Radio frequency chip assembly, distance detection method and electronic equipment

Abstract

The invention provides a radio frequency chip assembly, a distance detection method and an electronic device, the radio frequency chip assembly comprises a transceiver and a coupler assembly, the coupler assembly comprises an input port, a first output port, a first load port and a second load port, and the coupler assembly is coupled with the transceiver through the input port and the first output port. The first load port is used for coupling the first radiator, the second load port is used for coupling the second radiator, the first load port and the second load port are coupled, and the first output port and the second load port are coupled. According to the radio frequency chip assembly provided by the invention, the detection effect of distance detection of the to-be-detected target can be improved.

Description

Technical Field

[0001] The present application relates to the field of electronic technology, and in particular to a radio frequency chip component, a distance detection method and an electronic device. Background Art

[0002] At present, terminal communication equipment can adjust the transmission power so that the specific absorption rate (SAR, also known as the specific absorption rate) of the electronic device meets the regulatory requirements by identifying the distance of the target to be detected close to the electronic device. However, the use of capacitive detectors / sensors usually requires a large design space and requires antennas of specific structures, while the sensitivity of existing load reflection detectors / sensors is low and it is difficult to meet the use requirements. Therefore, how to improve the detection sensitivity of the detector and make it applicable to various antenna structures has become a technical problem that needs to be solved. Summary of the invention

[0003] The present application provides a radio frequency chip component, a distance detection method and an electronic device to improve the sensitivity of distance detection to a target to be detected.

[0004] In a first aspect, the present application provides a radio frequency chip component, including a transceiver and a coupler component. The coupler component includes an input port, a first output port, a first load port, and a second load port. The transceiver includes a transmitting port and a receiving port. The coupler component is coupled to the transceiver via an input port and a first output port, wherein the input port of the coupler component is coupled to the transmitting port of the transceiver, and the first output port of the coupler component is coupled to the receiving port of the transceiver. The first load port of the coupler component is used to couple a first radiator, and the second load port is used to couple a second radiator, wherein the first load port and the second load port are coupled, and the first output port and the second load port are coupled.

[0005] The RF chip assembly provided in the embodiment of the present application can couple the first load port and the second load port for connecting two radiators, and after the signal transmitted by the transceiver through the coupler assembly is transmitted by the first radiator, the received reflected signal can be coupled to the second radiator, and the target to be detected can be detected again, thereby improving the strength of the signal output from the coupler assembly to the transceiver, thereby improving the detection effect of the distance detection of the target to be detected. In addition, the RF chip assembly provided in the embodiment of the present application can transmit and receive signals through the radiator, and judge the distance of the target to be detected according to the change of the signal load impedance, so it can be applicable to different types of antennas.

[0006] It should be understood that the transceiver in the embodiment of the present application may also be referred to as a transceiver or a radio frequency integrated circuit (RFIC).

[0007] In combination with the first aspect, in certain implementations of the first aspect, the coupler assembly includes a first coupler and a second coupler. The first coupler includes an input port, a first load port, a third port, and a fourth port, and the second coupler includes a fifth port, a second load port, a seventh port, and an eighth port. The seventh port and the second load port are coupled, the eighth port and the second load port are isolated, the first output port is one of the seventh port and the eighth port, the third port of the first coupler is coupled and connected to the fifth port of the second coupler, the input port and the fourth port are coupled, and the first load port and the fourth port are isolated.

[0008] The RF chip assembly provided in the embodiment of the present application can be used as a coupler assembly after coupling the first coupler and the second coupler, and can couple the first reflected signal returned from the target to be detected and received by the first radiator through the second coupler, so that the signal can be transmitted again through the second radiator and the returned signal can be received, thereby realizing secondary detection of the target to be detected, and then the distance detection can be performed according to the result of the signal coupling of the two couplers, thereby improving the detection effect of the distance detection of the target to be detected.

[0009] Optionally, the first coupler is disposed inside a radio frequency front-end (RFFE), and the RF front-end also includes a power amplifier, a duplexer, and other parts.

[0010] Optionally, the coupler assembly may be partially or completely packaged together with the transceiver. For example, the RF front end and the transceiver are designed as one body.

[0011] In combination with the first aspect, in some implementations of the first aspect, the coupler component includes a second output port, and the receiving port of the transceiver includes a first receiving port and a second receiving port. The coupler component is coupled to the transceiver via the input port, the first output port, and the second output port, wherein the first output port of the coupler component is coupled to the first receiving port of the transceiver, the second output port of the coupler component is coupled to the second receiving port of the transceiver, and the second output port is a fourth port.

[0012] The RF chip assembly provided in the embodiment of the present application can sample the signal sent by the transceiver coupled to the input port as a reference signal by coupling the transceiver to the fourth port coupled to the input port in the coupler assembly; and can send the signal after secondary coupling by the second radiator to the transceiver as a sensing signal by coupling the transceiver to the first output port in the coupler assembly. Thus, the transceiver can compare and process the signal after being changed by the target to be detected with the reference signal, thereby improving the accuracy of the transceiver in detecting the distance of the target to be detected.

[0013] In combination with the first aspect, in some implementations of the first aspect, when the first output port is the seventh port, the eighth port is coupled to the second load port.

[0014] The RF chip assembly provided in the embodiment of the present application couples and connects the two isolated ports of the second coupler, so that when the coupler assembly is coupled and connected to the second radiator, the signal coupled from the first coupler to the fifth port can be transmitted to the second radiator through the second load port and the eighth port at the same time, or the signal received from the second radiator is transmitted to the first output port through the second load port and the eighth port, thereby improving the intensity of the signal emission coupled to the second radiator and the signal intensity output by the second coupler to the transceiver, thereby improving the sensitivity of the distance detection to the target to be detected.

[0015] In combination with the first aspect, in some implementations of the first aspect, when the coupler component is coupled to the transceiver via the input port and the first output port, a first switch is further provided on the connection circuit between the first coupler and the second coupler. The first switch has a first end, a second end, and a third end, the first end and the second end are coupled to the third port and the fourth port of the first coupler, respectively, and the third end is coupled to the fifth port of the second coupler.

[0016] The RF chip assembly provided in the embodiment of the present application can simplify the circuit by setting a first switch on the connection circuit between the first coupler and the second coupler so that the signals output from the first coupler through the third port and the fourth port are coupled to the second coupler by the switch.

[0017] Optionally, the first switch is a double-pole double-throw (DPDT) switch.

[0018] In combination with the first aspect, in some implementations of the first aspect, the third end of the first switch is further coupled to the second switch, and the receiving port of the transceiver is further coupled to the third switch. The third end of the first switch is optionally coupled to the transceiver through the second switch and the third switch. Alternatively, the third end of the first switch is optionally coupled to the fifth port of the second coupler through the second switch, and the seventh port of the second coupler is optionally coupled to the transceiver through the third switch.

[0019] The RF chip assembly provided in the embodiment of the present application can directly couple the first coupler to the transceiver by coupling the first switch to the second switch and the third switch, thereby realizing detection and tracking of the transmission power of the first radiator and then performing power calibration. On the other hand, the second switch and the third switch can also couple the first coupler, the second coupler and the transceiver, thereby realizing the function of distance detection of the target to be detected.

[0020] Optionally, the second switch and the third switch are single-pole double-throw switches.

[0021] In combination with the first aspect, in some implementations of the first aspect, the length of the first radiator is L1, the length of the second radiator is L2, and the distance N between the first radiator and the second radiator satisfies: N≤L1×3, and / or, N≤L2×3.

[0022] The RF chip assembly provided in the embodiment of the present application can ensure that the isolation between the first radiator and the second radiator is within a certain range by limiting the distance between the first radiator and the second radiator, so that the influence of the distance of the target to be detected on the isolation can be obtained according to the change of the signal, thereby improving the detection effect of the distance detection of the target to be detected.

[0023] In combination with the first aspect, in some implementations of the first aspect, at least a portion of the length direction of the first radiator and the second radiator is the same.

[0024] The radio frequency chip assembly provided in the embodiment of the present application can provide energy superposition in the length direction by making the first radiator and the second radiator at least partially the same in length direction, thereby improving the measurement effect of the distance detection of the target to be detected.

[0025] In combination with the first aspect, in some implementations of the first aspect, the first radiator is used to operate as a radiator of the first antenna, and the second radiator is used to operate as a radiator of the second antenna, wherein the resonance frequency bands of the first radiator and the second radiator at least partially overlap.

[0026] The radio frequency chip assembly provided in the embodiment of the present application enables the resonant frequency bands of the first radiator and the second radiator to at least partially overlap, so that the second radiator can receive the signal emitted by the first radiator, thereby improving the sensitivity of distance detection to the target to be detected.

[0027] In a second aspect, the present application provides a distance detection method, which can be applied to a radio frequency chip assembly, the radio frequency chip assembly includes a transceiver, a first coupler, a second coupler, a first radiator, and a second radiator. The method includes: the transceiver sends a first signal to the first coupler, the first coupler outputs a first detection signal according to the first signal, the first radiator sends the first detection signal and receives a first reflected signal returned from a target to be detected, the first coupler samples the first reflected signal to output a first sampling signal, the second coupler outputs a second detection signal according to the first sampling signal output by the first coupler, the second radiator sends a second detection signal and receives a signal returned from the target to be detected, and the second coupler outputs a sensing signal according to the signal received by the second radiator. The transceiver performs distance detection on the target to be detected according to the sensing signal.

[0028] The method provided in the embodiment of the present application can couple the first reflected signal returned from the target to be detected and received by the first coupler through the second coupler and then transmit the signal again through the second radiator, so that distance detection can be performed based on the results of signal coupling by the two couplers, thereby improving the sensitivity of distance detection to the target to be detected.

[0029] In combination with the second aspect, in some implementations of the second aspect, the method further includes: the first coupler outputs a first reference signal to the transceiver, the first reference signal including a second sampled signal obtained by the first coupler sampling the first signal. The transceiver performs distance detection on the target to be detected based on the first reference signal and the sensing signal.

[0030] The method provided in the embodiment of the present application sends a reference signal different from the sensing signal to the transceiver, so that the transceiver can compare and process the signal after being changed by the target to be detected with the reference signal, thereby improving the accuracy of the transceiver in detecting the distance of the target to be detected.

[0031] In combination with the second aspect, in some implementations of the second aspect, the method further includes: the second coupler outputs a second reference signal to the transceiver, the second reference signal including a signal output by the second coupler based on a third sampling signal obtained by sampling the first signal by the first coupler. The transceiver performs distance detection on the target to be detected based on the second reference signal and the sensing signal.

[0032] In combination with the second aspect, in some implementations of the second aspect, the second radiator is further used to receive the first detection signal sent by the first radiator.

[0033] In combination with the second aspect, in some implementations of the second aspect, the length of the first radiator is L1, the length of the second radiator is L2, and the distance N between the first radiator and the second radiator satisfies, N≤L1×3, and / or, N≤L2×3.

[0034] In combination with the second aspect, in some implementations of the second aspect, the RF chip assembly further includes a second switch and a third switch. The method further includes that when the first coupler is coupled to the transceiver through the second switch and the third switch, the transceiver is used to send a second signal to the first coupler, the first coupler is used to sample the second signal to output a fourth sampling signal, and the transceiver is further used to adjust the transmission power according to the fourth sampling signal. When the first coupler is coupled to the second coupler through the second switch, and the second coupler is coupled to the transceiver through the third switch, the transceiver is used to send the first signal to the first coupler.

[0035] In combination with the second aspect, in some implementations of the second aspect, the method further includes the transceiver adjusting the transmission power according to a distance detection result of the target to be detected.

[0036] In a third aspect, the present application provides an electronic device, comprising a housing. A mainboard, the mainboard being disposed in the housing. A first radiator and a second radiator, wherein the first radiator and / or the second radiator are disposed on the mainboard or attached to the housing or are part of the housing. A radio frequency chip assembly, the radio frequency chip assembly being disposed in the housing. The radio frequency chip assembly comprises a transceiver and a coupler assembly, the coupler assembly comprising an input port, a first output port, a first load port, and a second load port, and the transceiver comprises a transmitting port and a receiving port. The coupler assembly couples the transceiver via an input port and a first output port, the input port and the transmitting port are coupled and connected, the first output port and the receiving port are coupled and connected, the first load port is coupled and connected to the first radiator, and the second load port is coupled and connected to the second radiator, wherein the first load port and the second load port are coupled, and the first output port and the second load port are coupled.

[0037] In combination with the third aspect, in certain implementations of the third aspect, the coupler assembly includes a first coupler and a second coupler, the first coupler includes an input port, a first load port, a third port, and a fourth port, and the second coupler includes a fifth port, a second load port, a seventh port, and an eighth port. The seventh port and the second load port are coupled, the eighth port and the second load port are isolated, the first output port is one of the seventh port and the eighth port, the third port of the first coupler is coupled to the fifth port of the second coupler, the input port and the fourth port are coupled, and the first load port and the fourth port are isolated.

