Laminate

Abstract

A laminate including an adhesive sheet for capturing an element separated from a holding substrate, and a release sheet laminated on one surface of the adhesive sheet, the adhesive sheet having an adhesive layer, the adhesive layer having irregularities on the surface thereof, and the release sheet having a release layer in contact with the adhesive layer, the release layer has irregularities on the surface thereof, and the release sheet has a release force of 1000 mN / 50 mm or less at a release angle of 180 DEG with respect to the adhesive sheet as measured at a release speed of 300 mm / min.

Description

Technical Field

[0001] The present invention relates to a laminated body. Background Art

[0002] Elements used in electronic components or semiconductor devices are mostly obtained by forming a plurality of elements in large quantities at one time. For example, a semiconductor chip is obtained by cutting a semiconductor wafer attached to an adhesive. When such a semiconductor chip is mounted on a semiconductor device, the semiconductor chip is usually transferred. For example, Patent Document 1 discloses a method for transferring a semiconductor chip by irradiating a semiconductor chip with a laser (laser lift-off method).

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2021-141181 Summary of the invention

[0006] Problems to be solved by the invention

[0007] When the component moves from the substrate before transfer to the substrate after transfer, the component is captured by the substrate after transfer. When such component transfer is performed, there may be a deviation between the component position in the substrate before transfer and the component position in the substrate after transfer. However, by providing a concavo-convex surface on the surface of the adhesive sheet that captures the component to be transferred, the positional deviation of the component during capture can be suppressed.

[0008] On the other hand, the adhesive sheet is attached to the release sheet just before use, and the adhesive sheet is peeled off from the release sheet and then used for element transfer. However, if the adhesive sheet has unevenness on its surface, the adhesive sheet and the release sheet may be strongly bonded, making it difficult to peel the adhesive sheet from the release sheet.

[0009] An object of the present invention is to provide a laminated body which can transfer a component to an appropriate position and has improved releasability of a release sheet from a pressure-sensitive adhesive sheet.

[0010] Solutions for solving problems

[0011] After intensive research, the inventors of the present invention found that the above-mentioned problems can be solved by adjusting the peeling force of the release sheet on the adhesive sheet having projections and depressions. After further repeated research, the inventors of the present invention have completed the present invention.

[0012] That is, the present invention relates to the following [1] to

[12] .

[0013] [1] A laminate comprising a pressure-sensitive adhesive sheet for capturing an element separated from a holding substrate, and a release sheet laminated on one surface of the pressure-sensitive adhesive sheet,

[0014] The adhesive sheet comprises an adhesive layer, and the adhesive layer has irregularities on its surface.

[0015] The release sheet includes a release layer in contact with the adhesive layer, and the release layer has irregularities on its surface.

[0016] The peeling force of the release sheet with respect to the pressure-sensitive adhesive sheet at a peeling angle of 180° measured at a peeling speed of 300 mm / min is 1000 mN / 50 mm or less.

[0017] [2] The laminate according to [1], wherein the release layer contains a non-silicone release agent.

[0018] [3] The laminate according to [1] or [2], wherein the release layer contains a non-silicone olefin-based release agent.

[0019] [4] The laminate according to any one of [1] to [3], wherein the surface irregularities of the adhesive layer and the surface irregularities of the release layer are in a complementary relationship.

[0020] [5] The laminate as described in any one of [1] to [4], wherein the release layer has a plurality of recessed portions on its surface which are separated from each other by the protrusions and have a height of 1 μm or more.

[0021] [6] The laminate according to any one of [1] to [5], wherein the adhesive layer is formed from an adhesive composition containing an energy ray-curable compound (B).

[0022] [7] The laminate according to any one of [1] to [6], wherein the adhesive layer is formed from an adhesive composition containing an acrylic resin (A).

[0023] [8] The laminate according to any one of [1] to [7], wherein the adhesive layer is formed from an adhesive composition containing an acrylic resin (A) and an energy-ray-curable compound (B).

[0024] [9] A laminate as described in any one of [1] to [8], wherein the adhesive layer has a plurality of convex portions on its surface which are separated from each other by concave portions, and a pitch of the plurality of convex portions of the adhesive layer is greater than or equal to 1 μm and less than or equal to 100 μm.

[0025]

[10] A laminate as described in any one of [1] to [9], wherein the adhesive layer has a plurality of convex portions on its surface which are separated from each other by concave portions, and the area of ​​each of the plurality of convex portions of the adhesive layer is 10 μm 2 Above and 2000μm 2 the following.

[0026]

[11] A laminate as described in any one of [1] to

[10] , wherein the adhesive layer has a plurality of convex portions on its surface whose boundaries are determined by concave portions and are separated from each other, and the ratio of the area occupied by the convex portions of the adhesive layer to the area of ​​the adhesive layer is greater than 1% and less than 95%.

[0027]

[12] The laminate as described in any one of [1] to

[11] , wherein the adhesive layer is constructed so that the ratio of the bonding area between the adhesive layer and one of the elements to the area of ​​one of the elements is 1% to 95%.

[0028] Effects of the Invention

[0029] According to the present invention, a laminated body can be provided which can transfer an element to an appropriate position and has improved releasability of a release sheet with respect to a pressure-sensitive adhesive sheet. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] The accompanying drawings are incorporated in and constitute a part of the specification, illustrate embodiments of the present invention and, together with the description, serve to explain the principles of the present invention.

[0031] Figure 1 This is a schematic diagram of a laminated body according to one embodiment.

[0032] Figure 2A This is a plan view showing an example of the concavities and convexities of the pressure-sensitive adhesive sheet.

[0033] Figure 2B This is a plan view showing an example of the concavities and convexities of the pressure-sensitive adhesive sheet.

[0034] Figure 2C This is a plan view showing an example of the concavities and convexities of the pressure-sensitive adhesive sheet.

[0035] Figure 3A This is a cross-sectional view showing an example of the concavities and convexities of the pressure-sensitive adhesive sheet.

[0036] Figure 3B This is a cross-sectional view showing an example of the concavities and convexities of the pressure-sensitive adhesive sheet.

[0037] Figure 4A This is a schematic diagram for explaining the separation and capture of components.

[0038] Figure 4B This is a schematic diagram for explaining the separation and capture of components.

[0039] Figure 4C This is a schematic diagram for explaining the separation and capture of components.

[0040] Figure 5AThis is a plan view showing an example of the concavities and convexities of the release sheet.

[0041] Figure 5B This is a plan view showing an example of the concavities and convexities of the release sheet.

[0042] Figure 5C This is a plan view showing an example of the concavities and convexities of the release sheet.

[0043] Fig. 6A This is a cross-sectional view showing an example of the concavities and convexities of the release sheet.

[0044] Figure 6B This is a cross-sectional view showing an example of the concavities and convexities of the release sheet. DETAILED DESCRIPTION

[0045] Hereinafter, the embodiments are described in detail with reference to the accompanying drawings. It should be noted that the following embodiments do not limit the invention of the claims. In addition, the combination of features described in the embodiments is not necessarily required for the invention. Two or more of the multiple features described in the embodiments may be combined arbitrarily. In addition, the same figure mark is marked for the same or similar structure, and repeated description is omitted.

[0046] (definition)

[0047] In this specification, the mass average molecular weight (Mw) and the number average molecular weight (Mn) are values ​​measured by size exclusion chromatography in terms of standard polystyrene, specifically values ​​measured in accordance with JIS K7252-1: 2016. In addition, in this specification, "(meth)acrylic acid" refers to both "acrylic acid" and "methacrylic acid", and the same applies to other similar terms.

[0048] In this specification, "electronic components" include all components used in electronic engineering and electrical engineering, and all components constituting electronic equipment. "Electronic components" can be formed by any one of semiconductors, conductors and / or insulators or by a combination of these. As "electronic components", for example, active components (mainly formed by semiconductors, such as transistors, IC (Integrated Circuit), LSI (Large Scale Integration), super LSI, diodes, light-emitting diodes, thyristors, three-terminal regulators, and imaging elements, etc.), passive components (such as resistors, capacitors, speakers, coils, transformers, converters, relays, piezoelectric elements, crystal oscillators, ceramic resonators, and varistors, etc.), and structural components (such as wiring components, printed circuit boards, connectors, and switches, etc.). In addition, in this specification, "semiconductor devices" refer to all devices used in processors, memories, sensors, etc. that can function by utilizing semiconductor characteristics. As examples of "semiconductor devices", micro light-emitting diodes, small light-emitting diodes, power devices, MEMS (Micro Electro Mechanical Systems), and control chips can be listed.

[0049] In this specification, when more than one lower limit and more than one upper limit of a numerical range (such as a range of content, etc.) are recorded, it can be understood that any lower limit and upper limit and combination thereof are recorded. For example, the record of more than 1, more than 2, more than 3 and less than 9, less than 8, and less than 7 indicates that the numerical range can be any of more than 1 and less than 9, more than 1 and less than 8, more than 1 and less than 7, more than 2 and less than 9, more than 2 and less than 8, more than 2 and less than 7, more than 3 and less than 9, more than 3 and less than 8, and more than 3 and less than 7.

[0050] <<<Laminate of the present embodiment>>>

[0051] The laminate of the present embodiment is provided with an adhesive sheet for capturing the element away from the self-maintaining substrate and a release sheet stacked on the surface of one side of the adhesive sheet, the adhesive sheet is provided with an adhesive layer, the adhesive layer has a concavo-convex on its surface, and the release sheet is provided with a release layer in contact with the adhesive layer, and the release layer has a concavo-convex on its surface. Thus, the element can be transferred to an appropriate position. In addition, the release force of the release sheet relative to the adhesive sheet at a peeling angle of 180 ° measured at a peeling speed of 300mm / minute is less than 1000mN / 50mm. Thus, the release property of the release sheet relative to the adhesive sheet is improved, and the adhesive sheet can be easily peeled off from the release sheet.

