Housing, lead frame composite and manufacturing method

Abstract

In at least one embodiment, a housing (2) for an optoelectronic semiconductor chip (3) comprises-a first and a second lead frame part (41, 42),-a housing body (5) which mechanically connects the lead frame parts (41, 42) to one another, the lead frame parts (41, 42) each have a mounting region (45) on an inner side (43) and the mounting regions (45) are accessible through the housing body (5) and each have an outer side (44) opposite the inner side (43),-the lead frame parts (41, 42) each have at least one solder inspection point (47), the welding inspection points (47) are formed by recesses (77) from the outer side (44) and are accessible from the outer side walls (55) of the housing (2), and the welding inspection points (47) are located on the outer side walls (55) opposite each other and are offset from each other.

Description

Technical Field

[0001] A housing for an optoelectronic semiconductor chip and a lead frame assembly therefor are proposed. Furthermore, a production method for such a housing is proposed. Summary of the invention

[0002] The object to be achieved is to specify a housing which is resistant to thermal loads.

[0003] This object is achieved in particular by a housing and leadframe assembly having the features of the independent claims and by a production method. Preferred developments are the subject matter of the dependent claims.

[0004] According to at least one embodiment, a housing for at least one optoelectronic semiconductor chip is provided. The semiconductor chip or the plurality of semiconductor chips are, for example, light emitting diode chips, LED chips for short, and / or laser diode chips, LD chips for short. A plurality of optoelectronic semiconductor chips of different types can be combined with one another in the housing, for example, optoelectronic semiconductor chips for generating different light colors, such as red, green and yellow, can be combined with one another in the housing.

[0005] According to at least one embodiment, the housing comprises a first lead frame part and a second lead frame part. Additional lead frame parts may be present. The term lead frame part refers in particular to a metal body, which is, for example, stamped and / or etched and / or cut from a metal sheet. All lead frame parts are preferably made of the same basic material, in particular copper sheet or copper foil. The lead frame parts may be provided with at least one metal coating, which is, however, preferably significantly thinner than the basic material.

[0006] According to at least one embodiment, the housing comprises a housing body. The housing body is made of at least one electrically insulating material and is based on plastic, for example. The housing body can be based on epoxy or silicone. It is possible that the housing body contains a mixture, such as particles or fibers, for adjusting thermal expansion or for improving mechanical stability. The housing body is preferably opaque.

[0007] According to at least one embodiment, the housing body mechanically connects the first lead frame part and the second lead frame part and optionally further lead frame parts to one another. That is, without the housing body, the lead frame parts are not mechanically fixed relative to one another. For example, the housing body partially or completely covers the side faces of the lead frame parts, at least within the housing body. In the lateral direction, the lead frame parts are exposed from the housing body, for example, only at the outer side walls of the housing.

[0008] According to at least one embodiment, the first leadframe part has a mounting region for accommodating a semiconductor chip and / or for accommodating electrical connections. The semiconductor chip is in particular at least one optoelectronic semiconductor chip, but the semiconductor chip can also be another type of semiconductor chip, for example a control chip or a protection chip for an optoelectronic semiconductor chip, for example for protection against damage caused by electrostatic discharge, ESD for short. In the mounting region, the first leadframe part preferably has its full thickness.

[0009] In the same way, the second leadframe part and / or at least one optional further leadframe part can also have a mounting region for at least one semiconductor chip, at least one optoelectronic semiconductor chip and / or at least one electrical connection, such as a bonding wire.

[0010] The mounting region is, for example, located at the inner side of the lead frame component. That is to say, the mounting region can be located inside the housing.

[0011] According to at least one embodiment, the mounting area is accessible through the housing body. For this purpose, the housing body has, for example, one or more recesses in which the lead frame part emerges. Alternatively, the housing body is only as flat as the lead frame part or approximately only as flat as the lead frame part, so that the housing base body leaves the mounting area free due to its small thickness.

[0012] The housing base body can be designed in one piece or also in multiple parts.

[0013] According to at least one embodiment, the lead frame parts each have an outer side opposite the inner side. Like the inner side, the outer side is preferably the main side, ie the largest side, of the lead frame part. The outer side is configured for external mounting of the housing, for example by welding.

[0014] According to at least one embodiment, the first leadframe part and the second leadframe part each have one or more weld inspection locations, also referred to as weld inspection structures. The weld inspection locations are each formed by a recess in the leadframe part concerned, starting from the associated outer side. In addition, the weld inspection locations are accessible from the outer side wall of the housing. That is, in the unmounted state of the housing, i.e., when the housing has not yet been welded to an external electrical carrier, the weld inspection locations are visible when viewed toward the side wall. The weld inspection locations are provided, for example, with at least one metal coating, so that the weld inspection locations are constructed to be wetted by solder.

[0015] According to at least one embodiment, the weld inspection locations are located on mutually opposite outer side walls of the housing. That is, the weld inspection locations are arranged on mutually facing side walls.

[0016] According to at least one embodiment, the weld inspection locations are arranged offset from one another, that is to say, for example, when viewed in a vertical projection onto one of the outer side walls in question, the weld inspection locations overlap only partially or not at all.

