Method for manufacturing display panel, display panel and display device

Abstract

The application relates to a display panel preparation method, a display panel and a display device. The preparation method comprises the following steps: performing first patterning treatment on an isolation material layer formed on one side of a substrate to form a first isolation opening on the isolation material layer; performing second patterning treatment on a first encapsulation material layer, a first light emitting device material layer and the isolation material layer on one side of the substrate to form a first light emitting device and a first encapsulation part arranged in the first isolation opening, and to form a second isolation opening on the isolation material layer; forming a second light emitting device material layer and a second encapsulation material layer in a stack on the side of the first encapsulation material layer away from the substrate and at the second isolation opening; and performing third patterning treatment on the second encapsulation material layer and the second light emitting device material layer to form a second light emitting device and a second encapsulation part arranged in the second isolation opening. The display panel preparation method provided by the application can save production capacity.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, in particular to a preparation method of display panel, display panel and display device. BACKGROUND

[0002] Organic Light Emitting Diode (OLED) display panel is widely used due to its light and thin, active light-emitting, fast response speed, wide viewing angle, rich color and high brightness, low power consumption, high and low temperature resistance and many other advantages. However, there is a problem of capacity waste in the process of preparing the display panel at present. SUMMARY

[0003] Therefore, it is necessary to provide a preparation method of display panel, display panel and display device aiming at the above technical problems.

[0004] In a first aspect, an embodiment of the present application provides a preparation method of display panel, which comprises:

[0005] forming an isolation material layer on one side of the substrate, and performing first patterning treatment on the isolation material layer to form a first isolation opening on the isolation material layer;

[0006] forming a first light-emitting device material layer and a first encapsulation material layer in a stack on one side of the substrate, and performing second patterning treatment on the first encapsulation material layer, the first light-emitting device material layer and the isolation material layer to form a first light-emitting device and a first encapsulation part arranged in the first isolation opening, and a second isolation opening on the isolation material layer;

[0007] forming a second light-emitting device material layer and a second encapsulation material layer in a stack on the side of the first encapsulation material layer away from the substrate and at the second isolation opening, and performing third patterning treatment on the second encapsulation material layer and the second light-emitting device material layer to form a second light-emitting device and a second encapsulation part arranged in the second isolation opening.

[0008] In one of the embodiments, the substrate comprises a first region and a second region, a normal projection of the first isolation opening on the substrate is located within the range of the first region, and a normal projection of the second isolation opening on the substrate is located within the range of the second region; the second patterning treatment on the first encapsulation material layer, the first light-emitting device material layer and the isolation material layer to form the first light-emitting device and the first encapsulation part arranged in the first isolation opening, and the second isolation opening on the isolation material layer comprises:

[0009] removing the first encapsulation material layer on the side away from the substrate and only located in the second region to form the first encapsulation part;

[0010] removing the first encapsulation material layer and the first light emitting device material layer, which are located on the side away from the substrate and only in the second region, to form the first light emitting device arranged in the first isolation opening;

[0011] etching the isolation material layer, which is only in the second region, to form the second isolation opening on the isolation material layer;

[0012] Optionally, a dry etching process is used to remove the first encapsulation material layer, which is located on the side away from the substrate and only in the second region, to form the first encapsulation part;

[0013] Optionally, a wet etching process is used to remove the first light emitting device material layer, which is located on the side away from the substrate and only in the second region, to form the first light emitting device arranged in the first isolation opening;

[0014] Optionally, the dry etching process and the wet etching process are used to etch the isolation material layer, which is only in the second region, to form the second isolation opening on the isolation material layer;

[0015] Optionally, the second encapsulation material layer and the second light emitting device material layer are subjected to a third patterning process to form the second light emitting device and the second encapsulation part arranged in the second isolation opening, including:

[0016] removing the second encapsulation material layer and the second light emitting device material layer, which are located on the side away from the substrate and only in the second region, to form the second light emitting device and the second encapsulation part arranged in the second isolation opening;

[0017] Optionally, the first light emitting device material layer includes a first light emitting functional material layer and a first electrode material layer stacked together, the first light emitting device includes a first light emitting functional part formed by the first light emitting functional material layer and a first electrode formed by the first electrode material layer, and the second light emitting device material layer includes a second light emitting functional material layer and a second electrode material layer, the second light emitting device includes a second light emitting functional part formed by the second light emitting functional material layer and a second electrode formed by the second electrode material layer.

[0018] In one of the embodiments, the second patterning process is performed on the first encapsulation material layer, the first light emitting device material layer and the isolation material layer to form the first light emitting device and the first encapsulation part arranged in the first isolation opening and the second isolation opening on the isolation material layer, including:

[0019] The second patterning process is performed on the first encapsulation material layer, the first light emitting device material layer and the isolation material layer to form the first light emitting device, the first encapsulation part, a first covering part connected to the first light emitting device and the first encapsulation part, and the second isolation opening on the isolation material layer;

[0020] The first covering portion includes a first sub-covering portion arranged on the side of the first isolation structure away from the substrate between the first isolation opening and the second isolation opening, and a second sub-covering portion arranged on the sidewall of the first isolation structure corresponding to the first encapsulation portion;

[0021] Optionally, the first covering portion includes a redundant device material layer located in the first light-emitting device material layer and a first encapsulation sub-portion connected with the first encapsulation portion.

[0022] Optionally, the second encapsulation material layer and the second light-emitting device material layer are subjected to third patterning processing to form the second light-emitting device and the second encapsulation portion arranged in the second isolation opening, including:

[0023] The second encapsulation material layer and the second light-emitting device material layer are subjected to third patterning processing to form the second light-emitting device and the second encapsulation portion, and a second covering portion connected with the second light-emitting device and the second encapsulation portion.

[0024] The second covering portion includes a third sub-covering portion arranged on the side of the first isolation structure away from the substrate, and a fourth sub-covering portion arranged on the sidewall of the first isolation structure corresponding to the second isolation opening.

[0025] Optionally, the second covering portion includes a redundant device material layer located in the second light-emitting device material layer and a second encapsulation sub-portion connected with the second encapsulation portion.

[0026] Optionally, along the thickness direction of the substrate, the distance between the first sub-covering portion and the substrate is smaller than the distance between the third sub-covering portion and the substrate.

[0027] Optionally, the third sub-covering portion is located on the side of the part of the first sub-covering portion away from the substrate.

[0028] In one of the embodiments, the preparation method further includes:

[0029] The first encapsulation material layer, the first light-emitting device material layer and the isolation material layer are subjected to fourth patterning processing to form a third isolation opening on the isolation material layer.

[0030] A third light-emitting device material layer and a third encapsulation material layer are formed on one side of the substrate in a stacked manner.

[0031] The third encapsulation material layer and the third light-emitting device material layer are subjected to fifth patterning processing to form a third light-emitting device and a third encapsulation portion arranged in the third isolation opening.

[0032] Optionally, the third light-emitting device material layer includes a third light-emitting functional material layer and a third electrode material layer in a stacked manner, and the third light-emitting device includes a third light-emitting functional portion and a third electrode.

[0033] In one of the embodiments, the substrate comprises a third region, a third isolation opening has a projection on the substrate within the third region; the fourth patterning process is performed on the first encapsulation material layer, the first light emitting device material layer and the isolation material layer to form a third isolation opening on the isolation material layer, comprising:

[0034] removing the first encapsulation material layer away from the substrate and only in the third region;

[0035] removing the first light emitting device material layer away from the substrate and only in the third region;

[0036] etching the isolation material layer only in the third region to form a third isolation opening on the isolation material layer;

[0037] Optionally, the first encapsulation material layer away from the substrate and only in the third region is removed by a dry etching process;

[0038] Optionally, the second light emitting device material layer away from the substrate and only in the third region is removed by a wet etching process;

[0039] Optionally, the isolation material layer only in the third region is etched by a dry etching process and a wet etching process to form a third isolation opening on the isolation material layer;

[0040] Optionally, the fifth patterning process is performed on the third encapsulation material layer and the third light emitting device material layer to form a third light emitting device and a third encapsulation part in the third isolation opening, comprising:

[0041] removing the third encapsulation material layer and the third light emitting device material layer away from the substrate and except in the third region to form the third light emitting device and the third encapsulation part.

[0042] In one of the embodiments, the fourth patterning process is performed on the first encapsulation material layer, the first light emitting device material layer and the isolation material layer to form a third isolation opening on the isolation material layer, comprising:

[0043] the fourth patterning process is performed on the first encapsulation material layer, the first light emitting device material layer and the isolation material layer to form a third covering part and a third isolation opening on the isolation material layer;

[0044] the third covering part comprises a fifth sub-covering part of the second isolation structure away from the substrate between the second isolation opening and the third isolation opening, and a sixth sub-covering part of the side wall of the second isolation structure corresponding to the second isolation opening;

[0045] Optionally, the third covering portion includes a redundant device material layer located at the first light-emitting device material layer, a redundant device material layer located at the second light-emitting device material layer, and a redundant packaging material layer located at the first packaging material layer, and a third packaging sub-portion connected with the second packaging portion;

[0046] Optionally, the third packaging material layer and the third light-emitting device material layer are subjected to the fifth patterning process to form the third light-emitting device and the third packaging portion arranged at the third isolation opening, including:

[0047] The third packaging material layer and the third light-emitting device material layer are subjected to the fifth patterning process to form the third light-emitting device and the third packaging portion, and a fourth covering portion connected with the third light-emitting device and the third packaging portion;

[0048] The fourth covering portion includes a seventh sub-covering portion arranged at the side of the second isolation structure away from the substrate, and an eighth sub-covering portion arranged at the sidewall of the second isolation structure corresponding to the third isolation opening;

[0049] The fourth covering portion includes a redundant device material layer located at the third light-emitting device material layer, and a fourth packaging sub-portion connected with the third packaging portion;

[0050] Optionally, along the thickness direction of the substrate, the distance between the fifth sub-covering portion and the substrate is less than the distance between the seventh sub-covering portion and the substrate;

[0051] Optionally, the seventh sub-covering portion is located at the side of the part of the fifth sub-covering portion away from the substrate.

[0052] In one of the embodiments, a isolation material layer is formed at one side of the substrate, and the isolation material layer is subjected to the first patterning process to form a first isolation opening on the isolation material layer, including:

[0053] A pixel defining material layer and an isolation structure material layer are formed at one side of the substrate in a stacked manner;

[0054] The isolation structure material layer and the pixel defining material layer are subjected to the first patterning process to form a first isolation structure opening on the isolation structure material layer, and a first pixel opening on the pixel defining material layer; the orthographic projection of the first pixel opening on the substrate is located within the orthographic projection of the first isolation structure opening on the substrate;

[0055] The first isolation structure opening includes a first isolation sub-opening, a second isolation sub-opening, and a third isolation sub-opening, the second isolation sub-opening is located between the first isolation sub-opening and the third isolation sub-opening, the orthographic projection of the first isolation sub-opening on the substrate is located within the orthographic projection of the second isolation sub-opening on the substrate, and the orthographic projection of the third isolation sub-opening on the substrate is located within the orthographic projection of the second isolation sub-opening on the substrate;

[0056] Optionally, the first encapsulation material layer, the first light emitting device material layer and the isolation material layer are subjected to a second patterning process to form the first light emitting device and the first encapsulation portion arranged in the first isolation opening, and to form a second isolation opening on the isolation material layer, comprising:

[0057] The first encapsulation material layer, the first light emitting device material layer, the isolation structure material layer and the pixel defining material layer are subjected to a second patterning process to form the first light emitting device and the first encapsulation portion arranged in the first isolation structure opening and the first pixel opening, and to form a second isolation structure opening on the isolation structure material layer and a second pixel opening on the pixel defining material layer; a normal projection of the second pixel opening on the substrate is located within a normal projection of the second isolation structure opening on the substrate.

[0058] In one of the embodiments, the preparation method further comprises:

[0059] A plurality of fourth electrodes are formed on one side of the substrate, and the plurality of fourth electrodes are respectively arranged on the side of the first light emitting device close to the substrate and the side of the second light emitting device close to the substrate.

