Flexible substrate

Abstract

The invention relates to a flexible substrate. This flexible substrate is provided with: an insulating base material having a plurality of first tape sections that extend in a first direction and are arranged in a second direction intersecting the first direction, a plurality of second tape sections that extend in the second direction and are arranged in the first direction, and a plurality of island-shaped sections positioned at the intersection of the first tape sections and the second tape sections; a plurality of electronic components overlapping the island-shaped portion; a plurality of scan lines extending so as to overlap the first tape sections; a plurality of signal lines extending so as to overlap the second tape sections; a first organic insulating film which is positioned on the upper layer of the scanning line and the signal line and which overlaps the first tape section and the second tape section; a second organic insulating film positioned on the first organic insulating film; a stop layer located between the first organic insulating film and the second organic insulating film; and a barrier layer on the second organic insulating film.

Description

[0001] Cross-references to related applications

[0002] This application claims priority based on Japanese patent application No. 2023-185592 filed on October 30, 2023, the entire contents of which are incorporated herein by reference. Technical Field

[0003] Embodiments of the present invention relate to a flexible substrate. Background Art

[0004] In recent years, the use of flexible substrates with flexibility and stretchability has been studied in various fields. For example, a flexible substrate with electronic components arranged in a matrix can be attached to a curved surface of an electronic device or a human body. As electronic components, various sensors such as touch sensors and temperature sensors, and display components can be applied.

[0005] In a flexible substrate, measures need to be taken to prevent the wiring from being damaged by stress caused by bending and expansion. As such measures, for example, it is proposed to provide honeycomb-shaped openings in a substrate supporting the wiring and to make the wiring serpentine (zigzag). Summary of the invention

[0006] According to the present embodiment, a flexible substrate is provided, comprising: an insulating base material having a plurality of first band portions extending in a first direction and arranged in a second direction intersecting the first direction, a plurality of second band portions extending in the second direction and arranged in the first direction, and a plurality of island portions located at intersections of the first band portions and the second band portions; a plurality of electronic components overlapping the island portions; a plurality of scan lines extending so as to overlap the first band portions, respectively; a plurality of signal lines extending so as to overlap the second band portions, respectively; a first organic insulating film located on an upper layer of the scan lines and the signal lines and overlapping the first band portions and the second band portions; a second organic insulating film located on the first organic insulating film; a stop layer located between the first organic insulating film and the second organic insulating film; and a barrier layer located on the second organic insulating film.

[0007] This embodiment can provide a flexible substrate capable of reducing the risk of wiring breakage. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 It is a schematic plan view of the flexible substrate according to the present embodiment.

[0009] Figure 2 Yes Figure 1 An enlarged top view of a portion of the flexible substrate is shown.

[0010] Figure 3 It is along Figure 2 A cross-sectional view of the flexible substrate along line AB is shown.

[0011] Figure 4 It is along Figure 2 A cross-sectional view of the flexible substrate along line CD is shown.

[0012] Figure 5 is a top view showing the barrier layer and the stop layer.

[0013] Figure 6 It is along Figure 2 A cross-sectional view of the flexible substrate along line AB is shown.

[0014] Figure 7 It is along Figure 2 A cross-sectional view of the flexible substrate along line CD is shown.

[0015] Figure 8 is a top view showing a stop layer.

[0016] Fig. 9 It is along Figure 8 A cross-sectional view of the flexible substrate along line AB is shown.

[0017] Fig.10 It is along Figure 8 A cross-sectional view of the flexible substrate along line CD is shown.

[0018] Fig.11 It is along Figure 8 A cross-sectional view of the flexible substrate along line AB is shown.

[0019] Fig.12 It is along Figure 8 A cross-sectional view of the flexible substrate along line CD is shown.

[0020] Fig.13 It is along Figure 8 A cross-sectional view of the flexible substrate along line AB is shown.

[0021] Fig.14 It is along Figure 8 A cross-sectional view of the flexible substrate along line CD is shown.

[0022] Fig.15 It is along Figure 8 A cross-sectional view of the flexible substrate along line AB is shown.

