Full-automatic semiconductor test probe equipment

Abstract

The invention relates to the field of semiconductor testing, and discloses full-automatic semiconductor testing probe equipment which comprises a shifting mechanism, and the working end of the shifting mechanism is provided with at least one testing mechanism so as to drive probe heads of the testing mechanisms to be in contact with components; the testing mechanism comprises a testing support, a testing driving assembly, a testing linkage assembly and a first probe assembly, the testing linkage assembly is rotationally arranged on the lower portion of the testing support and rotationally connected with the first probe assembly, the testing driving assembly is arranged on the upper portion of the testing support, and the working end of the testing driving assembly is connected with the testing linkage assembly so as to be matched with the testing linkage assembly; the first probe assembly is driven to move; the first probe assembly comprises a shell part, an adjusting part and a probe part, the shell part is connected with the lower part of the test linkage assembly, and the adjusting part is at least partially arranged in the shell part in a sliding manner and is connected with the probe part so as to adjust the position of the probe part. The structure is simple, and the position of the probe is convenient to adjust.

Description

Technical Field

[0001] The invention relates to the field of semiconductor testing, and in particular to a fully automatic semiconductor testing probe device. Background Art

[0002] The probe is a medium for electrical testing. It is a high-end precision electronic hardware component and is a commonly used component in the assembly of electronic products. In the manufacturing process of circuit boards or semiconductor chips, a probe mechanism is usually required for functional and electrical parameter testing. The probe contacts the test point of the chip under test, and the pins of the chip under test are connected to the functional module of the tester through the probe and special connecting wires. The tester applies pressure input signals to the chip and collects output signals to determine whether the chip function and performance meet the design specification requirements.

[0003] In the process of the probe contacting the test point of the chip under test, the chip under test is generally placed in the test station, and the shifting component drives the probe to move toward the test station so that the probe contacts the test point of the chip under test; when the probe contacts the chip under test, if they are not on the same horizontal plane, the lower probe will not only damage the chip under test, but also damage the probe due to collision, thus affecting the test. Therefore, it is necessary to provide a test probe device with a simple structure and easy to adjust the probe. Summary of the invention

[0004] In order to solve the deficiencies in the prior art, the present invention provides a novel fully automatic semiconductor test probe device to solve the problem that the existing probe is easily damaged when it contacts the chip to be tested.

[0005] To achieve the above purpose, the present invention adopts the following technical solutions:

[0006] A fully automatic semiconductor test probe device, used to facilitate the adjustment of the probe, comprises a shift mechanism, at least one test mechanism is arranged at the working end of the shift mechanism to drive the probe head of the test mechanism to contact with components;

[0007] The test mechanism comprises a test support, a test drive assembly, a test linkage assembly and a first probe assembly, wherein the test linkage assembly is rotatably arranged at the lower part of the test support and is rotatably connected to the first probe assembly, and the test drive assembly is arranged at the upper part of the test support, and a working end thereof is connected to the test linkage assembly to cooperate with the test linkage assembly to drive the first probe assembly to move;

[0008] The first probe assembly includes a shell part, an adjustment part and a probe part. The shell part is connected to the lower part of the test linkage assembly. The adjustment part is at least partially slidably arranged inside the shell part and connected to the probe part to adjust the position of the probe part.

[0009] Further, the shifting mechanism includes a shifting bracket and a first shifting driving component. The first shifting driving component is arranged on the front side of the shifting bracket. At least one second shifting driving component is arranged at the working end of the first shifting driving component. The testing support of the testing mechanism is installed at the working end of the second shifting driving component.

[0010] Further, the second shifting driving component includes a shifting mounting plate, a shifting connecting plate and a shifting driving member. The shifting mounting plate is installed at the working end of the first shifting driving component. A guide rail member is arranged on the shifting mounting plate along its own height direction, and is slidably connected with the shifting connecting plate through the guide rail member. The shifting driving member is arranged on the upper side of the shifting mounting plate, and its working end is connected with the shifting connecting plate. The testing support is installed on the shifting connecting plate.

[0011] Further, the testing linkage component includes a linkage arm and a support arm arranged in parallel. The testing support is of a U-shaped structure. At the lower parts of the opposite side walls of the testing support, near the ends of its bottom side wall, a first connecting shaft is respectively arranged. The upper end of the support arm is rotationally connected with the testing support through the first connecting shaft.

