Tray testing device for vehicle gauge level AI chip and control method of tray testing device

Abstract

The invention relates to a tray testing device for a vehicle gauge level AI chip and a control method thereof, and belongs to the technical field of integrated circuit chip test.The tray testing device comprises a rack, a detection mechanism is arranged in the rack and comprises a bottom plate fixedly connected with the rack, a detection assembly is arranged on the bottom plate, and a detection transplanting platform is arranged between the detection assembly and the bottom plate; a chip tray is arranged at the rear end of the detection assembly; and a stacking assembly is arranged between the lower end of the chip tray and the bottom plate. The detection assembly comprises a detection support, and the upper part of the detection support is provided with a detection camera. The stacking assembly comprises a stacking frame, and a stacking bin used for containing chip trays is arranged on the stacking frame. Through driving of the motor, actions such as unstacking, carrying and up-and-down movement are carried out, so that the running speed of equipment is controllable and smoother, chips are effectively prevented from being violently vibrated, the operation stability is improved, and the probability of material damage is reduced. The automatic detection function is achieved, and the materials are prevented from being vibrated out in the transportation process.

Description

Technical Field

[0001] The present invention relates to the technical field of integrated circuit chip testing, and in particular to a pallet testing device for an automotive-grade AI chip and a control method thereof. Background Art

[0002] Chip trays, also known as IC trays, are packaging trays used by semiconductor packaging and testing companies for their chip (IC) packaging and testing. This type of tray is mainly used in the production and testing of electronic products to ensure the safe transportation and protection of chips. Chip trays are usually made of plastic, which can effectively prevent static electricity from touching, protect chips from damage, and facilitate automated testing and installation. In addition, chip trays also have anti-static and high temperature resistance functions, and can remain stable in high temperature environments to protect chips from damage.

[0003] The Chinese patent "A conveying device for chip tray detection", application number 2024119863656, discloses a conveying mechanism and a transfer mechanism; the conveying mechanism includes a bracket and a conveying member; the conveying member includes two synchronous belts; the transfer mechanism includes a support vertical plate, an inspection table and a first transfer member; the support vertical plate is fixed on one side of the bracket, and a slide rail is horizontally provided on the support vertical plate; the inspection table is fixed on the bracket; the first transfer member includes a first connecting rod, a second connecting rod, a first support seat, a first cylinder, a first vacuum suction cup and a first motor; one end of the first connecting rod is rotatably set on the side of the support vertical plate facing the bracket; the first connecting rod is provided with a first long groove along its length direction; the second connecting rod is slidably set on the slide rail, and its upper end is slidably set in the first long groove; the first cylinder is set on the first support seat; and a limit plate is also vertically fixed on the bracket.

[0004] The Chinese patent "Pallet Loading and Unloading System", application number 2024113800117, discloses a loading unit and a unloading unit; the loading unit includes a first material transfer car module, a first loading and unloading module, and a first docking module, the first material transfer car module is used to move the material cart from the system loading position to the loading grabbing position and the transition position in sequence, the first loading and unloading module is used to grab the pallet stacking combination on the material cart at the loading grabbing position and transfer it to the docking position of the first docking module; the unloading unit includes a second material transfer car module, a second loading and unloading module, and a second docking module, the second material transfer car module is used to move the material cart from the transition position to the unloading placement position and the system unloading position in sequence, the second loading and unloading module is used to transfer the pallet stacking combination on the docking position of the second docking module to the unloading placement position and place the pallet stacking combination on the material cart, and the loading and unloading process is realized by the material cart.

[0005] The existing belting loading structure is not suitable for the current chip tray group inspection. The linear method has low efficiency for single inspection and will move the chip to cause secondary damage; and the chip will be shaken out of the tray. This leads to a decrease in the quality of chip production. The loading structure is complex and heavy, not suitable for high-speed inspection of chip production, and has low efficiency. Summary of the invention

[0006] The present invention mainly solves the deficiencies in the prior art and provides a vehicle-grade AI chip pallet testing device and control method thereof, which is driven by a motor to perform depalletizing, transporting, and up and down operations, making the equipment running speed controllable and smoother, effectively preventing the chip from being subjected to severe vibration, improving the stability of the operation, and reducing the probability of material damage. The automatic detection function is realized to prevent the material from being shaken out during transportation.

