Movable package, test device and test method

Abstract

The invention discloses a movable package, a testing device and a testing method. The movable package includes: a movable package body including a first part and a second part for holding a substrate therebetween, the substrate carrying a microelectronic circuit and having a plurality of substrate terminals connected to the microelectronic circuit; a plurality of movable packaging contacts, the contacts are arranged on the second part, and the movable packaging contacts are matched with the substrate terminals so as to be in contact with the substrate terminals; a fixing system; and a first electrical interface on the movable package and connected to the movable package contact for connecting to a second electrical interface on the frame when the movable package is removably held by the frame.

Description

[0001] This application is a divisional application of the Chinese patent application with application number 202180068810.9, application date 2021-10-05, and name “Electronic Tester”.

[0002] CROSS-REFERENCE TO RELATED APPLICATIONS

[0003] This application claims priority to U.S. Provisional Patent Application No. 63 / 088,635, filed on October 7, 2020, the entire contents of which are incorporated by reference into this application. Background Art 1) Technical Field

[0004] The invention relates to a testing device for testing a microelectronic circuit.

[0005] 2) Related technical discussions

[0006] Microelectronic circuits are typically fabricated in and on semiconductor wafers. Such wafers are then "segmented" or "diced" into individual die. Such dies are typically mounted to a supporting substrate to provide rigidity thereto and for electronic communication with the integrated circuits or microelectronic circuits of the die. The final package may include packaging of the die, and the resulting package may then be shipped to the customer.

[0007] It is necessary to test the die or package before shipping it to the customer. Ideally, the die should be tested at an early stage in order to identify defects that occur during early manufacturing. Wafer-level testing can be achieved by providing a manipulator and a contactor with contacts and then using the manipulator to move the wafer so that the contacts on the wafer contact the contacts on the contactor. Then, power and electronic signals can be provided to and from the microelectronic circuits formed in the wafer through the contactors.

[0008] According to various embodiments, a wafer includes a substrate such as a silicon substrate or a printed circuit board and one or more devices fabricated in or mounted to the substrate.

[0009] Alternatively, the die may be located in a removable die package having an electrical interface and a thermal chuck. When the temperature of the die is thermally controlled by heating or cooling the thermal chuck, power and signals may be provided to and from the die through the electrical interface.

[0010] The individual dies may need to be tested again after the wafer is singulated, and the dies may need to be tested again after being mounted to a supporting substrate. Summary of the invention

[0011] The present invention provides a microelectronic circuit test package, comprising: a movable support structure, the movable support structure comprising a first component and a second component for holding a substrate therebetween, the substrate carrying a microelectronic circuit and having a plurality of terminals connected to the microelectronic circuit, a plurality of contacts on the second component, the contacts matching the terminals to contact the terminals, a pressure differential chamber seal between the first component and the second component, the pressure differential chamber seal forming a closed pressure differential chamber together with surfaces of the first component and the second component, a pressure relief channel formed through one of the first component and the second component, the pressure relief channel having an inlet opening at the pressure differential chamber and an outlet opening outside the pressure differential chamber, a pressure relief valve connected to the pressure relief channel, the opening of the pressure relief valve allowing air to come out of the pressure differential chamber to move the first component and the second component toward each other to ensure that the contacts and the terminals are in contact with each other The invention relates to a method of controlling the engagement of the movable support structure with the first and second parts of the first and second parts, and closing the pressure relief valve to prevent air from entering the pressure differential chamber, a first interface on the movable support structure and connected to the contact, a second interface connected to the fixed structure when the movable support structure is held by the fixed structure, and a latch system, including a first latch assembly, the first latch assembly may include a first part combined with the first part, a second part engaged with the second part, a connecting part having opposite ends respectively fixed to the first part and the second part to form a locking device, and an engaging mechanism, the engaging mechanism is connected to the locking device and is operable to move the locking device between a locked position and an unlocked position, in which the locking device keeps the first part and the second part locked in the closed position, and in the unlocked position, the locking device allows the first part and the second part to move from a closed relationship to a spaced relationship.

[0012] The microelectronic circuit testing package may include an engagement mechanism that moves the second component between a locked position and an unlocked position.

[0013] The microelectronic circuit testing package may include the second component being rotatable between a locked position and an unlocked position.

[0014] The microelectronic circuit test package may include an engagement mechanism including a surface on a first portion that forms a seat for contacting a surface on a jaw of a tool, the jaws of the tool being rotatable to rotate the first portion, and the first portion rotating the second portion via a connecting portion to move between a locked position and an unlocked position.

[0015] The microelectronic circuit test package may include the surface of the first portion forming the seat being an exterior surface of the first portion.

[0016] The microelectronic circuit testing package may include a first portion having tool pin openings therein for aligning pins of a tool with the first portion.

[0017] The microelectronic circuit test package may include a second portion having a body and at least a first tab extending from the body, wherein the first tab moves over a shoulder of the first portion when moved to a first locked position and moves away from the shoulder when moved away from the first locked position toward an unlocked position.

[0018] The microelectronic circuit testing package may include the second component having a second tab extending from the body, wherein the second tab moves over a shoulder of the first component when moved to the second locked position and moves away from the shoulder when moved away from the second locked position toward the unlocked position.

[0019] The microelectronic circuit test package may include, the latch system may also include a tuning block mounted in a fixed position relative to the first component, the tuning block having a leveling surface, the second wing being located above the leveling surface when the first wing is located above the shoulder, the second portion being adjustable relative to the first portion to adjust the gap between the leveling surface and the second wing.

[0020] The microelectronic circuit test package may include that the latching system may further include a locking nut having threads that engage threads on the connecting portion to rotationally adjust the second portion relative to the connecting portion.

[0021] The microelectronic circuit test package may include that the latching system may further include a spacer between the tuning block and the first component to adjust the distance between the leveling surface and the first component.

[0022] The microelectronic circuit test package may include that the latch system may further include a snap mechanism having a snap surface that snaps into the first snap recess to prevent the second component from moving out of the locked position, and the snap surface snaps into the second snap recess to prevent the second component from moving out of the unlocked position.

[0023] The microelectronic circuit testing package may include a first snap recess and a second snap recess located on the locking device.

[0024] The microelectronic circuit testing package may include a first snap recess and a second snap recess located on the second portion.

[0025] A microelectronic circuit test package may include a first component including a backplane and a signal distribution board, wherein a portion of the signal distribution board is located between the backplane and the second component, the signal distribution board has an opening, a connecting portion is inserted through the opening, the opening has a first dimension on an axis toward a center point of the signal distribution board, the first dimension is larger than a second dimension transverse to the axis, the connecting portion has a first portion, the first portion is smaller than the first dimension in the direction of the axis to allow the signal distribution board and the backplane to thermally expand relative to each other, and the size of the first portion is designed to be slidably fitted within the second dimension of the opening to prevent the signal distribution board from moving relative to the backplane in a direction transverse to the axis.

[0026] The microelectronic circuit test may include a connection portion having a second portion having a first thickness and a second thickness transverse to the first thickness, the first thickness being fitable through the opening in the direction of the axis during the insertion, and the first thickness being greater than a second dimension of the opening, the second thickness being fitable through the second dimension of the opening during the insertion.

[0027] The microelectronic circuit test package may include, the latch system may also include a second latch assembly, wherein each corresponding latch assembly may include a first portion engaged with the first component, a second portion engaged with the second component, a connecting portion having opposite ends respectively fixed to the first portion and the second portion to form a locking device, and an engaging mechanism, which is connected to the locking device and is operable to move the locking device between a locked position and an unlocked position, in which the locking device keeps the first component and the second component locked in the closed position, and in the unlocked position, the locking device allows the first component and the second component to move from a closed relationship to a spaced relationship.

[0028] The microelectronic circuit test package may include the first latch assembly and the second latch assembly having respective second portions on different sides of the second component.

[0029] A microelectronic circuit test package may include a differential pressure cavity seal surrounding contacts and terminals.

[0030] The microelectronic circuit test package may include a differential pressure chamber seal secured to the first component when the first component and the second component are separated.

[0031] The microelectronic circuit test package may include that the differential pressure chamber seal is a lip seal.

[0032] The microelectronic circuit test package may include a pressure relief valve that is a pressure relief check valve, a vacuum relief passage formed through a component having the pressure relief check valve, the vacuum relief passage having an inlet opening at a pressure differential chamber and an outlet opening outside the pressure differential chamber, and a second valve that is a vacuum relief valve connected to the vacuum relief passage, the opening of the vacuum relief valve allowing air to enter the pressure differential chamber, and the closing of the vacuum relief valve preventing air from escaping from the pressure differential chamber.

[0033] The microelectronic circuit test package may include that the substrate is a wafer having a plurality of microelectronic circuits.

[0034] The microelectronic circuit test package may include that the contacts are pins, each pin having a spring that is pressed against its spring force when the corresponding contact is pressed by a corresponding one of the terminals.

[0035] The present invention also provides a testing device, comprising: a movable support structure, the movable support structure comprising a first component and a second component for holding a substrate therebetween, the substrate carrying a microelectronic circuit and having a plurality of terminals connected to the microelectronic circuit; a plurality of contacts on the second component, the contacts matching the terminals to contact the terminals; a pressure differential chamber seal between the first component and the second component, the pressure differential chamber seal forming a closed pressure differential chamber together with surfaces of the first component and the second component; a pressure relief channel formed through one of the first component and the second component, the pressure relief channel having an inlet opening at the pressure differential chamber and an outlet opening outside the pressure differential chamber; a pressure relief valve connected to the pressure relief channel, the opening of the pressure relief valve allowing air to come out of the pressure differential chamber to move the first component and the second component toward each other to ensure proper contact between the contacts and the terminals, and the closing of the pressure relief valve preventing air from entering the pressure differential chamber; a first interface, on the movable support structure and connected to the contacts; a first latch assembly, the first latch assembly may include a first portion engaged with the first component, a first portion engaged with the second component A second part, a connecting part having opposite ends fixed to the first part and the second part respectively to form a locking device, and a coupling mechanism, the coupling mechanism is connected to the locking device and can be operated to move the locking device between a locked position and an unlocked position, in which the locking device keeps the first part and the second part locked in a closed position, and in the unlocked position, the locking device allows the first part and the second part to move from a closed relationship to a spaced relationship; a fixed structure, a movable support structure can be received to be held by the fixed structure, and can be removed from the fixed structure; a second interface on the fixed structure, when the movable support structure is held by the fixed structure, the second interface is connected to the first interface, and when the movable support structure is removed from the fixed structure, the second interface is disconnected from the first interface; and an electronic tester, the electronic tester is connected to the terminal through the second interface, the first interface and the contact, so that a signal is transmitted between the electronic tester and the microelectronic circuit to test the microelectronic circuit.

[0036] The testing device may include an engagement mechanism that moves the second component between a locked position and an unlocked position.

[0037] The test device may include that the second component is rotatable between a locked position and an unlocked position.

[0038] The testing device may include an engagement mechanism including a surface on a first portion forming a seat for contacting a surface on a jaw of a tool, the jaw of the tool being rotatable to rotate the first portion, and the first portion rotating the second portion via a connecting portion to move between a locked position and an unlocked position.