[0052] <<Configuration of Laminated Body>>

[0053] Figure 1 A schematic diagram showing a laminate according to an embodiment. In one embodiment, the laminate may include an adhesive layer 110, an adhesive sheet substrate 120, a release layer 130, and a release sheet substrate 140. However, the adhesive sheet and the release sheet do not necessarily have the adhesive sheet substrate 120 and the release sheet substrate 140. For example, the adhesive sheet may be composed only of the adhesive layer 110, and the release sheet may be composed only of the release layer 130. In this case, an adhesive layer 110 and a release layer 130 with high support properties may be used.

[0054] The laminate is usually pasted with the adhesive sheet and the release sheet just before the moment of use. The aforementioned characteristics of the laminate may vary according to the composition, properties, etc. of the adhesive sheet and the release sheet described later. In addition, in one embodiment, the laminate can be obtained by pasting the adhesive sheet and the release sheet in a manner that the adhesive layer 110 of the adhesive sheet is in contact with the release layer 130 of the release sheet. It should be noted that the laminate can be formed by forming the adhesive layer 110 on the release layer 130 of the release sheet having a concave-convex shape, and then bonding the adhesive sheet substrate 120 on the adhesive layer 110. The details of each structure will be described later.

[0055] <<Peel force>>

[0056] In the laminate of the present embodiment, the peeling force of the release sheet relative to the adhesive sheet at a peeling angle of 180° measured at a peeling speed of 300 mm / min is 1000 mN / 50 mm or less. The upper limit of the peeling force of the release sheet relative to the adhesive sheet can be preferably set to 1000 mN / 50 mm or less, more preferably 800 mN / 50 mm or less, more preferably 500 mN / 50 mm or less, further preferably 200 mN / 50 mm or less, and particularly preferably 100 mN / 50 mm or less. Thus, the peelability of the release sheet relative to the adhesive sheet is improved, and the adhesive sheet with a concave-convex surface can be easily peeled off from the release sheet.

[0057] On the other hand, the lower limit of the peeling force of the peeling sheet relative to the adhesive sheet is not particularly limited, and can be preferably set to more than 1mN / 50mm, more preferably more than 2mN / 5mm, more preferably more than 10mN / 50mm, further preferably more than 15mN / 50mm, and particularly preferably more than 20mN / 50mm. Thus, it can be maintained as a laminate. The range of the peeling force of the laminate can be preferably set to more than 1mN / 50mm and less than 1000mN / 50mm, more preferably more than 2mN / 5mm and less than 800mN / 50mm, more preferably more than 10mN / 50mm and less than 500mN / 50mm, further preferably more than 15mN / 50mm and less than 200mN / 50mm, and particularly preferably more than 20mN / 50mm and less than 100mN / 50mm.

[0058] The method for measuring the peeling force of the release sheet with respect to the pressure-sensitive adhesive sheet will be described in the examples.

[0059] <<Adhesive Sheet>>

[0060] <Adhesive layer>

[0061] The adhesive sheet of the present embodiment has an adhesive layer 110, which is an adhesive layer and may contain a resin. In addition, the adhesive sheet may have more than two adhesive layers 110. For example, the adhesive sheet may have a laminate of one or more adhesive layers 110. In addition, the surface of the adhesive layer 110 has projections and depressions. The adhesive sheet captures the element separated from the self-maintaining substrate in the adhesive layer 110, and the gas compressed between the element and the adhesive layer 110 generated by the element approaching the adhesive layer 110 can escape to the concave portion of the adhesive sheet. Thus, the pressure generated between the element and the adhesive layer can be eased. Details about the capture of the element by the adhesive sheet will be described later.

[0062] (Shape of adhesive layer)

[0063] When the surface of the adhesive layer 110 has a concave portion, the pressure generated between the element and the adhesive layer can be relieved, thereby suppressing the displacement of the holding position of the element on the adhesive sheet. Therefore, the specific shape of the concave and convex surface of the adhesive layer 110 is not limited. On the other hand, the surface concave and convex surface of the adhesive layer 110 and the surface concave and convex surface of the release layer described later are in a complementary relationship.

[0064] In one embodiment, the adhesive layer 110 has a plurality of convex portions separated from each other by concave portions on its surface. Each of the plurality of convex portions may be separated by a concave portion that is continuous across the entire adhesive layer 110. By providing a continuous concave portion around such a convex portion, the pressure relief effect may be improved.

[0065] In one embodiment, the recessed portion around each of the plurality of protrusions is continuous to the end of the adhesive layer 110. Thus, by providing the recessed portion continuous to the end of the adhesive layer 110, the gas compressed between the element and the protrusion of the adhesive layer 110 can be efficiently released to the outside of the element. FIG. 2A to FIG. 2C 1 is a plan view showing the shape of such an adhesive layer 110 .

[0066] like Figure 2A As shown in FIG. 1 , the convex portions 111 may be regularly arranged on the surface of the adhesive layer 110. Regular arrangement of the convex portions 111 means that the convex portions 111 are arranged on a straight line at a certain interval. Figure 2B As shown, the protrusions 111 may also be arranged in a manner with regularly varying intervals. Figure 2BIn the example of , the intervals between the convex portions 111 are shortened in the center of the adhesive sheet, and are lengthened in the peripheral portion of the adhesive sheet. According to this configuration, the retention of the adhesive sheet can be improved, and the compressed gas can be efficiently released from the peripheral portion of the element through the wider recessed portion. In addition, the convex portions 111 can also be arranged irregularly.

[0067] Figure 2C is a top view showing other shapes of the adhesive layer 110. Figure 2C As shown, stripe-shaped protrusions 111 may be provided on the surface of the adhesive layer 110 . Figure 2C In the embodiment, linear protrusions 111 having a certain width are arranged at a certain interval. Figure 2B Likewise, the width or interval of the linear protrusions 111 may vary regularly, or the linear protrusions 111 may be arranged irregularly.

[0068] It should be noted that if Figure 2B As shown, the minimum interval among all the convex portions 111 in the central portion of the adhesive sheet may be shorter than the minimum interval among all the convex portions 111 in the peripheral portion of the adhesive sheet. Here, the central portion is, for example, a circular region having 1 / 4 of the area of ​​the adhesive sheet and centered at the center of gravity of the adhesive sheet, and the peripheral portion is, for example, all regions other than the central portion of the adhesive sheet.

[0069] From the viewpoint of improving the pressure relief effect, the pitch P of the protrusions 111 is preferably 1 μm or more, more preferably 5 μm or more, further preferably 10 μm or more, and particularly preferably 15 μm or more. On the other hand, from the viewpoint of increasing the contact area between the adhesive layer 110 and the element to suppress positional deviation during capture, the pitch is preferably 100 μm or less, more preferably 75 μm or less, more preferably 50 μm or less, further preferably 35 μm or less, and particularly preferably 25 μm or less. Here, the pitch of the protrusions 111 refers to the distance between the center point of an arbitrarily selected protrusion 111 and the center point of another protrusion 111 closest to the protrusion 111. For example, Figure 2A In the case of , the pitch of the convex portion 111 indicates the distance between the center point of the convex portion 111 on the straight line where the convex portions 111 are arranged at a certain interval and the center point of another convex portion 111' closest to the convex portion 111. When the convex portions 111 are arranged on multiple straight lines, the pitch indicates the distance between the center points of the convex portions on the straight line arranged with the shortest pitch. In addition, for example Figure 2C When the convex portion is generally elongated and it is difficult to identify the center point of the convex portion, the pitch refers to the distance from the boundary of the same side of the convex portion 111 to the boundary of another convex portion 111 ′ that is closest to it.

[0070] The specific shape of the convex portion 111 is not particularly limited. For example, the convex portion 111 may have a pillar shape. As a specific example, the convex portion 111 may have a cylindrical shape or a prism shape. In addition, as described above, the convex portion 111 may extend in a linear shape or in a curved shape such as a wave shape. In addition, these convex portions 111 may be provided with a slope.

[0071] Figure 3A FIG. 1 is a cross-sectional view of the adhesive layer 110 according to one embodiment, which passes through the convex portion 111 and is perpendicular to the surface of the adhesive layer 110 . Figure 3A The convex portion 111 shown in the figure has an inclination, that is, the front end of the convex portion 111 becomes thinner. Figure 3A As shown, the surface of the adhesive layer 110 may have a flat concave portion and a convex portion 111 protruding from the concave portion. As described above, the adhesive layer 110 may have a plurality of convex portions 111 separated from each other and defined by the concave portion.

[0072] In addition, if Figure 3B As shown, the front end of the convex portion 111 may be a curved surface such as a hemispherical shape or a part of a sphere. According to this configuration, the impact when the element separated from the holding substrate contacts the adhesive layer 110 is further mitigated, so that the adhesive layer 110 can easily capture the element in an appropriate position. On the other hand, the front end of the convex portion may also be a flat surface.

[0073] In addition, the convex portion 111 may be in the shape of a plurality of particles, a lotus leaf surface, or a needle. As a further example, the surface of the adhesive layer 110 may be rough or fibrous, and it can be said that such a surface may also have concavities and convexities.