[0007] The above technical problems of the present invention are mainly solved by the following technical solutions: A pallet testing device for automotive-grade AI chips includes a frame, a detection mechanism is provided in the frame, the detection mechanism includes a bottom plate connected and fixed to the frame, a detection component is provided on the bottom plate, a detection transplanting platform is provided between the detection component and the bottom plate, a chip tray is provided at the rear end of the detection component, and a stacking component is provided between the lower end of the chip tray and the bottom plate. The detection component includes a detection bracket, and a detection camera is provided on the upper part of the detection bracket. The stacking component includes a stacking rack, and a stacking bin for placing chip trays is provided on the stacking rack.

[0008] Preferably, the detection and transplanting platform comprises a Y-axis linear module, a clamping platform is provided at the upper end of the Y-axis linear module, and photoelectric sensors I are provided at the front and rear ends of the clamping platform.

[0009] Preferably, a silo assembly is provided at the side of the detection and transplanting platform, and a destacking assembly is provided at the front end of the detection assembly for destacking the chips in the silo assembly and transporting them to the detection and transplanting platform.

[0010] Preferably, the destacking assembly comprises a destacking frame, an X-axis linear module is provided at the upper end of the destacking frame, a Z-axis linear module is provided on the side of the X-axis linear module, a destacking clamp is provided at the lower end of the Z-axis linear module, and the side of the Y-axis linear module, the upper end of the X-axis linear module and the side of the Z-axis linear module are all provided with drag chains which are respectively connected to the Y-axis linear module, the X-axis linear module and the Z-axis linear module.

[0011] Preferably, the silo assembly includes a silo fixed frame, a movable silo is provided in the silo fixed frame and is slidably socketed with the silo fixed frame, photoelectric sensors II are provided at the upper and lower parts of the movable silo, a cylindrical cylinder extending to the movable silo is provided at the lower end of the silo fixed frame, and a linear guide rail is provided on the side of the cylindrical cylinder which is fixed to the silo fixed frame and slidably inserted into the movable silo.

[0012] Preferably, a lifting rod is provided on the side of the stacking silo, a lifting cylinder for driving the lifting rod to rise and fall is provided in the stacking frame, and guide bearings integrated with the stacking frame are provided at both ends of the lifting rod.

[0013] Preferably, a camera lens is provided at the lower end of the detection camera, and strip light sources fixedly connected to the detection bracket are provided on both sides of the middle part of the detection bracket.

[0014] Preferably, the front end of the upper part of the rack is provided with a human-machine interactive operation panel in circuit communication with the detection mechanism, and the lower part of the rack is provided with an electric control cabinet in circuit communication with the human-machine interactive operation panel and the detection mechanism. The electric control cabinet adopts the control mode of the host computer and the motion board, and the pneumatic control adopts the control mode of the valve island bus, so that the motion control and the factory MES can interactively share a control machine, which is convenient for the factory MES to monitor the equipment operation data and operation status in real time.

[0015] A control method for a pallet testing device using an automotive-grade AI chip includes the following steps: The first step: place the whole stack of chips into the silo assembly, and then the destacking claws on the destacking assembly take out one tray from the silo assembly each time and place it on the detection and transplanting platform.

[0016] Step 2: The clamping platform on the detection transplanting platform is driven by the Y-axis linear module to the detection component, and the detection camera is used to take pictures and calculate.

[0017] Step 3: After the test is completed, unqualified chips are manually screened out and qualified chips are sent to the palletizing assembly.

[0018] Step 4: The lifting cylinder drives the lifting rod to lift the pallet of the gripper platform to the chip pallet in the stacking bin.

[0019] Step 5: Repeat the process of depalletizing and palletizing multiple times, so that the chips on a stack of trays are tested in turn, and the chip trays are taped and packaged after they are full.

[0020] Preferably, the destacking assembly clamps the four sides and four corners of the core plate pallet through destacking claws, and is operated by an X-axis linear module and a Z-axis linear module to destacker and transfer the core plate pallet from the silo assembly to the inspection and transplanting platform.

