Display module and display device

By designing a support pad structure with the first sub-part and the second sub-part, the problems of support pad disengagement and glue flow in the display module are solved, and the display effect is improved.

CN119920156AActive Publication Date: 2025-05-02BOE TECHNOLOGY GROUP CO LTD +1
View PDF 7 Cites 0 Cited by

Patent Information

Application Number
CN202311424650.4
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2023-10-30
Publication Date
2025-05-02
Estimated Expiration
2043-10-30

AI Technical Summary

Technical Problem

There is a risk when the support pad is disengaged from the main body part, and the risk of injection molded glue flowing to other parts of the display module is high, affecting the display effect.

Method used

A display module is designed, wherein the support pad includes a first sub-part and a second sub-part, the second sub-part is located at at least one side of the first sub-part, and both ends of the first sub-part are flush with both ends of the support pad to avoid the generation of the first overflow channel. At the same time, the first sub-part is not adhered when separated from the adsorption fixture, thereby improving the problem of bonding between the adsorption fixture and the first sub-part.

Benefits of technology

The risk of the support pad being disengaged from the main body is effectively reduced, and the injection molding flows to other parts of the display module is avoided, thereby improving the display effect of the display module.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN119920156A_ABST
    Figure CN119920156A_ABST
Patent Text Reader

Abstract

The embodiment of the invention provides a display module and a display device, relates to the technical field of display, and is used for reducing the risk that a supporting pad is separated from a main body part and improving the display effect of the display module. The display module comprises a display panel and a supporting pad. The display panel comprises a main body part, a binding part and a bending part located between the main body part and the binding part. The bending part is bent towards the non-display side of the main body part along a bending shaft extending in the first direction, so that the binding part is bent to the non-display side of the main body part. The supporting pad is positioned between the main body part and the binding part; the supporting pad comprises a first sub-part and a second sub-part in the first direction, the second sub-part is located on at least one side of the first sub-part, and the two ends of the first sub-part are flush with the two ends of the supporting pad. Wherein the first sub-part is configured to have no adhesive force between the first sub-part and the adsorption jig when the first sub-part is separated from the adsorption jig. The display module is used for displaying images.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a display module and a display device. Background Art

[0002] Organic light emitting diodes (OLED) have been widely used in the display field due to their advantages of self-luminescence, low driving voltage, high luminous efficiency, fast response speed and flexible display. With the rapid development of display technology, display technologies such as liquid crystal display (LCD), organic light emitting display (OLED), quantum dot light emitting display (QLED) and mini / micro light emitting display (MLED) have been widely used in people's daily lives. For example, smart phones, wearable watches, televisions, laptops and car displays have gradually spread throughout people's lives. Summary of the invention

[0003] The purpose of the embodiments of the present disclosure is to provide a display module and a display device, which are used to reduce the risk of the support pad being separated from the main body and to improve the display effect of the display module.

[0004] To achieve the above objectives, the embodiments of the present disclosure provide the following technical solutions:

[0005] On the one hand, a display module is provided. The display module includes a display panel and a support pad. The display panel includes a main body, a binding part, and a bending part located between the main body and the binding part. The main body has a display side and a non-display side that are arranged opposite to each other, and the bending axis of the bending part extending along the first direction is bent toward the non-display side of the main body, so that the binding part is bent to the non-display side of the main body. The support pad is located between the main body and the binding part; the support pad includes a first sub-part and a second sub-part along the first direction, the second sub-part is located on at least one side of the first sub-part, and the two ends of the first sub-part are flush with the two ends of the support pad. Wherein, the first sub-part is configured so that when separated from the adsorption jig, there is no adhesive force between the first sub-part and the adsorption jig.

[0006] In the above-mentioned display module, the support pad includes a first sub-section and a second sub-section. Along the first direction, the second sub-section is located on at least one side of the first sub-section, and the two ends of the first sub-section are flush with the two ends of the support pad. In this way, the generation of the first overflow glue channel can be avoided, and the risk of the injection molding glue flowing to other parts of the display module can be reduced, thereby improving the display effect of the display module. The first sub-section is configured so that there is no adhesion force between the first sub-section and the adsorption jig when it is separated from the adsorption jig. Arranged in this way, the problem of the adsorption jig and the first sub-section adhering to each other and causing the support pad to detach from the main body can be improved.

[0007] In some embodiments, the support pad includes a first support layer, a support portion, and a first adhesive layer. Along the first direction, the two ends of the first support layer extend beyond the two ends of the binding portion, and a receiving groove is provided on the surface of the first support layer close to the binding portion; the orthographic projection of the receiving groove on the main body is located within the range of the orthographic projection of the binding portion on the main body. The support portion is located in the receiving groove; the first support layer and the binding portion are connected through the support portion. The first adhesive layer is located on the side of the first support layer away from the binding portion, and overlaps with the first support layer.

[0008] In some embodiments, the support portion includes a second adhesive layer, a second support layer and a third adhesive layer. The second support layer is located on a side of the second adhesive layer away from the binding portion. The third adhesive layer is located on a side of the second support layer away from the binding portion.

