A constant energy laser-assisted surface processing method and system

Abstract

The present application belongs to the field of ultra-precision machining technology, and discloses a constant energy laser-assisted surface machining method and system, which includes: adjusting the inclination angle between the laser beam and the incident surface so that the laser beam is emitted from the front cutting face of the diamond tool; determining the action position of the diamond tool arc in each machining site based on the surface machining cutting trajectory, and obtaining the laser beam offset distance; performing laser focus position compensation based on the laser beam offset distance, so that any machining site can obtain laser assistance; simulating and obtaining a mapping relationship model between the laser power and the material softening temperature corresponding to different machining sites; obtaining the actual laser power required for all machining sites based on the mapping relationship model; and performing laser-assisted machining on all machining sites in the machining area in sequence according to the actual laser power. This application can achieve the effect of improving the surface quality and surface shape accuracy of machining curved optical elements made of hard, brittle, and difficult-to-machine materials.

Description

Technical Field

[0001] The present application belongs to the field of ultra-precision machining, and more specifically, relates to a constant energy laser-assisted surface machining method and system. Background Art

[0002] Materials such as single-crystal silicon and fused quartz are typically hard, brittle, and difficult to machine due to their high hardness, brittleness, and low fracture toughness. When processed using traditional cutting methods, the brittle fracture of the material results in poor surface quality and severe subsurface loss. Furthermore, the high cutting forces and unstable cutting during brittle removal lead to severe tool wear, making it difficult to achieve high-precision machining of large-aperture, complex curved optical components. With the development and popularization of laser technology, laser in-situ assisted machining has become an important method for high-precision machining of hard and brittle materials. This method primarily uses single-point diamond cutting technology to achieve plastic removal of the material, thereby improving surface quality and reducing tool wear.

[0003] The existing laser in-situ assisted cutting technology has two major technical bottlenecks in curved surface processing. First, the laser beam is fixedly applied to the center of the diamond tool arc, while the actual cutting point in curved surface processing continuously changes at different positions of the tool edge, resulting in a lack of effective laser assistance in most processing areas. The main reason is that the arc structure of the back tool face makes it difficult to control the optical path, and the energy utilization rate of the backward emission mode is low. Secondly, when using constant speed processing, as the tool moves toward the center of the workpiece, the scanning line speed gradually decreases, causing a sharp increase in heat accumulation under constant laser power, and large local temperature fluctuations, which not only cause uneven softening of the material and ablation defects, but also a large amount of heat accumulation leads to the risk of graphitization of the diamond tool. These two problems together lead to large deviations in the surface accuracy of curved components and increased depth of sub-surface damage, which seriously restricts the improvement of the processing quality of optical components. In short, from the perspective of existing technologies, there is currently no suitable processing method for ultra-precision processing of curved optical components made of hard, brittle and difficult-to-process materials. Summary of the Invention

[0004] In response to the defects of the existing technology, the purpose of this application is to provide a constant energy laser-assisted surface processing method, which aims to solve the problem that the existing laser in-situ assisted cutting technology is prone to cause large surface accuracy deviation of curved components and deep sub-surface damage depth, making it difficult to achieve high-precision and low-damage manufacturing.

[0005] To achieve the above objectives, in a first aspect, the present application provides a constant energy laser-assisted surface processing method, comprising:

[0006] S1 adjusts the inclination angle between the laser beam and the incident surface so that the laser beam is emitted from the rake face of the diamond tool; determines the action position of the diamond tool arc in each processing position based on the surface processing cutting trajectory, and obtains the laser beam offset distance; and performs laser focus position compensation based on the laser beam offset distance so that any processing position can obtain laser assistance;

[0007] S2 simulates and obtains a mapping relationship model between the laser power and the material softening temperature corresponding to different processing locations; based on the mapping relationship model, the actual laser power required for all processing locations is obtained;

[0008] S3 performs laser-assisted processing on all processing positions in the processing area in sequence according to the actual laser power.

[0009] Furthermore, the following relationship model is used to adjust the inclination angle between the laser beam and the incident surface so that the laser is emitted from the rake face of the diamond tool:

[0010]

[0011] in, β is the laser incident angle, L is the diamond tool length, a is the distance from the upper end of the laser incident surface to the cutting edge of the diamond tool, n is the refractive index of diamond.