[0038] In combination with the third aspect, in certain implementations of the third aspect, the coupler component includes a second output port, the receiving port of the transceiver includes a first receiving port and a second receiving port, and the coupler component is coupled to the transceiver via an input port, a first output port, and a second output port, wherein the first output port and the first receiving port are coupled, the second output port and the second receiving port are coupled, and the second output port is a fourth port.

[0039] Optionally, when the first output port is the seventh port, the eighth port is coupled to the second load port.

[0040] In combination with the third aspect, in some implementations of the third aspect, the first radiator is provided with a first feeding port, the second radiator is provided with a second feeding port, the first feeding port and the first load port are coupled and connected, and the second feeding port and the second load port are coupled and connected.

[0041] In combination with the third aspect, in some implementations of the third aspect, the second radiator is further used to receive the first detection signal sent by the first radiator.

[0042] In combination with the third aspect, in some implementations of the third aspect, the length of the first radiator is L1, the length of the second radiator is L2, and the distance N between the first radiator and the second radiator satisfies: N≤L1×3, and / or, N≤L2×3.

[0043] In combination with the third aspect, in some implementations of the third aspect, the first radiator is also used to operate as a radiator of the first antenna, and the second radiator is also used to operate as a radiator of the second antenna, wherein the resonance frequency bands of the first radiator and the second radiator at least partially overlap.

[0044] In combination with the third aspect, in some implementations of the third aspect, at least a portion of the length direction of the first radiator and the second radiator is the same.

[0045] In combination with the third aspect, in some implementations of the third aspect, at least one of the first radiator and the second radiator is provided with a grounding point, and the grounding point is coupled to the floor through a device, or is directly coupled to the floor.

[0046] In combination with the third aspect, in certain implementations of the third aspect, the transceiver is further used to adjust the transmission power according to a distance detection result of the target to be detected.

[0047] The technical effects that can be achieved in the second and third aspects mentioned above can be referred to the description of the technical effects in the first aspect mentioned above, and will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0048] Figure 1 This is a schematic diagram of a directional coupler.

[0049] Figure 2 A schematic diagram of a bidirectional coupler.

[0050] Figure 3 It is a structural schematic diagram of a radio frequency chip assembly provided in an embodiment of the present application.

[0051] Figure 4 It is a schematic diagram of the structure of another radio frequency chip assembly provided in an embodiment of the present application.

[0052] Figure 5 It is a schematic diagram of the structure of another radio frequency chip assembly provided in an embodiment of the present application.

[0053] Figure 6 It is a schematic diagram of the structure of another radio frequency chip assembly provided in an embodiment of the present application.

[0054] Figure 7 It is a schematic diagram of the structure of another radio frequency chip assembly provided in an embodiment of the present application.

[0055] Figure 8 It is a schematic diagram of the structure of another radio frequency chip assembly provided in an embodiment of the present application.

[0056] Fig. 9 It is a schematic diagram of the structure of another radio frequency chip assembly provided in an embodiment of the present application.

[0057] Fig.10 It is a structural schematic diagram of a radio frequency chip assembly provided in an embodiment of the present application.

[0058] Fig.11 It is a schematic diagram of the structure of another radio frequency chip assembly provided in an embodiment of the present application.

[0059] Fig.12 A schematic diagram of a mixing frequency detection process provided in an embodiment of the present application.

[0060] Fig.13 A schematic diagram of another frequency mixing detection process provided in an embodiment of the present application.

[0061] Fig.14 A schematic diagram of another frequency mixing detection process provided in an embodiment of the present application.

[0062] Fig.15 is a schematic diagram of an electronic device 10 provided in an embodiment of the present application.

[0063] Fig.16 It is a partial schematic diagram of an electronic device 10 provided in an embodiment of the present application.

[0064] Fig.17It is a partial schematic diagram of another electronic device 10 provided in an embodiment of the present application.

[0065] Fig.18 It is a partial schematic diagram of another electronic device 10 provided in an embodiment of the present application.

[0066] Fig.19 It is a flow chart of a distance detection method provided in an embodiment of the present application. DETAILED DESCRIPTION

[0067] The following explains the terms that may appear in the embodiments of the present application.

[0068] It should be understood that the term "and / or" used in this article is only a description of the same field of the associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0069] As used in this application, “in the range of…” includes both end values ​​of the range by default. For example, in the range of 1 to 5, the two values ​​1 and 5 are included.

[0070] Coupling: can be understood as direct coupling and / or indirect coupling, and "coupled connection" can be understood as direct coupling connection and / or indirect coupling connection. Direct coupling can also be called "electrical connection", which is understood as the physical contact and electrical conduction between components; it can also be understood as the connection between different components in the circuit structure through physical lines such as printed circuit board (PCB) copper foil or wires that can transmit electrical signals; "indirect coupling" can be understood as two conductors being electrically conductive in an airless / non-contact manner. In one embodiment, indirect coupling can also be called capacitive coupling, for example, signal transmission is achieved by coupling between the gaps between two conductive parts to form an equivalent capacitor.

[0071] Component / device: includes at least one of lumped component / device and distributed component / device.

[0072] Lumped component / device: refers to the collective name for all components when the size of the component is much smaller than the wavelength relative to the circuit operating frequency. For the signal, regardless of any time, the component characteristics always remain fixed and are independent of frequency.

[0073] Distributed components / devices: Unlike lumped components, if the size of the component is similar to or larger than the wavelength relative to the circuit operating frequency, then when the signal passes through the component, the characteristics of each point of the component itself will vary due to changes in the signal. At this time, the component as a whole cannot be regarded as a single entity with fixed characteristics, but should be called a distributed component.

[0074] Radiator: It is a device in the antenna used to receive / send electromagnetic wave radiation. In some cases, the "antenna" in a narrow sense is understood as a radiator, which converts the waveguide energy from the transmitter into radio waves, or converts radio waves into waveguide energy, which is used to radiate and receive radio waves. The modulated high-frequency current energy (or waveguide energy) generated by the transmitter is transmitted to the transmitting radiator via the feeder line, and is converted into a certain polarized electromagnetic wave energy by the radiator and radiated in the desired direction. The receiving radiator converts a certain polarized electromagnetic wave energy from a specific direction in space into modulated high-frequency current energy, which is transmitted to the receiver input via the feeder line.

[0075] The radiator may include a conductor with a specific shape and size, such as a linear or sheet shape, etc., and the present application does not limit the specific shape. In one embodiment, the linear radiator may be referred to as a linear antenna. In one embodiment, the linear radiator may be implemented by a conductive frame, and may also be referred to as a frame antenna. In one embodiment, the linear radiator may be implemented by a bracket conductor, and may also be referred to as a bracket antenna. In one embodiment, the linear radiator, or the radiator of the linear antenna, has a wire diameter (e.g., including thickness and width) much smaller than the wavelength (e.g., the dielectric wavelength) (e.g., less than 1 / 16 of the wavelength), and the length may be comparable to the wavelength (e.g., the dielectric wavelength) (e.g., the length is about 1 / 8 of the wavelength, or 1 / 8 to 1 / 4, or 1 / 4 to 1 / 2, or longer). The main forms of linear antennas include dipole antennas, half-wave dipole antennas, monopole antennas, loop antennas, and inverted F antennas (also known as IFA, Inverted F Antenna). For example, for a dipole antenna, each dipole antenna generally includes two radiating branches, and each branch is fed by a feeding unit from the feeding end of the radiating branch. For example, an inverted-F antenna (IFA) can be regarded as a monopole antenna with a ground path added. The IFA antenna has a feeding point and a grounding point, and is called an inverted-F antenna because its side view is an inverted F shape. In one embodiment, the sheet radiator may include a microstrip antenna, or a patch antenna, such as a planar inverted F antenna (also known as PIFA, Planar Inverted FAntenna). In one embodiment, the sheet radiator may be implemented by a planar conductor (such as a conductive sheet or a conductive coating, etc.). In one embodiment, the sheet radiator may include a conductive sheet, such as a copper sheet, etc. In one embodiment, the sheet radiator may include a conductive coating, such as a silver paste, etc. The shape of the sheet radiator includes a circle, a rectangle, a ring, etc., and the present application does not limit the specific shape. The structure of the microstrip antenna is generally composed of a dielectric substrate, a radiator and a floor, wherein the dielectric substrate is arranged between the radiator and the floor.

[0076] The radiator may also include a slot or a slit formed on the conductor, for example, a closed or semi-closed slot or slit formed on a grounded conductor surface. In one embodiment, a slotted or slitted radiator may be referred to as a slot antenna or a slot antenna. In one embodiment, the radial dimension (e.g., including the width) of the slot or slit of the slot antenna / slot antenna is much smaller than the wavelength (e.g., the dielectric wavelength) (e.g., less than 1 / 16 of the wavelength), and the length dimension may be comparable to the wavelength (e.g., the dielectric wavelength) (e.g., the length is about 1 / 8 of the wavelength, or 1 / 8 to 1 / 4, or 1 / 4 to 1 / 2, or longer). In one embodiment, a radiator with a closed slot or slit may be referred to as a closed slot antenna. In one embodiment, a radiator with a semi-closed slot or slit (e.g., an opening is added to a closed slot or slit) may be referred to as an open slot antenna. In some embodiments, the slot shape is a long strip. In some embodiments, the length of the slot is about half a wavelength (e.g., the dielectric wavelength). In some embodiments, the length of the slot is about an integer multiple of the wavelength (e.g., one times the dielectric wavelength). In some embodiments, the slot can be fed by a transmission line connected across one or both sides thereof, thereby exciting a radio frequency electromagnetic field on the slot and radiating electromagnetic waves into space. In one embodiment, the radiator of the slot antenna or slot antenna can be realized by a conductive frame with both ends grounded, which can also be called a frame antenna; in this embodiment, it can be regarded as that the slot antenna or slot antenna includes a linear radiator, which is spaced apart from the floor and grounded at both ends of the radiator, thereby forming a closed or semi-closed slot or slot. In one embodiment, the radiator of the slot antenna or slot antenna can be realized by a bracket conductor with both ends grounded, which can also be called a bracket antenna.

[0077] The feed source / feed circuit is a combination of all circuits used for receiving and transmitting radio frequency signals. The feed circuit may include a transceiver and an RF front end circuit. In some cases, the "feed circuit" is understood in a narrow sense as a radio frequency chip RFIC, and RFIC can be considered to include an RF front end chip and a transceiver. The feed circuit has the function of converting radio waves (e.g., radio frequency signals) and electrical signals (e.g., digital signals). Generally, it is considered to be part of the radio frequency.

[0078] In some embodiments, the electronic device may further include a test socket (or referred to as a radio frequency socket, a radio frequency test socket, or a feeding port). The test socket may be used to insert a coaxial cable to test the characteristics of the radio frequency front-end circuit or the radiator of the antenna through the cable. The radio frequency front-end circuit may be considered as a circuit portion coupled between the test socket and the transceiver.

[0079] In some embodiments, the RF front-end circuit may be integrated into a RF front-end chip in the electronic device, or the RF front-end circuit and the transceiver may be integrated into a RF chip in the electronic device.

[0080] It should be understood that any two of the first / second / …Nth feeding circuits in the present application can share the same transceiver, for example, transmitting signals through a RF channel in a transceiver (for example, a port (pin) of a RF chip); they can also share a RF front-end circuit, for example, processing signals through a switch or amplifier in a RF front-end.

[0081] It should also be understood that two feeding circuits in the first / second / ...Nth feeding circuits in the present application usually correspond to two radio frequency test sockets in the electronic device.

[0082] Antenna return loss: It can be understood as the ratio of the signal power reflected back to the antenna port through the antenna circuit to the transmit power of the antenna port. The smaller the reflected signal, the larger the signal radiated into space through the antenna, and the greater the radiation efficiency of the antenna. The larger the reflected signal, the smaller the signal radiated into space through the antenna, and the lower the radiation efficiency of the antenna.

[0083] Antenna return loss can be represented by the S11 parameter, which is one of the S parameters. S11 represents the reflection coefficient, which can characterize the antenna transmission efficiency. The S11 parameter is usually a negative number. The smaller the S11 parameter is, the smaller the antenna return loss is, and the less energy is reflected back by the antenna itself, which means that more energy actually enters the antenna, and the higher the antenna system efficiency is; the larger the S11 parameter is, the greater the antenna return loss is, and the lower the antenna system efficiency is.

[0084] Ground (GND): can refer to at least a part of any grounding layer, grounding plate, or grounding metal layer in an electronic device (such as a mobile phone), or at least a part of any combination of any of the above grounding layers, grounding plates, or grounding components, etc. "GND" can be used for grounding components in electronic devices. In one embodiment, "ground" can be a grounding layer of a circuit board of an electronic device, or a grounding plate formed by a frame of an electronic device, or a grounding metal layer formed by a metal film under a screen. In one embodiment, the circuit board can be a printed circuit board (PCB), such as an 8-layer, 10-layer, or 12 to 14-layer board having 8, 10, 12, 13, or 14 layers of conductive material, or an element separated and electrically insulated by a dielectric layer or insulating layer such as glass fiber, polymer, etc. In one embodiment, the circuit board includes a dielectric substrate, a grounding layer, and a routing layer, and the routing layer and the grounding layer are electrically connected through vias. In one embodiment, components such as a display, a touch screen, input buttons, a transceiver, a processor, a memory, a battery, a charging circuit, a system on chip (SoC) structure, etc. can be mounted on or connected to a circuit board; or electrically connected to a wiring layer and / or a ground layer in the circuit board. For example, a radio frequency source is disposed in the wiring layer.

