Flexible circuit board shaping and positioning device and method

Through the flexible circuit board shaping and positioning device and method, using the side push cylinder, shaping push block and camera assembly to identify the QR code, the positioning difficulty problem caused by the small and thin flexible circuit board is solved, precise positioning and precise adjustment are achieved, and the testing efficiency and accuracy are improved.

CN119916178BActive Publication Date: 2025-10-17OAT (HANGZHOU) INTELLIGENT MFG CO LTD
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Patent Information

Application Number
CN202510001975.4
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2025-01-02
Publication Date
2025-10-17
Estimated Expiration
2045-01-02

AI Technical Summary

Technical Problem

Flexible circuit boards are difficult to position due to their small size and thinness, and existing technologies are unable to effectively and accurately position them.

Method used

A flexible circuit board shaping and positioning device was designed, including a carrier assembly and a shaping assembly. The flexible circuit board was precisely positioned using a side push cylinder, a shaping push block, and a shaping block. The QR code was recognized by a camera assembly for data transmission, and precise adjustment was achieved by combining a vacuum adsorption assembly and an adjusting screw.

Benefits of technology

It achieves precise positioning and adjustment of flexible circuit boards, solves the problem of difficult positioning of flexible circuit boards due to their small size and thinness, and improves test efficiency and accuracy.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present application is suitable for the field of automation, and provides a flexible circuit board shaping and positioning device, which comprises a carrier plate assembly and at least one shaping assembly, the carrier plate assembly is used for placing a flexible circuit board, and the shaping assembly is arranged on one side of the carrier plate assembly; the shaping assembly comprises a side pushing air cylinder, a shaping push block and a shaping block, the shaping push block is provided with the shaping block on one side and the side pushing air cylinder on the other side, and the side pushing air cylinder is used for pushing the shaping push block and the shaping block. The present application relaxes the single-side gap of the carrier plate assembly, so that the flexible circuit board can smoothly enter the hole, and then the position of the flexible circuit board is adjusted by using the shaping assembly, so that the positioning accuracy is ensured.
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Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of automation, and particularly relates to a flexible circuit board shaping and positioning device and method. BACKGROUND

[0002] The demand for flexible circuit board testing is increasing, and there are many types of testing, such as 5G communication, computers, mobile phones, wearable electronic devices, etc. The number of components integrated on the flexible circuit board is increasing rapidly, such as chips, sensors, and keys integrated on the flexible circuit board. For integrated flexible circuit boards (FPC, Flexible Printed Circuit), we need to test to know whether the function of the element is perfect.

[0003] However, with the development of the electronic industry, the flexible circuit board technology field also develops forward, and the flexible circuit board develops towards small, soft, thin and other characteristics. This brings various challenges to the flexible circuit board testing industry. The existing technical difficulties are that the flexible circuit board is getting smaller and thinner, and is prone to deformation, which leads to difficult positioning. SUMMARY

[0004] The purpose of the embodiment of the application is to provide a flexible circuit board shaping and positioning device, which aims to solve the problem that the flexible circuit board is difficult to position due to its small size and thinness.

[0005] The embodiment of the application is implemented as follows: a flexible circuit board shaping and positioning device, which comprises a carrier plate assembly and at least one shaping assembly, the carrier plate assembly is used for placing a flexible circuit board, and the shaping assembly is arranged on one side of the carrier plate assembly.

[0006] The shaping assembly comprises a side pushing air cylinder, a shaping push block and a shaping block, the shaping push block is provided with the shaping block on one side and the side pushing air cylinder on the other side, and the side pushing air cylinder is used for pushing the shaping push block and the shaping block.

[0007] Further, the shaping block comprises a first shaping block and a second shaping block, the first shaping block and the second shaping block are arranged on one side of the shaping push block, and the pushing direction of the shaping block is neither parallel nor perpendicular to the side edge of the carrier plate assembly.

[0008] Further, the shaping assembly further comprises a hard limiting block and an adjusting screw, the hard limiting block is fixedly arranged on the carrier plate assembly, and the hard limiting block is connected with the shaping push block through the adjusting screw.

[0009] Further, the shaping assembly further comprises a linear guide rail, and the linear guide rail is in sliding connection with the shaping push block.

[0010] Further, the carrier plate assembly comprises a shaping carrier plate and a support frame, the shaping carrier plate is arranged on the support frame, and the support frame is height-adjustable.

[0011] Further, the flexible circuit board shaping and positioning device further comprises a camera assembly arranged on the support frame below the shaping carrier plate and used for identifying a two-dimensional code of the flexible circuit board.

[0012] Further, the camera assembly comprises a lens, a camera and a light source, the lens and the camera are arranged on the support frame below the shaping carrier plate, and the light source is fixedly arranged below the shaping carrier plate.

