Three-dimensional packaging device of integrated antenna and preparation method of three-dimensional packaging device

Abstract

The invention discloses a three-dimensional packaging device of an integrated antenna and a preparation method thereof, the three-dimensional packaging device comprises a first package and a second package, the bottom of the first package is provided with a first solder ball used for installing and connecting a circuit board, and the first package is connected with the second package through a third solder ball; the second package comprises a second substrate composed of multiple layers of ceramic dielectrics, second metal conductor layers used for forming transmission signal wires and shielding signals are arranged among the multiple layers of ceramic dielectrics, and a second chip, a microstrip antenna, a metal enclosure frame and a metal cover plate are arranged on the surface of the second substrate. The two ends of the second chip are connected with the nearest second metal conductor layer through second bonding wires, a second substrate via hole and a feed via hole are formed in the second substrate, and the two ends of the second substrate via hole and the two ends of the feed via hole are connected with the second metal conductor layer. The performance advantage of metal ceramic in high-frequency microwaves and the cost advantage of plastic packaging in a low-frequency circuit can be exerted at the same time, the feed circuit is minimized, the feed loss is reduced, and the microwave performance is improved.

Description

Technical Field

[0001] The invention relates to an antenna packaging device and a manufacturing method thereof, in particular to a three-dimensional packaging device with an integrated antenna and a manufacturing method thereof. Background Art

[0002] With the continuous development of semiconductor and packaging technology, the integration of communication radar systems continues to increase, and it is necessary to integrate antennas, microwave circuits, analog circuits and digital circuits in one package to meet the development needs of miniaturization and lightweight systems. Using three-dimensional stacking technology to integrate antennas on the package is an important technical approach to achieve highly integrated devices.

[0003] The existing conventional stacking solutions either use two metal ceramic packages to stack, or arrange the chip on the positive side of the substrate inside the plastic package device, which fails to combine the performance advantages of metal ceramics in high-frequency microwaves with the cost advantages of plastic packages in low-frequency circuits. High-frequency microwave chips can also be packaged at the wafer level and then welded together with plastic-sealed low-frequency packages, but this method makes it difficult to integrate the antenna on the package, and the loss from the high-frequency microwave chip to the antenna will be relatively large in actual use. Summary of the invention

[0004] Purpose of the invention: In order to overcome the deficiencies in the prior art, the purpose of the present invention is to provide a three-dimensional packaging device with an integrated antenna that reduces feeding losses and minimizes feeding lines. Another purpose of the present invention is to provide a high-performance, low-cost method for preparing a three-dimensional packaging device with an integrated antenna.

[0005] Technical solution: The three-dimensional package device with integrated antenna described in the present invention includes a first package and a second package. The first package is provided with a first solder ball for mounting a connection circuit board at the bottom, and the first package is connected to the second package through a third solder ball. The second package includes a second substrate composed of a multilayer ceramic medium, and a metal conductor layer 2 for forming a transmission signal conductor and a shielding signal is provided between the multilayer ceramic medium. A second chip, a microstrip antenna, a metal frame and a metal cover are provided on the surface of the second substrate. The two ends of the second chip are connected to the nearest metal conductor layer 2 through a second bonding wire. A second substrate via and a feed via are provided in the second substrate, and both ends of the second substrate via and the feed via are connected to the metal conductor layer 2. The second substrate, the metal frame and the metal cover are used to achieve sealing of the second chip.

[0006] Furthermore, the first package includes a first substrate, a first substrate via is arranged on the first substrate, both ends of the first substrate via are connected to the metal conductor layer 1, a plastic seal is arranged on the surface of the first substrate, a second solder ball, a first chip and a first bonding wire are arranged in the plastic seal, and the first chip is connected to the metal conductor layer 1 through the first bonding wire.

[0007] Furthermore, the first substrate is a single-layer dielectric substrate or a multi-layer dielectric substrate. The first substrate realizes signal transmission through surface and internal metal wiring and metal vias.

[0008] Furthermore, the first substrate is a packaging substrate, a high-density board or a PCB board.

[0009] Furthermore, the first bonding wire is a gold wire or an aluminum wire.

[0010] Furthermore, the second solder ball is a high-lead solder ball or a copper core solder ball.

[0011] Furthermore, the second substrate is an aluminum oxide substrate or an aluminum nitride substrate, and the multilayer structure is manufactured by the HTCC process or the LTCC process, and the signal transmission is realized through the surface and internal metal wiring and metal vias.

[0012] Furthermore, the third solder ball is a pure solder material solder ball, a high-lead solder ball or a copper core solder ball.

[0013] Furthermore, the metal frame and the metal cover are both made of fellable materials.

[0014] The three-dimensional packaging device with integrated antenna described in the present invention comprises the following steps:

[0015] Step 1, making the first package;

[0016] Step 2, manufacturing a second package, assembling the metal frame onto the second substrate, assembling the second chip onto the second substrate, interconnecting the second chip and the second substrate via a second bonding wire, assembling the metal cover onto the metal frame, and planting a third solder ball on the bottom of the second package;

[0017] Step 3, stacking and welding the first package and the product obtained in step 2;

[0018] Step 4: welding a first solder ball on the bottom of the first package.

