Heat dissipation circuit board and manufacturing method thereof

Abstract

The application provides a manufacturing method of a heat dissipation circuit board, comprising the following steps: arranging a first slot on one side of a first circuit substrate, wherein the first circuit substrate comprises a first substrate layer and a plurality of first conductive circuits arranged on one side of the first substrate layer, a first slot is arranged on the first substrate layer, and the first slot corresponds to the first slot; arranging a first cooling medium in the first slot; and arranging a first insulating protective layer on the plurality of first conductive circuits, and part of the first insulating protective layer fills the first slot to form a first insulating piece, so that the first cooling medium and the first conductive circuits adjacent to the first cooling medium are insulated. In addition, the application also provides a heat dissipation circuit board.

Description

TECHNICAL FIELD

[0001] The present application belongs to the field of circuit board, and particularly relates to a heat dissipation circuit board and a manufacturing method thereof. BACKGROUND

[0002] With the development of science and technology, consumer electronics products are rapidly evolving towards functional diversification and intelligence. Products need to support higher screen refresh rates, faster wireless transmission rates, and more powerful data processing capabilities, etc., which all require chips and circuits to work under high load conditions, generating a large amount of heat. At the same time, consumer electronics products are also designed to be thinner and lighter, with higher density of internal components. This exacerbates the difficulty of heat dissipation in limited space.

[0003] The heat dissipation effect of traditional circuit boards and their components is poor, which cannot effectively take away the generated heat, resulting in continuous accumulation of the working temperature of chips and circuits, seriously affecting the performance and stability of the products. When the temperature is too high, it may cause aging and failure of components, and even safety accidents such as explosion. SUMMARY

[0004] To solve the above problems of the prior art, the present application provides a manufacturing method of a heat dissipation circuit board.

[0005] In addition, the present application also provides a heat dissipation circuit board.

[0006] A manufacturing method of a heat dissipation circuit board, comprising the steps of:

[0007] A first slot is provided on one side of a first circuit substrate, the first circuit substrate comprising a first substrate layer and a plurality of first conductive lines arranged at intervals on one side of the first substrate layer, a first slot being formed between each adjacent two first conductive lines, the first slot being provided on the first substrate layer, and the first slot corresponding to the first slot;

[0008] A first cooling medium is provided in the first slot, and

[0009] A first insulating protective layer is provided on the plurality of first conductive lines, the first insulating protective layer partially filling the first slot to form a first insulating member, the first insulating member isolating the first cooling medium and the first conductive line adjacent to the first cooling medium.

[0010] In some possible embodiments, the first circuit substrate further comprises a plurality of second conductive lines arranged at intervals on the other side of the first substrate layer, a second slot being formed between each adjacent two second conductive lines, and the manufacturing method further comprises the steps of:

[0011] a second slot is formed on the other side of the first circuit substrate, the second slot is formed on the other side of the first substrate layer and is arranged correspondingly to the second wire slot;

[0012] a second cooling medium is arranged in the second slot, and

[0013] a second insulating protective layer is arranged on the plurality of second conductive lines, the second insulating protective layer partially fills the second wire slot to form a second insulating member, and the second insulating member insulates the second cooling medium and the second conductive lines adjacent to the second cooling medium.

[0014] In some possible embodiments, the second wire slot is in communication with the first slot.

[0015] In some possible embodiments, the first circuit substrate further comprises a plurality of second conductive lines arranged on the other side of the first substrate layer, and each two adjacent second conductive lines form a second wire slot, and the manufacturing method further comprises the steps of:

[0016] a second slot is formed on the other side of the first circuit substrate, the second slot is formed on the other side of the first substrate layer and is arranged correspondingly to the second wire slot;

[0017] a second cooling medium is arranged in the second slot:

[0018] an insulating adhesive layer is arranged on the plurality of second conductive lines, the insulating adhesive layer partially fills the second wire slot to form a third insulating member, and the third insulating member insulates the second cooling medium and the second conductive lines adjacent to the second cooling medium.

