MEMS inertial measurement unit vibration reduction decoupling design method based on space four-point vibration reduction

Abstract

The invention relates to the technical field of vibration reduction design, and discloses an MEMS inertial measurement unit vibration reduction decoupling design method based on space four-point vibration reduction, and the method comprises the following steps: selecting a space diagonal four-point vibration reduction scheme to carry out MEMS inertial measurement unit design; carrying out fine modeling on the MEMS inertial measurement unit by utilizing three-dimensional modeling software, and carrying out eccentricity analysis; according to the design requirement of the MEMS inertial measurement unit vibration reduction system, the first-order frequency of the vibration reduction system is designed; determining the amplification factor of the vibration amplitude of the vibration reduction system according to the damping characteristic of the vibration reduction system; adjusting a vibration damping gasket according to the eccentricity analysis result, and determining the compression amount of the vibration damping gasket; according to the method, the MEMS inertial measurement unit is designed according to the first-order frequency of the vibration reduction system, the amplification factor of the vibration amplitude of the vibration reduction system and the amount of compression of the vibration reduction pad, the space diagonal four-point vibration reduction scheme is selected for design of the MEMS inertial measurement unit, and the problem of decoupling of linear motion and angular motion of space four-point vibration reduction design in engineering application is solved; and the environmental adaptability and reliability of vibration, impact and the like based on the MEMS inertial measurement unit are improved.

Description

Technical Field

[0001] The present invention relates to the technical field of vibration reduction design, and in particular to a MEMS inertial group vibration reduction decoupling design method based on spatial four-point vibration reduction. Background Art

[0002] Improving the accuracy of missile hits has always been the goal of continuous pursuit and exploration in weapons research and development. Inertial devices are the heart of control and guidance, and they are directly related to the control and navigation accuracy of weapon systems. This is bound to put higher and higher requirements on the accuracy of inertial devices, especially the accuracy in dynamic environments such as overload, vibration, and impact.

[0003] At present, great progress has been made in MEMS design technology, processing technology and basic raw materials. The performance indicators of silicon micro MEMS gyroscopes in static environments have reached the level of low-precision fiber optic gyroscopes. MEMS inertial measurement units are increasingly widely used in various weapon models due to their advantages such as small size and low cost. Compared with fiber optic gyroscopes, due to the natural disadvantages of their working principles, the accuracy of silicon micro MEMS gyroscopes is easily affected by dynamic environments such as overload, vibration, and shock. Therefore, improving the dynamic environment adaptability and reliability of MEMS inertial measurement units based on silicon micro MEMS gyroscopes and added meters has become a top priority in the design of MEMS inertial measurement units.

[0004] In view of the insufficient adaptability of the MEMS inertial measurement unit used in guided bombs to the on-board environment, the abnormally large number and large response of the gyro under vibration conditions, and the excessive zero offset of the meter vibration, vibration reduction design measures are taken for the MEMS inertial measurement unit. In the case that the gyro and meter themselves have limited ability to withstand vibration, the vibration resistance of the MEMS inertial measurement unit is improved to solve the problem that limits the application of MEMS inertial measurement units in harsh environments. Summary of the invention

[0005] In view of this, the present invention provides a MEMS inertial group vibration reduction decoupling design method based on spatial four-point vibration reduction to solve the problem of how to perform vibration reduction design.

[0006] In a first aspect, the present invention provides a MEMS inertial group vibration reduction decoupling design method based on spatial four-point vibration reduction, the method comprising:

[0007] The spatial diagonal four-point vibration reduction scheme is used for MEMS inertial group design;

[0008] Use 3D modeling software to fine-tune the MEMS inertial unit modeling and conduct eccentricity analysis;

[0009] According to the design requirements of the MEMS inertial group vibration reduction system, the first-order frequency of the vibration reduction system is designed;

[0010] Determine the amplification factor of the vibration reduction system amplitude according to the damping characteristics of the vibration reduction system;

[0011] Adjust the vibration damping pad according to the eccentricity analysis results and determine the compression amount of the vibration damping pad;

[0012] The vibration damper is designed according to the first-order frequency of the vibration damping system, the amplification factor of the vibration damping system amplitude and the compression of the vibration damping pad.

[0013] The present invention designs a MEMS inertial group by selecting a spatial diagonal four-point vibration reduction scheme that can achieve decoupling, and further designs and analyzes the eccentricity that affects the decoupling, the first-order frequency of the vibration absorber, the amplitude magnification, and the compression of the vibration pad, determines the main design parameters of the vibration absorber, and improves the environmental adaptability and reliability of the MEMS inertial group such as vibration and impact.

[0014] In an optional implementation, a three-dimensional modeling software is used to perform a refined modeling of the MEMS inertial unit and perform an eccentricity analysis, including:

[0015] The MEMS inertial group is finely modeled using 3D modeling software. Taking the elastic center coordinates as a reference, the structure is repeatedly adjusted to calculate the eccentricity of the vibration reduction part of the MEMS inertial group, and the eccentricity is controlled within a preset range.

[0016] The present invention uses three-dimensional modeling software to finely model the MEMS inertial group, and repeatedly adjusts the structure to control the eccentricity, thereby realizing the design analysis of the eccentricity that affects the decoupling.

[0017] In an optional embodiment, the MEMS inertial group vibration reduction system design requirements include that the angular vibration frequency of the vibration reducer is high and far away from the measurement bandwidth of the inertial group, and the vibration reducer frequency should avoid the gyro drive frequency, the gyro pickup frequency and the frequency difference between the gyro drive frequency and the gyro pickup frequency.

[0018] The present invention designs the angular vibration frequency of the vibration absorber according to the design requirements of the MEMS inertial group vibration reduction system to avoid amplification within the bandwidth and affecting the measurement of the real signal, and designs the vibration absorber frequency according to the relationship between the vibration absorber frequency and the gyroscope frequency to ensure that the in-band signal is not amplified or attenuated.

[0019] In an optional implementation, determining the amplification factor of the vibration reduction system amplitude according to the damping characteristics of the vibration reduction system includes:

[0020] Calculate the damping coefficient of the vibration reduction material based on the vibration reduction damping, the mass of the vibration reduction system and the vibration reduction stiffness;

[0021] The amplification factor of the vibration reduction system amplitude is calculated based on the damping coefficient of the vibration reduction material.