[0039] The test device may comprise that the surface of the first part forming the seat is an outer surface of the first part.

[0040] The testing device may include a first portion having tool pin openings therein for aligning pins of a tool with the first portion.

[0041] The test device may include a second portion having a body and at least a first tab extending from the body, wherein the first tab moves over a shoulder of the first component when moving to the first locked position and moves away from the shoulder when moving away from the first locked position toward the unlocked position.

[0042] The test device may include the second portion having a second tab extending from the body, wherein the second tab moves over a shoulder of the first portion when moving to the second locked position and moves away from the shoulder when moving away from the second locked position toward the unlocked position.

[0043] The test apparatus may include, the latching system may further include a tuning block mounted in a fixed position relative to the first component, the tuning block having a leveling surface, the second wing being located above the leveling surface when the first wing is located above the shoulder, the second portion being adjustable relative to the first portion to adjust a gap between the leveling surface and the second wing.

[0044] The test apparatus may include that the latching system may further include a locking nut having threads engaging threads on the connecting portion to rotationally adjust the second portion relative to the connecting portion.

[0045] The test apparatus may include that the latching system may further include a shim between the tuning block and the first component to adjust the distance between the leveling surface and the first component.

[0046] The test device may include that the latch system may further include a snap mechanism having a snap surface that snaps into the first snap recess to prevent the second component from moving out of the locked position, and the snap surface snaps into the second snap recess to prevent the second component from moving out of the unlocked position.

[0047] The testing device may include a first snap recess and a second snap recess located on the locking device.

[0048] The testing device may include a first snap recess and a second snap recess located on the second portion.

[0049] The test device may include a first component including a back plate and a signal distribution plate, wherein a portion of the signal distribution plate is located between the back plate and the second component, the signal distribution plate has an opening, a connecting portion is inserted through the opening, the opening has a first dimension on an axis toward a center point of the signal distribution plate, the first dimension is larger than a second dimension transverse to the axis, the connecting portion has a first portion, the first portion is smaller than the first dimension in the direction of the axis to allow thermal expansion of the signal distribution plate and the back plate relative to each other, and the size of the first portion is designed to be slidably fitted within the second dimension of the opening to prevent the signal distribution plate from moving relative to the back plate in a direction transverse to the axis.

[0050] The test device may include a connecting portion having a second portion having a first thickness and a second thickness transverse to the first thickness, the first thickness being able to fit through the opening in the direction of the axis during the insertion and being larger than the second dimension of the opening, the second thickness being able to fit through the second dimension of the opening during the insertion.

[0051] The test device may include, the latch system may further include a second latch assembly, wherein each latch assembly may have a first portion engaged with the first component, a second portion engaged with the second component, a connecting portion having opposite ends fixed to the first portion and the second portion, respectively, to form a locking device, and an engaging mechanism, which is connected to the locking device and is operable to move the locking device between a locked position and an unlocked position, in which the locking device keeps the first component and the second component locked in the closed position, and in the unlocked position, the locking device allows the first component and the second component to move from a closed relationship to a spaced relationship.

[0052] The test device may include the first latch assembly and the second latch assembly having respective second portions on different sides of the second component.

[0053] The test device may include a differential pressure chamber seal surrounding the contacts and the terminals.

[0054] The test device may include the differential pressure chamber seal being secured to the first component when the first component and the second component are separated.

[0055] The test device may include that the differential pressure chamber seal is a lip seal.

[0056] The test device may include, the pressure reducing valve is a pressure reducing check valve, a vacuum release channel is formed through the component with the pressure reducing check valve, the vacuum release channel has an inlet opening at the pressure differential chamber and an outlet opening outside the pressure differential chamber, the test device also includes a second valve, the second valve is a vacuum release valve connected to the vacuum release channel, the opening of the vacuum release valve allows air to enter the pressure differential chamber, and the closing of the vacuum release valve prevents air from escaping from the pressure differential chamber.

[0057] The test apparatus may include the fixed structure including a thermal chuck, the second part of the movable support structure including a thin chuck in contact with the thermal chuck to allow heat to be transferred between the movable support structure and the thermal chuck.

[0058] The test apparatus may include that the substrate is a wafer having a plurality of microelectronic circuits.

[0059] The test device may include that the contacts are pins, each pin having a spring, and when the corresponding contact is pressed by a corresponding one of the terminals, the spring is pressed against a spring force thereof.

[0060] The present invention also provides a method for testing a microelectronic circuit held by a substrate, comprising holding the substrate between a first component and a second component of a movable support structure, the second component having contacts abutting against terminals of the substrate connected to the microelectronic circuit, wherein a pressure relief passage is formed through one of the first component and the second component, the pressure relief passage having an inlet opening at a pressure differential chamber and an outlet opening outside the pressure differential chamber, positioning a pressure differential chamber seal between the first component and the second component to form a closed chamber by surfaces of the first component and the second component and the pressure differential chamber seal, opening a pressure relief valve to allow air to leave the pressure differential chamber and reducing the pressure in the pressure differential chamber to move the first component and the second component toward each other to ensure proper contact between the contacts and the terminals, and closing the pressure relief valve to prevent air from entering the pressure differential chamber. Air enters the pressure difference chamber, and the engaging mechanism is operated to move the locking device between a locked position and an unlocked position. In the locked position, the locking device keeps the first component and the second component locked in the closed position. In the unlocked position, the locking device allows the first component and the second component to move from a closed relationship to a spaced relationship. The locking device may include a first part engaged with the first component, a second part engaged with the second component, and a connecting part having opposite ends fixed to the first part and the second part, respectively. The movable support structure is received by the fixed structure, wherein the first interface on the movable support structure is connected to the second interface on the fixed structure, and signals are transmitted between the electronic tester and the microelectronic circuit through the terminals, contacts, and the first interface and the second interface to test the microelectronic circuit.

[0061] The method may include the engagement mechanism moving the second component between a locked position and an unlocked position.

[0062] The method may include rotating the second component between a locked position and an unlocked position.

[0063] The method may include the engagement mechanism including a surface on a first portion forming a seat for contacting a surface on a jaw of a tool, the jaw of the tool being rotatable to rotate the first portion, and the first portion rotating the second portion via a connecting portion to move between a locked position and an unlocked position.

[0064] The method may include the surface of the first part forming the seat being an outer surface of the first part.

[0065] The method may include the first portion having a tool pin opening therein for aligning a pin of a tool with the first portion.

[0066] The method may include the second portion having a body and at least a first tab extending from the body, wherein the first tab moves over a shoulder of the first component when moving to a first locked position and moves away from the shoulder when moving away from the first locked position toward an unlocked position.

[0067] The method may include the second portion having a second tab extending from the body, wherein the second tab moves over a shoulder of the first portion when moving to the second locked position and moves away from the shoulder when moving away from the second locked position toward the unlocked position.

[0068] The method may include that the latch system may further include a tuning block mounted in a fixed position relative to the first component, the tuning block having a leveling surface, the second wing being located above the leveling surface when the first wing is located above the shoulder, the second portion being adjustable relative to the first portion to adjust a gap between the leveling surface and the second wing.

[0069] The method may include that the latch system may further include a locking nut having threads that engage threads on the connecting portion to rotationally adjust the second portion relative to the connecting portion.

[0070] The method may include that the latching system may further include positioning a shim between the tuning mass and the first component to adjust the distance between the leveling surface and the first component.

[0071] The method may include that the latch system may also include a snap mechanism having a snap surface that snaps into the first snap recess to prevent movement of the second component from the locked position, and the snap surface snaps into the second snap recess to prevent movement of the second component from the unlocked position.

[0072] The method may include a first snap recess and a second snap recess being located on the locking device.

[0073] The method may include a first snap recess and a second snap recess being located on the second portion.

[0074] The method may include that the first component includes a backplate and a signal distribution plate, wherein a portion of the signal distribution plate is located between the backplate and the second component, the signal distribution plate has an opening, a connecting portion is inserted through the opening, the opening has a first dimension on an axis toward a center point of the signal distribution plate, the first dimension is larger than a second dimension transverse to the axis, the connecting portion has a first portion, the first portion is smaller than the first dimension in the direction of the axis to allow the signal distribution plate and the backplate to thermally expand relative to each other, and the size of the first portion is designed to be slidably fitted within the second dimension of the opening to prevent the signal distribution plate from moving relative to the backplate in a direction transverse to the axis.

[0075] The method may include a connecting portion having a second portion having a first thickness and a second thickness transverse to the first thickness, the first thickness being fitable through the opening in an axial direction during the insertion, and the first thickness being greater than a second dimension of the opening, the second thickness being fitable through the second dimension of the opening during the insertion.

[0076] The method may include that the latch system may include a second latch assembly, each corresponding latch assembly having: a first portion engaged with the first component, a second portion engaged with the second component, a connecting portion having opposite ends respectively fixed to the first portion and the second portion to form a locking device, and an engaging mechanism, which is connected to the locking device and is operable to move the locking device between a locked position and an unlocked position, in which the locking device keeps the first component and the second component locked in the closed position, and in the unlocked position, the locking device allows the first component and the second component to move from a closed relationship to a spaced relationship.

[0077] The method may include the first latch assembly and the second latch assembly having respective second portions on different sides of the second component.

[0078] The method may include a differential pressure cavity seal surrounding the contacts and the terminals.

[0079] The method may include securing the differential pressure chamber seal to the first component when the first component and the second component are separated.

[0080] The method may include creating a differential pressure chamber seal with a lip seal.

[0081] The method may include, the pressure reducing valve being a pressure reducing check valve, a vacuum relief passage being formed through a component having the pressure reducing check valve, the vacuum relief passage having an inlet opening at the pressure differential chamber and an outlet opening outside the pressure differential chamber, and also including opening a second valve, which is a vacuum relief valve connected to the vacuum relief passage, to allow air to enter the pressure differential chamber.

[0082] The method may include the fixed structure comprising a thermal chuck and the second part of the moveable support structure comprising a thin chuck.

[0083] The method may include that the substrate is a wafer having a plurality of microelectronic circuits.

[0084] The method may include that the contacts are pins, each pin having a spring, and when the corresponding contact is pressed by a corresponding one of the terminals, the spring is pressed against its spring force.

[0085] The present invention also provides a microelectronic circuit test package, which includes a movable support structure, the movable support structure including a first component and a second component for holding a substrate therebetween, the substrate carrying a microelectronic circuit and having a plurality of terminals connected to the microelectronic circuit, a plurality of contacts on the second component, the contacts matching the terminals to contact the terminals, a pressure differential cavity seal between the first component and the second component, the pressure differential cavity seal forming a closed pressure differential cavity together with surfaces of the first component and the second component, a decompression channel formed through one of the first component and the second component, the decompression channel having an inlet opening at the pressure differential cavity and a pressure differential cavity outside the pressure differential cavity an outlet opening, a pressure relief valve connected to the pressure relief passage, opening of the pressure relief valve allowing air to leave the pressure differential chamber to move the first component and the second component toward each other to ensure proper contact between the contact and the terminal, and closing of the pressure relief valve to prevent air from entering the pressure differential chamber, a first interface on the movable support structure and connected to the contact, a second interface connected to the fixed structure when the movable support structure is removably held by the fixed structure, a pressure sensor positioned to detect pressure in the pressure differential chamber, and an electronic pressure sensor interface connected to the pressure sensor to communicate pressure with an electronic tester.