[0023] Fig.16 It is along Figure 8 A cross-sectional view of the flexible substrate along line CD is shown.

[0024] Fig.17 is a top view showing a stop layer. DETAILED DESCRIPTION

[0025] Hereinafter, the present embodiment will be described with reference to the accompanying drawings. It should be noted that the present disclosure is only an example, and for those skilled in the art, the content that can be easily thought of for appropriate changes that maintain the main purpose of the invention is of course included in the scope of the present invention. In addition, in order to make the description clearer, the accompanying drawings sometimes roughly indicate the width, thickness, shape, etc. of each part compared with the actual method, but it is only an example and does not limit the interpretation of the present invention. In addition, in this specification and each figure, the same reference numerals are marked for the constituent elements that perform the same or similar functions as the constituent elements previously described in the figures that have already appeared, and repeated detailed descriptions are sometimes appropriately omitted.

[0026] [First embodiment]

[0027] First, refer to Figures 1 to 5 , the structure of the first embodiment is described.

[0028] Figure 1 1 is a schematic plan view of the flexible substrate 100 according to the present embodiment.

[0029] In the present embodiment, a first direction D1, a second direction D2, and a third direction D3 are defined as shown in the figure. The first direction D1 and the second direction D2 are directions parallel to the main surface of the flexible substrate 100 and intersecting each other. The third direction D3 is a direction perpendicular to the first direction D1 and the second direction D2, and corresponds to the thickness direction of the flexible substrate 100. In the present embodiment, the first direction D1 and the second direction D2 intersect perpendicularly, but may intersect at an angle other than perpendicular. In this specification, the direction toward the front end of the arrow indicating the third direction D3 is referred to as "up", and the direction from the front end of the arrow to the opposite direction is referred to as "down". In addition, assuming that there is an observation position for observing the flexible substrate 100 on the front end side of the arrow indicating the third direction D3, the situation of observing from the observation position toward the D1-D2 plane defined by the first direction D1 and the second direction D2 is referred to as a top view.

[0030] like Figure 1 As shown, the flexible substrate 100 includes a plurality of scanning lines 1, a plurality of signal lines 2, a plurality of electronic components 3, a resin layer 81, a scanning line driver DR1, and a signal line driver DR2. The plurality of scanning lines 1, the plurality of signal lines 2, the plurality of electronic components 3, the scanning line driver DR1, and the signal line driver DR2 are arranged on the resin layer 81.

[0031] A plurality of scan lines 1 extend in the first direction D1 and are arranged in the second direction D2. The plurality of scan lines 1 are connected to scan line drivers DR1. A plurality of signal lines 2 extend in the second direction D2 and are arranged in the first direction D1. The plurality of signal lines 2 are connected to signal line drivers DR2. A plurality of electronic components 3 are located at intersections of the scan lines 1 and the signal lines 2 and are electrically connected to the scan lines 1 and the signal lines 2.

[0032] The scanning signal is supplied to the electronic element 3 via the scanning line 1. For example, when the electronic element 3 outputs a signal such as a sensor, the output signal from the electronic element 3 is supplied to the signal line 2. It should be noted that the scanning line 1 and the signal line 2 are examples of wirings provided in the flexible substrate 100. In addition to the scanning line 1 and the signal line 2, the flexible substrate 100 may also include other types of wirings such as a power line for supplying power to the electronic element 3.

[0033] The scanning line driver DR1 functions as a supply source for supplying scanning signals to the scanning lines 1. The signal line driver DR2 functions as a supply source for supplying driving signals to the signal lines 2 or as a signal processing unit for processing output signals to the signal lines 2.

[0034] Figure 2 Yes Figure 1 An enlarged top view of a portion of the flexible substrate 100 is shown.

[0035] like Figure 2 As shown, in addition to the above, the flexible substrate 100 further includes an insulating base material 4 that supports the scanning line 1 and the signal line 2. The insulating base material 4 has stretchability and flexibility. The insulating base material 4 is formed of, for example, polyimide, but is not limited to this example.

