Polishing device and method for chip processing

Abstract

The invention relates to the technical field of chip polishing devices, and discloses a polishing device for chip machining, the polishing device comprises a bottom supporting table and a control system installed in the bottom supporting table, a center gear is fixedly installed in the middle of the top end of the bottom supporting table, and a base assembly is fixedly installed at the top end of the bottom supporting table. A turnover polishing assembly is arranged, miniature air cylinders and a pressure sensor array are embedded in a tray and a polishing pad correspondingly, each miniature air cylinder is communicated with an external air source through an independent electromagnetic valve, and the pressure sensor array can be used for monitoring the pressure of all parts on the surface of the polishing pad in real time and collecting pressure data; according to the chip polishing device, the pressure data distribution diagram is generated, then the micro air cylinders at the corresponding positions can control and adjust local pressure through opening and closing of the independent electromagnetic valves according to the pressure data distribution diagram, and then the chip polishing uniformity is improved, so that the production efficiency and the yield of subsequent products are improved.

Description

Technical Field

[0001] The present invention relates to the technical field of chip polishing devices, and in particular to a chip processing polishing device and method. Background Art

[0002] In the production process of chips, the single crystal silicon substrate of the chip needs to be precisely polished. At present, chemical mechanical polishing technology is often used. This technology can effectively take into account the global and local flatness of the processed surface. The specific method is: during polishing, the chip to be polished is applied to the polishing pad that rotates with the polishing disk with a certain pressure. The polishing liquid flows between the chip and the polishing pad and produces a chemical reaction on the surface of the chip. The chemical reactants formed on the surface of the chip are removed by the mechanical friction of the abrasive in the polishing liquid. In the alternating process of chemical film formation and mechanical film removal, a very thin layer of material is removed from the chip surface through the combined action of chemistry and mechanics, and finally ultra-precision surface processing is achieved. However, there are still some problems in the use of existing polishing devices, as follows:

[0003] Existing traditional chip polishing devices usually use fixed pressure or simple pressure control for polishing, which is difficult to adapt to the complex changes in the chip surface morphology, and easily leads to over-polishing or under-polishing, affecting the yield and performance of the chip. In addition, the polishing pad will be severely worn after long-term use. The polishing pad in this situation cannot be well identified by the human eye, and it is impossible to detect and replace the severely worn polishing pad in time, resulting in unsatisfactory polishing effect of some chips, which in turn affects the quality of the product. For this reason, we propose a polishing device and method for chip processing. Summary of the invention

[0004] The present invention provides a polishing device and method for chip processing, which has the advantages of good uniform polishing effect, high polishing precision, high product production efficiency and high yield rate, and solves the problems raised in the above background technology.

[0005] The present invention provides the following technical scheme: a polishing device for chip processing, comprising a bottom support and a control system installed therein, a central gear is fixedly installed on the middle part of the top end of the bottom support, a base assembly is fixedly installed on the top end of the bottom support, a polishing assembly is embedded and installed on the base assembly, the polishing assembly is connected with an external air source, a driving structure is arranged inside the bottom support to drive the base assembly to rotate, a pushing assembly is fixedly installed on the outside of the bottom support, an adjusting assembly is fixedly installed on the other side of the bottom support, a liquid storage tank is fixedly installed on the top end of the bottom support, a round table base is fixedly installed on the side of the bottom support, an inner motor is installed in the round table base and a top plate is fixedly installed on the output shaft of the motor, a micro motor is installed inside the top plate and an electric telescopic rod is fixedly installed on the output shaft of the motor, a chuck is fixedly installed on the telescopic end of the electric telescopic rod, and a wafer carrier is fixedly installed on the bottom end of the electric telescopic rod;

[0006] The base assembly comprises a ring seat, on which grooves are evenly arranged in an annular shape, a core ring is fixedly installed on the inner side of the ring seat through a connecting rod, and a circular hole is arranged in an annular shape on the top of the core ring;

[0007] The polishing assembly comprises an outer base block, a bearing rod is movably mounted on the outer base block, a pinion is mounted and connected to one end of the bearing rod, a tray is movably sleeved on the bearing rod, a polishing pad is mounted on the top of the tray, a micro cylinder is embedded and fixedly mounted on the top of the tray, a pressure sensor array is embedded and mounted in the polishing pad, a spring is fixedly mounted in the bearing rod, and a pin is fixedly mounted on one end of the bearing rod;

[0008] The pushing assembly comprises a supporting bracket, and a pushing triggering end is fixedly mounted on the top of the supporting bracket;

[0009] The adjustment assembly includes an outer frame, the top of the outer frame is fixedly connected to a fan ring plate, the lower surface of the fan ring plate is respectively fixedly mounted with a first scraper and a second scraper, a liquid guide frame is fixedly mounted on one side of the second scraper, a liquid guide tube is fixedly mounted above one end of the liquid guide frame, a liquid storage chamber is fixedly mounted on one end of the liquid guide tube, a support plate is rotatably mounted on the bottom end of the liquid guide frame and a transmission gear is fixedly mounted on one end of the support plate, one end of the second scraper is located on a core ring and a straight plate is fixedly mounted, and a wear detection module is fixedly mounted on the bottom end of the first scraper.