[0085] Any of the above-mentioned grounding layers, grounding plates, or grounding metal layers are made of conductive materials. In one embodiment, the conductive material can be any of the following materials: copper, aluminum, stainless steel, brass and their alloys, copper foil on an insulating substrate, aluminum foil on an insulating substrate, gold foil on an insulating substrate, silver-plated copper, silver-plated copper foil on an insulating substrate, silver foil and tin-plated copper on an insulating substrate, cloth impregnated with graphite powder, graphite-coated substrates, copper-plated substrates, brass-plated substrates, and aluminum-plated substrates. It will be appreciated by those skilled in the art that the grounding layer / grounding plate / grounding metal layer can also be made of other conductive materials.

[0086] Grounding: refers to coupling with the above-mentioned ground / floor through a grounding structure and / or a grounding circuit. In one embodiment, grounding can be achieved through physical grounding, such as physical grounding (or physical ground) at a specific position on the frame through some structural parts of the middle frame. In one embodiment, grounding can be achieved through device grounding, such as grounding through devices such as capacitors / inductors / resistors connected in series or in parallel (or device ground).

[0087] Isolation: refers to the degree of mutual influence between different signal paths in a radio frequency system. For antennas, isolation describes the degree of mutual interference between different antennas during reception and transmission.

[0088] The technical solution of the embodiments of the present application will be described below in conjunction with the accompanying drawings.

[0089] In recent years, with the development of communication technology, the application of wireless communication equipment has become more and more extensive, and wireless communication equipment has been continuously updated. It should be noted that the wireless communication device mentioned in the embodiment of the present application may refer to a device that provides voice and / or data connectivity to users, and can be used to connect people, objects and machines, such as handheld devices with wireless connection functions, vehicle-mounted devices, etc. The wireless communication device in the embodiment of the present application may be, for example, a mobile phone, a tablet computer (Pad), a laptop computer, a PDA, a mobile Internet device (mobile internet device, MID), a wearable device, a virtual reality (virtual reality, VR) device, an augmented reality (augmented reality, AR) device, a wireless terminal in industrial control (industrial control), a wireless terminal in self-driving, a wireless terminal in remote medical surgery, a wireless terminal in smart grid (smart grid), a wireless terminal in transportation safety (transportation safety), a wireless terminal in a smart city (smart city), a wireless terminal in a smart home (smart home), etc.

[0090] Wireless communication devices usually include a baseband system and a radio frequency system. The baseband system is used to generate baseband signals, and the radio frequency system is used to convert the baseband signals into radio frequency signals, so as to transmit the radio frequency signals into a wireless channel through an antenna.

[0091] Since the SAR value is proportional to the conducted power of the antenna, the industry currently reduces the RF power, or power back-off, to prevent high SAR values. In actual use, the SAR value can be adjusted according to the radiated power of the antenna. In some implementations, the radiated power of the antenna can be detected by measuring the forward transmit power of the antenna, or by measuring the reflected power of the antenna.

[0092] Since the antenna is the last impedance element in the RF circuit, measuring the reflected power of the antenna can include changes in SAR caused by external influences on the performance of the antenna itself.

[0093] In the RF transmission system of communication equipment, if the load is mismatched, part of the incident power will be reflected back to the signal source. Due to different mismatch conditions, the same incident signal will generate reflected signals of different sizes. The degree of mismatch is usually quantitatively described by return loss (RL), also known as reflection loss. Among them, RL = incident power / reflected power.

[0094] Return loss is the ratio of incident power to reflected power of the RF circuit. It is the mismatch between input and output from the perspective of power. For example, if 1mW (0dBm) power is input to the antenna, and 10% of it is reflected (bounced) back, the return loss is 10dB. When the parameters such as the component impedance of the RF circuit, antenna efficiency, and antenna radiation field shape are determined, the return loss of the RF circuit is also fixed.

[0095] There are many ways to measure the reflected power of an antenna. You can measure the power of the entire reflected signal of the antenna, or you can measure the power of a sampled signal of the reflected signal of the antenna.

[0096] The load reflection detector can use a coupler to transmit a detection signal and receive a load reflection signal. After the detection signal is transmitted, if the distance of the target to be measured changes, the equivalent load impedance of the load reflection signal received by the detector changes, causing the load reflection signal to change in amplitude and / or phase. After receiving the load reflection signal, the system can determine the distance to the target to be measured based on the degree of change in the reflection signal. Among them, the coupler is a power distribution device. In the RF transceiver system, the signal can be "sampled" through the coupler. Figure 1 is a schematic diagram of the structure of a directional coupler, such as Figure 1 As shown, the signal size of the coupling path is proportional to the size of the signal passing through the coupler. The ratio of the coupled signal to the input signal is called the coupling coefficient or coupling amount. The coupling coefficient of the coupler is usually fixed. More and more radio frequency systems use couplers as a means of detecting power. Couplers include directional couplers and bidirectional couplers, wherein directional couplers include forward couplers and reverse couplers (backward couplers, or reverse couplers), and bidirectional couplers include four-terminal couplers (bi-directional couplers) and dual directional couplers (dualdirectional couplers), etc. In some embodiments, a bidirectional coupler (i.e., a bidirectional directional coupler) can be formed by superimposing two directional couplers in opposite directions, wherein the isolation end of the directional coupler can be hidden inside the component.

[0097] Figure 2 This is a schematic diagram of a bidirectional coupler. Figure 2As shown, the bidirectional coupler includes four ports, each of which can input a signal in the forward direction or output a signal in the reverse direction for power coupling. For example, when port 201 is used as an input port (RFInput, or Input port, or Input), port 202 is an output port (RFOutput, or Outputport, or Output), and port 204 is a coupled port (Coupled port, or Coupled Forward, or Coupled). Assuming that the coupling amount of the coupler is C, the coupled signal of port 204 is ∝C·the input signal of port 201, and the output signal of port 202 is ∝(1-C)·the input signal of port 201. Port 203 is an isolated port (Isolated port, or Coupled Reverse, or Isolated), which can be regarded as no signal output from port 203. In one embodiment, the signal output of port 203 is much smaller than the signal output of port 204. In other words, the energy of the input signal at the input port is approximately equal to the sum of the energy of the output signals at the output port and the coupled port.

[0098] Existing distance sensors usually use capacitive sensors. In capacitive sensors, a fixed-frequency electric field needs to be generated through capacitance, and the distance of the object is determined based on the change in the equivalent dielectric when the object to be detected approaches the sensor. Since the capacitive sensor will cause the load to decrease when grounded, that is, the induced current is directed to the floor, causing the sensor to be unable to obtain effective signals. Therefore, capacitive sensors are only suitable for suspended antennas and cannot be used with grounded antennas. In addition, the existing load reflection detectors have low sensitivity and are difficult to meet actual usage requirements.

[0099] In view of the above technical problems, the present application provides a radio frequency chip component, a distance detection method and an electronic device, which can improve the sensitivity of distance detection to a target to be detected.

[0100] The radio frequency chip assembly provided in the embodiment of the present application includes a transceiver and a coupler assembly. The coupler assembly includes an input port, a first output port, a first load port, and a second load port. The coupler assembly is coupled to the transceiver via the input port and the first output port, the first load port is used to couple the first radiator, and the second load port is used to couple the second radiator, wherein the first load port and the second load port are coupled, and the first output port and the second load port are coupled.

[0101] Combine the following Figures 3 to 11 The radio frequency chip assembly provided in this application is described.

[0102] Fig.10 It is a structural schematic diagram of a radio frequency chip assembly provided in an embodiment of the present application.

[0103] like Fig.10 As shown, the RF chip assembly provided in the embodiment of the present application includes a transceiver 1010 and a coupler assembly 1020. The coupler assembly includes an input port 1021, an output port 1035, a first load port 1022 and a second load port 1032. The transceiver includes a transmitting port 1011 and a receiving port 1012.

[0104] The coupler component 1020 is coupled to the transceiver 1010 via an input port 1021 and an output port 1035. Specifically, the transceiver 1010 includes a transmitting port 1011 and a receiving port 1012. The input port 1021 of the coupler component 1020 is coupled to the transmitting port 1011 of the transceiver 1010, and the first output port of the coupler component 1020 is coupled to the receiving port 1012 of the transceiver 1010. The transmitting port 1011 is used to transmit a radio frequency signal, and the receiving port 1012 is used to receive a sensing signal. It should be understood that the sensing signal refers to a signal after the two radiators output by the coupler component 1020 are coupled. The transmitting port 1011 is coupled to the input port 1021 of the coupler component 1020, and the receiving port 1012 is coupled to the output port 1035 of the coupler component 1020. It should be understood that the transceiver 1010 in the embodiment of the present application may also be called a transceiver or a radio frequency integrated circuit, and the transceiver 1010 may also be replaced by an independent radio frequency transmitter (transmitter) and a radio frequency receiver (receiver), and the combination of a radio frequency transmitter and a radio frequency receiver may also be replaced by a radio frequency transceiver.

[0105] The first load port 1022 in the coupler assembly 1020 is used to couple the first radiator 1051 , and the second load port 1032 is used to couple the second radiator 1052 , wherein the first load port 1022 and the second load port 1032 are coupled, and the output port 1035 and the second load port 1032 are coupled.

[0106] Specifically, Fig.10A target to be detected is shown on the right side of the figure. When the RF chip assembly performs distance detection on the target to be detected, the transceiver 1010 transmits a radio frequency signal to the input port 1021 of the coupler assembly 1020 through the transmitting port 1011, and the radio frequency signal is transmitted to the target to be detected through the first radiator 1051 coupled to the first load port 1022, and then the first radiator 1051 receives the reflected signal returned from the target to be detected. It should be understood that as the distance of the target to be detected changes, the reflected signal will also change accordingly. It can also be understood that the signal reflected by the target to be detected has a change in amplitude and / or phase, so the distance of the target to be detected can be judged according to the degree of change of the signal. The first radiator 1051 couples the reflected signal to the second load port 1032 via the first load port 1022 in the coupler component 1020, and the reflected signal is again transmitted to the target to be detected by the second radiator 1052 coupled to the second load port 1032. After that, the second radiator 1052 receives the reflected signal returned from the target to be detected, and couples the signal to the receiving port 1012 of the transceiver 1010 via the output port 1035 in the coupler component 1020. The transceiver 1010 processes the signal coupled by the coupler component 1020, thereby detecting the distance to the target to be detected.

[0107] In this way, by coupling the first load port 1022 and the second load port 1032 for connecting the two radiators, the signal transmitted by the transceiver 1010 through the coupler component 1020 can be transmitted by the first radiator 1051, and the received reflected signal can be coupled to the second radiator 1052, and the target to be detected can be detected again, so that the strength of the signal output from the coupler component 1020 to the transceiver 1010 can be improved, thereby improving the detection effect of the distance detection of the target to be detected. In addition, the RF chip component provided in the embodiment of the present application can transmit and receive signals through the radiator, and judge the distance of the target to be detected according to the change of the signal load impedance, so it can be applicable to different types of antennas.

[0108] In some embodiments, Fig.10 As shown, the first radiator 1051 is provided with a first feeding port 1041, the second radiator 1052 is provided with a second feeding port 1042, the first feeding port 1041 is coupled to the first load port 1022, and the second feeding port 1042 is coupled to the second load port 1032. The first feeding port 1041 and the second feeding port 1042 are fed by the transceiver 1010, and the signals in the transceiver 1010 are synchronized.

[0109] In some embodiments, the coupler assembly 1020 may be partially or completely packaged together with the transceiver 1010. For details, please refer to the description in the subsequent embodiments.

[0110] Specifically, the coupling manner between the first load port 1022 and the second load port 1032 , and the coupling manner between the output port 1035 and the second load port 1032 may refer to the description in subsequent embodiments.

[0111] In the embodiment of the present application, the output port 1035 of the coupler assembly 1020 is also used to output a reference signal to the transceiver 1010, and the transceiver 1010 is used to detect the distance of the target to be detected based on the reference signal and the sensing signal returned from the target to be detected.

[0112] In this way, the transceiver can compare the signal after being changed by the target to be detected with the reference signal, thereby improving the accuracy of the transceiver in detecting the distance of the target to be detected.

[0113] In an embodiment of the present application, the transceiver 1010 is also used to perform power detection on the received signal, and judge the distance of the target to be detected based on the processing of the amplitude and / or phase of the received signal. Optionally, the transceiver 1010 includes a low noise amplifier (LNA), which is used to amplify the received signal. Optionally, the transceiver 1010 includes a filter, which can be connected to the above-mentioned LNA, mainly used to filter out in-band interference sources, such as interference signals generated in channels such as LNA, separate useful signals from noise, and improve the signal's anti-interference and signal-to-noise ratio. Optionally, the transceiver 1010 includes a mixer, which can be located after the above-mentioned filter and LNA to process the RF signal amplified by the LNA. The mixer is usually composed of a nonlinear element and a frequency selection circuit. It will be described in detail below.