[0012] At the lower parts of the opposite side walls of the testing support, away from the ends of its bottom side wall, a second connecting shaft is respectively arranged. The middle part of the linkage arm is rotationally connected with the testing support through the second connecting shaft.

[0013] Further, a limiting block is arranged on the bottom side of the testing support. A limiting groove is opened at the position of the support arm corresponding to the limiting block. The end of the limiting block penetrates through the limiting groove.

[0014] Further, the housing part includes a mounting seat and a main housing. The mounting seat is rotatably arranged at the lower part of the testing linkage component. The main housing is detachably connected with the mounting seat.

[0015] The main housing includes an upper end cover, an outer housing, an inner housing and a lower end cover. The inner housing is located inside the outer housing and is arranged on the upper side of the lower end cover. The upper end cover and the lower end cover are respectively screwed to the upper and lower ends of the outer housing. The adjusting part is slidably arranged inside the inner housing and at least partially passes through the inner housing and is connected with the probe part located under the lower end cover.

[0016] Further, the mounting seat is divided into a mounting main body and a pressing block. The mounting main body is rotationally connected with the testing linkage component. The mounting main body is provided with a mounting groove for placing the main housing. A notch is arranged on the side of the mounting groove. The pressing block is arranged at the notch of the mounting groove.

[0017] Furthermore, the adjustment part includes an adjustment seat and an elastic member, the adjustment seat includes an adjustment upper part and an adjustment lower part, a through opening is provided on the bottom side of the inner shell, the adjustment lower part is at least partially passed through the through opening, and a contact part is provided on the lower side of the upper end cover corresponding to the position of the adjustment upper part, a gap is provided between the contact part and the adjustment upper part, and the upper and lower ends of the elastic member are respectively sleeved on the contact part and the adjustment upper part.

[0018] Furthermore, the bottom side walls of the inner shell are provided with symmetrical guide blocks on both sides of the adjustment seat, and the guide blocks are provided with guide grooves opening upward. The lower side of the adjustment upper part corresponds to the position of the guide blocks, and a guide sheet is provided. The guide sheet is at least partially inserted into the guide groove to limit the rotation of the adjustment seat in the inner shell.

[0019] Furthermore, a connecting seat is arranged on the side of the test support, an adjusting assembly is arranged on a side of the connecting seat away from the test support, and a second probe assembly is arranged on the adjusting assembly.

[0020] The beneficial effect compared with the prior art is that the above scheme is adopted, the present invention has a simple structure and is easy to operate. The test mechanism is first driven by the shifting mechanism to move toward the component, and then the test driving assembly drives the test linkage assembly to rotate to adjust the first probe assembly so that the probe head contacts the component. During the contact process, the position height of the probe head is adjusted by the adjusting part, which is not only convenient for testing, but also has a buffer when the probe contacts the component during measurement to avoid damaging the probe and the workpiece, thereby improving the probe life and measurement flexibility, and has good market application value. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic diagram of the general assembly structure of an embodiment of the present invention;

[0022] Figure 2 For the present invention Figure 1 A schematic structural diagram of a shifting mechanism of an embodiment;

[0023] Figure 3 For the present invention Figure 1 A schematic structural diagram of a test mechanism of an embodiment;

[0024] Figure 4 For the present invention Figure 1 A schematic structural diagram of a test support, a test linkage assembly and a first probe assembly of an embodiment;

[0025] Figure 5 For the present invention Figure 1 A schematic structural diagram of a test support and a test linkage assembly of an embodiment;

[0026] Figure 6For the present invention Figure 1 A schematic structural diagram of a first probe assembly of an embodiment;

[0027] In the figure, 1, shift mechanism; 11, shift bracket; 12, first shift drive assembly; 13, second shift drive assembly; 14, shift mounting plate; 15, shift connecting plate; 16, shift drive member; 17, guide rail member; 2, test mechanism; 21, test support; 211, limit block; 212, retaining edge; 22, test drive assembly; 23, test linkage assembly; 231, linkage arm; 232, support arm; 233, second connecting shaft; 234, first connecting shaft; 24, first probe assembly; 25, connecting seat; 26, adjustment assembly; 27 , the second probe assembly; 3, shell part; 31, mounting seat; 311, mounting body; 312, pressure block; 313, mounting groove; 314, connecting screw; 32, main shell; 321, upper end cover; 322, outer shell; 323, inner shell; 324, lower end cover; 325, guide block; 326, abutment part; 327, screw; 4, adjustment part; 41, adjustment seat; 42, elastic member; 43, adjustment upper part; 44, adjustment lower part; 45, guide sheet; 5, probe part; 51, probe seat; 52, probe head; 53, guide channel. DETAILED DESCRIPTION