[0022] The present invention calculates the damping coefficient and the amplification factor according to the damping parameters of the shock absorber to evaluate the dynamic response characteristics of the shock absorption system at different frequencies.

[0023] In an optional implementation, adjusting the vibration damping pad according to the eccentricity analysis result to determine the compression amount of the vibration damping pad includes:

[0024] According to the eccentricity analysis results, determine the direction of the center of mass deviation;

[0025] The vibration damping pad is adjusted by adjusting the compression amount in the direction of the center of mass deviation, so that the stiffness of the shock absorber in the direction of the center of mass deviation is improved, thereby offsetting the line-angle coupling caused by the eccentricity.

[0026] The present invention adjusts the compression amount of the vibration damping pad according to the eccentricity analysis result to offset the line-angle coupling caused by the eccentricity and avoid unnecessary vibration.

[0027] In an optional embodiment, the method further includes:

[0028] Finite element analysis software is used to perform simulation analysis on the vibration reduction system, and the simulation analysis includes modal analysis and random vibration simulation analysis.

[0029] The present invention performs simulation analysis on the vibration reduction system, modal analysis, and random vibration simulation analysis on the vibration reduction system to evaluate whether the six degrees of freedom of the vibration reduction system are independent of each other, whether the first-order natural frequency meets the design requirements, whether the strength of the material meets the requirements, and analyze the frequency response characteristics.

[0030] In a second aspect, the present invention provides a MEMS inertial group vibration reduction decoupling design system based on spatial four-point vibration reduction, the system comprising:

[0031] The first design module is used to select a spatial diagonal four-point vibration reduction scheme for MEMS inertial group design;

[0032] The analysis module is used to use 3D modeling software to carry out detailed modeling of the MEMS inertial group and eccentricity analysis;

[0033] The second design module is used to design the first-order frequency of the vibration reduction system according to the design requirements of the MEMS inertial group vibration reduction system;

[0034] A first determination module, used to determine the amplification factor of the vibration reduction system amplitude according to the damping characteristics of the vibration reduction system;

[0035] The second determination module is used to adjust the vibration damping pad according to the eccentricity analysis result and determine the compression amount of the vibration damping pad;

[0036] The third design module is used to design the vibration damper according to the first-order frequency of the vibration damping system, the amplification factor of the amplitude of the vibration damping system and the compression amount of the vibration damping pad.

[0037] In a third aspect, the present invention provides a computer device, comprising: a memory and a processor, the memory and the processor being communicatively connected to each other, the memory storing computer instructions, and the processor executing the MEMS inertial group vibration reduction decoupling design method based on spatial four-point vibration reduction of the above-mentioned first aspect or any corresponding embodiment thereof by executing the computer instructions.

[0038] In a fourth aspect, the present invention provides a computer-readable storage medium having computer instructions stored thereon, the computer instructions being used to enable a computer to execute the MEMS inertial group vibration reduction decoupling design method based on spatial four-point vibration reduction according to the first aspect or any corresponding embodiment thereof.

[0039] In a fifth aspect, the present invention provides a computer program product, comprising computer instructions for causing a computer to execute the MEMS inertial group vibration reduction decoupling design method based on spatial four-point vibration reduction according to the first aspect or any corresponding embodiment thereof. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0041] Figure 1 is a schematic diagram of different vibration reduction modes according to an embodiment of the present invention;

[0042] Figure 2 It is a flow chart of a method for designing a vibration reduction decoupling of a MEMS inertial group based on spatial four-point vibration reduction according to an embodiment of the present invention;

[0043] Figure 3 is a schematic structural diagram of a MEMS inertial group according to an embodiment of the present invention;

[0044] Figure 4 is a schematic diagram of a six-degree-of-freedom equivalent model according to an embodiment of the present invention;

[0045] Figure 5 1 is an amplitude-frequency and phase-frequency characteristic curve when the low-pass cut-off frequency is 120 Hz according to an embodiment of the present invention;

[0046] Figure 6 is a schematic diagram of the eccentricity relative to the elastic center according to an embodiment of the present invention;

[0047] Figure 7is a relationship diagram between the amplitude magnification factor and the damping ratio of the second-order damping system according to an embodiment of the present invention;

[0048] Figure 8 is a schematic structural diagram of a shock absorber with adjustable compression according to an embodiment of the present invention;

[0049] Fig. 9 is a schematic diagram of a modal simulation result according to an embodiment of the present invention;

[0050] Fig.10 is a schematic diagram of vibration shapes of the first six modes according to an embodiment of the present invention;

[0051] Fig.11 is a stress cloud diagram of random vibration simulation analysis according to an embodiment of the present invention;

[0052] Fig.12 is a deformation diagram of random vibration simulation analysis according to an embodiment of the present invention;

[0053] Fig.13 is a schematic diagram of the X-axis translation PSD response of the gyro installation position according to an embodiment of the present invention;

[0054] Fig.14 is a schematic diagram of a Y-axis translation PSD response of a gyro installation position according to an embodiment of the present invention;

[0055] Fig.15 is a schematic diagram of a Z-axis translation PSD response of a gyro installation position according to an embodiment of the present invention;

[0056] Fig.16 is a random vibration PSD curve diagram according to an embodiment of the present invention;

[0057] Fig.17 is a schematic diagram of changes in triaxial gyro vibration data and triaxial gyro vibration data when no vibration reduction is performed according to an embodiment of the present invention;

[0058] Fig.18 is a schematic diagram of changes in 1s smoothed vibration data of a three-axis gyroscope without vibration reduction and 1s smoothed vibration data of a three-axis gyroscope with vibration reduction according to an embodiment of the present invention;

[0059] Fig.19 is a schematic diagram of changes in triaxial gyro vibration data and triaxial gyro vibration data after vibration reduction according to an embodiment of the present invention;

[0060] Fig. 20 is a schematic diagram of changes in 1s smoothed vibration data of a three-axis gyroscope after vibration reduction and 1s smoothed vibration data of a three-axis gyroscope after vibration reduction according to an embodiment of the present invention;

[0061] Fig.21is a structural block diagram of a MEMS inertial group vibration reduction decoupling design system based on spatial four-point vibration reduction according to an embodiment of the present invention;

[0062] Fig. 22 It is a schematic diagram of the hardware structure of a computer device according to an embodiment of the present invention. DETAILED DESCRIPTION

[0063] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention.