[0074] The width or diameter of each convex portion 111 is the width or diameter of its base rather than the front end. From the perspective of improving adhesion to suppress positional deviation during capture, it is preferably 1 μm or more, more preferably 2 μm or more, further preferably 5 μm or more, and particularly preferably 10 μm or more. On the other hand, it is preferably 100 μm or less, more preferably 50 μm or less, further preferably 30 μm or less, and particularly preferably 20 μm or less. Here, the width and diameter of the convex portion 111 refer to the minimum distance and maximum distance ( Figure 3A (denoted by D in the figure).

[0075] In addition, from the viewpoint of improving adhesion and suppressing positional deviation during capture, the area of ​​each convex portion 111 is preferably 10 μm 2 More preferably, 20 μm 2 More preferably, 30 μm 2 On the other hand, from the viewpoint of improving the pressure relaxation effect, the area of ​​each convex portion 111 is preferably 2000 μm 2Below, more preferably 1000 μm 2 Below, more preferably 500 μm 2 Here, the area of ​​the convex portion 111 refers to the area of ​​the portion protruding from the surface of the concave portion ( Figure 3A In the case of , it is the area of ​​a circle with diameter D).

[0076] In addition, from the viewpoint of improving impact absorption to suppress positional deviation during capture, the height of each convex portion 111 is preferably 1 μm or more, more preferably 3 μm or more, and further preferably 5 μm or more. On the other hand, from the viewpoint of improving morphological stability, the height of each convex portion 111 is preferably 20 μm or less, more preferably 15 μm or less, and further preferably 10 μm or less. Here, the height of the convex portion 111 is preferably 20 μm or less, more preferably 15 μm or less, and further preferably 10 μm or less. Figure 3A Indicated by H.

[0077] In addition, from the viewpoint of improving adhesion to suppress positional deviation during capture, the area of ​​each convex portion 111 is preferably 1% or more, more preferably 5% or more, more preferably 10% or more, further preferably 18% or more, and particularly preferably 40% or more relative to the area of ​​the adhesive layer 110. On the other hand, from the viewpoint of improving the pressure relaxation effect, the area of ​​each convex portion is preferably 95% or less, more preferably 75% or less, and further preferably 60% or less relative to the area of ​​the adhesive layer 110.

[0078] The concavoconvexity of the adhesive layer 110 can also be designed according to the shape of the element held by the adhesive sheet. For example, from the viewpoint of improving adhesion to suppress positional deviation during capture, the ratio of the bonding area between the adhesive layer 110 and an element to the area of ​​one element is preferably 1% or more relative to 100% of the area of ​​one element, more preferably 2% or more, more preferably 3% or more, more preferably 4% or more, more preferably 5% or more, further preferably 7% or more, and particularly preferably 10% or more. On the other hand, from the viewpoint of improving the pressure relief effect, the ratio of the bonding area between the adhesive layer 110 and an element to the area of ​​one element is preferably 95% or less, more preferably 70% or less, further preferably 50% or less, and particularly preferably 30% or less. Figure 3A In the case of, the bonding area is equivalent to the area of ​​a circle with a diameter T. It should be noted that when the capture position of the element on the adhesive sheet is offset, the bonding area may change. In this case, regardless of the capture position of the element, the bonding area ratio can be within the above range.

[0079] (Thickness of adhesive layer)

[0080] The thickness of the adhesive layer 110 is not particularly limited. From the viewpoint of adhesion, it can be preferably set to 1 μm or more, more preferably 5 μm or more, and more preferably 10 μm or more, and preferably 70 μm or less, more preferably 50 μm or less, and more preferably 40 μm or less. The thickness of the adhesive layer 110 can preferably be set to 1 μm or more and 70 μm or less, more preferably 5 μm or more and 50 μm or less, and more preferably 10 μm or more and 40 μm or less.

[0081] (Composition of Adhesive Layer (Adhesive Composition))

[0082] The adhesive composition forming the adhesive layer 110 contains resin. As examples of the resin contained in the adhesive composition, rubber resins such as polyisobutylene resins, polybutadiene resins, and styrene-butadiene resins, acrylic resins, urethane resins, polyester resins, olefin resins, silicone resins, and polyvinyl ether resins can be listed. In addition, the adhesive layer can have heat resistance, and as the material of this heat-resistant adhesive layer, polyimide resins and silicone resins can be listed. The adhesive composition forming the adhesive layer 110 can contain a copolymer with two or more structural units. The form of this copolymer is not particularly limited, and can be any of a block copolymer, a random copolymer, an alternating copolymer, and a graft copolymer. In addition, the resin contained in the adhesive composition forming the adhesive layer 110 can be composed of one resin or two or more resins.

[0083] The resin contained in the adhesive composition forming the adhesive layer 110 can be set as an adhesive resin having adhesiveness alone. In addition, the resin can be set as a polymer with a mass average molecular weight (Mw) of more than 10,000. From the viewpoint of improving the adhesive force, the mass average molecular weight (Mw) of the resin is preferably more than 10,000, more preferably more than 70,000, and more preferably more than 140,000. In addition, from the viewpoint of suppressing the elastic modulus to be below the specified value, the Mw is preferably less than 2 million, more preferably less than 1.2 million, and more preferably less than 900,000. In addition, from the viewpoint of improving the adhesive force, the number average molecular weight (Mn) of the resin is preferably more than 10,000, more preferably more than 50,000, and more preferably more than 100,000. In addition, from the viewpoint of suppressing the elastic modulus to be below the specified value, the Mn is preferably less than 2 million, more preferably less than 1 million, and more preferably less than 700,000. As described below, when the adhesive layer 110 contains a resin derived from an energy-ray-curable resin, its mass average molecular weight (Mw) and number average molecular weight (Mn) refer to the mass average molecular weight (Mw) and number average molecular weight (Mn) before a crosslinking reaction occurs by energy application.

[0084] Furthermore, from the viewpoint of improving adhesive strength, the glass transition temperature (Tg) of the resin is preferably -75°C or higher, more preferably -70°C or higher, and is preferably -10°C or lower, more preferably -20°C or lower.

[0085] The amount of resin relative to the total amount of components constituting the adhesive composition that forms the adhesive layer 110 can be appropriately set according to the required adhesive strength of the adhesive layer 110, and is preferably 30 mass % or more, more preferably 40 mass % or more, more preferably 50 mass % or more, further preferably 55 mass % or more, particularly preferably 60 mass % or more, and is preferably 99.99 mass % or less, more preferably 99.95 mass % or less, further preferably 99.90 mass % or less.

[0086] Thermoplastic resin

[0087] In one embodiment, the resin contained in the adhesive composition forming the adhesive layer 110 may contain a thermoplastic resin. That is, the adhesive layer 110 may be formed of a thermoplastic resin. When a thermoplastic resin is used, the resin is softened by heating, and it is easy to form a concave-convex shape in the adhesive layer 110, and it is easy to maintain the concave-convex shape formed by cooling the resin. As examples of thermoplastic resins, rubber resins, acrylic resins, urethane resins, and olefin resins can be listed. As an example, a polybutadiene-based thermoplastic elastomer using butadiene as a monomer, a styrene-based thermoplastic elastomer using styrene as a monomer, and an acrylic thermoplastic elastomer using (meth)acrylate as a monomer can be listed.

[0088] Acrylic resin (A)

[0089] In one embodiment, the thermoplastic resin may be an acrylic resin (A). From the viewpoint of improving adhesive strength, the mass average molecular weight (Mw) of the acrylic resin (A) is preferably 10,000 or more, more preferably 100,000 or more, and further preferably 500,000 or more. In addition, from the viewpoint of suppressing the elastic modulus to a value below a specified value, it is preferably 2,000,000 or less, more preferably 1,500,000 or less, and further preferably 1,000,000 or less.

[0090] From the viewpoint of improving adhesive strength, the glass transition temperature (Tg) of the acrylic resin (A) is preferably -75°C or higher, more preferably -70°C or higher, and is preferably 75°C or lower, more preferably 25°C or lower, and further preferably -55°C or lower.

[0091] When the acrylic resin (A) has two or more structural units, the glass transition temperature (Tg) of the acrylic resin (A) can be calculated using the Fox equation. The Tg of the monomer from which the structural unit is derived can be the value described in the polymer data handbook or the adhesive handbook.

[0092] Examples of the (meth)acrylic acid ester constituting the acrylic resin (A) include methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, isopropyl (meth)acrylate, n-butyl (meth)acrylate, isobutyl (meth)acrylate, sec-butyl (meth)acrylate, tert-butyl (meth)acrylate, amyl (meth)acrylate, hexyl (meth)acrylate, heptyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, isooctyl (meth)acrylate, n-octyl (meth)acrylate, n-nonyl (meth)acrylate, isononyl (meth)acrylate, decyl (meth)acrylate, undecyl (meth)acrylate, lauryl (meth)acrylate, tridecyl (meth)acrylate, myristyl (meth)acrylate, pentadecyl (meth)acrylate, palmityl (meth)acrylate, heptadecyl (meth)acrylate, and stearyl (meth)acrylate. (Meth)acrylic acid alkyl esters whose alkyl group is a chain structure with 1 to 18 carbon atoms; (meth)acrylic acid cycloalkyl esters such as isobornyl (meth)acrylate and dicyclopentanyl (meth)acrylate; (meth)acrylic acid aralkyl esters such as benzyl (meth)acrylate; (meth)acrylic acid cycloalkenyl esters such as dicyclopentenyl (meth)acrylate; (meth)acrylic acid cycloalkenyloxyalkyl esters such as dicyclopentenyloxyethyl (meth)acrylate; (meth)acrylic acid imide esters; (meth)acrylic acid esters containing glycidyl group such as glycidyl (meth)acrylate; (meth)acrylic acid esters containing hydroxyl group such as hydroxymethyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 3-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, 3-hydroxybutyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate; (meth)acrylic acid esters containing substituted amino groups such as N-methylaminoethyl (meth)acrylate, etc. Here, the "substituted amino group" refers to a group having a structure in which one or two hydrogen atoms of an amino group are substituted with a group other than a hydrogen atom.