[0028] To facilitate those skilled in the art to understand the present invention, the specific implementation methods of the present invention are described below in conjunction with the accompanying drawings. The accompanying drawings provide preferred embodiments of the present invention. However, the present invention can be implemented in many different forms and is not limited to the embodiments described in this specification. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0029] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be an intermediate element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element at the same time. The terms "mounted", "fixed", "front side", "rear side" and similar expressions used in this specification are for illustrative purposes only.

[0030] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used in this specification in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention.

[0031] One embodiment of the present invention is as follows Figure 1 , 3As shown in , 4, the fully automatic semiconductor test probe equipment is used to facilitate the adjustment of the probe, and includes a shift mechanism 1, and at least one test mechanism 2 is arranged at the working end of the shift mechanism 1 to drive the probe head 52 of the test mechanism 2 to contact the component;

[0032] The test mechanism 2 includes a test support 21, a test drive assembly 22, a test linkage assembly 23 and a first probe assembly 24. The test linkage assembly 23 is rotatably arranged at the lower part of the test support 21 and is rotatably connected with the first probe assembly 24. The test drive assembly 22 is arranged at the upper part of the test support 21, and its working end is connected with the test linkage assembly 23 to cooperate with the test linkage assembly 23 to drive the first probe assembly 24 to move.

[0033] The first probe assembly 24 includes a shell portion 3, an adjustment portion 4 and a probe portion 5, the shell portion 3 is connected to the lower portion of the test linkage assembly 23, the adjustment portion 4 is at least partially slidably disposed inside the shell portion 3, and is connected to the probe portion 5 to adjust the position of the probe portion 5.

[0034] The fully automatic semiconductor test probe equipment in this embodiment is suitable for testing semiconductor components and has a simple structure. When in use, the test mechanism 2 is first driven by the shift mechanism 1 to move toward the component, and then the test drive component 22 drives the test linkage component 23 to rotate to adjust the first probe component 24 so that its probe head 52 contacts the component. During the contact process, the position height of the probe head 52 is adjusted by the adjustment part 4, which is not only convenient for testing, but also has a buffer when the probe and the workpiece are in contact during measurement to avoid damage to the probe and the workpiece, thereby improving the probe life and measurement flexibility.

[0035] In this embodiment, Figure 2 As shown, the shift mechanism 1 includes a shift bracket 11 and a first shift drive component 12, the first shift drive component 12 is arranged on the front side of the shift bracket 11, at least one second shift drive component 13 is arranged at the working end of the first shift drive component 12, and the test support 21 of the test mechanism 2 is installed at the working end of the second shift drive component 13.

[0036] Specifically, the first shift drive component 12 is a linear motor module or a linear slide, which is arranged on the front side of the shift bracket 11. Two second shift drive components 13 are arranged at the working end of the first shift drive component 12, so that the shift mechanism 1 can drive the two testing mechanisms 2 to test the workpiece to improve the testing efficiency.

[0037] In this embodiment, Figure 2As shown, the second shifting drive assembly 13 includes a shifting mounting plate 14, a shifting connecting plate 15, and a shifting drive member 16. The shifting mounting plate 14 is mounted on the working end of the first shifting drive assembly 12. A guide member 17 is provided on the shifting mounting plate 14 along its own height direction, and is slidably connected to the shifting connecting plate 15 through the guide member 17. The shifting drive member 16 is disposed on the upper side of the shifting mounting plate 14, and its working end is connected to the shifting connecting plate 15. The test support 21 is mounted on the shifting connecting plate 15.

[0038] Specifically, the shifting drive member 16 is composed of a servo motor and a precision lead screw, and drives the test mechanism 2 to move up and down along the guide member 17 in a lead screw drive manner.

[0039] In this embodiment, the selected drive components are cylinders and motors, and the selected components such as cylinders and motors are all existing devices. The first shifting drive assembly 12 and the second shifting drive assembly 13 cooperate to drive the test mechanism 2 to move in the X direction and the Z direction.

