Substrate cleaning apparatus, cleaning method, and spin coating and developing apparatus

Abstract

The application discloses a substrate cleaning device, a cleaning method and a gluing and developing equipment. The substrate cleaning device comprises a chuck body, a plurality of clamping pieces arranged in a circle on the surface of the chuck body, used for clamping a substrate and driving the substrate to rotate, a back cleaning mechanism used for cleaning one side of the substrate close to the chuck body during the rotation of the substrate, and a chuck driving mechanism connected with the chuck body and used for driving the chuck body to rotate to spin dry the cleaned substrate. The technical effect of improving the back cleaning effect of the substrate and the cleaning efficiency are achieved.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of semiconductor equipment, and further relates to a substrate cleaning device, a cleaning method and a coating and developing device. BACKGROUND

[0002] At present, the inline machine for realizing the photolithography process is composed of a coating and developing machine and a photolithography machine. The general process of the photolithography process is as follows: after the substrate is subjected to the coating treatment in the coating and developing machine, the substrate is sent into the photolithography machine to be subjected to the exposure treatment, and the substrate after the exposure treatment is returned to the coating and developing machine to be subjected to the developing treatment.

[0003] After the substrate is subjected to the coating treatment and before the substrate is conveyed into the photolithography machine to be subjected to the exposure treatment, the back surface of the substrate needs to be cleaned, so as to prevent the contaminant particles on the back surface of the substrate from being transferred into the photolithography machine, so that the contaminant particles are mixed between the substrate and the substrate support table during the exposure treatment of the substrate, the surface of the substrate is bent to appear local protrusions, the focal points cannot be matched during the exposure, the defocus phenomenon is caused, the exposure pattern accuracy of the substrate is affected, and the substrate processing yield is finally reduced.

[0004] The Chinese patent document with the application number 200710160027.7 discloses a substrate cleaning device and a substrate cleaning method. The substrate cleaning device is provided with two substrate holding units for supporting the substrate from the back surface of the substrate, and the two substrate holding units do not overlap each other in the supporting area of the back surface of the substrate, so as to alternately support the substrate during the substrate cleaning, so that the cleaning mechanism can clean different supporting areas of the back surface of the substrate in sequence. Specifically, the first substrate holding unit includes an adsorption pad, and the adsorption pad is configured to support and adsorb the peripheral part of the back surface of the substrate; the second substrate holding unit includes a rotary chuck, and the rotary chuck is configured to support and adsorb the central part of the back surface of the substrate; and the cleaning mechanism includes a cleaning brush. During the substrate cleaning, the peripheral part of the back surface of the substrate is first supported by the adsorption pad, so that the central part of the back surface of the substrate can be cleaned by the cleaning mechanism, and then the central part of the back surface of the substrate is supported by the rotary chuck, so that the peripheral part of the back surface of the substrate can be cleaned by the cleaning mechanism, so as to clean the entire back surface of the substrate.

[0005] However, the above-mentioned scheme still has defects. After the central part of the back surface of the substrate is cleaned by the cleaning mechanism, the rotary chuck needs to support the central part of the back surface of the substrate to clean the peripheral part of the back surface of the substrate, the cleaning efficiency is low, and during this period, there is a risk that the contaminant particles on the rotary chuck cause secondary pollution to the back surface of the substrate, thereby affecting the cleaning effect of the device on the back surface of the substrate, and there is still a risk that the contaminant particles on the back surface of the substrate are transferred into the photolithography machine. SUMMARY

[0006] In view of the above technical problems, the purpose of the present application is to improve the cleaning effect and cleaning efficiency of the substrate back surface by the substrate cleaning device.

[0007] In order to achieve the above purpose, the present application provides a substrate cleaning device, a cleaning method and a glue coating and developing equipment.

[0008] In some embodiments, the substrate cleaning device comprises: a chuck body; a plurality of clamping pieces arranged in a circle on the surface of the chuck body, used for clamping a substrate and driving the substrate to rotate; a back surface cleaning mechanism, used for cleaning one side of the substrate close to the chuck body during the rotation of the substrate; and a chuck driving mechanism connected with the chuck body, used for driving the chuck body to rotate to spin dry the cleaned substrate.

