Chip bonder and method for correcting head position of chip bonder
By integrating the camera device and control unit in the chip bonding machine, and correcting the head position using image data, the chip operation error problem caused by the deformation of the drive shaft is solved, and precise chip bonding and high-yield manufacturing process are realized.
Patent Information
- Application Number
- CN202411528788.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2023-10-30
- Filing Date
- 2024-10-30
- Publication Date
- 2025-05-02
Smart Images
Figure CN119920724A_ABST
Abstract
Description
Technical Field
[0001] Embodiments of the present invention relate to a chip bonding machine and a method for correcting the head position of the chip bonding machine. More specifically, they relate to a chip bonding machine capable of correcting the position of a deformed head and a method for correcting the head position of the chip bonding machine. Background Art
[0002] As an example of a semiconductor manufacturing apparatus, a die bonder can mount a chip (semiconductor chip) on a so-called substrate such as a wiring substrate or a lead frame, and can assemble a package as a product.
[0003] In order to achieve a precise bonding process, the chip bonder needs to accurately bond the chip to the bonding surface of the substrate. To this end, the chip needs to be picked and placed (Pick & Place) precisely.
[0004] However, when the die bonding is driven for a long time, the drive shaft at the head, which is a component of picking up and placing the die, may be deformed. Due to the deformation of the drive shaft, the pick-up and placement operation for the die may have errors. Such errors may affect the yield rate during the semiconductor manufacturing process. Summary of the invention
[0005] The present invention is intended to solve various problems including the above-mentioned problems, and an object of the present invention is to provide a die bonder capable of correcting the position of a deformed head and a head position correction method of the die bonder. However, these problems are exemplary, and the scope of the present invention is not limited thereto.
[0006] In order to solve the above-mentioned problem, a chip bonding machine according to an embodiment of the present invention may include: a head for picking up and placing a target arranged at a first position; a driving device for moving the head; a camera device for generating image data including an upper surface of the target and an upper surface of the head; and a control unit for acquiring the 1-1 center point information of the head and the 1-2 center point information of the target based on the image data, and correcting the position of the head based on the 1-1 center point information and the 1-2 center point information.
[0007] In one embodiment, after picking up the target from the first position, the head can lift the target in a vertical direction, rotate the target in a horizontal direction by a predetermined angle, and can lower the target in a vertical direction and place it in the first position.
[0008] In one embodiment, the camera device can generate 1-1 image data, the 1-1 image data including the upper surface of the target before being picked up by the head and the upper surface of the head before picking up the target, and can generate 1-2 image data, the 1-2 image data including the upper surface of the target after being placed by the head in the first position and the upper surface of the head after placing the target.
[0009] In one embodiment, the control unit may acquire the 1-1st center point information and the 1-2nd center point information based on the 1-1st image data and the 1-2nd image data.
[0010] In one embodiment, the 1-1th center point information may be the 1-1th average coordinates of the center point coordinates of the upper surface of the head of the 1-1th image data and the center point coordinates of the upper surface of the head of the 1-2nd image data.
[0011] In one embodiment, the 1-2nd center point information may be 1-2 average coordinates of the center point coordinates of the upper surface of the target in the 1-1st image data and the center point coordinates of the upper surface of the target in the 1-2nd image data.
[0012] In one embodiment, the control unit may move the head in such a manner that the 1-1th average coordinate is consistent with the 1-2nd average coordinate.
[0013] In order to solve the above-mentioned problem, a head position correction method of a chip bonding machine according to an embodiment of the present invention may include the following steps: controlling a camera device to generate 1-1 image data including an upper surface of a target arranged at a first position and an upper surface of a head; controlling a head pick-up and placement operation, wherein the pick-up and placement operation is to perform an operation of lifting the target in a vertical direction, rotating the target in a horizontal direction by a predetermined angle, and lowering the target in a vertical direction and placing it in the first position after picking up the target from the first position; after the pick-up and placement operation, controlling the camera device to generate 1-2 image data including an upper surface of the target and an upper surface of the head; acquiring 1-1 center point information of the head and 1-2 center point information of the target based on the 1-1 image data and the 1-2 image data; and correcting the position of the head based on the 1-1 center point information and the 1-2 center point information.
[0014] In one embodiment, the 1-1th center point information may be the 1-1th average coordinates of the center point coordinates of the upper surface of the head of the 1-1th image data and the center point coordinates of the upper surface of the head of the 1-2nd image data.
[0015] In one embodiment, the 1-2nd center point information may be 1-2 average coordinates of the center point coordinates of the upper surface of the target in the 1-1st image data and the center point coordinates of the upper surface of the target in the 1-2nd image data.
[0016] In one embodiment, the step of correcting the position of the head may be a step of moving the head in such a manner that the 1-1th average coordinates are consistent with the 1-2nd average coordinates.
[0017] In one embodiment, the method for correcting the position of a head of a chip bonder may further include a step of controlling the head to move the target to a second position.
[0018] In one embodiment, the head position correction method of a die bonder may further include controlling the camera device to generate 2-1st image data including the target arranged at the second position and an upper surface of the head.
[0019] In one embodiment, the head position correction method of the chip bonding machine may further include the following steps: performing a second pick-and-place operation, wherein the second pick-and-place operation is to lift the target in a vertical direction after picking up the target from the second position, rotate the target in a horizontal direction by a predetermined angle, and lower the target in a vertical direction and place it in the second position.
[0020] In one embodiment, the head position correction method of a chip bonder may further include a step of controlling the camera device to generate 2-2nd image data including an upper surface of the target and an upper surface of the head after the second pick and place operation.
[0021] In one embodiment, the head position correction method of the chip bonding machine may further include the step of acquiring the 2-1st center point information of the head and the 2-2nd center point information of the target based on the 2-1st image data and the 2-2nd image data.
[0022] In one embodiment, the method for calibrating the head position of a chip bonding machine may further include a step of performing a second calibration on the position of the head based on the 2-1st center point information and the 2-2nd center point information.
[0023] In one embodiment, the 2-1st center point information may be the 2-1st average coordinates of the center point coordinates of the upper surface of the head of the 2-1st image data and the center point coordinates of the upper surface of the head of the 2-2nd image data.