[0010] In a preferred embodiment, the polishing components are multiple and are evenly installed in a ring shape on the base component, and the polishing components are detachably connected to the base component, and the side height of the pushing component is the same as the side height of the polishing component.

[0011] In a preferred embodiment, the polishing component is embedded in the groove and can be detachably installed. One end of the polishing component passes through the circular hole and is rotatably installed. The center gear is located inside the core ring and is fixedly installed. The circular hole is rotatably arranged. The bottom end of the ring seat is connected to the driving structure arranged inside the bottom support for driving.

[0012] In a preferred embodiment, inner holes are respectively opened in the inner middle part and the upper and lower ends of the outer base block, the bearing rod is movably inserted into the inner hole in the middle part, the pin rod is inserted into the inner holes in the upper and lower ends, and the middle part of the bearing rod is arranged in a bent shape.

[0013] In a preferred embodiment, the pinion gear is arranged inside the circular hole and is detachably connected to the supporting rod. The pinion gear meshes with the central gear by movement. The two adjacent trays are arranged at intervals, and the liquid storage tank is fixed below the interval between the two trays.

[0014] In a preferred embodiment, the polishing pad adopts a double-layer polyurethane structure, the upper layer is a microporous layer, and the lower layer is an airbag layer, which is directly connected to the micro cylinder. The microporous layer of the polishing pad has a pore size of 50 μm and a porosity of 30%. The micro cylinder is evenly embedded in the inner top of the tray. The diameter of a single micro cylinder is less than or equal to 2 mm, and a single micro cylinder is connected to an external air source through an independent solenoid valve.

[0015] In a preferred embodiment, the pressure sensor array is embedded in a honeycomb arrangement with an embedding density greater than or equal to 10 / cm, one end of the spring is fixedly installed in the tray, and the other end is arranged to abut against the bent portion of the bearing rod.

[0016] In a preferred embodiment, a hydraulic rod is arranged in the push trigger end head, and an arc plate is arranged at the end of the hydraulic rod. The hydraulic rod is electrically connected to the control system and is regulated by the structural signal on the regulating component.

[0017] In a preferred embodiment, the bottom end of the outer frame is fixedly connected to the outer side of the bottom support platform, a ring groove is opened in the middle of the chuck and the ring groove is movably connected to the fan ring plate, the first scraper and the second scraper can be arranged in a fit with the polishing assembly, the first scraper and the second scraper are respectively arranged to scrape away the polishing liquid of the waste gas and to scrape the new polishing liquid evenly, the transverse part of the liquid guide tube is inclined and connected to the inside of the liquid storage chamber, and a rack is arranged on the straight plate and meshes with the transmission gear.

[0018] A polishing device for chip processing, the specific use method steps are as follows:

[0019] S1. Fix the wafer to be polished under the wafer carrier, and use the driving structure inside the round table base to drive the top plate and the structure on it to rotate to above the polishing assembly;

[0020] S2, flowing the polishing liquid into the liquid guide frame through the liquid storage cavity, then starting the electric telescopic rod to contract so that the polishing liquid flows to the surface of the polishing pad, and then starting the electric telescopic rod to extend so that the wafer and the first scraper and the second scraper are attached to the surface of the polishing pad, and when the edge of the wafer rotates to the gap between two adjacent polishing components, the electric telescopic rod starts to contract so that the wafer is separated from the surface of the polishing pad;

[0021] S3. When the wafer is in contact with the surface of the polishing pad, the micromotor in the top plate drives the electric telescopic rod and the wafer to rotate and polish. The polishing liquid after polishing is scraped off when it rotates to the first scraper. After scraping, the wear degree is detected by the wear detection module. Then, the polishing liquid is released to the surface of the polishing pad by the liquid guide frame and evenly spread by the second scraper for use.

[0022] S4. When the wear detection module detects that the polishing pad has reached the degree of wear and replacement, the signal is transmitted to the control system to control the electric telescopic rod in the trigger end to push out the arc plate, so that it is pressed and contacted with the load-bearing rod, and the small gear is engaged with the center gear, thereby realizing the overall rotation of the polishing assembly around the axis during the rotation of the base assembly around the axis, and the polishing pad that has been worn and needs to be replaced is rotated to the bottom, reminding the staff to replace it. After replacement, it can continue to be used normally.

[0023] The present invention has the following beneficial effects:

[0024] 1. The polishing device and method for chip processing are provided with a reversible polishing component, and micro cylinders and pressure sensor arrays are respectively embedded in the tray and the polishing pad. Each micro cylinder is connected to an external air source by an independent solenoid valve. The pressure sensor array can be used to monitor the pressure of various parts of the surface of the polishing pad in real time and collect pressure data to generate a pressure data distribution map. Then, according to the pressure data distribution map, the micro cylinder at the corresponding position can control and adjust the local pressure by opening and closing the independent solenoid valve, thereby improving the uniformity of chip polishing, so as to improve the production efficiency and yield rate of subsequent products.