[0019] a second circuit substrate is arranged on the insulating adhesive layer, the second circuit substrate comprises a second substrate layer and a plurality of third conductive lines arranged on the second substrate layer, the second substrate layer is arranged between the insulating adhesive layer and the plurality of third conductive lines, and each two adjacent third conductive lines form a third wire slot, and the third wire slot is arranged correspondingly to the second wire slot;

[0020] a third slot is formed on the second substrate layer, and the third slot is arranged correspondingly to the third wire slot;

[0021] a third cooling medium is arranged in the third slot, and

[0022] a third insulating protective layer is arranged on the plurality of third conductive lines, the third insulating protective layer partially fills the third wire slot to form a fourth insulating member, and the fourth insulating member insulates the third cooling medium and the third conductive lines adjacent to the third cooling medium.

[0023] In some possible implementations, the third slot is in communication with the second slot.

[0024] In some possible implementations, the method further comprises the steps of:

[0025] An interlayer conductive body is disposed on the first circuit substrate and the second circuit substrate, and electrically connected to the first conductive circuit, the second conductive circuit, and the third conductive circuit.

[0026] A heat dissipation circuit board, comprising:

[0027] A first circuit substrate, one side of the first circuit substrate is provided with a first slot, the first circuit substrate comprises a first base material layer and a plurality of first conductive circuits arranged at one side of the first base material layer in a spaced manner, a first slot is formed between each two adjacent first conductive circuits, the first slot is arranged on the first base material layer, and the first slot corresponds to the first slot;

[0028] A first cooling medium, the first cooling medium is arranged in the first slot, and

[0029] A first insulating protective layer, the first insulating protective layer is arranged on the plurality of first conductive circuits, and the first insulating protective layer partially fills the first slot to form a first insulating member, the first insulating member insulates the first cooling medium and the first conductive circuit adjacent to the first cooling medium.

[0030] In some possible implementations, the first circuit substrate further comprises a plurality of second conductive circuits arranged at the other side of the first base material layer in a spaced manner, a second slot is formed between each two adjacent second conductive circuits, the other side of the first base material layer is provided with a second slot corresponding to the second slot, and the heat dissipation circuit board further comprises:

[0031] A second cooling medium, the second cooling medium is arranged in the second slot, and

[0032] A second insulating protective layer, the second insulating protective layer partially fills the second slot to form a second insulating member, the second insulating member insulates the second cooling medium and the second conductive circuit adjacent to the second cooling medium.

[0033] In some possible implementations, the first circuit substrate further comprises a plurality of second conductive circuits arranged at the other side of the first base material layer in a spaced manner, a second slot is formed between each two adjacent second conductive circuits, the other side of the first base material layer is provided with a second slot corresponding to the second slot, and the heat dissipation circuit board further comprises:

[0034] A second cooling medium, the second cooling medium is arranged in the second slot.

[0035] an insulating adhesive layer disposed on the plurality of second conductive lines, the insulating adhesive layer partially filling the second grooves to form a third insulating member, the third insulating member insulating the second cooling medium and the second conductive lines adjacent to the second cooling medium;

[0036] a second circuit substrate disposed on the insulating adhesive layer, the second circuit substrate comprising a second substrate layer and a plurality of third conductive lines disposed on the second substrate layer, the second substrate layer being disposed between the insulating adhesive layer and the plurality of third conductive lines, a third groove being formed between each adjacent two of the third conductive lines, the third groove corresponding to the second groove, the second substrate layer being provided with a third slot, the third slot corresponding to the third groove;

[0037] a third cooling medium disposed in the third slot;

[0038] a third insulating protective layer disposed on the plurality of third conductive lines, the third insulating protective layer partially filling the third grooves to form a fourth insulating member, the fourth insulating member insulating the third cooling medium and the third conductive lines adjacent to the third cooling medium.

[0039] In some possible embodiments, the second groove is in communication with the first slot, and the third slot is in communication with the second slot.