[0114] In some embodiments, the coupler assembly includes a second output port, and the coupler assembly is coupled to the transceiver via the input port, the first output port, and the second output port.

[0115] For example, Fig.11 is a schematic diagram of the structure of another radio frequency chip assembly provided in an embodiment of the present application. Fig.11 As shown, compared to Fig.10 The RF chip component shown, the RF chip component provided in the embodiment of the present application includes a coupler component 1030, wherein the coupler component 1030 includes an input port 1021, a first output port 1033, a second output port 1024, a first load port 1022 and a second load port 1032.

[0116] Specifically, the coupler component 1030 is coupled to the transceiver 1010 through the input port 1021, the first output port 1033, and the second output port 1024. The receiving port of the transceiver 1010 includes a first receiving port 1012 and a second receiving port 1013, wherein the transceiver 1010 includes a transmitting port 1011, a first receiving port 1012, and a second receiving port 1013, wherein the transmitting port 1011 is used to transmit a radio frequency signal, the first receiving port 1012 is used to receive a sensing signal, and the second receiving port 1013 is used to receive a reference signal. The transmitting port 1011 is coupled to the input port 1021 of the coupler component 1030, the first receiving port 1012 is coupled to the first output port 1033 of the coupler component 1030, and the second receiving port 1013 is coupled to the second output port 1024 of the coupler component 1030.

[0117] In some embodiments, the coupler assembly includes a first coupler and a second coupler, the first coupler includes an input port, a first load port, a third port and a fourth port, the second coupler includes a fifth port, a second load port, a seventh port and an eighth port, wherein the seventh port and the second load port are coupled, the eighth port and the second load port are isolated, the first output port is one of the seventh port and the eighth port, the third port of the first coupler is coupled to the fifth port of the second coupler, the input port and the fourth port are coupled, and the first load port and the fourth port are isolated.

[0118] In this way, the first coupler and the second coupler can be coupled and connected as a coupler assembly, so that the first reflected signal returned from the target to be detected and received by the first radiator can be coupled through the second coupler, and the signal can be transmitted again through the second radiator and the signal returned from the target to be detected can be received, thereby realizing secondary detection of the target to be detected, and then the distance detection can be performed according to the result of the signal coupling of the two couplers, thereby improving the detection effect of the distance detection of the target to be detected.

[0119] Combine the following Figures 3 to 9 Describe in detail.

[0120] Figure 3 Schematic diagram of the structure of a radio frequency chip assembly provided in an embodiment of the present application. Figure 3As shown, the RF chip assembly provided in the embodiment of the present application includes a transceiver 310, a first coupler 320, and a second coupler 330, wherein the first coupler 320 is coupled to the first radiator 351, and the second coupler 330 is coupled to the second radiator 352. The transceiver 310 couples the first coupler 320 and the second coupler 330 through ports 311, 312, and 313. Port 311 is a transmitting port of the transceiver 310, and ports 312 and 313 are receiving ports of the transceiver 310.

[0121] In the embodiment of the present application, the first coupler 320 includes a port 321, a port 322, a port 323, and a port 324. The second coupler 330 includes a port 331, a port 332, a port 333, and a port 334. The port 311 of the transceiver 310 is coupled to the first coupler 320 through the port 321, the first coupler 320 is coupled to the port 331 of the second coupler 330 through the port 323, the first coupler 320 is coupled to the port 313 of the transceiver 310 through the port 324, and the second coupler 330 is coupled to the port 312 of the transceiver 310 through the port 333. The first radiator 351 is provided with a feeding port 341, and the second radiator 352 is provided with a feeding port 342. The first radiator 351 is coupled to the port 322 of the first coupler 320 through the feeding port 341, and the second radiator 352 is coupled to the port 332 of the second coupler 330 through the feeding port 342. The feeding port 341 and the feeding port 342 are fed by the transceiver 310 , and the signals in the transceiver 310 are synchronized.

[0122] It should be understood that the embodiments of the present application may correspond to Fig.11 The embodiment shown, wherein Fig.11 The transceiver 1010 shown may be the transceiver 310, wherein the transmitting port 1011 may be the port 311, the first receiving port 1012 may be the port 312, and the second receiving port 1013 may be the port 313; the input port 1021 of the coupler assembly 1030 may be the port 321, the first output port 1033 may be the port 333, the second output port 1024 may be the port 324, the first load port 1022 may be the port 322, and the second load port 1032 may be the port 332. When the first coupler 320 and the second coupler 330 are partially or completely packaged with the transceiver 310, the corresponding ports may be hidden due to the packaging, for example, when the first coupler 320 and the transceiver 310 are packaged, the port 311 and the port 321 may be hidden due to the packaging, which will not be described in detail in this application.

[0123] In the embodiment of the present application, the first coupler 320 and the second coupler 330 are bidirectional couplers. When the port 321 is used as the input port, the port 323 is the isolation port, that is, the port 321 is isolated from the port 323; the port 324 is the coupling port, that is, the port 321 is coupled to the port 324; the port 322 is the output port of the port 321. The port 321 can also be used as the output port of the port 322. In this case, the port 322 is the input port, the port 323 is the coupling port of the port 322, and the port 324 is the isolation port of the port 322. The port of the second coupler 330 is similar to that of the first coupler 320.

[0124] Specifically, port 321 is isolated from port 323, port 322 is isolated from port 324, port 331 is isolated from port 333, port 333 is isolated from port 334, and signal coupling can be performed between other ports, for example, port 333 is coupled to port 332, and when a signal is input to port 332, the coupled signal can be output through port 333. In addition, since the first coupler 320 is coupled to port 331 of the second coupler 330 through port 323, ports 322 and 324 in the first coupler 320 can be coupled to ports 334 and 332 in the second coupler 330, for example, ports 322 and 332 are coupled, that is, after a signal is input from port 322, the coupled signal can be output from port 332.

[0125] In the embodiment of the present application, the transceiver 310 is used to send a first signal to the first coupler 320, and the first coupler 320 is used to output a first detection signal according to the first signal. It should be understood that in the first coupler 320, if the coupling amount of the coupler 320 is C, the signal input from the port 321 can be output through the port 322, and the output signal of the port 322 is ∝(1-C)·the input signal of the port 321, and at the same time, the coupled signal of the input signal of the port 321 is output from the port 324, and the coupled signal of the port 324 is ∝C·the input signal of the port 321, wherein the symbol ∝ represents a proportional relationship.

[0126] Figure 3 A target to be detected is shown on the right side of the figure. After the port 322 outputs a signal, the first radiator 351 is used to send a first detection signal and receive a first reflected signal returned from the target to be detected. It should be understood that as the distance of the target to be detected changes, the first reflected signal will also change accordingly. It can also be understood that the signal after being reflected by the target to be detected has a change in amplitude and / or phase, so the distance of the target to be detected can be judged based on the degree of change of the signal. At this time, after receiving the first reflected signal returned from the target to be detected, the first radiator 351 uses the port 322 of the first coupler 320 as the input end.

[0127] The first coupler 320 is also used to sample the first reflected signal to output a first sampled signal. After the first reflected signal is input from the port 322, the first coupler 320 outputs the first sampled signal from the coupling end of the port 322, that is, the port 323. The process of the first coupler 320 sampling the signal can also be understood as the process of signal coupling.

[0128] After the two couplers are coupled, the signal input from the port 322 of the first coupler 320 can be input to the coupler 330 through the port 331 coupled to the second coupler, and the target to be detected can be detected again from the port 332 through the radiator 352, that is, the port 322 and the port 332 can be signal coupled. Specifically, the second coupler 330 is used to output the second detection signal according to the first sampling signal. It should be understood that after receiving the first sampling signal from the port 331, the second coupler 330 can output the second detection signal from the output end of the port 331, that is, the port 332.

[0129] The second radiator 352 is used to send a second detection signal and receive a signal returned from the target to be detected. At this time, after receiving the signal returned from the target to be detected, the second radiator 352 uses the port 332 of the second coupler 330 as the input end of the signal.

[0130] The second coupler 330 is also used to output a sensing signal according to the signal received by the second radiator 352. It should be understood that after the above signal is input from the port 332, the second coupler 330 can output the sensing signal from the coupling end of the port 332, that is, the port 333, wherein the second coupler 330 is coupled to the transceiver 310 through the port 333, and the port 333 is isolated from the port 331.

[0131] The transceiver 310 is used to perform proximity detection on a target to be detected according to the sensing signal.

[0132] In this way, the RF chip assembly provided in the embodiment of the present application can couple the first reflected signal returned from the target to be detected and received by the first radiator 351 through the coupler 330 by coupling the coupler 320 with the coupler 330, so that the signal can be transmitted again through the second radiator 352 and the returned signal can be received, and then the distance detection can be performed according to the result of the signal coupling by the two couplers, thereby improving the detection effect of the distance detection of the target to be detected.

[0133] In some embodiments, the transceiver 310 is further configured to adjust the transmission power according to the distance detection result of the target to be detected.

[0134] It should be understood that the above-mentioned target to be detected can be a biological body or any object.

[0135] In the embodiment of the present application, the port 312 of the transceiver 310 is a sensing port, and the port 313 is a reference port, wherein the sensing port is used to receive a sensing signal, and the reference port is used to receive a reference signal.

[0136] Specifically, Figure 3 As shown, a reference signal can be output to the transceiver 310 through the first coupler 320. The reference signal includes a second sampling signal of the first signal sampled by the first coupler 320. It should be understood that after the transceiver 310 sends the first signal to the port 321 of the first coupler 320, the second sampling signal of the first signal sampled can be output from the coupling end of the port 321, that is, the port 324. It should be understood that in the embodiment of the present application, the first coupler 320 and the second coupler 330 are both coupled to the transceiver 310.

[0137] In an embodiment of the present application, the transceiver 310 is used to perform power detection on the received signal. Optionally, the transceiver 310 includes a low noise amplifier LNA, which is used to amplify the received signal. Optionally, the transceiver 310 includes a filter, which can be connected to the above-mentioned LNA, mainly used to filter out in-band interference sources, such as interference signals generated in the LNA and other channels, separate useful signals from noise, and improve the signal's anti-interference and signal-to-noise ratio. Optionally, the transceiver 310 includes a mixer, which can be located after the above-mentioned filter and LNA to process the RF signal amplified by the LNA. The mixer is usually composed of a nonlinear element and a frequency selection circuit.

[0138] Optionally, after receiving the sensing signal and the reference signal, the transceiver 310 may perform frequency mixing detection on the two. After the output signal obtained by the frequency mixing detection is processed by the transceiver, a detection result including the position information or distance of the target to be detected is obtained. After obtaining the detection result, the transmission power of the transceiver may be adjusted according to the result. Figure 12 to Figure 14 Describe the process of frequency mixing detection in detail.

[0139] Specifically, Fig.12 A schematic diagram of a mixing detection process provided in an embodiment of the present application. Fig.12As shown, after the sensing signal and the reference signal are adjusted in power by components such as LNA, the reference signal is input into the mixer through the local oscillator (LO) port of the mixer, and the sensing signal is input into the mixer through the radio frequency (RF) port of the mixer, that is, the sensing signal and the reference signal are mixed and detected with each other. By mixing the above signals, the mixer can output a signal with an intermediate frequency through an intermediate frequency (IF) port, and then processed by a low-pass filter (LPF) so that the transceiver 340 can perform detection processing.

[0140] Optionally, Fig.13 Another schematic diagram of a mixing detection process provided in an embodiment of the present application. Fig.13 As shown, compared to Fig.12 In the mixing detection process shown in FIG. 1 , after the sensing signal and the reference signal are adjusted in power by components such as LNA, the RF signal is smoothly converted into a DC signal by a root mean square detector, and the average value is used to represent the effective value, and then the transceiver 310 performs detection processing.

[0141] Optionally, Fig.14 Another schematic diagram of a mixing detection process provided in an embodiment of the present application. Fig.14 As shown, compared to Fig.13 In the mixing detection process shown, in this embodiment, the sensing signal and the reference signal are mixed through different mixers after the power of the components such as LNA is adjusted, and the additional local oscillator signal is mixed with the sensing signal and the reference signal in different mixers, so that different intermediate frequency signals are obtained according to the sensing signal and the reference signal, and then detected and processed by the transceiver 310.

[0142] In some embodiments, mapping relationship information among the usage status of the electronic device, the detection results of the transceiver, and the SAR value can be pre-stored. Then, the transmission power of the transceiver can be obtained by searching the mapping relationship information based on the usage status of the electronic device and the detection results of the transceiver.

[0143] In some embodiments, when the first output port is the seventh port, the eighth port is connected to the second load port by coupling.