[0017] In at least one embodiment, the housing is provided for at least one optoelectronic semiconductor chip and comprises a first leadframe part and a second leadframe part and a housing body which mechanically connects the first leadframe part and the second leadframe part to one another.

[0018] in

[0019] the first leadframe part and the second leadframe part each have a mounting region at an inner side and each have an outer side opposite the inner side,

[0020] the first leadframe part and the second leadframe part each have at least one weld inspection location which is formed by a recess from the associated outer side and is accessible from an outer side wall of the housing, and

[0021] The weld inspection locations are located on mutually opposite outer side walls and are arranged offset with respect to one another.

[0022] In other words, a housing with staggered weld inspection structures is proposed, which can achieve a higher housing tightness of the QFN panel, a higher mechanical load capacity during production and a lower risk of gap formation and delamination between metal and housing plastic.

[0023] Quad-Flat No-leads, QFN housings are usually not completely free of gaps and delaminations between the metal lead frame and the housing plastic, such as epoxy resin molding compound. The gaps are partially already produced during the production of the panel with a plurality of housing units to be separated, and partially also during further processing. Particularly stressful processes are water jet deburring after molding, wire bonding, potting and sawing in the case of panels that are greatly curved and must be flattened.

[0024] It is possible to produce the etched solder check structure in such a way that an elongated recess is etched in the connecting tabs, also called tie bars, between the lead frame units, which is positioned symmetrically to the subsequent sawing path, for example. In the finished component, after sawing, the etched solder check structure is then exactly opposite to the opposite sides of the produced housing.

[0025] In the housing described here, the welding check structures are not etched into the continuous connecting strip. The etched grooves are not symmetrical with respect to the subsequent sawing path. Therefore, in the finished component, the welding check structures are not exactly opposite each other, but are arranged laterally offset from each other.

[0026] In particular, the following effects can be utilized in the housing described here, individually or in combination:

[0027] The two largest leadframe parts, also referred to as soldering pads, for example an LED soldering pad and an IC soldering pad, are no longer coupled closely to one another by means of a direct force line, but are connected to one another in a relatively mechanically flexible manner.

[0028] Each individual component in the panel composite has a circumferential half-etched web frame which, for example, by a regular grid-like arrangement, results in a grid structure which imparts a higher rigidity to the entire panel with respect to vibrations.

[0029] The half-etched surrounding connecting strip frame retains the full material thickness at certain locations. As a result, the panel can be reinforced against bending at particularly sensitive locations.

[0030] - Those points with full material thickness can simultaneously serve as sawing marks.

[0031] For example, the weak point in a QFN-LED component is the seam between the LED pad and the IC pad. Due to the staggered solder check structures, two adjacent components in the panel composite no longer pull against each other. At the same time, thickenings arranged at certain locations on the surrounding connecting strip frame protect the connection between the LED pad and the IC pad from harmful bending forces. Bending forces are generated, for example, by vibrations during water jet deburring or when a bent panel has to be flattened. Panel bending can even occur, for example when the panel is cooled, due to different thermal expansion coefficients. Reinforcements in the connecting strip frame protect sensitive areas in the panel during production.

[0032] According to at least one embodiment, the welding inspection locations are arranged completely offset from each other. That is to say, for example, the welding inspection locations are arranged without overlap in a direction parallel to the main axis. In other words, when the welding inspection locations are projected onto each other in a direction parallel to the main axis, the welding inspection locations do not overlap with each other.

[0033] For example, when viewed in a top view from the outside, the main axis extends perpendicularly to the mutually opposite outer side walls with the weld inspection location. Alternatively or additionally, the main axis can extend parallel to the other side walls, wherein the other side walls are oriented transversely to the mutually opposite outer side walls with the weld inspection location. Furthermore, when viewed in a top view from the outside, the main axis can intersect the center point of the housing. When viewed in a top view from the outside, the center point is in particular the intersection point of the diagonals or the area centroid in the case of four corners of the housing.

[0034] In other words, the weld inspection location is at different distances from a common reference surface of the housing, wherein the common reference surface is, for example, one of the other side walls. The difference in the distance from the reference surface is, for example, at least as great as the width of the weld inspection location along the outer side wall having the weld inspection location.

[0035] According to at least one embodiment, the first number N1 of weld inspection locations of the first lead frame part is different from the second number N2 of weld inspection locations of the second lead frame part. For example, |NI-N2|=1 or |NI-N2|=2 applies. Alternatively or additionally, it applies that: N1<N2. For example, N1=1 and N2=2, or N1=1 and N2=3, or N1=2 and N2=3.

[0036] For example, when viewed in a top view from the inside, the first lead frame part has a larger area than the second lead frame part.

[0037] According to at least one embodiment, the weld inspection locations of the first leadframe part and the second leadframe part are present only at two opposite outer side walls. That is to say, the further side wall then has no weld inspection location. Alternatively, the further side wall can be provided with further weld inspection locations, wherein the further weld inspection locations can optionally also be arranged offset from one another.