[0036] The insulating substrate 4 includes a plurality of island-shaped portions 40, and a plurality of first band portions 41 and a plurality of second band portions 42 formed integrally with the island-shaped portions 40. The insulating substrate 4 is formed in a mesh shape. The plurality of island-shaped portions 40 are arranged in a matrix shape in the first direction D1 and the second direction D2 at intervals from each other. The plurality of island-shaped portions 40 are located at the intersection of the first band portion 41 and the second band portion 42. Each of the island-shaped portions 40 is formed into, for example, a quadrilateral shape when viewed from above. It should be noted that the island-shaped portion 40 may also be formed into other polygonal shapes, and may also be formed into a circular shape or an elliptical shape.

[0037] The plurality of first belt portions 41 extend approximately in the first direction D1 and are arranged in the second direction D2. The first belt portion 41 connects the plurality of island-shaped portions 40 arranged in the first direction D1. The plurality of second belt portions 42 extend approximately in the second direction D2 and are arranged in the first direction D1. The second belt portion 42 connects the plurality of island-shaped portions 40 arranged in the second direction D2. The first belt portion 41 and the second belt portion 42 are each formed into a wave shape when viewed from above. In other words, the first belt portion 41 and the second belt portion 42 are formed into a serpentine shape (zigzag shape) when viewed from above.

[0038] The plurality of scanning lines 1 extend so as to overlap with the first band portion 41. The plurality of signal lines 2 extend so as to overlap with the second band portion 42. That is, the scanning lines 1 and the signal lines 2 are both formed in a meandering shape.

[0039] A plurality of electronic components 3 overlap with the island portion 40. For example, the electronic component 3 is a sensor, a semiconductor component, an actuator, or the like. For example, as a sensor, an optical sensor that receives visible light or near-infrared light, a temperature sensor, a pressure sensor, or a touch sensor, or the like can be applied. For example, as a semiconductor component, a light-emitting component, a light-receiving component, a diode, or a transistor, or the like can be used. In the case where the electronic component 3 is a light-emitting component, a flexible display having flexibility and stretchability can be realized. As a light-emitting component, for example, a light-emitting diode having a size of about 100 μm, such as a mini LED or a micro LED, or an organic electroluminescent component can be applied. In the case where the electronic component 3 is an actuator, for example, a piezoelectric element can be applied. It should be noted that the electronic component 3 is not limited to the components illustrated here, and components having various functions can also be applied in addition. The electronic component 3 can also be a capacitor, a resistor, or the like. In addition, the configuration position and shape of the electronic component 3 are not limited Figure 2 Example shown.

[0040] Figure 3 It is along Figure 2 FIG. 1 is a cross-sectional view of the flexible substrate 100 taken along line AB.

[0041] like Figure 3 As shown, the flexible substrate 100 further includes insulating films 51 to 57 , a stop layer ST, a barrier layer BR, and a resin layer 82 .

[0042] The insulating base material 4 is located on the resin layer 81. The insulating film 51 is located on the insulating base material 4. The insulating film 52 is located on the insulating film 51. The insulating film 53 is located on the insulating film 52. The scanning line 1 is located on the insulating film 53. The insulating film 54 is located on the insulating film 53 and covers the scanning line 1. The insulating film 55 is located on the insulating film 54.

[0043] The insulating films 51 to 55 are all inorganic insulating films formed of an inorganic insulating material such as silicon oxide (SiO), silicon nitride (SiN), or silicon oxynitride (SiON).

[0044] The insulating film (first organic insulating film) 56 is located on the insulating film 55. The insulating film 56 is located on the upper layer of the scanning line 1 and overlaps with the first band portion 41. The stop layer ST is located on the insulating film 56. The stop layer ST suppresses cracks from above from reaching the scanning line 1 and the signal line 2. The stop layer ST is formed using any one of silicon oxide (SiO), silicon nitride (SiN), polysilicon (Poly-Si), aluminum (Al), titanium (Ti), and copper (Cu). The insulating film (second organic insulating film) 57 is located on the insulating film 56 and the stop layer ST. The stop layer ST is located between the insulating film 56 and the insulating film 57.