[0144] Specifically, Figure 3As shown, the first output port may be port 333 in the second coupler 330, and the eighth port and the second load port may be port 334 and port 332 in the second coupler 330, respectively. Port 332 and port 334 in the second coupler 330 are coupled and connected, and then coupled and connected to the second radiator 352 through the feeding port 342. Port 334 of the second coupler 330 is coupled and connected to port 332 through wiring, and port 334 is isolated from port 332. After the second radiator 352 receives the reflected signal of the target to be detected, the signal may be input to the second coupler 330 through ports 332 and port 334 of the second coupler 330 at the same time, or the signal coupled to port 331 from the first coupler 320 may be coupled to the second radiator 352 through ports 332 and port 334 at the same time. In this way, by coupling and connecting the two isolated ports of the second coupler to the second radiator at the same time, the strength of the transmission signal coupled to the second radiator and the signal strength output by the second coupler to the transceiver can be increased, thereby improving the sensitivity of distance detection to the target to be detected.

[0145] It should be understood that the port 332 and the port 334 in the second coupler can be packaged as one port, for example Fig.11 The second load port 1024 is shown and is coupled to the second radiator 1052 through the second load port 1024 .

[0146] Optionally, port 334 is connected to ground via a resistor.

[0147] like Figure 4 As shown, Figure 4 is a schematic diagram of the structure of another radio frequency chip assembly provided in an embodiment of the present application. Figure 3 , Figure 4 The difference is that the port 334 of the second coupler 330 is grounded through a resistor. It should be understood that impedance matching refers to designing the input impedance of the load and / or designing the output impedance of the signal source (output impedance, also known as internal impedance) to maximize the power transmission from the signal source to the load and / or minimize the signal reflection at the load end. In the embodiment of the present application, the second coupler 330 is connected to the second radiator through the port 332, and the port 334 is grounded through a resistor, which can simplify the circuit while keeping the circuit impedance matching. Exemplarily, the resistor is a 50 ohm resistor.

[0148] It should be understood that the above Figure 3 and Figure 4 The description of the RF chip components can also correspond to Fig.11 The RF chip components in the Fig.11 The RF chip components shown can also be implemented Figure 3 and Figure 4 The functionality of the RF chip assembly is described.

[0149] In some embodiments, when the coupler component is coupled to the transceiver via the input port and the first output port, a first switch is further provided on the connection circuit between the first coupler and the second coupler, the first switch having a first end, a second end and a third end, the first end and the second end being coupled to the third port and the fourth port of the first coupler respectively, and the third end being coupled to the fifth port of the second coupler.

[0150] For example, Figure 5 As shown, Figure 5 5 is a schematic diagram of the structure of another radio frequency chip component provided in an embodiment of the present application. The input port of the coupler component can be port 521, and the first output port can be port 534. A switch 561 is also provided on the connection circuit of the first coupler 520 and the second coupler 530. For example, a double-pole double-throw switch. The switch has a first end, a second end and a third end. The first end and the second end are respectively connected to two ports of the first coupler 520, namely port 523 and port 524, and the third end is connected to the second coupler 530. The switch is used to control the connection circuit to be turned on after the transceiver 510 sends the first signal, so that the first coupler 520 outputs a signal to the second coupler 530. At this time, the second coupler 530 in the coupler component is coupled to the port 512 of the transceiver 510 through the eighth port, namely port 534. It should be understood that after the connection circuit is turned on, the first coupler 520 can output a signal to the second coupler 530 through port 523 and port 524. Optionally, the switch also includes a fourth end, which is grounded through a resistor. For example, a 50 ohm resistor.

[0151] Optionally, the first output port of the coupler assembly may be the port 533 of the second coupler 530 , that is, the coupler assembly is coupled to the transceiver 510 via the port 533 .

[0152] In the embodiment of the present application, when the first output port is the seventh port, the eighth port is coupled to the second load port.

[0153] Specifically, Figure 5 As shown, the first output port may be port 531 in the second coupler 530, and the seventh port and the second load port are respectively port 533 and port 532 in the second coupler 530. Port 533 and port 532 in the second coupler 530 are coupled and connected, and then coupled and connected to the second radiator 552 through the feeding port 542. Port 534 of the second coupler 530 is coupled and connected to port 532 through wiring, and port 533 is coupled to port 532.

[0154] The following are the main Figure 5 and Figure 3 The differences are described below, and most of the same contents are not repeated here.

[0155] In the embodiments of the present application, Figure 5 As shown, the transceiver 510 includes a port 511 and a port 512. Among them, the port 511 is a transmitting port, and the port 512 is a receiving port. When the second coupler 530 is coupled to the receiving port of the transceiver 510, that is, the port 512, through the port 533, the second coupler 530 can output a reference signal and a sensing signal to the port 512 of the transceiver 510 through the port 533. Among them, the reference signal includes a signal output by the second coupler 530 according to the third sampling signal sampled by the first coupler 520 on the first signal. Specifically, after the transceiver 510 sends the first signal to the port 521 of the first coupler 520, the signal sampled by the first signal can be output from the coupling end of the port 521, that is, the port 524, and the signal is then sent from the port 524 to the port 531 of the second coupler 530. Then, the signal is input to the receiving end of the transceiver 510, that is, the port 512, through the second coupler 530.

[0156] In the embodiment of the present application, specifically, the first coupler 520 has a port 521, a port 522, a port 523, and a port 524. The second coupler 530 has a port 531, a port 532, a port 533, and a port 534. The transceiver 510 is coupled to the first coupler 520 via the port 521, the first coupler 520 is coupled to the port 531 of the second coupler 530 via the port 523 and the port 542, the first radiator 551 is coupled to the port 522 of the first coupler 520, and the second radiator 552 is coupled to the port 532 of the second coupler 530. In the embodiment of the present application, the first coupler 520 and the second coupler 530 are bidirectional couplers.

[0157] The transceiver 510 is used to send a first signal to the first coupler 520, and the first coupler 520 is used to output a first detection signal according to the first signal. Specifically, the signal input from the port 521 can be output through the port 522, and the coupled signal of the input signal of the port 521 is output from the port 524, which is the third sampling signal of the first signal, and this application will not repeat it.

[0158] After outputting the signal from port 522, the first radiator 551 is used to send the first detection signal and receive the first reflected signal returned from the target to be detected. At this time, after receiving the first reflected signal returned from the target to be detected, the first radiator 551 uses port 522 of the first coupler 520 as the input end.

[0159] The first coupler 520 is also used to sample the first reflected signal to output a first sampled signal. After the first reflected signal is input from the port 522 , the first coupler 520 outputs the first sampled signal from the coupling end of the port 522 , that is, the port 523 .

[0160] The second coupler 530 is used to output the second detection signal according to the first sampling signal. It should be understood that after receiving the first sampling signal from the port 531 , the second coupler 530 can output the second detection signal from the output end of the port 531 , that is, the port 532 .

[0161] In the embodiment of the present application, when the first output port is the seventh port, the eighth port is coupled to the second load port. That is, port 532 is coupled to port 534, which is coupled to the second radiator 552, wherein port 531 is coupled to port 534.

[0162] Specifically, Figure 5 As shown, the eighth port and the second load port are port 534 and port 532 in the second coupler 530, respectively. Port 532 and port 534 in the second coupler 530 are coupled and connected, and then coupled and connected to the second radiator 552 through the feeding port 542. Among them, port 534 of the second coupler 530 is coupled and connected to port 532 through wiring, and port 534 is isolated from port 532. After the second radiator 552 receives the reflected signal of the target to be detected, the signal can be input to the second coupler 530 through port 532 and port 534 of the second coupler 530 at the same time, or the signal coupled from the first coupler 520 to port 531 can be coupled to the second radiator 552 through port 532 and port 534 at the same time. In this way, by coupling and connecting the two isolated ports of the second coupler and then connecting them to the second radiator, the strength of the transmitted signal coupled to the second radiator and the signal strength output by the second coupler to the transceiver can be increased, thereby improving the sensitivity of the distance detection of the target to be detected.

[0163] It should be understood that the port 532 and the port 534 in the second coupler can be packaged as one port, for example Fig.11 The second load port 1024 is shown and is coupled to the second radiator 1052 through the second load port 1024 .

[0164] Optionally, port 534 is connected to ground via a resistor.

[0165] The second coupler 530 is also used to output a sensing signal according to the signal received by the second radiator 552. Specifically, after the signal returned from the target to be detected is input through the port 532 of the second coupler 530, the sensing signal is output to the transceiver 510 through the port 533.

[0166] In this way, after receiving the signal returned from the target to be detected, the second radiator 552 can input the signal into the second coupler 530 through the coupled port 532 and the port 534 , and output the sensing signal to the transceiver 510 through the port 533 .

[0167] It should be understood that the reference signal and the sensing signal are output to the transceiver 510 via the port 533. The transceiver 510 can distinguish different signals according to parameters such as the timing or power of the received signal, which is not limited in the present application.

[0168] Figure 6 is a schematic diagram of the structure of another radio frequency chip assembly provided in an embodiment of the present application. Figure 6 and Figure 5 The differences are described in this section, and most of the same contents are not repeated here. Figure 6 As shown, the second coupler 530 has ports 531, 532, 533 and 534. The first coupler 520 is coupled to the port 531 of the second coupler 530 through ports 523 and 542, and the second radiator 552 is coupled to the port 532 of the second coupler 530. The second coupler 530 is coupled to the transceiver 510 through port 533.

[0169] The second coupler 530 may output a reference signal and a sensing signal to the port 541 of the transceiver 510 through the port 533. The reference signal includes a signal output by the second coupler 530 according to the third sampling signal sampled by the first coupler 520 on the first signal. Specifically, after the transceiver 510 sends the first signal to the port 521 of the first coupler 520, the signal sampled on the first signal may be output from the coupling end of the port 521, that is, the port 524, and the signal is then sent from the port 524 to the port 531 of the second coupler 530.

[0170] In the second coupler 530 , the reference signal is output to port 532 through port 531 , and is coupled to port 533 after being sent and received by the second radiator 552 and reflected signals, and then received by the receiving port of the transceiver 510 , that is, port 512 .

[0171] In the embodiment of the present application, the difference between the sensing signal and the reference signal is that the first signal sent by the transceiver 510 to the first coupler 520 is input from the port 521 and output through the port 522. After the signal is output from the port 522, the first radiator 551 is used to send the first detection signal and receive the first reflected signal returned from the target to be detected. At this time, after receiving the first reflected signal returned from the target to be detected, the first radiator 551 uses the port 522 of the first coupler 520 as the input end.

[0172] The first coupler 520 is also used to sample the first reflected signal to output a first sampled signal. After the first reflected signal is input from the port 522 , the first coupler 520 outputs the first sampled signal from the coupling end of the port 522 , that is, the port 523 .

[0173] The second coupler 530 outputs a sensing signal from a port 533 through the same path as the reference signal according to the first sampling signal.

[0174] Thus, the RF chip assembly provided in the embodiment of the present application is compared with Figure 5 The circuit can be simplified.

[0175] Optionally, the port 534 of the second coupler 530 is grounded via a resistor, for example, a 50 ohm resistor.

[0176] Optionally, the port 534 of the second coupler 530 may be coupled to the port 532 and coupled to the second radiator 552 via the feeding port 542 .

[0177] It should be understood that the above Figure 5 and Figure 6 The description of the RF chip assembly described in may correspond to Fig.10 In the RF chip assembly, when the first coupler and the second coupler are used as a coupler assembly, the coupler assembly is coupled to the transceiver through the input port and the first output port. At this time, the first output port corresponds to Fig.10 port 1035 in , while Fig.10 Port 1035 in can correspond to Figure 5 Port 534 in , can also correspond to Figure 6 In other words, Fig.10 The RF chip components shown can also be implemented Figure 5 and Figure 6 The functionality of the RF chip assembly is described.

[0178] In some embodiments, the third end of the first switch is further coupled to the second switch, and the receiving port of the transceiver is further coupled to the third switch. The third end of the first switch is optionally coupled to the transceiver through the second switch and the third switch. Alternatively, the third end of the first switch is optionally coupled to the fifth port of the second coupler through the second switch, and the seventh port of the second coupler is optionally coupled to the transceiver through the third switch.

[0179] like Figure 7 As shown, Figure 7 is a schematic diagram of the structure of another radio frequency chip assembly provided in an embodiment of the present application. Figure 7 and Figure 6 The differences are described below, and most of the same contents are not repeated here.

[0180] Specifically, the third end of the switch 561 is also coupled to the switch 562, and the receiving port 512 of the transceiver 510 is also coupled to the switch 563. Figure 7 As shown, the third end of the switch 561 is coupled to the transceiver 510 through the switch 562 and the switch 563. It should be understood that the switch 562 and the switch 563 can switch the connection state of the circuit. For example, the third end of the switch 561 is coupled to the fifth port 531 of the second coupler 530 through the switch 562, and the seventh port 533 of the second coupler 530 is coupled to the transceiver 510 through the switch 563.

[0181] That is, switch 562 and switch 563 have a first state and a second state. It should be understood that Figure 7 The states of the switch 562 and the switch 563 shown in the figure are both in the first state. When the switch 562 and the switch 563 are both in the first state, the third end of the switch 561 is coupled and connected to the transceiver 510 through the switch 562 and the switch 563. That is, when the switch 562 and the switch 563 are both in the first state, the third end of the switch 561 can be directly coupled and connected to the port 512 of the transceiver 510.

[0182] Optionally, switch 562 and switch 563 are single-pole double-throw switches.

