Triggering alarm device for fragmentation in silicon wafer processing and control method of triggering alarm device

Abstract

The invention relates to a trigger alarm device for fragmentation during silicon wafer processing and a control method thereof, and belongs to the technical field of silicon wafer processing equipment.The trigger alarm device comprises a wafer grinding rack, a grinding rotary table is arranged in the wafer grinding rack, and a plurality of wafer supporting grooves distributed annularly are formed in the grinding rotary table; a grinding disc grinding wheel for rotating a grinding disc in a lifting mode is arranged above the grinding rotary disc, and a fragmentation triggering alarm assembly is arranged on the side edge of the grinding disc grinding wheel. The fragmentation triggering alarm assembly comprises a fixing support, and a plurality of laser sensors extending to the grinding rotary disc are arranged on the fixing support. The fool-proof device effectively solves the problems that at present, LAP grinding equipment is in a normal machining state all the time due to the fact that the LAP grinding equipment has cracks or fragments in the machining starting process and the machining process and does not give an alarm or stop in time, and the fool-proof problem of the equipment is effectively solved. And an alarm is given by detecting broken pieces or broken pieces, so that batch broken pieces are effectively reduced, and meanwhile, unnecessary cost loss is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of silicon wafer processing equipment, and in particular to a trigger alarm device for silicon wafer breakage during processing and a control method thereof. Background Art

[0002] Silicon single crystal grinding is an important process in the single crystal silicon wafer preparation and processing line. Its main purpose is to: remove visually visible uneven defects such as residual traces of the slicing process; eliminate residual processing stress of the slicing process; improve the surface uniformity, surface flatness and local flatness of the edge of the finished grinding product, and improve the surface accuracy of the silicon wafer; reduce the surface roughness of the silicon wafer, and lay the foundation for the final inspection indicators of the finished product to be qualified, so as to ensure the overall quality and yield of the finished product.

[0003] Therefore, this puts forward strict requirements for the grinding of 12-inch silicon wafers. There are two problems with the LAP grinding process: (1) The debris LAP device does not trigger an alarm when processing starts.

[0004] (2) The LAP device does not trigger an alarm during processing. Summary of the invention

[0005] The present invention mainly solves the deficiencies in the prior art and provides a trigger alarm device for silicon wafer chipping during processing and a control method thereof, which effectively solves the problem that the LAP grinding equipment does not alarm or stop in time when chipping or fragmentation occurs at the beginning of processing and during processing, and is always in a normal processing state, effectively solving the foolproofing problem of the equipment. By detecting chipping or fragmentation and giving an alarm, batch chipping can be effectively reduced, while reducing unnecessary cost losses.

[0006] The above technical problems of the present invention are mainly solved by the following technical solutions: A trigger alarm device for silicon wafer breakage during processing includes a grinding machine frame, a grinding turntable is provided in the grinding machine frame, a plurality of annularly distributed wafer support slots are provided on the grinding turntable, a grinding wheel for lifting and rotating the grinding wheel is provided above the grinding turntable, and a breakage trigger alarm component is provided on the side of the grinding wheel. The breakage trigger alarm component includes a fixed bracket, and a plurality of laser sensors extending to the grinding turntable are provided on the fixed bracket.

[0007] Preferably, an operation control cabinet connected to the laser sensor is provided on the side of the grinding machine frame, and the fragmentation trigger alarm component also includes a buzzer and an intermediate relay installed on the operation control cabinet. Cables are provided between the buzzer and the intermediate relay, and between the intermediate relay and the laser sensor.

[0008] Preferably, a grinding wheel seat is provided between the upper end of the grinding wheel and the grinding machine frame, and a motor for driving the grinding wheel to rotate is provided at the upper end of the grinding wheel seat.

[0009] Preferably, a telescopic cylinder is provided between the grinding wheel seat and the grinding wheel.

[0010] Preferably, a grinding liquid tube is provided on the side of the grinding wheel seat, and a tube clamp seat is provided on the grinding liquid tube and is fixedly connected to the grinding wheel seat by screws.