[0045] The insulating films 56 and 57 are organic insulating films formed of an organic insulating material such as acrylic resin.

[0046] The insulating film 56 has a first film thickness TH1. The insulating film 57 has a second film thickness TH2. The first film thickness TH1 and the second film thickness TH2 are equal to each other. That is, the stop layer ST is located substantially in the middle of the sum of the film thicknesses of the insulating films 56 and 57.

[0047] The barrier layer BR is located on the insulating film 57. The barrier layer BR is formed, for example, using any one of silicon oxide (SiO), silicon nitride (SiN), polysilicon (Poly-Si), aluminum (Al), titanium (Ti), and copper (Cu). The barrier layer BR may also be formed using the same material as the stop layer ST. The barrier layer BR suppresses the intrusion of moisture and the like from above the flexible substrate 100.

[0048] The barrier layer BR and the stop layer ST overlap with the scanning line 1 .

[0049] The rigidity of the stop layer ST is equal to or less than the rigidity of the barrier layer BR. For example, when the stop layer ST and the barrier layer BR are formed using the same material, the third film thickness TH3 of the stop layer ST is equal to or less than the fourth film thickness TH4 of the barrier layer BR. In addition, when the stop layer ST is formed using a material different from that of the barrier layer BR, the elastic modulus and the film thickness of the materials used in the stop layer ST and the barrier layer BR are adjusted, so that the stop layer ST is formed with lower rigidity than the barrier layer BR. By making the stop layer ST lower in rigidity than the barrier layer BR, the stop layer ST can be made less likely to break. In addition, the elasticity of the flexible substrate 100 can be improved.

[0050] The resin layer 82 covers the insulating substrate 4 , the insulating films 51 to 57 , the stop layer ST, and the barrier layer BR. The resin layer 82 is in contact with the resin layer 81 .

[0051] Figure 4 It is along Figure 2 FIG. 1 is a cross-sectional view of the flexible substrate 100 along line CD.

[0052] The signal line 2 is located on the insulating film 54. The insulating film 55 is located on the insulating film 54 and covers the signal line 2. The insulating film 56 is located on the upper layer of the signal line 2 and overlaps with the second band portion 42. The barrier layer BR and the stop layer ST overlap with the signal line 2.

[0053] In addition, if Figure 3 and Figure 4 As shown, the scanning line 1, the insulating film 54, the signal line 2, and the insulating film 55 are stacked in this order.

[0054] According to the present embodiment, the stop layer ST is located between the barrier layer BR and the scanning line 1. In addition, the stop layer ST is located between the barrier layer BR and the signal line 2. For example, when the flexible substrate 100 is stretched, cracks may be generated from the barrier layer BR. When cracks are generated in the barrier layer BR, even if the cracks develop in the film thickness direction, the development of the cracks is stopped by the stop layer ST, and the risk of breaking the scanning line 1 and the signal line 2 can be reduced.

[0055] In addition, the first film thickness TH1 of the insulating film 56 and the second film thickness TH2 of the insulating film 57 are equal to each other. For example, when the stop layer ST is located near the barrier layer BR, the stop layer ST is likely to break at the same time as the barrier layer BR. In addition, for example, when the stop layer ST is located near the scanning line 1 and the signal line 2, the scanning line 1 and the signal line 2 are likely to break at the same time as the stop layer ST. By locating the stop layer ST at approximately the center of the sum of the film thicknesses of the insulating films 56 and 57, the above risk can be reduced.

[0056] Figure 5 is a top view showing the barrier layer BR and the stop layer ST. Figure 5 In FIG. 1 , the barrier layer BR and the stop layer ST are located in the region indicated by dotted hatching.