[0024] In one embodiment, the 2-2nd center point information may be 2-2nd average coordinates of the center point coordinates of the upper surface of the target in the 2-1st image data and the center point coordinates of the upper surface of the target in the 2-2nd image data.
[0025] In one embodiment, the step of performing a second correction on the position of the head may be a step of performing a second movement on the head in such a manner that the 2-1st average coordinate is consistent with the 2-2nd average coordinate.
[0026] According to the embodiments of the present invention implemented as described above, a die bonder and a head position correction method for a die bonder capable of correcting the position of a deformed head can be implemented. Of course, the scope of the present invention is not limited to such effects. BRIEF DESCRIPTION OF THE DRAWINGS
[0027] Figure 1 FIG. 1 is a conceptual diagram schematically showing components of a die bonder according to an embodiment of the present invention.
[0028] Figure 2 It is schematically shown Figure 1 A conceptual diagram of the components of the control unit.
[0029] Figure 3 It is schematically shown Figure 1 FIG. 1 is a diagram of an embodiment of a chip bonder.
[0030] Figure 4 It is schematically shown Figure 3 Plan view of the upper surface of the target.
[0031] Figure 5 (a) and Figure 5 (b) schematically shows Figure 3 Plan view of the upper surface of the head.
[0032] Figure 6 FIG. 4 is a flow chart schematically illustrating a method for correcting a head position of a die bonder according to an embodiment of the present invention.
[0033] Figure 7 It is schematically shown Figure 6 A flowchart of the steps following the steps of
[0034] Description of Reference Numerals
[0035] 100: Chip bonder 110: Head
[0036] 120: driving device 130: camera device
[0037] 140: Control unit 131: First camera device
[0038] 132: Second camera device 111: Fiducial marker
[0039] TG: Target 10: Substrate
[0040] A: First position B: Second position DETAILED DESCRIPTION
[0041] The present invention can be transformed into various forms and can have various embodiments, and specific embodiments will be shown in the drawings and described in detail in the description of the present invention. The effects, features and methods of achieving the same can be clearly understood by referring to the embodiments described in detail below in conjunction with the drawings. However, the present invention is not limited to the embodiments disclosed below, but can be implemented in various forms.
[0042] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. When describing with reference to the accompanying drawings, the same reference numerals are given to the same or corresponding components, and repeated description thereof will be omitted.
[0043] In the following embodiments, the terms "first", "second", etc. are not restrictive, but are used to distinguish one component from other components. In addition, in the following embodiments, unless the context clearly indicates otherwise, singular expressions also include plural expressions.
[0044] In the following embodiments, when various components such as layers, films, regions, and plates are located “on” another component, this includes not only the case where the component is “directly above” another component, but also the case where another component exists between the two components.
[0045] Moreover, in the drawings, the size of the components may be enlarged or reduced for the convenience of description. For example, the size and thickness of each component shown in the drawings are arbitrarily indicated for the convenience of description, and therefore the present invention is not limited to the size and thickness shown in the drawings.
[0046] In the following embodiments, terms such as “including” or “having” refer to the existence of features or constituent elements described in the specification, and do not preclude the possibility of adding one or more other features or constituent elements.
[0047] In the following embodiments, when part of a film, region, component, etc. is located on or above another part, it includes not only the case where it is directly located on the other part, but also the case where another film, region, component, etc. is sandwiched therebetween.
[0048] When a certain embodiment can be implemented in different ways, a specific process order can be performed differently from the order described. For example, two processes described in succession can be performed substantially simultaneously, or can be performed in an order opposite to the order described.
[0049] In this specification, "A and / or B" means A or B or A and B. Also, "at least one of A and B" means A or B or = or A and B.
[0050] In the following embodiments, when a film, region, component, etc. is connected, it also includes the case where the film, region, component, etc. are directly connected, and / or the case where the film, region, component, etc. are indirectly connected with another film, region, component, etc. in between. For example, in this specification, when a film, region, component, etc. is connected, it means the case where the film, region, component, etc. are directly electrically connected, and / or the case where another film, region, component, etc. are indirectly electrically connected with another film, region, component, etc. in between.
[0051] In the following embodiments, the x-axis, y-axis, and z-axis are not limited to the three axes on the rectangular coordinate system, but can be interpreted as a broad sense including these. For example, the x-axis, y-axis, and z-axis can be orthogonal to each other, but can also refer to different directions that are not orthogonal to each other.
[0052] Based on the above contents, according to a preferred embodiment of the present invention, a die bonder capable of correcting the position of a deformed head and a method for correcting the head position of the die bonder are described in detail as follows.
[0053] Figure 1 FIG. 1 is a conceptual diagram schematically showing components of a die bonder according to an embodiment of the present invention.
[0054] like Figure 1 As shown, a die bonder 100 according to an embodiment of the present invention may include a head 110 , a driving device 120 , a camera device 130 , and a control unit 140 .
[0055] The head 110 may be a component for performing a pick-and-place operation on a target TG arranged on the substrate 10. For example, the head 110 may include a suction head, a finger-driven head, a magnetic head, and a customized head. For example, depending on the situation, the chip bonder 100 may include a plurality of arms or a plurality of heads 110. Hereinafter, in the description of the present invention, the head 110 is described as a suction head, but the protection scope of the present invention is not limited thereto.
[0056] The driving device 120 may be a component for moving the head 110. The driving device 120 may drive the head 110 along the vertical axis and the horizontal axis. However, when driven for a long time, the axis operation method of the driving device 120 may have a certain degree of error. Therefore, it is necessary to perform the manufacturing process while correcting such error in the manufacturing process of semiconductors, etc.
[0057] The camera device 130 may include an optical sensor and may be a component for photographing an object to generate an optical image. The camera device 130 may be arranged on the target TG and the head 110, and may photograph the upper surface of the target TG and the upper surface of the head 110. For example, the camera device 130 may be arranged on the target TG and the head 110 to face the target TG and the head 110, and the camera device 130 may generate image data including the upper surface of the target TG and the upper surface of the head 110.
[0058] The control unit 140 may be a component for controlling other components of the die bonder 100, generating and transmitting control instructions, and receiving and storing data generated from other components. For example, the control unit 140 may be a user terminal, a computing device, a server, etc. For example, the control unit 140 may acquire the center point information of the head 110 and the center point information of the target TG based on the image data generated from the camera device 130.