[0009] In some embodiments, a surface of the supporting portion close to the binding portion is flush with a surface of the first supporting layer close to the binding portion.

[0010] In some embodiments, there is a gap between a boundary of an orthographic projection of the support portion on the main body and an outer boundary of an orthographic projection of the receiving groove on the main body.

[0011] In some embodiments, along the first direction, a distance between a boundary of an orthographic projection of the binding portion on the main body and an outer boundary of an orthographic projection of the receiving groove on the main body is 1.7 mm to 2.9 mm.

[0012] In some embodiments, the support pad includes a first support layer, a fourth adhesive layer and a first adhesive layer. Along the first direction, two ends of the first support layer exceed two ends of the binding portion. The fourth adhesive layer is located on a side of the first support layer close to the binding portion and overlaps with the first support layer. The first adhesive layer is located on a side of the first support layer away from the binding portion and overlaps with the first support layer.

[0013] In some embodiments, the material of the fourth adhesive layer is a UV-curable adhesive layer.

[0014] In some embodiments, along the first direction, a distance between a boundary of an orthographic projection of the first supporting layer on the main body and a boundary of an orthographic projection of the binding portion on the main body is 150 μm to 250 μm.

[0015] On the other hand, a display device is provided. The display device comprises: a display module and a middle frame as described in any of the above embodiments. The middle frame comprises a bottom plate and a frame arranged around the bottom plate. The bottom plate is arranged on a side of the binding portion of the display module away from the main body, and the frame is arranged around the peripheral side of the display panel.

[0016] The above-mentioned display device has the same structure and beneficial technical effects as the display panels provided in some of the above-mentioned embodiments, which will not be described in detail here.

[0017] In some embodiments, the display device includes a first fixing portion and a second fixing portion. The first fixing portion covers a side of the bending portion away from the frame and extends to the main body and the binding portion. The second fixing portion covers a side of the bending portion close to the frame and extends to the main body and the binding portion. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the present disclosure, the following briefly introduces the drawings required to be used in some embodiments of the present disclosure. Obviously, the drawings described below are only drawings of some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can also be obtained based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams, and are not limitations on the actual size of the product involved in the embodiments of the present disclosure, the actual process of the method, the actual timing of the signal, etc.

[0019] Figure 1 is a structural diagram of a display device according to some embodiments;

[0020] Figure 2 is a structural diagram of a display device in a flat state according to some embodiments;

[0021] Figure 3 for Figure 1 A cross-sectional view along section line AA;

[0022] Figure 4 is a structural diagram of a display panel according to some embodiments;

[0023] Figure 5 for Figure 1 Another cross-sectional view along section line AA;

[0024] Figure 6is a structural diagram of a display module according to some embodiments;

[0025] Figure 7 for Figure 1 A cross-sectional view along section line BB;

[0026] Figure 8 for Figure 1 Another cross-sectional view along section line BB;

[0027] Fig. 9 for Figure 1 Another cross-sectional view along section line BB;

[0028] Fig.10 is a structural diagram of the positions of circuit boards and binding portions according to some embodiments. DETAILED DESCRIPTION

[0029] The following will be combined with the accompanying drawings to clearly and completely describe the technical solutions in some embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, rather than all the embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field belong to the scope of protection of the present disclosure.

[0030] Unless the context requires otherwise, throughout the specification and claims, the term "including" is to be interpreted as an open, inclusive meaning, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "examples" or "some examples" and the like are intended to indicate that specific features, structures, materials or characteristics associated with the embodiment or example are included in at least one embodiment or example of the present disclosure. The schematic representations of the above terms do not necessarily refer to the same embodiment or example. In addition, the specific features, structures, materials or characteristics described may be included in any one or more embodiments or examples in any appropriate manner.

[0031] In the following, the terms "first" and "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present disclosure, unless otherwise specified, "plurality" means two or more.

[0032] When describing some embodiments, the term "connection" and its derivative expressions may be used. The term "connection" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection or an indirect connection through an intermediate medium.

[0033] “At least one of A, B, and C” has the same meaning as “at least one of A, B, or C” and both include the following combinations of A, B, and C: A only, B only, C only, the combination of A and B, the combination of A and C, the combination of B and C, and the combination of A, B, and C.

[0034] “A and / or B” includes the following three combinations: A only, B only, and a combination of A and B.

[0035] The use of "adapted to" or "configured to" herein is meant to be open and inclusive language that does not exclude devices adapted or configured to perform additional tasks or steps.

[0036] Additionally, the use of “based on” is meant to be open and inclusive, as a process, step, calculation, or other action “based on” one or more stated conditions or values ​​may, in practice, be based on additional conditions or values ​​beyond those stated.

[0037] As used herein, "about," "substantially," or "approximately" includes the stated value and an average value that is within an acceptable range of variation from the particular value as determined by one of ordinary skill in the art taking into account the measurements in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system).