[0040] In this embodiment, as Figure 4 、 5 shown, the test linkage assembly 23 includes a linkage arm 231 and a support arm 232 arranged in parallel. The test support 21 has a C-shaped structure. At the lower parts of the opposite side walls of the test support 21, near the ends of its bottom side wall, a first connecting shaft 234 is provided respectively. The upper end of the support arm 232 is rotatably connected to the test support 21 through the first connecting shaft 234.

[0041] At the lower parts of the opposite side walls of the test support 21, away from the ends of its bottom side wall, a second connecting shaft 233 is provided respectively. The middle part of the linkage arm 231 is rotatably connected to the test support 21 through the second connecting shaft 233.

[0042] Specifically, the bottom side wall of the test support 21 is mounted on the shifting connecting plate 15 of the shifting mechanism 1 through bolts. The test drive assembly 22 is a telescopic cylinder, which is rotatably mounted on the upper part of the bottom side wall of the test support 21, and its working end is rotatably connected to the upper end of the linkage arm 231.

[0043] Specifically, the test support 21 forms a C-shaped structure through its bottom side wall and left and right side walls. The test drive assembly 22 drives the linkage arm 231 to rotate along the second connecting shaft 233, so as to drive the first probe assembly 24 to swing back and forth, so as to realize the Y-direction movement of the first probe assembly 24.

[0044] In this embodiment, as Figure 4As shown, a limit block 211 is provided on the bottom side of the test support 21 , and a limit groove is formed on the support arm 232 corresponding to the position of the limit block 211 , and the end of the limit block 211 is inserted into the limit groove.

[0045] Specifically, there are two support arms 232, which are symmetrically arranged on the left and right inner sides of the bottom of the test support 21. A limit block 211 is set at the bottom of the test support 21 corresponding to the position of the support arm 232. The front end of the limit block 211 extends forward and is passed through the limit groove. The front end of the limit block 211 extends outward to set a retaining edge 212, so that the front end of the limit block 211 can move in the limit groove to limit the rotation range of the support arm 232, thereby limiting the Y-axis movement range of the first probe assembly 24.

[0046] In this embodiment, Figure 4 , 6 As shown, the housing portion 3 includes a mounting seat 31 and a main housing 32, the mounting seat 31 is rotatably disposed at the lower portion of the test linkage assembly 23, and the main housing 32 is detachably connected to the mounting seat 31;

[0047] The main shell 32 includes an upper end cover 321, an outer shell 322, an inner shell 323 and a lower end cover 324. The inner shell 323 is located inside the outer shell 322 and is arranged on the upper side of the lower end cover 324. The upper end cover 321 and the lower end cover 324 are respectively screwed to the upper and lower ends of the outer shell 322. The adjustment part 4 is slidably arranged inside the inner shell 323, and at least partially passes through the inner shell 323, and is connected to the probe part 5 located on the lower side of the lower end cover 324.

[0048] Specifically, the upper and lower ends of the outer shell 322 are provided with internal threads along its inner periphery, and the upper end cover 321 and the lower end cover 324 are provided with external threads along their respective outer peripheries to achieve a detachable connection of the main shell 32, which is convenient for assembly and maintenance of the probe assembly.

[0049] In this embodiment, Figure 5 As shown, the mounting seat 31 is divided into a mounting body 311 and a pressure block 312. The mounting body 311 is rotatably connected to the test linkage assembly 23. The mounting body 311 is provided with a mounting groove 313 for placing the main shell 32. The side of the mounting groove 313 has a notch, and the pressure block 312 is arranged at the notch of the mounting groove 313.

[0050] Specifically, the main shell 32 is provided with a mounting groove 313 that passes through from top to bottom, the pressure block 312 is arranged at the front side of the mounting groove 313, and the pressure block 312 is provided with at least one connecting screw hole that passes through itself and extends to the mounting body 311, and a connecting screw 314 is provided in the connecting screw hole, and the connecting screw 314 is inserted into the connecting screw hole of the pressure block 312 and the mounting body 311 to install the main shell 32 in the mounting groove 313 of the main shell 32; the assembled main shell 32 is placed in the mounting groove 313 from the notch of the pressure block 312, and then the connecting screw 314 is screwed into the connecting screw hole of the pressure block 312 and the mounting body 311 to detachably install the main shell 32 in the mounting groove 313 of the mounting seat 31.