[0086] The microelectronic circuit test package may include a pressure sensor positioned remote from the differential pressure cavity, and a pressure sensing channel connecting the differential pressure cavity with the pressure sensor.

[0087] The microelectronic circuit testing package may include a reduced pressure passage formed in the first component.

[0088] The microelectronic circuit test package may include a first component including a backplate and a signal distribution board, wherein a portion of the signal distribution board is located between the backplate and the second component, wherein a pressure sensing channel is formed in the backplate.

[0089] The microelectronic circuit test package may include a pressure sensing channel formed through a signal distribution board.

[0090] The microelectronic circuit test package may include a pressure sensor secured to a movable support structure.

[0091] The microelectronic circuit test package may include a differential pressure chamber seal secured to the first component when the first component and the second component are separated.

[0092] The microelectronic circuit test package may include that the differential pressure chamber seal is a lip seal.

[0093] The microelectronic circuit test package may include a pressure relief valve that is a pressure relief check valve, a vacuum relief passage formed through a component having the pressure relief check valve, the vacuum relief passage having an inlet opening at a pressure differential chamber and an outlet opening outside the pressure differential chamber, and a second valve that is a vacuum relief valve connected to the vacuum relief passage, the opening of the vacuum relief valve allowing air to enter the pressure differential chamber, and the closing of the vacuum relief valve preventing air from escaping from the pressure differential chamber.

[0094] The microelectronic circuit test package may include that the substrate is a wafer having a plurality of microelectronic circuits.

[0095] The microelectronic circuit test package may include that the contacts are pins, each pin having a spring that is pressed against its spring force when the corresponding contact is pressed by a corresponding one of the terminals.

[0096] The present invention also provides a testing device, comprising: a movable supporting structure, the movable supporting structure comprising a first component and a second component for holding a substrate therebetween, the substrate carrying a microelectronic circuit and having a plurality of terminals connected to the microelectronic circuit; a plurality of contacts on the second component, the contacts matching the terminals to contact the terminals; a pressure differential chamber seal between the first component and the second component, the pressure differential chamber seal forming a closed pressure differential chamber together with surfaces of the first component and the second component; a pressure relief passage formed through one of the first component and the second component, the pressure relief passage having an inlet opening at the pressure differential chamber and an outlet opening outside the pressure differential chamber; a pressure relief valve connected to the pressure relief passage, the opening of the pressure relief valve allowing air to flow out of the pressure differential chamber a pressure sensor positioned to detect pressure in the pressure differential chamber, and a pressure monitoring system including an electronic pressure sensor interface connected to the pressure sensor to communicate pressure with the electronic tester.

[0097] The test device may include a pressure sensor located remote from the differential pressure chamber, and a pressure sensing channel connecting the differential pressure chamber with the pressure sensor.

[0098] The testing device may include that the pressure relief passage is formed in the first component.

[0099] The testing device may include a first component including a back plate and a signal distribution board, wherein a portion of the signal distribution board is located between the back plate and the second component, wherein the pressure sensing channel is formed in the back plate.

[0100] The testing device may include a pressure sensing channel formed through the signal distribution board.

[0101] The test apparatus may include a pressure sensor secured to a movable support structure.

[0102] The test device may include a pressure monitoring system that may include an electronic pressure connector interface on the fixed structure, the electronic pressure sensor interface releasably contacting the electronic pressure connector interface to communicate pressure with the electronic tester.

[0103] The test device may include an electronic pressure sensor interface including at least a first contact, and a pressure monitoring system including at least a first terminal, wherein the first contact mates with the first terminal when the movable support structure is received by the fixed structure, and the first contact disengages from the first terminal when the movable support structure is removed from the fixed structure.

[0104] The test device may include that the electronic pressure sensor interface is in a printed circuit board having a substrate, and the first contact is formed on the substrate.

[0105] The test device may include that the electronic pressure sensor interface includes at least a second contact, and the pressure monitoring system includes at least a second terminal, wherein the second contact engages with the second terminal when the movable support structure is received by the fixed structure, and the second contact disengages from the second terminal when the movable support structure is removed from the fixed structure.

[0106] The test device may include a differential pressure chamber seal surrounding the contacts and the terminals.

[0107] The test device may include the differential pressure chamber seal being secured to the first component when the first component and the second component are separated.

[0108] The test device may include that the differential pressure chamber seal is a lip seal.

[0109] The test device pressure reducing valve is a pressure reducing check valve, a vacuum relief channel is formed through a component having the pressure reducing check valve, the vacuum relief channel having an inlet opening at the pressure differential chamber and an outlet opening outside the pressure differential chamber, the test device also includes a second valve, which is a vacuum relief valve connected to the vacuum relief channel, the opening of the vacuum relief valve allows air to enter the pressure differential chamber and the closing of the vacuum relief valve prevents air from escaping from the pressure differential chamber.

[0110] The test apparatus may include the fixed structure including a thermal chuck, the second part of the movable support structure including a thin chuck, the thin chuck in contact with the thermal chuck to allow heat to be transferred between the movable support structure and the thermal chuck.

[0111] The test device may include a substrate being a wafer having a plurality of microelectronic circuits.

[0112] The test device may include that the contacts are pins, each pin having a spring, and when the corresponding contact is pressed by a corresponding one of the terminals, the spring is pressed against its spring force.

[0113] The present invention also provides a method for testing a microelectronic circuit held by a substrate, comprising holding the substrate between a first component and a second component of a movable support structure, the second component having contacts that abut against terminals of the substrate connected to the microelectronic circuit, wherein a pressure relief channel is formed through one of the first component and the second component, the pressure relief channel having an inlet opening at a pressure differential chamber and an outlet opening outside the pressure differential chamber, positioning a pressure differential chamber seal between the first component and the second component to form a closed chamber by surfaces of the first component and the second component and the pressure differential chamber seal, opening a pressure relief valve to allow air to leave the pressure differential chamber and reduce the pressure within the pressure differential chamber to move the first component and the second component toward each other to ensure proper contact between the contacts and the terminals, closing the pressure relief valve to prevent air from entering the pressure differential chamber, receiving the movable support structure through a fixed structure, wherein a first interface on the movable support structure is connected to a second interface on the fixed structure, transmitting signals between an electronic tester and the microelectronic circuit through the terminals, the contacts, and the first and second interfaces to test the microelectronic circuit, detecting the pressure in the pressure differential chamber of a pressure monitoring system and communicating the pressure to the electronic tester.

[0114] The method may include positioning a pressure sensor remote from the differential pressure chamber, and a pressure sensing passage connecting the differential pressure chamber with the pressure sensor.

[0115] The method may include forming a pressure relief passage in the first component.

[0116] The method may include a first component including a back plate and a signal distribution plate, wherein a portion of the signal distribution plate is located between the back plate and the second component, wherein a pressure sensing channel is formed in the back plate.

[0117] The method may include forming a pressure sensing channel through a signal distribution plate.

[0118] The method may include securing a pressure sensor to a movable support structure.

[0119] The method may include that the pressure monitoring system may include an electronic pressure connector interface on the fixed structure, the electronic pressure sensor interface releasably contacting the electronic pressure connector interface to communicate pressure with the electronic tester.

[0120] The method may include an electronic pressure sensor interface including at least a first contact and a pressure monitoring system including at least a first terminal, wherein the first contact engages with the first terminal when the movable support structure is received by the fixed structure and the first contact disengages from the first terminal when the movable support structure is removed from the fixed structure.

[0121] The method may include interfacing the electronic pressure sensor in a printed circuit board having a substrate, with the first contact formed on the substrate.

[0122] The method may include the electronic pressure sensor interface including at least a second contact and the pressure monitoring system including at least a second terminal, wherein the second contact engages with the second terminal when the movable support structure is received by the fixed structure and the second contact disengages from the second terminal when the movable support structure is removed from the fixed structure.

[0123] The method may include a differential pressure cavity seal surrounding the contacts and the terminals.

[0124] The method may include securing the differential pressure chamber seal to the first component when the first component and the second component are separated.

[0125] The method may include creating a differential pressure chamber seal with a lip seal.

[0126] The method may include, the pressure reducing valve being a pressure reducing check valve, a vacuum relief passage being formed through a component having the pressure reducing check valve, the vacuum relief passage having an inlet opening at the pressure differential chamber and an outlet opening outside the pressure differential chamber, and also including opening a second valve, which is a vacuum relief valve connected to the vacuum relief passage, to allow air to enter the pressure differential chamber.

[0127] The method may include the fixed structure comprising a thermal chuck and the second part of the moveable support structure comprising a thin chuck.

[0128] The method may include that the substrate is a wafer having a plurality of microelectronic circuits.

[0129] The method may include that the contacts are pins, each pin having a spring, and when the corresponding contact is pressed by a corresponding one of the terminals, the spring is pressed against its spring force. BRIEF DESCRIPTION OF THE DRAWINGS

[0130] The present invention will be further described by way of example with reference to the accompanying drawings, in which:

[0131] Figure 1 is a cross-sectional side view of a test device having a slot assembly according to one embodiment of the present invention;

[0132] Figure 2 is along Figure 1 A cross-sectional side view of the test device along line 2-2 in FIG.

[0133] Figure 3 is along Figure 1 A cross-sectional side view of the test device along line 3-3 in FIG.

[0134] Figure 4 is along Figure 2 and 3 A cross-sectional side view of the test device along line 4-4;

[0135] Figure 5A , 5B and 5C is a perspective view of the test apparatus showing the removable wafer package being inserted into or removed from an oven defined by a frame;

[0136] Figure 6 is a timing diagram showing how one die package can be inserted and used to test the electronics of a die and then another die package inserted;

[0137] Figure 7 is a perspective view of a test device showing the insertion or removal of a slot assembly;

[0138] Fig. 8A and 8B It is shown in about Figure 1-7 A cross-sectional side view of a wafer package configuration used in the described configuration;

[0139] Fig. 9A , 9B and 10 are side views showing an apparatus for inserting and removing a removable wafer package into and from an oven;

[0140] Fig.11 is a perspective view of the first chip package as viewed from above;

[0141] Fig.12 is a perspective view of the first chip package as viewed from below;

[0142] Fig.13 is the first chip package along Fig.11 and 12 The cross-sectional view of 13-13;

[0143] Fig.14 is the first chip package along Fig.13 The cross-sectional view of 14-14;

[0144] Fig.15 is the first chip package along Fig.12 The cross-sectional view of 15-15;

[0145] Fig.16 is along Fig.15 A view in the direction of arrow A in FIG. 1 with parts thereof removed;

[0146] Fig.17 yes Fig.15 Sectional view of 17-17;

[0147] Figure 18a(i) and 18a(ii) yes Fig.15 A view in the direction of arrows A and B, wherein the latch mechanism is in an unlocked configuration;

[0148] Figure 18b(i) and 18b(ii) is with Figure 18a(i) and 18a(ii) a similar view with the latch mechanism in the locked position;

[0149] Fig.19 is a perspective view showing how to use shims to set the height of the tabs of the latch mechanism;

[0150] Fig. 20 is a perspective view of components of a pressure monitoring system;

[0151] Fig.21 is a three-dimensional diagram of other components of the pressure monitoring system;

[0152] Fig.22a and 22b are perspective and side views of components of a pressure monitoring system prior to engagement; and

[0153] Fig.23a and 23b is with Fig.22a and 22b A similar view of the components of a pressure monitoring system after engagement. DETAILED DESCRIPTION

[0154] In the attached figure Figure 1A test device 10 according to an embodiment of the present invention is shown, which includes (i) a fixed structure, the fixed structure includes a tester 12, a frame 14, a power bus 16, a first and a second slot assembly 18A and 18B, a tester cable 20, a power cable 22, a cold liquid supply line 24A, a cold liquid return line 24B, a control liquid supply line 24C, a control liquid return line 24D, a vacuum line 24E, (ii) a movable device, the movable device includes a first and a second chip package 28A and 28B, and (iii) a first and a second chip 30A and 30B. The first and second chip packages 28A and 28B are described herein as "chip packages", and their use is described as being used to test chips. It should be understood that the first and second chips 28A and 28B can generally be used to test microelectronic circuits and can be classified as "first and second microelectronic circuit test packages 28A and 28B".