[0038] As used herein, "parallel", "perpendicular", and "equal" include the situations described and situations similar to the situations described, and the range of the similar situations is within the acceptable deviation range, wherein the acceptable deviation range is determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, wherein the acceptable deviation range of approximate parallelism may be, for example, a deviation within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, wherein the acceptable deviation range of approximate perpendicularity may also be, for example, a deviation within 5°. "Equal" includes absolute equality and approximate equality, wherein the acceptable deviation range of approximate equality may be, for example, the difference between the two equalities is less than or equal to 5% of either one.

[0039] It will be understood that when a layer or an element is referred to as being on another layer or substrate, it can be directly on the other layer or substrate, or intervening layers may be present between the layer or element and the other layer or substrate.

[0040] Exemplary embodiments are described herein with reference to cross-sectional views and / or plan views that are idealized exemplary drawings. In the drawings, the thickness of the layers and the area of ​​the regions are exaggerated for clarity. Therefore, variations in the shapes relative to the drawings due to, for example, manufacturing techniques and / or tolerances are conceivable. Therefore, the exemplary embodiments should not be interpreted as being limited to the shapes of the regions shown herein, but include shape deviations due to, for example, manufacturing. For example, an etched region shown as a rectangle will typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to illustrate the actual shapes of the regions of the device, and are not intended to limit the scope of the exemplary embodiments.

[0041] like Figure 1 As shown, some embodiments of the present disclosure provide a display device 1000 , which may be any device that displays anything, whether in motion (eg, video) or fixed (eg, still image), and whether in text or image.

[0042] For example, Figure 1 As shown, the display device 1000 can be any product or component with a display function, such as a television, a laptop computer, a tablet computer, a mobile phone, a personal digital assistant (PDA), a navigator, a vehicle display, a flight display, a wearable device, a virtual reality (VR) device, etc.

[0043] In some embodiments, Figure 2 and Figure 3 As shown, the display device 1000 includes a display module 100. The display module 100 includes a display panel 10 and a support pad 20.

[0044] The display panel 10 may be: an organic light emitting diode display panel, a quantum dot light emitting diode display panel, a micro light emitting diode display panel, a liquid crystal display panel, a plasma display panel, a field emission display panel, an electrowetting display panel or an electrophoretic display panel, etc., and the embodiments of the present disclosure are not specifically limited here.

[0045] The following takes the above-mentioned display panel 10 as an organic light emitting diode display panel as an example to schematically illustrate some embodiments of the present disclosure, but the implementation of the present disclosure is not limited to this, and any other display panel can also be considered as long as the same technical concept is applied.

[0046] In some embodiments, Figure 2As shown, the display panel 10 includes a main body 11, a bending portion 12 and a binding portion 13 connected in sequence. The bending portion 12 is located on one side of the main body 11, and the binding portion 13 is located on a side of the bending portion 12 away from the main body 11, that is, the bending portion 12 is located between the main body 11 and the binding portion 13.

[0047] like Figure 3 As shown, the main body 11 may be a part of the display panel 10 for displaying images, that is, the main body 11 has a display area A. The main body 11 may also include a peripheral area B, which is disposed on at least one side of the display area A. Figure 4 In the figure, the peripheral area B is arranged around the display area A for illustration.

[0048] Exemplarily, as shown in FIG4 , the shape of the display area A is roughly any one of a circle, an ellipse, a rectangle, etc., and the embodiment of the present disclosure is not specifically limited here.

[0049] In this article, "substantially circular or elliptical" means that the shape is circular or elliptical as a whole, but is not limited to a standard circular or elliptical shape. That is, the "circular or elliptical" here includes not only a substantially circular or elliptical shape, but also a shape similar to a circular or elliptical shape.

[0050] In this article, "approximately rectangular" means that the shape is rectangular as a whole, but is not limited to a standard rectangle. That is, the "rectangle" here includes not only basic rectangular shapes, but also shapes similar to rectangles. For example, the long side and the short side of the rectangle are curved at each intersection (i.e., corners), that is, the corners are smooth and the shape is a rounded rectangle. The following description takes the shape of the display area being approximately a rounded rectangle as an example.

[0051] like Figure 2 As shown, the main body 11 has a display side 11A and a non-display side 11B that are arranged opposite to each other. It should be noted that the display side 11A refers to the side of the main body 11 that displays an image ( Figure 2 The non-display side 11B refers to the other side opposite to the display side 11A ( Figure 2 The lower side of the middle main body 11).

[0052] like Figure 2 As shown, the binding portion 13 may be a portion of the display panel 10 used to bind and connect with the circuit board 30. Figure 3As shown, through the bending process, the bending portion 12 can be bent along the bending axis extending in the first direction X toward the non-display side 11B of the main body 11 of the display panel 10, so that the binding portion 13 is bent to the non-display side 11B of the main body 11, thereby reducing the frame of the display device 1000. The bending axis is not an actual structure existing in the display panel 10, but is only a concept proposed to illustrate the bending process of the display panel 10.