[0040] The heat dissipation circuit board provided by the above embodiments of the present application has the first cooling medium disposed in the first slot, which can absorb heat in the heat dissipation circuit board, thereby reducing heat accumulation in the heat dissipation circuit board, reducing the temperature rise speed and reducing the adverse effects on other electronic components. In addition, by arranging the first slot corresponding to the first groove, the first cooling medium and the first conductive line are arranged staggered, which is conducive to reducing the thickness of the heat dissipation circuit board. In addition, the first insulating protective layer partially fills the first groove to form a first insulating member, which insulates the first cooling medium and the adjacent first conductive line, which is conducive to improving the stability of the heat dissipation circuit board. BRIEF DESCRIPTION OF DRAWINGS

[0041] Figure 1 A cross-sectional view of the first single-sided copper-clad substrate provided by the first embodiment of the present application.

[0042] Figure 2 For etching Figure 1 A cross-sectional view of the first copper foil layer for forming the first conductive line.

[0043] Figure 3 ForFigure 2 A cross-sectional view of the first substrate layer with a first slot.

[0044] Figure 4 A cross-sectional view of the first substrate layer with a first slot. Figure 3 A cross-sectional view of the first slot with a first cooling medium.

[0045] Figure 5 A cross-sectional view of the first substrate layer with a first slot. Figure 4 A cross-sectional view of the first substrate layer with a first slot.

[0046] Figure 6 A cross-sectional view of the double-sided copper clad substrate according to the second embodiment of the present application.

[0047] Figure 7 A cross-sectional view of the second copper foil layer for etching. Figure 6 A cross-sectional view of the second copper foil layer for etching.

[0048] Figure 8 A cross-sectional view of the second substrate layer with a second slot. Figure 7 A cross-sectional view of the second substrate layer with a second slot.

[0049] Figure 9 A cross-sectional view of the second substrate layer with a second slot. Figure 8 A cross-sectional view of the second slot with a second cooling medium.

[0050] Figure 10 A cross-sectional view of the second slot with a second cooling medium. Figure 9 A plan view of the second slot with a second cooling medium.

[0051] Figure 11 A cross-sectional view of the second substrate layer with a second slot. Figure 9 A cross-sectional view of the second substrate layer with a second slot.

[0052] Figure 12 A cross-sectional view of the heat dissipation circuit board according to another embodiment of the present application.

[0053] Figure 13 A cross-sectional view of the second single-sided copper clad substrate according to the third embodiment of the present application.

[0054] Figure 14 A cross-sectional view of the third substrate layer with a third slot. Figure 13 A cross-sectional view of the third substrate layer with a third slot.

[0055] Figure 15 A cross-sectional view of the third slot with a third cooling medium. Figure 14 A cross-sectional view of the third slot with a third cooling medium.

[0056] Figure 16 A cross-sectional view of the third substrate layer with a third slot. Figure 15 A cross-sectional view of the third substrate layer with a third slot.

[0057] Figure 17 A cross-sectional schematic view of a heat dissipation circuit board is provided for another other embodiment of the present application.

[0058] Explanation of main element symbols

[0059]

[0060]

[0061] The following detailed description will further describe the present application in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0062] The technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments.

[0063] Referring to Figures 1 to 5 The first embodiment of the present application provides a manufacturing method of a first heat dissipation circuit board 100, comprising the following steps:

[0064] S100: Referring to Figure 1 A first single-sided copper-clad plate 10 is provided, which comprises a first copper foil layer 12 of a first base material layer 11. The first single-sided copper-clad plate 10 has a thickness direction A.

[0065] In the present embodiment, the material of the first base material layer 11 includes but is not limited to polyimide (PI), polyethylene terephthalate (PET), polyethylenenaphthalate two formic acid glycol ester (PEN), liquid crystal polymer (LCP), and modified polyimide (MPI).

[0066] Referring to Figures 6 to 10 The second embodiment of the present application provides a manufacturing method of a second heat dissipation circuit board 200. In the second embodiment of the present application, the first single-sided copper-clad plate 10 can also be replaced by a double-sided copper-clad substrate 25. The double-sided copper-clad substrate 25 comprises the single-sided copper-clad plate 10 and a second copper foil layer 13. The second copper foil layer 13 and the first copper foil layer 12 are respectively arranged on opposite sides of the first base material layer 11.

