A Vibration Damping and Decoupling Design Method for MEMS Inertial Assemblies Based on the Vibration Damping of Four Spatial Points

Abstract

The present invention relates to the technical field of vibration damping design, and discloses a vibration damping decoupling design method for a MEMS inertial assembly based on spatial four-point vibration damping. The method includes: selecting a spatial diagonal four-point vibration damping scheme for MEMS inertial assembly design; using 3D modeling software to perform refined modeling on the MEMS inertial assembly and conduct eccentricity analysis; designing the first-order frequency of the vibration damping system according to the design requirements of the MEMS inertial assembly vibration damping system; determining the magnification factor of the vibration amplitude of the vibration damping system according to the damping characteristics of the vibration damping system; adjusting the vibration damping gasket according to the eccentricity analysis result and determining the compression amount of the vibration damping pad; designing a shock absorber according to the first-order frequency of the vibration damping system, the magnification factor of the vibration amplitude of the vibration damping system and the compression amount of the vibration damping pad. The present invention selects a spatial diagonal four-point vibration damping scheme for MEMS inertial assembly design, solves the problem of decoupling of linear motion and angular motion in spatial four-point vibration damping design in engineering applications, and improves the environmental adaptability and reliability of vibration, shock, etc. based on MEMS inertial assemblies.

Description

Technical Field

[0001] The present invention relates to the technical field of vibration damping design, and particularly relates to a vibration damping decoupling design method for a MEMS inertial assembly based on four-point vibration damping in space. Background Art

[0002] Improving the hitting accuracy of missiles has always been the goal pursued and explored in weapon research and development. Inertial devices are the heart of control and guidance, which are directly related to the control and navigation accuracy of weapon systems. Therefore, higher requirements are bound to be put forward for the accuracy of inertial devices, especially the accuracy under dynamic environments such as overload, vibration, and shock.

[0003] At present, great progress has been made in MEMS design technology, processing technology, and basic raw materials. The performance indicators of silicon micro MEMS gyroscopes in a static environment have been able to reach the level of low-precision fiber optic gyroscopes. MEMS inertial measurement units are widely used in various weapon models due to their advantages such as small size and low cost. Compared with fiber optic gyroscopes, due to the natural disadvantages of their working principles, the accuracy of silicon micro MEMS gyroscopes is extremely vulnerable to dynamic environments such as overload, vibration, and shock. Therefore, improving the dynamic environment adaptability and reliability of MEMS inertial measurement units based on silicon micro MEMS gyroscopes and accelerometers has become the top priority in the design of MEMS inertial measurement units.

[0004] Aiming at the insufficient on-board environment adaptability of MEMS inertial measurement units for guided bombs, problems such as abnormal large numbers and large responses of gyroscopes under vibration conditions, and out-of-tolerance zero-position offsets during vibration of accelerometers, vibration damping design measures are taken for MEMS inertial measurement units. When the vibration resistance capabilities of gyroscopes and accelerometers themselves are limited, the vibration resistance of MEMS inertial measurement units is improved to solve the problem that restricts the application of MEMS inertial measurement units in harsh environments. Summary of the Invention

[0005] In view of this, the present invention provides a vibration damping decoupling design method for a MEMS inertial assembly based on four-point vibration damping in space to solve the problem of how to perform vibration damping design.

[0006] In a first aspect, the present invention provides a vibration damping decoupling design method for a MEMS inertial assembly based on four-point vibration damping in space, the method comprising:

[0007] Selecting a four-point vibration damping scheme on the space diagonal for MEMS inertial assembly design;

[0008] Performing refined modeling on the MEMS inertial assembly using three-dimensional modeling software and conducting eccentricity analysis;

[0009] Designing the first-order frequency of the vibration damping system according to the design requirements of the MEMS inertial assembly vibration damping system;

[0010] Determine the magnification factor of the amplitude of the vibration damping system according to the damping characteristics of the vibration damping system;

[0011] Adjust the vibration damping gasket according to the analysis result of the eccentricity, and determine the compression amount of the vibration damping pad;

[0012] Design the shock absorber according to the first-order frequency of the vibration damping system, the magnification factor of the amplitude of the vibration damping system, and the compression amount of the vibration damping pad.

[0013] In the present invention, a spatial diagonal four-point vibration damping solution capable of achieving decoupling is selected for the design of the MEMS inertial assembly, and further design analysis is carried out on the eccentricity, the first-order frequency of the shock absorber, the amplitude magnification factor, and the compression amount of the vibration damping pad that affect decoupling to determine the main design parameters of the shock absorber, so as to improve the environmental adaptability and reliability of vibration, shock, etc. based on the MEMS inertial assembly.

[0014] In an alternative embodiment, a three-dimensional modeling software is used to perform refined modeling on the MEMS inertial assembly for eccentricity analysis, including:

[0015] Use the three-dimensional modeling software to perform refined modeling on the MEMS inertial assembly, take the elastic center coordinates as the reference, repeatedly adjust the structure, calculate the eccentricity of the vibration damping part of the MEMS inertial assembly, and control the eccentricity within a preset range.

[0016] In the present invention, refined modeling of the MEMS inertial assembly is performed through three-dimensional modeling software, and the structure is repeatedly adjusted to control the eccentricity, so as to realize the design analysis of the eccentricity that affects decoupling.

[0017] In an alternative embodiment, the design requirements of the MEMS inertial assembly vibration damping system include that the angular vibration frequency of the shock absorber is high and far from the measurement bandwidth of the inertial assembly, and the shock absorber frequency should avoid the gyro drive frequency, the gyro pickup frequency, and the frequency difference between the gyro drive frequency and the gyro pickup frequency.

[0018] In the present invention, according to the design requirements of the MEMS inertial assembly vibration damping system, the angular vibration frequency of the shock absorber is designed to avoid amplification within the bandwidth and affect the measurement of the true signal, and the shock absorber frequency is designed according to the relationship between the shock absorber frequency and the gyro frequency to ensure that the in-band signal is not amplified or attenuated.

[0019] In an alternative embodiment, determining the magnification factor of the amplitude of the vibration damping system according to the damping characteristics of the vibration damping system includes:

[0020] Calculate the damping coefficient of the damping material according to the shock absorber damping, the mass of the vibration damping system, and the stiffness of the shock absorber;

[0021] Calculate the magnification factor of the amplitude of the vibration damping system according to the damping coefficient of the damping material.

