally, the conductive structure includes a first conductive structure, the power line includes a first power line, and the first conductive structure is electrically connected to the first power line; the pixel circuit includes a driving module, and the driving current generated by the driving module is related to a first power voltage transmitted by the first power line;

[0012] Optionally, the conductive structure includes a second conductive structure, the power line includes a second power line, and the second conductive structure is electrically connected to the second power line; the pixel circuit includes an initialization module, the initialization module is used to initialize the control end of the driving module or the light-emitting device, and the second power line is used to transmit the initialization voltage.

[0013] Optionally, the conductive structure is electrically connected to the power line from at least two sides of the display area;

[0014] Optionally, at least one conductive structure is electrically connected to the power line from opposite sides of the display area;

[0015] Optionally, at least one conductive structure is electrically connected to the power line from both sides of the display area in the first direction and both sides of the display area in the second direction, respectively, and the first direction intersects the second direction;

[0016] Optionally, the first direction is perpendicular to the second direction.

[0017] Optionally, the conductive structure is located in at least one conductive layer; the display panel further comprises a plurality of light emitting devices located in a display area, and in the display area, the conductive layer is located between the light emitting devices and the substrate;

[0018] Optionally, conductive structures in different conductive layers are used to transmit different signals.

[0019] Optionally, the display panel further includes a plurality of light-emitting devices located in the display area, the light-emitting devices including a first electrode, a light-emitting layer, and a second electrode that are stacked; the conductive structure includes a third conductive structure, and the third conductive structure is electrically connected to the second electrodes of at least some of the light-emitting devices;

[0020] Optionally, the second electrodes of at least some of the light-emitting devices are electrically connected to each other, and the third conductive structure is electrically connected to the second electrodes from at least two sides of the display area.

[0021] Optionally, the display panel further includes an isolation structure located in the display area, the isolation structure encloses an isolation opening, and the light-emitting layer is located in the isolation opening; the isolation structure overlaps the second electrode of at least part of the light-emitting device; and the third conductive structure is electrically connected to the second electrode of at least part of the light-emitting device through the isolation structure;

[0022] Optionally, the isolation structure is arranged in a mesh;

[0023] Optionally, the third conductive structure and the isolation structure are arranged in the same layer;

[0024] Optionally, the third conductive structure and the isolation structure are an integrated structure.

[0025] Optionally, the display panel further includes a pixel defining layer, the pixel defining layer is located between the substrate and the isolation structure, the pixel defining layer includes a plurality of pixel openings, and the first electrode is at least partially exposed to the pixel openings;

[0026] The orthographic projection of the isolation structure on the pixel defining layer is located between adjacent pixel openings;

[0027] The isolation structure includes a support portion and a partition portion, the support portion is located between the partition portion and the pixel defining layer; the orthographic projection of the partition portion on the pixel defining layer covers the orthographic projection of the support portion on the pixel defining layer; the second electrode of the light-emitting device on at least one side of the isolation structure overlaps the isolation structure;

[0028] Optionally, the second electrode of the light-emitting device on at least one side of the isolation structure overlaps with the support portion of the isolation structure;

[0029] Optionally, in the direction of the isolation openings on both sides of the isolation structure, at the position where the support portion and the partition portion meet, the size of the support portion is smaller than the size of the partition portion;

[0030] Optionally, the isolation structure further includes an auxiliary support portion, the auxiliary support portion is located between the support portion and the pixel defining layer, and the orthographic projection of the support portion on the substrate is located within the orthographic projection of the auxiliary support portion on the substrate;

[0031] Optionally, the second electrode of the light-emitting device on at least one side of the isolation structure overlaps with the auxiliary support portion;

[0032] Optionally, the pixel defining layer extends from the display area to the first packaging area; the conductive structure further includes a first conductive structure and / or a second conductive structure, the pixel defining layer covers the first conductive structure and / or the second conductive structure, and contacts the first conductive structure and / or the second conductive structure; the first conductive structure is electrically connected to the first power line, and the second conductive structure is electrically connected to the second power line;

[0033] Optionally, the thickness of the pixel defining layer in the first encapsulation area is less than or equal to the thickness of the pixel defining layer in the display area;

[0034] Optionally, the thickness of the pixel defining layer in the first encapsulation area is less than the thickness of the pixel defining layer in the display area.

[0035] Optionally, the display panel further includes a second encapsulation region and an encapsulation layer, and in the second encapsulation region, the encapsulation layer includes a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer that are stacked;

[0036] In at least a portion of the first encapsulation region, the encapsulation layer includes a second inorganic encapsulation layer, and the second inorganic encapsulation layer covers the third conductive structure;

[0037] Optionally, the second packaging area includes a display area.

[0038] Optionally, the second electrodes of the light-emitting device are electrically connected to each other to form a whole-surface structure; the second electrode extends to the non-display area and is electrically connected to the third conductive structure; the non-display area includes the first packaging area;

[0039] Optionally, the third conductive structure is located in a conductive layer in the display panel, and in the display area, the conductive layer where the third conductive structure is located is located between the light-emitting device and the substrate.

[0040] Optionally, the display panel further includes an insulating layer, the insulating layer covers the conductive structure; the insulating layer is an inorganic layer;

[0041] Optionally, on a side of the dam away from the substrate, a first organic part is further included, and the first organic part is on a side of the encapsulation layer in the display panel close to the substrate;

[0042] Optionally, the first organic part is located in the first organic layer, and the first organic layer further includes a second organic part located in the display area, the second organic part is in contact with the first electrode of the light-emitting device in the display area, and is located on a side of the first electrode close to the substrate;

[0043] Optionally, the dam includes a third organic portion, the third organic portion is located in the second organic layer, and the second organic layer is located on a side of the first organic layer close to the substrate.

[0044] Optionally, the conductive structure includes a first boundary and a second boundary, and the first boundary is located on a side of the second boundary close to the display area; the first packaging area includes a third boundary and a fourth boundary, and the third boundary is located on a side of the fourth boundary close to the display area;

[0045] A distance from a second boundary of the at least one conductive structure to the display area is greater than or equal to a distance from a fourth boundary to the display area.

[0046] Optionally, at least two conductive structures are arranged in the same layer, and among the conductive structures arranged in the same layer, the distance from the second boundary of the conductive structure farthest from the display area to the display area is greater than or equal to the distance from the fourth boundary to the display area;

[0047] Optionally, among the conductive structures arranged in the same layer, the distance from the first boundary of the conductive structure closest to the display area to the display area is less than or equal to the distance from the third boundary to the display area;

[0048] Alternatively, the conductive structures are arranged in different layers, and the distance from the second boundary of each conductive structure to the display area is greater than or equal to the distance from the fourth boundary to the display area;

[0049] Optionally, the distance from the first boundary of each conductive structure to the display area is less than or equal to the distance from the third boundary to the display area.

[0050] Optionally, the display panel further comprises at least one connecting portion, the connecting portion being connected to a power source and being electrically connected to a corresponding conductive structure, and an orthographic projection of the connecting portion on the substrate being at least partially located on a side of the correspondingly connected conductive structure away from the display area;

[0051] Optionally, each connecting portion is arranged in the same layer as one of the conductive structures;

[0052] Optionally, the conductive structure and at least one connecting portion disposed on the same layer are an integrated structure;

[0053] Optionally, the conductive structure is electrically connected to at least one connecting portion provided at a different layer through a via.

[0054] Optionally, each conductive structure is electrically connected to at least one connecting portion, and a width of the conductive structure between two connecting portions electrically connected to at least one conductive structure is greater than a width of the conductive structure at other positions.

[0055] According to another aspect of the present invention, a display panel is provided, comprising a display area; the display panel also comprises a conductive structure and a peripheral packaging portion, the conductive structure and the peripheral packaging portion are arranged on the same side of a substrate and surround the display area; the conductive structure comprises a first boundary and a second boundary, the first boundary is located on a side of the second boundary close to the display area, the peripheral packaging portion comprises a third boundary and a fourth boundary, the third boundary is located on a side of the fourth boundary close to the display area; the second boundary is located on a side of the third boundary away from the display area, and the first boundary is located on a side of the fourth boundary close to the display area.

[0056] Optionally, the conductive structure includes at least one of a first conductive structure, a second conductive structure and a third conductive structure; the display panel also includes a plurality of light-emitting devices, the light-emitting devices include a first electrode, a light-emitting layer and a second electrode which are stacked; the first conductive structure is electrically connected to a first power line; the second conductive structure is electrically connected to a second power line, the second power line is electrically connected to an initialization module in a pixel circuit, and the initialization module is used to initialize a control end of a driving module of the pixel circuit or a light-emitting device; the third conductive structure is electrically connected to the second electrode of at least some of the light-emitting devices in the display panel.

[0057] Optionally, the display panel further includes an isolation structure located in the display area, the isolation structure encloses an isolation opening, and the light-emitting layer is located in the isolation opening; the isolation structure overlaps the second electrode of at least part of the light-emitting device; and the third conductive structure is electrically connected to the second electrode of at least part of the light-emitting device through the isolation structure;

[0058] Optionally, the isolation structure is arranged in a mesh;

[0059] Optionally, the third conductive structure and the isolation structure are arranged in the same layer;

[0060] Optionally, the third conductive structure and the isolation structure are an integrated structure.