[0064] In view of the problem that silicon micro MEMS gyroscopes and accelerometers are easily affected by the external environment, vibration reduction design measures are proposed to reduce the impact of stresses such as vibration, impact, and temperature changes on the performance of sensitive components, and effectively improve the environmental adaptability and long-term reliability of sensitive components.

[0065] In engineering, due to the small size and light weight of the MEMS inertial group, there is a high risk of deviation between the center of mass and the elastic center of the vibration reduction. The hardness and damping parameter matching design of the shock absorber are difficult. These problems lead to difficulties in the selection and design analysis of the MEMS inertial group vibration reduction scheme. It is urgent to solve these difficulties from the aspects of theoretical analysis, simulation analysis and experimental verification, so as to improve the environmental adaptability and stability of the MEMS inertial group, as well as the accuracy of indicators in dynamic environments.

[0066] Existing MEMS inertial group vibration reduction technologies mostly use eight-point vibration reduction, waist four-point vibration reduction and spatial four-point vibration reduction. The eight-point vibration reduction method occupies a large volume for the small MEMS inertial group, which makes the MEMS inertial group lose its small size advantage. The waist four-point vibration reduction method and the spatial four-point vibration reduction method are prone to cause the coupling problem of linear motion and angular motion, and there is no substantial solution.

[0067] As an inertial coordinate reference and inertial measurement device, the working accuracy and reliability of the MEMS in a dynamic environment directly affect the flight accuracy of the aircraft. In general, the MEMS inertial group vibration reduction system can vibrate in translation along the three coordinate axes, or rotate around the three coordinate axes. Each translation or rotation of the system has its natural frequency, so there are a total of 6 degrees of freedom.

[0068] In order to reduce the adverse effects of vibration, the MEMS inertial group is often elastically connected to the body through a rubber shock absorber, that is, the overall vibration reduction measure is taken. The selection of the vibration reduction mode not only affects the vibration reduction performance of the MEMS inertial group, but also affects the measurement accuracy of the system. The actual vibration reduction modes that can be used are very limited. At present, there are three main vibration reduction modes that can be theoretically decoupled through theoretical analysis, such as Figure 1 As shown in a to c. Among the three vibration reduction methods, the angular vibration of the eight-point vibration reduction and the spatial diagonal four-point vibration reduction can completely exceed the linear vibration; the angular vibration frequency of the waist four-point vibration reduction method is lower than that of the other two vibration reduction methods.

[0069] As an inertial coordinate reference and inertial measurement device, the working accuracy and reliability of the MEMS in a dynamic environment directly affect the flight accuracy of the aircraft. In general, the MEMS inertial group vibration reduction system can vibrate in translation along the three coordinate axes, or rotate around the three coordinate axes. Each translation or rotation of the system has its natural frequency, so there are a total of 6 degrees of freedom.

[0070] Compared with other electronic equipment vibration reduction, the vibration reduction requirements for inertial products are more stringent. Not only are there requirements for resonance frequency, amplification factor, vibration reduction efficiency, etc., but also due to its working characteristics, there are the following special requirements for the design of the vibration absorber:

[0071] (1) The vibration reduction mode is selected to make the vibrations in the six degrees of freedom independent and non-coupled, so as to avoid the vibration coupling introducing unreal signals in other degrees of freedom and causing error accumulation in the control of the inertial navigation system;

[0072] (2) The angular vibration frequency of the shock absorber is high and far away from the measurement bandwidth of the inertial group, avoiding amplification within the band and affecting the measurement of the real signal;

[0073] (3) Make the line vibration frequency lower than the angular vibration frequency as much as possible. Under random vibration, the lower the line vibration frequency, the better the vibration reduction effect on high-frequency signals;

[0074] (4) The designed vibration damper frequency should avoid the gyro's driving frequency, pickup frequency, and the frequency difference between the two;

[0075] (5) The line vibration frequencies in the three directions should be as similar and concentrated as possible.

[0076] For MEMS inertial groups based on silicon micro-sensitive elements, small size and light weight are their natural advantages, but they also bring great difficulties to vibration decoupling in engineering, especially the spatial diagonal four-point vibration reduction. Compared with the eccentricity of the same elastic center and center of mass of the fiber optic gyro inertial group and laser gyro inertial group, the MEMS inertial group has a much larger relative proportion of eccentricity due to its small size, and the impact on vibration coupling is also much greater. Therefore, for the MEMS inertial group, a reasonable design of the eccentricity is necessary. In addition, the design of the main parameters of the vibration absorber, such as the first-order natural frequency and amplification factor, is also crucial.

[0077] According to an embodiment of the present invention, an embodiment of a MEMS inertial group vibration reduction decoupling design method based on spatial four-point vibration reduction is provided. It should be noted that the steps shown in the flowchart of the accompanying drawings can be executed in a computer system such as a set of computer executable instructions, and although a logical order is shown in the flowchart, in some cases, the steps shown or described can be executed in an order different from that shown here.

[0078] In this embodiment, a MEMS inertial group vibration reduction decoupling design method based on spatial four-point vibration reduction is provided. Figure 2 FIG. 1 is a flow chart of a MEMS inertial group vibration reduction decoupling design method based on spatial four-point vibration reduction according to an embodiment of the present invention. Figure 2 As shown, the process includes the following steps:

[0079] Step S201, selecting a spatial diagonal four-point vibration reduction scheme to design a MEMS inertial group.

[0080] In the embodiment of the present invention, based on the vibration reduction design requirements of the MEMS inertial group, taking into account the need to increase the vibration reduction space as small as possible and not to make the MEMS inertial group lose its advantage of small size due to the addition of the vibration reduction system, a spatial diagonal four-point vibration reduction solution is selected.

[0081] like Figure 3 As shown, the MEMS inertial group includes three silicon micro MEMS gyroscopes, three MEMS accelerometers, power circuit, data processing circuit, vibration damper, mounting structure and base structure. The whole machine weighs 89g, of which the effective mass of vibration damping is 55g, and the overall size of the whole machine is 43*43*35 (unit: mm).