[0022] The present invention calculates the damping coefficient according to the damping parameters of the shock absorber, calculates the magnification factor, and evaluates the dynamic response characteristics of the shock absorption system at different frequencies.

[0023] In an alternative embodiment, the shock absorption gasket is adjusted according to the eccentricity analysis result, and the compression amount of the shock absorption pad is determined, including:

[0024] According to the eccentricity analysis result, the direction of the centroid deviation is determined;

[0025] The shock absorption pad is adjusted by adjusting the compression amount in the direction of the centroid deviation, so that the stiffness of the shock absorber in the direction of the centroid deviation is increased to offset the linear angle coupling caused by the eccentricity.

[0026] The present invention adjusts the compression amount of the shock absorption pad according to the eccentricity analysis result to offset the linear angle coupling caused by the eccentricity and avoid unnecessary vibrations.

[0027] In an alternative embodiment, the method further includes:

[0028] The shock absorption system is simulated and analyzed by using finite element analysis software, and the simulation analysis includes modal analysis and random vibration simulation analysis.

[0029] The present invention evaluates whether the six degrees of freedom of the shock absorption system are independent, whether the first-order natural frequency meets the design requirements, evaluates whether the strength of the material meets the requirements, and analyzes the frequency response characteristics by performing modal analysis and random vibration simulation analysis on the shock absorption system through simulation analysis.

[0030] In a second aspect, the present invention provides a MEMS inertial unit shock absorption decoupling design system based on spatial four-point shock absorption, and the system includes:

[0031] A first design module, configured to select a spatial diagonal four-point shock absorption scheme for MEMS inertial unit design;

[0032] An analysis module, configured to perform refined modeling on the MEMS inertial unit by using three-dimensional modeling software and perform eccentricity analysis;

[0033] A second design module, configured to design the first-order frequency of the shock absorption system according to the design requirements of the MEMS inertial unit shock absorption system;

[0034] A first determination module, configured to determine the magnification factor of the amplitude of the shock absorption system according to the damping characteristics of the shock absorption system;

[0035] A second determination module, configured to adjust the shock absorption gasket according to the eccentricity analysis result and determine the compression amount of the shock absorption pad;

[0036] A third design module, configured to design a shock absorber according to the first-order frequency of the shock absorption system, the magnification factor of the amplitude of the shock absorption system, and the compression amount of the shock absorption pad.

[0037] In a third aspect, the present invention provides a computer device, comprising: a memory and a processor, which are communicatively connected to each other. The memory stores computer instructions, and the processor executes the computer instructions to perform the MEMS inertial unit vibration damping and decoupling design method based on spatial four-point vibration damping according to the first aspect or any corresponding embodiment thereof.

[0038] In a fourth aspect, the present invention provides a computer-readable storage medium, on which computer instructions are stored. The computer instructions are used to cause a computer to execute the MEMS inertial unit vibration damping and decoupling design method based on spatial four-point vibration damping according to the first aspect or any corresponding embodiment thereof.

[0039] In a fifth aspect, the present invention provides a computer program product, comprising computer instructions, which are used to cause a computer to execute the MEMS inertial unit vibration damping and decoupling design method based on spatial four-point vibration damping according to the first aspect or any corresponding embodiment thereof. Description of the Drawings

[0040] In order to more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following will briefly introduce the drawings required for the description of the specific embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0041] Figure 1 is a schematic diagram of different vibration damping modes according to an embodiment of the present invention;

[0042] Figure 2 is a schematic flowchart of the MEMS inertial unit vibration damping and decoupling design method based on spatial four-point vibration damping according to an embodiment of the present invention;

[0043] Figure 3 is a schematic structural diagram of a MEMS inertial unit according to an embodiment of the present invention;

[0044] Figure 4 is a schematic diagram of a six-degree-of-freedom equivalent model according to an embodiment of the present invention;

[0045] Figure 5 is an amplitude-frequency and phase-frequency characteristic curve when the low-pass cut-off frequency is 120 hz according to an embodiment of the present invention;

[0046] Figure 6 is a schematic diagram of the eccentricity relative to the elastic center according to an embodiment of the present invention;

[0047] Figure 7It is a diagram showing the relationship between the amplitude magnification factor and the damping ratio of a second-order damping system according to an embodiment of the present invention;

[0048] Figure 8 It is a schematic structural diagram of a shock absorber with adjustable compression according to an embodiment of the present invention;

[0049] Figure 9 It is a schematic diagram of the modal simulation result according to an embodiment of the present invention;

[0050] Figure 10 It is a schematic diagram of the vibration modes of the first six orders according to an embodiment of the present invention;

[0051] Figure 11 It is a stress nephogram of the random vibration simulation analysis according to an embodiment of the present invention;

[0052] Figure 12 It is a deformation diagram of the random vibration simulation analysis according to an embodiment of the present invention;

[0053] Figure 13 It is a schematic diagram of the X-axis translational PSD response of the gyro installation position according to an embodiment of the present invention;

[0054] Figure 14 It is a schematic diagram of the Y-axis translational PSD response of the gyro installation position according to an embodiment of the present invention;

[0055] Figure 15 It is a schematic diagram of the Z-axis translational PSD response of the gyro installation position according to an embodiment of the present invention;

[0056] Figure 16 It is a random vibration PSD curve diagram according to an embodiment of the present invention;

[0057] Figure 17 It is a schematic diagram of the change of the vibration data of the three-axis gyro and the vibration data of the three-axis accelerometer without shock absorption according to an embodiment of the present invention;

[0058] Figure 18 It is a schematic diagram of the change of the 1s smoothed vibration data of the three-axis gyro and the 1s smoothed vibration data of the three-axis accelerometer without shock absorption according to an embodiment of the present invention;

[0059] Figure 19 It is a schematic diagram of the change of the vibration data of the three-axis gyro and the vibration data of the three-axis accelerometer after shock absorption according to an embodiment of the present invention;

[0060] Figure 20 It is a schematic diagram of the change of the 1s smoothed vibration data of the three-axis gyro and the 1s smoothed vibration data of the three-axis accelerometer after shock absorption according to an embodiment of the present invention;

[0061] Figure 21It is a structural block diagram of a MEMS inertial unit vibration reduction and decoupling design system based on spatial four-point vibration reduction according to an embodiment of the present invention;

[0062] Figure 22 It is a schematic diagram of the hardware structure of a computer device according to an embodiment of the present invention. Specific embodiments

[0063] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some, but not all, of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0064] Aiming at the problem that silicon micro MEMS gyroscopes and accelerometers are extremely vulnerable to external environmental influences, vibration reduction design measures are proposed to reduce the influence of stresses such as vibration, shock, and temperature changes on the performance of sensitive components, and effectively improve the environmental adaptability and long-term reliability of sensitive components.