[0060] In a second aspect, one of the embodiments of the present application provides a display panel, comprising:

[0061] A substrate;

[0062] An isolation layer arranged on one side of the substrate, comprising a first isolation opening, a second isolation opening and a first isolation structure between the first isolation opening and the second isolation opening;

[0063] A light emitting device, comprising a first light emitting device arranged in the first isolation opening and a second light emitting device arranged in the second isolation opening;

[0064] An encapsulation layer, comprising a first encapsulation portion arranged on the side of the first light emitting device away from the substrate and a second encapsulation portion arranged on the side of the second light emitting device away from the substrate;

[0065] A covering portion, comprising a first covering portion connected with the first light emitting device and the first encapsulation portion, and a second covering portion connected with the second light emitting device and the second encapsulation portion;

[0066] The first covering portion comprises a first sub-covering portion arranged on the side of the first isolation structure away from the substrate, and a second sub-covering portion arranged on the side wall of the first isolation structure corresponding to the first isolation opening; and the second covering portion comprises a third sub-covering portion arranged on the side of the first isolation structure away from the substrate, and a fourth sub-covering portion arranged on the side wall of the first isolation structure corresponding to the second isolation opening.

[0067] In the thickness direction of the substrate, the distance between the first sub-covering portion and the substrate is smaller than the distance between the third sub-covering portion and the substrate.

[0068] In one of the embodiments, the first covering part includes a redundant device material layer located at the first light-emitting device material layer and a first packaging sub-part connected with the first packaging part;

[0069] The second covering part includes a redundant device material layer located at the second light-emitting device material layer and a second packaging sub-part connected with the second packaging part;

[0070] Optionally, the third sub-covering part is located at a side of the partial first sub-covering part away from the substrate;

[0071] Optionally, the first light-emitting device includes a first light-emitting functional part and a first electrode, and the second light-emitting device includes a second light-emitting functional part and a second electrode.

[0072] In one of the embodiments, the isolation layer includes a pixel defining layer and an isolation structure layer, the pixel defining layer is located at a side of the substrate, and the isolation structure layer is located at a side of the pixel defining layer away from the substrate;

[0073] The pixel defining layer is provided with a first pixel opening and a second pixel opening, and the isolation structure layer is provided with a first isolation structure opening and a second isolation structure opening; a normal projection of the first pixel opening on the substrate is located within a normal projection of the first isolation structure opening on the substrate, and a normal projection of the second pixel opening on the substrate is located within a normal projection of the second isolation structure opening on the substrate;

[0074] Optionally, the first isolation structure opening includes a first isolation sub-opening, a second isolation sub-opening and a third isolation sub-opening, the second isolation sub-opening is located between the first isolation sub-opening and the third isolation sub-opening, a normal projection of the first isolation sub-opening on the substrate is located within a normal projection of the second isolation sub-opening on the substrate, and a normal projection of the third isolation sub-opening on the substrate is located within a normal projection of the second isolation sub-opening on the substrate;

[0075] Optionally, the second isolation structure opening includes a fourth isolation sub-opening, a fifth isolation sub-opening and a sixth isolation sub-opening, the fifth isolation sub-opening is located between the fourth isolation sub-opening and the sixth isolation sub-opening, a normal projection of the fourth isolation sub-opening on the substrate is located within a normal projection of the fifth isolation sub-opening on the substrate, and a normal projection of the sixth isolation sub-opening on the substrate is located within a normal projection of the fifth isolation sub-opening on the substrate.

[0076] In one of the embodiments, the isolation layer further includes a third isolation opening, and a second isolation structure is included between the second isolation opening and the third isolation opening;

[0077] The light-emitting device further includes a third light-emitting device located at the third isolation opening;

[0078] Optionally, the packaging layer further includes a third packaging part located at a side of the third light-emitting device away from the substrate;

[0079] Optionally, the pixel defining layer is further provided with a third pixel opening, and the isolation structure layer is further provided with a third isolation structure opening, a normal projection of the third pixel opening on the substrate is located within a normal projection of the third isolation structure opening on the substrate.

[0080] Optionally, the third isolation structure opening comprises a seventh isolation sub-opening, an eighth isolation sub-opening and a ninth isolation sub-opening, the eighth isolation sub-opening is located between the seventh isolation sub-opening and the ninth isolation sub-opening, a normal projection of the seventh isolation sub-opening on the substrate is located within a normal projection of the eighth isolation sub-opening on the substrate, and a normal projection of the ninth isolation sub-opening on the substrate is located within a normal projection of the eighth isolation sub-opening on the substrate.

[0081] In one of the embodiments, the covering part further comprises a third covering part and a fourth covering part connected with the third light emitting device and the third packaging part.

[0082] The third covering part comprises a fifth sub-covering part arranged on a side of the second isolation structure away from the substrate, and a sixth sub-covering part arranged on a sidewall of the second isolation structure corresponding to the second isolation opening.

[0083] The fourth covering part comprises a seventh sub-covering part arranged on a side of the second isolation structure away from the substrate, and an eighth sub-covering part arranged on a sidewall of the second isolation structure corresponding to the third isolation opening.

[0084] Optionally, the third covering part comprises a redundant device material layer located in the first light emitting device material layer, a redundant device material layer located in the second light emitting device material layer, a redundant packaging material layer located in the first packaging material layer, and a third packaging sub-part connected with the second packaging part.

[0085] Optionally, the fourth covering part comprises a redundant device material layer located in the third light emitting device material layer, and a fourth packaging sub-part connected with the third packaging part.

[0086] Optionally, along the thickness direction of the substrate, the distance between the fifth sub-covering part and the substrate is smaller than the distance between the seventh sub-covering part and the substrate.

[0087] Optionally, the seventh sub-covering part is located on a side of the fifth sub-covering part away from the substrate.

[0088] In one of the embodiments, the display panel further comprises:

[0089] A plurality of fourth electrodes are arranged on a side of the first light emitting device close to the substrate and a side of the second light emitting device close to the substrate.

[0090] In a third aspect, an embodiment of the present application further provides a display device comprising the display panel provided in the second aspect.

[0091] The embodiment of the present application provides a display panel preparation method, a display panel and a display device. The preparation method comprises the following steps: forming an isolation material layer on one side of a substrate, and performing first patterning treatment on the isolation material layer to form a first isolation opening on the isolation material layer; forming a first light-emitting device material layer and a first encapsulation material layer in a stack on one side of the substrate, and performing second patterning treatment on the first encapsulation material layer, the first light-emitting device material layer and the isolation material layer to form a first light-emitting device and a first encapsulation part arranged in the first isolation opening, and a second isolation opening on the isolation material layer; and forming a second light-emitting device material layer and a second encapsulation material layer in a stack on the side of the first encapsulation material layer away from the substrate and at the second isolation opening, and performing third patterning treatment on the second encapsulation material layer and the second light-emitting device material layer to form a second light-emitting device and a second encapsulation part arranged in the second isolation opening. In the present application, after the first light-emitting device material layer and the first encapsulation material layer are formed on one side of the substrate, the first encapsulation material layer, the first light-emitting device material layer and the isolation material layer are directly subjected to the second patterning treatment to form the first light-emitting device and the first encapsulation part arranged in the first isolation opening, and the second isolation opening on the isolation material layer, so that the process of removing the first light-emitting device material layer and the first encapsulation material layer located outside the area where the first isolation opening is arranged can be reduced, the mask plate can be reduced, and the production capacity can be saved. In the process of preparing the second light-emitting device, the first encapsulation material layer and the first light-emitting device material layer can protect the isolation material layer, reduce the invasion risk of the liquid medicine in the subsequent preparation process, and thus the display effect of the prepared display panel can be improved. BRIEF DESCRIPTION OF DRAWINGS

[0092] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed to be used in the embodiments or the prior art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor on the basis of these drawings.

[0093] Figure 1 The step flowchart of the display panel preparation method provided for an embodiment is shown in the figure;

[0094] Figure 2 The step flowchart of the display panel preparation method provided for another embodiment is shown in the figure;

[0095] Figure 3 The step flowchart of the display panel preparation method provided for another embodiment is shown in the figure;

[0096] Figure 4 The step flowchart of the display panel preparation method provided for another embodiment is shown in the figure;

[0097] Figure 5 A step flow chart of a method for manufacturing a display panel is provided for another embodiment;

[0098] Figure 6 A step flow chart of a method for manufacturing a display panel is provided for another embodiment;

[0099] Figures 7-14 A cross-sectional structure of a display panel is provided for Figure 6 A cross-sectional structure of a display panel is provided for

[0100] Figure 15 A cross-sectional structure of a display panel is provided for an embodiment;

[0101] Figure 16 A cross-sectional structure of a display panel is provided for another embodiment;

[0102] Figure 17 A cross-sectional structure of a display panel is provided for another embodiment;

[0103] Figure 18 A planar distribution of a display panel is provided for an embodiment.

[0104] 1, pixel defining material layer; 2, isolation structure material layer; 3, first light emitting device material layer; 4, first encapsulation material layer; 5, second light emitting device material layer; 6, second encapsulation material layer; 7, third light emitting device material layer; 8, third encapsulation material layer; 10, display panel; 11, substrate; 12, isolation layer; 121, first isolation opening; 122, second isolation opening; 123, first isolation structure; 124, isolation structure layer; 1241, first isolation structure opening; 1241a, first isolation sub-opening; 1241b, second isolation sub-opening; 1241c, third isolation sub-opening; 1242, second isolation structure opening; 1242a, fourth isolation sub-opening; 1242b, fifth isolation sub-opening; 1242c, sixth isolation sub-opening; 1243, third isolation structure opening; 1243a, seventh isolation sub-opening; 1243b, eighth isolation sub-opening; 1243c, seventh isolation sub-opening; 125, pixel defining layer; 1251, first pixel opening; 1252, second pixel opening; 1253, third pixel opening; 126, third isolation opening; 127, second isolation structure; 13, light emitting device; 131, first light emitting device; 1311, first light emitting functional part; 1312, first electrode; 132, second light emitting device; 1321, second light emitting functional part; 1322, second electrode; 133, third light emitting device; 1331, third light emitting functional part; 1332, third electrode; 14, encapsulation layer; 141, first encapsulation part; 142, second encapsulation part; 143, third encapsulation part; 15, cover layer; 151, first cover part; 1511, first sub-cover part; 1512, second sub-cover part; 152, second cover part; 1521, third sub-cover part; 1522, fourth sub-cover part; 153, third cover part; 1531, fifth sub-cover part; 1532, sixth sub-cover part; 154, fourth cover part; 1541, seventh sub-cover part; 1542, eighth sub-cover part; 16, fourth electrode. DETAILED DESCRIPTION

[0105] For the purposes of this application, a more complete description of the application will be presented in the following with reference to the relevant drawings. The preferred embodiments of the application are shown in the drawings. However, the application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided to make the disclosure of the application more thorough and comprehensive.

[0106] It should be understood that, although the terms "first", "second", etc. can be used herein to describe various elements, they are not intended to denote any order, quantity, or importance, but are merely used to distinguish one element from another. For example, a first element can be termed a second element, and, similarly, a second element can be termed a first element, without departing from the scope of the present application. The terms "comprises" or "comprising", and similar terms as used herein specify the presence of stated elements or integers but do not preclude the presence or addition of one or more other elements or integers. The term "consisting of" or "consisting" as used herein specifies the presence of stated elements or integers and precludes additional elements or integers.

[0107] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description herein is for describing particular embodiments only and is not intended to be limiting of the application. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0108] Further, in the specification, the phrase "plan view schematic diagram" refers to a drawing when the target portion is viewed from above, and the phrase "cross-sectional schematic diagram" or "cross-sectional structure schematic diagram" refers to a drawing when a section is taken by cutting the target portion vertically and viewed from the side.

[0109] Further, the drawings are not drawn to scale 1:1, and the relative sizes of the elements are only drawn by way of example in the drawings, and are not necessarily drawn according to the true scale.

[0110] An organic light emitting diode (OLED) display panel is widely used due to its lightness, active light emission, fast response speed, wide viewing angle, rich color and high brightness, low power consumption, high and low temperature resistance, and many other advantages.