[0082] In mechanical analysis, the shock absorber is generally regarded as an elastic body, and the IMU part supported by its vibration reduction system is regarded as a rigid body. The dynamic model of the strapdown inertial unit using the four-point vibration reduction scheme in space can be used as follows: Figure 4 The six-degree-of-freedom equivalent model shown in the figure is used for approximate simulation. A rectangular coordinate system oxyz is established at the center of mass of the equivalent model, and the directions of the coordinate axes are as follows Figure 4When the damping effect is ignored, the dynamic differential equation of the system when it is free vibrating in space can be written as follows.

[0083]

[0084] Among them, M is the total mass of the vibration reduction system, K is the total stiffness of the vibration reduction system, and x is the displacement of the vibration reduction system.

[0085] The dynamic differential equation decomposed into the coordinate system can be written as follows:

[0086]

[0087]

[0088] I xx =∫(y 2 +z 2 )dm,I yy =∫(x 2 +z 2 )dm,I zz =∫(x 2 +y 2 )dm;

[0089] I xy =I yx =∫yzdm,I yz =I zy =∫xzdm,I xz =I zx =∫xydm;

[0090] Where m is the mass of the vibration reduction system, I x ,I y ,I z are the moments of inertia of the inertia group around the x, y, and z axes, respectively, xy ,I yz ,I zx are the inertia products of the inertia group relative to the x, y, and z axes, respectively, and K x , K y , K z are the total stiffness of the shock absorber along the x, y, and z axes, respectively, and K xx , K yy , K zz is the torsional stiffness of the system when it rotates around the coordinate axis, is the angular displacement around the three axes, R xy , R yx , R zx , R xz , R yz , R zyThey are the linear rotational stiffness of each plane relative to the three coordinate planes of the system, k xi , k yi , k zi are the stiffness of the ith shock absorber in the x, y and z directions, n is the number of shock absorbers, n = 4, l xi , l yi , l zi are the coordinate values ​​of the i-th shock absorber installation.

[0091] Assuming that the center of mass coincides with the elastic center, the model

[0092] I xy =I yx =I yz =I zy =I zx =I xz =0

[0093] K xy =K yx =K yz =K zy =K zx =K xz =0

[0094] R xy =R yx =R yz =R zy =R zx =R xz =0

[0095] Substituting into formula (1-2), we get

[0096]

[0097] It can be seen from the above formula (1-3) that when the center of mass coincides with the elastic center, theoretically the six degrees of freedom are independent of each other and no coupling will occur.

[0098] Step S102: Use three-dimensional modeling software to perform detailed modeling of the MEMS inertial system and perform eccentricity analysis.

[0099] In the embodiment of the present invention, it can be known through theoretical analysis that only when the center of mass coincides with the elastic center (that is, the eccentricity is zero), the six degrees of freedom can be independent of each other and no coupling occurs. However, in actual engineering applications, the eccentricity can only be as small as possible, but cannot be completely eliminated. If the eccentricity is not zero, the linear vibration in one direction will be coupled to the angular motion in other directions, causing the inertial group gyro to produce false output. The control of the eccentricity is extremely important to avoid linear and angular coupling. Therefore, the MEMS inertial group is finely modeled using three-dimensional modeling software to perform eccentricity analysis.

[0100] Step S103, designing the first-order frequency of the vibration reduction system according to the design requirements of the MEMS inertial group vibration reduction system.

[0101] In the embodiment of the present invention, according to the second special requirement for the design of the MEMS inertial group vibration reduction system: the angular vibration frequency of the vibration absorber is high and far away from the measurement bandwidth of the inertial group to avoid amplification within the band and affect the measurement of the real signal.

[0102] The MEMS inertial group is used in a certain type of guided bomb system. The measurement bandwidth required by the system is 100Hz. In order to ensure that the angular velocity and linear acceleration measured by the MEMS inertial group are real and effective within the band, and the phase delay is less than 90°, according to the measurement bandwidth required by the system, a 2nd-order IIR low-pass filter is generally required in the MEMS inertial group. In order to ensure the bandwidth and delay requirements, the bandwidth is generally set to 1.2 to 1.5 times the bandwidth requirement, such as Figure 5 As shown, the amplitude-frequency and phase-frequency characteristic curves when the sampling frequency is 1k and the low-pass cutoff frequency is 120hz, where: Figure 5 The blue curve in the middle is the amplitude-frequency characteristic curve, and the green curve is the phase-frequency characteristic curve.

[0103] For the inertial vibration reduction system, in order to ensure that the in-band signal is not amplified or attenuated, the first-order natural frequency of the vibration reduction system is generally designed to be greater than twice the measurement bandwidth, that is, greater than 240 Hz.

[0104] According to Article 4 of the special design requirements for the inertial group vibration reduction system mentioned above: the designed vibration absorber frequency should avoid the gyroscope's driving frequency, pickup frequency and the frequency difference between the two.

[0105] The gyroscopes used in the embodiments of the present invention are domestically produced silicon micro-MEMS gyroscopes. The driving frequencies and frequency differences of the three gyroscopes are shown in Table 1 below. The first three frequencies of the designed vibration reduction system need to avoid the frequencies listed in the table. For the convenience of design, the first-order natural frequency is generally greater than the maximum frequency difference of 80 Hz, that is, the first-order natural frequency needs to be greater than 388 Hz.

[0106] Table 1 Gyro driving frequency and frequency difference

[0107]

[0108]

[0109] In summary, the first-order natural frequency of the vibration reduction system in the embodiment of the present invention needs to be greater than 400 Hz.

[0110] Step S104: determining the amplification factor of the vibration reduction system amplitude according to the damping characteristics of the vibration reduction system.

[0111] In the embodiment of the present invention, the damping characteristic of the vibration reduction system determines the amplification factor of the vibration reduction system amplitude, and the damping characteristic of the vibration reduction system is determined by the damping of the vibration reduction system, the mass of the vibration reduction system, and the stiffness of the vibration reduction system.

[0112] Step S105, adjusting the vibration damping pad according to the eccentricity analysis result to determine the compression amount of the vibration damping pad.

[0113] In the embodiment of the present invention, because the MEMS inertial group is in an overload environment such as vibration and impact, it is necessary to ensure that the zero position change of the gyroscope and the gauge is as small as possible, so the vibration damping pad cannot be in a free state and must be compressed. According to the eccentricity analysis result, the vibration damping pad is adjusted to determine the compression amount of the vibration damping pad to compensate for the eccentricity problem.

[0114] Step S106, designing a vibration damper according to the first-order frequency of the vibration damping system, the amplification factor of the vibration damping system amplitude and the compression amount of the vibration damping pad.