[0051] In this embodiment, Figure 4 , 5 As shown, the top of the installation body 311 is rotatably connected to the lower ends of the linkage arm 231 and the support arm 232 respectively.

[0052] Specifically, the two ends of the top rear side of the installation body 311 are rotatably connected to the lower ends of the two support arms 232 through connecting shafts, and the two ends of the top front side of the installation body 311 are rotatably connected to the opposite sides of the lower ends of the linkage arms 231 through connecting shafts. In the process of the test drive component 22 driving the first probe component 24 to move forward and backward through the test linkage component 23, the probe part 5 of the first probe component 24 is always kept in a vertical state to ensure the detection accuracy.

[0053] In this embodiment, Figure 6 As shown, the adjusting portion 4 includes an adjusting seat 41 and an elastic member 42, the adjusting seat 41 includes an adjusting upper portion 43 and an adjusting lower portion 44, a through opening is provided on the bottom side of the inner shell 323, the adjusting lower portion 44 is at least partially passed through the through opening, and a contact portion 326 is provided on the lower side of the upper end cover 321 corresponding to the position of the adjusting upper portion 43, a gap is provided between the contact portion 326 and the adjusting upper portion 43, and the upper and lower ends of the elastic member 42 are respectively sleeved on the contact portion 326 and the adjusting upper portion 43.

[0054] Specifically, the cross-section of the adjustment seat 41 is in the shape of a cross, with the upper part being the upper adjustment part 43 and the lower part being the lower adjustment part 44. A through-opening is formed in the middle of the bottom side wall of the inner housing 323. The lower part of the lower adjustment part 44 is inserted into the through-opening and connected to the probe part 5. The middle part of the lower side of the upper end cover 321 protrudes downward to form an abutting part 326, and is abutted against the upper adjustment part 43 through the elastic member 42. The gap between the abutting part 326 and the upper adjustment part 43 facilitates the compression and rebound of the elastic member 42. The elastic member 42 is a spring. When the probe head 52 of the probe part 5 is impacted, the lower adjustment part 44 retracts towards the inside of the inner housing 323, buffering the force of contact between the buffer component and the probe head 52, and then being driven by the compressed spring to slowly move downward to contact the component, so as to adjust the position height of the probe head 52.

[0055] In this embodiment, as Figure 6 shown, on both sides of the adjustment seat 41 on the bottom side wall of the inner housing 323, symmetric guiding blocks 325 are provided. An upward-opening guiding groove is provided on the guiding block 325. At the position corresponding to the guiding block 325 on the lower side of the upper adjustment part 43, a guiding piece 45 is provided. At least a part of the guiding piece 45 is inserted into the guiding groove to limit the rotation of the adjustment seat 41 in the inner housing 323.

[0056] Specifically, the inner housing 323 is a cylindrical structure with an opening at the top side, and its cross-section is in the shape of a C with the opening upward. On the upper surface of the bottom side wall of the inner housing 323, guiding blocks 325 extend upward on both sides of the adjustment seat 41. The outer ends of the guiding pieces 45 on the adjustment seat 41 are inserted into the corresponding guiding grooves, so as to limit the rotation of the adjustment seat 41 in the inner housing 323 and enable the adjustment seat 41 to move up and down in the inner housing 323.

[0057] In this embodiment, as Figure 6 shown, the probe part 5 includes a probe seat 51 and a probe head 52. One end of the probe head 52 is arranged on the probe seat 51. The lower end cover 324 is provided with a guiding channel 53 for placing the probe seat 51. The guiding channel 53 is communicated with the through-opening at the bottom side of the inner housing 323, and the diameter of the guiding channel 53 gradually decreases from top to bottom.

[0058] Specifically, a vertically-through guiding channel 53 is provided in the middle of the lower end cover 324 and is communicated with the through-opening at the bottom side of the inner housing 323. The upper part of the probe seat 51 is connected to the lower adjustment part 44 of the adjustment seat 41. The probe seat 51 is adapted to the guiding channel 53, so that the probe seat 51 moves up and down along the guiding channel 53.

[0059] In this embodiment, as Figure 6 As shown, the lower end cover 324 is provided with at least one connecting screw hole which passes through itself and extends to the bottom side wall of the inner shell 323, and a screw 327 is provided in the connecting screw hole. The screw 327 is screwed into the connecting screw hole of the lower end cover 324 and the inner shell 323 to install the inner shell 323 on the lower end cover 324.

