Novel metering device for HP-RTM glue injection machine

Abstract

The invention relates to a novel metering device for an HP-RTM (High Pressure Resin Transfer Molding) glue injection machine, and aims to improve the stability and efficiency of an HP-RTM process. The device comprises a stirring tank, a feeding pump, a low-pressure filter, a pressure regulating device, a high-pressure metering pump, a flow meter and other key components. After resin is subjected to heating, stirring and vacuum defoaming treatment in the stirring tank, the resin is pumped by the feeding pump and conveyed to the high-pressure metering pump and the flow meter, the pressure of the resin is changed into high pressure through the high-pressure metering pump, and then the flow meter accurately measures the volume of the passing resin, and a low-pressure circulation loop exists between the feeding pump and the high-pressure metering pump. A pressure regulating device is arranged in the loop, so that the pressure of the pipeline is smaller than that of the inlet of the metering pump, and redundant resin can flow back to the stirring tank. Besides, the device is provided with an intelligent monitoring device, key parameters such as the temperature, the pressure and the flow of the resin can be monitored in real time, early warning and alarming functions are achieved, and the safety and the reliability of the device are improved.

Description

Technical Field

[0001] The invention relates to the technical field of high pressure resin transfer molding (HP-RTM), in particular to a novel epoxy resin metering device for an HP-RTM glue injection machine. Background Art

[0002] The HP-RTM process is an advanced composite material molding technology with the advantages of high production efficiency, stable product quality, and low porosity. It is widely used in the fields of automobiles, aerospace, and sporting goods. In HP-RTM equipment, the metering and delivery of resin is one of the key factors affecting product quality and production efficiency. Traditional resin metering devices have problems such as inaccurate metering and unstable delivery, which lead to fluctuations in product quality and low production efficiency. In addition, traditional equipment often requires a long time for preheating and debugging during the startup process, which affects production efficiency. Therefore, it is of great practical significance to develop a new type of epoxy resin metering device to improve the stability and efficiency of HP-RTM equipment and achieve rapid startup of the equipment. Summary of the invention

[0003] In order to solve the problems of unstable metering and conveying and long startup time, the purpose of the present invention is to provide a new epoxy resin metering device for HP-RTM glue injection machine, which can accurately measure and stably convey epoxy resin, meet the high requirements of HP-RTM process for resin materials, and at the same time achieve rapid startup of HP-RTM equipment, thereby improving production efficiency and product quality.

[0004] The technical solution adopted by the present invention to achieve the above functions is:

[0005] A new epoxy resin metering device for HP-RTM glue injection machine includes a stirring tank, a feeding pump, a low-pressure filter, a pressure regulating device, a high-pressure metering pump and a flow meter. The stirring tank includes a tank body, a frame-type stirring ruler, a variable frequency motor and a mechanical seal, wherein the stirring tank body adopts a sandwich structure, and the water in the sandwich is circulated and heated by a water temperature machine to reduce the viscosity of the epoxy resin; the vacuum pump and the stirring ruler work together to achieve vacuum degassing of the epoxy resin; the feeding pump is connected to the discharge port at the bottom of the stirring tank to adjust the delivery rate of the epoxy resin; the low-pressure filter is arranged after the feeding pump to filter impurities in the epoxy resin; the pressure regulating device has a built-in pressure sensor, which is integrated with the control device to monitor and automatically adjust the pressure of the epoxy resin in real time to ensure the stability of the pressure before the metering pump inlet; the high-pressure metering pump is equipped with inlet and outlet pressure sensors and a relief valve, and the inlet pressure of the metering pump needs to be lower than 0.5Mpa. The overflow valve sets a safety threshold of 19Mpa to prevent the metering pump from being damaged when the pipeline is under pressure, and the inlet and outlet pressure sensors are integrated with the control system to monitor the inlet and outlet pressures of the metering pump in real time.