[0038] According to at least one embodiment, the first leadframe part and the second leadframe part extend with their outer sides only to the outer side wall. That is, when viewed in a plan view from the outer side, the first leadframe part and the second leadframe part may end spaced apart from the further side wall.

[0039] According to at least one embodiment, the first leadframe part and the second leadframe part are flush with the housing body at the outside and / or at opposite outer side walls. Thus, the housing underside and the outside of the housing body can lie in a common plane.

[0040] According to at least one embodiment, the housing further comprises one or more further leadframe components. The at least one further leadframe component is, for example, made of the same leadframe assembly as the first leadframe component and the second leadframe component.

[0041] According to at least one embodiment, at least one supporting web, also referred to as a connecting strip, is present at one further lead frame component, at one or more of the plurality of further lead frame components or at all further lead frame components. By means of the supporting webs, the lead frame components within the lead frame assembly can be mechanically connected to one another when no housing body is yet present.

[0042] According to at least one embodiment, at least one supporting web of the further leadframe part is exposed only at the further outer side wall extending transversely to the outer side wall with the weld inspection location. Thus, the side wall with the weld inspection location may not have supporting webs.

[0043] According to at least one embodiment, a further leadframe part or one or more of the further leadframe parts are connected to the first and / or second leadframe part by means of at least one further supporting web. In other words, a direct mechanical connection between the first and / or second leadframe part and at least one of the further leadframe parts in question can be achieved by means of the further supporting web.

[0044] Furthermore, a lead frame assembly is proposed for a housing as described in conjunction with one or more of the above embodiments. Therefore, features of the lead frame assembly are also disclosed for the housing and vice versa.

[0045] In at least one embodiment, the lead frame assembly includes a plurality of lead frame units for each housing. Each lead frame unit includes a first lead frame component and a second lead frame component,

[0046] Where in each lead frame unit:

[0047] the first and the second leadframe part each have a mounting region on an inner side and each have an outer side opposite the inner side, wherein it is possible for each inner side to be larger than the associated outer side,

[0048] the first and second leadframe parts each have at least one weld inspection location, the at least one weld inspection location being formed by a recess from the outside, and

[0049] The welding inspection points are located on opposite sides and are arranged offset with respect to one another.

[0050] According to at least one embodiment, each lead frame unit has a frame that partially or completely surrounds the lead frame unit. That is, the frame can surround the lead frame unit in question as a closed line. When viewed in a top view, the frame is, for example, rectangular. The frames of the lead frame units can form a grid as a whole. Adjacent lead frame units share the pillars of the frame.

[0051] According to at least one embodiment, the width of the frame, viewed in plan view from the outside and / or the inside, is at least 30 μm or at least 50 μm or at least 100 μm and alternatively or additionally at most 0.3 mm or at most 200 μm.

[0052] For example, the lead frame assembly has a thickness of at least 100 μm or at least 150 μm or at least 190 μm and / or at most 0.8 mm or at most 0.5 mm or at most 320 μm.

[0053] According to at least one embodiment, the frames each have a thickening with the full material thickness of the leadframe assembly and the thickening is arranged in the extension of the gap between the associated first and second leadframe parts. It is possible that the width of the frame in the region of the thickening is constant when viewed in a top view from the inside and / or outside.

[0054] According to at least one embodiment, the length of the thickening, viewed from the outside, is at least twice the width of the associated gap. Alternatively or additionally, the value is up to six times or up to three times. By means of such a thickening, bending of the lead frame assembly in the region of the gap can be prevented.

[0055] According to at least one embodiment, the frame has at least one further thickening which originates from at least one of the weld inspection locations. The further thickening extends, for example, in the extension of a gap between the first leadframe part and a plurality of further leadframe parts.

[0056] According to at least one embodiment, when viewed in a top view from the outside, the edge of the weld inspection point of one of the lead frame units extends between the weld inspection points of one of the lead frame parts of the directly adjacent lead frame unit. That is, in the lead frame assembly, the weld inspection point and / or its edge is not yet completely divided into the lead frame units, but can extend across two adjacent lead frame units. Such a region in which the edge extends across two adjacent lead frame units is, for example, narrower than the segmentation track between the lead frame units involved.

[0057] According to at least one embodiment, the weld inspection locations on the common side of two directly adjacent lead frame units are connected to one another by means of one or more transverse struts. The transverse struts can be part of a frame surrounding the lead frame units in question. At least one transverse strut extends, for example, transversely, in particular perpendicularly, to the associated main axis. At least one transverse strut is limited, for example, to the separation path between the lead frame units in question.

[0058] According to at least one embodiment, at least one transverse strut is set back relative to the outside. That is to say, in the region of at least one transverse strut, the lead frame assembly then does not have full thickness. At least one transverse strut can end at the inside, but not extend to the outside.

[0059] According to at least one embodiment, the recesses for the welding inspection locations are respectively limited to one of the lead frame units when viewed from outside in a top view, that is to say, for example, the recesses respectively touch or exceed the boundaries between adjacent lead frame units.