[0183] In the embodiment of the present application, the transceiver 310 can send a radio frequency signal to the first coupler 520, and the port 524 of the first coupler 520 can output a sampled signal after sampling the radio frequency signal, and output it to the port 512 of the transceiver 510 through the switch 561, the switch 562 and the switch 563. By receiving the sampled signal, the transceiver 510 can detect and track the transmission power of the port 511 and adjust the output power in real time to perform power calibration.

[0184] Optionally, the transmission power of the transceiver 510 may be adjusted according to the influence of environmental parameters, such as the influence of temperature or the object to be detected on the signal received by the first radiator 551 .

[0185] In addition, the transceiver 510 can also implement distance detection of a target to be detected by a single coupler through the first coupler 520 and the first radiator 551. This application will not elaborate on this.

[0186] When the switch 562 and the switch 563 are both in the second state, the third end of the switch 561 is coupled to the port 531 of the second coupler 530 through the switch 562, and the port 533 of the second coupler 530 is coupled to the transceiver 510 through the switch 563. In other words, when the switch 562 and the switch 563 are both in the second state, the third end of the switch 561 can be directly used to couple the second coupler 530 to the circuit, so that the first coupler 520 can be connected to the port 531 of the second coupler 530 through the switch 561 and the switch 562, and at the same time, the second coupler 530 can output a signal to the port 512 of the transceiver 510 through the port 533. When the switch 562 and the switch 563 are both in the second state, it can be referred to Figure 5 Embodiment of the invention.

[0187] It should be understood that Figure 7 The connection method of the second coupler 530 can refer to Figure 5 and Figure 6 The connection method of the second coupler 530 will not be described in detail in this application.

[0188] In this way, by adding the second switch and the third switch to the RF chip assembly, and combining the switching of the second switch and the third switch states, the switching of different functions can be achieved, thereby enhancing practicality. For example, by coupling the first switch to the second switch and the third switch, the first coupler can be directly coupled to the transceiver, thereby realizing the detection and tracking of the transmission power of the first radiator and then enabling power calibration. Alternatively, the second switch and the third switch can also couple the first coupler, the second coupler and the transceiver, thereby realizing the function of distance detection of the target to be detected.

[0189] In some embodiments, Figure 7 As shown, the first coupler 520 and the switch 561 may be included in the RF front end, which is coupled to the port 511 of the transceiver 510 through the port 521, coupled to the feeding port 541 of the first radiator 551 through the port 522, and connected to the switch 562 through the third end of the switch 561. It should be understood that the RF front end may be included in the RF chip, that is, the transceiver 510 and the RF front end are packaged as one body, and the external components include the second coupler 530, the switch 562 and the switch 563. The above components may also be packaged in combination in other ways, for example, the switch 562, the switch 563 and the second coupler 530 are packaged at the same time, which is not limited in the present application.

[0190] Optionally, the RF front end also includes a power amplifier, a duplexer and other parts.

[0191] In some embodiments, the second radiator is further used to receive the first detection signal sent by the first radiator.

[0192] It should be understood that when the distance between the first radiator and the second radiator is less than a certain threshold, there is mutual interference between the first radiator and the second radiator. In radio frequency systems, isolation (ISO) is usually used to describe the degree of mutual influence between different signal paths. Figure 3 As shown, if the reflection coefficient of the first radiator 351 is Γ1, the reflection coefficient of the second radiator 352 is Γ2, and the isolation between the first radiator 351 and the second radiator 352 is ISO, then in addition to the above-mentioned coupling path, the first signal IN sent by the transceiver 310 can also be sent through the first radiator 351 and then received by the second radiator 352. At this time, the second radiator 352 will receive the signal emitted by the first radiator 351 in addition to the reflected signal returned from the target to be detected. A part of the signal input by the second radiator 352 to the second coupler 330 is output to the sensing port 312 of the transceiver 310 through the first path, that is, port 333, and the other part is output to the reference port 313 of the transceiver 310 through the second path, that is, port 331 via ports 323 and port 324 of the first coupler 320. Among them, with respect to the signal emitted by the first radiator 351 received by the second radiator 352, the signal SEN received by the sensing port 312 of the transceiver 310 can be expressed as:

[0193] SEN∝IN*a*Γ1*Γ2*ISO, where a is the proportional coefficient of the first signal IN after flowing through the component on the first path.

[0194] The signal REF received by the reference port 342 of the transceiver 310 can be expressed as:

[0195] REF∝IN*b*Γ1*Γ2*ISO, where b is the proportional coefficient of the first signal IN after it flows through the element on the second path.

[0196] In this way, by adjusting the positions of the first radiator and the second radiator, the second radiator can be used to receive the first detection signal sent by the first radiator. As the distance of the target to be detected changes, the degree of interference will also change accordingly, that is, the isolation will change. Therefore, after the second radiator receives the first detection signal sent by the first radiator, the distance of the target to be detected can be judged according to the change in signal isolation, thereby improving the sensitivity of distance detection of the target to be detected.

[0197] In some embodiments, the length of the first radiator is L1, the length of the second radiator is L2, and the distance N between the first radiator and the second radiator satisfies: N≤L1×3, and / or, N≤L2×3.

[0198] In this way, by limiting the distance between the first radiator and the second radiator, the isolation between the first radiator and the second radiator can be ensured, thereby improving the detection effect of the distance detection on the target to be detected.

[0199] In some embodiments, at least part of the length direction of the first radiator and the second radiator is the same. For example, the first radiator or the second radiator can be partially bent, and the extension direction of one radiator after bending is the same as the extension direction of the other radiator.

[0200] It should be understood that when the length directions of at least a portion of the first radiator and the second radiator are the same, the two radiators can provide energy superposition in the length direction, thereby improving the measurement effect of the distance detection of the target to be detected.

[0201] Optionally, at least a portion of the first radiator and at least a portion of the second radiator extend collinearly. The collinear extension of A and B can be understood as A and B both extending along a first straight line, for example, the extension direction of A and the extension direction of B are both located on the first straight line.

[0202] Optionally, the first radiator is a bent metal segment, and at least a portion of the first radiator and at least a portion of the second radiator are in the same direction. In this way, the first radiator has signal detection in both directions of the bend, covering a wider range of directions.

[0203] Optionally, the length directions of the first radiator and the second radiator are different. Figure 8 As shown, Figure 8 is a schematic diagram of the structure of another radio frequency chip assembly provided in an embodiment of the present application. Figure 3 , Figure 8 The difference is that the length directions of the first radiator 451 and the second radiator 452 are different, that is, the signal transmission directions are different. In the embodiment of the present application, the length direction of the first radiator is perpendicular to the length direction of the second radiator. For example, the length direction of the first radiator 451 is the x direction, and the length direction of the second radiator 452 is the y direction. The length directions of the above two radiators can also be any other direction, which is not limited in the present application. At this time, since radiators in different directions provide detection signals in different directions, when the transceiver processes the received signals, it can detect the spatial distance of the target to be detected, thereby improving the accuracy of the detection.

[0204] In some embodiments, the first radiator is used to operate as a radiator of the first antenna, and the second radiator is used to operate as a radiator of the second antenna, wherein the resonant frequency bands of the first radiator and the second radiator at least partially overlap. For example, the first antenna and / or the second antenna are used to support at least one of the GPS-L1 band, the LB band, the MHB band, the Wi-Fi 2.4G band, the Wi-Fi 5G band, the N28 band, the N40 band, the N41 band, the N78 band, the N79 band, and the ISM band.

[0205] Optionally, the resonant frequency bands of the first radiator and the second radiator may include at least part of a low band (LB) (698MHz-960MHz), a middle band (MB) (1710MHz-2170MHz) and a high band (HB) (2300MHz-2690MHz).

[0206] In this way, by making the resonant frequency bands of the first radiator and the second radiator at least partially overlap, the second radiator can receive part of the signal emitted by the first radiator, thereby improving the sensitivity of distance detection to the target to be detected based on the isolation information that changes with the distance of the target to be detected.

[0207] Optionally, the first antenna and / or the second antenna may be in the form of an antenna based on a flexible printed circuit (FPC), an antenna based on laser direct structuring (LDS), or a microstrip disk antenna (MDA). The antenna structure provided in the embodiment of the present application includes a wire antenna, a dipole antenna, a patch antenna, a planar inverted-Fantenna (PIFA), etc., and the embodiment of the present application does not limit this.

[0208] In some embodiments, the radio frequency chip assembly can couple multiple couplers to improve the sensitivity of detecting the distance of the target to be detected.

[0209] like Fig. 9 As shown, Fig. 9 is a schematic diagram of the structure of another radio frequency chip assembly provided in an embodiment of the present application. Figure 3 , Fig. 9The difference is that the RF chip assembly further includes a third coupler 340 and a third radiator 353, the third coupler 340 is coupled to the second coupler 330, and the third radiator 353 is coupled to the third coupler 340. At this time, the coupler assembly may include a first coupler 320, a second coupler 330, and a third coupler 340. The connection method of the third coupler 340 is similar to that of the second coupler 330. The specific structure and function of the third coupler 340 and the third radiator 353 can refer to the above description of the second coupler 330 and the second radiator 352, which will not be repeated here.

[0210] Combine the following Figures 15 to 17 The electronic device provided by the present application is described.

[0211] It should be understood that the electronic device provided in the present application can be a device that provides voice and / or data connectivity to users, and can be used to connect people, objects and machines, such as handheld devices with wireless connection functions, vehicle-mounted devices, etc. The electronic devices in the embodiments of the present application can be, for example, mobile phones, tablet computers, laptop computers, PDAs, mobile Internet devices (MID), wearable devices, virtual reality (VR) devices, augmented reality (AR) devices, wireless terminals in industrial control, wireless terminals in self-driving, wireless terminals in remote medical surgery, wireless terminals in smart grids, wireless terminals in transportation safety, wireless terminals in smart cities, wireless terminals in smart homes, etc.

[0212] Specifically, Fig.15 As shown, the electronic device 10 may include: a cover 13, a display screen / module (display) 15, a printed circuit board (PCB) 17, a middle frame (middle frame) 19 and a rear cover (rear cover) 21. It should be understood that in some embodiments, the cover 13 may be a glass cover, or may be replaced by a cover made of other materials, such as a PET (Polyethylene terephthalate) material cover.

[0213] The cover plate 13 may be disposed closely to the display module 15 , and may be mainly used to protect the display module 15 and prevent dust.

[0214] In one embodiment, the display module 15 may include a liquid crystal display panel (LCD), a light emitting diode (LED) display panel or an organic light emitting semiconductor (OLED) display panel, etc., but the embodiment of the present application does not limit this.

[0215] The middle frame 19 mainly supports the entire device. Fig.14 It is shown that PCB17 is arranged between the middle frame 19 and the back cover 21. It should be understood that in one embodiment, PCB17 can also be arranged between the middle frame 19 and the display module 15, and the embodiment of the present application does not limit this. Among them, the printed circuit board PCB17 can adopt a flame retardant material (FR-4) dielectric board, a Rogers dielectric board, a mixed dielectric board of Rogers and FR-4, and so on. Here, FR-4 is a code for a grade of flame retardant material, and the Rogers dielectric board is a high-frequency board. Electronic components, such as radio frequency chips, etc. are carried on PCB17. In one embodiment, a metal layer can be provided on the printed circuit board PCB17. The metal layer can be used for grounding the electronic components carried on the printed circuit board PCB17, and can also be used for grounding other components, such as bracket antennas, frame antennas, etc. The metal layer can be called a floor, a grounding plate, or a grounding layer. In one embodiment, the metal layer can be formed by etching metal on the surface of any layer of the dielectric board in PCB17. In one embodiment, the metal layer for grounding can be provided on the side of the printed circuit board PCB17 close to the middle frame 19. In one embodiment, the edge of the printed circuit board PCB17 can be regarded as the edge of its grounding layer. In one embodiment, the metal middle frame 19 can also be used for grounding the above components. The electronic device 10 can also have other floors / grounding plates / grounding layers, as described above, which will not be repeated here.

[0216] Due to the compactness of the interior of the electronic device, a floor / grounding plate / grounding layer is usually provided in the internal space 0-2 mm away from the inner surface of the frame (for example, a printed circuit board, a middle frame, a metal layer of a screen, a battery, etc. can all be regarded as part of the floor). In one embodiment, a medium is filled between the frame and the floor, and the inner surface contour of the filling medium and the length and width of the rectangle enclosed by the medium can be simply regarded as the length and width of the floor; the length and width of the rectangle enclosed by the contour formed by superimposing all the conductive parts inside the frame can also be regarded as the length and width of the floor.

[0217] The electronic device 10 may further include a battery (not shown). The battery may be disposed between the middle frame 19 and the back cover 21, or between the middle frame 19 and the display module 15, and the embodiment of the present application does not limit this. In some embodiments, the PCB 17 is divided into a main board and a sub-board, and the battery may be disposed between the main board and the sub-board, wherein the main board may be disposed between the middle frame 19 and the upper edge of the battery, and the sub-board may be disposed between the middle frame 19 and the lower edge of the battery.