[0013] Another purpose of the embodiment of the present application is to provide a flexible circuit board shaping and positioning method, which comprises the following steps:

[0014] Placing the flexible circuit board on the shaping carrier plate;

[0015] Starting the side push cylinder of the shaping assembly to push the shaping push block and the shaping block, so that the shaping block is close to the shaping carrier plate;

[0016] Controlling the shaping block to push the flexible circuit board from the inclined direction;

[0017] Adjusting the adjusting screw on the hard stop block in the process of pushing according to the positioning gap of the flexible circuit board;

[0018] After adjustment, the vacuum suction assembly on the shaping carrier plate is started;

[0019] Using the camera assembly to scan and identify the two-dimensional code at the bottom of the flexible circuit board and transmitting data to the control module;

[0020] Taking the flexible circuit board off the shaping carrier plate.

[0021] The flexible circuit board shaping and positioning device provided by the embodiment of the present application is designed for soft and slender flexible circuit boards. The traditional carrier plate is funnel-shaped. Since the flexible circuit board is soft and slender, it is not easy to slide into the hole and even may be blocked, resulting in difficult positioning. The present application relaxes the single-side gap of the carrier plate assembly, so that the flexible circuit board can smoothly enter the hole, and then the position of the flexible circuit board is adjusted by the shaping assembly to ensure the positioning accuracy. BRIEF DESCRIPTION OF DRAWINGS

[0022] Figure 1 A perspective view of the flexible circuit board shaping and positioning device provided by the embodiment of the present application;

[0023] Figure 2 A side view of the flexible circuit board shaping and positioning device provided by the embodiment of the present application;

[0024] Figure 3 A top view of the flexible circuit board shaping and positioning device provided for the embodiment of the present application;

[0025] Figure 4 A perspective view of the shaping assembly provided for the embodiment of the present application;

[0026] 100, carrier plate assembly; 110, shaping carrier plate; 120, support frame;

[0027] 200, shaping assembly; 210, side pushing air cylinder; 220, shaping pushing block; 230, shaping block; 240, hard limit block; 250, adjusting screw; 260, linear guide rail;

[0028] 300, camera assembly; 310, lens; 320, camera; 330, light source;

[0029] 400, flexible circuit board. DETAILED DESCRIPTION

[0030] In order to make the purpose, technical scheme and advantages of the present application clearer, the present application will be further described in detail below in combination with the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and do not limit the present application.

[0031] It can be understood that the terms "first", "second" and the like used in the present application can be used herein to describe various elements, but unless specifically stated, these elements are not limited by these terms. These terms are only used to distinguish the first element from another element.

[0032] In the first embodiment, as shown in Figures 1-3 A flexible circuit board shaping and positioning device is provided, which comprises a carrier plate assembly 100 for placing a flexible circuit board 400 and at least one shaping assembly 200 arranged on one side of the carrier plate assembly 100.

[0033] The shaping assembly 200 comprises a side pushing air cylinder 210, a shaping pushing block 220 and a shaping block 230, the shaping pushing block 220 is arranged with the shaping block 230 on one side and the side pushing air cylinder 210 on the other side, and the side pushing air cylinder 210 is used to push the shaping pushing block 220 and the shaping block 230.

[0034] In the embodiment, the carrier plate assembly 100 is provided with a work station for placing the flexible circuit board 400. The shaping assembly 200 is at least one, which is arranged at the side of the carrier plate assembly 100. The number of the shaping assembly 200 given in the embodiment is two, which can adjust the flexible circuit board in the two work stations. The number of the shaping assembly 200 is determined according to the actual production, and the preferred scheme is given herein, which is not specifically limited. The side pushing cylinder 210 is used to push the shaping push block 220 and the shaping block 230 laterally, so as to adjust the position of the flexible circuit board 400. The traditional carrier plate is funnel-shaped. Since the flexible circuit board is thin and soft, it is not easy to slide into the hole and even can be blocked, which causes difficult positioning. The carrier plate assembly 100 needs to calculate the hole width and the single side positioning gap according to the flexible circuit board to be shaped. At this time, the single side positioning gap is 1 mm, which is beneficial to the feeding of the feeding robot. The single side gap of the carrier plate assembly 100 is widened in the embodiment, so that the flexible circuit board 400 can be smoothly put into the hole. Then the position of the flexible circuit board 400 is adjusted by the shaping assembly 200, so as to ensure the positioning accuracy.

[0035] In an optimization scheme, the structure of the shaping block 230 is specifically limited as shown in Figure 3 and 4 The shaping block 230 includes a first shaping block and a second shaping block, which are arranged at one side of the shaping push block 220, and the pushing direction of the shaping block 230 is neither parallel nor perpendicular to the side of the carrier plate assembly 100.

