Antenna structure, manufacturing method of antenna structure and intelligent terminal

Abstract

An antenna structure comprises a dielectric layer, a radiation layer, a grounding layer and a connector, the upper surface of the dielectric layer is provided with a groove, the radiation layer is arranged on the inner wall of the groove in a shape following manner, the radiation surface of the radiation layer is a curved surface, the grounding layer is arranged on the lower surface of the dielectric layer, and the connector is electrically connected with the radiation layer and the grounding layer. According to the antenna structure, the high-frequency impedance matching of the antenna structure can be improved, and the impedance bandwidth is improved. The invention further relates to a manufacturing method of the antenna structure and an intelligent terminal.

Description

Technical Field

[0001] The present invention relates to the field of antenna technology, and in particular to an antenna structure, a method for manufacturing the antenna structure, and a smart terminal. Background Art

[0002] As the front end of signal transmission and reception, antenna is an indispensable component of wireless communication and detection system. The performance of antenna plays a decisive role in the overall performance of communication system. High-performance antenna can not only relax the requirements of system but also improve the performance of the whole system. The rapid development and wide application of wireless communication technology have put forward higher requirements on the technical performance of antenna. The improvement of wireless transmission rate requires wireless communication system to provide larger bandwidth, and ultra-wideband (UWB) technology provides an effective solution to the above problems. Ultra-wideband antenna refers to an antenna with an absolute working bandwidth greater than 500MHz or a relative working bandwidth greater than 20%. Traditional microstrip patch antenna is widely used in the field of array antenna due to its small size and easy conformal, but its impedance bandwidth is low (≤20%), which limits the performance improvement of array antenna. In addition, microstrip patch antenna adopts planar manufacturing process, which has great limitations in material selection and structural design, and it is difficult to further improve the antenna performance. Summary of the invention

[0003] In view of this, the present invention provides an antenna structure, which can improve the high-frequency impedance matching of the antenna structure and increase the impedance bandwidth.

[0004] An antenna structure includes a dielectric layer, a radiating layer, a grounding layer and a connector. The upper surface of the dielectric layer is provided with a groove, the radiating layer is conformally arranged on the inner wall of the groove, the radiating surface of the radiating layer is a curved surface, the grounding layer is arranged on the lower surface of the dielectric layer, and the connector electrically connects the radiating layer and the grounding layer.

[0005] In an embodiment of the present invention, a feeding point where the radiation layer is connected to the connector deviates from the center of the radiation layer.

[0006] In an embodiment of the present invention, the feeding point where the ground layer is connected to the connector is located at the center of the ground layer.

[0007] In an embodiment of the present invention, an annular hole is provided on the above-mentioned radiation layer, and the annular hole divides the radiation layer into a radiation part, a feeding part and a connecting part. The connecting part is connected between the feeding part and the radiation part, and the annular hole is arranged around the circumference of the feeding part, and the two ends of the annular hole extend to the opposite sides of the connecting part.

[0008] In an embodiment of the present invention, along the radial direction of the feeding portion, the width of the annular hole is less than 1 mm.

[0009] In an embodiment of the present invention, the above-mentioned dielectric layer is provided with a first connection hole, the feeding part is provided with a second connection hole, the grounding layer is provided with a third connection hole, the connector includes a head and a probe connected to the head, the probe passes through the third connection hole, the first connection hole and the second connection hole in sequence, and is electrically connected to the feeding part and the grounding layer respectively.

[0010] In an embodiment of the present invention, the radiation layer is in a circular pot shape, and the diameter of the radiation layer is equal to 1 / 4 wavelength.

[0011] In an embodiment of the present invention, the thickness of the dielectric layer is 1 mm to 6 mm.

[0012] In an embodiment of the present invention, the radiation surface of the radiation layer is one of a spherical surface, a conical surface, a frustum surface, and an ellipsoidal surface.

[0013] In an embodiment of the present invention, the antenna structure further includes a first adhesive film and a second adhesive film, the radiation layer is fixed to the inner wall of the groove through the first adhesive film, and the ground layer is fixed to the lower surface of the dielectric layer through the second adhesive film.

[0014] The present application also relates to a method for manufacturing an antenna structure, the manufacturing method is used to manufacture the above antenna structure, and the manufacturing method comprises:

[0015] forming a groove in the dielectric layer;

[0016] Providing a curved radiation layer, wherein the radiation surface of the radiation layer is a curved surface;

[0017] The grounding layer is provided, and the grounding layer is arranged on the lower surface of the dielectric layer, and the radiation layer is arranged in the groove, and the radiation layer, the dielectric layer and the grounding layer are bonded together by a lamination process to form an antenna structure.