[0115] In the embodiment of the present invention, the vibration damper is designed after the first-order frequency of the vibration damping system, the amplification factor of the vibration damping system amplitude and the compression amount of the vibration damping pad are determined, that is, the main design parameters of the vibration damper are determined.

[0116] The MEMS inertial group vibration reduction and decoupling design method based on spatial four-point vibration reduction provided in this embodiment is designed by selecting a spatial diagonal four-point vibration reduction scheme that can achieve decoupling for MEMS inertial group design, and further design and analyze the eccentricity, first-order frequency of the vibration absorber, amplitude magnification, and compression of the vibration pad that affect the decoupling, determine the main design parameters of the vibration absorber, and improve the environmental adaptability and reliability of the MEMS inertial group such as vibration and impact.

[0117] In this embodiment, a MEMS inertial group vibration reduction decoupling design method based on spatial four-point vibration reduction is provided, and the process includes the following steps:

[0118] Step S201, selecting a spatial diagonal four-point vibration reduction scheme to design a MEMS inertial system, wherein the MEMS inertial system includes a vibration reducer.

[0119] For details, please see Figure 1 Step S101 of the illustrated embodiment will not be described in detail here.

[0120] Step S202: Use 3D modeling software to perform detailed modeling of the MEMS inertial system and conduct eccentricity analysis.

[0121] Specifically, the above step S202 includes:

[0122] Step S2021, use three-dimensional modeling software to perform fine modeling of the MEMS inertial group, use the elastic center coordinates as a reference, repeatedly adjust the structure, calculate the eccentricity of the vibration reduction part of the MEMS inertial group, and control the eccentricity within a preset range.

[0123] In the embodiment of the present invention, the CREO three-dimensional modeling software is used to finely model the inertial group. The eccentricity of the vibration reduction part of the inertial group is calculated by repeatedly adjusting the structure based on the elastic center coordinates, such as Figure 6 As shown in the figure, through refined modeling and adjustment, the eccentricity of the system is extremely small, and the error is controlled within 5‰.

[0124] The MEMS inertial group is finely modeled using 3D modeling software, and the structure is repeatedly adjusted to control the eccentricity, thereby achieving design analysis of the eccentricity that affects decoupling.

[0125] Step S203, designing the first-order frequency of the vibration reduction system according to the design requirements of the MEMS inertial group vibration reduction system.

[0126] For details, please see Figure 1 Step S103 of the illustrated embodiment will not be described in detail here.

[0127] Step S204: determining the amplification factor of the vibration reduction system amplitude according to the damping characteristics of the vibration reduction system.

[0128] Specifically, the above step S204 includes:

[0129] Step S2041, calculating the damping coefficient of the vibration reduction material according to the vibration reduction damping, the mass of the vibration reduction system and the stiffness of the vibration reduction device.

[0130] Step S2042, calculating the amplification factor of the vibration reduction system amplitude according to the damping coefficient of the vibration reduction material.

[0131] In the embodiment of the present invention, the damping characteristic of the vibration reduction system determines the amplification factor of the vibration reduction system amplitude, and the calculation formula is:

[0132] Q≈1 / 2(1-4)

[0133] Among them, Q is the system amplitude magnification, ζ is the damping coefficient of the vibration reduction material, Among them, c is the damping of the shock absorber, m is the mass of the vibration reduction system, and k is the stiffness of the shock absorber.

[0134] like Figure 7 As shown, Figure 7 is the system amplitude magnification curve under different damping coefficients, Figure 7 It can be seen that the greater the damping, the smaller the system amplitude magnification. However, in practical applications, the damping coefficient is related to the material and cannot be blindly small. An acceptable value must be selected.

[0135] The size of the amplification factor depends on the vibration resistance of the sensitive element itself at the low-order natural frequency of the vibration reduction system (generally considering the first three orders). For example, the vibration resistance of the gyro sensitive element itself in the low-order natural frequency range is 1000g. When the system needs to withstand a 500g impact, the amplification factor of the vibration reduction system must be less than 2.

[0136] In general engineering, when the system needs to withstand vibration and impact of a small magnitude, the amplification factor is 3 to 5; when the vibration and impact are large, the amplification factor is 2 to 3.

[0137] After determining the amplification factor, the damping coefficient of the selected material can be determined. According to the vibration resistance of the selected gyroscope and gauge and the overload environmental conditions such as vibration and impact that the system needs to withstand in this project, the maximum acceptable amplification factor is 2.5, so the damping coefficient of the shock absorber rubber material ζ ≥ 0.2.

[0138] The damping coefficient and amplification factor are calculated according to the damping parameters of the shock absorber to evaluate the dynamic response characteristics of the vibration reduction system at different frequencies.

[0139] Step S205, adjusting the vibration damping pad according to the eccentricity analysis result to determine the compression amount of the vibration damping pad.

[0140] Specifically, the above step S205 includes:

[0141] Step S2051, determining the center of mass deviation direction according to the eccentricity analysis result.

[0142] Step S2052, adjusting the vibration damping pad by adjusting the compression amount in the direction of the center of mass deviation, so as to increase the stiffness of the vibration damper in the direction of the center of mass deviation and offset the line-angle coupling caused by the eccentricity.

[0143] In the embodiment of the present invention, because the MEMS inertial group is in an overload environment such as vibration and impact, it is necessary to ensure that the zero position change of the gyro and the gauge is as small as possible, so the vibration damping pad cannot be in a free state and must be compressed. The compression of the rubber material shock absorber is generally controlled at 10% to 20%, which can achieve better results.

[0144] According to the eccentricity obtained in the eccentricity analysis, we can know which direction the center of mass is biased. The existence of eccentricity will cause the coupling of the linear motion and angular motion of the inertial group, causing the inertial group to produce false output. In order to solve the problem that the eccentricity of the design cannot be completely eliminated in actual engineering, the compression adjustment gasket in the corresponding direction is adjusted to slightly increase the stiffness of the shock absorber in that direction to offset the linear angle coupling caused by the eccentricity. Design a shock absorber with adjustable compression, such as Figure 8 As shown, the eccentricity problem can be compensated by adjusting the compression amount of the vibration damping pad.

[0145] By adjusting the compression of the vibration damping pad according to the eccentricity analysis results, the line-angle coupling caused by the eccentricity can be offset to avoid unnecessary vibration.