[0012] Furthermore, a method for compensating the laser focus position based on the laser beam offset distance is as follows:

[0013] S101 establishes the XY distance relationship model of the diamond tool edge arc;

[0014] S102 obtains a compensation value of the laser focus in the Y direction after the laser beam is offset in the X direction according to the XY distance relationship model of the diamond tool edge arc;

[0015] S103 controls the laser beam to move in the Y direction according to the compensation value so that the laser beam coincides with the position to be processed.

[0016] Furthermore, the XY distance relationship model of the diamond tool edge arc is expressed as the following model:

[0017]

[0018] in, dx is the X-direction offset distance of the laser beam, dy It is the compensation value of laser focus in Y direction.

[0019] Furthermore, the method for obtaining the laser power of all processing positions in the area to be processed based on the mapping relationship model is:

[0020] S201 outputs the material softening temperature corresponding to each processing point based on the mapping relationship model;

[0021] S202 compares the softening temperature of the material with the corresponding ideal softening temperature to determine whether the laser power at the current processing site meets the softening requirements: if so, the current laser power is retained as the actual laser power; if not, the laser power is adjusted until the laser power that meets the softening requirements is obtained and the adjustment is stopped.

[0022] Furthermore, the laser power is dynamically matched with the cutting trajectory of the diamond tool in real time until the constant energy assisted processing of all processing positions is completed.

[0023] According to a second aspect of the present application, a system for implementing any of the above constant energy laser-assisted surface machining methods is also provided, the system comprising:

[0024] A laser beam adjustment module is used to adjust the inclination angle between the laser beam and the incident surface so that the laser beam is emitted from the rake face of the diamond tool;

[0025] A laser beam offset distance acquisition module is used to determine the action position of the diamond tool arc in each processing position based on the surface processing cutting trajectory and obtain the laser beam offset distance;

[0026] A laser focus position compensation module, configured to compensate the laser focus position based on the laser beam offset distance, so that any processing position can obtain laser assistance;

[0027] A laser beam energy control module is used to simulate and obtain a mapping relationship model between the laser power and the material softening temperature corresponding to different processing locations; and is also used to obtain the actual laser power required for all processing locations based on the mapping relationship model;

[0028] A laser processing module, configured to sequentially perform laser-assisted processing on all processing locations in the processing area according to the actual laser power;

[0029] The multi-directional displacement automatic adjustment platform is used to integrate the laser beam adjustment module, the laser beam offset distance acquisition module, the laser focus position compensation module, the laser beam energy control module and the laser processing module to form a closed-loop control system.

[0030] In a third aspect, the present application provides an electronic device comprising: at least one memory for storing programs; and at least one processor for executing the programs stored in the memory. When the program stored in the memory is executed, the processor is used to execute the method described in the first aspect or any possible implementation of the first aspect.

[0031] In a third aspect, the present application provides a computer-readable storage medium storing a computer program. When the computer program runs on a processor, the processor executes the method described in the first aspect or any possible implementation of the first aspect.

[0032] In a fourth aspect, the present application provides a computer program product. When the computer program product runs on a processor, it enables the processor to execute the method described in the first aspect or any possible implementation of the first aspect.

[0033] It can be understood that the beneficial effects of the second to fourth aspects mentioned above can be found in the relevant description of the first aspect mentioned above, and will not be repeated here.

[0034] In general, the above technical solutions conceived by this application have the following beneficial effects compared with the existing technologies:

[0035] (1) The constant energy laser-assisted surface processing provided by this application enables the laser beam to be emitted from the front cutting edge. Compared with the traditional back cutting edge, it breaks through the optical path control limitation of the back cutting edge arc structure and greatly improves its energy utilization rate. Based on the constant propagation direction characteristic of the laser, a coordinated control algorithm of the beam offset and focus compensation is developed to achieve real-time matching of the laser posture and the cutting point of the tool edge during the processing process, ensuring that any processing position can obtain effective laser assistance, solving the surface accuracy deviation and sub-surface damage problems of hard and brittle material surface components caused by insufficient local softening, and improving the surface quality and surface accuracy of the processing of hard and brittle difficult-to-process surface optical components.