[0019] Working principle: The first chip inside the first package is a low-frequency working chip, which mainly realizes functions such as analog and digital circuits. The plastic encapsulation material has no effect on its performance. The packaging by plastic encapsulation reduces the manufacturing cost of this part of the packaging. The second package contains a high-frequency microwave chip. At present, a considerable number of high-frequency microwave chips cannot be encapsulated by plastic encapsulation due to the use of air bridge technology, and the plastic encapsulation material will affect the performance of chips with higher working frequencies. Therefore, the second package uses metal ceramic packaging, places the chip on the top of the package, and integrates the antenna on the package, thereby minimizing the path from the high-frequency microwave chip to the antenna and maximizing the performance of the system. The first package and the second package are realized through three-dimensional stacking, which reduces the circuit area occupied to 1 / 2 of the original, while taking into account the low cost of low-frequency packaging and the high performance of high-frequency packaging.

[0020] Beneficial effects: Compared with the prior art, the present invention has the following significant characteristics: by combining metal ceramic packaging devices and plastic packaging devices in a three-dimensional stacking manner, the performance advantages of metal ceramics in high-frequency microwaves and the cost advantages of plastic packaging in low-frequency circuits can be simultaneously exerted; the top package integrates the bare chip and the antenna together, minimizes the feeding line from the bare chip to the antenna, minimizes the feeding loss, improves the microwave performance of the device, and forms a high-performance, low-cost packaged antenna solution. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 is a cross-sectional view of the present invention;

[0022] Figure 2 is a flow chart of the preparation of the first package 1 of the present invention;

[0023] Figure 3 is a preparation flow chart of the second package 2 of the present invention;

[0024] Figure 4 It is a preparation flow chart of combining the first package 1 and the second package 2 into a complete device according to the present invention. DETAILED DESCRIPTION

[0025] The experimental methods described in the examples are conventional methods unless otherwise specified; the reagents and materials are commercially available unless otherwise specified.

[0026] like Figure 1The first solder ball 3 of the three-dimensional package device with integrated antenna is soldered to the bottom of the first package 1 to form a BGA interface of the device. The solder can be a low-melting-point lead-tin solder, and the first solder ball 3 is a high-lead solder ball or a copper core solder ball. The first package 1 is based on the first substrate 11. The first chip 16 is bonded to the surface of the first substrate 11 by conductive glue or insulating glue, etc. The second solder ball 15 is soldered to the surface of the first substrate 11 by a high-melting-point lead-free solder. The first chip 16 and the first substrate 11 are connected by a first bonding wire 17. The first chip 16, the first bonding wire 17 and the second solder ball 15 are filled and covered with a plastic encapsulation material 14. The surface of the second solder ball 15 is exposed from the surface of the plastic encapsulation material 14 to form a pad for the third solder ball 4. The first substrate 11 has a first substrate via 12 that runs through the front and back sides thereof, and both ends of the first substrate via 12 are connected to the metal conductor layer 13. The first substrate 11 is a package substrate, a high-density board or a PCB board, and its aperture is generally 0.5mm to 0.2mm, and the thickness of each layer is 20um to 100μm. The first chip 16 is a bare chip, and the first bonding wire 17 is a gold wire or an aluminum wire of different specifications. The first chip 16 is connected to the metal conductor layer 13 through the first bonding wire 17. The second solder ball 15 is a high-lead solder ball or a copper core solder ball, which is mainly used to form a BGA pad on the top of the first package 1 to realize signal transmission from the first substrate 11 to the third solder ball 4. The third solder ball is a pure solder material solder ball, a high-lead solder ball or a copper core solder ball, which is used to connect the first package 1 and the second package 2 by welding.

[0027] The second package 2 is mainly composed of the second substrate 21, and is equipped with a metal frame 25, a second chip 23 and a metal cover plate 26. The second chip 26 and the second substrate 21 are connected by a second bonding wire 27. The second bonding wire 27 can be a gold wire of different specifications. The second substrate 21 is an aluminum oxide or aluminum nitride multilayer ceramic substrate, which is composed of multiple layers of ceramic dielectrics. There is a metal conductor layer 22 between different ceramic dielectrics, which is used to form a large-area bottom layer for transmitting signal wires and shielding signals. The upper surface of the second substrate 21 has a cavity structure for placing the second chip 23. The upper surface of the second substrate 21 also has a square microstrip antenna 24 made of metal graphics for radiating and receiving microwave signals. The metal cover plate 26 and the metal frame 25 can achieve sealing protection for the second chip 26. The second substrate via 28 and the feed via 29 are internal vias of the second substrate 21. Both ends are connected to the metal conductor layer 22, which are used for signal transmission between different wire layers inside the second substrate 21. The metal frame 25 and the metal cover plate 26 are varable materials.

[0028] The method for preparing the three-dimensional packaged device with integrated antenna of this embodiment comprises the following steps:

[0029] S1, such as Figure 2 As shown, make the first package 1:

[0030] S1.1. The first chip 16 is mounted on the surface of the first substrate 11 by bonding. The bonding material may be conductive glue, insulating glue or nano silver paste, etc. The bonding material is applied at room temperature and then cured by high temperature baking.