[0060] According to at least one embodiment, the weld inspection location is arranged mirror-symmetrically with respect to the main axis of the lead frame unit in question when viewed from above from the outside. It is possible that only one weld inspection location of the lead frame unit in question lies on the main axis or that the main axis intersects only one weld inspection location.

[0061] Furthermore, a method for producing a housing as described in conjunction with one or more of the above embodiments is provided. Therefore, the features of the housing are also disclosed for the leadframe assembly and the method, and vice versa.

[0062] In at least one embodiment, the method is used to produce a housing for at least one optoelectronic semiconductor chip and comprises the following steps, for example in the order specified:

[0063] - providing a lead frame assembly (7),

[0064] - molding the housing base body onto the lead frame unit of the lead frame assembly, and

[0065] - Segmenting the housing base body and the lead frame assembly into individual housings, so that each segmented housing includes the lead frame component of one of the lead frame units and the housing body.

[0066] According to at least one embodiment, during segmentation, the frame, the weld inspection position edge and / or the transverse strut are partially or completely located in the segmentation trajectory. That is, in the finished housing, the frame, the weld inspection position edge and / or the transverse strut are no longer present.

[0067] Furthermore, an optoelectronic semiconductor component is proposed, which is produced by means of a method as described in conjunction with one or more of the above embodiments. Features of the optoelectronic semiconductor component are therefore also disclosed for the housing, the leadframe assembly and the method, and vice versa.

[0068] In at least one embodiment, the optoelectronic semiconductor component comprises a housing and one or more optoelectronic semiconductor chips, such as LED chips. Furthermore, at least one further semiconductor chip, such as a control chip, may be present. BRIEF DESCRIPTION OF THE DRAWINGS

[0069] A housing described here, a lead frame assembly described here, a method described here, and an optoelectronic semiconductor component described here are explained in detail below with reference to the drawings based on exemplary embodiments. The same reference numerals denote the same elements in the individual figures. However, the relationships are not shown to scale here, but rather individual elements may be shown exaggeratedly for a better understanding. Description of the drawings:

[0071] Figure 1 shows a schematic perspective view of an exemplary embodiment of an optoelectronic semiconductor component described herein;

[0072] Figure 2 and Figure 3 A schematic perspective view showing a variant of the housing;

[0073] Figure 4 A schematic top view showing a variant of the lead frame assembly together with a variant of the housing;

[0074] Figure 5 A schematic perspective view showing one embodiment of a housing described herein;

[0075] Figure 6 and Figure 7 shows a schematic perspective view of a lead frame unit for an embodiment of a housing described herein;

[0076] Figure 8 shows a schematic perspective view of an exemplary embodiment of an optoelectronic semiconductor component described herein;

[0077] Figures 9 to 12 shows a schematic top view of an embodiment of a lead frame assembly described herein;

[0078] Fig.13 A schematic perspective view showing one embodiment of a housing described herein;

[0079] Figures 14 to 16 shows a schematic perspective view of a lead frame unit for an embodiment of a housing described herein;

[0080] Figures 17 to 21 Schematic perspective and top views showing embodiments of the lead frame assembly described herein;

[0081] Fig. 22A schematic top view showing one embodiment of a housing described herein; and

[0082] Fig.23 A schematic block diagram shows an exemplary embodiment of a method for producing a housing described here. DETAILED DESCRIPTION

[0083] exist Figure 1 In FIG. 1 , an example of a housing 2 is shown in two views facing different outer side walls 55 that are opposite to each other. The housing 2 comprises a first lead frame part 41 and a second lead frame part 42. Optionally, there is a further lead frame part 83, wherein Figure 1 Only the associated support tabs 48 on the other outer side wall 56 are visible. The lead frame parts 41, 42 are embedded in the housing body 5. It is possible, for example, to apply an orientation mark 22 on the upper side of the housing body 5. There is at least one optoelectronic semiconductor chip in the housing 2. Figure 1 Not visible in.

[0084] The lead frame parts 41, 42 are each provided with at least one weld inspection location 47. The weld inspection location 47 is located on the side wall 55 and is formed by a recess from the outer side 44 of the lead frame parts 41, 42 on the housing bottom side 21. The weld inspection locations 47 on the side wall 55 are arranged offset from one another. Therefore, in the projection onto the side wall 55, the weld inspection locations 47 do not overlap.

[0085] And according to Figure 2 and Figure 3 In the variant form 92 of the housing, the welding inspection position 47 is located at the same position on the side wall 55. Therefore, this causes that in the modified lead frame composite 97, the welding inspection position 47 is made across the adjacent lead frame units 4, see Figure 4 As a result, adjacent lead frame units 4 are mechanically strongly coupled to one another at the sides having the weld inspection locations 47 and are connected to one another in a bending-resistant manner.

[0086] Therefore, the potential bending point of the lead frame assembly 97 is along the line K between the lead frame parts 41, 42, because the lead frame assembly 97 is mechanically weakest here. Figure 1 and Figure 5 As shown in FIG. 1 , adjacent lead frame units 4 can be significantly decoupled from one another mechanically, and the risk of delamination of the material of the housing body 5 and the lead frame parts 41 , 42 can be reduced.