[0009] In some embodiments, the substrate cleaning method is suitable for a substrate cleaning device, which comprises: a chuck body; a plurality of clamping pieces arranged in a circle on the surface of the chuck body, used for clamping a substrate and driving the substrate to rotate; a back surface cleaning mechanism, used for cleaning one side of the substrate close to the chuck body; and a chuck driving mechanism, used for driving the chuck body to rotate; wherein the substrate cleaning method comprises: step S10, loading and clamping a substrate to be processed by at least part of the plurality of clamping pieces; step S20, driving the substrate to be processed to rotate by at least part of the plurality of clamping pieces, and cleaning one side of the substrate to be processed close to the chuck body by the back surface cleaning mechanism; and step S30, driving the chuck body to rotate by the chuck driving mechanism to spin dry the cleaned substrate.

[0010] In some embodiments, the glue coating and developing equipment comprises a front-end module, a process station and an interface station connected in sequence, the process station comprises: a coating unit, used for coating treatment of a substrate; a developing unit, used for developing treatment of the substrate; a heat treatment unit, used for heat treatment of the substrate; and the above-mentioned substrate cleaning device, used for cleaning the substrate after coating treatment.

[0011] Compared with the prior art, the present application has the following beneficial effects: the present application clamps and drives the substrate to rotate by the clamping pieces, so that the back surface cleaning mechanism cleans the back surface of the substrate as a whole, avoiding the prior art of cleaning the central part and the peripheral part of the substrate back surface in sequence, which affects the cleaning efficiency of the substrate and increases the risk of secondary pollution to the central part of the substrate back surface, and the chuck body is driven to rotate by the chuck driving mechanism to spin dry the cleaned substrate, thereby realizing the technical effect of improving the cleaning effect of the substrate back surface and the cleaning efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0012] The above features, technical characteristics, advantages and implementation manners of the present application will be further described in a clear and easy-to-understand manner in combination with the preferred embodiments and the accompanying drawings.

[0013] Figure 1 is a schematic view of a substrate cleaning device according to an embodiment of the present application;

[0014] Figure 2 is Figure 1 is a sectional view along the line a-a;

[0015] Figure 3 is Figure 2 is a schematic view during clamping of a substrate;

[0016] Figure 4 is a schematic view of a clamping member. DETAILED DESCRIPTION

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the specific embodiments of the present application will be described below with reference to the accompanying drawings. Obviously, the accompanying drawings in the following description only represent some embodiments of the present application, and for those skilled in the art, other drawings can be obtained from these drawings without creative effort, and other embodiments can also be obtained.

[0018] In order to make the drawings simple, only the parts related to the present application are schematically shown in the drawings, which do not represent the actual structure of the product. In addition, in order to make the drawings simple and easy to understand, in some drawings, only one of the parts with the same structure or function is schematically shown, or only one of them is marked. In this document, "one" not only means "only one", but also means "more than one" situation.

[0019] In this document, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connecting" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium, or it can be the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0020] In addition, in the description of the present application, the terms "first", "second", etc. are only used for distinction and description, and cannot be understood as indicating or implying relative importance.

[0021] As Figure 1 and Figure 2As shown, a substrate cleaning device 10 according to an embodiment of the present application is disclosed. The substrate cleaning device 10 comprises a chuck body 200, a plurality of clamping pieces 300, a backside cleaning mechanism 100 and a chuck driving mechanism 400. Wherein, referring to Figure 1 The plurality of clamping pieces 300 are arranged in a circle on the surface of the chuck body 200, for clamping the substrate 20 and driving the substrate 20 to rotate. In combination with Figure 3 The backside cleaning mechanism 100 is used for cleaning the side of the substrate 20 close to the chuck body 200 (the backside 21 of the substrate 20) during the rotation of the substrate 20. The chuck driving mechanism 400 is connected with the chuck body 200, for driving the chuck body 200 to rotate to spin dry the cleaned substrate 20.