[0111] In the prior art, when preparing light emitting devices of each color in a display panel, a separate opening scheme is adopted to reduce the loss of light emitting devices prepared later to light emitting devices prepared earlier, which is beneficial to dark spot improvement. However, after the first light emitting device is evaporated, the related process of the second light emitting device needs to be performed, and after the second light emitting device is evaporated, the related process of the third light emitting device needs to be performed, so that more mask plates are required, which will cause waste of production capacity, and the subsequent process will increase the risk of dark spots.

[0112] Therefore, the application provides a display panel preparation method, a display panel and a display device. The preparation method comprises the following steps: forming an isolation material layer on one side of a substrate, and performing first patterning treatment on the isolation material layer to form a first isolation opening on the isolation material layer; forming a first light-emitting device material layer and a first encapsulation material layer in a stack on one side of the substrate, and performing second patterning treatment on the first encapsulation material layer, the first light-emitting device material layer and the isolation material layer to form a first light-emitting device and a first encapsulation part arranged in the first isolation opening, and a second isolation opening on the isolation material layer; and forming a second light-emitting device material layer and a second encapsulation material layer in a stack on the side of the first encapsulation material layer away from the substrate and at the second isolation opening, and performing third patterning treatment on the second encapsulation material layer and the second light-emitting device material layer to form a second light-emitting device and a second encapsulation part arranged in the second isolation opening.

[0113] In the application, after the first light-emitting device material layer and the first encapsulation material layer are formed on one side of the substrate, the second patterning treatment is directly performed on the first encapsulation material layer, the first light-emitting device material layer and the isolation material layer to form the first light-emitting device and the first encapsulation part arranged in the first isolation opening, and the second isolation opening on the isolation material layer. In this way, the process of removing the first light-emitting device material layer and the first encapsulation material layer located outside the area where the first isolation opening is arranged can be reduced, the mask plate can be reduced, and the production capacity can be saved. In addition, in the process of preparing the second light-emitting device, the first encapsulation material layer and the first light-emitting device material layer can protect the isolation material layer, reduce the risk of invasion of the liquid medicine in the subsequent preparation process, and thus the display effect of the prepared display panel can be improved.

[0114] The composition and preparation of the isolation structure mentioned below are further described in CN118251982A, 202410864269.8, PCT / CN2024 / 098407, PCT / CN2024 / 102783, PCT / CN2024 / 098217, PCT / CN2024 / 099419, PCT / CN2024 / 099072, CN117979755A, CN117998900A, CN117062489A, CN117580403A, CN116583155A, CN116669477A, CN117396039A, CN116669480A, CN116600606A, CN117500332A, and the like, for reference.

[0115] Please refer to Figure 1 The application provides a display panel preparation method, and the specific steps of the preparation method comprise the following steps:

[0116] In step 100, an isolation material layer is formed on one side of the substrate, and a first patterning process is performed on the isolation material layer to form a first isolation opening on the isolation material layer.

[0117] A substrate is provided, which can be a substrate made of inorganic material, a substrate made of organic material, or a composite substrate made by stacking a substrate made of inorganic material and a substrate made of organic material. The isolation material layer can include multiple layers of isolation material, and the material of the isolation material layer can be an organic insulating material or a metal. The present embodiment does not limit the number of layers and the material of the substrate and the isolation material layer, as long as the functions thereof can be achieved.

[0118] The isolation material layer is formed by full-area evaporation on one side of the substrate, a first mask plate is formed on the side of the isolation material layer away from the substrate, and a first patterning process is performed on the isolation material layer based on the first mask plate to form a first isolation opening on the isolation material layer.

[0119] In step 101, a first light emitting device material layer and a first encapsulation material layer are formed on one side of the substrate in a stacked manner, and a second patterning process is performed on the first encapsulation material layer, the first light emitting device material layer, and the isolation material layer to form a first light emitting device and a first encapsulation portion arranged in the first isolation opening, and to form a second isolation opening on the isolation material layer.

[0120] The first light emitting device material layer can include multiple layers of light emitting material, and the present embodiment does not limit the specific structure of the first light emitting device material layer, as long as it can emit light of the first color of the display panel.

[0121] After the first isolation opening is formed on the isolation material layer, the first light emitting device material layer is first formed on one side of the substrate, and then the first encapsulation material layer is formed on the side of the first light emitting device material layer away from the substrate. It can be understood that the first light emitting device material layer and the first encapsulation material layer are formed on the side of the isolation material layer away from the substrate and in the first isolation opening, and they are in communication with each other.

[0122] After the first light emitting device material layer and the first encapsulation material layer are formed on one side of the substrate, a second patterning process is performed on the first encapsulation material layer, the first light emitting device material layer, and the isolation material layer to form a first light emitting device arranged in the first isolation opening and a first encapsulation portion on the side of the first light emitting device away from the substrate, and an isolation layer can be formed, which has a second isolation opening arranged thereon. That is, a second mask plate is formed on the side of the first encapsulation material layer away from the substrate, and a second patterning process is performed on the first encapsulation material layer, the first light emitting device material layer, and the isolation material layer based on the second mask plate to form the first light emitting device, the first encapsulation portion, and the second isolation opening.

[0123] It can be understood that the isolation layer formed includes the first isolation opening and the second isolation opening, the first isolation structure is arranged between the first isolation opening and the second isolation opening, and the first light emitting device and the first packaging portion are arranged in the first isolation opening in a stacked manner.

[0124] In step 102, the second light emitting device material layer and the second packaging material layer are formed at the side of the first packaging material layer away from the substrate and the second isolation opening, and the second packaging material layer and the second light emitting device material layer are subjected to third patterning processing to form the second light emitting device and the second packaging portion arranged at the second isolation opening.

[0125] The second light emitting device material layer can include multiple layers of light emitting materials, and the specific structure of the second light emitting device material layer is not limited in the embodiment, as long as the second light emitting device material layer can emit light of the second color of the display panel.

[0126] After the second isolation opening is formed on the isolation material layer, the second light emitting device material layer is directly vapor-deposited on the side of the substrate, and then the second packaging material layer is formed on the side of the second light emitting device material layer away from the substrate. It can be understood that after the second isolation opening is formed on the isolation material layer, the side of the substrate includes the first packaging portion, the first packaging material layer, and the second isolation opening, and then the second light emitting device material layer and the second packaging material layer are formed on the side of the first packaging portion away from the substrate, the side of the first packaging material layer away from the substrate, and the second isolation opening.

[0127] After the second light emitting device material layer and the second packaging material layer are formed on the side of the substrate, a third mask plate is formed on the side of the second packaging material layer away from the substrate, and the second packaging material layer and the second light emitting device material layer are subjected to third patterning processing based on the third mask plate to form the second light emitting device and the second packaging portion.

[0128] It can be understood that the second isolation opening is arranged with the second light emitting device and the second packaging portion in a stacked manner. The structure and material of the second packaging material layer can be the same as or different from the structure and material of the first packaging material layer.

[0129] The preparation method of the display panel provided in the embodiments of the present application is characterized in that, after the first light-emitting device material layer and the first encapsulation material layer are formed on one side of the substrate, the second patterning process is directly performed on the first encapsulation material layer, the first light-emitting device material layer and the isolation material layer to form the first light-emitting device and the first encapsulation part arranged at the first isolation opening, and the second isolation opening is formed on the isolation material layer, so that the process of removing the first light-emitting device material layer and the first encapsulation material layer located outside the area where the first isolation opening is located can be reduced, the mask plate can be reduced, and the production capacity can be saved. Moreover, in the process of preparing the second light-emitting device, the first encapsulation material layer and the first light-emitting device material layer can protect the isolation material layer, reduce the invasion risk of the liquid medicine in the subsequent preparation process, and thus the display effect of the prepared display panel can be improved.

[0130] In one embodiment, the substrate includes a first region and a second region, and a normal projection of the first isolation opening on the substrate is located within the range of the first region, and a normal projection of the second isolation opening on the substrate is located within the range of the second region.

[0131] As shown in Figure 2 , one implementation mode related to the second patterning process performed on the first encapsulation material layer, the first light-emitting device material layer and the isolation material layer to form the first light-emitting device and the first encapsulation part arranged at the first isolation opening, and the second isolation opening formed on the isolation material layer, the steps of the implementation mode include:

[0132] Step 200: removing the first encapsulation material layer located on the side away from the substrate and only in the second region to form the first encapsulation part.

[0133] The second region refers to the area on the substrate where the second isolation opening needs to be arranged. The first encapsulation material layer located in the second region in the first encapsulation material layer formed on the side away from the substrate of the first light-emitting device material layer is removed, and the first encapsulation part can be formed.

[0134] In one optional embodiment, the dry etching process is used to remove the first encapsulation material layer located on the side away from the substrate and in the second region to form the first encapsulation part.

[0135] Step 201: removing the first light-emitting device material layer located on the side away from the substrate and only in the second region to form the first light-emitting device arranged at the first isolation opening.

[0136] After the first encapsulation material layer located in the second region is removed, the first light-emitting device material layer located in the second region is exposed. The first light-emitting device material layer located in the second region in the first light-emitting device material layer formed on the side away from the substrate of the isolation material layer is removed, that is, the exposed first light-emitting device material layer located in the second region is removed, and the first light-emitting device is formed at the first isolation opening.

[0137] In an optional embodiment, a wet etching process is used to remove the first light emitting device material layer on the side facing away from the substrate and only in the second region, to form the first light emitting device arranged in the first isolation opening.

[0138] In step 202, the isolation material layer in the second region is etched to form a second isolation opening on the isolation material layer.

[0139] After the first light emitting device material layer in the second region is removed, the isolation material layer in the second region is etched to form an isolation layer including the second isolation opening.

[0140] In an optional embodiment, a dry etching process and a wet etching process are used to etch the isolation material layer in the second region to form the second isolation opening on the isolation material layer.

[0141] In an optional embodiment, the first light emitting device material layer includes a first light emitting functional material layer and a first electrode material layer stacked, the first light emitting device includes a first light emitting functional part formed by the first light emitting device material layer and a first electrode formed by the first electrode material layer, and the first light emitting functional part includes one or more of a hole injection layer, a hole transport layer, a hole blocking layer, an electron transport layer, and an electron injection layer stacked. The first electrode is a cathode.

[0142] In the above embodiment, after the first light emitting device material layer and the first encapsulation material layer are formed on the side of the substrate, the second isolation opening is directly formed in the second region. Thus, the removal operation of the first encapsulation material layer and the first light emitting device material layer in the region other than the first region does not need to use a mask plate, which can reduce the mask plate and save production capacity. Moreover, the first encapsulation material layer and the first light emitting device material layer can protect the isolation material layer, reduce the risk of invasion of the liquid medicine in the subsequent preparation process, and thus improve the display effect of the prepared display panel.

[0143] In an embodiment, an implementation of the third patterning process on the second encapsulation material layer and the second light emitting device material layer to form the second light emitting device and the second encapsulation part arranged in the second isolation opening includes:

[0144] The second encapsulation material layer and the second light emitting device material layer on the side facing away from the substrate and other than in the second region are removed to form the second light emitting device and the second encapsulation part arranged in the second isolation opening.

[0145] After forming the second light-emitting device material layer and the second encapsulation material layer on one side of the substrate, the second encapsulation material layer on the side away from the substrate and in regions other than the second region is removed, i.e., only the second encapsulation material layer in the second region is retained, and then the second light-emitting device material layer on the side away from the substrate and in regions other than the second region is removed, i.e., only the second light-emitting device material layer in the second region is retained, so as to form the second light-emitting device arranged in the second isolation opening and the second encapsulation portion on the side away from the substrate of the second light-emitting device, and expose the first light-emitting device arranged in the first isolation opening.

[0146] In an optional embodiment, the second light-emitting device material layer includes a second light-emitting functional material layer and a second electrode material layer stacked together, the second light-emitting device includes a second light-emitting functional portion formed by the second light-emitting functional material layer and a second electrode formed by the second electrode material layer, and the second light-emitting functional portion includes one or more of a hole injection layer, a hole transport layer, a hole blocking layer, an electron transport layer, and an electron injection layer stacked together. The second electrode is a cathode.