[0093] The acrylic resin (A) may be a resin obtained by copolymerizing one or more monomers selected from (meth)acrylic acid, itaconic acid, vinyl acetate, acrylonitrile, styrene, and N-methylolacrylamide, in addition to (meth)acrylate.

[0094] The monomers constituting the acrylic resin (A) may be one kind or two or more kinds. When two or more kinds are used, the combination and ratio of the monomers may be arbitrarily selected.

[0095] The acrylic resin (A) may have a functional group that can bond to other compounds, such as a vinyl group, a (meth)acryloyl group, an amino group, a carboxyl group, an isocyanate group, etc., in addition to a hydroxyl group. These functional groups, including the hydroxyl group of the acrylic resin (A), may bond to other compounds via a crosslinking agent (C) described later, or may directly bond to other compounds without the crosslinking agent (C).

[0096] The amount of acrylic resin (A) in the total amount of resins in the adhesive composition can be appropriately set according to the required adhesive strength of the adhesive layer 110, and is preferably 0 mass % or more, more preferably 10 mass % or more, further preferably 20 mass % or more, particularly preferably 50 mass % or more, and is preferably 100 mass % or less, more preferably 95 mass % or less, further preferably 80 mass % or less, and particularly preferably 60 mass % or less.

[0097] Energy ray curable resin (B)

[0098] In one embodiment, the resin contained in the adhesive composition forming the adhesive layer 110 may contain an energy-ray curable resin (B). "Energy-ray curability" refers to the property of curing by irradiating energy rays, and energy-ray curable resin (B) refers to a resin that is cured by irradiating energy rays. In addition, "energy rays" refer to rays with energy quanta in electromagnetic waves or charged particle beams, and examples thereof include ultraviolet rays, radiation, electron beams, etc. Ultraviolet rays can be irradiated, for example, by using an electrodeless lamp, a high-pressure mercury lamp, a metal halide lamp, a UV-LED (Ultraviolet Light Emitting Diode) or the like as an ultraviolet light source. For electron beams, electron beams generated by electron beam accelerators or the like can be irradiated. In addition, "energy-ray polymerization" refers to the property of polymerization by irradiating energy rays.

[0099] When such an energy-beam-curable resin (B) is used, the formed concavo-convex shape can be easily maintained by applying energy (for example, irradiating with energy beams) after the concavo-convex shape is formed on the resin.

[0100] As the energy-ray curable resin (B), monomers, oligomers and polymers into which polymerizable functional groups are introduced can be used. The polymerizable functional group refers to a functional group that is cross-linked by the imparting of energy (e.g., irradiation with energy rays). Examples of the polymerizable functional group include alkenyl groups such as vinyl and allyl, (meth)acryloyl, oxetanyl, and epoxy groups.

[0101] From the viewpoint of improving adhesive force, the mass average molecular weight (Mw) of the energy-ray curable resin (B) is preferably 100 or more, and more preferably 150 or more. Furthermore, from the viewpoint of suppressing the elastic modulus to be below a predetermined value, the mass average molecular weight (Mw) of the energy-ray curable resin (B) is preferably 2 million or less, more preferably 1 million or less, and further preferably 200,000 or less.

[0102] When a monomer or oligomer is used as the energy-ray curable resin (B), from the viewpoint of polymerizability, the number average molecular weight (Mn) of the energy-ray curable resin (B) is preferably 100 or more, more preferably 150 or more. Furthermore, from the viewpoint of suppressing the elastic modulus to be below a predetermined value, the number average molecular weight (Mn) of the energy-ray curable resin (B) is preferably 5000 or less, more preferably 1000 or less, and further preferably 500 or less.

[0103] When a polymer is used as the energy-ray curable resin (B), from the viewpoint of improving the adhesive force, the mass average molecular weight (Mw) of the energy-ray curable resin (B) is preferably 10,000 or more, more preferably 50,000 or more, and further preferably 100,000 or more. In addition, from the viewpoint of suppressing the elastic modulus to a prescribed value or less, the mass average molecular weight (Mw) of the energy-ray curable resin (B) is preferably 2,000,000 or less, more preferably 500,000 or less, and further preferably 300,000 or less.

[0104] From the viewpoint of facilitating the maintenance of the concavo-convex shape of the adhesive layer, the average value of the number of polymerizable functional groups per molecule in the energy ray curable resin (B) is preferably 1.5 or more, more preferably 2 or more. On the other hand, from the viewpoint of improving the adhesiveness and flexibility of the adhesive layer, the average value is preferably 20 or less, more preferably 15 or less, and further preferably 10 or less.

[0105] In one embodiment, as the energy-ray curable resin (B), a monomer or oligomer having a polymerizable functional group can be used. As such an energy-ray curable compound, for example, poly (meth)acrylate monomers such as glycerol di(meth)acrylate, glycerol tri(meth)acrylate, 1,4-butanediol di(meth)acrylate, 1,6-hexanediol (meth)acrylate, trimethylolpropane tri(meth)acrylate, pentaerythritol (meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol hexa(meth)acrylate, tricyclodecane dimethanol di(meth)acrylate, etc. can be listed; urethane (meth)acrylate; polyester (meth)acrylate; polyether (meth)acrylate; epoxy (meth)acrylate, etc. Among them, from the perspective of maintaining the concavo-convex shape formed, preferably glycerol di(meth)acrylate, glycerol tri(meth)acrylate, tricyclodecane dimethanol di(meth)acrylate can be listed.

[0106] In one embodiment, as the energy-ray curable resin (B), a diene rubber composed of a polymer having a polymerizable functional group at the main chain end and / or side chain can be used. Diene rubber refers to a rubber-like polymer having a double bond in the polymer main chain. As specific examples of diene rubbers, polymers using butadiene or isoprene as monomers (i.e., having butene diyl or pentene diyl as structural units) can be listed. In one embodiment, as the energy-ray curable resin (B), polybutadiene resins, styrene-butadiene-styrene block copolymers, and styrene-isoprene-styrene block copolymers can be listed.

[0107] The amount of the energy-ray-curable resin (B) in the total amount of resin in the adhesive composition can be appropriately set according to the required adhesive strength of the adhesive layer 110, and is preferably 0 mass % or more, more preferably 10 mass % or more, further preferably 20 mass % or more, particularly preferably 50 mass % or more, and preferably 100 mass % or less, more preferably 95 mass % or less, further preferably 80 mass % or less, and particularly preferably 60 mass % or less.

[0108] In addition, in one embodiment, the adhesive composition may contain an acrylic resin (A) and an energy-ray curable resin (B). The relationship between the content of the acrylic resin (A) and the energy-ray curable resin (B) can be appropriately set according to the required adhesive force of the adhesive layer 110. In one embodiment, the content of the acrylic resin (A) in the total content of the acrylic resin (A) and the energy-ray curable resin (B) is preferably 0% by mass or more, more preferably 10% by mass or more, further preferably 20% by mass or more, particularly preferably 50% by mass or more, and preferably 100% by mass or less, more preferably 95% by mass or less.

[0109] The adhesive composition forming the adhesive layer 110 may contain components other than the resin. For example, the adhesive composition may contain one or more of a crosslinking agent (C), a photopolymerization initiator (D), an antioxidant (E), and other additives.

[0110] Crosslinking agent (C)

[0111] The adhesive composition may also contain a crosslinking agent (C) for bonding and crosslinking the functional groups of the resin with other compounds. Examples of the crosslinking agent (C) include isocyanate crosslinking agents (crosslinking agents having an isocyanate group) such as toluene diisocyanate, hexamethylene diisocyanate, xylylene diisocyanate, and adducts of these diisocyanates, epoxy crosslinking agents (crosslinking agents having a glycidyl group) such as ethylene glycol glycidyl ether, aziridine crosslinking agents (crosslinking agents having an aziridine group) such as hexa[1-(2-methyl)-aziridine]triphosphine triazine, metal chelate crosslinking agents (crosslinking agents having a metal chelate structure) such as aluminum chelates, and isocyanurate crosslinking agents (crosslinking agents having an isocyanuric acid skeleton), etc.

[0112] The adhesive composition may contain one crosslinking agent or two or more crosslinking agents. From the viewpoint of appropriately performing a crosslinking reaction, the content of the crosslinking agent (C) in the adhesive composition is preferably 0.01% by mass or more, more preferably 0.1% by mass or more, further preferably 1% by mass or more, and preferably 5% by mass or less, more preferably 4% by mass or less, further preferably 2% by mass or less.

[0113] Photopolymerization initiator (D)

[0114] The adhesive composition may also contain a photopolymerization initiator (D) that initiates a crosslinking reaction by energy impartation (e.g., irradiation with energy rays). When the adhesive composition contains an energy ray-curable resin (B), by further including a photopolymerization initiator (D) in the adhesive layer 110, a crosslinking reaction proceeds even by relatively low energy impartation.

[0115] Examples of the photopolymerization initiator (D) include 1-hydroxycyclohexyl phenyl ketone, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin propyl ether, benzyl phenyl sulfide, tetramethylthiuram monosulfide, azobisisobutyronitrile, dibenzyl, diacetyl, 8-chloroanthraquinone, and bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide.