[0021] The present invention can achieve the following effects: The present invention provides a vehicle-grade AI chip pallet testing device and control method thereof. Compared with the prior art, the device can be driven by a motor to perform actions such as pallet removal, transportation, and up and down movements, making the equipment running speed controllable and smoother, effectively preventing the chip from being subjected to severe vibration, improving the stability of the operation, and reducing the probability of material damage. The automatic detection function is realized to prevent the material from being shaken out during transportation.

[0022] Realize chip packaging automation, ensure that the information of each IC is traceable, and ensure that the materials are unique and accurate. Each IC needs to be tested and the information verified before packaging and shipment. Testing is one of the indispensable functions to complete the verification of chip information.

[0023] Utilizing self-developed depalletizing, inspection platform, visual inspection and palletizing mechanisms, 100% inspection of each chip is carried out, and the information is exchanged and recorded with MES; strapping is performed immediately after the inspection is completed, effectively eliminating the risk of human material movement. The structure is equipped with anti-fool alarm and overflow alarm, and vibration is avoided during the inspection process, requiring that the order of the chips after inspection cannot be changed. The internal motion mechanism is completely separated from the external links through the external frame, which improves the overall safety of the equipment and meets the anti-static requirements of semiconductor workshop production equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a structural schematic diagram of the present invention.

[0025] Figure 2 It is a structural schematic diagram of the detection mechanism of the present invention.

[0026] Figure 3 It is a structural schematic diagram of the detection and transplanting platform of the present invention.

[0027] Figure 4 It is a schematic diagram of the structure of the detection component of the present invention.

[0028] Figure 5 It is a structural schematic diagram of the silo assembly of the present invention.

[0029] Figure 6 It is a structural schematic diagram of the destacking assembly of the present invention.

[0030] Figure 7 It is a structural schematic diagram of the palletizing assembly of the present invention.

[0031] In the figure: human-machine interaction operation panel 1, frame 2, detection mechanism 3, electric control cabinet 4, depalletizing component 5, detection component 6, chip tray 7, stacking component 8, bottom plate 9, silo component 10, detection and transplanting platform 11, clamping claw platform 12, photoelectric sensor I 13, Y-axis linear module 14, drag chain 15, detection bracket 16, detection camera 17, camera lens 18, strip light source 19, movable silo 20, photoelectric sensor II 21, cylindrical cylinder 22, linear guide 23, silo fixed frame 24, depalletizing frame 25, X-axis linear module 26, Z-axis linear module 27, depalletizing claw 28, stacking silo 29, lifting drag rod 30, guide bearing 31, stacking frame 32, lifting cylinder 33. DETAILED DESCRIPTION

[0032] The technical solution of the invention is further specifically described below through embodiments and in conjunction with the accompanying drawings.

[0033] Example: Figure 1-7 As shown, a vehicle-grade AI chip pallet testing device includes a frame 2, a detection mechanism 3 is provided in the frame 2, a human-machine interactive operation panel 1 connected to the detection mechanism 3-phase circuit is provided at the front end of the upper part of the frame 2, and an electric control cabinet 4 connected to the human-machine interactive operation panel 1 and the detection mechanism 3-phase circuit is provided at the lower part of the frame 2. The detection mechanism 3 includes a bottom plate 9 connected and fixed to the frame 2, and a detection component 6 is provided on the bottom plate 9. The detection component 6 includes a detection bracket 16, a detection camera 17 is provided on the upper part of the detection bracket 16, and a camera lens 18 is provided at the lower end of the detection camera 17. Both sides of the middle part of the detection bracket 16 are provided with a strip light source 19 fixedly connected to the detection bracket 16. A detection transplanting platform 11 is provided between the detection component 6 and the bottom plate 9. The detection transplanting platform 11 includes a Y-axis linear module 14, and a clamping claw platform 12 is provided at the upper end of the Y-axis linear module 14. The front and rear ends of the clamping claw platform 12 are provided with photoelectric sensors Ⅰ13. A chip tray 7 is provided at the rear end of the detection component 6, and a stacking component 8 is provided between the lower end of the chip tray 7 and the bottom plate 9. The stacking component 8 includes a stacking frame 32, and a stacking bin 29 for placing the chip tray 7 is provided on the stacking frame 32. A lifting rod 30 is provided on the side of the stacking bin 29, and a lifting cylinder 33 for driving the lifting rod 30 to rise and fall is provided in the stacking frame 32. Both ends of the lifting rod 30 are provided with guide bearings 31 that are integrated with the stacking frame 32.