[0057] The barrier layer BR has a plurality of first band-shaped portions BR11 extending approximately in the first direction D1 and arranged in the second direction D2, a plurality of second band-shaped portions BR12 extending approximately in the second direction D2 and arranged in the first direction D1, and a third portion BR13 located at the intersection of the first portion BR11 and the second portion BR12. The first portion BR11 extends overlapping with the first band portion 41. The second portion BR12 extends overlapping with the second band portion 42. The first portion BR11 and the second portion BR12 are formed into a wave shape when viewed from above. A plurality of third portions BR13 overlap with the island-shaped portions 40, respectively. The third portions BR13 are arranged in a matrix shape in the first direction D1 and the second direction D2 at intervals from each other.

[0058] The stop layer ST includes a plurality of first band-shaped portions ST11 extending approximately in the first direction D1 and arranged in the second direction D2, a plurality of second band-shaped portions ST12 extending approximately in the second direction D2 and arranged in the first direction D1, and a third portion ST13 located at the intersection of the first portion ST11 and the second portion ST12. The first portion ST11 extends overlapping the first band portion 41. The second portion ST12 extends overlapping the second band portion 42. The first portion ST11 and the second portion ST12 are formed into a wave shape when viewed from above. A plurality of third portions ST13 overlap the island-shaped portions 40, respectively. The third portions ST13 are arranged in a matrix shape in the first direction D1 and the second direction D2 at intervals from each other.

[0059] The barrier layer BR and the stop layer ST are located in the same region. That is, the first portion BR11 and the first portion ST11 overlap each other, the second portion BR12 and the second portion ST12 overlap each other, and the third portion BR13 and the third portion ST13 overlap each other.

[0060] In addition, the first portion BR11 and the first portion ST11 overlap with the scanning line 1. The second portion BR12 and the second portion ST12 overlap with the signal line 2. The third portion BR13 and the third portion ST13 overlap with the electronic component 3.

[0061] Next, refer to Figure 6 and Figure 7 , the structure of a modified example of the first embodiment is described.

[0062] Figure 6 It is along Figure 2 The cross-sectional view of the flexible substrate 100 along the line AB is shown. Figure 3 Compared with the structure shown, Figure 6 The illustrated configuration is different in that the flexible substrate 100 includes insulating films 61 and 62 instead of the insulating films 51 to 55 .

[0063] The insulating film 61 is located on the insulating substrate 4. The scanning line 1 is located on the insulating film 61. The insulating film 62 is located on the insulating film 61 and covers the scanning line 1. The insulating film 56 is located on the insulating film 62.

[0064] The insulating films 61 and 62 are organic insulating films formed of an organic insulating material such as acrylic resin.

[0065] Figure 7 It is along Figure 2 The cross-sectional view of the flexible substrate 100 is shown in FIG. Figure 4 Compared with the structure shown, Figure 7The illustrated configuration is different in that the flexible substrate 100 includes insulating films 61 and 62 instead of the insulating films 51 to 55 .

[0066] The insulating film 61 is located on the insulating substrate 4. The insulating film 62 is located on the insulating film 61. The signal line 2 is located on the insulating film 62. The insulating film 56 is located on the insulating film 62 and covers the signal line 2.

[0067] Even in such a modified example, the same effects as those of the first embodiment can be obtained.

[0068] [Second embodiment]

[0069] Next, refer to Figures 8 to 10 The configuration of the second embodiment will be described. The second embodiment is different from the first embodiment in that the stop layer ST has the slit 5 .

[0070] Figure 8 1 is a plan view showing the stop layer ST.

[0071] The stop layer ST has a plurality of slits 5. In the example shown in the figure, the slits 5 are straight lines when viewed from above. The width of the slits 5 in a direction perpendicular to the extension direction is, for example, 3 μm or more. The pattern of the slits 5 may be repeated regularly in a certain area, or may be irregular. In addition, for example, the slits 5 pass through from the outer edge to the outer edge of the stop layer ST when viewed from above. It should be noted that the shape of the slits 5 is not limited to the example shown in the figure, and may also be curved, etc.

[0072] Fig. 9 It is along Figure 8 The cross-sectional view of the flexible substrate 100 along the line AB is shown. Figure 3 Compared with the structure shown, Fig. 9 The structure shown is different in that the stop layer ST has a slit 5 .