[0065] In engineering, due to the small size and light weight of MEMS inertial units, there is easily a deviation between the center of mass and the vibration reduction elastic center, and it is difficult to match the hardness and damping parameters of vibration reducers. These problems all lead to difficulties in the selection and design analysis of MEMS inertial unit vibration reduction schemes, and it is urgent to solve these difficulties from aspects such as theoretical analysis, simulation analysis, and experimental verification, in order to improve the environmental adaptability and stability of MEMS inertial units, as well as the index accuracy in a dynamic environment.

[0066] Existing MEMS inertial unit vibration reduction technologies mostly adopt eight-point vibration reduction, waist four-point vibration reduction, and spatial four-point vibration reduction methods. For MEMS inertial units with extremely small volumes, the eight-point vibration reduction method occupies a relatively large volume, causing MEMS inertial units to lose the advantage of small size. For the waist four-point vibration reduction method and the spatial four-point vibration reduction method, the problem of linear motion and angular motion coupling is easily caused and there is no substantial solution method.

[0067] As an inertial coordinate reference and inertial measurement device, the working accuracy and reliability of MEMS inertial units in a dynamic environment directly affect the flight accuracy of aircraft. Generally, the MEMS inertial unit vibration reduction system can translate and vibrate along the directions of 3 coordinate axes, and can also rotate and vibrate around 3 coordinate axes. Each translation or rotation of the system has its own natural frequency, so there are a total of 6 degrees of freedom.

[0068] To reduce the adverse effects caused by vibration, the MEMS inertial assembly is often elastically connected to the projectile body through a rubber shock absorber, that is, an overall shock absorption measure is taken. The selection of the shock absorption mode not only affects the shock absorption performance of the MEMS inertial assembly, but also affects the measurement accuracy of the system. The actually available shock absorption modes are very limited. At present, there are mainly three theoretically decoupled shock absorption modes through theoretical analysis as shown in Figure 1 Figures a - c in

[0069] As an inertial coordinate reference and inertial measurement device, the working accuracy and reliability of the MEMS inertial assembly under dynamic conditions directly affect the flight accuracy of the aircraft. Generally, the shock absorption system of the MEMS inertial assembly can translate and vibrate along the directions of 3 coordinate axes, and can also rotate and vibrate around 3 coordinate axes. Each translation or rotation of the system has its own natural frequency, so there are a total of 6 degrees of freedom.

[0070] Compared with the shock absorption of other electronic instruments, the shock absorption requirements for inertial products are more stringent. There are not only requirements for resonance frequency, magnification, shock absorption efficiency, etc., but also special requirements for the design of shock absorbers in the following aspects due to their working characteristics:

[0071] (1) Select a shock absorption mode where the vibrations in 6 degrees of freedom are independent of each other and there is no coupling, to avoid vibration coupling introducing untrue signals in other degrees of freedom directions and causing error accumulation in the control of the inertial navigation system;

[0072] (2) The angular vibration frequency of the shock absorber is high and far from the measurement bandwidth of the inertial assembly, to avoid amplification within the band and affecting the measurement of true signals;

[0073] (3) Try to make the linear vibration frequency lower than the angular vibration frequency. Under random vibration, the lower the linear vibration frequency, the better the shock absorption effect on high-frequency signals;

[0074] (4) The designed shock absorber frequency should avoid the drive frequency, pickup frequency of the gyroscope and the frequency difference between the two;

[0075] (5) The linear vibration frequencies in three directions should be as the same and concentrated as possible.

[0076] For MEMS inertial units based on silicon micro-sensing elements, small size and light weight are their natural advantages, but in engineering, it also brings great difficulties to vibration decoupling, especially for vibration reduction at the four diagonal points in space. Compared with the eccentricity of the same elastic center and centroid in fiber optic gyro inertial units, laser gyro inertial units, etc., due to the small size of MEMS inertial units, the relative proportion of eccentricity will be much larger, and the impact on vibration coupling will also be much greater. Therefore, for MEMS inertial units, reasonable design of eccentricity is necessary. In addition, the design of main parameters such as the first natural frequency and magnification of the shock absorber is also crucial.

[0077] According to an embodiment of the present invention, there is provided an embodiment of a vibration reduction and decoupling design method for a MEMS inertial unit based on four-point vibration reduction in space. It should be noted that the steps shown in the flowchart of the accompanying drawings can be executed in a computer system such as a set of computer-executable instructions, and although the logical order is shown in the flowchart, in some cases, the steps shown or described can be executed in a different order than here.

[0078] In this embodiment, a vibration reduction and decoupling design method for a MEMS inertial unit based on four-point vibration reduction in space is provided. Figure 2 It is a flowchart of a vibration reduction and decoupling design method for a MEMS inertial unit based on four-point vibration reduction in space according to an embodiment of the present invention, as Figure 2 shown, and this process includes the following steps:

[0079] Step S201, select a four-point vibration reduction scheme for the diagonal points in space for the design of the MEMS inertial unit.

[0080] In an embodiment of the present invention, based on the vibration reduction design requirements of the MEMS inertial unit, considering adding as little vibration reduction space as possible and not losing the advantage of small size of the MEMS inertial unit due to the addition of the vibration reduction system, a four-point vibration reduction scheme for the diagonal points in space is selected.

[0081] As Figure 3 shown, the MEMS inertial unit consists of three silicon micro MEMS gyros, three MEMS accelerometers, a power circuit, a data processing circuit, a shock absorber, and an installation structure and a base structure. The total weight of the whole machine is 89 g, of which the effective vibration reduction mass is 55 g, and the overall dimensions of the whole machine are 43 * 43 * 35 (unit: mm).

[0082] When performing mechanical analysis, the shock absorber is generally regarded as an elastic body, and the IMU part supported by its vibration reduction system is regarded as a rigid body. Then, the dynamic model of the strapdown inertial unit using the four-point vibration reduction scheme for the diagonal points in space can be approximated and simulated by the six-degree-of-freedom equivalent model shown in Figure 4 shown. A rectangular coordinate system oxyz is established at the centroid position of the equivalent model, and the directions of the coordinate axes are as Figure 4As shown. When the damping effect is ignored, the dynamic differential equation of the system during free vibration in space can be written in the following form.