[0059] The center point information of the head 110 may include 1-1 center point information, 2-1 center point information, 3-1 center point information, and 4-1 center point information, and the center point information of the target TG may include 1-2 center point information, 2-2 center point information, 3-2 center point information, and 4-2 center point information. The center point information mentioned in the present invention may be the coordinate information of the rotation axis when rotating and driving in the horizontal direction.
[0060] The control unit 140 can correct the position of the head 110 based on the above-mentioned center point information. Specifically, the control unit 140 can obtain the 1-1 center point information of the head 110 and the 1-2 center point information of the target TG based on the image data, and can correct the position of the head 110 based on the 1-1 center point information and the 1-2 center point information.
[0061] As described above, the chip bonder according to the present invention can provide a device capable of correcting the position of the head using a camera device. As the position of the head can be corrected using only an optical image of the target, the chip bonder according to the present invention can have the effect of determining the position of the head in real time during the semiconductor manufacturing process and correcting the position of the head. Therefore, the chip bonder according to the present invention can correct the position of the head without interrupting the manufacturing process, and thus has a significant effect of being able to correct the position of the head in real time without causing problems caused by interruptions in the manufacturing process.
[0062] Figure 2 It is schematically shown Figure 1 A conceptual diagram of the components of the control unit.
[0063] For reference, Figure 2 In the description, the same or repeated contents as above may be omitted.
[0064] The control unit 140 may include a memory 141, a processor 142, and a communication module 143. Hereinafter, in this specification, it should be understood that operations, instructions, controls, etc. performed by the control unit 140 are performed by the processor 142 executing instructions stored in the memory 141 described later, and data or information generated by the processor 142 is transmitted to an external device via the communication module 143.
[0065] The memory 141 stores data supporting various functions of the control unit 140. The memory 141 may store a plurality of application programs (applications) driven by the control unit 140, data and instructions for the operation of the control unit 140. The application program may be stored in the memory 141, installed in the control unit 140, and driven by the processor 142 to execute the operation (or function) of the control unit 140.
[0066] The processor 142 can control other components by executing instructions stored in the memory 141. The processor 142 can execute instructions stored in the memory 141. The processor 142 is a component that can perform calculations and control other devices. It can mainly refer to a central processing unit (CPU), an application (AP), a graphics processing unit (GPU), etc.
[0067] The communication module 143 can perform wired communication functions with other components, or can perform wireless communication through an antenna. Wireless communication can refer to communication using communication facilities already set up by a communication company and a wireless communication network using the frequency of the communication facilities. Alternatively, wireless communication can refer to Bluetooth. TM ), Bluetooth Low Energy (BLE), Beacon, RFID (Radio Frequency Identification), NFC (Near Field Communication), IrDA (Infrared Data Association), UWB (Ultra Wideband), Zigbee, and other short-distance communications.
[0068] Figure 3 It is schematically shown Figure 1 FIG. 1 is a diagram of an embodiment of a chip bonder.
[0069] For reference, Figure 3 In the description, the same or repeated contents as above may be omitted.
[0070] like Figure 3 As shown, the target TG can be arranged on the substrate 10. For example, the target TG can refer to a chip in a semiconductor manufacturing process. For example, the target TG is a test chip used for calibrating the head 110, and can be glass of the same specifications as the chip used in the manufacturing process. The substrate 10, as a structure for placing the target TG, can be an object for chip bonding. At this time, the substrate 10 can be understood as a common substrate 10 used in a semiconductor process.
[0071] For example, the head 110 may move the target TG using an adsorption method. To implement the adsorption method, the head 110 may include an adsorption plate 112, and the target TG may be moved by the adsorption force of the adsorption plate 112.
[0072] The target TG may be arranged at a first position A on the substrate 10. The head 110 may move the target TG at the first position A to a second position B on the substrate 10. To this end, the head 110 may perform vertical driving and horizontal driving.
[0073] For example, after picking up the target TG from the first position A, the head 110 can lift the target TG in the vertical direction, rotate the target TG in the horizontal direction by a predetermined angle (for example, 180 degrees), and lower the target TG in the vertical direction and place it in the first position A.
[0074] For example, after picking up the target TG from the first position A, the head 110 can lift the target TG in the vertical direction, and can move the target TG in the horizontal direction (for example, from the first position A toward the second position B) a predetermined distance, and can lower the target TG in the vertical direction and place it in the second position B.
[0075] For example, after picking up the target TG from the second position B, the head 110 can lift the target TG in the vertical direction, rotate the target TG in the horizontal direction by a predetermined angle (for example, 180 degrees), and lower the target TG in the vertical direction and place it in the second position B.
[0076] The camera device 130 may include lens units 131a and 132a for generating an optical image. The lens units 131a and 132a may be arranged above the target TG and the head 110 to face the upper surface of the target TG and the upper surface of the head 110. For example, the camera device 130 may include a first camera device 131 arranged above a first position A and a second camera device 132 arranged above a second position B.
[0077] For example, the camera device 130 may generate 1-1th image data, which may include the upper surface of the target TG before being picked up by the head 110 and the upper surface of the head 110 before picking up the target TG. At this time, the camera device 130 may be the first camera device 131.
[0078] For example, the camera device 130 may generate 1-2nd image data including the upper surface of the target TG after the head 110 is placed at the first position A and the upper surface of the head 110 after the target TG is placed. At this time, the camera device 130 may be the first camera device 131 .
[0079] In other words, the 1-1st image data may include the upper surface of the target TG before the pick and place driving and the upper surface of the head 110. The 1-2nd image data may include the upper surface of the target TG after the pick and place driving and the upper surface of the head 110. The target TG of the 1-1st image data may be in a state of not rotating in the horizontal direction, and the target TG of the 1-2nd image data may be in a state of rotating in the horizontal direction.
[0080] The control unit 140 may acquire the 1-1st center point information and the 1-2nd center point information based on the 1-1st image data and the 1-2nd image data.
[0081] The 1-1st center point information may be the 1-1st average coordinates of the center point coordinates of the upper surface of the head 110 of the 1-1st image data and the center point coordinates of the upper surface of the head 110 of the 1-2nd image data. For example, if the shaft for driving the head 110 is in a twisted state, the center point coordinates of the upper surface of the head 110 of the 1-1st image data and the center point coordinates of the upper surface of the head 110 of the 1-2nd image data may be different from each other. Therefore, it is necessary to correct the difference of the two center point coordinates.