[0011] Preferably, a liquid return tank is provided at the center of the grinding turntable.

[0012] Preferably, a carrier disc is provided in the wafer supporting slot, and a plurality of silicon wafer slots distributed in a ring shape are provided on the carrier disc.

[0013] Preferably, the outer ring of the carrier disc is provided with a carrier self-rotating external toothed disc which is integrated with the carrier disc, a driving motor is provided in the grinding disc frame, an active gear which is spring-engaged with the driving motor is provided in the upper end of the driving motor, and a transition gear is provided between the driving gear and the carrier self-rotating external toothed disc.

[0014] A control method for a trigger alarm device for silicon wafer breakage during processing, comprising the following steps: Step 1: Place the silicon wafer into the wafer holder slot on the grinding turntable.

[0015] Step 2: The grinding turntable rotates, and at the same time the grinding wheel rotates down to contact and grind the silicon wafer surface.

[0016] Step 3: Laser sensors monitor the silicon wafer grinding process in real time.

[0017] Step 4: When cracks or fragments appear during the silicon wafer grinding process, the laser sensor will immediately trigger a buzzer alarm and disconnect the connected power supply through the intermediate relay, thereby triggering the grinding wheel to lift and stop the silicon wafer processing.

[0018] Preferably, the laser sensors are connected in series with each other, the positive pole of each laser sensor is connected to the positive pole of the power supply, and the negative pole of the first laser sensor is connected to the negative pole of the power supply; the negative pole of the middle laser sensor is connected to the switch output end of the previous laser sensor, and the switch of the last laser sensor is connected to the stop input end of the operation control cabinet; the buzzer is connected to the negative pole of the power supply and one end of the intermediate relay, one end of the intermediate relay is connected to the buzzer and the positive pole of the power supply, and the other end of the intermediate relay is connected to the stop input end of the operation control cabinet.

[0019] The present invention can achieve the following effects: The present invention provides a trigger alarm device for silicon wafer chipping during processing and a control method thereof. Compared with the prior art, the present invention effectively solves the problem that the LAP grinding device does not give an alarm or stop in time when chipping or fragmenting occurs at the beginning of processing and during processing, and is always in a normal processing state, thereby effectively solving the foolproofing problem of the device. By detecting chipping or fragments and giving an alarm, batch chipping can be effectively reduced, while unnecessary cost losses can be reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a front view structural schematic diagram of the present invention.

[0021] Figure 2 It is a schematic diagram of the top structure of the present invention.

[0022] Figure 3 It is a structural schematic diagram of the fragmentation trigger alarm assembly of the present invention.

[0023] Figure 4 It is a schematic diagram of the transmission structure of the carrier plate of the present invention.

[0024] In the figure: grinding machine frame 1, motor 2, grinding wheel seat 3, grinding wheel 4, operation control cabinet 5, fragmentation trigger alarm component 6, telescopic cylinder 7, grinding liquid pipe 8, pipe clamp seat 9, grinding turntable 10, return liquid tank 11, wafer support slot 12, buzzer 13, cable 14, intermediate relay 15, fixed bracket 16, laser sensor 17, carrier plate 18, carrier self-rotating outer gear plate 19, silicon wafer slot 20, transition gear 21, driving gear 22, drive motor 23. DETAILED DESCRIPTION

[0025] The technical solution of the invention is further specifically described below through embodiments and in conjunction with the accompanying drawings.