[0155] The slot assembly 18A includes a slot assembly body 32, a heat chuck 34, a temperature detector 36, a temperature changing device in the form of a heating resistor 38, a first slot assembly interface 40, and a plurality of second slot assembly interfaces, including a control interface 44, a power interface 46, a cold liquid supply interface 48A, a cold liquid return interface 48B, a control liquid supply interface 48C, a control liquid return interface 48D, and a vacuum interface 48E.

[0156] The first slot assembly interface 40 is located within the slot assembly body 32 and mounted to the slot assembly body 32. A control interface 44, a power interface 46 and a second interface in the form of interfaces 48A to 48E are mounted in the left wall of the slot assembly body 32.

[0157] The slot assembly 18A can be inserted into the frame 14 from left to right and can be removed from the frame 14 from right to left. The tester cable 20, the power cable 22, and the lines 24A to 24E are manually connected to the control interface 44, the power interface 46, and the interfaces 48A to 48E, respectively. Before removing the slot assembly 18A from the frame 14, the tester cable 20, the power cable 22, and the lines 24A to 24E are first manually disconnected from the control interface 44, the power interface 46, and the interfaces 48A to 48E, respectively.

[0158] The slot assembly 18A includes a main board 60 with test electronics, a plurality of channel module boards 62 with test electronics, a flexible connector 64, and a connection board 66. The control interface 44 and the power interface 46 are connected to the main board 60, and the thermal controller 50 is mounted to the main board 60. The channel module board 62 is electrically connected to the main board 60. The flexible connector 64 connects the channel module board 62 to the connection board 66. Control functions are provided by electrical conductors connecting the control interface 44 to the main board 60. Power is provided to the main board 60 through the power interface 46. Both power and control are provided from the main board 60 to the channel module board 62 through conductors. The flexible connector 64 provides conductors connecting the channel module board 62 to the connection board 66. The connection board 66 includes conductors connecting the flexible connector 64 to the first slot assembly interface 40. The first slot assembly interface 40 is thus connected to the control interface 44 and the power interface 46 through various conductors, so that power and control can be provided to the first slot assembly interface 40 through the control interface 44 and the power interface 46.

[0159] The second slot assembly 18B includes similar components to the first slot assembly 18A, and like reference numerals denote like components. The second slot assembly 18B is inserted into the frame 14, and the control interface 44, power interface 46, and interfaces 48A to 48E of the second slot assembly 18B are respectively manually connected to a separate set of connection components, which includes a separate tester cable 20, a separate power cable 22, and separate lines 24A to 24E.

[0160] Wafer package 28A includes a wafer package body formed by a thin chuck 72 and a back plate 74. Wafer 30A has a plurality of microelectronic devices formed therein. Wafer 30A is inserted into the wafer package body between thin chuck 72 and back plate 74. Wafer package contacts 76 contact corresponding contacts (not shown) on wafer 30A. Wafer package 28A also includes a wafer package interface 78 located on back plate 74. Conductors in back plate 74 connect wafer package interface 78 to wafer package contacts 76.

[0161] Wafer package 28A has a lip seal 77 (also referred to herein as a "differential pressure chamber seal") connected between back plate 74 and thin chuck 72. A vacuum is applied to the area defined by lip seal 77, back plate 74, and thin chuck 72. The vacuum holds wafer package 28A together and ensures proper contact between wafer package contacts 76 and contacts on wafer 30A.

[0162] Temperature detector 36 is located in thermal chuck 34 and thus close enough to wafer 30A to detect the temperature of wafer 30A to within five degrees Celsius, preferably within one or two degrees Celsius.

[0163] The slot assembly 18A also has a door 82 that is connected to the slot assembly body 32 by a hinge 84. When the door 82 is rotated to the open position, the wafer package 28A can be inserted into the slot assembly body 32 through the door opening 86. The wafer package 28A is then lowered onto the thermal chuck 34 and the door 82 is closed. The thermal chuck 34 is mounted to the slot assembly body 32. The thermal chuck 34 then essentially forms a holder with a wafer test station.

[0164] The slot assembly 18A also has a thermal interface cavity seal 88 located between the thermal chuck 34 and the thin chuck 72. A vacuum is applied to the area defined by the thermal interface cavity seal 88, the thermal chuck 34, and the thin chuck 72 through the vacuum port 48E and the vacuum line 90. Thus, a good thermal connection is provided between the thermal chuck 34 and the thin chuck 72. When the heating resistor 38 generates heat, the heat is conducted through the thermal chuck 34 and the thin chuck 72 to the wafer 30A. When the thermal chuck 34 is at a lower temperature than the wafer 30A, the heat is conducted in the opposite direction.

[0165] The wafer package interface 78 is coupled to the first slot assembly interface 40. Power and signals are provided to the wafer 30A through the first slot assembly interface 40, the wafer package interface 78, and the wafer package contacts 76. The performance of the devices in the wafer 30A is measured through the wafer package contacts 76, the wafer package interface 78, and the first slot assembly interface 40.

[0166] The door 82 of the slot assembly 18B is shown in a closed position. A front seal 100 is mounted on the upper surface of the slot assembly 18A and seals with the lower surface of the slot assembly 18B. A front seal 102 is mounted to the upper surface of the slot assembly 18B and seals with the lower surface of the frame 14. A continuous sealed front wall 104 is provided by the doors 82 of the slot assemblies 18A and 18B and the front seals 100 and 102.

[0167] The slot assembly 18A also includes a thermal controller 50. The temperature detector 36 is connected to the thermal controller 50 through a temperature feedback line 52. Power is supplied to the heating resistor 38 through the power interface 46 and the power line 54, so that the heating resistor 38 becomes hot. Then, the heating resistor 38 heats the thermal chuck 34 and the wafer 30A on the thermal chuck 34, and the heating resistor 38 is controlled by the thermal controller 50 based on the temperature detected by the temperature detector 36.

[0168] The thermal chuck 34 has a thermal fluid channel 224 formed therein. The thermal fluid channel 224 holds a thermal fluid. The thermal fluid is preferably a liquid rather than a gas because liquids are incompressible and heat convects to or from the liquid more quickly. Different thermal fluids are used for different applications, with oil being used for the highest temperature applications.

[0169] Controlled liquid supply and return lines 226 and 228 connect opposite ends of the hot fluid channel 224 to cold liquid supply and return interfaces 48C and 48D, respectively. The heating resistor 38 acts as a heater, which is mounted at a location that heats the thermal chuck 34, thereby heating the hot fluid. By recirculating the hot fluid through the hot fluid channel 224, the hot chuck 222 provides a more uniform heat distribution to the hot chuck 34, and ultimately to the wafer 30A. The temperature of the fluid can also be controlled to heat or cool the hot chuck 34.

[0170] The test apparatus 10 also includes a cooling system 240, a temperature control system 242, and a vacuum pump 244. The two cold liquid supply lines 24A connected to the first and second slot assemblies 18A and 18B are also connected to the cooling system 240 through a manifold (not shown). An additional manifold connects the cold liquid return line 24B to the cooling system 240, the control liquid supply line 24C to the temperature control system 242, the control liquid return line 24D to the temperature control system 242, and the vacuum line 24E to the vacuum pump 244. Each slot assembly 18A or 18B has a respective cooling plate 246 having respective fluid channels 248. The cooling system 240 circulates a fluid through the fluid channels 248 to cool the cooling plates 246. The cooling plates 246 then keep the channel module plates 62 cool. Temperature control system 242 circulates fluid through thermal fluid channel 224 to control the temperature of thermal chuck 34 and transfer heat to or from wafers 30A and 30B. Vacuum pump 244 provides air under vacuum pressure to vacuum line 90.

[0171] The slot assembly 18A includes a separator seal 108 mounted to the upper surface of the slot assembly body 32 and above its inner wall 106. The separator seal 108 seals with the lower surface of the slot assembly 18B. The slot assembly 18B has a separator seal 110 mounted to the upper surface of its slot assembly body 32. The separator seal 108 seals with the lower surface of the frame 14. A continuous sealed separator wall 112 is provided by the inner walls 106 of the slot assemblies 18A and 18B and the separator seals 108 and 110.

[0172] Figure 2 Shows Figure 1 2-2 of the test device 10. The frame 14 defines a first closed-loop air path 120. Air inlet and outlet openings (not shown) can be opened to change the first closed-loop air path 120 to an open air path, in which air at room temperature passes through the frame 14 without being recirculated. The closed-loop path is particularly useful in a clean room environment because it causes less particulate material to be released into the air.

[0173] The testing device 10 also includes a temperature changing device in the form of a first fan 122 , a first fan motor 124 , and a water cooler 126 .

[0174] The first fan 122 and the first fan motor 124 are mounted at an upper portion of the first closed-loop air path 120. The water cooler 126 is mounted to the frame 14 within the upper portion of the first closed-loop air path 120.

[0175] The wafer packages 28A and 28B are positioned with the slot assemblies 18A and 18B and are located within the lower portion of the first closed-loop air path 120 .

[0176] In use, current is provided to the first fan motor 124. The first fan motor 124 rotates the first fan 122. The first fan 122 circulates air through the first closed-loop air path 120 in a clockwise direction.

[0177] The water cooler 126 then cools the air in the first closed-loop air path 120. The air then flows through the slot assemblies 18A and 18B located above the wafer package 28A or 28B. The air then cools the wafer package 28A or 28B by convection.

[0178] Figure 3 Shows Figure 1 The test device 10 shown in Figure 3-3. The frame 14 defines a second closed-loop air path 150. The test device 10 also includes a second fan 152, a second fan motor 154 and a temperature change device in the form of a water cooler 156. Figure 2 No electric heater or damper is provided. The air inlet and outlet openings (not shown) may be opened to convert the second closed-loop air path 150 into an open air path where air at room temperature passes through the frame 14 without being recirculated.

[0179] The closed loop path is particularly useful in a clean room environment because it results in less particulate material being released into the air. The second fan 152 and the second fan motor 154 are located in the upper portion of the second closed loop air path 150. The water cooler 156 is located slightly downstream of the second fan 152 within the second closed loop air path 150. The main plate 60 and the channel module plate 62 that form part of the slot assemblies 18A and 18B are located in the lower half of the second closed loop air path 150.