[0147] In an optional embodiment, a dry etching process is used to remove the second encapsulation material layer on the side away from the substrate and in regions other than the second region.

[0148] In an optional embodiment, a wet etching process is used to remove the second light-emitting device material layer on the side away from the substrate and in regions other than the second region. Specifically, a wet etching process is used to remove the second light-emitting functional material layer and the second electrode material layer in regions other than the second region.

[0149] In an embodiment, a second patterning process is performed on the first encapsulation material layer, the first light-emitting device material layer, and the isolation material layer to form the first light-emitting device arranged in the first isolation opening and the first encapsulation portion, and the second isolation opening formed on the isolation material layer, and the implementation includes:

[0150] The second patterning process is performed on the first encapsulation material layer, the first light-emitting device material layer, and the isolation material layer to form the first light-emitting device arranged in the first isolation opening, the first encapsulation portion, and the first covering portion connected to the first light-emitting device, and the second isolation opening formed on the isolation material layer.

[0151] It can be understood that after the second patterning process is performed on the first encapsulation material layer, the first light-emitting device material layer, and the isolation material layer, not only the first light-emitting device, the first encapsulation portion, and the second isolation opening can be formed, but also the first covering portion connected to the first light-emitting device and the first encapsulation portion can be formed.

[0152] The first covering portion includes a first sub-covering portion arranged on the side of the first isolation structure away from the substrate and a second sub-covering portion arranged on the sidewall of the first isolation structure corresponding to the first isolation opening.

[0153] That is, the first covering portion extends along the sidewall of the first isolation structure close to the first isolation opening to the side of the first isolation structure away from the substrate.

[0154] In one embodiment, the first covering portion includes a redundant device material layer on the first light-emitting device material layer and a first packaging sub-portion connected to the first packaging portion.

[0155] During the second patterning process of the first packaging material layer, the first light-emitting device material layer and the isolation material layer, a part of the first light-emitting device material layer (i.e., a redundant first light-emitting device material layer on the side of the first isolation structure away from the substrate) and the first packaging sub-portion are left on the side of the first isolation structure away from the substrate, forming the first covering portion.

[0156] In the above embodiment, during the second patterning process of the first packaging material layer, the first light-emitting device material layer and the isolation material layer, not only the first light-emitting device, the first packaging portion and the second isolation opening can be formed, but also the first covering portion connected to the first light-emitting device and the first packaging portion can be formed. The first covering portion formed can protect the first isolation structure and the first light-emitting device, reduce the risk of invasion of the liquid medicine in the subsequent preparation process, thereby improving the display effect of the prepared display panel.

[0157] In one embodiment, a third patterning process is performed on the second packaging material layer and the second light-emitting device material layer to form a second light-emitting device and a second packaging portion arranged on the second isolation opening, and a second covering portion connected to the second light-emitting device and the second packaging portion.

[0158] The third patterning process is performed on the second packaging material layer and the second light-emitting device material layer to form a second light-emitting device and a second packaging portion arranged on the second isolation opening, and a second covering portion connected to the second light-emitting device and the second packaging portion.

[0159] It can be understood that after the third patterning process is performed on the second packaging material layer and the second light-emitting device material layer, not only the second light-emitting device and the second packaging portion can be formed, but also the second covering portion connected to the second light-emitting device and the second packaging portion can be formed.

[0160] The second covering portion includes a third sub-covering portion arranged on the side of the first isolation structure away from the substrate and a fourth sub-covering portion arranged on the sidewall of the first isolation structure corresponding to the second isolation opening.

[0161] That is, the second covering portion extends along the sidewall of the first isolation structure close to the second isolation opening to the side of the first isolation structure away from the substrate.

[0162] In an optional embodiment, the second covering portion includes a redundant device material layer located in the second light-emitting device material layer and a second encapsulation sub-portion connected with the second encapsulation portion.

[0163] In the third patterning process on the second encapsulation material layer and the second light-emitting device material layer, the second light-emitting device material layer (i.e., the redundant second light-emitting device material layer on the side of the first isolation structure away from the substrate) and the second encapsulation sub-portion are left on the side of the first isolation structure away from the substrate, forming the second covering portion.

[0164] In an embodiment, along the thickness direction of the substrate, the distance between the first sub-covering portion and the substrate is smaller than the distance between the third sub-covering portion and the substrate.

[0165] The first sub-covering portion includes a first side close to the substrate and a second side away from the substrate, and the third sub-covering portion includes a third side close to the substrate and a fourth side away from the substrate. Along the thickness direction of the substrate, the distance between the first side and the substrate is smaller than the distance between the third side and the substrate, and the distance between the second side and the substrate is smaller than the distance between the fourth side and the substrate.

[0166] In an embodiment, the third sub-covering portion is located on the side of the first sub-covering portion away from the substrate.

[0167] That is, the orthographic projection of the third sub-covering portion on the substrate and the orthographic projection of the first sub-covering portion on the substrate partially overlap.

[0168] In the above embodiment, after the third patterning process on the second encapsulation material layer and the second light-emitting device material layer, not only the second light-emitting device and the second encapsulation portion can be formed, but also the second covering portion connected with the second light-emitting device and the second encapsulation portion can be formed. The formed second covering portion can protect the first isolation structure and the second light-emitting device, reduce the risk of liquid invasion in the subsequent preparation process, and thus improve the display effect of the prepared display panel.

[0169] In an embodiment, three light-emitting devices can be included in the display panel, and after the first light-emitting device and the second light-emitting device are formed, the third light-emitting device can also be formed. As shown in FIG. 1C, the preparation method further includes: Figure 3

[0170] Step 300, performing a fourth patterning process on the first encapsulation material layer, the first light-emitting device material layer, and the isolation material layer to form a third isolation opening on the isolation material layer. ​

[0171] A fourth mask plate is arranged on the first encapsulation material layer, and the first encapsulation material layer, the first light-emitting device material layer and the isolation material layer are subjected to fourth patterning treatment based on the fourth mask plate, so that the third isolation opening can be formed on the isolation material layer.

[0172] It can be understood that the isolation layer formed includes the first isolation opening, the second isolation opening and the third isolation opening, the first isolation structure is arranged between the first isolation opening and the second isolation opening, and the second isolation structure is arranged between the second isolation opening and the third isolation opening.

[0173] Step 301: forming a laminated third light-emitting device material layer and a third encapsulation material layer on one side of the substrate.

[0174] The third light-emitting device material layer can include multiple layers of light-emitting materials, and the specific structure of the first light-emitting device material layer is not limited in the embodiment, as long as it can emit light of the third color of the display panel.

[0175] After the third isolation opening is formed on the isolation material layer, the third light-emitting device material layer is first deposited on the whole side of the substrate, and then the third encapsulation material layer is deposited on the whole side of the third light-emitting device material layer away from the substrate. It can be understood that the third light-emitting device material layer and the third encapsulation material layer are formed in the same communication at the first encapsulation part away from the substrate, the first covering part away from the substrate, the second covering part away from the substrate, the second encapsulation part away from the substrate and the third isolation opening. The structure and material of the third encapsulation material layer can be the same as or different from the structure and material of the first encapsulation material layer.

[0176] Step 302: performing fifth patterning treatment on the third encapsulation material layer and the third light-emitting device material layer to form a third light-emitting device and a third encapsulation part arranged at the third isolation opening.

[0177] After the third light-emitting device material layer and the third encapsulation material layer are formed on one side of the substrate, a fifth mask plate is arranged on the side of the third encapsulation material layer away from the substrate, and the third encapsulation material layer and the third light-emitting device material layer are subjected to fifth patterning treatment based on the fifth mask plate, so that the third light-emitting device and the third encapsulation part arranged at the third isolation opening can be formed.

[0178] In an optional embodiment, the third light-emitting device material layer includes a laminated third light-emitting functional material layer and a third electrode material layer, the third light-emitting device includes a third light-emitting functional part and a third electrode, and the third light-emitting functional part includes one or more of a hole injection layer, a hole transport layer, a hole blocking layer, an electron transport layer and an electron injection layer arranged in layers. The third electrode is a cathode.

[0179] In the above embodiment, the fourth patterning process is performed on the first encapsulation material layer, the first light emitting device material layer and the isolation material layer to form a third isolation opening on the isolation material layer; the third light emitting device material layer and the third encapsulation material layer are formed on one side of the substrate, and the fifth patterning process is performed on the third encapsulation material layer and the third light emitting device material layer to form the third light emitting device and the third encapsulation part arranged in the third isolation opening. The display panel prepared in this way can emit light of three different colors, and the display performance of the prepared display panel can be improved.

[0180] In one embodiment, the substrate includes a third region, and a normal projection of the third isolation opening on the substrate is located within the third region.

[0181] As shown in Figure 4 , one implementation of the fourth patterning process performed on the first encapsulation material layer, the first light emitting device material layer and the isolation material layer to form a third isolation opening on the isolation material layer includes the following steps:

[0182] Step 400: removing the first encapsulation material layer located on the side away from the substrate and only in the third region.

[0183] The third region refers to the region on the substrate where the third isolation opening needs to be arranged. The first encapsulation material layer located in the third region of the first encapsulation material layer formed on the side away from the substrate of the first light emitting device material layer is removed.

[0184] In one optional embodiment, a dry etching process is used to remove the first encapsulation material layer located on the side away from the substrate and only in the third region.

[0185] Step 401: removing the first light emitting device material layer located on the side away from the substrate and only in the third region.

[0186] After removing the first encapsulation material layer located in the third region, the first light emitting device material layer located in the third region is exposed. The first light emitting device material layer located in the third region of the third light emitting device material layer formed on the side away from the substrate of the isolation material layer is removed, i.e. the exposed first light emitting device material layer located in the third region is removed.

[0187] In one optional embodiment, a wet etching process is used to remove the first light emitting device material layer located only in the third region. Specifically, a wet etching process is used to remove the first light emitting functional material layer and the first electrode material layer located in the third region.

[0188] Step 402: etching the isolation material layer located only in the third region to form a third isolation opening on the isolation material layer.

[0189] After removing the first light emitting device material layer located in the third region, the isolation material layer located in the third region is etched to form a third isolation opening on the isolation material layer.

[0190] In an optional embodiment, a dry etching process and a wet etching process are used to remove the isolation material layer located only in the third region.

[0191] In an embodiment, the fifth patterning process on the third encapsulation material layer and the third light emitting device material layer to form the third light emitting device and the third encapsulation part located in the third isolation opening includes:

[0192] The third encapsulation material layer and the third light emitting device material layer located outside the third region are removed from the side away from the substrate to form the third light emitting device and the third encapsulation part.

[0193] After forming the third encapsulation material layer and the third light emitting device material layer on one side of the substrate, removing the third encapsulation material layer and the third light emitting device material layer formed on the other regions of the substrate except the third region (i.e., only retaining the third encapsulation material layer and the third light emitting device material layer located in the third region) can form the third light emitting device located in the third isolation opening and the third encapsulation part located on the side away from the substrate of the third light emitting device.

[0194] In an embodiment, the fourth patterning process on the first encapsulation material layer, the first light emitting device material layer and the isolation material layer to form the third isolation opening on the isolation material layer includes:

[0195] The fourth patterning process on the first encapsulation material layer, the first light emitting device material layer and the isolation material layer forms the third covering part and the third isolation opening on the isolation material layer.

[0196] It can be understood that after the fourth patterning process on the first encapsulation material layer, the first light emitting device material layer and the isolation material layer, not only the third isolation opening can be formed, but also the third covering part can be formed, and the third covering part can be connected with the second light emitting device and the second encapsulation part.

[0197] The third covering part includes a fifth sub-covering part located on the side away from the substrate of the second isolation structure between the second isolation opening and the third isolation opening, and a sixth sub-covering part located on the sidewall of the second isolation structure corresponding to the second isolation opening.

[0198] That is, the third covering part extends along the sidewall of the second isolation structure close to the second isolation opening to the side away from the substrate of the second isolation structure.