[0022] The embodiment clamps and drives the substrate 20 to rotate by the clamping pieces 300, so that the backside cleaning mechanism 100 can clean the backside of the substrate 20 as a whole, avoiding the twice cleaning of the central part and the peripheral part of the backside of the substrate in the prior art, which affects the cleaning efficiency of the substrate and increases the risk of secondary pollution to the central part of the backside of the substrate. After the backside 21 of the substrate 20 is cleaned, the chuck body 200 is driven to rotate by the chuck driving mechanism 400 to spin dry the cleaned substrate 20, thereby realizing the technical effects of improving the backside cleaning effect and cleaning efficiency of the substrate 20.

[0023] Specifically, as shown in Figure 4 The clamping piece 300 comprises a sliding part 320 and a limiting part 330 from bottom to top. Wherein, the sliding part 320 is in the structure of a circular truncated cone with a large bottom and a small top, and is configured to provide a vertical upward force for the edge of the backside 21 of the substrate 20 when the clamping piece 300 slides inward along the radial direction r of the chuck body 200, so as to make the substrate 20 rise. The limiting part 330 has an annular clamping groove 331 matched with the edge of the substrate 20, so as to provide a friction force for the edge of the substrate 20 to drive the substrate 20 to rotate during the rotation of the clamping piece 300. In addition, the sliding part 320 can support the substrate by the side surface of the circular truncated cone. During the loading of the substrate 20, the substrate 20 is first loaded between the clamping pieces 300 and supported by the side surface of the circular truncated cone; then, at least one clamping piece 300 slides inward along the radial direction r, so that the substrate 20 rises until it is clamped in the annular clamping groove 331.

[0024] Preferably, the clamping piece 300 further comprises a supporting part located at the bottom end of the sliding part 320. Again referring to Figure 4In one embodiment, the support portion 310 has an annular support surface 311 arranged around the sliding portion 310 for supporting the substrate 20. During loading of the substrate 20, the substrate 20 is first loaded between the clamping members 300 and is supported by the annular support surface 311; then, at least one clamping member 300 slides inward along the radial direction r, and the side surface of the circular truncated cone structure of the sliding portion 320 provides an upward vertical component force to the edge of the substrate 20, so that the substrate 20 is lifted until it is clamped in the annular clamping groove 331.

[0025] Preferably, referring again to Figure 1 and Figure 2 , the clamping member 300 includes a plurality of first clamping members 340 and a plurality of second clamping members 350, and the substrate cleaning device 10 further includes a plurality of first radial driving members 341, a plurality of second radial driving members 351, a plurality of rotary driving members 352, and a pressure supply pipeline 360. The first radial driving members 341 and the second radial driving members 351 include pneumatic cylinders (e.g., single-acting spring return cylinders) or hydraulic cylinders; and the rotary driving members 352 include pneumatic motors or hydraulic motors.

[0026] Specifically, the plurality of first radial driving members 341 are configured to simultaneously drive the plurality of first clamping members 340 to slide along the radial direction r, respectively, and each of the plurality of first radial driving members 341 has a first start-up pressure (the minimum hydraulic or pneumatic pressure for starting the first radial driving member 341, and only when a hydraulic or pneumatic pressure not lower than the first start-up pressure is provided to the first radial driving member 341, the first radial driving member 341 can drive the first clamping member 340 to slide, and the substrate 20 is lifted until it is clamped in the annular clamping groove 331). The plurality of second radial driving members 351 are configured to simultaneously drive the plurality of second clamping members 350 to slide along the radial direction r, respectively, and each of the plurality of second radial driving members 351 has a second start-up pressure (similar to the first start-up pressure, which will not be described again herein), and the second start-up pressure is not less than the first start-up pressure. The plurality of rotary driving members 352 are configured to simultaneously drive the plurality of second clamping members 350 to rotate, respectively, to drive the substrate 20 to rotate, and each of the plurality of rotary driving members 352 has a third start-up pressure (the minimum hydraulic or pneumatic pressure for starting the rotary driving member 352, and only when a hydraulic or pneumatic pressure not lower than the third start-up pressure is provided to the rotary driving member 352, the rotary driving member 352 can drive the second clamping member 350 to rotate, and the substrate 20 is driven to rotate), and the third start-up pressure is greater than the second start-up pressure. The pressure supply pipeline 360 is connected to the first radial driving members 341, the second radial driving members 351, and the rotary driving members 352, respectively, for connecting an external pressure source 361 (e.g., a pneumatic source or a hydraulic source) to the first radial driving members 341, the second radial driving members 351, and the rotary driving members 352 to simultaneously provide pressure.