[0083]

[0084] Where, M is the total mass of the vibration damping system, K is the total stiffness of the vibration damping system, and x is the displacement of the vibration damping system.

[0085] The dynamic differential equation decomposed into the coordinate system can be written in the following form:

[0086]

[0087]

[0088] I xx = ∫(y 2 + z 2 )dm, I yy = ∫(x 2 + z 2 )dm, I zz = ∫(x 2 + y 2 )dm;

[0089] I xy = I yx = ∫yzdm, I yz = I zy = ∫xzdm, I xz = I zx = ∫xydm;

[0090] Where, m is the mass of the vibration damping system, I x , I y , I z are the moments of inertia of the inertial unit about the x, y, and z axes respectively, I xy , I yz , I zx are the products of inertia of the inertial unit with respect to the x, y, and z axes respectively, K x , K y , K z are the total stiffnesses of the shock absorbers along the x, y, and z axes respectively, K xx , K yy , K zz is the torsional stiffness when the system rotates about the coordinate axes, is the angular displacement about the three axes, R xy , R yx , R zx , R xz , R yz , R zyThey are the linear rotational stiffnesses of rotation about each of the three coordinate planes of the system, k xi , k yi , k zi They are the stiffnesses of the i-th shock absorber in the x, y, and z-axis directions respectively, n is the number of shock absorbers, n = 4, l xi , l yi , l zi They are the coordinate values of the installation of the i-th shock absorber respectively.

[0091] Assume that the center of mass coincides with the elastic center, then in the model

[0092] I xy = I yx = I yz = I zy = I zx = I xz = 0

[0093] K xy = K yx = K yz = K zy = K zx = K xz = 0

[0094] R xy = R yx = R yz = R zy = R zx = R xz = 0

[0095] Substitute into Equation (1-2), we get

[0096]

[0097] It can be seen from the above Equation (1-3) that when the center of mass coincides with the elastic center, theoretically the six degrees of freedom are independent of each other and no coupling will occur.

[0098] Step S102, use 3D modeling software to perform refined modeling on the MEMS inertial assembly and conduct eccentricity analysis.

[0099] In the embodiment of the present invention, through theoretical analysis, it can be known that only when the center of mass coincides with the elastic center (i.e., the eccentricity is zero), the six degrees of freedom can be independent of each other and no coupling will occur. However, in actual engineering applications, the eccentricity can only be minimized but cannot be completely eliminated. If the eccentricity is not zero, the linear vibration in one direction will be coupled into the angular motion in other directions, resulting in false outputs of the inertial assembly gyroscopes. Therefore, it is extremely important to control the eccentricity to avoid linear and angular coupling. Therefore, use 3D modeling software to perform refined modeling on the MEMS inertial assembly and conduct eccentricity analysis.

[0100] Step S103: Design the first-order frequency of the vibration damping system according to the design requirements of the MEMS inertial unit vibration damping system.

[0101] In the embodiment of the present invention, according to the second special design requirement of the above MEMS inertial unit vibration damping system: the angular vibration frequency of the shock absorber is high and far from the measurement bandwidth of the inertial unit, so as to avoid amplification in the band and affect the measurement of the true signal.

[0102] The MEMS inertial unit is used in a certain type of guided bomb system, and the required measurement bandwidth of the system is 100 Hz. To ensure that the measured angular velocity and linear acceleration of the MEMS inertial unit are true and effective in the band and the phase delay is less than 90°, according to the required measurement bandwidth of the system, generally a second-order IIR low-pass filter needs to be added in the MEMS inertial unit. To ensure the bandwidth and delay requirements, the bandwidth is generally set to 1.2 - 1.5 times the required bandwidth. As Figure 5 shown, they are the amplitude-frequency and phase-frequency characteristic curves when the sampling frequency is 1k and the low-pass cut-off frequency is 120 hz. Among them, Figure 5 the blue curve is the amplitude-frequency characteristic curve, and the green curve is the phase-frequency characteristic curve.

[0103] For the inertial unit vibration damping system, to ensure that the signals in the band are not amplified or attenuated, the first-order natural frequency of the vibration damping system is generally designed to be greater than 2 times the measurement bandwidth in engineering, that is, greater than 240 hz.

[0104] According to the fourth special design requirement of the above inertial unit vibration damping system: the designed frequency of the shock absorber should avoid the driving frequency, pickup frequency of the gyroscope and the frequency difference between the two.

[0105] The gyroscopes used in the embodiment of the present invention are domestic silicon micro MEMS gyroscopes. The driving frequencies and frequency differences of the three gyroscopes are shown in Table 1 below. The first three-order frequencies of the designed vibration damping system need to avoid the frequencies listed in the table. For the convenience of design, generally the first-order natural frequency is greater than the maximum frequency difference of 80 hz or more, that is, the first-order natural frequency needs to be greater than 388 hz.

[0106] Table 1 Gyroscope driving frequency and frequency difference

[0107]

[0108]

[0109] In summary, the first-order natural frequency of the vibration damping system in the embodiment of the present invention needs to be greater than 400 Hz.

[0110] Step S104: Determine the amplification factor of the amplitude of the vibration damping system according to the damping characteristics of the vibration damping system.

[0111] In the embodiment of the present invention, the damping characteristic of the vibration damping system determines the amplification factor of the amplitude of the vibration damping system, and the damping characteristic of the vibration damping system is determined by the shock absorber damping, the mass of the vibration damping system, and the stiffness of the shock absorber.

[0112] Step S105: Adjust the vibration damping gasket according to the eccentric amount analysis result, and determine the compression amount of the vibration damping pad.

[0113] In the embodiment of the present invention, since the MEMS inertial assembly needs to ensure that the zero position change of the gyroscope and the accelerometer is as small as possible in overloaded environments such as vibration and shock, the vibration damping pad cannot be in a free state and must have a compression amount. Adjust the vibration damping gasket according to the eccentric amount analysis result, and determine the compression amount of the vibration damping pad to compensate for the eccentric problem.

[0114] Step S106: Design the shock absorber according to the first-order frequency of the vibration damping system, the amplification factor of the amplitude of the vibration damping system, and the compression amount of the vibration damping pad.