[0199] In one embodiment, the third covering portion includes a redundant device material layer located at the first light-emitting device material layer, a redundant device material layer located at the second light-emitting device material layer, and a redundant packaging material layer located at the first packaging material layer, and a third packaging sub-portion connected with the second packaging portion.

[0200] In the fourth patterning process on the first packaging material layer, the first light-emitting device material layer, and the isolation material layer, the first light-emitting device material layer, the first packaging material layer, the second light-emitting device material layer (i.e., the redundant first light-emitting device material layer, the redundant second light-emitting device material layer, and the redundant first packaging material layer are included on the side of the second isolation structure away from the substrate), and the third packaging sub-portion connected with the second packaging portion are left on the side of the second isolation structure away from the substrate.

[0201] In the above embodiment, after the fourth patterning process on the first packaging material layer, the first light-emitting device material layer, and the isolation material layer, not only the third isolation opening is formed, but also the third covering portion is formed. The third covering portion formed can include the second isolation structure and the second light-emitting device, reduce the risk of invasion of the liquid medicine in the subsequent preparation process, and thus improve the display effect of the prepared display panel.

[0202] In one embodiment, an implementation of the fifth patterning process on the third packaging material layer and the third light-emitting device material layer to form the third light-emitting device and the third packaging portion arranged at the third isolation opening includes:

[0203] The fifth patterning process is performed on the third packaging material layer and the third light-emitting device material layer to form the third light-emitting device and the third packaging portion, and a fourth covering portion connected with the third light-emitting device and the third packaging portion.

[0204] It can be understood that after the fifth patterning process on the third packaging material and the third light-emitting device material layer, not only the third light-emitting device and the third packaging portion are formed, but also the fourth covering portion connected with the third light-emitting device and the third packaging portion is formed.

[0205] The fourth covering portion includes a seventh sub-covering portion arranged on the side of the second isolation structure away from the substrate, and an eighth sub-covering portion arranged on the side wall of the second isolation structure corresponding to the third isolation opening.

[0206] That is, the fourth covering portion extends along the side wall of the second isolation structure close to the third isolation opening to the side of the second isolation structure away from the substrate.

[0207] In one optional embodiment, the fourth covering portion includes a redundant device material layer located at the third light-emitting device material layer, and a fourth packaging sub-portion connected with the third packaging portion.

[0208] In the fifth patterning process of the third encapsulation material layer and the third light emitting device material layer, the third light emitting device material layer is left on the side of the second isolation structure away from the substrate (i.e. the third light emitting device material layer is included on the side of the second isolation structure away from the substrate), and the fourth encapsulation sub-portion connected with the third encapsulation portion, forming a fourth covering portion.

[0209] In an embodiment, along the thickness direction of the substrate, the distance between the fifth sub-covering portion and the substrate is smaller than the distance between the seventh sub-covering portion and the substrate.

[0210] The fifth sub-covering portion includes a fifth side close to the substrate and a sixth side away from the substrate, and the seventh sub-covering portion includes a seventh side close to the substrate and an eighth side away from the substrate. Along the thickness direction of the substrate, the distance between the fifth side and the substrate is smaller than the distance between the seventh side and the substrate, and the distance between the sixth side and the substrate is smaller than the distance between the eighth side and the substrate.

[0211] In an embodiment, the seventh sub-covering portion is located on the side of the partial fifth sub-covering portion away from the substrate.

[0212] That is, the orthographic projection of the seventh sub-covering portion on the substrate and the orthographic projection of the fifth sub-covering portion on the substrate have an overlapping area.

[0213] In an embodiment, the isolation material layer can include a pixel defining material layer and an isolation structure material layer, in which case, as shown in Figure 5 An implementation of forming the isolation material layer on one side of the substrate and performing the first patterning process on the isolation material layer to form the first isolation structure opening on the isolation material layer includes:

[0214] Step 500, forming a stacked pixel defining material layer and isolation structure material layer on one side of the substrate.

[0215] First, deposit the pixel defining material layer on one side of the substrate, and then deposit the isolation structure material layer on the side of the pixel defining material layer away from the substrate, to form the isolation material layer on one side of the substrate.

[0216] Step 501, performing the first patterning process on the isolation structure material layer and the pixel defining material layer to form the first isolation structure opening on the isolation structure material layer and the first pixel opening on the pixel defining material layer; the orthographic projection of the first pixel opening on the substrate is located within the orthographic projection of the first isolation structure opening on the substrate.

[0217] A first mask plate is formed on a side of the isolation structure material layer away from the substrate. The isolation material layer and the pixel definition material layer are subjected to a first patterning process based on the first mask plate, so as to form a first isolation structure opening on the isolation structure material layer and a first pixel opening on the pixel definition material layer. The first isolation opening includes the first pixel opening and the first isolation structure opening.

[0218] In an optional embodiment, a photoresist can be coated on a side of the isolation structure material layer away from the substrate. A first sub-patterning process is performed on the isolation structure material layer using a first sub-mask plate, so as to form a first isolation structure opening on the isolation structure material layer. A second sub-patterning process is performed on the pixel definition material layer using a second sub-mask plate, so as to form a first pixel opening on the pixel definition material layer. In this way, the first isolation opening can be formed.

[0219] In an embodiment, the first isolation structure opening formed on the isolation structure material layer can include a first isolation sub-opening, a second isolation sub-opening, and a third isolation sub-opening. The second isolation sub-opening is located between the first isolation sub-opening and the third isolation sub-opening. That is, along the thickness direction of the display panel, the first isolation sub-opening, the second isolation sub-opening, and the third isolation sub-opening are sequentially formed on the isolation structure material layer. The orthographic projection of the first isolation sub-opening on the substrate is located within the orthographic projection of the second isolation sub-opening on the substrate, and the orthographic projection of the third isolation sub-opening on the substrate is located within the orthographic projection of the second isolation sub-opening on the substrate.

[0220] It can be understood that, along a direction perpendicular to the thickness direction of the display panel, the distance between the side walls of the isolation structure material layer on both sides of the second isolation sub-opening is greater than the distance between the side walls of the isolation structure material layer on both sides of the first isolation sub-opening, and the distance between the side walls of the isolation structure material layer on both sides of the second isolation sub-opening is greater than the distance between the side walls of the isolation structure material layer on both sides of the third isolation sub-opening.

[0221] In an optional embodiment, the orthographic projection of the first isolation sub-opening on the substrate can coincide with the orthographic projection of the third isolation sub-opening on the substrate. The orthographic projection of the third isolation sub-opening on the substrate can also be located within the orthographic projection of the first isolation sub-opening on the substrate.

[0222] In an optional embodiment, the first isolation structure material layer includes a three-layer structure material layer. The first isolation sub-opening is formed on a first structure material layer, the second isolation sub-opening is formed on a second structure material layer, and the third isolation sub-opening is formed on a third structure material layer.

[0223] In one embodiment, in the case of forming the pixel defining material layer and the isolation structure material layer on one side of the substrate, an implementation of the second patterning process on the first encapsulation material layer, the first light emitting device material layer and the isolation material layer to form the first light emitting device and the first encapsulation part arranged in the first isolation opening, and the second isolation opening formed on the isolation material layer includes:

[0224] The second patterning process is performed on the first encapsulation material layer, the first light emitting device material layer, the isolation structure material layer and the pixel defining material layer to form the first light emitting device and the first encapsulation part arranged in the first isolation structure opening and the first pixel opening, and the second isolation structure opening formed on the isolation structure material layer, and the second pixel opening formed on the pixel defining material layer; the orthographic projection of the second pixel opening on the substrate is located in the orthographic projection of the second isolation structure opening on the substrate.

[0225] After forming the first light emitting device material layer and the first encapsulation material layer on one side of the substrate, a second mask plate is arranged on the side of the first encapsulation material layer away from the substrate, and the second patterning process is performed on the first encapsulation material layer, the first light emitting device material layer, the isolation structure material layer and the pixel defining material layer based on the second mask plate, so as to form the first light emitting device and the first encapsulation part arranged in the first isolation structure opening and the first pixel opening, and the second isolation structure opening formed on the isolation structure material layer, and the second pixel opening formed on the pixel defining material layer.

[0226] The description of the second pixel opening and the second isolation structure opening can refer to the specific description of the first pixel opening and the first isolation structure opening in the above examples, which will not be described here.

[0227] It can be understood that the prepared display panel includes the pixel defining layer and the isolation structure layer, the first pixel opening and the second pixel opening are arranged on the pixel defining layer, and the first isolation structure opening and the second isolation structure opening are arranged on the isolation structure layer.

[0228] In one optional embodiment, an implementation of the second patterning process on the first encapsulation material layer, the first light emitting device material layer and the isolation material layer to form the first light emitting device and the first encapsulation part arranged in the first isolation opening, and the second isolation opening formed on the isolation material layer can include:

[0229] Removing the first encapsulation material layer on the side away from the substrate and only in the second region to form the first encapsulation part;

[0230] Removing the first light emitting device material layer on the side away from the substrate and only in the second region to form the first light emitting device arranged in the first isolation opening;

[0231] etching the isolation structure material layer only in the second region to form a second isolation structure opening on the isolation structure material layer;

[0232] etching the pixel defining material layer only in the second region to form a second pixel opening on the pixel defining material layer.

[0233] Optionally, the first encapsulation material layer only in the second region is removed by a dry etching process.

[0234] Optionally, the first light emitting device material layer only in the second region is removed by a wet etching process.

[0235] Optionally, the isolation structure material layer only in the second region is etched by a dry etching process and a wet etching process.

[0236] In an optional embodiment, after etching the isolation structure material layer only in the second region, the photoresist is stripped. The photoresist is coated on the side away from the substrate, and the pixel defining material layer in the second region is etched based on the corresponding mask plate to form a second pixel opening on the pixel defining material layer.

[0237] In the above embodiment, the isolation material layer formed on one side of the substrate includes the pixel defining material layer and the isolation structure material layer which are sequentially evaporated, the first isolation opening includes the first pixel opening and the first isolation structure opening, and the second isolation opening includes the second pixel opening and the second isolation structure opening. The arrangement of such an isolation layer can provide the display effect of the display panel.

[0238] In an optional embodiment, in the case where the isolation material layer formed on one side of the substrate includes the pixel defining material layer and the isolation structure material layer, the third isolation opening formed can include a third pixel opening and a third isolation structure opening. The description of the third pixel opening and the third isolation structure opening can refer to the specific description of the first pixel opening and the first isolation structure opening above, which will not be repeated here.

[0239] In an embodiment, the preparation method further includes:

[0240] A plurality of fourth electrodes are formed on one side of the substrate, and the plurality of fourth electrodes are respectively arranged on the side of the first light emitting device close to the substrate and the side of the second light emitting device close to the substrate.

[0241] Before forming the isolation material layer on the side of the substrate, a plurality of fourth electrodes are formed on the side of the substrate. Specifically, a fourth electrode material layer can be deposited on the side of the substrate, and the fourth electrode material layer can be subjected to corresponding patterning processing to form a plurality of fourth electrodes. The plurality of fourth electrodes are respectively arranged near the side of the substrate of the first light emitting device and the side of the substrate of the second light emitting device. That is, the fourth electrodes are arranged in the first region of the substrate, and the fourth electrodes are arranged in the second region of the substrate. The fourth electrodes are anodes.

[0242] In an optional embodiment, in the case of including the third light emitting device in the prepared display panel, the fourth electrodes are also arranged near the side of the substrate of the third light emitting device. That is, the fourth electrodes are arranged in the third region of the substrate.

[0243] It should be noted that in the preparation method of the display panel provided in the embodiments of the present application, each film layer can be made by a sputtering method, a chemical vapor deposition (CVD) method, a vacuum deposition method, a pulsed laser deposition (PLD) method, an atomic layer deposition (ALD) method, or the like. The CVD method includes plasma enhanced chemical vapor deposition (PECVD), laser chemical vapor deposition (LCVD), low pressure chemical vapor deposition (LPCVD), and the like.