[0082] The 1-2 center point information may be the 1-2 average coordinates of the center point coordinates of the upper surface of the target TG of the 1-1 image data and the center point coordinates of the upper surface of the target TG of the 1-2 image data. For example, if the axis for driving the head 110 is in a twisted state, the center point coordinates of the upper surface of the target TG of the 1-1 image data and the center point coordinates of the upper surface of the target TG of the 1-2 image data may be different from each other. Therefore, it is necessary to correct the difference in the two center point coordinates.
[0083] In order to correct the difference between the center point coordinates, the control unit 140 may move the head 110 so that the 1-1 average coordinates coincide with the 1-2 average coordinates. At this time, the 1-1 average coordinates and the 1-2 average coordinates may coincide with each other at the viewpoint of the camera device 130. That is, the control unit 140 may move the head 110 based on the image data received from the camera device 130 so that the 1-1 average coordinates coincide with the 1-2 average coordinates.
[0084] The control part 140 may move the target TG from the first position A to the second position B. The control part 140 may perform the above-mentioned process on the target TG at the second position B again.
[0085] For example, the control section 140 may control the camera device 130 to generate 2-1st image data including the upper surface of the target TG and the upper surface of the head 110 disposed at the second position B. At this time, the camera device 130 may be the second camera device 132 .
[0086] For example, the control unit 140 can control the head 110 to perform a second picking and placing operation in which, after picking up the target TG from the second position B, the target TG is lifted in the vertical direction, the target TG is rotated in the horizontal direction by a predetermined angle, and the target TG is lowered in the vertical direction and placed in the second position B.
[0087] For example, the control section 140 may control the camera device 130 to generate 2-2nd image data including the upper surface of the target TG and the upper surface of the head 110 after the second pick-and-place operation. At this time, the camera device 130 may be the second camera device 132.
[0088] For example, the control unit 140 may acquire the 2-1st center point information of the head 110 and the 2-2nd center point information of the target TG based on the 2-1st image data and the 2-2nd image data.
[0089] The 2-1st center point information may be the 2-1st average coordinates of the center point coordinates of the upper surface of the head 110 of the 2-1st image data and the center point coordinates of the upper surface of the head 110 of the 2-2nd image data. For example, if the shaft for driving the head 110 is in a twisted state, the center point coordinates of the upper surface of the head 110 of the 2-1st image data and the center point coordinates of the upper surface of the head 110 of the 2-2nd image data may be different from each other. Therefore, it is necessary to correct the difference of the two center point coordinates.
[0090] The 2-2 center point information may be the 2-2 average coordinates of the center point coordinates of the upper surface of the target TG of the 2-1 image data and the center point coordinates of the upper surface of the target TG of the 2-2 image data. For example, if the axis for driving the head 110 is in a twisted state, the center point coordinates of the upper surface of the head 110 of the 2-1 image data and the center point coordinates of the upper surface of the head 110 of the 2-2 image data may be different from each other. Therefore, it is necessary to correct the difference in the two center point coordinates.
[0091] For example, the control unit 140 may move the head 110 a second time so that the 2-1 average coordinates are consistent with the 2-2 average coordinates. At this time, the consistency of the 2-1 average coordinates and the 2-2 average coordinates can be achieved at the viewpoint of the camera device 130. That is, the control unit 140 may move the head 110 based on the image data received from the camera device 130 so that the 2-1 average coordinates are consistent with the 2-2 average coordinates.
[0092] Furthermore, the control unit 140 may move the target TG from the second position B to the third position, and the control unit 140 may perform the above process again on the target TG at the third position. In this case, the image data generated from the camera device 130 may be the 3-1st image data and the 3-2nd image data. For ease of explanation, the process performed on the target TG at the third position is replaced by the above content.
[0093] Furthermore, the control unit 140 may move the target TG from the third position to the fourth position, and the control unit 140 may perform the above process again on the target TG at the fourth position. At this time, the image data generated from the camera device 130 may be the 4-1st image data and the 4-2nd image data. For ease of explanation, the process performed on the target TG at the fourth position is replaced by the above content.
[0094] However, in the case where the distance between the derived average coordinates is less than a preset distance, the control unit 140 may terminate the process for correction. For example, in the case where the distance between the 1-1 average coordinates and the 1-2 average coordinates is less than a preset distance, the control unit 140 may not move the target TG to the second position B and terminate the process for correction. For example, in the case where the distance between the 2-1 average coordinates and the 2-2 average coordinates is less than a preset distance, the control unit 140 may not move the target TG to the third position and terminate the process for correction.
[0095] Furthermore, when the distance between the 1-1th average coordinate and the 1-2nd average coordinate is greater than a preset distance, the control unit 140 may control the head 110 to move the target TG to the second position B and perform a process for a second calibration.
[0096] For example, when the distance between the 2-1st average coordinate and the 2-2nd average coordinate is less than the preset distance, the control unit 140 may not move the target TG to the third position and terminate the process for correction. Also, when the distance between the 2-1st average coordinate and the 2-2nd average coordinate is greater than the preset distance, the control unit 140 may control the head 110 to move the target TG to the third position and perform the process for the third correction.
[0097] For example, when the distance between the 3-1 average coordinate and the 3-2 average coordinate is less than the preset distance, the control unit 140 may not move the target TG to the fourth position and terminate the process for correction. And, when the distance between the 3-1 average coordinate and the 3-2 average coordinate is greater than the preset distance, the control unit 140 may control the head 110 to move the target TG to the fourth position and perform the process for the fourth correction.
[0098] For example, in the case where the distance between the 4-1 average coordinate and the 4-2 average coordinate is less than a preset distance, the control unit 140 may not move the target TG to the next position and terminate the process for correction. Also, in the case where the distance between the 4-1 average coordinate and the 4-2 average coordinate is greater than a preset distance, the control unit 140 may control the head 110 to move the target TG to the next position and perform the process for the next correction.
[0099] As described above, the control unit 140 may execute the process for correction a plurality of times, and when the distance between the acquired average coordinates is less than a preset distance and satisfies a preset reference, the control unit 140 may terminate the process for correction.