[0053] like Figure 3 As shown, after the binding portion 13 is bent, the circuit board 30 can be bent along with the display panel 10 to the non-display side 11B of the main body 11, so as to achieve the purpose of reducing the frame of the display device 1000. Part of the circuit board 30 is located on the side of the main body 11 close to the binding portion 13 and is bonded to the main body 11, and part of the circuit board 30 is located on the side of the binding portion 13 away from the main body 11 and is bound and connected to the binding portion 13.

[0054] It should be noted that the bending radius of the bending portion 12 may be 0.1 mm to 0.5 mm. For example, the bending radius of the bending portion 12 may be any one of 0.1 mm, 0.2 mm, 0.3 mm, 0.35 mm, 0.4 mm and 0.5 mm.

[0055] It should be understood that the smaller the bending radius of the bending portion 12, the narrower the frame of the display device 1000 corresponding to the bending portion 12 can be designed, which is more conducive to the narrow frame design of the display device 1000. Exemplarily, the bending radius of the bending portion 12 can be 0.1 mm to 0.2 mm, for example, the bending radius of the bending portion 12 can be any one of 0.12 mm, 0.15 mm and 0.18 mm, so that the frame of the display device 1000 corresponding to the bending portion 12 can be made narrower.

[0056] like Figure 3 As shown, the support pad 20 is located between the main body 11 and the binding part 13 , and the main body 11 and the binding part 13 are bonded together by the support pad 20 .

[0057] Based on the above structure, the bending process can be described as follows: In the first step, a support pad 20 is set on the non-display side 11B of the main body 11. In the second step, an adsorption jig is used to contact the surface of the binding part 13 close to the circuit board 30 to adsorb the binding part 13. In the third step, the binding part 13 is bent toward the non-display side 11B of the main body 11 of the display panel 10, so that the binding part 13 is located on the side of the support pad 20 away from the main body 11, and there is a gap between the binding part 13 and the support pad 20. In the fourth step, the adsorption jig moves the binding part 13 toward the direction close to the main body 11 so that the binding part 13 and the support pad 20 are bonded. In the fifth step, the adsorption jig is removed.

[0058] like Figure 5As shown, the display device 1000 also includes a middle frame 200. The middle frame 200 includes a bottom plate 210 and a frame 220 arranged around the bottom plate 210, and the bottom plate 210 is arranged on the side of the binding portion 13 of the display panel 10 away from the main body 11, and the orthographic projection on the plane where the main body 11 is located is located outside the display area A. The frame 220 is arranged around the peripheral side of the display panel 10. The middle frame 200 and the display module 100 can be connected by edge injection molding (English: Insert Molding) technology. In other words, the fixing portion 300 is formed by edge injection molding technology, and the fixing portion 300 connects the middle frame 200 and the display module 100, and the orthographic projection of the fixing portion 300 on the plane where the main body 11 is located is located outside the display area A. Arranged in this way, the frame of the display device 1000 can be reduced.

[0059] For example, Figure 5 As shown, the fixing portion 300 includes a first fixing portion 310 and a second fixing portion 320. The first fixing portion 310 covers the side of the bending portion 12 away from the frame 220 and extends to the main body 11 and the binding portion 13. The second fixing portion 320 covers the side of the bending portion 12 close to the frame 220 and extends to the main body 11 and the binding portion 13.

[0060] In some related technologies, along the first direction, the two ends of the support pad exceed the two ends of the binding part. During the bending process, the adsorption jig will adhere to the support pad. When the adsorption jig is removed from the binding part, the adsorption jig will drive the main body of the support pad to detach. In other related technologies, along the first direction, the two ends of the support pad are retracted relative to the two ends of the binding part, and the part of the support pad that is retracted relative to the binding part, the part of the binding part that exceeds the support pad, and the injection mold form a first overflow glue channel. During the edge injection molding process, the injected glue flows through the first overflow glue channel to other parts of the display module, such as the display area, thereby causing the display module to display abnormally.

[0061] In order to solve the above technical problems, Figure 6 to Figure 10 As shown, the support pad 20 provided in some embodiments of the present disclosure includes a first sub-portion 21 and a second sub-portion 22. Along the first direction X, the second sub-portion 22 is located on at least one side of the first sub-portion 21, and both ends of the first sub-portion 21 are flush with both ends of the support pad 20. That is, along the first direction X, one end of the support pad 20 exceeds the binding portion 13, and the other end is flush with the binding portion 13, or, both ends of the support pad 20 exceed both ends of the binding portion 13.

[0062] like Figure 6As shown, during the edge injection molding process, the portion of the support pad 20 that exceeds the binding portion 13, i.e., the second sub-portion 22, contacts the injection mold 1, which can avoid the generation of the first overflow glue channel in the related art, thereby preventing the injected glue from flowing through the first overflow glue channel to other parts of the display module 100, so as to improve the display effect of the display module 100.