[0244] In an embodiment, referring to the flowchart of Figure 6 , and combining the preparation process diagram of Figures 7-14 , the present application provides a preparation method of a display panel, and steps of the preparation method include:

[0245] In step 600, a pixel defining material layer 1 and an isolation structure material layer 2 are formed on the side of the substrate 11, the isolation structure material layer 2 and the pixel defining material layer 1 in the first region A are removed, a first isolation structure opening 1241 is formed on the isolation structure material layer 2, and a first pixel opening 1251 is formed on the pixel defining material layer 1; as shown in Figure 7 .

[0246] The display panel comprises a first area A, a second area B and a third area C, a first light emitting device 131 is arranged at a corresponding position of the first area A, a second light emitting device 132 is arranged at a corresponding position of the second area B, and a third light emitting device 133 is arranged at a corresponding position of the third area C.

[0247] In step 601, a first light emitting device material layer 3 and a first encapsulation material layer 4 are formed on one side of the substrate 11; as shown in FIG. 1A. Figure 8

[0248] In step 602, the first encapsulation material layer 4, the first light emitting device material layer 3, the isolation structure material layer 2 and the pixel defining material layer 1 located only in the second area B are removed to form a second isolation structure opening 1242 on the isolation structure material layer 2, a second pixel opening 1252 on the pixel defining material layer 1, a first light emitting device 131 and a first encapsulation part 141 arranged in the first isolation structure opening 1241 and the first pixel opening 1251, and a first covering part 151 connected to the first light emitting device 131 and the first encapsulation part 141; as shown in FIG. 1B. Figure 9

[0249] The first isolation structure 123 is arranged between the first isolation structure opening 1241 and the second isolation structure opening 1242.

[0250] In step 603, a second light emitting device material layer 5 and a second encapsulation material layer 6 are formed on one side of the substrate 11; as shown in FIG. 1C. Figure 10

[0251] In step 604, the second encapsulation material layer 6 and the second light emitting device material layer 5 except those located in the second area B are removed to form a second light emitting device 132 and a second encapsulation part 142, and a second covering part 152 connected to the second light emitting device 132 and the second encapsulation part 142; as shown in FIG. 1D. Figure 11

[0252] In step 605, the first encapsulation material layer 4, the first light emitting device material layer 3, the isolation structure material layer 2 and the pixel defining material layer 1 located only in the third area C are removed to form a third isolation structure opening 1243 on the isolation structure material layer 2, a second pixel opening 1253 on the pixel defining material layer 1, and a third covering part 153; as shown in FIG. 1E. Figure 12

[0253] The second isolation structure 127 is arranged between the second isolation structure opening 1242 and the third isolation structure opening 1243.

[0254] In step 606, a third light emitting device material layer 7 and a third encapsulation material layer 8 are formed on one side of the substrate 11; as shown in FIG. 1F. Figure 13 ​​​​​​

[0255] Step 607, removing the third encapsulation material layer 8 and the third light emitting device material layer 7 except for the third region C, to form a third light emitting device 133 and a third encapsulation part 143, and a fourth covering part 154 connected with the third light emitting device 133 and the third encapsulation part 143. As shown in Figure 14 .

[0256] It should be understood that, although each step in the flowchart in the figure is shown in sequence according to the direction of the arrow, these steps are not necessarily executed in sequence according to the direction of the arrow. Unless otherwise specified herein, the execution of these steps is not strictly limited in sequence, and these steps can be executed in other sequences. Moreover, at least a part of the steps in the figure can include multiple sub-steps or multiple stages, which are not necessarily executed at the same time, but can be executed at different times, and the execution sequence of these sub-steps or stages is not necessarily sequential, but can be executed in rotation or alternation with at least a part of other steps or sub-steps or stages of other steps.

[0257] In one embodiment, as shown in Figure 15 , the present application provides a display panel 10, which comprises:

[0258] a substrate 11;

[0259] an isolation layer 12 provided on one side of the substrate 11, provided with a first isolation opening 121 and a second isolation opening 122, and a first isolation structure 123 between the first isolation opening 121 and the second isolation opening 122;

[0260] a light emitting device 13, comprising a first light emitting device 131 provided in the first isolation opening 121 and a second light emitting device 132 provided in the second isolation opening 122;

[0261] an encapsulation layer 14, comprising a first encapsulation part 141 provided on the side of the first light emitting device 131 away from the substrate 11, and a second encapsulation part 142 provided on the side of the second light emitting device 132 away from the substrate 11;

[0262] The cover layer 15 includes a first cover portion 151 connected with the first light emitting device 131 and the first encapsulation portion 141, and a second cover portion 152 connected with the second light emitting device 132 and the second encapsulation portion 142. The first cover portion 151 includes a first sub-cover portion 1511 arranged on the side of the first isolation structure 123 away from the substrate 11, and a second sub-cover portion 1512 arranged on the sidewall of the first isolation structure 123 corresponding to the first isolation opening 121; the second cover portion 152 includes a third sub-cover portion 1521 arranged on the side of the first isolation structure 123 away from the substrate 11, and a fourth sub-cover portion 1522 arranged on the sidewall of the first isolation structure 123 corresponding to the second isolation opening 122.

[0263] In the thickness direction of the substrate 11, the distance between the first sub-cover portion 1511 and the substrate 11 is less than the distance between the third sub-cover portion 1521 and the substrate 11.

[0264] It can be understood that the display panel 10 includes the substrate 11, the isolation layer 12, the light emitting device 13, the encapsulation layer 14 and the cover layer 15. The isolation layer 12 is provided with the first isolation opening 121 and the second isolation opening 122, and the first isolation structure 123 between the first isolation opening 121 and the second isolation opening 122. The first light emitting device 131 is arranged at the first isolation opening 121, and the second light emitting device 132 is arranged at the second isolation opening 122. The first light emitting device 131 and the second light emitting device 132 can emit light of different colors.

[0265] The first sub-cover portion 1511 and the third sub-cover portion 1521 are arranged on the side of the first isolation structure 123 away from the substrate. The second sub-cover portion 1512 and the fourth sub-cover portion 1522 are arranged on the sidewall of the first isolation structure 123. The descriptions of the first sub-cover portion 1511, the second sub-cover portion 1512, the third sub-cover portion 1521 and the fourth sub-cover portion 1522 can refer to the specific descriptions in the above embodiments, which will not be repeated here.

[0266] The display panel 10 provided in the embodiment of the present application comprises a substrate 11, an isolation layer 12, a light emitting device 13, an encapsulation layer 14 and a cover layer 15. The isolation layer 12 is arranged on one side of the substrate 11 and is provided with a first isolation opening 121 and a second isolation opening 122 and a first isolation structure 123 between the first isolation opening 121 and the second isolation opening 122. The light emitting device 13 comprises a first light emitting device 131 arranged in the first isolation opening 121 and a second light emitting device 132 arranged in the second isolation opening 122. The encapsulation layer 14 comprises a first encapsulation part 141 arranged on a side of the first light emitting device 131 away from the substrate 11 and a second encapsulation part 142 arranged on a side of the second light emitting device 132 away from the substrate 11. The cover layer 15 comprises a first cover part 151 connected with the first light emitting device 131 and the first encapsulation part 141 and a second cover part 152 connected with the second light emitting device 132 and the second encapsulation part 142. In the process of preparing the display panel 10 provided in the embodiment, after the first light emitting device 131 is formed, the first light emitting device material layer in other regions on the substrate 11 except the first region is not removed, and the second light emitting device material layer is directly prepared, so that the cover layer 15 can be formed. In this way, in the process of preparing the display panel 10, the use of the mask plate can be reduced, the production capacity can be saved, and the display panel 10 has higher practicability.

[0267] In one embodiment, as shown in Figures 12-15 The first cover part 151 comprises a redundant device material layer in the first light emitting device material layer and a first encapsulation sub-part connected with the first encapsulation part 141.

[0268] The second cover part 152 comprises a redundant device material layer in the second light emitting device material layer and a second encapsulation sub-part connected with the second encapsulation part 142.

[0269] Optionally, the third sub-cover part 1521 is located on a side of the part of the first sub-cover part 1511 away from the substrate 11.

[0270] The description of the first cover part 151, the second cover part 152, the third sub-cover part 1521 and the first sub-cover part 1511 can refer to the specific description in the above embodiments, which will not be described here.

[0271] In one embodiment, as shown in Figure 16 The first light emitting device 131 comprises a first light emitting functional part 1311 and a first electrode 1312, and the second light emitting device 132 comprises a second light emitting functional part 1321 and a second electrode 1322.

[0272] The description of the first light emitting functional part 1311 and the first electrode 1312, and the second light emitting functional part 1321 and the second electrode 1322 can refer to the specific description in the above embodiments, which will not be described here.

[0273] In the above embodiments, the covering layer 15 can protect the first light-emitting device 131, the second light-emitting device 132 and the first isolation structure 123, thereby improving the service life and display effect of the display panel 10.

[0274] In one embodiment, such as Figures 7-16 As shown, the isolation layer 12 includes an isolation structure layer 124 and a pixel defining layer 125. The pixel defining layer 125 is disposed on one side of the substrate 11, and the isolation structure layer 124 is disposed on the side of the pixel defining layer 125 away from the substrate 11.

[0275] The pixel defining layer 125 has a first pixel opening 1251 and a second pixel opening 1252, and the isolation structure layer 124 has a first isolation structure opening 1241 and a second isolation structure opening 1242. That is, when the isolation layer 12 includes the isolation structure layer 124 and the pixel defining layer 125, the first isolation opening 121 in the isolation layer 12 includes the first isolation structure opening 1241 and the first pixel opening 1251, and the second isolation opening 122 includes the second isolation structure opening 1242 and the second pixel opening 1252.

[0276] Wherein, the orthographic projection of the first pixel opening 1251 on the substrate 11 is located within the orthographic projection of the first isolation structure opening 1241 on the substrate 11, and the orthographic projection of the second pixel opening 1252 on the substrate 11 is located within the orthographic projection of the second isolation structure opening 1242 on the substrate 11.

[0277] The descriptions of the first pixel opening 1251, the second pixel opening 1252, the first isolation structure opening 1241, and the second isolation structure opening 1242 can be found in the specific descriptions in the above embodiments, and will not be repeated here.

[0278] In an optional embodiment, such as Figures 7-17 As shown, for the first isolation structure opening 1241 in the isolation structure layer 124, the first isolation structure opening 1241 includes a first insulator opening 1241a, a second insulator opening 1241b, and a third insulator opening 1241c. The orthographic projection of the first insulator opening 1241a on the substrate 11 lies within the orthographic projection of the second insulator opening 1241b on the substrate 11, and the orthographic projection of the third insulator opening 1241c on the substrate 11 lies within the orthographic projection of the second insulator opening 1241b on the substrate 11.

[0279] It can be understood that, along the thickness direction of the display panel 10, the first isolation structure opening 1241 includes the first isolation sub-opening 1241a, the second isolation sub-opening 1241b and the third isolation sub-opening 1241c which are sequentially stacked, that is, the second isolation sub-opening 1241b is located between the first isolation sub-opening 1241a and the third isolation sub-opening 1241c. The distance between the side walls on both sides of the isolation structure layer 124 corresponding to the second isolation sub-opening 1241b is greater than the distance between the side walls on both sides of the isolation structure layer 124 corresponding to the first isolation sub-opening 1241a, and the distance between the side walls on both sides of the isolation structure layer 124 corresponding to the third isolation sub-opening 1241c is greater than the distance between the side walls on both sides of the isolation structure layer 124 corresponding to the first isolation sub-opening 1241a.

[0280] In an optional embodiment, the distance between the side walls on both sides of the isolation structure layer 124 corresponding to the first isolation sub-opening 1241a can be equal to the distance between the side walls on both sides of the isolation structure layer 124 corresponding to the third isolation sub-opening 1241c, or can be greater than the distance between the side walls on both sides of the isolation structure layer 124 corresponding to the third isolation sub-opening 1241c.

[0281] In an optional embodiment, the second isolation structure opening 1242 includes the fourth isolation sub-opening 1242a, the fifth isolation sub-opening 1242b and the sixth isolation sub-opening 1242c which are sequentially stacked, that is, the fifth isolation sub-opening 1242b is located between the fourth isolation sub-opening 1242a and the sixth isolation sub-opening 1242c.