[0027] Preferably, the second startup pressure is configured to be greater than the first startup pressure, and the substrate cleaning device 10 is configured to: during loading of the substrate 20, the substrate 20 is first loaded between each first chuck 340 and second chuck 350, and is simultaneously supported by the plurality of annular support surfaces 311. Subsequently, with reference to Figure 3 the pressure supply line 360 first provides the first radial drive 341, the second radial drive 351, and the rotary drive 352 with a first pressure simultaneously, the first pressure being greater than or equal to the first startup pressure and less than the second startup pressure, so as to drive the first radial drive 341 to slide the first chuck 340 inward along the radial direction r, so as to drive the substrate 20 to rise and clamp the substrate 20, and then the pressure supply line 360 provides a second pressure greater than or equal to the second startup pressure and less than the third startup pressure, so as to make the second chuck 350 clamp the substrate 20 later than the first chuck 340.

[0028] Preferably, the substrate cleaning device 10 is configured to: during cleaning of the substrate 20, the pressure supply line 360 provides the first radial drive 341, the second radial drive 351, and the rotary drive 352 with a third pressure simultaneously, the third pressure being greater than or equal to the third startup pressure, so as to drive the rotary drive 352 to drive the second chuck 350 to rotate the substrate 20. At this time, the back surface 21 of the substrate 20 is cleaned by the back surface cleaning mechanism 100.

[0029] Preferably, the substrate cleaning device 10 is configured to: after the substrate 20 is cleaned, the pressure provided by the pressure supply line 360 to the first radial drive 341, the second radial drive 351, and the rotary drive 352 is decreased from the third pressure to be less than the third startup pressure and greater than or equal to the first startup pressure, so as to stop the second chuck 350 from rotating the substrate 20, and then the chuck body 200 is driven to rotate by the chuck drive mechanism 400 to spin dry the cleaned substrate 20.

[0030] Preferably, the substrate cleaning device 10 is configured to: after the substrate 20 is cleaned, the pressure provided by the pressure supply line 360 to the first radial drive 341, the second radial drive 351, and the rotary drive 352 is decreased from the third pressure to be less than the third startup pressure and greater than or equal to the second startup pressure, so as to stop the second chuck 350 from rotating the substrate 20, and then the chuck body 200 is driven to rotate by the chuck drive mechanism 400 to spin dry the cleaned substrate 20.

[0031] The first clamping member 340 drives the substrate 20 to rise and clamp the substrate 20 to play a role of pre-positioning, and then the second clamping member 350 clamps the substrate 20, thereby increasing the clamping force on the substrate 20 to increase the stability of the substrate 20 in rotation during cleaning and in revolution during spin-drying. A faster clamping speed can cause abrasion on the edge of the substrate 20, and therefore, the first clamping member 340 drives the substrate 20 to rise and clamp under the first pressure, and then the second clamping member 350 clamps the substrate 20 under the second pressure, which can reduce the abrasion on the edge of the substrate 20 during the rising of the substrate 20. In addition, the present embodiment controls the working states of the first radial driving member 341, the second radial driving member 351 and the rotary driving member 352 through one pressure supply pipeline 360 to realize independent control of the first clamping member 340, the second clamping member 350 and the rotary driving member 352, thereby avoiding the use of multiple pressure supply pipelines 360 to control the first clamping member 340, the second clamping member 350 and the rotary driving member 352 respectively, and further reducing the processing difficulty of providing the pressure supply pipeline 360 in the substrate cleaning device 10.