[0180] In use, current is supplied to the second fan motor 154, which rotates the second fan 152. The second fan 152 then recirculates the air in a clockwise direction through the second closed-loop air path 150. The air is cooled by the water cooler 156. The cooled air then passes through the main board 60 and the channel module board 62, so that heat is transferred from the main board 60 and the channel module board 62 to the air by convection.

[0181] Figure 1 The continuous sealing separation wall 112 shown makes Figure 2 The air recirculated through the first closed-loop air path 120 is Figure 3 The air in the second closed-loop air path 150 remains isolated. Figure 1 The illustrated continuous sealed front wall 104 prevents air from escaping from the first closed loop air path 120 .

[0182] like Figure 2 and 3 As shown, Figure 1 The same cooling system 240 used in is also used to cool the water cooler 126. Figure 4 As shown, a plenum 160 separates the first closed loop air path 120 from the second closed loop air path 150 in all areas except those areas provided by the continuous sealed separation wall 112. The frame 14 has left and right walls 162, 164 that further define the closed loop air paths 120 and 150.

[0183] Figure 5A , 5B 5C show how die packages 30C, 30D, and 30E may be inserted or removed at any time while all other die packages are used to test devices of the die and may be placed in various temperature ramp states. Figure 6 The concept is shown in more detail. At time T1, the first chip package is inserted into the frame 14, while the second chip package is located outside the frame 14. At time T1, the first chip package is heated. Between T1 and T2, the temperature of the first chip package increases from room temperature, i.e., about 22°C, to a test temperature that is 50°C to 150°C higher than the room temperature at T2. At T2, power is applied to the first chip package, and the device in the first chip package is tested. At T3, the second chip package is inserted into the frame 14, and heating of the second chip package is started. At T4, the test of the first chip package is terminated. At T4, cooling of the first chip package is also started. At T5, the second chip package reaches the test temperature, and power is provided to the second chip package, and the chip in the second chip package is tested. At T6, the second chip package reaches a temperature close to room temperature and is removed from the frame 14. Then, a third chip package can be inserted to replace the first chip package. At T7, the test of the second chip package is terminated, and its cooling is started. At T8, the second chip package has cooled to room temperature or close to room temperature and is removed from the frame 14.

[0184] Different tests can be performed at different temperatures. For example, a wafer package can be inserted and tested at room temperature. Another test can be performed during the temperature increase. A further test can be performed at an elevated temperature. A further test can be performed during the temperature decrease. Two of these tests can be a single test that is run from one temperature stage to the next.

[0185] like Figure 7 As shown, one slot assembly 18A can be removed or inserted into the frame 14. The slot assembly 18A can be inserted or removed while other slot assemblies in the frame 14 are used to test devices on the wafer, as shown in FIG. Figure 6 described.

[0186] like Fig. 8A As shown, a signal distribution board 500, a contactor 502, a plurality of pins 504, a contactor clamping ring 506, a fastener 508, and a post 510 are further shown.

[0187] The signal distribution board 500 is mainly made of an insulating material and has a circuit (not shown) formed therein. Contacts 512 are formed on a lower side 514 of the signal distribution board 500. Threaded openings 516 are formed in the lower side 514.

[0188] The contactor 502 has a plurality of pin openings 518, post openings 520, and fastener openings 522 formed through the contactor from an upper side 524 to a lower side 526. Each pin opening 518 has a first portion 528 and a second portion 530. When viewed in plan, the first and second portions 528 and 530 are both circular. The first portion 528 has a larger diameter than the second portion 530. When viewed in plan, the first portion 528 has a larger diameter than the second portion 530. Fig. 8A When viewed in a cross-sectional side view of , the diameter of the first portion 528 is greater than the diameter of the second portion 530 resulting in the first portion 528 being wider than the second portion 530 .

[0189] The column opening 520 has a first portion 534 and a second portion 536. When viewed in plan, the first portion 534 and the second portion 536 are both circular. The diameter of the first portion 534 is greater than the diameter of the second portion 536. Because the diameter of the first portion 534 is greater than the diameter of the second portion 536, when Fig. 8A When viewed in a cross-sectional side view of the first portion 534, the first portion 534 is wider than the second portion 536. The first and second portions 534 and 536 have vertical side walls. A horizontal platform 538 connects the vertical side walls of the first and second portions 534 and 536.

[0190] Each pin 504 includes a conductive holder portion 542, a coil spring 544, and first and second end pieces 546 and 548. The first end piece 546 has a first inner portion 550 and a first end 552. The second end piece 548 has a second inner portion 554 and a second end 556. The coil spring 544 and the first and second inner portions 550 and 554 are held by the holder portion 542, wherein the coil spring 544 is located between the first and second inner portions 550 and 554. The first and second ends 552 and 556 protrude from the upper and lower ends of the holder portion 542, respectively.

[0191] The upper surface of the first end 552 forms a terminal 560. The lower end of the second end 556 forms a contact 562. The coil spring 544 and the first and second end pieces 546 and 548 are made of metal and are therefore made of conductive material. The coil spring 544 and the first and second end pieces 546 and 548 form a conductor capable of conducting current between the terminal 560 and the contact 562.

[0192] The corresponding pins are inserted into the corresponding pin openings 518 through the upper side 524. The second end 556 is slightly smaller than the second portion 530 so that it passes through the second portion 530 and protrudes from the lower side 526. The retainer portion 542 is slightly narrower than the first portion 528, but wider than the second portion 530 to prevent the pins 504 from falling out of the lower side 526. When the pins 504 are fully inserted into the pin openings 518, and before the contactor 502 is mounted to the signal distribution board 500, the first end 552 still protrudes above the upper side 524 of the contactor 502.

[0193] Post 510 has a support 564, a force transfer portion 566, and a force transmission portion 568. Post 510 is made from a single piece of metal or other material selected for its strength compared to the strength and brittleness of the ceramic material of contactor 502.

[0194] The post 510 is inserted into the post opening 520 through the upper side 524. The support 564 and the force transfer portion 566 are slightly narrower than the second portion 536. The force transfer portion 568 is slightly narrower than the first portion 534, but wider than the second portion 536. The lower surface 570 of the force transfer portion 568 abuts against the platform 538. The post 510 is thereby prevented from falling off the lower side 526.

[0195] The column 510 has a surface 572. Fig. 8A When fully inserted as shown, surface 572 is in a plane parallel to and below the surface of lower side 526. When post 510 is fully inserted, force transfer portion 568 has a surface 574 that is in the same plane as upper side 524.

[0196] The signal distribution board 500 is positioned on top of the contactor 502. Each contact 512 contacts a corresponding one of the terminals 560. Because the terminals 560 are located in a plane above the plane of the upper side 524, the lower side 514 is initially spaced apart from the upper side 524.

[0197] The fastener 508 has a threaded shaft 578 and a head 580. The contactor clamping ring 506 has a ring opening 582. The contactor clamping ring 506 is located on the lower surface 584 of the contactor 502. The threaded shaft 578 is inserted from the bottom through the ring opening 582 and then through the fastener opening 522. The head 580 contacts the lower surface of the contactor clamping ring 506. The head 580 is then rotated so that the threads on the threaded shaft 578 are screwed into the threads on the threaded opening 516. The threading action moves the signal distribution board 500 closer to the contactor 502 and the contactor clamping ring 506. The lower side 514 eventually contacts the upper side 524. The contact 512 moves the first end piece 546 downward into the pin opening 518 until the terminal 560 is in the same plane as the upper side 524. The coil spring 544 is compressed and thus slightly deformed to allow the first end piece 546 to move relatively toward the second end piece 548.

[0198] The underside 514 has a portion that rests against a surface 574 that forms part of the post 510. Because the post 510 abuts the signal distribution board 500, the post 510 is in a position to transfer force to the signal distribution board 500 through the surface 572.

[0199] The first wafer 32A has a plurality of electronic devices formed therein. Each electronic device has a plurality of terminals 588 at the upper surface 590 of the first wafer 32A. When the back plate 74 and the first wafer 32A are put together, the first wafer 32A is aligned with the back plate 74 to ensure that each terminal 588 contacts a corresponding one of the contacts 562.

[0200] A vacuum pressure is created in the area between the upper surface 590 and the underside 526 while the pressure below the lower surface 592 of the thin chuck 72 and the upper surface 594 of the signal distribution plate 500 remains at atmospheric pressure. The pressure differential creates equal and opposite forces F1 and F2 on the signal distribution plate 500 and the thin chuck 72.

[0201] like Figure 8BAs shown, forces F1 and F2 cause the back plate 74 to move relatively toward the first wafer 32A and the thin chuck 72. The coil spring 544 compresses more to allow the second end piece 548 to move into the pin opening 518. Each coil spring 544 is deformed to overcome its spring force, such as F3. However, force F1 is still greater than the sum of all forces F3 added together. The upper surface 590 eventually abuts against the surface 572 of the support 564. Because the column 510 is close to the signal distribution board 500, the support 564 prevents the upper surface 590 from moving close to and contacting the lower side 526 of the contactor 502. The first wafer 32A transfers force F4 to the support 564. The force transfer portion 566 transfers force F4 through the second portion 536 of the column opening 520. The force transmission portion 568 receives force F4 from the force transfer portion 566 and transmits force F4 to the signal distribution board 500 via the surface 574.

[0202] Thus, it can be seen that force F4 is not carried by contact 502, thereby preventing stress that could damage the brittle ceramic material of contact 502. Instead, force F4 is transmitted directly from the electronic devices in the form of first wafer 32A through posts 510 to signal distribution board 500.

[0203] exist Fig. 8A and 8B In the illustrated embodiment, the contactor 502 is used as a support plate having a column opening 520 passing therethrough. The signal distribution board 500 is used as a backing structure on a first side of the support board and includes at least a circuit board having a contact 512. The pin 504 is used as a conductor having a contact 562 to contact a terminal 588 on an electronic device located on a second side of the support board, the second side being opposite to the first side of the support board. The retainer portion 542 is used as a portion of the conductor held by the support board. The conductor also has a terminal 560 connected to the contact 512 on the signal distribution board 500. A spring in the form of a coil spring 544 is provided. The thin chuck 72 is used as a force generating device on one side of the electronic device in the form of a first wafer 32A opposite to the support board. The force generating device and the support board can be moved relative to each other to move the electronic device closer to the support board and deform the spring. The post 510 has a support 564 having a surface 572 in a plane spaced apart from the plane of the surface of the support plate to prevent the electronic device from moving closer to the support plate; a force transfer portion 566 extending at least partially from the support 564 through the post opening 520; and a force transfer portion 568 extending from the force transfer portion 566, the force transfer portion 568 being held by a backing structure.

[0204] Fig. 9A A portion of the testing apparatus 10 is shown for inserting and removing wafer packages into each slot assembly, such as the slot assembly 18A. Fig. 9AThe components of the testing apparatus 10 shown are components of a fixed structure, including a frame 300 , a portion of the first slot assembly 18A, a first slot assembly interface 40 , a retaining structure 302 , a horizontal transport 304 , a vertical transport 306 , a pusher blade 308 , and a locking mechanism 310 .