[0025] 2. The polishing device and method for chip processing are provided with a bearing rod and a small gear, and combined with the design of the center gear, when the wear degree of the polishing pad surface reaches the wear threshold, the wear degree of the polishing pad can be detected in real time through the wear detection module, so as to achieve that after the wear degree is reached, the telescopic driving rod in the trigger end is driven to push the internal ring rod to push out the bearing rod, so that the small gear and the center gear are engaged. In this way, during the overall rotation of the base assembly, the polishing assembly as a whole will rotate around the axis where the two ends of the bearing rod are located until the pin rod on one side is reinserted and locked, completing the flip prompt of the worn polishing pad. In this way, the staff can intuitively find the worn polishing pad and replace it in time to ensure the consistent quality of the chip in the continuous production process, thereby improving the product qualification rate of the polishing device. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention;

[0027] Figure 2 It is a schematic diagram of a first partial three-dimensional structure of the present invention;

[0028] Figure 3 It is a schematic diagram of a second partial three-dimensional structure of the present invention;

[0029] Figure 4 It is a schematic diagram of the three-dimensional structure of the base assembly of the present invention;

[0030] Figure 5 For the present invention Figure 2 The enlarged structural diagram at A in the middle;

[0031] Figure 6 It is a schematic diagram of the three-dimensional structure of the polishing assembly of the present invention;

[0032] Figure 7 It is a schematic cross-sectional view of the polishing assembly of the present invention;

[0033] Figure 8 This is a schematic diagram of the three-dimensional structure of the adjustment component of the present invention;

[0034] Fig. 9 For the present invention Figure 8 The enlarged structural diagram at B in the middle;

[0035] Fig.10 This is a schematic diagram of the three-dimensional structure of the outer base block of the present invention;

[0036] Fig.11 It is a schematic diagram of the partial three-dimensional structure of the polishing assembly of the present invention.

[0037] In the figure: 1. bottom support platform; 2. center gear; 3. base assembly; 31. ring seat; 32. groove; 33. core ring; 34. round hole; 4. polishing assembly; 41. outer base block; 42. bearing rod; 43. pinion; 44. tray; 45. polishing pad; 46. micro cylinder; 47. pressure sensor array; 48. spring; 49. pin rod; 5. pushing assembly; 51. supporting bracket; 52. pushing trigger end; 6. adjustment assembly; 61. outer frame; 62. fan ring plate; 63. first scraper; 64. second scraper; 65. liquid guide frame; 66. liquid guide tube; 67. liquid storage chamber; 68. transmission gear; 69. straight plate; 610. wear detection module; 7. liquid storage tank; 8. round table base; 9. top plate; 10. electric telescopic rod; 11. chuck; 12. wafer carrier. DETAILED DESCRIPTION

[0038] The technical solutions in the present invention will be described clearly and completely below in conjunction with the accompanying drawings in the present invention. In addition, the forms of the various structures described in the following embodiments are merely illustrative, and the polishing device and method for chip processing involved in the present invention are not limited to the various structures described in the following embodiments. All other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0039] See also Figure 1-Figure 4 A polishing device for chip processing comprises a bottom support 1 and a control system installed therein, a central gear 2 is fixedly installed at the middle of the top of the bottom support 1, a base assembly 3 is fixedly installed at the top of the bottom support 1, a polishing assembly 4 is embedded and installed on the base assembly 3, and the polishing assembly 4 is connected with an external air source, a driving structure is arranged inside the bottom support 1 to drive the base assembly 3 to rotate, a pushing assembly 5 is fixedly installed on the outside of the bottom support 1, an adjusting assembly 6 is fixedly installed on the other side of the bottom support 1, a liquid storage tank 7 is fixedly installed on the top of the bottom support 1, a round table base 8 is fixedly installed on the side of the bottom support 1, an inner motor is installed in the round table base 8, and a top plate 9 is fixedly installed on the output shaft of the motor, a micro motor is installed inside the top plate 9, and an electric telescopic rod 10 is fixedly installed on the output shaft of the motor, a chuck 11 is fixedly installed on the telescopic end of the electric telescopic rod 10, and a wafer carrier 12 is fixedly installed on the bottom end of the electric telescopic rod 10;

[0040] Compared with the prior art, the present application is provided with a reversible polishing assembly 4, and a micro cylinder 46 and a pressure sensor array 47 are respectively embedded in the tray 44 and the polishing pad 45. Each micro cylinder 46 is connected to an external air source by an independent solenoid valve. The pressure sensor array 47 can be used to monitor the pressure of each part of the surface of the polishing pad 45 in real time and collect pressure data to generate a pressure data distribution map. Then, according to the pressure data distribution map, the micro cylinder 46 at the corresponding position can be controlled and adjusted by opening and closing the independent solenoid valve to adjust the local pressure, thereby improving the uniformity of chip polishing, so as to improve the production efficiency and yield rate of subsequent products. At the same time, by providing a bearing rod 42 and a pinion 43, and combining the design of the central gear 2, it can be achieved on the polishing pad 4. When the wear degree of the surface reaches the wear threshold, the wear degree of the polishing pad 45 is detected in real time through the wear detection module 610, and then when the wear degree is reached, the telescopic driving rod in the trigger end 52 is driven to push the internal ring rod to push out and squeeze the bearing rod 42, so that the pinion 43 is meshed with the central gear 2, so that during the overall rotation of the base assembly 3, the polishing assembly 4 will rotate as a whole around the axis where the two ends of the bearing rod 42 are located, until the pin rod 49 on one side is reinserted and locked, completing the flip prompt of the worn polishing pad 45, so that the staff can intuitively find the worn polishing pad 45 and can replace it in time, so as to ensure the quality of the chip is consistent during the continuous production process, and improve the product qualification rate of the polishing device.