[0032] In other embodiments of the present application, the second starting pressure is configured to be equal to the first starting pressure, and the substrate cleaning device 10 is configured such that during loading of the substrate 20, the substrate 20 is first loaded between each first clamping member 340 and second clamping member 350. Then, the pressure supply pipeline 360 simultaneously provides the first radial driving member 341, the second radial driving member 351 and the rotary driving member 352 with the first pressure, which is greater than or equal to the first starting pressure and less than the third starting pressure, so that the first radial driving member 341 and the second radial driving member 351 simultaneously drive the first clamping member 340 and the second clamping member 350 to slide inward along the radial direction r, respectively, to drive the substrate 20 to rise and clamp the substrate 20.

[0033] In addition, during unloading of the substrate 20, the pressure supply pipeline 360 provides a pressure that decreases to be lower than the first starting pressure, so that the second radial driving member 351 drives the second clamping member 350 to slide outward along the radial direction r, and the first radial driving member 341 drives the first clamping member 340 to slide outward along the radial direction r, to release the substrate 20 and make the substrate 20 descend until it is supported by the annular support surface 311, and then unloaded by the robot 30.

[0034] In other embodiments of the present application, during unloading of the substrate 20, the robot 30 first moves to below the substrate 20 and above the annular support surface 311, the pressure supply pipe 360 provides a pressure drop to below the first start-up pressure, so that the second radial drive 351 drives the second clamping member 350 to slide outward along the radial direction r, and the first radial drive 341 drives the first clamping member 340 to slide outward along the radial direction r, so as to release the substrate 20 and support the substrate by the robot 30, and then unload the substrate 20 by the robot 30. Compared with the previous embodiment, in the present embodiment, the substrate 20 is supported by the robot 30 before it is lowered to contact the annular support surface 311, thereby avoiding the substrate 20 from contacting the annular support surface 311 again and increasing the risk of edge contamination of the substrate 20.

[0035] Specifically, the chuck driving mechanism 400 includes a rotating shaft 410 and a hollow motor 420. The rotating shaft 410 is arranged at the bottom of the chuck body 200 and coaxially arranged with the chuck body 200. The hollow motor 420 is arranged on the side wall of the rotating shaft 410 and used to drive the rotating shaft 410 to rotate. The rotating shaft 410 has a hollow channel and can be used as the pressure supply pipe 360.

[0036] Preferably, the backside cleaning mechanism 100 includes a cleaning brush 110, a cleaning brush moving assembly 120, a first nozzle 130, and a cleaning brush rotating driving assembly 140. The brush surface 111 of the cleaning brush 110 is arranged upward and arranged at the end of the cleaning brush moving assembly 120. The cleaning brush moving assembly 120 is used to move the cleaning brush 110 below the substrate 20 during backside cleaning of the substrate 20, so that the brush surface 111 brushes the backside 21 of the substrate 20. The cleaning brush rotating driving assembly 140 is arranged at the end of the cleaning brush moving assembly 120 and connected with the cleaning brush 110, and used to drive the cleaning brush 110 to rotate during backside cleaning of the substrate 20. The first nozzle 130 is arranged on the cleaning brush moving assembly 120 and used to spray cleaning liquid (for example, DIW) toward the backside of the substrate 20 during backside cleaning of the substrate 20, so as to increase the cleaning effect of the cleaning brush 110 on the backside of the substrate 20. In addition, the second nozzle 210 is arranged on the surface of the chuck body 200 and used to spray cleaning liquid toward the backside 21 of the substrate 20 during backside cleaning of the substrate 20, so as to keep the backside of the substrate 20 wet during backside cleaning of the substrate 20 and prevent the backside of the substrate 20 from being partially dried to form water stains.

[0037] In the embodiment, during the backside cleaning of the substrate 20, the clamping members 300 only rotate around the vertical axis, and the cleaning brush 110 can move to the lower side of the substrate 20 between two adjacent clamping members 300, and clean the backside 21 of the substrate 20 by reciprocating along the radial direction r while the substrate 20 rotates. The rotation of the clamping members 300 does not hinder the cleaning brush 110 from moving to the lower side of the substrate 20 to clean the backside 21 of the substrate 20, so that the backside cleaning mechanism 100 can continuously and comprehensively clean the backside 21 of the substrate 20.