[0282] For specific descriptions of the fourth isolation sub-opening 1242a, the fifth isolation sub-opening 1242b and the sixth isolation sub-opening 1242c, reference can be made to the descriptions of the first isolation sub-opening 1241a, the second isolation sub-opening 1241b and the third isolation sub-opening 1241c in the above embodiments, and details are not described herein.

[0283] In the above embodiments, the isolation layer 12 includes the isolation structure layer 124 and the pixel definition layer 125, the first isolation structure opening 1241 and the second isolation structure opening 1242 are provided on the isolation structure layer 124, and the first pixel opening 1251 and the second pixel opening 1252 are provided on the pixel definition layer 125. That is, the first isolation opening 121 includes the first pixel opening 1251 and the first isolation structure opening 1241, and the second isolation opening 122 includes the second pixel opening 1252 and the second isolation structure opening 1242, which can isolate the first light emitting device 131 and the second light emitting device 132 more effectively, thereby improving the display effect of the display panel 10.

[0284] In an embodiment, as Figures 7-16As shown, the isolation layer 12 is also provided with a third isolation opening 126, and a second isolation structure 127 is included between the second isolation opening 122 and the third isolation opening 126.

[0285] When the isolation layer 12 is provided with a third isolation opening 126, the light-emitting device 13 also includes a third light-emitting device 133 provided in the third isolation opening 126.

[0286] In one embodiment, when the isolation layer 12 is provided with a third isolation opening 126, the encapsulation layer 14 further includes a third encapsulation portion 143 provided on the side of the third light-emitting device 133 facing away from the substrate 11.

[0287] The third light-emitting device 133 emits a different color than the first light-emitting device 131 and the second light-emitting device 132. The description of the third light-emitting device 133 and the third packaging portion 143 can be found in the detailed description of the second light-emitting device 132 and the second packaging portion 142 in the above embodiments, and will not be repeated here.

[0288] In one embodiment, such as Figures 7-17 As shown, when the isolation layer 12 is provided with a third isolation opening 126, the isolation structure layer 124 included in the isolation layer 12 is also provided with a third isolation structure opening 1243, and the pixel defining layer 125 included in the isolation layer 12 is also provided with a third pixel opening 1253. The orthographic projection of the third pixel opening 1253 on the substrate 11 is located within the orthographic projection of the third isolation structure opening 1243 on the substrate 11.

[0289] In an optional embodiment, such as Figures 7-17 As shown, for the third isolation structure opening 1243 in the isolation structure layer 124, the third isolation structure opening 1243 includes a seventh isolation sub-opening 1243a, an eighth isolation sub-opening 1243b and a ninth isolation sub-opening 1243c. The orthographic projection of the seventh isolation sub-opening 1243a on the substrate 11 is located within the orthographic projection of the eighth isolation sub-opening 1243b on the substrate 11, and the orthographic projection of the ninth isolation sub-opening 1243c on the substrate 11 is located within the orthographic projection of the eighth isolation sub-opening 1243b on the substrate 11.

[0290] For a detailed description of the third isolation structure opening 1243, please refer to the description of the first isolation structure opening 1241 or the second isolation structure opening 1242 in the above embodiments, which will not be repeated here.

[0291] In the above embodiments, the display panel 10 also includes a third light-emitting device 133 disposed in the third isolation opening 126. Such a display panel 10 can display multiple colors, thereby improving the practicality and display effect of the display panel 10.

[0292] In one embodiment, such as Figure 16The third light emitting device 133 includes a third light emitting functional part 1331 and a third electrode 1332.

[0293] The description of the third light emitting functional part 1331 and the third electrode 1332 can refer to the specific description of the first light emitting functional part 1311 and the first electrode 1312, or the second light emitting functional part 1321 and the second electrode 1322 in the above embodiments, which will not be repeated here.

[0294] In one embodiment, as shown in FIG. 1, the display panel 10 further includes a third light emitting device 133 and a fourth light emitting device 134. Figure 14 As shown in FIG. 1, the cover layer 15 further includes a third cover part 153 connected with the second light emitting device 132 and the second packaging part 142, and a fourth cover part 154 connected with the third light emitting device 133.

[0295] The third cover part 153 includes a fifth sub-cover part 1531 arranged on the side of the second isolation structure 127 away from the substrate 11, and a sixth sub-cover part 1532 arranged on the side wall of the second isolation structure 127 corresponding to the second isolation opening 122.

[0296] The fourth cover part 154 includes a seventh sub-cover part 1541 arranged on the side of the second isolation structure 127 away from the substrate 11, and an eighth sub-cover part 1542 arranged on the side wall of the second isolation structure 127 corresponding to the third isolation opening 126.

[0297] Optionally, the third cover part 153 includes a redundant device material layer located in the first light emitting device material layer, a redundant device material layer located in the second light emitting device material layer, and a redundant packaging material layer located in the first packaging material layer, and a third packaging sub-part connected with the second packaging part 142.

[0298] Optionally, the fourth cover part 154 includes a redundant device material layer located in the third light emitting device material layer, and a fourth packaging sub-part connected with the third packaging part 143.

[0299] Optionally, in the thickness direction of the substrate 11, the distance between the fifth sub-cover part 1531 and the substrate 11 is less than the distance between the seventh sub-cover part 1541 and the substrate 11.

[0300] Optionally, the seventh sub-cover part 1541 is located on the side of part of the fifth sub-cover part 1531 away from the substrate 11.

[0301] The description of the third cover part 153 and the fourth cover part 154 can refer to the specific description in the above embodiments, which will not be repeated here.

[0302] In one embodiment, as shown in FIG. 1, the display panel 10 further includes a third light emitting device 133 and a fourth light emitting device 134. Figure 16 As shown in FIG. 1, the display panel 10 further includes:

[0303] A plurality of fourth electrodes 16 are respectively arranged on the side of the first light emitting device 131 close to the substrate 11 and on the side of the second light emitting device 132 close to the substrate 11.

[0304] In the case where the display panel 10 comprises a third light emitting device 133, a fourth electrode 16 is also arranged on the side of the third light emitting device 133 close to the substrate 11.

[0305] In one embodiment, a plan view (i.e. a top view) of the display panel 10 is as shown in Figure 18 As can be seen from Figure 18 , each isolation opening in the display panel 10 is arranged in a grid pattern, and the isolation structure is arranged around the isolation opening.

[0306] One embodiment of the present application provides a display device comprising the display panel 10 provided by the above-mentioned embodiments. Alternatively, the display device can also comprise the display panel 10 prepared by the preparation method of the display panel provided by the above-mentioned embodiments.

[0307] The display device comprising the display panel 10 provided by the above-mentioned embodiments, or the display panel prepared by the preparation method of the display panel provided by the above-mentioned embodiments, has all the beneficial effects of the display panel 10, or all the beneficial effects of the preparation method of the display panel, which will not be described herein again.

[0308] The display device can be a notebook computer, a mobile phone, a wireless device, a personal data assistant (PDA), a handheld or portable computer, a GPS receiver / navigator, a camera, an MP4 video player, a video camera, a game console, a watch, a clock, a calculator, a television monitor, a flat panel display, a computer monitor, an automobile display (e.g. an odometer display, etc.), a navigator, a cockpit controller and / or display, a display of a camera view (e.g. a display of a rear view camera in a vehicle), an electronic photo, an electronic billboard or sign, a projector, etc.

[0309] In the case where “comprising”, “having”, and “including” are used in this document, another component can be added unless a specific limiting phrase such as “only”, “consisting of”, etc. is used. The singular form of a term can include the plural form unless the context clearly indicates otherwise, and the number of one should not be understood as one.

[0310] The technical features of the above embodiments can be combined in any manner. In order to make the description concise, all possible combinations of the technical features in the above embodiments are not described, however, as long as the combinations of the technical features do not contradict each other, they should be considered as falling within the scope of the present disclosure.

[0311] The above-described embodiments are merely illustrative of several embodiments of the present application, which are described in more detail and in a specific manner, but should not be construed as limiting the scope of the patent of the present application. It should be noted that, for those of ordinary skill in the art, several modifications and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application should be subject to the appended claims.

Claims

1. A method for manufacturing a display panel, characterized in that, The preparation method includes: An isolation material layer is formed on one side of the substrate, and the isolation material layer is subjected to a first patterning process to form a first isolation opening on the isolation material layer; A first light-emitting device material layer and a first encapsulation material layer are stacked on one side of the substrate, and the first encapsulation material layer, the first light-emitting device material layer and the isolation material layer are subjected to a second patterning process to form a first light-emitting device and a first encapsulation portion disposed at the first isolation opening, and a second isolation opening is formed on the isolation material layer; A second light-emitting device material layer and a second encapsulation material layer are stacked on the side of the first encapsulation material layer away from the substrate and at the second isolation opening. The second encapsulation material layer and the second light-emitting device material layer are subjected to a third patterning process to form a second light-emitting device and a second encapsulation portion disposed at the second isolation opening. The first light-emitting device and the second light-emitting device emit different colors. The substrate includes a first region and a second region. The orthographic projection of the first isolation opening on the substrate is located within the first region, and the orthographic projection of the second isolation opening on the substrate is located within the second region. The third patterning process performed on the second encapsulation material layer and the second light-emitting device material layer to form the second light-emitting device and the second encapsulation portion disposed at the second isolation opening includes: The second encapsulation material layer and the second light-emitting device material layer, excluding those located in the second region, are removed from the side facing away from the substrate to form the second light-emitting device and the second encapsulation portion disposed in the second isolation opening.

2. The preparation method according to claim 1, characterized in that, The second patterning process performed on the first encapsulation material layer, the first light-emitting device material layer, and the isolation material layer to form a first light-emitting device and a first encapsulation portion disposed at the first isolation opening, and to form a second isolation opening on the isolation material layer, includes: A dry etching process is used to remove the first encapsulation material layer on the side opposite to the substrate and located only in the second region to form the first encapsulation portion; A wet etching process is used to remove the first light-emitting device material layer on the side opposite to the substrate and located only in the second region to form the first light-emitting device disposed in the first isolation opening; The isolation material layer located only in the second region is etched using both dry and wet etching processes to form the second isolation opening on the isolation material layer.

3. The preparation method according to claim 1, characterized in that, The first light-emitting device material layer includes a first light-emitting functional material layer and a first electrode material layer stacked together. The first light-emitting device includes a first light-emitting functional part formed by the first light-emitting functional material layer and a first electrode formed by the first electrode material layer. The second light-emitting device material layer includes a second light-emitting functional material layer and a second electrode material layer. The second light-emitting device includes a second light-emitting functional part formed by the second light-emitting functional material layer and a second electrode formed by the second electrode material layer.

4. The preparation method according to claim 1, characterized in that, The second patterning process performed on the first encapsulation material layer, the first light-emitting device material layer, and the isolation material layer to form a first light-emitting device and a first encapsulation portion disposed at the first isolation opening, and to form a second isolation opening on the isolation material layer, includes: The first encapsulation material layer, the first light-emitting device material layer, and the isolation material layer are subjected to a second patterning process to form the first light-emitting device, the first encapsulation portion, a first cover portion connected to the first light-emitting device and the first encapsulation portion, and a second isolation opening is formed on the isolation material layer; the first cover portion includes a redundant device material layer located on the first light-emitting device material layer and a first encapsulation sub-part connected to the first encapsulation portion; The first covering portion includes a first sub-covering portion disposed between the first isolation opening and the second isolation opening on the side of the first isolation structure facing away from the substrate, and a second sub-covering portion disposed on the sidewall of the first isolation structure corresponding to the first isolation opening.