[0031] S1.2. Connect the first chip 16 and the first substrate 11 via the first bonding wire 17. The bonding may be achieved by ultrasound, heat pressing or the like.

[0032] S1.3. The second solder ball 15 is mounted on the surface of the first substrate 11 by soldering. The solder may be lead-containing solder or lead-free solder.

[0033] S1.4, using a plastic packaging material 14 to cover the first chip 11 and the second solder balls 15.

[0034] S1.5, grinding the upper surface of the plastic packaging material 14 to expose the surface of the second solder ball 15 as the top solder pad of the first package 1.

[0035] S2, such as Figure 3 As shown, make the second package 2:

[0036] S2.1, welding the metal frame 25 to the surface of the second substrate 21 .

[0037] S2.2. The second chip 23 is mounted in the cavity on the surface of the second substrate 21 by bonding. The bonding material may be conductive glue, insulating glue or nano silver paste, etc. The bonding material is applied at room temperature and then cured by high temperature baking.

[0038] S2.3. Connect the second chip 23 and the second substrate 21 via the second bonding wire 27. The bonding may be achieved by ultrasound, heat pressing or the like.

[0039] S2.4. Install the metal cover plate 26 on the metal frame 25 by parallel welding or gold-tin welding.

[0040] S3, such as Figure 4 As shown, the first package 1 and the second package 2 are stacked and welded:

[0041] S3.1. Install the third solder ball 4 on the bottom of the second substrate 21 by soldering. The solder may be lead-containing solder or lead-free solder.

[0042] S3.2. Weld the first package 1 and the second package 2 together by welding.

[0043] S3.3. Install the first solder ball 3 at the bottom of the first package 1 by welding.

Claims

1. A three-dimensional packaged device with an integrated antenna, characterized in that: The invention comprises a first package (1) and a second package (2); the first package (1) has a first solder ball (3) at the bottom thereof for mounting a connection circuit board; the first package (1) and the second package (2) are connected via a third solder ball (4); the second package (2) comprises a second substrate (21) composed of a multilayer ceramic medium; a second metal conductor layer (22) for forming a transmission signal conductor and a shielding signal is arranged between the multilayer ceramic medium; a second chip (23), a microstrip antenna (24), a metal frame (25) and a metal cover plate (26) are arranged on the surface of the second substrate (21); two ends of the second chip (23) are connected to the nearest second metal conductor layer (22) via a second bonding wire (27); a second substrate via hole (28) and a feeding via hole (29) are arranged in the second substrate (21); both ends of the second substrate via hole (28) and the feeding via hole (29) are connected to the second metal conductor layer (22).

2. The three-dimensional packaged device with integrated antenna according to claim 1, characterized in that: The first package (1) comprises a first substrate (11), a first substrate via hole (12) is arranged on the first substrate (11), both ends of the first substrate via hole (12) are connected to the first metal conductor layer (13), a plastic seal (14) is arranged on the surface of the first substrate (11), a second solder ball (15), a first chip (16) and a first bonding wire (17) are arranged in the plastic seal (14), and the first chip (16) is connected to the first metal conductor layer (13) via the first bonding wire (17).

3. The three-dimensional packaged device with integrated antenna according to claim 2, characterized in that: The first substrate (11) is a single-layer dielectric substrate or a multi-layer dielectric substrate.

4. The three-dimensional packaged device with integrated antenna according to claim 2, characterized in that: The first substrate (11) is a packaging substrate, a high-density board or a PCB board.

5. The three-dimensional packaged device with integrated antenna according to claim 2, characterized in that: The first bonding wire (17) is a gold wire or an aluminum wire.

6. The three-dimensional packaged device with integrated antenna according to claim 2, characterized in that: The second solder ball (15) is a high-lead solder ball or a copper core solder ball.

7. The three-dimensional packaged device with integrated antenna according to claim 1, characterized in that: The second substrate (21) is an aluminum oxide substrate or an aluminum nitride substrate.

8. The three-dimensional packaged device with integrated antenna according to claim 1, characterized in that: The third solder ball (4) is a pure solder material solder ball, a high-lead solder ball or a copper core solder ball.

9. The three-dimensional packaged device with integrated antenna according to claim 1, characterized in that: The metal surrounding frame (25) and the metal cover plate (26) are both made of calcified material.

10. The method for preparing a three-dimensional packaged device with integrated antenna according to any one of claims 1 to 9, characterized in that: The following steps are involved: Step 1, making a first package (1); Step 2, manufacturing a second package (2), assembling a metal frame (25) onto a second substrate (21), assembling a second chip (23) onto the second substrate (21), interconnecting the second chip (23) and the second substrate (21) via a second bonding wire (27), assembling a metal cover plate (26) onto the metal frame (25), and implanting a third solder ball (4) at the bottom of the second package (2); Step 3, stacking and welding the first package (1) and the product obtained in step 2; Step 4: welding a first solder ball (3) on the bottom of the first package (1).

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