[0116] The adhesive composition may contain one polymerization initiator or two or more polymerization initiators. The content of the photopolymerization initiator (D) in the adhesive composition is preferably 0.01% by mass or more, more preferably 0.1% by mass or more, and further preferably 1% by mass or more, and is preferably 10% by mass or less, more preferably 5% by mass or less, and further preferably 2% by mass or less.

[0117] Antioxidant (E)

[0118] The adhesive composition may contain an antioxidant (E). For example, examples of the antioxidant (E) include phenolic antioxidants such as hindered phenolic compounds, aromatic amine antioxidants, sulfur antioxidants, and phosphorus antioxidants such as phosphate antioxidant compounds.

[0119] Furthermore, the adhesive composition forming the adhesive layer 110 may contain one or more of an ultraviolet absorber, a light stabilizer, a resin stabilizer, a filler, a pigment, an extender, a softener, and the like.

[0120] <Adhesive Sheet Base Material>

[0121] The adhesive sheet substrate 120 of the adhesive sheet of the present embodiment functions as a support body for supporting the adhesive layer 110. The type of the adhesive sheet substrate 120 is not particularly limited, and may be a hard substrate or a soft substrate, for example, a plastic film, a metal foil such as aluminum or stainless steel, a glass paper, a high-quality paper, a coated paper, an impregnated paper, a synthetic paper, etc. In one embodiment, the adhesive sheet substrate 120 may be a soft substrate from the viewpoint of improving the cushioning when capturing the element, facilitating installation on other components, improving the peelability, facilitating lamination, or being able to be made into a roll form. As the adhesive sheet substrate 120, for example, a resin film may be used.

[0122] The resin film is a film using a resin material as a main material, and may be formed of the resin material or may contain additives in addition to the resin material. The resin film may also have laser transparency.

[0123] As specific examples of resin films, there can be listed: polyethylene films such as low-density polyethylene films, linear low-density polyethylene films, and high-density polyethylene films, polypropylene films, polybutylene films, polybutadiene films, polymethylpentene films, ethylene-norbornene copolymer films, and polyolefin films such as norbornene resin films; ethylene-vinyl acetate copolymer films, ethylene-(meth)acrylic acid copolymer films, and ethylene-(meth)acrylic acid ester copolymer films. Ethylene copolymer films such as polyvinyl chloride films and vinyl chloride copolymer films; polyester films such as polyethylene terephthalate films and polybutylene terephthalate films; polyurethane films; polyimide films; polystyrene films; polycarbonate films; and fluororesin films. In addition, films containing a mixture of two or more materials, cross-linked films formed by cross-linking the resins forming these films, and modified films such as ion polymer films can also be used. In addition, the adhesive sheet substrate 120 can also be a laminated film formed by laminating two or more resin films.

[0124] From the perspective of versatility, relatively high strength and easy prevention of warping, and heat resistance, the resin film can be set as a single-layer film selected from the group consisting of polyethylene film, polyester film, and polypropylene film, or a laminated film formed by laminating two or more films selected from the group.

[0125] The thickness of the adhesive sheet substrate 120 is not particularly limited. From the perspective of both support and roll winding properties, it can be preferably set to 10 μm or more, more preferably 25 μm or more, and more preferably 40 μm or more, and preferably 500 μm or less, more preferably 200 μm or less, and more preferably 90 μm or less. The thickness of the adhesive sheet substrate 120 can preferably be set to a range of 10 μm or more and 500 μm or less, more preferably 25 μm or more and 200 μm or less, and more preferably 40 μm or more and 90 μm or less.

[0126] <Other layers>

[0127] The adhesive sheet may also have a layer other than the adhesive sheet substrate 120 and the adhesive layer 110. For example, an adhesive layer may be further provided on the surface of the adhesive sheet substrate 120 opposite to the adhesive layer 110. The adhesive sheet may be attached to other substrates such as quartz glass via such an adhesive layer. The type of the further provided adhesive layer is not particularly limited, and for example, a conventional adhesive may be used to form the further provided adhesive layer.

[0128] <Method for producing adhesive sheet>

[0129] There is no particular limitation on the method for manufacturing the adhesive sheet. In one embodiment, an adhesive sheet having an adhesive layer 110 on an adhesive sheet substrate 120 can be manufactured as follows. First, an organic solvent is added to the adhesive composition forming the adhesive layer 110 to prepare a solution of the adhesive composition. Next, the solution is applied to the adhesive sheet substrate 120 to form a coating film and then dried, thereby providing an adhesive layer on the adhesive sheet substrate 120. Furthermore, by performing a process of providing a concave-convex surface on the adhesive layer, an adhesive layer 110 having a concave-convex surface can be formed.

[0130] In another embodiment, an adhesive sheet having an adhesive layer 110 on an adhesive sheet substrate 120 can be produced as follows. First, an organic solvent is added to an adhesive composition forming the adhesive layer 110 to prepare a solution of the adhesive composition. Next, the solution is applied to a mold or a release sheet having concave-convex shapes opposite to those of the adhesive layer 110 (complementary concave-convex shapes) to form a coating film and then dried to produce the adhesive layer 110. The adhesive sheet can be produced by attaching the adhesive layer 110 to the adhesive sheet substrate 120.

[0131] Examples of organic solvents for preparing the solution of the adhesive composition include toluene, ethyl acetate, and methyl ethyl ketone. Examples of the method for applying the solution include spin coating, spray coating, rod coating, knife coating, roll coating, roll knife coating, blade coating, die coating, gravure coating, and printing methods (e.g., screen printing and inkjet).

[0132] In the preparation of the adhesive sheet of one embodiment, the processing of setting the concavoconvex on the surface of the adhesive layer is also not particularly limited. For example, the surface of the adhesive layer can be set with a embossing method. In the embossing method, a mold having a shape complementary to the concavoconvex to be set can be used. Specifically, the adhesive layer provided on the adhesive sheet substrate can be pressed by the mold while the adhesive layer is heated, so as to set the concavoconvex on the surface of the adhesive layer. As a more specific method, the adhesive layer can be pressed by the mold, the adhesive layer is heated and maintained for a predetermined time, and then the adhesive layer is cooled and the mold is removed. When the adhesive layer is heated, for example, the adhesive layer can be heated to a temperature higher than the softening point of the adhesive layer. In addition, the time for maintaining the adhesive layer in a heated state is also not particularly limited, for example, it can be maintained for more than 10 seconds, or it can be maintained for less than 10 minutes. As a specific method for heating the adhesive layer while using a mold to press the adhesive layer, a method for vacuum laminating the adhesive layer provided on the adhesive sheet substrate and the mold can be cited. It should be noted that the adhesive layer 110 having the surface irregularities may be formed on the adhesive sheet substrate 120 in a single step instead of performing the two-step steps of forming the adhesive layer and forming the irregularities.

[0133] As another method, a solution of an adhesive composition can be sprayed to provide an adhesive layer 110 having a concavo-convex shape. In addition, a filler can be added to a solution of an adhesive composition and the solution can be applied to provide an adhesive layer 110 having a rough surface or a fibrous surface. As a further other method, a solution of an adhesive composition can be applied in a desired pattern by a printing method such as an inkjet method to directly provide an adhesive layer having a concavo-convex shape on an adhesive sheet substrate.

[0134] In addition, the adhesive sheet without the adhesive sheet substrate 120 can be made by forming the adhesive composition into a sheet. Moreover, the adhesive layer can also be formed by applying the liquid adhesive containing the adhesive composition to any object. In these cases, the surface of the adhesive layer can be provided with a concavo-convex process after the adhesive layer is formed, and the adhesive layer can also be formed by forming a concavo-convex method on the surface.

[0135] <Component snapping>

[0136] The adhesive sheet of this embodiment can be used to capture an element that is separated from a holding substrate. For example, the adhesive sheet can be used as a grain capture sheet for capturing grains such as semiconductor grains. The element is used to manufacture electronic components or semiconductor devices.

[0137] (Preparation of adhesive sheet)

[0138] FIG. 4A to FIG. 4C This is a schematic diagram for explaining the separation and capture of components. For the replenishment of components of the self-holding substrate by the adhesive sheet, please refer to FIG. 4A to FIG. 4C For example Figure 1 As shown in FIG. 1 , the laminate is usually attached with the adhesive sheet and the release sheet just before use. Figure 4A As shown, the release sheet is peeled off from the laminated body to prepare an adhesive sheet 150 having an uneven adhesive layer.

[0139] (Preparation of components and substrate)

[0140] like Figure 4B As shown in FIG. 1 , the element 170 to be attached to the holding substrate 160 is prepared so as to face the adhesive sheet 150 .

[0141] element

[0142] The type of component is not particularly limited. The component may be, for example, a semiconductor chip such as an LED chip, a semiconductor chip with a protective film, a semiconductor chip with a die-attached film (DAF), etc. In addition, the component may be a micro light-emitting diode, a small light-emitting diode, a power device, a MEMS (Micro Electro Mechanical Systems), or a control chip, or a component thereof. In addition, the component may be a monolithic object such as a wafer, a panel, or a substrate. For example, the component may also have a circuit surface, which is formed with an integrated circuit having circuit elements such as transistors, resistors, and capacitors. In addition, the component is not necessarily limited to a monolithic object, and may also be various wafers or various substrates that are not monolithic.

[0143] The size of the element is not particularly limited. For example, the size of the element is preferably 100 μm. 2 More preferably 500 μm 2 More preferably, 1000 μm 2 On the other hand, the size of the element may preferably be 100 mm 2 Below, more preferably 25mm 2 Below, more preferably 1mm 2 When using small-sized components, the laser lift-off method described later is suitable for separating the components because it is easy to selectively separate the small components.