[0061] Optionally, a distance from a second boundary of at least one conductive structure to the display area is greater than or equal to a distance from a fourth boundary to the display area.

[0062] According to another aspect of the present invention, a display device is provided, comprising the display panel according to any embodiment of the present invention.

[0063] It should be understood that the contents described in this section are not intended to identify the key or important features of the embodiments of the present invention, nor are they intended to limit the scope of the present invention. Other features of the present invention will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0064] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0065] Figure 1 is a top view of a display panel provided by an embodiment of the present invention;

[0066] Figure 2 is a cross-sectional view of a display panel provided by an embodiment of the present invention;

[0067] Figure 3 is a cross-sectional view of another display panel provided by an embodiment of the present invention;

[0068] Figure 4 It is a schematic diagram of a gap formed between an insulating layer and a conductive structure at a side engraving position in the related art;

[0069] Figure 5 is a cross-sectional view of another display panel provided by an embodiment of the present invention;

[0070] Figure 6 is a top view of another display panel provided by an embodiment of the present invention;

[0071] Figure 7 is a top view of another display panel provided by an embodiment of the present invention;

[0072] Figure 8 is a top view of another display panel provided by an embodiment of the present invention;

[0073] Fig. 9 is a top view of a display panel provided by an embodiment of the present invention;

[0074] Fig.10 It is a structural schematic diagram of a pixel circuit in the related art;

[0075] Fig.11 is a cross-sectional view of another display panel provided by an embodiment of the present invention;

[0076] Fig.12 is an enlarged view of an isolation structure provided by an embodiment of the present invention;

[0077] Fig.13 is an enlarged view of another isolation structure provided by an embodiment of the present invention,

[0078] Fig.14 is a cross-sectional view of another display panel provided by an embodiment of the present invention;

[0079] Fig.15 is a top view of another display panel provided by an embodiment of the present invention;

[0080] Fig.16 is a top view of another display panel provided by an embodiment of the present invention;

[0081] Fig.17 is a top view of another display panel provided by an embodiment of the present invention;

[0082] Fig.18 It is a structural schematic diagram of a display device provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0083] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0084] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0085] As described in the background technology, the display panel of the prior art has the problem of short service life. The inventors have found that the reason for the above problem is that in the prior display panel, some conductive layers have side engravings. When the side engravings of the conductive layers extend from the outside of the packaging area of ​​the display panel to the packaging area, it will create an invasion path for water and oxygen, thereby reducing the service life of the display panel.

[0086] Based on the above reasons, an embodiment of the present invention provides a display panel. Figure 1 is a top view of a display panel provided by an embodiment of the present invention, Figure 2 is a cross-sectional view of a display panel provided by an embodiment of the present invention, Figure 3 is a cross-sectional view of another display panel provided by an embodiment of the present invention, Figure 2 and Figure 3 Can correspond Figure 1 Obtained by cutting along BB'. Figure 1-Figure 3 The display panel includes: a display area AA; the display panel also includes a substrate 110, a conductive structure 130 and a first packaging area FA, the conductive structure 130 and the first packaging area FA are arranged on the same side of the substrate 110 and surround the display area AA; the orthographic projection of the conductive structure 130 on the substrate 110 and the orthographic projection of the first packaging area FA on the substrate 110 at least partially overlap to form an overlapping portion, and the overlapping portion surrounds the display area AA.

[0087] The display panel includes a display area AA and a non-display area NAA, and the non-display area NAA includes a first encapsulation area FA. A light-emitting device is arranged in the display area AA, and when the light-emitting device emits light, the display panel can be displayed. The first encapsulation area FA surrounds the display area AA, and an encapsulation layer is arranged in the first encapsulation area FA, so that the display panel can be encapsulated at the periphery of the display area AA.

[0088] Among them, the conductive structure 130 can be used for signal transmission. Optionally, the conductive structure 130 can be used to transmit signals from the non-display area NAA to the display area AA. In some optional embodiments, the conductive structure 130 can be in the same layer and prepared at the same time as the component structure of the pixel circuit in the display area AA, the component structure of the light-emitting device, or the signal line.

[0089] An insulating layer 140 is disposed on the side of the conductive structure 130 away from the substrate 110. Optionally, at least one insulating layer 140 is disposed on the side of each conductive structure 130 away from the substrate 110. On the one hand, the insulation between the conductive structure 130 and other conductive structures 130 is ensured. On the other hand, since the insulating layer 140 covers the conductive structure 130 at least in the first encapsulation area FA, a partial encapsulation effect can be achieved. In an optional embodiment of the present invention, at least one insulating layer 140 is an inorganic insulating layer; in another optional embodiment of the present invention, at least one insulating layer 140 is an organic insulating layer. In other optional embodiments of the present invention, the insulating layer 140 may include an organic insulating layer and an inorganic insulating layer. Among them, Figure 2 Schematically shows a case where the display panel includes a conductive structure 130, Figure 3 The schematic diagram shows a case where the display panel includes two layers of conductive structures 130 .

[0090] During the manufacturing process of the display panel, some side engraving will inevitably occur at the edge of the conductive structure 130 ; or during the patterning process of the conductive structure 130 itself, some side engraving may also be formed at the edge of the conductive structure 130 in the first packaging area FA. Figure 4 is a schematic diagram of a gap formed between an insulating layer and a conductive structure at a side engraving position in the related art, referring to Figure 4 There may be gaps 20 between the insulating layer 140 on the conductive structure 130 and the conductive structure 130 at the side engraving position, and some gaps 20 may extend from outside the first packaging area to the first packaging area, forming an invasion path for water and oxygen.

[0091] In this embodiment, the orthographic projection of the conductive structure 130 on the substrate 110 and the orthographic projection of the first encapsulation area FA on the substrate 110 at least partially overlap to form an overlapping portion, and the overlapping portion surrounds the display area AA. Therefore, the portion of the conductive structure 130 located in the first encapsulation area FA is a continuous ring structure, that is, the conductive structure 130 will not have a breakpoint in the first encapsulation area FA, and accordingly, even if there is a side engraving on the edge of the conductive structure 130, the edge with the side engraving will not extend from the outside of the first encapsulation area FA to the inside of the first encapsulation area FA, so the side engraving of the conductive structure 130 will not form a continuous gap extending from the outside of the first encapsulation area FA to the inside of the first encapsulation area FA, and accordingly, no water and oxygen intrusion path extending from the outside of the first encapsulation area FA to the inside of the first encapsulation area FA will be formed, so that it is difficult for water and oxygen to enter the display area AA through the conductive structure, thereby improving the service life of the display panel and ensuring the reliability of the display panel.

[0092] Optionally, the first encapsulation area FA includes a dam 120 and a groove 150, the dam 120 is arranged on one side of the substrate 110 and is arranged around the display area AA, and the groove 150 is located on a side of the dam 120 close to the display area AA and / or away from the display area AA; the orthographic projection of the conductive structure 130 on the substrate 110 at least partially covers the orthographic projection of the dam 120 and the groove 150 on the substrate 110.

[0093] At least one dam 120 is provided in the first encapsulation area FA. The dam 120 is a ring-shaped structure and is provided around the display area AA. A groove 150 is formed on the side of the dam 120 close to the display area AA, or a groove 150 is formed on the side of the dam 120 away from the display area AA. The groove 150 can be obtained by patterning and removing at least part of the film structure on at least one side of the dam 120 (the side of the dam 120 close to the display area AA and / or the side of the dam 120 away from the display area AA) during the preparation of the display panel. The groove 150 and the dam 120 form a concave-convex structure, which can extend the water and oxygen intrusion path.

[0094] In this embodiment, the orthographic projection of the conductive structure 130 on the substrate 110 at least partially covers the orthographic projection of the dam 120 and the groove 150 on the substrate 110, including two cases, one of which is that the orthographic projection of the conductive structure 130 on the substrate 110 covers the orthographic projection of part of the dam 120 and / or part of the groove 150 on the substrate 110; the other case is that the orthographic projection of the conductive structure 130 on the substrate 110 completely covers the orthographic projection of the dam 120 and the groove 150 on the substrate 110, that is, the orthographic projection of the conductive structure 130 on the substrate 110 covers the orthographic projection of the surface of the dam 120 on the substrate 110, and covers the orthographic projection of the bottom of the groove 150 and the sidewall of the groove 150 on the substrate 110. Among them, Figure 1 Schematically shows a situation where the orthographic projection of the conductive structure 130 on the substrate 110 completely covers the orthographic projection of the dam 120 and the groove 150 on the substrate 110. In this case, the overlapping portion is also the projection of the first encapsulation area FA on the substrate 110. The surface of the dam 120 includes the top surface of the dam 120 and the side surface of the dam 120. The two opposite side surfaces of the dam 120 are connected through the top surface of the dam 120; the side surface of the dam 120 serves as one of the side walls of the groove 150.

[0095] As described above, during the formation of the dam 120, at least part of the film layer structure in a part of the first packaging area FA needs to be patterned to form the groove 150. During the formation of the groove 150 or after the formation of the groove 150, some film layer structures on the conductive layer where the conductive structure 130 is located are patterned to remove part of the film layer structure at the location of the groove 150. If the conductive structure 130 is discontinuous in the first packaging area FA, then in the first packaging area FA, there will inevitably be certain side engravings at the edge of the conductive structure 130.