[0146] Step S206, designing a vibration damper according to the first-order frequency of the vibration damping system, the amplification factor of the vibration damping system amplitude, and the compression amount of the vibration damping pad.

[0147] For details, please see Figure 1 Step S106 of the illustrated embodiment will not be described in detail here.

[0148] Step S207: using finite element analysis software to perform simulation analysis on the vibration reduction system, the simulation analysis including modal analysis and random vibration simulation analysis.

[0149] In the embodiment of the present invention, the vibration reduction effect of the vibration reduction system is simulated and analyzed using finite element analysis software ANSYS.

[0150] The analysis mainly focuses on the following aspects.

[0151] (1) Through modal analysis, evaluate whether the six degrees of freedom of the vibration reduction system are independent of each other and not coupled with each other;

[0152] (2) Calculate the first-order natural frequency of the vibration reduction system through modal analysis to see if it meets the design requirements;

[0153] (3) Through random vibration simulation analysis, the maximum stress and deformation of the system under vibration conditions are analyzed to evaluate whether the strength of the material meets the requirements;

[0154] (4) Through random vibration simulation analysis, the PSD response curve of the sensitive element installation location is output and the frequency response characteristics are analyzed.

[0155] a) Modal analysis:

[0156] After setting the material properties and boundary conditions, the modal simulation analysis of the inertial group is carried out. The results of the first 15 modal responses are as follows: Fig. 9 shown.

[0157] pass Fig. 9 It can be seen that the first-order mode of the inertial vibration reduction system is 742 Hz, which is greater than 388 Hz and meets the design requirements. The vibration shapes of the first six modes are as follows Fig.10 As shown in the figure. It can be seen from the figure that the first six modes are motion along the z-axis, motion along the x-axis, motion along the y-axis, angular motion around the y-axis, angular motion around the x-axis, and angular motion around the z-axis. Each mode is independent of each other and there is no mutual coupling. The first three-order linear motion modes are concentrated at (740-800) Hz, and the last three-order angular motion modes are far away from the linear motion modes and concentrated at (1100-1200) Hz, which meets the requirements of the inertial group vibration reduction design.

[0158] b) Random vibration simulation analysis

[0159] According to the standard 6.06g random vibration test conditions, simulation analysis is carried out. Taking the axial direction with the largest stress as an example, the stress cloud diagram is as follows Fig.11 As shown in the deformation diagram, Fig.12 As shown in the figure, the maximum stress is 1.69MPa, and the maximum stress is concentrated on the limit screw (material 304 stainless steel), which is much smaller than the allowable strength of the material 205MPa. The maximum deformation is 4.04um, and the maximum deformation occurs in the vibration damping rubber pad, which is within the allowable deformation of the rubber.

[0160] Take the X direction as an example for analysis. Apply 1G in the X direction of the system within the range of (20~2000) Hz 2 / Hz random excitation, the PSD response of the gyro installation position in three directions is as follows Figure 13 to Figure 15 The random vibration PSD curve is shown in Fig.16 As shown. The square of the resonance peak value (i.e., magnification) of the system amplitude-frequency characteristic is the ordinate of the PSD response curve. After conversion, the resonance response frequency and magnification are shown in Table 2. As can be seen from Table 2, when a translational excitation is applied to the X-axis, the response is mainly on the X-axis, and the other two axes are very small, indicating that no coupling is caused. Fig.13 It can be seen that the system decays quickly after the resonance frequency, indicating that the vibration reduction system has a significant effect on high-frequency attenuation.

[0161] Table 2 Response frequency and magnification (X-axis excitation)

[0162] X-axis linear excitation X-axis translation Y axis translation Z axis translation Response frequency(Hz) 814.61 849.46 921.68 Magnification 2.43 0.007 0.065

[0163] From the simulation analysis, it can be seen that the maximum amplification factor of the vibration reduction system at the resonant frequency is 2.43, which meets the design requirements of the amplification factor.

[0164] The MEMS inertial group vibration reduction decoupling design method based on spatial four-point vibration reduction provided in this embodiment performs simulation analysis on the vibration reduction system, modal analysis, and random vibration simulation analysis on the vibration reduction system to evaluate whether the six degrees of freedom of the vibration reduction system are independent of each other, whether the first-order natural frequency meets the design requirements, whether the strength of the material meets the requirements, and analyze the frequency response characteristics.

[0165] The test verification process is described below:

[0166] (1) Test conditions

[0167] In order to verify the rationality of the shock absorber design and the correctness of the simulation analysis, a random vibration test is carried out on the product. The random vibration conditions are as follows:

[0168] a) Frequency range: 20Hz~2000Hz;

[0169] b) Vibration direction: X, Y, Z directions;

[0170] c) Vibration time: 5 minutes in each direction;

[0171] d) Power on the product for testing before and after vibration, and monitor the power-on data of the product during random vibration.

[0172] Fix the product on a horizontal slide and perform a random vibration test on it. The following takes the random vibration in the X direction as an example.

[0173] 1) Experimental data analysis

[0174] The IMU base is fixed to the base with a rigid pad. The vibration data without vibration reduction is as follows: Figure 17-18 As shown in the figure, during the vibration process, the x-axis gyro and the z-axis gyro had large values, the maximum value reached 200° / s, and the zero position of the Y-axis plus the table vibration was 12mg.

[0175] The vibration data of the inertia group after adding vibration reduction is as follows Figure 19-20 As shown in the figure, it can be seen that after adding vibration reduction, the gyro table data is normal, there is no large response, and the linear vibration does not cause angular motion coupling.

[0176] The vibration reduction effect of the vibration reduction system was analyzed by comparing the maximum peak-to-peak value of each axial vibration and the change of zero position before and during vibration. The results are shown in Table 3.

[0177] Table 3 Comparison of vibration reduction effects

[0178]

[0179]

[0180] It can be seen from Table 3 that after adding the vibration reduction system, the peak-to-peak value of the MEMS inertial group is reduced by more than 55.6%, and the zero position change before and during vibration is reduced by more than 46.4%. Combining the above two aspects, after adding the four-point vibration reduction at the diagonal angle, the vibration reduction design is effective, which improves the ability of the MEMS inertial group product to resist the vibration environment, greatly improves the performance indicators of the product in the dynamic vibration environment, and solves the problem that the MEMS inertial group cannot adapt to the dynamic vibration environment on a certain type of guided artillery shell.