[0087] exist Figures 5 to 72 shows another example of a housing 2 and an associated lead frame unit 4. The housing body 5 can be as thick as the lead frame parts 41, 42. It is possible that a further housing body (not shown) is present.

[0088] The first, larger leadframe part 41 is designed as an elongated rectangle with rounded corners, viewed from the outer side 44 provided for the welded mounting of the housing 2, wherein the weld test points 47 are lateral protrusions of the rectangle. The second, smaller leadframe part 42 is U-shaped and is provided with two weld test points 47. The weld test points 47 of the first leadframe part 41 are passed through by a main axis M, which is also an axis of mirror symmetry, and are located between the weld test points 47 of the second leadframe part 42. The main axis M, viewed toward the housing underside 21, runs perpendicular to the side wall 55 and runs through the center point M of the housing 2.

[0089] A plurality of further lead frame parts 83 may optionally be arranged on both sides along the first lead frame part 41. Each further lead frame part 83 may be provided with one of the support tabs 48. Optionally, a corner extension 84 is arranged at each of the two further lead frame parts 83 closest to the second lead frame part 42 in order to mechanically reinforce the corner region of the housing body 5. It is possible that the further lead frame parts 83 at the outer side 4 are all of the same size. The further lead frame parts 83 may all be smaller than the first lead frame part 41 and the second lead frame part 42.

[0090] The lead frame parts 41, 42, 83 are half-etched, see Figure 6 and Figure 7 . As a result, the inner side 43 is larger than the outer side 44. As a result, there is a projection 78 of the inner side 43 around the associated outer side 44. In the region of the projection 78, the lead frame part 41, 42, 83 has only approximately half the thickness. Except at the weld inspection point 47, the projection 78 can extend around the lead frame part 41, 42, 83 in question. The surface facing the outer side 44 and the side surfaces of the projection 78 are preferably completely covered by the housing body 5, so that only one side surface of the supporting web 48 is exposed during separation and is visible at the side wall 56.

[0091] In addition, Figure 6 As schematically shown in FIG. 8 , solder test point 47 can be provided with a metal coating 81 in order to facilitate wetting with solder.

[0092] In other respects, Figures 1 to 4 The implementation scheme is applicable in the same way to Figures 5 to 7 , and vice versa.

[0093] exist Figure 81 shows an example of an optoelectronic semiconductor component 1. A plurality of optoelectronic semiconductor chips 3 are located on the inner side 43 of the second lead frame part 42. Further semiconductor chips 31, for example a control chip for the optoelectronic semiconductor chips 3, are located on the inner side 43 of the first lead frame part 41. The chips 3, 31 are arranged in a mounting region 45 and are connected to one another and to the lead frame parts 41, 42, 83 by means of electrical connections 6, such as bonding wires.

[0094] Optionally, the housing body 5 can have recesses (not shown) for the chips 3 , 31 .

[0095] Optionally, it is possible that the second leadframe part 42 also has a corner widening 84 .

[0096] In other respects, Figures 1 to 7 The implementation scheme is applicable in the same way to Figure 8 , and vice versa.

[0097] exist Fig. 9 and Fig.10 An example of a lead frame assembly 7 for a housing 2 is shown in FIG. 4 , with the outer side 44 being viewed in each case. Fig. 9 The housing base body 50 for the housing body 5 is shown in FIG. Fig.10 The lead frame assembly 7 comprises a plurality of lead frame units 4 which are separated from each other by separation center lines 82 ; the separation center lines 82 do not need to have a physical correspondence and can be imaginary or structural lines. The housing base body 50 extends in a continuous manner in the region of the lead frame units 4 .

[0098] Especially in Fig. 9 As can be seen in FIG. 4 , there is a half-etched recess 77 from the outer side 44 for the welding inspection part 47. The recess 77 is, for example, respectively limited to one of the lead frame units 4 so as not to intersect or contact the separation center line 82, see FIG. Fig. 9 The recess 77 has side surfaces which extend transversely, in particular perpendicularly or approximately perpendicularly, to the outer side 44 .

[0099] In addition, Fig. 9 , the optional thickenings 72, 74 extend along the separation centerline 82 and reach the housing underside 21. The thickening 72 extends parallel to the main axis M, the further thickening 74 extends perpendicularly to the main axis M. The further thickening 74 starts from the weld inspection location 47 of the second lead frame part 42 and extends to between the further lead frame parts 83.

[0100] The recess 77 is surrounded by a weld inspection point edge 75 which extends with the full material thickness of the leadframe assembly 7 as far as the outer side 44. The weld inspection point edge 75 extends in each case across two adjacent leadframe units 4.

[0101] exist Fig.10 It can be seen that a transverse support 76 is arranged between the welding inspection positions 47 of two adjacent lead frame units 4 along one of the separation center lines 82, see Fig.10 The transverse struts 76 connect the weld inspection site edges 75 of the weld inspection sites 47 to one another. The weld inspection sites 47 involved thus form a group, according to Fig. 9 and Fig.10 The examples are grouped in threes.