[0036] In the optimization scheme, the shaping block 230 and the shaping push block 220 are both in the shape of a long strip. The first shaping block and the second shaping block are parallel to each other, which can be perpendicular to the shaping push block 220 or parallel to the shaping push block 220. The shaping block 230 must form a certain angle with the side of the carrier plate assembly 100, and similarly, must be neither parallel nor perpendicular to the side of the flexible circuit board 400. When pushing, the first shaping block and the second shaping block gradually approach the flexible circuit board 400. The flexible circuit board 400 is continuously pushed by the side, so that the shaping block 230 is pushed to the position where two edges of the shaping block 230 contact the flexible circuit board 400. In this way, the side pushing in one direction realizes the shaping of the flexible circuit board 400 in two directions, which also enables the flexible circuit board 400 to be precisely positioned in X and Y directions, so as to achieve the purpose of precisely positioning the flexible circuit board 400.

[0037] In an optimization scheme, the structure of the shaping assembly 200 is specifically limited as shown in Figure 3 and 4 The shaping assembly 200 further includes a hard limiting block 240 and an adjusting screw 250. The hard limiting block 240 is fixedly arranged on the carrier plate assembly 100, and the hard limiting block 240 is connected with the shaping push block 220 through the adjusting screw 250.

[0038] In the optimization scheme, during the movement of the side pushing cylinder 210, the adjusting screw 250 installed on the hard limit block 240 can be adjusted, so that the shaping block 230 can be pushed out by different distances, and different distances between the shaping block 230 and the positioning edge in the hole of the carrier plate assembly 100 are generated, so as to achieve different positioning accuracies. According to the working conditions, the single-side positioning can be adjusted to be 0.05mm-1mm.

[0039] In an optimization scheme, as shown in Figure 3 and 4 , the structure of the shaping assembly 200 is specifically limited. The shaping assembly 200 further comprises a linear guide rail 260, which is in sliding connection with the shaping push block 220.

[0040] In the optimization scheme, the shaping push block 220 is installed on the linear guide rail 260. In the embodiment, the number of linear guide rails 260 is 2, which is beneficial to ensure the straightness of the movement of the shaping block 230, thereby ensuring the angle of the shaping block 230 and the positioning edge in the hole of the carrier plate assembly 100.

[0041] In an optimization scheme, as shown in Figure 1 , the structure of the carrier plate assembly 100 is specifically limited. The carrier plate assembly 100 comprises a shaping carrier plate 110 and a support frame 120, the shaping carrier plate 110 is arranged on the support frame 120, and the height of the support frame 120 is adjustable.

[0042] In the optimization scheme, the hole of the shaping carrier plate 110 is used to place the flexible circuit board 400, and the hole width and single-side positioning gap are calculated according to the flexible circuit board to be shaped. The height of the support frame 120 can be changed by changing the height of the support column according to the height of the feeding and discharging manipulator, and the implementation modes include but are not limited to cylinder adjustment, screw structure adjustment, etc. The shaping carrier plate 110 is installed on the support structure, which is beneficial to the mutual cooperation between the shaping carrier plate 110 and the shaping assembly 200, and guarantees the adjustment accuracy.

[0043] In an optimization scheme, as shown in Figure 2 , the structure of the flexible circuit board shaping and positioning device is specifically limited. The flexible circuit board shaping and positioning device further comprises a camera assembly 300, which is arranged on the support frame 120 and located below the shaping carrier plate 110, and is used to identify the two-dimensional code of the flexible circuit board 400. The camera assembly 300 comprises a lens 310, a camera 320 and a light source 330, the lens 310 and the camera 320 are arranged on the support frame 120 and located below the shaping carrier plate 110, and the light source 330 is fixedly arranged below the shaping carrier plate 110.

[0044] In the optimization scheme, the camera assembly 300 includes three parts of the camera 320, the lens 310 and the light source 330, and the main feature is that the scheme has strong compatibility and can scan two-dimensional codes on different flexible circuit boards. The scanned forms include paper two-dimensional codes, steel sheet laser two-dimensional codes and ink two-dimensional codes.

[0045] The technical features of the above-described embodiments can be combined in any manner. To make the description concise, all possible combinations of the optimization schemes in the above-described embodiments are not described, but as long as the combination of the technical features does not exist contradictory, it should be considered as the scope of the present disclosure.

[0046] In the second embodiment, a flexible circuit board shaping and positioning method is given. The method is applied to the flexible circuit board shaping and positioning device described in the first embodiment, and the flexible circuit board shaping and positioning method includes the following steps S1-S7.