[0038] Preferably, the substrate cleaning device 10 further comprises a substrate edge cleaning mechanism 500 for flushing the chemical liquid splashed to the edge of the upper surface of the substrate 20 after the backside cleaning of the substrate 20 is completed. Specifically, the substrate edge cleaning mechanism 500 comprises a third nozzle 510 and a nozzle moving mechanism 520 for driving the third nozzle 510 to move above the edge of the substrate 20, so that the chemical liquid splashed to the edge of the upper surface of the substrate 20 is flushed by the third nozzle 510 after the backside cleaning of the substrate 20 is completed.

[0039] The application further discloses a substrate cleaning method suitable for the substrate cleaning device, and the substrate cleaning device has the same structure as the substrate cleaning device 10 in any of the above embodiments, which will not be described here.

[0040] The substrate cleaning method comprises the following steps.

[0041] In step S10, at least some of the clamping members 300 carry and clamp the substrate to be processed.

[0042] In step S20, at least some of the clamping members 300 drive the substrate to be processed to rotate around the vertical axis, and the backside cleaning mechanism 100 cleans the side of the substrate to be processed close to the chuck body 200.

[0043] In step S30, the chuck driving mechanism 400 drives the chuck body 200 to rotate to spin dry the cleaned substrate.

[0044] Preferably, the second starting pressure is greater than the first starting pressure, and step S10 comprises the following steps.

[0045] In step S11, the substrate to be processed is loaded between the clamping members 300 and supported by the clamping members 300.

[0046] In step S12, the pressure supply pipeline 360 provides the first pressure, and the first pressure is greater than or equal to the first starting pressure and less than the second starting pressure, so that the first clamping member 340 drives the substrate to be processed to rise and clamp the substrate to be processed.

[0047] Step S13: the pressure supply pipeline 360 provides a second pressure, the second pressure is greater than or equal to the second starting pressure and less than the third starting pressure, so that the second clamping member 350 clamps the substrate to be processed.

[0048] Preferably, step S20 comprises:

[0049] Step S21: the pressure supply pipeline 360 provides a third pressure, the third pressure is greater than or equal to the third starting pressure, so that the second clamping member 350 drives the substrate to be processed to rotate;

[0050] Step S22: the backside cleaning mechanism 100 cleans the substrate to be processed.

[0051] Preferably, step S30 comprises:

[0052] Step S31: the pressure supply pipeline 360 provides a pressure that is lower than the third starting pressure and greater than or equal to the second starting pressure, so that the second clamping member 350 stops driving the cleaned substrate to rotate;

[0053] Step S32: the chuck driving mechanism 400 drives the chuck body 200 to rotate to spin dry the cleaned substrate.

[0054] Preferably, the substrate cleaning method further comprises: step S40, unloading the substrate after the spin-drying treatment from the substrate cleaning device 10.

[0055] Specifically, step S40 comprises:

[0056] Step S411: the pressure supply pipeline 360 provides a pressure that is lower than the first starting pressure, and the clamping member 300 slides outward along the radial direction r to release the substrate after the spin-drying treatment and lower it until it is supported by the annular support surface 311;

[0057] Step S412: the substrate supported by the annular support surface 311 is unloaded by the robot 30.

[0058] In another embodiment of the present application, step S40 comprises:

[0059] Step S421: the robot 30 moves below the substrate after the spin-drying treatment and above the annular support surface 311;

[0060] Step S422: the pressure supply pipeline 360 provides a pressure that is lower than the first starting pressure, and the clamping member 300 slides outward along the radial direction r to release the substrate after the spin-drying treatment and support it by the robot 30.

[0061] The present application also discloses a gluing and developing device, comprising a device front-end module, a process station and an interface station connected in sequence. The process station comprises a coating unit, a developing unit, a heat treatment unit and a substrate cleaning device 10.