5. The preparation method according to claim 4, characterized in that, The third patterning process performed on the second encapsulation material layer and the second light-emitting device material layer to form the second light-emitting device and the second encapsulation portion disposed at the second isolation opening includes: The second encapsulation material layer and the second light-emitting device material layer are subjected to a third patterning process to form the second light-emitting device and the second encapsulation portion, as well as a second cover portion connected to the second light-emitting device and the second encapsulation portion; The second cover portion includes a third sub-cover portion disposed on the side of the first isolation structure away from the substrate, and a fourth sub-cover portion disposed on the sidewall of the first isolation structure corresponding to the second isolation opening; the second cover portion also includes a redundant device material layer located in the second light-emitting device material layer and a second encapsulation sub-part connected to the second encapsulation portion; Wherein, along the thickness direction of the substrate, the distance between the first sub-covering portion and the substrate is smaller than the distance between the third sub-covering portion and the substrate; The third sub-cover portion is located on the side of the first sub-cover portion that is away from the substrate.

6. The preparation method according to any one of claims 1-5, characterized in that, The preparation method further includes: The first encapsulation material layer, the first light-emitting device material layer, and the isolation material layer are subjected to a fourth patterning process to form a third isolation opening on the isolation material layer; A third light-emitting device material layer and a third encapsulation material layer are formed on one side of the substrate; The third encapsulation material layer and the third light-emitting device material layer are subjected to a fifth patterning process to form a third light-emitting device and a third encapsulation portion disposed at the third isolation opening; the third light-emitting device material layer includes a stacked third light-emitting functional material layer and a third electrode material layer, and the third light-emitting device includes a third light-emitting functional portion and a third electrode.

7. The preparation method according to claim 6, characterized in that, The substrate includes a third region, and the orthographic projection of the third isolation opening on the substrate lies within the range of the third region; the fourth patterning process of the first encapsulation material layer, the first light-emitting device material layer, and the isolation material layer to form the third isolation opening on the isolation material layer includes: The first encapsulation material layer, located only in the third region, is removed using a dry etching process; The first light-emitting device material layer, located only in the third region, on the side opposite to the substrate, is removed using a wet etching process. The isolation material layer located only in the third region is etched using both dry and wet etching processes to form the third isolation opening on the isolation material layer.

8. The preparation method according to claim 7, characterized in that, The fifth patterning process performed on the third encapsulation material layer and the third light-emitting device material layer to form the third light-emitting device and the third encapsulation portion disposed in the third isolation opening includes: Remove the side facing away from the substrate, and the third encapsulation material layer and the third light-emitting device material layer except those located in the third region, leaving only the third encapsulation material layer and the third light-emitting device material layer in the third region, to form the third light-emitting device and the third encapsulation portion.

9. The preparation method according to claim 6, characterized in that, The fourth patterning process performed on the first encapsulation material layer, the first light-emitting device material layer, and the isolation material layer to form a third isolation opening on the isolation material layer includes: The first encapsulation material layer, the first light-emitting device material layer, and the isolation material layer are subjected to a fourth patterning process to form a third cover portion and to form the third isolation opening on the isolation material layer; The third covering portion includes a fifth sub-covering portion disposed between the second isolation opening and the third isolation opening, on the side of the second isolation structure facing away from the substrate, and a sixth sub-covering portion disposed on the sidewall of the second isolation structure corresponding to the second isolation opening; The third covering portion includes a redundant device material layer located in the first light-emitting device material layer, a redundant device material layer located in the second light-emitting device material layer, and a redundant encapsulation material layer located in the first encapsulation material layer, as well as a third encapsulation sub-part connected to the second encapsulation portion.

10. The preparation method according to claim 9, characterized in that, The fifth patterning process performed on the third encapsulation material layer and the third light-emitting device material layer to form the third light-emitting device and the third encapsulation portion disposed in the third isolation opening includes: A fifth patterning process is performed on the third encapsulation material layer and the third light-emitting device material layer to form the third light-emitting device and the third encapsulation portion, as well as a fourth cover portion connected to the third light-emitting device and the third encapsulation portion; The fourth covering portion includes a seventh sub-covering portion disposed on the side of the second isolation structure away from the substrate, and an eighth sub-covering portion disposed on the side wall of the second isolation structure corresponding to the third isolation opening; The fourth covering portion also includes a redundant device material layer located in the third light-emitting device material layer, and a fourth packaging sub-part connected to the third packaging portion; Wherein, along the thickness direction of the substrate, the distance between the fifth sub-covering portion and the substrate is less than the distance between the seventh sub-covering portion and the substrate; the seventh sub-covering portion is located on the side of the fifth sub-covering portion that is away from the substrate.

11. The preparation method according to any one of claims 1-5, characterized in that, The method of forming an isolation material layer on one side of the substrate and performing a first patterning process on the isolation material layer to form a first isolation opening on the isolation material layer includes: A pixel defining material layer and an isolation structure material layer are formed on one side of the substrate; The isolation structure material layer and the pixel defining material layer are subjected to a first patterning process to form a first isolation structure opening on the isolation structure material layer and a first pixel opening on the pixel defining material layer; the orthographic projection of the first pixel opening on the substrate is located within the orthographic projection of the first isolation structure opening on the substrate. The first isolation structure opening includes a first isolator opening, a second isolator opening, and a third isolator opening. The second isolator opening is located between the first isolator opening and the third isolator opening. The orthographic projection of the first isolator opening on the substrate is located within the orthographic projection of the second isolator opening on the substrate. The orthographic projection of the third isolator opening on the substrate is located within the orthographic projection of the second isolation opening on the substrate.

12. The preparation method according to claim 11, characterized in that, The second patterning process performed on the first encapsulation material layer, the first light-emitting device material layer, and the isolation material layer to form a first light-emitting device and a first encapsulation portion disposed at the first isolation opening, and to form a second isolation opening on the isolation material layer, includes: The first encapsulation material layer, the first light-emitting device material layer, the isolation structure material layer, and the pixel defining material layer are subjected to a second patterning process to form the first light-emitting device and the first encapsulation portion disposed at the first isolation structure opening and the first pixel opening, and to form a second isolation structure opening on the isolation structure material layer and a second pixel opening on the pixel defining material layer; the orthographic projection of the second pixel opening on the substrate is located within the orthographic projection of the second isolation structure opening on the substrate.

13. The preparation method according to any one of claims 1-5, characterized in that, The preparation method further includes: A plurality of fourth electrodes are formed on one side of the substrate, and the plurality of fourth electrodes are respectively disposed on the side of the first light-emitting device near the substrate and the side of the second light-emitting device near the substrate.

14. A display panel, characterized in that, include: substrate; An isolation layer is disposed on one side of the substrate, and has a first isolation opening and a second isolation opening, as well as a first isolation structure between the first isolation opening and the second isolation opening; The light-emitting device includes a first light-emitting device disposed in the first isolation opening and a second light-emitting device disposed in the second isolation opening; The encapsulation layer includes a first encapsulation portion disposed on the side of the first light-emitting device facing away from the substrate and a second encapsulation portion disposed on the side of the second light-emitting device facing away from the substrate; The covering portion includes a first covering portion connected to the first light-emitting device and the first encapsulation portion, and a second covering portion connected to the second light-emitting device and the second encapsulation portion; The first covering portion includes a first sub-covering portion disposed on the side of the first isolation structure away from the substrate, and a second sub-covering portion disposed on the sidewall of the first isolation structure corresponding to the first isolation opening; the second covering portion includes a third sub-covering portion disposed on the side of the first isolation structure away from the substrate, and a fourth sub-covering portion disposed on the sidewall of the first isolation structure corresponding to the second isolation opening. Along the thickness direction of the substrate, the distance between the first sub-cover and the substrate is less than the distance between the third sub-cover and the substrate; the orthographic projection of the third sub-cover on the substrate and the orthographic projection of the first sub-cover on the substrate have a partially overlapping area.

15. The display panel according to claim 14, characterized in that, The first covering portion includes a redundant device material layer located in the first light-emitting device material layer and a first encapsulation sub-part connected to the first encapsulation portion; The second cover portion includes a redundant device material layer located in the second light-emitting device material layer and a second encapsulation sub-part connected to the second encapsulation portion; The third sub-cover portion is located on the side of the first sub-cover portion that is away from the substrate; the first light-emitting device includes a first light-emitting functional portion and a first electrode, and the second light-emitting device includes a second light-emitting functional portion and a second electrode.

16. The display panel according to claim 15, characterized in that, The isolation layer includes an isolation structure layer and a pixel defining layer. The pixel defining layer is disposed on one side of the substrate, and the isolation structure layer is disposed on the side of the pixel defining layer opposite to the substrate. The pixel defining layer is provided with a first pixel opening and a second pixel opening, and the isolation structure layer is provided with a first isolation structure opening and a second isolation structure opening; The orthographic projection of the first pixel opening on the substrate is located within the orthographic projection of the first isolation structure opening on the substrate, and the orthographic projection of the second pixel opening on the substrate is located within the orthographic projection of the second isolation structure opening on the substrate; Wherein, the first isolation structure opening includes a first isolator opening, a second isolator opening and a third isolator opening, the second isolator opening is located between the first isolator opening and the third isolator opening, the orthographic projection of the first isolator opening on the substrate is located within the orthographic projection of the second isolator opening on the substrate, and the orthographic projection of the third isolator opening on the substrate is located within the orthographic projection of the second isolator opening on the substrate; The second isolation structure opening includes a fourth isolator opening, a fifth isolator opening, and a sixth isolator opening. The fifth isolator opening is located between the fourth isolator opening and the sixth isolator opening. The orthographic projection of the fourth isolator opening on the substrate is located within the orthographic projection of the fifth isolator opening on the substrate. The orthographic projection of the sixth isolator opening on the substrate is located within the orthographic projection of the fifth isolator opening on the substrate.

17. The display panel according to claim 16, characterized in that, The isolation layer is further provided with a third isolation opening, and a second isolation structure is included between the second isolation opening and the third isolation opening; The light-emitting device also includes a third light-emitting device disposed in the third isolation opening.

18. The display panel according to claim 17, characterized in that, The encapsulation layer further includes a third encapsulation portion disposed on the side of the third light-emitting device opposite to the substrate.

19. The display panel according to claim 18, characterized in that, The pixel defining layer is further provided with a third pixel opening, and the isolation structure layer is further provided with a third isolation structure opening. The orthogonal projection of the third pixel opening on the substrate is located within the orthogonal projection of the third isolation structure opening on the substrate. The third isolation structure opening includes a seventh isolation sub-opening, an eighth isolation sub-opening, and a ninth isolation sub-opening. The eighth isolation sub-opening is located between the seventh isolation sub-opening and the ninth isolation sub-opening. The orthographic projection of the seventh isolation sub-opening on the substrate is located within the orthographic projection of the eighth isolation sub-opening on the substrate, and the orthographic projection of the ninth isolation sub-opening on the substrate is located within the orthographic projection of the eighth isolation sub-opening on the substrate.

20. The display panel according to claim 17, characterized in that, The covering portion further includes: a third covering portion, and a fourth covering portion connected to the third light-emitting device and the third encapsulation portion; The third covering portion includes a fifth sub-covering portion disposed on the side of the second isolation structure away from the substrate, and a sixth sub-covering portion on the sidewall of the second isolation structure corresponding to the second isolation opening; The fourth covering portion includes a seventh sub-covering portion disposed on the side of the second isolation structure away from the substrate, and an eighth sub-covering portion on the sidewall of the second isolation structure corresponding to the third isolation opening; The third covering portion further includes a redundant device material layer located in the first light-emitting device material layer, a redundant device material layer located in the second light-emitting device material layer, and a redundant encapsulation material layer located in the first encapsulation material layer, as well as a third encapsulation sub-part connected to the second encapsulation portion; the fourth covering portion further includes a redundant device material layer located in the third light-emitting device material layer, as well as a fourth encapsulation sub-part connected to the third encapsulation portion. Along the thickness direction of the substrate, the distance between the fifth sub-cover and the substrate is less than the distance between the seventh sub-cover and the substrate; the seventh sub-cover is located on the side of the fifth sub-cover that is away from the substrate.

21. The display panel according to any one of claims 14-20, characterized in that, The display panel also includes: Multiple fourth electrodes are respectively disposed on the side of the first light-emitting device close to the substrate and the side of the second light-emitting device close to the substrate.

22. A display device, characterized in that, Includes the display panel as described in any one of claims 14-21.

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