[0060] In a specific implementation, the probe head 52 is first installed on the probe seat 51, and the probe seat 51 is pushed into the guide channel 53 from the upper side of the lower end cover 324, so that the probe head 52 protrudes from the lower side of the lower end cover 324; and then a plurality of screws 327 are respectively screwed into the corresponding connecting screw holes of the lower end cover 324 and the inner shell 323 to install the inner shell 323 on the upper side of the lower end cover 324;

[0061] Then, the adjusting lower portion 44 of the adjusting seat 41 is inserted into the opening of the inner shell 323 and connected to the upper portion of the probe seat 51, and at the same time, the guide piece 45 on the side of the adjusting upper portion 43 is inserted into the guide groove;

[0062] Then, the outer shell 322 and the lower end cover 324 are screwed together by matching the inner thread of the lower end of the outer shell 322 with the outer thread of the lower end cover 324;

[0063] Next, the elastic member 42 is sleeved on the upper adjustment portion 43 of the adjustment seat 41 , and then the outer shell 322 and the upper end cover 321 are screwed together so that the upper end of the elastic member 42 abuts against the abutting portion 326 .

[0064] In this embodiment, Figure 3 As shown, a connection seat 25 is disposed on the side of the test support 21 , an adjustment component 26 is disposed on a side of the connection seat 25 away from the test support 21 , and a second probe component 27 is disposed on the adjustment component 26 .

[0065] Specifically, the connecting seat 25 is arranged on the right side of the test support 21, and the adjustment assembly 26 includes an adjustment seat and a fine-tuning screw 327. The adjustment seat is installed on the right side of the connecting seat 25. The adjustment seat is provided with a fine-tuning screw hole. The fine-tuning screw 327 passes through the fine-tuning screw hole and is connected to the second probe assembly 27, so that the second probe assembly 27 can be fine-tuned in the X direction to adjust the position between the two probe assemblies.

[0066] The fully automatic semiconductor test probe equipment of this scheme first drives the two probe assemblies to move in the X and Z directions to approach the components through the cooperation of the first shift drive assembly 12 and the second shift drive assembly 13; then drives the linkage arm 231 to rotate along the second connecting axis 233 through the test drive assembly 22 to drive the first probe assembly 24 to move in the Y direction and make the probe part 5 vertically downward; when touching the components, the probe part 5 can retract and then slowly move downward to adjust the position height of the probe head 52, so that it can contact the components at different position heights; and the probe head 52 can be accurately adjusted to the same horizontal plane through the adjustment assembly 26 to improve the measurement accuracy and precision.

[0067] It should be noted that the above-mentioned technical features are further combined with each other to form various embodiments not listed above, which are all deemed to be within the scope of the present invention; and, for ordinary technicians in this field, they can be improved or transformed according to the above description, and all these improvements and transformations should fall within the scope of protection of the claims attached to the present invention.

Claims

1. A fully automatic semiconductor test probe device for facilitating probe adjustment, characterized in that: It includes a displacement mechanism (1), and at least one test mechanism (2) is provided at the working end of the displacement mechanism (1) to drive the probe head (52) of the test mechanism (2) to contact the component. The test mechanism (2) includes a test support (21), a test driving component (22), a test linkage component (23), and a first probe component (24). The test linkage component (23) is rotatably arranged at the lower part of the test support (21) and is rotatably connected to the first probe component (24). The test driving component (22) is arranged at the upper part of the test support (21), and its working end is connected to the test linkage component (23) to cooperate with the test linkage component (23) to drive the first probe component (24) to move. The first probe component (24) includes a housing part (3), an adjustment part (4), and a probe part (5). The housing part (3) is connected to the lower part of the test linkage component (23). The adjustment part (4) is at least partially slidably arranged inside the housing part (3) and is connected to the probe part (5) to adjust the position of the probe part (5).

2. The fully automatic semiconductor test probe equipment according to claim 1, characterized in that: The displacement mechanism (1) includes a displacement bracket (11) and a first displacement driving component (12). The first displacement driving component (12) is arranged on the front side of the displacement bracket (11). At least one second displacement driving component (13) is provided at the working end of the first displacement driving component (12). The test support (21) of the test mechanism (2) is installed at the working end of the second displacement driving component (13).