[0062] The coating unit is used for coating treatment of the substrate. The developing unit is used for developing treatment of the substrate. The heat treatment unit is used for heat treatment of the substrate. The substrate cleaning device 10 is used for cleaning the substrate after the coating treatment, so as to prevent the contaminant particles on the back of the substrate from transferring into the photoetching machine, causing the contaminant particles to be mixed between the substrate and the substrate support table during the exposure treatment, making the substrate surface curved to appear local protrusions, so that the focus cannot be matched during the exposure, causing defocus phenomenon, affecting the exposure pattern precision of the substrate, and causing the substrate processing yield to be reduced.

[0063] It should be noted that the above embodiments can be freely combined according to needs. The above is only a preferred embodiment of the present application, and those of ordinary skill in the art can make several improvements and refinements without departing from the principles of the present application, and these improvements and refinements should also be considered within the scope of protection of the present application.

Claims

1. A substrate cleaning apparatus, characterized in that, include: Chuck body; A plurality of clamping members, including a plurality of first clamping members and a plurality of second clamping members, are arranged in a circle on the surface of the chuck body for clamping the substrate and driving the substrate to rotate. A back-side cleaning mechanism is used to clean the side of the substrate near the chuck body during the substrate's rotation. A chuck drive mechanism, connected to the chuck body, is used to drive the chuck body to rotate in order to spin-dry the substrate that has been cleaned. A plurality of first radial drive members are used to simultaneously drive the plurality of first clamping members to slide along the radial direction of the chuck body, and the plurality of first radial drive members all have a first starting pressure; A plurality of second radial driving members are used to simultaneously drive the plurality of second clamping members to slide along the radial direction, and the plurality of second radial driving members each have a second starting pressure, the second starting pressure being not less than the first starting pressure; A plurality of rotary drive members are used to simultaneously drive the plurality of second clamping members to rotate, thereby causing the substrate to rotate, and the plurality of rotary drive members all have a third starting pressure, the third starting pressure being greater than the second starting pressure.

2. The substrate cleaning apparatus according to claim 1, characterized in that, The clamping components, from bottom to top, include: The sliding part has a frustum structure that is larger at the bottom and smaller at the top. The sliding part is configured to provide a vertically upward component force to the edge of the substrate when the clamping member slides inward along the radial direction of the chuck body, so as to make the substrate rise. The limiting part has an annular groove that is adapted to the edge of the substrate.

3. The substrate cleaning apparatus according to claim 2, characterized in that, The clamping element further includes: The support portion is located at the bottom end of the sliding portion; wherein, The support portion has an annular support surface surrounding the sliding portion for supporting the substrate.

4. The substrate cleaning apparatus according to claim 1, characterized in that, The substrate cleaning apparatus further includes: The pressure supply line is connected to the first radial drive, the second radial drive, and the rotary drive respectively, and is used to simultaneously provide pressure to the first radial drive, the second radial drive, and the rotary drive.

5. The substrate cleaning apparatus according to claim 4, characterized in that, The second starting pressure is greater than the first starting pressure, and the substrate cleaning device is configured as follows: During substrate loading, the pressure supply line first provides a first pressure, which is greater than or equal to the first start-up pressure and less than the second start-up pressure, so that the first clamping member drives the substrate to rise and clamps the substrate. Then, the pressure supply line provides a second pressure, which is greater than or equal to the second start-up pressure and less than the third start-up pressure, so that the second clamping member clamps the substrate.

6. The substrate cleaning apparatus according to claim 4, characterized in that, The substrate cleaning apparatus is configured as follows: During substrate cleaning, the pressure supply line provides a third pressure, which is greater than or equal to the third start-up pressure, so that the second clamping member drives the substrate to rotate.

7. The substrate cleaning apparatus according to claim 4, characterized in that, The substrate cleaning apparatus is configured as follows: After the substrate is cleaned, the pressure supplied by the pressure supply line drops to below the third starting pressure but is greater than or equal to the first starting pressure, so that the second clamping member stops driving the substrate to rotate. Then, the chuck drive mechanism drives the chuck body to rotate to spin dry the cleaned substrate.