[0026] Example: Figure 1-4As shown, a trigger alarm device for silicon wafer breakage during processing includes a grinding machine frame 1, a grinding turntable 10 is provided in the grinding machine frame 1, and 5 wafer support slots 12 are arranged in an annular manner on the grinding turntable 10, and a carrier disc 18 is provided in the wafer support slot 12, and 4 silicon wafer slots 20 are arranged in an annular manner on the carrier disc 18. The outer ring of the carrier disc 18 is provided with a carrier self-rotating outer toothed disc 19 that is integrated with the carrier disc 18, and a driving motor 23 is provided in the grinding machine frame 1, and a driving gear 22 that is plug-in-connected with the driving motor 23 in a spring-type manner is provided in the upper end of the driving motor 23, and a transition gear 21 is provided between the driving gear 22 and the carrier self-rotating outer toothed disc 19. A liquid return tank 11 is provided in the center of the grinding turntable 10. A grinding wheel 4 for lifting and rotating the grinding disc is arranged above the grinding turntable 10, a grinding wheel seat 3 is arranged between the upper end of the grinding wheel 4 and the grinding machine frame 1, a grinding liquid pipe 8 is arranged on the side of the grinding wheel seat 3, and a pipe clamp seat 9 connected and fixed with the grinding wheel seat 3 by screws is arranged on the grinding liquid pipe 8. A motor 2 for driving the grinding wheel 4 to rotate is arranged on the upper end of the grinding wheel seat 3. A telescopic cylinder 7 is arranged between the grinding wheel seat 3 and the grinding wheel 4. A fragmentation trigger alarm component 6 is arranged on the side of the grinding wheel 4, and the fragmentation trigger alarm component 6 includes a fixed bracket 16, and a plurality of laser sensors 17 extending to the grinding turntable 10 are arranged on the fixed bracket 16. An operation control cabinet 5 connected with the laser sensor 17 is arranged on the side of the grinding machine frame 1, and the fragmentation trigger alarm component 6 also includes a buzzer 13 and an intermediate relay 15 installed on the operation control cabinet 5, and cables 14 are arranged between the buzzer 13 and the intermediate relay 15, and between the intermediate relay 15 and the laser sensor 17.

[0027] A control method for a trigger alarm device for silicon wafer breakage during processing, comprising the following steps: Step 1: Place the silicon wafer into the wafer support slot 12 on the grinding turntable 10 .

[0028] Step 2: The grinding turntable 10 rotates, and at the same time, the grinding wheel 4 rotates down to contact and grind the silicon wafer surface.

[0029] Step 3: The laser sensor 17 monitors the silicon wafer grinding process in real time.

[0030] The laser sensors 17 are connected in series with each other, the positive pole of each laser sensor 17 is connected to the positive pole of the power supply, and the negative pole of the first laser sensor 17 is connected to the negative pole of the power supply; the negative pole of the middle laser sensor 17 is connected to the switch output end of the previous laser sensor 17, and the switch of the last laser sensor 17 is connected to the stop input end of the operation control cabinet 5; the buzzer 13 is connected to the negative pole of the power supply and one end of the intermediate relay 15, one end of the intermediate relay 15 is connected to the buzzer 13 and the positive pole of the power supply, and the other end of the intermediate relay 15 is connected to the stop input end of the operation control cabinet 5.

[0031] Step 4: When cracks or fragments appear during the silicon wafer grinding process, the laser sensor 17 will immediately trigger the buzzer 13 to alarm, and disconnect the connected power supply through the intermediate relay 15, thereby triggering the grinding wheel 4 to lift and stop the silicon wafer processing.

[0032] In summary, the trigger alarm device for silicon wafer chipping during processing and its control method effectively solve the problem that the LAP grinding equipment does not alarm or stop in time when chipping or fragmentation occurs at the beginning and during processing, and remains in a normal processing state, effectively solving the foolproofing problem of the equipment. By detecting chipping or fragmentation and giving an alarm, batch chipping can be effectively reduced, while reducing unnecessary cost losses.

[0033] The above description is only a specific embodiment of the present invention, but the structural features of the present invention are not limited thereto. Any changes or modifications made by any technician in the field of the present invention are included in the patent scope of the present invention.

Claims

1. A trigger alarm device for silicon wafer breakage during processing, characterized in that: The invention comprises a grinding machine frame (1), wherein a grinding turntable (10) is provided in the grinding machine frame (1), a plurality of ring-shaped plate-carrying grooves (12) are provided on the grinding turntable (10), a grinding wheel (4) for performing lifting and rotating grinding is provided above the grinding turntable (10), a fragmentation trigger alarm component (6) is provided on the side of the grinding wheel (4); the fragmentation trigger alarm component (6) comprises a fixed bracket (16), and a plurality of laser sensors (17) extending to the grinding turntable (10) are provided on the fixed bracket (16).