[0218] The electronic device 10 may further include a frame 11, which may be formed of a conductive material such as metal. The frame 11 may be disposed between the display screen 15 and the back cover 21 and extend circumferentially around the periphery of the electronic device 10. The frame 11 may have four sides surrounding the display screen 15 to help fix the display screen 15.

[0219] In one implementation, the frame 11 made of a conductive material can be directly used as a conductive frame of the electronic device 10, for example, forming the appearance of a metal frame, suitable for a metal industrial design (ID). In one implementation, the outer surface of the frame 11 can be a conductive material, such as a metal material, to form the appearance of a metal frame. In these implementations, the conductive portion of the frame 11 can be used as an antenna radiator of the electronic device 10.

[0220] In another implementation, the outer surface of the frame 11 can also be a non-conductive material, such as plastic, to form the appearance of a non-metallic frame, suitable for non-metallic ID. In one implementation, the inner surface of the frame 11 may include a conductive material, such as a metal material. In this implementation, the conductive portion of the frame 11 can be used as a radiator of the antenna of the electronic device 10. It should be understood that the radiator (or book, the conductive material on the inner surface) disposed on the inner surface of the frame 11 is arranged in contact with the non-conductive material of the frame 11 to facilitate antenna radiation, and the conductive material and the non-conductive material should be regarded as part of the frame 11.

[0221] The middle frame 19 may include a border 11. The middle frame 19 including the border 11 is an integral part, which can support the electronic devices in the whole machine. The cover plate 13 and the back cover 21 are respectively covered along the upper and lower edges of the border to form a shell or housing (housing) of the electronic device. In one embodiment, the cover plate 13, the back cover 21, the border 11 and / or the middle frame 19 can be collectively referred to as the shell or housing of the electronic device 10. It should be understood that "shell or housing" can be used to refer to part or all of any one of the cover plate 13, the back cover 21, the border 11 or the middle frame 19, or to refer to part or all of any combination of the cover plate 13, the back cover 21, the border 11 or the middle frame 19.

[0222] The frame 11 on the middle frame 19 can at least partially serve as an antenna radiator to receive / transmit radio frequency signals. There can be a gap between this portion of the frame serving as the radiator and other portions of the middle frame 19, thereby ensuring that the antenna radiator has a good radiation environment. In one embodiment, the middle frame 19 can be provided with an aperture at this portion of the frame serving as the radiator to facilitate antenna radiation.

[0223] Alternatively, the frame 11 may not be considered as a part of the middle frame 19. In one embodiment, the frame 11 may be connected to the middle frame 19 and formed integrally. In another embodiment, the frame 11 may include a protrusion extending inward to be connected to the middle frame 19, for example, by means of a shrapnel, a screw, welding, etc. The protrusion of the frame 11 may also be used to receive a feed signal, so that at least a portion of the frame 11 serves as a radiator of the antenna to receive / transmit radio frequency signals. There may be a gap 42 between this portion of the frame that serves as a radiator and the middle frame 30, thereby ensuring that the antenna radiator has a good radiation environment, so that the antenna has a good signal transmission function.

[0224] The back cover 21 may be a back cover made of metal material; or a back cover made of non-conductive material, such as a glass back cover, a plastic back cover, or a back cover made of both conductive and non-conductive materials. In one embodiment, the back cover 21 made of conductive material may replace the middle frame 19 and be integrated with the frame 11 to support the electronic components in the whole device.

[0225] In one embodiment, the middle frame 19 and / or the conductive parts in the back cover 21 can be used as the reference ground of the electronic device 10, wherein the frame 11, PCB 17, etc. of the electronic device can be grounded through electrical connection with the middle frame.

[0226] The antenna of the electronic device 10 can also be arranged in the frame 11. When the frame 11 of the electronic device 10 is a non-conductive material, the antenna radiator can be located in the electronic device 10 and arranged along the frame 11. For example, the antenna radiator is arranged close to the frame 11 to minimize the volume occupied by the antenna radiator and to be closer to the outside of the electronic device 10 to achieve better signal transmission effect. It should be noted that the antenna radiator is arranged close to the frame 11 means that the antenna radiator can be arranged close to the frame 11, or it can be arranged close to the frame 11, for example, there can be a certain small gap between the antenna radiator and the frame 11.

[0227] The antenna of the electronic device 10 may also be disposed in the housing, such as a bracket antenna, a millimeter wave antenna, etc. ( Fig.15). The clearance of the antenna disposed in the housing can be obtained by the slits / openings on any one of the middle frame, and / or the frame, and / or the back cover, and / or the display screen, or by the non-conductive gap / aperture formed between any of them. The clearance setting of the antenna can ensure the radiation performance of the antenna. It should be understood that the clearance of the antenna can be a non-conductive area formed by any conductive component in the electronic device 10, and the antenna radiates signals to the external space through the non-conductive area. In one embodiment, the antenna 40 can be in the form of an antenna based on a flexible printed circuit (FPC), an antenna based on laser direct structuring (LDS), or a microstrip disk antenna (MDA). In one embodiment, the antenna can also be a transparent structure embedded in the screen of the electronic device 10, so that the antenna is a transparent antenna unit embedded in the screen of the electronic device 10.

[0228] Fig.15 Only some components of the electronic device 10 are schematically shown, and the actual shapes, sizes and structures of these components are not subject to the present invention. Fig.15 limited.

[0229] It should be understood that in the embodiments of the present application, the surface where the display screen of the electronic device is located can be considered as the front side, the surface where the back cover is located can be considered as the back side, and the surface where the frame is located can be considered as the side side.

[0230] It should be understood that in the embodiments of the present application, it is considered that when a user holds the electronic device (for example, the user holds the electronic device and unlocks it, or for example, when the user holds the electronic device vertically and faces the screen), the orientation of the electronic device has a top, a bottom, a left side, and a right side.

[0231] Fig.16 It is a partial schematic diagram of an electronic device 10 provided in an embodiment of the present application.

[0232] like Fig.16 As shown, the electronic device 10 provided in the embodiment of the present application includes a housing, wherein the housing includes a frame 11.

[0233] The main board 1 is arranged in the housing.

[0234] The first radiator 51 and the second radiator 52. It should be understood that the first radiator and the second radiator can be composed of the conductive part of the frame of the electronic device, and either of the first radiator and the second radiator can also be arranged on the mainboard 1 or attached to the shell or be a part of the shell. And the first radiator belongs to the first antenna, and the second radiator belongs to the second antenna.

[0235] It should be understood that being attached to the shell can be understood as being closely attached to the inner surface of the frame or the back cover, including being fixed to the inner surface of the frame or the back cover, and can also be a part of the frame or the back cover, all of which are attached to the shell.

[0236] In some embodiments, the first radiator is provided with a first feeding port, the second radiator is provided with a second feeding port, the first feeding port and the first load port are coupled and connected, and the second feeding port and the second load port are coupled and connected.

[0237] like Fig.16 As shown, the first radiator 51 is provided with a first feeding port 61 , and the second radiator 52 is provided with a second feeding port 62 . The first radiator 51 and the second radiator 52 are connected to the coupler assembly through the feeding ports.

[0238] Optionally, the antenna (eg, the first antenna) further includes a feeding port. The feeding port may be provided on the mainboard 1, contacting and electrically connected to the radiator. The feeding port is coupled to the radiator (eg, the first radiator) to feed an electrical signal to the radiator.

[0239] In the embodiment of the present application, the antenna may be an antenna module. The antenna includes at least a radio frequency transceiver chip, at least one matching circuit, at least one feed port, and at least one radiator. The first radiator and the second radiator in the embodiment of the present application may belong to the same antenna or to different antennas.

[0240] In the embodiment of the present application, the frame 11 can be composed of multiple mutually insulated metal segments. Among them, the space between two adjacent metal segments is filled with insulating material to insulate the two adjacent metal segments from each other. The present application does not specifically limit the length of each metal segment. The length of the metal segment can be designed according to the frequency of the received and transmitted frequency band. Each metal segment can serve as a radiator (e.g., a first radiator). Optionally, as Fig.15 As shown, the radiator in the present application can be a bent metal segment, such as the first radiator 51, and at least a portion of the first radiator 51 and at least a portion of the second radiator 352 have the same direction. In this way, the first radiator 51 has signal detection in both bending directions, that is, the x direction and the y direction, covering a wider range of directions.

[0241] It should be understood that the resonant frequency band of the radiator includes but is not limited to millimeter wave signals, submillimeter wave signals, terahertz signals, 2.4GHz and 5.0GHz WIFI signals, 900MHz, 1800MHz and 1900MHz and other frequency bands of GSM signals, GPS signals, Bluetooth signals, etc.

[0242] The electronic device 10 provided in the embodiment of the present application further includes a radio frequency chip assembly, wherein the radio frequency chip assembly is arranged in the housing, and the radio frequency chip assembly includes a transceiver 100 and a coupler assembly (such as Fig.10 ). The coupler component includes an input port, a first output port, a first load port, and a second load port. Optionally, the coupler component includes a second output port. Specifically, the coupler component includes a first coupler 20 and a second coupler 30. The transceiver includes a transmitting port and a receiving port. The coupler component is coupled to the transceiver 100 via the input port and the first output port. Specifically, the input port of the coupler component is coupled to the transmitting port of the transceiver 100, and the first output port of the coupler component is coupled to the receiving port of the transceiver 100. The first load port is coupled to the first radiator, and the second load port is coupled to the second radiator, wherein the first load port and the second load port are coupled, and the first output port and the second load port are coupled.

[0243] In some embodiments, the coupler assembly includes a first coupler and a second coupler, the first coupler includes an input port, a first load port, a third port, and a fourth port, and the second coupler includes a fifth port, a second load port, a seventh port, and an eighth port. The seventh port and the second load port are coupled, the eighth port and the second load port are isolated, the first output port is one of the seventh port and the eighth port, the third port of the first coupler is coupled and connected to the fifth port of the second coupler, the input port and the fourth port are coupled, and the first load port and the fourth port are isolated.

[0244] In some embodiments, the coupler component includes a second output port, the receiving port of the transceiver includes a first receiving port and a second receiving port, and the coupler component is coupled to the transceiver via an input port, a first output port, and a second output port, wherein the first output port and the first receiving port are coupled, the second output port and the second receiving port are coupled, and the second output port is a fourth port.

[0245] In some embodiments, the first radiator is provided with a first feeding port, the second radiator is provided with a second feeding port, the first feeding port and the first load port are coupled and connected, and the second feeding port and the second load port are coupled and connected.

[0246] In some embodiments, the length of the first radiator is L1, the length of the second radiator is L2, and the distance N between the first radiator and the second radiator satisfies: N≤L1×3, and / or, N≤L2×3. In some embodiments, the first radiator is also used to operate as a radiator of the first antenna, and the second radiator is also used to operate as a radiator of the second antenna, wherein the resonance frequency bands of the first radiator and the second radiator at least partially overlap.

[0247] In some embodiments, at least a portion of the first radiator and the second radiator have the same length direction.

[0248] The description of the coupler assembly in the embodiment of the present application can refer to the above Figure 3-Figure 11 The description of the coupler assembly in the present application will not be repeated here.

[0249] Specifically, the transceiver 100 is used to send a first signal to the coupler assembly. The first coupler 20 is used to output a first detection signal according to the first signal, the first radiator 51 is used to send the first detection signal and receive a first reflected signal returned from the target to be detected, the first coupler 20 is also used to sample the first reflected signal to output a first sampling signal, the second coupler 30 is used to output a second detection signal according to the first sampling signal, the second radiator 52 is used to send the second detection signal and receive a signal returned from the target to be detected, and the second coupler 30 is also used to output a sensing signal according to the signal received by the second radiator 52. The transceiver 100 is also used to perform distance detection on the target to be detected according to the sensing signal.

[0250] In some embodiments, the second radiator is further used to receive the first detection signal sent by the first radiator.

[0251] In some embodiments, the transceiver 100 is further configured to adjust the transmission power according to the distance detection result of the target to be detected.

[0252] In some embodiments, at least one of the first radiator and the second radiator is provided with a grounding point, and the grounding point is coupled to the floor through a device, or is directly coupled to the floor.

[0253] In some embodiments, Fig.15 As shown, the first radiator 51 and the second radiator 52 can be grounded through an adjustable device. For example, through a capacitive device and / or an inductive device, or a switch device. Specifically, the grounding point can be set at Fig.14 The middle frame 19 shown, for example, the connecting ribs on the middle frame 19. In the embodiment of the present application, the radiator, the connecting ribs and the floor can be integrally formed, and the present application does not limit this.

[0254] Specifically, the specific structure and functions included in the electronic device 10 provided in the embodiment of the present application can refer to the above description of the radio frequency chip component, which will not be repeated here.

[0255] Fig.17 FIG. 1 is a partial schematic diagram of another electronic device 10 provided in an embodiment of the present application. Fig.17 As shown, the electronic device 10 provided in the embodiment of the present application includes a radio frequency chip 100 and a second coupler 30. That is, the electronic device 10 provided in the embodiment of the present application and Fig.16 In comparison, Fig.16 The transceiver 100 in the radio frequency chip assembly is integrally packaged with the first coupler 20. It should be understood that the components in the radio frequency chip assembly of the present application can realize the functions of the above embodiments through any packaging combination.