[0115] In the embodiment of the present invention, after determining the first-order frequency of the vibration damping system, the amplification factor of the amplitude of the vibration damping system, and the compression amount of the vibration damping pad, that is, after determining the main design parameters of the shock absorber, design the shock absorber.

[0116] The MEMS inertial assembly vibration damping decoupling design method based on spatial four-point vibration damping provided in this embodiment selects a spatial diagonal four-point vibration damping scheme that can achieve decoupling for MEMS inertial assembly design, and further conducts design analysis on the eccentricity, the first-order frequency of the shock absorber, the amplitude amplification factor, and the compression amount of the vibration damping pad that affect decoupling, determines the main design parameters of the shock absorber, and improves the environmental adaptability and reliability of vibration, shock, etc. based on the MEMS inertial assembly.

[0117] In this embodiment, a MEMS inertial assembly vibration damping decoupling design method based on spatial four-point vibration damping is provided. The process includes the following steps:

[0118] Step S201: Select a spatial diagonal four-point vibration damping scheme for MEMS inertial assembly design. The MEMS inertial assembly includes a shock absorber.

[0119] For details, please refer to Figure 1 Step S101 of the embodiment shown, which will not be elaborated here.

[0120] Step S202: Use three-dimensional modeling software to perform refined modeling on the MEMS inertial assembly and conduct eccentricity analysis.

[0121] Specifically, the above step S202 includes:

[0122] Step S2021: Use three-dimensional modeling software to perform refined modeling on the MEMS inertial assembly. Based on the elastic center coordinates, repeatedly adjust the structure, calculate the eccentricity of the vibration damping part of the MEMS inertial assembly, and control the eccentricity within a preset range.

[0123] In the embodiment of the present invention, the CREO three-dimensional modeling software is used to perform a detailed modeling of the inertial group. Taking the elastic center coordinate as the reference, the eccentricity of the inertial group vibration reduction part is calculated after repeated adjustment of the structure, as shown in FIG. Figure 6 As shown in the figure, through refined modeling and adjustment, the eccentricity of the system is extremely small, and the error is controlled within 5‰.

[0124] The MEMS inertial group is finely modeled using 3D modeling software, and the structure is repeatedly adjusted to control the eccentricity, thereby achieving design analysis of the eccentricity that affects decoupling.

[0125] Step S203 : Designing the first-order frequency of the vibration reduction system according to the design requirements of the MEMS inertial group vibration reduction system.

[0126] For details, please see Figure 1 Step S103 of the illustrated embodiment will not be described in detail here.

[0127] Step S204: determining the amplification factor of the vibration reduction system amplitude according to the damping characteristics of the vibration reduction system.

[0128] Specifically, the above step S204 includes:

[0129] Step S2041: Calculate the damping coefficient of the vibration damping material according to the vibration absorber damping, the mass of the vibration damping system, and the stiffness of the vibration absorber.

[0130] Step S2042: Calculate the amplification factor of the vibration reduction system amplitude according to the damping coefficient of the vibration reduction material.

[0131] In the embodiment of the present invention, the damping characteristics of the vibration reduction system determine the amplification factor of the vibration reduction system amplitude, and the calculation formula is:

[0132] Q≈1 / 2(1-4)

[0133] Among them, Q is the system amplitude magnification, ζ is the damping coefficient of the vibration reduction material, Among them, c is the damping of the shock absorber, m is the mass of the vibration reduction system, and k is the stiffness of the shock absorber.

[0134] like Figure 7 As shown, Figure 7 is the system amplitude magnification curve under different damping coefficients, Figure 7 It can be seen that the greater the damping, the smaller the system amplitude amplification factor. However, in practical applications, the damping coefficient is related to the material and cannot be blindly small. An acceptable value must be selected.

[0135] The magnitude of the magnification factor depends on the anti-vibration ability of the sensitive element itself at the low-order natural frequencies (generally considering the first three orders) of the vibration damping system. For example, if the anti-vibration ability of the gyro sensitive element itself within the range of low-order natural frequencies is 1000g, and when the system needs to withstand an impact of 500g, then the magnification factor of the vibration damping system must be less than 2.

[0136] Generally in engineering, when the system needs to withstand relatively small vibration and impact levels, the magnification factor is taken as 3 - 5; when the vibration and impact levels are relatively large, the magnification factor is taken as 2 - 3.

[0137] After determining the magnification factor, the damping coefficient of the selected material can be determined. According to the anti-vibration performance of the selected gyro and accelerometer and the vibration, impact and other overload environmental conditions required by the system in this project, the maximum acceptable magnification factor is 2.5. Therefore, the damping coefficient ζ of the rubber material of the shock absorber is ≥0.2.

[0138] By calculating the damping coefficient based on the damping parameters of the shock absorber and calculating the magnification factor, the dynamic response characteristics of the vibration damping system at different frequencies are evaluated.

[0139] Step S205: Adjust the vibration damping gasket according to the eccentric quantity analysis result to determine the compression amount of the vibration damping pad.

[0140] Specifically, the above step S205 includes:

[0141] Step S2051: Determine the direction of the centroid deviation according to the eccentric quantity analysis result.

[0142] Step S2052: Adjust the vibration damping pad by adjusting the compression amount in the direction of the centroid deviation, so as to increase the stiffness of the shock absorber in the direction of the centroid deviation and offset the linear-angular coupling caused by the eccentric quantity.

[0143] In the embodiment of the present invention, since the MEMS inertial assembly needs to ensure that the zero position changes of the gyro and accelerometer are as small as possible in the vibration, impact and other overload environments, the vibration damping pad cannot be in a free state and must have a compression amount. The compression amount control of the shock absorber made of rubber material is generally 10% - 20%, and better results can be obtained.

[0144] According to the analysis of the eccentric quantity obtained in the eccentric quantity analysis, it can be known which direction the centroid deviates to. The existence of the eccentric quantity will cause the coupling of the linear motion and angular motion of the inertial assembly, resulting in false output of the inertial assembly. To solve the problem that the design eccentric quantity cannot be completely eliminated in practical engineering, the gasket is adjusted by adjusting the compression amount in the corresponding direction, so that the stiffness of the shock absorber in this direction is slightly increased to offset the linear-angular coupling brought by the eccentric quantity. Design a shock absorber with adjustable compression amount, such as Figure 8 As shown, by adjusting the compression amount of the vibration damping pad, the eccentric problem is compensated.