[0063] The first sub-section 21 is configured such that when separated from the adsorption jig, there is no adhesive force between the first sub-section 21 and the adsorption jig. This arrangement can improve the problem of the adsorption jig and the first sub-section 21 adhering to each other and causing the support pad 20 to separate from the main body 11.

[0064] The specific structure of the support pad 20 is described below by way of example.

[0065] In some embodiments, Figure 7 and Figure 8 As shown, the support pad 20 includes a first support layer 201, a support portion 202 and a first adhesive layer 203. Along the first direction X, the two ends of the first support layer 201 exceed the two ends of the binding portion 13. A receiving groove 2011 is provided on the surface of the first support layer 201 close to the binding portion 13. The orthographic projection of the receiving groove 2011 on the reference surface is located within the range of the orthographic projection of the binding portion 13 on the reference surface. The support portion 202 is located in the receiving groove 2011, and the first support layer 201 and the binding portion 13 are connected through the support portion 202. The first adhesive layer 203 is located on the side of the first support layer 201 away from the binding portion 13, and overlaps with the first support layer 201.

[0066] That is to say, along the first direction X, the portion of the first supporting layer 201 that does not extend beyond the binding portion 13, the portion of the supporting portion 202 and the first adhesive layer 203 that does not extend beyond the binding portion 13 form a first sub-portion 21, the portion of the first supporting layer 201 that extends beyond the binding portion 13 and the portion of the first adhesive layer 203 that extends beyond the binding portion 13 form a second sub-portion 22, and, along the first direction X, the second sub-portion 22 is located on both sides of the first sub-portion 21.

[0067] In this way, on the one hand, the second sub-section 22 is located on both sides of the first sub-section 21, which can avoid the generation of the first overflow glue channel in the related art, and improve the problem that the injection glue flows to other parts of the display module 100, thereby affecting the normal display of the display module 100. On the other hand, during the bending process, the part of the first support layer 201 that exceeds the binding part 13 is in direct contact with the adsorption jig, that is, there is no adhesive layer between the first support layer 201 and the adsorption jig, that is, there is no adhesive force between the first adhesive layer 203 and the adsorption jig, so that the problem of the adsorption jig and the second sub-section 22 being bonded to each other and causing the support pad 20 to detach from the main body 11 can be improved.

[0068] The material of the first supporting layer 201 may include polyethylene terephthalate (PET) and polyimide (PI), and the material of the first adhesive layer 203 may include pressure sensitive adhesive (PSA).

[0069] The specific structure of the support portion 202 is described below by way of example.

[0070] In some examples, such as Figure 7 As shown, the support portion 202 includes a second adhesive layer 2021 . The material of the second adhesive layer 2021 may include a pressure-sensitive adhesive. The first support layer 201 and the binding portion 13 are bonded together by the second adhesive layer 2021 .

[0071] In other examples, such as Figure 8 As shown, the support portion 202 includes a second adhesive layer 2021 , a second support layer 2022 and a third adhesive layer 2023 .

[0072] The second support layer 2022 is located on the side of the second adhesive layer 2021 away from the binding portion 13, and overlaps with the second adhesive layer 2021. The second support layer 2022 is used to provide support to enhance the rigidity of the support pad 20, so that the support pad 20 can better support the binding portion 13. The second support layer 2022 can be a single-layer structure or a multi-layer structure, which is not specifically limited in the embodiment of the present disclosure.

[0073] It should be noted that the material of the second supporting layer 2022 may include polyethylene terephthalate and polyimide.

[0074] The third adhesive layer 2023 is located on a side of the second supporting layer 2022 away from the binding portion 13, and overlaps with the second supporting layer 2022. The material of the third adhesive layer 2023 may include a pressure-sensitive adhesive. The third adhesive layer 2023 may be made of the same material as the second adhesive layer 2021, for example, the materials of the third adhesive layer 2023 and the second adhesive layer 2021 are both pressure-sensitive adhesives.

[0075] In some examples, such as Figure 7 and Figure 8 As shown, the surface of the support portion 202 close to the binding portion 13 is flush with the surface of the first support layer 201 close to the binding portion 13 .

[0076] By configuring in this manner, the surface of the first supporting layer 201 close to the binding portion 13 can be in direct contact with the binding portion 13, thereby improving the problem of a second glue overflow channel formed by a gap between the surface of the first supporting layer 201 close to the binding portion 13 and the binding portion 13, thereby avoiding the risk of the injected glue flowing to other parts of the display module 100 (such as the display area A) through the second glue overflow channel, thereby improving the display effect of the display module 100.

[0077] In some examples, such as Figure 7 and Figure 8 As shown, there is a gap between the boundary of the orthographic projection of the support portion 202 on the main body 11 and the outer boundary of the orthographic projection of the receiving groove 2011 on the main body 11. In this way, the support portion 202 can be located in the receiving groove 2011.