[0067] S101: Referring to Figure 2etching the first copper foil layer 12 to form a plurality of first conductive lines 121, the plurality of first conductive lines 121 being spaced apart, to obtain a first line substrate 123. A first line groove 122 is formed between each two adjacent first conductive lines 121, and part of the first substrate layer 11 is exposed in the first line groove 122.

[0068] In the present embodiment, the plurality of first conductive lines 121 can be power lines or impedance lines, etc. The first conductive lines 121 generate and accumulate heat when passing current.

[0069] In the second embodiment of the present application, please refer to Figure 7 etching the second copper foil layer 13 to form a plurality of second conductive lines 131, the plurality of second conductive lines 131 being spaced apart. A second line groove 132 is formed between each two adjacent second conductive lines 131, and part of the first substrate layer 11 is exposed in the second line groove 132. The second line groove 132 is substantially corresponding to the second line groove 132. That is, the plurality of first conductive lines 121 substantially one-to-one correspond to the plurality of second conductive lines 131.

[0070] S102: please refer to Figure 3 a first slot 14 is arranged on the first substrate layer 11 exposed in the first line groove 122, and the first slot 14 is arranged staggered with the first conductive lines 121.

[0071] In the present embodiment, along the thickness direction A, the first slot 14 does not penetrate the first substrate layer 11, and the depth of the first slot 14 is less than half of the thickness of the first substrate layer 11. Preferably, the depth of the first slot 14 is one-third of the thickness of the first substrate layer 11.

[0072] In the present embodiment, along the thickness direction A, the first slot 14 does not penetrate the first substrate layer 11, and the depth of the first slot 14 is less than half of the thickness of the first substrate layer 11. Preferably, the depth of the first slot 14 is one-third of the thickness of the first substrate layer 11.

[0073] In the second embodiment of the present application, please refer to Figure 8, step S102 further comprises: disposing a second slot 15 in the first substrate layer 11 exposed in the second slot 132 part, to obtain a first intermediate body 151. Wherein, the second slot 15 is disposed corresponding to the first slot 14. The cross-sectional width of the second slot 15 is substantially the same as the cross-sectional width of the first slot 14, and the depth of the second slot 15 is substantially the same as the depth of the first slot 14; disposing a plurality of first interlayer conductive bodies 152 in the first intermediate body 151, the first interlayer conductive body 152 is connected to the corresponding first conductive circuit 121 and second conductive circuit 131.

[0074] S103: Please see Figure 4 , disposing a first cooling medium 20 in the first slot 14. The first cooling medium 20 is used to absorb the heat of the first substrate layer 11 and a plurality of first conductive circuits 121. Wherein, the first cooling medium 20 can be at least one of paraffin, paraffin and helium gas combination, paraffin and hydrofluoroether combination, non-paraffin organic compound, inorganic phase change material, hydrofluorocarbon and hydrofluoroether. Wherein, the paraffin is a paraffin with a carbon atom number of 13-34; the paraffin and hydrofluoroether combination includes hydrofluoroether filled in paraffin; the paraffin and helium gas combination includes helium gas filled in paraffin; the non-paraffin organic compound includes stearic acid, acetamide, lauric acid, etc.; the inorganic phase change material includes sodium sulfate decahydrate, sodium acetate trihydrate, lithium chloride trihydrate, etc.; the hydrofluorocarbon includes CF3CF2-C-F-OMe-CF(CF3)2 and other fluorides.

[0075] Specifically, according to different types of the first cooling medium 20, the first cooling medium 20 has different heat absorption principles, for example, when the first cooling medium 20 is paraffin, the paraffin absorbs heat and changes phase, thereby changing from solid to liquid, and the liquid paraffin quickly and widely conducts the heat of the first substrate layer 11 and the first conductive circuit 121, thereby effectively increasing the heat dissipation area and improving the heat dissipation effect. When the first cooling medium 20 is sodium acetate trihydrate, the sodium acetate trihydrate has a large specific heat capacity and latent heat of phase change, so it can absorb the heat of the first substrate layer 11 and the first conductive circuit 121 without causing rapid temperature increase. When the first cooling medium 20 is hydrofluorocarbon, the hydrofluorocarbon absorbs heat and changes phase, thereby changing from liquid to gas, and because the hydrofluorocarbon has a high heat capacity and thermal conductivity, it can quickly and widely conduct heat.