[0034] A silo assembly 10 is provided on the side of the detection and transplanting platform 11. The silo assembly 10 includes a silo fixed frame 24. A movable silo 20 is provided in the silo fixed frame 24 and is slidably connected to the silo fixed frame 24. Photoelectric sensors II 21 are provided at the upper and lower parts of the movable silo 20. A cylindrical cylinder 22 extending to the movable silo 20 is provided at the lower end of the silo fixed frame 24. A linear guide 23 fixed to the silo fixed frame 24 and slidably inserted with the movable silo 20 is provided on the side of the cylindrical cylinder 22. A destacking assembly 5 is provided at the front end of the detection assembly 6 to destacker the chips of the silo assembly 10 and transport them to the detection and transplanting platform 11. The destacking assembly 5 includes a destacking frame 25, an X-axis linear module 26 is provided at the upper end of the destacking frame 25, a Z-axis linear module 27 is provided on the side of the X-axis linear module 26, a destacking clamp 28 is provided at the lower end of the Z-axis linear module 27, and a drag chain 15 which is respectively connected to the Y-axis linear module 14, the X-axis linear module 26, and the Z-axis linear module 27 is provided on the side of the Y-axis linear module 14, the upper end of the X-axis linear module 26, and the side of the Z-axis linear module 27.

[0035] A control method for a pallet testing device using an automotive-grade AI chip includes the following steps: The first step is to place the whole stack of chips into the silo assembly 10 , and then the destacking claws 28 on the destacking assembly 5 take out a tray from the silo assembly 10 each time and place it on the detection and transplanting platform 11 .

[0036] The destacking assembly 5 clamps the four sides and four corners of the core plate pallet through the destacking claws 28 , and is operated by the X-axis linear module 26 and the Z-axis linear module 27 to destacker the core plate pallet from the silo assembly 10 and transfer it to the inspection and transplanting platform 11 .

[0037] Step 2: The clamping platform 12 on the detection transplanting platform 11 is driven by the Y-axis linear module 14 to the detection component 6, and the detection camera 17 is used to take pictures and calculate.

[0038] Step 3: After the test is completed, unqualified chips are manually screened out and qualified chips are sent to the stacking component 8.

[0039] Step 4: The lifting cylinder 33 drives the lifting rod 30 to lift the tray of the clamping claw platform 12 to the chip tray 7 in the stacking bin 29.

[0040] Step 5: Repeat the process of depalletizing by the depalletizing assembly 5 and palletizing by the palletizing assembly 8 for many times, so that the chips on a stack of trays are tested in turn, and the chip trays 7 are taped and packaged after they are full.

[0041] In summary, the automotive-grade AI chip pallet testing device and its control method can be driven by a motor to perform depalletizing, transporting, and up and down movements, making the equipment's running speed controllable and smoother, effectively preventing the chip from being subjected to severe vibration, improving the stability of the operation, and reducing the probability of material damage. The automatic detection function is realized to prevent materials from being shaken out during transportation.

[0042] The above description is only a specific embodiment of the present invention, but the structural features of the present invention are not limited thereto. Any changes or modifications made by any technician in the field of the present invention are included in the patent scope of the present invention.

Claims

1. A pallet testing device for automotive-grade AI chips, characterized by: The invention comprises a frame (2), wherein a detection mechanism (3) is arranged in the frame (2), wherein the detection mechanism (3) comprises a bottom plate (9) connected and fixed to the frame (2), wherein a detection component (6) is arranged on the bottom plate (9), wherein a detection transplanting platform (11) is arranged between the detection component (6) and the bottom plate (9), wherein a chip tray (7) is arranged at the rear end of the detection component (6), and a stacking component (8) is arranged between the lower end of the chip tray (7) and the bottom plate (9); wherein the detection component (6) comprises a detection bracket (16), wherein a detection camera (17) is arranged on the upper part of the detection bracket (16); and wherein the stacking component (8) comprises a stacking frame (32), wherein a stacking material bin (29) for placing the chip tray (7) is arranged on the stacking frame (32).