[0205] The frame 300 includes a first mounting member 312 and a second mounting member 314 spaced apart from each other. The horizontal conveyor 304 is a slide mounted between the first and second mounting members 312 and 314. The retaining structure 302 is mounted for sliding movement along the horizontal conveyor 304. Opposite ends of the pusher blade 308 are mounted to the first and second mounting members 312 and 314, respectively.

[0206] The locking mechanism 310 includes a connecting rod 316, a control rod 318, and a pressure rod 320. The control rod 318 is mounted to the first mounting member 312 on a pivot connection 322. The vertical transport device 306 is a rigid beam. The connecting member 324 connects the center points of the vertical transport device 306 and the pusher blade 308 to each other. The pressure rod 320 has a first connecting rod 326 rotatably connected to the control rod 318 and a second connecting rod 328 rotatably connected to one end of the vertical transport device 306. Fig. 9A In the unlocked configuration shown, a line 330 connects the pivot connection 322 with the second link 328 , and the first link 326 is to the left of the line 330 .

[0207] In use, the first wafer package 28A is positioned on the holding structure 302. The first wafer package 28A is then moved from left to right into the first slot assembly 18A together with the holding structure 302. The placement and movement of the first wafer package 28A may be performed manually or may be performed using a robot.

[0208] The holding structure 302 slides along the horizontal conveyor 304. The connecting rod 316 connects one end of the control rod 318 to the holding structure 302. When the holding structure 302 moves in the horizontal direction along the horizontal conveyor 304, the connecting rod 316 rotates the control rod 318 about the pivot connection 322 in the counterclockwise direction.

[0209] The first link 326 rotates in a counterclockwise direction with the control rod 318. The pressure rod 320 converts the movement of the first link 326 into a downward movement of the second link 328. At first, the downward movement is minimal, but when the first wafer package 28A is fully inserted into the first slot assembly 18A, the vertical movement becomes more significant and the vertical transport device 306 engages the first wafer package 28A with the first slot assembly 18A. The horizontal transport device 304 is thus operable to horizontally move the first wafer package 28A from a first position to a second position into the first slot assembly 18A, and the vertical transport device 306 is operable to move the first wafer package 28A and the first slot assembly 18A relative to each other in a first vertical direction so that the slot assembly interface 40 engages the wafer package interface on the first wafer package 28A.

[0210] exist Fig. 9A , the lever 318 is shown in an unlocked position, wherein the first link 326 is located on a first side of a line 330 connecting the pivot connection 322 and the second link 328. Fig. 9A The unlocked position shown rotates through a compressed position in which the pusher blade 308 is deformed by the vertical conveyor 306 through the connection 324 by bending the pusher blade 308 against its spring force, and the first link 326 is aligned with the pivot connection 322 and the second link 328. The control lever 318 continues to rotate from the compressed position to the locked position, as shown. Fig. 9B and 10 In the locked position, the first link 326 is to the right of the line 330, and therefore on a second side of the line 330 opposite the first side. Because the first link 326 has passed the line 330 and the pusher blade 308 has been deformed against its spring force, the first wafer package 28A is locked in position against the slot assembly interface 40.

[0211] The system can be unlocked by moving the holding structure 302 from right to left. The control lever 318 is rotated in a clockwise direction and the first link 326 is moved from right to left through the line 330. The vertical transport 306 is moved upward, i.e., in a second vertical direction opposite to the first vertical direction, to release the first wafer package 28A from the slot assembly interface 40. Further movement of the holding structure 302 along the horizontal transport 304 removes the first wafer package.

[0212] Fig.11 and 12 Other components of the first wafer package 28A are shown, including a pressure relief check valve 600, a vacuum relief check valve 602, components of a latch system including first, second, third and fourth latch assemblies 604A to 604D, and an electronic pressure sensor interface 606 forming part of a pressure monitoring system.

[0213] Fig.13 is along Fig.11 and 12 13-13 of . The pressure relief passage 608 is formed in the back plate 74. The pressure relief passage 608 has an outlet opening 610 and an intermediate position 612 located in the same plane. The outlet opening 610 is connected to the pressure relief check valve 600. The intermediate position 612 is closer to the center point of the back plate 74 than the outlet opening 610. The pressure relief passage 608 is formed by first drilling four passages in the back plate 74 and then closing one end of three passages, so that the formed pressure relief passage 608 is completely isolated from the atmospheric pressure outside the back plate 74.

[0214] Fig.14 yes Fig.13 14-14 in the cross-sectional view, the pressure relief passage 608 continues downward from the middle position 612 through the support plate 74 and the signal distribution plate 500. The pressure relief passage 608 has an inlet opening 624 that communicates with the pressure differential chamber 622. The lip seal 77 is located in the groove of the thin chuck 72. The pressure differential chamber 622 is formed by the thin chuck 72 that forms the lower side of the pressure differential chamber 622, the contactor 502, the contactor clamping ring 506 and the signal distribution plate 500 that forms the upper side of the pressure differential chamber 622, and the lip seal 77 that forms the connection between the upper and lower sides of the pressure differential chamber 622. The lip seal 77 is completely circular and completely surrounds the contactor 502 and the wafer located between the contactor 502 and the thin chuck 72.

[0215] Fig.14 The components shown form a movable support structure 626. The movable support structure 626 has a first component 628 including the signal distribution plate 500 and the backing plate 74, and a second component 630 including the thin chuck 72.

[0216] In use, the first component 628 is separated from the second component 630. The wafer is then placed on the thin chuck 72. The first component 628 is then positioned on the second component 630. The upper peripheral edge of the lip seal 77 is in contact with the signal distribution board 500. The wafer is thus held in the movable support structure 626.

[0217] Now combine the reference Fig.13 and 14 , the pump is connected to the pressure reducing check valve 600. The pressure reducing check valve 600 is then opened. The pressure reducing passage 608 may initially be at atmospheric pressure, and the pump subsequently reduces the pressure within the pressure reducing passage 608. The pressure differential chamber 622 is exposed to a pressure lower than atmospheric pressure. The outer surface of the first wafer package 28A is still exposed to atmospheric pressure. Because a pressure differential is created between the pressure differential chamber 622 and the outer surface of the first wafer package 28A, the spring within the contactor 502 is compressed, as shown in FIG. Figure 8BAs described above. The lip seal 77 is made of a resilient elastomeric material that compresses the lip seal against its spring force. Because the lip seal 77 is compressed against its spring force, an improved seal is created between the lip seal 77 and the signal distribution plate 500, so that the pressure within the differential pressure chamber 622 can be maintained. The pressure relief check valve 600 is then closed, thereby isolating the pressure relief passage 608 from the external atmospheric pressure. The pump can then be disconnected from the pressure relief check valve 600.

[0218] The first wafer package 28A with the wafer loaded therein can now be moved around in the manufacturing environment without being connected to a pump or tester. If the wafer needs to be removed later, it can be moved to the Fig.11 and 12 The vacuum release check valve 602 shown applies positive pressure. The vacuum release check valve 602 is spring loaded and requires a predetermined amount of pressure to be applied before it opens. Air can then flow through the vacuum release channel in the back plate 74 to the pressure differential chamber 622 and bring the pressure differential chamber 622 to atmospheric pressure. The first and second components 628 and 630 can then be separated from each other and the wafer can be removed. When a new wafer is loaded into the first wafer package 28A, and when it is necessary to reduce the pressure in the pressure differential chamber 622 using the pressure relief check valve 600, the vacuum release check valve 602 is then closed.

[0219] Fig.15 yes Fig.12 The first latch assembly 604A includes a first portion 640 , a second portion 642 , a connecting portion 644 , an engagement mechanism 646 , a tuning block 648 , a locking nut 650 , a spacer 652A, a washer 652B, and a snap mechanism 654 .

[0220] The first portion 640 and the connecting portion 644 are processed as a single piece and are thus fixed to each other. The first portion 640 has a length 660 and a width 662. In the cross section, only half of the width 662 is shown. The length 660 is greater than the width 662. The length 660 is also greater than the diameter of the connecting portion 644. The first portion 640 has a tool pin opening 664 formed therein.

[0221] The second portion 642 has a body 666 and first and second fins 668A and 668B extending from the body 666. The second portion 642 has a length 670 including the fins 668A and 668B and a width 672. Only half of the width 672 is shown in cross section. Because the first and second fins 668A and 668B form a portion of the length 670 but not a portion of the width 672, the length 670 is much greater than the width 672. The body 666 also has an opening 674 into which the connecting portion 644 can be inserted.

[0222] The connecting portion 644 includes a first portion 678 and a second portion 680. The second portion 680 has external threads formed thereon.

[0223] The engagement mechanism 646 is formed by opposing surfaces that define the width 662 of the first portion 640. The opposing surfaces forming the engagement mechanism 646 are parallel to one another to facilitate engagement of the parallel surfaces on the jaws of a tool that can subsequently rotate the first portion 640.

[0224] The tuning block 648 is mounted to the spacer 652A in a fixed position. The thin chuck 72 includes a metal portion 682 and a protective sheet 684. The protective sheet 684 forms a shoulder 686 on the thin chuck 72. The shim 652B is located between the spacer 652A and the signal distribution board 500. Only a single shim 652B is shown. Additional shims are typically inserted one on top of the other until the leveling surface 690 of the tuning block 648 is at the same vertical height as the shoulder 686.

[0225] The snap mechanism 654 includes a retainer body 694, a spherical ball 696, and a spring 698. The body 666 of the second portion 642 forms a part of the snap mechanism 654 in that the body 666 has a first snap recess 700A formed therein.

[0226] The retainer body 694 has an outer surface with threads 702 thereon. The retainer body 694 also has an end with a slot 704 formed therein that can receive a tool, such as a screwdriver. A spring 698 is located within the retainer body 694. A spherical ball 696 is positioned within the mouth of the retainer body 694. The mouth of the retainer body 694 has a slightly reduced size to prevent the spherical ball 696 from falling out of the retainer body 694. The outer surface of the spherical ball 696 forms a snap surface 706. The threads 702 engage with complementary threads in the tuning block 648. A tool, such as a screwdriver, is inserted into the slot 704 and then rotated to adjust how far the snap surface 706 is spaced from the tuning block 648.

[0227] The intermediate protection member 708 is inserted into a complementary groove on the upper surface of the back plate 74. Openings 710, 712 and 714 are formed in the intermediate protection member 708, the back plate 74 and the signal distribution board 500, respectively. The second portion 680 of the connection portion 644 is inserted through the openings 710, 712 and 714 from above. The length 660 of the first portion 640 is greater than the length of any one of the openings 710, 712 and 714 in the same direction, which prevents the first portion 640 from entering the openings 710, 712 and 714. The lower surface of the first portion 640 rests on the upper surface formed in the intermediate protection member 708. Then, the first portion 678 of the connection portion 644 is located in the openings 710, 712 and 714, and the second portion 680 of the connection portion 644 is located below the openings 710, 712 and 714. Then, the spring-loaded washer 720, the gasket 652B and the spacer 652A are positioned on the connection portion 644 from below. The second portion 642 is then positioned from below onto the connecting portion 644. The opening 674 forms a sliding fit with the outer diameter of the threads on the second part 680 of the connecting portion 644.