[0076] In the second embodiment of the present application, please see Figure 9, step S103 further includes: disposing a second cooling medium 21 in the second slot 15. The second cooling medium 21 is used to absorb heat of the first substrate layer 11 and the plurality of second conductive circuits 131. Wherein, the material of the first cooling medium 20 is substantially the same as the material of the second cooling medium 21. Please refer to Figure 10 , the first slot 122 is substantially annular, the first slot 14 is also substantially annular, and the first cooling medium 20 is disposed in the annular first slot 14.

[0077] S104: Please refer to Figure 5 , a first insulating protective layer 30 is disposed on the plurality of first conductive circuits 121, and the first insulating protective layer 30 partially fills the first slot 122 to form a first insulating piece 301. The first insulating piece 301 is located between the side of the first slot 14 and the side of the first slot 122, and the first heat dissipation circuit board 100 is obtained. The first insulating piece 301 is used to isolate the first cooling medium 20 and the first conductive circuit 121 adjacent to the first cooling medium 20. Wherein, the material of the first insulating protective layer 30 includes oleic acid ester, phenolic resin, polyimide, polytetrafluoroethylene, etc.

[0078] Please refer to Figure 5 , the first heat dissipation circuit board 100 includes a first circuit substrate 123, a first cooling medium 20, and a first insulating protective layer 30. The first circuit substrate 123 is provided with a first slot 14 on one side, and the first circuit substrate 123 includes a first substrate layer 11 and a plurality of first conductive circuits 121 arranged at one side of the first substrate layer 11. A first slot 122 is formed between every two adjacent first conductive circuits 121, and the first slot 14 is arranged on the first substrate layer 11 and corresponds to the first slot 122. The first cooling medium 20 is disposed in the first slot 14. The first insulating protective layer 30 is disposed on the plurality of first conductive circuits 121, and part of the first insulating protective layer 30 fills the first slot 122 to form a first insulating piece 301. The first insulating piece 301 isolates the first cooling medium 20 and the first conductive circuit 121 adjacent to the first cooling medium 20.

[0079] In the second embodiment of the present application, please refer to Figure 11, step S104 further comprises: disposing a second insulating protective layer 31 on the plurality of second conductive lines 131, the second insulating protective layer 31 partially fills the second line groove 132 to form a second insulating piece 311, the second insulating piece 311 is located between the side of the second slot 15 and the side of the second line groove 132, and the second heat dissipation circuit board 200 is obtained. The second insulating piece 311 is used to insulate the second cooling medium 21 and the second conductive line 131 adjacent to the second cooling medium 21. Wherein, the material of the second insulating protective layer 31 is substantially the same as the material of the first insulating protective layer 30.

[0080] Please refer to Figure 11 , the second embodiment of the present application further provides a second heat dissipation circuit board 200, which is different from the first heat dissipation circuit board 100 in that: the first circuit substrate 123 further comprises a plurality of second conductive lines 131 arranged at the other side of the first base material layer 11, and a second line groove 132 is formed between each adjacent two second conductive lines 131. The other side of the first base material layer 11 is provided with a second slot 15 corresponding to the second line groove 132. The second heat dissipation circuit board 200 further comprises a second cooling medium 21 and a second insulating protective layer 31. The second cooling medium 21 is arranged in the second slot 15. Part of the second insulating protective layer 31 fills the second line groove 132 to form a second insulating piece 311, and the second insulating piece 311 insulates the second cooling medium 21 and the second conductive line 131 adjacent to the second cooling medium 21. It can be understood that, please refer to Figure 12 In other embodiments of the present application, the first slot 14 and the second slot 15 are in communication.