[0041] See also Figure 1-Figure 4 A polishing device for chip processing includes a polishing assembly 4, wherein the polishing assembly 4 is multiple and evenly mounted on a base assembly 3 in an annular shape, and the polishing assembly 4 can be detachably connected to the base assembly 3, and the side height of the pushing assembly 5 is the same as the side height of the polishing assembly 4;

[0042] In this embodiment, it should be noted that during the rotation of the polishing component 4, the telescopic effect of the pushing component 5 can be used to realize whether the polishing component 4 can rotate relative to the base component 3, thereby realizing the turning down of the upper surface of the polishing component 4 that has been worn to a threshold value, so that the staff can find and replace it in time, and ensure that the worn polishing component 4 will no longer be used for polishing wafers, thereby ensuring the stability of wafer production quality.

[0043] See also Figure 1-Figure 4 A polishing device for chip processing includes a base assembly 3, the base assembly 3 includes a ring seat 31, the ring seat 31 is provided with a groove 32 in an annular shape, a core ring 33 is fixedly installed on the inner side of the ring seat 31 through a connecting rod, and a circular hole 34 is provided on the top of the core ring 33;

[0044] In this embodiment, it should be noted that the polishing component 4 is embedded in the groove 32 and can be detachably installed. One end of the polishing component 4 passes through the circular hole 34 and is rotatably installed. The center gear 2 is located inside the core ring 33, and the center gear 2 is fixedly installed. The circular hole 34 is rotatably arranged. The bottom end of the ring seat 31 is connected to the driving structure arranged inside the bottom support 1 for driving. In this way, the driving structure can be used to drive the ring seat 31 to rotate, thereby driving other structures thereon to rotate, so that the multiple polishing components 4 arranged thereon take turns to reach the bottom of the electric telescopic rod 10 for wafer polishing operations during the rotation process. In this way, not only can the polishing liquid be replaced in time through the rotation and the use of the adjustment component 6 of the device, thereby ensuring the quality of polishing, but it can also ensure that the polishing component 4 can be replaced in time after excessive wear occurs without affecting the normal operation of the equipment.

[0045] See also Figure 3-Figure 11 A polishing device for chip processing includes a polishing assembly 4, which includes an outer base block 41, a bearing rod 42 is movably mounted on the outer base block 41, a pinion 43 is mounted and connected to one end of the bearing rod 42, a tray 44 is movably sleeved on the bearing rod 42, a polishing pad 45 is mounted on the top of the tray 44, a micro cylinder 46 is embedded and fixedly mounted on the top of the tray 44, a pressure sensor array 47 is embedded and mounted in the polishing pad 45, a spring 48 is fixedly mounted in the bearing rod 42, and a pin 49 is fixedly mounted on one end of the bearing rod 42;

[0046] In the present embodiment, it should be noted that inner holes are respectively provided in the inner middle part and the upper and lower ends of the outer base block 41, the bearing rod 42 is movably inserted into the inner hole in the middle part, the pin rod 49 is inserted into the inner holes at the upper and lower ends, the middle part of the bearing rod 42 is arranged in a bent shape, the pinion 43 is arranged inside the circular hole 34 and is detachably connected to the bearing rod 42, the pinion 43 meshes with the central gear 2 by movement, the two adjacent trays 44 are arranged at intervals, the liquid storage tank 7 is located below the interval between the two trays 44 and is fixedly arranged, the polishing pad 45 adopts a double-layer polyurethane structure, the upper layer is a microporous layer, and the lower layer is an airbag layer, which is directly connected to the micro cylinder 46, the microporous layer of the polishing pad 45 has a pore size of 50μm and a porosity of 30%, the micro cylinder 46 is evenly embedded and distributed at the inner top of the tray 44, the diameter of a single micro cylinder 46 is less than or equal to 2mm, and a single micro cylinder 46 is connected to an external air source through an independent solenoid valve, and the pressure sensor array 47 is embedded in a honeycomb arrangement and the embedding density is greater than or equal to 10 / cm 2One end of the spring 48 is fixedly installed in the tray 44, and the other end is set to abut against the bending part of the bearing rod 42, so that the pinion 43 can be engaged with the center gear 2 by pushing the component 5 to abut against the bearing rod 42, so that the polishing component 4 as a whole can rotate around the axis with the help of the drive of the pinion 43, so that the upper surface rotates to the bottom, so that the worn polishing pad 45 rotates downward to prompt the staff to replace it in time, thereby ensuring the stability of the chip polishing effect.

[0047] At the same time, the micro cylinder 46 and the pressure sensor array 47 implement the implementation adjustment of the wafer load morphology through the fuzzy PID algorithm and the morphology reconstruction module, wherein:

[0048] The fuzzy PID algorithm dynamically adjusts the PID parameters (proportional coefficient Kp, integral coefficient Ki, differential coefficient Kd) through the fuzzy rule base to adapt to the pressure changes under complex morphology. The implementation steps are as follows:

[0049] S1. Input variable definition:

[0050] Error (e): The difference between the target pressure and the actual pressure.