[0100] The head 110 may further include a reference mark 111. For example, the reference mark 111 may be installed on the side of the head 110. The camera device 130 may generate image data including the upper surface of the head 110 and may generate image data including the reference mark 111 installed on the side of the head 110. The detailed description of the reference mark 111 will be described later.
[0101] As described above, as the target is rotated in the horizontal direction while performing the pick-and-place operation on the target at the first position (or the second position to the fourth position), the chip bonder according to the present invention can easily obtain information about the rotation axis of the head that absorbs the target and rotates. Since the camera device can be installed above the head to shoot the entire manufacturing process, the chip bonder according to the present invention has the ability to correct the position of the head in real time, thereby having a significant effect of providing a reference that can simply correct the position of the head without causing problems due to interruption of the manufacturing process and without the need to equip other additional components.
[0102] Figure 4 It is schematically shown Figure 3 Plan view of the upper surface of the target.
[0103] For reference, Figure 4 In the description, the same or repeated contents as above may be omitted.
[0104] like Figure 4 As shown, a plurality of marks M1, M2, M3, and M4 may be arranged on the upper surface of the target TG. The plurality of marks M1, M2, M3, and M4 may include a first mark M1, a second mark M2, a third mark M3, and a fourth mark M4.
[0105] For example, the control unit 140 may generate image data including the upper surface of the target TG through the camera device 130. The control unit 140 may obtain the center point coordinates CP of the target TG through the image data including the upper surface of the target TG. For example, in the case where the upper surface of the target TG is a quadrilateral in a plan view, a plurality of markers M1, M2, M3, and M4 may be arranged around each corner. The plurality of markers M1, M2, M3, and M4 may have a predetermined shape so that the control unit 140 can easily identify the plurality of markers M1, M2, M3, and M4.
[0106] The control unit 140 may acquire the coordinate information of the first marker M1 and the coordinate information of the fourth marker M4 from the image data. The control unit 140 may acquire the average coordinate of the coordinate information of the first marker M1 and the coordinate information of the fourth marker M4.
[0107] Furthermore, the control unit 140 may acquire the coordinate information of the second marker M2 and the coordinate information of the third marker M3 from the image data. The control unit 140 may acquire the average coordinate of the coordinate information of the second marker M2 and the coordinate information of the third marker M3.
[0108] The control unit 140 can obtain the center point coordinates CP of the upper surface of the target TG through the first average coordinates of the coordinate information of the first marker M1 and the coordinate information of the fourth marker M4 and the second average coordinates of the coordinate information of the second marker M2 and the coordinate information of the third marker M3. For example, the control unit 140 can obtain the average coordinates between the first marker average coordinates and the second marker average coordinates as the center point coordinates CP of the target TG.
[0109] As described above, the control unit 140 can obtain information about the center point of the upper surface of the target TG through the 1-1 image data and the 1-2 image data. The control unit 140 can obtain information about the center point of the upper surface of the target TG through the 2-1 image data and the 2-2 image data. The control unit 140 can obtain information about the center point of the upper surface of the target TG through the 3-1 image data and the 3-2 image data. The control unit 140 can obtain information about the center point of the upper surface of the target TG through the 4-1 image data and the 4-2 image data.
[0110] As described above, the die bonder according to the present invention can easily obtain the center point information according to the rotation of the target by marking only a plurality of marks on the target. At this time, the plurality of marks can be in a shape that is easily recognized by a camera device, and in order to recognize the plurality of marks, the existing visual recognition technology can be used.
[0111] Figure 5 (a) and Figure 5 (b) schematically shows Figure 3 Plan view of the upper surface of the head.
[0112] For reference, Figure 5 (a) and Figure 5 In the description of (b), the same or overlapping contents as those described above may be omitted.
[0113] like Figure 5 (a) and Figure 5 As shown in (b) of FIG. 1 , the upper surface of the head 110 may be photographed by the camera device 130 . The camera may photograph the upper surface of the head 110 , and the camera may photograph the reference mark 111 installed on the side of the head 110 .
[0114] Figure 5 The head 110 of (a) may represent the upper surface of the head 110 before picking up the target TG of the first position A. For example, Figure 5The header 110 of (a) may be included in the 1-1 image data.
[0115] Figure 5 The head 110 of (b) may represent the upper surface of the head 110 after the above-mentioned pick-and-place operation is performed on the target TG at the first position A. For example, Figure 5 The header 110 of (b) may be included in the 1-2 image data.
[0116] In order to obtain the rotation axis information of the head 110, the control unit 140 can obtain the first reference coordinate information of the reference mark 111 on the upper surface of the head 110 before picking up the target TG, and can obtain the second reference coordinate information of the reference mark 111 on the upper surface of the head 110 after performing the above-mentioned picking and placing operation on the target TG.
[0117] For example, the control unit 140 may obtain the average coordinates of the first reference coordinate information and the second reference coordinate information as the center point information of the head 110 .
[0118] For example, the control unit 140 may obtain the first reference coordinate information from the 1-1 image data, and may obtain the second reference coordinate information from the 1-2 image data. The control unit 140 may obtain the average coordinate information of the first reference coordinate information and the second reference coordinate information, and the obtained average coordinate information may be the 1-1 central axis information of the head 110.
[0119] and, Figure 5 The head 110 of (a) may also represent the upper surface of the head 110 before picking up the target TG at the second position B. For example, Figure 5 The header 110 of (a) may also be included in the 2-1 image data.
[0120] Figure 5 The head 110 of (b) may also represent the upper surface of the head 110 after the second pick-and-place operation described above is performed on the target TG at the second position B. For example, Figure 5 The header 110 of (b) may also be included in the 2-2 image data.
[0121] also, Figure 5 The head 110 of (a) may also represent the upper surface of the head 110 before picking up and placing the target TG at the third position or the fourth position, etc. For example, Figure 5 The header 110 of (a) may also be included in the 3-1st image data or the 4-1st image data.
[0122] also, Figure 5The head 110 of (b) may also represent the upper surface of the head 110 after the third pick-and-place operation or the fourth pick-and-place operation described above is performed on the target TG at the third position or the fourth position. For example, Figure 5 The header 110 of (b) may also be included in the 3-2nd image data or the 4-2nd image data.