[0102] The transverse struts 76 do not extend, for example, to the outer side 44. That is, the transverse struts 76 may be half-etched regions of the leadframe assembly 7.

[0103] In addition Fig.10 It can be seen in FIG that the lead frame units 4 are each completely surrounded by a frame 71. The frames 71 overall form a network that extends continuously across the lead frame assembly 7. The frames 71 include reinforcements 72, 74 and transverse struts 76. Fig.10 It can be seen that although the reinforcements 72 and 74 increase the thickness of the frame 71 at some locations, they do not widen the frame 71. The reinforcements 72 and 74 are described in more detail below, especially see Fig.17 and Fig.18 .

[0104] exist Fig.11 and Fig.12 Chinese illustration Fig. 9 and Fig.10 The lead frame composite 7 is cut, wherein Fig.11 For a better view, the housing base body 50 is not shown. The housing 2 is cut along the separation center line 82, for example by sawing. Due to the width of the saw blade, a separation track C is generated. The width of the separation track C is, for example, between 0.2 mm and 0.5 mm, in particular 0.3 mm.

[0105] By cutting, the frame 71 is completely removed. Therefore, in the finished housing 2, there are no reinforcements 72, 74 or transverse struts 76. In addition, the portion of the weld inspection location edge 75 located in the dividing track C is removed, so that the recess 77 is exposed laterally. Thus, the side faces 55, 56 and the edge side 46 of the lead frame parts 41, 42 with the weld inspection location 47 are produced by cutting.

[0106] The resulting shell 2 is Fig.13 Visible in.

[0107] In other respects, Figures 1 to 8 The implementation scheme is applicable in the same way to Figures 9 to 13 , and vice versa.

[0108] exist Figures 14 to 16 In each case, a lead frame unit 4 is drawn. Figures 9 to 13 The areas removed by cutting are nevertheless still drawn, so that Figures 14 to 16 There is no segmentation track C in the lead frame unit 4. Figures 14 to 16 8 and is shown up to and including the separation center line 82 .

[0109] exist Figures 14 to 16 It can be seen in particular that the frame 71 has its full thickness only in the region of the thickenings 72 , 74 and in the region of the weld inspection point 47 and is half-etched elsewhere. As a result, the amount of material of the leadframe assembly in the separation center line C is kept as small as possible.

[0110] In other respects, Figures 1 to 13 The implementation scheme is applicable in the same way to Figures 14 to 16 , and vice versa.

[0111] The function and structure of the reinforcement parts 72 and 74 are Fig.17 and Fig.18 More precisely explained in.

[0112] There is a gap 73 between the lead frame parts 41, 42. In the region of the gap 73 there is only the housing body 5, but no lead frame material. The gap 73 is therefore a weak point. To prevent bending in the region of the gap 73, a thickening 72 is provided transversely to the gap 73 along a separation center line 82 extending parallel to the main axis M, see Fig.17 The thickening 74 extends into the leadframe parts 41 , 42 , as viewed along the main axis M. The gap 73 is therefore located between the two thickenings 72 .

[0113] For the length L of the thickening 72 and the width B of the slot 73 at the inner side 43, for example: 2B≤L≤15B or 4B≤L≤8B. With a tolerance of + / -B, the thickening 72 can be arranged centrally with respect to the slot 73 so that the thickening 72 extends along the main axis M beyond the slot width B by the same distance or approximately the same distance.

[0114] exist Fig.18It is emphasized that the further thickening 74 extends transversely to the further gap between the first leadframe part 41 and the further leadframe part 83 . Therefore, two further gaps per leadframe unit 4 are located between two further thickenings 74 , respectively.

[0115] For the total length L2 of the additional thickening 74 including the welding inspection location 47 of the second leadframe part 42 and the width B2 of the additional gap at the inner side 43, for example: 2B2≤L2≤15B2 or 4B2≤L2≤8B2 applies. With a tolerance of + / -B2, the additional thickening 74 can be arranged centrally with respect to the additional gap, so that the additional thickening 74 extends in a direction perpendicular to the main axis M by the same distance or approximately the same distance beyond the additional gap width B2.

[0116] The thickening 72 and the further thickening 74 can be present independently of one another or in combination.

[0117] exist Fig.19 , the thickening 72 and the further thickening 74 are visible from the housing underside 21. The thickening 72 and / or the further thickening 74 thus serve as a marker during the cut.

[0118] In other respects, Figures 1 to 16 The implementation scheme is applicable in the same way to Figures 17 to 19 , and vice versa.

[0119] As combined Figures 5 to 19 The lead frame assembly 7 used is finally again in Fig. 20 The diagram is illustrated in a three-dimensional manner toward the outside 44 .

[0120] exist Fig.21 Another example of a lead frame assembly 7 is shown in FIG. In the lead frame assembly 7, two further lead frame parts of the further lead frame parts 83 are respectively connected to the first lead frame part 41 by means of further supporting webs 79, see Fig.21 The further supporting webs 79 are, for example, half-etched and are therefore not visible when viewing the housing underside 21. The further supporting webs 79 originate, for example, from two diagonally opposite further leadframe parts 83.