[0036] (2) The laser in-situ assisted processing technology provided in this application establishes a dynamic mapping model of processing position-scanning speed-laser power, and compensates for the linear velocity attenuation caused by the centripetal motion of the tool by adjusting the power in real time, thereby maintaining a constant laser energy per unit area; by constructing a workpiece temperature field distribution model, laser energy is obtained to avoid uneven material softening or thermal damage that occurs in traditional constant power processing, thereby significantly improving the quality and integrity of the processed surface.

[0037] (3) The laser in-situ assisted processing system of the present application retains the original processing system. It only needs to improve the laser beam control device in the original in-situ laser assisted cutting system, replace the traditional single manual displacement platform with a multi-directional displacement automatic adjustment platform, and cooperate with various modules for realizing laser beam posture control and laser beam energy control to realize the laser in-situ assisted processing technology provided by the present application. The overall system structure is simple and can realize real-time tracking of the laser beam and the cutting position, avoiding adverse effects on the original processing process. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] Figure 1 1 is a flow chart of a constant energy laser-assisted surface machining method provided in an embodiment of the present application;

[0039] Figure 2 This is a schematic structural diagram of a device for laser-assisted curved surface machining capable of achieving constant energy provided by an embodiment of the present application;

[0040] Figure 3 Schematic diagram of the structure of a diamond tool in which a laser beam is emitted from the rake face of the tool, provided in an embodiment of the present application;

[0041] Figure 4 1 is a schematic diagram of an optical simulation of a laser beam emitted from a rake face of a tool provided in an embodiment of the present application;

[0042] Figure 5 This is a schematic diagram of an optical simulation of a laser beam emitted from the rake face of a diamond tool after being offset by a certain distance, provided in an embodiment of the present application;

[0043] Figure 6 This is a schematic diagram of laser focus position compensation provided by an embodiment of the present application;

[0044] Figure 7 This is a schematic diagram of the laser beam energy control process in the constant energy laser-assisted surface machining process provided by an embodiment of the present application;

[0045] Figure 8 It is a structural diagram of an electronic device provided in an embodiment of the present application.

[0046] Throughout the drawings, the same reference numerals are used to denote the same elements or structures, wherein:

[0047] 100-displacement platform, 101-beam shaping device, 102-laser beam, 103-diamond tool, 104-X-axis piezoelectric nano-displacement platform, 105-Y-axis piezoelectric nano-displacement platform, 106-position controller, 107-laser controller; 500-laser beam, 501-diamond tool, 502-workpiece to be processed, 503-machining center position, 504-laser beam after offset, 505-processing other positions. DETAILED DESCRIPTION

[0048] In order to make the purpose, technical solutions and advantages of this application more clear, the following further describes this application in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application.

[0049] The term "and / or" as used herein describes an association between related objects, indicating that three possible relationships exist. For example, "A and / or B" can represent: A exists alone, A and B exist simultaneously, or B exists alone. The symbol " / " as used herein indicates that the related objects are in an "or" relationship, for example, A / B means either A or B.

[0050] The terms "first" and "second" in this specification and claims are used to distinguish different objects rather than to describe a specific order of objects. For example, "first response message" and "second response message" are used to distinguish different response messages rather than to describe a specific order of response messages.

[0051] In the embodiments of this application, words such as "exemplary" or "for example" are used to indicate examples, illustrations, or descriptions. Any embodiment or design described as "exemplary" or "for example" in the embodiments of this application should not be interpreted as being preferred or advantageous over other embodiments or designs. Rather, the use of words such as "exemplary" or "for example" is intended to present the relevant concepts in a concrete manner.

[0052] In the description of the embodiments of the present application, unless otherwise specified, "multiple" means two or more, for example, multiple processing units means two or more processing units, etc.; multiple elements means two or more elements, etc.

[0053] For ease of understanding, the English abbreviations and related technical terms involved in the embodiments of this application are explained and described below.

[0054] The present application provides a method for constant energy laser-assisted surface processing, such as Figure 1 As shown, the following steps are included:

[0055] S1 first controls the laser beam posture: adjusts the inclination angle between the laser beam and the incident surface so that the laser beam is emitted from the rake face of the diamond tool; determines the action position of the diamond tool arc in each processing position based on the surface machining cutting trajectory, and obtains the laser beam offset distance; and compensates the laser focus position based on the laser beam offset distance so that any processing position can obtain laser assistance;

[0056] S2 then controls the laser beam energy: a simulation is performed to obtain a mapping relationship model between the laser power and the material softening temperature corresponding to different processing locations; based on the mapping relationship model, the actual laser power required for all processing locations is obtained;

[0057] S3 performs laser-assisted processing on all processing locations in the processing area in sequence according to the actual laser power.