[0081] Please refer to Figures 13 to 16 The third embodiment of the present application provides a manufacturing method of a third heat dissipation circuit board 300, which is different from the second embodiment in that the manufacturing method comprises the following steps:

[0082] S105: Please refer to Figure 13 , an insulating adhesive layer 22 is disposed on the plurality of second conductive lines 131, the insulating adhesive layer 22 partially fills the second line groove 132 to form a third insulating piece 221. The third insulating piece 221 is located between the side of the second slot 15 and the side of the second line groove 132, and the insulation of the second cooling medium 21 and the second conductive line 131 adjacent to the second cooling medium 21 is realized. Wherein, the material of the insulating adhesive layer 22 comprises epoxy resin, polyimide, acrylic resin, silicone and polyurethane.

[0083] S106: Please refer again to Figure 13A second single-sided copper clad substrate 23 is disposed on the insulating adhesive layer 22. The second single-sided copper clad substrate 23 includes a second base material layer 231 and a third copper foil layer 232. The second base material layer 231 is disposed between the insulating adhesive layer 22 and the third copper foil layer 232. The second base material layer 231 covers the second line groove 132 and the second slot 15.

[0084] S107: Please refer to Figure 14 The third copper foil layer 232 is etched to form a plurality of third conductive lines 233, thereby forming a second circuit board 235. The third conductive lines 233 are spaced apart from each other. A third line groove 236 is formed between each pair of adjacent third conductive lines 233. Part of the second base material layer 231 is exposed at the bottom of the third line groove 236.

[0085] In this embodiment, step S107 further includes disposing a plurality of second interlayer conductive bodies 234 in the second base material layer 231. The second interlayer conductive bodies 234 connect the second conductive lines 131 and the third conductive lines 233 disposed opposite to each other.

[0086] S108: Please refer to Figure 14 A third slot 32 is disposed in part of the second base material layer 231 exposed at the bottom of the third line groove 236. The third slot 32 is substantially disposed corresponding to the second slot 15. The cross-sectional width of the third slot 32 is smaller than the cross-sectional width of the third line groove 236, and the depth of the third slot 32 is smaller than the thickness of the second base material layer 231.

[0087] S109: Please refer to Figure 15 A third cooling medium 33 is disposed in the third slot 32. The third cooling medium 33 is used to absorb heat of the second base material layer 231 and the third conductive lines 233. The material of the third cooling medium 33 is substantially the same as that of the first cooling medium 20.

[0088] S110: Please refer to Figure 16 A third insulating protective layer 34 is disposed on the third conductive lines 233. Part of the third insulating protective layer 34 fills the third line groove 236 to form a third insulating member 35. The third insulating member 35 insulates the third cooling medium 33 and the third conductive lines 233 adjacent to the third cooling medium 33, thereby obtaining the third heat dissipation circuit board 300. It can be understood that in other embodiments of the present application, please refer to Figure 17 The third slot 32 penetrates through the second base material layer 231 and communicates with the second slot 15.

[0089] Please refer to Figure 16The third embodiment of the present application further provides a third heat dissipation circuit board 300. The first circuit substrate 123 further comprises a plurality of second conductive circuits 131 arranged at the other side of the first substrate layer 11. A second slot 132 is formed between each two adjacent second conductive circuits 131. The other side of the first substrate layer 11 is provided with a second slot 15 corresponding to the second slot 132. The third heat dissipation circuit board 300 further comprises a second cooling medium 21, an insulating adhesive layer 22, a second circuit substrate 235, a third cooling medium 33 and a third insulating protective layer 34. The second cooling medium 21 is arranged in the second slot 15. The insulating adhesive layer 22 is arranged on the plurality of second conductive circuits 131. Part of the insulating adhesive layer 22 fills the second slot 132 to form a third insulating member 35. The third insulating member 35 separates the second cooling medium 21 and the second conductive circuits 131 adjacent to the second cooling medium 21. The second circuit substrate 235 is arranged on the insulating adhesive layer 22. The second circuit substrate 235 comprises a second substrate layer 231 and a plurality of third conductive circuits 233 arranged on the second substrate layer 231. The second substrate layer 231 is arranged between the insulating adhesive layer 22 and the plurality of third conductive circuits 233. A third slot 236 is formed between each two adjacent third conductive circuits 233. The third slot 236 corresponds to the second slot 132. The second substrate layer 231 is provided with a third slot 32. The third slot 32 corresponds to the third slot 236. The third cooling medium 33 is arranged in the third slot 32. The third insulating protective layer 34 is arranged on the plurality of third conductive circuits 233. Part of the third insulating protective layer 34 fills the third slot 236 to form a third insulating member 35. The third insulating member 35 separates the third cooling medium 33 and the third conductive circuits 233 adjacent to the third cooling medium 33.