8. The substrate cleaning apparatus according to claim 4, characterized in that, The substrate cleaning apparatus is configured as follows: After the substrate is cleaned, the pressure supplied by the pressure supply line drops to below the third starting pressure but is greater than or equal to the second starting pressure, so that the second clamping member stops driving the substrate to rotate. Then, the chuck drive mechanism drives the chuck body to rotate to spin dry the cleaned substrate.

9. The substrate cleaning apparatus according to claim 1, characterized in that, The rotary drive component includes a pneumatic motor or a hydraulic motor; And / or, the first radial drive and the second radial drive include a pneumatic cylinder or a hydraulic cylinder.

10. The substrate cleaning apparatus according to claim 1, characterized in that, The back cleaning mechanism includes: A cleaning brush, wherein the brush surface of the cleaning brush is positioned upwards; A cleaning brush moving assembly is used to move the cleaning brush below the substrate during the substrate's rotation, so that the brush face can brush the back side of the substrate.

11. A substrate cleaning method, characterized in that, A substrate cleaning apparatus is applicable, comprising: a chuck body; a plurality of clamping members, including a plurality of first clamping members and a plurality of second clamping members, arranged in a circle on the surface of the chuck body for clamping a substrate and driving the substrate to rotate; a back cleaning mechanism for cleaning the side of the substrate near the chuck body; a chuck driving mechanism for driving the chuck body to rotate; a plurality of first radial driving members for simultaneously driving the plurality of first clamping members to slide along the radial direction of the chuck body, and each of the plurality of first radial driving members having a first starting pressure; a plurality of second radial driving members for simultaneously driving the plurality of second clamping members to slide along the radial direction, and each of the plurality of second radial driving members having a second starting pressure, the second starting pressure being not less than the first starting pressure; and a plurality of rotary driving members for simultaneously driving the plurality of second clamping members to rotate, thereby driving the substrate to rotate, and each of the plurality of rotary driving members having a third starting pressure, the third starting pressure being greater than the second starting pressure. The substrate cleaning method includes: Step S10: The substrate to be processed is carried and clamped by at least a portion of the clamping members. Step S20: The substrate to be processed is rotated by at least some of the clamping members, and the back cleaning mechanism cleans the side of the substrate to be processed that is close to the chuck body. Step S30: Drive the chuck body to rotate through the chuck drive mechanism to spin dry the cleaned substrate.

12. The substrate cleaning method according to claim 11, characterized in that, The substrate cleaning apparatus further includes: A pressure supply line is connected to the first radial drive, the second radial drive, and the rotary drive, respectively, for simultaneously providing pressure to the first radial drive, the second radial drive, and the rotary drive; wherein, step S10 includes: Step S11: The substrate to be processed is loaded between each of the clamping members and supported by the clamping members; Step S12: The pressure supply line provides a first pressure, which is greater than or equal to the first starting pressure and less than the second starting pressure, so that the first clamping member drives the substrate to be processed to rise and clamps the substrate to be processed. Step S13: The pressure supply line provides a second pressure, which is greater than or equal to the second starting pressure and less than the third starting pressure, so that the second clamping member clamps the substrate to be processed.

13. The substrate cleaning method according to claim 12, characterized in that, Step S20 includes: Step S21: The pressure supply line provides a third pressure, which is greater than or equal to the third starting pressure, so that the second clamping member drives the substrate to be processed to rotate. Step S22: Clean the substrate to be processed using the back cleaning mechanism.

14. The substrate cleaning method according to claim 12, characterized in that, Step S30 includes: Step S31: The pressure supplied by the pressure supply line drops to below the third starting pressure, but is greater than or equal to the second starting pressure, so that the second clamping member stops driving the cleaned substrate to rotate. Step S32: The chuck drive mechanism drives the chuck body to rotate to spin dry the cleaned substrate.

15. A coating and developing apparatus, comprising a front-end module, a process station, and an interface station connected in sequence, characterized in that, The process station includes: A coating unit is used to coat a substrate. The developing unit is used to develop the substrate. A heat treatment unit is used to heat treat the substrate; And a substrate cleaning apparatus as described in any one of claims 1-10, for cleaning the substrate after coating treatment.

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