[0121] In other respects, Figures 1 to 20 The implementation scheme is applicable in the same way to Fig.21 , and vice versa.

[0122] exist Fig. 22In the example of FIG. 4 , there may be further weld inspection locations 49 . The further weld inspection locations 49 are located, for example, at the first leadframe part 41 and extend to the side wall 56 , which may be oriented parallel to the main axis M.

[0123] It is possible that the further weld inspection locations 49 overlap congruently when viewed in a projection onto the side wall 56 , i.e. in a direction parallel to the minor axis N. For example, when viewed in a top view onto the housing underside 21 , the minor axis N is oriented perpendicular to the main axis M. Alternatively, the further weld inspection locations 49 can also be arranged offset from one another, similar to the weld inspection location 47 .

[0124] Such additional weld inspection locations 49 may also be present in all other examples.

[0125] In other respects, Figures 1 to 21 The implementation scheme is applicable in the same way to Fig. 22 , and vice versa.

[0126] exist Fig.23 Schematically illustrated in FIG. 1 is a manufacturing method for a housing 22. In step S1, a lead frame assembly 7 is provided. Subsequently, in step S2, a housing base body 50 is molded onto the lead frame unit 4 of the lead frame assembly 7. Subsequently, in an optional step S3, the lead frame unit 4 is equipped with chips 3, 31, provided with connecting means 6 and, if necessary, covered with a covering body, such as a luminescent material block. Finally, in step S4, the housing base body 50 and the lead frame assembly 7 are divided into individual housings 2, so that each of the housings 2 includes the lead frame parts 41, 42 of one of the lead frame units 4 and the housing body 5.

[0127] In other respects, Figures 1 to 22 The implementation scheme is applicable in the same way to Fig.23 , and vice versa.

[0128] Unless otherwise stated, the components shown in the drawings preferably follow one another in the order given, in particular directly follow one another. Components that are not in contact in the drawings preferably have a spacing from one another. If the lines are shown parallel to one another, the associated surfaces are preferably also oriented parallel to one another. Furthermore, unless otherwise stated, the relative positions of the components shown to one another are reproduced correctly in the drawings.

[0129] The invention described here is not limited to the description based on the exemplary embodiments. Rather, the invention includes any novel features and any combination of features, which in particular includes any combination of features in the claims, even if the feature or the combination itself is not presented in detail in the claims or exemplary embodiments.

[0130] This application claims the priority of German patent application 10 2022 123 579.3, the disclosure content of which is incorporated herein by reference.

[0131] Reference numerals list

[0132] 1 Optoelectronic semiconductor devices

[0133] 2 Housing

[0134] 20 Shell composite parts

[0135] 21 Housing bottom

[0136] 22 Orientation Mark

[0137] 3 Optoelectronic semiconductor chips

[0138] 31 Other semiconductor chips

[0139] 4 Lead frame unit

[0140] 41 first lead frame member

[0141] 42 Particularly smaller second lead frame component

[0142] 43 Inside

[0143] 44 outside

[0144] 45 Installation area

[0145] 46 Edge side

[0146] 47 Welding inspection area

[0147] 48 Support tab

[0148] 49 Other welding inspection areas

[0149] 5 Shell body

[0150] 50 Shell primitives

[0151] 55 External side wall

[0152] 56 Additional external side wall

[0153] 6 Electrical connection mechanism

[0154] 7 Lead frame composite parts

[0155] 71 Surrounding Frame

[0156] 72 Thickening

[0157] 73 Gap between first and second lead frame components

[0158] 74 Additional thickening

[0159] 75 Welding inspection edge

[0160] 76 Horizontal support

[0161] 77 recess

[0162] 78 Exceeding

[0163] 79 Additional support tabs

[0164] 81 Metal cladding

[0165] 82 Separation center line

[0166] 83 Additional lead frame components

[0167] 84 Extension

[0168] 92 Shell variants

[0169] 97 Variants of lead frame assemblies

[0170] B Gap Width

[0171] B2 Additional gap width

[0172] C Split Track

[0173] K Potential bending line

[0174] L Length of thickened part

[0175] L2 Additional thickening length

[0176] M Main axis

[0177] N Secondary axis

[0178] P Midpoint of shell

Claims

1. A housing (2) for at least one optoelectronic semiconductor chip (3), comprising: - a first lead frame part (41) and a second lead frame part (42), and a housing body (5) which mechanically connects the first lead frame part and the second lead frame part (41, 42) to one another, in The first lead frame part and the second lead frame part (41, 42) each have a mounting region (45) at an inner side (43) and each have an outer side (44) opposite the inner side (43), The first lead frame part (41) has at least one weld inspection point (47) and the second lead frame part (42) has at least two weld inspection points (47), and the weld inspection points are each formed by a recess (77) from the associated outer side (44) and are accessible from an outer side wall (55) of the housing (2), and - The welding inspection position (47) of the second lead frame part (42) is on one side and at least one welding inspection position (47) of the first lead frame part (42) is on the other side located at the mutually opposite outer side walls (55) of the housing body (5) and are arranged completely offset from each other, so that the welding inspection positions (47) do not overlap in a direction parallel to the main axis (M), and when viewed in a top view of the outer side (44), the main axis (M) extends perpendicularly to the mutually opposite outer side walls (55) having the welding inspection positions (47) and intersects the midpoint (P) of the housing (2).