[0006] After the pressure regulating device presets the pressure, the excess epoxy resin flows back to the bottom of the mixing tank through it and the supporting pipelines, forming a closed-loop circulation, which can ensure that the pipeline pressure is less than the inlet pressure of the metering pump, and the excess resin can flow back to the mixing tank. The pipeline design in the low-pressure circulation loop follows the principle of increasing pipe diameter, optimizes the flow path of the resin, and improves the circulation efficiency. The feeding pump runs continuously to ensure that the resin remains in a flowing state in the low-pressure circulation pipeline, providing conditions for rapid startup. Integrated temperature sensors, pressure sensors, flow sensors, etc. monitor the key parameters of the resin in real time, and transmit the data to the remote control center through wireless communication to achieve remote monitoring and fault diagnosis. When the temperature, pressure or flow of the resin is monitored to exceed the preset range, the intelligent monitoring device can automatically trigger a warning signal and stop the device operation when necessary to protect the safety of the equipment and avoid material waste.

[0007] The present invention discloses a novel epoxy resin metering device for HP-RTM glue injection machine, which has the following beneficial effects: the prior art mainly directly feeds the high-pressure metering pump through the feeding pump. Since the inlet pressure of the metering pump is required to be lower than 0.5Mpa, this direct feeding method will cause the motor speed of the feeding pump to be too low, thereby causing unstable material transportation and metering. Compared with the prior art, the present invention uses a low-pressure circulation pipeline to divert the resin supplied by the feeding pump at the normal motor speed to ensure the stability of the inlet pressure of the high-pressure metering pump, thereby achieving stable transportation and metering of the resin. At the same time, this method reduces the difficulty of coordination between the feeding pump and the high-pressure metering pump. When the glue injection machine is started, it only needs to control the motor speed of the metering pump to reach the requirement, which greatly reduces the start-up time. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying creative work.

[0009] Figure 1 It is a schematic diagram of the principle of the present invention;

[0010] Figure 2 It is a schematic diagram of the overall appearance of the present invention.

[0011] Among them, there are 1 mixing tank, 2 feeding pump, 3 low-pressure filter, 4 pressure regulating device, 5 high-pressure metering pump and 6 flow meter. DETAILED DESCRIPTION

[0012] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0013] In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "back", "top", "inside", "outside", etc. indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, they should not be understood as limitations on the present invention.

[0014] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0015] A new epoxy resin metering device for HP-RTM glue injection machine includes a stirring tank, a feeding pump, a low-pressure filter, a pressure regulating device, a metering pump and a flow meter. The stirring tank, the feeding pump, the low-pressure filter, the pressure regulating device, the high-pressure metering pump and the flow meter are all connected to the insulation box by bolts. The new epoxy resin metering device is all connected by hoses. Both ends of the hoses are respectively equipped with H-type joints with fluororubber sealing rings and quick-release chuck joints to ensure sealing.

[0016] Specific work:

[0017] Equipment preparation: Add an appropriate amount of epoxy resin raw material to the mixing tank 1 to ensure that the quality and quantity of the raw material meet the production requirements. Start the circulating water temperature machine to heat the resin in the mixing tank 1 to reduce the viscosity of the resin and improve its fluidity. Start the vacuum pump and stirring ruler to stir and vacuum degas the resin to ensure the uniformity of the resin and the absence of bubbles.

[0018] Low-pressure circulation loop operation: Start the feeding pump 2 to extract the resin in the mixing tank 1 and filter it through the low-pressure filter 3. The filtered resin enters the pressure regulating device 4, and the pressure of the resin is monitored in real time through the built-in pressure sensor of the pressure regulating device, and the pressure is automatically adjusted to a stable state. The stabilized resin maintains a flowing state in the low-pressure circulation pipeline, and the excess resin flows back to the bottom of the mixing tank 1 through the pressure regulating device and the supporting pipeline, forming a closed loop.

[0019] Quick start of injection operation: When the injection operation needs to be started, it is only necessary to start the high-pressure metering pump 5, which receives the resin after the pressure is stabilized by the pressure regulating device 4 and performs high-precision metering. The metered resin is monitored in real time by the flow meter 6 to ensure that the amount of resin injected each time is accurate. The resin is finally transported to the HP-RTM injection head for injection operation, completing the molding process of the composite material.