[0047] Step S1, placing the flexible circuit board 400 on the shaping carrier plate 110;

[0048] Step S2, starting the side pushing cylinder 210 of the shaping assembly 200 to push the shaping push block 220 and the shaping block 230, so that the shaping block 230 is close to the shaping carrier plate 110;

[0049] Step S3, controlling the shaping block 230 to push the flexible circuit board 400 from the inclined direction;

[0050] Step S4, adjusting the adjusting screw 250 on the hard stop block 240 during the pushing process according to the positioning gap of the flexible circuit board 400;

[0051] Step S5, after adjusting to the position, starting the vacuum suction assembly on the shaping carrier plate 110;

[0052] Step S6, using the camera assembly 300 to scan and identify the two-dimensional code at the bottom of the flexible circuit board 400, and transmitting the data to the control module;

[0053] Step S7, taking the flexible circuit board 400 off the shaping carrier plate 110.

[0054] In the embodiment, the method is suitable for an automated feeding and discharging device. Step S1 can be feeding the shaping carrier plate 110 by a feeding manipulator. At this time, the side pushing in the shaping assembly 200 is in a retracted state, and the single-side positioning gap of the product in the hole of the shaping carrier plate 110 is 1 mm, which is a state that is extremely easy to put in, thereby avoiding the edge lifting caused by the small gap of the shaping carrier plate 110 or the discharging failure caused by the product deformation. In step S3, the first shaping block and the second shaping block gradually approach the flexible circuit board 400, the flexible circuit board 400 is continuously pushed by the side, the shaping block 230 is pushed to a position where two edges of the shaping block 230 are in contact with the flexible circuit board 400, and thus the side pushing in one direction realizes the shaping of the flexible circuit board 400 in two directions. In step S4, the adjusting screw 250 on the hard stop block 240 can be adjusted in the process of pushing, different product positioning gaps are adjusted, and thus different accuracy requirements are achieved. In step S5, when the adjusting is adjusted to the positioning accuracy of the flexible circuit board 400, the carrier plate vacuum suction is started, and the product is in a relatively static state. In step S6, the camera scanning is started while step S5 is performed, the flexible circuit board 400 is identified one by one, and the data after the test is one by one corresponding. In step S7, the shaping carrier plate 110 is discharged by a discharging manipulator.

[0055] The above only describes the preferred embodiments of the present application and is not used to limit the present application. Any modification, equivalent replacement and improvement within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims

1. A flexible circuit board shaping and positioning device, characterized in that: The flexible circuit board shaping and positioning device includes a carrier assembly and at least one shaping assembly, wherein the carrier assembly is used to place the flexible circuit board, and the shaping assembly is arranged on one side of the carrier assembly; The shaping assembly includes a side thrust cylinder, a shaping push block and a shaping block. The shaping block is provided on one side of the shaping push block, and the side thrust cylinder is provided on the other side. The side thrust cylinder is used to push the shaping push block and the shaping block. The shaping block includes a first shaping block and a second shaping block, wherein the first shaping block and the second shaping block are arranged on one side of the shaping push block, and the pushing direction of the shaping block is neither parallel nor perpendicular to the side of the carrier assembly; The shaping block is neither parallel nor perpendicular to the side of the flexible circuit board.

2. The flexible circuit board shaping and positioning device according to claim 1, characterized in that: The shaping assembly further comprises a hard limit block and an adjusting screw. The hard limit block is fixedly arranged on the carrier assembly, and the hard limit block is connected to the shaping push block via the adjusting screw.

3. The flexible circuit board shaping and positioning device according to claim 2, characterized in that: The shaping assembly further comprises a linear guide rail, which is slidably connected to the shaping push block.

4. The flexible circuit board shaping and positioning device according to claim 1, characterized in that: The carrier plate assembly includes a shaping carrier plate and a support frame. The shaping carrier plate is arranged on the support frame, and the height of the support frame is adjustable.

5. The flexible circuit board shaping and positioning device according to claim 4, characterized in that: The flexible circuit board shaping and positioning device also includes a camera assembly, which is arranged on the support frame and located below the shaping carrier plate, and is used to identify the QR code of the flexible circuit board.

6. The flexible circuit board shaping and positioning device according to claim 5, characterized in that: The camera assembly includes a lens, a camera and a light source. The lens and the camera are arranged on the support frame and located below the shaping carrier. The light source is fixedly arranged below the shaping carrier.

7. A flexible circuit board shaping and positioning method, applied to the flexible circuit board shaping and positioning device according to any one of claims 1 to 6, characterized in that: The flexible circuit board shaping and positioning method comprises the following steps: Placing the flexible circuit board on the shaped carrier; Start the side push cylinder of the shaping assembly to push the shaping push block and the shaping block so that the shaping block is close to the shaping carrier plate; Controlling the shaping block to push the flexible circuit board in an inclined direction; According to the positioning gap of the flexible circuit board, adjust the adjusting screw on the hard limit block during the advancement process; After adjustment is in place, the vacuum adsorption assembly on the shaping carrier is turned on; The camera component is used to scan and identify the QR code on the bottom of the flexible circuit board and transmit the data to the control module; The flexible circuit board is removed from the shaping carrier.

Citation Information

Patent Citations

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