[0073] The slit 5 penetrates the stopper layer ST from the insulating film 56 to the insulating film 57 .

[0074] Fig.10 It is along Figure 8 The cross-sectional view of the flexible substrate 100 along the CD line is shown. Figure 4 Compared with the structure shown, Fig.10 The structure shown is different in that the stop layer ST has a slit 5 .

[0075] The slit 5 penetrates the stopper layer ST from the insulating film 56 to the insulating film 57 .

[0076] According to the second embodiment, the stop layer ST has the slit 5. Therefore, even if a crack is generated in the barrier layer BR and propagates to the stop layer ST, the stress can be dispersed in a direction parallel to the D1-D2 plane by the slit 5, and the crack can be prevented from propagating to the layer below the stop layer ST.

[0077] In such a second embodiment as well, the same effects as those of the first embodiment can be obtained.

[0078] Next, refer to Fig.11 and Fig.12 , the structure of the first variant of the second embodiment is described.

[0079] Fig.11 It is along Figure 8 The cross-sectional view of the flexible substrate 100 along the line AB is shown. Figure 6 Compared with the structure shown, Fig.11 The structure shown is different in that the stop layer ST has a slit 5. Fig. 9 Compared with the structure shown, Fig.11 The illustrated configuration is different in that the flexible substrate 100 includes insulating films 61 and 62 instead of the insulating films 51 to 55 .

[0080] The slit 5 penetrates the stopper layer ST from the insulating film 56 to the insulating film 57 .

[0081] Fig.12 It is along Figure 8 The cross-sectional view of the flexible substrate 100 is shown in FIG. Figure 7 Compared with the structure shown, Fig.12 The structure shown is different in that the stop layer ST has a slit 5. Fig.10 Compared with the structure shown, Fig.12 The illustrated configuration is different in that the flexible substrate 100 includes insulating films 61 and 62 instead of the insulating films 51 to 55 .

[0082] The slit 5 penetrates the stopper layer ST from the insulating film 56 to the insulating film 57 .

[0083] In such a first modification as well, the same effects as those of the second embodiment can be obtained.

[0084] Next, refer to Fig.13 and Fig.14 , the structure of the second variant of the second embodiment is described.

[0085] Fig.13 It is along Figure 8 The cross-sectional view of the flexible substrate 100 along the line AB is shown. Fig. 9 Compared with the structure shown, Fig.13The structure shown is different in that the slit 5 does not penetrate the stopper layer ST.

[0086] The slit 5 is formed on the upper surface STU of the stop layer ST. The stop layer ST is interposed between the slit 5 and the insulating film 56 .

[0087] Fig.14 It is along Figure 8 The cross-sectional view of the flexible substrate 100 is shown in FIG. Fig.10 Compared with the structure shown, Fig.14 The structure shown is different in that the slit 5 does not penetrate the stopper layer ST.

[0088] The slit 5 is formed on the upper surface STU of the stop layer ST. The stop layer ST is interposed between the slit 5 and the insulating film 56 .

[0089] In such a second modification, the same effects as those of the second embodiment can be obtained.

[0090] Next, refer to Fig.15 and Fig.16 , the structure of the third variant of the second embodiment is described.

[0091] Fig.15 It is along Figure 8 The cross-sectional view of the flexible substrate 100 along the line AB is shown. Fig.11 Compared with the structure shown, Fig.15 The structure shown is different in that the slit 5 does not penetrate the stop layer ST. Fig.13 Compared with the structure shown, Fig.15 The illustrated configuration is different in that the flexible substrate 100 includes insulating films 61 and 62 instead of the insulating films 51 to 55 .

[0092] The slit 5 is formed on the upper surface STU of the stop layer ST. The stop layer ST is interposed between the slit 5 and the insulating film 56 .