[0228] When the second part 642 slides upward on the connecting part 644, the first snap recess 700A also contacts the snap surface 706. The spherical ball 696 moves a small amount from right to left against the spring force of the spring 698. Then, the locking nut 650 engages with the protruding end of the second part 680. The rotation of the locking nut 650 causes the body 666 of the second part 642 to tighten against the spring force of the washer 720. A feeler gauge or other instrument can be used to determine the gap between the second wing 668B and the leveling surface 690. The locking nut 650 can be rotated until an acceptable gap is formed between the second wing 668B and the leveling surface 690. This gap is generally the same as the desired gap between the first wing 668A and the shoulder 686. Then, the locking device is formed by the first part 640, the second part 642, and the connecting part 644.

[0229] When the locking nut 650 is rotated, the first snap recess 700A also moves upward. The first snap recess 700A is an elongated slot. When the second portion 642 continues to move upward as the locking nut 650 continues to rotate, the snap surface 706 and the first snap recess 700A can slide on each other.

[0230] As shown in the drawings, when the first latch assembly 604A is assembled, the thin chuck 72 is in place. In addition, there is a negative pressure in the differential pressure chamber 622. By placing the first wafer package 28A in a compressed state, it is possible to measure whether the first and second tabs 668A and 668B are equally spaced from the shoulder 686 and the leveling surface 690. As long as the leveling surface 690 has been set at the correct height using one or more shims such as shim 652B, the first latch assembly 604A can also be assembled in place without the thin chuck 72 by simply measuring the spacing between the second tab 668B and the leveling surface 690.

[0231] Fig.16 is along Fig.15 64 and 650. The present invention is a view in direction A of FIG.

[0232] The opening 712 has a first dimension 724 on an axis 726 toward the center point of the signal distribution board 500, which is larger than a second dimension 728 transverse to the axis 726. The first portion 678 of the connector 644 is smaller than the first dimension 724 in the direction of the axis 726 to allow the signal distribution board 500 and the backplane 74 (see Fig.15 ) relative to each other. The first portion 678 is sized to slidably fit within the second dimension 728 to prevent the signal distribution board 500 from moving relative to the back plate 74 in a direction transverse to the axis 726.

[0233] The second portion 680 of the connection 644 has a first thickness 730 and a second thickness 732. The first thickness 730 can fit through the opening 712 in the direction of the axis 726, and the first thickness 730 is greater than the second dimension 728 of the opening 712. The second thickness 732 is transverse to the first thickness 730 and can fit through the second dimension 728 of the opening 712. Because the second dimension 728 is relatively large, it allows threads to be formed thereon and it is still relatively strong. The entire second portion 680 is located below the opening 712, which allows the connection 644 to rotate about its longitudinal axis without the second portion 680 getting stuck on the relatively narrow opening 712. The first portion 678 has a circular cross-section with a diameter no greater than the second dimension 728, which allows the first portion 678 to rotate freely within the relatively narrow second dimension 728 of the opening 712.

[0234] An additional opening 734 is formed in the signal distribution board 500 for additional fixation of the gasket. The opening 734 is similarly proportioned to the opening 712, with a longer dimension on an axis 736 toward the center point of the signal distribution board 500. When used in a manufacturing environment, the anchor passing through the opening 734 does not have to be rotated, and the size of the opening 734 is only used to allow for thermal expansion of the signal distribution board 500 relative to the back plate 74.

[0235] Fig.17 for Fig.15 17-17, the fixing device 740 is inserted through Fig.16 The opening 734 is used to secure the spacer 652A and the gasket 652B to the back plate 74. The fastener 740 includes a bolt and a nut, wherein the head of the bolt is on one side and the nut is on the opposite side.

[0236] The body 666 has a circular outer surface 742 in which first, second, third and fourth snap recesses 700A to 700D are formed. The snap surface 706 of the spherical ball 696 is located in the first snap recess 700A, which prevents the body 666 from rotating. The opening 674 in the body 666 is keyed to accept the shape of the second part 680 so that if the body 666 remains stationary, the second part 680 cannot rotate.

[0237] A small amount of torque is required to rotate the body 666 and make the spherical ball 696 come out of the first snap recess 700A. If the body 666 is rotated clockwise, the snap surface 706 rides on the circular outer surface 742 between the first snap recess 700A and the second snap recess 700B. When the body 666 rotates, the second part 680 rotates with the body 666 by the same angle. When the body 666 is rotated close to 90 degrees, the snap surface 706 snaps into the second snap recess 700B. Then, the second snap recess 700B prevents the rotation of the body 666 and the second part 680. The first to fourth snap recesses 700A to 700D gently lock the body 666 at four different rotation angles, including 0 degrees, 90 degrees, 180 degrees and 270 degrees.

[0238] Figure 18a(i) and 18a(ii) is along Fig.15 18a(ii), the first latch assembly 604A is shown unlocked. The shoulder 686 is not obstructed from below by the first wing 668A or the second wing 668B. The wings 668A and 668B are formed by Fig.15 and 17 The illustrated snap mechanism 654 remains in the position shown in FIG. 18a(i). The pressure within the first wafer package 28A can be reduced, and the thin chuck 72 can be removed to insert or replace the wafer. After the wafer is replaced, the pressure within the first wafer package 28A is reduced again to hold the first wafer package 28A together.

[0239] When the first chip package 28A is fully assembled, it may be necessary to provide further fault protection so that electrical contact with the chip can be maintained even if the negative pressure within the first chip package 28A cannot be maintained due to a system failure. The operator can use a tool (not shown) having jaws and pins. The pins are inserted into the tool pin openings 664. The tool pin openings 664 are tapered so that the deeper the pins are inserted into the tool pin openings 664, the more the tool gradually becomes aligned with the first portion 640. The operator then engages the opposing parallel surfaces of the jaws of the tool with the opposing parallel surfaces formed by the engagement mechanism 646. Once the tool is engaged with the engagement mechanism 646, the operator rotates the tool, and the tool rotates the first portion 640. The connecting portion 644 and the second portion 642 and their first and second tabs 668A and 668B rotate together with the first portion 640. Refer to Fig.17 , the snap-on surface 706 leaves the fourth snap-on recess 700D and slides on the circular outer surface 742. Then, the snap-on surface 706 snaps into the first snap-on recess 700A.

[0240] Figure 18b(i) and 18b(ii) The first latch assembly is shown after the first portion 640 and the second portion 642 are rotated 90 degrees at an angle 752. The operator can see that the orientation of the first portion 640 matches the locked position shown by reference numeral 750. The first wing 668A is now located above the shoulder 686, which prevents the thin chuck 72 from moving in a vertical downward direction away from the rest of the wafer package 28A. The second wing 668B is located on the tuning block 648. By rotating the first portion 640 90 degrees clockwise or counterclockwise, the first wing 668A can be disengaged from the shoulder 686. Either of the wing 668A or 668B can be used to lock the thin chuck 72 in place.

[0241] Fig.19 It is shown how one or more shims 652B to 652F can be used to adjust the height of the leveling surface 690 of the tuning block 648. Ideally, the tuning block 648 should be at the same height as the shoulder 686. Since the tuning block 648 is mounted to the spacer 652A, as more shims 652B to 652F are inserted, the tuning block 648 moves up and down with the spacer 652A. If the leveling surface 690 is below the shoulder 686, more shims can be inserted to raise the leveling surface 690, or if the leveling surface 690 is above the height of the shoulder 686, the shims can be removed.

[0242] The engagement mechanism 646 is conveniently located directly on the first portion 640. In another arrangement, the engagement mechanism may be formed directly on the second portion 642 or directly on the connecting portion 644.

[0243] In another embodiment, the engagement mechanism may be a mechanism separate from the first and second portions 640 and 642 and from the connecting portion 644. For example, a worm gear may be formed on the connecting portion 644, and the engagement mechanism may be a separate rotatable mechanism that rotates the worm gear.

[0244] The engagement mechanism may also be located between the first portion 640 and the connecting portion 644. For example, the first wing 668A may be pivoted downward away from the shoulder 686 and rearward toward the shoulder 686 using a cam system located between the first portion 640 and the connecting portion 644. Such a cam system as an engagement mechanism may alternatively be located between the connecting portion 644 and the second portion 642. Alternatively, the connecting portion 644 may be made in two pieces, and the engagement mechanism may connect the two pieces and adjust the spacing of the two pieces, and the spacing adjustment may pivot the wing.

[0245] The first latch assembly 604A mainly uses incompressible and non-flexible materials. In alternative embodiments, considering the same or similar purposes, straps or other flexible materials can be used.

[0246] Instead of having the engagement mechanism 646 on an outer surface of the first portion 640, the engagement mechanism may instead be on an inner surface of any portion.

[0247] Reference again Fig.12 , the first, second, third and fourth latch assemblies 604A to 604D are identical except for their respective positions and orientations. The first and third latch assemblies 604A and 6040C are located on opposite sides of the thin chuck 72, and the second and fourth latch assemblies 604B and 604D are located on opposite sides of the thin chuck 72. Because the latch assemblies 604A to 604D are located on more than one side of the thin chuck 72, that is, they cover more than 180 degrees around the circumference of the thin chuck 72, they can collectively hold all sides of the thin chuck 72 in place around its entire circumference.

[0248] The latching system provided by the first, second, third and fourth latching assemblies 604A to 604D helps to make the movement of the first chip package 28A in the manufacturing environment easier without the need for human supervision. Without the latching system, human supervision is required to determine when the negative pressure within the first chip package 28A fails and the chip 28A is separated. The latching system provides a structural fail-safe to prevent the first chip package 28A from separating, even if it draws air from the outside.

[0249] Fig. 20 , 21 , 22a and 22b show other components of the pressure monitoring system, including pressure sensing channel 760 ( Fig.21 )、pressure sensor 762( Fig.22a and 22b ), reference Fig.11 The electronic pressure sensor interface 606 ( Fig. 20 , 21 , 22a and 22b)), an electronic pressure connector interface 764, a mounting bracket 766, a ribbon cable 768 having first and second connectors 770 and 772 at opposite ends thereof ( Fig. 20 , 22a and 22b), connector block 774 and reinforcing plate 776 ( Fig. 20 ).

[0250] Pressure sensing channel 760 is similar to reference Fig.13 The pressure relief channel 608 is formed in the back plate 74. The pressure sensing channel 760 has Fig.14 The pressure sensing channel 760 has a first end within the differential pressure chamber 622 shown in FIG. The pressure sensing channel 760 has a second end near the outer edge of the back plate 74 opposite the first end.

[0251] The electronic pressure sensor interface 606 is in the form of a printed circuit board having a substrate 780 and a plurality of contacts, including first, second, and third contacts 782A, 782B, and 782C formed on the substrate 780 .