[0018] The present application also relates to an intelligent terminal, comprising the above-mentioned antenna structure.

[0019] The antenna structure of the present invention adopts a radiating layer with a three-dimensional curved surface, and the radiating layer and the grounding layer form a gradient butterfly structure, which effectively improves the high-frequency impedance matching of the antenna structure and increases the impedance bandwidth of the antenna structure. Moreover, the antenna structure of the present application has been tested to have an impedance bandwidth of 25% to 85%. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a structural schematic diagram of the antenna structure of the present application.

[0021] Figure 2 It is a schematic diagram of the split structure of the antenna structure of the present application.

[0022] Figure 3 It is a schematic cross-sectional structural diagram of the antenna structure of the present application.

[0023] Figure 4 It is a schematic diagram of the top view structure of the radiation layer of the present application.

[0024] Figure 5 It is a schematic diagram of the top view structure of the ground layer of the present application. DETAILED DESCRIPTION

[0025] The following is an explanation of the implementation of the present application by means of specific embodiments. People familiar with the art can easily understand other advantages and effects of the present application from the contents disclosed in this specification.

[0026] In the following description, reference is made to the accompanying drawings, which describe several embodiments of the present application. It should be understood that other embodiments may be used and that mechanical, structural, electrical, and operational changes may be made without departing from the spirit and scope of the present application. The following detailed description should not be considered limiting, and the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit the present application.

[0027] Although the terms first, second, etc. are used herein to describe various elements in some instances, these elements should not be limited by these terms. These terms are only used to distinguish one element from another element.

[0028] Furthermore, as used in this article, the singular forms "one", "an" and "the" are intended to include plural forms as well, unless there is an indication to the contrary in the context. It should be further understood that the terms "comprise", "include" indicate the presence of features, steps, operations, elements, components, projects, kinds, and / or groups, but do not exclude the presence, occurrence or addition of one or more other features, steps, operations, elements, components, projects, kinds, and / or groups. The terms "or" and "and / or" used herein are interpreted as inclusive, or mean any one or any combination. Therefore, "A, B or C" or "A, B and / or C" means "any of the following: A; B; C; A and B; A and C; B and C; A, B and C". Only when the combination of elements, functions, steps or operations is inherently mutually exclusive in some way, will there be an exception to this definition.

[0029] Figure 1 is a schematic diagram of the structure of the antenna structure of the present application, Figure 2 is a schematic diagram of the split structure of the antenna structure of the present application, Figure 3 is a schematic cross-sectional view of the antenna structure of the present application, such as Figure 1 , Figure 2 and Figure 3As shown, the antenna structure includes a dielectric layer 11, a radiating layer 12, a grounding layer 13 and a connector 14. A groove 101 is provided on the upper surface of the dielectric layer 11. The radiating layer 12 is conformally arranged on the inner wall of the groove 101. The radiating surface 12a of the radiating layer 12 is a curved surface. The grounding layer 13 is arranged on the lower surface of the dielectric layer 11. The connector 14 electrically connects the radiating layer 12 and the grounding layer 13.

[0030] The antenna structure of the present application adopts a radiation layer 12 with a three-dimensional curved surface. The radiation layer 12 and the ground layer 13 form a gradual butterfly structure, which effectively improves the high-frequency impedance matching of the antenna structure and improves the impedance bandwidth of the antenna structure. Moreover, the antenna structure of the present application has been tested to have an impedance bandwidth of 25% to 85%. Since the radiation layer 12 is a three-dimensional curved surface structure, compared with the radiation layer of the existing planar structure, it must use a high-temperature resistant (a material resistant to more than 100°C) material as the dielectric layer. The material used to make the dielectric layer 11 of the present application can be selected from non-high-temperature resistant materials or high-temperature resistant materials, and is not limited by the temperature resistance of the material. Under the premise of ensuring performance, lower-priced materials can be selected, which is conducive to reducing production costs. Moreover, the use of planar or three-dimensional materials to make the dielectric layer 11 and the radiation layer 12 has more choices compared to the existing dielectric layer 11 and the radiation layer 12 that can only be made of planar materials.