[0096] In the present embodiment, the conductive structure 130 and the dam 120 are arranged on the same side of the substrate 110, and the orthographic projection of the conductive structure 130 on the substrate 110 covers the orthographic projections of the dam 120 and the groove 150 on the substrate 110, that is, the conductive structure 130 in the first packaging area FA is a continuous annular structure, and there is no breakpoint in the conductive structure 130 in the first packaging area FA, so that there is no edge of the conductive structure 130 in the first packaging area FA. Accordingly, the first packaging area avoids the gap 20 caused by the side engraving of the conductive structure 30 extending from outside the first packaging area FA to inside the first packaging area FA, so there is no invasion path extending from outside the first packaging area FA to the first packaging area FA, making it difficult for water and oxygen to enter the display area AA through the conductive structure, thereby improving the service life of the display panel and ensuring the reliability of the display panel.

[0097] In some optional embodiments of the present invention, the distance between the orthographic projection of the conductive structure 130 on the substrate 110 and the third boundary FA1 of the first packaging area FA is greater than 0, and the distance between the orthographic projection of the conductive structure 130 on the substrate 110 and the fourth boundary FA2 of the first packaging area FA is greater than 0. In this way, it can be ensured that the orthographic projection of the conductive structure 130 on the substrate 110 completely covers the orthographic projections of the dam 120 and the groove 150 on the substrate 110, and it is ensured that the conductive structure 130 in the first packaging area FA does not form a continuous gap extending from the outside of the packaging area to the inside of the packaging area, and further does not form a water and oxygen intrusion path extending from the outside of the first packaging area FA to the first packaging area FA. In another optional embodiment of the present invention, the distance between the orthographic projection of the conductive structure 130 on the substrate 110 and the inner boundary of the first packaging area FA is equal to 0, or the distance between the orthographic projection of the conductive structure 130 on the substrate 110 and the outer boundary of the first packaging area FA is equal to 0.

[0098] The boundary of the first encapsulation area FA close to the display area AA is the third boundary FA1 of the first encapsulation area FA, and the boundary of the first encapsulation area FA away from the display area AA is the fourth boundary FA2 of the first encapsulation area FA. The first encapsulation area FA is provided with dams 120 and grooves 150. When the structure closest to the display area AA among the dams 120 and grooves 150 of the first encapsulation area FA is the groove 150, the boundary of the groove 150 closest to the display area AA in the first encapsulation area FA is the third boundary FA1 of the first encapsulation area FA, wherein the boundary of the groove 150 closest to the display area AA may be on the side wall of the groove 150. When the structure closest to the display area AA among the dams 120 and grooves 150 of the first encapsulation area FA is the dam 120, the boundary of the dam 120 closest to the display area AA in the first encapsulation area FA is the third boundary FA1 of the first encapsulation area FA, wherein the boundary of the dam 120 closest to the display area AA may be on the side of the dam 120. In the case where the structure farthest from the display area AA among the dams 120 and the grooves 150 of the first encapsulation area FA is the groove 150, the boundary farthest from the display area AA among the grooves 150 farthest from the display area AA in the first encapsulation area FA is the fourth boundary FA2 of the first encapsulation area FA, wherein the boundary farthest from the display area AA among the grooves 150 may be on the side wall of the groove 150. In the case where the structure farthest from the display area AA among the dams 120 and the grooves 150 of the first encapsulation area FA is the dam 120, the boundary farthest from the display area AA among the dams 120 farthest from the display area AA in the first encapsulation area FA is the fourth boundary FA2 of the first encapsulation area FA, wherein the boundary farthest from the display area AA among the dams 120 may be on the side of the dam 120.

[0099] In the display panel of this embodiment, a dam and a groove are arranged in the first packaging area, and the dam is arranged on one side of the substrate and is arranged around the display area; the conductive structure and the dam are arranged on the same side of the substrate, and the orthographic projection of the conductive structure on the substrate covers the orthographic projection of the dam and the groove on the substrate. That is, the conductive structure in the first packaging area is a continuous ring structure, and there is no breakpoint in the conductive structure in the first packaging area, so that there is no edge of the conductive structure in the first packaging area. Accordingly, the gap 20 caused by the side engraving of the conductive structure 30 is avoided from extending from the outside of the packaging area to the inside of the packaging area, so there is no invasion path extending from the outside of the first packaging area to the first packaging area, making it difficult for water and oxygen to enter the display area through the conductive structure in the first packaging area, thereby improving the service life of the display panel and ensuring the reliability of the display panel.

[0100] Continue to refer Figure 1-Figure 3 Optionally, in the first encapsulation area FA, the conductive structure 130 is located on a side of the dam 120 away from the substrate 110 and in the groove 150 .

[0101] Specifically, the display panel includes multiple conductive layers, the first conductive layer is formed before the dam 120 and the groove 150 are formed, and the position is relatively low; the second conductive layer is formed after the dam 120 and the groove 150 are formed, and the position is relatively high. In this embodiment, the conductive structure 130 is a ring corresponding to the dam 120 and the groove 150, ensuring that the orthographic projection of the conductive structure 130 on the substrate 110 can form a ring-shaped overlapping portion with the orthographic projection of the first packaging area F1 on the substrate 110, ensuring that the conductive structure 130 has no breakpoints in the first packaging area FA, and further ensuring that there is no water and oxygen intrusion path from the outside of the first packaging area FA to the inside of the first packaging area FA, thereby extending the service life of the display panel. In the first packaging area FA, the conductive structure 130 is located on the side of the dam 120 away from the substrate 110 and in the groove 150. Accordingly, the conductive structure 130 is formed after the dam 120 and the groove 150 are formed. In this way, when some film layer structures are patterned and removed during the formation of the groove 150 , the conductive structure 130 will not be over-etched, thereby ensuring the continuity and thickness uniformity of the conductive structure 130 . Figure 5 is a cross-sectional view of another display panel provided by an embodiment of the present invention, Figure 5 Can correspond Figure 1 Cut along BB', reference Figure 5 In another optional embodiment of the present invention, in the first encapsulation area FA, the conductive structure 130 is located on a side of the dam 120 close to the substrate 110 and in the groove 150 .

[0102] It should be noted that Figure 1 Schematically shows a situation where the orthographic projection of the conductive structure 130 on the substrate 110 completely covers the orthographic projection of the first encapsulation area FA on the substrate 110, Figure 6is a top view of another display panel provided by an embodiment of the present invention, Figure 7 is a top view of another display panel provided by an embodiment of the present invention, Figure 8 is a top view of another display panel provided by an embodiment of the present invention, referring to Figure 6-Figure 8 , the orthographic projection of the conductive structure 130 on the substrate 110 partially overlaps with the orthographic projection of the first encapsulation area FA on the substrate 110 .

[0103] Fig. 9 is a top view of a display panel provided by an embodiment of the present invention, Fig.10 This is a schematic diagram of a pixel circuit structure in the related art, refer to Fig. 9 and Fig.10 Optionally, the display panel further includes a pixel circuit and a power line L0, the power line L0 is electrically connected to the pixel circuit; and at least one conductive structure 130 is electrically connected to the power line L0.

[0104] Specifically, the power line L0 may be at least partially located in the display area AA to transmit a power signal to the pixel circuit in the display area AA. In this embodiment, at least one conductive structure 130 is electrically connected to the power line L0, and the orthographic projection of the conductive structure 130 on the substrate 110 covers the dam 120 and the groove 150. The conductive structure 130 forms a ring structure, so that the conductive structure 130 itself has a large area, thereby making the resistance of the conductive structure 130 small, and the voltage drop loss of the conductive structure 130 transmitting the power signal to the power line L0 is small. In addition, as described in the above embodiment, the orthographic projection of the conductive structure 130 on the substrate 110 covers the dam 120 and the groove 150, and the insulating layer 140 in the first packaging area FA can form a good contact with the surface of the conductive structure 130 to avoid the existence of a gap, so that the conductive structure 130 is not easily corroded by water and oxygen, ensuring the reliability of the conductive structure 130 transmitting the signal to the power line L0, and ensuring a good display effect of the display panel.

[0105] On the basis of the above technical solution, in some optional embodiments of the present invention, the conductive structure 130 includes a first conductive structure 131, the power line L0 includes a first power line VDD, and the first conductive structure 131 is electrically connected to the first power line VDD; the pixel circuit includes a driving module 210, and the driving current generated by the driving module 210 is related to the first power supply voltage transmitted by the first power line VDD.

[0106] The driving module 210 is connected in series between the first power line VDD and the light emitting device. The driving module 210 can generate a driving current according to the data voltage written by the data writing module and the first power voltage transmitted by the first power line VDD, and output the driving current to the light emitting device to drive the light emitting device.

[0107] On the basis of the above technical solution, in another optional embodiment of the present invention, the conductive structure 130 includes a second conductive structure 132, the power line L0 includes a second power line Vref, and the second conductive structure 132 is electrically connected to the second power line Vref; Fig.10 Optionally, the pixel circuit includes an initialization module, the initialization module is used to initialize the control end or the light-emitting device of the driving module 210, and the second power line Vref is used to transmit the initialization voltage.