[0144] As wafers, for example, semiconductor wafers such as silicon wafers, silicon carbide (SiC) wafers, compound semiconductor wafers (such as gallium phosphide (GaP) wafers, gallium arsenide (GaAs) wafers, indium phosphide (InP) wafers, and gallium nitride (GaN) wafers) can be listed. The size of the wafer is not particularly limited, preferably 6 inches (about 150 mm in diameter) or more, and more preferably 12 inches (about 300 mm in diameter) or more. It should be noted that the shape of the wafer is not limited to a circle, and can be, for example, a rectangle such as a square or a rectangle.

[0145] As the panel, a fan-out semiconductor package (such as FOWLP (Fan Out Wafer Level Package: fan-out wafer level package) or FOPLP (Fan-out Panel Level Package: fan-out panel level package)) can be cited. That is, the processed object can be a semiconductor package before or after singulation in the fan-out semiconductor package manufacturing technology. The size of the panel is not particularly limited, for example, it can be a rectangular substrate of about 300mm to 700mm.

[0146] Examples of the substrate include a glass substrate, a sapphire substrate, and a compound semiconductor substrate.

[0147] Keep the substrate

[0148] The type of the holding substrate is also not particularly limited. For example, the holding substrate may be an adhesive sheet or a tray. The adhesive sheet may have an adhesive layer, and the adhesive layer may be provided on the substrate. In this case, the holding substrate may hold the element on the adhesive layer. The substrate may be a resin film or a hard substrate.

[0149] The method for preparing the holding substrate for holding the element is also not particularly limited. For example, a semiconductor wafer may be attached to the holding substrate, and then the semiconductor wafer may be cut. Thus, by cutting the semiconductor wafer, the element may be obtained, and thus the holding substrate with the element attached thereto may be obtained.

[0150] As another method, the element obtained by cutting the semiconductor wafer can be transferred to the holding substrate, thereby obtaining the holding substrate with the element attached. For example, after cutting the semiconductor wafer held on the wafer substrate, the obtained element is made to be in close contact with the adhesive layer of the holding substrate. Then, by applying external stimulation such as laser, the adhesion between the wafer substrate and the element can be reduced. Through this step, the element can be transferred from the wafer substrate to the holding substrate.

[0151] It should be noted that, as described below, in one embodiment, the element is separated from the holding substrate by irradiation with laser (laser lift-off method). When using this method, the adhesive layer holding the substrate may contain a laser absorbent. As the laser absorbent, for example, one or more selected from pigments and dyes can be listed.

[0152] (Separation and capture of components)

[0153] like Figure 4C As shown, the element 170 attached to the holding substrate 160 is separated from the holding substrate 160 by an external stimulus and captured by the adhesive sheet 150. In one embodiment, the holding substrate 160 and the adhesive sheet 150 are stationary, and the element 170 separated from the holding substrate 160 moves toward the adhesive sheet 150. For example, when the laser lift-off method described later is used, the element 170 can be moved toward the adhesive sheet 150 by utilizing the pressure of the gas generated by the irradiation of the laser. On the other hand, the element 170 does not necessarily have to move. For example, the holding substrate 160 can be moved away from the element 170. In addition, the adhesive sheet 150 can also be moved toward the element 170.

[0154] Separation

[0155] The type of external stimulus during element separation is not particularly limited, and examples thereof include energy imparting, cooling, extension of the holding substrate, and physical stimulation (for example, pressing the back of the holding substrate with a pin, etc.). By using one or more of these external stimuli, the bonding force between the holding substrate and the element can be reduced, and then the element can be separated from the holding substrate.

[0156] As a method of imparting energy, local heating, light irradiation, or hot ray irradiation can be listed. In addition, as a method of light irradiation, infrared irradiation, visible light irradiation, and laser irradiation can be listed. In one embodiment, laser irradiation is performed as an external stimulus, that is, the element is separated from the holding substrate by a laser stripping method. At this time, the laser is irradiated toward the pasting part of the specific element in the holding substrate. For example, the surface of the holding substrate opposite to the element can be irradiated with such laser. Then, gas is generated at the contact part between the specific element and the holding substrate. For example, if the laser is absorbed by the adhesive layer, gas is generated by sublimation of at least a portion of the adhesive layer. In this way, by sublimation of at least a portion of the adhesive layer, the bonding area between the specific element and the adhesive layer is reduced, so the bonding force between the specific element and the holding substrate decreases. In addition, by the pressure of the generated gas, the bonding force between the specific element and the holding substrate will also decrease. As a result, the specific element is separated from the holding substrate.

[0157] The irradiation conditions of the laser are not particularly limited. From the perspective of selectively separating a portion of the elements efficiently, the frequency of the laser is preferably 10,000 Hz or more and 100,000 Hz or less. In addition, the beam diameter of the laser is preferably 10 μm or more, more preferably 20 μm or more, on the other hand, preferably 100 μm or less, more preferably 40 μm or less. The output of the laser is preferably 0.1 W or more and 10 W or less. The scanning speed of the laser is preferably 50 mm / sec or more and 2000 mm / sec or less.

[0158] Capture

[0159] like Figure 4C As shown, the element 170 separated from the holding substrate 160 is captured on the adhesive sheet 150. Specifically, the element 170 is relatively far away from the holding substrate 160. In addition, the element 170 is relatively close to the adhesive sheet 150. Then, the element 170 is captured on the adhesive sheet 150 by contacting the adhesive layer 110 of the adhesive sheet 150.

[0160] The compressed gas between the element and the adhesive layer 110 generated by the proximity of the element and the adhesive layer 110 can escape to the concave portion of the adhesive sheet. In this way, the pressure generated between the element 170 and the adhesive layer 110 can be relieved by the concave-convexity of the adhesive layer 110. Therefore, the displacement of the holding position of the element on the adhesive sheet due to the pressure generated between the element and the adhesive layer 110 can be suppressed.

[0161] <<Peel Sheet>>

[0162] <Peeling layer>

[0163] The release sheet of the present embodiment has a release layer 130, which is a layer in contact with the adhesive layer and may contain a resin. As described above, the surface of the release layer 130 has projections and depressions. The surface projections and depressions of the release layer 130 are in a complementary relationship with the surface projections and depressions of the adhesive layer 110. That is, the shape of the projections 111 of the adhesive layer 110 is the same as the shape of the recesses 132 of the release layer 130, and the shape of the recesses 112 of the adhesive layer 110 is the same as the shape of the projections 131 of the release layer 130. It should be noted that the release sheet may also have more than two layers of release layers 130. For example, the release sheet may have a laminate of one or more release layers 130.

[0164] (Shape of peeling layer)

[0165] In one embodiment, the peeling layer 130 has a plurality of concave portions separated from each other by convex portions on its surface. Each of the plurality of concave portions may be separated by a convex portion that is continuous across the entire peeling layer 130. As described above, the surface concave-convex of the peeling layer 130 is in a complementary relationship with the surface concave-convex of the peeling layer 130, and the specific shape of the concave-convex on the surface of the peeling layer 130 is not limited.

[0166] In one embodiment, the convex portion located around each of the plurality of concave portions continues to the end of the release layer 130 . FIG. 5A to FIG. 5C FIG. 1 is a top view showing the shape of the peeling layer 130. Figure 5A As shown, the surface of the peeling layer 130 may be regularly arranged with recesses 132. Regular arrangement of the recesses 132 means that the recesses 132 are arranged on a straight line at a fixed interval. Figure 5B As shown, the recesses 132 may also be arranged in a manner with regularly varying intervals. Figure 5B In the example of FIG. 1 , the intervals between the recesses 132 are shortened in the center of the release sheet, and the intervals between the recesses 132 are lengthened in the peripheral portion of the release sheet. Furthermore, the recesses 132 may be arranged irregularly.

[0167] Figure 5C 1 is a top view showing another shape of the peeling layer 130. Figure 5C As shown, stripe-shaped recessed portions 132 may be provided on the surface of the release layer 130 . Figure 5C In the embodiment, linear recesses 132 having a certain width are arranged at a certain interval. Figure 5B Likewise, the width or interval of the linear recesses 132 may vary regularly, or the linear recesses 132 may be arranged irregularly.

[0168] It should be noted that if Figure 5BAs shown, the minimum interval among all the recesses 132 in the central portion of the peeling sheet may be shorter than the minimum interval among all the recesses 132 in the peripheral portion of the peeling sheet. Here, the central portion is, for example, a circular area having 1 / 4 of the area of ​​the peeling sheet and centered at the center of gravity of the peeling sheet, and the peripheral portion is, for example, all areas other than the central portion of the peeling sheet.

[0169] As described above, the surface roughness of the release layer 130 and the surface roughness of the adhesive layer 110 are in a complementary relationship. Therefore, the pitch P of the recesses 132 of the release layer 130 can be set to be the same as the pitch of the protrusions 111 of the adhesive layer 110. In this regard, the pitch of the recesses 132 is preferably greater than 1 μm, more preferably greater than 5 μm, further preferably greater than 10 μm, and particularly preferably greater than 15 μm. On the other hand, the pitch is preferably less than 100 μm, more preferably less than 75 μm, more preferably less than 50 μm, further preferably less than 35 μm, and particularly preferably less than 25 μm. Here, the pitch of the recess 132 refers to the distance between the center point of an arbitrarily selected recess 132 and the center point of another recess 132 closest to the recess 132. For example, Figure 5A In the case of , the pitch of the concave portion 132 means the distance between the center point of the concave portion 132 on the straight line where the concave portions 132 are arranged at a certain interval and the center point of another concave portion 132' closest to the concave portion 132. When the concave portions 132 are arranged on a plurality of straight lines, the pitch means the distance between the center points of the concave portions on the straight line arranged with the shortest pitch. Figure 5C In the case where the concave portion 132 is generally elongated and it is difficult to identify the center point of the concave portion, the pitch refers to the distance from the boundary of the concave portion 132 on the same side to the boundary of another concave portion 132 ′ that is closest to the concave portion.