[0051] Error change rate (Δe): the difference between the current error and the error at the previous moment;

[0052] S2, fuzzification:

[0053] Map the input variables (e and Δe) to fuzzy sets (such as "negative large", "negative small", "zero", "positive small", "positive large") through membership functions;

[0054] S3, fuzzy rule base:

[0055] Fuzzy set definition:

[0056] Input variables:

[0057] Error (e): {NB (negative large), NS (negative small), ZO (zero), PS (positive small), PB (positive large)};

[0058] Error change rate (Δe): Same as above.

[0059] Output variables:

[0060] ΔKp, ΔKi, ΔKd: {NB (negative large), NS (negative small), ZO (zero), PS (positive small), PB (positive large)};

[0061] Design fuzzy rules, such as:

[0062] If e is "negative and large" and Δe is "negative and large", then the output ΔKp is "positive and large", ΔKi is "negative and large", and ΔKd is "positive and small". The rule is interpreted as the error is extremely large and continues to increase in the negative direction. It is necessary to greatly increase the proportional action, weaken the integral, and increase the differential to suppress overshoot;

[0063] If e is "negative and large" and Δe is "negative and small", then the output ΔKp is "positive and large", ΔKi is "negative and large", and ΔKd is "zero". The rule is interpreted as the error is extremely large but the negative growth rate is slowed down, maintaining a strong proportional effect, weakening the integral, and keeping the differential neutral;

[0064] If e is "negative and large" and Δe is "zero", then the output ΔKp is "positive and large", ΔKi is "negative and small", and ΔKd is "negative and small", and the rule is interpreted as the error is extremely large and tends to be stable, maintaining a strong proportional effect, moderately weakening the integral, and slightly weakening the differential;

[0065] If e is "negative and large" and Δe is "positive and small", then the output ΔKp is "positive and small", ΔKi is "negative and small", and ΔKd is "negative and large", and the rule is interpreted as the error is extremely large but begins to change positively, moderately strengthening the proportion, weakening the integral, and greatly weakening the differential;

[0066] If e is "negative and large" and Δe is "positive and large", the output ΔKp is "zero", ΔKi is "zero", and ΔKd is "negative and large", and the rule is interpreted as the error is extremely large but the positive speed is too fast, the proportional remains neutral, the integral remains neutral, and the differential is greatly weakened;

[0067] The above listed cases are cases where the error (e) is NB (negative large). A total of 25 fuzzy rule base data can be designed, and they can be designed one by one according to the above. The rule design logic of the data is:

[0068] 1. Dynamic balance principle:

[0069] When the error is large (NB / PB), the proportional action is enhanced first (ΔKp=PB / NB) for quick response.

[0070] When the error approaches zero (ZO), the integral action is enhanced (ΔKi=PB) to eliminate the steady-state error.

[0071] When the error change rate is large (Δe=PB / NB), the differential action is enhanced (ΔKd=PB / NB) to suppress overshoot or oscillation.

[0072] 2. Conflict scenario handling:

[0073] If the error and the error change rate are in opposite directions (such as e=NB and Δe=PB), the proportional effect (ΔKp=ZO / NS) is weakened and the integral is enhanced to compensate for the steady-state error. In practical application, in chip polishing, when encountering the groove area (e=NB), the fuzzy PID quickly enhances the local pressure through rules 1-5 to avoid insufficient polishing.

[0074] S4. Membership function design

[0075] The membership function of the error (e) and the error change rate (Δe) adopts the triangular membership function, and the mathematical expression is:

[0076] μ(x)=0,if x≤a;

[0077]

[0078] μ(x)=0,if x>c;

[0079] in,

[0080] x: input variable (such as error or rate of change of error)

[0081] a, b, c are the parameters of the triangular function, satisfying a <b<c。

[0082] The membership function of the output variables (ΔKp, ΔKi, ΔKd) adopts the Gaussian membership function, and the mathematical expression is:

[0083]

[0084] Where, x: input variable (such as PID parameter adjustment value);

[0085] cc: mean (center value) of the Gaussian function;

[0086] σ: standard deviation of the Gaussian function (width parameter).

[0087] S5. Reasoning and defuzzification:

[0088] The fuzzy values ​​of the output variables are calculated based on the fuzzy rule base using the Mamdani reasoning method.

[0089] Through the centroid method of defuzzification, accurate PID parameter adjustment values ​​(ΔKp, ΔKi, ΔKd) are obtained;

[0090] S6. Parameter adjustment:

[0091] The PID controller parameters are dynamically adjusted according to ΔKp, ΔKi, and ΔKd, and the control signal is output to the micro cylinder.