[0108] Optionally, the initialization module includes a first initialization unit 221 and / or a second initialization unit 222, the first initialization unit 221 is electrically connected to the control end of the driving module 210, and is used to initialize the control end of the driving module 210; the second initialization unit 222 is electrically connected to the light-emitting device, and is used to initialize the light-emitting device.

[0109] The first conductive structure 131 and the second conductive structure 132 are located in different conductive layers of the display panel, and the first conductive structure 131 and the second conductive structure 132 are insulated from each other. Fig. 9 The conductive structure 130 shown in the display panel may be a first conductive structure 131 or a second conductive structure 132. In some optional embodiments, the orthographic projection of the first conductive structure 131 on the substrate 110 and the orthographic projection of the second conductive structure 132 on the substrate 110 coincide with each other.

[0110] Continue to refer Fig. 9 Optionally, the conductive structure 130 is electrically connected to the power line L0 from at least two sides of the display area AA.

[0111] In the related art, the conductive structure 130 is located on one side of the display area AA, and is electrically connected to the power line L0 from one side of the display area AA. Under this connection mode, when the power line L0 transmits the power signal, the transmission voltage drop from one end to the other end of the display area AA will be relatively large, and the power signals received by the pixel circuits at different positions in the display area AA will be relatively different, which will affect the display uniformity of the display panel. Different from the related art, in this embodiment, the conductive structure 130 is electrically connected to the power line L0 from at least two sides of the display area AA. In this way, the conductive structure 130 can be electrically connected to the power line L0 from different directions of the display area AA, so that the power signals received by the pixel circuits at different positions in the display area AA will be relatively different, which is conducive to improving the display uniformity.

[0112] like Fig. 9 As shown, optionally, at least one conductive structure 130 is electrically connected to the power line L0 from opposite sides of the display area AA; in this way, the difference in power signals received by pixel circuits at different positions in the display area AA can be further reduced, thereby improving display uniformity.

[0113] On the basis of the above technical solution, optionally, at least one conductive structure 130 is electrically connected to the power line L0 from both sides of the display area in the first direction x and both sides of the display area in the second direction y, and the first direction x intersects the second direction y;

[0114] In some optional embodiments of the present invention, the first direction x is perpendicular to the second direction y.

[0115] Optionally, the display panel is in a rectangular or rounded rectangular shape.

[0116] Based on the above embodiments, optionally, the conductive structure 130 is located in at least one conductive layer, and the display panel further includes a plurality of light-emitting devices located in the display area AA, and in the display area AA, the conductive layer is located between the light-emitting devices and the substrate 110. Optionally, the conductive structures 130 in different conductive layers are used to transmit different signals.

[0117] Specifically, the display area AA includes structures such as pixel circuits and signal lines, and the pixel circuits may include circuit components such as transistors and capacitors. The conductive structure 130 is arranged in the conductive layer between the light-emitting device and the substrate 110, so that the conductive structure 130 can be prepared simultaneously with the components of the transistors or capacitors or the signal lines in the display area AA, thereby simplifying the preparation process of the display panel.

[0118] Fig.11 is a cross-sectional view of another display panel provided by an embodiment of the present invention, referring to Fig.11 Optionally, the display panel also includes a plurality of light-emitting devices 160 located in the display area AA, the light-emitting device 160 includes a first electrode 161, a light-emitting layer 162 and a second electrode 163 which are stacked; the conductive structure 130 includes a third conductive structure 130, and the third conductive structure 130 is electrically connected to the second electrode 163 of at least some of the light-emitting devices 160.

[0119] Among them, the first electrode 161 can be the anode of the light-emitting device 160, and the second electrode 163 can be the cathode of the light-emitting device 160. The first electrode 161, i.e., the anode, is a reflective electrode, i.e., an opaque electrode. The anode can adopt a three-layer structure, wherein the first layer and the third layer can be metal oxide layers, such as indium tin oxide (ITO), indium zinc oxide (IZO), aluminum zinc oxide (AZO), and the second layer in the middle can be a metal layer (such as silver or copper). The cathode can be an ITO transparent electrode or a magnesium-silver alloy. The light-emitting layer 162 can include only a single film layer, i.e., only a light-emitting material layer; or it can include a multilayer structure formed by a hole injection layer, a hole transport layer, a light-emitting material layer, an electron transport layer, an electron injection layer, etc. stacked from the first electrode 161 to the second electrode 163. Optionally, the light-emitting layer 162 includes at least a red light-emitting layer, a green light-emitting layer, and a blue light-emitting layer, thereby realizing a display of multiple colors. In this embodiment, the conductive structure 130 includes a third conductive structure 130 , and the third conductive structure 130 is electrically connected to the second electrode 163 of at least a portion of the light emitting device 160 , and further transmits a corresponding electrical signal to the second electrode 163 .

[0120] Combination Figure 3 and Fig.11 On the basis of the above technical solution, optionally, the second electrodes 163 of at least some of the light-emitting devices 160 are electrically connected to each other, and the third conductive structure 130 is electrically connected to the second electrodes 163 from at least two sides of the display area AA; in this way, the difference in electrical signals received by the second electrodes 163 of the light-emitting devices 160 at different positions in the display area AA can be reduced, thereby improving display uniformity.

[0121] Continue to refer Fig.11 Optionally, the display panel further includes an isolation structure 170 located in the display area AA, the isolation structure 170 encloses an isolation opening 171, the light-emitting layer 162 is located in the isolation opening 171, and the isolation structure 170 is used to isolate the light-emitting layer 162 of adjacent light-emitting devices 160; the isolation structure 170 overlaps the second electrode 163 of at least part of the light-emitting devices 160; the third conductive structure 133 is electrically connected to the second electrode 163 of at least part of the light-emitting devices 160 through the isolation structure 170; the third conductive structure 133 is in the same layer as the isolation structure 170. Optionally, the isolation structure 170 is arranged in a mesh shape.

[0122] The composition, preparation and other contents of the isolation structure 170 are further described in patent CN118251982A, patent 202410864269.8, patent PCT / CN2024 / 098407, patent PCT / CN2024 / 102783, patent PCT / CN2024 / 098217, patent PCT / CN2024 / 099419, and patent PCT / CN2024 / 099072, the contents of which are incorporated into this application by reference for reference.

[0123] The isolation structure 170 may be provided around the light emitting device 160. The isolation structure 170 has a certain thickness, so that the light emitting layers 162 of adjacent light emitting devices 160 are separated at the isolation structure 170, so as to avoid the generation of cross-color when the light emitting colors of adjacent light emitting devices 160 are different. The isolation structure 170 has a certain thickness. Specifically, the thickness of the isolation structure 170 is greater than the thickness of the second electrode 163. Exemplarily, when preparing a display panel, after the isolation structure 170 is prepared, the light emitting layer 162 may be evaporated using the isolation structure 170 as a mask, and then the light emitting layer 162 of the adjacent light emitting device 160 may be separated at the isolation structure 170 through the isolation structure 170, and the light emitting layer 162 may not be in contact with the isolation structure 170, so as to avoid the generation of cross-color when the light emitting colors of adjacent light emitting devices 160 are different. In addition, the use of a precision mask for evaporating the light emitting layer 162 in the prior art can be saved. When preparing the second electrode 163 on the light-emitting layer 162, for example, when the second electrode 163 is evaporated using a universal mask, due to the presence of the isolation structure 170, the second electrode 163 is divided into a plurality of independent second electrodes 163 corresponding to the light-emitting devices 160, wherein the preparation process of the second electrode 163 is not limited to the above-mentioned evaporation process, and a sputtering process or other processes may also be used, which is not specifically limited in this embodiment. It should be noted that when the light-emitting layer 162 and the second electrode 163 are both prepared by the evaporation process, the light-emitting layer 162 and the isolation structure 170 can be made to have no contact, and the second electrode 163 and the isolation structure 170 can be at least partially in contact to achieve overlap between the two, thereby achieving interconnection between the second electrodes 163 of at least some of the light-emitting devices 160 in the display panel. In this embodiment, the third conductive structure 133 is electrically connected to the second electrodes 163 of at least some of the light-emitting devices 160 through the isolation structure 170, and the electrical signal can be transmitted to the second electrode 163 of the light-emitting device 160 through the third conductive structure 133 and the isolation structure 170. Among them, the third conductive structure 133 is in the same layer as the isolation structure 170. Optionally, the third conductive structure 133 and the isolation structure 170 are made of the same material and are prepared simultaneously using the same process. There is no need to add an additional film layer to the display panel to prepare the third conductive structure 133, which can simplify the structure and preparation process of the display panel.

[0124] On the basis of the above technical solution, optionally, the third conductive structure 133 and the isolation structure 170 are an integrated structure. Specifically, during the preparation of the display panel, a material of a whole conductive layer can be formed in the display area AA and the non-display area NAA of the display panel, and then the whole conductive layer is patterned, and the conductive layer at the position of the isolation opening 171 is removed to obtain an integrated third conductive structure 133 and the isolation structure 170.