[0123] As described above, by utilizing the reference mark installed on the side of the head, the die bonder according to the present invention can easily obtain the center point information according to the rotation of the head only by generating an optical image of the upper surface of the head. The reference mark has a specific shape so as to be easily recognized by the existing visual recognition technology, or may include a fluorescent substance, a substance that reacts to light of a specific wavelength, etc.
[0124] Based on the above contents, a head position correction method of a die bonder according to a preferred embodiment of the present invention, which is capable of correcting the position of the deformed head 110, will be described in detail below.
[0125] For reference, a main body that executes the head position correction method of the die bonder may be the above-mentioned control part 140 or the processor 142 included in the control part 140 .
[0126] Figure 6 FIG. 4 is a flow chart schematically illustrating a method for correcting a head position of a die bonder according to an embodiment of the present invention.
[0127] For reference, Figure 6 In the description, the same or repeated contents as above may be omitted.
[0128] like Figure 6 As shown, a head position correction method of a chip bonder according to an embodiment of the present invention may include the following steps: controlling the camera device 130 to generate 1-1 image data including the upper surface of the target TG arranged at the first position A and the upper surface of the head 110 (S1100).
[0129] The head position correction method of the chip bonding machine may also include the following steps: controlling the head 110 to perform a pick-up and place operation, wherein the pick-up and place operation is to lift the target TG in a vertical direction after picking up the target TG from the first position A, rotate the target TG in a horizontal direction by a predetermined angle, and lower the target TG in a vertical direction and place it in the first position A (S1200).
[0130] The head position correction method of the die bonder may further include the step of controlling the camera device 130 to generate 1-2 nd image data including the upper surface of the target TG and the upper surface of the head 110 after the pick and place operation ( S1300 ).
[0131] The head position correction method of the die bonder may further include the step of acquiring 1-1st center point information of the head 110 and 1-2nd center point information of the target TG based on the 1-1st image data and the 1-2nd image data (S1400).
[0132] The 1-1st center point information may be 1-1st average coordinates of the center point coordinates of the upper surface of the head 110 of the 1-1st image data and the center point coordinates of the upper surface of the head 110 of the 1-2nd image data.
[0133] The 1-2nd center point information may be 1-2nd average coordinates of the center point coordinates of the upper surface of the target TG of the 1-1st image data and the center point coordinates of the upper surface of the target TG of the 1-2nd image data.
[0134] The head position correction method of the chip bonder may further include the following step: correcting the position of the head 110 based on the 1-1st center point information and the 1-2nd center point information (S1500).
[0135] The step of correcting the position of the head 110 may be a step of moving the head 110 so that the 1-1st average coordinates coincide with the 1-2nd average coordinates.
[0136] The head position correction method of the chip bonding machine may further include the following steps: obtaining the distance between the 1-1 average coordinate and the 1-2 average coordinate. The head position correction method of the chip bonding machine may further include the following steps: determining whether to terminate the correction process based on the distance between the 1-1 average coordinate and the 1-2 average coordinate.
[0137] In the head position correction method of the die bonder, when the acquired distance is less than a preset distance and satisfies a preset reference, the correction process may be terminated. However, the head position correction method of the die bonder may further include a step of controlling the head 110 to move the target TG to the second position B when the acquired distance is greater than the preset distance.
[0138] For example, the head position correction method of the die bonder may include the step of generating a termination instruction or a second position B movement instruction of the target TG based on the distance between the 1-1th average coordinate and the 1-2nd average coordinate.
[0139] As described above, the head position correction method of the chip bonder according to the present invention can provide a device for correcting the position of the head using a camera device. As the position of the head is corrected only by an optical image using a target, the chip bonder according to the present invention can have the effect of determining the position of the head in real time during the semiconductor manufacturing process and correcting the position of the head. Therefore, the head position correction method of the chip bonder according to the present invention can correct the position of the head without interrupting the manufacturing process, thereby having a significant effect of being able to correct the position of the head in real time without causing problems caused by interruptions in the manufacturing process.
[0140] As described above, as the target is rotated in the horizontal direction while the pick-up and placement operation is performed on the target at the first position, the head position correction method of the chip bonder according to the present invention can easily obtain information about the rotation axis of the head adsorbing the target and rotating. The camera device can be installed on the top of the head to shoot the entire manufacturing process, so the chip bonder according to the present invention has the ability to correct the position of the head in real time, thereby providing a reference that can easily correct the position of the head without causing problems due to interruption of the manufacturing process and without equipping other additional components.
[0141] Figure 7 It is schematically shown Figure 6 A flowchart of the steps following the steps of
[0142] For reference, Figure 7 In the description, the same or repeated contents as above may be omitted.
[0143] The head position correction method of the die bonder may further include the following step: after the step of correcting the position of the head 110 ( S1500 ), controlling the head 110 to move the target TG to the second position B ( S1600 ).
[0144] The head position correction method of the die bonder may further include the step of controlling the camera device 130 to generate 2-1st image data including the target TG disposed at the second position B and the upper surface of the head 110 (S1700).
[0145] The head position correction method of the chip bonding machine may also include the following steps: performing a second pick-up and placement operation, wherein the second pick-up and placement operation is to lift the target TG in the vertical direction after picking up the target TG from the second position B, rotate the target TG in the horizontal direction by a predetermined angle, and lower the target TG in the vertical direction and place it in the second position B (S1800).
[0146] The head position correction method of the die bonder may further include the step of controlling the camera device 130 to generate 2-2nd image data including the upper surface of the target TG and the upper surface of the head 110 after the second pick and place operation (S1900).
[0147] The head position correction method of the die bonder may further include the step of acquiring 2-1st center point information of the head 110 and 2-2nd center point information of the target TG based on the 2-1st image data and the 2-2nd image data (S2000).
[0148] The head position correction method of the chip bonding machine may further include the following step: performing a second correction on the position of the head 110 based on the 2-1st center point information and the 2-2nd center point information (S2100).
[0149] The 2-1st center point information may be 2-1st average coordinates of the center point coordinates of the upper surface of the head 110 of the 2-1st image data and the center point coordinates of the upper surface of the head 110 of the 2-2nd image data.
[0150] The 2-2nd center point information may be 2-2nd average coordinates of the center point coordinates of the upper surface of the target TG of the 2-1st image data and the center point coordinates of the upper surface of the target TG of the 2-2nd image data.