[0058] In this embodiment, beam energy control needs to be performed after laser posture control. Through posture control, it is ensured that all processing sites in the area to be processed are irradiated with laser. Then, the laser energy at each processing site is controlled to ensure consistency of laser energy.

[0059] Figure 2 The laser in-situ assisted machining device for implementing steps S1-S3 above includes a displacement platform 100, a beam shaping device 101, a laser beam 102, a diamond tool 103, an X-axis piezoelectric nano-displacement platform 104, a Y-axis piezoelectric nano-displacement platform 105, a position controller 106, and a laser controller 107. In this embodiment, the laser beam 102 is collimated and focused by the beam shaping device 101 before being emitted from the circular arc position of the diamond tool 103. The beam shaping device 101 is mounted above the displacement platform 100, the X-axis piezoelectric nano-displacement platform 104, and the Y-axis piezoelectric nano-displacement platform 105. During laser beam position control, laser beam offset is achieved by the X-axis piezoelectric nano-displacement platform 104, and laser focus position compensation is achieved by the Y-axis piezoelectric nano-displacement platform 105. The position controller 106 is used to control the movement of the X-axis piezoelectric nano-displacement platform 104 and the Y-axis piezoelectric nano-displacement platform 105. During the laser beam energy regulation process, the laser power is controlled by the laser controller 107. The above-mentioned processing device is equipped with a constant energy laser-assisted surface processing system, which can realize constant energy laser assistance in the surface processing process, specifically including laser beam posture control and laser beam energy control.

[0060] like Figure 3 The figure is a schematic diagram of the structure of the diamond tool in step S1. In this embodiment, the diamond tool is designed mainly through the following relationship model, specifically by adjusting the inclination angle between the laser beam in the diamond tool and its incident surface β , so that the laser is emitted from the rake face of the diamond tool:

[0061] (1)

[0062] in, β is the angle between the laser and its incident surface, L is the diamond tool length, a is the distance from the upper end of the laser incident surface to the cutting edge of the diamond tool, nis the refractive index of diamond.

[0063] For example, when the diamond tool rake angle is -35°, β The use of 40° can ensure that the laser beam is emitted from the rake face of the tool. At the same time, the above relationship model can ensure that the laser beam has a large adjustment range and improve the laser energy utilization rate.

[0064] like Figure 4 Figures A and B show the optical simulation diagrams of the laser beam emitted from the rake face of the diamond tool. Figure 4 Figure A in the middle is a schematic diagram of a diamond tool from a top-down perspective. Figure 4 Figure B is a schematic diagram of the diamond tool from a front view. Specifically, after completing the design of the diamond tool structure and dimensions according to the aforementioned formula (1), optical simulation was performed using the non-sequential module of Zemax optical simulation software. The laser beam was incident from the center of the diamond tool bottom surface at a height of 0.6 mm. The laser beam was refracted and reflected in the diamond tool and emitted from the center of the tool rake face.

[0065] like Figure 5 The figure shows an optical simulation diagram of a laser beam emitted from the rake face of a diamond tool after being offset by a certain distance. Figure 5 Figure A in the middle is a schematic diagram of a diamond tool from a top-down perspective. Figure 5 Figure B is a schematic diagram of the diamond tool from a front view. Specifically, in Zemax software, the laser beam is incident on the diamond tool after being offset by 0.15 mm in the X direction.

[0066] Depend on Figure 4 and Figure 5 The simulation results show that the propagation path of the laser beam after deflection in this application is different from the propagation path of the laser beam before deflection ( Figure 4 ) and from Figure 4 Figure C and Figure 5 Figure C shows that the incoherent irradiance of the laser beam remains unchanged before and after the offset. The offset distance between the position where the laser beam emerges from the tool rake face and the center axis of the tool arc is 0.15 mm. This means the distance between the incident laser and the center axis of the tool arc is the offset distance of the laser beam in the X direction. Given that the propagation path of the offset laser beam remains unchanged when emitted from the tool rake face, it can be seen that the position and posture of the laser beam can be controlled by moving the laser beam.