[0090] Compared with the prior art, the heat dissipation circuit board (the first heat dissipation circuit board 100, the second heat dissipation circuit board 200 and the third heat dissipation circuit board 300) provided by the above embodiments of the present application has the following advantages:

[0091] (1) The cooling medium (the first cooling medium 20, the second cooling medium 21 and the third cooling medium 33) is arranged in the slot (the first slot 14, the second slot 15 and the third slot 32). The effective heat conduction is realized, which is conducive to reducing the heat accumulation of the heat dissipation circuit board and reducing the adverse effects on other electronic components (such as chips).

[0092] (ii) The grooves are arranged corresponding to the line grooves (the first line groove 122, the second line groove 132 and the third line groove 236), so that the grooves avoid the conductive lines (the first conductive line 121, the second conductive line 131 and the third conductive line 233), thereby effectively balancing the density and heat dissipation efficiency of the heat dissipation circuit board without increasing the thickness of the heat dissipation circuit board.

[0093] (iii) The insulating protective layer (the first insulating protective layer 30, the second insulating protective layer 31 and the third insulating protective layer 34) is partially filled in the line grooves, thereby forming insulating pieces (the first insulating piece 301, the second insulating piece 311 and the third insulating piece 35), which insulate the conductive lines from the adjacent cooling medium, thereby improving the stability of the heat dissipation circuit board.

[0094] The above description is merely one optimized specific embodiment of the present application, but in actual application process, it cannot be limited to this embodiment. Other variations and changes made according to the technical concept of the present application by those of ordinary skill in the art should belong to the protection scope of the present application.

Claims

1. A method for manufacturing a heat dissipation circuit board, characterized in that, Including the following steps: A first slot is provided on one side of a first circuit board. The first circuit board includes a first substrate layer and a plurality of first conductive lines spaced apart on one side of the first substrate layer. A first groove is formed between each pair of adjacent first conductive lines. The first slot is provided on the first substrate layer and corresponds to the first groove. The first circuit board has a thickness direction. Along the thickness direction, the first slot does not penetrate the first substrate layer. Along the direction perpendicular to the thickness, the cross-sectional width of the first slot is smaller than the cross-sectional width of the first groove, and the two sides of the first slot are spaced apart from the sides of the first groove. A first cooling medium is provided in the first slot, and A first insulating protective layer is provided on a plurality of first conductive lines. The first insulating protective layer fills a portion of the first wire groove to form a first insulating element. The first insulating element isolates the first cooling medium and the first conductive lines adjacent to the first cooling medium.

2. The manufacturing method as described in claim 1, characterized in that, The first circuit board further includes a plurality of second conductive lines spaced apart on the other side of the first substrate layer, wherein a second groove is formed between each pair of adjacent second conductive lines, and the manufacturing method further includes the step of: A second slot is provided on the other side of the first circuit board, and the second slot is provided on the other side of the first substrate layer and is corresponding to the second slot. A second cooling medium is provided in the second slot, and A second insulating protective layer is provided on a plurality of second conductive lines. The second insulating protective layer fills a portion of the second wire groove to form a second insulating element. The second insulating element isolates the second cooling medium and the second conductive lines adjacent to the second cooling medium.

3. The manufacturing method as described in claim 2, characterized in that, The second slot is connected to the first slot.