[0170] The specific shape of the recess 132 is not particularly limited. For example, the recess 132 may be recessed in a pillar shape. As a specific example, the recess 132 may be recessed in a cylindrical shape or in a prism shape. In addition, as described above, the recess 132 may be recessed in a linear extension or in a curved extension such as a wave shape. Furthermore, these recesses 132 may be provided with a slope.

[0171] Fig. 6A FIG. 1 is a cross-sectional view of the peeling layer 130 according to one embodiment, which passes through the recess 132 and is perpendicular to the surface of the peeling layer 130 . Fig. 6A The recess 132 shown in the figure has an inclination, that is, the front end of the recess 132 becomes thinner. Fig. 6A As shown, the surface of the peeling layer 130 may have flat convex portions and concave portions 132 that are concave from the convex portions. As described above, the concave portions 132 that are spaced apart from each other may have boundaries determined by the convex portions.

[0172] In addition, if Figure 6BAs shown, the bottom of the concave portion 132 may be a curved surface such as a hemispherical shape or a part of a sphere. On the other hand, the bottom of the concave portion may also be a flat surface. As a further example, the concave portion 132 may be in the shape of a plurality of particle collections, a lotus leaf surface, or a needle-like concave shape. As a further example, the surface of the peeling layer 130 may be a rough surface or a fibrous concave surface, and it can be said that such a surface also has concave and convex.

[0173] As described above, the surface convexities and concavities of the peeling layer 130 are complementary to those of the adhesive layer 110. To facilitate the adhesive layer 110 to be peeled off from the peeling layer 130, the size of the concave portion 132 of the peeling layer 130 described below may be the same as or larger than the size of the convex portion 111 of the adhesive layer 110.

[0174] The width or diameter of each concave portion 132 is the width or diameter of the top portion rather than the bottom portion, and is preferably 1 μm or more, more preferably 2 μm or more, further preferably 5 μm or more, and particularly preferably 10 μm or more. On the other hand, it is preferably 100 μm or less, more preferably 50 μm or less, further preferably 30 μm or less, and particularly preferably 20 μm or less. Here, the width and diameter of the concave portion 132 refer to the minimum distance and maximum distance ( Fig. 6A Indicated by D).

[0175] In addition, the area of ​​each recess 132 is preferably 10 μm 2 More preferably, 20 μm 2 More preferably, 30 μm 2 On the other hand, the area of ​​each convex portion 111 is preferably 2000 μm 2 Below, more preferably 1000 μm 2 Below, more preferably 500 μm 2 Here, the area of ​​the concave portion 132 refers to the area of ​​the portion sunken from the surface of the convex portion ( Fig. 6A In the case of , it is the area of ​​a circle with diameter D).

[0176] In addition, the height (depth) of each concave portion 132 is preferably 1 μm or more, more preferably 3 μm or more, and further preferably 5 μm or more. On the other hand, the height (depth) of each concave portion 132 is preferably 20 μm or less, more preferably 15 μm or less, and further preferably 10 μm or less. Here, the depth of the concave portion 132 is preferably Fig. 6A Indicated by H.

[0177] Furthermore, the area of ​​each recessed portion 132 is preferably 1% or more, more preferably 5% or more, more preferably 10% or more, further preferably 18% or more, and particularly preferably 40% or more relative to the area of ​​the peeling layer 130. On the other hand, the area of ​​each recessed portion 132 is preferably 95% or less, more preferably 75% or less, and further preferably 60% or less relative to the area of ​​the peeling layer 130.

[0178] (Thickness of peeling layer)

[0179] The thickness of the peeling layer 130 is not particularly limited. From the perspective of peelability, it is preferably 10 μm or more, more preferably 15 μm or more, and more preferably 20 μm or more, and preferably 50 μm or less, more preferably 45 μm or less, and more preferably 40 μm or less. The thickness of the peeling layer 130 can preferably be set in the range of 10 μm or more and 50 μm or less, more preferably 15 μm or more and 45 μm or less, and more preferably 20 μm or more and 40 μm or less.

[0180] (Composition of Release Layer (Releasant Composition))

[0181] The stripper composition forming the stripping layer 130 contains a resin. In one embodiment, as the resin contained in the stripper composition, polyolefins such as polyethylene resins, thermoplastic elastomers such as olefin thermoplastic elastomers, fluororesins such as tetrafluoroethylene, and mixtures thereof, etc. can be cited. In addition, the stripper composition forming the stripping layer 130 may include a non-silicone stripper (resin) or a non-silicone olefin stripper (resin). As such resins, polyethylene resins and olefin thermoplastic elastomers can be cited. If the stripper composition contains a silicone resin, there will be a situation where a layer of silicone compounds from silicone resins is formed on the surface of a component in the manufacturing process, etc. By setting the resin contained in the stripper composition forming the stripping layer 130 to a non-silicone stripper (resin) or a non-silicone olefin stripper (resin), a suitable circuit can be formed without forming a layer of silicone compounds on the surface of a component in the manufacturing process, etc.

[0182] In one embodiment, when the resin contained in the release agent composition is an olefin-based thermoplastic elastomer and a polyethylene resin, the olefin-based thermoplastic elastomer and the polyethylene resin may satisfy the following conditions.

[0183] In one embodiment, the olefin-based thermoplastic elastomer may be an ethylene-propylene copolymer, an ethylene-octene copolymer, etc. For example, the olefin-based thermoplastic elastomer may be an ethylene-propylene copolymer. By using an ethylene-propylene copolymer as the olefin-based thermoplastic elastomer, a release sheet having excellent releasability can be obtained.

[0184] The density of the olefin-based thermoplastic elastomer is not particularly limited, but can be preferably set to 0.80 g / cm 3 More preferably 0.86 g / cm 3 As a result, the heat resistance is improved. In addition, the density of the olefin-based thermoplastic elastomer can be preferably set to 0.90 g / cm 3 Below, more preferably 0.88 g / cm 3 The density of the olefin-based thermoplastic elastomer can be preferably set to 0.80 g / cm 3 Above and 0.90g / cm 3 Below, more preferably 0.86 g / cm 3 Above 0.88g / cm 3 the following.

[0185] In one embodiment, the polyethylene resin can be synthesized using a transition metal catalyst such as a Ziegler-Natta catalyst or a metallocene catalyst. For example, a polyethylene resin synthesized using a metallocene catalyst has excellent releasability and heat resistance.

[0186] The density of the polyethylene resin is not particularly limited, but can be preferably set to 0.890 g / cm 3 More preferably 0.900 g / cm 3 As a result, the heat resistance is improved. In addition, the density of the polyethylene resin can be preferably set to 0.925 g / cm 3 Below, more preferably 0.922 gg / cm 3 The density of the polyethylene resin can be preferably set to 0.890 g / cm 3 Above 0.925g / cm 3 Below, more preferably 0.900 g / cm 3 Above 0.922g / cm 3 the following.

[0187] The mass ratio (blending ratio) of the olefin-based thermoplastic elastomer to the polyethylene resin is not particularly limited, and can be preferably set to 25:75 to 75:25, and more preferably 40:60 to 60:4. As a result, the peeling property and heat resistance are improved. It should be noted that the peeling agent composition forming the peeling layer 130 may also contain various additives such as other resin components, plasticizers, stabilizers, etc.

[0188] <Release Sheet Base Material>

[0189] The release sheet substrate 140 of the release sheet of this embodiment functions as a support body for supporting the release layer 130. The type of the release sheet substrate 140 is not particularly limited, and it can be a hard substrate or a soft substrate. As the release sheet substrate 140, for example, a resin film can be used. In addition, the release sheet substrate 140 can use the same thing as the aforementioned adhesive sheet substrate 120.

[0190] The thickness of the release sheet substrate 140 is not particularly limited. From the perspective of both support and roll winding properties, it is preferably 10 μm or more, more preferably 20 μm or more, and more preferably 30 μm or more, and preferably 200 μm or less, more preferably 150 μm or less, and more preferably 100 μm or less. The thickness of the release sheet substrate 140 can preferably be set in the range of 10 μm or more and 200 μm or less, more preferably 20 μm or more and 150 μm or less, and more preferably 30 μm or more and 100 μm or less.

[0191] <Other layers>

[0192] The release sheet may include layers other than the release sheet base material 140 and the release layer 130. For example, an intermediate layer may be provided between the release sheet base material 140 and the release layer 130 to improve the adhesion between the two.

[0193] <Method for producing release sheet>

[0194] The method for manufacturing the release sheet is not particularly limited. In one embodiment, a release sheet having a release layer 130 disposed on a release sheet substrate 140 can be manufactured as follows. First, an organic solvent is added to a release agent composition for forming the release layer 130 to prepare a solution of an adhesive composition. Next, the solution is applied to the release sheet substrate 140 to form a coating film and then dried, thereby providing a release layer on the release sheet substrate 140. Furthermore, by performing a process of providing a surface of the release layer with a concave-convex surface, a release layer 130 having a concave-convex surface can be formed.