[0125] Continue to refer Fig.11 Optionally, the display panel further includes a pixel defining layer 180, the pixel defining layer 180 is located between the substrate 110 and the isolation structure 170, the pixel defining layer 180 includes a plurality of pixel openings 181, and the first electrode 161 is at least partially exposed to the pixel openings 181; the orthographic projection of the isolation structure 170 on the pixel defining layer 180 is located between adjacent pixel openings 181;

[0126] Fig.12 is an enlarged view of an isolation structure provided by an embodiment of the present invention, combined with Fig.11 and Fig.12 Optionally, the isolation structure 170 includes a supporting portion 172 and a partition portion 173, the supporting portion 172 is located between the partition portion 173 and the pixel defining layer 180; the orthographic projection of the partition portion 173 on the pixel defining layer 180 covers the orthographic projection of the supporting portion 172 on the pixel defining layer 180; the second electrode 163 of the light-emitting device 160 on at least one side of the isolation structure 170 overlaps with the isolation structure 170.

[0127] In some optional embodiments of the present invention, the second electrode 163 of the light-emitting device 160 on at least one side of the isolation structure 170 overlaps with the support portion 172 of the isolation structure 170 .

[0128] Among them, the pixel defining layer 180 includes a plurality of pixel openings 181, and a light-emitting layer 162 of a light-emitting device 160 is arranged in each pixel opening 181. The pixel defining layer 180 can be made of organic materials such as acrylic organic compounds, polyamide, or polyimide, and can also be made of inorganic materials such as silicon oxide, silicon nitride, silicon oxynitride, or aluminum oxide. The embodiment of the present invention is not specifically limited here.

[0129] Optionally, the orthographic projection of the pixel opening 181 on the substrate 110 is within the orthographic projection of the isolation opening 171 on the substrate 110. In an optional embodiment, the orthographic projection of the pixel opening 181 on the substrate 110 completely overlaps with the orthographic projection of the isolation opening 171 on the substrate 110. In another optional embodiment, the orthographic projection of the pixel opening 181 on the substrate 110 partially overlaps with the orthographic projection of the isolation opening 171 on the substrate 110, and the orthographic projection of the pixel opening 181 on the substrate 110 is completely within the orthographic projection of the isolation opening 171 on the substrate 110.

[0130] The isolation structure 170 includes a support portion 172 and a partition portion 173. The material of the support portion 172 may be a conductive material. The second electrodes 163 of adjacent light-emitting devices 160 are all connected to the support portion 172, so that the second electrodes 163 of adjacent light-emitting devices 160 are electrically connected through the support portion 172. The material of the support portion 172 may be aluminum. The material of the partition portion 173 may include a conductive material and / or an insulating material, for example, the material of the partition portion 173 includes titanium, silicon nitride, or silicon oxide.

[0131] Continue to refer Fig.11 and Fig.12 Optionally, in the direction z of the line connecting the isolation openings 171 on both sides of the isolation structure 170, at the position where the support portion 172 and the partition portion 173 are connected, the size of the support portion 172 (represented as the first size d1) is smaller than the size of the partition portion 173 (represented as the second size d2).

[0132] Specifically, in the direction of the isolation openings 171 on both sides of the isolation structure 170, at the position where the support portion 172 and the partition portion 173 meet, the size of the support portion 172 is smaller than the size of the partition portion 173, so that an undercut structure is formed on the side of the isolation structure 170, and then when the light-emitting layer 162 of the light-emitting device 160 in the display panel is evaporated, the light-emitting layer 162 of the adjacent light-emitting device 160 can be cut off at the position of the isolation structure 170. It should be noted that in this embodiment, the shape of the isolation structure 170 is not limited to 7 and Figure 8 The shape shown can also block the light emitting layer 162 of the light emitting device 160 , and the size of the supporting portion 172 is smaller than the size of the blocking portion 173 at the position where the supporting portion 172 and the blocking portion 173 meet.

[0133] Fig.13 is an enlarged view of another isolation structure provided by an embodiment of the present invention, refer to Fig.13 In another optional embodiment of the present invention, the isolation structure 170 also includes an auxiliary support portion 174, which is located between the support portion 172 and the pixel defining layer 180, and the orthographic projection of the support portion 172 on the substrate 110 is located within the orthographic projection of the auxiliary support portion 174 on the substrate 110.

[0134] The auxiliary support part 174 is made of conductive material, and the isolation structure 170 can be made more solid by providing the auxiliary support part 174. Optionally, the second electrode 163 of the light emitting device 160 on at least one side of the isolation structure 170 overlaps with the auxiliary support part 174.

[0135] Continue to refer Figure 3 and Fig.11On the basis of the above technical solution, in some optional embodiments of the present invention, the pixel defining layer 180 extends from the display area AA to the first encapsulation area FA; the conductive structure 130 further includes a first conductive structure 131 and / or a second conductive structure, and the pixel defining layer 180 covers the first conductive structure 131 and / or the second conductive structure and contacts the first conductive structure 131 and / or the second conductive structure. Fig.10 As shown, the first conductive structure 131 is electrically connected to the first power line VDD, and the second conductive structure is electrically connected to the second power line Vref. Fig.11 The first conductive structure 131 is exemplarily shown in FIG. 1 , while the second conductive structure is not shown.

[0136] Among them, the first conductive structure and / or the second conductive structure are located on the side of the third conductive structure 133 close to the substrate 110, and the third conductive structure 133 and the first conductive structure, or the third conductive structure 133 and the second conductive structure are insulated by the pixel defining layer 180. In this way, the original pixel defining layer 180 in the display panel is used as the insulating layer 140, which can simplify the film structure and preparation process of the display panel. Optionally, the thickness of the pixel defining layer 180 in the first encapsulation area FA is less than or equal to the thickness of the pixel defining layer 180 in the display area AA. In some optional embodiments of the present invention, the thickness of the pixel defining layer 180 in the first encapsulation area FA is less than the thickness of the pixel defining layer 180 in the display area AA. In this way, on the one hand, the pixel defining layer 180 has a relatively large thickness in the display area AA, so that the pixel opening 181 can accommodate the light-emitting layer 162. On the other hand, in the first encapsulation area FA, the pixel defining layer 180 has a relatively small thickness, so that the pixel defining layer 180 formed in the groove 150 does not occupy too large a depth, ensuring that the groove 150 can accommodate the organic material of the encapsulation layer and extending the invasion path of water and oxygen.

[0137] Continue to refer Fig.11 Optionally, the display panel further includes an encapsulation layer 190 and a second encapsulation area PA, in which the encapsulation layer 190 includes a first inorganic encapsulation layer 191, an organic encapsulation layer 192, and a second inorganic encapsulation layer 193 which are stacked; in at least a portion of the first encapsulation area FA, the encapsulation layer 190 includes a second inorganic encapsulation layer 193, and the second inorganic encapsulation layer 193 covers the third conductive structure 133. In some optional embodiments of the present invention, the second encapsulation area PA includes the display area AA.

[0138] Specifically, in a display panel including an isolation structure 170, devices of different light-emitting colors are evaporated and packaged independently. Exemplarily, after the pixel defining layer 180 and the isolation structure 170 are prepared, the light-emitting layer 162, the second electrode 163 and the first inorganic encapsulation layer 191 of the light-emitting device 160 of the first light-emitting color are firstly evaporated in all pixel openings 181, and then the light-emitting layer 162 and the second electrode 163 in the first pixel opening 181 corresponding to the light-emitting device 160 of the first light-emitting color are retained, and the first inorganic encapsulation layer 191 on the second electrode 163 of the light-emitting device 160 of the first light-emitting color and the first inorganic encapsulation layer 191 on the isolation structure 170 around the second electrode 163 of the light-emitting device 160 of the first light-emitting color are retained, and the light-emitting layer 162, the second electrode 163 and the first inorganic encapsulation layer 191 at the corresponding positions at other pixel openings 181 and the isolation structure 170 are removed. Then, the light-emitting layer 162, the second electrode 163 and the first inorganic encapsulation layer 191 of the light-emitting device 160 of the second light-emitting color are patterned in the same manner, and only the light-emitting layer 162 and the second electrode 163 in the second pixel opening 181 corresponding to the light-emitting device 160 of the second light-emitting color are retained, and the first inorganic encapsulation layer 191 on the second electrode 163 of the light-emitting device 160 of the second light-emitting color and the first inorganic encapsulation layer 191 on the isolation structure 170 around the second electrode 163 of the light-emitting device 160 of the second light-emitting color are retained. In the case where the display panel also includes light-emitting devices 160 of other light-emitting colors, the above preparation method can also be used for preparation. Therefore, the first inorganic encapsulation layer 191 in the first encapsulation area FA will be removed, and due to the blocking effect of the dam 120 on the organic encapsulation layer 192 in the encapsulation layer 190, at least part of the first encapsulation area FA does not include the organic encapsulation layer 192, but only includes the second inorganic encapsulation layer 193.

[0139] The second inorganic encapsulation layer 193 serves as an insulating layer 140 to cover the third conductive structure 133. If the third conductive structure 133 has side engravings in the first encapsulation area FA, it is easier to form a gap at the side engraving position, providing a path for water and oxygen to invade. In each embodiment of the present invention, by setting the positive projection of each conductive structure 130 including the third conductive structure 133 on the substrate 110 to cover the dam 120 and the groove 150, the conductive structure 130 will not have side engravings in the first encapsulation area FA. Even if the encapsulation layer 190 of the first encapsulation area FA only includes the second inorganic encapsulation layer 193, it can be well attached to the third conductive layer, that is, the second inorganic encapsulation layer 193 and the third conductive structure 133 in the first encapsulation area FA will not form a water and oxygen invasion path from the first encapsulation area FA to the second encapsulation area PA, thereby extending the service life of the display panel.