[0078] For example, Figure 7 and Figure 8 As shown, the distance between the boundary of the orthographic projection of the support portion 202 on the main body 11 and the outer boundary of the orthographic projection of the receiving groove 2011 on the main body 11 is 0.3 mm to 0.5 mm.

[0079] For example, the distance between the boundary of the orthographic projection of the support portion 202 on the main body 11 and the outer boundary of the orthographic projection of the accommodating groove 2011 on the main body 11 is 0.3 mm, 0.32 mm, 0.35 mm, 0.36 mm, 0.39 mm, 0.40 mm, 0.44 mm, 0.47 mm or 0.5 mm, which are not listed one by one in the embodiments of the present disclosure.

[0080] In some embodiments, Figure 7 and Figure 8 As shown, along the first direction X, the distance between the boundary of the orthographic projection of the binding portion 13 on the main body 11 and the outer boundary of the orthographic projection of the receiving groove 2011 on the main body 11 is 1.7 mm to 2.9 mm.

[0081] For example, the distance between the boundary of the orthographic projection of the binding portion 13 on the main body 11 and the outer boundary of the orthographic projection of the accommodating groove 2011 on the main body 11 is 1.7 mm, 1.71 mm, 1.75 mm, 1.79 mm, 1.8 mm, 1.83 mm, 1.86 mm, 1.9 mm, 2 mm, 2.3 mm, 2.4 mm, 2.6 mm, 2.8 mm or 2.9 mm, and the embodiments of the present disclosure are not listed one by one.

[0082] Arranged in this way, the receiving groove 2011 can be made larger, so that the supporting portion 202 can be made larger, and the contact area between the supporting portion 202 and the binding portion 13 is larger, thereby increasing the connection firmness between the supporting portion 202 and the binding portion 13.

[0083] For example, Figure 7 and Figure 8 As shown, along the first direction X, the distance between the outer boundary of the orthographic projection of the support portion 202 on the main body 11 and the outer boundary of the orthographic projection of the receiving groove 2011 on the main body 11 is 2 mm to 3 mm.

[0084] For example, the distance between the outer boundary of the orthographic projection of the support portion 202 on the main body 11 and the outer boundary of the orthographic projection of the accommodating groove 2011 on the main body 11 is 2 mm, 2.1 mm, 2.2 mm, 2.4 mm, 2.5 mm, 2.7 mm, 2.9 mm or 3 mm, and the embodiments of the present disclosure are not listed one by one.

[0085] like Figure 7 and Figure 8 As shown, along the first direction X, the distance between the outer boundary of the orthographic projection of the support portion 202 on the main body 11 and the boundary of the orthographic projection of the binding portion 13 on the main body 11 is 150 μm to 250 μm.

[0086] For example, the distance between the outer boundary of the orthographic projection of the support portion 202 on the main body 11 and the boundary of the orthographic projection of the binding portion 13 on the main body 11 is 150μm, 160μm, 180μm, 190μm, 200μm, 205μm, 213μm, 220μm, 225μm, 233μm, 240μm, 245μm or 250μm, which are not listed one by one in the embodiments of the present disclosure.

[0087] In other embodiments, Fig. 9 As shown, the support pad 20 includes a first support layer 201, a fourth adhesive layer 204 and a first adhesive layer 203. Along the first direction X, two ends of the first support layer 201 exceed two ends of the binding portion 13. The fourth adhesive layer 204 is located on a side of the first support layer 201 close to the binding portion 13 and overlaps with the first support layer 201. The first adhesive layer 203 is located on a side of the first support layer 201 away from the binding portion 13 and overlaps with the first support layer 201.

[0088] That is, along the first direction X, the portion of the first supporting layer 201 that does not extend beyond the binding portion 13, the portion of the fourth adhesive layer 204 that does not extend beyond the binding portion 13, and the portion of the first adhesive layer 203 that does not extend beyond the binding portion 13 form the first sub-portion 21. The portion of the first supporting layer 201 that extends beyond the binding portion 13, the portion of the fourth adhesive layer 204 that extends beyond the binding portion 13, and the portion of the first adhesive layer 203 that does not extend beyond the binding portion 13 form the second sub-portion 22, and, along the first direction X, the second sub-portion 22 is located on both sides of the first sub-portion 21.

[0089] In this way, on the one hand, the second sub-section 22 is located on both sides of the first sub-section 21, which can avoid the generation of the first overflow glue channel in the related art, and improve the problem that the injection glue flows to other parts of the display module 100, thereby affecting the normal display of the display module 100. On the other hand, during the bending process, the part of the first adhesive layer 203 that exceeds the binding part 13 is in direct contact with the adsorption jig, and the part of the first adhesive layer 203 that exceeds the binding part 13 is non-sticky, that is, there is no adhesive force between the first adhesive layer 203 and the adsorption jig, thereby improving the problem that the adsorption jig and the second sub-section 22 are bonded to each other, causing the support pad 20 to detach from the main body 11.

[0090] The material of the fourth adhesive layer 204 is exemplified below.