4. The manufacturing method as described in claim 3, characterized in that, The first circuit board further includes a plurality of second conductive lines spaced apart on the other side of the first substrate layer, wherein a second groove is formed between each pair of adjacent second conductive lines, and the manufacturing method further includes the step of: A second slot is provided on the other side of the first circuit board, and the second slot is provided on the other side of the first substrate layer and is corresponding to the second slot. A second cooling medium is provided in the second slot: An insulating adhesive layer is provided on a plurality of second conductive lines, the insulating adhesive layer partially filling the second groove to form a third insulating element, the third insulating element isolating the second cooling medium and the second conductive lines adjacent to the second cooling medium; A second circuit board is disposed on the insulating adhesive layer. The second circuit board includes a second substrate layer and a plurality of third conductive lines disposed on the second substrate layer. The second substrate layer is disposed between the insulating adhesive layer and the plurality of third conductive lines. A third groove is formed between each two adjacent third conductive lines. The third groove is disposed corresponding to the second groove. A third groove is provided in the second substrate layer, and the third groove is provided corresponding to the third line groove; A third cooling medium is provided in the third slot, and A third insulating protective layer is provided on a plurality of the third conductive lines, and the third insulating protective layer partially fills the third groove to form a fourth insulating element, the fourth insulating element isolating the third cooling medium and the third conductive lines adjacent to the third cooling medium.

5. The manufacturing method as described in claim 4, characterized in that, The third slot is connected to the second slot.

6. The manufacturing method as described in claim 4, characterized in that, It also includes the following steps: An interlayer conductor is provided on the first circuit board and the second circuit board, and the interlayer conductor electrically connects the first conductive line, the second conductive line and the third conductive line.

7. A heat dissipation circuit board, characterized in that, include: A first circuit board has a first slot on one side. The first circuit board includes a first substrate layer and a plurality of first conductive lines spaced apart on one side of the first substrate layer. A first groove is formed between each pair of adjacent first conductive lines. The first slot is disposed in the first substrate layer and corresponds to the first groove. The first circuit board has a thickness direction. Along the thickness direction, the first slot does not penetrate the first substrate layer. Along the direction perpendicular to the thickness, the cross-sectional width of the first slot is smaller than the cross-sectional width of the first groove, and the two sides of the first slot are spaced apart from the sides of the first groove. A first cooling medium, wherein the first cooling medium is disposed in the first slot, and A first insulating protective layer is disposed on a plurality of first conductive lines. The first insulating protective layer partially fills the first groove to form a first insulating element. The first insulating element isolates the first cooling medium and the first conductive lines adjacent to the first cooling medium.

8. The heat dissipation circuit board as described in claim 7, characterized in that, The first circuit board further includes a plurality of second conductive lines spaced apart on the other side of the first substrate layer, each pair of adjacent second conductive lines forming a second groove, and the other side of the first substrate layer corresponding to the second groove having a second slot. The heat dissipation circuit board further includes: The second cooling medium, which is disposed within the second slot, and A second insulating protective layer partially fills the second groove to form a second insulating element, which isolates the second cooling medium and the second conductive line adjacent to the second cooling medium.

9. The heat dissipation circuit board as described in claim 7, characterized in that, The first circuit board further includes a plurality of second conductive lines spaced apart on the other side of the first substrate layer, each pair of adjacent second conductive lines forming a second groove, and the other side of the first substrate layer corresponding to the second groove having a second slot. The heat dissipation circuit board further includes: The second cooling medium is disposed within the second slot; An insulating adhesive layer is disposed on a plurality of second conductive lines, and the insulating adhesive layer partially fills the second groove to form a third insulating element, the third insulating element isolating the second cooling medium and the second conductive lines adjacent to the second cooling medium; The second circuit board is disposed on the insulating adhesive layer. The second circuit board includes a second substrate layer and a plurality of third conductive lines disposed on the second substrate layer. The second substrate layer is disposed between the insulating adhesive layer and the plurality of third conductive lines. A third groove is formed between each two adjacent third conductive lines. The third groove is disposed corresponding to the second groove. The second substrate layer is provided with a third slot, which is disposed corresponding to the third groove. A third cooling medium is disposed in the third slot; A third insulating protective layer is disposed on a plurality of third conductive lines. The third insulating protective layer partially fills the third groove to form a fourth insulating element, which isolates the third cooling medium and the third conductive lines adjacent to the third cooling medium.

10. The heat dissipation circuit board as described in claim 9, characterized in that, The second groove is connected to the first slot, and the third slot is connected to the second slot.

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