[0093] Fig.16 It is along Figure 8 The cross-sectional view of the flexible substrate 100 is shown in FIG. Fig.12 Compared with the structure shown, Fig.16 The structure shown is different in that the slit 5 does not penetrate the stop layer ST. Fig.14 Compared with the structure shown, Fig.16 The illustrated configuration is different in that the flexible substrate 100 includes insulating films 61 and 62 instead of the insulating films 51 to 55 .

[0094] The slit 5 is formed on the upper surface STU of the stop layer ST. The stop layer ST is interposed between the slit 5 and the insulating film 56 .

[0095] In such a third modification, the same effects as those of the second embodiment can be obtained.

[0096] Next, refer to Fig.17 The configuration of a fourth modified example of the second embodiment will be described.

[0097] Fig.17 FIG. 1 is a top view showing the stop layer ST. Figure 8 Compared with the structure shown, Fig.17 In the illustrated configuration, the shapes of the plurality of slits 5 included in the stop layer ST are different.

[0098] In the example shown in the figure, the slit 5 meanders in a plan view. The pattern of the slit 5 may be repeated regularly in a certain area or may be irregular. In addition, for example, the slit 5 penetrates from the outer edge to the outer edge of the stop layer ST in a plan view.

[0099] It should be noted that in Fig.17 In the example shown, it is also possible to apply Figures 9 to 16 The cross-sectional views shown have the same structure.

[0100] In such a fourth modification, the same effects as those of the second embodiment can be obtained.

[0101] As described above, according to the present embodiment, a flexible substrate capable of reducing the risk of breakage of wiring can be obtained.

[0102] It should be noted that several embodiments of the present invention have been described, but these embodiments are presented as examples and are not intended to limit the scope of the invention. These new embodiments can be implemented in various other ways, and various omissions, substitutions, and changes can be made without departing from the scope of the invention. These embodiments and their variations are included in the scope and purpose of the invention, and are included in the invention described in the claims and the scope of their equivalents.

Claims

1. A flexible substrate having: An insulating substrate having a plurality of first band portions extending in a first direction and arranged in a second direction intersecting the first direction, a plurality of second band portions extending in the second direction and arranged in the first direction, and a plurality of island portions located at intersections of the first band portions and the second band portions; a plurality of electronic components overlapping the island; a plurality of scanning lines extending so as to overlap with the first belt portion respectively; a plurality of signal lines extending so as to overlap with the second band portion respectively; a first organic insulating film located on an upper layer of the scanning line and the signal line and overlapping the first band portion and the second band portion; a second organic insulating film located on the first organic insulating film; a stop layer located between the first organic insulating film and the second organic insulating film; and A barrier layer is located on the second organic insulating film.

2. The flexible substrate according to claim 1, wherein: A first film thickness of the first organic insulating film and a second film thickness of the second organic insulating film are equal to each other.

3. The flexible substrate according to claim 1, wherein: The rigidity of the stop layer is equal to or less than the rigidity of the barrier layer.

4. The flexible substrate according to claim 3, wherein: The stop layer and the barrier layer are formed of the same material, The third film thickness of the stop layer is equal to or less than the fourth film thickness of the barrier layer.

5. The flexible substrate according to claim 1, wherein: The stop layer is formed using any one of silicon oxide, silicon nitride, polysilicon, aluminum, titanium, and copper.

6. The flexible substrate according to claim 1, wherein: The stop layer has a slit.

7. The flexible substrate according to claim 6, wherein: The slit is linear in a plan view.

8. The flexible substrate according to claim 6, wherein: The slit is tortuous when viewed from above.

9. The flexible substrate according to claim 6, wherein: The slit passes through the stop layer.

10. The flexible substrate according to claim 6, wherein: The slit does not penetrate the stop layer.

11. The flexible substrate according to claim 1, wherein: The stop layer includes a plurality of strip-shaped first portions extending in the first direction and arranged in the second direction, and a plurality of strip-shaped second portions extending in the second direction and arranged in the first direction. The first portion extends overlapping the first belt portion, The second portion extends so as to overlap with the second belt portion.

12. The flexible substrate according to claim 11, wherein: The first belt portion and the second belt portion are each formed in a wave shape.

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