[0092] The technical principle of the topography reconstruction module is to generate a three-dimensional topography map of the chip surface based on the real-time data of the pressure sensor array and predict the pressure distribution at the next moment. Its core idea is to convert discrete pressure data into continuous topography information through interpolation algorithms and machine learning models. The implementation steps are as follows:

[0093] S1. Data collection:

[0094] The pressure data of each point on the chip surface is collected in real time through a high-density pressure sensor array;

[0095] S2. Data preprocessing:

[0096] Filter the pressure data to remove noise and outliers;

[0097] Mapping the pressure data to spatial coordinates on the chip surface;

[0098] S3, morphology reconstruction:

[0099] Using bilinear interpolation algorithm or radial basis function interpolation algorithm, the discrete pressure data is converted into a continuous surface topography image;

[0100] Generate 3D topography and mark high and low relief areas (such as grooves and ridges);

[0101] S4. Pressure prediction:

[0102] Based on the historical pressure data and the current topography, a time series prediction model (such as ARIMA or LSTM neural network) is used to predict the pressure distribution at the next moment;

[0103] S5, control signal generation:

[0104] The prediction results are input into the fuzzy PID algorithm to adjust the pressure of the micro cylinder in advance to realize the pre-regulation function.

[0105] See also Figure 1-Figure 2 , a polishing device for chip processing, comprising a pushing assembly 5, the pushing assembly 5 comprising a supporting frame 51, a top end of the supporting frame 51 is fixedly mounted with a pushing trigger end 52;

[0106] In the present embodiment, it should be noted that a hydraulic rod is provided in the push trigger end 52, and an arc plate is provided at the end of the hydraulic rod. The hydraulic rod is electrically connected to the control system and is regulated by the structural signal on the adjustment component 6. In this way, after the surface of the polishing pad 45 is worn, the arc plate in the push trigger end 52 can be promptly pushed out and squeezed into the bearing rod 42 according to the detection of the adjustment component 6, so that the pinion 43 is meshed with the center gear 2, thereby driving the polishing component 4 to rotate as a whole, and under the limiting action of the pin rod 49, it can be automatically locked after rotating one hundred and eighty degrees, prompting the staff to replace it in time.

[0107] See also Figure 1-Figure 9 A polishing device for chip processing, comprising an adjusting component 6, the adjusting component 6 comprising an outer frame 61, a fan ring plate 62 is fixedly connected to the top of the outer frame 61, a first scraper 63 and a second scraper 64 are fixedly installed on the lower surface of the fan ring plate 62, a liquid guide frame 65 is fixedly installed on one side of the second scraper 64, a liquid guide tube 66 is fixedly installed above one end of the liquid guide frame 65, a liquid storage chamber 67 is fixedly installed on one end of the liquid guide tube 66, a support plate is rotatably installed on the bottom end of the liquid guide frame 65 and a transmission gear 68 is fixedly installed on one end of the support plate, one end of the second scraper 64 is located on the core ring 33 and a straight plate 69 is fixedly installed, and a wear detection module 610 is fixedly installed on the bottom end of the first scraper 63;

[0108] In the present embodiment, it should be noted that the bottom end of the outer frame 61 is fixedly connected to the outer side of the bottom support 1, an annular groove is provided in the middle of the chuck 11 and the annular groove is movably connected to the fan ring plate 62, the first scraper 63 and the second scraper 64 can be arranged in a manner to fit the polishing assembly 4, the first scraper 63 and the second scraper 64 are respectively arranged to scrape off the polishing liquid for waste gas and to scrape the new polishing liquid evenly, the transverse part of the liquid guide tube 66 is inclined and connected to the inside of the liquid storage chamber 67, a rack is provided on the straight plate 69 and meshes with the transmission gear 68, so that the lifting and lowering of the electric telescopic rod 10 can be used to drive the lifting and lowering of the adjustment assembly 6 as a whole, and the first scraper 63 and the second scraper 64 can be separated from the surface of the polishing pad 45 when lifting, and after moving down, The two are in contact with the surface of the polishing pad 45, which can not only realize the downward pressure control of the wafer at the bottom of the wafer carrier 12, but also enable the second scraper 64 to open the polishing liquid stored and flowing evenly in the liquid guide frame 65 during the upward movement with the help of the meshing rotation of the transmission gear 68 and the straight plate 69 to flow downward and evenly scrape it, thereby ensuring the uniformity of the polishing liquid on the entire surface of the polishing pad 45. The lifting operation can also make the wafer directly pressed down when it contacts the surface of the polishing pad 45 coated with uniform polishing liquid, instead of making the polishing liquid contact the wafer surface from the side of the wafer, which greatly improves the polishing effect of the wafer, and also greatly reduces the secondary damage to the wafer surface caused by impurities in the waste gas polishing liquid by scraping away the waste gas polishing liquid, thereby ensuring the polishing effect of the wafer.

[0109] The wear detection module is mainly composed of an optical sensor, a thickness sensor, an image processing algorithm and a set wear threshold.

[0110] Optical sensor: A high-resolution optical sensor (resolution ≥ 5 μm) is installed above each unit;

[0111] By scanning the polishing pad surface, image data of the worn area is obtained;

[0112] Thickness sensor: A thickness sensor (accuracy ±0.01mm) is embedded in each unit to measure the remaining thickness of the polishing pad in real time;

[0113] Image processing algorithm: Use edge detection algorithms (such as Canny algorithm) to identify the boundaries of the worn area, calculate the area and depth of the worn area, and determine the degree of wear;

[0114] Wear threshold: When the wear area exceeds 10% of the total area or the remaining thickness is less than 2mm, the flipping or replacement operation is triggered;

[0115] At the same time, the wear detection module can also introduce multi-spectral imaging technology to detect the wear status of the polishing pad surface and interior through light of different wavelengths, add a temperature sensor to monitor the temperature changes during the polishing process, and assist in judging the degree of wear.