2. The vehicle-grade AI chip pallet testing device according to claim 1 is characterized in that: The detection and transplanting platform (11) comprises a Y-axis linear module (14), the upper end of the Y-axis linear module (14) is provided with a clamping claw platform (12), and the front and rear ends of the clamping claw platform (12) are both provided with photoelectric sensors I (13).

3. The vehicle-grade AI chip pallet testing device according to claim 2 is characterized in that: A silo assembly (10) is provided on the side of the detection and transplanting platform (11), and a destacking assembly (5) for destacking the chips in the silo assembly (10) and transporting them to the detection and transplanting platform (11) is provided at the front end of the detection assembly (6).

4. The vehicle-grade AI chip pallet testing device according to claim 3 is characterized in that: The destacking assembly (5) comprises a destacking frame (25), the upper end of the destacking frame (25) is provided with an X-axis linear module (26), the side of the X-axis linear module (26) is provided with a Z-axis linear module (27), the lower end of the Z-axis linear module (27) is provided with a destacking clamp (28), and the side of the Y-axis linear module (14), the upper end of the X-axis linear module (26), and the side of the Z-axis linear module (27) are all provided with a drag chain (15) which is connected to the Y-axis linear module (14), the X-axis linear module (26), and the Z-axis linear module (27) respectively.

5. The vehicle-grade AI chip tray testing device according to claim 3 is characterized in that: The silo assembly (10) includes a silo fixed frame (24), a movable silo (20) is provided in the silo fixed frame (24) and is slidably sleeved with the silo fixed frame (24), a photoelectric sensor II (21) is provided at the upper and lower parts of the movable silo (20), a cylindrical cylinder (22) is provided at the lower end of the silo fixed frame (24) and extends to the movable silo (20), and a linear guide rail (23) is provided on the side of the cylindrical cylinder (22) and is fixed to the silo fixed frame (24) and slidably inserted into the movable silo (20).

6. The vehicle-grade AI chip pallet testing device according to claim 1 is characterized in that: A lifting rod (30) is provided on the side of the stacking silo (29), a lifting cylinder (33) for driving the lifting rod (30) to move up and down is provided in the stacking frame (32), and guide bearings (31) are provided at both ends of the lifting rod (30) and are integrated with the stacking frame (32).

7. The vehicle-grade AI chip pallet testing device according to claim 1 is characterized in that: A camera lens (18) is provided at the lower end of the detection camera (17), and strip light sources (19) fixedly connected to the detection bracket (16) are provided on both sides of the middle of the detection bracket (16).

8. The vehicle-grade AI chip pallet testing device according to claim 1 is characterized in that: The front end of the upper portion of the frame (2) is provided with a human-machine interactive operation panel (1) which is in circuit communication with the detection mechanism (3), and the lower portion of the frame (2) is provided with an electric control cabinet (4) which is in circuit communication with the human-machine interactive operation panel (1) and the detection mechanism (3).

9. The control method of the vehicle-grade AI chip for pallet testing according to claim 4 is characterized in that The steps are as follows: The first step is to place the whole stack of chips into the hopper assembly (10), and then the destacking claw (28) on the destacking assembly (5) takes out one tray from the hopper assembly (10) each time and places it on the detection and transplanting platform (11); Step 2: The clamping platform (12) on the detection transplanting platform (11) is driven by the Y-axis linear module (14) to the detection component (6), and a detection camera (17) is used to take pictures and perform calculations; Step 3: After the test is completed, unqualified chips are manually screened out and qualified chips are sent to the palletizing assembly (8); Step 4: The lifting cylinder (33) drives the lifting rod (30) to lift the pallet of the clamping claw platform (12) to the chip pallet (7) in the stacking bin (29); Step 5: Repeat the process of depalletizing by the depalletizing component (5) and palletizing by the palletizing component (8) for multiple times, so that the chips on a stack of trays are tested in sequence, and the chip trays (7) are taped and packaged after they are full.

10. The control method of the vehicle-grade AI chip for pallet testing according to claim 9 is characterized in that: The depalletizing assembly (5) clamps the four sides and four corners of the core plate pallet through the depalletizing claws (28), and is operated by the X-axis linear module (26) and the Z-axis linear module (27) to depalletize and transfer the core plate pallet from the silo assembly (10) to the inspection and transplanting platform (11).

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