2. The trigger alarm device for silicon wafer breakage during processing according to claim 1, characterized in that: An operation control cabinet (5) connected to the laser sensor (17) is provided on the side of the grinding machine frame (1), and the fragmentation trigger alarm component (6) further includes a buzzer (13) and an intermediate relay (15) installed on the operation control cabinet (5). Cables (14) are provided between the buzzer (13) and the intermediate relay (15), and between the intermediate relay (15) and the laser sensor (17).

3. The trigger alarm device for silicon wafer breakage during processing according to claim 1, characterized in that: A grinding wheel seat (3) is provided between the upper end of the grinding wheel (4) and the grinding machine frame (1), and a motor (2) for driving the grinding wheel (4) to rotate is provided at the upper end of the grinding wheel seat (3).

4. The trigger alarm device for silicon wafer breakage during processing according to claim 3, characterized in that: A telescopic cylinder (7) is provided between the grinding wheel seat (3) and the grinding wheel (4).

5. The trigger alarm device for silicon wafer breakage during processing according to claim 1, characterized in that: A grinding liquid pipe (8) is provided on the side of the grinding wheel seat (3), and a pipe clamp seat (9) is provided on the grinding liquid pipe (8) and is fixedly connected to the grinding wheel seat (3) by screws.

6. The trigger alarm device for silicon wafer breakage during processing according to claim 5, characterized in that: A liquid return groove (11) is provided at the center of the grinding turntable (10).

7. The trigger alarm device for silicon wafer breakage during processing according to claim 1, characterized in that: A carrier plate (18) is provided in the wafer support slot (12), and a plurality of silicon wafer slots (20) distributed in a ring shape are provided on the carrier plate (18).

8. The trigger alarm device for silicon wafer breakage during processing according to claim 1, characterized in that: The outer ring of the carrier disc (18) is provided with a carrier self-rotating outer toothed disc (19) which is integrated with the carrier disc (18); a driving motor (23) is provided inside the grinding machine frame (1); a driving gear (22) which is plug-in-connected to the driving motor (23) in a spring-type manner is provided inside the upper end of the driving motor (23); and a transition gear (21) is provided between the driving gear (22) and the carrier self-rotating outer toothed disc (19).

9. The control method of the trigger alarm device for silicon wafer breakage during processing according to claim 2, characterized in that The steps are as follows: Step 1: placing the silicon wafer into a wafer support slot (12) on a grinding turntable (10); Step 2: The grinding turntable (10) rotates, and at the same time, the grinding wheel (4) rotates down to contact and grind the silicon wafer surface; Step 3: The laser sensor (17) monitors the silicon wafer grinding process in real time; Step 4: When cracks or fragments appear during the silicon wafer grinding process, the laser sensor (17) will immediately trigger the buzzer (13) to alarm, and disconnect the connected power supply through the intermediate relay (15), thereby triggering the grinding wheel (4) to lift and stop the silicon wafer processing.

10. The control method for triggering an alarm device for silicon wafer breakage during processing according to claim 9, characterized in that: The laser sensors (17) are connected in series with each other, the positive electrode of each laser sensor (17) is connected to the positive electrode of the power supply, and the negative electrode of the first laser sensor (17) is connected to the negative electrode of the power supply; the negative electrode of the middle laser sensor (17) is connected to the switch output end of the previous laser sensor (17), and the switch of the last laser sensor (17) is connected to the stop input end of the operation control cabinet (5); the buzzer (13) is connected to the negative electrode of the power supply and one end of the intermediate relay (15), one end of the intermediate relay (15) is connected to the buzzer (13) and the positive electrode of the power supply, and the other end of the intermediate relay (15) is connected to the stop input end of the operation control cabinet (5).

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