[0140] The above embodiment is described by taking the example that the second electrodes 163 of the light emitting device 160 are electrically connected to each other through the isolation structure 170 . In other optional embodiments of the present invention, the display panel may not include the isolation structure 170 . Fig.14 is a cross-sectional view of another display panel provided by an embodiment of the present invention, referring to Fig.14 Optionally, the second electrodes 163 of the light-emitting devices are electrically connected to each other to form a whole surface structure; the second electrode 163 extends to the non-display area NAA and is electrically connected to the third conductive structure 133; the non-display area NAA includes the first encapsulation area FA. In this display panel structure, the second electrodes 163 of all light-emitting devices in the display panel are formed by one-time evaporation or sputtering, and the preparation method is simple. Fig.14 As shown, the entire second electrode 163 may overlap the third conductive structure 133 in the non-display area NAA (eg, Fig.14 The first position is overlapped at 12).

[0141] Continue to refer Fig.14 On the basis of the above embodiment, optionally, the third conductive structure 133 is located in a conductive layer in the display panel, and in the display area AA, the conductive layer where the third conductive structure 133 is located is located between the light emitting device and the substrate 110 .

[0142] As described in the above embodiment, a plurality of conductive layers are included between the light-emitting device and the substrate 110, and the third conductive structure 133 is located in the conductive layer between the light-emitting device and the substrate 110, and can be prepared simultaneously with the component structure of the pixel circuit or the signal line in the display area AA, thereby simplifying the preparation process. In addition, the conductive layer between the light-emitting device and the substrate 110 includes a metal layer, and the conductive layer between the light-emitting device and the substrate 110 has a smaller square resistance than the material of the first electrode 161 and the second electrode 163 of the light-emitting device. Therefore, the third conductive structure 133 is arranged in the conductive layer between the light-emitting device and the substrate 110, so that the third conductive structure 133 has a smaller resistance, so that the voltage drop of the third conductive structure 133 transmitting the electrical signal is smaller, which is conducive to improving the display effect.

[0143] Combination Fig.11 , Fig.14 and Fig.10 The display panel further includes a third power line VSS, the third conductive structure is electrically connected to the third power line VSS, and the third power line VSS is electrically connected to the second electrode of the light emitting device. The third power line VSS can be arranged in the display area and / or the non-display area. When the third power line VSS is arranged in the display area, it can also be adopted. Fig. 9 The mesh structure of the power line L0 shown reduces the transmission resistance.

[0144] Combination Figure 11-Figure 14On the basis of the above embodiments, optionally, the display panel further includes an insulating layer 140, which covers the conductive structure 130; the insulating layer 140 is an inorganic layer; on the side of the dam 120 away from the substrate 110, it also includes a first organic part 310, and the first organic part 310 is on the side of the encapsulation layer 190 in the display panel close to the substrate 110.

[0145] Specifically, a groove 150 needs to be formed in the first encapsulation area FA. Since the thickness of the organic layer is usually thicker than that of the inorganic layer, the organic layer needs to be removed at the position corresponding to the groove 150. Accordingly, in the first encapsulation area FA, the insulating layer 140 is an inorganic layer, so that the depth of the groove 150 occupied by the insulating layer 140 in the groove 150 is small. On the side of the dam 120 away from the substrate 110, the first organic part 310 is included, so that the first organic part 310 serves as a supplementary structure of the dam 120. The sum of the heights of the first organic part 310 and the dam 120 is greater than the height of the dam 120, so that the overall structure of the first organic part 310 and the dam 120 and the groove 150 form a concave-convex structure with a greater height difference, which is conducive to further extending the invasion path of water and oxygen, while avoiding overflow of the organic encapsulation layer 192, and is conducive to achieving a better encapsulation effect.

[0146] On the basis of the above technical solution, optionally, the first organic part 310 is located in the first organic layer, and the first organic layer also includes a second organic part 320 located in the display area AA, and the second organic part 320 is in contact with the first electrode 161 of the light-emitting device 160 in the display area AA, and is located on the side of the first electrode 161 close to the substrate 110.

[0147] The first organic layer may be a planarization layer in the display panel (eg Fig.11 and Fig.14 The first planarization layer 301 in the display panel is used, and the portion of the planarization layer in the first encapsulation area FA is used as the first organic part 310, which can be prepared simultaneously with the structure of the planarization layer in the display area AA, thereby simplifying the display panel preparation process.

[0148] In some optional embodiments of the present invention, the bank 120 includes a third organic portion 330 . The third organic portion 330 is located in the second organic layer 302 . The second organic layer 302 is located on a side of the first organic layer close to the substrate 110 .

[0149] The display panel may include at least one second organic layer 302. Fig.11 and Fig.14 FIG. 2 schematically shows a case where the display panel includes two second organic layers 302. The second organic layer 302 may also be a planarization layer (eg, Fig.11 and Fig.14The second planarization layer 303 and the third planarization layer 304 are formed in the display panel, and the planarization layer in the first encapsulation area FA is used as the dam 120, which can be prepared simultaneously with the structure of the planarization layer in the display area AA, thereby simplifying the display panel preparation process.

[0150] Fig.15 is a top view of another display panel provided by an embodiment of the present invention, Fig.16 is a top view of another display panel provided by an embodiment of the present invention, referring to Fig.15 and Fig.16 On the basis of the above embodiment, optionally, the display panel further includes at least one connecting portion 410, the connecting portion 410 is connected to a power source and electrically connected to the conductive structure 130, and the orthographic projection of the connecting portion 410 on the substrate 110 is at least partially located on a side of the correspondingly connected conductive structure 130 away from the display area AA. Fig.10 It may correspond to the connection structure between the first conductive structure 131 or the second conductive structure 132 and the connection portion 410 in the above-mentioned embodiment. Fig.16 The conductive structure shown may correspond to the above embodiment. Fig.11 The connection structure between the third conductive structure 133 and the connection portion 410 in the top view of the cross-sectional structure is shown.

[0151] By providing the connection portion 410, the power signal provided by the power source can be transmitted to the conductive structure 130, and then the power signal can be transmitted to the display area AA through the conductive structure 130. The connection portions 410 corresponding to different conductive structures 130 are insulated from each other.

[0152] In some optional embodiments of the present invention, each connecting portion 410 is disposed on the same layer as one of the conductive structures 130 .

[0153] Specifically, the non-display area NAA also includes a bending area, and the bending area can be located on one side of the first packaging area FA. In the bending area, signal transmission is usually achieved through a signal line of a metal layer. By setting each connecting portion 410 on the same layer as one of the conductive structures 130, the connection method between the signal line and the connecting portion 410 in the bending area can be made simpler and more convenient. In an optional embodiment of the present invention, each connecting portion 410 is on the same layer as the signal line in the bending area. Exemplarily, the connecting portion 410 can be set on the same layer as the first conductive structure 131 or the second conductive structure 132.

[0154] On the basis of the above technical solution, optionally, the conductive structure 130 and the connecting portion 410 provided on the same layer are an integrated structure.

[0155] Optionally, the conductive structure 130 is electrically connected to at least one connecting portion 410 disposed on a different layer through a via. Fig.16In the embodiment, the third conductive structure 133 is electrically connected to the corresponding connection portion 410 through a via hole.

[0156] Optionally, the display panel is in a rectangular or rounded rectangular shape, and the connection portion 410 is disposed at a frame position on one side of the display area AA. The exemplary non-display area NAA includes an upper frame, a lower frame, a left frame, and a frame, wherein the upper frame is opposite to the lower frame, and the left frame is opposite to the right frame. The connection portion 410 can be disposed on the lower frame, and the lower frame or the back side of the display panel can also include a power supply.

[0157] In some optional embodiments of the present invention, each conductive structure 130 is electrically connected to two connecting portions 410, and the width of the conductive structure 130 between at least one connecting portion 410 electrically connected to at least one conductive structure 130 is greater than the width of the conductive structure 130 at other positions. Optionally, each conductive structure 130 is electrically connected to two connecting portions 410, and the width of the conductive structure 130 between two connecting portions 410 electrically connected to at least one conductive structure 130 is greater than the width of the conductive structure 130 at other positions.

[0158] Specifically, the two connecting parts 410 and the conductive structure 130 between the two connecting parts 410 collect current. Setting the width of the conductive structure 130 between the two connecting parts 410 to be greater than the width of the conductive structure 130 at other positions can improve the current carrying capacity of the conductive structure 130 and ensure the reliability of the display panel.

[0159] Continue to refer Figure 1 , Figure 6-Figure 8 Optionally, the conductive structure 130 includes a first boundary 1301 and a second boundary 1302, the first boundary 1301 is located on a side of the second boundary 1302 close to the display area AA; the first encapsulation area FA includes a third boundary FA1 and a fourth boundary FA2, the third boundary FA1 is located on a side of the fourth boundary FA2 close to the display area AA; the distance from the second boundary 1302 of at least one conductive structure 130 to the display area AA is greater than or equal to the distance from the fourth boundary FA2 to the display area AA.