[0031] Optionally, a feeding point where the radiation layer 12 is connected to the connector 14 is offset from the center of the radiation layer 12 .

[0032] Optionally, a feeding point where the ground layer 13 is connected to the connector 14 is located at the center of the ground layer 13 .

[0033] Optionally, Figure 4 is a schematic diagram of the top view structure of the radiation layer of the present application, such as Figure 2 and Figure 4 As shown, the radiation layer 12 is provided with an annular hole 103, which divides the radiation layer 12 into a radiation portion 121, a feeding portion 122 and a connecting portion 123. The connecting portion 123 is connected between the feeding portion 122 and the radiation portion 121. The annular hole 103 is arranged around the circumference of the feeding portion 122, and both ends of the annular hole 103 extend to opposite sides of the connecting portion 123. In this embodiment, the overall shape of the feeding portion 122 is an arc.

[0034] Optionally, the radiation portion 121 , the feeding portion 122 and the connecting portion 123 of the radiation layer 12 are integrally manufactured by, for example, an injection molding process, a laser cutting process, or a CNC machine tool process, to facilitate integrated processing and preparation.

[0035] Optionally, along the radial direction of the feeding portion 122, the width of the annular hole 103 is less than 1 mm; since the feeding point where the radiation layer 12 is connected to the connector 14 deviates from the center of the radiation layer 12, the antenna capacitance is increased by adjusting the width of the annular hole 103, which can improve the antenna standing wave ratio.

[0036] Optionally, Figure 5 This is a top view of the grounding layer of this application. Please refer to Figures 2 to 5 The dielectric layer 11 is provided with a first connection hole 102, the feeding part 122 is provided with a second connection hole 104, the grounding layer 13 is provided with a third connection hole 105, the connector 14 includes a head 141 and a probe 142 connected to the head 141, the probe 142 passes through the third connection hole 105, the first connection hole 102 and the second connection hole 104 in sequence, and is respectively electrically connected to the feeding part 122 and the grounding layer 13. In this embodiment, the probe 142 is respectively welded to the feeding part 122 and the grounding layer 13.

[0037] Alternatively, if Figure 2 and Figure 3 As shown, the radiation layer 12 is in a circular pot shape, and the diameter L of the radiation layer 12 is equal to 1 / 4 wavelength.

[0038] Optionally, the radiation layer 12 has a shape of an elliptical pot, a truncated cone, or a cone.

[0039] Optionally, the radiation surface 12a of the radiation layer 12 is one of a spherical surface, a conical surface, a frustum surface, and an ellipsoidal surface.

[0040] Optionally, the inner wall of the groove 101 is one of a spherical surface, a conical surface, a frustum surface, and an ellipsoidal surface.

[0041] Optionally, the thickness of the dielectric layer 11 is 1 mm to 6 mm, for example, 2 mm, 3 mm, 4 mm, or 5 mm.

[0042] Optionally, the material of the dielectric layer 11 is an insulating material, such as aramid honeycomb, polyimide, PEEK, PTFE, LCP, melamine, ceramic and glass, but not limited thereto.

[0043] Optionally, the radiation layer 12 and the ground layer 13 are both made of metal materials, such as copper and aluminum, but not limited thereto.

[0044] Optionally, the radiation layer 12 is curved as a whole, and the ground layer 13 is flat as a whole.

[0045] Optionally, the antenna structure further includes a first adhesive film (not shown) and a second adhesive film (not shown), the radiation layer 12 is fixed to the inner wall of the groove 101 through the first adhesive film, and the grounding layer 13 is fixed to the lower surface of the dielectric layer 11 through the second adhesive film. In this embodiment, the first adhesive film and / or the second adhesive film is an epoxy film or a silicone film.

[0046] The present application also relates to a method for manufacturing an antenna structure, the manufacturing method is used to manufacture the above antenna structure, and the manufacturing method comprises:

[0047] A groove 101 is made on the dielectric layer 11; specifically, a desired shape of the dielectric layer 11 is formed on the insulating substrate by laser cutting or numerical control (CNC) technology, and the groove 101 is formed on the upper surface of the dielectric layer 11, and the shape of the groove 101 is one of a spherical surface, a conical surface, a frustum surface, and an ellipsoidal surface; the thickness of the dielectric layer 11 is 1 mm to 6 mm, for example, 2 mm, 3 mm, 4 mm, 5 mm; the material of the dielectric layer 11 is an insulating material, such as aramid honeycomb, polyimide, PEEK, PTFE, LCP, melamine, ceramic and glass, but not limited thereto.