[0145] By adjusting the compression amount of the vibration damping pad according to the eccentricity analysis result, the line-angle coupling caused by the eccentricity is offset to avoid unnecessary vibration.

[0146] Step S206: Design a shock absorber according to the first-order frequency of the shock absorption system, the magnification factor of the amplitude of the shock absorption system, and the compression amount of the shock absorption pad.

[0147] For details, please refer to Figure 1 Step S106 of the embodiment shown, which will not be elaborated here.

[0148] Step S207: Perform a simulation analysis on the shock absorption system using finite element analysis software. The simulation analysis includes modal analysis and random vibration simulation analysis.

[0149] In the embodiment of the present invention, the finite element analysis software ANSYS is used to perform a simulation analysis on the shock absorption effect of the shock absorption system.

[0150] Mainly analyze the following aspects.

[0151] (1) Through modal analysis, evaluate whether the six degrees of freedom of the shock absorption system are independent of each other and do not couple with each other;

[0152] (2) Through modal analysis, calculate the first natural frequency of the shock absorption system and whether it meets the design requirements;

[0153] (3) Through random vibration simulation analysis, analyze the maximum stress and deformation of the system under vibration conditions, and evaluate whether the strength of the material meets the requirements;

[0154] (4) Through random vibration simulation analysis, output the PSD response curve at the installation location of the sensitive element and analyze the frequency response characteristics.

[0155] a) Modal analysis:

[0156] Set the material properties and boundary conditions, and perform modal simulation analysis on the inertial measurement unit. The first 15-order modal response results are as Figure 9 shown.

[0157] Through Figure 9 It can be seen that the first-order mode of the inertial measurement unit shock absorption system is 742 hz, which is greater than 388 hz and meets the design requirements. The vibration modes of the first six orders are as follows Figure 10 shown. It can be seen from the figure that the first six orders of modes are respectively moving along the z-axis, moving along the x-axis, moving along the y-axis, angular motion around the y-axis, angular motion around the x-axis, and angular motion around the z-axis. Each order of mode is independent of each other and no mutual coupling occurs. The first three orders of linear motion modes are concentrated in (740 - 800) hz, and the last three orders of angular motion modes are far from the linear motion modes and are concentrated in (1100 - 1200) hz, meeting the requirements of inertial measurement unit shock absorption design.

[0158] b) Random vibration simulation analysis

[0159] The simulation analysis was carried out according to the random vibration test conditions of 6.06 g standard. Taking the axial direction with the maximum stress as an example, the stress nephogram is as shown in Figure 11 shown, and the deformation diagram is as shown in Figure 12 shown. The maximum stress is 1.69 MPa, and the maximum stress concentration is on the limit screw (material 304 stainless steel), which is much less than the allowable strength of the material, 205 MPa. The maximum deformation is 4.04 um, and the maximum deformation occurs in the damping rubber pad, within the allowable deformation of the rubber.

[0160] Taking the X direction as an example for analysis. A random excitation of 1 G 2 / Hz was applied to the system in the X direction within the range of (20 - 2000) Hz. The PSD responses of the gyro installation position in the three directions are as shown in Figures 13 - 15 shown. The random vibration PSD curve diagram is as shown in Figure 16 shown. The square of the resonance peak value (i.e., the magnification factor) of the system's amplitude-frequency characteristic is the ordinate of the PSD response curve. After conversion, the resonance response frequency and magnification factor are shown in Table 2. It can be seen from Table 2 that when a translational excitation is applied to the X axis, the response is mainly on the X axis, and the other two axes are very small, indicating that no coupling is caused. It can be seen from Figure 13 that the attenuation of the system is very fast after the resonance frequency, indicating that the damping system has an obvious effect on high-frequency attenuation.

[0161] Table 2 Response Frequency and Magnification Factor (X-axis Excitation)

[0162] Linear excitation in the X direction Translation in the X - axis Translation in the Y - axis Translation in the Z - axis Response frequency (Hz) 814.61 849.46 921.68 Magnification factor 2.43 0.007 0.065

[0163] It can be known from the simulation analysis that the maximum magnification factor of the damping system at the resonance frequency is 2.43, which meets the design requirements of the magnification factor.

[0164] The MEMS inertial unit damping decoupling design method based on spatial four-point damping provided in this embodiment evaluates whether the six degrees of freedom of the damping system are independent of each other, whether the first-order natural frequency meets the design requirements, evaluates whether the strength of the material meets the requirements, and analyzes the frequency response characteristics by performing simulation analysis on the damping system and modal analysis and random vibration simulation analysis on the damping system.

[0165] The following is an explanation of the test verification process:

[0166] (1) Test conditions

[0167] In order to verify the rationality of the shock absorber design and the correctness of the simulation analysis, a random vibration test was carried out on the product. The random vibration conditions are as follows:

[0168] a) Frequency range: 20 Hz - 2000 Hz;

[0169] b) Vibration direction: X, Y, Z directions;

[0170] c) Vibration time: 5 minutes for each direction;

[0171] d) Power on the product for testing before and after vibration, and monitor the data of the product during random vibration.

[0172] Fix the product on the horizontal sliding table and conduct random vibration test on it. The following takes the random vibration in the X direction as an example for illustration.

[0173] 1) Test data analysis

[0174] The IMU substrate is fixed to the base with a rigid pad, and the vibration data without vibration damping is as Figures 17 - 18 shown. It can be seen from the figure that large numbers appeared in the x-axis gyro and z-axis gyro during vibration, up to 200° / s at most, and the zero position deviation in the Y-axis accelerometer vibration was 12 mg.

[0175] The vibration data of the inertial assembly after adding vibration damping is as Figures 19 - 20 shown. It can be seen from the figure that after adding vibration damping, the gyro and accelerometer data are normal, there is no large response, and the linear vibration does not cause angular motion coupling.

[0176] Compare from two aspects: the maximum peak-to-peak value during vibration in each axial direction and the zero position change before and during vibration, and analyze the vibration damping effect of the vibration damping system. The results are shown in Table 3.

[0177] Table 3 Comparison of vibration damping effects

[0178]

[0179]

[0180] It can be seen from Table 3 that after adding the vibration damping system, the peak-to-peak value during vibration of the MEMS inertial assembly is reduced by more than 55.6%, and the zero position change before and during vibration is reduced by more than 46.4%. Considering the above two aspects, after adding the four-point vibration damping at the space diagonal, the vibration damping design is effective, which improves the anti-vibration environment ability of the MEMS inertial assembly product, greatly improves the performance index of the product in the vibration dynamic environment, and solves the problem that the MEMS inertial assembly cannot adapt to the vibration dynamic environment on a certain type of guided projectile.