[0091] In some examples, the material of the fourth adhesive layer 204 is a photocurable adhesive layer. The portion of the fourth adhesive layer 204 overlapping the binding portion 13 is not irradiated by ultraviolet light, and the portion of the fourth adhesive layer 204 overlapping the binding portion 13 is sticky. The portion of the fourth adhesive layer 204 overlapping the binding portion 13 can bond the first support layer 201 to the binding portion 13. The portion of the fourth adhesive layer 204 that exceeds the binding portion 13 is irradiated by ultraviolet light, and the portion of the fourth adhesive layer 204 that exceeds the binding portion 13 is not sticky, so that there is no adhesive force between the first adhesive layer 203 and the adsorption jig, thereby improving the problem of the adsorption jig and the second sub-portion 22 being bonded to cause the support pad 20 to detach from the main body 11.

[0092] For example, Fig. 9 and Fig.10 As shown, between bending the binding portion 13 and bonding the main body 11 and the binding portion 13, the bending process also includes: using ultraviolet light to vertically irradiate the fourth adhesive layer 204 from the side of the binding portion 13 away from the main body 11. The ultraviolet light cannot pass through the binding portion 13, and the portion of the fourth adhesive layer 204 overlapping the binding portion 13 cannot be irradiated by ultraviolet light, and has adhesion. The portion of the fourth adhesive layer 204 that exceeds the binding portion 13 is not blocked by a side close to the binding portion 13, and the portion of the fourth adhesive layer 204 that exceeds the binding portion 13 is irradiated by ultraviolet light and has no adhesion.

[0093] In some examples, such as Fig. 9 As shown, along the first direction X, the distance between the outer boundary of the orthographic projection of the support portion 202 on the main body 11 and the boundary of the orthographic projection of the binding portion 13 on the main body 11 is 150 μm to 250 μm.

[0094] For example, the distance between the outer boundary of the orthographic projection of the support portion 202 on the main body 11 and the boundary of the orthographic projection of the binding portion 13 on the main body 11 is 150μm, 160μm, 180μm, 190μm, 200μm, 205μm, 213μm, 220μm, 225μm, 233μm, 240μm, 245μm or 250μm, which are not listed one by one in the embodiments of the present disclosure.

[0095] In some embodiments, Figure 2 and Figure 3 As shown, the display module 100 further includes a driving chip 40 , and the driving chip 40 is configured to provide the display panel 10 with data signals required for displaying images.

[0096] like Figure 2 and Figure 3 As shown, the driving chip 40 can be disposed on the binding portion 13 , so that the driving chip 40 can provide the data signal required for displaying the picture to the main body 11 through the binding portion 13 and the bending portion 12 to control the display panel 10 to display the image.

[0097] Here, the driving chip 40 includes at least one of microchips such as a source driving chip, a touch chip, a timing controller, and a gamma circuit, which is not specifically limited in the embodiments of the present disclosure.

[0098] In some embodiments, Figure 2 and Figure 3 As shown, the display module 100 further includes a back film 50 , and the back film 50 is located on the non-display side 11B of the display panel 10 .

[0099] In some examples, such as Figure 2 and Figure 3 As shown, the back film 50 may include, for example, a first sub-back film 501 and a second sub-back film 502 , and the first sub-back film 501 and the second sub-back film 502 are disconnected at the bending portion 12 .

[0100] The first sub-back film 501 at least partially overlaps the main body 11 along a direction perpendicular to the main body 11. The second sub-back film 502 at least partially overlaps the binding portion 13, and the second sub-back film 502 can be bent along the binding portion 13 to the non-display side 11B of the main body 11 of the display panel 10.

[0101] In this case, the back film 50 exposes the bending portion 12 of the display panel 10, which can reduce the bending resistance of the bending portion 12 of the display panel 10 and change the position of the force-neutral layer of the bending portion 12 of the display panel 10 during the bending process, thereby reducing the risk of damage to the display panel 10.

[0102] In some examples, such as Figure 2 and Figure 3As shown, the orthographic projection of the boundary of the main body 11 on the reference surface is located within the range of the orthographic projection of the boundary of the first sub-back film 501 on the reference surface, that is, the first sub-back film 501 covers the main body 11, and the side of the first sub-back film 501 close to the second sub-back film 502 extends to the bending portion 12. The orthographic projection of the boundary of the binding portion 13 on the reference surface is located within the range of the orthographic projection of the boundary of the second sub-back film 502 on the reference surface, that is, the second sub-back film 502 covers the binding portion 13, and the side of the second sub-back film 502 close to the first sub-back film 501 extends to the bending portion 12.

[0103] In this case, during the bending process of the display panel 10, stress concentration at the junction of the main body 11, the bending portion 12 and the binding portion 13 can be avoided, thereby reducing the risk of cracks or breakage of the display panel 10 at the junction of the main body 11, the bending portion 12 and the binding portion 13.

[0104] In some embodiments, Figure 5 As shown, the display module 100 further includes a cover plate 60 , a fifth adhesive layer 70 , a circular polarizer 80 and a buffer layer 90 .