[0181] The embodiment of the present invention establishes an equivalent mechanical model, theoretically analyzes that the spatial four-point vibration reduction method can achieve decoupling, further designs and analyzes the eccentricity and main parameters of the shock absorber that affect decoupling in engineering, and determines the main design parameters of the shock absorber. In order to solve the problem that the design eccentricity cannot be completely eliminated in actual engineering, a shock absorber with adjustable compression is designed. By adjusting the compression of the shock pad, the eccentricity problem is compensated, and the 6 degrees of freedom are completely decoupled in engineering. The 6 degrees of freedom are completely decoupled in engineering based on the spatial four-point vibration reduction scheme through finite element simulation analysis and experimental verification. The experimental data show that after adding the vibration reduction system, the peak-to-peak value of the MEMS inertial group in each axial direction is reduced by more than 55.6%, and the zero position change before and during vibration is reduced by more than 46.4%, which improves the environmental adaptability and reliability of vibration, impact, etc. based on the MEMS inertial group.

[0182] In this embodiment, a MEMS inertial group vibration reduction decoupling design system based on spatial four-point vibration reduction is also provided. The system is used to implement the above-mentioned embodiments and preferred implementation modes, and the descriptions that have been made will not be repeated. As used below, the term "module" can be a combination of software and / or hardware that implements a predetermined function. Although the devices described in the following embodiments are preferably implemented in software, the implementation of hardware, or a combination of software and hardware, is also possible and conceivable.

[0183] This embodiment provides a MEMS inertial group vibration reduction decoupling design system based on spatial four-point vibration reduction, such as Fig.21 As shown, including:

[0184] The first design module 2101 is used to select a spatial diagonal four-point vibration reduction scheme to design a MEMS inertial group.

[0185] The analysis module 2102 is used to use three-dimensional modeling software to perform fine modeling of the MEMS inertial group and perform eccentricity analysis.

[0186] The second design module 2103 is used to design the first-order frequency of the vibration reduction system according to the design requirements of the MEMS inertial group vibration reduction system.

[0187] The first determination module 2104 is used to determine the amplification factor of the vibration reduction system amplitude according to the damping characteristics of the vibration reduction system.

[0188] The second determination module 2105 is used to adjust the vibration damping pad according to the eccentricity analysis result and determine the compression amount of the vibration damping pad.

[0189] The third design module 2106 is used to design the vibration damper according to the first-order frequency of the vibration damping system, the amplification factor of the vibration damping system amplitude and the compression amount of the vibration damping pad.

[0190] In some optional implementations, the first determining module 2104 includes:

[0191] The first calculation unit is used to calculate the damping coefficient of the vibration reduction material according to the damping of the vibration reduction device, the mass of the vibration reduction system and the stiffness of the vibration reduction device.

[0192] The second calculation unit is used to calculate the amplification factor of the vibration reduction system amplitude according to the damping coefficient of the vibration reduction material.

[0193] In some optional implementations, the second determining module 2105 includes:

[0194] The determination unit is used to determine the center of mass deviation direction according to the eccentricity analysis result.

[0195] The adjustment unit is used to adjust the vibration damping pad by adjusting the compression amount in the direction of the center of mass deviation, so as to increase the stiffness of the shock absorber in the direction of the center of mass deviation and offset the line-angle coupling caused by the eccentricity.

[0196] In some optional embodiments, the device further comprises:

[0197] The simulation module is used to perform simulation analysis on the vibration reduction system using finite element analysis software. The simulation analysis includes modal analysis and random vibration simulation analysis.

[0198] The further functional description of each of the above modules and units is the same as that of the above corresponding embodiments and will not be repeated here.

[0199] The MEMS inertial group vibration reduction decoupling design system based on spatial four-point vibration reduction in this embodiment is presented in the form of a functional unit, where the unit refers to an ASIC (Application Specific Integrated Circuit) circuit, a processor and memory that executes one or more software or fixed programs, and / or other devices that can provide the above functions.

[0200] The embodiment of the present invention also provides a computer device having the above Fig.21 The MEMS inertial group vibration reduction decoupling design system based on spatial four-point vibration reduction is shown.

[0201] See also Fig. 22 , Fig. 22 is a schematic diagram of the structure of a computer device provided by an optional embodiment of the present invention, such as Fig. 22As shown, the computer device includes: one or more processors 10, a memory 20, and interfaces for connecting various components, including high-speed interfaces and low-speed interfaces. Various components are connected to each other using different buses for communication, and can be installed on a common mainboard or installed in other ways as needed. The processor can process the instructions executed in the computer device, including instructions stored in or on the memory to display the graphical information of the GUI on an external input / output device (such as, a display device coupled to the interface). In some optional embodiments, if necessary, multiple processors and / or multiple buses can be used together with multiple memories and multiple memories. Similarly, multiple computer devices can be connected, and each device provides some necessary operations (for example, as a server array, a group of blade servers, or a multi-processor system). Fig. 22 A processor 10 is taken as an example.

[0202] The processor 10 may be a central processing unit, a network processor or a combination thereof. The processor 10 may further include a hardware chip. The hardware chip may be a dedicated integrated circuit, a programmable logic device or a combination thereof. The programmable logic device may be a complex programmable logic device, a field programmable gate array, a general purpose array logic or any combination thereof.

[0203] The memory 20 stores instructions executable by at least one processor 10, so that at least one processor 10 executes the method shown in the above embodiment.

[0204] The memory 20 may include a program storage area and a data storage area, wherein the program storage area may store an operating system, an application required for at least one function; the data storage area may store data created according to the use of the computer device, etc. In addition, the memory 20 may include a high-speed random access memory, and may also include a non-transient memory, such as at least one disk storage device, a flash memory device, or other non-transient solid-state storage device. In some optional embodiments, the memory 20 may optionally include a memory remotely arranged relative to the processor 10, and these remote memories may be connected to the computer device via a network. Examples of the above-mentioned network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.

[0205] The memory 20 may include a volatile memory, such as a random access memory; the memory may also include a non-volatile memory, such as a flash memory, a hard disk or a solid state drive; the memory 20 may also include a combination of the above types of memory.

[0206] The computer device also includes an input device 30 and an output device 40. The processor 10, the memory 20, the input device 30 and the output device 40 may be connected via a bus or other means. Fig. 22 The example of connecting through bus is taken in the following.