[0160] In this way, it can be ensured that the second boundary 1302 of at least one conductive structure 130 is outside the first packaging area FA (i.e., on the side away from the display area), so that the side engraving structure at the edge of the conductive structure 130 will not pass through the first packaging area FA, and thus will not form a water and oxygen intrusion path from outside the first packaging area FA to inside the first packaging area FA, thereby improving the packaging effect. In addition, the second boundary 1302 of at least one conductive structure 130 is outside the first packaging area FA. Even if there is a side engraving at the second boundary 1302 of the conductive structure 130, the side engraving will be outside the first packaging area FA and will not affect the packaging effect, further ensuring a good packaging effect. Moreover, in the case where the conductive structure 130 is on the side of the first packaging area FA away from the substrate 110, the second boundary 1302 of the conductive structure 130 covers the fourth boundary FA2 of the first packaging area FA, which is conducive to further improving the packaging effect.

[0161] Fig.17 is a top view of another display panel provided by an embodiment of the present invention, referring to Fig.17 In some optional embodiments of the present invention, at least two conductive structures 130 are arranged in the same layer, and among the conductive structures 130 arranged in the same layer, the distance from the second boundary 1302 of the conductive structure 130 farthest from the display area AA to the display area AA is greater than or equal to the distance from the fourth boundary FA2 to the display area AA.

[0162] In this way, the second boundary 1302 of the conductive structure 130 farthest from the display area AA is outside the first packaging area FA. Even if there is side engraving at the second boundary 1302 of the conductive structure 130 farthest from the display area AA, the side engraving will be outside the first packaging area FA and will not affect the packaging effect, thereby further ensuring a good packaging effect.

[0163] Optionally, in the conductive structure 130 disposed in the same layer, the distance from the first boundary 1301 of the conductive structure 130 closest to the display area AA to the display area AA is less than or equal to the distance from the third boundary FA1 to the display area AA. In this way, the first boundary 1301 of the conductive structure 130 closest to the display area AA is located on the side of the first packaging area FA close to the display area AA. Even if there is a side engraving at the first boundary 1301 of the conductive structure 130 closest to the display area AA, the side engraving will be located on the side of the first packaging area FA close to the display area AA, and will not affect the packaging effect, further ensuring a good packaging effect. In addition, when the conductive structure 130 is located on the side of the first packaging area FA far away from the substrate 110, the first boundary 1301 of the conductive structure 130 covers the third boundary FA1 of the first packaging area FA, which is conducive to further improving the packaging effect.

[0164] Combination Figure 1In another optional embodiment of the present invention, each conductive structure 130 is arranged in a different layer, and the distance from the second boundary 1302 of each conductive structure 130 to the display area AA is greater than or equal to the distance from the fourth boundary FA2 to the display area AA.

[0165] In this way, the second boundary 1302 of each conductive structure 130 is outside the first packaging area FA. Even if there is a side engraving at the second boundary 1302 of the conductive structure 130, the side engraving will be outside the first packaging area FA and will not affect the packaging effect, further ensuring a good packaging effect.

[0166] Optionally, the distance from the first boundary 1301 of each conductive structure 130 to the display area AA is less than or equal to the distance from the third boundary FA1 to the display area AA. In this way, the first boundary 1301 of each conductive structure 130 is located on the side of the first packaging area FA close to the display area AA. Even if there is a side engraving at the first boundary 1301 of the conductive structure 130, the side engraving will be located on the side of the first packaging area FA close to the display area AA, and will not affect the packaging effect, further ensuring a good packaging effect. In addition, when the conductive structure 130 is located on the side of the first packaging area FA far away from the substrate 110, the first boundary 1301 of the conductive structure 130 covers the third boundary FA1 of the first packaging area FA, which is conducive to further improving the packaging effect.

[0167] The embodiment of the present invention further provides another display panel, in combination with Figure 1-Figure 3 , Figure 6-Figure 8 , the display panel includes a display area AA; the display panel also includes a conductive structure 130 and a peripheral encapsulation part, the conductive structure 130 and the peripheral encapsulation part are arranged on the same side of the substrate 110 and surround the display area AA; the conductive structure 130 includes a first boundary 1301 and a second boundary 1302, the first boundary 1301 is located on the side of the second boundary 1302 close to the display area AA, the peripheral encapsulation part includes a third boundary FA1 and a fourth boundary FA2, the third boundary FA1 is located on the side of the fourth boundary FA2 close to the display area AA; the second boundary 1302 is located on the side of the third boundary FA1 away from the display area AA, and the first boundary 1301 is located on the side of the fourth boundary FA2 close to the display area AA. Figure 1-Figure 3 As shown, the peripheral packaging part includes a first packaging area FA. Accordingly, the peripheral packaging part includes the structure of the first packaging area FA in any of the above embodiments of the present invention.

[0168] In the embodiment of the present invention, the outer boundary (i.e., the second boundary 1302) of the conductive structure 130 is located on the side of the inner boundary (i.e., the third boundary FA1) of the peripheral packaging part away from the display area AA, and the inner boundary (i.e., the first boundary 1301) of the conductive structure 130 is located on the side of the outer boundary (i.e., the fourth boundary FA2) of the peripheral packaging part close to the display area AA, so as to ensure that the orthographic projection of the conductive structure 130 on the substrate 110 and the orthographic projection of the first packaging area FA on the substrate 110 at least partially overlap to form an overlapping portion 11, and the overlapping portion 11 surrounds the display area AA, so that there is no intrusion path extending from the outside of the first packaging area to the first packaging area, so that it is difficult for water and oxygen to enter the display area through the conductive structure, thereby improving the service life of the display panel and ensuring the reliability of the display panel.

[0169] Combination Figure 9-14 Optionally, the conductive structure 130 includes at least one of a first conductive structure 131, a second conductive structure 132 and a third conductive structure 133; the display panel also includes a plurality of light-emitting devices 160, the light-emitting device 160 includes a first electrode 161, a light-emitting layer 162 and a second electrode 163 which are stacked; the first conductive structure 131 is electrically connected to a first power line VDD; the second conductive structure 132 is electrically connected to a second power line Vref, the second power line Vref is electrically connected to an initialization module in a pixel circuit, and the initialization module is used to initialize a control end of a driving module of the pixel circuit or the light-emitting device 160; the third conductive structure 133 is electrically connected to the second electrode 163 of at least some of the light-emitting devices 160 in the display panel.

[0170] Optionally, the display panel further includes an isolation structure 170 located in the display area AA, the isolation structure 170 encloses an isolation opening, and the light-emitting layer 162 is located in the isolation opening; the isolation structure 170 overlaps the second electrode 163 of at least part of the light-emitting device 160; the third conductive structure 133 is electrically connected to the second electrode 163 of at least part of the light-emitting device 160 through the isolation structure 170;

[0171] Optionally, the isolation structure 170 is arranged in a mesh shape;

[0172] Optionally, the third conductive structure 133 and the isolation structure 170 are disposed in the same layer;

[0173] Optionally, the third conductive structure 133 and the isolation structure 170 are an integrated structure.

[0174] Optionally, the distance from the second boundary 1302 of at least one conductive structure 130 to the display area AA is greater than or equal to the distance from the fourth boundary FA2 to the display area AA. The above structures are all involved in the above embodiments, and their beneficial effects are not repeated here.

[0175] An embodiment of the present invention further provides a display device, Fig.18 is a schematic diagram of a display device provided by an embodiment of the present invention, with reference to Fig.18 The display device 10 includes the display panel 100 of any of the above embodiments of the present invention, and has the beneficial effects of the display panel of any of the above embodiments of the present invention, which will not be described in detail herein.

[0176] It should be understood that the various forms of processes shown above can be used to reorder, add or delete steps. For example, the steps described in the present invention can be executed in parallel, sequentially or in different orders, as long as the desired results of the technical solution of the present invention can be achieved, and this document does not limit this.

[0177] The above specific implementations do not constitute a limitation on the protection scope of the present invention. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modification, equivalent substitution and improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A display panel, characterized in that: include: Display area; The display panel further comprises a substrate, a conductive structure and a first packaging area, wherein the conductive structure and the first packaging area are arranged on the same side of the substrate and surround the display area; The orthographic projection of the conductive structure on the substrate at least partially overlaps with the orthographic projection of the first packaging area on the substrate to form an overlapping portion, and the overlapping portion surrounds the display area.

2. The display panel according to claim 1, wherein the first encapsulation area comprises a dam and a groove, wherein the dam is disposed on one side of the substrate and surrounds the display area, and the groove is located on a side of the dam close to the display area and / or away from the display area; The orthographic projection of the conductive structure on the substrate at least partially covers the orthographic projections of the dam and the groove on the substrate; Preferably, the orthographic projection of the conductive structure on the substrate completely covers the orthographic projection of the dam and the groove on the substrate; Preferably, in the first packaging area, the conductive structure is located on a side of the dam away from the substrate and in the groove.

3. The display panel according to claim 1, characterized in that: The display panel further comprises a pixel circuit and a power line, wherein the power line is electrically connected to the pixel circuit; Preferably, the conductive structure includes a first conductive structure, the power line includes a first power line, and the first conductive structure is electrically connected to the first power line; The pixel circuit comprises a driving module, wherein the driving current generated by the driving module is related to the first power supply voltage transmitted by the first power supply line; Preferably, the conductive structure includes a second conductive structure, the power line includes a second power line, and the second conductive structure is electrically connected to the second power line; the pixel circuit includes an initialization module, the initialization module is used to initialize the control end of the driving module or the light-emitting device, and the second power line is used to transmit the initialization voltage.