[0181] In the embodiment of the present invention, by establishing an equivalent mechanical model, it is theoretically analyzed that the four-point vibration damping method in space can achieve decoupling. Further, the eccentricity and the main parameters of the shock absorber that affect decoupling in engineering are designed and analyzed to determine the main design parameters of the shock absorber. To solve the problem that the design eccentricity cannot be completely eliminated in actual engineering, a shock absorber with adjustable compression amount is designed. By adjusting the compression amount of the shock pad, the eccentricity problem is compensated, and complete decoupling of six degrees of freedom is achieved in engineering. Through finite element simulation analysis and experimental verification, complete decoupling of six degrees of freedom based on the four-point vibration damping scheme in space is achieved in engineering. The test data shows that after adding the vibration damping system, the peak-to-peak value of the vibration center of each axis of the MEMS inertial unit is reduced by more than 55.6%, and the zero position change before and during vibration is reduced by more than 46.4%, improving the environmental adaptability and reliability of vibration, shock, etc. based on the MEMS inertial unit.

[0182] In this embodiment, a MEMS inertial unit vibration damping and decoupling design system based on four-point vibration damping in space is also provided. This system is used to implement the above-mentioned embodiments and preferred implementation manners, and those that have been described will not be repeated. As used below, the term "module" can be a combination of software and / or hardware that can achieve a predetermined function. Although the devices described in the following embodiments are preferably implemented in software, implementation in hardware, or a combination of software and hardware is also possible and contemplated.

[0183] This embodiment provides a MEMS inertial unit vibration damping and decoupling design system based on four-point vibration damping in space, as Figure 21 shown, including:

[0184] The first design module 2101 is used to select a four-point vibration damping scheme for the diagonal points in space for the design of the MEMS inertial unit.

[0185] The analysis module 2102 is used to perform refined modeling on the MEMS inertial unit using three-dimensional modeling software and perform eccentricity analysis.

[0186] The second design module 2103 is used to design the first-order frequency of the vibration damping system according to the design requirements of the MEMS inertial unit vibration damping system.

[0187] The first determination module 2104 is used to determine the amplification factor of the amplitude of the vibration damping system according to the damping characteristics of the vibration damping system.

[0188] The second determination module 2105 is used to adjust the vibration damping gasket according to the eccentricity analysis result and determine the compression amount of the vibration damping pad.

[0189] The third design module 2106 is used to design the shock absorber according to the first-order frequency of the vibration damping system, the amplification factor of the amplitude of the vibration damping system, and the compression amount of the vibration damping pad.

[0190] In some alternative implementation manners, the first determination module 2104 includes:

[0191] A first calculation unit for calculating a damping coefficient of a vibration damping material according to a shock absorber damping, a mass of a vibration damping system, and a stiffness of the shock absorber.

[0192] A second calculation unit for calculating a magnification factor of an amplitude of the vibration damping system according to the damping coefficient of the vibration damping material.

[0193] In some alternative embodiments, the second determination module 2105 includes:

[0194] A determination unit for determining a centroid deviation direction according to an analysis result of an eccentricity.

[0195] An adjustment unit for adjusting a vibration damping pad by adjusting a compression amount in the centroid deviation direction, so as to increase the stiffness of the shock absorber in the centroid deviation direction and offset the line-angle coupling caused by the eccentricity.

[0196] In some alternative embodiments, the device further includes:

[0197] A simulation module for performing a simulation analysis on the vibration damping system by using finite element analysis software, where the simulation analysis includes a modal analysis and a random vibration simulation analysis.

[0198] The further function descriptions of the above-mentioned various modules and units are the same as those in the corresponding embodiments above, and will not be repeated here.

[0199] The MEMS inertial unit vibration damping decoupling design system based on spatial four-point vibration damping in this embodiment is presented in the form of functional units. Here, the unit refers to an ASIC (Application Specific Integrated Circuit) circuit, a processor and a memory that execute one or more software or fixed programs, and / or other devices that can provide the above functions.

[0200] An embodiment of the present invention further provides a computer device having the above-mentioned Figure 21 shown MEMS inertial unit vibration damping decoupling design system based on spatial four-point vibration damping.

[0201] Please refer to Figure 22 , Figure 22 is a schematic structural diagram of a computer device provided by an alternative embodiment of the present invention. As shown in Figure 22As shown, the computer device includes: one or more processors 10, a memory 20, and interfaces for connecting various components, including high-speed interfaces and low-speed interfaces. Each component communicates with each other using different buses and can be installed on a common motherboard or in other ways as needed. The processor can process instructions executed within the computer device, including instructions stored in the memory or on the memory to display graphical information of the GUI on an external input / output device (such as a display device coupled to the interface). In some alternative embodiments, if needed, multiple processors and / or multiple buses can be used together with multiple memories. Similarly, multiple computer devices can be connected, and each device provides some necessary operations (for example, as a server array, a set of blade servers, or a multi-processor system). Figure 22 In the figure, one processor 10 is taken as an example.

[0202] The processor 10 can be a central processing unit, a network processor, or a combination thereof. Among them, the processor 10 can further include a hardware chip. The above-mentioned hardware chip can be an application-specific integrated circuit, a programmable logic device, or a combination thereof. The above-mentioned programmable logic device can be a complex programmable logic device, a field programmable gate array, a generic array logic, or any combination thereof.

[0203] Among them, the memory 20 stores instructions executable by at least one processor 10, so that at least one processor 10 executes the method shown in the above embodiments.

[0204] The memory 20 can include a program storage area and a data storage area. Among them, the program storage area can store an operating system and application programs required for at least one function; the data storage area can store data created according to the use of the computer device. In addition, the memory 20 can include a high-speed random access memory, and can also include a non-transitory memory, such as at least one disk storage device, a flash memory device, or other non-transitory solid-state storage devices. In some alternative embodiments, the memory 20 can optionally include a memory remotely set relative to the processor 10, and these remote memories can be connected to the computer device through a network. Examples of the above-mentioned network include but are not limited to the Internet, an enterprise intranet, a local area network, a mobile communication network, and combinations thereof.

[0205] The memory 20 can include a volatile memory, such as a random access memory; the memory can also include a non-volatile memory, such as a flash memory, a hard disk, or a solid-state drive; the memory 20 can also include a combination of the above types of memories.