3. The fully automatic semiconductor test probe equipment according to claim 2, characterized in that: The second displacement driving component (13) includes a displacement mounting plate (14), a displacement connecting plate (15), and a displacement driving member (16). The displacement mounting plate (14) is installed at the working end of the first displacement driving component (12). A guide rail member (17) is arranged on the displacement mounting plate (14) along its own height direction and is slidably connected to the displacement connecting plate (15) through the guide rail member (17). The displacement driving member (16) is arranged on the upper side of the displacement mounting plate (14), and its working end is connected to the displacement connecting plate (15). The test support (21) is installed on the displacement connecting plate (15).

4. The fully automatic semiconductor test probe equipment according to claim 1, characterized in that: The test linkage component (23) includes a linkage arm (231) and a support arm (232) arranged in parallel. The test support (21) has a U-shaped structure. At the lower parts of the opposite side walls of the test support (21), near the ends of its bottom side wall, a first connecting shaft (234) is provided at each. The upper end of the support arm (232) is rotatably connected to the test support (21) through the first connecting shaft (234). At the lower parts of the opposite side walls of the test support (21), away from the ends of its bottom side wall, a second connecting shaft (233) is provided at each. The middle part of the linkage arm (231) is rotatably connected to the test support (21) through the second connecting shaft (233).

5. The fully automatic semiconductor test probe equipment according to claim 4, characterized in that: A limit block (211) is provided on the bottom side of the test support (21), a limit groove is provided on the support arm (232) corresponding to the position of the limit block (211), and an end of the limit block (211) is inserted into the limit groove.

6. The fully automatic semiconductor test probe equipment according to claim 1, characterized in that: The housing portion (3) comprises a mounting seat (31) and a main housing (32); the mounting seat (31) is rotatably disposed at the lower part of the test linkage assembly (23); and the main housing (32) is detachably connected to the mounting seat (31); The main shell (32) comprises an upper end cover (321), an outer shell (322), an inner shell (323) and a lower end cover (324); the inner shell (323) is located inside the outer shell (322) and is arranged on the upper side of the lower end cover (324); the upper end cover (321) and the lower end cover (324) are respectively screwed to the upper and lower ends of the outer shell (322); the adjustment part (4) is slidably arranged inside the inner shell (323) and at least partially passes through the inner shell (323) to be connected to the probe part (5) located on the lower side of the lower end cover (324).

7. The fully automatic semiconductor test probe equipment according to claim 6, characterized in that: The mounting seat (31) is divided into a mounting body (311) and a pressing block (312); the mounting body (311) is rotatably connected to the test linkage assembly (23); the mounting body (311) is provided with a mounting groove (313) for placing the main housing (32); a side of the mounting groove (313) has a notch; and the pressing block (312) is arranged at the notch of the mounting groove (313).

8. The fully automatic semiconductor test probe equipment according to claim 6, characterized in that: The adjusting portion (4) comprises an adjusting seat (41) and an elastic member (42); the adjusting seat (41) comprises an adjusting upper portion (43) and an adjusting lower portion (44); a through opening is provided on the bottom side of the inner shell (323); the adjusting lower portion (44) is at least partially inserted into the through opening; a contact portion (326) is provided on the lower side of the upper end cover (321) corresponding to the position of the adjusting upper portion (43); a gap is provided between the contact portion (326) and the adjusting upper portion (43); and upper and lower ends of the elastic member (42) are respectively sleeved on the contact portion (326) and the adjusting upper portion (43).

9. The fully automatic semiconductor test probe equipment according to claim 8, characterized in that: The bottom side walls of the inner shell (323) are provided with symmetrical guide blocks (325) on both sides of the adjustment seat (41), and the guide blocks (325) are provided with guide grooves opening upward. The lower side of the adjustment upper part (43) corresponds to the position of the guide blocks (325), and a guide piece (45) is provided. The guide piece (45) is at least partially inserted into the guide groove to limit the rotation of the adjustment seat (41) in the inner shell (323).

10. The fully automatic semiconductor test probe equipment according to claim 1, characterized in that: A connecting seat (25) is arranged on the side of the test support (21), an adjusting component (26) is arranged on a side of the connecting seat (25) away from the test support (21), and a second probe component (27) is arranged on the adjusting component (26).

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