[0105] like Figure 5 As shown, the cover plate 60 is located on a side of the main body 11 away from the binding portion 13. Arranged in this way, the cover plate 60 can reduce the risk of the main body 11 being scratched.

[0106] The fifth adhesive layer 70 is located between the cover plate 60 and the main body 11. The material of the fifth adhesive layer 70 may include an adhesive material with a high light transmittance (for example, a light transmittance greater than or equal to 85%) such as an optically clear adhesive (OCA) or a pressure sensitive adhesive (PSA). For example, the material of the fifth adhesive layer 70 includes optical adhesive.

[0107] The circular polarizer 80 is located between the fifth adhesive layer 70 and the main body 11 , and at least covers the display area A. The circular polarizer 80 can reduce the reflection of ambient light by the main body 11 .

[0108] The buffer layer 90 is located between the main body 11 and the support pad 20 and covers at least the display area A. The buffer layer 90 mainly plays a role of buffering and shock resistance to improve the impact resistance of the display module 100. The material of the buffer layer 90 includes super clean foam composite film (English: Super Clean Foam, referred to as: SCF).

[0109] In the description of this specification, specific features, structures, materials or characteristics may be combined in an appropriate manner in any one or more embodiments or examples.

[0110] The above is only a specific embodiment of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any changes or substitutions that can be thought of by any person skilled in the art within the technical scope disclosed in the present disclosure should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. A display module, characterized in that: include: The display panel comprises a main body, a binding portion and a bending portion between the main body and the binding portion; The main body has a display side and a non-display side that are opposite to each other, and the bending axis of the bending portion extending along the first direction is bent toward the non-display side of the main body, so that the binding portion is bent to the non-display side of the main body; A support pad is located between the main body and the binding portion; the support pad comprises a first sub-portion and a second sub-portion; along the first direction, the second sub-portion is located on at least one side of the first sub-portion, and two ends of the first sub-portion are flush with two ends of the support pad; The first sub-section is configured such that, when separated from the adsorption jig, there is no adhesive force between the first sub-section and the adsorption jig.

2. The display module according to claim 1, characterized in that: The support pad comprises: a first supporting layer; along the first direction, two ends of the first supporting layer extend beyond two ends of the binding portion, and a receiving groove is provided on a surface of the first supporting layer close to the binding portion; an orthographic projection of the receiving groove on the main body is located within the range of an orthographic projection of the binding portion on the main body; A supporting portion, located in the receiving groove; the first supporting layer and the binding portion are connected via the supporting portion; The first adhesive layer is located on a side of the first supporting layer away from the binding portion and overlaps with the first supporting layer.

3. The display module according to claim 2, characterized in that: The support portion comprises: a second adhesive layer; a second supporting layer, located on a side of the second adhesive layer away from the binding portion; The third adhesive layer is located on a side of the second supporting layer away from the binding portion.

4. The display module according to claim 2, characterized in that: A surface of the supporting portion close to the binding portion is flush with a surface of the first supporting layer close to the binding portion.

5. The display module according to claim 2, characterized in that: There is a gap between a boundary of an orthographic projection of the support portion on the main body and an outer boundary of an orthographic projection of the accommodation groove on the main body.

6. The display module according to claim 2, characterized in that: Along the first direction, a distance between a boundary of an orthographic projection of the binding portion on the main body and an outer boundary of an orthographic projection of the accommodating groove on the main body is 1.7 mm to 2.9 mm.

7. The display module according to claim 1, characterized in that: The support pad comprises: A first supporting layer; along the first direction, two ends of the first supporting layer extend beyond two ends of the binding portion; a fourth adhesive layer, located on a side of the first supporting layer close to the binding portion and overlapping with the first supporting layer; The first adhesive layer is located on a side of the first supporting layer away from the binding portion and overlaps with the first supporting layer.

8. The display module according to claim 7, characterized in that: The material of the fourth adhesive layer is a photocurable adhesive layer.

9. The display module according to claim 7, characterized in that: Along the first direction, a distance between a boundary of an orthographic projection of the first supporting layer on the main body and a boundary of an orthographic projection of the binding portion on the main body is 150 μm to 250 μm.

10. A display device, characterized in that: comprising a display module as claimed in any one of claims 1 to 9; The middle frame includes a bottom plate and a frame arranged around the bottom plate; the bottom plate is arranged on a side of the binding part of the display module away from the main body, and the frame is arranged around the peripheral side of the display panel.

11. The display device according to claim 10, characterized in that: Also includes A first fixing portion covers a side of the bending portion away from the frame and extends to the main body portion and the binding portion; The second fixing portion covers a side of the bending portion close to the frame and extends to the main body portion and the binding portion.

Citation Information

Patent Citations

  • Display device and electronic device

    CN112071197A

  • Display module and display terminal

    CN114203050A

  • Display module and display device

    CN115775499A

  • Display device and mobile terminal

    CN115775500A

  • Display module and display device

    CN116884316A