[0067] After the laser beam is offset, the laser focus position will change due to the circular arc shape of the diamond tool rake face. Therefore, it is necessary to establish an XY distance relationship model for the tool edge arc. Based on the laser beam's X-direction offset distance, the Y-direction compensation value of the laser focus is obtained. The laser focus position is compensated by the laser beam's Y-direction movement.

[0068] Specifically, the method for compensating the laser focus position based on the laser beam offset distance includes the following steps:

[0069] S101 establishes the XY distance relationship model of the diamond tool edge arc:

[0070] In this embodiment, the XY distance relationship model of the diamond tool edge arc is expressed as:

[0071] (2)

[0072] in, dx is the X-direction offset distance of the laser beam, dy It is the compensation value of laser focus in Y direction.

[0073] In other preferred embodiments, the diamond tool cutting edge arc XY distance relationship model can be refined and designed into other forms.

[0074] S102 obtains a compensation value of the laser focus in the Y direction after the laser beam is offset in the X direction according to the XY distance relationship model of the diamond tool edge arc.

[0075] S103 controls the laser beam to move in the Y direction according to the compensation value so that the laser beam coincides with the position to be processed, thereby achieving laser assistance at any processing position during the surface processing.

[0076] like Figure 6 Figure 2 shows a schematic diagram of laser focus position compensation. Specifically, at the machining center position 503 on the machining surface 502, laser beam 500 is incident from the center of diamond tool 501. After being refracted and reflected within diamond tool 501, laser beam 500 is emitted from the center of the tool's rake face. For machining other machining positions 505 on the machining surface 502, the laser beam needs to be offset by a certain distance, denoted by dx. After this offset, laser beam 504 is refracted and reflected within diamond tool 501, and then emitted from the tool's rake face and acts on the machining positions 505 on the machining surface 502.

[0077] In step S2, the method flow of simulating and obtaining the mapping relationship model between the laser power and the material softening temperature corresponding to different processing positions is as follows: Figure 7As shown in the figure, the specific steps are as follows: first, a temperature field model (i.e., a mapping relationship model) under laser assistance is established in the finite element software. Specifically, the material parameters, process parameters, and cutting parameters of the surface to be processed are first input, and then the initial laser power is set. Then, the relationship between the laser power and the output softening temperature at different processing positions is obtained. The formula of the temperature field model is:

[0078] T=G(v,x,y,P)(3)

[0079] Wherein, T represents the softening temperature of the material, v represents the processing speed, x represents the processing position of the processing site in the x-axis direction, y represents the processing position of the processing site in the y-axis direction, and P represents the laser power.

[0080] Specifically, the method for obtaining the actual laser power required for all processing locations in the area to be processed based on the mapping relationship model is:

[0081] S201 outputs the material softening temperature corresponding to each processing site based on the mapping relationship model;

[0082] S202 compares the material softening temperature with the corresponding ideal softening temperature to determine whether the laser power at the current processing location meets the softening requirements: if so, the current laser power is retained as the actual laser power; if not, the laser power is adjusted until the laser power that meets the softening requirements is obtained and the adjustment is stopped.

[0083] In step S3, the actual laser power is dynamically matched to the cutting trajectory of the diamond tool in real time until constant energy assisted machining is completed at all machining locations. Specifically, the in-situ assisted machining CNC system and the laser are collaboratively controlled to dynamically match the actual laser power to the cutting trajectory of the diamond tool in real time, achieving constant energy assisted machining and ensuring the integrity of the surface machining.