[0195] In another embodiment, a release sheet having a release layer 130 on a release sheet substrate 140 can be produced as follows. First, an organic solvent is added to a release agent composition for forming the release layer 130 to prepare a solution of the release agent composition. Next, the solution is applied to a mold or adhesive sheet having concavities and convexities opposite to those of the release layer 130 (complementary concavities and convexities) to form a coating film, which is then dried to produce the release layer 130. The release sheet can be produced by attaching the release layer 130 to the release sheet substrate 120.

[0196] The organic solvent for preparing the solution of the release agent composition and the method for applying the solution can be the same as those used for the above-mentioned adhesive composition.

[0197] In the preparation of the pressure-sensitive adhesive sheet of one embodiment, the treatment of providing the surface of the release layer with irregularities is not particularly limited, and the same method as that for the pressure-sensitive adhesive layer can be used.

[0198] In addition, a release sheet without a release sheet substrate 140 can be produced by forming a release agent composition into a sheet. In addition, the release layer can also be formed by applying a liquid release agent containing a release agent composition to an arbitrary object. In these cases, a process of providing a surface of the release layer with unevenness can be performed after the release layer is formed, and the release layer can also be formed by a method of forming unevenness on the surface.

[0199] Example

[0200] The present invention is described in more detail below with reference to examples. However, the present invention is not limited to the following examples. Parts and % in each example are based on mass unless otherwise specified.

[0201] In the preparation of the pressure-sensitive adhesive sheets, the following compounds were used in Examples and Comparative Examples.

[0202] ((A) ingredient)

[0203] Acrylic copolymer (A1): monomer ratio is 2-ethylhexyl acrylate / 2-hydroxyethyl acrylate / acrylic acid = 92.8 / 7.0 / 0.2, and the mass average molecular weight (Mw) is 1.1 million

[0204] ((B) ingredient)

[0205] Energy beam curable resin (B1): manufactured by Toagosei Co., Ltd., product name "Aronix M-920"

[0206] Energy beam curable resin (B2): manufactured by Toagosei Co., Ltd., product name "Aronix M-930"

[0207] ((C) ingredient)

[0208] Crosslinking agent (C1): isocyanurate-type polyisocyanate derived from hexamethylene diisocyanate (component (D))

[0209] Photopolymerization initiator (D1): 1-hydroxycyclohexyl phenyl ketone

[0210] (Example 1)

[0211] Adhesive sheet production

[0212] 100 parts by mass of an acrylate copolymer (A), 5.0 parts by mass of an energy-ray curable resin (B1), 0.5 parts by mass of a crosslinking agent (C), and 0.15 parts by mass of a photopolymerization initiator (D1) were dissolved in toluene to prepare an adhesive composition. The adhesive composition was applied to the peeling-treated surface of a process sheet (manufactured by Lintec Co., Ltd., product name "SP-PET382150", thickness 38 μm), and the obtained coating was dried at 100° C. for two minutes to form an adhesive layer with a thickness of 25 μm. A substrate (polyethylene terephthalate film, thickness 50 μm) was bonded to the adhesive layer to produce an adhesive sheet having no concave-convex surface.

[0213] Preparation of release sheet with convex and concave surface

[0214] 50 parts by mass of an olefin-based thermoplastic elastomer including an ethylene-propylene copolymer and 50 parts by mass of a polyethylene resin were dissolved in toluene to prepare a release agent composition. The release agent composition was applied to a polyethylene terephthalate film (38 μm thick), and the obtained coating was dried at 100° C. for two minutes to form a release layer with a thickness of 20 μm. Thereafter, the release layer was heated to 160° C. to soften the release layer, and a master mold with a convex shape formed in advance was attached to produce a release sheet with a convex-concave surface.

[0215] After the process sheet was peeled off, the adhesive layer of the adhesive sheet was attached to the release sheet having a convex-concave surface, and vacuum laminated at 60°C for 300 seconds. Next, an ultraviolet irradiator (manufactured by Heraeus) was used at an illumination of 130 mW / cm 2 , light intensity 210mJ / cm 2 By irradiating ultraviolet rays, a laminate composed of the pressure-sensitive adhesive sheet having a concavo-convex shape on the surface and the release sheet having a concavo-convex shape on the surface is produced.

[0216] The concavo-convex shape of the adhesive layer of the adhesive sheet Figure 2A Similarly, the columns are arranged in a lattice shape. The pitch P between the columns in the adhesive sheet is 20 μm. Figure 3A The height (H) of each column shown is 8 μm, the diameter (T) of the front end is 8 μm, and the diameter (D) of the base is 16 μm. In addition, the ratio of the area of ​​the adhesive layer and the bonding portion of the element to be captured (i.e., the area of ​​the front end surface of the convex portion) to the area of ​​the adhesive sheet is about 12.6%. It should be noted that the concave-convex shape of the adhesive layer of the adhesive sheet has a surface shape complementary to the concave-convex shape of the release sheet.

[0217] (Examples 2 to 4 and Comparative Examples 1 and 2)

[0218] Except having changed the kind and blending ratio of each component as shown in Table 1, the same method as Example 1 was carried out to obtain laminated bodies of Examples 2 to 4 and Comparative Examples 1 and 2.

[0219] (Reference Example 1 and Reference Example 2)

[0220] Laminated bodies of Reference Examples 1 and 2 were obtained in the same manner as in Example 1 except that the types and blending ratios of the components were changed as shown in Table 1 and the unevenness was not formed on the surface of the pressure-sensitive adhesive sheet.

[0221] (Peel force)

[0222] The laminates obtained in the examples and comparative examples were cut into a size of 150 mm long x 50 mm wide. Next, the liner peeling peeling force of the release sheet (peeling force when the release sheet side is folded back at 180° and peeled) was measured at a tensile speed of 300 m / min using a universal tensile tester (manufactured by Shimadzu Corporation) at 23°C and 50% RH (relative humidity). Table 1 shows the peeling force results.

[0223] [Table 1]

[0224]

[0225] The peeling force of the laminated bodies of Examples 1 to 4 was 1000 mN / 50 mm or less. Therefore, the laminated bodies of Examples 1 to 4 can easily peel the pressure-sensitive adhesive sheet having the irregular surface from the release sheet.

[0226] On the other hand, the peeling force of the laminated bodies of Comparative Examples 1 and 2 was 1000 mN / 50 mm or more. Therefore, the laminated bodies of Comparative Examples 1 and 2 could not easily peel the PSA sheet having the irregular surface from the release sheet.

[0227] As mentioned above, although embodiment of the invention was described, the invention is not limited to the said embodiment, Various deformation|transformation and change are possible within the range of the summary of the invention.

[0228] This application claims the benefit of priority based on Japanese Patent Application No. 2022-151756 filed on September 22, 2022, Japanese Patent Application No. 2022-151757 filed on September 22, 2022, Japanese Patent Application No. 2023-058459 filed on March 31, 2023, Japanese Patent Application No. 2023-058460 filed on March 31, 2023, Japanese Patent Application No. 2023-058462 filed on March 31, 2023, and Japanese Patent Application No. 2023-058463 filed on March 31, 2023, and all the contents described therein are incorporated herein by reference.

Claims

1. A laminate comprising an adhesive sheet for capturing an element separated from a holding substrate and a release sheet laminated on one surface of the adhesive sheet, The adhesive sheet comprises an adhesive layer, and the adhesive layer has irregularities on its surface. The release sheet includes a release layer in contact with the adhesive layer, and the release layer has irregularities on its surface. The peeling force of the release sheet with respect to the pressure-sensitive adhesive sheet at a peeling angle of 180° measured at a peeling speed of 300 mm / min is 1000 mN / 50 mm or less.

2. The laminate according to claim 1, wherein The release layer includes a non-silicone release agent.

3. The laminate according to claim 1, wherein The release layer contains a non-silicone olefin-based release agent.

4. The laminate according to claim 1, wherein The surface irregularities of the adhesive layer and the surface irregularities of the release layer are in a complementary relationship.

5. The laminate according to claim 1, wherein The peeling layer has a plurality of concave portions on its surface, the concave portions defining boundaries and being separated from each other. The height of the recessed portion of the release layer is 1 μm or more.

6. The laminate according to claim 1, wherein The adhesive layer is formed of an adhesive composition containing an energy ray-curable compound (B).

7. The laminate according to claim 1, wherein The adhesive layer is formed from an adhesive composition including an acrylic resin (A).

8. The laminate according to claim 1, wherein The adhesive layer is formed of an adhesive composition containing an acrylic resin (A) and an energy-ray-curable compound (B).

9. The laminate according to claim 1, wherein The adhesive layer has a plurality of convex portions on its surface, the convex portions being bounded by concave portions and being separated from each other. The plurality of convex portions of the adhesive layer have a pitch of 1 μm or more and 100 μm or less.

10. The laminate according to claim 1, wherein The adhesive layer has a plurality of convex portions on its surface, the convex portions being bounded by concave portions and being separated from each other. The area of ​​each of the plurality of convex portions of the adhesive layer is 10 μm 2 Above and 2000μm 2 the following.

11. The laminate according to claim 1, wherein The adhesive layer has a plurality of convex portions on its surface, the convex portions being bounded by concave portions and being separated from each other. A ratio of an area occupied by the protrusions of the adhesive layer to an area of ​​the adhesive layer is 1% or more and 95% or less.

12. The laminate according to claim 1, wherein The adhesive layer is configured so that a ratio of an area of ​​adhesion between the adhesive layer and one of the components to an area of ​​one of the components is 1% or more and 95% or less.

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