[0048] A curved radiation layer 12 is provided, wherein the radiation surface 12a of the radiation layer 12 is a curved surface; specifically, the curved radiation layer 12 is formed by one of injection molding, laser cutting or numerical control machine tool (CNC) processes, and the curved radiation layer 12 includes a circular pot shape (whose radiation surface is a spherical surface), an elliptical pot shape, a truncated cone shape, and a cone shape.

[0049] A grounding layer 13 is provided, and the grounding layer 13 is disposed on the lower surface of the dielectric layer 11, and the radiation layer 12 is disposed in the groove 101, and the radiation layer 12, the dielectric layer 11 and the grounding layer 13 are bonded together by a lamination process to form an antenna structure. In this embodiment, the antenna structure manufactured is tested to have an impedance bandwidth of 25% to 85%.

[0050] The manufacturing method of the antenna structure of the present application can manufacture an antenna structure having a three-dimensional structure radiation layer 12. Since the radiation layer 12 manufactured by the present application is a three-dimensional curved surface structure, compared with the radiation layer of the existing planar structure, it must use a high temperature resistant (resistant to 100°C or above) material as the dielectric layer. The material for manufacturing the dielectric layer 11 of the present application can be selected from non-high temperature resistant materials or high temperature resistant materials, and is not limited by the temperature resistance of the material. Under the premise of ensuring performance, lower-priced materials can be selected, which is conducive to reducing production costs. Moreover, the present application can use planar or three-dimensional materials to manufacture the dielectric layer 11 and the radiation layer 12, which has more choices compared to the existing dielectric layer 11 and the radiation layer 12 that can only be manufactured using planar materials. In addition, the radiation layer 12 of the antenna structure manufactured by the manufacturing method of the antenna structure of the present application forms a gradient butterfly structure with the ground layer 13, which effectively improves the high-frequency impedance matching of the antenna structure and improves the impedance bandwidth of the antenna structure. After testing, the impedance bandwidth is 25% to 85%.

[0051] Optionally, the radiation layer 12 is fixed to the inner wall of the groove 101 by a first adhesive film, and the grounding layer 13 is fixed to the lower surface of the dielectric layer 11 by a second adhesive film, and the first adhesive film and / or the second adhesive film are epoxy adhesive films or silicone films; the vacuum curing temperature is 120°C, the heat preservation is performed for 4 to 6 hours, and the pressure curing is performed at room temperature for 24 hours to ensure that the first adhesive film bonds and fixes the radiation layer 12 to the dielectric layer 11 and the second adhesive film bonds and fixes the radiation layer 12 to the dielectric layer 11.

[0052] Embodiment 1

[0053] The second film copper clad laminate is used as the substrate material of the grounding layer 13, and the required grounding layer 13 is formed by laser cutting process. The grounding layer 13 is circular in shape with a diameter of 40 mm, the aperture of the third connecting hole 105 is 4 mm, the thickness of the copper plate is 18 μm, and the thickness of the second film is 0.1 mm.

[0054] The required circular dielectric layer 11 with a diameter of 40 mm and a thickness of 6 mm is formed on the insulating substrate by laser cutting technology.

[0055] The spherical radiation layer 12 of the required dimensions is formed by injection molding process. The injection molding material is metal, that is, the radiation layer 12 formed is made of metal material. The diameter of the radiation layer 12 is 10 mm. A first adhesive film is provided on the lower surface of the radiation layer 12 .

[0056] The ground layer 13, the dielectric layer 11 and the radiation layer 12 are bonded together by vacuum lamination, wherein the first adhesive film and the second adhesive film are both epoxy adhesive films, which are cured for 4 hours at 120° C. The tested frequency of the antenna structure is 6.5 GHz to 10.4 GHz, and the impedance bandwidth is 46.2%.

[0057] Embodiment 2

[0058] The second film copper clad laminate is used as the substrate material of the grounding layer 13, and the required grounding layer 13 is formed by laser cutting process. The grounding layer 13 is circular in shape with a diameter of 40 mm, the aperture of the third connecting hole 105 is 4 mm, the thickness of the copper plate is 18 μm, and the thickness of the second film is 0.1 mm.

[0059] The required rectangular dielectric layer 11 with a side length of 40 mm and a thickness of 3 mm is formed on the insulating substrate by laser cutting technology.