[0151] The step of performing a second correction on the position of the head 110 may be a step of performing a second movement on the head 110 in such a manner that the 2-1st average coordinates are consistent with the 2-2nd average coordinates.
[0152] The head position correction method of the chip bonding machine may further include the following steps: obtaining the distance between the 2-1st average coordinate and the 2-2nd average coordinate. The head position correction method of the chip bonding machine may further include the following steps: determining whether to terminate the correction process based on the distance between the 2-1st average coordinate and the 2-2nd average coordinate.
[0153] In the head position correction method of the die bonder, when the acquired distance is less than a preset distance and satisfies a preset reference, the correction process may be terminated. However, in the head position correction method of the die bonder, when the acquired distance is greater than a preset distance, the head 110 may be controlled to move the target TG to a third position.
[0154] For example, the head position correction method of the die bonder may include the step of generating a termination instruction or a third position movement instruction of the target TG based on the distance between the 2-1st average coordinate and the 2-2nd average coordinate.
[0155] In addition, although not shown in the drawings, the head position correction method of the die bonder may further include the following steps.
[0156] The head position correction method of the chip bonder may further include the following step: after the step of performing the second correction on the position of the head 110 ( S2100 ), controlling the head 110 to move the target TG to a third position.
[0157] The head position correction method of the die bonder may further include the step of controlling the camera device 130 to generate 3-1st image data including the upper surface of the target TG disposed at the third position and the upper surface of the head 110 .
[0158] The head position correction method of the chip bonding machine may also include the following steps: performing a third pick-up and placement operation, wherein the third pick-up and placement operation is to lift the target TG in the vertical direction after picking up the target TG from the third position, rotate the target TG in the horizontal direction by a predetermined angle, and lower the target TG in the vertical direction and place it in the third position.
[0159] The head position correction method of the die bonder may further include the step of controlling the camera device 130 to generate 3 - 2 nd image data including the upper surface of the target TG and the upper surface of the head 110 after the third pick and place operation.
[0160] The head position correction method of the die bonder may further include the step of acquiring 3-1st center point information of the head 110 and 3-2nd center point information of the target TG based on the 3-1st image data and the 3-2nd image data.
[0161] The head position correction method of the chip bonding machine may further include the following step: performing a third correction on the position of the head 110 based on the 3-1st center point information and the 3-2nd center point information.
[0162] The 3-1st center point information may be 3-1st average coordinates of the center point coordinates of the upper surface of the head 110 of the 3-1st image data and the center point coordinates of the upper surface of the head 110 of the 3-2nd image data.
[0163] The 3-2nd center point information may be 3-2nd average coordinates of the center point coordinates of the upper surface of the target TG of the 3-1st image data and the center point coordinates of the upper surface of the target TG of the 3-2nd image data.
[0164] The step of performing the third correction on the position of the head 110 may be a step of performing the third movement on the head 110 in such a manner that the 3-1st average coordinates are consistent with the 3-2nd average coordinates.
[0165] The head position correction method of the chip bonding machine may further include the step of obtaining the distance between the 3-1 average coordinate and the 3-2 average coordinate. The head position correction method of the chip bonding machine may further include the step of determining whether to terminate the correction process based on the distance between the 3-1 average coordinate and the 3-2 average coordinate.
[0166] In the head position correction method of the chip bonder, when the acquired distance is less than a preset distance and satisfies a preset reference, the correction process can be terminated. However, the head position correction method of the chip bonder may further include the following step: when the acquired distance is greater than the preset distance, controlling the head 110 to move the target TG to the fourth position.
[0167] For example, the head position correction method of the die bonder may further include a step of generating a termination instruction or a fourth position movement instruction of the target TG based on the distance between the 3-1st average coordinate and the 3-2nd average coordinate.
[0168] The head position correction method of the chip bonder may further include the following step: after the step of performing the third correction on the position of the head 110 , controlling the head 110 to move the target TG to a fourth position.
[0169] The head position correction method of the die bonder may further include the step of controlling the camera device 130 to generate 4-1st image data including the upper surface of the target TG disposed at the fourth position and the upper surface of the head 110 .
[0170] The head position correction method of the chip bonding machine may also include the following steps: performing a fourth pick-and-place operation, wherein the fourth pick-and-place operation is to lift the target TG in a vertical direction after picking up the target TG from the fourth position, rotate the target in a horizontal direction by a predetermined angle, and lower the target TG in a vertical direction and place it in the fourth position.
[0171] The head position correction method of the die bonder may further include the step of controlling the camera device 130 to generate 4 - 2 nd image data including the upper surface of the target TG and the upper surface of the head 110 after the fourth pick and place operation.
[0172] The head position correction method of the die bonder may further include the step of acquiring 4-1st center point information of the head 110 and 4-2nd center point information of the target TG based on the 4-1st image data and the 4-2nd image data.
[0173] The head position correction method of the chip bonding machine may further include the following step: performing a fourth correction on the position of the head 110 based on the 4-1st center point information and the 4-2nd center point information.
[0174] The 4-1st center point information may be the 4-1st average coordinates of the center point coordinates of the upper surface of the head 110 of the 4-1st image data and the center point coordinates of the upper surface of the head 110 of the 4-2nd image data.
[0175] The 4-2nd center point information may be the 4-2nd average coordinates of the center point coordinates of the upper surface of the target TG of the 4-1st image data and the center point coordinates of the upper surface of the target TG of the 4-2nd image data.
[0176] The step of performing a second correction on the position of the head 110 may be a step of moving the head 110 four times in such a manner that the 4-1st average coordinates are consistent with the 4-2nd average coordinates.
[0177] The head position correction method of the chip bonding machine may further include the following steps: obtaining the distance between the 4-1st average coordinate and the 4-2nd average coordinate. The head position correction method of the chip bonding machine may further include the following steps: determining whether to terminate the process for correction based on the distance between the 4-1st average coordinate and the 4-2nd average coordinate.
[0178] In the head position correction method of the die bonder, when the acquired distance is less than a preset distance and satisfies a preset reference, the process for correction may be terminated. However, in the head position correction method of the die bonder, when the acquired distance is greater than the preset distance, the head 110 is controlled to move the target TG to the next position.