[0207] The input device 30 can receive input digital or character information and generate key signal input related to user settings and function control of the computer device, such as a touch screen, etc. The output device 40 can include a display device, etc.

[0208] The embodiment of the present invention also provides a computer-readable storage medium. The method according to the embodiment of the present invention can be implemented in hardware, firmware, or can be implemented as a computer code that can be recorded in a storage medium, or can be implemented as a computer code that is originally stored in a remote storage medium or a non-temporary machine-readable storage medium and will be stored in a local storage medium through a network download, so that the method described herein can be stored in such software processing on a storage medium using a general-purpose computer, a dedicated processor, or programmable or dedicated hardware. Among them, the storage medium can be a magnetic disk, an optical disk, a read-only storage memory, a random access memory, a flash memory, a hard disk or a solid-state hard disk, etc.; further, the storage medium can also include a combination of the above types of memories. It can be understood that a computer, a processor, a microprocessor controller, or programmable hardware includes a storage component that can store or receive software or computer code. When the software or computer code is accessed and executed by a computer, a processor, or hardware, the method shown in the above embodiment is implemented.

[0209] A part of the present invention may be applied as a computer program product, such as a computer program instruction, which, when executed by a computer, can call or provide the method and / or technical solution according to the present invention through the operation of the computer. Those skilled in the art should understand that the existence of the computer program instruction in a computer-readable medium includes, but is not limited to, a source file, an executable file, an installation package file, etc., and accordingly, the way in which the computer program instruction is executed by the computer includes, but is not limited to: the computer directly executes the instruction, or the computer compiles the instruction and then executes the corresponding compiled program, or the computer reads and executes the instruction, or the computer reads and installs the instruction and then executes the corresponding installed program. Here, the computer-readable medium may be any available computer-readable storage medium or communication medium accessible to the computer.

[0210] Although the embodiments of the present invention have been described in conjunction with the accompanying drawings, those skilled in the art may make various modifications and variations without departing from the spirit and scope of the present invention, and such modifications and variations all fall within the scope of the present application.

Claims

1. A MEMS inertial group vibration reduction decoupling design method based on spatial four-point vibration reduction, characterized in that: The method comprises: The spatial diagonal four-point vibration reduction scheme is used for MEMS inertial group design; Use 3D modeling software to fine-tune the MEMS inertial unit modeling and conduct eccentricity analysis; According to the design requirements of the MEMS inertial group vibration reduction system, the first-order frequency of the vibration reduction system is designed; Determine the amplification factor of the vibration reduction system amplitude according to the damping characteristics of the vibration reduction system; Adjust the vibration damping pad according to the eccentricity analysis results and determine the compression amount of the vibration damping pad; The vibration damper is designed according to the first-order frequency of the vibration damping system, the amplification factor of the vibration damping system amplitude and the compression amount of the vibration damping pad.

2. The method according to claim 1, characterized in that: The method of using three-dimensional modeling software to finely model the MEMS inertial group and perform eccentricity analysis includes: The MEMS inertial group is finely modeled using 3D modeling software. Taking the elastic center coordinates as a reference, the structure is repeatedly adjusted to calculate the eccentricity of the vibration reduction part of the MEMS inertial group, and the eccentricity is controlled within a preset range.

3. The method according to claim 1, characterized in that The design requirements of the MEMS inertial group vibration reduction system include that the angular vibration frequency of the vibration reducer is high and far away from the measurement bandwidth of the inertial group, and the vibration reducer frequency should avoid the gyro driving frequency, the gyro pickup frequency and the frequency difference between the gyro driving frequency and the gyro pickup frequency.

4. The method according to claim 1, characterized in that Determining the amplification factor of the vibration reduction system amplitude according to the damping characteristics of the vibration reduction system includes: Calculate the damping coefficient of the vibration reduction material based on the vibration reduction damping, the mass of the vibration reduction system and the vibration reduction stiffness; The amplification factor of the vibration reduction system amplitude is calculated based on the damping coefficient of the vibration reduction material.

5. The method according to claim 1, characterized in that The step of adjusting the vibration damping pad according to the eccentricity analysis result to determine the compression amount of the vibration damping pad includes: According to the eccentricity analysis results, determine the direction of the center of mass deviation; The vibration damping pad is adjusted by adjusting the compression amount in the direction of the center of mass deviation, so that the stiffness of the shock absorber in the direction of the center of mass deviation is improved, thereby offsetting the line-angle coupling caused by the eccentricity.

6. The method according to claim 1, characterized in that The method further comprises: The vibration reduction system is simulated and analyzed using finite element analysis software, wherein the simulation analysis includes modal analysis and random vibration simulation analysis.

7. A MEMS inertial group vibration reduction decoupling design system based on spatial four-point vibration reduction, characterized in that: The system comprises: The first design module is used to select a spatial diagonal four-point vibration reduction scheme for MEMS inertial group design; The analysis module is used to use 3D modeling software to carry out detailed modeling of the MEMS inertial unit and eccentricity analysis; The second design module is used to design the first-order frequency of the vibration reduction system according to the design requirements of the MEMS inertial group vibration reduction system; A first determination module, used to determine the amplification factor of the vibration reduction system amplitude according to the damping characteristics of the vibration reduction system; The second determination module is used to adjust the vibration damping pad according to the eccentricity analysis result and determine the compression amount of the vibration damping pad; The third design module is used to design the vibration absorber according to the first-order frequency of the vibration reduction system, the amplification factor of the amplitude of the vibration reduction system and the compression amount of the vibration reduction pad.

8. A computer device, characterized in that: include: A memory and a processor, wherein the memory and the processor are communicatively connected to each other, the memory stores computer instructions, and the processor executes the MEMS inertial group vibration reduction decoupling design method based on spatial four-point vibration reduction according to any one of claims 1 to 6 by executing the computer instructions.

9. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores computer instructions, and the computer instructions are used to enable a computer to execute the MEMS inertial group vibration reduction decoupling design method based on spatial four-point vibration reduction according to any one of claims 1 to 6.

10. A computer program product, characterized in that The method comprises computer instructions, wherein the computer instructions are used to enable a computer to execute the MEMS inertial group vibration reduction decoupling design method based on spatial four-point vibration reduction according to any one of claims 1 to 6.

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