[0020] Intelligent monitoring and early warning: During the entire operation of the device, the intelligent monitoring device monitors key parameters of the resin such as temperature, pressure, and flow in real time. When abnormal parameters are detected, the intelligent monitoring device can automatically trigger an early warning signal and stop the device operation when necessary to protect the safety of the equipment and avoid material waste. The early warning signal is transmitted to the remote control center via wireless communication, which is convenient for operators to handle and troubleshoot in a timely manner.

[0021] Equipment maintenance and care: Regularly clean and maintain the mixing tank 1, feeding pump 2, low-pressure filter 3, pressure regulating device 4, metering pump 5 and flow meter 6 to ensure the normal operation of the device and extend its service life. Regularly check the connection and sealing performance of each component to ensure there is no leakage or looseness. Regularly calibrate and test the intelligent monitoring device to ensure the accuracy and reliability of the monitoring data.

[0022] The above description of the disclosed embodiments enables one skilled in the art to implement or use the present invention. Various modifications to the embodiments will be apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A novel epoxy resin metering device for HP-RTM glue injection machine, characterized in that: The device comprises: a stirring tank (1) for heating, stirring and vacuum degassing epoxy resin; a feeding pump (2) connected to the discharge port at the bottom of the stirring tank (1) and used to adjust the delivery rate of the epoxy resin; a low-pressure filter (3) arranged behind the feeding pump (2) and used to filter impurities in the epoxy resin; a pressure regulating device (4) arranged between the low-pressure filter (3) and the high-pressure metering pump (5) and used to adjust and stabilize the pressure of the epoxy resin to form a low-pressure circulation loop; the high-pressure metering pump (5) receives the epoxy resin stabilized by the pressure regulating device (4) and performs precise metering; and a flow meter (6) connected to the high-pressure metering pump (5) and used to monitor the flow of the epoxy resin in real time.

2. A novel epoxy resin metering device for HP-RTM glue injection machine according to claim 1, characterized in that: After the pressure is preset in the pressure regulating device (4), the excess epoxy resin flows back to the bottom of the stirring tank (1) through the pressure regulating device (4) and the supporting pipeline, forming a closed-loop circulation, thereby ensuring the continuous supply of epoxy resin and stable pressure.

3. A novel epoxy resin metering device for HP-RTM glue injection machine according to claim 1, characterized in that: The stirring tank (1) comprises a tank body, a frame-type stirring ruler, a variable frequency motor and a mechanical seal, wherein the tank body of the stirring tank (1) adopts a sandwich structure, and the water in the sandwich is circulated and heated by a water temperature machine to reduce the viscosity of the epoxy resin; the vacuum pump and the stirring ruler work together to achieve vacuum degassing of the epoxy resin.

4. A novel epoxy resin metering device for HP-RTM glue injection machine according to any one of claims 1 to 3, characterized in that: The pipeline design in the low-pressure circulation loop follows the principle of increasing pipe diameter, that is, feeding pump pipeline < feeding pipeline < pressure regulating loop, so as to improve the circulation efficiency of epoxy resin.

5. A novel epoxy resin metering device for HP-RTM glue injection machine according to claim 1, characterized in that: The high-pressure metering pump (5) is equipped with inlet and outlet pressure sensors and a relief valve. The inlet pressure of the metering pump needs to be lower than 0.5 MPa. The safety threshold of the relief valve is set to 19 MPa to prevent the metering pump from being damaged when the pipeline is over-pressured. At the same time, the inlet and outlet pressure sensors are integrated with the control system to monitor the inlet and outlet pressures of the metering pump in real time.

6. A novel epoxy resin metering device for HP-RTM glue injection machine according to claim 2, characterized in that: The pressure regulating device (4) has a built-in pressure sensor, which is integrated with the control device to monitor and automatically adjust the pressure of the epoxy resin in real time, thereby ensuring that the pressure before the inlet of the metering pump is stable.

7. A novel epoxy resin metering device for HP-RTM glue injection machine according to any one of claims 1 to 8, characterized in that: It includes an intelligent monitoring device that integrates temperature sensors, pressure sensors, flow sensors, etc., to monitor key parameters such as temperature, pressure, flow, etc. of epoxy resin in real time, and transmits data to a remote control center via wireless communication to achieve remote monitoring and fault diagnosis.

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