[0116] A polishing device for chip processing, and its use method is as follows:

[0117] S1, fix the wafer to be polished under the wafer carrier 12, and use the driving structure inside the truncated table base 8 to drive the top plate 9 and the structure thereon to rotate to above the polishing assembly 4;

[0118] S2, the polishing liquid flows into the liquid guide frame 65 through the liquid storage chamber 67, and then the electric telescopic rod 10 is started to contract so that the polishing liquid flows to the surface of the polishing pad 45, and then the electric telescopic rod 10 is started to extend so that the wafer and the first scraper 63 and the second scraper 64 are attached to the surface of the polishing pad 45, and when the edge of the wafer rotates to the gap between two adjacent polishing assemblies 4, the electric telescopic rod 10 is started to contract so that the wafer is separated from the surface of the polishing pad 45;

[0119] S3, when the wafer is in contact with the surface of the polishing pad 45, the micromotor in the top plate 9 drives the electric telescopic rod 10 and the wafer to rotate and polish, and the polishing liquid after polishing is scraped off when it rotates to the first scraper 63, and after scraping, the wear degree is detected by the wear detection module 610, and then the polishing liquid is released again by the liquid guide frame 65 to the surface of the polishing pad 45 and is evenly spread by the second scraper 64 for use;

[0120] S4. When the wear detection module 610 detects that the polishing pad 45 has reached the degree of wear and replacement, the signal is transmitted to the control system to control the electric telescopic rod in the trigger end 52 to push out the arc plate, so that it is pressed and contacted with the support rod 42, so that the pinion 43 is engaged with the center gear 2, and then the polishing assembly 4 as a whole rotates around the axis during the rotation of the base assembly 3 around the axis, and the polishing pad 45 that has been worn and needs to be replaced is rotated to the bottom, reminding the staff to replace it. After replacement, it can continue to be used normally.

[0121] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A polishing device for chip processing, comprising a bottom support (1) and a control system installed therein, characterized in that: A central gear (2) is fixedly mounted at the middle of the top of the bottom support (1); a base assembly (3) is fixedly mounted at the top of the bottom support (1); a polishing assembly (4) is embedded and mounted on the base assembly (3); the polishing assembly (4) is connected to an external air source; a driving structure is arranged inside the bottom support (1) to drive the base assembly (3) to rotate; a pushing assembly (5) is fixedly mounted on the outside of the bottom support (1); and an adjusting assembly (6) is fixedly mounted on the other side of the bottom support (1). A liquid storage tank (7) is fixedly mounted on the top of the bottom support platform (1), a truncated cone base (8) is fixedly mounted on the side of the bottom support platform (1), an internal motor is mounted inside the truncated cone base (8), and a top plate (9) is fixedly mounted on the output shaft of the motor, a micro motor is mounted inside the top plate (9), and an electric telescopic rod (10) is fixedly mounted on the output shaft of the motor, a chuck (11) is fixedly mounted on the telescopic end of the electric telescopic rod (10), and a wafer carrier (12) is fixedly mounted on the bottom end of the electric telescopic rod (10); The base assembly (3) comprises a ring seat (31), on which a groove (32) is evenly and annularly formed, a core ring (33) is fixedly mounted on the inner side of the ring seat (31) via a connecting rod, and a circular hole (34) is formed in an annular shape at the top end of the core ring (33); The polishing assembly (4) comprises an outer base block (41), a bearing rod (42) is movably mounted on the outer base block (41), one end of the bearing rod (42) is connected to a pinion gear (43), a tray (44) is movably sleeved on the bearing rod (42), a polishing pad (45) is mounted on the top of the tray (44), a micro cylinder (46) is embedded and fixedly mounted on the top of the tray (44), a pressure sensor array (47) is embedded and mounted in the polishing pad (45), a spring (48) is fixedly mounted in the bearing rod (42), and a pin rod (49) is fixedly mounted on one end of the bearing rod (42); The pushing assembly (5) comprises a supporting frame (51), and a pushing triggering end (52) is fixedly mounted on the top of the supporting frame (51); The adjustment component (6) comprises an outer frame (61), the top end of the outer frame (61) is fixedly connected to a fan ring plate (62), the lower surface of the fan ring plate (62) is respectively fixedly mounted with a first scraper (63) and a second scraper (64), one side of the second scraper (64) is fixedly mounted with a liquid guide frame (65), a liquid guide tube (66) is fixedly mounted above one end of the liquid guide frame (65), one end of the liquid guide tube (66) is fixedly mounted with a liquid storage chamber (67), the bottom end of the liquid guide frame (65) is rotatably mounted with a support plate and one end of the support plate is fixedly mounted with a transmission gear (68), one end of the second scraper (64) is located on the core ring (33) and is fixedly mounted with a straight plate (69), and the bottom end of the first scraper (63) is fixedly mounted with a wear detection module (610).