[0252] The pressure sensor 762 is mounted to the substrate 780 on the side of the substrate 780 opposite to the first, second and third contacts 782A, 782B and 782C. The pressure sensor 762 is electrically connected to the first, second and third contacts 782A, 782B and 782C through the substrate 780. The pressure sensor 762 is capable of sensing the pressure of a gas (in this case, air) and converting the pressure into an electrical signal, wherein the magnitude of the pressure is indicated by the magnitude of the signal or another variable. The pressure can be conveniently detected using a diaphragm that displaces a known distance as the pressure increases or decreases. Other pressure sensors are also within the scope of the present invention, such as a pressure sensor using a piezoelectric crystal or a pressure sensor using a strain gauge. In the case of a moving diaphragm, for example, by moving an induction coil, the movement can be converted into a voltage, and the amplitude of the voltage then indicates the displacement and therefore the pressure. The pressure sensor can be, for example, the MLX90809 sold by Melexis (www.melexis.com). The electronic pressure sensor interface 606 is mounted to the back plate 74 using fasteners 784. The diaphragm of the pressure sensor 762 is then exposed to air at the second end of the pressure sensing channel 760. The pressure sensor 762 can thus sense the pressure within the differential pressure chamber 622.

[0253] The electronic pressure connector interface 764 has a plate 790 and a plurality of terminals, including first terminal 792A to sixth terminal 792F fixed to the plate 790. The plate 790 is mounted to the mounting bracket 766 by fasteners 794. The reinforcement plate 776 is fixed between the two push rod blades 308. The mounting bracket 766 is fixed to the reinforcement plate 776 by fasteners 796. The slot assembly body 32 together with the push rod blades 308 and the reinforcement plate 776 form a part of the fixed structure, and the electronic pressure connector interface 764 is thus mounted to the fixed structure.

[0254] The connector block 774 is mounted to the slot assembly body 32. The connectors 770 and 772 are respectively connected to the electronic pressure connector interface 764 and the connector block 774. The first to sixth terminals 792A to 792F are connected to the pressure sensing board of the electronic tester through the first connector 770, the ribbon cable 768 and the second connector 772.

[0255] Fig.23a and 23b The electronic pressure sensor interface 606 is shown to engage with the electronic pressure connector interface 764 when the first wafer package 28A is inserted into the slot assembly. The first, second and third contacts 782A, 782B and 782C first contact with the first, second and third terminals 792A, 792B and 792C, respectively. Further movement of the electronic pressure sensor interface 606 causes the first, second and third contacts 782A, 782B and 782C to engage with the fourth, fifth and sixth terminals 792D, 792E and 792F, respectively. The first contact 782A is therefore in contact with both the first terminal 792A and the fourth terminal 792D. Similarly, each of the contacts 782B and 782C contacts two of the terminals 792B, 792C, 792E and 792F.

[0256] The terminals 792A-792F can be resiliently pressed against the plate 790 to ensure proper contact with the contacts 782A-782C. The ribbon cable 768 allows a small amount of movement of the stiffener plate 776 relative to the slot assembly body 32 when the first die package 28A is inserted.

[0257] While the wafer is under test, the pressure within the differential pressure chamber 622 may be monitored throughout the process. If a wafer fails a test, the tester may be programmed to determine if such a test may be the result of a negative pressure failure within the differential pressure chamber 622.

[0258] While certain exemplary embodiments have been described and shown in the drawings, it is to be understood that these embodiments are merely illustrative and not restrictive of the invention, and that the invention is not limited to the specific construction and arrangements shown and described, as modifications may occur to those skilled in the art.

Claims

1. A removable package comprising: a removable package including a first member and a second member for holding a substrate therebetween, the substrate carrying a microelectronic circuit and having a plurality of substrate terminals connected to the microelectronic circuit; a plurality of movable package contacts, the contacts being on the second component, the movable package contacts being matched with the substrate terminals to contact the substrate terminals; A fixing system, the fixing system comprising: A first fixing component, the first fixing component comprising: a first portion engaged with the first component; a second portion engaged with the second component; a connecting portion having opposite ends respectively fixed to the first portion and the second portion to form a locking device; an engagement mechanism connected to the locking device and operable to move the locking device between a locked position in which the locking device retains the first component and the second component locked in the closed position and an unlocked position in which the locking device allows the first component and the second component to move from the closed relationship to a spaced relationship, wherein the engagement mechanism moves the second component between the locked position and the unlocked position, wherein, when the locking device moves between the locking position and the unlocking position, the second portion rotates around an axis perpendicular to the base plate; and A first electrical interface is on the removable package and connected to the removable package contact for connecting to a second electrical interface on the frame when the removable package is removably held by the frame.

2. The removable package according to claim 1, wherein: The first portion rotates about an axis perpendicular to the base plate when the locking device moves between the locked position and the unlocked position.

3. The removable package according to claim 1, wherein: When the locking device moves between the locking position and the unlocking position, the connecting portion rotates about an axis perpendicular to the base plate.

4. The removable package according to claim 1, wherein: The engagement mechanism rotates about an axis perpendicular to the base plate when the locking device moves between the locked position and the unlocked position.

5. The removable package according to claim 1, wherein: The locking mechanism includes a surface on the first part that forms a seat that contacts a surface on a tool that can be rotated to turn the first part, and the first part rotates the second part through the connecting portion to move between the locked position and the unlocked position.

6. The removable package according to claim 5, wherein: The surface on the first part forming the seat is an outer surface of the first part.

7. The removable package according to claim 6, wherein: The first portion has a tool opening therein for aligning the tool with the first portion.

8. The removable package according to claim 1, wherein: The fixing system comprises: A second fixing assembly, wherein each respective fixing assembly has: a first portion engaged with the first component; a second portion engaged with the second member; a connecting portion having opposite ends respectively fixed to the first portion and the second portion to form a locking device; and an engagement mechanism connected to the locking device and operable to move the locking device between a locked position in which the locking device retains the first component and the second component locked in the closed position and an unlocked position in which the locking device allows the first component and the second component to move from the closed relationship to a spaced relationship, wherein the engagement mechanism moves the second component between the locked position and the unlocked position, Wherein, when the locking device moves between the locking position and the unlocking position, the second part rotates around an axis perpendicular to the base plate.

9. The removable package according to claim 8, wherein: The first and second fastening assemblies have respective second portions on different sides of the second component.

10. The removable package according to claim 1, further comprising: A pressure differential chamber seal is provided between the first component and the second component, and the pressure differential chamber seal between the first component and the second component forms a closed pressure differential chamber.

11. The removable package according to claim 10, further comprising: A channel is provided for connecting a gas interface on the frame to the pressure difference chamber when the movable package is held by the frame.

12. The removable package according to claim 10, further comprising: At least a first valve is between the differential pressure chamber and air outside the differential pressure chamber surrounding the movable enclosure.

13. A testing device comprising: A removable package, the removable package comprising: a removable package including a first member and a second member for holding a substrate therebetween, the substrate carrying a microelectronic circuit and having a plurality of substrate terminals connected to the microelectronic circuit; a plurality of movable package contacts located on the second component, the movable package contacts matching the substrate terminals to contact the substrate terminals; A fixing system, the fixing system comprising: A first fixing component, the first fixing component comprising: a first portion engaged with the first component; a second portion engaged with the second component; a connecting portion having opposite ends respectively fixed to the first portion and the second portion to form a locking device; an engagement mechanism connected to the locking device and operable to move the locking device between a locked position in which the locking device retains the first component and the second component locked in the closed position and an unlocked position in which the locking device allows the first component and the second component to move from the closed relationship to a spaced relationship, wherein the engagement mechanism moves the second component between the locked position and the unlocked position, wherein, when the locking device moves between the locking position and the unlocking position, the second portion rotates around an axis perpendicular to the base plate; and a first electrical interface on the movable package body and connected to the movable package contact; a frame, the movable package being receivable to be held by the frame and removable from the frame; a second electrical interface on the frame, the second electrical interface connected to the first electrical interface when the removable package is held by the frame, and disconnected from the first electrical interface when the removable package is removed from the frame; and An electrical tester is connected to the substrate terminals through the second electrical interface, the first electrical interface, and the movable package contacts such that signals are transmitted between the electrical tester and the microelectronic circuit to test the microelectronic circuit.

14. A method of testing a microelectronic circuit held by a substrate, comprising: holding the substrate between a first part of a removable package body, the removable package body forming part of the removable package, and a second part having removable package contacts abutting substrate terminals of the substrate connected to a microelectronic circuit; The engagement mechanism is operated to move the locking device between a locked position in which the locking device maintains the first component and the second component locked in the closed position and an unlocked position in which the locking device allows the first component and the second component to move from the closed relationship to the spaced relationship, the locking device comprising: a first portion engaged with the first component; a second portion engaged with the second member; a connecting portion having opposite ends fixed to the first portion and the second portion, respectively, wherein the engagement mechanism moves the second component between the locked position and the unlocked position, wherein, when the locking device moves between the locking position and the unlocking position, the second portion rotates around an axis perpendicular to the base plate; receiving the removable package through a frame, wherein a first electrical interface on the removable package body is connected to a second electrical interface on the frame; transmitting signals between an electrical tester and the microelectronic circuit through the substrate terminals, the movable package contacts, and the first and second electrical interfaces to test the microelectronic circuit; and In a case where the first electrical interface on the removable enclosure is disconnected from the second electrical interface on the frame, the removable enclosure is removed from the frame.

15. The method according to claim 14, wherein: The first portion rotates about an axis perpendicular to the base plate when the locking device moves between the locked position and the unlocked position.

16. The method according to claim 14, wherein: When the locking device moves between the locking position and the unlocking position, the connecting portion rotates about an axis perpendicular to the base plate.

17. The method according to claim 14, wherein: The engagement mechanism rotates about an axis perpendicular to the base plate when the locking device moves between the locked position and the unlocked position.

18. The method according to claim 14, wherein: The locking mechanism includes a surface on the first part, the surface forming a seat for contacting a surface on the jaws of a tool, the jaws of the tool being rotatable to rotate the first part, and the first part rotating the second part through the connecting part to move between the locked position and the unlocked position.

19. The method according to claim 18, wherein: The surface on the first part forming the seat is an outer surface of the first part.

20. The method according to claim 19, wherein: The first portion has a tool opening therein for aligning the tool with the first portion.

21. The method according to claim 14, wherein: The fixing system comprises: The second fixing assembly, wherein each respective fixing assembly has: a first portion engaged with the first component; a second portion engaged with the second member; a connecting portion having opposite ends respectively fixed to the first portion and the second portion to form a locking device; and an engagement mechanism connected to the locking device and operable to move the locking device between a locked position in which the locking device retains the first component and the second component locked in the closed position and an unlocked position in which the locking device allows the first component and the second component to move from the closed relationship to the spaced relationship, wherein the engagement mechanism moves the second component between the locked position and the unlocked position, Wherein, when the locking device moves between the locking position and the unlocking position, the second part rotates around an axis perpendicular to the base plate.

22. The method according to claim 21, wherein: The first and second fastening assemblies have respective second portions on different sides of the second component.

23. The method of claim 14, further comprising: A differential pressure chamber seal is positioned between the first component and the second component, the differential pressure chamber seal forming a closed differential pressure chamber between the first component and the second component.

24. The method according to claim 23, further comprising: A gas interface fixed to the frame is connected to the pressure difference chamber through a channel, so that when the movable packaging body is held by the frame, the gas interface is connected to the pressure difference chamber.

25. The method of claim 23, further comprising: At least a first valve is operated, wherein the first valve when closed is located between the differential pressure chamber and air outside the differential pressure chamber surrounding the movable enclosure.

Images