[0256] Fig.18 It is a partial schematic diagram of another electronic device 10 provided in an embodiment of the present application.

[0257] like Fig.18 As shown, compared to Fig.16 The electronic device shown, the electronic device 10 provided in the embodiment of the present application, comprises a first radiator 51 and a second radiator 53. The second radiator belongs to the second antenna, the second radiator is a suspended antenna radiator, and the second antenna is a suspended antenna.

[0258] It should be understood that the suspension antenna can be an antenna formed by pasting a thin metal conductor to a grounded dielectric substrate, and the suspension antenna is separated from the mainboard of the terminal device, which can improve the signal strength. Optionally, the suspension antenna is arranged on the housing.

[0259] In existing capacitive distance sensors, it is usually necessary to generate an electric field of fixed frequency through capacitance, and judge the distance of the object based on the change of the equivalent dielectric when the object to be detected approaches the sensor. Since the capacitive sensor will cause the load to decrease when grounded, that is, the induced current is directed to the floor, causing the sensor to be unable to obtain a valid signal. Therefore, capacitive sensors are only suitable for suspended antennas and cannot be used with grounded antennas. In the embodiment of the present application, the distance of the target to be detected is judged by the change of the signal load impedance through the emission and reception of the radiator, which can be applicable to different types of antennas, such as grounded antennas, suspended antennas, etc. Therefore, the radiator in the embodiment of the present application can be grounded through an adjustable device, while not affecting the distance detection of the target to be detected, thereby improving the compatibility with the antenna.

[0260] Fig.19 It is a flow chart of a distance detection method provided in an embodiment of the present application.

[0261] It should be understood that the method can be applied to any of the radio frequency chip components or electronic devices 10 described in the above embodiments.

[0262] S1910, the transceiver sends a first signal to the first coupler.

[0263] In one embodiment, the transceiver is a radio frequency chip, the first coupler is a bidirectional coupler, and the transceiver is coupled to the first coupler.

[0264] S1920, the first coupler outputs a first detection signal according to the first signal.

[0265] S1930, the first radiator sends a first detection signal and receives a first reflected signal returned from the target to be detected.

[0266] In one embodiment, the first radiator is coupled to the first coupler.

[0267] It should be understood that as the distance of the target to be detected changes, the load impedance of the first reflected signal will also change accordingly, that is, parameters such as the amplitude and phase of the signal will change.

[0268] S1940, the first coupler samples the first reflected signal to output a first sampling signal.

[0269] S1950: The second coupler outputs a second detection signal according to the first sampling signal output by the first coupler.

[0270] In one embodiment, the first coupler is coupled to the second coupler, and the second coupler is a bidirectional coupler.

[0271] S1960, the second radiator sends a second detection signal and receives a signal returned from the target to be detected.

[0272] In one embodiment, the second radiator is coupled to the second coupler, and the second coupler is a bidirectional coupler.

[0273] S1970: The second coupler outputs a sensing signal according to the signal received by the second radiator.

[0274] S1980: The transceiver performs distance detection on the target to be detected according to the sensing signal.

[0275] In one embodiment, the transceiver may determine the distance to the target to be detected according to the load impedance change of the received signal.

[0276] In one embodiment, the method further includes, the transceiver adjusts the transmission power according to the distance detection result of the target to be detected. Specifically, when the distance of the target to be detected is less than the first threshold, the transmission power is adjusted from the first value to the second value so that the SAR generated by the radiator meets the regulations. For example, when the first threshold is set to 5 cm, if the distance of the target to be detected is greater than 5 cm, no power adjustment is performed, and if the distance of the target to be detected is less than 5 cm, the transmission power of the transceiver is reduced. It should be understood that in the embodiment of the present application, the first threshold, the first value and the second value are all preset values, which can be adjusted according to different production or design requirements, and the embodiment of the present application does not limit this.

[0277] In one embodiment, when the first coupler and the second coupler are coupled to the transceiver, the method further includes the first coupler outputting a first reference signal to the transceiver, the first reference signal including a second sampling signal obtained by the first coupler sampling the first signal. Specifically, the transceiver performs distance detection on the target to be detected based on the first reference signal and the sensing signal.

[0278] Optionally, when the second coupler is coupled to the transceiver, the method further includes: the second coupler outputs a second reference signal to the transceiver, the second reference signal including a signal output by the second coupler according to a third sampling signal obtained by sampling the first signal by the first coupler. The transceiver performs distance detection on the target to be detected according to the second reference signal and the sensing signal.

[0279] In one embodiment, the second radiator is also used to receive the first detection signal sent by the first radiator. It should be understood that by adjusting the positions of the first radiator and the second radiator, the second radiator can be used to receive the first detection signal sent by the first radiator, and as the distance of the target to be detected changes, the degree of interference will also change accordingly, that is, the isolation will change, so that after the second radiator receives the first detection signal sent by the first radiator, it can further judge the distance of the target to be detected according to the change of signal isolation, thereby improving the sensitivity of detecting the distance of the target to be detected.

[0280] In one embodiment, the first radiator is further configured to operate as a radiator of the first antenna, and the second radiator is further configured to operate as a radiator of the second antenna, wherein the resonance frequency bands of the first radiator and the second radiator at least partially overlap.

[0281] In one embodiment, the RF chip assembly further includes a second switch and a third switch. The method further includes that when the first coupler is coupled to the transceiver through the second switch and the third switch, the transceiver is used to send a second signal to the first coupler, the first coupler is used to sample the second signal to output a fourth sampling signal, and the transceiver is further used to adjust the transmission power according to the fourth sampling signal. When the first coupler is coupled to the second coupler through the second switch, and the second coupler is coupled to the transceiver through the third switch, the transceiver is used to send the first signal to the first coupler.

[0282] The specific steps and designed structure of the above method can refer to any RF chip assembly or electronic device 10 described in the above embodiments, which will not be described in detail here.

[0283] Those of ordinary skill in the art will appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of this application.

[0284] In the several embodiments provided in the present application, it should be understood that the disclosed systems, devices and methods can be implemented in other ways. For example, the device embodiments described above are only schematic. For example, the division of the units is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or units, which can be electrical, mechanical or other forms.

[0285] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0286] In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit.

[0287] If the functions are implemented in the form of software functional units and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application can be essentially or partly embodied in the form of a software product that contributes to the prior art. The computer software product is stored in a storage medium and includes several instructions for a computer device (which can be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the methods described in each embodiment of the present application. The aforementioned storage medium includes: various media that can store program codes, such as a USB flash drive, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk.

[0288] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A radio frequency chip assembly, characterized in that: include: A transceiver (310) and a coupler component, wherein the coupler component comprises an input port (321), a first output port (333), a first load port (322) and a second load port (332); the transceiver (310) comprises a transmitting port (311) and a receiving port (312, 313); the input port (321) and the transmitting port (311) are coupled and connected; the first output port (333) and the receiving port (312) are coupled and connected; the first load port (322) is used to couple a first radiator (351); the second load port (332) is used to couple a second radiator (352); wherein the first load port (322) and the second load port (332) are coupled; and the first output port (333) and the second load port (332) are coupled.

2. The radio frequency chip assembly according to claim 1, characterized in that: The coupler assembly comprises a first coupler (320) and a second coupler (330), wherein the first coupler (320) comprises the input port (321), the first load port (322), a third port (323) and a fourth port (324), and the second coupler (330) comprises a fifth port (331), the second load port (332), a seventh port (333) and an eighth port (334), wherein the seventh port (333) and the second load port (332) are coupled, and the eighth port (334) and the second load port (332) are isolated, and the first output port is one of the seventh port (333) and the eighth port (334), and the third port (323) of the first coupler (320) is coupled to the fifth port (331) of the second coupler (330), and the input port (321) and the fourth port (324) are coupled, and the first load port (322) and the fourth port (324) are isolated.

3. The radio frequency chip assembly according to claim 2, characterized in that: The coupler component includes a second output port (324), and the receiving port (312, 313) of the transceiver includes a first receiving port (312) and a second receiving port (313), wherein the first output port (333) and the first receiving port (312) are coupled and connected, the second output port (324) and the second receiving port (313) are coupled and connected, and the second output port (324) is the fourth port (324).

4. The radio frequency chip assembly according to claim 2 or 3, characterized in that: When the first output port (333) is the seventh port (333), the eighth port (334) is coupled to the second load port (332).

5. The radio frequency chip assembly according to any one of claims 2 to 4, characterized in that: When the coupler component is coupled to the transceiver via the input port and the first output port, a first switch (561) is further provided on the connection circuit of the first coupler and the second coupler, the first switch (561) having a first end, a second end and a third end, the first end and the second end being coupled to the third port and the fourth port of the first coupler respectively, and the third end being coupled to the fifth port of the second coupler.

6. The radio frequency chip assembly according to claim 5, characterized in that: The third end of the first switch (561) is also coupled to a second switch (562), and the receiving port of the transceiver is also coupled to a third switch (563). The third end of the first switch (561) is optionally coupled to the transceiver via the second switch (562) and the third switch (563); or The third end of the first switch (561) is optionally coupled to the fifth port of the second coupler through the second switch (562), and the seventh port of the second coupler is optionally coupled to the transceiver through the third switch (563).

7. The radio frequency chip assembly according to any one of claims 1 to 6, characterized in that: The length of the first radiator is L1, the length of the second radiator is L2, and a distance N between the first radiator and the second radiator satisfies: N≤L1×3, and / or, N≤L2×3.

8. The radio frequency chip assembly according to any one of claims 1 to 7, characterized in that: The first radiator and the second radiator have at least a portion of the same length direction.

9. The radio frequency chip assembly according to any one of claims 1 to 8, characterized in that: The first radiator is used to operate as a radiator of a first antenna, and the second radiator is used to operate as a radiator of a second antenna, wherein resonance frequency bands of the first radiator and the second radiator at least partially overlap.

10. A distance detection method, characterized in that: Applied to a radio frequency chip assembly, the radio frequency chip assembly includes a transceiver, a first coupler, a second coupler, a first radiator and a second radiator, the method includes: The transceiver sends a first signal to the first coupler, the first coupler outputs a first detection signal according to the first signal, the first radiator sends the first detection signal and receives a first reflected signal returned from a target to be detected, the first coupler samples the first reflected signal to output a first sampling signal, the second coupler outputs a second detection signal according to the first sampling signal output by the first coupler, the second radiator sends the second detection signal and receives a signal returned from the target to be detected, and the second coupler outputs a sensing signal according to the signal received by the second radiator; The transceiver performs distance detection on the target to be detected according to the sensing signal.

11. The method according to claim 10, characterized in that The method further comprises: The first coupler outputs a first reference signal to the transceiver, wherein the first reference signal includes a second sampling signal obtained by sampling the first signal by the first coupler; The transceiver performs distance detection on the target to be detected according to the first reference signal and the sensing signal.

12. The method according to claim 10, characterized in that The method further comprises: The second coupler outputs a second reference signal to the transceiver, the second reference signal comprising a signal output by the second coupler according to a third sampling signal obtained by sampling the first signal by the first coupler; The transceiver performs distance detection on the target to be detected according to the second reference signal and the sensing signal.

13. The method according to any one of claims 10 to 12, characterized in that: The second radiator is further used to receive the first detection signal sent by the first radiator.

14. The method according to claim 13, characterized in that The length of the first radiator is L1, the length of the second radiator is L2, and a distance N between the first radiator and the second radiator satisfies: N≤L1×3, and / or, N≤L2×3.

15. The method according to any one of claims 10 to 14, characterized in that The radio frequency chip assembly further includes a second switch and a third switch, and the method further includes: When the first coupler is coupled to the transceiver through the second switch and the third switch, the transceiver is used to send a second signal to the first coupler, the first coupler is used to sample the second signal to output a fourth sampling signal, and the transceiver is further used to adjust the transmission power according to the fourth sampling signal; When the first coupler is coupled to the second coupler through the second switch, and the second coupler is coupled to the transceiver through the third switch, the transceiver is used to send the first signal to the first coupler.

16. The method according to any one of claims 10 to 15, characterized in that The method further comprises: The transceiver adjusts the transmission power according to the distance detection result of the target to be detected.

17. An electronic device, characterized in that: include: case; A mainboard, the mainboard being arranged in the housing; A first radiator and a second radiator, wherein the first radiator and / or the second radiator is arranged on the mainboard or attached to the housing or is a part of the housing; And the radio frequency chip assembly according to any one of claims 1 to 9, wherein the radio frequency chip assembly is arranged in the shell.

18. The electronic device according to claim 17, characterized in that: The first radiator is provided with a first feeding port, the second radiator is provided with a second feeding port, the first feeding port is coupled to the first load port, and the second feeding port is coupled to the second load port.

19. The electronic device according to claim 17 or 18, characterized in that: The length of the first radiator is L1, the length of the second radiator is L2, and a distance N between the first radiator and the second radiator satisfies: N≤L1×3, and / or, N≤L2×3.

20. The electronic device according to any one of claims 17 to 19, characterized in that: At least one of the first radiator and the second radiator is provided with a grounding point, and the grounding point is coupled to the floor through a device, or is directly coupled to the floor.

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