[0206] The computer device further includes an input device 30 and an output device 40. The processor 10, the memory 20, the input device 30, and the output device 40 can be connected through a bus or other means.Figure 22 Take the bus connection as an example.

[0207] The input device 30 can receive input digital or character information, and generate key signal inputs related to the user settings and function controls of the computer device, such as a touch screen, etc. The output device 40 may include a display device, etc.

[0208] The embodiments of the present invention also provide a computer-readable storage medium. The methods according to the embodiments of the present invention can be implemented in hardware, firmware, or be implemented as computer code that can be recorded on a storage medium, or be implemented as computer code that is originally stored in a remote storage medium or a non-transitory machine-readable storage medium and downloaded through a network and will be stored in a local storage medium, so that the methods described herein can be stored in such software processes on a storage medium using a general-purpose computer, a dedicated processor, or programmable or dedicated hardware. Among them, the storage medium can be a magnetic disk, an optical disk, a read-only memory, a random access memory, a flash memory, a hard disk, or a solid-state drive, etc.; further, the storage medium can also include a combination of the above types of memories. It can be understood that a computer, a processor, a microprocessor controller, or programmable hardware includes a storage component that can store or receive software or computer code. When the software or computer code is accessed and executed by the computer, the processor, or the hardware, the methods shown in the above embodiments are implemented.

[0209] A part of the present invention can be applied as a computer program product, such as computer program instructions. When executed by a computer, through the operation of the computer, the methods and / or technical solutions according to the present invention can be called or provided. Those skilled in the art should be able to understand that the forms in which computer program instructions exist in a computer-readable medium include, but are not limited to, source files, executable files, installation package files, etc. Correspondingly, the ways in which computer program instructions are executed by a computer include, but are not limited to: the computer directly executes the instructions, or the computer compiles the instructions and then executes the corresponding compiled program, or the computer reads and executes the instructions, or the computer reads and installs the instructions and then executes the corresponding installed program. Herein, the computer-readable medium can be any available computer-readable storage medium or communication medium accessible to the computer.

[0210] Although the embodiments of the present invention have been described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of the present invention, and such modifications and variations all fall within the scope of this application.

Claims

1. A decoupling design method for vibration reduction of MEMS inertial units based on vibration reduction of four spatial points, characterized in that, The method includes: Selecting a four-point vibration damping scheme for spatial diagonal to design the MEMS inertial assembly; Using 3D modeling software to perform refined modeling on the MEMS inertial assembly and conduct eccentricity analysis; Designing the first-order frequency of the vibration damping system according to the design requirements of the MEMS inertial assembly vibration damping system; Determining the magnification factor of the vibration amplitude of the vibration damping system according to the damping characteristics of the vibration damping system; Adjusting the vibration damping gasket according to the eccentricity analysis result and determining the compression amount of the vibration damping pad; Designing a shock absorber according to the first-order frequency of the vibration damping system, the magnification factor of the vibration amplitude of the vibration damping system, and the compression amount of the vibration damping pad.

2. The method according to claim 1, wherein The using 3D modeling software to perform refined modeling on the MEMS inertial assembly and conduct eccentricity analysis includes: Using 3D modeling software to perform refined modeling on the MEMS inertial assembly, taking the elastic center coordinates as the reference, repeatedly adjusting the structure, calculating the eccentricity of the vibration damping part of the MEMS inertial assembly, and controlling the eccentricity within a preset range.

3. The method according to claim 1, characterized in that The design requirements of the MEMS inertial assembly vibration damping system include that the angular vibration frequency of the shock absorber is high and far from the measurement bandwidth of the inertial assembly, and the frequency of the shock absorber should avoid the gyro drive frequency, the gyro pickup frequency, and the frequency difference between the gyro drive frequency and the gyro pickup frequency.

4. The method according to claim 1, wherein The determining the magnification factor of the vibration amplitude of the vibration damping system according to the damping characteristics of the vibration damping system includes: Calculating the damping coefficient of the damping material according to the shock absorber damping, the mass of the vibration damping system, and the stiffness of the shock absorber; Calculating the magnification factor of the vibration amplitude of the vibration damping system according to the damping coefficient of the damping material.

5. The method according to claim 1, characterized in that The adjusting the vibration damping gasket according to the eccentricity analysis result and determining the compression amount of the vibration damping pad includes: Determining the centroid deviation direction according to the eccentricity analysis result; Adjusting the vibration damping pad by adjusting the compression amount in the centroid deviation direction so that the stiffness of the shock absorber in the centroid deviation direction is increased to offset the linear and angular coupling caused by the eccentricity.

6. The method according to claim 1, wherein The method further includes: Performing simulation analysis on the vibration damping system using finite element analysis software, and the simulation analysis includes modal analysis and random vibration simulation analysis.

7. A vibration reduction and decoupling design system for a MEMS inertial assembly based on the vibration reduction of four points in space, characterized in that, The system includes: A first design module for selecting a four-point vibration damping scheme for spatial diagonal to design the MEMS inertial assembly; An analysis module for using 3D modeling software to perform refined modeling on the MEMS inertial assembly and conduct eccentricity analysis; A second design module for designing the first-order frequency of the vibration damping system according to the design requirements of the MEMS inertial assembly vibration damping system; A first determination module for determining the magnification factor of the vibration amplitude of the vibration damping system according to the damping characteristics of the vibration damping system; A second determination module for adjusting the vibration damping gasket according to the eccentricity analysis result and determining the compression amount of the vibration damping pad; A third design module for designing a shock absorber according to the first-order frequency of the vibration damping system, the magnification factor of the vibration amplitude of the vibration damping system, and the compression amount of the vibration damping pad.

8. A computer device, characterized in that, It includes: A memory and a processor, which are communicatively connected to each other. The memory stores computer instructions, and the processor executes the computer instructions to execute the MEMS inertial assembly vibration damping decoupling design method according to any one of claims 1 to 6 based on spatial four-point vibration damping.

9. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores computer instructions for causing a computer to execute the MEMS inertial unit vibration reduction and decoupling design method based on spatial four-point vibration reduction according to any one of claims 1 to 6.

10. A computer program product, characterized in that, It includes computer instructions for causing a computer to execute the MEMS inertial unit vibration reduction and decoupling design method based on spatial four-point vibration reduction according to any one of claims 1 to 6.

Images