[0084] Another embodiment of the present application further provides a system for implementing the above-mentioned constant energy laser-assisted surface processing method, the system comprising:

[0085] A laser beam adjustment module is used to adjust the inclination angle between the laser beam and the incident surface so that the laser beam is emitted from the rake face of the diamond tool;

[0086] A laser beam offset distance acquisition module is used to determine the action position of the diamond tool arc in each processing position based on the surface processing cutting trajectory and obtain the laser beam offset distance;

[0087] Laser focus position compensation module, used to compensate the laser focus position based on the laser beam offset distance, so that any processing position can obtain laser assistance;

[0088] The laser beam energy control module is used to simulate and obtain the mapping relationship model between the laser power and the material softening temperature corresponding to different processing locations; it is also used to obtain the actual laser power required for all processing locations based on the mapping relationship model;

[0089] The laser processing module is used to perform laser-assisted processing on all processing locations in the processing area in sequence according to the actual laser power;

[0090] The multi-directional automatic displacement adjustment platform integrates a laser beam adjustment module, a laser beam offset distance acquisition module, a laser focus position compensation module, a laser beam energy control module, and a laser processing module to form a closed-loop control system. Specifically, the multi-directional automatic displacement adjustment platform receives control commands from each of the aforementioned modules, synchronously adjusts the spatial position of optical components and the tool motion trajectory, and transmits physical parameters such as platform displacement and acceleration back to the control layer. More specifically, the multi-directional automatic displacement adjustment platform integrates a five-axis motion mechanism (XYZ linear axes + AB rotational axis) and corresponding linear motors to achieve multi-directional displacement.

[0091] It is understandable that the detailed functional implementation of each of the above units / modules can be found in the introduction of the aforementioned method embodiment, and will not be repeated here.

[0092] It should be understood that the above-mentioned device is used to execute the method in the above-mentioned embodiment. The implementation principle and technical effect of the corresponding program module in the device are similar to those described in the above-mentioned method. The working process of the device can refer to the corresponding process in the above-mentioned method and will not be repeated here.

[0093] Based on the methods in the above embodiments, an embodiment of the present application provides an electronic device, which includes: a processor (Processor) 810, a communication interface (Communications Interface) 820, a memory (Memory) 830, and a communication bus 840, wherein the processor 810, the communication interface 820, and the memory 830 communicate with each other via the communication bus 840. The processor 810 can call the logic instructions in the memory 830 to execute the methods in the above embodiments.

[0094] In addition, the logic instructions in the aforementioned memory 830 can be implemented in the form of a software functional unit and, when sold or used as an independent product, can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application, or the portion that contributes to the prior art, or the portion of the technical solution, can be embodied in the form of a software product. The computer software product is stored in a storage medium and includes a number of instructions for enabling a computer device (which can be a personal computer, server, or network device, etc.) to execute all or part of the steps of the method described in each embodiment of the present application.

[0095] Based on the method in the above embodiment, an embodiment of the present application provides a computer-readable storage medium, which stores a computer program. When the computer program runs on a processor, the processor executes the method in the above embodiment.

[0096] Based on the method in the above embodiment, an embodiment of the present application provides a computer program product. When the computer program product runs on a processor, the processor executes the method in the above embodiment.

[0097] It is understood that the processor in the embodiments of the present application may be a central processing unit (CPU), other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), field programmable gate arrays (FPGA), other programmable logic devices, transistor logic devices, hardware components, or any combination thereof. The general-purpose processor may be a microprocessor or any conventional processor.

[0098] The method steps in the embodiments of the present application can be implemented by hardware or by a processor executing software instructions. The software instructions can be composed of corresponding software modules, which can be stored in random access memory (RAM), flash memory, read-only memory (ROM), programmable read-only memory (PROM), erasable programmable read-only memory (EPROM), electrically erasable programmable read-only memory (EEPROM), registers, hard disks, mobile hard disks, CD-ROMs, or any other form of storage medium known in the art. An exemplary storage medium is coupled to the processor so that the processor can read information from the storage medium and write information to the storage medium. Of course, the storage medium can also be an integral part of the processor. The processor and storage medium can be located in an ASIC.

[0099] The above embodiments can be implemented in whole or in part using software, hardware, firmware, or any combination thereof. When implemented using software, they can be implemented in whole or in part in the form of a computer program product. The computer program product comprises one or more computer instructions. When loaded and executed on a computer, the computer program instructions fully or partially produce the processes or functions described in the embodiments of this application. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable device. The computer instructions can be stored in a computer-readable storage medium or transmitted via the computer-readable storage medium. The computer instructions can be transmitted from one website, computer, server, or data center to another website, computer, server, or data center via wired (e.g., coaxial cable, optical fiber, digital subscriber line (DSL)) or wireless (e.g., infrared, wireless, microwave, etc.) means. The computer-readable storage medium can be any available medium accessible by a computer or a data storage device such as a server or data center that integrates one or more available media. The available medium can be magnetic media (e.g., floppy disk, hard disk, tape), optical media (e.g., DVD), or semiconductor media (e.g., solid-state drive (SSD)).