2. The housing (2) according to the preceding claim, The mounting region (45) is configured for accommodating the at least one optoelectronic semiconductor chip (3), at least one further semiconductor chip (31) and / or at least one electrical connection means, and the outer side (44) is configured for external mounting of the housing (2).

3. A housing (2) according to any one of the preceding claims, A first number of welding inspection locations (47) of the first lead frame component (41) is different from a second number of welding inspection locations (47) of the second lead frame component (42).

4. A housing (2) according to any one of the preceding claims, The first lead frame part and the second lead frame part (41, 42) are flush with the housing body (5) at the outer side (44) and at the opposite outer side walls (55).

5. A housing (2) according to any one of the preceding claims, The housing further comprises one or more further lead frame components (83) at which support tabs (48) are present, The supporting web (48) is exposed only at a further outer side wall (56) extending transversely to the outer side wall (55) having the weld inspection point (47).

6. Housing (2) according to the preceding claim, The further lead frame part (83) or at least one of the further lead frame parts (83) is connected to the first lead frame part or the second lead frame part (41, 42) by means of a further supporting web (79).

7. A lead frame assembly (40), the lead frame assembly having a plurality of lead frame units (4) respectively used for a housing (2), the lead frame assembly comprising a first lead frame component (41) and a second lead frame component (42), respectively, In each lead frame unit (4) - the first lead frame part and the second lead frame part (41, 42) each have a mounting area (45) at an inner side (43) and each have an outer side (44) opposite the inner side (43), and each inner side (43) is respectively larger than the associated outer side (44), - the first lead frame part (41) has at least one weld inspection location (47) and the second lead frame part (42) has at least two weld inspection locations (47), and the weld inspection locations (47) are each formed by a recess (77) from the outer side (44), and - The welding inspection position (47) of the second lead frame part (42) is on one side and at least one welding inspection position (47) of the first lead frame part (42) is on the other side located on opposite sides and are arranged completely offset from each other, so that the welding inspection positions (47) do not overlap in a direction parallel to a main axis (M) of the lead frame unit (4) in question, and the main axis (M) extends perpendicularly to the opposite sides having the welding inspection positions (47) and intersects the midpoint (P) of the lead frame unit (4) in question.

8. Lead frame assembly (7) according to the preceding claim, Each of the lead frame units (4) has a frame (71) which partially or completely surrounds the lead frame unit, wherein the width of the frame (71) when viewed in a plan view of the outer side (44) is at least 30 μm and at most 0.3 mm.

9. Lead frame assembly (7) according to the preceding claim, The frames (71) each have a thickening (72) which has the full material thickness of the lead frame assembly (7) and is arranged in the extension of a gap between the associated first and second lead frame parts (41, 42), The length (L) of the thickened portion (72) is at least twice the width (B) of the associated gap (73).

10. Lead frame assembly (7) according to any one of the two preceding claims, The frame (71) has at least one further thickening (74), which starts from at least one of the weld inspection locations (47).

11. The lead frame assembly (7) according to any one of claims 7 to 10, In a top view of the outer side (44), a weld inspection location edge (75) of one of the lead frame units (4) extends between a weld inspection location (47) of one of the lead frame parts (41, 42) of a directly adjacent lead frame unit (4).

12. The lead frame assembly (7) according to any one of claims 7 to 11, wherein the weld inspection locations (47) are connected to one another at a common side of two directly adjacent lead frame units (4) by means of at least one transverse strut (76), wherein the at least one transverse strut (76) is retracted relative to the outer side (44).

13. The lead frame assembly (7) according to any one of claims 7 to 12, When viewed in a plan view of the outer side (44), the recess (77) for the welding inspection position (47) is respectively limited to one of the lead frame units (4), so that the recess (77) does not touch or exceed the boundary between adjacent lead frame units (4).

14. The lead frame assembly (7) according to any one of claims 7 to 13, In the top view of the outer side (44), the welding inspection positions (47) are arranged in a mirror-symmetrical manner with respect to the main axis (M) of the lead frame unit (4) concerned, and only one of the welding inspection positions (47) of the lead frame unit (4) concerned is located on the main axis (M).

15. A method for producing a housing (2) for at least one optoelectronic semiconductor chip (3), the method comprising the following steps: - providing a lead frame assembly (7) according to any one of claims 7 to 14, - molding a housing base body (50) onto the lead frame unit (4), and - dividing the housing base body (50) and the lead frame assembly (7) into individual housings (2), so that each of the housings (2) includes the lead frame components (41, 42) of one of the lead frame units (4) and a housing body (5).

16. The method according to the preceding claim, using a lead frame assembly (7) according to any one of claims 8 to 12, During the segmentation, the frame (71), the edge (75) of the welding inspection position and / or the transverse support (76) are partially or completely located in the segmentation trajectory (C).

Images