2. A chip processing polishing device according to claim 1, characterized in that: The polishing components (4) are multiple in number and are evenly mounted in a ring shape on the base component (3), and the polishing components (4) can be detachably connected to the base component (3), and the side height of the pushing component (5) is the same as the side height of the polishing component (4).

3. A chip processing polishing device according to claim 1, characterized in that: The polishing assembly (4) is embedded in the groove (32) and can be detachably installed. One end of the polishing assembly (4) passes through the circular hole (34) and is rotatably installed. The central gear (2) is located inside the core ring (33), and the central gear (2) is fixedly installed. The circular hole (34) is rotatably installed. The bottom end of the ring seat (31) is connected to the driving structure arranged inside the bottom support platform (1) for driving.

4. A chip processing polishing device according to claim 1, characterized in that: The inner middle part and the upper and lower ends of the outer base block (41) are respectively provided with inner holes, the bearing rod (42) is movably inserted into the inner hole in the middle part, and the pin rod (49) is inserted into the inner holes in the upper and lower ends. The middle part of the bearing rod (42) is arranged in a bent shape.

5. A chip processing polishing device according to claim 4, characterized in that: The pinion gear (43) is arranged inside the circular hole (34) and is detachably connected to the bearing rod (42). The pinion gear (43) is engaged with the central gear (2) by movement. Two adjacent trays (44) are arranged at intervals. The liquid storage tank (7) is fixedly arranged below the interval between the two trays (44).

6. A chip processing polishing device according to claim 5, characterized in that: The polishing pad (45) adopts a double-layer polyurethane structure, the upper layer is a microporous layer, and the lower layer is an airbag layer, which is directly connected to the micro cylinder (46). The microporous layer of the polishing pad (45) has a pore size of 50 μm and a porosity of 30%. The micro cylinder (46) is evenly embedded and distributed on the inner top of the tray (44). The diameter of a single micro cylinder (46) is less than or equal to 2 mm, and the single micro cylinder (46) is connected to an external air source through an independent solenoid valve.

7. A chip processing polishing device according to claim 6, characterized in that: The pressure sensor array (47) is embedded in a honeycomb arrangement with an embedding density of greater than or equal to 10 / cm 2 One end of the spring (48) is fixedly installed in the tray (44), and the other end is arranged to abut against the bent portion of the bearing rod (42).

8. A chip processing polishing device according to claim 1, characterized in that: A hydraulic rod is arranged inside the push trigger end (52), and an arc-shaped plate is arranged at the end of the hydraulic rod. The hydraulic rod is electrically connected to the control system and is regulated by a structural signal on the regulating component (6).

9. A chip processing polishing device according to claim 1, characterized in that: The bottom end of the outer frame (61) is fixedly connected to the outer side of the bottom support platform (1), a ring groove is opened in the middle of the chuck (11), and the ring groove is clamped on the fan ring plate (62) and is movably arranged in a sleeve manner. The first scraper (63) and the second scraper (64) can be arranged in a close contact with the polishing component (4), and the first scraper (63) and the second scraper (64) are respectively arranged to scrape away the polishing liquid for waste gas and to scrape new polishing liquid. The transverse part of the liquid guide tube (66) is inclined and is connected to the inside of the liquid storage chamber (67). A rack is arranged on the straight plate (69) and is meshed with the transmission gear (68).

10. A chip processing polishing device according to claims 1-9, characterized in that: The specific method of use is as follows: S1, fix the wafer to be polished under the wafer carrier (12), and use the driving structure inside the truncated table base (8) to drive the top plate (9) and the structure thereon to rotate to above the polishing assembly (4); S2, the polishing liquid flows into the liquid guide frame (65) through the liquid storage chamber (67), and then the electric telescopic rod (10) is started to contract so that the polishing liquid flows to the surface of the polishing pad (45), and then the electric telescopic rod (10) is started to extend so that the wafer and the first scraper (63) and the second scraper (64) are attached to the surface of the polishing pad (45), and when the edge of the wafer rotates to the gap between two adjacent polishing assemblies (4), the electric telescopic rod (10) is started to contract so that the wafer is separated from the surface of the polishing pad (45); S3, when the wafer is in contact with the surface of the polishing pad (45), the micromotor in the top plate (9) drives the electric telescopic rod (10) and the wafer to rotate and polish, and the polishing liquid after polishing is scraped off when it rotates to the first scraper (63), and after scraping, the wear degree is detected by the wear detection module (610), and then the polishing liquid is released again by the liquid guide frame (65) to the surface of the polishing pad (45) and is evenly spread by the second scraper (64) for use; S4. When the wear detection module (610) detects that the polishing pad (45) has reached the degree of wear and replacement, a signal is transmitted to the control system to control the electric telescopic rod in the trigger end (52) to push out the arc plate, so that it is pressed and contacted with the bearing rod (42), so that the small gear (43) and the central gear (2) are engaged, thereby realizing that the polishing assembly (4) as a whole rotates around the axis during the rotation of the base assembly (3), and the polishing pad (45) that has been worn and needs to be replaced is rotated to the bottom, reminding the staff to replace it, and it can continue to be used normally after replacement.

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