4. The display panel according to claim 3, characterized in that: The conductive structure is electrically connected to the power line from at least two sides of the display area; Preferably, at least one of the conductive structures is electrically connected to the power line from opposite sides of the display area; Preferably, at least one conductive structure is electrically connected to the power line from both sides of the display area in a first direction and both sides of the display area in a second direction, respectively, and the first direction intersects the second direction; Preferably, the first direction is perpendicular to the second direction.

5. The display panel according to any one of claims 1 to 4, characterized in that: The conductive structure is located in at least one conductive layer; the display panel further comprises a plurality of light emitting devices located in a display area, and in the display area, the conductive layer is located between the light emitting devices and the substrate; Preferably, the conductive structures in different conductive layers are used to transmit different signals.

6. The display panel according to any one of claims 1 to 4, characterized in that: The display panel further comprises a plurality of light emitting devices located in the display area, wherein the light emitting devices comprise a first electrode, a light emitting layer, and a second electrode which are stacked; the conductive structure comprises a third conductive structure, and the third conductive structure is electrically connected to the second electrode of at least part of the light emitting devices; Preferably, the second electrodes of at least some of the light-emitting devices are electrically connected to each other, and the third conductive structure is electrically connected to the second electrodes from at least two sides of the display area.

7. The display panel according to claim 6, characterized in that: The display panel further comprises an isolation structure located in the display area, the isolation structure encloses to form an isolation opening, and the light emitting layer is located in the isolation opening; The isolation structure overlaps with at least a portion of the second electrode of the light-emitting device; The third conductive structure is electrically connected to at least part of the second electrode of the light emitting device through the isolation structure; Preferably, the isolation structure is arranged in a mesh shape; Preferably, the third conductive structure and the isolation structure are arranged in the same layer; Preferably, the third conductive structure and the isolation structure are an integrated structure.

8. The display panel according to claim 7, characterized in that: Also included is a pixel defining layer, the pixel defining layer is located between the substrate and the isolation structure, the pixel defining layer includes a plurality of pixel openings, and the first electrode is at least partially exposed to the pixel openings; The orthographic projection of the isolation structure on the pixel defining layer is located between adjacent pixel openings; The isolation structure comprises a supporting portion and a partitioning portion, wherein the supporting portion is located between the partitioning portion and the pixel defining layer; the orthographic projection of the partitioning portion on the pixel defining layer covers the orthographic projection of the supporting portion on the pixel defining layer; the second electrode of the light emitting device on at least one side of the isolation structure overlaps with the isolation structure; Preferably, the second electrode of the light-emitting device on at least one side of the isolation structure overlaps with the support portion of the isolation structure; Preferably, in the direction of the isolation openings on both sides of the isolation structure, at the position where the support portion and the partition portion are connected, the size of the support portion is smaller than the size of the partition portion; Preferably, the isolation structure further comprises an auxiliary support portion, wherein the auxiliary support portion is located between the support portion and the pixel defining layer, and an orthographic projection of the support portion on the substrate is located within an orthographic projection of the auxiliary support portion on the substrate; Preferably, the second electrode of the light-emitting device on at least one side of the isolation structure overlaps with the auxiliary support portion; Preferably, the pixel defining layer extends from the display area to the first packaging area; the conductive structure further includes a first conductive structure and / or a second conductive structure, the pixel defining layer covers the first conductive structure and / or the second conductive structure, and contacts the first conductive structure and / or the second conductive structure; the first conductive structure is electrically connected to a first power line, and the second conductive structure is electrically connected to a second power line; Preferably, the thickness of the pixel defining layer in the first encapsulation area is less than or equal to the thickness of the pixel defining layer in the display area; Preferably, the thickness of the pixel defining layer in the first encapsulation area is smaller than the thickness of the pixel defining layer in the display area.

9. The display panel according to claim 7, characterized in that: It also includes a second encapsulation area and an encapsulation layer, wherein in the second encapsulation area, the encapsulation layer includes a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer that are stacked; In at least a portion of the first encapsulation region, the encapsulation layer includes the second inorganic encapsulation layer, and the second inorganic encapsulation layer covers the third conductive structure; Preferably, the second packaging area includes a display area.

10. The display panel according to claim 6, characterized in that: The second electrodes of the light emitting device are electrically connected to each other to form a whole surface structure; the second electrode extends to the non-display area and is electrically connected to the third conductive structure; the non-display area includes the first packaging area; Preferably, the third conductive structure is located in a conductive layer in the display panel, and in the display area, the conductive layer where the third conductive structure is located is located between the light emitting device and the substrate.

11. The display panel according to claim 2, characterized in that: It also includes an insulating layer, the insulating layer covers the conductive structure; the insulating layer is an inorganic layer; Preferably, the side of the dam away from the substrate further includes a first organic part, and the first organic part is located on a side of the encapsulation layer in the display panel close to the substrate; Preferably, the first organic part is located in a first organic layer, the first organic layer further comprises a second organic part located in the display area, the second organic part is in contact with the first electrode of the light emitting device in the display area, and is located on a side of the first electrode close to the substrate; Preferably, the dam includes a third organic portion, the third organic portion is located in the second organic layer, and the second organic layer is located on a side of the first organic layer close to the substrate.

12. The display panel according to claim 1, characterized in that: The conductive structure includes a first boundary and a second boundary, and the first boundary is located on a side of the second boundary close to the display area; the first encapsulation area includes a third boundary and a fourth boundary, and the third boundary is located on a side of the fourth boundary close to the display area; A distance from the second boundary of at least one of the conductive structures to the display area is greater than or equal to a distance from the fourth boundary to the display area.

13. The display panel according to claim 12, characterized in that: At least two of the conductive structures are arranged in the same layer, and among the conductive structures arranged in the same layer, the distance from the second boundary of the conductive structure farthest from the display area to the display area is greater than or equal to the distance from the fourth boundary to the display area; Preferably, among the conductive structures arranged in the same layer, the distance from the first boundary of the conductive structure closest to the display area to the display area is less than or equal to the distance from the third boundary to the display area; Alternatively, the conductive structures are arranged in different layers, and the distance from the second boundary of each conductive structure to the display area is greater than or equal to the distance from the fourth boundary to the display area; Preferably, the distance from the first boundary of each of the conductive structures to the display area is less than or equal to the distance from the third boundary to the display area.

14. The display panel according to claim 1, characterized in that: The invention also includes at least one connecting portion, the connecting portion is connected to a power source and is electrically connected to the conductive structure, and the orthographic projection of the connecting portion on the substrate is at least partially located on a side of the conductive structure that is connected to the connecting portion and is away from the display area; Preferably, each of the connecting parts is arranged in the same layer as one of the conductive structures; Preferably, the conductive structure and at least one of the connecting parts arranged in the same layer are an integrated structure; Preferably, the conductive structure is electrically connected to at least one of the connecting parts arranged in different layers through a via.

15. The display panel according to claim 14, characterized in that: Each of the conductive structures is electrically connected to at least one of the connecting portions, and a width of the conductive structure between two of the connecting portions electrically connected to at least one of the conductive structures is greater than a width of the conductive structure at other positions.

16. A display panel, characterized in that: including a display area; The display panel further comprises a conductive structure and a peripheral packaging portion, wherein the conductive structure and the peripheral packaging portion are arranged on the same side of the substrate and surround the display area; The conductive structure includes a first boundary and a second boundary, the first boundary is located on a side of the second boundary close to the display area, the peripheral encapsulation portion includes a third boundary and a fourth boundary, the third boundary is located on a side of the fourth boundary close to the display area; The second boundary is located at a side of the third boundary away from the display area, and the first boundary is located at a side of the fourth boundary close to the display area.

17. The display panel according to claim 16, characterized in that: The conductive structure includes at least one of a first conductive structure, a second conductive structure and a third conductive structure; the display panel further includes a plurality of light emitting devices, and the light emitting devices include a first electrode, a light emitting layer and a second electrode which are stacked; The first conductive structure is electrically connected to the first power line; The second conductive structure is electrically connected to the second power line, and the second power line is electrically connected to an initialization module in the pixel circuit, and the initialization module is used to initialize the control end or the light-emitting device of the driving module of the pixel circuit; The third conductive structure is electrically connected to the second electrodes of at least some of the light emitting devices in the display panel.

18. The display panel according to claim 17, characterized in that: The display panel further comprises an isolation structure located in the display area, the isolation structure encloses to form an isolation opening, and the light emitting layer is located in the isolation opening; The isolation structure overlaps with at least a portion of the second electrode of the light-emitting device; The third conductive structure is electrically connected to at least part of the second electrode of the light emitting device through the isolation structure; Preferably, the isolation structure is arranged in a mesh shape; Preferably, the third conductive structure and the isolation structure are arranged in the same layer; Preferably, the third conductive structure and the isolation structure are an integrated structure.

19. The display panel according to claim 16, characterized in that: A distance from the second boundary of at least one of the conductive structures to the display area is greater than or equal to a distance from the fourth boundary to the display area.

20. A display device, characterized in that: A display panel comprising any one of claims 1-19.

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