[0100] It will be understood that the various numerical numbers involved in the embodiments of the present application are merely distinctions for the convenience of description and are not intended to limit the scope of the embodiments of the present application.

[0101] It is easy for those skilled in the art to understand that the above is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the scope of protection of the present application.

Claims

1. A constant energy laser-assisted surface processing method, characterized in that: include: S1 uses the following relationship model to adjust the tilt angle between the laser beam and the incident surface so that the laser is emitted from the rake face of the diamond tool: in, β is the laser incident angle, L is the diamond tool length, a is the distance from the upper end of the laser incident surface to the cutting edge of the diamond tool, n is the refractive index of diamond; Based on the surface machining cutting trajectory, the action position of the diamond tool arc in each machining position is determined to obtain the laser beam offset distance; and the laser focus position is compensated based on the laser beam offset distance: S101 establishes the XY distance relationship model of the diamond tool edge arc; S102 obtains a compensation value of the laser focus in the Y direction after the laser beam is offset in the X direction according to the XY distance relationship model of the diamond tool edge arc; S103 controls the laser beam to move in the Y direction according to the compensation value, so that the laser beam coincides with the position to be processed, thereby enabling any processing position to obtain laser assistance; S2 simulation obtains the mapping relationship model between the laser power and the material softening temperature corresponding to different processing positions. The mapping relationship model is: T=G(v,x,y,P) Wherein, T represents the softening temperature of the material, v represents the processing speed, x represents the processing position of the processing site in the x-axis direction, y represents the processing position of the processing site in the y-axis direction, and P represents the laser power; The actual laser power required for all processing locations is obtained based on the mapping relationship model: S201 outputs the material softening temperature corresponding to each processing site based on the mapping relationship model; S202 compares the material softening temperature with the corresponding ideal softening temperature to determine whether the laser power at the current processing location meets the softening requirement: if so, the current laser power is retained as the actual laser power; if not, the laser power is adjusted until the laser power that meets the softening requirement is obtained, and the adjustment is stopped; S3 dynamically matches the actual laser power with the cutting trajectory of the diamond tool in real time until constant energy assisted processing is completed at all processing locations.

2. The constant energy laser-assisted curved surface processing method according to claim 1, characterized in that: In step S1, the XY distance relationship model of the diamond tool edge arc is expressed as: in, dx is the X-direction offset distance of the laser beam, dy It is the compensation value of laser focus in Y direction.

3. A system for implementing the constant energy laser-assisted surface processing method according to any one of claims 1 to 2, characterized in that: The system comprises: A laser beam adjustment module is used to adjust the inclination angle between the laser beam and the incident surface so that the laser beam is emitted from the rake face of the diamond tool; A laser beam offset distance acquisition module is used to determine the action position of the diamond tool arc in each processing position based on the surface processing cutting trajectory and obtain the laser beam offset distance; A laser focus position compensation module is used to compensate the laser focus position based on the laser beam offset distance so that any processing position can obtain laser assistance; A laser beam energy control module is used to simulate and obtain a mapping relationship model between the laser power and the material softening temperature corresponding to different processing locations; and is also used to obtain the actual laser power required for all processing locations based on the mapping relationship model; A laser processing module, configured to sequentially perform laser-assisted processing on all processing locations in the processing area according to the actual laser power; The multi-directional displacement automatic adjustment platform is used to integrate the laser beam adjustment module, the laser beam offset distance acquisition module, the laser focus position compensation module, the laser beam energy control module and the laser processing module to form a closed-loop control system.

4. An electronic device, characterized in that: include: at least one memory for storing a computer program; At least one processor is used to execute the program stored in the memory. When the program stored in the memory is executed, the processor is used to execute the method according to any one of claims 1-2.

5. A computer-readable storage medium storing a computer program, characterized in that: When the computer program is executed on a processor, the processor is caused to execute the method according to any one of claims 1 to 2.

6. A computer program product, characterized in that When the computer program product runs on a processor, the processor is caused to execute the method according to any one of claims 1 to 2.

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