[0179] For example, the head position correction method of the die bonder may further include a step of generating a termination instruction or a next position movement instruction of the target TG based on the distance between the 4-1st average coordinate and the 4-2nd average coordinate.
[0180] As described above, the control unit 140 may implement the head position correction method of the die bonder multiple times while changing the position of the target TG. However, in the case where the acquired distance is less than the preset distance and satisfies the preset reference, the control unit 140 may terminate the process for correction. In the case where the acquired distance is greater than the preset distance, the control head 110 may move the position of the target TG to perform the process for correction again.
[0181] As described above, the die bonder according to the present invention can easily obtain information about the rotation axis of the head while adsorbing the target and rotating it while performing the pick-and-place operation on the target at various positions such as the second position to the fourth position. Since the camera device can be installed above the head to photograph the entire manufacturing process, the die bonder according to the present invention has a significant effect of being able to correct the position of the head in real time, thereby providing a reference that can simply correct the position of the head without causing problems due to interruption of the manufacturing process and without equipping other additional components.
[0182] As described above, the present invention has been described with reference to the embodiments shown in the accompanying drawings, but these embodiments are only examples. It can be fully understood by those skilled in the art that various modifications and other equivalent embodiments can be made from the embodiments according to the embodiments. Therefore, the true technical protection scope of the present invention should be determined according to the attached claims.
Claims
1. A chip bonding machine, comprising: a head, picking up and placing a target arranged at a first location; A drive device for moving the head; a camera device disposed above the head and generating image data including an upper surface of the target and an upper surface of the head; as well as The control unit acquires 1-1 center point information of the head and 1-2 center point information of the object based on the image data, and corrects the position of the head based on the 1-1 center point information and the 1-2 center point information.
2. The die bonding machine according to claim 1, wherein: After picking up the target from the first position, the head lifts the target in a vertical direction, rotates the target in a horizontal direction by a predetermined angle, and lowers the target in a vertical direction and places it in the first position.
3. The die bonder according to claim 1, wherein: the camera device generates 1-1th image data, the 1-1th image data including an upper surface of the object before being picked up by the head and an upper surface of the head before picking up the object, The camera device generates 1-2nd image data including an upper surface of the object after being placed by the head at the first position and an upper surface of the head after the object is placed.
4. The chip bonding machine according to claim 3, wherein: The control unit acquires the 1-1st center point information and the 1-2nd center point information based on the 1-1st image data and the 1-2nd image data.
5. The chip bonding machine according to claim 4, wherein: The 1-1st center point information is the 1-1st average coordinates of the center point coordinates of the upper surface of the head of the 1-1st image data and the center point coordinates of the upper surface of the head of the 1-2nd image data.
6. The die bonding machine according to claim 5, wherein: The 1-2nd center point information is the 1-2nd average coordinates of the center point coordinates of the upper surface of the object in the 1-1st image data and the center point coordinates of the upper surface of the object in the 1-2nd image data.
7. The die bonder according to claim 6, wherein: The control unit moves the head so that the 1-1 average coordinates coincide with the 1-2 average coordinates.
8. A method for calibrating the head position of a chip bonding machine comprises the following steps: controlling the camera device to generate 1-1th image data including an upper surface of the object arranged at the first position and an upper surface of the head; Controlling the head to perform a pick-and-place operation, wherein the pick-and-place operation is an operation of, after picking up the target from the first position, lifting the target in a vertical direction, rotating the target in a horizontal direction by a predetermined angle, and lowering the target in a vertical direction and placing it in the first position; After the pick-and-place operation, controlling the camera device to generate first-second image data including an upper surface of the object and an upper surface of the head; acquiring 1-1st center point information of the head and 1-2nd center point information of the object based on the 1-1st image data and the 1-2nd image data; and The position of the head is corrected based on the 1-1st center point information and the 1-2nd center point information.
9. The head position correction method of a die bonder according to claim 8, wherein: The 1-1st center point information is the 1-1st average coordinates of the center point coordinates of the upper surface of the head of the 1-1st image data and the center point coordinates of the upper surface of the head of the 1-2nd image data.
10. The head position correction method of a die bonder according to claim 9, wherein: The 1-2nd center point information is the 1-2nd average coordinates of the center point coordinates of the upper surface of the object in the 1-1st image data and the center point coordinates of the upper surface of the object in the 1-2nd image data.
11. The head position correction method of a die bonder according to claim 10, wherein: The step of correcting the position of the head is a step of moving the head so that the 1-1 average coordinates coincide with the 1-2 average coordinates.
12. The head position correction method of the chip bonding machine according to claim 8, further comprising the following steps: The head is controlled to move the target to a second position.
13. The head position correction method of the chip bonding machine according to claim 12, further comprising the following steps: The camera device is controlled to generate 2-1st image data including the object arranged at the second position and an upper surface of the head.
14. The head position correction method of the chip bonding machine according to claim 13, further comprising the following steps: A second pick-and-place operation is performed, wherein after picking up the target from the second position, the target is lifted vertically, rotated horizontally by a predetermined angle, and lowered vertically and placed at the second position.
15. The head position correction method of the chip bonding machine according to claim 14, further comprising the following steps: After the second pick-and-place operation, the camera device is controlled to generate 2-2nd image data including an upper surface of the object and an upper surface of the head.
16. The head position correction method of the chip bonding machine according to claim 15, further comprising the following steps: The 2-1st center point information of the head and the 2-2nd center point information of the object are acquired based on the 2-1st image data and the 2-2nd image data.
17. The head position correction method of the chip bonding machine according to claim 16, further comprising the following steps: The position of the head is corrected for the second time based on the 2-1st center point information and the 2-2nd center point information.
18. The head position correction method of a die bonder according to claim 17, wherein: The 2-1st center point information is 2-1st average coordinates of the center point coordinates of the upper surface of the head of the 2-1st image data and the center point coordinates of the upper surface of the head of the 2-2nd image data.
19. The head position correction method of a die bonder according to claim 18, wherein: The 2-2nd center point information is 2-2nd average coordinates of the center point coordinates of the upper surface of the object in the 2-1st image data and the center point coordinates of the upper surface of the object in the 2-2nd image data.
20. The head position correction method of a die bonder according to claim 19, wherein: The step of performing a second correction on the position of the head is a step of performing a second movement on the head so that the 2-1 average coordinates coincide with the 2-2 average coordinates.