[0060] The ellipsoidal radiation layer 12 of the required dimensions is formed by injection molding process. The injection molding material is metal, that is, the radiation layer 12 formed is made of metal material. The maximum diameter of the radiation layer 12 is 10 mm. A first adhesive film is provided on the lower surface of the radiation layer 12 .

[0061] The ground layer 13, the dielectric layer 11 and the radiation layer 12 are bonded together by vacuum lamination, wherein the first adhesive film and the second adhesive film are both epoxy adhesive films, which are cured for 6 hours at 120° C. The tested antenna has a frequency of 9.29 GHz to 18.06 GHz and an impedance bandwidth of 64.1%.

[0062] The manufacturing method of the antenna structure of the present application adopts laser manufacturing, mold injection molding and vacuum pressing to assemble the layers of the antenna structure to form an antenna structure with a three-dimensional curved radiation layer 12, thereby solving the problem that traditional PCB processes cannot achieve three-dimensional manufacturing.

[0063] The present application also relates to an intelligent terminal, comprising the above-mentioned antenna structure.

[0064] The above embodiments are merely illustrative of the principles and effects of the present application and are not intended to limit the present application. Anyone familiar with the technology may modify or change the above embodiments without violating the spirit and scope of the present application. Therefore, all equivalent modifications or changes made by a person of ordinary skill in the art without departing from the spirit and technical ideas disclosed in the present application shall still be covered by the claims of the present application.

Claims

1. An antenna structure, characterized in that: It includes a dielectric layer, a radiation layer, a grounding layer and a connector. The upper surface of the dielectric layer is provided with a groove. The radiation layer is arranged on the inner wall of the groove in a conformal manner. The radiation surface of the radiation layer is a curved surface. The grounding layer is arranged on the lower surface of the dielectric layer. The connector electrically connects the radiation layer and the grounding layer.

2. The antenna structure according to claim 1, characterized in that: Include at least one of the following: The feeding point where the radiating layer is connected to the connector deviates from the center of the radiating layer; The feeding point where the ground layer is connected to the connector is located at the center of the ground layer.

3. The antenna structure according to claim 1 or 2, characterized in that: An annular hole is provided on the radiation layer, and the annular hole divides the radiation layer into a radiation part, a feeding part and a connecting part. The connecting part is connected between the feeding part and the radiation part. The annular hole is arranged around the circumference of the feeding part, and both ends of the annular hole extend to opposite sides of the connecting part.

4. The antenna structure according to claim 3, characterized in that: Along the radial direction of the feeding portion, the width of the annular hole is less than 1 mm.

5. The antenna structure according to claim 3, characterized in that: The dielectric layer is provided with a first connection hole, the feeding part is provided with a second connection hole, the grounding layer is provided with a third connection hole, the connector includes a head and a probe connected to the head, the probe passes through the third connection hole, the first connection hole and the second connection hole in sequence, and is electrically connected to the feeding part and the grounding layer respectively.

6. The antenna structure according to claim 1 or 2, characterized in that: Include at least one of the following: The radiation layer is in a circular pot shape, and the diameter of the radiation layer is equal to 1 / 4 wavelength; The thickness of the dielectric layer is 1 mm to 6 mm.

7. The antenna structure according to claim 1 or 2, characterized in that: The radiation surface of the radiation layer is one of a spherical surface, a conical surface, a frustum surface, and an ellipsoidal surface.

8. The antenna structure according to claim 1 or 2, characterized in that: The antenna structure further includes a first adhesive film and a second adhesive film, the radiation layer is fixed on the inner wall of the groove through the first adhesive film, and the grounding layer is fixed to the lower surface of the dielectric layer through the second adhesive film.

9. A method for manufacturing an antenna structure, characterized in that: The manufacturing method is used to manufacture the antenna structure according to any one of claims 1 to 8, and the manufacturing method comprises: forming a groove in the dielectric layer; Providing a curved radiation layer, wherein the radiation surface of the radiation layer is a curved surface; The grounding layer is provided, and the grounding layer is arranged on the lower surface of the dielectric layer, and the radiation layer is arranged in the groove, and the radiation layer, the dielectric layer and the grounding layer are bonded together by a lamination process to form an antenna structure.

10. An intelligent terminal, characterized in that: The invention comprises the antenna structure as claimed in any one of claims 1 to 8.

Images